WO2023248235A1

WO2023248235A1 - Electronic component enclosure and method of assembling the electronic component enclosure

Info

Publication number: WO2023248235A1
Application number: PCT/IN2023/050213
Authority: WO
Inventors: Sivanesaselvam Thangarajan; Senthilnathan SUBBIAH; S N Prashanth
Original assignee: Tvs Motor Company Limited
Priority date: 2022-06-23
Filing date: 2023-03-07
Publication date: 2023-12-28

Abstract

The present invention provides an electronic component enclosure (100) and a method (1100) of assembling thereof. The enclosure (100) comprises a casing (102) for accommodating Printed Circuit Board (PCB) (104) having electronic components (106) on it. Partition wall assembly (108) is mounted onto PCB (104) and is disposed in front portion (102a) for partitioning casing (102) into front portion (102a) and rear portion (102b). The assembly (108) is adapted to receive and support ports (110) configured for providing communication interface to electronic components (106), wherein assembly (108) includes potting filling cavity (112) for receiving and retaining potting material in front portion (102a). A heat exchanging device (114) is mounted onto casing (102) and is adapted to maintain thermal contact with electronic components (106) for dissipating heat generated within the enclosure (100). The enclosure (100) facilitates local potting, improves manufacturability, serviceability, and assembly of PCB within the enclosure 100.

Description

TITLE OF INVENTION

ELECTRONIC COMPONENT ENCLOSURE AND METHOD OF ASSEMBLING THE ELECTRONIC COMPONENT ENCLOSURE

FIELD OF THE INVENTION

[001 ] The present invention relates to an electronic component enclosure. More particularly, relates to the electronic component enclosure for enclosing a Printed Circuit Board (PCB) and a method of assembling the electronic component enclosure. BACKGROUND OF THE INVENTION

[002] In conventional electronic component enclosures, in order to protect Printed Circuit Board (PCB) components, a potting material is used. The potting material is poured within a casing adapted to enclose the PCB components and is then cured. The potting material protects the PCB components from abrasion and environmental hazards. However, potting material is incapable of providing ingress protection to the PCB components. Hence, sealants or gaskets are required to be mounted onto the casing, for preventing dust and/or water intrusion into the casing, thereby providing ingress protection to the PCB components. However, additional components such as sealants and gaskets, increases cost and time of assembly of the electronic component, which is undesirable. Moreover, filling the casing completely with the potting material increases weight and also makes the process of assembly of the electronic component cumbersome and expensive. Additionally, potting when done in the whole casing requires replacement of the entire PCB unit, in the event of damage to the substrate of the PCB. That is, only replacement of PCB is not feasible due to filling of the casing with potting material and no reworking or repairing of the PCB is possible, which is undesirable.

[003] Further, in existing electronic components, say a Vehicle Control Unit (VCU), the ports providing external interface to the VCU are fastened to the casing and an end cover using multiple fasteners. The casing has the end cover with gaskets for sealing the enclosure and the end cover has provisions for accommodating the external interface ports, thereby exposing the ports outside of the casing and the end cover for connecting the VCU to various components. However multiple fasteners are used to hold the ports in place and also the end cover, again increasing the number of components and cost in assembly and servicing. [004] In order to overcome some of the aforesaid limitations, conformal coating of PCBs is carried out, wherein an aerosol is sprayed on a surface of the PCB or the electronic components. However, such a process is again cumbersome and expensive.

[005] Furthermore, the electronic components on the PCB generate heat during operation, which is required to be dissipated. Accordingly, heatsinks or heat transfer bridges are typically mounted on the PCB such that, a thermal contact is established with the electronic components for dissipating the heat. However, such an installation or mounting of the heat sinks or heat transfer bridges make the PCB assembly bulky. Also, precision is needed for ensuring thermal contact of the electronics components with the heat sink. Also, installation of heat sink or heat transfer bridges require fasteners or adhesives, and a mechanism such as forced cooling means or liquid cooling means for directing the heat extracted from the electronic components to external environment. Such a requirement makes the PCB assembly bulky and cumbersome, which is undesirable. Additionally, the heat sink may be required for only localized cooling of some electronic components that generate heat and hence may not be required to extend over the entire surface of the PCB. However, the heat sink extends to whole length of the PCB when directly mounted in the PCB assembly, consequently reducing strength of the PCB, and thus may require reinforcement members for strengthening the PCB, which further adds the number of components in the PCB, which is undesirable.

[006] In view of the above, there is a need for an electronic component enclosure and a method of assembling the electronic component enclosure, which addresses one or more limitations stated above.

