WO2023273757A1 - Carte de circuit imprimé et dispositif électronique - Google Patents

Carte de circuit imprimé et dispositif électronique Download PDF

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Publication number
WO2023273757A1
WO2023273757A1 PCT/CN2022/095913 CN2022095913W WO2023273757A1 WO 2023273757 A1 WO2023273757 A1 WO 2023273757A1 CN 2022095913 W CN2022095913 W CN 2022095913W WO 2023273757 A1 WO2023273757 A1 WO 2023273757A1
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WO
WIPO (PCT)
Prior art keywords
hole
holes
crimping
signal
ground
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Application number
PCT/CN2022/095913
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English (en)
Chinese (zh)
Inventor
杨成建
宋功斌
刘旭升
Original Assignee
华为技术有限公司
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Publication of WO2023273757A1 publication Critical patent/WO2023273757A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the embodiments of the present application relate to the technical field of circuit boards, and in particular to a printed circuit board and electronic equipment.
  • the purpose of this application is to provide a printed circuit board and electronic equipment, which can shield the electromagnetic field between each pair of signal crimping holes, so as to reduce the signal crosstalk of high-speed signals between each pair of signal crimping holes, so that high-speed The signal can meet the corresponding transmission requirements.
  • the present application provides a printed circuit board.
  • the printed circuit board includes a connector insertion area, and multiple rows of crimping holes are arranged in the connector insertion area, and each row of crimping holes includes at least two For the signal crimping holes, each pair of the signal crimping holes includes two of the signal crimping holes; the row arrangement direction of the crimping holes is the first direction, and along the first direction, each pair of the signal crimping holes
  • a ground hole group is provided on both sides of the hole, and the ground hole group includes a ground crimp hole and a ground hole located at least one side of the ground crimp hole, and two signal crimp holes in each pair of signal crimp holes
  • At least one shielding hole is also provided between the crimping holes, and the grounding crimping hole, the ground hole and the shielding hole are all grounded; the grounding crimping hole, the ground hole and the shielding hole jointly surround The signal crimp holes.
  • the printed circuit board can be a double-sided board or a multi-layer board.
  • the printed circuit board is a multi-layer board, it includes a multi-layer conductive layer and a multi-layer dielectric layer, a multi-layer conductive layer and a multi-layer
  • the dielectric layers are alternately stacked, and the number of layers of the printed circuit board is not specifically limited here.
  • the conductive layer is generally made of copper foil, which is used to form the signal outlet in the printed circuit board;
  • the dielectric layer is generally made of resin or glass fiber, etc., and is used to electrically isolate two adjacent conductive layers.
  • the connector insertion area is used to cooperate with the connector, and the position of the connector insertion area in the printed circuit board is not limited.
  • the connector insertion area can be located at the four corners of the printed circuit board region, and can also be located in the central region.
  • the number of rows of crimping holes in the connector insertion area and the number of signal crimping holes in each row of crimping holes can be set according to the corresponding use requirements, and are not specifically limited here.
  • the ground crimping hole is used to match the grounding crimping pin of the connector, and the shape of the grounding crimping hole is the same or similar to that of the grounding crimping pin in the connector, so that the grounding crimping pin in the connector can be inserted Mounted in the ground crimp hole.
  • the ground hole is set on at least one side of the ground crimping hole, and both the ground hole and the grounding crimping hole are connected to the conductive layer of the printed circuit board to achieve grounding.
  • each adjacent two Grounding crimping holes and ground holes are arranged between the signal crimping holes, which can separate two adjacent pairs of signal crimping holes, thereby shielding the electromagnetic field between two adjacent pairs of signal crimping holes, so as to Effectively reduce signal crosstalk between two pairs of signal crimping holes in the same row.
  • the shielding hole is also connected to the conductive layer for grounding.
  • the shielding hole, the ground crimping hole, the ground hole and the shielding hole can jointly surround the signal crimping hole.
  • the ground crimping holes, ground holes and shielding holes form a shielding area, and the electromagnetic field of a pair of signal crimping holes is limited in the above shielding area, which not only reduces the number of signal crimping holes in the same row.
  • the signal crosstalk between them also reduces the signal crosstalk between each pair of signal crimping holes between different rows, so that when high-speed signals are transmitted in the printed circuit board provided by the embodiment of the present application, the corresponding transmission requirements can be met.
  • a grounding hole group is provided on both sides of each pair of signal crimping holes, and the grounding hole group includes grounding crimping holes and ground holes on at least one side of the grounding crimping holes, There is also at least one shielding hole between the two signal crimping holes in the signal crimping hole, the grounding crimping hole, the ground hole and the shielding hole are all grounded, and they surround the signal crimping hole together, so that a pair of signal crimping holes
  • the electromagnetic field of the connection hole is limited within a certain range, which reduces the signal crosstalk between each pair of signal crimping holes in the same row and the signal crosstalk between each pair of signal crimping holes in different rows, so that the high-speed signal is in the printed circuit board.
  • the transmission can meet the corresponding transmission requirements.
