WO2010088797A1

WO2010088797A1 - Power distributing combiner and circuit board having power distributing combiner

Info

Publication number: WO2010088797A1
Application number: PCT/CN2009/070358
Authority: WO
Inventors: 何平华; 龚兰平; 李莹君; 邓亮辉
Original assignee: 华为技术有限公司
Priority date: 2009-02-04
Filing date: 2009-02-04
Publication date: 2010-08-12
Also published as: CN102301619A

Abstract

A power distributing combiner and circuit board having the power distributing combiner are provided. The power distributing combiner comprises a combining end and at least three dividing end groups; one dividing end group comprises one or two dividing ends; the at least three dividing end groups are located in the same plane; the dividing ends all connect with a connecting device which is vertical to the plane; the parameters of the elements which connect the dividing ends to the connecting device are same and the angles between each of two neighbor dividing end groups are same; the combining end connects with the connecting device.

Description

Technical field

The present invention relates to the field of communications, and in particular, to a power split combiner and a circuit board having a power split combiner. Background technique

In mobile communication systems, the application of power splitters is very extensive. In some cases, the signals at the shunt ends of the power combiner are required to be in the same phase, that is, the microstrip lines of the respective shunt ends are required to receive the same spatially coupled signals of the microstrip lines of the other shunt ends.

As shown in FIG. 1 , it is a circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art, where B0 is the intersection of four microstrip lines, on the PCB, the microstrip lines B1B0, B2B0 and B3B0 Both are 1/4 wavelength impedance conversion lines with a center frequency and an impedance of 86.6 ohms. The impedance of the microstrip lines 21, 22 and 23 is typically 50 ohms. The microstrip line 22 at the second shunt end receives the spatial coupling signal of the microstrip line 21 of the first shunt end and the microstrip line 23 of the third shunt end; since the third shunt end is far from the first shunt end, The spatial coupling signal of the microstrip line 23 received by the microstrip line 21 at the first shunt end is weak and negligible, so that the microstrip line 21 of the first shunt end basically receives only the microstrip of the second shunt end. The spatially coupled signal of line 22; for the same reason, the microstrip line 23 at the third shunt end receives substantially only the spatially coupled signal of the microstrip line 22 at the second shunt end. According to the principle of signal vector superposition, the signal received by the microstrip line 21 of the first shunt end is the same as that of the third shunt end, and the signal received by the microstrip line 22 of the second shunt end is separated from the first shunt end and the third branch. The difference between the ends of the road, the signal amplitude of the split end is different, and it also affects the phase of each split end. Therefore, it is difficult to achieve equal amplitude and phase in one-by-three Wilkinson power split combiner on the PCB.

As shown in FIG. 2, it is a circuit diagram of a one-four-four Wilkinson power split combiner in the prior art, which is formed by a cascade of two Wilkinson power split combiners. The first shunt end and the fourth shunt end are in the same edge position, and the second shunt end and the third shunt end are in an intermediate position. The splitting end of the intermediate position receives more spatial coupling signals than the shunt ends of the edge position. Therefore, it is difficult to achieve equal amplitude in phase on the PCB by one minute and four Wilkinson power split combiners.

As shown in FIG. 3, it is a circuit diagram of another one-fourth Wilkinson power split combiner in the prior art. The splitter combiner does not have too many microstrip lines, instead an area is compared. A large copper foil 40 is connected between the combining end and the first shunt end, the second shunt end, the third shunt end, and the fourth shunt end. By the same token, the shunt ends (second shunt end and third shunt end) in the middle position receive more spatial coupling signals than the shunt ends of the edge positions (first shunt end and fourth shunt end). , so it is difficult to achieve the same amplitude in phase.

In summary, using a three-dimensional Wilkinson power split combiner or a four-four Wilkinson power split combiner as described above, the effects of the split ends are inconsistent, resulting in a difficult signal at the split end. Realize the same amplitude in phase. Summary of the invention

The embodiment of the invention provides a power split combiner and a circuit board with a power split combiner. When it is required to divide one signal into three or more signals, the influence of the split ends is consistent with each other, thereby The signals of all the split ends can be achieved in the same amplitude and in phase.

An embodiment of the present invention provides a power split combiner, including a combined end and at least three split end groups, wherein one split end group includes one or two split ends; the at least three The branch ends of the shunt end groups are located in the same plane, and the shunt ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the shunt ends to the connecting device are the same, each two adjacent points The corners of the road end group are equal; the joint end is connected to the connecting device.