SUMMARY OF THE INVENTION

[007] In one aspect, an electronic component enclosure is disclosed. The enclosure comprises a casing for accommodating a Printed Circuit Board (PCB) having a plurality of electronic components on it. A partition wall assembly is mounted onto the PCB and is adapted to be disposed in a front portion of the casing for partitioning the casing into the front portion and a rear portion. The partition wall assembly is adapted to receive and support one or more ports configured for providing communication interface to the plurality of electronic components. The partition wall assembly is defined with a potting filling cavity for receiving and retaining a potting material in the front portion of the casing. Further, a heat exchanging device is mounted onto the casing and is adapted to maintain thermal contact with the plurality of electronic components. The heat exchanging device is adapted to dissipate heat generated within the electronic component enclosure.

[008] In an embodiment, the heat exchanging device is a heat sink comprising an upper portion with a plurality of fin members and a lower portion provided with one or more projections. The one or more projections is adapted to contact the plurality of electronic components for establishing thermal contact between the heat exchanging device with the plurality of electronic components.

[009] In an embodiment, an end region of the front portion of the casing is provided with a slot for enabling mounting of the heat exchanging device onto the casing. Also, a top portion of the partition wall assembly is provided with an opening such that, the opening and the slot are in-line to receive a lower portion of the heat exchanging device into the casing for mounting the heat exchanging device to the casing.

[010] In an embodiment, the casing is provided with a peripheral groove around the slot. The peripheral groove is adapted to engage with a tongue member provided along periphery of the upper portion for mounting the heat exchanging device onto the casing.

[011] In an embodiment, the partition wall assembly comprises a top partition wall unit comprising a top portion and a seat portion extending downwardly from the top portion. The seat portion is defined with one or more mounting elements for mounting the top partition wall unit to a top surface of the PCB. A bottom partition wall unit is also provided to the partition wall assembly and comprises a bottom portion and an engaging portion extending upwardly from the bottom portion. The engaging portion is defined with one or more mounting elements for mounting the bottom partition unit to a bottom surface of the PCB.

[012] In an embodiment, the top partition wall unit and the bottom partition wall unit are provided with one or more guide members. The one or more guide members extend downwardly from the top portion of the top partition wall unit and upwardly from the bottom portion for engaging with support grooves provided in the one or more ports.

[013] In an embodiment, the top partition wall unit and the bottom partition wall unit comprise ribs provided on an inner surface of the top portion and on an inner surface of the bottom portion respectively. The ribs are adapted to enhance structural rigidity of the top partition wall unit and the bottom partition wall unit.

[014] In an embodiment, length of the bottom partition wall unit is less than length of the top partition wall unit.

[015] In an embodiment, the top partitional wall unit is provided with a lip portion that protrudes vertically from the top portion, to form a stepped profile.

[016] In an embodiment, the casing comprises a stopper for restricting position of the partition wall assembly in the front portion of the casing.

[017] In an embodiment, the top partition wall unit and the bottom partition wall unit comprises a plurality of cutouts on the top portion and on the bottom portion respectively. The plurality of cutouts is adapted to adhere to the top partition wall unit and the bottom partition wall unit to the inner surface of the front portion of the casing.

[018] In an embodiment, guiding grooves are provided on inner side surfaces of the casing. The guiding grooves are adapted to guide and maintain orientation of the PCB within the casing.

[019] In another aspect, a method of assembly the electronic component enclosure is provided. The method comprising mounting the top partition wall unit onto the top surface of the PCB through one or more mounting elements. The bottom partition wall unit is then mounted onto the bottom surface of the PCB through one or more mounting elements to form a PCB sub assembly. The top partition wall unit and the bottom partition wall unit upon mounting on the PCB define a potting filling cavity for receiving and retaining a potting material. The one or more guide members of the top partition wall unit and the bottom partition wall unit engage with the support grooves in one or more ports of the PCB upon mounting of the top partition wall unit and the bottom partition wall unit onto the PCB, for supporting the one or more ports. Thereafter, the PCB sub assembly is inserted into a casing through a front portion such that, the top partition wall unit, the bottom partition wall unit and the one or more ports are disposed in the front portion of the casing. The potting material is then filled in the potting filling cavity through the front portion of the casing. The potting material is thereafter cured for fixing the PCB sub assembly to the casing. Subsequently, the heat exchanging device is mounted onto the casing. The heat exchanging device is adapted to maintain thermal contact with a plurality of electronic components provided on the PCB, wherein the heat exchanging device is adapted to dissipate heat generated within the electronic component enclosure.

[020] In an embodiment, mounting of the heat dissipating member on the casing comprises, insertion of the heat dissipating member into the slot of the casing and an opening provided on the top portion of the top partition wall unit, wherein, a tongue member is provided in a bottom surface of an upper portion of the heat dissipating member to engage with the peripheral groove around the slot of the casing and the lower portion is inserted into the casing. Insertion of the lower portion into the casing enables one or more projections of the heat exchanging device to thermally contact the plurality of electronic components for dissipating heat generated in the electronic component enclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[021] Reference will be made to embodiments of the invention, examples of which may be illustrated in accompanying figures. These figures are intended to be illustrative, not limiting. Although the invention is generally described in context of these embodiments, it should be understood that it is not intended to limit the scope of the invention to these particular embodiments. Figure 1 is a perspective view of an electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

Figure 2 is an exploded view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

Figure 3 is a sectional view of the electronic component enclosure along axis A-A’ of Figure 1 , in accordance with an exemplary embodiment of the present invention.

