Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
  • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
  • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
  • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
  • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/12—Unsaturated polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
  • C08G75/02—Polythioethers
  • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
  • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
  • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
  • G03F7/031—Organic compounds not covered by group G03F7/029
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F7/0387—Polyamides or polyimides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/40—Treatment after imagewise removal, e.g. baking
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1003—Preparatory processes
  • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
  • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
  • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used

Definitions

• the present invention relates to a photosensitive resin composition containing a polyimide resin precursor, a patterned resin film using the photosensitive resin precursor composition, and a method for producing a patterned polyimide resin film.
• Polyimide resins and polyamide resins have properties such as excellent heat resistance, mechanical strength, insulation, and low dielectric constant, so they are used in electrical and electronic applications such as various elements and electronic boards such as multilayer wiring boards. It is widely used as an insulating and protective material in parts.
• 4,4'-dioxybiphenyl derived from 4,4'-bis(4-aminophenoxy)biphenyl has been developed as a composition capable of forming a resin film exhibiting good dielectric properties in a high frequency band.
• a photosensitive resin composition (see Patent Document 1, Examples) has been proposed that includes an aromatic polyamide resin having a specific structure having a structural unit having a skeleton and a photopolymerization initiator.
• the photosensitive resin composition described in Patent Document 1 When using the photosensitive resin composition described in Patent Document 1, a polyimide resin film with a somewhat low dielectric loss tangent can be formed. On the other hand, the photosensitive resin composition described in Patent Document 1 has a problem in that it tends to undergo changes in properties such as thickening during storage.
• the present invention was made in view of the above problems, and provides a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and has excellent stability during storage, and a patterned resin composition using the photosensitive resin composition.
• the present invention aims to provide a patterned resin film and a method for manufacturing a patterned polyimide resin film.
• the present inventors have developed a diamine compound having an aromatic group in the side chain, a diamine compound having a 4,4'-dioxybiphenyl skeleton, and a dicarboxylic acid compound having an unsaturated group containing a carbon-carbon double bond.
• a photosensitive resin composition containing a polyimide resin precursor (A) derived from The inventors have discovered that the above-mentioned problems can be solved by using a system solvent (S1), and have completed the present invention. More specifically, the present invention provides the following.
• a first aspect of the present invention is a photosensitive resin composition
• a polyimide resin precursor (A) has the following formula (1):
• X A1 and Y A1 are organic groups having 6 to 40 carbon atoms
• R A1 and R A2 are each independently a hydrogen atom or an organic group having 1 or more and 30 or less carbon atoms
• the organic groups as R A1 and R A2 are connected to each other via a C-O bond. Bonds to the oxygen atom in the ester bond in formula (1).
• the polyimide resin precursor (A) has an unsaturated group having 3 to 20 carbon atoms having a carbon-carbon double bond as the organic group as R A1 and R A2 ,
• the polyimide resin precursor (A) has the following formula (A1-1) as Y A1 :
• (In formula ( A1-1 ) group, hydroxy group, carboxy group, sulfonic acid group, or halogen atom
• Ar is a phenyl group optionally substituted with R a2 , or a naphthyl group optionally substituted with R a2
• ma1 is , is an integer between 0 and 10
• ma2 is an integer between 0 and 7
• ma3 is an integer between 1 and 10.
• R a3 and R a4 are each independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or
• a second aspect of the present invention includes applying the photosensitive resin composition according to the first aspect onto a substrate to form a coating film, position-selectively exposing the coating film, and exposing the photosensitive resin composition according to the first embodiment. Developing a patterned coating film.
• a third aspect of the present invention includes generating a polyimide resin derived from a polyimide resin precursor by heating the patterned resin film manufactured by the manufacturing method according to the second aspect. This is a method for manufacturing a patterned polyimide resin film.
• a photosensitive resin composition that provides a polyimide resin with a low dielectric loss tangent and has excellent stability during storage, a patterned resin film using the photosensitive resin composition, and a patterned polyimide resin composition.
• a method for manufacturing a resin film can be provided.
• the photosensitive resin composition includes a polyimide resin precursor (A), a photoradical polymerization initiator (C), and an organic solvent (S).
• the polyimide resin precursor (A) consists of a structural unit represented by the formula (1) described below. Forming a polyimide resin with a low dielectric loss tangent using the photosensitive resin composition by including the polyimide resin precursor (A) consisting of the structural unit represented by formula (1). I can do it.
• the polyimide resin precursor (A) will be described in detail later.
• the organic solvent (S) includes a urea solvent (S1).
• the content of the urea solvent (S1) is 50% by mass or more based on the mass of the organic solvent (S). Since the photosensitive resin composition contains the urea solvent (S1) in the above amount, the photosensitive resin composition has excellent stability during storage.
• the polyimide resin precursor (A) consists of a structural unit represented by the following formula (1).
• X A1 and Y A1 are organic groups having 6 or more and 40 or less carbon atoms.
• R A1 and R A2 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms.
• the organic groups as R A1 and R A2 are bonded to the oxygen atom in the ester bond in formula (1) via a C—O bond.
• the polyimide resin precursor (A) has an unsaturated group having 3 to 20 carbon atoms and having a carbon-carbon double bond as the organic group R A1 and R A2 .
• a desired amount of unsaturated groups having 3 or more and 20 or less carbon atoms having a carbon-carbon double bond are present as R A1 and R A2 as organic It is sufficient that it exists as a base. It is not necessary that all the organic groups as R A1 and R A2 on the molecular chain of the polyimide resin precursor (A) be unsaturated groups having 3 to 20 carbon atoms and having a carbon-carbon double bond. .
• the polyimide resin precursor (A) has a divalent group represented by the following formula (A1-1) or a partial structure represented by the following formula (A2-1) as Y A1 in formula (1). Contains divalent groups with As a result, a polyimide resin having a low dielectric loss tangent can be formed using the photosensitive resin composition.
• X is a tetravalent organic group.
• R a1 is a hydroxy group, a carboxy group, or a halogen atom.
• R a2 is an aliphatic group having 1 to 20 carbon atoms, a hydroxy group, a carboxy group, a sulfonic acid group, or a halogen atom.
• Ar is a phenyl group optionally substituted with R a2 or a naphthyl group optionally substituted with R a2 .
• ma1 is an integer from 0 to 10.
• ma2 is an integer from 0 to 7.
• ma3 is an integer from 1 to 10.
• R a3 and R a4 each independently represent an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom.
• ma4 and ma5 are each independently an integer of 0 or more and 4 or less.
• the polyimide resin precursor (A) is typically a polymer of a diamine compound and a dicarboxylic acid that is a reaction product of tetracarboxylic dianhydride and alcohol. However, regarding the diamine compound, dicarboxylic acid, tetracarboxylic dianhydride, and alcohol, the polyimide resin precursor (A) is selected so as to satisfy the above-mentioned predetermined requirements.
• the diamine compound is represented by the following formula (A2). H 2 N-Y A1 -NH 2 ...(A2) (In formula (A2), Y A1 represents a divalent organic group.)
• Y A1 is a divalent organic group having 6 or more and 40 or less carbon atoms.
• Y A1 may have one or more substituents in addition to the two amino groups.
• substituents include a fluorine atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a fluorinated alkyl group having 1 to 6 carbon atoms, and a fluorinated alkyl group having 1 to 6 carbon atoms.
• One to six fluorinated alkoxy groups, carboxy groups, or hydroxy groups are preferred.
• the substituent is a fluorinated alkyl group or a fluorinated alkoxy group, it is preferably a perfluoroalkyl group or a perfluoroalkoxy group.
• Y A1 The lower limit of the number of carbon atoms in the organic group as Y A1 is 6, and the upper limit is 40, with 30 being more preferable.
• Y A1 may be an aliphatic group, but is preferably an organic group containing one or more aromatic rings.
• Y A1 is an organic group containing one or more aromatic rings
• the organic group may be the aromatic group itself, and two or more aromatic groups may be an aliphatic hydrocarbon group or a halogenated aliphatic group. It may be a group bonded via a bond containing a group hydrocarbon group or a heteroatom such as an oxygen atom, a sulfur atom, or a nitrogen atom.
• the aromatic ring in Y A1 bonded to the amino group is preferably a benzene ring.
• the ring bonded to the amino group in Y A1 is a condensed ring containing two or more rings
• the ring bonded to the amino group in the condensed ring is preferably a benzene ring.
• the aromatic ring contained in Y A1 may be an aromatic heterocycle.
• Y A1 is an organic group containing an aromatic ring, from the viewpoint of improving the electrical properties and mechanical properties of the polyimide resin formed using the polyimide resin precursor (A), the organic group is ) to (24) is preferred.
• R 111 is a hydrogen atom, a fluorine atom, a carboxy group, a sulfonic acid group, a hydroxy group, an alkyl group having 1 to 4 carbon atoms, and a halogen having 1 to 4 carbon atoms. represents one selected from the group consisting of alkyl groups.
• Q 1 is a 9,9'-fluorenylidene group, or the formula: -C 6 H 4 -, -C 6 H 4 -C 6 H 4 -, -O- C 6 H 4 -C 6 H 4 -O-, -OC 6 H 4 -CO-C 6 H 4 -O-, -O-C 6 H 4 -C(CH 3 ) 2 -C 6 H 4 -O-, -OCO -C 6 H 4 -COO-, -OCO-C 6 H 4 -C 6 H 4 -COO-, -OCO-, -O-, -CO-, -C(CF 3 ) 2 -, -C(CH 3 ) 2 -, -CH 2 -, -O-C 6 H 4 -SO 2 -C 6 H 4 -O-, -C(CH 3 ) 2 -C 6 H 4 -C(CH 3 ) 2 -, Consisting of
• -C 6 H 4 - in the example of Q 1 is a phenylene group, preferably m-phenylene group and p-phenylene group, more preferably p-phenylene group.
• -C 10 H 6 - is a naphthalene diyl group, such as a naphthalene-1,2-diyl group, a naphthalene-1,4-diyl group, a naphthalene-2,3-diyl group, a naphthalene-2,6-diyl group, and a naphthalene-2,3-diyl group.
• n is an integer of 1 or more, preferably an integer of 1 or more and 20 or less, more preferably an integer of 1 or more and 12 or less, and even more preferably an integer of 1 or more and 6 or less.
• a diamine compound containing a group represented by formula (24) is preferably a compound represented by formula (a2) below.
• the n in formula (a2) is as explained for Q1 in formula (24).
• R 111 in formulas (21) to (24) is more preferably a hydrogen atom, a fluorine atom, a methyl group, an ethyl group, or a trifluoromethyl group, from the viewpoint of improving the electrical properties of the resin film formed. Particularly preferred are atoms or trifluoromethyl groups.
• Q 1 in formula (24) is -C 6 H 4 -C 6 H 4 -, -O-C 6 H 4 -C 6 H 4 from the viewpoint of electrical properties and mechanical properties of the resin film formed.
• Q 1 in formula (24) is -OC 6 H 4 -C 6 H 4 - O-, -O-C 6 H 4 -C(CH 3 ) 2 -C 6 H 4 -O- is more preferable, and is represented by -O-C 6 H 4 -C 6 H 4 -O-, and -C 6 Particularly preferred is a group in which H 4 - are both p-phenylene groups.
• the aromatic diamine compounds shown below can be suitably used. That is, the aromatic diamine compounds include p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 4,4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 3,4'-diaminobiphenyl, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene, 9,10-diaminoanthracene, 9,10-bis(4-aminophenyl)anthracene, 4,4'-diamino-2,2'-bis(trifluoro methyl)biphenyl, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone, 4,4'-diamino
• Y A1 a silicon atom-containing group which may have a chain aliphatic group and/or an aromatic ring can be employed.
• a silicon atom-containing group the groups shown below can typically be used.
• Specific examples of compounds having amino groups at both ends and silicon atom-containing groups include amino-modified methylphenyl silicone at both ends (for example, X-22-1660B-3 (number average molecular weight 4, manufactured by Shin-Etsu Chemical Co., Ltd.).
• X-22-161A number average molecular weight approximately 1,600 manufactured by Shin-Etsu Chemical Co., Ltd.
• X-22-161B number average molecular weight approximately 3,000
• KF8012 number average molecular weight approximately 4,400
• BY16-835U manufactured by Dow Corning Toray (number average molecular weight approximately 900)
• Silaplane FM3311 manufactured by JNC. (number average molecular weight of about 1,000)).
• a diamine having an oxyalkylene group can also be preferably used as the diamine compound represented by formula (A2).
