WO2023280083A1

WO2023280083A1 - Inner-layer strip-shaped power divider circuit and power divider system

Info

Publication number: WO2023280083A1
Application number: PCT/CN2022/103494
Authority: WO
Inventors: 王宝杰; 曾武
Original assignee: 中兴通讯股份有限公司
Priority date: 2021-07-05
Filing date: 2022-07-01
Publication date: 2023-01-12
Also published as: CN115588833A

Abstract

Embodiments of the present application relate to the technical field of microwave component design, and disclose an inner-layer strip-shaped power divider circuit, which comprises a multi-layer circuit board (10) and a first power divider (20) disposed on the multi-layer circuit board (10). The first power divider (20) comprises: a power divider body (21), which is disposed on an inner layer of the multi-layer circuit board (10), the power divider body (21) comprising an input port (210), a transmission line (211) connected to the input port (210), and two output ports (212) connected to the transmission line (211); an isolation resistor (22), which is disposed on a surface layer of the multi-layer circuit board (10); and a via hole (23), the via hole (23) penetrating through at least two conductive metal layers of the multi-layer circuit board (10) and electrically connecting the transmission line (211) to the isolation resistor (22). Further provided in the embodiments of the present application is a power divider system. The inner-layer strip-shaped power divider circuit and the power divider system provided in the embodiments of the present application can simultaneously meet design requirements of a power divider for convenient processing and a high degree of isolation.

Description

Inner strip power divider circuit and power divider system

Cross References to Related Applications

This application is based on the Chinese patent application with the application number "2021107582499" and the filing date is July 05, 2021, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference. Apply.

technical field

The embodiments of the present application relate to the technical field of microwave component design, and in particular to an inner strip power divider circuit and a power divider system.

Background technique

The power divider (that is, the power divider) is an important component widely used in modern microwave, radar and other communication systems. It plays the role of power distribution and combination of microwave signals. Its performance directly affects the overall microwave system. performance.

There are many kinds of power splitters in the prior art, and the ribbon power splitters designed in the inner layer of the multilayer circuit board mainly include T-shaped power splitters and Wilkinson power splitters. Among them, the T-type power divider structure has no isolation resistance, and the isolation between output ports is poor (about 6dB), which cannot meet the high isolation requirements of power divider design; the Wilkinson power divider structure has isolation resistance, and the isolation between ports It is relatively high (about 20dB), which can meet the high isolation requirements of the power splitter design, but it needs to use buried resistance or circuit board digging to set the isolation resistance, which is difficult to process and high in cost.

Therefore, the inner strip power splitter solution in the prior art cannot meet the design requirements of convenient processing and high isolation, which limits the design flexibility of application scenarios that require multiple power splitter networks at the same time.

Contents of the invention

An embodiment of the present application provides an inner ribbon power divider circuit, comprising a multilayer circuit board and a first power divider disposed on the multilayer circuit board, the first power divider comprising: A splitter main body, arranged on the inner layer of the multi-layer circuit board, the power splitter main body includes an input port, a transmission line connected to the input port, and two output ports connected to the transmission line; isolation resistor , arranged on the surface layer of the multilayer circuit board; and a via hole, the via hole penetrates at least two conductive metal layers of the multilayer circuit board and electrically connects the transmission line to the isolation resistor.

The embodiment of the present application also provides a power divider system, including multiple power divider circuits cascaded to each other, at least one of the multiple power divider circuits is the above-mentioned inner strip power divider circuit.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.

FIG. 1 is a schematic structural diagram of an inner strip power divider circuit provided by some embodiments of the present application;

Fig. 2 is a schematic structural diagram of another inner strip power divider circuit provided by some embodiments of the present application;

Fig. 3 is a schematic structural diagram of a power divider system provided by other embodiments of the present application;

Fig. 4 is a schematic structural diagram of another power splitter system provided by other embodiments of the present application.

detailed description

The purpose of the embodiments of the present application is to provide an inner strip power divider circuit and a power divider system, which can meet the demands of convenient processing and high isolation of the power divider.

