WO2023229426A1 - Module d'affichage à del transparent ayant une structure étanche à l'eau et à la poussière, et procédé pour le fabriquer - Google Patents

Module d'affichage à del transparent ayant une structure étanche à l'eau et à la poussière, et procédé pour le fabriquer Download PDF

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Publication number
WO2023229426A1
WO2023229426A1 PCT/KR2023/007280 KR2023007280W WO2023229426A1 WO 2023229426 A1 WO2023229426 A1 WO 2023229426A1 KR 2023007280 W KR2023007280 W KR 2023007280W WO 2023229426 A1 WO2023229426 A1 WO 2023229426A1
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WIPO (PCT)
Prior art keywords
transparent
adhesive layer
thermoplastic resin
display module
led display
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PCT/KR2023/007280
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English (en)
Korean (ko)
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양주웅
허정욱
정상천
전용선
Original Assignee
주식회사 루미디아
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Publication of WO2023229426A1 publication Critical patent/WO2023229426A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Definitions

  • the present invention relates to a transparent LED display module having a water-proof and dust-proof structure and a method of manufacturing the same. More specifically, the present invention relates to a transparent LED display module having a water-proof and dust-proof structure and a method of manufacturing the same. More specifically, the present invention relates to a method of preventing oxidation, damage by invasion, short circuit, discoloration, etc. of the conductive electrode pattern and LED elements with a simple process. The present invention relates to a transparent LED display module having a waterproof and dustproof structure that can simultaneously reduce distortion of displayed images and improve visibility, and a method of manufacturing the same.
  • Transparent LED display modules use high-density polymer materials such as glass, PET, PC, or PI as a base substrate, form a conductive pattern on the top of the substrate, and mount LEDs. The LED lights up toward the top of the substrate to create video and still images. Alternatively, various information such as text and pictures can be output, so its utility as an advertising medium is increasing.
  • transparent LED display is that, unlike existing LED electronic signs, when an image is displayed, the outside can be seen from the opposite direction where the LED is mounted, in the direction in which the LED is turned on, and when the image is turned off, the inside and outside can be seen from both directions where the transparent LED display is installed.
  • transparent LED displays are recognized as a new material that can serve as both a building exterior finishing material and an advertising and lighting display, and interest in them is significantly increasing.
  • a method of mounting the LED on one of a pair of transparent substrates and filling transparent resin between the pair of transparent substrates to form a protective layer to protect the LED is mainly used.
  • this filling method has a limitation in that there is a difference in optical characteristics between the filler and the resin film, which ultimately causes scattering and refraction of light emitted from the LED device, resulting in distortion of the displayed image and reduced visibility.
  • this method has limitations in that the number of processes, such as the resin film perforation process and the filler filling process, increases, which reduces the yield and increases the number of equipment required for manufacturing, ultimately increasing the manufacturing cost.
  • the first problem to be solved by the present invention is a transparent LED display module with a waterproof and dustproof structure that can prevent oxidation, damage by invasion, short circuit, and discoloration of the conductive electrode pattern and LED elements with a simple process, and a method of manufacturing the same. is to provide.
  • the second problem to be solved by the present invention relates to a transparent LED display module having a waterproof and dustproof structure that can reduce distortion of the displayed image and improve visibility, and a method of manufacturing the same.
  • the present invention provides a transparent LED display module having a waterproof and dustproof structure, comprising: a transparent base substrate on which a conductive electrode pattern and a plurality of LED packages are formed on at least one surface; A thermoplastic resin layer disposed on the upper surface of the transparent base substrate and formed to completely surround one surface of the transparent base substrate on which the conductive electrode pattern and the plurality of LED packages are formed; and an adhesive layer formed on top of the thermoplastic resin layer, wherein the adhesive layer includes: a base sheet; and an adhesive layer formed by applying an adhesive to the upper surface of the base sheet.
  • the adhesive layer may further include an adhesive layer formed by applying an adhesive to the lower surface of the base sheet.
  • it further includes an adhesive layer protective liner formed on an upper surface of the adhesive layer, wherein the adhesive layer protective liner is removed when installing the transparent LED display module to display the transparent LED display.
  • the installation surface on which the module is installed and the adhesive layer may be bonded to each other.