• Preferred examples of the oxyalkylene group include ethyleneoxy group, propyleneoxy group (-C(CH 3 )-CH 2 -O-, -CH 2 -C(CH 3 )-O-, or -CH 2 CH 2 CH 2 -O-).
• the diamine having an oxyalkylene group may contain a combination of two or more types of oxyalkylene groups. When the diamine having an oxyalkylene group contains two or more types of oxyalkylene groups, the two or more types of oxyalkylene groups may be contained in the diamine blockwise or randomly.
• the diamine having an oxyalkylene group preferably does not contain a cyclic group, and more preferably does not contain an aromatic group.
• Specific examples of diamines having an oxyalkylene group include Jeffamine (registered trademark) KH-511, Jeffamine (registered trademark) ED-600, Jeffamine (registered trademark) ED-900, and Jeffamine (registered trademark) ED-900, all manufactured by HUNTSUMAN.
• the polyimide resin precursor (A) includes a group represented by the following formula (A1-1) or the following formula (A2-1) as Y A1 in formula (1). Therefore, when preparing a polyimide resin precursor (A) by reacting a diamine compound with a dicarboxylic acid which is a reaction product of tetracarboxylic dianhydride and alcohol, it is represented by formula (A2), In addition, a compound in which Y A1 is a group represented by the following formula (A1-1) or the following formula (A2-1) is used as part or all of the diamine compound.
• X is a tetravalent organic group.
• R a1 is a hydroxy group, a carboxy group, or a halogen atom.
• R a2 is an aliphatic group having 1 to 20 carbon atoms, a hydroxy group, a carboxy group, a sulfonic acid group, or a halogen atom.
• Ar is a phenyl group optionally substituted with R a2 or a naphthyl group optionally substituted with R a2 .
• ma1 is an integer from 0 to 10.
• ma2 is an integer from 0 to 7.
• ma3 is an integer from 1 to 10.
• the upper limit of the number of divalent carbon atoms represented by formula (A1-1) is 40.
• Ar is a phenyl group optionally substituted with R a2 or a naphthyl group optionally substituted with R a2 .
• Ar is preferably a phenyl group or a naphthyl group. That is, in formula (A1-1), ma2 is preferably 0.
• R a2 is an aliphatic group having 1 to 20 carbon atoms, a hydroxy group, a carboxy group, a sulfonic acid group, or a halogen atom.
• the organic group as R a2 may contain a hetero atom such as O, N, S, P, B, Si, or a halogen atom.
• the number of carbon atoms in the aliphatic group as R a2 is preferably 1 or more and 12 or less, more preferably 1 or more and 6 or less.
• Aliphatic groups as R a2 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, n-hexyl group.
• n-heptyl group n-octyl group, 2-ethylhexyl group, n-nonyl group, n-decyl group, n-undecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group chain alkyl groups such as n-heptadecyl group, n-octadecyl group, n-nonadecyl group, and n-icosyl group; vinyl group, 1-propenyl group, 2-n-propenyl group (allyl group), 1- Chain alkenyl groups such as n-butenyl group, 2-n-butenyl group, and 3-n-butenyl group; cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohex
• Chain alkyloxycarbonyl group formyloxy group, acetyloxy group, propionyloxy group, butanoyloxy group, pentanoyloxy group, hexanoyloxy group, heptanoyloxy group, octanoyloxy group, nonanoyloxy group, and decanoyl group It is an aliphatic acyloxy group such as an oxy group.
• ma3 is an integer from 1 to 10.
• the value of ma3 is not particularly limited as long as it is 1 or more and 10 or less, and is appropriately selected depending on the structure of X.
• the value of ma3 is preferably 1 or more and 4 or less, and more preferably 1 or 2.
• the organic group as X may contain a hetero atom such as O, N, S, P, B, Si, and a halogen atom. Note that in the compound represented by formula (A1-1), the two amino groups are each bonded to a carbon atom in the organic group as X.
• the organic group as X may be an aliphatic group, an aromatic group, or a combination of an aliphatic group and an aromatic group.
• the organic group as X may be a group bonded via a bond containing a heteroatom such as an oxygen atom, a sulfur atom, and a nitrogen atom.
• the aliphatic group may be a saturated aliphatic group or an unsaturated aliphatic group.
• the aliphatic group is preferably an aliphatic hydrocarbon group.
• the organic group as X is an aliphatic group
• the aliphatic group may be a chain or a cyclic group, or a combination of a chain aliphatic group and a cyclic aliphatic group. Good too.
• the chain aliphatic group may have a branch.
• the aliphatic group is preferably a group obtained by removing (ma1+ma3+2) hydrogen atoms from an alkylene group having 1 to 20 carbon atoms, and 1 to 16 carbon atoms
• a group obtained by removing (ma1+ma3+2) hydrogen atoms from the following alkylene group is more preferable, and a group obtained by removing (ma1+ma3+2) hydrogen atoms from an alkylene group having 1 to 12 carbon atoms is even more preferable.
• the groups composed of X, Ar, R a1 and R a2 in formula (A1) include the following formulas (11) to (15). ).
• formulas (11) to (15) Ar, R a1 , R a2 , ma1, ma2, and ma3 are the same as those in formula (A1).
• ma4 and ma5 are each independently an integer of 0 or more and 4 or less.
• ma6 and ma7 are each independently an integer of 0 or more and 4 or less.
• the sum of ma6 and ma7 is 1 or more and 8 or less.
• ma8, ma9, and ma10 are each independently an integer of 0 or more and 4 or less.
• the sum of ma8, ma9, and ma10 is 0 or more and 10 or less.
• ma11, ma12, and ma13 are each independently an integer of 0 or more and 4 or less.
• ma11, ma12, and ma13 is 1 or more and 10 or less.
• ma14 is an integer from 0 to 3.
• ma15 is an integer greater than or equal to 0 and less than or equal to 5.
• the sum of ma14 and ma15 is 0 or more and 8 or less.
• ma16 is an integer from 0 to 3.
• ma17 is an integer from 0 to 5.
• the sum of ma16 and ma17 is 1 or more and 8 or less.
• ma1 is preferably 0. Ma2 is preferably 0. Ma3 is preferably 1 or 2.
• ma1 is preferably 0. Ma2 is preferably 0. Ma3 is preferably 1 or 2.
• ma2 is preferably 0. Ma4 and ma5 are each preferably 0. Ma6 and ma7 are preferably 0, 1, or 2, respectively. The sum of ma6 and ma7 is 1 or more, and preferably 4 or less.
• ma2 is preferably 0. Ma8, ma9, and ma10 are each preferably 0. Ma11, ma12, and ma13 are preferably 0, 1, or 2, respectively. The sum of ma11, ma12, and ma13 is 1 or more, and preferably 6 or less.
• ma2 is preferably 0. Ma14 and ma15 are each preferably 0. Ma16 and ma17 are preferably 0, 1, or 2, respectively. The sum of ma16 and ma17 is 1 or more, and preferably 4 or less.
• R a3 is a single bond or a divalent linking group.
• the divalent linking group is not a group containing an aromatic group.
• the number of carbon atoms in the linking group is preferably 1 or more and 20 or less, more preferably 1 or more and 12 or less, and even more preferably 1 or more and 6 or less.
• the aliphatic hydrocarbon group as a linking group may have one or more unsaturated bonds, may have a branch, and may include a ring structure.
• Specific examples of aliphatic hydrocarbon groups as linking groups include methylene group, ethane-1,2-diyl group (ethylene group), ethane-1,1-diyl group, propane-1,3-diyl group, and propane group.
• Suitable examples of the linking group include an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, an alkynylene group having 2 to 6 carbon atoms, and an alkylene group having 1 to 6 carbon atoms.
• Alkyleneoxy group alkenyleneoxy group having 2 to 6 carbon atoms, alkynyleneoxy group having 2 to 6 carbon atoms, alkylenethio group having 1 to 6 carbon atoms, alkenylene having 2 to 6 carbon atoms Thio group, alkynylenethio group having 2 to 6 carbon atoms, alkylene amino group having 1 to 6 carbon atoms, alkenylene amino group having 2 to 6 carbon atoms, alkynylene amino group having 2 to 6 carbon atoms , -CONH-, -NH-, -COO-, -O-, -CO-, -SO-, -SO 2 -, -S-, -OCONH-, and -OCOO-.
• the polyimide resin formed using the polyimide resin precursor (A) exhibits a low dielectric loss tangent and good mechanical properties, among the divalent groups represented by formula (A1-1), the following A divalent group represented by formula (A1-2) is preferred.
• R a1 , R a2 , Ar, ma1, ma2, and ma3 are the same as those in formula (A1).
• Y a1 is an organic group having 1 or more and 20 or less carbon atoms, or a single bond.
• Y a2 is an organic group having 1 or more and 20 or less carbon atoms.
• na1 is 0 or 1.
• na2 is 0 or 1.
• Ya1 is not a single bond.
• the organic group as Y a1 may contain a hetero atom such as O, N, S, P, B, Si, and a halogen atom.
• the organic group as Y a1 is preferably a hydrocarbon group.
• the hydrocarbon group as Y a1 may be an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination of an aliphatic hydrocarbon group and an aromatic hydrocarbon group.
• the hydrocarbon group as Y a1 is preferably an aromatic hydrocarbon group, and more preferably a phenylene group or a naphthalenediyl group.
• Preferred specific examples of the aromatic hydrocarbon group as Y a1 include p-phenylene group, m-phenylene group, o-phenylene group, naphthalene-1,4-diyl group, naphthalene-1,2-diyl group, naphthalene-1,3-diyl group, naphthalene-1,5-diyl group, naphthalene-1,6-diyl group, naphthalene-1,7-diyl group, naphthalene-1,8-diyl group, naphthalene-2,6 -diyl group, naphthalene-2,7-diyl group, and naphthalene-2,3-diyl group.
• p-phenylene group and m-phenylene group are preferred, and p-phenylene group is more preferred.
• na2 is preferably 1, na1 and na2 are both 1, and Y a1 is more preferably an organic group.
• the structural unit represented by formula (A1-2) is likely to be packed well, and has excellent mechanical properties, thermal properties, electrical properties, etc. It is considered that it is easier to obtain a polyimide resin precursor (A) that provides a polyimide resin.
• ma1 is preferably 0.
• Ma2 is preferably 0.
• Ma3 is preferably 1 or 2.
• diamine compound (A-1) represented by the formula (A1-1) described above include the following compounds.
• R a3 and R a4 each independently represent an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom.
• ma4 and ma5 are each independently an integer of 0 or more and 4 or less.
• the alkyl groups having 1 to 4 carbon atoms as R a3 and R a4 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, Examples include sec-butyl group and tert-butyl group. Among these alkyl groups, methyl group and ethyl group are preferred, and methyl group is more preferred.
• the alkoxy group having 1 to 4 carbon atoms as R a3 and R a4 includes methoxy group, ethoxy group, n-propyloxy group, isopropyloxy group, n-butyloxy group, isobutyl group.
• examples of the halogen atom as R a3 and R a4 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these halogen atoms, chlorine atoms and bromine atoms are preferred.
• ma4 and ma5 are each independently an integer from 0 to 4.
• ma4 and ma5 are respectively designated because a diamine compound having a divalent group having a partial structure represented by formula (A2-1) is easily available.
• An integer of 0 or more and 2 or less is preferable, and 0 is more preferable.
• a suitable group as a divalent group having a partial structure represented by formula (A2-1) includes a divalent group represented by formula (A2-2) below.
• X 1 and X 2 are each independently selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a halogen atom. is an aromatic hydrocarbon group optionally substituted with one or more groups.
• R a3 , R a4 , ma4, and ma5 are the same as those in formula (A2-1). However, the upper limit of the number of carbon atoms in the divalent group represented by formula (A2-2) is 40.
• X 1 and X 2 in formula (A2-2) are each independently selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a halogen atom. It is a divalent aromatic hydrocarbon group which may be substituted with one or more groups. Examples of the alkyl group having 1 to 4 carbon atoms as a substituent include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, and tert-butyl group. Can be mentioned.
• alkyl groups methyl group and ethyl group are preferred, and methyl group is more preferred.
• alkoxy group having 1 to 4 carbon atoms as a substituent include methoxy group, ethoxy group, n-propyloxy group, isopropyloxy group, n-butyloxy group, isobutyloxy group, sec-butyloxy group, and tert- A butyloxy group is mentioned.
• methoxy group and ethoxy group are preferred, and methoxy group is more preferred.
• the halogen atom as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these halogen atoms, chlorine atoms and bromine atoms are preferred.
• the number of carbon atoms in the aromatic hydrocarbon groups as X 1 and X 2 is not particularly limited as long as the number of carbon atoms in the divalent group represented by formula (A2-2) is 40 or less. Note that the number of carbon atoms in the above-mentioned aromatic hydrocarbon group does not include the number of carbon atoms in the substituents.
