WO2023243581A1 - Manufacturing method for capacitor, and capacitor - Google Patents

Manufacturing method for capacitor, and capacitor Download PDF

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Publication number
WO2023243581A1
WO2023243581A1 PCT/JP2023/021668 JP2023021668W WO2023243581A1 WO 2023243581 A1 WO2023243581 A1 WO 2023243581A1 JP 2023021668 W JP2023021668 W JP 2023021668W WO 2023243581 A1 WO2023243581 A1 WO 2023243581A1
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Prior art keywords
electrode
capacitor
resin
base electrode
base
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PCT/JP2023/021668
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French (fr)
Japanese (ja)
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克朋 有富
芳正 吉野
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株式会社村田製作所
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Publication of WO2023243581A1 publication Critical patent/WO2023243581A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors

Definitions

  • This invention relates to a technique for connecting internal electrodes within a laminate to external electrodes on the outer surface of the laminate.
  • Patent Document 1 describes a chip type capacitor.
  • the internal electrodes are exposed on the side surface of the chip substrate.
  • a metal film is formed on the exposed surface by plating, and a conductive resin paste is further applied.
  • side electrodes are formed on the side surfaces of the chip substrate, and the internal electrodes and the side electrodes (external electrodes) are connected.
  • Patent Document 2 describes a solid electrolytic capacitor.
  • a part of the anode body is exposed to the outside of the sealing body.
  • the exposed portion is covered with a plating layer, and is electrically connected to the conductive elastic body for the anode through the plating layer.
  • an external electrode is formed on the side surface of the sealing body, and the anode body (internal electrode) and the external electrode are connected.
  • the adhesion strength (adhesion strength) between the internal electrode and the external electrode may be low.
  • Such a low adhesion force for example, causes an increase in ESR of the solid electrolytic capacitor.
  • an object of the present invention is to obtain high adhesion between the internal electrode and the external electrode.
  • the capacitor manufacturing method of the present invention includes an element body forming step, a base electrode forming step, and an external electrode forming step.
  • the element forming process a plurality of flat film-shaped capacitor electrodes are stacked and sealed with an insulating resin to form an element, and a plurality of capacitor electrodes are exposed in a linear manner on the end face of the element.
  • a base electrode is formed on the exposed end faces of the plurality of capacitor electrodes by an AD method.
  • the resin electrode forming step a resin electrode is formed to cover the end face and the base electrode.
  • an external electrode covering the resin electrode is formed.
  • the surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 ⁇ m or more and 10.0 ⁇ m or less.
  • the base electrode has appropriate unevenness in a direction perpendicular to the end face. This improves the adhesion between the base metal and the resin electrode, and the adhesion between the capacitor electrode and the resin and external electrodes.
  • FIG. 1 is an external perspective view of a solid electrolytic capacitor according to an embodiment of the present invention.
  • FIG. 2 is a side sectional view showing the configuration of a solid electrolytic capacitor according to an embodiment of the present invention.
  • FIG. 3(A) is a plan view of the capacitor element, and FIG. 3(B) is a side sectional view of the capacitor element.
  • FIG. 4 is a flowchart showing an example of a schematic flow of the method for manufacturing a solid electrolytic capacitor according to this embodiment.
  • 5(A), FIG. 5(B), and FIG. 5(C) are side sectional views of the solid electrolytic capacitor according to the present embodiment according to each process.
  • FIG. 6 is a diagram of an apparatus for forming a base electrode using the AD method.
  • FIG. 7 is an enlarged plan view showing an example of a specific shape of the base electrode.
  • FIG. 8 is a table showing the relationship between surface roughness Rmax and adhesion force.
  • FIG. 1 is an external perspective view of a solid electrolytic capacitor according to an embodiment of the present invention.
  • FIG. 2 is a side sectional view showing the configuration of a solid electrolytic capacitor according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along a plane perpendicular to the top, bottom, and end surfaces of the solid electrolytic capacitor body.
  • FIG. 2 in order to describe the configuration in an easy-to-understand manner, dimensions in each direction are appropriately emphasized, and in particular, dimensions in the height direction (z-axis direction in the figure) are emphasized.
  • the solid electrolytic capacitor 10 includes an element body 11, a base electrode 61, a base electrode 62, a resin electrode 71, a resin electrode 72, an external electrode 81, and an external electrode 82.
  • the element body 11 has a rectangular parallelepiped shape and has a top surface, a bottom surface, an end surface 111, an end surface 112, and two side surfaces.
  • the element body 11 includes a plurality of capacitor elements 20, a plurality of cathode electrodes 30, a plurality of connection layers 40, an insulating resin 50, and an insulator layer 500.
  • the cathode electrode 30 is a type of "capacitor electrode" of the present invention.
  • FIG. 3(A) is a plan view of the capacitor element
  • FIG. 3(B) is a side sectional view of the capacitor element
  • FIG. 3(B) is a cross-sectional view taken along a plane perpendicular to the flat membrane surface and the end surface of the capacitor element.
  • the capacitor element 20 includes an anode electrode 21 and a CP layer (solid electrolyte layer) 22.
  • the anode electrode 21 is a type of "capacitor electrode" of the present invention.
  • the anode electrode 21 is a flat membrane having a predetermined thickness, and has an end surface 211, an end surface 212, a flat membrane surface 213, and a flat membrane surface 214.
  • the length of the flat membrane surface 213 and the flat membrane surface 214 in the direction perpendicular to each other corresponds to the thickness of the anode electrode 21 .
  • the anode electrode 21 includes a large number of holes recessed from the flat membrane surfaces 213 and 214.
  • the portion of the anode electrode 21 having a predetermined thickness near the flat membrane surfaces 213 and 214 is a porous body in a porous state.
  • the ratio of the thicknesses of the porous body and core metal portion on one side of the anode electrode 21 to the thickness of the porous body on the other side is about 1:1:1.
  • the dielectric layer 210 covers the outer surface of the anode electrode 21. Since the detailed structure of the anode electrode 21 is not illustrated in FIG. 3, the dielectric layer 210 is schematically shown as covering the macroscopic surface (flat membrane surfaces 213 and 214) of the anode electrode 21. has been done. However, in reality, the dielectric layer 210 covers not only the macroscopic surface (flat membrane surfaces 213 and 214) of the anode electrode 21 but also the inner surfaces of the many holes in the anode electrode 21.
  • the CP layer 22 covers the surface of the dielectric layer 210.
  • An insulator layer 500 is formed in a region of the flat film surfaces 213 and 214 of the anode electrode 21 on the end surface 211 side.
  • the region in which the CP layer 22 is formed is regulated by the insulator layer 500. More specifically, the CP layer 22 has a shape that does not reach the end surface 211 of the anode electrode 21.
  • the anode electrode 21 and the CP layer 22 face each other with the dielectric layer 210 in between, and the capacitor element 20 functions as a capacitor having a predetermined capacitance.
  • the plurality of capacitor elements 20 and the plurality of cathode electrodes 30 have a flat film shape.
  • the plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are arranged such that their respective flat membrane surfaces are substantially parallel to the top and bottom surfaces of the element body 11.
  • the plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are arranged alternately in a direction perpendicular to the top surface and the bottom surface (height direction of the element body 11 (z-axis direction in the figure)). Note that in FIG. 2, the number of the plurality of capacitor elements 20 is three, and the number of the plurality of cathode electrodes 30 is four, but the respective numbers are not limited to these.
  • connection layer 40 is provided between adjacent capacitor elements 20 and cathode electrodes 30.
  • the connection layer 40 has conductivity. Thereby, the CP layer 22 of the capacitor element 20 and the cathode electrode 30 are electrically connected.
  • the end surfaces 211 (see FIG. 3(B)) of the plurality of capacitor elements 20 are at approximately the same position when viewed from the side.
  • the end surfaces 311 of the plurality of cathode electrodes 30 are at approximately the same position when viewed from the side.
  • the end surfaces 211 of the plurality of capacitor elements 20 protrude from the end surfaces 312 of the plurality of cathode electrodes 30.
  • the end surfaces 311 of the plurality of cathode electrodes 30 protrude more than the end surfaces 212 of the plurality of capacitor elements 20.
  • the capacitor laminate in which a plurality of capacitor elements 20 and a plurality of cathode electrodes 30 are stacked in this way is sealed with an insulating resin 50. More specifically, the insulating resin 50 covers the capacitor laminate so that the end faces 211 of the plurality of capacitor elements 20 and the end faces 311 of the plurality of cathode electrodes 30 are exposed and the other parts are enclosed.
  • the end faces 211 of the plurality of capacitor elements 20 are exposed to the outside of the element body 11 from the end face 111 of the element body 11.