  • the printed circuit board includes a first surface, and in a direction perpendicular to the first surface, the ground hole, the shielding hole, and the ground crimping hole form a surrounding hole group, and the The dimension of the surrounding hole group extending in the direction perpendicular to the first surface is greater than or equal to the dimension of the signal crimping holes extending in the direction perpendicular to the first surface. It can be understood that the depths of the ground hole, the shielding hole and the ground crimping hole should be greater than or equal to the depth of the signal crimping hole.
  • the ground crimping hole, ground hole and shielding hole can shield the electromagnetic field between adjacent pairs of signal crimping holes in the thickness direction of the printed circuit board, so as to reduce the gap between each pair of signal crimping holes. signal crosstalk.
  • each of the ground hole groups includes a plurality of ground holes, and the maximum connection length of the plurality of ground holes in the second direction is greater than or equal to the signal crimping hole in the second direction. Length in the second direction; the second direction is on the first surface and is perpendicular to the first direction. It can be understood that when there are multiple ground holes, the multiple ground holes can cover a larger area, so that the electromagnetic fields of the signal crimping holes can be shielded more comprehensively.
  • the maximum connection length of the plurality of ground holes in the second direction is greater than or equal to the length of the signal crimping hole in the second direction
  • the ground hole group composed of the plurality of ground holes and the ground crimping hole can effectively Two adjacent pairs of signal crimping holes in the same row are separated to block the electromagnetic field between two adjacent pairs of signal crimping holes, thereby reducing signal crosstalk between pairs of signal crimping holes in the same row.
  • the maximum connection length refers to the maximum value of the connection length between holes.
  • each of the ground hole groups includes two pairs of the ground holes, and along the first direction, the two pairs of the ground holes are respectively located on both sides of the ground crimping hole, each pair Each of the ground holes includes two ground holes arranged at intervals along the second direction. It can be understood that, generally, the space between two adjacent pairs of signal crimping holes in the same row is relatively small, so there is not enough space between them to arrange a large number of ground holes.
  • only two pairs of ground holes surround the ground crimping holes to form a ground hole group, so that the space between two adjacent pairs of signal crimping holes can effectively accommodate the above-mentioned ground hole groups, and one ground hole
  • the combination of the crimping holes and the two pairs of ground holes can achieve sufficient electromagnetic field shielding effect, so as to effectively reduce signal crosstalk between two adjacent pairs of signal crimping holes in the same row.
  • the ground crimping hole communicates with the ground hole to form an integrated structure. It can be understood that, according to different application requirements, the ground crimping hole and the ground hole can be partially overlapped to form an integrated plum blossom hole structure. Under the above structure, the space occupied by the ground crimping hole and the ground hole Smaller and capable of sufficient electromagnetic field shielding effect to effectively reduce signal crosstalk between two adjacent pairs of signal crimping holes in the same row.
  • a plurality of shielding holes are provided between two signal crimping holes in each pair of signal crimping holes, and the plurality of shielding holes at least include a first shielding hole and a second shielding hole spaced apart from each other.
  • the first shielding hole is provided on a side of the signal crimping hole facing the second direction
  • the second shielding hole is provided on a side of the signal crimping hole facing away from the second direction.
  • the first shielding hole and the second shielding hole are provided, and the first shielding hole is set on the side of the signal crimping hole facing the second direction, and the second shielding hole is set on the side of the signal crimping hole facing away from the second direction. side, that is, in the second direction, the first shielding hole is set between the signal crimping hole of this row and the signal crimping hole of the previous row, and the second shielding hole is set between the signal crimping hole of this row and the next row.
  • the first shielding hole and the second shielding hole can separate the signal crimping holes in different rows, so as to effectively reduce the signal crosstalk between the pairs of signal crimping holes in different rows.
  • the number of the first shielding holes is multiple, and the multiple first shielding holes are arranged in sequence along the first direction; the multiple first shielding holes are arranged at intervals; or , a plurality of the first shielding holes are connected to form an integrated structure.
  • a plurality of first shielding holes can cover a larger area between two adjacent rows of signal crimping holes, thereby achieving a better electromagnetic field shielding effect and effectively reducing the distance between each pair of signal crimping holes between different rows. crosstalk between signals.
  • the number of the second shielding holes is multiple, and the multiple second shielding holes are arranged in sequence along the first direction; the multiple second shielding holes are arranged at intervals; or , a plurality of the second shielding holes are connected to form an integrated structure.
  • a plurality of second shielding holes can cover a larger area between two adjacent rows of signal crimping holes, so as to achieve a better electromagnetic field shielding effect and effectively reduce the distance between each pair of signal crimping holes between different rows. crosstalk between signals.
  • each of the ground hole groups includes a plurality of ground crimping holes, and the plurality of ground crimping holes are arranged at intervals along the second direction. It can be understood that when the printed circuit board is matched with different types of connectors, due to the difference in the number of grounding crimping pins in different types of connectors, correspondingly, each grounding hole group can include a plurality of grounding crimping pins. contact holes, and a plurality of ground crimping holes are arranged at intervals along the second direction.
