WO2010088797A1 - Power distributing combiner and circuit board having power distributing combiner - Google Patents
Power distributing combiner and circuit board having power distributing combiner Download PDFInfo
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- WO2010088797A1 WO2010088797A1 PCT/CN2009/070358 CN2009070358W WO2010088797A1 WO 2010088797 A1 WO2010088797 A1 WO 2010088797A1 CN 2009070358 W CN2009070358 W CN 2009070358W WO 2010088797 A1 WO2010088797 A1 WO 2010088797A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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- the present invention relates to the field of communications, and in particular, to a power split combiner and a circuit board having a power split combiner. Background technique
- the application of power splitters is very extensive.
- the signals at the shunt ends of the power combiner are required to be in the same phase, that is, the microstrip lines of the respective shunt ends are required to receive the same spatially coupled signals of the microstrip lines of the other shunt ends.
- FIG. 1 it is a circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art, where B0 is the intersection of four microstrip lines, on the PCB, the microstrip lines B1B0, B2B0 and B3B0 Both are 1/4 wavelength impedance conversion lines with a center frequency and an impedance of 86.6 ohms.
- the impedance of the microstrip lines 21, 22 and 23 is typically 50 ohms.
- the microstrip line 22 at the second shunt end receives the spatial coupling signal of the microstrip line 21 of the first shunt end and the microstrip line 23 of the third shunt end; since the third shunt end is far from the first shunt end, The spatial coupling signal of the microstrip line 23 received by the microstrip line 21 at the first shunt end is weak and negligible, so that the microstrip line 21 of the first shunt end basically receives only the microstrip of the second shunt end.
- the signal received by the microstrip line 21 of the first shunt end is the same as that of the third shunt end, and the signal received by the microstrip line 22 of the second shunt end is separated from the first shunt end and the third branch.
- the difference between the ends of the road, the signal amplitude of the split end is different, and it also affects the phase of each split end. Therefore, it is difficult to achieve equal amplitude and phase in one-by-three Wilkinson power split combiner on the PCB.
- FIG. 2 it is a circuit diagram of a one-four-four Wilkinson power split combiner in the prior art, which is formed by a cascade of two Wilkinson power split combiners.
- the first shunt end and the fourth shunt end are in the same edge position, and the second shunt end and the third shunt end are in an intermediate position.
- the splitting end of the intermediate position receives more spatial coupling signals than the shunt ends of the edge position. Therefore, it is difficult to achieve equal amplitude in phase on the PCB by one minute and four Wilkinson power split combiners.
- FIG. 3 it is a circuit diagram of another one-fourth Wilkinson power split combiner in the prior art.
- the splitter combiner does not have too many microstrip lines, instead an area is compared.
- a large copper foil 40 is connected between the combining end and the first shunt end, the second shunt end, the third shunt end, and the fourth shunt end.
- the shunt ends (second shunt end and third shunt end) in the middle position receive more spatial coupling signals than the shunt ends of the edge positions (first shunt end and fourth shunt end). , so it is difficult to achieve the same amplitude in phase.
- the embodiment of the invention provides a power split combiner and a circuit board with a power split combiner.
- the influence of the split ends is consistent with each other, thereby The signals of all the split ends can be achieved in the same amplitude and in phase.
- An embodiment of the present invention provides a power split combiner, including a combined end and at least three split end groups, wherein one split end group includes one or two split ends; the at least three The branch ends of the shunt end groups are located in the same plane, and the shunt ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the shunt ends to the connecting device are the same, each two adjacent points The corners of the road end group are equal; the joint end is connected to the connecting device.
- An embodiment of the present invention provides a circuit board having a power split combiner, the power split combiner includes a combined end and at least three split end groups, wherein one split end group includes one or two points a branch end; the branch ends of the at least three shunt end groups are located in the same plane, and the shunt ends are connected to a connecting device perpendicular to the plane, wherein parameters of the components connecting the shunt end to the connecting device Similarly, the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and the plurality of shunt ends are disposed on the same layer of the circuit board.
- FIG. 1 is a schematic circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art
- FIG. 2 is a schematic circuit diagram of a one-four-four Wilkinson power split combiner in the prior art
- FIG. 3 is a schematic circuit diagram of another one-four-four Wilkinson power split combiner in the prior art
- 4 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention
- FIG. 5 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention.
- FIG. 6 is a schematic structural diagram of a three-power split combiner according to an embodiment of the present invention.
- FIG. 7 is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention.
- FIG. 8 is a schematic structural view of a circuit board having a power split combiner according to an embodiment of the present invention
- FIG. 9 is a cross-sectional view of the A-A plane of FIG. 8;
- FIG. 10 is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention. detailed description
- the power split combiner provided by the embodiment of the present invention includes a combined end and at least three split end groups, wherein one split end group includes one or two split ends; and the at least three split end groups
- the branch ends are located in the same plane, and the branch ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the branch ends to the connecting device are the same, and the clamping of each two adjacent shunt end groups The angles are equal; the combined end is connected to the connecting device.
- the respective split ends are evenly distributed, and the parameters of the components from the connecting device to the respective split ends are the same, according to the signal vector superposition principle, the spatial coupling signals received by the respective split ends are equal, and therefore, when needed When one signal is divided into multiple signals, the signals of all the split ends are realized in the same amplitude and in phase.
- FIG. 4 it is a schematic structural diagram of a power split combiner according to an embodiment of the present invention.
- three split end groups are used, and one split end group is a split end.
- the power split combiner of the present embodiment includes a combining end 50, three branching ends, and a connecting device 54, wherein the three shunt ends are shunt ends 51, 52, and 53, respectively.
- the shunt terminals 51, 52 and 53 are located on the same plane, and the shunt terminals 51, 52 and 53 are connected to the connecting device 54, the connecting device 54 is perpendicular to the plane of the three shunt ends; the clip of each two adjacent shunt ends The angles are equal, and the angle between every two adjacent shunt ends in this embodiment may be 120 degrees.
- the shunt ends 51, 52, and 53 are radially distributed uniformly with the connecting device 54 as a center; The parameters of the components of the device 54 to the respective branch ends 51, 52, 53 are the same; the combining end 50 is connected to the connecting device 54.
- the branching end 51 receives the spatial coupling signal of the shunting end 52 and the shunting end 53
- the shunting end 52 receives the spatial coupling signal of the shunting end 51 and the shunting end 53
- the shunting end 53 receives Spatial coupling signals to the shunt terminal 51 and the shunt terminal 52; since the respective shunt terminals (the shunt terminals 51, 52, and 53) are evenly distributed, and from the connecting device 54 to the respective shunt terminals (the shunt terminal 51,
- the parameters of the components of 52 and 53 are the same.
- the spatial coupling signals received by the respective split ends are equal. Therefore, when it is necessary to divide one signal into three signals, the signals of all the split ends are realized.
- the equal amplitude is in phase.
- the combining end 50 may be a microstrip line or a strip line, and when the combining end 50 is a microstrip line or a strip line At the same time, the combining end 50 is separated from the planes of the shunting ends 51, 52 and 53 by at least one ground plane, so that the combining end 50 does not have a signal passing space coupled to any shunt end.