  • the end surfaces 211 of the plurality of capacitor elements 20 are aligned with the end surfaces of the element bodies 11 in a line substantially perpendicular to the stacking direction when viewed in the stacking direction of the plurality of capacitor elements 20 (the z-axis direction in FIG. 2). Exposure from 111.
  • the end faces 311 of the plurality of cathode electrodes 30 are exposed to the outside of the element body 11 from the end face 112 of the element body 11. At this time, the end surfaces 311 of the plurality of cathode electrodes 30 are linear, substantially perpendicular to the stacking direction when viewed in the stacking direction of the plurality of cathode electrodes 30 (the z-axis direction in FIG. 2), and It is exposed from the end face 112.
  • the plurality of base electrodes 61 are formed on the end surfaces 211 of the anode electrodes 21 of the plurality of capacitor elements 20, respectively.
  • the base electrode 61 is formed with a predetermined thickness (height) from the end surface 211. That is, the base electrode 61 protrudes outward from the end surface 111 of the element body 11. Note that a specific method for forming the base electrode 61 and a specific shape will be described later.
  • the plurality of base electrodes 62 are formed on the end surfaces 311 of the plurality of cathode electrodes 30, respectively.
  • the base electrode 62 is formed with a predetermined thickness (height) from the end surface 311. That is, the base electrode 62 protrudes outward from the end surface 112 of the element body 11 .
  • the specific formation method and specific shape of the base electrode 62 are the same as those of the base electrode 61, and a description thereof will be omitted.
  • the resin electrode 71 contacts the end surface 111 of the element body 11 and the base electrode 61, and covers the end surface 111 and the base electrode 61.
  • the resin electrode 72 contacts the end surface 112 of the element body 11 and the base electrode 62 and covers the end surface 112 and the base electrode 62.
  • the external electrode 81 has a laminated structure of an electrode film 811 and an electrode film 812.
  • the electrode film 811 covers the outer surface of the resin electrode 71, and the electrode film 812 covers the outer surface of the electrode film 811.
  • the external electrode 82 has a laminated structure of an electrode film 821 and an electrode film 822.
  • the electrode film 821 covers the outer surface of the resin electrode 72, and the electrode film 822 covers the outer surface of the electrode film 821.
  • FIG. 4 is a flowchart showing an example of a schematic flow of the method for manufacturing a solid electrolytic capacitor according to this embodiment.
  • 5(A), FIG. 5(B), and FIG. 5(C) are side sectional views of the solid electrolytic capacitor according to the present embodiment according to each process.
  • FIG. 6 is a diagram of an apparatus for forming a base electrode using the AD method.
  • the element body 11 is formed (S11). Specifically, as shown in FIG. 5A, a plurality of capacitor elements 20 and a plurality of cathode electrodes 30 are sequentially stacked with a connection layer 40 in between to form a laminate. The element body 11 is formed by sealing the laminate with an insulating resin 50. At this time, the anode electrodes 21 and the cathode electrodes 30 of the plurality of capacitor elements 20 are made of, for example, aluminum.
  • a base electrode 61 is formed on the end face 211 of the anode electrode 21 of the plurality of capacitor elements 20 in the element body 11 using the AD method (S12).
  • a plurality of element bodies 11 are fixed on a stage 92 and placed in a chamber 91. At least the tip (the ejection end) of the aerosol generator 93 is inserted into the chamber 91 .
  • the aerosol generator 93 generates an aerosol by introducing copper powder (Cu powder) 600 into the carrier gas, and sprays the aerosol onto the end surface 111 of the element body 11 .
  • the copper powder 600 can be
  • a base electrode 61 is formed on the end surface 211 of the plurality of anode electrodes 21 by stacking them at a predetermined height (predetermined thickness) (see FIG. 5(B)).
  • the particle size of the copper powder 600 is, for example, about 3 ⁇ m, but may be 2 ⁇ m or less.
  • the base electrode 62 is formed on the end surface 311 of the plurality of cathode electrodes 30 in the element body 11 using the AD method (S13). Note that the method for forming the base electrode 62 is the same as the method for forming the base electrode 61, and a description thereof will be omitted (see FIG. 5(B)).
  • a resin electrode 71 is formed so as to cover the end face 111 of the element body 11 and the base electrode 61, and a resin electrode 72 is formed so as to cover the end face 112 of the element body 11 and the base electrode 62 (S15).
  • the resin electrode 71 is made of a paste-like material in which conductive particles such as silver (Ag) are kneaded into resin.
  • the resin electrode 71 is formed by applying this paste-like material so as to cover the end surface 111 of the element body 11 and the base electrode 61 and then solidifying it (see FIG. 5(C)). Since the resin electrode 72 is also formed by the same method as the resin electrode 71, the description thereof will be omitted (see FIG. 5(C)).
  • an external electrode 81 is formed on the surface of the resin electrode 71, and an external electrode 82 is formed on the surface of the resin electrode 72 (S15).
  • the external electrode 81 consists of an electrode film 811 and an electrode film 812, and is formed by plating.
  • the electrode film 811 is a nickel (Ni) plating layer
  • the electrode film 812 is a tin (Sn) plating layer.
  • the external electrode 82 is also formed by plating like the external electrode 81.
  • the electrode film 821 is a nickel (Ni) plating layer
  • the electrode film 822 is a tin (Sn) plating layer.
  • the thickness of the terminal electrode consisting of the resin electrode 71 and the external electrode 81 and the thickness of the terminal electrode consisting of the resin electrode 72 and the external electrode 82 are preferably 8 ⁇ m or more and less than 20 ⁇ m.
  • FIG. 7 is an enlarged plan view showing an example of a specific shape of the base electrode.
  • FIG. 7 is a diagram of the solid electrolytic capacitor 10 and the element body 11 as viewed in the thickness direction (z-axis direction).
  • the base electrode 61 When the base electrode 61 is formed using the AD method, the base electrode 61 is formed in the shape of a mountain protruding from the end surface 211 of the anode electrode 21 (see FIG. 2). At this time, as shown in FIG. 7, the base electrode 61 has a ridgeline 610 extending along the longitudinal direction of the end surface 211 (the y-axis direction in the figure) when viewed in a direction perpendicular to the flat membrane surface 213 of the anode electrode 21.
  • the ridge line 610 is a line connecting the furthest point of the base electrode 61 in the direction orthogonal to the end surface 211 at each position in the longitudinal direction of the end surface 211 (the direction perpendicular to the thickness direction of the anode electrode 21 on the end surface 211).
  • the height of this ridgeline 610 (the length of protrusion from the end surface 211 (distance in the x-axis direction)) varies in the longitudinal direction.
  • the surface roughness Rmax is defined as a variation index of the height of the ridgeline 610.
  • the surface roughness Rmax in this case is the difference between the length (Hmax) from the end surface 211 at the highest point of the ridge line 610 and the length (Hmin) from the end surface 211 at the lowest point (Hmax - Hmin). ) is defined.
  • the surface roughness Rmax is 1.5 ⁇ m or more and 10.0 ⁇ m or less.
  • FIG. 8 is a table showing the relationship between surface roughness Rmax and adhesion force.
  • the adhesion force is the adhesion force between the base electrode 61 and the resin electrode 71, and in turn corresponds to the adhesion force between the anode electrode 21 and the terminal electrode (the electrode consisting of the resin electrode 71 and the external electrode 81).
  • F indicates that the adhesion is within a reasonable range
  • G indicates that the adhesion is good
  • E indicates that the adhesion is excellent. That is, the adhesion force is in the relationship F ⁇ G ⁇ E.
  • the thickness of the base electrode 61 is larger than the respective surface roughness Rmax.
  • the maximum thickness (length Hmax) of the base electrode 61 is 0.5 ⁇ m or more.
  • the maximum thickness (length Hmax) of the base electrode 61 is 1.5 ⁇ m or more, and when the surface roughness Rmax is 10.0 ⁇ m, the maximum thickness of the base electrode 61 is (Length Hmax) is 10.0 ⁇ m or more.
  • the base electrode 61 has a shape that is neither too thin nor too thick, and the base electrode This is because a surface area of 61 mm can be obtained. Thereby, the adhesion between the base electrode 61 and the resin electrode 71 is improved, and a decrease in ESR can be suppressed.
  • the thickness of the base electrode 61 is preferably 0.1 ⁇ m or more and less than 30 ⁇ m within a thickness range that can achieve the above-mentioned surface roughness Rmax.
  • the thickness of the base electrode 61 here is the average value of the height of the ridge line (the average value in the y-axis direction in the figure). Thereby, the base electrode 61 has a more appropriate thickness, the adhesion between the base electrode 61 and the resin electrode 71 can be stably increased, and a decrease in ESR can be suppressed.
