WO2023229188A1 - Film de polyester et procédé de fabrication associé - Google Patents
Film de polyester et procédé de fabrication associé Download PDFInfo
- Publication number
- WO2023229188A1 WO2023229188A1 PCT/KR2023/003961 KR2023003961W WO2023229188A1 WO 2023229188 A1 WO2023229188 A1 WO 2023229188A1 KR 2023003961 W KR2023003961 W KR 2023003961W WO 2023229188 A1 WO2023229188 A1 WO 2023229188A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyester film
- film
- inorganic filler
- dielectric constant
- paragraph
- Prior art date
Links
- 229920006267 polyester film Polymers 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229920001123 polycyclohexylenedimethylene terephthalate Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 229910052623 talc Inorganic materials 0.000 claims abstract description 33
- 239000000454 talc Substances 0.000 claims abstract description 32
- 239000011256 inorganic filler Substances 0.000 claims abstract description 29
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical group OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- 150000002009 diols Chemical class 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 238000009998 heat setting Methods 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 3
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 229910001593 boehmite Inorganic materials 0.000 claims description 3
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 3
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 3
- 239000004571 lime Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 11
- 230000000052 comparative effect Effects 0.000 description 14
- 239000003963 antioxidant agent Substances 0.000 description 11
- 239000002994 raw material Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical group OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- -1 alkali metal salt Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- 229940031723 1,2-octanediol Drugs 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- YUQDBHFUUCAXOX-UHFFFAOYSA-N 2,2-diethylpentane-1,5-diol Chemical compound CCC(CC)(CO)CCCO YUQDBHFUUCAXOX-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- LNFDWQCEHXSMLT-UHFFFAOYSA-N 5-methylhexane-1,5-diol Chemical compound CC(C)(O)CCCCO LNFDWQCEHXSMLT-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 241000270457 Lacerta Species 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000007573 shrinkage measurement Methods 0.000 description 1
- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
- B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
- B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
Definitions
- Embodiments relate to polyester films and methods of making them.
- films must have a low dielectric constant to minimize signal loss or delay, and must also have a low shrinkage rate at high temperatures. Additionally, rigidity must be high to minimize film deformation.
- PCT polycyclohexylenedimethylene terephthalate
- moisture absorption, etc. are suitable for high-frequency antenna films, but there is a need to further improve high-temperature shrinkage and dielectric constant.
- the purpose of the embodiment is to provide a polyester film with improved high-temperature shrinkage and dielectric constant by adding an inorganic filler, and a method for manufacturing the same.
- the polyester film according to the embodiment is,
- the dielectric constant may be less than 2.5 at a frequency of 100 kHz.
- the inorganic filler includes at least one selected from the group consisting of talc, boehmite, alumina, silica, titania, lime, barium titanate, alumina-silica complex oxide, boron nitride, barium sulfate, and calcium fluoride. can do.
- the hot air condition is a condition in which hot air at a temperature of 150° C. is applied to the polyester film and left for 30 minutes.
- the longitudinal (machine direction) shrinkage rate of the polyester film may be 1.2% to 2.05%, and the width direction shrinkage rate may be 0.1% to 0.7%.
- the polycyclohexylenedimethylene terephthalate resin includes a repeating unit derived from a dicarboxylic acid-based compound and a repeating unit derived from a diol-based compound,
- the repeating unit derived from the dicarboxylic acid-based compound may include 80 mol% to 100 mol% of terephthalic acid residues and 0 mol% to 20 mol% of isophthalic acid residues.
- the polyester film may have a dielectric loss of 0.006 or less at a frequency of 100 kHz.
- the polyester film may have a dielectric loss of 0.006 or less at a frequency of 50 kHz and a dielectric constant of 2.6 or less at a frequency of 50 kHz.
- the dielectric constant may be 2.5 to 2.8 at any frequency between 3 GHz and 10 GHz.
- the dielectric constant may be 2.55 to 2.8 at frequencies greater than 10 GHz and less than or equal to 100 GHz.
- the polyester film may have a ratio of dielectric constant at a frequency of 50 kHz/dielectric constant at a frequency of 100 kHz of 0.85 to 1.2.
- the polyester film may have a longitudinal (machine direction) shrinkage of 1.5% to 2% under the hot air conditions, and a width direction shrinkage of 0.2% to 0.6% under the hot air conditions.
