WO2023279871A1 - 空调及用于空调控制的方法、装置 - Google Patents
空调及用于空调控制的方法、装置 Download PDFInfo
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- WO2023279871A1 WO2023279871A1 PCT/CN2022/094638 CN2022094638W WO2023279871A1 WO 2023279871 A1 WO2023279871 A1 WO 2023279871A1 CN 2022094638 W CN2022094638 W CN 2022094638W WO 2023279871 A1 WO2023279871 A1 WO 2023279871A1
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- air conditioner
- semiconductor refrigeration
- temperature value
- refrigeration component
- heating
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- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000005057 refrigeration Methods 0.000 claims abstract description 193
- 239000004065 semiconductor Substances 0.000 claims abstract description 184
- 238000010438 heat treatment Methods 0.000 claims abstract description 85
- 238000001816 cooling Methods 0.000 claims description 76
- 238000004378 air conditioning Methods 0.000 claims description 16
- 238000005485 electric heating Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 230000006870 function Effects 0.000 description 8
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- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000013500 data storage Methods 0.000 description 2
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- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
- F24F11/67—Switching between heating and cooling modes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
- F24F2110/12—Temperature of the outside air
Definitions
- the present application relates to the technical field of intelligent air conditioners, for example, to air conditioners and methods and devices for air conditioner control.
- Air conditioners have been widely used as a common intelligent device for adjusting the temperature and humidity of indoor environments.
- the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency.
- the air conditioner may have the problem of low cooling or heating capacity.
- the air conditioner can increase the heating capacity by adding electric heating tubes, but it is difficult to find a way to solve the problem of low cooling capacity when cooling at high temperature. It can be seen that it is still difficult for the air conditioner to provide more heating and cooling capacity to meet the cooling and heating needs under severe working conditions.
- Embodiments of the present disclosure provide an air conditioner and a method and device for controlling the air conditioner, so as to solve the technical problem of insufficient cooling or heating capacity of the air conditioner under severe working conditions.
- the air conditioner includes: two sets of semiconductor refrigeration components, wherein,
- the first cooling end of the first semiconductor refrigeration component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor refrigeration component is connected to the air conditioner external unit;
- the second cooling end of the second semiconductor refrigeration component is connected to the air conditioner external unit, and the second heating terminal of the second semiconductor refrigeration component is connected to the air conditioner internal unit.
- the method includes:
- the first semiconductor refrigeration component in the air conditioner When the current outdoor temperature value is greater than the first temperature value, control the first semiconductor refrigeration component in the air conditioner to start running, the first refrigeration terminal of the first semiconductor refrigeration component is connected to the air conditioner internal unit, The first heating end of the first semiconductor refrigeration component is connected to the external unit of the air conditioner;
- the first temperature value is greater than the second temperature value.
- the device for air conditioner control is as described above, the device includes a processor and a memory storing program instructions, and the processor is configured to, when executing the program instructions, execute The above is used for the air conditioner control method.
- the air conditioner is equipped with two sets of semiconductor refrigeration components.
- a set of semiconductor refrigeration components can be controlled to run to pre-cool the internal unit of the air conditioner, while the external temperature of the air conditioner is controlled.
- the machine is preheated to increase the cooling capacity of the air conditioner; when the current outdoor temperature value is lower than the second temperature value, when the air conditioner is heating and running, another group of semiconductor refrigeration components can be controlled to preheat the internal unit of the air conditioner, while the The external unit of the air conditioner is pre-cooled, which increases the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
- Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure
- Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
- Fig. 3 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure
- Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
- Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure
- Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
- A/B means: A or B.
- a and/or B means: A or B, or, A and B, these three relationships.
- two groups of semiconductor refrigeration components are added to the air conditioner, and each group of semiconductor refrigeration components is respectively connected to the air conditioner internal unit and the air conditioner external unit. , can control the operation of a group of semiconductor refrigeration components, pre-cool the evaporator inlet pipeline in the air conditioner internal unit, and preheat the condenser inlet pipeline in the air conditioner external unit, increasing the cooling capacity of the air conditioner; and
- the current outdoor temperature value is lower than the second temperature value, and when the air conditioner is heating, it can control the operation of another group of semiconductor refrigeration components to preheat the evaporator inlet pipeline in the air conditioner internal unit, while the condensation in the air conditioner external unit
- Pre-cooling the inlet pipeline of the air conditioner improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.
- semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce the emission pollution of the refrigeration system to the atmosphere, and are more energy-saving and environmentally friendly.
- Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure.
- the air conditioner includes: an air conditioner internal unit 100 , an air conditioner external unit 200 and two sets of semiconductor refrigeration components, namely a first semiconductor refrigeration component 310 and a second semiconductor refrigeration component 320 .
- the first cooling end 311 of the first semiconductor cooling component 310 is connected to the air conditioner inner unit 100
- the first heating end 312 of the first semiconductor cooling component 310 is connected to the air conditioner outer unit 200 .
- the second cooling terminal 321 of the second semiconductor refrigeration component 320 is connected to the air conditioner external unit 200
- the second heating terminal 322 of the second semiconductor refrigeration component 320 is connected to the air conditioner internal unit 100 .
- the semiconductor refrigeration component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be raised.
- Heater cooling There are multiple sets of hotspot elements inside the semiconductor refrigeration components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10-20°C at the cold end, and a temperature difference of 60°C.
- the first semiconductor refrigeration component 310 After the first semiconductor refrigeration component 310 is turned on and running, there are multiple groups of hotspot elements in the first cooling end 311, which can reduce the temperature, and there are also multiple groups of hotspot elements in the first heating end 312, but the temperature can be increased. .
- the second semiconductor refrigeration component 320 After the second semiconductor refrigeration component 320 is turned on and running, the two ends can also realize temperature reduction and temperature rise respectively.
- There are also multiple sets of hotspot elements in the middle which can realize temperature rise.
- the first semiconductor refrigeration component 310 and the second semiconductor refrigeration component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and cool the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively. warm up.
- one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110 , and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 .
- the other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
- One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .
- the two ends of the first semiconductor refrigeration component and the second semiconductor refrigeration component are arranged oppositely, and opposite temperature changes can be realized after the start-up operation. That is, when cooling, turn on the first semiconductor refrigeration component to pre-cool the evaporator inlet pipeline in the air conditioner's inner unit, and preheat the condenser inlet pipeline in the air conditioner's outer unit, so as to realize indoor precooling and indoor cooling. External preheating; when heating, turn on the second semiconductor refrigeration component to preheat the evaporator inlet pipeline in the air conditioner internal unit, and precool the condenser inlet pipeline in the air conditioner external unit to realize indoor cooling. Side preheating and outdoor side precooling, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, meeting the cooling and heating requirements under severe working conditions.
- both ends of the two groups of semiconductor refrigeration components can be equipped with exhaust fans that enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor refrigeration components and the indoor/outdoor side, thereby realizing the cooling capacity/cooling of the system. Compensation for heat.
- the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312.
- the exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .
- the air conditioner may also have only one, two or three exhaust fans, which may be located at any end of any semiconductor refrigeration component.
- the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor refrigeration components. Refrigeration and heating requirements under severe working conditions.
- Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure.
- the air conditioner can be configured with two sets of semiconductor refrigeration components, or equipped with two sets of semiconductor refrigeration components and their corresponding exhaust fans.
- the processes used for air conditioning control include:
- Step 2001 Obtain the current outdoor temperature value of the area where the air conditioner outdoor unit is located.