  • the thermoplastic resin layer is formed by heat compression in a vacuum state so as to be in close contact with the transparent base substrate, and completely encloses and seals the upper surface and both sides of the transparent base substrate to provide a waterproof and dustproof structure.
  • the transparent base substrate may be a glass substrate.
  • the transparent base substrate is a transparent flexible material selected from the group consisting of polycarbonate (PC), poly ethylene terephthalate (PET), and polyimide (PI). It can be made of any one resin.
  • PC polycarbonate
  • PET poly ethylene terephthalate
  • PI polyimide
  • the resin material forming the thermoplastic resin layer may be any one selected from the group consisting of PVB (Polyvinyl Butyral), EVA (Ethylene Vinyl Acetate), PU (Polyurethane), and PO (Polyolefin). there is.
  • PVB Polyvinyl Butyral
  • EVA Ethylene Vinyl Acetate
  • PU Polyurethane
  • PO Polyolefin
  • the glass transition temperature (Tg) of the thermoplastic resin included in the thermoplastic resin layer may be lower than the glass transition temperature (Tg) of the resins included in the adhesive layer.
  • the adhesive layer can satisfy the following relational equation 1.
  • T 310 Thickness of base sheet
  • T 320 Thickness of adhesive layer
  • the adhesive layer can satisfy all of the following conditions (a) to (c).
  • Adhesion must be 4 to 10 gf/25mm
  • the elongation rate should be 70 to 90%.
  • the adhesive forming the adhesive layer of the adhesive layer may be any one selected from the group consisting of silicone adhesive, acrylic adhesive, urethane adhesive, and rubber adhesive.
  • the present invention includes the steps of preparing a transparent base substrate on which a conductive electrode pattern and a plurality of LED packages are formed on at least one surface; Laminating a thermoplastic resin film on the upper surface of the transparent base substrate; Forming a laminate by laminating an adhesive layer with an adhesive layer protective liner attached on top of the thermoplastic resin film; And a step of applying heat and pressure to the laminate to heat-compress the thermoplastic resin of the thermoplastic resin film so that the thermoplastic resin becomes transparent and liquefied.
  • the heat-pressing step includes the conductive electrode pattern of the transparent base substrate and the plurality of LED packages.
  • thermoplastic resin layer is cured on one side of the formed surface to form a thermoplastic resin layer to completely cover the top surface and both sides of the transparent base substrate, and the adhesive layer includes a base sheet; and an upper surface of the base sheet.
  • a transparent LED display module manufacturing method including a pressure-sensitive adhesive layer formed by applying an adhesive is provided.
  • the adhesive layer may further include an adhesive layer formed by applying an adhesive to the lower surface of the base sheet.
  • the thermoplastic resin of the thermoplastic resin film in the thermal compression step, is fluidized by heat in a vacuum state and then completely surrounds the upper surface and both sides of the transparent base substrate,
  • the thermoplastic resin may be cured to form a thermoplastic resin layer to completely enclose and seal the top and both sides of the transparent base substrate.
  • the thermal compression step may be performed for 20 to 60 minutes at a pressure rate of 2 to 15 kgf/m2 under a temperature condition of 120 to 170°C in a vacuum state.
  • the thermoplastic resin of the thermoplastic resin film in the thermal compression step, is fluidized by heat in a vacuum state and then completely surrounds the upper surface and both sides of the transparent base substrate,
  • the thermoplastic resin may be cured to form a thermoplastic resin layer to completely enclose and seal the top and both sides of the transparent base substrate.
  • a protective glass cover layer is further disposed on the uppermost layer and the lowermost layer of the laminate, respectively, and in the heat compression step, the laminate is laminated. After the heat compression step, the protective glass cover layer can be removed and reused.
  • the present invention can form a resin layer that protects the conductive electrode pattern and the LED device through a simple process, resulting in excellent process efficiency.
  • the present invention can prevent oxidation, damage due to invasion, short circuit phenomenon, discoloration, etc. of the conductive electrode pattern and LED elements by forming a waterproof and dustproof structure.
  • the present invention can reduce distortion of displayed images and improve visibility.
  • Figure 1 is a cross-sectional view showing the schematic configuration of a transparent LED display module according to a preferred embodiment of the present invention.