An embodiment of the present invention provides a circuit board having a power split combiner, the power split combiner includes a combined end and at least three split end groups, wherein one split end group includes one or two points a branch end; the branch ends of the at least three shunt end groups are located in the same plane, and the shunt ends are connected to a connecting device perpendicular to the plane, wherein parameters of the components connecting the shunt end to the connecting device Similarly, the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and the plurality of shunt ends are disposed on the same layer of the circuit board. It can be seen from the above technical solution that each of the shunt end groups is symmetrically distributed, and the spatial couplings received by the respective shunt ends are equal. Therefore, the signals of all the split ends achieve equal amplitude and the same phase. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are to be regarded as Other drawings may also be obtained from these drawings without the inventive labor.

1 is a schematic circuit diagram of a three-dimensional Wilkinson power split combiner in the prior art;

2 is a schematic circuit diagram of a one-four-four Wilkinson power split combiner in the prior art; FIG. 3 is a schematic circuit diagram of another one-four-four Wilkinson power split combiner in the prior art; 4 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a power split combiner according to an embodiment of the present invention; FIG.

6 is a schematic structural diagram of a three-power split combiner according to an embodiment of the present invention;

7 is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention;

8 is a schematic structural view of a circuit board having a power split combiner according to an embodiment of the present invention; FIG. 9 is a cross-sectional view of the A-A plane of FIG. 8;

FIG. 10 is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention. detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Unless otherwise specified, the signals referred to herein refer to modulated signals with a certain bandwidth. The power split combiner provided by the embodiment of the present invention includes a combined end and at least three split end groups, wherein one split end group includes one or two split ends; and the at least three split end groups The branch ends are located in the same plane, and the branch ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the branch ends to the connecting device are the same, and the clamping of each two adjacent shunt end groups The angles are equal; the combined end is connected to the connecting device.

It can be seen that since the respective split ends are evenly distributed, and the parameters of the components from the connecting device to the respective split ends are the same, according to the signal vector superposition principle, the spatial coupling signals received by the respective split ends are equal, and therefore, when needed When one signal is divided into multiple signals, the signals of all the split ends are realized in the same amplitude and in phase.

The following is a detailed description of a power split combiner according to an embodiment of the present invention:

As shown in FIG. 4, it is a schematic structural diagram of a power split combiner according to an embodiment of the present invention. In this embodiment, three split end groups are used, and one split end group is a split end. Specifically, the power split combiner of the present embodiment includes a combining end 50, three branching ends, and a connecting device 54, wherein the three shunt ends are shunt ends 51, 52, and 53, respectively. The shunt terminals 51, 52 and 53 are located on the same plane, and the shunt terminals 51, 52 and 53 are connected to the connecting device 54, the connecting device 54 is perpendicular to the plane of the three shunt ends; the clip of each two adjacent shunt ends The angles are equal, and the angle between every two adjacent shunt ends in this embodiment may be 120 degrees. As can be seen from FIG. 4, the shunt ends 51, 52, and 53 are radially distributed uniformly with the connecting device 54 as a center; The parameters of the components of the device 54 to the respective branch ends 51, 52, 53 are the same; the combining end 50 is connected to the connecting device 54.

In this embodiment, the branching end 51 receives the spatial coupling signal of the shunting end 52 and the shunting end 53, and the shunting end 52 receives the spatial coupling signal of the shunting end 51 and the shunting end 53, and the shunting end 53 receives Spatial coupling signals to the shunt terminal 51 and the shunt terminal 52; since the respective shunt terminals (the shunt terminals 51, 52, and 53) are evenly distributed, and from the connecting device 54 to the respective shunt terminals (the shunt terminal 51, The parameters of the components of 52 and 53 are the same. According to the principle of signal vector superposition, the spatial coupling signals received by the respective split ends are equal. Therefore, when it is necessary to divide one signal into three signals, the signals of all the split ends are realized. The equal amplitude is in phase.

Wherein, the combining end 50 may be a microstrip line or a strip line, and when the combining end 50 is a microstrip line or a strip line At the same time, the combining end 50 is separated from the planes of the shunting ends 51, 52 and 53 by at least one ground plane, so that the combining end 50 does not have a signal passing space coupled to any shunt end. The connecting device 54 can be a via.