- the outdoor temperature value of the area where the air conditioner outdoor unit is located can be acquired in real time or periodically through a temperature acquisition device, such as an outdoor temperature sensor, and the acquired temperature value is the current outdoor temperature value for each acquisition.
- Step 2002 When the current outdoor temperature value is greater than the first temperature value, control the first semiconductor refrigeration component in the air conditioner to start running, the first refrigeration terminal of the first semiconductor refrigeration component is connected to the air conditioner internal unit, the first semiconductor refrigeration The first heating end of the refrigeration component is connected with the air conditioner external unit.
- the air conditioner when the air conditioner adopts the vapor compression refrigeration cycle, the air conditioner may have a problem of low cooling capacity or low heating capacity when cooling at high temperature or heating at low temperature.
- cooling capacity or heating capacity can be increased by controlling semiconductor refrigeration components. Therefore, a first temperature value can be configured to meet high temperature conditions, for example, the first temperature value can be 42°C, 43°C, or 45°C, etc. In this way, when the current outdoor temperature value is greater than the first temperature value, it can be determined that the area where the air conditioner is located is in a high-temperature condition, and the air conditioner is operating in cooling mode, and there may be a problem of insufficient cooling capacity. At this time, the first semiconductor refrigeration unit in the air conditioner can be controlled.
- the components start running. Since the first cooling terminal of the first semiconductor refrigeration component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor refrigeration component is connected to the external unit of the air conditioner, in this way, after the first semiconductor refrigeration component starts running, it can realize Indoor precooling and outdoor preheating.
- the first cooling end of the first semiconductor refrigeration component since the first cooling end of the first semiconductor refrigeration component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, the first heating end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus , the evaporator inlet pipeline in the air conditioner internal unit can be precooled, and the condenser inlet pipeline in the air conditioner external unit can be preheated, thereby increasing the cooling capacity of the air conditioner.
- Step 2003 When the current outdoor temperature value is lower than the second temperature value, control the second semiconductor refrigeration component in the air conditioner to start running, the second refrigeration terminal of the second semiconductor refrigeration component is connected to the external machine of the air conditioner, and the second semiconductor refrigeration component The second heating end of the refrigeration component is connected with the air conditioner internal unit.
- a second temperature value can be configured to meet low temperature conditions, for example, the second temperature value can be -5°C, -7°C, or -10°C, etc.
- the second semiconductor in the air conditioner can be controlled to The refrigeration unit starts to operate.
- the second cooling terminal of the second semiconductor refrigeration component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor refrigeration component is connected to the internal unit of the air conditioner, after the second semiconductor refrigeration component starts running, it can realize Indoor preheating and outdoor precooling.
- the second heating end of the second semiconductor refrigeration component is connected to the evaporator of the air conditioner internal unit through the indoor connection piece, and the second cooling end is connected to the condenser of the air conditioner external unit through the outdoor connection piece, thus , the evaporator inlet pipeline in the air conditioner internal unit can be preheated, and the condenser inlet pipeline in the air conditioner external unit can be precooled, thereby increasing the heating capacity of the air conditioner.
- the start-up operation of the semiconductor refrigeration components can be controlled to increase the cooling or heating capacity of the air conditioner, which meets the cooling and heating requirements under severe working conditions.
- semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce the emission pollution of the refrigeration system to the atmosphere, and are more energy-saving and environmentally friendly.
- the semiconductor refrigeration components of the air conditioner may be equipped with a corresponding exhaust fan.
- the exhaust fan can strengthen the air circulation and strengthen the heat exchange between the two ends of the semiconductor refrigeration components and the indoor/outdoor side, so as to realize the control of the cooling capacity/heating capacity of the system. compensate. Therefore, in some embodiments, when the first semiconductor refrigeration component is running, the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component is controlled; In the case of running, control the operation of the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor refrigeration component. Wherein, in the air conditioner, the first exhaust fan is located on the first cooling end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second heating end. On the second refrigeration end.
- the air conditioner can also adjust the indoor temperature to the set value at the fastest speed by adjusting the frequency of the compressor or starting the electric heating device.
- the current operating frequency of the compressor of the air conditioner is adjusted to the highest cooling frequency matching the current outdoor temperature value; when the second semiconductor refrigeration component is running, the air conditioner is controlled to The electric heating device starts to operate.
- the first semiconductor refrigeration component can always run, and during the heating process of the air conditioner, the second semiconductor refrigeration component can also run continuously.
- the operation of semiconductor refrigeration components consumes energy. Therefore, in some embodiments, when the indoor temperature value of the area where the air conditioner indoor unit is located is relatively close to the preset indoor temperature value, the semiconductor refrigeration components can be turned off. In this way, It can reduce the power consumption of the air conditioner and improve the overall energy efficiency of the air conditioner.
- the current indoor temperature value of the area where the air conditioner's inner unit is located is obtained; the current indoor temperature value and the preset indoor temperature
- the first semiconductor refrigeration component in the air conditioner is controlled to stop running; the second temperature difference between the preset indoor temperature value and the current indoor temperature value If the value is less than the second difference, the second semiconductor refrigeration component in the air conditioner is controlled to stop running.
- the semiconductor refrigeration components are turned off, so the first difference can be 1°C, 2°C or 3°C, and the second difference can also be 1°C, 2°C, or 2°C. °C or 3°C and so on.
- the indoor temperature value of the area where the air conditioner’s internal unit is located can be obtained in real time or periodically through the indoor temperature acquisition device, such as an indoor temperature sensor.
- the indoor temperature value collected at the current moment is Current indoor temperature value.
- the semiconductor refrigeration components of the air conditioner are in the running state, and the current indoor temperature value of the area where the air conditioner indoor unit is located can be obtained when the set acquisition timing is reached. For example: After the semiconductor refrigeration components start to run, the current indoor temperature value can be collected every 3 minutes, 5 minutes or 6 minutes.
- the air conditioner When the first semiconductor refrigeration component is in the running state, the air conditioner is generally in the cooling operation, and the current indoor temperature value Tr is generally greater than the preset indoor temperature value Tset. In this way, if Tr-Tset ⁇ the first difference, for example: 2, then it can be Control the first semiconductor refrigeration component in the air conditioner to stop running.
- Tr-Tset the first difference, for example: 2
- Tr-Tr the second difference
- the second semiconductor refrigeration component in the air conditioner can be controlled to stop running.
- the semi-conductor refrigeration component stops running, and in order to further reduce energy consumption, the corresponding exhaust fan can also be closed.
- control the first semiconductor refrigeration component The first exhaust fan and the second exhaust fan configured above stop running; when the second semiconductor refrigeration component stops running, control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component The fan stops operating.
- the operating state of the semiconductor refrigeration components can be maintained unchanged, and the air conditioner can still use a vapor compression refrigeration cycle to Realize the regulation of indoor temperature.
- the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor refrigeration components according to the received instructions.
- the switching operation of the semiconductor refrigeration components in the air conditioner is controlled. In this way, the user can control the switch of semiconductor refrigeration components through the APP, which improves the intelligence and user experience of the air conditioner.
- the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.
- the air conditioner may include two sets of semiconductor refrigeration components and four exhaust fans as shown in FIG. 1 .
- the first temperature value stored in the air conditioner may be 42°C
- the second temperature value may be -7°C
- both the first difference value and the second difference value may be 2°C.
- Fig. 3 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. Combining Figure 1 and Figure 3, the process for air conditioning control includes:
- Step 3001 Obtain the current outdoor temperature value Tao of the area where the air conditioner outdoor unit is located.
- Step 3002 Determine whether the current outdoor temperature value Tao>42°C holds true? If yes, go to step 3003; otherwise, go to step 3008.