  • ground crimping holes when the number of ground crimping holes is multiple and arranged at intervals along the second direction, the existence of multiple ground crimping holes can also effectively block the electromagnetic field, thereby effectively reducing the number of adjacent pairs of the same row. Signal crosstalk between signal crimp holes.
  • any pair of signal crimping holes in the upper row and any pair of signal crimping holes in the next row Misaligned socket settings. It can be understood that when two pairs of signal crimping holes located in different rows face each other, the electromagnetic fields between the two pairs of signal crimping holes are more likely to interact with each other, thus causing serious signal crosstalk.
  • the signal crimping holes located in two adjacent rows are misplaced to effectively reduce the signal crosstalk between pairs of signal crimping holes in different rows, so that the high-speed signal is The transmission can meet the corresponding transmission requirements.
  • each of the signal crimping holes is surrounded by an anti-pad, and the outer contour of the anti-pad is circular. It can be understood that the existence of the anti-pad can reduce the dielectric capacitance on the printed circuit board, which is more conducive to the integrity of the signal and the impedance matching of the signal. However, the electromagnetic field between the signal outlets on different conductive layers can pass through the anti-pad and interfere with each other, resulting in signal crosstalk between the signal outlets on different conductive layers.
  • the outer contour of the anti-pad is designed as a circle to replace the traditional rectangular anti-pad, so as to effectively reduce the size of the anti-pad, thereby reducing the signal outlets on different conductive layers
  • the signal crosstalk between them enables the high-speed signal to meet the corresponding transmission requirements when it is transmitted in the printed circuit board.
  • the inner surface of the signal crimping hole is provided with a first metal plating layer, the inner surface of the grounding crimping hole is provided with a second metal plating layer; the inner surface of the ground hole is provided with a first conductive Plating, the inner surface of the shielding hole is provided with a second conductive coating, the material of the first conductive coating and the second conductive coating is conductive metal or conductive non-metal; the printed circuit board includes alternately stacked conductive layer and a dielectric layer, the first metal coating, the second metal coating, the first conductive coating and the second conductive coating are all electrically connected to the conductive layer; at least one of the conductive layers is formed There is a signal outlet, the ground crimping hole, the ground hole and the shielding hole are all spaced apart from the signal outlet, and the signal outlet is electrically connected to the first metal plating layer in the signal crimping hole connect.
  • the first metal coating can be formed by electroplating, vapor deposition, sputtering, chemical plating or vapor deposition, and the first metal coating can be made of metal materials such as copper, aluminum, silver or other alloy materials , the material and formation process of the first metal plating layer are not specifically limited here.
  • the second metal plating layer is electrically connected to the conductive layer, so as to electrically connect each conductive layer in the printed circuit board, when the grounding of the connector After the crimping pin is inserted into the grounding crimping hole, the sides of the grounding crimping pin can be in contact with each conductive layer at the same time to improve the grounding effect, and the presence of the second metal plating layer can also improve the electromagnetic field shielding of the grounding crimping hole effect, thereby reducing signal crosstalk between signal crimping holes.
  • the material and formation process of the second metal coating layer and the first metal coating layer may be the same, which will not be repeated here. It can be understood that by arranging the first conductive plating layer on the inner surface of the ground hole and the second conductive plating layer on the inner surface of the shielding hole, not only the electromagnetic field shielding effect between two adjacent pairs of signal crimping holes can be improved , At the same time, it can improve the grounding effect of each conductive layer in the printed circuit board.
  • first conductive coating and the second conductive coating are made of conductive metal
  • the materials and forming processes of the first conductive coating, the second conductive coating, the first metal coating and the second metal coating can be the same, No need to go into details here; when the first conductive plating layer and the second conductive plating layer are made of conductive non-metal, they can also have the same grounding and electromagnetic field shielding functions.
  • the material of the first conductive plating layer and the second conductive plating layer is conductive resin.
  • the signal transmission function can be effectively realized by forming the signal outgoing line on at least one conductive layer and electrically connecting the signal outgoing line with the first metal plating layer.
  • the ground crimping hole is spaced from the signal outlet to effectively avoid overlapping positions between the two.
  • the two signal outlets connected to the same pair of signal crimping holes are distributed axisymmetrically with respect to the axis of symmetry extending along the second direction; the second direction is perpendicular to in the first direction. It can be understood that when the two signal outlets connected to the same pair of signal crimping holes are distributed symmetrically, a better signal skew compensation effect can be achieved to facilitate high-speed signal transmission. It should be noted that, under the above-mentioned structure, the position of the signal outgoing line is likely to overlap with part of the shielding hole, therefore, part of the shielding hole can be omitted to achieve the effect of signal skew compensation.
  • the signal crimping hole, the grounding crimping hole, the ground hole and the shielding hole are any one of through holes, blind holes or back-drilled holes.