Figure 4 is a perspective view of a casing, in accordance with an exemplary embodiment of the present invention.

Figure 5a is a top view of the casing, in accordance with an exemplary embodiment of the present invention.

Figure 5b is a front view of the casing including a partition wall assembly, in accordance with an embodiment of the present invention.

Figure 5c is a right-side view of the casing, in accordance with an embodiment of the present invention.

Figure 6 is a perspective view of a top partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 7a is a top view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 7b is a front view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 7c is a right-side view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 8 is a perspective view of a bottom partition wall unit, in accordance with an exemplary embodiment of the present invention. Figure 9a is a top view of the bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 9b is a front view of the bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 9c is a right-side view of the bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.

Figure 10a is a perspective view of a heat exchanging device, in accordance with an exemplary embodiment of the present invention.

Figure 10b is a sectional view of the electronic component enclosure about axis A-A’ of Figure 1 , in accordance with an exemplary embodiment of the present invention.

Figure 11 is a flow diagram depicting a method of assembling the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

Figure 12 is an exploded view of a PCB sub-assembly, in accordance with an exemplary embodiment of the present invention.

Figure 13 is an exploded view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

Figure 14 is an exploded view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[022] Various features and embodiments of the present invention here will be discernible from the following further description thereof, set out hereunder. [023] Figure 1 is a perspective view of an electronic component enclosure 100 (hereinafter referred to as ‘enclosure 100’), in accordance with an exemplary embodiment of the present disclosure. The enclosure 100 is adapted to accommodate and protect a Printed Circuit Board (PCB) 104 (for e.g. as shown in Figure 2) having a plurality of electronic components 106 such as capacitors, resistors etc., while being inexpensive, easy to manufacture, and assemble.

[024] The enclosure 100 comprises a casing 102 adapted to accommodate the PCB 104 and/or any other electronic components 106. In the present embodiment, the casing 102 is a shell structure, adapted to accommodate the PCB 104 and/or the electronic components 106. The casing 102 is defined with a front portion 102a and a rear portion 102b. The front portion 102a acts as a mouth portion of the casing 102 and is adapted to receive the PCB 104 and/or the electronic components 106. In the present embodiment, the front portion 102a is provided with a larger area of cross-section than the rear portion 102b, for ease of entry of PCB 104 and/or electronic components 106 into the casing 102. The extent of the front portion 102a and the rear portion 102b is clearly shown in the Figs. 5a-5c. In an embodiment, the casing 102 is provided with an upper casing 102c and a lower casing 102d. The upper casing 102c and the lower casing 102d are attached to one another via conventional attaching mechanisms known in the art, to form the casing 102. In another embodiment, the upper casing 102c and the lower casing 102d may be integrally formed in the casing 102. In an embodiment, the casing 102 is defined with a stepped profile at the interface of the front portion 102a and the rear portion 102b, due to the larger area of cross-section of the front portion 102a compared to the rear portion 102b.

[025] In an embodiment, the casing 102 is provided with guiding grooves 140 (shown in Figures 2, 5b and 13) on inner side surfaces 146 (shown in Figures 2 and 13) for guiding the PCB 104 to the rear portion 102b, thereby maintaining orientation and/or alignment of the PCB 104 within the rear portion 102b. During assembly of the PCB 104 into the casing 102, side edges of the PCB 104 engage with the guiding grooves 140 and thereby, enable the guiding grooves 140 to guide and maintain orientation and/or alignment of the PCB 104 within the casing 102. In an embodiment, the guiding groove 140 may be etched onto the inner side surfaces 146 of the casing 102. In another embodiment, the upper casing 102c and the lower casing 102d may be defined with a cutout (not shown) at the adjoining side surfaces (not shown), so that the guiding grooves 140 are formed on the inner side surfaces 146 upon assembly of the upper casing 102c and the lower casing 102d. In the present embodiment, the guiding grooves 140 extend only along the inner side surfaces 146 of the rear portion 102b of the casing 102.

[026] In an embodiment, the casing 102 is a flat oval cylindrical shell structure with a rectangular cross-section. In another embodiment, the casing 102 is made of a plastic material. Alternatively, the casing 102 may be made by a metallic material or a composite material as per design feasibility and requirement. In another embodiment, the dimensions of the casing 102 are selected as per the size of the PCB 104 and/or electronic components that is to be accommodated.

