WO2023238171A1 - Structure de câblage d'alimentation - Google Patents

Structure de câblage d'alimentation Download PDF

Info

Publication number
WO2023238171A1
WO2023238171A1 PCT/JP2022/022711 JP2022022711W WO2023238171A1 WO 2023238171 A1 WO2023238171 A1 WO 2023238171A1 JP 2022022711 W JP2022022711 W JP 2022022711W WO 2023238171 A1 WO2023238171 A1 WO 2023238171A1
Authority
WO
WIPO (PCT)
Prior art keywords
power wiring
conductor
magnetic
wiring structure
power
Prior art date
Application number
PCT/JP2022/022711
Other languages
English (en)
Japanese (ja)
Inventor
弘宜 樋口
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2022566387A priority Critical patent/JP7199624B1/ja
Priority to PCT/JP2022/022711 priority patent/WO2023238171A1/fr
Publication of WO2023238171A1 publication Critical patent/WO2023238171A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to power wiring structures.
  • Patent Document 1 discloses a wiring structure including a flat conductive material.
  • This application was made in order to solve the above-mentioned problems, and aims to obtain a power wiring structure that can suppress the outflow of magnetic flux that causes magnetic interference over a wider frequency range. .
  • the power wiring structure disclosed in the present application includes a conductive wire for flowing current, an insulator covering the conductive wire, a conductor covering the insulator, and a magnetic material disposed on the surface of the conductor. ing.
  • the power wiring structure of the present application it is possible to obtain a power wiring structure that can suppress outflow of magnetic flux that causes magnetic interference in a wide frequency range.
  • FIG. 1 is a schematic diagram showing a power conversion system using a power wiring structure according to Embodiment 1.
  • FIG. 1 is a cross-sectional view showing a power wiring structure according to Embodiment 1.
  • FIG. FIG. 3 is a cross-sectional view showing a power wiring structure according to a second embodiment.
  • FIG. 7 is a cross-sectional view showing a power wiring structure according to Embodiment 3.
  • FIG. 7 is a cross-sectional view showing a modification of the power wiring structure according to the third embodiment.
  • FIG. 7 is a cross-sectional view showing another modification of the power wiring structure according to the third embodiment.
  • FIG. 7 is a cross-sectional view showing a power wiring structure according to a fourth embodiment.
  • FIG. 7 is a cross-sectional view showing a power wiring structure according to a fifth embodiment.
  • FIG. 1 shows the connection relationship of the power wiring 10 in a power conversion system 100 to which the power wiring structure according to the first embodiment is applied
  • FIG. 2 shows the detailed structure of the power wiring 10.
  • FIG. 1 shows a configuration in which the power wiring structure according to the first embodiment is applied to a power conversion system 100.
  • Power wiring 10 according to the first embodiment is configured to include a conductive wire 4 and a conductor 5 arranged between a power source 1 and a power converter 2.
  • the power wiring 10 includes a conductive wire 4 and a conductor 5 arranged between the power converter 2 and the load 3.
  • the power source 1 is, for example, a commercial power source for AC, a storage battery, etc. for DC, and has a configuration in which a reference potential (for example, a conductor 5) is connected to a conductive wire 4 via a ground wire 6. There are configurations where this is not the case.
  • the power converter 2 consists of a switching element (IGBT or MOSFET), a reactor, an electrolytic capacitor, a diode, etc., and can be selected to obtain AC output or DC output for the power supplied from the power supply 1.
  • IGBT switching element
  • MOSFET MOSFET
  • the elements or circuit structures involved are significantly different.
  • an inverter circuit when obtaining AC output from the power converter 2, an inverter circuit is configured.
  • Six switching elements are mainly used in an inverter circuit, and they are mainly connected in a circuit of two in series and three in parallel.
  • the switching element connected to the positive side of the input DC voltage is called the upper arm
  • the switching element connected to the negative side is called the lower arm.
  • a conductive wire 4 is connected to the connection point between the upper arm and the lower arm
  • the output section is constituted by a total of three conductive wires 4 (three upper and lower arms).
  • the power converter 2 is connected to a load 3, such as a motor, via a conductive wire 4.
  • the electric motor rotates when a pseudo sine wave current generated by the on/off operation of the switching element is inputted via the conductive wire 4 .
  • Power converter 2 is often grounded to conductor 5 via grounding wire 6 .
  • the conductor 5 is a metal that has a reference potential at the point where it is used.
  • the metal casing serves as the reference potential.
  • the power supplied from the power supply 1 is input to the power converter 2 via the power wiring 10, and after changing the power into an arbitrary form (voltage value, current value, direct current, alternating current (frequency)), the power is connected to the power wiring. It is outputted to the load 3 via 10.