  • the signal crimping hole can penetrate the printed circuit board along the thickness direction of the printed circuit board, that is, the signal crimping hole is a through hole, and the depth of the signal crimping hole is the same as the thickness of the printed circuit board; but it is not limited to this , the signal crimping hole can also not penetrate the printed circuit board along the thickness direction of the printed circuit board, that is, the signal crimping hole is a blind hole, and the depth of the signal crimping hole is smaller than the thickness of the printed circuit board; the signal crimping hole can also be through Back-drilled holes formed by the back-drilling process.
  • the structure of the signal crimping hole is determined by actual use requirements, and the structure of the signal crimping hole is not specifically limited here.
  • the ground crimping holes, ground holes and shielding holes can also be any of through holes, blind holes or back-drilled holes, and the structures of the ground crimping holes, ground holes and shielding holes are not discussed here. For specific limitations, it is only necessary to ensure that the depths of the ground crimping hole, ground hole and shielding hole are greater than or equal to the depth of the signal crimping hole.
  • the present application provides an electronic device, which includes the printed circuit board described in any one of the implementation manners of the first aspect, and a connector matched with the printed circuit board, the signal voltage of the connector The contact pin is inserted in the signal crimping hole, and the grounding crimping pin of the connector is inserted in the grounding crimping hole.
  • the electronic equipment provided by this application can effectively solve the problem of signal crosstalk by installing the printed circuit board provided by this application, so that high-speed signals can meet the corresponding transmission requirements when transmitting in the electronic equipment.
  • Figure 1 is a schematic diagram of the interconnection of multiple printed circuit boards in a related design
  • Fig. 2 is a perspective view of a printed circuit board provided by an embodiment of the present application.
  • Fig. 3 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 4 is a schematic diagram of near-end crosstalk and far-end crosstalk obtained by simulating the connector insertion area shown in Fig. 3;
  • Fig. 5 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 6 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 7 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 8 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 9 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 10 is a schematic structural view of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 11 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment
  • Fig. 12 is a partial structural schematic diagram of the connector insertion area in the printed circuit board of an embodiment.
  • the printed circuit board 100 (Printed Circuit Board, PCB) is an important electronic component in electronic equipment, and is the carrier of the electrical connection of electronic components and parts, for example, in electronic communication equipment, usually need to set up a plurality of interconnection connected printed circuit board. In a common way of interconnecting multiple printed circuit boards, as shown in FIG. Connector 200 is connected.
  • Both the backplane 110 and the sub-board 120 are provided with a signal crimping hole and a grounding crimping hole connected to the connector 200, the signal crimping pin of the connector 200 is inserted in the signal crimping hole, and the grounding crimping pin is inserted in the In the ground crimping hole, the backplane 110 and the sub-board 120 can be interconnected through the connector 200 to realize the signal transmission function.
  • the embodiment of the present application provides a printed circuit board 100 .
  • the printed circuit board 100 may be a double-sided board or a multi-layer board.
  • the printed circuit board 100 is a multilayer board, which includes a multilayer conductive layer 11 and a multilayer dielectric layer 12, and the multilayer conductive layer 11 and the multilayer dielectric layer 12 are alternately stacked.
  • the number of layers of the printed circuit board 100 is not specifically limited.
  • the conductive layer 11 is generally made of copper foil, which is used to form the signal outlet in the printed circuit board 100;
  • the dielectric layer 12 is generally made of resin or glass fiber, etc., and is used to electrically isolate two adjacent conductive layers. 11.
  • the printed circuit board 100 is usually provided with a connector inserting area 101 for matching with the connector 200, and the connector inserting area 101 is on the printed circuit board 100.
  • the location of the circuit board 100 is not limited, for example, the connector inserting area 101 may be located in the four corners of the printed circuit board 100 , or may be located in the middle area.
  • each row of crimping holes includes at least two pairs of signal crimping holes 10 arranged at intervals, and each pair of signal crimping holes 10 includes two signal crimping holes.
  • the crimping hole 10, the signal crimping hole 10 is used to cooperate with the signal crimping pin of the connector 200, so as to realize the corresponding signal transmission function.
  • three rows of crimping holes are arranged in the connector insertion area 101 , and each row of crimping holes includes two pairs of signal crimping holes 10 . It should be noted that the number of rows of crimping holes in the connector insertion area 101 and the number of signal crimping holes 10 in each row of crimping holes can be set according to the corresponding use requirements, and no specific details are given here. limited.
  • the row arrangement direction of the crimping holes is the first direction 901, along the first direction 901, each pair of signal crimping holes 10 is provided with a grounding hole group 20 on both sides, and the grounding hole group 20 includes grounding crimping holes 21 and a ground hole 22 located on at least one side of the ground crimping hole 21 .
  • the grounding crimping hole 21 is used to cooperate with the grounding crimping pin of the connector 200, and the shape of the grounding crimping hole 21 is the same as or similar to the shape of the grounding crimping pin in the connector 200, so that the connector 200 The grounding crimping pin can be inserted into the grounding crimping hole 21 .
  • the shape of the grounding crimping pin is generally circular, elliptical or oblate.
  • the grounding crimping hole 21 can be a round hole, an oval hole or an oblate hole.