[027] Referring to Figure 2 in conjunction with Figure 1 , a partition wall assembly 108 is mounted onto the PCB 104 via a plurality of mounting elements 128, 132. The partition wall assembly 108 is disposed on the front portion 102a. In an embodiment, the casing 102 comprises a stopper 138 (for e.g. shown in Figures 4 and 13) for restricting position of the partition wall assembly 108 in the front portion 102a. The partition wall assembly 108 ensures partition of the casing 102 as the front portion 102a and the rear portion 102b. Such a construction, ensures that a potting material (not shown) is only required to be filled either at the front portion 102a or at the rear portion 102b, thereby mitigating the need for filling the potting material throughout the casing 102. In the present embodiment, the potting material is filled in the front portion 102a of the casing 102. Also, the partition wall assembly 108 prevents flow of the potting material from the front portion 102a to the rear portion 102b, and vice versa. In the present embodiment, the partition wall assembly 108 prevents flow of the potting material from the front portion 102a to the rear portion 102b. Further, the partition wall assembly 108 is adapted to receive and support one or more ports 1 10 provided to the PCB 104, in order to provide communication interface to the electronic components 106 of the PCB 104. The communication interface enables transfer of electric current and electrical signals to the PCB 104 for operation of the electronic components 106 in a powered device, such as a vehicle (not shown) being controlled by the electronic components 106. In an embodiment, the electronic component enclosure 100 may be a motor control unit (not shown) controlling the operation of a motor (not shown) of the vehicle. The motor may drive the vehicle and the motor control unit may be connected between one or more power sources (not shown) in the vehicle and the motor. The ports 1 10 may be the means for transfer of power and control signals to both the energy source and the motor. In another embodiment, the electronic component enclosure 100 may be a vehicle control unit controlling different subsystems of the vehicle, such as, ignition system (not shown), transmission system (not shown), etc.

[028] The partition wall assembly 108 when mounted on the PCB 104 and along with the inner surface of the casing 102 in the front portion 102a forms a potting filling cavity 112 (for e.g. as shown in Figure 3, which is a sectional view of Figure 1 along axis A-A’) for receiving and retaining the potting material of the enclosure 100 in the front portion 102a. The potting filling cavity 112 ensures filling of the potting material within the front portion 102a itself, thereby mitigating requirement of filling the entire casing 102 with the potting material. Consequently, the enclosure 100 becomes inexpensive due to reduced usage of the potting material. Also, the potting material in the front portion 102a ensures that the PCB 104 is resistant to shocks and vibrations and prevents ingress of water, moisture or any corrosive agent from the front portion 102a toward the rear portion 102b. It is in the rear portion 102b of the casing 102 that the electronic components 106 of the PCB 104 are located and the potting material in the potting filling cavity 112 is in the front portion 102a of the casing 102. In an embodiment, the partition wall assembly 108 may be a monolithic structure. In the present embodiment, the partition wall assembly 108 is an assembly of a top partition wall unit 126 and a bottom partition wall unit 130, which will be described in description pertaining to Figures 6-9c.

[029] Referring to Figures 6-7c, the top partition wall unit 126 of the partition wall assembly 108 is depicted. The top partition wall unit 126 comprises a top portion 126a and a seat portion 126b that extends downwardly from the top portion 126a. In an embodiment, the downward extension of the seat portion 126b can be inclined to the top portion 126a, as per requirement. In an embodiment, the top portion 126a and the seat portion 126b conform to an inverted L-shaped structure (for e.g. as shown in Figure 7c), for feasibility of mounting onto the front portion 102a of the casing 102. The top portion 126a is adapted to engage on a top inner surface (not shown) of the front portion 102a of the casing 102, while the seat portion 126b engages with a top surface 104a (for e.g. as shown in Figure 2) of the PCB 104.

[030] Further, the seat portion 126b is defined with the mounting provisions 128 that engage with slots 104c (for e.g. as shown in Figure 10) provided on the PCB 104, and thus, enabling mounting of the top partition wall unit 126 onto the top surface 104a of the PCB 104. In an embodiment, the mounting provisions 128 engage with the slots 104c via a snap-fit mechanism. In an embodiment, the mounting provisions 128 are provided at the ends and at a central region of the seat portion 126b. Corresponding to the location of the mounting provisions 128, the slots 104c are provided for enabling engagement with the top surface 104a of the PCB 104.

[031] Further, one or more guide members 134 (for e.g. as shown in Figures 6, 7b and 7c) are provided on the top partition wall unit 126. The guide members 134 extend downwardly from the top portion 126a towards the PCB 104. The guide members 134 are configured to engage with support grooves 136 (for e.g. as shown in Figure 3) provided on the one or more ports 110. The guide members 134 are configured to stably support the ports 1 10 within the enclosure 100. Thus, the guide members 134 act as a securing mechanism for the ports 1 10, thereby mitigating need for use of fasteners in the enclosure 100. In an embodiment, the guide members 134 extend upto a required length based on the depth of the support grooves 136 for seamless engagement. In another embodiment, the guide members 134 are rectangular members with dimensions corresponding to the construction of the support grooves 136.

[032] The top partition wall unit 126 further comprises ribs (not shown in Figures) provided on an inner surface (not shown in Figures) of the top portion 126a. The ribs are adapted to enhance structural rigidity of the top partition wall unit 126. In the present embodiment, the ribs are hexagonal in construction for enhancing the structural rigidity.