  • a solid electrolytic capacitor is explained as an example, but the present embodiment can be applied to any electronic component including a laminate including a film-like internal electrode and an external electrode formed on an end surface of the laminate. By applying the configuration, similar effects can be achieved.
  • the configuration of this embodiment is particularly effective in electronic components that use resin electrodes between internal electrodes and external electrodes.
  • the surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 ⁇ m or more and 10.0 ⁇ m or less, Method of manufacturing capacitors.
  • the capacitor electrode includes an anode electrode made of aluminum, In the anode electrode, A porous material is formed at a predetermined depth from the flat membrane surface forming the flat membrane shape, the flat membrane surface and the surface of the porous body are oxidized to form a dielectric layer; A method for manufacturing a capacitor according to ⁇ 1>.
  • ⁇ 3> The method for manufacturing a capacitor according to ⁇ 1> or ⁇ 2>, wherein the base electrode has an average thickness of 0.1 ⁇ m or more and less than 30 ⁇ m.
  • ⁇ 4> The method for manufacturing a capacitor according to any one of ⁇ 1> to ⁇ 3>, wherein the external electrode has a thickness of 8 ⁇ m or more and less than 20 ⁇ m.
  • ⁇ 5> In the external electrode forming step, forming the external electrode on the resin electrode by plating; The method for manufacturing a capacitor according to any one of ⁇ 1> to ⁇ 4>.
  • the capacitor electrode includes an anode electrode formed of aluminum, In the anode electrode, A porous body is located at a predetermined depth from the flat membrane surface forming the flat membrane shape, the flat membrane surface and the surface of the porous body are oxidized dielectric layers; The capacitor described in ⁇ 6>.
  • ⁇ 8> The capacitor according to ⁇ 6> or ⁇ 7>, wherein the base electrode has an average thickness of 0.1 ⁇ m or more and less than 30 ⁇ m.
  • ⁇ 9> The capacitor according to any one of ⁇ 6> to ⁇ 8>, wherein the terminal electrode made of the resin electrode and the external electrode has a thickness of 8 ⁇ m or more and less than 20 ⁇ m.
  • Solid electrolytic capacitor 11 Element body 20: Capacitor element 21: Anode electrode 22: CP layer 30: Cathode electrode 40: Connection layer 50: Insulating resin 61, 62: Base electrode 71, 72: Resin electrode 81, 82: External electrode 91: Chamber 92: Stage 93: Aerosol generator 111, 112: End surface 210: Dielectric layer 211, 212, 311, 312: End surface 213, 214: Flat film surface 500: Insulator layer 600: Copper powder 610: Ridge lines 811, 812, 821, 822: electrode film

Abstract

In the present invention, a solid electrolyte capacitor (10) comprises: an element body (11) having an end surface (111) from which a plurality of positive electrodes (21) are linearly exposed; base electrodes (61) disposed on exposed surfaces of end surfaces (211) of the plurality of positive electrodes (21); a resin electrode (71) covering the end surface (111) of the element body (11) and the base electrodes (61); and an external electrode (81) covering the resin electrode (71). The surface roughness of the base electrodes (61), in the direction in which the base electrodes (61) linearly extend, is 1.5-10.0 μｍ.

Description

コンデンサの製造方法、および、コンデンサCapacitor manufacturing method and capacitor
　積層体内の内部電極を積層体の外面の外部電極に接続する技術に関する。 This invention relates to a technique for connecting internal electrodes within a laminate to external electrodes on the outer surface of the laminate.
　特許文献１には、チップ型コンデンサが記載されている。特許文献１のチップ型コンデンサでは、内部電極がチップ基板の側面に露出している。露出面には、めっき処理によって金属膜が形成され、さらに、導電性樹脂ペーストが塗布されている。これにより、チップ基板の側面に側面電極（外部電極）が形成され、内部電極と側面電極（外部電極）とが接続される。 Patent Document 1 describes a chip type capacitor. In the chip-type capacitor disclosed in Patent Document 1, the internal electrodes are exposed on the side surface of the chip substrate. A metal film is formed on the exposed surface by plating, and a conductive resin paste is further applied. As a result, side electrodes (external electrodes) are formed on the side surfaces of the chip substrate, and the internal electrodes and the side electrodes (external electrodes) are connected.
　特許文献２には、固体電解コンデンサが記載されている。特許文献２に記載の固体電解コンデンサでは、陽極体の一部が封止体の外部に露出している。露出部は、めっき層で被覆されており、めっき層を通じて陽極用導電性弾性体へ電気的に接続される。これにより、封止体の側面に外部電極が形成され、陽極体（内部電極）と外部電極とは接続される。 Patent Document 2 describes a solid electrolytic capacitor. In the solid electrolytic capacitor described in Patent Document 2, a part of the anode body is exposed to the outside of the sealing body. The exposed portion is covered with a plating layer, and is electrically connected to the conductive elastic body for the anode through the plating layer. As a result, an external electrode is formed on the side surface of the sealing body, and the anode body (internal electrode) and the external electrode are connected.
特開２００７－０７３８８３号公報Japanese Patent Application Publication No. 2007-073883 特許第３２７６１１３号公報Patent No. 3276113
　しかしながら、特許文献１、２に記載の構成では、内部電極と外部電極との密着力（固着強度）が低くなる場合があった。このような密着力の低さは、例えば、固体電解コンデンサのＥＳＲの増加を招いてしまう。 However, in the configurations described in Patent Documents 1 and 2, the adhesion strength (adhesion strength) between the internal electrode and the external electrode may be low. Such a low adhesion force, for example, causes an increase in ESR of the solid electrolytic capacitor.
　したがって、本発明の目的は、内部電極と外部電極との間で高い密着力を得ることにある。 Therefore, an object of the present invention is to obtain high adhesion between the internal electrode and the external electrode.
　この発明のコンデンサの製造方法は、素体形成工程、下地電極形成工程、外部電極形成工程を有する。素体形成工程は、複数の平膜状のコンデンサ用電極を積層して絶縁性樹脂によって封止することで素体を形成し、素体の端面に複数のコンデンサ用電極を線状に露出させる。下地金属形成工程は、複数のコンデンサ用電極の端面の露出面にＡＤ法によって下地電極を形成する。樹脂電極形成工程は、端面と下地電極とを覆う樹脂電極を形成する。外部電極形成工程は、樹脂電極を覆う外部電極を形成する。下地電極形成工程では、下地電極が線状に延びる方向の下地電極の表面粗さは、１．５μｍ以上１０．０μｍ以下である。 The capacitor manufacturing method of the present invention includes an element body forming step, a base electrode forming step, and an external electrode forming step. In the element forming process, a plurality of flat film-shaped capacitor electrodes are stacked and sealed with an insulating resin to form an element, and a plurality of capacitor electrodes are exposed in a linear manner on the end face of the element. . In the base metal forming step, a base electrode is formed on the exposed end faces of the plurality of capacitor electrodes by an AD method. In the resin electrode forming step, a resin electrode is formed to cover the end face and the base electrode. In the external electrode forming step, an external electrode covering the resin electrode is formed. In the base electrode forming step, the surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 μm or more and 10.0 μm or less.
　この方法では、下地電極が端面に直交する方向に適切な凹凸を有する。これにより、下地金属と樹脂電極との密着力が向上し、コンデンサ用電極と樹脂電極および外部電極との密着力は向上する。 In this method, the base electrode has appropriate unevenness in a direction perpendicular to the end face. This improves the adhesion between the base metal and the resin electrode, and the adhesion between the capacitor electrode and the resin and external electrodes.
　この発明によれば、内部電極と外部電極との間で高い密着力を得られる。 According to this invention, high adhesion can be obtained between the internal electrode and the external electrode.
図１は、本発明の実施形態に係る固体電解コンデンサの外観斜視図である。FIG. 1 is an external perspective view of a solid electrolytic capacitor according to an embodiment of the present invention. 図２は、本発明の実施形態に係る固体電解コンデンサの構成を示す側面断面図である。FIG. 2 is a side sectional view showing the configuration of a solid electrolytic capacitor according to an embodiment of the present invention. 図３（Ａ）は、コンデンサ素子の平面図であり、図３（Ｂ）はコンデンサ素子の側面断面図である。FIG. 3(A) is a plan view of the capacitor element, and FIG. 3(B) is a side sectional view of the capacitor element. 図４は、本実施形態に係る固体電解コンデンサの製造方法の概略フローの一例を示すフローチャートである。FIG. 4 is a flowchart showing an example of a schematic flow of the method for manufacturing a solid electrolytic capacitor according to this embodiment. 図５（Ａ）、図５（Ｂ）、図５（Ｃ）は、本実施形態に係る固体電解コンデンサの工程別の側面断面図である。5(A), FIG. 5(B), and FIG. 5(C) are side sectional views of the solid electrolytic capacitor according to the present embodiment according to each process. 図６は、ＡＤ法による下地電極の形成装置の図である。FIG. 6 is a diagram of an apparatus for forming a base electrode using the AD method. 図７は、下地電極の具体的な形状の一例を示す拡大平面図である。FIG. 7 is an enlarged plan view showing an example of a specific shape of the base electrode. 図８は、表面粗さＲｍａｘと密着力との関係を示す表である。FIG. 8 is a table showing the relationship between surface roughness Rmax and adhesion force.