• the aromatic hydrocarbon groups as X 1 and X 2 include phenylene groups such as o-phenylene group, m-phenylene group, and p-phenylene group, naphthalene-1,4-diyl group, naphthalene-1,3 Naphthalenediyl groups such as -diyl group, naphthalene-2,6-diyl group, and naphthalene-2,7-diyl group, biphenyl-4,4'-diyl group, biphenyl-3,4'-diyl group, and biphenyl group
• a biphenyldiyl group such as a -3,3'-diyl group is preferred.
• p-phenylene group p-phenylene group, m-phenylene group, naphthalene-1,4-diyl group, and biphenyl-4,4'-diyl group are preferred; ,4'-diyl group is more preferred, and p-phenylene group is even more preferred.
• diamine compound having a divalent group having a partial structure represented by formula (A2-1) described above include the following groups.
• the diamine compound used in the production of the polyimide resin precursor (A) is a divalent group represented by the above formula (A1-1) as Y A1 in formula (A2), or a divalent group represented by formula (A2-1). It is preferable to include the following diamine compound (A-3) or the following dimer diamine compound (A-4) together with a diamine compound having a divalent group having a partial structure represented by:
• the diamine compound (A-3) has a partial structure represented by the following formula (A3), and Y A1 in formula (A2) is a divalent group represented by the above formula (A1-1). , or a diamine compound that does not correspond to a diamine compound having a divalent group having a partial structure represented by formula (A2-1).
• R a5 and R a6 each independently represent an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom.
• ma6 and ma7 are each independently an integer of 0 or more and 4 or less.
• R a7 and R a8 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a halogenated alkyl group having 1 to 4 carbon atoms, or a phenyl group.
• R a7 and R a8 may be combined with each other to form a ring.
• the alkyl groups having 1 to 4 carbon atoms as R a5 and R a6 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec- Examples include butyl group and tert-butyl group. Among these alkyl groups, methyl group and ethyl group are preferred, and methyl group is more preferred.
• the alkoxy group having 1 to 4 carbon atoms as R a5 and R a6 includes methoxy group, ethoxy group, n-propyloxy group, isopropyloxy group, n-butyloxy group, isobutyloxy group. , sec-butyloxy group, and tert-butyloxy group. Among these alkoxy groups, methoxy group and ethoxy group are preferred, and methoxy group is more preferred.
• examples of the halogen atom as R a5 and R a6 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these halogen atoms, chlorine atoms and bromine atoms are preferred.
• ma6 and ma7 are each independently an integer from 0 to 4. Since the diamine compound (A-3) is easily available, ma6 and ma7 are each preferably an integer of 0 or more and 2 or less, and 0 is more preferable.
• the alkyl groups having 1 to 4 carbon atoms as R a7 and R a8 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec- Examples include butyl group and tert-butyl group.
• the halogenated alkyl group having 1 to 4 carbon atoms as R a7 and R a8 includes chloromethyl group, dichloromethyl group, trichloromethyl group, bromomethyl group, dibromomethyl group, tribromomethyl group.
• R a7 and R a8 in formula (A3) the solubility of the polyimide resin precursor (A) in an organic solvent is good, the diamine compound (A-3) is easily available, etc. From these, a hydrogen atom, a methyl group, an ethyl group, a trifluoromethyl group, and a phenyl group are preferred.
• R a7 and R a8 combine with each other to form a cycloalkylidene group having 5 to 8 carbon atoms, such as a cyclopentylidene group, a cyclohexylidene group, a cycloheptylidene group, and a cyclooctylidene group. It is also preferable to do so.
• Preferred specific examples of the partial structure represented by formula (A3) include the following structures.
• Examples of compounds suitable as the diamine compound (A-3) include compounds represented by the following formula (A3-1).
• X 3 and X 4 are each independently selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a halogen atom. is an aromatic hydrocarbon group optionally substituted with one or more groups.
• R a5 , R a6 , R a7 , R a8 , ma6, and ma7 are the same as those in formula (A3).
• X 3 and X 4 in formula (A3-1) are each independently selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a halogen atom. It is a divalent aromatic hydrocarbon group which may be substituted with one or more groups. Examples of the alkyl group having 1 to 4 carbon atoms as a substituent include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, and tert-butyl group. Can be mentioned.
• alkyl groups methyl group and ethyl group are preferred, and methyl group is more preferred.
• alkoxy group having 1 to 4 carbon atoms as a substituent include methoxy group, ethoxy group, n-propyloxy group, isopropyloxy group, n-butyloxy group, isobutyloxy group, sec-butyloxy group, and tert- A butyloxy group is mentioned.
• methoxy group and ethoxy group are preferred, and methoxy group is more preferred.
• the halogen atom as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these halogen atoms, chlorine atoms and bromine atoms are preferred.
• the number of carbon atoms in the aromatic hydrocarbon groups as X 3 and X 4 is not particularly limited as long as the number of carbon atoms in the diamine compound represented by formula (A3-1) is 40 or less. Note that the number of carbon atoms in the above-mentioned aromatic hydrocarbon group does not include the number of carbon atoms in the substituents.
• aromatic hydrocarbon group as X 3 and Naphthalenediyl groups such as diyl group, naphthalene-2,6-diyl group, and naphthalene-2,7-diyl group, biphenyl-4,4'-diyl group, biphenyl-3,4'-diyl group, and biphenyl- Biphenyldiyl groups such as 3,3'-diyl groups are preferred.
• p-phenylene group p-phenylene group, m-phenylene group, naphthalene-1,4-diyl group, and biphenyl-4,4'-diyl group are preferred; A 4'-diyl group is more preferred, and a p-phenylene group is even more preferred.
• diamine compound (A-3) represented by the formula (A3) described above include the following compounds.
• the diamine compound Since it is easy to obtain a polyimide resin precursor (A) that provides a polyimide resin with a low dielectric constant and a low dielectric loss tangent in a high frequency band, the diamine compound is used as Y A1 in the formula (A2) as shown in the formula (A1- Preferably, it contains a dimer diamine compound (A-4) together with a diamine compound having a divalent group represented by 1) or a divalent group having a partial structure represented by formula (A2-1).
• the dimer diamine compound (A-4) is a diamine compound in which two terminal carboxy groups of a dimer acid are substituted with an aminomethyl group or an amino group.
• Dimer acid is a known dibasic acid obtained by intermolecular polymerization reaction of unsaturated fatty acids.
• the industrial manufacturing process for producing dimer acids is largely standardized.
• a dimer acid is obtained by dimerizing an unsaturated fatty acid having 11 to 22 carbon atoms in the presence of a clay catalyst or the like.
• the upper limit of the number of carbon atoms in the dimer diamine compound (A-4) is 40.
• Industrially obtained dimer acids are mainly composed of dibasic acids having 36 carbon atoms obtained by dimerizing unsaturated fatty acids having 18 carbon atoms such as oleic acid, linoleic acid, and linolenic acid.
• dimer acids contain arbitrary amounts of monomer acids with 18 carbon atoms, trimer acids with 54 carbon atoms, and other polymerized fatty acids with 20 to 54 carbon atoms, depending on the degree of purification. , may contain.
• dimer diamine compound (A-4) a diamine compound represented by the following formula (31) is preferable. (31)
• e, f, g, and h are each integers of 0 or more. e+f is an integer of 6 or more and 17 or less, and g+h is 8 or more and 19 or less.
• the wavy line portion means a carbon-carbon single bond or a carbon-carbon double bond.
• the diamine compound represented by formula (31) is preferably a compound represented by formula (32) below. (32)
• diamine compounds represented by the formula (31) include Versamine 551 (manufactured by BASF) and Priamine 1074 (manufactured by Croda Japan), which include the compound represented by the following formula (33), and the diamine compound represented by the formula (33) below.
• Examples include Versamine 552 (manufactured by BASF), Priamine 1073 (manufactured by Croda Japan), and Priamine 1075 (manufactured by Croda Japan), which contain the compound represented by (32).
• Such a commercially available dimer diamine compound (A-4) is usually a mixture containing multiple types of amine compounds. (33)
• Y A1 in formula (A2) with respect to the total number of moles of the diamine compound has a divalent group represented by the above formula (A1-1) or a partial structure represented by formula (A2-1)
• the ratio of the number of moles of the diamine compound having a divalent group is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, particularly preferably 90 mol% or more, and 100 mol% Most preferred.
• Dicarboxylic acid which is a reaction product of tetracarboxylic dianhydride and alcohol
• Dicarboxylic acid is a reaction product of tetracarboxylic dianhydride and alcohol.
• the polyimide resin precursor (A) has an unsaturated group having 3 or more and 20 or less carbon atoms having a carbon-carbon double bond as the organic groups R A1 and R A2 in the above formula (1). have Therefore, the dicarboxylic acid includes a dicarboxylic acid having an unsaturated group having a carbon-carbon double bond and having 3 or more and 20 or less carbon atoms.
• Such a dicarboxylic acid can be obtained by reacting an alcohol having 3 to 20 carbon atoms and having a carbon-carbon double bond with a tetracarboxylic dianhydride.
• the photosensitive composition containing the polyimide resin precursor (A) has good photosensitivity, and the polyimide resin precursor (A) can be used to improve various mechanical properties and electrical properties.
• Polyimide resin with excellent properties can be formed.
• dicarboxylic acid means a dicarboxylic acid that is a reaction product of tetracarboxylic dianhydride and the above-mentioned alcohol. Tetracarboxylic dianhydride and alcohols will be explained below.
• the tetracarboxylic dianhydride is not particularly limited as long as the desired effect is not impaired.
• a tetracarboxylic dianhydride conventionally used in the production of polyamic acids and polyimide resins can be used.
• Examples of the tetracarboxylic dianhydride include a compound represented by the following formula (A3).
• X A1 is a tetravalent organic group having 6 or more and 40 or less carbon atoms.
• X A1 may have one or more substituents in addition to the two acid anhydride groups represented by -CO-O-CO- in formula (A3).
• substituents include a fluorine atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a fluorinated alkyl group having 1 to 6 carbon atoms, and a fluorinated alkyl group having 1 to 6 carbon atoms.
• a fluorinated alkoxy group of 1 or more and 6 or less is preferred.
• the compound represented by formula (A3) may contain a carboxy group or a carboxylic acid ester group in addition to the acid anhydride group.
• the substituent is a fluorinated alkyl group or a fluorinated alkoxy group, it is preferably a perfluoroalkyl group or a perfluoroalkoxy group.
• the same can be said of one or more substituents that the aromatic group described below may have on the aromatic ring.
• the number of carbon atoms constituting X A1 is preferably 8 or more, more preferably 12 or more. Further, the number of carbon atoms constituting X A1 is preferably 30 or less.
• X A1 may be an aliphatic group, an aromatic group, or a combination of these structures.
• X A1 may contain a halogen atom, an oxygen atom, a nitrogen atom, and a sulfur atom in addition to a carbon atom and a hydrogen atom.
• X A1 contains an oxygen atom, nitrogen atom, or sulfur atom
• the oxygen atom, nitrogen atom, or sulfur atom is a nitrogen-containing heterocyclic group
• the tetracarboxylic dianhydride represented by formula (A3) is an aliphatic tetracarboxylic dianhydride that has two dicarboxylic anhydride groups that bond to an aliphatic group, it does not bond to an aromatic group. It may also be an aromatic tetracarboxylic dianhydride having at least one dicarboxylic anhydride group. Note that the aromatic tetracarboxylic dianhydride preferably has two dicarboxylic anhydride groups bonded to the aromatic group.
• the aliphatic tetracarboxylic dianhydride may contain an alicyclic structure.
• the alicyclic structure may be polycyclic.
• Examples of aliphatic tetracarboxylic dianhydrides that do not have an alicyclic structure include 1,2,3,4-tetracarboxylic dianhydride (for example, Rikacid BT-100, manufactured by Shinnihon Chemical Co., Ltd.). Can be mentioned.
• Examples of the aliphatic tetracarboxylic dianhydride having an alicyclic structure include cyclobutanetetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, and cyclohexane-1,2,4 , 5-tetracarboxylic dianhydride, norbornane-2-spiro- ⁇ -cyclopentanone- ⁇ '-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride (e.g.