  • the connecting hole 21 is a round hole, which is designed as a circular grounding crimping hole 21 , which is simple to manufacture, low in cost, and has high positioning precision for the grounding crimping pin.
  • the ground hole 22 is arranged on at least one side of the ground crimping hole 21, and both the ground hole 22 and the grounding crimping hole 21 are connected to the conductive layer 11 of the printed circuit board 100 to realize grounding.
  • a grounding crimping hole 21 and a ground hole 22 are provided between every two adjacent pairs of signal crimping holes 10, which can separate two adjacent pairs of signal crimping holes 10, so that two adjacent pairs of signal crimping holes 10 can be separated.
  • the electromagnetic field between the contact holes 10 is shielded to effectively reduce signal crosstalk between two pairs of signal crimping holes 10 in the same row.
  • At least one shielding hole 30 is further provided between two signal crimping holes 10 in each pair of signal crimping holes 10 .
  • the shielding hole 30 is also connected to the conductive layer 11 for grounding.
  • the shielding hole 30 by setting the shielding hole 30 , the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 can jointly surround the signal crimping hole 10 .
  • the ground crimping hole 21, the ground hole 22 and the shielding hole 30 enclose a shielding area 102, and the electromagnetic field of a pair of signal crimping holes 10 is limited in the above-mentioned shielding area 102, thereby not only reducing the
  • the signal crosstalk between each pair of signal crimping holes 10 also reduces the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that when high-speed signals are transmitted in the printed circuit board 100 provided by the embodiment of the present application , which can meet the corresponding transmission requirements.
  • a grounding hole group 20 is provided on both sides of each pair of signal crimping holes 10, and the grounding hole group 20 includes a grounding crimping hole 21 and at least one ground hole 21 located in the grounding crimping hole 21.
  • the ground hole 22 on the side, and at least one shielding hole 30 is provided between the two signal crimping holes 10 in each pair of signal crimping holes 10, and the grounding crimping hole 21, the ground hole 22 and the shielding hole 30 are all grounded , and together surround the signal crimping holes 10, thereby limiting the electromagnetic field of a pair of signal crimping holes 10 within a certain range, reducing the signal crosstalk between each pair of signal crimping holes 10 in the same row and the signal crosstalk between each pair of signal crimping holes 10 in different rows.
  • Signal crosstalk between the crimping holes 10 enables high-speed signals to meet corresponding transmission requirements when being transmitted in the printed circuit board 100 .
  • the signal crimping hole 10 can penetrate the printed circuit board 100 along the thickness direction of the printed circuit board 100, that is, the signal crimping hole 10 is a through hole, and the signal crimping hole 10 is a through hole.
  • the depth of the connection hole 10 is the same as the thickness of the printed circuit board 100; but it is not limited thereto, the signal crimping hole 10 may not penetrate the printed circuit board 100 along the thickness direction of the printed circuit board 100, that is, the signal crimping hole 10 is blind
  • the depth of the signal crimping hole 10 is smaller than the thickness of the printed circuit board 100; the signal crimping hole 10 may also be a back-drilling hole formed by a back-drilling process. It can be understood that the structure of the signal crimping hole 10 is determined by actual use requirements, and the structure of the signal crimping hole 10 is not specifically limited here.
  • the printed circuit board 100 includes a first surface 103, and in a direction perpendicular to the first surface 103, the ground hole 22, the shielding hole 30 and the ground crimping hole 21 form a surrounding hole group 80, and the surrounding holes
  • the dimension extending in the direction perpendicular to the first surface 103 of the group 80 is greater than or equal to the dimension extending in the direction perpendicular to the first surface 103 of the signal crimping holes 10 .
  • the ground hole 22 , the shielding hole 30 , the ground crimping hole 21 and the signal crimping hole 10 all penetrate the first surface 103 .
  • the ground crimping hole 21, the ground hole 22 and the shielding hole 30 can also be any one of through holes, blind holes or back-drilled holes, and the ground crimping hole 21, the ground hole 22 and the shielding
  • the structure of the hole 30 is specifically defined, and it is only necessary to ensure that the depths of the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 are greater than or equal to the depth of the signal crimping hole 10 .
  • the surrounding hole group 80 formed by the ground crimping hole 21 , the ground hole 22 and the shielding hole 30 can be arranged between adjacent pairs of signal crimping holes 10 in the thickness direction of the printed circuit board 100 . The electromagnetic field between them is shielded to reduce the signal crosstalk between each pair of signal crimping holes 10 .
  • any pair of signal crimping holes 10 in the upper row and any pair of signal crimping holes in the next row 10 dislocation arrangement wherein the second direction 902 is on the first surface 103 and is perpendicular to the first direction 901 . It can be understood that, when two pairs of signal crimping holes 10 in different rows are arranged facing each other, the electromagnetic fields between the two pairs of signal crimping holes 10 are more likely to interact with each other, thus causing serious signal crosstalk.
  • the signal crimping holes 10 located in two adjacent rows are misplaced to effectively reduce the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that the high-speed signal can be transmitted through the printed circuit.
  • the transmission in the board 100 can meet the corresponding transmission requirements.