　本発明の実施形態に係る固体電解コンデンサの製造方法、および、この製造方法によって製造される固体電解コンデンサについて、図を参照して説明する。 A method for manufacturing a solid electrolytic capacitor according to an embodiment of the present invention and a solid electrolytic capacitor manufactured by this manufacturing method will be described with reference to the drawings.
　（固体電解コンデンサ１０の構成の説明）
　図１は、本発明の実施形態に係る固体電解コンデンサの外観斜視図である。図２は、本発明の実施形態に係る固体電解コンデンサの構成を示す側面断面図である。図２は、固体電解コンデンサの素体の天面、底面および端面に直交する面による断面図である。なお、図２では、構成を分かり易く記載するため、各方向の寸法を適宜強調しており、特に、高さ方向（図のｚ軸方向）の寸法を強調している。 (Description of the configuration of the solid electrolytic capacitor 10)
FIG. 1 is an external perspective view of a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 2 is a side sectional view showing the configuration of a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along a plane perpendicular to the top, bottom, and end surfaces of the solid electrolytic capacitor body. In addition, in FIG. 2, in order to describe the configuration in an easy-to-understand manner, dimensions in each direction are appropriately emphasized, and in particular, dimensions in the height direction (z-axis direction in the figure) are emphasized.
　図１、図２に示すように、固体電解コンデンサ１０は、素体１１、下地電極６１、下地電極６２、樹脂電極７１、樹脂電極７２、外部電極８１、および、外部電極８２を備える。 As shown in FIGS. 1 and 2, the solid electrolytic capacitor 10 includes an element body 11, a base electrode 61, a base electrode 62, a resin electrode 71, a resin electrode 72, an external electrode 81, and an external electrode 82.
　素体１１は、直方体形状であり、天面、底面、端面１１１、端面１１２、二個の側面を有する。素体１１は、複数のコンデンサ素子２０、複数の陰極電極３０、複数の接続層４０、絶縁性樹脂５０、および、絶縁体層５００を備える。陰極電極３０が、本発明の「コンデンサ用電極」の一種である。 The element body 11 has a rectangular parallelepiped shape and has a top surface, a bottom surface, an end surface 111, an end surface 112, and two side surfaces. The element body 11 includes a plurality of capacitor elements 20, a plurality of cathode electrodes 30, a plurality of connection layers 40, an insulating resin 50, and an insulator layer 500. The cathode electrode 30 is a type of "capacitor electrode" of the present invention.
　図３（Ａ）は、コンデンサ素子の平面図であり、図３（Ｂ）はコンデンサ素子の側面断面図である。図３（Ｂ）は、コンデンサ素子の平膜面および端面に直交する面による断面図である。 FIG. 3(A) is a plan view of the capacitor element, and FIG. 3(B) is a side sectional view of the capacitor element. FIG. 3(B) is a cross-sectional view taken along a plane perpendicular to the flat membrane surface and the end surface of the capacitor element.
　図３（Ａ）、図３（Ｂ）に示すように、コンデンサ素子２０は、陽極電極２１、ＣＰ層（固体電解質層）２２を備える。陽極電極２１は、本発明の「コンデンサ用電極」の一種である。 As shown in FIGS. 3(A) and 3(B), the capacitor element 20 includes an anode electrode 21 and a CP layer (solid electrolyte layer) 22. The anode electrode 21 is a type of "capacitor electrode" of the present invention.
　陽極電極２１は、所定の厚みを有する平膜であり、端面２１１、端面２１２、平膜面２１３、平膜面２１４を有する。平膜面２１３と平膜面２１４との直交する方向の長さが、陽極電極２１の厚みに対応する。図３では詳細な構造の図示は割愛されているが、陽極電極２１は、平膜面２１３、２１４から凹む多数の孔を備える。言い換えれば、陽極電極２１における平膜面２１３、２１４の近傍の所定厚みの部分は、ポーラス状態の多孔質体である。陽極電極２１の一方側の多孔質体と芯金部分と他方側の多孔質体の厚みの比は、１：１：１程度である。 The anode electrode 21 is a flat membrane having a predetermined thickness, and has an end surface 211, an end surface 212, a flat membrane surface 213, and a flat membrane surface 214. The length of the flat membrane surface 213 and the flat membrane surface 214 in the direction perpendicular to each other corresponds to the thickness of the anode electrode 21 . Although illustration of the detailed structure is omitted in FIG. 3, the anode electrode 21 includes a large number of holes recessed from the flat membrane surfaces 213 and 214. In other words, the portion of the anode electrode 21 having a predetermined thickness near the flat membrane surfaces 213 and 214 is a porous body in a porous state. The ratio of the thicknesses of the porous body and core metal portion on one side of the anode electrode 21 to the thickness of the porous body on the other side is about 1:1:1.
　誘電体層２１０は、陽極電極２１の外面を覆う。図３では陽極電極２１の詳細な構造の図示が割愛されているため、誘電体層２１０は模式的に陽極電極２１の巨視的な表面（平膜面２１３、２１４）を覆っているように図示されている。しかしながら、実際には、誘電体層２１０は、陽極電極２１の巨視的な表面（平膜面２１３、２１４）のみならず、陽極電極２１の多数の孔の内面も覆っている。 The dielectric layer 210 covers the outer surface of the anode electrode 21. Since the detailed structure of the anode electrode 21 is not illustrated in FIG. 3, the dielectric layer 210 is schematically shown as covering the macroscopic surface (flat membrane surfaces 213 and 214) of the anode electrode 21. has been done. However, in reality, the dielectric layer 210 covers not only the macroscopic surface (flat membrane surfaces 213 and 214) of the anode electrode 21 but also the inner surfaces of the many holes in the anode electrode 21.
　ＣＰ層２２は、誘電体層２１０の表面を覆う。陽極電極２１の平膜面２１３、２１４における端面２１１側の領域には、絶縁体層５００が形成されている。絶縁体層５００によって、ＣＰ層２２の形成領域が規制される。より具体的には、ＣＰ層２２は、陽極電極２１における端面２１１に達しない形状である。 The CP layer 22 covers the surface of the dielectric layer 210. An insulator layer 500 is formed in a region of the flat film surfaces 213 and 214 of the anode electrode 21 on the end surface 211 side. The region in which the CP layer 22 is formed is regulated by the insulator layer 500. More specifically, the CP layer 22 has a shape that does not reach the end surface 211 of the anode electrode 21.
　このような構成によって、陽極電極２１とＣＰ層２２とは、誘電体層２１０を挟んで対向し、コンデンサ素子２０は、所定の静電容量を有するコンデンサとして機能する。 With such a configuration, the anode electrode 21 and the CP layer 22 face each other with the dielectric layer 210 in between, and the capacitor element 20 functions as a capacitor having a predetermined capacitance.
　複数のコンデンサ素子２０と複数の陰極電極３０は、平膜状である。複数のコンデンサ素子２０と複数の陰極電極３０とは、それぞれの平膜面が素体１１の天面および底面に略平行になるように配置される。複数のコンデンサ素子２０と複数の陰極電極３０とは、天面および底面に直交する方向（素体１１の高さ方向（図のｚ軸方向））に、交互に配置される。なお、図２では、複数のコンデンサ素子２０の個数は３であり、複数の陰極電極３０の個数は４であるが、それぞれの個数はこれに限るものではない。 The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 have a flat film shape. The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are arranged such that their respective flat membrane surfaces are substantially parallel to the top and bottom surfaces of the element body 11. The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are arranged alternately in a direction perpendicular to the top surface and the bottom surface (height direction of the element body 11 (z-axis direction in the figure)). Note that in FIG. 2, the number of the plurality of capacitor elements 20 is three, and the number of the plurality of cathode electrodes 30 is four, but the respective numbers are not limited to these.
　隣り合うコンデンサ素子２０と陰極電極３０との間には接続層４０が配設される。接続層４０は導電性を有する。これにより、コンデンサ素子２０のＣＰ層２２と陰極電極３０とは電気的に接続される。 A connection layer 40 is provided between adjacent capacitor elements 20 and cathode electrodes 30. The connection layer 40 has conductivity. Thereby, the CP layer 22 of the capacitor element 20 and the cathode electrode 30 are electrically connected.