  • Figure 2 is a cross-sectional view showing the schematic configuration of a transparent LED display module according to a preferred embodiment of the present invention.
  • Figure 3 is a schematic diagram showing the process of installing a transparent LED display module on the outer wall of a building according to a preferred embodiment of the present invention.
  • Figure 4 is a schematic diagram schematically showing the transparent LED display module manufacturing process according to a preferred embodiment of the present invention.
  • Figure 5 is a schematic diagram schematically showing the transparent LED display module manufacturing process according to a preferred embodiment of the present invention.
  • the present invention provides a transparent LED display module having a waterproof and dustproof structure, comprising: a transparent base substrate on which a conductive electrode pattern and a plurality of LED packages are formed on at least one surface; A thermoplastic resin layer disposed on the upper surface of the transparent base substrate and formed to completely surround one surface of the transparent base substrate on which the conductive electrode pattern and the plurality of LED packages are formed; and an adhesive layer formed on top of the thermoplastic resin layer, wherein the adhesive layer includes: a base sheet; A solution to the above-mentioned limitations was sought by providing a transparent LED display module including; and an adhesive layer formed by applying an adhesive to the upper surface of the base sheet.
  • 'top' refers to the direction of one side of the transparent base substrate where the conductive electrode pattern and a plurality of LED packages are formed.
  • 'a thermoplastic resin layer is formed on the top of the transparent base substrate' means that the thermoplastic resin layer is formed on one side of both sides of the transparent base substrate where the conductive electrode pattern and a plurality of LED packages are formed.
  • top surface' refers to the surface on which the conductive electrode pattern and a plurality of LED packages are formed among the upper and lower surfaces of the transparent base substrate.
  • a method of forming a protective layer to protect an existing transparent LED display module an LED is mounted on one of a pair of transparent substrates and a transparent resin is filled between the pair of transparent substrates to make the LED.
  • a method of forming a protective layer is mainly used.
  • this filling method has a limitation in that there is a difference in optical characteristics between the filler and the resin film, which ultimately causes scattering and refraction of light emitted from the LED device, resulting in distortion of the display image and reduced visibility.
  • this method has limitations in that the number of processes, such as the resin film perforation process and the filler filling process, increases, which reduces the yield and increases the number of equipment required for manufacturing, ultimately increasing the manufacturing cost.
  • the present invention provides a transparent LED display module having a waterproof and dustproof structure, comprising: a transparent base substrate on which a conductive electrode pattern and a plurality of LED packages are formed on at least one surface; A thermoplastic resin layer disposed on the upper surface of the transparent base substrate and formed to completely surround one surface of the transparent base substrate on which the conductive electrode pattern and the plurality of LED packages are formed; and an adhesive layer formed on top of the thermoplastic resin layer, wherein the adhesive layer includes: a base sheet; A solution to the above-mentioned limitations was sought by providing a transparent LED display module including; and an adhesive layer formed by applying an adhesive to the upper surface of the base sheet.
  • FIG. 1 is a cross-sectional view showing the schematic configuration of a transparent LED display module according to a preferred embodiment of the present invention.
  • the transparent LED display module 1 of the present invention includes a transparent base substrate 10 on which a conductive electrode pattern 110 and a plurality of LED packages 120 are formed on at least one surface.
  • a thermoplastic resin layer disposed on the upper surface of the transparent base substrate 10 and formed to completely surround one side of the transparent base substrate 10 on which the conductive electrode pattern 110 and the plurality of LED packages 120 are formed ( 20) and an adhesive layer 30 formed on the thermoplastic resin layer 20.
  • the adhesive layer 30 includes a base sheet 310 and an adhesive layer 320 formed by applying an adhesive to the upper surface of the base sheet 310.
  • the present invention can form a thermoplastic resin layer that protects the conductive electrode pattern and the LED device through a simple process, and forms a waterproof and dustproof structure through this, thereby preventing damage due to oxidation and invasion of the conductive electrode pattern and the LED device. It can effectively prevent short circuits, discoloration, etc.
  • a separate filler there is no difference in optical properties between the filler and the resin layer, thereby reducing distortion of the displayed image and improving visibility.
  • the transparent base substrate 10 is a substrate on which a conductive electrode pattern and an LED package are formed on at least one side, and has a first side and a second side that is opposite to the first side.