- the connecting device 54 can be a via.
- the foregoing embodiment 1 shows a case where the embodiment of the present invention includes three branch end groups, and one split end group is a split end.
- the embodiment of the present invention is not limited to the above case, and the above described structure may also be applicable to more than three.
- the splitter combiner of the split end group may also be applicable to more than three.
- the copper foil pattern in the field of radio frequency, is also an element and is a distributed element.
- the three-dimensional structure of this graphic determines the parametric characteristics of this distributed component.
- the components are a general term, including distributed circuits, distributed elements, and lumped elements.
- the distributed components refer to various copper foil patterns on the PCB.
- the three-dimensional structure of the copper foil patterns determines Its characteristics.
- the lumped components are component, lead, and outline packages such as resistors, inductors, and capacitors supplied by component suppliers.
- FIG. 5 it is a schematic structural diagram of a two-way split combiner according to an embodiment of the present invention.
- the terminals are respectively shunt terminals 61, 62, 63, 64, 65, 66, 67 and 68; 8 shunt ends are located in the same plane, and 8 shunt ends are connected with a via 69, which can be used as a connection
- the device whose direction is perpendicular to the plane where the eight shunt ends (the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68) are located; every two adjacent shunt ends (the shunt ends 61, 62)
- the angles of 63, 64, 65, 66, 67 and 68 are equal.
- the angle between the split ends 61 and 62 is equal to the angle between any two adjacent split ends.
- the shunt ends are radially evenly distributed with the via 69 as a center; the parameters from the via 69 to the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68 are the same; Also not shown in FIG. 5 is a connection to the via 69.
- the combining end may be a cross section of the via 69.
- the branching end and the combining end may be connected without using the metallized via 69, for example, by connecting the center conductor of the coaxial connector or the like.
- the cross section of the coaxial connector may be a combined end.
- the respective split ends are evenly distributed, and the parameters of the components from the via 69 to the respective split ends are the same, the spatial coupling signals of the other split ends received by the respective split ends are also Etc. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are realized in the same amplitude and in phase.
- FIG. 6 it is a schematic structural diagram of a three-way split combiner according to an embodiment of the present invention.
- the split end group is eight, and one split end group is a split end.
- a resistor is connected in series between the eight shunt terminals and the connecting device 72, and the resistor can be a buried resistor or a surface-mounted resistor in the PCB, and is located at The plane where the split end is located.
- the shunt terminal 71 is connected to the connecting device 72 through a series resistor 74 and a microstrip line 75.
- the resistor 74 can be used for ultra-wideband impedance matching to improve the return loss of the shunt terminal 71.
- an impedance matching network 73 is provided between the connecting device 72 and the combining end 70. Looking from the impedance matching network 73 to the connecting device 72, since the impedances of the respective shunt terminals are connected in parallel, the impedance at the connecting device 72 is one eighth of the sum of the impedances of the shunt terminals and the series resistance, so the impedance is low.
- the impedance matching network 73 is used to connect the combining end 70 and the connecting device 72, and also functions to match the high impedance of the combining end 70 and the low impedance at the connecting device 72.
- the impedance matching network 73 may be a combination of more than one lumped element, a distributed element, and specifically, may be a conventional impedance transform line, that is, a 1/4 wavelength microstrip line (or strip line) of a center frequency, Of course, it is also possible to use a passive network such as RLC.
- the impedance matching network 73 and the combining end 70 are in the same plane, but are not in the plane of the shunt end, and are separated from the plane of the shunt end by at least one ground plane, so that the combining end 70 does not have signal through space coupling. To any branch.
- the connecting device 72 may be a metallized via
- the combining end 70 may be a microstrip line or a strip line
- the microstrip line or the strip line is connected to the metalized via.
- FIG. 7 it is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention.
- the road end group includes two branch ends, and a total of eight branch ends. That is to say, when the number of the shunt ends is an even number N, the two shunt ends can be grouped into one group to form N/2 shunt end groups.
- the eight shunt ends are located on the same plane, and one end thereof is connected to the connecting device 85, and the connecting device 85 is perpendicular to the plane of the eight shunt ends; each two adjacent shunt end groups (the shunt end) The angles of the groups 81, 82, 83 and 84) are equal.
- the four branch end groups are radially evenly distributed with the connecting device 85 as the center; from the respective branch end groups 81, 82, 83, The parameters of the components of the connecting device 85 are the same; the combining end 80 is connected to the connecting device 85, and the plane of the eight shunt ends is separated from the plane of the combining end 80 by at least one grounding layer.
- each shunt end group Since the angles of the adjacent shunt end groups are equal, the wiring and layout of each shunt end group are completely identical, so that each shunt end can receive the same amount of spatial coupling signals sent by the adjacent position shunt end, therefore, The signals at all branches are equal amplitude in phase.
- the connecting device 85 may be a via, and the combining end may be a microstrip line or a strip line.
- the embodiment of the present invention further provides a circuit board including a power split combiner, wherein the power split combiner can be any one of the embodiments described above in the power split combiner of the embodiment of the present invention, The branches of the device are placed on the same layer of the board.
- FIG. 8 is a schematic structural diagram of a circuit board having a power split combiner according to an embodiment of the present invention.
- the power split combiner of the circuit board 90 includes a combiner end 50 and at least three split end groups (shunt End groups 51, 52 and 53), wherein one shunt end group comprises one or two shunt ends; at least three shunt end groups have shunt ends located on the same plane, the shunt ends being perpendicular to the a planar connecting device 54 is connected, wherein the parameters connecting the branch end to the connecting device are the same, and the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and The plurality of branch terminals are disposed on the same layer of the circuit board.
- each of the shunt ends is evenly distributed, and from the connecting device to each The parameters of the components at the shunt end are the same, and the spatial coupling signals of the other shunt terminals received by the respective shunt terminals are also equal. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are equal in amplitude. Phase.
- the connecting device 54 may be a via, and the combining end may be a microstrip line or a strip line.
- the plane where the branch terminals 51, 52, 53 are located is separated from the plane where the junction terminal 50 is located by at least one ground layer, so that the junction end 50 can be coupled to any branch end without a signal passage space.
- the plane in which the shunt terminals 51, 52, 53 are located may be the surface layer of the circuit board 90.
- FIG. 9 it is a schematic cross-sectional view of the AA plane in FIG. 8 , wherein the plane 101 where the branch ends 51 , 52 , 53 are located is the surface layer of the circuit board 90 , and the combining end 50 is not in the surface layer, and the shunt end 51 ,
- the plane 101 where the 52, 53 is located is separated from the plane 102 where the combining end 50 is located by a grounding layer 103, and a grounding layer 104 is further disposed below the plane 102 where the combining end 50 is located.
- the plane 102 where the combining end 50 is located and the grounding layer 104 can exchange positions, and the plane 101 where the branching ends 51, 52, 53 are located and the plane 102 where the combining end 50 is located are separated by two grounding layers. , can also achieve the same technical effect.
- FIG. 10 it is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention.
- the circuit board 110 includes the power split combiner shown in FIG. 6, and is in every two adjacent points.
- a metallized via 111 is disposed between the ends of the road.