　このような積層状態において、複数のコンデンサ素子２０の端面２１１（図３（Ｂ）参照）は側面視して略同じ位置となる。複数の陰極電極３０の端面３１１は側面視して略同じ位置となる。そして、複数のコンデンサ素子２０の端面２１１は複数の陰極電極３０の端面３１２よりも突出している。また、複数の陰極電極３０の端面３１１は複数のコンデンサ素子２０の端面２１２よりも突出している。 In such a stacked state, the end surfaces 211 (see FIG. 3(B)) of the plurality of capacitor elements 20 are at approximately the same position when viewed from the side. The end surfaces 311 of the plurality of cathode electrodes 30 are at approximately the same position when viewed from the side. The end surfaces 211 of the plurality of capacitor elements 20 protrude from the end surfaces 312 of the plurality of cathode electrodes 30. Furthermore, the end surfaces 311 of the plurality of cathode electrodes 30 protrude more than the end surfaces 212 of the plurality of capacitor elements 20.
　このように複数のコンデンサ素子２０と複数の陰極電極３０とが積層されたコンデンサ積層体は、絶縁性樹脂５０によって封止される。より具体的には、絶縁性樹脂５０は、複数のコンデンサ素子２０の端面２１１および複数の陰極電極３０の端面３１１が露出し、他の部分を内包するように、コンデンサ積層体を覆う。 The capacitor laminate in which a plurality of capacitor elements 20 and a plurality of cathode electrodes 30 are stacked in this way is sealed with an insulating resin 50. More specifically, the insulating resin 50 covers the capacitor laminate so that the end faces 211 of the plurality of capacitor elements 20 and the end faces 311 of the plurality of cathode electrodes 30 are exposed and the other parts are enclosed.
　これにより、複数のコンデンサ素子２０の端面２１１は、素体１１の端面１１１から素体１１の外部に露出する。この際、複数のコンデンサ素子２０の端面２１１は、複数のコンデンサ素子２０の積層方向（図２のｚ軸方向）に視て、該積層方向に対して略直交する線状に素体１１の端面１１１から露出する。 As a result, the end faces 211 of the plurality of capacitor elements 20 are exposed to the outside of the element body 11 from the end face 111 of the element body 11. At this time, the end surfaces 211 of the plurality of capacitor elements 20 are aligned with the end surfaces of the element bodies 11 in a line substantially perpendicular to the stacking direction when viewed in the stacking direction of the plurality of capacitor elements 20 (the z-axis direction in FIG. 2). Exposure from 111.
　また、複数の陰極電極３０の端面３１１は、素体１１の端面１１２から素体１１の外部に露出する。この際、複数の陰極電極３０の端面３１１は、複数の陰極電極３０の積層方向（図２のｚ軸方向）に視て、該積層方向に対して略直交する線状で、素体１１の端面１１２から露出する。 Further, the end faces 311 of the plurality of cathode electrodes 30 are exposed to the outside of the element body 11 from the end face 112 of the element body 11. At this time, the end surfaces 311 of the plurality of cathode electrodes 30 are linear, substantially perpendicular to the stacking direction when viewed in the stacking direction of the plurality of cathode electrodes 30 (the z-axis direction in FIG. 2), and It is exposed from the end face 112.
　複数の下地電極６１は、複数のコンデンサ素子２０の陽極電極２１の端面２１１にそれぞれ形成される。下地電極６１は、端面２１１から所定厚み（高さ）で形成される。すなわち、下地電極６１は、素体１１の端面１１１から外方に突出する。なお、下地電極６１の具体的な形成方法および具体的な形状は、後述する。 The plurality of base electrodes 61 are formed on the end surfaces 211 of the anode electrodes 21 of the plurality of capacitor elements 20, respectively. The base electrode 61 is formed with a predetermined thickness (height) from the end surface 211. That is, the base electrode 61 protrudes outward from the end surface 111 of the element body 11. Note that a specific method for forming the base electrode 61 and a specific shape will be described later.
　複数の下地電極６２は、複数の陰極電極３０の端面３１１にそれぞれ形成される。下地電極６２は、端面３１１から所定厚み（高さ）で形成される。すなわち、下地電極６２は、素体１１の端面１１２から外方に突出する。なお、下地電極６２の具体的な形成方法および具体的な形状は、下地電極６１と同様であり、説明は省略する。 The plurality of base electrodes 62 are formed on the end surfaces 311 of the plurality of cathode electrodes 30, respectively. The base electrode 62 is formed with a predetermined thickness (height) from the end surface 311. That is, the base electrode 62 protrudes outward from the end surface 112 of the element body 11 . Note that the specific formation method and specific shape of the base electrode 62 are the same as those of the base electrode 61, and a description thereof will be omitted.
　樹脂電極７１は、素体１１の端面１１１および下地電極６１に当接し、端面１１１および下地電極６１を覆う。樹脂電極７２は、素体１１の端面１１２および下地電極６２に当接し、端面１１２および下地電極６２を覆う。 The resin electrode 71 contacts the end surface 111 of the element body 11 and the base electrode 61, and covers the end surface 111 and the base electrode 61. The resin electrode 72 contacts the end surface 112 of the element body 11 and the base electrode 62 and covers the end surface 112 and the base electrode 62.
　外部電極８１は、電極膜８１１と電極膜８１２との積層構造である。電極膜８１１は、樹脂電極７１の外面を覆い、電極膜８１２は、電極膜８１１の外面を覆う。外部電極８２は、電極膜８２１と電極膜８２２との積層構造である。電極膜８２１は、樹脂電極７２の外面を覆い、電極膜８２２は、電極膜８２１の外面を覆う。 The external electrode 81 has a laminated structure of an electrode film 811 and an electrode film 812. The electrode film 811 covers the outer surface of the resin electrode 71, and the electrode film 812 covers the outer surface of the electrode film 811. The external electrode 82 has a laminated structure of an electrode film 821 and an electrode film 822. The electrode film 821 covers the outer surface of the resin electrode 72, and the electrode film 822 covers the outer surface of the electrode film 821.
　以上の構成によって、固体電解コンデンサ１０は実現される。 With the above configuration, the solid electrolytic capacitor 10 is realized.
　（固体電解コンデンサ１０の製造方法）
　上述の構成からなる固体電解コンデンサ１０は、例えば、次のように製造される。図４は、本実施形態に係る固体電解コンデンサの製造方法の概略フローの一例を示すフローチャートである。図５（Ａ）、図５（Ｂ）、図５（Ｃ）は、本実施形態に係る固体電解コンデンサの工程別の側面断面図である。図６は、ＡＤ法による下地電極の形成装置の図である。 (Method for manufacturing solid electrolytic capacitor 10)
The solid electrolytic capacitor 10 having the above-described configuration is manufactured, for example, as follows. FIG. 4 is a flowchart showing an example of a schematic flow of the method for manufacturing a solid electrolytic capacitor according to this embodiment. 5(A), FIG. 5(B), and FIG. 5(C) are side sectional views of the solid electrolytic capacitor according to the present embodiment according to each process. FIG. 6 is a diagram of an apparatus for forming a base electrode using the AD method.
　素体１１を形成する（Ｓ１１）。具体的には、図５（Ａ）に示すように、複数のコンデンサ素子２０と複数の陰極電極３０とを接続層４０を挟んで順次積層して、積層体を形成する。積層体を絶縁性樹脂５０で封止することで、素体１１を形成する。この際、複数のコンデンサ素子２０の陽極電極２１および複数の陰極電極３０は、例えばアルミニウムからなる。 The element body 11 is formed (S11). Specifically, as shown in FIG. 5A, a plurality of capacitor elements 20 and a plurality of cathode electrodes 30 are sequentially stacked with a connection layer 40 in between to form a laminate. The element body 11 is formed by sealing the laminate with an insulating resin 50. At this time, the anode electrodes 21 and the cathode electrodes 30 of the plurality of capacitor elements 20 are made of, for example, aluminum.
　次に、素体１１における複数のコンデンサ素子２０の陽極電極２１の端面２１１にＡＤ法を用いて下地電極６１を形成する（Ｓ１２）。 Next, a base electrode 61 is formed on the end face 211 of the anode electrode 21 of the plurality of capacitor elements 20 in the element body 11 using the AD method (S12).