  • a conductive electrode pattern and an LED package may be formed on at least one of the two sides, preferably on one side.
  • the shape of the transparent base substrate 10 is such that it can form the transparent LED display module 1, considering the location/place where the transparent LED display module 1 is installed, such as the outer wall of the building, the outer window of the building, and the glass inside the building. It can be formed into any shape. For example, it may be formed in a rectangular, circular, oval shape, etc.
  • the transparent base substrate 10 can be a transparent material that can reproduce images as is, for example, a glass substrate, a PEN (Poly Ethylene Naphthalene) film, or a PET (Poly Ethylene Terephthalate) film.
  • a resin substrate such as PI (Polyimide) film, PE (Poly Ethylene) film, or acrylic (PMMA. Poly Methyl MethAcrylate) can be used.
  • the transparent base substrate 10 may preferably be a glass substrate.
  • the transparent base substrate 10 itself can be used as a screen for a transparent LED display, eliminating the need to use a separate thick glass plate. In this case, weight reduction is possible, and as will be described later, the installation surface on which the transparent LED display module 1 is installed and the adhesive layer 30 can be easily bonded to each other, resulting in more stable construction or installation.
  • the transparent LED display module 1 of the present invention is manufactured by forming a laminate through a thermocompression process. When a glass substrate is used, the thermoplastic resin layer is higher than when a substrate of other materials is used. (20) may be formed to completely adhere to the upper surface of the transparent base substrate (10). In addition, since the glass plays a role in supporting and protecting the base substrate, it can also play a role in protecting the LED from external shock.
  • the transparent base substrate 10 may be made of a transparent flexible material.
  • it may be made of resin such as polycarbonate (PC), polyethylene terephthalate (PET), and polyimide (PI).
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PI polyimide
  • the thickness of the transparent base substrate 10 may be 0.1 to 50 mm, and preferably 0.5 to 10 mm. If the thickness of the transparent base substrate 10 is less than the above, a problem may occur in which the transparent base substrate 10 is broken or damaged during the thermal compression process. In addition, if the thickness of the transparent base substrate 10 exceeds the above range, heat is not applied well and the thermoplastic resin is not sufficiently melted when forming the thermoplastic resin layer 20. As a result, the thickness of the transparent base substrate 10 Problems may arise where the coating is not uniformly applied to the elements.
  • the transparent base substrate 10 may be electrically connected to an external control PCB.
  • the present invention may further include an external control PCB 130 that supplies power and control signals, and that the transparent base substrate 10 and the external control PCB 130 may be electrically connected.
  • the external control PCB 130 may be a conventional FR-4 PCB, a Flexible Printed Circuit Board (FPCB), or a conventional FR-4 PCB.
  • FPCB Flexible Printed Circuit Board
  • the external control PCB 130 is electrically connected to an external control PCB using a connector mounted on the conductive electrode pattern 110 created on the transparent base substrate 10, or the FPCB is connected to the conductive electrode pattern 110 and the transparent base by methods such as solder or ACF bonding. It may be connected to the conductive pattern of the board 10 and connected to an external power source or control PCB.
  • the thermoplastic resin layer 20 is a layer formed of a thermoplastic resin material and is disposed on the upper surface of the transparent base substrate 10, on which a conductive electrode pattern 110 and a plurality of LED packages 120 are formed. It is formed to completely surround one side of the. Through this, a waterproof and dustproof structure can be formed to effectively prevent oxidation, damage due to invasion, short circuit, discoloration, etc. of the conductive electrode pattern 110 and the LED package 120.
  • the thermoplastic resin layer 20 is formed by heat compression in a vacuum state so as to be in close contact with the transparent base substrate 10, and completely covers and encapsulates one and both sides of the transparent base substrate 10. By doing so, a waterproof and dustproof structure can be formed.
  • thermoplastic resin layer 20 is formed when heat and pressure are applied to a thermoplastic resin in the form of a film or sheet in a vacuum state, so that the thermoplastic resin melts and becomes a transparent liquid, and then is applied to the upper surface and both sides except the lower surface of the transparent base substrate 10. completely surrounds the Thereafter, as the applied heat cools and the transparent liquefied thermoplastic resin hardens, a thermoplastic resin layer 20 having a certain thickness and shape may be formed.