The foregoing embodiment 1 shows a case where the embodiment of the present invention includes three branch end groups, and one split end group is a split end. The embodiment of the present invention is not limited to the above case, and the above described structure may also be applicable to more than three. The splitter combiner of the split end group.

It should be noted that, for the elements set forth in the specific embodiments of the present invention, in the field of radio frequency, the copper foil pattern is also an element and is a distributed element. The three-dimensional structure of this graphic determines the parametric characteristics of this distributed component. The components are a general term, including distributed circuits, distributed elements, and lumped elements. The distributed components refer to various copper foil patterns on the PCB. The three-dimensional structure of the copper foil patterns determines Its characteristics. The lumped components are component, lead, and outline packages such as resistors, inductors, and capacitors supplied by component suppliers.

As shown in FIG. 5, it is a schematic structural diagram of a two-way split combiner according to an embodiment of the present invention. In this embodiment, there are eight split end groups; one of the split end groups is one split end and eight branches. The terminals are respectively shunt terminals 61, 62, 63, 64, 65, 66, 67 and 68; 8 shunt ends are located in the same plane, and 8 shunt ends are connected with a via 69, which can be used as a connection The device, whose direction is perpendicular to the plane where the eight shunt ends (the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68) are located; every two adjacent shunt ends (the shunt ends 61, 62) The angles of 63, 64, 65, 66, 67 and 68 are equal. For example: The angle between the split ends 61 and 62 is equal to the angle between any two adjacent split ends. As can be seen from Fig. 5, 8 The shunt ends are radially evenly distributed with the via 69 as a center; the parameters from the via 69 to the shunt ends 61, 62, 63, 64, 65, 66, 67 and 68 are the same; Also not shown in FIG. 5 is a connection to the via 69. Here, for the mode of Fig. 5, it is also considered that the combining end may be a cross section of the via 69.

In this embodiment, the branching end and the combining end may be connected without using the metallized via 69, for example, by connecting the center conductor of the coaxial connector or the like. Wherein, for the coaxial connector, the cross section of the coaxial connector may be a combined end.

In this embodiment, since the respective split ends are evenly distributed, and the parameters of the components from the via 69 to the respective split ends are the same, the spatial coupling signals of the other split ends received by the respective split ends are also Etc. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are realized in the same amplitude and in phase.

As shown in FIG. 6 , it is a schematic structural diagram of a three-way split combiner according to an embodiment of the present invention. In this embodiment, the split end group is eight, and one split end group is a split end.

The difference between this embodiment and the second embodiment is that a resistor is connected in series between the eight shunt terminals and the connecting device 72, and the resistor can be a buried resistor or a surface-mounted resistor in the PCB, and is located at The plane where the split end is located. Taking one of the shunt terminals 71 as an example, the shunt terminal 71 is connected to the connecting device 72 through a series resistor 74 and a microstrip line 75. The resistor 74 can be used for ultra-wideband impedance matching to improve the return loss of the shunt terminal 71. The prior art in Figures 2 and 3 has too many 1/4 wavelength impedance conversion lines, occupying a large amount of PCB area in the case of low frequency, but the size of the resistor 74 is small, in the layout area, ultra-wideband The index is far superior to the 1/4 wavelength impedance conversion line; and, since all the shunt ends are connected to the connecting device 72 through the microstrip line and the resistor, the isolation between the respective shunt ends is improved.

Therein, an impedance matching network 73 is provided between the connecting device 72 and the combining end 70. Looking from the impedance matching network 73 to the connecting device 72, since the impedances of the respective shunt terminals are connected in parallel, the impedance at the connecting device 72 is one eighth of the sum of the impedances of the shunt terminals and the series resistance, so the impedance is low. The impedance matching network 73 is used to connect the combining end 70 and the connecting device 72, and also functions to match the high impedance of the combining end 70 and the low impedance at the connecting device 72. The impedance matching network 73 may be a combination of more than one lumped element, a distributed element, and specifically, may be a conventional impedance transform line, that is, a 1/4 wavelength microstrip line (or strip line) of a center frequency, Of course, it is also possible to use a passive network such as RLC. The impedance matching network 73 and the combining end 70 are in the same plane, but are not in the plane of the shunt end, and are separated from the plane of the shunt end by at least one ground plane, so that the combining end 70 does not have signal through space coupling. To any branch.