An embodiment of the present application provides an inner ribbon power divider circuit, comprising a multilayer circuit board and a first power divider disposed on the multilayer circuit board, the first power divider comprising: A splitter main body, arranged on the inner layer of the multi-layer circuit board, the power splitter main body includes an input port, a transmission line connected to the input port, and two output ports connected to the transmission line; isolation resistor , arranged on the surface layer of the multilayer circuit board; and a via hole, which penetrates at least two conductive metal layers of the multilayer circuit board and electrically connects the transmission line to the isolation resistor, which will be used for The isolation resistor to improve the isolation of the output port is set on the surface layer of the multilayer circuit board, and the main body of the power divider located in the inner layer of the multilayer circuit board is electrically connected to the isolation resistor on the surface layer of the multilayer circuit board through holes, so that the Under the premise of high isolation required by the design of the power divider, there is no need to use the isolation resistor setting method of buried resistance or circuit board digging, which takes into account the design requirements of the power divider for convenient processing and high isolation.

In order to make the purpose, technical solutions and advantages of some embodiments of the present application clearer, some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , an inner strip power divider circuit 100 provided by some embodiments of the present application includes a multilayer circuit board 10 and a first power divider 20 disposed on the multilayer circuit board 10 .

The multilayer circuit board 10 is the carrier of the first power divider 20, which mainly includes a dielectric layer and a conductive metal layer. The first power divider 20 is made by patterning and etching the conductive metal layer and contains a strip A circuit structure or circuit device of metal lines. In this embodiment, the multilayer circuit board 10 can be a mixed-press printed board, or a circuit board that can realize a multilayer circuit structure, such as high- and low-temperature co-fired ceramics.

The first power divider 20 includes a power divider main body 21 , an isolation resistor 22 and a via hole 23 .

The power divider main body 21 is used to realize power distribution, the isolation resistor 22 is used to ensure the isolation of the inner ribbon power divider circuit 100 , and the via hole 23 is used to connect the power divider main body 21 and the isolation resistor 22 . In some embodiments, the power divider main body 21 is disposed on the inner layer of the multilayer circuit board 10 , and the isolation resistor 22 is disposed on the surface layer of the multilayer circuit board 10 . In this embodiment, the isolation resistor 22 can be a thin film resistor or the like. The via hole 23 penetrates at least two conductive metal layers of the multilayer circuit board 10 and electrically connects the transmission line 211 to the isolation resistor 22 . In this embodiment, the via hole 23 is a metal via hole arranged vertically on the multilayer circuit board 10 (that is, arranged along the stacking direction of the multilayer circuit board 10 ), and the metal via hole is formed from the main body 21 of the power divider. The inner layer (of the multilayer circuit board 10) extends to the surface layer (of the multilayer circuit board 10), thereby electrically connecting the power divider main body 21 with the isolation resistor 22, thereby improving the isolation between the two output ports 212 .

The power splitter main body 21 includes an input port 210, a transmission line 211 connected to the input port 210, and two output ports 212 connected to the transmission line 211. Microwave signals are poured into the input port 210 and transmitted to the The output port 212 is then transmitted to subsequent microwave radio frequency links and components.

In a possible implementation of this embodiment, the main body 21 of the power divider has a centerline OO′ and is symmetrical about the centerline OO′, and the isolation resistor 22 includes a first isolation resistor 221 and a second isolation resistor 222 . The transmission line 211 is composed of a plurality of branch lines, and the power divider main body 21 in this embodiment further includes a first branch transmission line 2111, a second branch transmission line 2112, a third branch transmission line 2113, a fourth branch transmission line 2114, and a fifth branch transmission line 2115.

The first branch transmission line 2111 is located on the center line OO′ of the power divider main body 211 , one end of the first branch transmission line 2111 is connected to the input port 210 , and the other end is connected to the second branch transmission line 2112 .

The second branch transmission line 2112 has two opposite ends 2112a, 2112b, and a central position between the two ends 2112a, 2112b on OO′, to which the other end of the first branch transmission line 2111 is connected.

There are two third branch transmission lines 2113, and the two third branch transmission lines 2113 are symmetrical about the central line OO′, wherein one third branch transmission line 2113 connects one end 2112a of the second branch transmission line 2112 to one of the two output ports 212 One and another third branch transmission line 2113 connects the other end 2112 b of the second branch transmission line 2112 to the other of the two output ports 212 .