- Step 3003 Control the first semiconductor refrigeration component in the air conditioner, and start the corresponding first exhaust fan and second exhaust fan.
- Step 3004 Determine whether the preset sampling time has been reached? If yes, execute step 3005; otherwise, return to step 3004.
- Step 3005 Obtain the current indoor temperature value Tr of the area where the air conditioner indoor unit is located.
- Step 3006 Determine whether Tr-Tset ⁇ 2°C holds true? If yes, execute step 3007; otherwise, return to step 3004.
- Tset is a preset indoor temperature value.
- Step 3007 Control the first semiconductor refrigeration component in the air conditioner, and the corresponding first exhaust fan and second exhaust fan to stop running, and this control process ends.
- Step 3008 Determine whether Tao ⁇ -7°C holds true? If yes, go to step 3009; otherwise, go to step 3014.
- Step 3009 Control the second semiconductor refrigeration component in the air conditioner, and start the operation of the corresponding third and fourth exhaust fans.
- Step 3010 Determine whether the preset sampling time has been reached? If yes, execute step 3011; otherwise, return to step 3010.
- Step 3011 Obtain the current indoor temperature Tr of the area where the air conditioner indoor unit is located.
- Step 3012 Determine whether Tset-Tr ⁇ 2°C holds true? If yes, execute step 3013; otherwise, return to step 3010.
- Step 3013 Control the second semiconductor refrigeration component in the air conditioner, and stop the corresponding third exhaust fan and fourth exhaust fan, and this control process ends.
- Step 3014 Control the air conditioner to operate the vapor compression refrigeration cycle.
- two sets of semiconductor refrigeration components are configured in the air conditioner.
- the current outdoor temperature value is greater than the first temperature value.
- the evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner outdoor unit is preheated, which increases the cooling capacity of the air conditioner; if the current outdoor temperature value is lower than the second temperature value, when the air conditioner is in heating operation, It can control the operation of another group of semiconductor refrigeration components, preheat the evaporator inlet pipeline in the air conditioner internal unit, and precool the condenser inlet pipeline in the air conditioner external unit, which improves the heating capacity of the air conditioner and satisfies the Refrigeration and heating requirements under harsh working conditions.
- the operation of the semiconductor refrigeration components can be turned off, reducing the power consumption of the air conditioner and improving the overall energy efficiency of the air conditioner.
- semiconductor refrigeration components do not use halogenated hydrocarbon refrigerants, and have no impact on atmospheric emissions, which can reduce air-conditioning emissions and pollution to the atmosphere, and are more energy-saving and environmentally friendly.
- an apparatus for air-conditioning control can be constructed.
- Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
- the air conditioner includes two sets of semiconductor cooling components, or two sets of semiconductor cooling components and their corresponding exhaust fans.
- the air conditioner control device includes: a first acquisition module 4100 , a first startup control module 4200 and a second startup control module 4300 .
- the first acquiring module 4100 is configured to acquire the current outdoor temperature value of the area where the air conditioner outdoor unit is located.
- the first start control module 4200 is configured to control the first semiconductor refrigeration component in the air conditioner to start running when the current outdoor temperature value is greater than the first temperature value, and the first refrigeration terminal of the first semiconductor refrigeration component is connected to the air conditioner.
- the internal unit is connected, and the first heating end of the first semiconductor refrigeration component is connected to the external unit of the air conditioner.
- the second start control module 4300 is configured to control the second semiconductor refrigeration component in the air conditioner to start running when the current outdoor temperature value is lower than the second temperature value, and the second refrigeration terminal of the second semiconductor refrigeration component is connected to the air conditioner The external unit is connected, and the second heating end of the second semiconductor refrigeration component is connected with the air conditioner internal unit.
- the first temperature value is greater than the second temperature value.
- the first startup control module 4200 is further configured to control the first exhaust fan and the second exhaust fan configured on the first peltier element when the first peltier element is running run.
- the second start control module 4300 is further configured to control the operation of the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component when the second semiconductor refrigeration component is running.
- the frequency adjustment module is configured to adjust the current operating frequency of the compressor of the air conditioner to the highest cooling frequency matching the current outdoor temperature value when the first semiconductor refrigeration component is running.
- the heating control module is configured to control the electric heating device of the air conditioner to start running when the second semiconductor refrigeration component is running.
- the second acquisition module is configured to acquire the current indoor temperature value of the area where the air conditioner indoor unit is located when the semiconductor refrigeration components of the air conditioner are in operation.
- the first shutdown control module is configured to control the first semiconductor refrigeration component in the air conditioner to stop running when the first temperature difference between the current indoor temperature value and the preset indoor temperature value is smaller than the first difference value.
- the second shutdown control module is configured to control the second semiconductor refrigeration component in the air conditioner to stop running when the second temperature difference between the preset indoor temperature value and the current indoor temperature value is smaller than the second difference value.
- the first shutdown control module is further configured to control the first exhaust fan and the second exhaust fan configured on the first semiconductor refrigeration component when the first semiconductor refrigeration component stops running stop running.
- the second shutdown control module is further configured to control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor refrigeration component to stop running when the second semiconductor refrigeration component stops running.
- the instruction control module is configured to control the switching operation of the semiconductor refrigeration components in the air conditioner according to the semiconductor switch instruction when receiving the semiconductor switch instruction sent by the configuration control application APP terminal.
- the following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.
- the air conditioner can be shown in Figure 1, including two sets of semiconductor refrigeration components and four exhaust fans. Also, the first temperature value stored in the air conditioner may be 42°C, the second temperature value may be -7°C, the first difference value may be 2°C, and the second difference value may both be 3°C.
- Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.
- the air conditioner control device includes: a first acquisition module 4100, a first startup control module 4200, a second startup control module 4300, a frequency adjustment module 4400, a heating control module 4500, a second acquisition module 4600, A shutdown control module 4700 , a second shutdown control module 4800 and a maintenance control module 4900 .
- the first obtaining module 4100 obtains the current outdoor temperature value Tao of the area where the outdoor unit of the air conditioner is located, so that when Tao>42°C, the first start control module 4200 can control the first semiconductor refrigeration component and the corresponding first semiconductor refrigeration component in the air conditioner.
- the first exhaust fan and the second exhaust fan start to operate.
- the frequency adjustment module 4400 can also adjust the current operating frequency of the compressor of the air conditioner to the highest cooling frequency that matches the current outdoor temperature value, so as to realize the maximum capacity and maximum power operation of the compressor, and cooperate with the pre-set temperature of the first semiconductor refrigeration component. Cold, can make the indoor cooling effect to achieve the best, to achieve the effect of rapid cooling.
- the second start-up control module 4300 can control the second semiconductor refrigeration components in the air conditioner, and the corresponding third and fourth exhaust fans start to run.
- the heating control module 4500 controls the electric heating device of the air conditioner to start and run. In this way, the indoor heating capacity can be increased, and with the preheating of the second semiconductor refrigeration components, the indoor heating effect can be optimized to achieve rapid heating. Effect.
- the second acquisition module 4600 can collect the current indoor temperature value Tr of the area where the air conditioner indoor unit is located in real time, and run the first semiconductor refrigeration components, that is, during the cooling process, if Tr-Tset ⁇ 2°C , the first shutdown control module 4700 controls the first semiconductor refrigeration component in the air conditioner, and the corresponding first and second exhaust fans stop running. While the second semiconductor refrigeration component is running, that is, during the heating process, if Tset-Tr ⁇ 3°C, the second shutdown control module 4800 can control the second semiconductor refrigeration component in the air conditioner and the corresponding third row The air fan and the fourth exhaust fan stop operating.