• aromatic tetracarboxylic dianhydride represented by formula (A3) and having two dicarboxylic anhydride groups bonded to an aromatic group examples include pyromellitic dianhydride, 1,4-bis(3 ,4-dicarboxyphenoxy)benzene dianhydride, 4,4'-oxydiphthalic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4' -Biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-diphenylsulfonetetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfide tetracarboxylic dianhydride, trimellitic acid (3,4-
• 2,2-bis[4-(3,4-dicarboxyphenyloxy)phenyl]propane dianhydride is preferred because it easily forms a cured product with excellent electrical properties.
• ⁇ , ⁇ -bis(3,4-dicarboxyphenylcarbonyloxy)alkane dianhydride is a compound represented by the following formula (a1).
• n in formula (a1) which is the number of carbon atoms of the linear alkylene group in ⁇ , ⁇ -bis(3,4-dicarboxyphenylcarbonyloxy)alkane dianhydride, is an integer of 1 or more; 20 or less is preferable, and 2 or more and 12 or less are more preferable.
• Preferred specific examples of ⁇ , ⁇ -bis(3,4-dicarboxyphenylcarbonyloxy)alkane dianhydride include 1,2-bis(3,4-dicarboxyphenylcarbonyloxy)ethane dianhydride (e.g.
• the composition containing the polyimide resin precursor (A) when the polyimide resin film formed using the composition containing the polyimide resin precursor (A) is suppressed from warping, and when the composition containing the polyimide resin precursor (A) is imparted with photosensitivity, the composition It is also preferable that the aromatic tetracarboxylic dianhydride is biphenyltetracarboxylic dianhydride, since the photolithography properties thereof are good.
• biphenyltetracarboxylic dianhydride examples include 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, and 2,2 ',3,3'-biphenyltetracarboxylic dianhydride may be mentioned, and 3,3',4,4'-biphenyltetracarboxylic dianhydride is preferred.
• the aromatic tetracarboxylic dianhydride may also be, for example, a compound represented by the following formulas (a3-2) to (a3-4).
• R a01 , R a02 and R a03 each represent an aliphatic group optionally substituted with halogen, an oxygen atom, a sulfur atom, one or more It is either an aromatic group via a divalent element, or a divalent group constituted by a combination thereof.
• R a02 and R a03 may be the same or different. That is, R a01 , R a02 and R a03 may contain a carbon-carbon single bond, a carbon-oxygen-carbon ether bond, or a halogen element (fluorine, chlorine, bromine, iodine).
• Examples of the compound represented by formula (a3-2) include 2,2-bis(3,4-dicarboxyphenoxy)propane dianhydride, bis(3,4-dicarboxyphenoxy)methane dianhydride, 1, 1-bis(3,4-dicarboxyphenoxy)ethane dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene, 2,2-bis(3,4-dicarboxyphenoxy)hexafluoropropane Examples thereof include dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, and the like.
• R a04 and R a05 are either an aliphatic group which may be substituted with halogen, an aromatic group via one or more divalent elements, or a halogen. , or a combination thereof.
• R a04 and R a05 may be the same or different.
• difluoropyromellitic dianhydride, dichloropyromellitic dianhydride, etc. can also be used.
• the polyimide resin precursor (A) has a radically polymerizable group-containing group on its molecular chain in addition to the residue derived from the alcohol described above. Therefore, the tetravalent organic group A 2 in formula (A3) may be a group represented by the following formulas (a3-5) to (a3-7).
• R a01 , R a02 , and R a03 in formulas (a3-5) to (a3-7) are the same as those in formula (a3-2), formula (a3-3), and formula (a3-4) described above. , R a01 , R a02 , and R a03 .
• R a06 is a radically polymerizable group-containing group. The radically polymerizable group-containing group will be described later.
• dicarboxylic acid is a reaction product of tetracarboxylic dianhydride and alcohol.
• the polyimide resin precursor (A) has carbon-carbon double bonds (ethylenic unsaturated double bonds) as the organic groups R A1 and R A2 in the above formula (1). It has an unsaturated group having 3 or more and 20 or less carbon atoms. Therefore, as part or all of the alcohols, alcohols having a carbon-carbon double bond and having 3 to 20 carbon atoms are used.
• Alcohol II an alcohol having 3 to 20 carbon atoms and having a carbon-carbon double bond will be referred to as Alcohol I.
• Alcohols other than Alcohol I are referred to as Alcohol II.
• the dicarboxylic acid has two carboxylic acid ester groups produced by a reaction between a carboxylic anhydride group and the above-mentioned alcohols.
• the ratio of the number of moles of the carboxylic acid ester groups derived from alcohol I to the total number of moles of the aforementioned carboxylic ester groups in the dicarboxylic acid is preferably 50 mol% or more, more preferably 80 mol% or more, and 90 mol%. The above is more preferable.
• Alcohol I-1 is preferred because it has a low dielectric loss tangent and can easily form a polyimide resin with excellent chemical resistance. Furthermore, alcohol I may include alcohol I-2 which does not fall under the following alcohols.
• Alcohol I-1 is an alcohol having a combination of a secondary hydroxyl group and an ethylenically unsaturated double bond, or a combination of a methylol group and an ethylenically unsaturated double bond.
• a methylol group is defined as a secondary carbon atom, a tertiary carbon atom, a carbon atom that is bonded to one carbon atom and one heteroatom, or a bond that is bonded to two heteroatoms.
• a hydroxymethyl group bonded to a carbon atom in an aromatic ring is defined as a hydroxymethyl group bonded to a carbon atom in an aromatic ring, or a carbon atom in an aromatic ring.
• a hydroxyethyl group consists of a hydroxymethyl group and a methylene group.
• the hydroxymethyl group bonded to the primary carbon atom in the methylene group, which is included in the hydroxyethyl group does not fall under the methylol group. .
• Alcohol I-1 When producing Alcohol I-1, a mixture containing Alcohol I-1 and Alcohol I-2 may inevitably be produced due to the production method.
• Alcohol I when producing alcohol I by reacting a polyol having a secondary hydroxyl group or a methylol group and a primary hydroxyl group with (meth)acrylic acid halide, allyl halide, etc., together with the primary hydroxyl group ( Alcohols having meth)acryloyl groups or allyl groups may be produced as by-products.
• a mixture containing alcohol I-1 and alcohol I-2 produced by such a method can be used as the alcohol to be reacted with the tetracarboxylic dianhydride.
• the ratio of the number of moles of alcohol I-1 to the total number of moles of alcohol I-1 and the number of moles of alcohol 1-II is not particularly limited.
• the ratio of the number of moles of alcohol I-1 to the total number of moles of alcohol I-1 and the number of moles of alcohol 1-II is preferably 50 mol% or more, more preferably 70 mol% or more, and 90 mol%. is more preferable, and 100 mol% is particularly preferable.
• alcohol I has an ethylenically unsaturated double bond.
• an alkenyl group-containing group including an alkenyl group such as a vinyl group and an allyl group is preferable, and a (meth)acryloyl group-containing group is more preferable.
• the dicarboxylic acid has a residue containing an ethylenically unsaturated double bond derived from alcohol I. Therefore, the polyimide resin precursor (A) also has a residue containing an ethylenically unsaturated double bond derived from alcohol I.
• Alcohol I-1 is an alcohol having a combination of a secondary hydroxyl group and an ethylenically unsaturated double bond, or a combination of a methylol group and an ethylenically unsaturated double bond.
• Alcohol I-1 may have a combination of two or more hydroxyl groups.
• Alcohol I-1 may have a combination of a secondary hydroxyl group and a methylol group.
• alcohol I-1 has one secondary hydroxyl group or one methylol group.
• alcohol I-1 has two or more ethylenically unsaturated double bonds
• alcohol I is preferably a (meth)acrylate such as glycerin, trimethylolpropane, pentaerythritol, or dipentaerythritol.
• Preferred specific examples of alcohol I-1 having two or more ethylenically unsaturated double bonds include glycerin-1,3-di(meth)acrylate, glycerin-1,2-di(meth)acrylate, trimethylol Propane di(meth)acrylate, pentaerythritol tri(meth)acrylate, and dipentaerythritol penta(meth)acrylate. These compounds may have a combination of an acryloyl group and a methacryloyl group.
• alcohol I When alcohol I-1 has one ethylenically unsaturated double bond, alcohol I is selected from a compound represented by the following formula (I) and a compound represented by the following formula (II). At least one type is preferred.
• CH CR 1 -CO-O-R 2 -CHR 3 -OH (I)
• CH CR 1 -CO-O-R 4 -CH 2 -OH (II)
• R 1 is a hydrogen atom or a methyl group.
• R 2 is a divalent organic group that is bonded to the oxygen atom in the ester bond via a C—O bond, and bonded to the carbon atom to which R 3 is bonded via a C—C bond.
• R 3 is a monovalent organic group that is bonded to the carbon atom to which R 3 is bonded through a C—C bond. R 2 and R 3 may be combined to form a ring.
• R 1 is a hydrogen atom or a methyl group.
• R 4 is a divalent organic group that is bonded to the oxygen atom in the ester bond via a C—O bond and bonded to the methylol group in formula (II) via a C—C bond.
• R 2 is a divalent organic group that is bonded to the oxygen atom in the ester bond via a C—O bond and bonded to the carbon atom to which R 3 is bonded via a C—C bond.
• the divalent organic group may be a group containing a halogen atom, and a heteroatom such as O, S, and N.
• the number of carbon atoms in the divalent organic group as R 2 in formula (I) is not particularly limited as long as the alcohol represented by formula (I) has 20 or less carbon atoms.
• the number of carbon atoms in the divalent organic group is, for example, preferably 1 or more and 12 or less, more preferably 1 or more and 8 or less.
• the divalent organic group as R 2 in formula (I) is preferably a divalent hydrocarbon group.
• the divalent hydrocarbon group may include a cyclic group.
• the cyclic group may be an aliphatic ring, an aromatic ring, or a condensed ring in which an aliphatic ring and an aromatic ring are condensed.
• the divalent hydrocarbon group as R 2 is preferably an alkylene group.
• Suitable examples of the alkylene group include a methylene group, an ethane-1,2-diyl group (ethylene group), an ethane-1,1-diyl group, a propane-1,3-diyl group, and a propane-1,2-diyl group. group, propane-1,1-diyl group, butane-1,4-diyl group, pentane-1,5-diyl group, hexane-1,6-diyl group, heptane-1,7-diyl group, and octane- A 1,8-diyl group is mentioned.
• methylene group ethane-1,2-diyl group (ethylene group), propane-1,3-diyl group, butane-1,4-diyl group, and pentane-1,5-diyl group are preferable. .
• R 3 is a monovalent organic group that is bonded to the carbon atom to which R 3 is bonded through a C—C bond.
• the monovalent organic group may be a group containing a halogen atom, and a heteroatom such as O, S, and N.
• the number of carbon atoms in the monovalent organic group as R 3 in formula (I) is not particularly limited as long as the alcohol represented by formula (I) has 20 or less carbon atoms.
• the number of carbon atoms in the monovalent organic group is preferably 1 or more and 12 or less, and more preferably 1 or more and 8 or less.
• the monovalent organic group as R 3 in formula (I) may be a chain aliphatic group, a cyclic group, or a group consisting of a chain aliphatic group and a cyclic group. There may be.
• the cyclic group may be an aliphatic ring, an aromatic ring, or a condensed ring in which an aliphatic ring and an aromatic ring are condensed.
• the monovalent organic group as R 3 in formula (I) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert- Alkyl groups such as butyl group, n-pentyl group, n-hexyl group, n-heptyl group, and n-octyl group; methoxymethyl group, ethoxymethyl group, n-propyloxymethyl group, n-butyloxymethyl group, 2-methoxyethyl group, 2-ethoxyethyl group, 2-n-propyloxyethyl group, 2-n-butyloxyethyl group, 3-methoxypropyl group, 3-ethoxypropyl group, 3-n-propyloxypropyl group , 3-n-butyloxypropyl group, 4-methoxybutyl group, 4-ethoxybutyl group
• the divalent group represented by -R 2 -CHR 3 - in formula (I) include the following groups.
• * is the terminal end of the bond bonding to the oxygen atom in the ester bond in formula (I).
• ** is the terminal end of the bond bonding to the hydroxyl group of formula (I).
• the divalent group includes a cyclic group.
• Such a cyclic group may be an aromatic group, an alicyclic group, or a condensed cyclic group in which an aromatic ring and an aliphatic ring are condensed.
• Preferred specific examples of the compound represented by formula (I) include the following compounds.
• R 4 is a divalent organic group that is bonded to the oxygen atom in the ester bond via a C-O bond and bonded to the methylol group in formula (II) via a C-C bond.
• the divalent organic group may be a group containing a halogen atom and a heteroatom such as O, S, and N.
• the number of carbon atoms in the divalent organic group as R 4 in formula (II) is not particularly limited as long as the alcohol represented by formula (II) has 20 or less carbon atoms.