- a grounded metallized via 111 is disposed between the shunt end 71 and a shunt end adjacent to the left.
- the vias of these settings can be distributed in a circumferential symmetry, which is advantageous for the signals of the respective split ends to be reflowed consistently, and further ensures that the signals of the respective split ends are in the same phase.
- this can prevent the spatial coupling between the respective split ends and the combined ends, resulting in inconsistent isolation and avoiding changes in the amplitude or phase of the signals of the respective split ends; or, the combined end 70 is perpendicular to the split end The plane, such that the spatial coupling signals from the combining end 70 to the respective shunt ends are equal, so that the amplitude and phase changes of the signals of the respective shunt ends are the same, and the amplitude or phase of the signals of the respective shunt ends can be avoided.
- the circuit board 90 having the power split combiner has a connecting device 54 as a via, and the combining end 50 is a microstrip.
- the wire or the strip is illustrated.
- the connecting device 54 of the circuit board 90 having the combiner can also be a through hole, and the cross section of the through hole can be a combined end, which is in the embodiment of the present invention. Not limited to this.
- the embodiment of the present invention solves the problem that it is difficult to realize a small-volume N (N > 3 ) road equal-amplitude phase-phase power split combiner on a PCB.
- the power split combiner provided by the embodiment of the present invention The embedded in the PCB also has the advantage of occupying a small area.
- the embodiment of the present invention can be applied to a base station to ensure the performance of the base station. It is not limited thereto; although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or some of the technologies. The features are equivalent to the equivalents of the technical solutions of the embodiments of the embodiments of the present invention.
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Abstract
A power distributing combiner and circuit board having the power distributing combiner are provided. The power distributing combiner comprises a combining end and at least three dividing end groups; one dividing end group comprises one or two dividing ends; the at least three dividing end groups are located in the same plane; the dividing ends all connect with a connecting device which is vertical to the plane; the parameters of the elements which connect the dividing ends to the connecting device are same and the angles between each of two neighbor dividing end groups are same; the combining end connects with the connecting device.
Description
技术领域 Technical field
本发明涉及通信领域, 尤其涉及一种功分合路器及具有功分合路器的电 路板。 背景技术 The present invention relates to the field of communications, and in particular, to a power split combiner and a circuit board having a power split combiner. Background technique
在移动通信系统中, 功分合路器的应用很广泛。 在有些情况下, 要求功 分合路器的分路端的信号为等幅同相位, 也就是说, 要求各个分路端的微带 线接收到其他分路端的微带线的空间耦合信号相同。 In mobile communication systems, the application of power splitters is very extensive. In some cases, the signals at the shunt ends of the power combiner are required to be in the same phase, that is, the microstrip lines of the respective shunt ends are required to receive the same spatially coupled signals of the microstrip lines of the other shunt ends.
如图 1所示, 为现有技术中一分三威尔金森功分合路器的电路示意图, 其中 B0为四段微带线的交叉点, 在 PCB上, 微带线 B1B0、 B2B0和 B3B0 均为长度为中心频率的 1/4波长的阻抗变换线, 阻抗为 86.6欧姆,微带线 21、 22和 23的阻抗通常为 50欧姆。 第二分路端的微带线 22接收到第一分路端 的微带线 21和第三分路端的微带线 23的空间耦合信号; 由于第三分路端距 离第一分路端较远, 第一分路端的微带线 21接收到第三分路端的微带线 23 的空间耦合信号微弱, 可以忽略, 因此第一分路端的微带线 21基本上只接收 第二分路端的微带线 22的空间耦合信号; 同理, 第三分路端的微带线 23基 本上只接收第二分路端的微带线 22 的空间耦合信号。 根据信号矢量叠加原 理, 第一分路端的微带线 21接收到的信号与第三分路端相同, 第二分路端的 微带线 22接收到的信号与第一分路端、 第三分路端的不同, 分路端的信号幅 度不同, 同时还会影响各个分路端的相位, 所以, 一分三威尔金森功分合路 器在 PCB上难以实现等幅同相位。 As shown in FIG. 1 , it is a circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art, where B0 is the intersection of four microstrip lines, on the PCB, the microstrip lines B1B0, B2B0 and B3B0 Both are 1/4 wavelength impedance conversion lines with a center frequency and an impedance of 86.6 ohms. The impedance of the microstrip lines 21, 22 and 23 is typically 50 ohms. The microstrip line 22 at the second shunt end receives the spatial coupling signal of the microstrip line 21 of the first shunt end and the microstrip line 23 of the third shunt end; since the third shunt end is far from the first shunt end, The spatial coupling signal of the microstrip line 23 received by the microstrip line 21 at the first shunt end is weak and negligible, so that the microstrip line 21 of the first shunt end basically receives only the microstrip of the second shunt end. The spatially coupled signal of line 22; for the same reason, the microstrip line 23 at the third shunt end receives substantially only the spatially coupled signal of the microstrip line 22 at the second shunt end. According to the principle of signal vector superposition, the signal received by the microstrip line 21 of the first shunt end is the same as that of the third shunt end, and the signal received by the microstrip line 22 of the second shunt end is separated from the first shunt end and the third branch. The difference between the ends of the road, the signal amplitude of the split end is different, and it also affects the phase of each split end. Therefore, it is difficult to achieve equal amplitude and phase in one-by-three Wilkinson power split combiner on the PCB.
如图 2所示, 为现有技术中一种一分四威尔金森功分合路器的电路示意 图, 该功分合路器由一分二威尔金森功分合路器级联形成, 其中第一分路端 与第四分路端处于同样的边缘位置,第二分路端与第三分路端处于中间位置,
中间位置的分路端接收到的空间耦合信号多于边缘位置的分路端, 因此, 一 分四威尔金森功分合路器在 PCB上难以实现等幅同相位。 As shown in FIG. 2, it is a circuit diagram of a one-four-four Wilkinson power split combiner in the prior art, which is formed by a cascade of two Wilkinson power split combiners. The first shunt end and the fourth shunt end are in the same edge position, and the second shunt end and the third shunt end are in an intermediate position. The splitting end of the intermediate position receives more spatial coupling signals than the shunt ends of the edge position. Therefore, it is difficult to achieve equal amplitude in phase on the PCB by one minute and four Wilkinson power split combiners.
如图 3所示, 为现有技术中另一种一分四威尔金森功分合路器的电路示 意图, 这种功分合路器没有太多的微带线, 取而代之的是一块面积较大的铜 箔 40, 该铜箔 40连接在合路端和第一分路端、 第二分路端、 第三分路端、 第四分路端之间。 同样的道理, 中间位置的分路端 (第二分路端和第三分路 端)接收到的空间耦合信号多于边缘位置的分路端 (第一分路端和第四分路 端) , 所以难以实现等幅同相位。 As shown in FIG. 3, it is a circuit diagram of another one-fourth Wilkinson power split combiner in the prior art. The splitter combiner does not have too many microstrip lines, instead an area is compared. A large copper foil 40 is connected between the combining end and the first shunt end, the second shunt end, the third shunt end, and the fourth shunt end. By the same token, the shunt ends (second shunt end and third shunt end) in the middle position receive more spatial coupling signals than the shunt ends of the edge positions (first shunt end and fourth shunt end). , so it is difficult to achieve the same amplitude in phase.