- control module 4900 can keep the operating state of the semiconductor refrigeration components of the air conditioner unchanged, and can control the air conditioner to operate the vapor compression refrigeration cycle.
- two sets of semiconductor refrigeration components are configured in the air conditioner, so that the device for air conditioning control controls the semiconductor refrigeration components to start and run according to the outdoor temperature value, increasing the controlled cooling capacity or heating capacity, satisfying the Cooling and heating needs under harsh working conditions, and when the indoor temperature value is close to the preset indoor temperature value, the operation of semiconductor refrigeration components is turned off to reduce the power consumption of the air conditioner and improve the overall energy efficiency of the air conditioner.
- An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:
- a processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer.
- the processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.
- the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.
- the memory 1001 as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure.
- the processor 1000 executes the program instructions/modules stored in the memory 1001 to execute functional applications and data processing, that is, to implement the method for air conditioner control in the above method embodiments.
- the memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like.
- the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.
- An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.
- An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.
- An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.
- An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.
- the above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.
- the technical solutions of the embodiments of the present disclosure can be embodied in the form of software products.
- the computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure.
- the aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc.
- a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element” are renamed consistently and all occurrences of "Second component” can be renamed consistently.
- the first element and the second element are both elements, but may not be the same element.
- the terms used in the present application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a”, “an” and “the” are intended to include the plural forms as well unless the context clearly indicates otherwise .
- the term “and/or” as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones.
- the term “comprise” and its variants “comprises” and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these.
- an element defined by the phrase “comprising a " does not exclude the presence of additional identical elements in the process, method or condition comprising said element.
- the disclosed methods and products can be implemented in other ways.
- the device embodiments described above are only illustrative.
- the division of the units may only be a logical function division. In actual implementation, there may be other division methods.
- multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented.
- the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
- each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
- each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions.
- the functions noted in the block may occur out of the order noted in the figures.
- two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved.
- the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps.
- each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.
Abstract
本申请涉及智能空调技术领域，公开一种空调及用于空调控制的方法、装置。该空调包括：两组半导体制冷元器件。该方法包括：获取空调外机所在区域的当前室外温度值；在当前室外温度值大于第一温度值的情况下，控制空调中的第一半导体制冷元器件启动运行，其中，第一半导体制冷元器件的第一制冷端与空调内机连接，第一半导体制冷元器件的第一制热端与空调外机连接；在当前室外温度值小于第二温度值的情况下，控制空调中的第二半导体制冷元器件启动运行，其中，第二半导体制冷元器件的第二制冷端与空调外机连接，第二半导体制冷元器件的第二制热端与空调内机连接。这样，提高了空调的制冷量或制热量，满足了在恶劣工况下的制冷制热需求。