• the number of carbon atoms in the divalent organic group is preferably 1 or more and 12 or less, and more preferably 1 or more and 8 or less.
• the divalent organic group as R 4 in formula (II) may be a chain aliphatic group, a cyclic group, or a group consisting of a chain aliphatic group and a cyclic group. There may be.
• the cyclic group may be an aliphatic ring, an aromatic ring, or a condensed ring in which an aliphatic ring and an aromatic ring are condensed.
• Preferred specific examples of the divalent group represented by R 4 in formula (II) include the following groups.
• * is the end of the bond bonding to the oxygen atom in the ester bond in formula (II).
• ** is the terminal end of the bond bonding to the methylol group of formula (II).
• Preferred specific examples of the compound represented by formula (II) include the following compounds.
• Alcohol I-2 is an alcohol having 3 to 20 carbon atoms and having a carbon-carbon double bond (ethylenic unsaturated double bond), and is an alcohol that does not fall under Alcohol I-1.
• Alcohol I-2 has an ethylenically unsaturated double bond-containing group.
• the ethylenically unsaturated double bond-containing group an alkenyl group-containing group including an alkenyl group such as a vinyl group and an allyl group is preferable, and a (meth)acryloyl group-containing group is more preferable.
• alcohols having ethylenically unsaturated double bond-containing groups as alcohol I-2 include mono(meth)acrylates of diols, N-hydroxyalkyl-substituted (meth)acrylamides, and unsaturated ketones containing hydroxyl groups. , alkenyl alcohol, and monoalkenyl ether of diols having an alkenyl group having 3 or more carbon atoms. However, these alcohols do not have a secondary hydroxyl group or a methylol group.
• Diols that give mono(meth)acrylates of diols include alkanediols (alkylene glycols) such as ethylene glycol, 1,2-propanediol, and 1,3-propanediol; diethylene glycol, dipropylene glycol, and triethylene glycol. and oligo- or polyalkylene glycols such as tripropylene glycol; and cycloalkanediols such as 1,4-cyclohexanediol, 1,3-cyclohexanediol, and 1,2-cyclohexanediol. Diols that provide mono(meth)acrylates of diols are not limited to these.
• the number of carbon atoms in the alkanediol is preferably 2 or more and 10 or less, more preferably 2 or more and 6 or less, and more preferably 2 or more and 4 or less.
• the number of carbon atoms in the oligo or polyalkylene glycol is preferably 4 or more and 20 or less, more preferably 4 or more and 10 or less.
• the number of carbon atoms in the cycloalkanediol is preferably 4 or more and 8 or less, more preferably 5 or more and 7 or less.
• the alkanediols and oligo- or polyalkylene glycols may be linear or branched.
• the number of carbon atoms in the N-hydroxyalkyl group of the N-hydroxyalkyl-substituted (meth)acrylamide is preferably 2 or more and 10 or less, more preferably 2 or more and 6 or less, and even more preferably 2 or more and 4 or less.
• the N-hydroxyalkyl group possessed by the N-hydroxyalkyl-substituted (meth)acrylamide may be linear or branched.
• the hydroxyl group-containing unsaturated ketone is preferably a compound in which a hydroxyalkyl group and an alkenyl group are bonded to a carbonyl group.
• the number of carbon atoms in the hydroxyalkyl group is preferably 2 or more and 10 or less, more preferably 2 or more and 6 or less, and even more preferably 2 or more and 4 or less.
• the hydroxyalkyl group may be linear or branched.
• a hydroxyalkyl group does not have a secondary hydroxyl group or a methylol group.
• the number of carbon atoms in the alkenyl group is preferably 2 or more and 10 or less, more preferably 2 or more and 6 or less, and even more preferably 2 or more and 4 or less.
• the alkenyl group may be linear or branched.
• the number of carbon atoms in the alkenyl alcohol is preferably 3 or more and 10 or less, more preferably 3 or more and 6 or less, and even more preferably 3 or 4.
• the alkenyl alcohol may be linear or branched. Alkenyl alcohols do not have secondary hydroxyl groups or methylol groups.
• the diols that give the monoalkenyl ether of the diols are the same as the diols that give the mono(meth)acrylate of the diols.
• the number of carbon atoms in the alkenyl group is 3 or more, preferably 3 or more and 10 or less, and more preferably 3 or more and 6 or less.
• the alkenyl group may be linear or branched.
• alcohol II having a radically polymerizable group examples include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 5-hydroxypentyl (meth)acrylate.
• 6-hydroxyhexyl (meth)acrylate, and mono(meth)acrylate of diols such as 2-(2-hydroxyethoxy)ethyl (meth)acrylate; N-(2-hydroxyethyl)(meth)acrylamide, N- Examples include N-hydroxyalkyl-substituted (meth)acrylamides such as (3-hydroxypropyl)(meth)acrylamide; hydroxyl group-containing ketones such as (hydroxymethyl)vinyl ketone and (2-hydroxyethyl)vinyl ketone.
• Alcohol II is an alcohol that does not fall under Alcohol I.
• the structure of alcohol II is not particularly limited as long as the desired effect is not impaired.
• alcohol II examples include alkane monools such as methanol, ethanol, n-propanol, isopropanol, n-butanol, n-pentanol, and n-hexanol; phenol, p-cresol, m-cresol, o-cresol, Phenols or naphthols such as ⁇ -naphthol and ⁇ -naphthol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, 1,3-propanediol monomethyl ether, 1,3 - Monoethers of glycols such as propanediol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, and dipropylene glycol monoethyl ether; alcohols having radically poly
• a dicarboxylic acid can be obtained by reacting the above-described tetracarboxylic dianhydride with an alcohol. Alcohol rules react with carboxylic acid anhydride groups to generate carboxy groups and ester groups.
• a dicarboxylic acid can be obtained by reacting the aforementioned tetracarboxylic dianhydride with an alcohol represented by R a21 -OH.
• R a21 is a residue obtained by removing the hydroxyl group from the above-mentioned alcohol.
• Such a dicarboxylic acid has two pairs of a carboxy group and a group represented by -CO-O-R a21 located on adjacent carbon atoms in the dicarboxylic acid.
• the above dicarboxylic acid having two pairs of a carboxy group and a group represented by -CO-O-R a21 has the position of the carboxy group and the group represented by -CO-O-R a21 . Isomers differing in position may exist.
• one type of such isomers may be used alone, or two or more types may be used in combination.
• the specification and claims of the present application allow the polyimide resin precursor to contain multiple types of structural units derived from multiple isomers of dicarboxylic acids.
• the dicarboxylic acid corresponding to pyromellitic dianhydride there are two isomers: a compound represented by the following formula (a4-a1) and a compound represented by the following formula (a4-a2). do.
• the dicarboxylic acid corresponding to 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride as isomers, the compound represented by the following formula (a4-b1) and the following formula (a4 -b2) and a compound represented by the following formula (a4-b3) exist.
• R a21 is as described above.
• the dicarboxylic acids corresponding to the tetracarboxylic dianhydrides represented by the above formulas (a3-2) to (a3-4) include the following formulas (a4-2a) to (a4-2c), the formula ( Examples include compounds represented by formulas a4-3a) to (a4-3c) and formulas (a4-4a) to (a4-4c).
• formulas (a4-2a) to (a4-2c) formulas (a4-3a) to (a4-3c), and formulas (a4-4a) to (a4-4c)
• R a01 to R a05 are , are similar to those in formulas (a3-2) to (a3-4).
• formulas (a4-2a) to (a4-2c) formulas (a4-3a) to (a4-3c), and formulas (a4-4a) to (a4-4c)
• R a21 is the aforementioned That's right.
• the dicarboxylic acids corresponding to the tetracarboxylic dianhydrides represented by the above formulas (a3-5) to (a3-7) include the following formulas (a4-5a) to (a4-5c), and the formula ( Examples include compounds represented by formulas a4-6a) to (a4-6c), formula (a4-7a), and formula (a4-7b).
• formula (a4-5a) to formula (a4-5c) formula (a4-6a) to formula (a4-6c), formula (a4-7a), formula (a4-7b)
• R a01 to R a03 , R a06 , m1, and m2 are the same as those in formulas (a3-5) to (a3-7).
• R a21 is the aforementioned That's right.
• the reaction between tetracarboxylic dianhydride and alcohol is usually carried out in an organic solvent.
• the organic solvent used for the reaction of tetracarboxylic dianhydride and alcohol is an organic solvent that can dissolve tetracarboxylic dianhydride and alcohol and does not react with tetracarboxylic dianhydride and alcohol. If so, there are no particular limitations. Organic solvents can be used alone or in combination of two or more.
• organic solvents used for the reaction of tetracarboxylic dianhydride and alcohols include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, N , N-dimethylacetamide, N,N-dimethylpropionamide, N,N-dimethylisobutyramide, N,N-diethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylisobutyric acid amide , methoxy-N,N-dimethylpropionamide, butoxy-N,N-dimethylpropionamide, N-methylcaprolactam, N,N'-dimethylpropyleneurea, N,N,N',N'-tetramethylurea, and Nitrogen-containing polar solvents such as pyridine; dimethyl sulfoxide; sulfolane; lactones such as
• organic solvents are N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, N-methylcaprolactam, and A nitrogen-containing polar solvent such as N,N,N',N'-tetramethylurea is preferred.
• the temperature at which the tetracarboxylic dianhydride and alcohol are reacted is not particularly limited as long as the reaction proceeds well.
• the reaction temperature between the tetracarboxylic dianhydride and the alcohol is preferably -5°C or higher and 120°C or lower, more preferably 0°C or higher and 80°C or lower, particularly preferably 0°C or higher and 50°C or lower.
• the time for reacting the tetracarboxylic dianhydride and the alcohol varies depending on the reaction temperature, but typically, it is preferably 30 minutes or more and 20 hours or less, more preferably 1 hour or more and 8 hours or less, and 2 hours. It is particularly preferable that the heating time be 6 hours or less.
• a small amount of polymerization inhibitor may be used for the purpose of preventing crosslinking between ethylenically unsaturated double bonds during the reaction between the tetracarboxylic dianhydride and the alcohol.
• the polymerization inhibitor include phenols such as hydroquinone, 4-methoxyphenol, tert-butylpyrocatechol, and bis-tert-butylhydroxytoluene, and phenothiazine.
• the amount of the polymerization inhibitor used is, for example, preferably 0.01 mol% or more and 5 mol% or less based on the number of moles of ethylenically unsaturated double bonds.
• the reaction between tetracarboxylic dianhydride and alcohol is carried out in the presence of an organic base such as pyridine, triethylamine, diisopropylethylamine, 4-dimethylaminopyridine, and 1,4-azabicyclo[2,2,2]octane. You may go.
• organic bases such as pyridine, triethylamine, diisopropylethylamine, 4-dimethylaminopyridine, and 1,4-azabicyclo[2,2,2]octane. You may go.
• organic base such as pyridine, triethylamine, diisopropylethylamine, 4-dimethylaminopyridine, and 1,4-azabicyclo[2,2,2]octane. You may go.
• These bases may be used alone or in combination of two or more.
• the amount of alcohol used is preferably 1.8 mol or more and 2.2 mol or less, more preferably 2 mol or more and 2.1 mol or less, per 1 mol of tetracarboxylic dianhydride.
• dicarboxylic acids In the production of dicarboxylic acids, depending on the production conditions, only one dicarboxylic anhydride group may react with an alcohol, resulting in the production of a monocarboxylic acid compound having a dicarboxylic anhydride group, or a tetracarboxylic dianhydride group. By reacting with water in the reaction system, a portion of the reaction system may generate tetracarboxylic acid compounds and tricarboxylic acid compounds. As long as the desired effect is not impaired, a dicarboxylic acid containing at least one selected from the above monocarboxylic acid compounds, tricarboxylic acid compounds, and tetracarboxylic acid compounds can be used in the production of the polyimide resin precursor. .
• the dicarboxylic acid contains at least one selected from the above monocarboxylic acid compounds, tricarboxylic acid compounds, and tetracarboxylic acid compounds as impurities, the above monocarboxylic acid compounds and tricarboxylic acid compounds as impurities in the dicarboxylic acid.
• the content of at least one selected from acid compounds and tetracarboxylic acid compounds is preferably 30% by mass or less, more preferably 10% by mass or less, and 5% by mass or less based on the mass of dicarboxylic acid including the mass of impurities. % or less is more preferable, and 1 mass % or less is particularly preferable.
• the method for producing the polyimide resin precursor (A) includes mixing the diamine compound and dicarboxylic acid together until the weight average molecular weight of the polyimide resin precursor (A) increases to a desired level.