- the inorganic filler may be included in an amount of 1% to 6% by weight based on the total weight.
- the manufacturing method of the polyester film according to the embodiment is,
- composition for producing the film is,
- the base resin includes polycyclohexylenedimethylene terephthalate resin
- the inorganic filler composition may include 70 to 90 wt% of the basic resin and 10 to 23.3 wt% of the inorganic filler.
- the stretching step is,
- It includes a width direction stretching process of stretching the sheet that has undergone the longitudinal stretching process 3.3 times to 4.5 times in the width direction at a temperature of 110 °C to 130 °C, and heat setting the sheet stretched in the width direction at a temperature of 200 °C to 250 °C. can do.
- the polyester film according to the embodiment contains polycyclohexylenedimethylene terephthalate resin and an appropriate amount of inorganic filler, so that the film exhibits good high-temperature shrinkage, dielectric properties, and rigidity, and has physical properties suitable for application to high-frequency communication components. can be satisfied.
- Figure 1 (a) is a photograph taken at 3,000x magnification of the cross-section of the PCT film of Example 1 through a scanning electron microscope.
- Figures 1 (b) and (c) are photographs taken at 500x and 1000x magnification, respectively, of the cross-section of the PCT film of Example 1 through a scanning electron microscope.
- Figure 2 (a) is a photograph taken at 3,000x magnification of the cross-section of the PCT film of Example 2 through a scanning electron microscope.
- Figures 2 (b) and (c) are photographs taken at 500x and 1000x magnification, respectively, of the cross-section of the PCT film of Example 2 through a scanning electron microscope.
- Figure 3 (a) is a photograph taken at 3,000x magnification of the cross-section of the PCT film of Comparative Example 1 through a scanning electron microscope.
- Figures 3 (b) and (c) are photographs taken at 500x and 1000x magnification, respectively, of the cross-section of the PCT film of Comparative Example 1 through a scanning electron microscope.
- B being positioned on A means that B is positioned in direct contact with A or that B is positioned on A with another layer positioned in between, and B is positioned in contact with the surface of A. It is not interpreted as limited to doing so.
- the term "combination thereof" included in the Markushi format expression means a mixture or combination of one or more components selected from the group consisting of the components described in the Markushi format expression, It means including one or more selected from the group consisting of.
- the polyester film according to the embodiment is,
- the dielectric constant may be less than 2.5 at a frequency of 100 kHz.
- the polycyclohexylenedimethylene terephthalate (PCT) resin of the polyester film may be a copolymerization of a dicarboxylic acid-based compound and a diol-based compound, and may include residues and repeating units derived therefrom.
- the dicarboxylic acid-based repeating unit may include 80 mol% or more, 90 mol% or more, and 100 mol% or less of terephthalic acid residues, and 20 mol% or less and 10 mol% or less of isophthalic acid residues, based on a total of 100 mol%. It may be included in 0 mol% or more, 1 mol% or more, or 2 mol% or more.
- the diol-based repeating unit may include 70 mol% or more, 80 mol% or more, 90 mol% or more, and 100 mol% or less of cyclohexanedimethanol residues, based on 100 mol% of the total.
- the dicarboxylic acid-based repeating unit includes terephthalic acid residues and isophthalic acid residues in the above amounts, it may have relatively high melting point characteristics and low crystallization characteristics.
- the diol-based repeating unit may further include the following diol-based repeating units other than the cyclohexanedimethanol.
- the polycyclohexylenedimethylene terephthalate resin may have a weight average molecular weight (Mw) of 30,000 g/mol to 50,000 g/mol, and may be 30,000 g/mol to 40,000 g/mol.
- a catalyst may be applied to the polycyclohexylenedimethylene terephthalate resin to improve the efficiency of the polymerization reaction.
- the catalyst may be included in an amount of 0.1 ppm to 500 ppm, and 0.5 ppm to 100 ppm, based on 100 parts by weight of polycyclohexylenedimethylene terephthalate.
- the catalyst may be a titanium-based compound, an antimony-based compound, a germanium-based compound, an aluminum-based compound, or a mixture thereof.
- the catalyst may be a titanium-based compound.
- the titanium-based compound may include titanium tetraisopropoxide.