Description
本申请基于申请号为202110780701.1、申请日为2021年7月9日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
本申请涉及智能空调技术领域，例如涉及空调及用于空调控制的方法、装置。
空调作为一种常见调节室内环境温湿度的智能设备已被广泛应用。相关技术中，空调可采用蒸气压缩式制冷循环，来实现室内温度的调节，具有能效高的优点，但是，在高温制冷或低温制热时，空调可能会出现制冷量或制热量低的问题。
目前，在低温制热时，空调可采用增加电加热管的方式提高制热量，但在高温制冷时，却很难有方法可解决制冷量低的问题。可见，空调还很难提供更多的制热量和制冷量，满足在恶劣工况下的制冷制热需求。
发明内容
为了对披露的实施例的一些方面有基本的理解，下面给出了简单的概括。所述概括不是泛泛评述，也不是要确定关键/重要组成元素或描绘这些实施例的保护范围，而是作为后面的详细说明的序言。
本公开实施例提供了一种空调及用于空调控制的方法、装置，以解决在恶劣工况下，空调制冷量或制热量不足的技术问题。
在一些实施例中，所述空调包括：两组半导体制冷元器件，其中，
第一半导体制冷元器件的第一制冷端与空调内机连接，所述第一半导体制冷元器件的第一制热端与空调外机连接；
第二半导体制冷元器件的第二制冷端与所述空调外机连接，所述第二半导体制冷元器件的第二制热端与所述空调内机连接。
在一些实施例中，所述方法包括：
获取空调外机所在区域的当前室外温度值；
在所述当前室外温度值大于第一温度值的情况下，控制所述空调中的第一半导体制冷元器件启动运行，所述第一半导体制冷元器件的第一制冷端与空调内机连接，所述第一半导体制冷元器件的第一制热端与空调外机连接；
在所述当前室外温度值小于第二温度值的情况下，控制所述空调中的第二半导体制冷元器件启动运行，所述第二半导体制冷元器件的第二制冷端与所述空调外机连接，所述第二半导体制冷元器件的第二制热端与所述空调内机连接；
所述第一温度值大于所述第二温度值。
在一些实施例中，所述用于空调控制的装置，空调如上所述，所述装置包括处理器和存储有程序指令的存储器，所述处理器被配置为在执行所述程序指令时，执行上述用于空调控制方法。
本公开实施例提供的空调及用于空调控制的方法、装置，可以实现以下技术效果：
空调中配置了两组半导体制冷元器件，这样，当前室外温度值大于第一温度值，空调制冷运行时，可控制一组半导体制冷元器件运行，对空调内机进行预冷，而对空调外机进行预热，提高了空调的制冷量；而当前室外温度值小于第二温度值，空调制热运行时，可控制另一组半导体制冷元器件运行，对空调内机进行预热，而对空调外机进行预冷，提高了空调的制热量，满足了在恶劣工况下的制冷制热需求。
以上的总体描述和下文中的描述仅是示例性和解释性的，不用于限制本申请。
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1是本公开实施例提供的一种空调的结构示意图；
图2是本公开实施例提供的一种用于空调控制方法的流程示意图；
图3是本公开实施例提供的一种用于空调控制方法的流程示意图；
图4是本公开实施例提供的一种用于空调控制装置的结构示意图；
图5是本公开实施例提供的一种用于空调控制装置的结构示意图；
图6是本公开实施例提供的一种用于空调控制装置的结构示意图。
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
本公开实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本公开实施例的实施例。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
除非另有说明，术语“多个”表示两个或两个以上。
本公开实施例中，字符“/”表示前后对象是一种“或”的关系。例如，A/B表示：A或B。
术语“和/或”是一种描述对象的关联关系，表示可以存在三种关系。例如，A和/或B，表示：A或B，或，A和B这三种关系。
本公开实施例中，空调中增加了两组半导体制冷元器件，每组半导体制冷元器件分别与空调内机和空调外机连接，这样，当前室外温度值大于第一温度值，空调制冷运行时，可控制一组半导体制冷元器件运行，对空调内机中的蒸发器入口管路进行预冷，而对空调外机中的冷凝器入口管路进行预热，提高了空调的制冷量；而当前室外温度值小于第二温度值，空调制热运行时，可控制另一组半导体制冷元器件运行，对空调内机中的蒸发器入口管路进行预热，而对空调外机中的冷凝器入口管路进行预冷，提高了空调的制热量，满足了在恶劣工况下的制冷制热需求。另外，半导体制冷元器件不使用卤代烃制冷剂，对大气排放无影响，可以降低制冷系统对大气的排放污染，更加节能环保。
图1是本公开实施例提供的一种空调的结构示意图。如图1所示，空调包括：空调内机100、空调外机200以及两组半导体制冷元器件，分别是第一半导体制冷元器件310和第二半导体制冷元器件320。
第一半导体制冷元器件310的第一制冷端311与空调内机100连接，第一半导体制冷元器件310的第一制热端312与空调外机200连接。
第二半导体制冷元器件320的第二制冷端321与空调外机200连接，第二半导体制冷元器件320的第二制热端322与空调内机100连接。
本公开实施例中，半导体制冷元器件可利用半导体的热电效应，用导体连接两块 不同物性不同的金属并接通直流电，可以实现一端温度降低、一端温度升高，常用于电子元件和微型换热器的冷却。半导体制冷元器件内部存在多组热点元件，可以实现热端40～50℃，冷端-10～-20℃，温差60℃的制冷制热效果。
其中，第一半导体制冷元器件310开启运行后，第一制冷端311中有多组热点元件，可实现温度降低，而第一制热端312中也有多组热点元件，但可实现温度升高。第二半导体制冷元器件320开启运行后，两端也可分别实现温度降低和温度升高，其中，第二制冷端321中有多组热点元件，可实现温度降低，而第二制热端322中也多组热点元件，可实现温度升高。
在一些实施例中，第一半导体制冷元器件310，第二半导体制冷元器件320可与空调室内蒸发器和室外冷凝器配合，分别对蒸发器入口管路和冷凝器入口管路进行预冷和预热。可如图1所示，第一制冷端311的一端通过室内连接件110与空调内机100的蒸发器连接，另一端通过第一半导体组件连接管313与第一制热端312的一端连接，第一制热端312的另一端通过室外连接件210与空调外机200的冷凝器连接。
第二制热端322的一端通过室内连接件110与空调内机100的蒸发器连接，另一端通过第二半导体组件连接管323与第二制冷端321的一端连接，第二制冷端321的另一端通过室外连接件210与空调外机200的冷凝器连接。
可见，第一半导体制冷元器件和第二半导体制冷元器件的两端布置相反，开启运行后可以实现相反的温度变化。即制冷时，开启第一半导体制冷元器件，可以对空调内机中的蒸发器入口管路进行预冷，而对空调外机中的冷凝器入口管路进行预热，实现室内测预冷和室外侧预热；制热时，开启第二半导体制冷元器件，可以对空调内机中的蒸发器入口管路进行预热，而对空调外机中的冷凝器入口管路进行预冷，实现室内侧预热和室外侧预冷，从而，可以在外界高温时提高室内制冷量，在外界低温时提高室内制热量，满足了在恶劣工况下的制冷制热需求。
在一些实施例中，两组半导体制冷元器件的两端均可配有加强空气循环的排风扇，可以强化半导体制冷元器件两端与室内/室外侧的热量交换，从而实现对系统制冷量/制热量的补偿。如图1所示，空调还可包括：四个排气扇；其中，第一排气扇位于410第一制冷端311上，第二排气扇420位于第一制热端312上，第三排气扇430位于第二制热端322上，第四排气扇位440位于第二制冷端321上。
当然，在一些实施例中，可以空调也可只有一个、两个或三个排气扇，可位于任意一个半导体制冷元器件中的任意一端。
空调配置了两组半导体制冷元器件，或配置了两组半导体制冷元器件及其对应的排气扇后，可通过控制半导体制冷元器件的运行来提高空调的制冷量或制热量，满足了在恶劣工况下的制冷制热需求。
图2是本公开实施例提供的一种用于空调控制方法的流程示意图。空调可如上述，配置了两组半导体制冷元器件，或配置了两组半导体制冷元器件及其对应的排气扇。如图2所示，用于空调控制的过程包括：
步骤2001：获取空调外机所在区域的当前室外温度值。
本公开实施例中，可通过温度采集装置，例如：室外温度传感器，实时或定时获取空调外机所在区域的室外温度值，每次采集，获取的温度值即为当前室外温度值。
步骤2002：在当前室外温度值大于第一温度值的情况下，控制空调中的第一半导体制冷元器件启动运行，第一半导体制冷元器件的第一制冷端与空调内机连接，第一半导体制冷元器件的第一制热端与空调外机连接。