[033] In an embodiment, a plurality of cutouts (not shown in Figures) are provided on the top portion 126a. The plurality of cutouts are adapted to adhere the top partition wall unit 126 to the inner surface of the casing 102 via the potting material added into the potting filling cavity 112. In an embodiment, the plurality of cutouts are triangular in shape, as the vertex pointing towards the ports 110 ensures that the shear stress is directed away from the PCB 104 during disengagement of cables (not shown) from the ports 110.

[034] In an embodiment, the top portion 126a is provided with a lip portion 126c (as shown in Figure 6) that raises substantially vertically and then extends horizontally from the top portion 126a, so as to form a stepped profile. The lip portion 126c conforms with a top portion of the inner surface of the casing 102.

[035] Referring to Figures 8-9c, the bottom partition wall unit 130 of the partition wall assembly 108 is depicted. The bottom partition wall unit 130 comprises a bottom portion 130a and an engaging portion 130b that extends upwardly from the bottom portion 130a. In an embodiment, the upward extension of the engaging portion 130b can be inclined to the bottom portion 130a, as per requirement. In an embodiment, the bottom portion 130a and the engaging portion 130b conform to an L-shaped structure (for e.g. as shown in Figure 9c), for feasibility of mounting onto the front portion 102a of the casing 102. The bottom portion 130a is adapted to engage on a bottom inner surface (not shown) of the front portion 102a of the casing 102, while the engaging portion 130b engages with a bottom surface 104b (for e.g. as shown in Figure 2) of the PCB 104. Upon engagement, the engaging portion 130b partitions the front portion 102a from the rear portion 102b of the casing 102, towards the bottom surface 104b of the PCB 104.

[036] Further, the engaging portion 130b is defined with the mounting provisions 132 that engage with the slot 104c (for e.g. as shown in Figure 10) provided on the PCB 104 and thus, enabling mounting of the bottom partition wall unit 130 onto the bottom surface 104b of the PCB 104. In an embodiment, the mounting provisions 132 extend upwardly from the bottom portion 130a. In an embodiment, the mounting provisions 132 engage with the slots 104c via a snap-fit mechanism. In an embodiment, the mounting provisions 132 are provided at the ends and a central region of the engaging portion 130b for engagement with the slots 104c of the PCB 104.

[037] Furthermore, one or more guide members 134 may also be provided to the bottom partition wall unit 130, with construction identical to the one or more guide members 134 mounted onto the top partition wall unit 126. The bottom partition wall unit 130 also comprises ribs provided on an inner surface of the bottom portion 130a. The ribs are adapted to enhance structural rigidity of the bottom partition wall unit 130. In the present embodiment, the ribs are hexagonal in shape for enhancing the structural rigidity. In another embodiment, the construction and dimensions of the ribs are provided as per design feasibility and requirement. In the present embodiment, multiple cutouts are provided on the bottom portion 130a. The cutouts are adapted to adhere the bottom partition wall unit 130 to the inner surface of the casing 102 via the potting material that is added into the potting filling cavity 1 12.

[038] In an embodiment, dimensions of the bottom partition wall unit 130 are smaller than the dimensions of the top partition wall unit 126. In the present embodiment, length of bottom portion 130a of the bottom partition wall unit 130 is smaller than the length of the top portion 126a of the top partition wall unit 126. Such a construction ensures requirement of lesser volume of potting material.

[039] Referring to Figure 10a, a heat exchanging device 114 is depicted. The heat exchanging device 114 is mounted onto the casing 102 and is adapted to maintain thermal contact with the electronic components 106. The heat exchanging device 1 14 is adapted to dissipate heat generated within the electronic component enclosure 100, thereby ensuring optimum operating temperatures for the electronic components 106. In the present embodiment, the heat exchanging device 114 is a heat sink. [040] The heat exchanging device 114 comprises an upper portion 114a having a plurality of fin members 116 and a lower portion 114b provided with one or more projections 118. The fin members 116 increase the surface area available for contact with ambient air for heat dissipation, while the one or more projections 1 18 are adapted to contact with the electronic components 106 for establishing thermal contact between the heat exchanging device 114 and the electronic components 106. In an embodiment, length of each of the one or more projections 118 is selected in accordance with the dimensions of the electronic component 106 with which the thermal contact is made or based on the type of contact to be established with the electronic component 106.

[041] In an embodiment, the one or more projections 118 are in contact with the electronic component 106 via techniques such as soldering, brazing and the like, as per design feasibility and requirement. Also, the heat dissipating device 114, i.e. the upper portion 114a and the lower portion 114b are made of metallic material for facilitating heat dissipation. In an embodiment, the heat dissipating device 114 can be a monolithic structure or an assembly of the upper portion 114a and the lower portion 114b. In another embodiment, the dimensions and configuration of the heat dissipating device 114 are selected as per heat dissipation requirements of the enclosure 100.