- Antioxidants may be applied to the polymerization of the polycyclohexylenedimethylene terephthalate resin.
- the antioxidant may be applied as needed for the purpose of suppressing thermal oxidation at the temperature at which the esterification reaction occurs. However, it is common to apply an appropriate amount of antioxidants at this time. If an excessive amount of antioxidant is added during polymerization, there is a risk of delaying the reaction and may cause a decrease in the intrinsic viscosity of the produced resin. Antioxidants that affect resin polymerization are consumed during the polymerization process and can be distinguished from antioxidants added during subsequent film production.
- the antioxidants may include phenol-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants.
- the antioxidant may be included in an amount of 0.01 to 1 part by weight based on 100 parts by weight of the polycyclohexylenedimethylene terephthalate.
- the polycyclohexylenedimethylene terephthalate resin may further include an electrostatic applicator.
- the electrostatic applicator may be an alkali metal salt or an alkaline earth metal salt, and a magnesium-based compound or a calcium-based compound may be used. For example, magnesium acetate or calcium acetate may be used.
- the electrostatic applicator may have a metal or metal ion content of 300 ppm to 1000 ppm.
- the inorganic filler included in the polyester film may include talc, boehmite, alumina, silica, titania, lime, barium titanate, alumina-silica composite oxide, boron nitride, barium sulfate, calcium fluoride, etc., and the inorganic filler may be talc.
- the talc is a silicate mineral containing magnesium and may be Mg 3 Si 4 O 10 (OH) 2 or H 2 Mg 3 (SiO 3 ) 4 .
- the inorganic filler may be included in an amount of 0.3% to 7% by weight, 1% to 6% by weight, 3% to 5.5% by weight, and 4% to 5% by weight based on the total weight of the polyester film. may be included.
- the high-temperature shrinkage rate, dielectric properties, and rigidity of the film can be adjusted to the desired range, and physical properties suitable for application to high-frequency communication components can be satisfied.
- a polyester film containing talc as the inorganic filler in the above content may have reduced dielectric constant, dielectric constant, and high-temperature shrinkage, and increased rigidity, compared to a polyester film containing bulk silica rather than talc.
- the particle size of the talc may be 1 ⁇ m to 10 ⁇ m, 2 ⁇ m to 8 ⁇ m, and 3 ⁇ m to 6 ⁇ m. Talc having this particle size can be applied to a polyester film to prevent damage to the film but to have the desired dielectric properties, high temperature shrinkage, and rigidity.
- the polyester film may have a dielectric loss of 0.006 or less, 0.0055 or less, 0.0049 or less, and 0.0033 or less at a frequency of 100 kHz. At a frequency of 100 kHz, the dielectric loss may be greater than 0.001 and greater than 0.002.
- the polyester film may have a dielectric constant of 2.5 or less and 2.48 or less at a frequency of 100 kHz. At a frequency of 100 kHz, the dielectric constant may be greater than 1.5, and may be greater than 2.
- the polyester film may have a dielectric loss of 0.006 or less, 0.0055, 0.0049 or less, and 0.0032 or less at a frequency of 50 kHz. At a frequency of 50 kHz, the dielectric loss may be greater than 0.001 and greater than 0.002.
- the polyester film may have a dielectric constant of 2.6 or less, 2.55 or less, and 2.51 or less at a frequency of 50 kHz. At a frequency of 50 kHz, the dielectric constant may be greater than 1.5, and may be greater than 2.
- the polyester film may have a ratio of dielectric constant at a frequency of 50 kHz/dielectric constant at a frequency of 100 kHz of 0.85 to 1.2, 0.9 to 1.15, and 0.95 to 1.1.
- polyester film Since the polyester film has these dielectric properties and ratios at the frequencies of 100 kHz and 50 kHz, signal delay and loss can be minimized when applied to communication components.
- the polyester film may have a dielectric constant of 2.5 to 2.8, 2.5 to 2.7, or 2.5 to 2.6 at any frequency from 3 GHz to 10 GHz.
- the polyester film may have a dielectric constant of 2.25 to 2.8, 2.5 to 2.7, or 2.5 to 2.6 at 10 GHz.
- the polyester film may have a dielectric constant of 2.55 to 2.8, or 2.6 to 2.7, at any frequency between 10 GHz and 100 GHz.