There are two fourth branch transmission lines 2114, and the two fourth branch transmission lines 2114 are symmetrical about the central line OO′, and one end of one fourth branch transmission line 2114 is connected to the connection between a third branch transmission line 2113 and the second branch transmission line 2112 One end of the other fourth branch transmission line 2114 is connected to the junction of another third branch transmission line 2113 and the second branch transmission line 2112, and the other end is through the via hole 23 Connect to the second isolation resistor 222 .

The fifth branch transmission line 2115 has two

opposite ends

2115a, 2115b, and a central position located between the two

ends

2115a, 2115b and on the central line OO', wherein one end 2115a is away from one of the fourth branch transmission lines 2114 "second The branch transmission line 2112 is connected to the end of the third branch transmission line 2113", and the other section 2115b is connected to the end of another fourth branch transmission line 2114 away from the "second branch transmission line 2112 and the third branch transmission line 2113".

It should be noted that the first branch transmission line 2111 , the second branch transmission line 2112 , the third branch transmission line 2113 , the fourth branch transmission line 2114 , and the fifth branch transmission line 2115 may all be strip lines. The impedance of each branch transmission line can be appropriately selected according to different actual design requirements. In this embodiment, the impedance of each branch transmission line can be set according to but not limited to the following manner: the first branch transmission line 2111 and the two third branch transmission lines 2113, The impedances of the two fourth branch transmission lines 2114 are the same.

In addition, the main body 21 of the power divider is not limited to the above-mentioned "symmetry about the center line" and "including the above-mentioned first, second, third, fourth and fifth branch transmission lines", in other possible implementations of this embodiment , the main body 21 of the power splitter may also have other symmetrical structures or be composed of branch transmission lines of different numbers and structures, which may be determined according to different design requirements of the power splitter, and will not be repeated here.

In some embodiments, referring to FIG. 2 , the embodiment of the present application provides another inner strip power divider circuit 100 ′ improved on the basis of the inner strip power divider circuit 100 shown in FIG. 1 , which additionally adds an impedance matching line 24 connecting the main body 21 of the power splitter to the via hole 23 on the structure of the first power splitter 20 shown in FIG. 1 , and the impedance matching line 24 is connected between the transmission line 211 and the via hole 23 , can improve the deterioration of the standing wave when the via is interconnected, optimize the standing wave, and achieve better impedance matching. In some embodiments, both ends of the impedance matching line 24 are respectively connected to the junction of “the fifth branch transmission line 2115 and the fourth branch transmission line 2114 ”, and are located between the fourth branch transmission line 2114 and the via hole 23 .

It should be noted that, in this embodiment, the impedance matching line 24 and the power divider main body 21 are arranged on the same layer, so that the impedance matching line 24 and the power divider main body 21 can be on the conductive metal layer of the multilayer circuit board 10 (such as Copper foil) are patterned together to simplify the processing technology. It can be understood that, in another embodiment, the impedance matching line 24 can also be arranged in another inner layer of the multilayer circuit board 10 that is different from the main body 21 of the power divider, and connected between the transmission line 211 and the via hole 23 Since the impedance matching line 24 and the main body 21 of the power divider are in different layers, in the actual design process, the projection of the impedance matching line 24 and the main body 21 of the power splitter on the thickness direction of the multilayer circuit board 10 can be at least partially Overlapping, so that while optimizing the standing wave and achieving better impedance matching, space can be reused in the thickness direction of the multilayer circuit board 10 . Of course, in other implementations, the impedance matching line 24 can also be connected between the via hole 23 and the isolation resistor 22 , and be located on the surface layer of the multilayer circuit board 10 like the isolation resistor 22 . It should be noted that the "surface layer" in the aforementioned "impedance matching line 24 and isolation resistor 22 are also located on the surface layer of the multilayer circuit board 10" refers to the conductive metal that is arranged in the multilayer circuit board 10 and is closest to the surface layer of the circuit board. Layer, therefore, in other words, the impedance matching line is arranged on the conductive metal layer closest to the surface layer of the circuit board in the multi-layer circuit board. In this case, correspondingly, the impedance matching line 24 is connected to the isolated between the resistor 22 and the via hole 23 to electrically connect the transmission line 211 of the power divider main body 21 to the isolation resistor 22 .