[042] In an embodiment, the heat dissipating device 114 is mounted onto the casing 102 via a slot 120 (for e.g. as shown in Figures 4 and 5a), wherein the slot 120 is defined in the front portion 102a (for e.g. as shown in Figures 1 and 5c) of the casing 102. In an embodiment, the slot 120 is provided at an end region 102e of the front portion 102a, so that the heat dissipating device 114 is mounted at the end region 102e of the front portion 102a. In another embodiment, the slot 120 for mounting the heat dissipating device 114 may be provided based on the location of the electronic components 106 on the PCB 104. In Figures Y1

2, 10b and 12, it is shown that the heat dissipating electronic components 106 are positioned in the front section of the PCB 104 and for motor control units, the predominantly heat dissipating components could be high voltage capacitors and transistors. The layout of the PCB 104 may be ensured to be in manner that the heat dissipating electronic components 106 are all localized on the PCB 104 in the front portion 102a of the casing 102, for ease of thermal contact with the heat dissipating device 114. The heat dissipating device 114 is mounted such that the lower portion 114b is disposed within the casing 102 (for e.g. as shown in Figure 10b, which is a sectional view of Figure 1 along axis A-A’), while the upper portion 114a including the fin members 1 16 is exposed outside the casing 102. Such a construction, ensures that the fin members 116 are able to contact with the ambient air, thereby ensuring heat dissipation of the enclosure 100.

[043] Around the slot 120, a peripheral groove 124 is provided, wherein the slot 120 is adapted to engage with a tongue member 144 of the heat dissipating device 114. In an embodiment, the tongue member 144 is provided on side surfaces (not shown), front surface (not shown) and rear face (not shown) or along periphery of the upper portion 114a. In another embodiment, the tongue member 144 is provided at the interface of the upper portion 1 14a and the lower portion 114b.

[044] In the present embodiment, the tongue member 144 may be a clip member or a hook member that may be provided at strategic locations on the heat dissipating device 1 14 for engagement with the peripheral groove 124. In another embodiment, the dimensions and configuration of the slot 120 and the peripheral groove 124 are selected as per design of the tongue member 144 or as per requirement.

[045] Further, a top portion 126a of the partition wall assembly 108 is provided with an opening 122 for receiving the lower portion 114b of the heat dissipation device 114. That is, the opening 122 is provided on the top portion 126a of the top partition wall unit 126 for receiving the lower portion 114b of the heat dissipation device 1 14. The opening 122 is inline with the slot 120 upon assembly of the top partition wall unit 126 in the casing 102 for ease of mounting of the heat dissipating device 114 into the casing 102 through the top partition wall unit 126. In an embodiment, the opening 122 is provided with dimensions identical to that of the slot 120 for ease of mounting of the heat dissipating device 114.

[046] Figure 11 illustrates a flow diagram of a method 1 100 for assembling the electronic component enclosure 100, in accordance with an exemplary embodiment of the present disclosure.

[047] At step 1 102, the top partition wall unit 126 is mounted onto the top surface 104a of the PCB 104 through the one or more mounting elements 128 (for e.g. as shown in Figure 12). In an embodiment, the top partition wall unit 126 is mounted onto the top surface 104a via snap-fitting of the mounting elements 128 onto the slots 104c of the PCB 104.

[048] At step 1104, the bottom partition wall unit 130 is mounted onto the bottom surface 104b of the PCB 104 through one or more mounting elements 132 (for e.g. as shown in Figure 12) to form a PCB sub assembly 142 (for e.g. as shown in Figure 12). The PCB sub assembly 142 may be combination of the PCB 104, the top partition wall unit 126, and the bottom partition wall unit 130. The top partition wall unit 126 and the bottom partition wall unit 130 upon mounting on the PCB 104 define the potting filling cavity 112 for receiving and retaining the potting material. At this stage, the one or more guide members 134 of the top partition wall unit 126 and the bottom partition wall unit 130 engage with support grooves 136 in the ports 110 of the PCB 104 for supporting the ports 1 10.

[049] At step 1106. the PCB sub assembly 142 is inserted into the casing 102 (for e.g. as shown in Figure 13) such that, the top partition wall unit 126, the bottom partition wall unit 130 and the ports 110 are disposed in the front portion 102a of the casing 102. Upon inserting the PCB sub assembly 142 into the casing 102, the method 1 100 proceeds to step 1 108.

[050] At step 1108, the potting material is added or potted in the potting filling cavity 1 10. In an embodiment, the potting material is added or potted in the potting filling cavity 1 12 from the front portion 102a of the casing 102. Thereafter, the method 1100 proceeds to step 1110 where the potting material is cured thereby fixing the PCB sub assembly 142 to the casing 102.