- the polyester film may have a dielectric constant of 2.4 to 2.8, 2.45 to 2.7, or 2.5 to 2.69 at 28 GHz.
- the polyester film has these dielectric properties at GHz-level frequencies, so when applied to antennas that require high frequencies such as 5G, flexible copper clad laminate (FCCL), etc., it has low dielectric loss, enabling smooth communication with less data loss. there is.
- the dielectric constant and dielectric constant can be measured through the method of the following experimental example.
- the polyester film may have a longitudinal (machine direction, MD) shrinkage of 1.2% to 2.05% and 1.5% to 2% under hot air conditions of applying hot air at a temperature of 150° C. and leaving it for 30 minutes.
- MD machine direction
- the polycyclohexylenedimethylene terephthalate film may have a width direction (TD) shrinkage of 0.1% to 0.7% and 0.2% to 0.6% under the hot air conditions.
- TD width direction
- the polycyclohexylenedimethylene terephthalate film has such shrinkage rates in the longitudinal and width directions, deterioration or peeling of the film can be minimized at high temperatures.
- the shrinkage rate can be calculated as follows.
- Shrinkage rate (%) ⁇ (original length - length after shrinkage)/(original length) ⁇ 100%
- the shrinkage rate can be measured through the method of the following experimental example.
- the polyester film may have a longitudinal (machine direction, MD) stiffness of 0.45 to 0.7 and 0.5 to 0.65, as measured by a loop stiffness tester (Toyoseiki).
- the polyester film may have a transverse direction (TD) rigidity of 0.5 to 0.75, as measured by the rigidity measuring device, and 0.53 to 0.7.
- TD transverse direction
- polyester film Since the polyester film has such Young's modulus and rigidity characteristics, it can minimize deformation when applied to high-frequency communication components, etc., and maintain good quality.
- the polyester film may have a Young's modulus (elastic modulus) of 245 kgf/mm 2 to 275 kgf/mm 2 and 250 kgf/mm 2 to 270 kgf/mm 2 .
- polyester film Since the polyester film has such Young's modulus and rigidity, it can minimize deformation due to heat or force when applied to high-frequency communication components.
- the thickness of the polycyclohexylenedimethylene terephthalate film may be 1 ⁇ m to 1000 ⁇ m, and 10 ⁇ m to 500 ⁇ m.
- the antenna according to the embodiment may include the polyester film described above.
- the antenna may be a 5G antenna.
- the polyester film exhibits low dielectric constant, low high-temperature shrinkage, and high rigidity, so it can be excellently utilized as an antenna film.
- the polyester film has excellent usability as a film for 5G antennas.
- the method for producing a polyester film according to an embodiment is,
- composition for producing the film is,
- the base resin includes polycyclohexylenedimethylene terephthalate resin
- the inorganic filler composition may include 76.7% to 90% by weight of the base resin and 10% to 23.3% by weight of talc.
- the polyester film manufacturing method may further include a drying step of drying the film manufacturing composition before the melting step.
- the drying step may be carried out at a temperature of 150°C or lower and 100°C or higher. When drying is performed at this temperature, efficient drying is possible while substantially suppressing discoloration of the resin.
- the inorganic filler of the composition for producing the film may be substantially the same as the inorganic filler of the polyester film described above.
- the extrusion in the sheet forming step may be carried out at a temperature of 230 °C to 300 °C, and may be carried out at a temperature of 250 °C to 290 °C.
- stretching in the longitudinal direction and width direction may be performed after preheating.
- the preheating may be performed in a range that satisfies Tg+5°C to Tg+50°C based on the glass transition temperature (Tg) of the polycyclohexylenedimethylene terephthalate resin, and Tg+10°C to Tg+20°C. It can proceed within the range that satisfies. By satisfying this temperature range, the film can secure the flexibility necessary for stretching and minimize breakage during the stretching process.
- the stretching step may include a longitudinal direction (machine direction, MD) stretching process and a transverse direction (TD) stretching process.
- MD machine direction
- TD transverse direction
- the stretching step is a longitudinal stretching process of stretching the sheet 2.5 to 3.5 times in the longitudinal direction at a temperature of 80 °C to 95 °C, and
- It includes a width direction stretching process of stretching the sheet that has undergone the longitudinal stretching process 3.3 times to 4.5 times in the width direction at a temperature of 110 °C to 130 °C, and heat setting the sheet stretched in the width direction at a temperature of 200 °C to 250 °C. can do.