　より具体的には、図６に示すように、複数の素体１１をステージ９２上に固定し、チャンバ９１内に配置する。チャンバ９１には、エアロゾル発生器９３の少なくとも先端（噴出端）が挿入されている。エアロゾル発生器９３は、搬送ガスに銅粉（Ｃｕ粉）６００を導入することで、エアロゾルを発生し、素体１１の端面１１１に吹き付ける。この際、エアロゾルの仕様（例えば、搬送ガスに含む銅粉６００の体積比等）、吹きつけ条件（例えば、吹きつけ回数、吹きつけ強度等）を適宜設定することで、銅粉６００は、主として複数の陽極電極２１の端面２１１に所定高さ（所定厚み）で積み重なり、下地電極６１が成膜される（図５（Ｂ）参照）。なお、この際、銅粉６００の粒径は、例えば、３μｍ程度であるが、２μｍ以下であってもよい。 More specifically, as shown in FIG. 6, a plurality of element bodies 11 are fixed on a stage 92 and placed in a chamber 91. At least the tip (the ejection end) of the aerosol generator 93 is inserted into the chamber 91 . The aerosol generator 93 generates an aerosol by introducing copper powder (Cu powder) 600 into the carrier gas, and sprays the aerosol onto the end surface 111 of the element body 11 . At this time, the copper powder 600 can be A base electrode 61 is formed on the end surface 211 of the plurality of anode electrodes 21 by stacking them at a predetermined height (predetermined thickness) (see FIG. 5(B)). In this case, the particle size of the copper powder 600 is, for example, about 3 μm, but may be 2 μm or less.
　次に、素体１１における複数の陰極電極３０の端面３１１にＡＤ法を用いて下地電極６２を形成する（Ｓ１３）。なお、下地電極６２の形成方法は、下地電極６１の形成方法と同様であり、説明は省略する（図５（Ｂ）参照）。 Next, the base electrode 62 is formed on the end surface 311 of the plurality of cathode electrodes 30 in the element body 11 using the AD method (S13). Note that the method for forming the base electrode 62 is the same as the method for forming the base electrode 61, and a description thereof will be omitted (see FIG. 5(B)).
　次に、素体１１の端面１１１および下地電極６１を覆うように、樹脂電極７１を形成し、素体１１の端面１１２および下地電極６２を覆うように、樹脂電極７２を形成する（Ｓ１５）。具体的には、樹脂電極７１は、銀（Ａｇ）等の導電性粒子を樹脂に混練したペースト状の材料からなる。このペースト状の材料を素体１１の端面１１１および下地電極６１を覆うように塗布した後に固化することで、樹脂電極７１は、形成される（図５（Ｃ）参照）。樹脂電極７２も樹脂電極７１と同様の方法で形成されるため、説明は省略する（図５（Ｃ）参照）。 Next, a resin electrode 71 is formed so as to cover the end face 111 of the element body 11 and the base electrode 61, and a resin electrode 72 is formed so as to cover the end face 112 of the element body 11 and the base electrode 62 (S15). Specifically, the resin electrode 71 is made of a paste-like material in which conductive particles such as silver (Ag) are kneaded into resin. The resin electrode 71 is formed by applying this paste-like material so as to cover the end surface 111 of the element body 11 and the base electrode 61 and then solidifying it (see FIG. 5(C)). Since the resin electrode 72 is also formed by the same method as the resin electrode 71, the description thereof will be omitted (see FIG. 5(C)).
　次に、樹脂電極７１の表面に外部電極８１を形成し、樹脂電極７２の表面に外部電極８２を形成する（Ｓ１５）。具体的には、外部電極８１は、電極膜８１１と電極膜８１２とからなり、めっきによって形成される。例えば、電極膜８１１は、ニッケル（Ｎｉ）めっき層であり、電極膜８１２は、錫（Ｓｎ）めっき層である。外部電極８２も外部電極８１と同様にめっきによって形成され、例えば、電極膜８２１は、ニッケル（Ｎｉ）めっき層であり、電極膜８２２は、錫（Ｓｎ）めっき層である。なお、樹脂電極７１と外部電極８１からなる端子電極の厚み、および、樹脂電極７２と外部電極８２からなる端子電極の厚みは、８μｍ以上２０μｍ未満であることが好ましい。 Next, an external electrode 81 is formed on the surface of the resin electrode 71, and an external electrode 82 is formed on the surface of the resin electrode 72 (S15). Specifically, the external electrode 81 consists of an electrode film 811 and an electrode film 812, and is formed by plating. For example, the electrode film 811 is a nickel (Ni) plating layer, and the electrode film 812 is a tin (Sn) plating layer. The external electrode 82 is also formed by plating like the external electrode 81. For example, the electrode film 821 is a nickel (Ni) plating layer, and the electrode film 822 is a tin (Sn) plating layer. Note that the thickness of the terminal electrode consisting of the resin electrode 71 and the external electrode 81 and the thickness of the terminal electrode consisting of the resin electrode 72 and the external electrode 82 are preferably 8 μm or more and less than 20 μm.
　（下地電極６１および下地電極６２の具体的な形状）
　下地電極６１と下地電極６２とは、同様の形状であり、ここでは、代表して下地電極６１を例に説明する。図７は、下地電極の具体的な形状の一例を示す拡大平面図である。図７は、固体電解コンデンサ１０および素体１１の厚み方向（ｚ軸方向）に視た図である。 (Specific shapes of base electrode 61 and base electrode 62)
The base electrode 61 and the base electrode 62 have similar shapes, and here, the base electrode 61 will be described as a representative example. FIG. 7 is an enlarged plan view showing an example of a specific shape of the base electrode. FIG. 7 is a diagram of the solid electrolytic capacitor 10 and the element body 11 as viewed in the thickness direction (z-axis direction).
　ＡＤ法を用いて下地電極６１を形成すると、陽極電極２１の端面２１１から突起する山型に下地電極６１は形成される（図２参照）。この際、下地電極６１は、図７に示すように、陽極電極２１の平膜面２１３に直交する方向に視て、端面２１１の長手方向（図のｙ軸方向）に沿って延びる稜線６１０を形成する。稜線６１０は、端面２１１の長手方向（端面２１１における陽極電極２１の厚み方向に直交する方向）の各位置において下地電極６１における端面２１１から直交する方向に最も遠いところを結んだ線である。そして、この稜線６１０の高さ（端面２１１から突出する長さ（ｘ軸方向の距離））は、長手方向においてバラツキを有する。 When the base electrode 61 is formed using the AD method, the base electrode 61 is formed in the shape of a mountain protruding from the end surface 211 of the anode electrode 21 (see FIG. 2). At this time, as shown in FIG. 7, the base electrode 61 has a ridgeline 610 extending along the longitudinal direction of the end surface 211 (the y-axis direction in the figure) when viewed in a direction perpendicular to the flat membrane surface 213 of the anode electrode 21. Form. The ridge line 610 is a line connecting the furthest point of the base electrode 61 in the direction orthogonal to the end surface 211 at each position in the longitudinal direction of the end surface 211 (the direction perpendicular to the thickness direction of the anode electrode 21 on the end surface 211). The height of this ridgeline 610 (the length of protrusion from the end surface 211 (distance in the x-axis direction)) varies in the longitudinal direction.
　ここで、稜線６１０の高さのバラツキ指数として、表面粗さＲｍａｘを規定する。この場合の表面粗さＲｍａｘは、稜線６１０の一番高い点での端面２１１からの長さ（Ｈｍａｘ）と一番低い点での端面２１１からの長さ（Ｈｍｉｎ）との差（Ｈｍａｘ－Ｈｍｉｎ）で定義される。 Here, the surface roughness Rmax is defined as a variation index of the height of the ridgeline 610. The surface roughness Rmax in this case is the difference between the length (Hmax) from the end surface 211 at the highest point of the ridge line 610 and the length (Hmin) from the end surface 211 at the lowest point (Hmax - Hmin). ) is defined.
　そして、固体電解コンデンサ１０では、表面粗さＲｍａｘは、１．５μｍ以上１０．０μｍ以下である。 In the solid electrolytic capacitor 10, the surface roughness Rmax is 1.5 μm or more and 10.0 μm or less.
　図８は、表面粗さＲｍａｘと密着力との関係を示す表である。密着力とは、下地電極６１と樹脂電極７１との密着力であり、ひいては、陽極電極２１と端子電極（樹脂電極７１および外部電極８１からなる電極）との密着力に対応する。なお、密着力について、Ｆは、密着力が妥当な範囲であることを示し、Ｇは、密着力が良好なことを示し、Ｅは、密着力が優秀であることを示す。すなわち、密着力は、Ｆ＜Ｇ＜Ｅの関係にある。 FIG. 8 is a table showing the relationship between surface roughness Rmax and adhesion force. The adhesion force is the adhesion force between the base electrode 61 and the resin electrode 71, and in turn corresponds to the adhesion force between the anode electrode 21 and the terminal electrode (the electrode consisting of the resin electrode 71 and the external electrode 81). Regarding the adhesion, F indicates that the adhesion is within a reasonable range, G indicates that the adhesion is good, and E indicates that the adhesion is excellent. That is, the adhesion force is in the relationship F<G<E.