Since each of the shunt ends is connected to the connecting device 72 through the microstrip line 75, if the number of shunting ends is large, the microstrip line 75 forms a disc-shaped copper foil 76 around the connecting device 72, and the copper foil 76 can also To the role of impedance matching. In this embodiment, the connecting device 72 may be a metallized via, and the combining end 70 may be a microstrip line or a strip line, and the microstrip line or the strip line is connected to the metalized via.

As shown in FIG. 7 , it is a schematic structural diagram of a four-power split combiner according to an embodiment of the present invention. In this embodiment, there are four split end groups, which are split end groups 81, 82, 83, and 84, respectively. The road end group includes two branch ends, and a total of eight branch ends. That is to say, when the number of the shunt ends is an even number N, the two shunt ends can be grouped into one group to form N/2 shunt end groups.

In this embodiment, the eight shunt ends are located on the same plane, and one end thereof is connected to the connecting device 85, and the connecting device 85 is perpendicular to the plane of the eight shunt ends; each two adjacent shunt end groups (the shunt end) The angles of the groups 81, 82, 83 and 84) are equal. As can be seen from Fig. 7, the four branch end groups are radially evenly distributed with the connecting device 85 as the center; from the respective branch end groups 81, 82, 83, The parameters of the components of the connecting device 85 are the same; the combining end 80 is connected to the connecting device 85, and the plane of the eight shunt ends is separated from the plane of the combining end 80 by at least one grounding layer. Since the angles of the adjacent shunt end groups are equal, the wiring and layout of each shunt end group are completely identical, so that each shunt end can receive the same amount of spatial coupling signals sent by the adjacent position shunt end, therefore, The signals at all branches are equal amplitude in phase.

The connecting device 85 may be a via, and the combining end may be a microstrip line or a strip line. The embodiment of the present invention further provides a circuit board including a power split combiner, wherein the power split combiner can be any one of the embodiments described above in the power split combiner of the embodiment of the present invention, The branches of the device are placed on the same layer of the board.

FIG. 8 is a schematic structural diagram of a circuit board having a power split combiner according to an embodiment of the present invention. The power split combiner of the circuit board 90 includes a combiner end 50 and at least three split end groups (shunt End groups 51, 52 and 53), wherein one shunt end group comprises one or two shunt ends; at least three shunt end groups have shunt ends located on the same plane, the shunt ends being perpendicular to the a planar connecting device 54 is connected, wherein the parameters connecting the branch end to the connecting device are the same, and the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and The plurality of branch terminals are disposed on the same layer of the circuit board.

As can be seen from the above, since each of the shunt ends is evenly distributed, and from the connecting device to each The parameters of the components at the shunt end are the same, and the spatial coupling signals of the other shunt terminals received by the respective shunt terminals are also equal. Therefore, when it is necessary to divide one signal into more than three signals, the signals of all the split ends are equal in amplitude. Phase.

The connecting device 54 may be a via, and the combining end may be a microstrip line or a strip line. The plane where the branch terminals 51, 52, 53 are located is separated from the plane where the junction terminal 50 is located by at least one ground layer, so that the junction end 50 can be coupled to any branch end without a signal passage space. The plane in which the shunt terminals 51, 52, 53 are located may be the surface layer of the circuit board 90.

As shown in FIG. 9 , it is a schematic cross-sectional view of the AA plane in FIG. 8 , wherein the plane 101 where the branch ends 51 , 52 , 53 are located is the surface layer of the circuit board 90 , and the combining end 50 is not in the surface layer, and the shunt end 51 , The plane 101 where the 52, 53 is located is separated from the plane 102 where the combining end 50 is located by a grounding layer 103, and a grounding layer 104 is further disposed below the plane 102 where the combining end 50 is located. As another embodiment, the plane 102 where the combining end 50 is located and the grounding layer 104 can exchange positions, and the plane 101 where the branching ends 51, 52, 53 are located and the plane 102 where the combining end 50 is located are separated by two grounding layers. , can also achieve the same technical effect.

As shown in FIG. 10, it is a schematic structural diagram of a circuit board having a power split combiner according to Embodiment 2 of the present invention. The circuit board 110 includes the power split combiner shown in FIG. 6, and is in every two adjacent points. A metallized via 111 is disposed between the ends of the road. For example, a grounded metallized via 111 is disposed between the shunt end 71 and a shunt end adjacent to the left. The vias of these settings can be distributed in a circumferential symmetry, which is advantageous for the signals of the respective split ends to be reflowed consistently, and further ensures that the signals of the respective split ends are in the same phase.