• a preferred method includes a method of condensing the diamine compound and dicarboxylic acid in the presence of a condensing agent. If necessary, it is also preferable to use a condensation aid together with the condensation agent.
• the condensing agent and condensing aid are not particularly limited as long as they are compounds conventionally used for the condensation of dicarboxylic acids and diamine compounds.
• Preferred condensing agents include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide, diisopropylcarbodiimide, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 1-cyclohexyl -3-(2-morpholinoethyl)-carbodiimide methotoluenesulfonate, 1,3-bis(2,2-dimethyl-1,3-dioxolan-4-ylmethyl)carbodiimide, polymer-supported 1-benzyl-3 -cyclohexylcarbodiimide, and polymer-supported 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide.
• the amount of the condensing agent used is not particularly limited as long as a polyimide resin precursor (A) having a desired molecular weight can be obtained.
• the amount of the condensing agent used is typically preferably 1 mol or more and 5 mols or less, more preferably 2 mols or more and 4 mols or less, and even more preferably 2 mols or more and 3 mols or less, per 1 mol of dicarboxylic acid.
• the ratio between the amount of dicarboxylic acid and the amount of diamine compound when producing the polyimide resin precursor (A) is not particularly limited as long as the polyimide resin precursor (A) having a desired molecular weight can be produced.
• the raw material ratio expressed by (number of moles of dicarboxylic acid)/(number of moles of diamine compound) is preferably 0.5/1 to 0.95/ 1, more preferably within the range of 0.55/1 to 0.80/1.
• the raw material ratio expressed by (number of moles of diamine compound)/(number of moles of dicarboxylic acid) is preferably 0.5/1 to 0.95/ 1, more preferably within the range of 0.55/1 to 0.80/1.
• a dicarboxylic acid and a diamine compound are mixed in an organic solvent in the presence of the above-mentioned condensing agent at, for example, -20°C or more and 150°C or less, preferably 0°C or more and 50°C or less, for 30 minutes.
• the reaction is allowed to occur for at least 24 hours, preferably for at least 1 hour and at most 10 hours, more preferably for at least 1 hour and at most 4 hours.
• the solvent used in the polycondensation the above-mentioned solvents that can be used in the reaction between tetracarboxylic dianhydride and alcohol can be used.
• the amount of the solvent used is preferably 50 parts by mass or more and 10,000 parts by mass or less, more preferably 100 parts by mass or more and 2,000 parts by mass or less, based on the total of 100 parts by mass of the dicarboxylic acid and the diamine compound. It is preferably 150 parts by mass or more and 1,000 parts by mass or less.
• the amount of dicarboxylic acid and diamine compound used when producing the polyimide resin precursor (A) is not particularly limited, but the diamine compound should be used from 0.8 mol to 1.2 mol per mol of dicarboxylic acid. is preferred, more preferably 0.9 mol or more and 1.1 mol or less, particularly preferably 0.95 mol or more and 1.05 mol or less.
• the polyimide resin precursor (A) preferably has 2 to 50 carbon atoms, more preferably carbon It is preferable to include a divalent aliphatic hydrocarbon group having 3 or more atoms and 40 or less atoms.
• the position of the divalent aliphatic hydrocarbon group in the molecular chain of the polyimide resin precursor (A) is not particularly limited. Examples of monomers that provide a divalent aliphatic hydrocarbon group having 2 to 50 carbon atoms in the molecular chain include the above-mentioned dimer diamine compound (A-4) and the above-mentioned ⁇ , ⁇ -bis( Examples include 3,4-dicarboxyphenylcarbonyloxy)alkane dianhydride.
• the weight average molecular weight of the polyimide resin precursor (A) may be appropriately set according to its use.
• the weight average molecular weight of the polyimide resin precursor (A) can be measured as a weight average molecular weight in terms of polystyrene by GPC (gel permeation chromatography).
• the weight average molecular weight of the polyimide resin precursor (A) is, for example, 5,000 or more in terms of polystyrene, preferably 15,000 or more, and 250,000,000 from the viewpoint of obtaining a resin film with good mechanical properties. The above is more preferable.
• the weight average molecular weight of the obtained polyimide resin precursor (A) is, for example, 100,000 or less, preferably 80,000 or less, and 50,000 or less in terms of the polystyrene, from the viewpoint of solubility in organic solvents. The following are more preferable.
• This weight average molecular weight may be set to the above value by adjusting the blending amounts of the dicarboxylic acid and diamine compound described above, and reaction conditions such as the solvent and reaction temperature.
• the main chain end of the polyimide resin precursor (A) may be capped with a terminal capping agent.
• the terminal capping agent include monoamines, acid anhydrides, monocarboxylic acids, monoacid halides, and monoactive ester compounds.
• the monoamine used for end-capping known compounds can be used.
• monoamines examples include aromatic monoamines such as aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 3-hydroxyaniline, 4-hydroxyaniline, 3-aminothiophenol, and 4-aminothiophenol.
• aromatic monoamines such as aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 3-hydroxyaniline, 4-hydroxyaniline, 3-aminothiophenol, and 4-aminothiophenol.
• aliphatic monoamines which may have a branched structure having 3 to 20 carbon atoms such as hexylamine and octylamine
• monoamines having an alicyclic structure such as cyclohexylamine, trimethoxyaminopropylsilane
• Examples include aminosilanes such as triethoxyaminopropylsilane.
• acid anhydrides are preferred.
• acid anhydride known acid anhydrides and derivatives thereof can be used.
• phthalic anhydride tetrahydrophthalic anhydride, hexahydrophthalic anhydride, xo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, succinic anhydride, maleic anhydride, nadic acid anhydride. and derivatives thereof.
• the introduction rate of the terminal capping agent in the polyimide resin precursor (A) is preferably 40 mol% or less, based on the number of moles of all monomers, from the viewpoint of excellent mechanical properties of the polyimide resin film formed, and 20 mol % or less, more preferably 10 mol% or less.
• the polyimide resin precursor (A) produced as described above is used in the production of a polyimide resin in the form of a solution or suspension, or after being separated and recovered from the reaction solution by a well-known method.
• a polyimide resin is obtained by imidizing the aforementioned polyimide resin precursor (A).
• the polyimide resin exhibits a low dielectric loss tangent in a high frequency band and has excellent chemical resistance.
• the method of imidizing the polyimide resin precursor (A) is not particularly limited. Imidization may be performed by heating or using an imidization agent.
• heating may be performed on a solution or suspension of the polyimide resin precursor (A), or may be performed on a solid polyimide resin precursor (A). good.
• the heating conditions for imidization are not particularly limited as long as the polyimide resin precursor (A) does not decompose and imidization proceeds satisfactorily.
• the heating temperature is preferably 80°C or more and 220°C or less, more preferably 100°C or more and 200°C or less, and 120°C or more and 180°C or less. is particularly preferred.
• the heating temperature is typically preferably 180°C or more and 400°C or less, more preferably 200°C or more and 350°C or less.
• the heating time depends on the heating temperature, typically, it is preferably 1 hour or more and 24 hours or less, and more preferably 2 hours or more and 12 hours or less.
• the imidizing agent When imidizing the polyimide resin precursor (A) with an imidizing agent, the imidizing agent is usually added to a solution or suspension of the polyimide resin precursor (A) to perform imidization.
• the organic solvent that can be used when imidizing with an imidizing agent for example, the same organic solvent as the organic solvent that can be used for preparing the polyimide resin precursor (A) can be used.
• the concentration of the polyimide resin precursor (A) in the solution or suspension of the polyimide resin precursor (A) is not particularly limited.
• the concentration of the polyimide resin precursor (A) in the solution or suspension of the polyimide resin precursor (A) is preferably 5% by mass or more and 50% by mass or less, and 10% by mass or more and 30% by mass or less. More preferred.
• the amount of imidizing agent used is not particularly limited. The amount of the imidizing agent to be used is selected depending on the type of the imidizing agent so that the polyimide resin precursor (A) is imidized to a desired degree.
• the reaction temperature when imidizing with an imidizing agent is not particularly limited. The reaction temperature is, for example, preferably 0°C or higher and 100°C or lower, more preferably 5°C or higher and 50°C or lower.
• the time for the imidization reaction when an imidization agent is used is not particularly limited.
• the imidization reaction is preferably carried out for 30 minutes or more and about 24 hours, more preferably 1 hour or more and 12 hours or less, and 2 hours or more and 6 hours or less, depending on the type of imidization agent. is even more preferable.
• Imidizing agents include acetic anhydride, propionic anhydride, benzoic anhydride, trifluoroacetic anhydride, acetyl chloride, tosyl chloride, mesyl chloride, ethyl chloroformate, triphenylphosphine and dibenzimidazolyl disulfide, dicyclohexylcarbodiimide, carbodiimidazole, Dehydrating agents such as 2-ethoxy-1-ethoxycarbonyl-1,2-dihydroquinoline and oxalic acid N,N'-disuccinimidyl ester, pyridine, picoline, 2,6-lutidine, collidine, triethylamine, N- Methylmorpholine, 4-N,N'-dimethylaminopyridine, isoquinoline, triethylamine, 1,4-diazabicyclo[2.2.2]octane, and 1,8-diazabicyclo[5.4.0
• the photosensitive resin composition may contain a monomer compound (B) having a radically polymerizable group.
• a monomer compound having an ethylenically unsaturated double bond as a radically polymerizable group is preferably used.
• Such monomer compound (B) may be a monofunctional monomer compound or a polyfunctional monomer compound, and a polyfunctional monomer compound is preferable.
• Examples of monofunctional monomer compounds include (meth)acrylamide, methylol (meth)acrylamide, methoxymethyl (meth)acrylamide, ethoxymethyl (meth)acrylamide, propoxymethyl (meth)acrylamide, butoxymethoxymethyl (meth)acrylamide, N - Methylol (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2 -Acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamide sulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2 -
• Polyfunctional monomer compounds include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and propylene glycol.
• urethane (meth)acrylates described in Japanese Patent Publication No. 48-41708, Japanese Patent Publication No. 50-6034, and Japanese Patent Publication No. 51-37193; Polyester (meth)acrylates described in JP-A-43191 and Japanese Patent Publication No. 52-30490; Epoxy (meth)acrylates which are reaction products of epoxy resin and (meth)acrylic acid; JP-A-2008- Compounds described in paragraphs [0254] to [0257] of Publication No.
• polyfunctional (meth) obtained by reacting a polyfunctional carboxylic acid with a compound having an epoxy group such as glycidyl (meth)acrylate and an ethylenically unsaturated group; ) Acrylate; a compound having a fluorene ring and two or more groups having an ethylenically unsaturated bond, described in JP-A No. 2010-160418, JP-A No. 2010-129825, and Patent No. 4364216, etc. and cardo resin; unsaturated compounds described in Japanese Patent Publication No. 46-43946, Japanese Patent Publication No. 1-40337, and Japanese Patent Publication No. 1-40336; vinylphosphonic acid compounds described in Japanese Patent Publication No.
• polyfunctional monomer compounds having trifunctionality or more are preferred since they tend to increase the adhesion of the polyimide resin film to the substrate and the strength of the polyimide resin film.
• a polyfunctional monomer compound having four or more functionalities is more preferable, and a polyfunctional monomer compound having five or more functionalities is even more preferable.
• the content of the monomer compound (B) in the photosensitive resin composition is not particularly limited as long as it does not impede the purpose of the present invention.
• the content of the monomer compound (B) in the photosensitive resin composition is 0.1 part by mass or more when the mass of the photosensitive resin composition excluding the mass of the organic solvent (S) described below is 100 parts by mass. It is preferably 50 parts by mass or less, more preferably 0.5 parts by mass or more and 40 parts by mass or less, and particularly preferably 1 part by mass or more and 25 parts by mass or less.
• the radical photopolymerization initiator (C) is not particularly limited, and conventionally known photopolymerization initiators can be used.
• the photoradical polymerization initiator (C) includes 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl ]-2-hydroxy-2-methyl-1-propan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-hydroxy-1- ⁇ 4-[ 4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl ⁇ -2-methyl-propan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one , 2,2-dimethoxy-1,2-diphenylethan-1-one, bis(4-dimethylaminophenyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinopheny
• oxime ester compounds are preferred from the viewpoint of sensitivity of the photosensitive resin composition.
• a compound having a partial structure represented by the following formula (c1) is preferable.
• n1 is 0 or 1.
• R c2 is a monovalent organic group.
• R c3 is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, or an aryl group which may have a substituent. * is a bond.
• the content of the radical photopolymerization initiator (C) in the photosensitive resin composition is not particularly limited as long as the photosensitive resin composition has desired photolithographic properties.