综上所述, 釆用如上述结构的一分三威尔金森功分合路器或一分四威尔 金森功分合路器, 分路端彼此间的影响不一致, 导致分路端的信号难以实现 等幅同相位。 发明内容 In summary, using a three-dimensional Wilkinson power split combiner or a four-four Wilkinson power split combiner as described above, the effects of the split ends are inconsistent, resulting in a difficult signal at the split end. Realize the same amplitude in phase. Summary of the invention
本发明实施例提供了一种功分合路器及具有功分合路器的电路板, 当需 要将一路信号分为大于或等于 3路信号时, 保证分路端彼此间的影响一致, 从而使得所有分路端的信号可以实现等幅同相位。 The embodiment of the invention provides a power split combiner and a circuit board with a power split combiner. When it is required to divide one signal into three or more signals, the influence of the split ends is consistent with each other, thereby The signals of all the split ends can be achieved in the same amplitude and in phase.
本发明实施例提供了一种功分合路器, 包括合路端和至少三个分路端组, 其特征在于, 一个分路端组包括一个或两个分路端; 所述至少三个分路端组 的分路端位于同一平面, 该分路端均与垂直于该平面的连接装置连接, 其中, 连接该分路端至该连接装置的元件的参数相同, 每两个相邻分路端组的夹角 相等; 该合路端与该连接装置连接。 An embodiment of the present invention provides a power split combiner, including a combined end and at least three split end groups, wherein one split end group includes one or two split ends; the at least three The branch ends of the shunt end groups are located in the same plane, and the shunt ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the shunt ends to the connecting device are the same, each two adjacent points The corners of the road end group are equal; the joint end is connected to the connecting device.
本发明实施例提供了一种具有功分合路器的电路板, 该功分合路器包括 合路端和至少三个分路端组, 其中, 一个分路端组包括一个或两个分路端; 所述至少三个分路端组的分路端位于同一平面, 该分路端均与垂直于该平面 的连接装置连接, 其中, 连接该分路端至该连接装置的元件的参数相同, 每 两个相邻分路端组的夹角相等; 该合路端与该连接装置连接, 并且, 该数个 分路端设置在该电路板的同一层。
由上技术方案可以看出, 各个分路端组均为对称分布, 各个分路端接收 到的空间耦合等量, 因此, 所有分路端的信号实现了等幅同相位。 附图说明 实施例或现有技术描述中所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的附图仅仅是本发明的一些实施例, 对于本领域普通技术人员 来讲, 在不付出创造性劳动性的前提下, 还可以根据这些附图获得其他的 附图。 An embodiment of the present invention provides a circuit board having a power split combiner, the power split combiner includes a combined end and at least three split end groups, wherein one split end group includes one or two points a branch end; the branch ends of the at least three shunt end groups are located in the same plane, and the shunt ends are connected to a connecting device perpendicular to the plane, wherein parameters of the components connecting the shunt end to the connecting device Similarly, the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and the plurality of shunt ends are disposed on the same layer of the circuit board. It can be seen from the above technical solution that each of the shunt end groups is symmetrically distributed, and the spatial couplings received by the respective shunt ends are equal. Therefore, the signals of all the split ends achieve equal amplitude and the same phase. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are to be regarded as Other drawings may also be obtained from these drawings without the inventive labor.
图 1为现有技术中一分三威尔金森功分合路器的电路示意图; 1 is a schematic circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art;
图 2为现有技术中一种一分四威尔金森功分合路器的电路示意图; 图 3为现有技术中另一种一分四威尔金森功分合路器的电路示意图; 图 4为本发明实施例一功分合路器的结构示意图; 2 is a schematic circuit diagram of a one-four-four Wilkinson power split combiner in the prior art; FIG. 3 is a schematic circuit diagram of another one-four-four Wilkinson power split combiner in the prior art; 4 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention;
图 5为本发明实施例二功分合路器的结构示意图; FIG. 5 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention; FIG.
图 6为本发明实施例三功分合路器的结构示意图; 6 is a schematic structural diagram of a three-power split combiner according to an embodiment of the present invention;
图 7为本发明实施例四功分合路器的结构示意图; 7 is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention;
图 8为本发明实施例一具有功分合路器的电路板的结构示意图; 图 9为图 8中 A-A面的截面示意图; 8 is a schematic structural view of a circuit board having a power split combiner according to an embodiment of the present invention; FIG. 9 is a cross-sectional view of the A-A plane of FIG. 8;
图 10为本发明实施例二具有功分合路器的电路板的结构示意图。 具体实施方式 FIG. 10 is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention. detailed description
下面将结合本发明实施例中的附图, 对本发明实施例中的技术方案进行 清楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而 不是全部的实施例。 基于本发明中的实施例, 本领域普通技术人员在没有作 出创造性劳动前提下所获得的所有其他实施例, 都属于本发明保护的范围。 The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
除特别指明外, 本文所指的信号均指有一定带宽的调制信号。
本发明实施例提供的功分合路器包括合路端和至少三个分路端组,其中, 一个分路端组包括一个或两个分路端; 所述至少三个分路端组的分路端位于 同一平面, 该分路端均与垂直于该平面的连接装置连接, 其中, 连接该分路 端至该连接装置的元件的参数相同, 每两个相邻分路端组的夹角相等; 该合 路端与该连接装置连接。 Unless otherwise specified, the signals referred to herein refer to modulated signals with a certain bandwidth. The power split combiner provided by the embodiment of the present invention includes a combined end and at least three split end groups, wherein one split end group includes one or two split ends; and the at least three split end groups The branch ends are located in the same plane, and the branch ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the branch ends to the connecting device are the same, and the clamping of each two adjacent shunt end groups The angles are equal; the combined end is connected to the connecting device.
可以看出, 由于各个分路端为均匀分布, 并且从连接装置到各个分路端 的元件的参数相同, 根据信号矢量叠加原理, 各个分路端接收到的空间耦合 信号等量, 因此, 当需要将一路信号分为多路信号时, 所有分路端的信号实 现了等幅同相位。 It can be seen that since the respective split ends are evenly distributed, and the parameters of the components from the connecting device to the respective split ends are the same, according to the signal vector superposition principle, the spatial coupling signals received by the respective split ends are equal, and therefore, when needed When one signal is divided into multiple signals, the signals of all the split ends are realized in the same amplitude and in phase.