[051] Subsequently, the method 1100 proceeds to step 1112, where the heat dissipating device 114 is mounted onto the casing 102 (as shown in Figure 14). At step 1 112, the heat dissipating device 114 is inserted into the casing 102 via the slot 120 and the opening 122. Upon insertion, the tongue member 144 of the heat dissipating device 114 engages with the peripheral groove 124, thereby ensuring mounting of the heat dissipating device 114 onto the casing 102. Upon engagement of the tongue member 144, the lower portion 114b is disposed within the casing 102, while the upper portion 114a of the heat dissipating device 1 14 is disposed outwardly of the casing 102. At this scenario, the one or more projections 1 18 contact with the electronic components 106 for establishing thermal contact between the heat dissipating device 114 and the electronic components 106.

[052] The claimed invention as discussed above is not routine, conventional, or well understood in the art, as the claimed aspects enable the following solutions to the existing problems in conventional technologies. Specifically, the claimed aspect of the partition wall assembly 108 comprising the top partition wall unit 126 and the bottom partition wall unit 130, facilitates local potting, improves manufacturability, serviceability and assembly of the enclosure 100. Also, the aspect of the top partition wall unit 126 and the bottom partition wall unit 130 mitigates the requirement of filling the potting material onto whole of the casing 102, thereby reducing weight and size of the enclosure 100. Additionally, the aspect of providing the one or more guide members 134 provides adequate support to the one or more ports 1 10, thereby facilitating a screwless design of the enclosure 100. Furthermore, due to the one or more guide members 134 and ribs the need for a lid member which is typically used in conventional enclosures is mitigated, while achieving required sealing or ingress protection to the PCB 104. Moreover, due to the top partition wall unit 126 and the bottom partition wall unit 130 with the potting material, the PCB 104 can be removed and repaired with ease, thereby ensuring reusability of the PCB 104 and/or the enclosure 100. Furthermore, due to the construction of the casing 102 with the slot 120 and the opening 122, the heat dissipating device 114 is effortlessly mountable onto the casing 102, thereby making the design simple and mitigating a number of components in the assembly. Also, the plurality of fin members 116 being exposed outside the casing 102 ensures efficient cooling of the enclosure 100, while retaining the simpler construction.

Reference numerals

100 - Electronic component enclosure

102 - Casing

102a - Front portion

102b - Rear portion

102c - Upper casing

102d - Lower casing

102e - End region of the casing

104 - Printed Circuit Board (PCB)

104a - Top surface of PCB

104b - Bottom surface of PCB

104c - Slots on PCB

106 - Electronic components

108 - Partition wall assembly - One or more ports - Potting filling cavity - Heat exchanging device a - Upper portion of heat exchanging device b - Lower portion of heat exchanging device - Plurality of fin members - One or more projections - Slot on casing - Opening on partition wall assembly - Peripheral groove - Top partition wall unit a - Top portion of top partition wall unit b - Seat portion of the top partition wall unit c - Lip portion - Mounting elements on top partition wall unit - Bottom partition wall unit a - Bottom portion of bottom partition wall unitb - Engaging portion of bottom partition wall unit - Mounting elements on bottom partition wall unit - Guide members - Support grooves - Stopper - Guiding grooves - PCB sub assembly - Tongue member - Inner side surfaces

Claims

CLAIMS:

1 . An electronic component enclosure (100), comprising: a casing (102) for accommodating a Printed Circuit Board (PCB) (104) having a plurality of electronic components (106); a partition wall assembly (108) mounted onto the PCB (104) and adapted to be disposed in a front portion (102a) of the casing (102) for partitioning the casing (102) into the front portion (102a) and a rear portion (102b), the partition wall assembly (108) adapted to receive and support one or more ports (110) configured for providing communication interface to the plurality of electronic components (106), wherein the partition wall assembly (108) is defined with a potting filling cavity (112) for receiving and retaining a potting material in the front portion (102) of the casing (102); and a heat exchanging device (114) mounted onto the casing (102) and adapted to maintain thermal contact with the plurality of electronic components (106), the heat exchanging device (114) being adapted to dissipate heat generated within the electronic component enclosure (100).