In this way, the inner strip power divider circuit 100 provided by the embodiment of the present application is an improved structure of the traditional Gysel power divider. The traditional Gysel power divider is a circuit structure formed on the surface of the circuit board, while the embodiment of the present application The provided inner strip power splitter circuits 100, 100' set the isolation resistors 22 (221, 222) used to improve the isolation of the output port 212 on the surface layer of the multilayer circuit board 10, and use the via hole 23 to place the The main body 21 of the power divider in the inner layer of the multilayer circuit board 10 is electrically connected to the isolation resistor 22 on the surface layer of the multilayer circuit board 10, so that under the premise of ensuring high isolation that meets the design requirements of the power divider, there is no need to use buried resistance or circuit board excavation. The setting method of the isolation resistance of the groove takes into account the design requirements of the power divider with convenient processing and high isolation.

It should be additionally pointed out that, in this embodiment, the conductive metal layer (for example, the top layer copper foil of the multilayer circuit board 10) in the multilayer circuit board 10 that is closest to the surface layer of the circuit board includes the ground layer GND, and the isolation resistor 22 is connected to the ground layer. Between the hole 23 and the ground GND, in this way, the heat generated by the power loss on the isolation resistor 22 can be evacuated by the ground GND, so as to avoid affecting the electrical performance of the inner strip power divider circuits 100, 100'.

Referring to FIG. 3 , an embodiment of the present application provides an inner strip power divider circuit 200, including the first power divider 20, the second power divider 30 and the third power divider 40 as described in the foregoing embodiments. . The second power splitter 30 has an input port 310 , a transmission line 311 connected to the input port 310 , and two output ports 312 connected to the transmission line 311 . The third power splitter 40 has an input port 410 , a transmission line 411 connected to the input port 410 , and two output ports 412 connected to the transmission line 411 . The input port 310 is connected to one of the two output ports 212 of the first power splitter 20 , and the input port 410 is connected to the other of the two output ports 212 of the first power splitter 20 .

In some embodiments, both the second power divider 30 and the third power divider 40 may have the same structure as the first power divider 20 provided in the foregoing embodiments and having the impedance matching line 24 .

It should be noted that the structure of the second power divider 30 and the third power divider 40 can also be the same as that of the first power divider 20 without impedance matching line 24 provided in the foregoing embodiment, and the second power divider 30 and the third power divider 40 may also be different from the first power divider 20 provided in the first embodiment.

For example, as shown in FIG. 4 , another inner strip power divider circuit 300 provided by some embodiments of the present application cascades two A Wilkinson power splitter 30', 40'. The two Wilkinson power dividers 30', 40' are both arranged on the surface layer of the multilayer circuit board 10, and the two output ports 212 of the first power divider 20 located in the inner layer of the multilayer circuit board 10 Two vias 23' on the layer circuit board 10 are connected to two Wilkinson power dividers 30', 40'.

It can be understood that the aforementioned second power divider 30 and third power divider 40 may also be other types of power dividers that are cascaded on the two output ports 212 of the first power divider 20 and are different from each other. In addition, multiple power dividers can be additionally cascaded on the output ports of the second power divider 30 and the third power divider 40 to form a one-to-eight, one-to-sixteen cascaded structure. It depends on the actual design requirements, so I won’t go into details here.

Some embodiments of the present application also provide a power divider system with multiple power divider circuits, the multiple power divider circuits of the power divider system are cascaded with each other, and at least one of the multiple power divider circuits It is any inner strip power divider circuit provided in the foregoing embodiments.

It should also be noted that those skilled in the art can understand that in the various embodiments of the present application, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the above embodiments, the technical solution claimed in this application can also be realized. The division of the above embodiments is for the convenience of description, and should not constitute any limitation to the specific implementation of the present application, and the various embodiments can be combined and referenced to each other on the premise of no contradiction.