  • each ground hole group 20 includes a plurality of ground holes 22, and the maximum connection length of the plurality of ground holes 22 in the second direction 902 is greater than or equal to the signal crimping hole 10 in the second direction.
  • the length in two directions 902 It can be understood that when there are multiple ground holes 22 , the multiple ground holes 22 can cover a larger area, so that the electromagnetic field of the signal crimping hole 10 can be shielded more comprehensively.
  • the maximum connection length of the plurality of ground holes 22 in the second direction 902 is greater than or equal to the length of the signal crimping hole 10 in the second direction 902, the plurality of ground holes 22 and the ground crimping hole 21 form a
  • the ground hole group 20 can effectively separate two adjacent pairs of signal crimping holes 10 in the same row, so as to block the electromagnetic field between two adjacent pairs of signal crimping holes 10, thereby reducing the distance between each pair of signal crimping holes 10 in the same row. crosstalk between signals.
  • the maximum connection length refers to the maximum value of the connection length between holes.
  • each ground hole group 20 includes two pairs of ground holes 22, and along the first direction 901, the two pairs of ground holes 22 are respectively located on both sides of the ground crimping hole 21, and each pair of ground holes 22 Each includes two ground holes 22 arranged at intervals along the second direction 902 . It can be understood that, generally, the space between two adjacent pairs of signal crimping holes 10 in the same row is relatively small, therefore, there is not enough space between them to arrange a large number of ground holes 22 .
  • the ground hole group 20 is only formed by setting two pairs of ground holes 22 surrounding the ground crimping hole 21, so that the space between two adjacent pairs of signal crimping holes 10 can effectively accommodate the ground hole group 20 , and the combination of one ground crimping hole 21 and two pairs of ground holes 22 can achieve sufficient electromagnetic field shielding effect, so as to effectively reduce the signal crosstalk between two adjacent pairs of signal crimping holes 10 in the same row.
  • the maximum connection length between the two ground holes 22 should be greater than or equal to the signal crimping hole 10
  • the lengths in the two directions 902 effectively separate the two pairs of signal crimping holes 10 to achieve a better electromagnetic field shielding effect.
  • the signal crosstalk between two adjacent pairs of signal crimping holes 10 generally includes near-end crosstalk (Near End Crosstalk, referred to as NEXT) and far-end crosstalk (Far End Crosstalk, referred to as FEXT), wherein, near-end crosstalk means that after a pair of signal crimping holes 10 transmit a signal, the signal is received at the signal input end (near end) of another pair of signal crimping holes 10, which is called near-end crosstalk.
  • Far-end crosstalk means that after a pair of signal crimping holes 10 transmit a signal, the signal is received at the signal output end (far end) of another pair of signal crimping holes 10 , which is called far-end crosstalk.
  • the printed circuit board 100 provided by this embodiment can effectively reduce the near-end crosstalk and far-end crosstalk of the signal compared with the traditional printed circuit board, so that the high-speed signal can be used in the printed circuit board provided by the embodiment of the application When transmitting in 100, the corresponding transmission requirements can be met.
  • the ground crimping hole 21 communicates with the ground hole 22 to form an integrated structure. It can be understood that, according to different application requirements, the ground crimping hole 21 and the ground hole 22 can be partially overlapped to form an integrated plum blossom hole structure. Under the above structure, the ground crimping hole 21 and the ground hole 22 The occupied space is smaller, and sufficient electromagnetic field shielding effect can be achieved to effectively reduce the signal crosstalk between two adjacent pairs of signal crimping holes 10 in the same row.
  • each ground hole group 20 includes a plurality of ground crimping holes 21 , and the plurality of ground crimping holes 21 are arranged at intervals along the second direction 902 . It can be understood that when the printed circuit board 100 is matched with different types of connectors 200, due to the difference in the number of ground crimping pins in different types of connectors 200, correspondingly, each ground hole group 20 may include A plurality of ground crimping holes 21 , and the plurality of ground crimping holes 21 are arranged at intervals along the second direction 902 .
  • each ground hole group 20 includes two ground crimping holes 21 , and the two ground crimping holes 21 are arranged at intervals along the second direction 902 .
  • a plurality of shielding holes 30 are arranged between two signal crimping holes 10 in each pair of signal crimping holes 10, and the plurality of shielding holes 30 include at least spaced
  • the first shielding hole 31 and the second shielding hole 32 are provided, and the first shielding hole 31 is set on the side of the signal crimping hole 10 facing the second direction 902, and the second shielding hole 32 is set on the signal crimping hole 10 away from the side of the second direction 902, that is, in the second direction 902, the first shielding hole 31 is arranged between the signal crimping hole 10 of this row and the signal crimping hole 10 of the previous row, and the second shielding hole 32 is set between the signal crimping hole 10 of the row and the signal crimping hole 10 of the next row, so that the first shielding hole 31 and the second shielding hole 32 can separate the signal crimping holes 10 between different rows, so as to Signal crosstalk between pairs of signal crimping holes 10 between different rows is effectively reduced.