相关技术中，采用蒸气压缩式制冷循环的空调，在高温制冷或低温制热时，空调可能会出现制冷量或制热量低的问题。本公开实施例，可通过控制半导体制冷元器件，来增加制冷量或制热量。因此，可配置一个第一温度值，满足高温工况，例如：第一温度值可为42℃，43℃，或45℃等等。这样，当前室外温度值大于第一温度值时，可确定空调所在区域处于高温工况，空调进行制冷模式运行，并可能存在制冷量不足的问题，此时，可控制空调中的第一半导体制冷元器件启动运行。由于第一半导体制冷元器件的第一制冷端与空调内机连接，第一半导体制冷元器件的第一制热端与空调外机连接，这样，第一半导体制冷元器件启动运行后，可以实现室内测预冷和室外侧预热。在一些实施例中，由于第一半导体制冷元器件的第一制冷端通过室内连接件与空调内机的蒸发器连接，第一制热端通过室外连接件与空调外机的冷凝器连接，这样，可对空调内机中的蒸发器入口管路进行预冷，而对空调外机中的冷凝器入口管路进行预热，从而，提高了空调的制冷量。
步骤2003：在当前室外温度值小于第二温度值的情况下，控制空调中的第二半导体制冷元器件启动运行，第二半导体制冷元器件的第二制冷端与空调外机连接，第二半导体制冷元器件的第二制热端与空调内机连接。
当然，可配置一个第二温度值，满足低温工况，例如：第二温度值可为-5℃，-7℃，或-10℃等等。这样，当前室外温度值小于第二温度值时，可确定空调所在区域处于低温工况，空调进行制热模式运行，并可能存在制热量不足的问题，此时，可控制空 调中的第二半导体制冷元器件启动运行。由于第二半导体制冷元器件的第二制冷端与空调外机连接，第二半导体制冷元器件的第二制热端与空调内机连接，因此，第二半导体制冷元器件启动运行后，可以实现室内测预热和室外侧预冷。在一些实施例中，由于第二半导体制冷元器件的第二制热端通过室内连接件与空调内机的蒸发器连接，第二制冷端通过室外连接件与空调外机的冷凝器连接，这样，可对空调内机中的蒸发器入口管路进行预热，而对空调外机中的冷凝器入口管路进行预冷，从而，提高了空调的制热量。
可见，本实施例中，可控制半导体制冷元器件的启动运行来提高空调的制冷量或制热量，满足了在恶劣工况下的制冷制热需求。并且，半导体制冷元器件不使用卤代烃制冷剂，对大气排放无影响，可以降低制冷系统对大气的排放污染，更加节能环保。
空调的半导体制冷元器件中可能配置了对应的排气扇，排气扇可加强空气循环，强化半导体制冷元器件两端与室内/室外侧的热量交换，从而实现对系统制冷量/制热量的补偿。因此，在一些实施例中，在第一半导体制冷元器件运行的情况下，控制第一半导体制冷元器件上配置的第一排气扇和第二排气扇运行；在第二半导体制冷元器件运行的情况下，控制第二半导体制冷元器件上配置的第三排气扇和第四排气扇运行。其中，空调中，第一排气扇位于第一制冷端上，第二排气扇位于第一制热端上，第三排气扇位于第二制热端上，第四排气扇位于第二制冷端上。
在一些实施例中，空调在制冷或制热运行的过程中，还可通过调整压缩机频率或者启动电加热装置，实现以最快的速度将室内温度调整至设定值。其中，在第一半导体制冷元器件运行的情况下，将空调的压缩机的当前运行频率调整到与当前室外温度值匹配的制冷最高频率；在第二半导体制冷元器件运行的情况下，控制空调的电加热装置启动运行。
空调制冷运行时，将空调压缩机的当前运行频率调整至与当前室外温度值匹配的制冷最高频率，可以实现压缩机最大能力和最大功率运行，配合第一半导体制冷元器件的预冷，可使室内测制冷效果达到最佳，实现快速降温的效果。
空调制热运行时，将空调的电加热装置打开，可以增加室内测的制热量，配合第二半导体制冷元器件的预热，可使得室内测制热效果最佳，实现快速制热的效果。
在空调制冷的过程中，第一半导体制冷元器件可以一直运行，在空调制热过程中，第二半导体制冷元器件也可以一直运行。但是，半导体制冷元器件的运行是需要耗费能源的，因此，在一些实施例中，空调内机所在区域的室内温度值与预设室内温度值比较接近时，可关闭半导体制冷元器件，这样，可减少空调功耗，提升空调的整体能效，其 中，在空调的半导体制冷元器件处于运行状态的情况下，获取空调内机所在区域的当前室内温度值；在当前室内温度值与预设室内温度值之间的第一温度差值小于第一差值的情况下，控制空调中的第一半导体制冷元器件停止运行；在预设室内温度值与当前室内温度值之间的第二温度差值小于第二差值的情况下，控制空调中的第二半导体制冷元器件停止运行。
由于室内温度值与预设室内温度值比较接近时，关闭半导体制冷元器件，因此，第一差值可为1℃、2℃或3℃，同样，第二差值也可为1℃、2℃或3℃等等。
在空调的半导体制冷元器件处于运行状态的情况下，通过室内温度采集装置，例如，室内温度传感器，可实时或定时获取空调内机所在区域的室内温度值，当前时刻采集的室内温度值即为当前室内温度值。
因此，在一些实施例中，空调的半导体制冷元器件处于运行状态，在到达设定采集定时时刻的情况下，可获取空调内机所在区域的当前室内温度值。例如：半导体制冷元器件启动运行后，每3分钟、5分钟或6分钟可采集一次当前室内温度值。
第一半导体制冷元器件处于运行状态时，一般空调处于制冷运行，当前室内温度值Tr一般会大于预设室内温度值Tset，这样，若Tr-Tset＜第一差值，例如：2，则可控制空调中的第一半导体制冷元器件停止运行。而第二半导体制冷元器件处于运行状态时，一般空调处于制热运行，当前室内温度值Tr一般会小于预设室内温度值Tset，这样，若Tset-Tr＜第二差值，例如：3，则可控制空调中的第二半导体制冷元器件停止运行。
半导体制冷元器件停止运行了，为进一步减少能耗，可将对应的排气扇也关闭，在一些实施例中，在第一半导体制冷元器件停止运行的情况下，控制第一半导体制冷元器件上配置的第一排气扇和第二排气扇停止运行；在第二半导体制冷元器件停止运行的情况下，控制第二半导体制冷元器件上配置的第三排气扇和第四排气扇停止运行。
当然，在当前室外温度值小于或等于第一温度值，且大于或等于第二温度值的情况下，可维持半导体制冷元器件的运行状态不变，空调仍可采用蒸气压缩式制冷循环，来实现室内温度的调节。
目前，空调具有通讯功能，这样，空调还可根据接收到的指令，来控制半导体制冷元器件的运行。在一些实施例中，在接收到配置控制应用APP终端发送的半导体开关指令的情况下，根据半导体开关指令，控制空调中的半导体制冷元器件的开关运行。这样，用户可通过APP控制半导体制冷元器件的开关，提高了空调的智能性以及用户 体验。
下面将操作流程集合到具体实施例中，举例说明本公开实施例提供的用于空调控制过程。
本实施例中，空调可如图1所示，包括两组半导体制冷元器件和四个排气扇。并且，空调中保存的第一温度值可为42℃，第二温度值可为-7℃，第一差值和第二差值可都为2℃。
图3是本公开实施例提供的一种用于空调控制方法的流程示意图。结合图1和图3，用于空调控制的过程包括：
步骤3001：获取空调外机所在区域的当前室外温度值Tao。
步骤3002：判断当前室外温度值Tao>42℃是否成立？若是，执行步骤3003，否则，执行步骤3008。
步骤3003：控制空调中的第一半导体制冷元器件，以及对应的第一排气扇和第二排气扇启动运行。
步骤3004：判断是否到达预设采样时间？若是，执行步骤3005，否则，返回步骤3004。
步骤3005：获取空调内机所在区域的当前室内温度值Tr。
步骤3006：判断Tr-Tset＜2℃是否成立？若是，执行步骤3007，否则，返回步骤3004。
其中，Tset为预设室内温度值。
步骤3007：控制空调中的第一半导体制冷元器件，以及对应的第一排气扇和第二排气扇停止运行，本次控制流程结束。
步骤3008：判断Tao<-7℃是否成立？若是，执行步骤3009，否则，执行步骤3014。
步骤3009：控制空调中的第二半导体制冷元器件，以及对应的第三排气扇和第四排气扇启动运行。
步骤3010：判断是否到达预设采样时间？若是，执行步骤3011，否则，返回步骤3010。
步骤3011：获取空调内机所在区域的当前室内温度值Tr。
步骤3012：判断Tset-Tr＜2℃是否成立？若是，执行步骤3013，否则，返回步骤3010。
步骤3013：控制空调中的第二半导体制冷元器件，以及对应的第三排气扇和第四 排气扇停止运行，本次控制流程结束。
步骤3014：控制空调进行蒸气压缩式制冷循环的运行。
可见，本实施例中，空调中配置了两组半导体制冷元器件，这样，当前室外温度值大于第一温度值，空调制冷运行时，可控制一组半导体制冷元器件运行，对空调内机中的蒸发器入口管路进行预冷，而对空调外机中的冷凝器入口管路进行预热，提高了空调的制冷量；而当前室外温度值小于第二温度值，空调制热运行时，可控制另一组半导体制冷元器件运行，对空调内机中的蒸发器入口管路进行预热，而对空调外机中的冷凝器入口管路进行预冷，提高了空调的制热量，满足了在恶劣工况下的制冷制热需求。并且，半导体制冷元器件运行后，在室内温度值与预设室内温度值比较接近时，即可关闭半导体制冷元器件的运行，减少空调的功耗，提升空调的整体能效。当然，半导体制冷元器件不使用卤代烃制冷剂，对大气排放无影响，可以降低空调对大气的排放污染，更加节能环保。
根据上述用于空调控制的过程，可构建一种用于空调控制的装置。
图4是本公开实施例提供的一种用于空调控制装置的结构示意图。空调如上述，包括两组半导体制冷元器件，或者，包括两组半导体制冷元器件及其对应的排气扇。如图4所示，用于空调控制装置包括：第一获取模块4100，第一启动控制模块4200和第二启动控制模块4300。