　また、この際、下地電極６１の厚みは、それぞれの表面粗さＲｍａｘよりも大きい。例えば、表面粗さＲｍａｘが０．５μｍの場合、下地電極６１の最大厚み（長さＨｍａｘ）は、０．５μｍ以上である。また、表面粗さＲｍａｘが１．５μｍの場合、下地電極６１の最大厚み（長さＨｍａｘ）は、１．５μｍ以上であり、表面粗さＲｍａｘが１０．０μｍの場合、下地電極６１の最大厚み（長さＨｍａｘ）は、１０．０μｍ以上である。 Furthermore, at this time, the thickness of the base electrode 61 is larger than the respective surface roughness Rmax. For example, when the surface roughness Rmax is 0.5 μm, the maximum thickness (length Hmax) of the base electrode 61 is 0.5 μm or more. Further, when the surface roughness Rmax is 1.5 μm, the maximum thickness (length Hmax) of the base electrode 61 is 1.5 μm or more, and when the surface roughness Rmax is 10.0 μm, the maximum thickness of the base electrode 61 is (Length Hmax) is 10.0 μm or more.
　図８に示すように、表面粗さＲｍａｘが１．５μｍ以上１０．０μｍ以下であることによって、密着力は、Ｅ（優秀）となり、他の表面粗さＲｍａｘ（１．５μｍ未満、１０．０μｍより大きい）よりも、高い密着力を実現できる。 As shown in FIG. 8, when the surface roughness Rmax is 1.5 μm or more and 10.0 μm or less, the adhesion becomes E (excellent), and other surface roughness Rmax (less than 1.5 μm, 10.0 μm (larger) can achieve higher adhesion.
　これは、表面粗さＲｍａｘが１．５μｍ以上１０．０μｍ以下に制御されることによって、下地電極６１は薄すぎず、厚すぎない形状となり、且つ、密着力の向上に寄与できるように下地電極６１の表面積を稼ぐことができるからである。これにより、下地電極６１と樹脂電極７１の密着性は向上し、ＥＳＲの低下を抑制できる。 This is because by controlling the surface roughness Rmax to 1.5 μm or more and 10.0 μm or less, the base electrode 61 has a shape that is neither too thin nor too thick, and the base electrode This is because a surface area of 61 mm can be obtained. Thereby, the adhesion between the base electrode 61 and the resin electrode 71 is improved, and a decrease in ESR can be suppressed.
　なお、下地電極６１の厚みは、上記表面粗さＲｍａｘを実現可能な厚さの範囲内で、０．１μｍ以上３０μｍ未満であることが好ましい。なお、ここでの下地電極６１の厚みは、稜線の高さの平均値（図のｙ軸方向の平均値）である。これにより、下地電極６１は、より適正な厚みとなり、下地電極６１と樹脂電極７１の密着性を安定的に高くでき、ＥＳＲの低下を抑制できる。 Note that the thickness of the base electrode 61 is preferably 0.1 μm or more and less than 30 μm within a thickness range that can achieve the above-mentioned surface roughness Rmax. Note that the thickness of the base electrode 61 here is the average value of the height of the ridge line (the average value in the y-axis direction in the figure). Thereby, the base electrode 61 has a more appropriate thickness, the adhesion between the base electrode 61 and the resin electrode 71 can be stably increased, and a decrease in ESR can be suppressed.
　上述の実施形態では、固体電解コンデンサを例に説明するが、膜状の内部電極を含む積層体と、積層体の端面に形成された外部電極とを備える電子部品であれば、本実施形態の構成を適用し、同様の作用効果を奏することができる。特に、内部電極と外部電極との間に樹脂電極を用いる電子部品において、本実施形態の構成は有効である。 In the above embodiment, a solid electrolytic capacitor is explained as an example, but the present embodiment can be applied to any electronic component including a laminate including a film-like internal electrode and an external electrode formed on an end surface of the laminate. By applying the configuration, similar effects can be achieved. The configuration of this embodiment is particularly effective in electronic components that use resin electrodes between internal electrodes and external electrodes.
＜１＞　複数の平膜状のコンデンサ用電極を積層して絶縁性樹脂によって封止することで素体を形成し、前記素体の端面に前記複数のコンデンサ用電極を線状に露出させる素体形成工程と、
　前記複数のコンデンサ用電極の前記端面の露出面にＡＤ法によって下地電極を形成する下地電極形成工程と、
　前記端面と前記下地電極とを覆う樹脂電極を形成する樹脂電極形成工程と、
　前記樹脂電極を覆う外部電極を形成する外部電極形成工程と、
　を有し、
　前記下地電極形成工程では、
　前記下地電極が前記線状に延びる方向の前記下地電極の表面粗さは、１．５μｍ以上１０．０μｍ以下である、
　コンデンサの製造方法。 <1> An element in which a plurality of flat film capacitor electrodes are stacked and sealed with an insulating resin to form an element body, and the plurality of capacitor electrodes are exposed linearly on an end face of the element body. body formation process;
a base electrode forming step of forming a base electrode on the exposed end face of the plurality of capacitor electrodes by an AD method;
a resin electrode forming step of forming a resin electrode covering the end surface and the base electrode;
an external electrode forming step of forming an external electrode covering the resin electrode;
has
In the base electrode forming step,
The surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 μm or more and 10.0 μm or less,
Method of manufacturing capacitors.
＜２＞　前記コンデンサ用電極をアルミニウムで形成された陽極電極を含み、
　前記陽極電極では、
　前記平膜状を形成する平膜面から所定深さが多孔質体で形成され、
　前記平膜面と前記多孔質体の表面が酸化され誘電体層となっている、
　＜１＞に記載のコンデンサの製造方法。 <2> The capacitor electrode includes an anode electrode made of aluminum,
In the anode electrode,
A porous material is formed at a predetermined depth from the flat membrane surface forming the flat membrane shape,
the flat membrane surface and the surface of the porous body are oxidized to form a dielectric layer;
A method for manufacturing a capacitor according to <1>.
＜３＞　前記下地電極の平均厚みは、０．１μｍ以上３０μｍ未満である、＜１＞または＜２＞に記載のコンデンサの製造方法。 <3> The method for manufacturing a capacitor according to <1> or <2>, wherein the base electrode has an average thickness of 0.1 μm or more and less than 30 μm.
＜４＞　前記外部電極の厚みは、８μｍ以上２０μｍ未満である、＜１＞乃至＜３＞のいずれかに記載のコンデンサの製造方法。 <4> The method for manufacturing a capacitor according to any one of <1> to <3>, wherein the external electrode has a thickness of 8 μm or more and less than 20 μm.
＜５＞　前記外部電極形成工程では、
　前記樹脂電極に前記外部電極をめっきで形成する、
　＜１＞乃至＜４＞のいずれかに記載のコンデンサの製造方法。 <5> In the external electrode forming step,
forming the external electrode on the resin electrode by plating;
The method for manufacturing a capacitor according to any one of <1> to <4>.
＜６＞　複数の平膜状のコンデンサ用電極が積層されて絶縁性樹脂によって封止されており、前記複数のコンデンサ用電極が線状に露出する端面を有する素体と、
　前記複数のコンデンサ用電極の前記端面の露出面に配置された下地電極と、
　前記端面と前記下地電極とを覆う樹脂電極と、
　前記樹脂電極を覆う外部電極と、
　を備え、
　前記下地電極が前記線状に延びる方向の前記下地電極の表面粗さは、１．５μｍ以上１０．０μｍ以下である、
　コンデンサ。 <6> A base body in which a plurality of flat film-shaped capacitor electrodes are stacked and sealed with an insulating resin, and has an end face from which the plurality of capacitor electrodes are exposed linearly;
a base electrode disposed on the exposed end surface of the plurality of capacitor electrodes;
a resin electrode covering the end face and the base electrode;
an external electrode covering the resin electrode;
Equipped with
The surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 μm or more and 10.0 μm or less,
capacitor.
＜７＞　前記コンデンサ用電極をアルミニウムで形成された陽極電極を含み、
　前記陽極電極では、
　前記平膜状を形成する平膜面から所定深さが多孔質体であり、
　前記平膜面と前記多孔質体の表面が酸化誘電体層である、
　＜６＞に記載のコンデンサ。 <7> The capacitor electrode includes an anode electrode formed of aluminum,
In the anode electrode,
A porous body is located at a predetermined depth from the flat membrane surface forming the flat membrane shape,
the flat membrane surface and the surface of the porous body are oxidized dielectric layers;
The capacitor described in <6>.
＜８＞　前記下地電極の平均厚みは、０．１μｍ以上３０μｍ未満である、＜６＞または＜７＞に記載のコンデンサ。 <8> The capacitor according to <6> or <7>, wherein the base electrode has an average thickness of 0.1 μm or more and less than 30 μm.