  • the first shielding hole 31, the second shielding hole 32, the ground hole 22 and the grounding crimping hole 21 together surround a pair of signal crimping holes 10, and the electromagnetic field of the signal crimping holes 10 is Shielding in the surrounding space not only reduces the signal crosstalk between each pair of signal crimping holes 10 in the same row, but also reduces the signal crosstalk between each pair of signal crimping holes 10 in different rows, so that high-speed signals can be used in this application When transmission is performed in the printed circuit board 100 provided by the embodiment, corresponding transmission requirements can be met.
  • the number of first shielding holes 31 is multiple, and the plurality of first shielding holes 31 are arranged in sequence along the first direction 901, and the intervals between the plurality of first shielding holes 31 are set up.
  • a plurality of first shielding holes 31 can cover a larger area between two adjacent rows of signal crimping holes 10, so as to achieve a better electromagnetic field shielding effect and effectively reduce the number of pairs of signal crimping between different rows.
  • the number of the first shielding holes 31 is two, and the two first shielding holes 31 are arranged at intervals along the first direction 901 .
  • the multiple first shielding holes 31 are arranged in sequence along the first direction 901 , and the multiple first shielding holes 31 are connected, to form a one-piece structure. It should be noted that, generally, the distance between two signal crimping holes 10 in a pair of signal crimping holes 10 is relatively small, which may not be enough to accommodate a plurality of first shielding holes 31 arranged at intervals.
  • a plurality of first shielding holes 31 arranged along the first direction 901 are partially overlapped to form an integrated structure, which can be regarded as an opening along the first direction 901
  • the hole-like structure with a larger size effectively separates the signal crimping holes 10 between different rows, so as to effectively reduce the signal crosstalk between each pair of signal crimping holes 10 between different rows.
  • the number of second shielding holes 32 can also be multiple, and multiple second shielding holes 32 are arranged in sequence along the first direction 901, as shown in FIG. 8 , in a possible
  • the plurality of second shielding holes 32 are arranged at intervals; as shown in FIG. 9 , in another possible embodiment, the plurality of second shielding holes 32 are connected to form an integrated structure. I won't go into details here.
  • the inner surface of the signal crimping hole 10 is provided with a first metal plating layer 41
  • the inner surface of the grounding crimping hole 21 is provided with a second metal plating layer 42 . It can be understood that, by disposing the first metal plating layer 41 on the inner surface of the signal crimping hole 10 , the crimping function of the signal crimping pins in the connector 200 is correspondingly completed.
  • the first metal coating 41 can be formed by electroplating, vapor deposition, sputtering, chemical plating or vapor deposition, and the first metal coating 41 can be copper, aluminum, silver and other metal materials or other alloy materials
  • the material and forming process of the first metal plating layer 41 are not specifically limited here.
  • the second metal plating layer 42 is electrically connected to the conductive layer 11, so as to electrically connect the conductive layers 11 in the printed circuit board 100 , when the grounding crimping pin of the connector 200 is inserted into the grounding crimping hole 21, the sides of the grounding crimping pin can contact with each conductive layer 11 at the same time, so as to improve the grounding effect, and the presence of the second metal plating layer 42
  • the electromagnetic field shielding effect of the ground crimping hole 21 can also be improved, thereby reducing the signal crosstalk between the signal crimping holes 10 .
  • the material and formation process of the second metal coating layer 42 and the first metal coating layer 41 may be the same, and details are not described here.
  • At least one conductive layer 11 is formed with a signal outlet 60, the ground crimping hole 21 is spaced from the signal outlet 60, and the signal outlet 60 is electrically connected to the first metal plating layer 41 in the signal crimping hole 10. connect.
  • the signal transmission function is effectively realized by forming the signal outgoing line 60 on at least one conductive layer 11 and electrically connecting the signal outgoing line 60 with the first metal plating layer 41 .
  • the ground crimping hole 21 is spaced from the signal outgoing line 60 to effectively avoid overlapping positions between the two.
  • the inner surface of the ground hole 22 is provided with a first conductive coating 51
  • the inner surface of the shielding hole 30 is provided with a second conductive coating 52
  • the materials of the first conductive coating 51 and the second conductive coating 52 are Conductive metal or conductive non-metal.
  • first conductive coating 51 and the second conductive coating 52 are made of conductive metal
  • the materials of the first conductive coating 51, the second conductive coating 52, the first metal coating 41 and the second metal coating 42 and The formation process can be the same, and will not be repeated here; when the first conductive plating layer 51 and the second conductive plating layer 52 are made of conductive non-metal, they can also play the same grounding and electromagnetic field shielding functions.
  • the material of the first conductive plating layer 51 and the second conductive plating layer 52 is conductive resin. It should also be noted that both the ground hole 22 and the shielding hole 30 should be spaced apart from the signal outlet 60 to avoid overlapping positions among the three.