  • FIG. 2 is a cross-sectional view of the power wiring 10.
  • the power wiring 10 includes a conductive wire 4 for flowing current, an insulator 11 covering the conductive wire 4, a metal conductor 5 covering the insulator 11, and a magnetic material disposed on the surface of the conductor 5. 12.
  • the conductive wire 4 is usually made of a highly conductive material such as copper or aluminum.
  • the insulator 11 is arranged so as to surround the conductive wire 4, and is formed by impregnation with varnish, for example. It is preferable that the insulating material of the insulator 11 has high heat dissipation properties.
  • the conductor 5 is configured to surround the insulator 11 . Like the conductive wire 4, this conductor 5 is also preferably made of a highly conductive metal such as copper or aluminum.
  • the magnetic body 12 has an arbitrary shape and is located outside the conductor 5. For example, an effect can be obtained by attaching a magnetic sheet.
  • the conductor 5 and the magnetic body 12 do not need to be in contact with each other; a fixture may be installed between them, or they may be separately fixed to a structural part, or if the conductor 5 and the magnetic body 12 are integrated (conductor It is also effective when the relative magnetic permeability of the body 5 is not 1).
  • reflection is defined as an effect in which eddy currents are generated when magnetic flux passes through a substance, and the magnetic fluxes cancel each other out due to the magnetic flux generated by the eddy current itself.
  • reflection loss is defined as the amount of magnetic flux incident on a substance lost due to reflection.
  • absorption is defined as the effect of converting magnetic flux into Joule heat when it passes through a substance.
  • absorption loss is defined as the amount of magnetic flux incident on a substance lost due to absorption.
  • the conductive wire 4 serves as a current path as described above, magnetic flux is generated.
  • the magnetic flux interferes with other nearby equipment, leading to equipment malfunction.
  • the frequency at which reflection loss becomes large depends on the material or thickness of the material, but for example, when a magnetic flux with a frequency of 1 kHz is incident on aluminum with a thickness of 20 mm, the attenuation amount is 3 dB, but attenuation at 100 kHz is It can be seen that when a magnetic flux with a frequency is incident, the attenuation amount is 30 dB, and as the frequency of the magnetic flux changes, the magnetic flux shielding effect changes by 27 dB.
  • the frequency of the magnetic flux is low, the reflection loss of the shield becomes small, so that the magnetic flux passes through the shield formed by the conductor 5.
  • the magnetic flux that has passed through without being attenuated by the conductor 5 is incident on the magnetic body 12, which has a lower magnetic resistance than the surrounding air or the like.
  • the above-described absorption effect occurs in the case of a low frequency, and the incident magnetic flux is converted into Joule heat, resulting in a loss.
  • the structure of the power wiring 10 according to the first embodiment as described above by installing the magnetic material 12 on the outside of the electrical conductor 5, relatively low frequency waves that cannot be shielded by the electrical conductor 5 alone of the conventional technology can be shielded.
  • the magnetic flux By converting the magnetic flux into heat through the absorption action of the magnetic material, the incident magnetic flux can be attenuated and shielded.
  • the effects shown above largely depend on the material characteristics of the conductor 5 and magnetic material 12 selected, so they are not limited to materials such as aluminum or steel shown as examples.
  • Embodiment 2 The structure of the power wiring 10 according to the second embodiment will be explained.
  • FIG. 3 shows the structure of the power wiring 10 according to the second embodiment, and shows that a magnetic body 12 corresponding to the magnetic body 12 of the first embodiment is provided so as to cover the surface of the conductor 5.
  • the basic magnetic flux shielding action and effect are the same as in the first embodiment.
  • An additional effect obtained by this embodiment is that by forming the magnetic body 12 in a shape that covers the conductor 5, the magnetic circuit of the magnetic body 12 is closed and a closed loop is formed, thereby increasing the inductance. It is. Due to the increase in inductance, the impedance appears high for high-frequency currents, and it also has the effect of attenuating high-frequency conduction noise.
  • FIG. 4 shows the structure of power wiring 10 according to Embodiment 3, in which a magnetic body 12 corresponding to the magnetic body 12 of Embodiment 1 is plate-shaped, and one end thereof is in contact with the surface of conductor 5. A plurality of them are arranged in a fin shape. The conductor 5 and the magnetic body 12 are connected via adhesive or the like.