下面对本发明实施例一种功分合路器进行详细阐述: The following is a detailed description of a power split combiner according to an embodiment of the present invention:
如图 4所示, 为本发明实施例一功分合路器的结构示意图, 本实施例中分 路端组为 3个, 一个分路端组即为一个分路端。 具体地说, 本实施例功分合路 器包括合路端 50、 3个分路端以及连接装置 54, 其中 3个分路端分别为分路端 51、 52和 53。 分路端 51、 52和 53位于同一平面, 分路端 51、 52和 53均与连接 装置 54连接, 连接装置 54垂直于 3个分路端所在的平面; 每两个相邻分路端的 夹角相等, 本实施例中每两个相邻分路端的夹角可以为 120度, 从图 4可以看 出, 分路端 51、 52和 53以连接装置 54为圓心呈放射状均匀分布; 从连接装置 54到各分路端 51、 52、 53的元件的参数相同; 合路端 50与连接装置 54连接。 As shown in FIG. 4, it is a schematic structural diagram of a power split combiner according to an embodiment of the present invention. In this embodiment, three split end groups are used, and one split end group is a split end. Specifically, the power split combiner of the present embodiment includes a combining end 50, three branching ends, and a connecting device 54, wherein the three shunt ends are shunt ends 51, 52, and 53, respectively. The shunt terminals 51, 52 and 53 are located on the same plane, and the shunt terminals 51, 52 and 53 are connected to the connecting device 54, the connecting device 54 is perpendicular to the plane of the three shunt ends; the clip of each two adjacent shunt ends The angles are equal, and the angle between every two adjacent shunt ends in this embodiment may be 120 degrees. As can be seen from FIG. 4, the shunt ends 51, 52, and 53 are radially distributed uniformly with the connecting device 54 as a center; The parameters of the components of the device 54 to the respective branch ends 51, 52, 53 are the same; the combining end 50 is connected to the connecting device 54.
本实施例中, 分路端 51接收到分路端 52和分路端 53的空间耦合信号, 分 路端 52接收到分路端 51和分路端 53的空间耦合信号, 分路端 53接收到分路端 51和分路端 52的空间耦合信号; 由于各个分路端 (分路端 51、 52和 53 )为均 匀分布, 并且从连接装置 54到各个分路端 (分路端 51、 52和 53 ) 的元件的参 数相同, 根据信号矢量叠加原理, 各个分路端接收到的空间耦合信号等量, 因此, 当需要将一路信号分为 3路信号时, 所有分路端的信号实现了等幅同相 位。 In this embodiment, the branching end 51 receives the spatial coupling signal of the shunting end 52 and the shunting end 53, and the shunting end 52 receives the spatial coupling signal of the shunting end 51 and the shunting end 53, and the shunting end 53 receives Spatial coupling signals to the shunt terminal 51 and the shunt terminal 52; since the respective shunt terminals (the shunt terminals 51, 52, and 53) are evenly distributed, and from the connecting device 54 to the respective shunt terminals (the shunt terminal 51, The parameters of the components of 52 and 53 are the same. According to the principle of signal vector superposition, the spatial coupling signals received by the respective split ends are equal. Therefore, when it is necessary to divide one signal into three signals, the signals of all the split ends are realized. The equal amplitude is in phase.
其中, 合路端 50可以为微带线或带线状, 当合路端 50为微带线或带线状
时, 合路端 50与分路端 51、 52和 53所在平面相隔至少一层地平面, 这样, 合 路端 50不会有信号通过空间耦合到任何分路端。 连接装置 54可以为过孔。 Wherein, the combining end 50 may be a microstrip line or a strip line, and when the combining end 50 is a microstrip line or a strip line At the same time, the combining end 50 is separated from the planes of the shunting ends 51, 52 and 53 by at least one ground plane, so that the combining end 50 does not have a signal passing space coupled to any shunt end. The connecting device 54 can be a via.
上述实施例一示出了本发明实施例包括 3个分路端组、一个分路端组就是 一个分路端的情况, 本发明实施例不仅限于上述情况, 上述描述的结构还可 以适用于大于 3个分路端组的功分合路器。 The foregoing embodiment 1 shows a case where the embodiment of the present invention includes three branch end groups, and one split end group is a split end. The embodiment of the present invention is not limited to the above case, and the above described structure may also be applicable to more than three. The splitter combiner of the split end group.
需要说明的是, 对于本发明具体实施方式中阐述的元件, 在射频领域, 铜箔图形也是元件, 是分布式元件。 这种图形的三维结构, 决定了此分布式 元件的参数特征。元件是个总称,包含分布式元件 (distributed circuit, distributed element)和集总元件 (lumped circuit, lumped element) » 而分布式元件是指 PCB 上的各种铜箔图形, 铜箔图形的三维结构决定了其特征。 集总元件是元件供 应商提供的电阻、 电感、 电容等带有引脚和外形封装的元件。 It should be noted that, for the elements set forth in the specific embodiments of the present invention, in the field of radio frequency, the copper foil pattern is also an element and is a distributed element. The three-dimensional structure of this graphic determines the parametric characteristics of this distributed component. The components are a general term, including distributed circuits, distributed elements, and lumped elements. The distributed components refer to various copper foil patterns on the PCB. The three-dimensional structure of the copper foil patterns determines Its characteristics. The lumped components are component, lead, and outline packages such as resistors, inductors, and capacitors supplied by component suppliers.
如图 5所示, 为本发明实施例二功分合路器的结构示意图, 本实施例中分 路端组有 8个; 其中一个分路端组即为一个分路端, 8个分路端分别为分路端 61、 62、 63、 64、 65、 66、 67和 68; 8个分路端位于同一平面, 8个分路端与 一过孔 69连接, 该过孔 69可以作为连接装置, 其方向垂直于 8个分路端(分路 端 61、 62、 63、 64、 65、 66、 67和 68 ) 所在的平面; 每两个相邻分路端 (分 路端 61、 62、 63、 64、 65、 66、 67和 68 ) 的夹角相等, 例如: 分路端 61与 62 的夹角等于其他任意两个相邻分路端的夹角, 由图 5可以看出, 8个分路端以 该过孔 69为圓心呈放射状均匀分布; 从过孔 69到各分路端 61、 62、 63、 64、 65、 66、 67和 68的元件的参数相同; 合路端(图 5中未示出 )也与过孔 69连接。 其中, 对于图 5的这种方式, 也可以认为, 合路端可以为过孔 69的横截面。 As shown in FIG. 5, it is a schematic structural diagram of a two-way split combiner according to an embodiment of the present invention. In this embodiment, there are eight split end groups; one of the split end groups is one split end and eight branches. The terminals are respectively shunt terminals 61, 62, 63, 64, 65, 66, 67 and 68; 8 shunt ends are located in the same plane, and 8 shunt ends are connected with a via 69, which can be used as a connection The device, whose direction is perpendicular to the plane where the eight shunt ends (the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68) are located; every two adjacent shunt ends (the shunt ends 61, 62) The angles of 63, 64, 65, 66, 67 and 68 are equal. For example: The angle between the split ends 61 and 62 is equal to the angle between any two adjacent split ends. As can be seen from Fig. 5, 8 The shunt ends are radially evenly distributed with the via 69 as a center; the parameters from the via 69 to the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68 are the same; Also not shown in FIG. 5 is a connection to the via 69. Here, for the mode of Fig. 5, it is also considered that the combining end may be a cross section of the via 69.
本实施例也可以不釆用金属化过孔 69连接分路端和合路端, 例如, 釆用 同轴连接器的中心导体等方式连接。 其中, 对于釆用同轴连接器这种方式, 同轴连接器的横截面可以为合路端。 In this embodiment, the branching end and the combining end may be connected without using the metallized via 69, for example, by connecting the center conductor of the coaxial connector or the like. Wherein, for the coaxial connector, the cross section of the coaxial connector may be a combined end.