Claims

An inner strip power divider circuit, comprising a multilayer circuit board (10) and a first power divider (20) arranged on the multilayer circuit board (10), the first power divider Device (20) comprises:

The main body (21) of the power splitter is arranged on the inner layer of the multi-layer circuit board (10), and the main body (21) of the power splitter includes an input port (210), connected to the input port (210) a transmission line (211), and two output ports (212) connected to the transmission line (211);

an isolation resistor (22), arranged on the surface layer of the multilayer circuit board (10); and

A via hole (23), the via hole (23) penetrates at least two conductive metal layers of the multilayer circuit board (10) and electrically connects the transmission line to the isolation resistor (22).
The inner strip power divider circuit according to claim 1, further comprising an impedance matching line (24) arranged on the inner layer of the multilayer circuit board (10), and the impedance matching line (24) is connected to between the transmission line (211) and the via hole (23).
The inner strip power splitter circuit according to claim 2, wherein the impedance matching line (24) is arranged on the same layer as the power splitter main body (21).
The inner strip power splitter circuit according to claim 2, wherein the impedance matching line (24) is arranged in other inner layers of the multilayer circuit board (10) and connected to the power splitter The main body (21) has different layers.
The inner strip power divider circuit according to claim 1, wherein it also includes an impedance matching line (24), and the impedance matching line (24) is arranged in the multilayer circuit board (10), the nearest The conductive metal layer on the surface layer of the circuit board, the impedance matching line (24) is connected between the isolation resistor (22) and the via hole (23).
The inner strip power divider circuit according to claim 1, wherein the power divider main body (21) has a center line and is symmetrical about the center line, and the isolation resistor (22) comprises a first isolation resistor (221) and a second isolation resistor (222), the transmission line (211) includes:

A first branch transmission line (2111), located on the center line of the power divider main body (21), one end of the first branch transmission line (2111) is connected to the input port (210);

A second branch transmission line (2112), the second branch transmission line (2112) has two opposite ends, and a central position between the two ends and on the center line, the first branch transmission line The other end of (2111) is connected to said central location;

Two third branch transmission lines (2113), symmetrical about the central line, one of the third branch transmission lines (2113) connecting one end of the second branch transmission line (2112) to two of the output ports (210 ), the other third branch transmission line (2113) connects the other end of the second branch transmission line (2112) to the other of the two output ports (210);

Two fourth branch transmission lines (2114), symmetrical about the central line, one end of one of the fourth branch transmission lines (2114) is connected to one of the third branch transmission lines (2113) and the second branch transmission line ( 2112), the other end is connected to the first isolation resistor (221), and one end of another fourth branch transmission line (2114) is connected to another third branch transmission line (2113) and the first The junction of the two branch transmission lines (2112), the other end is connected to the second isolation resistor (222); and

A fifth branch transmission line (2115), the fifth branch transmission line (2115) has two opposite ends, and a central position between the two ends and on the central line, the five branch transmission line ( 2115) is connected to one end of the fourth branch transmission line (2114) away from the second branch transmission line (2112) and the end of the third branch transmission line (2113), and the other end is connected to another fourth branch transmission line (2114) away from the second branch transmission line (2114) The end of the branch transmission line (2112) and the third branch transmission line (2113).
The inner strip power divider circuit according to claim 6, wherein, the first branch transmission line (2111), the second branch transmission line (2112), the third branch transmission line (2113) and the The fourth branch transmission lines (2114) are all strip lines.
The inner strip power divider circuit according to any one of claims 1-7, further comprising a second power divider (30) and a third power divider (40),

Each of the second power divider (30) and the third power divider (40) has: an input port (310), a transmission line (311) connected to the input port, and a transmission line (311) connected to the input port. ) connected to the two output ports (312);

The input port (310) of the second power splitter (30) is connected to one of the two output ports (212) of the first power splitter (20);

The input port (410) of the third power splitter (40) is connected to the other of the two output ports (212) of the first power splitter (20).
The inner strip power divider circuit according to claim 8, wherein, the second power divider (30) and the third power divider (40) are both connected to the first power divider (20 ) have the same structure.
The inner strip power divider circuit according to claim 8, wherein, both the second power divider (30) and the third power divider (40) are arranged on the multilayer circuit board ( 10) Wilkinson power divider on the surface layer, the two output ports (212) of the first power divider (20) are electrically connected via the via holes (23) arranged on the multilayer circuit board (10) respectively. Connected to the second power splitter (30) and the third power splitter (40).
A power divider system, including a plurality of power divider circuits cascaded to each other, at least one of the plurality of power divider circuits is the inner strip-shaped power splitter circuit.