第一获取模块4100，被配置为获取空调外机所在区域的当前室外温度值。
第一启动控制模块4200，被配置为在当前室外温度值大于第一温度值的情况下，控制空调中的第一半导体制冷元器件启动运行，第一半导体制冷元器件的第一制冷端与空调内机连接，第一半导体制冷元器件的第一制热端与空调外机连接。
第二启动控制模块4300，被配置为在当前室外温度值小于第二温度值的情况下，控制空调中的第二半导体制冷元器件启动运行，第二半导体制冷元器件的第二制冷端与空调外机连接，第二半导体制冷元器件的第二制热端与空调内机连接。
当然，第一温度值大于第二温度值。
在一些实施例中，第一启动控制模块4200，还被配置为在第一半导体制冷元器件运行的情况下，控制第一半导体制冷元器件上配置的第一排气扇和第二排气扇运行。
第二启动控制模块4300，还被配置为在第二半导体制冷元器件运行的情况下，控制第二半导体制冷元器件上配置的第三排气扇和第四排气扇运行。
在一些实施例中，还包括：
频率调整模块，被配置为在第一半导体制冷元器件运行的情况下，将空调的压缩机的当前运行频率调整到与当前室外温度值匹配的制冷最高频率。
加热控制模块，被配置为在第二半导体制冷元器件运行的情况下，控制空调的电加热装置启动运行。
在一些实施例中，还包括：
第二获取模块，被配置为在空调的半导体制冷元器件处于运行状态的情况下，获取空调内机所在区域的当前室内温度值。
第一关闭控制模块，被配置为在当前室内温度值与预设室内温度值之间的第一温度差值小于第一差值的情况下，控制空调中的第一半导体制冷元器件停止运行。
第二关闭控制模块，被配置为在预设室内温度值与当前室内温度值之间的第二温度差值小于第二差值的情况下，控制空调中的第二半导体制冷元器件停止运行。
在一些实施例中，第一关闭控制模块，还被配置为在第一半导体制冷元器件停止运行的情况下，控制第一半导体制冷元器件上配置的第一排气扇和第二排气扇停止运行。
第二关闭控制模块，还被配置为在第二半导体制冷元器件停止运行的情况下，控制第二半导体制冷元器件上配置的第三排气扇和第四排气扇停止运行。
在一些实施例中，还包括：
指令控制模块，被配置为在接收到配置控制应用APP终端发送的半导体开关指令的情况下，根据半导体开关指令，控制空调中的半导体制冷元器件的开关运行。
下面举例说明本公开实施例提供的用于空调控制的装置进行空调控制过程。
空调可如图1所示，包括两组半导体制冷元器件和四个排气扇。并且，空调中保存的第一温度值可为42℃，第二温度值可为-7℃，第一差值可为2℃，以及第二差值可都为3℃。
图5是本公开实施例提供的一种用于空调控制装置的结构示意图。如图5所示，用于空调控制装置包括：第一获取模块4100，第一启动控制模块4200、第二启动控制模块4300、频率调整模块4400、加热控制模块4500、第二获取模块4600、第一关闭控制模块4700、第二关闭控制模块4800以及维持控制模块4900。
其中，第一获取模块4100获取空调外机所在区域的当前室外温度值Tao，这样，Tao>42℃时，第一启动控制模块4200可控制空调中的第一半导体制冷元器件，以及对应的第一排气扇和第二排气扇启动运行。并且，频率调整模块4400还可将空调的压缩 机的当前运行频率调整到与当前室外温度值匹配的制冷最高频率，可以实现压缩机最大能力和最大功率运行，配合第一半导体制冷元器件的预冷，可使室内测制冷效果达到最佳，实现快速降温的效果。
而在Tao<-7℃时，第二启动控制模块4300则可控制空调中的第二半导体制冷元器件，以及对应的第三排气扇和第四排气扇启动运行。并且，加热控制模块4500控制空调的电加热装置启动运行，这样，可以增加室内测的制热量，配合第二半导体制冷元器件的预热，可使得室内测制热效果最佳，实现快速制热的效果。
半导体制冷元器件启动运行后，可第二获取模块4600实时采集空调内机所在区域的当前室内温度值Tr，并在第一半导体制冷元器件运行，即制冷过程中，若Tr-Tset＜2℃时，第一关闭控制模块4700控制空调中的第一半导体制冷元器件，以及对应的第一排气扇和第二排气扇停止运行。而在第二半导体制冷元器件运行，即制热过程中，若Tset-Tr＜3℃时，第二关闭控制模块4800即可控制空调中的第二半导体制冷元器件，以及对应的第三排气扇和第四排气扇停止运行。
当然，-7℃≤Tao≤42℃时，维持控制模块4900可控制空调的半导体制冷元器件的运行状态不变，可控制空调进行蒸气压缩式制冷循环的运行。
可见，本实施例中，空调中配置了两组半导体制冷元器件，这样，用于空调控制的装置根据室外温度值，控制半导体制冷元器件启动运行，提高控制的制冷量或制热量，满足了在恶劣工况下的制冷制热需求，并且，在室内温度值与预设室内温度值比较接近时，关闭半导体制冷元器件的运行，减少空调的功耗，提升空调的整体能效。
本公开实施例提供了一种用于空调控制的装置，其结构如图6所示，包括：
处理器(processor)1000和存储器(memory)1001，还可以包括通信接口(Communication Interface)1002和总线1003。其中，处理器1000、通信接口1002、存储器1001可以通过总线1003完成相互间的通信。通信接口1002可以用于信息传输。处理器1000可以调用存储器1001中的逻辑指令，以执行上述实施例的用于空调控制的方法。
此外，上述的存储器1001中的逻辑指令可以通过软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。
存储器1001作为一种计算机可读存储介质，可用于存储软件程序、计算机可执行程序，如本公开实施例中的方法对应的程序指令/模块。处理器1000通过运行存储在存储器1001中的程序指令/模块，从而执行功能应用以及数据处理，即实现上述方法实施 例中的用于空调控制的方法。
存储器1001可包括存储程序区和存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序；存储数据区可存储根据终端空调的使用所创建的数据等。此外，存储器1001可以包括高速随机存取存储器，还可以包括非易失性存储器。
本公开实施例提供了一种用于空调控制装置，包括：处理器和存储有程序指令的存储器，处理器被配置为在执行程序指令时，执行用于空调控制方法。
本公开实施例提供了一种空调，包括上述用于空调控制装置。
本公开实施例提供了一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令设置为执行上述用于空调控制方法。
本公开实施例提供了一种计算机程序产品，所述计算机程序产品包括存储在计算机可读存储介质上的计算机程序，所述计算机程序包括程序指令，当所述程序指令被计算机执行时，使所述计算机执行上述用于空调控制方法。
上述的计算机可读存储介质可以是暂态计算机可读存储介质，也可以是非暂态计算机可读存储介质。
本公开实施例的技术方案可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括一个或多个指令用以使得一台计算机空调(可以是个人计算机，服务器，或者网络空调等)执行本公开实施例所述方法的全部或部分步骤。而前述的存储介质可以是非暂态存储介质，包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等多种可以存储程序代码的介质，也可以是暂态存储介质。
以上描述和附图充分地示出了本公开的实施例，以使本领域的技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。当用于本申请中时，虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如，在不改变描述的含义的情况下，第一元件可以叫做第二元件，并且同样第，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同 的元件。而且，本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本申请中时，术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下，由语句“包括一个…”限定的要素，并不排除在包括所述要素的过程、方法或者空调中还存在另外的相同要素。本文中，每个实施例重点说明的可以是与其他实施例的不同之处，各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言，如果其与实施例公开的方法部分相对应，那么相关之处可以参见方法部分的描述。
本领域技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，可以取决于技术方案的特定应用和设计约束条件。所述技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能，但是这种实现不应认为超出本公开实施例的范围。所述技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