  • the thermoplastic resin layer 20 may be formed to completely enclose and seal one and both sides of the transparent base substrate 10 or to surround the entire transparent LED display module 1.
  • a simple process is effective in protecting LED elements, conductive electrodes, etc. from the external environment (moisture, dust, etc.). That is, there is an advantage in that the LED display module 1 can be formed with a waterproof and dustproof structure with excellent process efficiency.
  • the resin material forming the thermoplastic resin layer 20 may be any one selected from the group consisting of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), polyurethane (PU), and polyolefin (PO).
  • PVB polyvinyl butyral
  • EVA ethylene vinyl acetate
  • PU polyurethane
  • PO polyolefin
  • EVA ethylene vinyl acetate
  • PU polyurethane
  • PO polyolefin
  • the thickness of the thermoplastic resin layer 20 can range from hundreds of micrometers to several millimeters, and is generally sufficient to sufficiently protect the LED or external power supply connector mounted on the transparent base substrate 10. .
  • the thickness of the thermoplastic resin layer 20 may be preferably 1 to 2.5 mm, and more preferably 1.3 to 2.2 mm.
  • the thermoplastic resin layer 20 can be formed higher than the height of a typical LED device (0.3 to 1 mm), allowing it to completely surround the LED and connector, thereby playing a role in protecting the LED and connector. do. If the thickness range of the thermoplastic resin layer 20 is less than the above range, a problem may occur in that the thermoplastic resin layer 20 becomes very vulnerable to external heat, moisture, shock, etc.
  • the adhesive layer 30 is formed on top of the thermoplastic resin layer 20.
  • the adhesive layer 30 includes a base sheet 310 and an adhesive layer 320 formed by applying an adhesive to the upper surface of the base sheet 310. That is, the adhesive layer 30 includes an adhesive layer 320 having adhesive properties by applying an adhesive containing an adhesive component formed on the upper surface of the base sheet 310.
  • the adhesive layer 320 has adhesive properties, so that the adhesive layer 30 can be bonded to the installation surface on which the transparent LED display module 1 of the present invention is installed, as will be described later.
  • the adhesive layer 30 is formed to include a base sheet 310 and an adhesive layer 320, and is formed on the upper surface of the thermoplastic resin layer 20.
  • the base sheet 310 included in the adhesive layer 30 may be any one selected from the group consisting of PE (Polyester), PVC, PET, acrylic, and urethane materials, and is preferably a polyester film or sheet. It can be.
  • the base sheet 310 When a polyester film is used as the base sheet 310, the base sheet 310 can be formed with a relatively thin thickness, and at the same time, the physical properties are improved due to excellent transparency, flexibility, impact resistance, and abrasion resistance.
  • the adhesive forming the adhesive layer 320 of the adhesive layer 30 may be a polymer adhesive, and may preferably be any one selected from the group consisting of a silicone adhesive, an acrylic adhesive, a urethane adhesive, and a rubber adhesive. It may be a silicone adhesive. When using a silicone adhesive, the constructability is excellent when attaching the transparent LED display (1) to glass due to its lower surface tension than other organic adhesives. In addition, it has the advantage of excellent heat resistance, cold resistance and electrical properties (insulating properties) according to temperature changes.
  • the thickness of the adhesive layer 30 may be 0.01 mm to 2 mm. In this case, the constructability and adhesion are excellent, so it has the advantage of being able to be constructed more robustly when mounted on the exterior wall of a building. In addition, there is an advantage that transparency on the glass construction surface is improved.
  • the thickness of the base sheet 310 included in the adhesive layer 30 may be 0.01 to 2.0 mm. More preferably, the thickness of the base sheet 310 may be 0.02 to 1.5 mm.
  • the thickness of the adhesive layer 320 is preferably 0.001 to 0.1 mm, and more preferably 0.0025 to 0.05 mm.
  • the adhesive layer 30 can satisfy the following relational expression 1.
  • T 310 Thickness of base sheet 310
  • T 320 Thickness of adhesive layer 320
  • the adhesive layer 320 has excellent adhesive properties even when formed at a relatively thin thickness.
  • the installation surface on which the transparent LED display module 1 of the invention is installed and the adhesive layer 30 can be effectively attached and bonded.