本实施例中, 由于各个分路端均为均匀分布, 并且从过孔 69到各个分路 端的元件的参数相同, 各个分路端接收到的其它分路端的空间耦合信号也相
等, 因此, 当需要将一路信号分为大于 3路信号时, 所有分路端的信号实现了 等幅同相位。 In this embodiment, since the respective split ends are evenly distributed, and the parameters of the components from the via 69 to the respective split ends are the same, the spatial coupling signals of the other split ends received by the respective split ends are also Etc. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are realized in the same amplitude and in phase.
如图 6所示, 为本发明实施例三功分合路器的结构示意图, 本实施例中分 路端组为 8个, 一个分路端组即为一个分路端。 As shown in FIG. 6 , it is a schematic structural diagram of a three-way split combiner according to an embodiment of the present invention. In this embodiment, the split end group is eight, and one split end group is a split end.
本实施例与实施例二的不同之处在于, 8个分路端与连接装置 72之间的微 带线上串联有电阻, 该电阻可以为 PCB内的埋阻或表面贴电阻器, 并位于分 路端所在的平面。 以其中一个分路端 71为例, 分路端 71通过串联的电阻 74和 微带线 75与连接装置 72连接, 该电阻 74可以用于超宽带阻抗匹配, 改善分路 端 71的回波损耗; 图 2和图 3中的现有技术存在太多的 1/4波长的阻抗变换线, 在频率低的情况下, 占用大量的 PCB面积, 但电阻 74的尺寸小, 在布局面积、 超宽带指标方面远优于 1/4波长的阻抗变换线; 并且, 由于所有的分路端都通 过微带线、 电阻连接到连接装置 72上, 这样, 改善了各个分路端之间的隔离 度。 The difference between this embodiment and the second embodiment is that a resistor is connected in series between the eight shunt terminals and the connecting device 72, and the resistor can be a buried resistor or a surface-mounted resistor in the PCB, and is located at The plane where the split end is located. Taking one of the shunt terminals 71 as an example, the shunt terminal 71 is connected to the connecting device 72 through a series resistor 74 and a microstrip line 75. The resistor 74 can be used for ultra-wideband impedance matching to improve the return loss of the shunt terminal 71. The prior art in Figures 2 and 3 has too many 1/4 wavelength impedance conversion lines, occupying a large amount of PCB area in the case of low frequency, but the size of the resistor 74 is small, in the layout area, ultra-wideband The index is far superior to the 1/4 wavelength impedance conversion line; and, since all the shunt ends are connected to the connecting device 72 through the microstrip line and the resistor, the isolation between the respective shunt ends is improved.
其中, 在连接装置 72与合路端 70之间设置有阻抗匹配网络 73。 从阻抗匹 配网络 73向连接装置 72看过去, 由于各分路端阻抗为并联连接, 连接装置 72 处的阻抗为各分路端阻抗与串联电阻值之和的八分之一, 所以阻抗很低, 该 阻抗匹配网络 73用于连接合路端 70与连接装置 72, 还起到匹配合路端 70的高 阻抗与连接装置 72处的低阻抗的作用。 该阻抗匹配网络 73可以为一个以上集 总元件、 分布式元件的组合, 具体地, 可以是常规的阻抗变换线, 即一段中 心频率的 1/4波长的微带线(或带状线) , 当然也可能釆用 RLC等无源网络构 成。 该阻抗匹配网络 73与合路端 70在同一平面内, 但都不在分路端所在平面, 并且与分路端所在平面相隔至少一层地平面, 使合路端 70不会有信号通过空 间耦合到任何分路端。 Therein, an impedance matching network 73 is provided between the connecting device 72 and the combining end 70. Looking from the impedance matching network 73 to the connecting device 72, since the impedances of the respective shunt terminals are connected in parallel, the impedance at the connecting device 72 is one eighth of the sum of the impedances of the shunt terminals and the series resistance, so the impedance is low. The impedance matching network 73 is used to connect the combining end 70 and the connecting device 72, and also functions to match the high impedance of the combining end 70 and the low impedance at the connecting device 72. The impedance matching network 73 may be a combination of more than one lumped element, a distributed element, and specifically, may be a conventional impedance transform line, that is, a 1/4 wavelength microstrip line (or strip line) of a center frequency, Of course, it is also possible to use a passive network such as RLC. The impedance matching network 73 and the combining end 70 are in the same plane, but are not in the plane of the shunt end, and are separated from the plane of the shunt end by at least one ground plane, so that the combining end 70 does not have signal through space coupling. To any branch.
由于各个分路端均通过微带线 75与连接装置 72相连, 如果分路端的数量 很多, 则微带线 75在连接装置 72周围形成了圓盘状铜箔 76, 该铜箔 76也可以 起到阻抗匹配的作用。
本实施例中, 连接装置 72可以为金属化过孔, 则合路端 70可以为微带线 或带状线, 微带线或带状线与金属化过孔连接。 Since each of the shunt ends is connected to the connecting device 72 through the microstrip line 75, if the number of shunting ends is large, the microstrip line 75 forms a disc-shaped copper foil 76 around the connecting device 72, and the copper foil 76 can also To the role of impedance matching. In this embodiment, the connecting device 72 may be a metallized via, and the combining end 70 may be a microstrip line or a strip line, and the microstrip line or the strip line is connected to the metalized via.
如图 7所示, 为本发明实施例四功分合路器的结构示意图, 本实施例中分 路端组为 4个, 分别为分路端组 81、 82、 83、 84, 每个分路端组包括两个分路 端, 共 8个分路端。 也就是说, 当分路端的个数为偶数 N时, 可以将两个分路 端分为一组, 构成 N/2个分路端组。 As shown in FIG. 7 , it is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention. In this embodiment, there are four split end groups, which are split end groups 81, 82, 83, and 84, respectively. The road end group includes two branch ends, and a total of eight branch ends. That is to say, when the number of the shunt ends is an even number N, the two shunt ends can be grouped into one group to form N/2 shunt end groups.
本实施例中, 8个分路端位于同一平面, 其一端均与连接装置 85连接, 该 连接装置 85垂直于 8个分路端所在平面; 每两个相邻分路端组(分路端组 81、 82、 83和 84 ) 的夹角相等, 由图 7可以看出, 4个分路端组以连接装置 85为圓 心呈放射状均匀分布; 从各个分路端组 81、 82、 83、 84到连接装置 85的元件 的参数相同; 合路端 80与连接装置 85连接, 且 8个分路端所在的平面与合路端 80所在的平面相隔至少一层接地层。 由于相邻分路端组的夹角相等, 使得每 个分路端组的布线和布局完全一致, 能够保证各个分路端接收到相邻位置分 路端发送的等量空间耦合信号, 因此, 所有分路端的信号实现了等幅同相位。 In this embodiment, the eight shunt ends are located on the same plane, and one end thereof is connected to the connecting device 85, and the connecting device 85 is perpendicular to the plane of the eight shunt ends; each two adjacent shunt end groups (the shunt end) The angles of the groups 81, 82, 83 and 84) are equal. As can be seen from Fig. 7, the four branch end groups are radially evenly distributed with the connecting device 85 as the center; from the respective branch end groups 81, 82, 83, The parameters of the components of the connecting device 85 are the same; the combining end 80 is connected to the connecting device 85, and the plane of the eight shunt ends is separated from the plane of the combining end 80 by at least one grounding layer. Since the angles of the adjacent shunt end groups are equal, the wiring and layout of each shunt end group are completely identical, so that each shunt end can receive the same amount of spatial coupling signals sent by the adjacent position shunt end, therefore, The signals at all branches are equal amplitude in phase.