＜９＞　前記樹脂電極と外部電極とからなる端子電極の厚みは、８μｍ以上２０μｍ未満である、＜６＞乃至＜８＞のいずれかに記載のコンデンサ。 <9> The capacitor according to any one of <6> to <8>, wherein the terminal electrode made of the resin electrode and the external electrode has a thickness of 8 μm or more and less than 20 μm.
＜１０＞　前記外部電極は、前記樹脂電極の外面に配置されためっき層である、＜６＞乃至＜９＞のいずれかに記載のコンデンサ。 <10> The capacitor according to any one of <6> to <9>, wherein the external electrode is a plating layer disposed on the outer surface of the resin electrode.
１０：固体電解コンデンサ
１１：素体
２０：コンデンサ素子
２１：陽極電極
２２：ＣＰ層
３０：陰極電極
４０：接続層
５０：絶縁性樹脂
６１、６２：下地電極
７１、７２：樹脂電極
８１、８２：外部電極
９１：チャンバ
９２：ステージ
９３：エアロゾル発生器
１１１、１１２：端面
２１０：誘電体層
２１１、２１２、３１１、３１２：端面
２１３、２１４：平膜面
５００：絶縁体層
６００：銅粉
６１０：稜線
８１１、８１２、８２１、８２２：電極膜 10: Solid electrolytic capacitor 11: Element body 20: Capacitor element 21: Anode electrode 22: CP layer 30: Cathode electrode 40: Connection layer 50: Insulating resin 61, 62: Base electrode 71, 72: Resin electrode 81, 82: External electrode 91: Chamber 92: Stage 93: Aerosol generator 111, 112: End surface 210: Dielectric layer 211, 212, 311, 312: End surface 213, 214: Flat film surface 500: Insulator layer 600: Copper powder 610: Ridge lines 811, 812, 821, 822: electrode film

Claims (10)

  1. 　複数の平膜状のコンデンサ用電極を積層して絶縁性樹脂によって封止することで素体を形成し、前記素体の端面に前記複数のコンデンサ用電極を線状に露出させる素体形成工程と、
    　前記複数のコンデンサ用電極の前記端面の露出面にＡＤ法によって下地電極を形成する下地電極形成工程と、
    　前記端面と前記下地電極とを覆う樹脂電極を形成する樹脂電極形成工程と、
    　前記樹脂電極を覆う外部電極を形成する外部電極形成工程と、
    　を有し、
    　前記下地電極形成工程では、
    　前記下地電極が前記線状に延びる方向の前記下地電極の表面粗さは、１．５μｍ以上１０．０μｍ以下である、
    　コンデンサの製造方法。     An element body forming step in which a plurality of flat film capacitor electrodes are stacked and sealed with an insulating resin to form an element body, and the plurality of capacitor electrodes are exposed linearly on an end face of the element body. and,
    a base electrode forming step of forming a base electrode on the exposed end face of the plurality of capacitor electrodes by an AD method;
    a resin electrode forming step of forming a resin electrode covering the end surface and the base electrode;
    an external electrode forming step of forming an external electrode covering the resin electrode;
    has
    In the base electrode forming step,
    The surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 μm or more and 10.0 μm or less,
    Method of manufacturing capacitors.
  2. 　前記コンデンサ用電極をアルミニウムで形成された陽極電極を含み、
    　前記陽極電極では、
    　前記平膜状を形成する平膜面から所定深さが多孔質体で形成され、
    　前記平膜面と前記多孔質体の表面が酸化され誘電体層となっている、
    　請求項１に記載のコンデンサの製造方法。     The capacitor electrode includes an anode electrode made of aluminum,
    In the anode electrode,
    A porous material is formed at a predetermined depth from the flat membrane surface forming the flat membrane shape,
    the flat membrane surface and the surface of the porous body are oxidized to form a dielectric layer;
    A method for manufacturing a capacitor according to claim 1.
  3. 　前記下地電極の平均厚みは、０．１μｍ以上３０μｍ未満である、
    　請求項1または請求項２に記載のコンデンサの製造方法。     The average thickness of the base electrode is 0.1 μm or more and less than 30 μm.
    A method for manufacturing a capacitor according to claim 1 or 2.
  4. 　前記外部電極の厚みは、８μｍ以上２０μｍ未満である、
    　請求項1乃至請求項３のいずれかに記載のコンデンサの製造方法。     The thickness of the external electrode is 8 μm or more and less than 20 μm.
    A method for manufacturing a capacitor according to any one of claims 1 to 3.
  5. 　前記外部電極形成工程では、
    　前記樹脂電極に前記外部電極をめっきで形成する、
    　請求項１乃至請求項４のいずれかに記載のコンデンサの製造方法。     In the external electrode forming step,
    forming the external electrode on the resin electrode by plating;
    A method for manufacturing a capacitor according to any one of claims 1 to 4.
  6. 　複数の平膜状のコンデンサ用電極が積層されて絶縁性樹脂によって封止されており、前記複数のコンデンサ用電極が線状に露出する端面を有する素体と、
    　前記複数のコンデンサ用電極の前記端面の露出面に配置された下地電極と、
    　前記端面と前記下地電極とを覆う樹脂電極と、
    　前記樹脂電極を覆う外部電極と、
    　を備え、
    　前記下地電極が前記線状に延びる方向の前記下地電極の表面粗さは、１．５μｍ以上１０．０μｍ以下である、
    　コンデンサ。     a plurality of flat film-shaped capacitor electrodes are stacked and sealed with an insulating resin, and an element body has an end face from which the plurality of capacitor electrodes are exposed linearly;
    a base electrode disposed on the exposed end surface of the plurality of capacitor electrodes;
    a resin electrode covering the end face and the base electrode;
    an external electrode covering the resin electrode;
    Equipped with
    The surface roughness of the base electrode in the direction in which the base electrode extends linearly is 1.5 μm or more and 10.0 μm or less,
    capacitor.
  7. 　前記コンデンサ用電極をアルミニウムで形成された陽極電極を含み、
    　前記陽極電極では、
    　前記平膜状を形成する平膜面から所定深さが多孔質体であり、
    　前記平膜面と前記多孔質体の表面が酸化誘電体層である、
    　請求項６に記載のコンデンサ。     The capacitor electrode includes an anode electrode made of aluminum,
    In the anode electrode,
    A porous body is located at a predetermined depth from the flat membrane surface forming the flat membrane shape,
    the flat membrane surface and the surface of the porous body are oxidized dielectric layers;
    A capacitor according to claim 6.
  8. 　前記下地電極の平均厚みは、０．１μｍ以上３０μｍ未満である、
    　請求項６または請求項７に記載のコンデンサ。     The average thickness of the base electrode is 0.1 μm or more and less than 30 μm.
    A capacitor according to claim 6 or claim 7.
  9. 　前記樹脂電極と外部電極とからなる端子電極の厚みは、８μｍ以上２０μｍ未満である、
    　請求項６乃至請求項８のいずれかに記載のコンデンサ。     The thickness of the terminal electrode consisting of the resin electrode and the external electrode is 8 μm or more and less than 20 μm.
    A capacitor according to any one of claims 6 to 8.
  10. 　前記外部電極は、前記樹脂電極の外面に配置されためっき層である、
    　請求項６乃至請求項９のいずれかに記載のコンデンサ。     The external electrode is a plating layer disposed on the outer surface of the resin electrode,
    A capacitor according to any one of claims 6 to 9.
PCT/JP2023/021668 2022-06-15 2023-06-12 Manufacturing method for capacitor, and capacitor WO2023243581A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159856A (en) * 2010-02-02 2011-08-18 Sanyo Electric Co Ltd Electrode for capacitor, capacitor, and methods of manufacturing them
JP2017034010A (en) * 2015-07-30 2017-02-09 株式会社村田製作所 Multilayer ceramic capacitor and manufacturing method therefor
JP2018098475A (en) * 2016-12-09 2018-06-21 株式会社村田製作所 Multilayer ceramic capacitor
WO2021085555A1 (en) * 2019-10-31 2021-05-06 パナソニックＩｐマネジメント株式会社 Electrolytic capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159856A (en) * 2010-02-02 2011-08-18 Sanyo Electric Co Ltd Electrode for capacitor, capacitor, and methods of manufacturing them
JP2017034010A (en) * 2015-07-30 2017-02-09 株式会社村田製作所 Multilayer ceramic capacitor and manufacturing method therefor
JP2018098475A (en) * 2016-12-09 2018-06-21 株式会社村田製作所 Multilayer ceramic capacitor
WO2021085555A1 (en) * 2019-10-31 2021-05-06 パナソニックＩｐマネジメント株式会社 Electrolytic capacitor

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