• the content of the photoradical polymerization initiator (C) in the tree photosensitive resin composition is typically 100 parts by mass in total of the mass of the polyimide resin precursor (A) and the mass of the monomer compound (B). On the other hand, it is preferably 0.01 parts by mass or more and 20 parts by mass or less, more preferably 0.1 parts by mass or more and 15 parts by mass or less, and even more preferably 1 part by mass or more and 10 parts by mass or less.
• the photosensitive resin composition may contain a thiol compound (D). This makes it easy to form a polyimide resin with excellent elongation and tensile strength using the photosensitive resin composition.
• the number of mercapto groups that the thiol compound (D) has is not particularly limited. The number of mercapto groups that the thiol compound (D) has is preferably 2 or more, more preferably 2 or more and 10 or less, and even more preferably 2 or more and 6 or less.
• compounds having two or more mercapto groups include 1,2-benzenedithiol, 1,3-benzenedithiol, 1,4-benzenedithiol, 1,2-bis(mercaptomethyl)benzene, and 1,3-benzenedithiol.
• thiol compound (D) having two or more mercapto groups polyols having two or more hydroxyl groups may be used because they are easy to obtain or synthesize, and from the viewpoint of dissolution stability in the curable composition.
• Mercaptoalkanoates are preferred.
• the mercaptoalkanoate of a polyol having two or more hydroxyl groups may have hydroxyl groups, but preferably does not have hydroxyl groups.
• the number of carbon atoms in the mercaptoalkanoic acid that provides the mercaptoalkanoate is not particularly limited, but is preferably 2 or more and 6 or less, and preferably 3 or 4.
• Specific examples of mercaptoalkanoic acids that give mercaptoalkanoates include thioglycolic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 2-mercaptobutanoic acid, 3-mercaptobutanoic acid, 4-mercaptobutanoic acid, 2-mercaptobutanoic acid, and 2-mercaptobutanoic acid.
• Examples include mercaptopentanoic acid, 3-mercaptopentanoic acid, 4-mercaptopentanoic acid, 5-mercaptopentanoic acid, 2-mercaptohexanoic acid, 3-mercaptohexanoic acid, 4-mercaptohexanoic acid, and 5-mercaptohexanoic acid.
• 2-mercaptopropionic acid and 3-mercaptobutanoic acid are preferred.
• the polyol providing the mercaptoalkanoate may contain aromatic groups.
• Polyols that do not contain aromatic groups include ethylene glycol, 1,3-propanediol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, and 1,7-heptanediol.
• Aromatic polyols include benzenediol such as hydroquinone, resorcinol, and catechol; benzenetriol such as phloroglucinol, pyrogallol, and 1,2,4-benzenediol; 1,2-naphthalenediol, 1,3-naphthalenediol , 1,4-naphthalene diol, 1,5-naphthalene diol, 1,6-naphthalene diol, 1,7-naphthalene diol, 1,5-naphthalene diol, 2,3-naphthalene diol, 2,6-naphthalene diol, and naphthalene diols such as 2,7-naphthalene diol; 1,4,5-naphthalene triol, 1,2,4-naphthalene triol, 1,3,8-naphthalene triol, and 1,2,7-naphthalene triol; Naphthalene triol; bisphenols such as
• Examples of the mercaptoalkanoates of the polyols described above include 1,4-butanediol di(2-mercaptopropionate), 1,4-butanediol di(3-mercaptobutanoate), and trimethylolethane tri(2-mercaptopropionate).
• the amount of the thiol compound (D) used is not particularly limited as long as it does not impede the purpose of the present invention.
• the amount of the thiol compound (D) used is preferably 0.1 parts by mass or more and 30 parts by mass or less, based on the total of 100 parts by mass of the polyimide resin precursor (A) and the monomer compound (B). More preferably 0.2 parts by mass or more and 20 parts by mass or less, further preferably 0.5 parts by mass or more and 15 parts by mass or less, particularly preferably 1 part by mass or more and 12 parts by mass or less.
• the photosensitive resin composition contains an organic solvent (S).
• the organic solvent (S) includes a urea solvent (S1).
• the ratio of the mass of the urea solvent (S1) to the mass of the organic solvent (S) is 50% by mass or more.
• the ratio of the mass of the urea solvent (S1) to the mass of the organic solvent (S) is 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. , 90% by mass or more is particularly preferred, and 100% by mass is most preferred.
• the content of the urea solvent (S1) is preferably 90 parts by mass or more, more preferably 150 parts by mass or more, even more preferably 200 parts by mass or more, and 250 parts by mass with respect to 100 parts by mass of the polyimide resin precursor (A). Parts or more are particularly preferred. Further, the content of the urea solvent (S1) is preferably 3,000 parts by mass or less, more preferably 2,000 parts by mass or less, and 1,500 parts by mass or less with respect to 100 parts by mass of the polyimide resin precursor (A). Parts below are particularly preferred.
• the urea solvent (S1) is not particularly limited as long as it is a compound containing a bond represented by >N-CO-N ⁇ .
• the urea-based solvent (S1) may be, for example, a cyclic nitrogen-containing compound such as 1,3-dimethyl-2-imidazolidinone and N,N'-dimethylpropylene urea.
• a compound represented by the following formula (S1) is preferable. R s1 R s2 N-CO-NR s3 R s4 ...(S1)
• R s1 to R s4 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. At least one of R s1 to R s4 is an alkyl group. Preferably, all of R s1 to R s4 are alkyl groups. R s1 or R s2 and R s3 or R s4 may be combined to form a ring.
• urea solvent (S1) N,N,N',N'-tetramethylurea, N,N,N',N'-tetraethylurea, N,N,N',N'-tetrabutylurea, One or more selected from the group consisting of 1,3-dimethyl-2-imidazolidinone and N,N'-dimethylpropylene urea is preferred.
• the organic solvent (S) may contain an organic solvent other than the urea solvent together with the urea solvent (S1).
• organic solvents include N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylformamide, N- Methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, hexamethylphosphoramide, N,N-dimethylisobutyric acid amide, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropion Nitrogen-containing polar solvents such as amide, N,N-dimethylpropionamide, N,N-dimethylisobutyramide; acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, diisobutyl ketone, cyclopentanone, cyclohexanone, and Ketones such as isophorone; ⁇ -
• Examples include cyclic ethers; cyclic esters such as ethylene carbonate and propylene carbonate; aromatic solvents such as anisole, toluene, and xylene; aliphatic hydrocarbons such as limonene; and sulfoxides such as dimethyl sulfoxide.
• the amount of the organic solvent (S) to be used is not particularly limited as long as the ratio of the mass of the urea solvent (S1) to the mass of the organic solvent (S) is 50% by mass or more.
• the photosensitive resin composition may be in the form of a suspension or a solution, and is preferably a solution. Because the photosensitive resin composition has particularly good stability during storage and because it is easy to form a polyimide resin film with a desired thickness, the photosensitive resin composition has a The mass ratio of the components other than the organic solvent (S) contained is preferably 50% by mass or less, more preferably 5% by mass or more and 50% by mass or less, further preferably 15% by mass or more and 45% by mass or less, and 20% by mass. The most preferable amount is 40% by mass or less.
• the photosensitive resin composition may contain various additives other than the components described above, if necessary.
• Additives include colorants, dispersants, sensitizers, adhesion promoters, polymerization inhibitors, antioxidants, ultraviolet absorbers, anti-aggregation agents, antifoaming agents, surfactants, imidization promoters, and adhesion promoters.
• Examples of the improver include nitrogen-containing heterocyclic compounds and silane coupling agents.
• the photosensitive resin composition may contain various fillers or reinforcing materials as necessary.
• sensitizer known compounds can be used.
• the sensitizer include bis(dimethylamino)benzophenone, bis(diethylamino)benzophenone, diethylthioxanthone, N-phenyldiethanolamine, N-phenylglycine, 7-diethylamino-3-benzoylcoumarin, 7-diethylamino-4-methyl Coumarin, N-phenylmorpholine, and derivatives thereof.
• polymerization inhibitor known compounds can be used.
• the polymerization inhibitor include compounds having a phenolic hydroxyl group, nitroso compounds, N-oxide compounds, quinone compounds, N-oxyl compounds, and phenothiazine compounds.
• the polymerization inhibitors include Irganox1010, Irganox1035, Irganox1098, Irganox1135, Irganox245, Irganox259, Irganox3114, (all manufactured by BASF Japan), 2,6-di-tert-butyl- p-cresol, and 4-methoxyphenol is preferred, and Irganox 1010, 2,6-di-tert-butyl-p-cresol, and 4-methoxyphenol are more preferred.
• the amount of the polymerization inhibitor used is as follows: Based on the mass of the polyimide resin precursor (A), it is preferably 0.005% by mass or more and 1% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, and 0.03% by mass or more and 0.0% by mass or less. More preferably, it is 3% by mass or less.
• the nitrogen-containing heterocyclic compound coordinates and stabilizes the metal surface, thereby improving the adhesion of the resin film formed using the photosensitive resin composition to the metal surface.
• known compounds can be used as the nitrogen-containing heterocyclic compound.
• the nitrogen-containing heterocyclic compound include imidazole, pyrazole, indazole, carbazole, triazole, pyrazoline, pyrazolidine, tetrazole, pyridine, piperidine, pyrimidine, pyrazine, triazine, cyanuric acid, isocyanuric acid, and derivatives thereof.
• nitrogen-containing heterocyclic compounds preferred from the viewpoint of coordination with metals include 1H-benzotriazole, 4-methyl-1H-methylbenzotriazole, 5-methyl-1H-methylbenzotriazole, and 4-carboxy- Examples include triazoles such as 1H-methylbenzotriazole and 5-carboxy-1H-methylbenzotriazole, and triazoles such as 1H-tetrazole, 5-methyl-1H-tetrazole, and 5-phenyl-1H-tetrazole.
• the amount of the nitrogen-containing heterocyclic compound to be used is determined. is preferably 0.01% by mass or more and 5% by mass or less, more preferably 0.05% by mass or more and 3% by mass or less, based on the mass of the polyimide resin precursor (A).
• silane coupling agent By blending a silane coupling agent into a photosensitive resin composition, it is possible to improve the adhesion of a resin film formed using the photosensitive resin composition to a substrate or the like.
• the silane coupling agent known compounds can be used.
• the silane coupling agent include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-mercaptopropyltriethoxysilane.
• Examples of acid anhydrides to be reacted with 3-aminopropyltrimethoxysilane or 3-aminopropyltriethoxysilane include succinic anhydride, maleic anhydride, nadic anhydride, 3-hydroxyphthalic anhydride, and pyromellitic dianhydride. anhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, and 4,4'-oxydiphthalic dianhydride etc.
• the amount of the silane coupling agent used is preferably 0.01% by mass or more and 10% by mass or less based on the mass of the polyimide resin precursor (A).
• a surfactant By blending a surfactant into a photosensitive resin composition, the coatability of the photosensitive resin composition is improved, and the wettability of the photosensitive resin composition with a substrate is also improved.
• the surfactant known compounds can be used. Examples of the surfactant include fluorine surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone surfactants.
• the amount of surfactant used is preferably 0.001% by mass or more and 1% by mass or less based on the mass of the polyimide resin precursor (A).
• the polyimide resin precursor (A) can be converted into a polyimide resin by heating.
• the photosensitive resin composition may contain a cyclization accelerator.
• the cyclization accelerator promotes the production of a polyimide resin by cyclizing a polyamide resin containing a structural unit derived from a polyamic acid or a dicarboxylic acid compound that can be synthesized by a reaction between a tetracarboxylic dianhydride and an alcohol.
• the photosensitive resin composition contains a cyclization accelerator, the mechanical properties and weather resistance reliability of a resin film formed using the photosensitive resin composition while producing a polyimide resin through cyclization are improved.
• the cyclization accelerator known thermal base generators and thermal acid generators are used.
• the amount of each additive used is not particularly limited as long as it does not impede the purpose of the present invention.
• the amount of additives whose usage amount is not listed above may be adjusted as appropriate within the range of, for example, 0.001% by mass or more and 60% by mass or less based on the mass of the solid content of the photosensitive resin composition. , preferably from 0.01% by mass to 5% by mass.
• a photosensitive resin composition can be prepared by uniformly mixing the above-described essential components and, if necessary, arbitrary components in desired amounts.
• the mixing method is not particularly limited.
• the photosensitive dry film has a base film and a photosensitive layer formed on the surface of the base film, and the photosensitive layer is made of the above-mentioned photosensitive resin composition.