2. The electronic component enclosure (100) as claimed in claim 1 , wherein the heat exchanging device (114) is a heat sink comprising: an upper portion (114a) comprising a plurality of fin members (116); and a lower portion (114b) provided with one or more projections (118), the one or more projections (118) being adapted to contact the plurality of electronic components (106) for establishing thermal contact between the heat exchanging device (114) and the plurality of electronic components (106). The electronic component enclosure (100) as claimed in claim 2, comprising an end region (102e) in the front portion (102a) of the casing (102) provided with a slot (120), the slot (120) enabling mounting of the heat exchanging device (114) onto the casing (102), wherein a top portion (126a) of the partition wall assembly (108) provided with an opening (122) such that, the opening (122) and the slot (120) are In line to receive a lower portion (114b) of the heat exchanging device (114) into the casing (102) for mounting the heat exchanging device (114) to the casing (102). The electronic component enclosures (100) as claimed in claim 3, wherein the casing (102) is provided with a peripheral groove (124) around the slot (120), the peripheral groove (124) being adapted to engage with a tongue member (144) provided along periphery of the upper portion (114a) for mounting the heat exchanging device (114) onto the casing (102). The electronic component enclosure (100) as claimed in claim 1 , wherein the partition wall assembly (108) comprises: a top partition wall unit (126) comprising a top portion (126a) and a seat portion (126b) extending downwardly from the top portion (126a), the seat portion (126b) defined with one or more mounting elements (128) for mounting the top partition wall unit (126) to a top surface (104a) of the PCB (104); and a bottom partition wall unit (130) comprising a bottom portion (130a) and an engaging portion (130b) extending upwardly from the bottom portion (130a), the engaging portion (130b) defined with one or more mounting elements (132) for mounting the bottom partition unit (130) to a bottom surface (104b) of the PCB (104). The electronic component enclosure (100) as claimed in claim 5, wherein the top partition wall unit (126) and the bottom partition wall unit (130) are provided with one or more guide members (134), the one or more guide members (134) extending downwardly from the top portion (126a) of the top partition wall unit (126) and extending upwardly from the bottom portion (130a) for engaging with support grooves (136) provided in the one or more ports (110). The electronic component enclosure (100) as claimed in claim 5, wherein the top partition wall unit (126) and the bottom partition wall unit (130) comprises ribs provided on an inner surface of the top portion (126a) and on an inner surface of the bottom portion (130a) respectively, the ribs being adapted to enhance structural rigidity of the top partition wall unit (126) and the bottom partition wall unit (130). The electronic component enclosure (100) as claimed in claim 5, wherein length of the bottom partition wall unit (130) is less than length of the top partition wall unit (126). The electronic component enclosure (100) as claimed in claim 5, wherein the top partitional wall unit (126) is provided with a lip portion 126c that protrudes vertically from the top portion 126a to form a stepped profile. The electronic component enclosure (100) as claimed in claim 5, wherein the top partition wall unit (126) and the bottom partition wall unit (130) comprises a plurality of cutouts on the top portion (126a) and on the bottom portion (130a) respectively, the plurality of cutouts being adapted to adhere the top partition wall unit (126) and the bottom partition wall unit (130) to the inner surface of the front portion (102a) of the casing (102). 1. The electronic component enclosure (100) as claimed in claim 1 , wherein the casing (102) comprises a stopper (138) for restricting position of the partition wall assembly (108) in the front portion (102a) of the casing (102). 2. The electronic component enclosure (100) as claimed in claim 1 , comprises guiding grooves (140) provided on inner side surfaces of the casing (102), the guiding grooves (140) being adapted to guide and maintain orientation of the PCB (104) within the casing (102).

3. A method (1100) of assembly of an electronic component enclosure (100), the method (1 100) comprising: mounting a top partition wall unit (126) onto a top surface (104a) of a Printed Circuit Board (PCB) (104) through one or more mounting elements (128); mounting a bottom partition wall unit (130) onto a bottom surface (104b) of the PCB (104) through one or more mounting elements (132) to form a PCB sub assembly (142), the top partition wall unit (126) and the bottom partition wall unit (130) upon mounting on the PCB (104) define a potting filling cavity (112) for receiving and retaining a potting material; wherein, one or more guide members (134) of the top partition wall unit (126) and the bottom partition wall unit (130) engage with support grooves (136) in one or more ports (1 10) of the PCB (104) upon mounting of the top partition wall unit (126) and the bottom partition wall unit (130) onto the PCB (104), for supporting the one or more ports (1 10); inserting the PCB sub assembly (142) into a casing (102) through a front portion (102a) such that, the top partition wall unit (126), the bottom partition wall unit (130) and the one or more ports (118) are disposed in a front portion (102a) of the casing (102); potting, the potting material in the potting filling cavity (112) through the front portion (102a) of the casing (102); curing, the potting material, for fixing the PCB sub assembly (142) to the casing (102); and mounting, a heat exchanging device (114) onto the casing (102), the heat exchanging device (114) adapted to maintain thermal contact with a plurality of electronic components (106) provided on the PCB (104), wherein the heat exchanging device (114) is adapted to dissipate heat generated within the electronic component enclosure (100). The method (1100) as claimed in claim 13, wherein mounting of the heat dissipating member (114) on the casing (102) comprises, insertion of the heat dissipating member (1 14) into a slot (120) of the casing (102) and an opening (122) provided on a top portion (126a) of the top partition wall unit (126), wherein, a tongue member (144) provided to an upper portion (114a) of the heat dissipating member (114) engages with a peripheral groove (124) around the slot (120) of the casing (102) and a lower portion (114b) is inserted into the casing (102), wherein insertion of the lower portion (114b) into the casing (102) enables one or more projections (118) of the heat exchanging device (114) to thermally contact the plurality of electronic components (106) for dissipating heat generated in the electronic component enclosure (100).