  • the magnetic flux generated from the current flowing through the conductive wire 4 is absorbed by the magnetic body 12 and generates heat, thereby suppressing the magnetic flux.
  • Heat generation causes magnetic saturation of the magnetic body 12, so by creating a structure with an increased surface area, it is possible to improve the amount of heat generated from the magnetic body 12 escaping to the surrounding gas (cooling performance), which reduces heat generation. Improves resistance.
  • the magnetic flux reduction performance increases by the number of magnetic bodies 12. By adjusting the thickness, material, etc. according to the purpose, it is possible to arbitrarily set an effective frequency band.
  • FIG. 5 shows the structure of a power wiring 10 that is a modification of the third embodiment, in which a metal plate 13 is provided on the surface of the conductor 5, and a magnetic material 12 is fixed to the surface of the metal plate 13. ing. That is, a plurality of plate-shaped metal plates 13 are provided on the conductor 5 in the form of fins, and the magnetic body 12 is arranged on the surface of the metal plate 13.
  • the metal plate 13 uses cooling fins made of copper or aluminum.
  • the magnetic body 12 is formed of a plate or sheet, and is connected to the metal plate 13 with an adhesive having excellent heat dissipation properties.
  • the heat generated by the magnetic material is conducted to the metal plate 13, which has a higher cooling effect, and is cooled by the refrigerant (gas or fluid) flowing between the fins, improving resistance to heat generation.
  • the heat generated by the conductive wire 4 can be simultaneously cooled by the metal plate 13, the cross-sectional area of the conductive wire 4 can be reduced, and the entire power wiring 10 can be downsized.
  • the metal plate itself has a shielding effect due to reflection, it is possible to improve the shielding effect of magnetic flux in a relatively high frequency band.
  • FIG. 6 shows the structure of a power wiring 10 that is another modification of the third embodiment, in which a metal plate 13 is placed in contact with both the front and back surfaces of the magnetic body 12. This further improves the heat dissipation effect and the shielding effect.
  • FIG. 7 shows the structure of a power wiring 10 according to a fourth embodiment, in which a magnetic conductor 14 containing or mixed with a magnetic material is used as a material corresponding to the metal plate 13 and the magnetic material 12 in the third embodiment. It has a set configuration.
  • the manufacturing process can be simplified.
  • the magnetic conductor 14 containing a magnetic substance for example, an alloy containing iron or nickel can be considered.
  • FIG. 8 shows the structure of a power wiring 10 according to the fifth embodiment, which includes a conductive wire 4 for passing current, an insulator 11 covering the conductive wire 4, and a magnetic material that covers the insulator 11.
  • the magnetic conductor 14 has a magnetic conductor 14.
  • the frequency range in which the magnetic flux can be shielded is widened, and the manufacturing process can be simplified, compared to the case of shielding only with the conductor 5.
  • the present invention is not limited to the embodiments described above, and, for example, the following embodiments may be used.
  • the power wiring 10 according to the embodiment described above includes one conductive wire 4, it may have a configuration including two or more conductive wires. In that case, a configuration in which the long sides, ie, wide sides, of the conductive wire 4 having a rectangular cross section, such as the conductive wire 4, are opposed to each other and the insulator 11 is sandwiched therebetween is effective against conduction noise.
  • the magnetic body 12, the metal plate 13, and the magnetic conductor 14 containing the magnetic body, which have one end connected to the surface of the conductor 5, have a plate-like configuration, but other configurations have a large surface area. But that's fine.
  • the arrangement method, number of sheets, physical properties, etc. may be changed as appropriate in consideration of the surrounding environment. For example, it is possible to arrange them densely in a direction in which magnetic flux does not want to interfere, or to arrange them sparsely in consideration of heat radiation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention concerne une structure de câblage d'alimentation comprenant une ligne conductrice (4) à travers laquelle passe un courant, un isolant (11) recouvrant la ligne conductrice (4), un conducteur (5) recouvrant l'isolant (11), et une substance magnétique (12) disposée sur une surface du conducteur (5).
PCT/JP2022/022711 2022-06-06 2022-06-06 Structure de câblage d'alimentation WO2023238171A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022566387A JP7199624B1 (ja) 2022-06-06 2022-06-06 電力配線構造
PCT/JP2022/022711 WO2023238171A1 (fr) 2022-06-06 2022-06-06 Structure de câblage d'alimentation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/022711 WO2023238171A1 (fr) 2022-06-06 2022-06-06 Structure de câblage d'alimentation