  • the transparent LED display module 1 can be easily removed from the installation surface by applying a predetermined force without any additional work.
  • the dismantled transparent LED display module 1 can be reattached or reinstalled in another installation space.
  • the adhesive layer 30 can satisfy all of the following conditions (a) to (c).
  • Adhesion must be 4 to 10 gf/25mm
  • the elongation rate should be 70 to 90%.
  • the adhesion may be 6 to 8 gf/25mm, the tensile strength may be 8 to 12 kgf/10mm, and the elongation may be 75 to 85%. It is desirable that all of the above conditions (a) to (c) be based on values measured according to the test method of KS T 1028.
  • the adhesive layer 30 has excellent adhesiveness with only a relatively thin thickness, so that the adhesive layer 30 can be effectively bonded to the installation surface on which the transparent LED display module 1 of the present invention is installed.
  • the adhesive layer 30 may further include an adhesive layer 330 formed by applying an adhesive to the lower surface of the base sheet 310.
  • Figure 2 is a cross-sectional view showing the schematic configuration of a transparent LED display module 1 according to a preferred embodiment of the present invention.
  • the adhesive layer 30 of the present invention is formed by applying an adhesive to the base sheet 310, the upper surface of the base sheet 310, and the adhesive layer 320 and the lower surface of the base sheet 310. It may include an adhesive layer 330 formed by applying .
  • thermoplastic resin layer 20 and the adhesive layer 30 can be strongly bonded by the adhesive force of the adhesive layer 330. Accordingly, there is an advantage in obtaining a transparent LED display module (1) with a more robust laminated structure.
  • the present invention can satisfy the following relational expression 2.
  • the adhesive layer 30 of the present invention has adhesive performance on the surface in contact with the installation surface where the transparent LED display module 1 is installed by forming the adhesive layer 320 and the adhesive layer 330 in separate configurations. This allows for multiple reattachments, and provides adhesive performance to the surface in contact with the thermoplastic resin layer 20 to provide strong bonding force to form a more robust laminated structure.
  • the adhesive forming the adhesive layer 330 may be a polymer adhesive, preferably any one selected from the group consisting of a silicone adhesive, an acrylic adhesive, a urethane adhesive, and a rubber adhesive, and more preferably a silicone adhesive. there is.
  • silicone adhesive When silicone adhesive is used, constructability is excellent when attaching the transparent LED display (1) to glass due to its lower surface tension than other organic adhesives. In addition, it has the advantage of excellent heat resistance, cold resistance and electrical properties (insulating properties) according to temperature changes.
  • the thickness of the adhesive layer 330 is preferably 0.001 to 0.1 mm, and more preferably 0.0025 to 0.05 mm.
  • the glass transition temperature (Tg) of the thermoplastic resin included in the thermoplastic resin layer 20 is preferably lower than the glass transition temperature (Tg) of the resins included in the adhesive layer 30.
  • the thermoplastic resin in the form of a film is transparently liquefied/fluidized above a certain temperature range to form the thermoplastic resin layer 20 in the position and shape as described above, but the adhesive layer 30 is melted. By preventing liquefaction, the desired transparent LED display module (1) can be obtained.
  • the adhesive layer 30 may further include an adhesive layer protection liner formed on the upper surface.
  • an adhesive layer protection liner formed on the upper surface. Referring to Figures 1 and 2, it can be seen that the adhesive layer protection liner 40 is formed on the upper surface of the adhesive layer 30.
  • the adhesive layer protection liner 40 can protect the adhesive layer 320 of the adhesive layer 30 from the heat and pressure applied during the heat compression step of the manufacturing process, and can protect the transparent LED display module during the distribution or installation step.
  • the adhesive layer 320 of (1) can be protected from the external environment.
  • the adhesive layer protective liner 40 is removed when installing the transparent LED display module 1, so that the installation surface on which the transparent LED display module 1 is installed and the adhesive layer 30 can be bonded to each other.
  • Figure 3 is a schematic diagram showing the process of installing the transparent LED display module 1 according to a preferred embodiment of the present invention.
  • the adhesive layer protective liner 40 is easily removed by applying a predetermined force in the It can be seen that the adhesive layer 30 can be installed by bonding to A).