  • each signal crimping hole 10 is surrounded by an anti-pad 70 , and the outer contour of the anti-pad 70 is circular. It can be understood that the presence of the anti-pad 70 can reduce the dielectric capacitance on the printed circuit board 100 , which is more conducive to signal integrity and signal impedance matching. However, the electromagnetic field between the signal outlets 60 on different conductive layers 11 may pass through the anti-pad 70 and interfere with each other, resulting in signal crosstalk between the signal outlets 60 on different conductive layers 11 . Based on this, in this embodiment, the anti-pad 70 is designed to be circular to replace the traditional rectangular anti-pad, so as to effectively reduce the size of the anti-pad 70, thereby reducing the number of outgoing signals on different conductive layers 11. 60 , so that high-speed signals can meet corresponding transmission requirements when being transmitted in the printed circuit board 100 .
  • the two signal outgoing lines 60 connected to the same pair of signal crimping holes 10 are distributed axisymmetrically with respect to the axis of symmetry extending along the second direction 902 . It can be understood that when the two signal outlet wires 60 connected to the same pair of signal crimping holes 10 are distributed symmetrically, a better signal skew compensation effect can be achieved to facilitate high-speed signal transmission. It should be noted that, under the above structure, the position of the signal outgoing line 60 is likely to overlap with part of the shielding hole 30 , therefore, part of the shielding hole 30 can be omitted to achieve the effect of signal skew compensation.
  • the embodiment of the present application also provides an electronic device, including the printed circuit board 100 of the above-mentioned embodiments, and the connector 200 matched with the printed circuit board 100.
  • the signal crimping pins of the connector 200 are inserted into the signal terminals of the printed circuit board 100.
  • the grounding crimping pin of the connector 200 is inserted into the grounding crimping hole 21 .
  • the electronic device since it adopts the printed circuit board 100 of the above-mentioned embodiments, the electronic device has the advantages of the above-mentioned printed circuit board 100 , and details can be referred to above related descriptions, which will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Divulgués dans la présente demande sont une carte de circuit imprimé et un dispositif électronique. La carte de circuit imprimé comprend une zone d'enfichage de connecteur, une pluralité de rangées de trous de sertissage étant disposées dans la zone d'obturation de connecteur ; chaque rangée de trous de sertissage comprend au moins deux paires de trous de sertissage de signal disposés à intervalles ; chaque paire de trous de sertissage de signal comprend deux trous de sertissage de signal ; la direction d'agencement de rangée des trous de sertissage est une première direction ; un groupe de trous de mise à la terre est prévu, dans la première direction, sur chacun des deux côtés de chaque paire de trous de sertissage de signal ; le groupe de trous de mise à la terre comprend un trou de sertissage de mise à la terre et un trou de mise à la terre situé sur au moins un côté du trou de sertissage de mise à la terre ; au moins un trou de blindage étant en outre disposé entre les deux trous de sertissage de signal dans chaque paire de trous de sertissage de signal ; et les trous de sertissage de mise à la terre, les trous de mise à la terre et les trous de blindage sont tous mis à la terre et entourent conjointement les trous de sertissage de signal. Par conséquent, un champ électromagnétique d'une paire de trous de sertissage de signal est limité dans une certaine plage, réduisant ainsi la diaphonie de signal entre chaque paire de trous de sertissage de signal, de telle sorte qu'un signal à grande vitesse peut satisfaire une exigence de transmission correspondante lorsqu'il est transmis dans la carte de circuit imprimé.
PCT/CN2022/095913 2021-06-29 2022-05-30 Carte de circuit imprimé et dispositif électronique WO2023273757A1 (fr)

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CN202121465962.6U CN215835591U (zh) 2021-06-29 2021-06-29 印刷电路板和电子设备

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Publication number Priority date Publication date Assignee Title
CN215835591U (zh) * 2021-06-29 2022-02-15 华为技术有限公司 印刷电路板和电子设备
CN116682800B (zh) * 2023-06-08 2024-02-23 合芯科技有限公司 一种导体结构、半导体封装结构及电路板

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US20130330941A1 (en) * 2012-06-11 2013-12-12 Tyco Electronics Corporation Circuit board having plated thru-holes and ground columns
CN204157162U (zh) * 2014-10-17 2015-02-11 杭州华三通信技术有限公司 Pcb板的压接孔结构
CN108366485A (zh) * 2017-01-27 2018-08-03 泰连公司 印刷电路板连接器足印
CN110730558A (zh) * 2019-09-09 2020-01-24 华为机器有限公司 印刷电路板及通信设备
CN215835591U (zh) * 2021-06-29 2022-02-15 华为技术有限公司 印刷电路板和电子设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330941A1 (en) * 2012-06-11 2013-12-12 Tyco Electronics Corporation Circuit board having plated thru-holes and ground columns
CN204157162U (zh) * 2014-10-17 2015-02-11 杭州华三通信技术有限公司 Pcb板的压接孔结构
CN108366485A (zh) * 2017-01-27 2018-08-03 泰连公司 印刷电路板连接器足印
CN110730558A (zh) * 2019-09-09 2020-01-24 华为机器有限公司 印刷电路板及通信设备
CN215835591U (zh) * 2021-06-29 2022-02-15 华为技术有限公司 印刷电路板和电子设备

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