其中, 该连接装置 85可以为过孔, 该合路端可以为微带线或带线状。 本发明实施例还提供了一种包括功分合路器的电路板, 其中功分合路器 可以为上述本发明实施例功分合路器中所述的任一实施例, 功分合路器的数 个分路端设置在电路板的同一层。 The connecting device 85 may be a via, and the combining end may be a microstrip line or a strip line. The embodiment of the present invention further provides a circuit board including a power split combiner, wherein the power split combiner can be any one of the embodiments described above in the power split combiner of the embodiment of the present invention, The branches of the device are placed on the same layer of the board.
如图 8所示, 为本发明实施例一具有功分合路器的电路板结构示意图, 该 电路板 90的功分合路器包括合路端 50和至少三个分路端组(分路端组 51、 52 和 53 ) , 其中, 一个分路端组包括一个或两个分路端; 至少三个分路端组的 分路端位于同一平面, 该分路端均与垂直于所述平面的连接装置 54连接, 其 中, 连接该分路端至该连接装置的元件的参数相同, 每两个相邻分路端组的 夹角相等; 该合路端与所述连接装置连接, 并且, 所述数个分路端设置在所 述电路板的同一层。 FIG. 8 is a schematic structural diagram of a circuit board having a power split combiner according to an embodiment of the present invention. The power split combiner of the circuit board 90 includes a combiner end 50 and at least three split end groups (shunt End groups 51, 52 and 53), wherein one shunt end group comprises one or two shunt ends; at least three shunt end groups have shunt ends located on the same plane, the shunt ends being perpendicular to the a planar connecting device 54 is connected, wherein the parameters connecting the branch end to the connecting device are the same, and the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and The plurality of branch terminals are disposed on the same layer of the circuit board.
由上可以看出, 由于各个分路端均为均匀分布, 并且从连接装置到各个
分路端的元件的参数相同, 各个分路端接收到的其它分路端的空间耦合信号 也相等, 因此, 当需要将一路信号分为大于 3路信号时, 所有分路端的信号实 现了等幅同相位。 As can be seen from the above, since each of the shunt ends is evenly distributed, and from the connecting device to each The parameters of the components at the shunt end are the same, and the spatial coupling signals of the other shunt terminals received by the respective shunt terminals are also equal. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are equal in amplitude. Phase.
其中, 该连接装置 54可以为过孔, 该合路端可以为微带线或带状线。 分 路端 51、 52、 53所在的平面与合路端 50所在的平面相隔至少一层接地层, 这 样, 可以使合路端 50不会有信号通过空间耦合到任何分路端。 分路端 51、 52、 53所在的平面可以为电路板 90的表面层。 The connecting device 54 may be a via, and the combining end may be a microstrip line or a strip line. The plane where the branch terminals 51, 52, 53 are located is separated from the plane where the junction terminal 50 is located by at least one ground layer, so that the junction end 50 can be coupled to any branch end without a signal passage space. The plane in which the shunt terminals 51, 52, 53 are located may be the surface layer of the circuit board 90.
如图 9所示, 为图 8中 A-A面的截面示意图, 其中分路端 51、 52、 53所在 的平面 101为电路板 90的表面层, 合路端 50不在表面层, 分路端 51、 52、 53 所在的平面 101与合路端 50所在的平面 102相隔一层接地层 103 ,合路端 50所在 的平面 102的下面还设有一层接地层 104。 作为另外一种实施方式, 合路端 50 所在的平面 102和接地层 104可以交换位置, 则分路端 51、 52、 53所在的平面 101与合路端 50所在的平面 102相隔两层接地层,也可以达到同样的技术效果。 As shown in FIG. 9 , it is a schematic cross-sectional view of the AA plane in FIG. 8 , wherein the plane 101 where the branch ends 51 , 52 , 53 are located is the surface layer of the circuit board 90 , and the combining end 50 is not in the surface layer, and the shunt end 51 , The plane 101 where the 52, 53 is located is separated from the plane 102 where the combining end 50 is located by a grounding layer 103, and a grounding layer 104 is further disposed below the plane 102 where the combining end 50 is located. As another embodiment, the plane 102 where the combining end 50 is located and the grounding layer 104 can exchange positions, and the plane 101 where the branching ends 51, 52, 53 are located and the plane 102 where the combining end 50 is located are separated by two grounding layers. , can also achieve the same technical effect.
如图 10所示,为本发明实施例二具有功分合路器的电路板的结构示意图, 电路板 110包括图 6所示的功分合路器, 并且, 在每两个相邻的分路端之间设 置有金属化过孔 111 , 例如: 在分路端 71与其左相邻的分路端间设置有接地的 金属化过孔 111。 这些设置的过孔可以呈圓周对称状分布, 利于各个分路端信 号回流一致, 进一步保证各个分路端信号的等幅同相位。
As shown in FIG. 10, it is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention. The circuit board 110 includes the power split combiner shown in FIG. 6, and is in every two adjacent points. A metallized via 111 is disposed between the ends of the road. For example, a grounded metallized via 111 is disposed between the shunt end 71 and a shunt end adjacent to the left. The vias of these settings can be distributed in a circumferential symmetry, which is advantageous for the signals of the respective split ends to be reflowed consistently, and further ensures that the signals of the respective split ends are in the same phase.
层, 这样可以防止各个分路端与合路端之间的空间耦合, 从而导致隔离度不 一致, 避免各个分路端信号的幅度或相位发生变化; 或者, 合路端 70垂直于 分路端所在的平面, 这样合路端 70至各个分路端的空间耦合信号是等量的, 使各个分路端信号的幅度和相位变化相同, 也能避免各个分路端信号的幅度 或相位不一致。 Layer, this can prevent the spatial coupling between the respective split ends and the combined ends, resulting in inconsistent isolation and avoiding changes in the amplitude or phase of the signals of the respective split ends; or, the combined end 70 is perpendicular to the split end The plane, such that the spatial coupling signals from the combining end 70 to the respective shunt ends are equal, so that the amplitude and phase changes of the signals of the respective shunt ends are the same, and the amplitude or phase of the signals of the respective shunt ends can be avoided.
上述具有功分合路器的电路板 90以连接装置 54为过孔, 合路端 50为微带
线或带线状进行了阐述, 可以理解的是, 该具有合路器的电路板 90的连接装 置 54也可以为过孔, 其过孔的横截面可以为合路端, 本发明实施例并不局限 于此。 The circuit board 90 having the power split combiner has a connecting device 54 as a via, and the combining end 50 is a microstrip. The wire or the strip is illustrated. It can be understood that the connecting device 54 of the circuit board 90 having the combiner can also be a through hole, and the cross section of the through hole can be a combined end, which is in the embodiment of the present invention. Not limited to this.