  • the present invention includes the steps of preparing a transparent base substrate on which a conductive electrode pattern and a plurality of LED packages are formed on at least one surface; Laminating a thermoplastic resin film on the upper surface of the transparent base substrate; Forming a laminate by laminating an adhesive layer with an adhesive layer protective liner attached on top of the thermoplastic resin film; And applying heat and pressure to the laminate to thermally compress the thermoplastic resin of the thermoplastic resin film into a transparent liquid.
  • a step; wherein the thermal compression step includes curing the transparent liquefied thermoplastic resin on one surface of the transparent base substrate on which the conductive electrode pattern and the plurality of LED packages are formed, thereby completely covering the upper surface and both sides of the transparent base substrate.
  • thermoplastic resin layer to surround the adhesive layer, wherein the adhesive layer includes a base sheet; and an adhesive layer formed by applying an adhesive to the upper surface of the base sheet.
  • Figure 4 is a schematic diagram schematically showing the transparent LED display module manufacturing process according to a preferred embodiment of the present invention.
  • the present invention prepares a transparent base substrate 10 on which a conductive electrode pattern 110 and a plurality of LED packages 120 are formed on at least one surface, and a transparent base substrate 10 is formed on the upper surface of the transparent base substrate 10.
  • a thermoplastic resin film (20A) is stacked, and an adhesive layer (30) to which an adhesive layer protective liner (40) is attached is stacked on top of the thermoplastic resin film (20A) to form a laminate.
  • the adhesive layer 30 includes the base sheet 310 and the adhesive layer 320 formed by applying an adhesive to the upper surface of the base sheet 310. In order to laminate the laminate, it is placed in a laminating machine (50, 50').
  • thermoplastic resin of the thermoplastic resin film 20A into a transparent liquid.
  • the present invention cures the transparent liquefied thermoplastic resin on one surface of the transparent base substrate 10 on which the conductive electrode pattern 110 and the plurality of LED packages 120 are formed, thereby forming the transparent base substrate ( 10) is performed to form a thermoplastic resin layer 20 to completely cover the upper surface and both sides.
  • the desired transparent LED display module (1) can be manufactured (M3).
  • Figure 5 is a schematic diagram schematically showing the transparent LED display module manufacturing process according to a preferred embodiment of the present invention.
  • the adhesive layer 30 may further include an adhesive layer 330 formed by applying an adhesive to the lower surface of the base sheet 310.
  • the thermoplastic resin of the thermoplastic resin film 20A is fluidized by heat in a vacuum state and then completely surrounds the upper surface and both sides of the transparent base substrate,
  • the thermoplastic resin may be cured to form a thermoplastic resin layer 20 to completely enclose and seal the top and both sides of the transparent base substrate 10.
  • thermoplastic resin of the thermoplastic resin film 20A is fluidized by heat in a vacuum state and then completely surrounds the upper surface and both sides of the transparent base substrate 10, and the thermoplastic resin It may be cured to form a thermoplastic resin layer 20 to completely enclose and seal the top and both sides of the transparent base substrate 10.
  • the present invention applies heat and pressure to the above-described laminate so that the resin of the thermoplastic resin film (20A) is fluidized into a transparent liquid state by heat, so that the resin is applied to the conductive electrode pattern 110 and the transparent base substrate 10.
  • the resin is applied to the conductive electrode pattern 110 and the transparent base substrate 10.
  • the present invention can easily form a protective layer to protect conductive electrodes, LED elements, etc. with a simple process, and has a waterproof and dustproof structure that can prevent damage due to oxidation and invasion, short circuit, discoloration, etc. It has the effect of providing a transparent LED display module.
  • thermoplastic resin layer 20 by performing thermal compression in a vacuum state, it is possible to completely prevent air bubbles, foreign substances, etc. from being introduced during the process of forming the thermoplastic resin layer 20.
  • the heat compression step may be performed for 20 to 60 minutes in a vacuum at a temperature of 120 to 170°C and at a pressurizing rate of 2 to 15 kgf/m2.
  • conditions such as temperature in the heat compression step may vary depending on the thickness of the glass on the front or back. If heat compression is performed under temperature conditions below the above range, the thermoplastic resin is not sufficiently liquefied and does not spread evenly over the LED elements and conductive electrodes on the transparent base substrate 10, resulting in the problem of generating bubbles inside. It can happen. In addition, a problem may arise in which the desired light transmittance cannot be secured.