Publications (1)

Publication Number Publication Date
WO2023238171A1 true WO2023238171A1 (fr) 2023-12-14

Family

ID=84784199

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/022711 WO2023238171A1 (fr) 2022-06-06 2022-06-06 Structure de câblage d'alimentation

Country Status (2)

Country Link
JP (1) JP7199624B1 (fr)
WO (1) WO2023238171A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092988A (ja) * 1996-09-12 1998-04-10 Tokin Corp ヒートシンク及び放熱シート
JPH1153956A (ja) * 1997-08-07 1999-02-26 Sumitomo Wiring Syst Ltd Ｅｍｉ抑制ケーブル
JP2004281181A (ja) * 2003-03-14 2004-10-07 Hitachi Kokusai Electric Inc 放熱構造
JP2009158658A (ja) * 2007-12-26 2009-07-16 Murata Mfg Co Ltd 放熱装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6327113B2 (ja) * 2014-10-30 2018-05-23 株式会社明電舎 電力変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092988A (ja) * 1996-09-12 1998-04-10 Tokin Corp ヒートシンク及び放熱シート
JPH1153956A (ja) * 1997-08-07 1999-02-26 Sumitomo Wiring Syst Ltd Ｅｍｉ抑制ケーブル
JP2004281181A (ja) * 2003-03-14 2004-10-07 Hitachi Kokusai Electric Inc 放熱構造
JP2009158658A (ja) * 2007-12-26 2009-07-16 Murata Mfg Co Ltd 放熱装置

Also Published As

Publication number Publication date
JP7199624B1 (ja) 2023-01-05
JPWO2023238171A1 (fr) 2023-12-14

Similar Documents

Publication Publication Date Title
JP5743851B2 (ja) 電子装置
WO2016147492A1 (fr) Dispositif de circuit de puissance
US5940272A (en) Electric apparatus having heat radiating fin
JP6104347B1 (ja) 電力変換装置
US20110221268A1 (en) Power Converter and In-Car Electrical System
WO2018116667A1 (fr) Dispositif de conversion de puissance
WO2014021035A1 (fr) Convertisseur continu-continu
CN103095100A (zh) 开关调节器及带有该开关调节器的电源装置
WO2023238171A1 (fr) Structure de câblage d'alimentation
CN106469695B (zh) 电子电气设备
KR20040111419A (ko) 복합 코어 비선형 리액터 및 유도 수전 회로
JP5532554B2 (ja) 電力変換装置
CN106469694B (zh) 电子电气设备
JP6583522B2 (ja) 電子電気機器
JP4543864B2 (ja) 放熱部品及びその製造方法
WO2019237703A1 (fr) Transformateur et dispositif électrique le comportant
JP2001326300A (ja) 半導体装置
JP4215096B2 (ja) 電磁調理器
JP4215095B2 (ja) 電磁調理器
JPH1117083A (ja) Ｅｍｉ対策機能付き放熱装置
JP6440779B1 (ja) 電力変換装置
WO2016143207A1 (fr) Filtre de bruit
JP2021005976A (ja) 電力変換装置
JP7309646B2 (ja) バスダクト
JP6291599B2 (ja) 電力変換装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22945684

Country of ref document: EP

Kind code of ref document: A1