综上所述, 本发明实施例解决了在 PCB上艮难实现小体积的 N ( N > 3 ) 路等幅同相位功分合路器的问题; 本发明实施例提供的功分合路器嵌入在 PCB内, 还具有占用面积较小的优点; 本发明实施例可以应用到基站中, 能 够保证基站的性能。 非对其限制; 尽管参照前述实施例对本发明实施例进行了详细的说明, 本领 域的普通技术人员应当理解: 其依然可以对前述各实施例所记载的技术方案 进行修改, 或者对其中部分技术特征进行等同替换; 而这些修改或者替换, 并不使相应技术方案的本质脱离本发明实施例各实施例技术方案的精神和范 围。
In summary, the embodiment of the present invention solves the problem that it is difficult to realize a small-volume N (N > 3 ) road equal-amplitude phase-phase power split combiner on a PCB. The power split combiner provided by the embodiment of the present invention The embedded in the PCB also has the advantage of occupying a small area. The embodiment of the present invention can be applied to a base station to ensure the performance of the base station. It is not limited thereto; although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or some of the technologies. The features are equivalent to the equivalents of the technical solutions of the embodiments of the embodiments of the present invention.
Claims
1、 一种功分合路器, 包括合路端和至少三个分路端组, 其特征在于, 一 个分路端组包括一个或两个分路端; 所述至少三个分路端组的分路端位于同 一平面, 所述分路端均与垂直于所述平面的连接装置连接, 其中, 连接所述 分路端至所述连接装置的元件的参数相同,每两个相邻分路端组的夹角相等; 所述合路端与所述连接装置连接。 What is claimed is: 1. A power split combiner comprising: a combiner end and at least three split end groups, wherein one split end group includes one or two split ends; and the at least three split end groups The branch ends are located in the same plane, and the branch ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the branch ends to the components of the connecting device are the same, each two adjacent points The angles of the road end groups are equal; the combined end is connected to the connecting device.
2、 根据权利要求 1所述的功分合路器, 其特征在于, 所述连接装置为过 孔或同轴连接器或同轴电缆, 所述过孔或同轴连接器或同轴电缆的横截面为 所述合路端。 2. The power split combiner according to claim 1, wherein the connecting device is a via or coaxial connector or a coaxial cable, the via or coaxial connector or coaxial cable The cross section is the combined end.
3、 根据权利要求 1所述的功分合路器, 其特征在于, 所述合路端与所述 分路端所在的平面相隔至少一层地平面。 3. The power split combiner according to claim 1, wherein the combining end is separated from the plane in which the branch end is located by at least one ground plane.
4、 根据权利要求 3所述的功分合路器, 其特征在于, 所述合路端为微带 线或带线状。 The power split combiner according to claim 3, wherein the combined end is a microstrip line or a strip line.
5、 根据权利要求 3所述的功分合路器, 其特征在于, 所述分路端均与垂 直于所述平面的连接装置连接为: 所述分路端分别通过微带线或带状线与垂 直于所述平面的所述连接装置连接。 The power split combiner according to claim 3, wherein the branch ends are connected to a connecting device perpendicular to the plane: the split ends respectively pass through a microstrip line or a strip The wire is connected to the connecting means perpendicular to the plane.
6、 根据权利要求 3所述的功分合路器, 其特征在于, 所述合路端与所述 连接装置连接为: 所述合路端通过阻抗匹配网络与所述连接装置连接。 The power split combiner according to claim 3, wherein the combining end is connected to the connecting device such that: the combining end is connected to the connecting device through an impedance matching network.
7、 根据权利要求 5所述的功分合路器, 其特征在于, 所述分路端与所述 连接装置之间的微带线串联有电阻。 The power split combiner according to claim 5, wherein the microstrip line between the shunt end and the connecting device has a resistor connected in series.
8、 一种具有功分合路器的电路板, 所述功分合路器包括合路端和至少三 个分路端组, 其特征在于, 一个分路端组包括一个或两个分路端; 所述至少 三个分路端组的分路端位于同一平面, 所述分路端均与垂直于所述平面的连 接装置连接, 其中, 连接所述分路端至所述连接装置的元件的参数相同, 每 两个相邻分路端组的夹角相等; 所述合路端与所述连接装置连接, 并且, 所 述数个分路端设置在所述电路板的同一层。
8. A circuit board having a power split combiner, the power split combiner comprising a combined end and at least three shunt end sets, wherein one shunt end group includes one or two shunts The split ends of the at least three split end groups are located in the same plane, and the split ends are connected to the connecting device perpendicular to the plane, wherein the branch end is connected to the connecting device The parameters of the components are the same, the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and the plurality of shunt ends are disposed on the same layer of the circuit board.
9、 根据权利要求 8所述的电路板, 其特征在于, 所述连接装置为过孔或 同轴连接器或同轴电缆, 所述过孔或同轴连接器或同轴电缆的横截面为所述 合路端。 9. The circuit board according to claim 8, wherein the connecting device is a via or coaxial connector or a coaxial cable, and the cross section of the via or coaxial connector or coaxial cable is The combined end.
10、 根据权利要求 8所述的电路板, 其特征在于, 每两个相邻的分路端 组间设置有接地的金属化过孔。 10. The circuit board according to claim 8, wherein a grounded metallized via is disposed between each two adjacent shunt end groups.
11、 根据权利要求 8所述的电路板, 其特征在于, 所述合路端与所述分 路端所在的平面相隔至少一层地平面。 11. The circuit board according to claim 8, wherein the combining end is separated from the plane in which the branch end is located by at least one ground plane.
12、 根据权利要求 11所述的电路板, 其特征在于, 每两个相邻的分路端 组间设置有接地的金属化过孔。 12. The circuit board according to claim 11, wherein a grounded metallized via is disposed between each two adjacent shunt end groups.
13、 根据权利要求 11所述的电路板, 其特征在于, 所述分路端均与垂直 于所述平面的连接装置连接为: 所述分路端分别通过微带线或带状线与垂直 于所述平面的所述连接装置连接。 The circuit board according to claim 11, wherein the branching ends are connected to a connecting device perpendicular to the plane: the branching ends respectively pass through a microstrip line or a strip line and a vertical line The connecting means on the plane are connected.
14、 根据权利要求 11所述的电路板, 其特征在于, 所述合路端与所述连 接装置连接为: 所述合路端通过阻抗匹配网络与所述连接装置连接。 The circuit board according to claim 11, wherein the combining end is connected to the connecting device such that: the combining end is connected to the connecting device through an impedance matching network.
15、 根据权利要求 13所述的电路板, 其特征在于, 所述分路端与所述连 接装置之间的微带线串联有电阻。 The circuit board according to claim 13, wherein the microstrip line between the shunt end and the connecting device has a resistor connected in series.
16、 根据权利要求 11所述的电路板, 其特征在于, 所述合路端为微带线 或带线状。
The circuit board according to claim 11, wherein the combining end is a microstrip line or a strip line.
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CN1380718A (en) * | 2002-05-31 | 2002-11-20 | 陈兆武 | High-power multi-path synthesis/distributor |
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US20070070957A1 (en) * | 2005-09-23 | 2007-03-29 | Wayout Wireless, Llc | Multiple beam antenna base station |
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