Layer, this can prevent the spatial coupling between the respective split ends and the combined ends, resulting in inconsistent isolation and avoiding changes in the amplitude or phase of the signals of the respective split ends; or, the combined end 70 is perpendicular to the split end The plane, such that the spatial coupling signals from the combining end 70 to the respective shunt ends are equal, so that the amplitude and phase changes of the signals of the respective shunt ends are the same, and the amplitude or phase of the signals of the respective shunt ends can be avoided.

The circuit board 90 having the power split combiner has a connecting device 54 as a via, and the combining end 50 is a microstrip. The wire or the strip is illustrated. It can be understood that the connecting device 54 of the circuit board 90 having the combiner can also be a through hole, and the cross section of the through hole can be a combined end, which is in the embodiment of the present invention. Not limited to this.

In summary, the embodiment of the present invention solves the problem that it is difficult to realize a small-volume N (N > 3 ) road equal-amplitude phase-phase power split combiner on a PCB. The power split combiner provided by the embodiment of the present invention The embedded in the PCB also has the advantage of occupying a small area. The embodiment of the present invention can be applied to a base station to ensure the performance of the base station. It is not limited thereto; although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or some of the technologies. The features are equivalent to the equivalents of the technical solutions of the embodiments of the embodiments of the present invention.

Claims

Rights request

What is claimed is: 1. A power split combiner comprising: a combiner end and at least three split end groups, wherein one split end group includes one or two split ends; and the at least three split end groups The branch ends are located in the same plane, and the branch ends are connected to the connecting device perpendicular to the plane, wherein the parameters connecting the branch ends to the components of the connecting device are the same, each two adjacent points The angles of the road end groups are equal; the combined end is connected to the connecting device.

2. The power split combiner according to claim 1, wherein the connecting device is a via or coaxial connector or a coaxial cable, the via or coaxial connector or coaxial cable The cross section is the combined end.

3. The power split combiner according to claim 1, wherein the combining end is separated from the plane in which the branch end is located by at least one ground plane.

The power split combiner according to claim 3, wherein the combined end is a microstrip line or a strip line.

The power split combiner according to claim 3, wherein the branch ends are connected to a connecting device perpendicular to the plane: the split ends respectively pass through a microstrip line or a strip The wire is connected to the connecting means perpendicular to the plane.

The power split combiner according to claim 3, wherein the combining end is connected to the connecting device such that: the combining end is connected to the connecting device through an impedance matching network.

The power split combiner according to claim 5, wherein the microstrip line between the shunt end and the connecting device has a resistor connected in series.

8. A circuit board having a power split combiner, the power split combiner comprising a combined end and at least three shunt end sets, wherein one shunt end group includes one or two shunts The split ends of the at least three split end groups are located in the same plane, and the split ends are connected to the connecting device perpendicular to the plane, wherein the branch end is connected to the connecting device The parameters of the components are the same, the angle between each two adjacent shunt end groups is equal; the combining end is connected to the connecting device, and the plurality of shunt ends are disposed on the same layer of the circuit board.

9. The circuit board according to claim 8, wherein the connecting device is a via or coaxial connector or a coaxial cable, and the cross section of the via or coaxial connector or coaxial cable is The combined end.

10. The circuit board according to claim 8, wherein a grounded metallized via is disposed between each two adjacent shunt end groups.

11. The circuit board according to claim 8, wherein the combining end is separated from the plane in which the branch end is located by at least one ground plane.

12. The circuit board according to claim 11, wherein a grounded metallized via is disposed between each two adjacent shunt end groups.

The circuit board according to claim 11, wherein the branching ends are connected to a connecting device perpendicular to the plane: the branching ends respectively pass through a microstrip line or a strip line and a vertical line The connecting means on the plane are connected.

The circuit board according to claim 11, wherein the combining end is connected to the connecting device such that: the combining end is connected to the connecting device through an impedance matching network.

The circuit board according to claim 13, wherein the microstrip line between the shunt end and the connecting device has a resistor connected in series.

The circuit board according to claim 11, wherein the combining end is a microstrip line or a strip line.