本文所披露的实施例中，所揭露的方法、产品(包括但不限于装置、空调等)，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，可以仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外，在本公开实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
附图中的流程图和框图显示了根据本公开实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上，流程图或框图中的每个方框可以代表一个模块、程序段或代码的一部分，所述模块、程序段或代码的一部分包含一个或多个用于实现规定的逻辑功能的可执行指令。在有些作为替换的实现中，方框中所标注的功能也可以以不同于附图中所标注的顺序发生。例如，两个连续的方框实际上可以基本并行地执行，它们有时也可以按相反的顺序执行，这可以依所涉及的功能而定。在附图中的流程图和框图所对应的描述中，不同的方框所对应的操作或步骤也可以以不同于描述中所披露的顺序发生，有时不同的操作或步骤之间不存在特定的顺序。例如，两个连续的操作或步骤实际上可以基本并行地执行，它们有时也可以按相反的顺序执行，这可以依所涉及的功能而定。框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合，可以用执行规定的功能或动作的专用的基于硬件的系统来实现，或者可以用专用硬件与计算机指令的组合来实现。
Claims (10)
- 一种空调，其特征在于，包括：两组半导体制冷元器件，其中，第一半导体制冷元器件的第一制冷端与空调内机连接，所述第一半导体制冷元器件的第一制热端与空调外机连接；第二半导体制冷元器件的第二制冷端与所述空调外机连接，所述第二半导体制冷元器件的第二制热端与所述空调内机连接。
- 根据权利要求1所述的空调，其特征在于，所述第一制冷端的一端通过室内连接件与所述空调内机的蒸发器连接，另一端通过第一半导体组件连接管与所述第一制热端的一端连接，所述第一制热端的另一端通过室外连接件与所述空调外机的冷凝器连接；所述第二制热端的一端通过室内连接件与所述空调内机的蒸发器连接，另一端通过第二半导体组件连接管与所述第二制冷端的一端连接，所述第二制冷端的另一端通过室外连接件与所述空调外机的冷凝器连接。
- 根据权利要求1或2所述的空调，其特征在于，还包括：四个排气扇；其中，第一排气扇位于所述第一制冷端上，所述第二排气扇位于所述第一制热端上，所述第三排气扇位于所述第二制热端上，所述第四排气扇位于所述第二制冷端上。
- 一种用于空调控制的方法，其特征在于，所述空调如权利要求1、2或3所述，所述方法包括：获取空调外机所在区域的当前室外温度值；在所述当前室外温度值大于第一温度值的情况下，控制所述空调中的第一半导体制冷元器件启动运行，所述第一半导体制冷元器件的第一制冷端与空调内机连接，所述第一半导体制冷元器件的第一制热端与空调外机连接；在所述当前室外温度值小于第二温度值的情况下，控制所述空调中的第二半导体制冷元器件启动运行，所述第二半导体制冷元器件的第二制冷端与所述空调外机连接，所述第二半导体制冷元器件的第二制热端与所述空调内机连接；所述第一温度值大于所述第二温度值。
- 根据权利要求4所述的方法，其特征在于，还包括：在所述第一半导体制冷元器件运行的情况下，控制所述第一半导体制冷元器件上配置的第一排气扇和第二排气扇运行；在所述第二半导体制冷元器件运行的情况下，控制所述第二半导体制冷元器件上配置的第三排气扇和第四排气扇运行。
- 根据权利要求4所述的方法，其特征在于，还包括：在所述第一半导体制冷元器件运行的情况下，将所述空调的压缩机的当前运行频率调整到与所述当前室外温度值匹配的制冷最高频率；在所述第二半导体制冷元器件运行的情况下，控制所述空调的电加热装置启动运行。
- 根据权利要求4-6任一项所述的方法，其特征在于，还包括：在空调的半导体制冷元器件处于运行状态的情况下，获取空调内机所在区域的当前室内温度值；在所述当前室内温度值与预设室内温度值之间的第一温度差值小于第一差值的情况下，控制所述空调中的第一半导体制冷元器件停止运行；在所述预设室内温度值与所述当前室内温度值之间的第二温度差值小于第二差值的情况下，控制所述空调中的第二半导体制冷元器件停止运行。
- 根据权利要求7所述的方法，其特征在于，还包括：在所述第一半导体制冷元器件停止运行的情况下，控制所述第一半导体制冷元器件上配置的第一排气扇和第二排气扇停止运行；在所述第二半导体制冷元器件停止运行的情况下，控制所述第二半导体制冷元器件上配置的第三排气扇和第四排气扇停止运行。
- 根据权利要求4所述的方法，其特征在于，还包括：在接收到配置控制应用APP终端发送的半导体开关指令的情况下，根据所述半导体开关指令，控制所述空调中的半导体制冷元器件的开关运行。
- 一种用于空调控制的装置，所述空调如权利要求1、2或3所述，该装置包括处理器和存储有程序指令的存储器，其特征在于，所述处理器被配置为在执行所述程序指令时，执行如权利要求4至9任一项所述用于空调控制的方法。
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105157105A (zh) * | 2015-07-22 | 2015-12-16 | 珠海格力电器股份有限公司 | 室内机及具有该室内机的空调器 |
| CN105757816A (zh) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | 一种窗式半导体空调器 |
| CN107525153A (zh) * | 2017-09-21 | 2017-12-29 | 北京同衡能源环境科学研究院有限公司 | 一种分布式新风处理机组 |
| CN107940563A (zh) * | 2017-11-14 | 2018-04-20 | 海信（山东）空调有限公司 | 一种空调室内机及空调 |
| CN212179120U (zh) * | 2020-04-20 | 2020-12-18 | 珠海格力电器股份有限公司 | 一种基于半导体换热器的机组及空调 |
| CN113531705A (zh) * | 2021-07-09 | 2021-10-22 | 青岛海尔空调器有限总公司 | 空调及用于空调控制的方法、装置 |
| CN113531830A (zh) * | 2021-07-09 | 2021-10-22 | 青岛海尔空调器有限总公司 | 用于空调控制的方法、装置及空调 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201819329U (zh) * | 2010-08-19 | 2011-05-04 | 常真源 | 半导体空调器 |
| CN103277862A (zh) * | 2013-06-17 | 2013-09-04 | 周哲明 | 一种节能水冷空调 |
| KR101461599B1 (ko) * | 2013-06-27 | 2014-11-20 | 나영수 | 제상 및 압축효율이 개선되는 공기조화기 |
| CN111043801A (zh) * | 2019-12-26 | 2020-04-21 | 南京工业大学 | 集成涡流管和半导体制冷片的空调室外机除霜系统及方法 |
| CN113071288B (zh) * | 2021-04-28 | 2022-06-14 | 吉林大学 | 一种太阳能车载辅助空调系统 |
-
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105157105A (zh) * | 2015-07-22 | 2015-12-16 | 珠海格力电器股份有限公司 | 室内机及具有该室内机的空调器 |
| CN105757816A (zh) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | 一种窗式半导体空调器 |
| CN107525153A (zh) * | 2017-09-21 | 2017-12-29 | 北京同衡能源环境科学研究院有限公司 | 一种分布式新风处理机组 |
| CN107940563A (zh) * | 2017-11-14 | 2018-04-20 | 海信（山东）空调有限公司 | 一种空调室内机及空调 |
| CN212179120U (zh) * | 2020-04-20 | 2020-12-18 | 珠海格力电器股份有限公司 | 一种基于半导体换热器的机组及空调 |
| CN113531705A (zh) * | 2021-07-09 | 2021-10-22 | 青岛海尔空调器有限总公司 | 空调及用于空调控制的方法、装置 |
| CN113531830A (zh) * | 2021-07-09 | 2021-10-22 | 青岛海尔空调器有限总公司 | 用于空调控制的方法、装置及空调 |
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