  • a step of stabilizing the substrate while the heat is removed from the laminate may be further included.
  • the state in which the heat is removed means a state in which the heat is sufficiently cooled and the heat is lowered to the level before performing heat compression.
  • thermoplastic resin is completely liquefied and maximum pressure and vacuum are achieved, and then a further process is performed to stabilize the substrate by blocking the heat source and lowering the temperature of the substrate by slowly lowering the heat. can do.
  • a protective glass cover layer may be further disposed on the uppermost layer and the lowermost layer of the laminate, respectively.
  • lamination through thermal compression can be performed by further including protective glass cover layers 50 and 50' on the top and bottom layers of the laminate, respectively. Thereafter, by removing the protective glass cover layers (50, 50'), it is possible to reduce the weight of the transparent LED display module (1). At the same time, the removed protective glass cover layers (50, 50') can be reused, thereby increasing process efficiency. This has excellent effects.
  • the present invention can form a resin layer that protects the conductive electrodes and LED elements with a simple process, forming a waterproof and dustproof structure with excellent process efficiency, thereby preventing oxidation, damage from invasion, and short circuits of the conductive electrode patterns and LED elements. , discoloration, etc. can be prevented. Additionally, the present invention can reduce distortion of displayed images and improve visibility. Accordingly, the present invention can be usefully used in various fields where transparent LED displays can be used.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

La présente invention permet de former, uniquement à l'aide d'un processus simple, une couche de résine destinée à protéger un motif d'électrode conductrice et un dispositif à DEL, et présente ainsi une excellente efficacité de traitement. Par ailleurs, la présente invention permet la formation d'une structure étanche à l'eau et à la poussière, et peut ainsi empêcher un motif d'électrode conductrice et un dispositif à DEL d'être endommagés, d'être sujets à des court-circuits, de subir une décoloration et analogue sous l'effet de l'oxydation et de l'infiltration. De plus, la présente invention permet de réduire la distorsion d'une image affichée et d'améliorer la visibilité.
PCT/KR2023/007280 2022-05-26 2023-05-26 Module d'affichage à del transparent ayant une structure étanche à l'eau et à la poussière, et procédé pour le fabriquer WO2023229426A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0064674 2022-05-26
KR1020220064674A KR102639991B1 (ko) 2022-05-26 2022-05-26 방수 및 방진 구조를 갖는 투명 led 디스플레이 모듈 및 이의 제조방법

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WO2023229426A1 true WO2023229426A1 (fr) 2023-11-30

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070083213A (ko) * 2006-02-20 2007-08-23 가부시키가이샤 히타치 디스프레이즈 유기 ｅｌ 표시 장치
KR102051886B1 (ko) * 2019-04-01 2019-12-05 주식회사 라훔나노테크 투명 엘이디 디스플레이 장치 및 그 제조방법
KR20200045912A (ko) * 2018-10-23 2020-05-06 한국유리공업 주식회사 투명 발광다이오드 필름
KR20210099461A (ko) * 2020-02-04 2021-08-12 주식회사 국영지앤엠 투명 엘이디 디스플레이 패널 및 이의 제조 방법
KR20220038657A (ko) * 2015-05-29 2022-03-29 엘지디스플레이 주식회사 유기발광 표시장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101188747B1 (ko) 2012-07-18 2012-10-10 지스마트 주식회사 투명전광판 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070083213A (ko) * 2006-02-20 2007-08-23 가부시키가이샤 히타치 디스프레이즈 유기 ｅｌ 표시 장치
KR20220038657A (ko) * 2015-05-29 2022-03-29 엘지디스플레이 주식회사 유기발광 표시장치
KR20200045912A (ko) * 2018-10-23 2020-05-06 한국유리공업 주식회사 투명 발광다이오드 필름
KR102051886B1 (ko) * 2019-04-01 2019-12-05 주식회사 라훔나노테크 투명 엘이디 디스플레이 장치 및 그 제조방법
KR20210099461A (ko) * 2020-02-04 2021-08-12 주식회사 국영지앤엠 투명 엘이디 디스플레이 패널 및 이의 제조 방법

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