• PET polyethylene terephthalate
• PP polypropylene
• PE polyethylene
• PET film is preferable because it has an excellent balance of light transmittance and breaking strength.
• a photosensitive dry film is manufactured by coating the above-described photosensitive resin composition on a base film to form a photosensitive layer.
• a photosensitive layer When forming a photosensitive layer on the base film, use an applicator, a bar coater, a wire bar coater, a roll coater, a curtain flow coater, etc. to form the photosensitive layer on the base film so that the film thickness after drying is preferably 0.5 ⁇ m.
• the photosensitive resin composition is coated to a thickness of 3 ⁇ m or more and 300 ⁇ m or less, more preferably 1 ⁇ m or more and 300 ⁇ m or less, particularly preferably 3 ⁇ m or more and 100 ⁇ m or less, and dried.
• the photosensitive dry film may further have a protective film on the photosensitive layer.
• this protective film include polyethylene terephthalate (PET) film, polypropylene (PP) film, and polyethylene (PE) film.
• ⁇ Resin film forming method a coating step of coating a photosensitive resin composition on a substrate to form a coating film;
• a resin film containing the aforementioned polyimide resin precursor (A) can be formed by a method comprising a drying step of drying a coating film to obtain a resin film.
• the substrate is not particularly limited, and any conventionally known substrate can be used, such as a substrate for electronic components or a substrate on which a predetermined wiring pattern is formed.
• a substrate for electronic components such as a substrate for electronic components or a substrate on which a predetermined wiring pattern is formed.
• a silicon substrate, a glass substrate, etc. can also be used.
• a coating film having a desired thickness is formed by removing the solvent from the applied photosensitive resin composition.
• the thickness of the coating film is not particularly limited, but is preferably 0.5 ⁇ m or more, more preferably 0.5 ⁇ m or more and 300 ⁇ m or less, particularly preferably 1 ⁇ m or more and 150 ⁇ m or less, and most preferably 3 ⁇ m or more and 100 ⁇ m or less.
• a spin coating method As a method for applying the photosensitive resin composition onto the substrate, methods such as a spin coating method, a slit coating method, a roll coating method, a screen printing method, and an applicator method can be adopted.
• the method of drying the photosensitive resin composition applied onto the substrate is not particularly limited. Preferably, drying is performed by heating.
• the heating conditions during drying vary depending on the type of each component in the photosensitive resin composition, blending ratio, coating film thickness, etc., but are usually 70°C or more and 200°C or less, preferably 80°C or more and 150°C or less, The time is about 2 minutes or more and 120 minutes or less.
• a resin film containing the aforementioned polyimide resin precursor (A) is formed.
• ⁇ Method for forming patterned resin film a coating step of coating the aforementioned photosensitive resin composition on the substrate to form a coating film; an exposure step of positionally selectively irradiating the coating film with actinic rays or radiation; A patterned resin film is formed by a method including a developing step of developing the exposed coating film to obtain a patterned resin film.
• the patterned resin film contains the aforementioned polyimide resin precursor (A).
• the substrate and the method of applying the photosensitive resin composition are as described above for the resin film forming method.
• the photosensitive resin composition applied onto the substrate is usually dried to form a coating film.
• the method of drying the photosensitive resin composition applied onto the substrate is not particularly limited. Preferably, drying is performed by heating.
• the heating conditions during drying vary depending on the type of each component in the photosensitive resin composition, blending ratio, coating film thickness, etc., but are usually 70°C or more and 200°C or less, preferably 80°C or more and 150°C or less, The time is about 2 minutes or more and 120 minutes or less.
• the coating film formed as described above is exposed by irradiating active light or radiation in a position-selective manner.
• One selective exposure is usually performed by position-selectively irradiating actinic light or radiation, such as ultraviolet rays or visible light having a wavelength of 300 nm or more and 500 nm or less, through a mask with a predetermined pattern.
• a radiation source a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon gas laser, etc. can be used.
• radiation includes microwaves, infrared rays, visible light, ultraviolet rays, X-rays, ⁇ -rays, electron beams, proton beams, neutron beams, ion beams, and the like.
• the amount of radiation irradiation varies depending on the composition of the resin film-forming photosensitive resin, the thickness of the photosensitive layer, etc., but for example, in the case of using an ultra-high pressure mercury lamp, it is 100 mJ/cm 2 or more and 10,000 mJ/cm 2 or less.
• the exposed coating film is developed according to a conventionally known method, and unnecessary portions are dissolved and removed, thereby forming a resin film patterned into a predetermined shape.
• a developer is used depending on the components contained in the photosensitive resin composition.
• the aforementioned polyimide resin precursor (A) is a resin having an alkali-soluble group such as a carboxyl group
• an alkaline aqueous solution may be used as the developer.
• the organic solvents exemplified as the organic solvent (S) described above can be used as the developer.
• alkaline developers include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, n-propylamine, diethylamine, di-n-propylamine, triethylamine, and methyldiethylamine.
• dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, piperidine, 1,8-diazabicyclo[5,4,0]-7-undecene, and 1 , 5-diazabicyclo[4,3,0]-5-nonane and the like can be used.
• an aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol and ethanol or a surfactant to the aqueous solution of the alkali mentioned above can also be used as the developer.
• the development time varies depending on the composition of the photosensitive resin composition, the thickness of the coating film, etc., but is usually between 1 minute and 30 minutes.
• the developing method may be any of a piling method, a dipping method, a paddle method, a spray developing method, and the like.
• the cleaning solvent is not particularly limited.
• water, alcohol, or the like can be used as a cleaning solvent in the case of alkaline development.
• the organic solvent (S) can be used within a range that does not cause solvent shock.
• the polyimide resin precursor (A) contained in the resin film can be imidized by heating. Therefore, after development, the developed coating film may be baked, if necessary, to imidize the polyimide resin precursor (A) in the resin film.
• the conditions for converting the polyimide resin precursor (A) into a polyimide resin by heating are as described above. Furthermore, baking is preferably performed in an atmosphere of an inert gas such as nitrogen or argon from the viewpoint of preventing oxidation of the resin film and obtaining a resin film with good mechanical properties.
• the patterned polyimide resin film formed as described above can be used, for example, as an insulating film for semiconductor devices, an interlayer insulating film for rewiring layers, an insulating film or a protective film in touch panel displays, organic electroluminescent display panels, etc. Suitably used. Since the photosensitive resin composition described above has good resolution, the patterned resin film formed as described above is particularly useful as an interlayer insulating film for a rewiring layer in a three-dimensional mounting device. , can be preferably used. Further, the patterned resin film formed as described above can be suitably used as a photoresist for electronics, a galvanic (electrolytic) resist, an etching resist, a solder top resist, and the like.
• the patterned resin film formed as described above can be used for manufacturing printing plates such as offset printing plates or screen printing plates, for forming etching masks when etching molded parts, and for electronic parts, especially microelectronic parts. It can also be used in the production of protective lacquers, dielectric layers, etc.
• a photosensitive resin composition comprising a polyimide resin precursor (A), a photoradical polymerization initiator (C), and an organic solvent (S),
• the polyimide resin precursor (A) has the following formula (1):
• X A1 and Y A1 are organic groups having 6 to 40 carbon atoms
• R A1 and R A2 are each independently a hydrogen atom or an organic group having 1 or more and 30 or less carbon atoms
• the organic groups as R A1 and R A2 have the formula Bonds to the oxygen atom in the ester bond in (1).
• the polyimide resin precursor (A) has an unsaturated group having 3 or more and 20 or less carbon atoms having a carbon-carbon double bond as an organic group as R A1 and R A2 ,
• the polyimide resin precursor (A) has the following formula (A1-1) as Y A1 :
• (In formula ( A1-1 ) group, hydroxy group, carboxy group, sulfonic acid group, or halogen atom
• Ar is a phenyl group optionally substituted with R a2 , or a naphthyl group optionally substituted with R a2
• ma1 is , is an integer between 0 and 10
• ma2 is an integer between 0 and 7
• ma3 is an integer between 1 and 10.
• R a3 and R a4 are each independently an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon
• the urea solvent (S1) is N,N,N',N'-tetramethylurea, N,N,N',N'-tetraethylurea, N,N,N',N'-tetrabutyl As described in any one of (1) to (4), which is one or more selected from the group consisting of urea, 1,3-dimethyl-2-imidazolidinone, and N,N'-dimethylpropylene urea.
• photosensitive resin composition (6) coating the photosensitive resin composition according to any one of (1) to (5) on a substrate to form a coating film; positionally selectively exposing the coating film; Developing the exposed resin film.
• a patterned polyimide resin film comprising generating a polyimide resin derived from a polyimide resin precursor by heating the patterned resin film produced by the production method described in (6). manufacturing method.
• Example 1 to 15 and Comparative Examples 1 to 14 In Examples and Comparative Examples, the following DA1 and DA2 were used as diamine compounds.
• Alc1 to Alc3 were used as alcohols to be reacted with tetracarboxylic acids and anhydrides.
• Alc2 2-hydroxypropyl acrylate (manufactured by Kyoeisha, light acrylate HOP-A (N))
• Alc3 2-hydroxybutyl acrylate (manufactured by Kyoeisha, light acrylate HOB-A)
• TMU N,N,N',N'-tetramethylurea
• TEU N,N,N',N'-tetraethylurea
• TBU N,N,N',N'-tetrabutylurea
• DMI 1,3- Dimethyl-2-imidazolidinone
• DMPU N,N'-dimethylpropyleneurea
• NMP N-methyl-2-pyrrolidone
• NEP N-ethyl-2-pyrrolidone
• GBL ⁇ -butyrolactone
• DEAc N,N-diethylacetamide
• DMAc N,N-dimethylacetamide
• DMPA N,N-dimethylpropionamide
• DEDM diethylene glycol dimethyl ether (diglyme)
• the filtrate containing the polyimide resin precursor was dropped into a large amount of isopropyl alcohol aqueous solution.
• the polyimide resin precursor precipitated in the aqueous solution in isopropyl alcohol was collected by filtration. The collected precipitate was washed three times with isopropyl alcohol. The precipitates after washing were dried under reduced pressure to obtain polyimide resin precursors for each example and comparative example.
• ⁇ Storage stability evaluation> The photosensitive resin composition was stored at room temperature. Based on the results of visual observation of the photosensitive resin composition during storage, storage stability was evaluated according to the following criteria. ⁇ : No change in properties such as change in viscosity was observed for 2 weeks or more. x: Changes in properties such as changes in viscosity were observed within 2 weeks.
• the thin film of the photosensitive resin composition was baked at 90° C. for 240 seconds.
• the baked coating film was exposed to light using a high-pressure mercury lamp at a cumulative light intensity of 2,000 mJ/cm 2 .
• the exposed film was heated in an inert oven under a nitrogen atmosphere at a rate of 5° C./min to 230° C., and the coated film was heated at the same temperature for 1 hour.
• the wafer When the temperature dropped to 100° C., the wafer was taken out and immersed in an aqueous solution of hydrofluoric acid with a concentration of 2% by mass for 5 to 30 minutes, and the resin film was peeled from the wafer to obtain a polyimide resin film.
• the thickness of the resin film after peeling was 10 ⁇ m.
• the dielectric loss tangent (tan ⁇ ) of the obtained film was calculated as follows: IEICE Technical Report, vol. 118, no. 506, MW2018-158, pp. 13-18, March 2019 Study on millimeter-wave complex permittivity evaluation using cavity resonator method” (Kohei Takahagi (Utsunomiya University), Kazuaki Ebisawa (Tokyo Ohka Kogyo Co., Ltd.), Yoshinori Kogami (Utsunomiya University), Takashi Shimizu (Utsunomiya University)) Measured using the method described.
• Measurement was performed using a network analyzer HP8510C (manufactured by Keysight) using a cavity resonator method under conditions of a room temperature of 25° C., a humidity of 50%, a frequency of 36 GHz, and a sample thickness of 10 ⁇ m. Based on the measured value of the dielectric loss tangent, the dielectric loss tangent was evaluated according to the following criteria. ⁇ : Dielectric loss tangent is less than 0.010. ⁇ : Dielectric loss tangent value exceeds 0.010.
• a photosensitive resin composition containing the polyimide resin precursor (A) having the above-mentioned predetermined structure, a photoradical polymerization initiator (C), and an organic solvent (S) is )
• the photosensitive resin composition contains the polyimide resin precursor (A) having the above-mentioned predetermined structure, a photoradical polymerization initiator (C), and an organic solvent (S). It can also be seen that when the ratio of the mass of the urea solvent (S1) to the mass of the organic solvent (S) is less than 50 mass, the photosensitive resin composition has poor storage stability.

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