- the stretching speed of the stretching step may be 6.5 m/min to 8.5 m/min.
- the heat setting in the stretching step may be performed for 5 seconds to 600 seconds, or may be performed for 10 seconds to 200 seconds.
- the film that has undergone heat setting in the stretching step may be relaxed to a certain extent in the longitudinal direction and/or the width direction, the temperature at the time of relaxation may be 150°C to 250°C, and the relaxation rate may be 1% to 10% and 3% to 7%. It can be.
- a film having the desired physical properties can be provided by applying conditions such as appropriate temperature when stretching in the longitudinal and width directions based on a manufacturing composition containing an inorganic filler.
- a monomer mixture containing 100 mol% of cyclohexanedimethanol (CHDM) as a diol-based compound and 96 mol% of terephthalic acid (TPA) and 4 mol% of isophthalic acid (IPA) as a dicarboxylic acid-based compound was added to a stirrer. After adding 1 ppm of titanium catalyst based on 100 parts by weight of the mixture, a transesterification reaction was performed at 275°C.
- CHDM cyclohexanedimethanol
- TPA terephthalic acid
- IPA isophthalic acid
- the transesterified material was transferred to a separate reactor equipped with vacuum equipment, and then polymerized at 285°C for 160 minutes to obtain polycyclohexylenedimethylene terephthalate (PCT) resin.
- PCT polycyclohexylenedimethylene terephthalate
- the PCT resin was processed into basic resin chips, and others were processed into talc composition chips.
- the talc composition chip contained 80% by weight of the PCT resin and 20% by weight of talc.
- the raw material mixed with 85% by weight of the basic resin chips and 15% by weight of the talc composition chips was dried at a temperature of 140°C. Afterwards, the raw materials were put into an extruder, extruded into a sheet form at a temperature of about 295°C, and casted on a casting roll. After preheating, the extruded sheet was stretched 2.7 times in the longitudinal direction (MD) at a temperature of 95°C, and then stretched 3.5 times in the transverse direction (TD) at a temperature of 110°C. Afterwards, the stretched sheet was heat-set at a temperature of 220° C. for about 30 seconds and relaxed to prepare a PCT film with a thickness of 25 ⁇ m.
- MD longitudinal direction
- TD transverse direction
- Example 1 a longitudinal stretching ratio of 2.9 times was applied, and the remaining conditions were the same as in Example 1 to prepare a PCT film.
- Example 1 the talc composition chip content of the raw material was applied to 25% by weight and the basic resin chip weight was 75% by weight, and the remaining conditions were the same as Example 1 to prepare a PCT film.
- Example 1 the talc composition chip content of the raw material was applied to 25% by weight, the basic resin chip weight was 75% by weight, the longitudinal stretching ratio was applied at 2.9 times, and the remaining conditions were the same as Example 1.
- a PCT film was prepared.
- Example 1 the basic resin chip was used as a raw material, a mixture of 375 ppm of bulk silica compared to the basic resin chip was used, the longitudinal stretching ratio was applied at 2.9 times, and the remaining conditions were the same as Example 1 to produce a PCT film. was manufactured.
- Example 1 Talc composition 15 wt% Basic balance remaining 3wt% MD 2.7 times TD 3.5 times MD 95°C TD 110°C Heat setting 220°C
- Example 2 Talc composition 15 wt% Basic balance remaining 3wt% MD 2.9 times TD 3.5 times
- Example 3 Talc composition 25 wt% Basic balance remaining 5wt% MD 2.7 times TD 3.5 times
- Example 4 Talc composition 25 wt% Basic balance remaining 5wt% MD 2.9 times TD 3.5 times Comparative Example 1 Massive silica 375 ppm Basic balance remaining - MD 2.9 times TD 3.5 times
- Figure 1 (a) is a photograph of the cross-section of the PCT film of Example 1 taken at 3,000 times through a scanning electron microscope
- Figures 1 (b) and (c) are cross-sections of the PCT film of Example 1 through a scanning electron microscope. These photos were taken at 500x and 1000x magnification, respectively.
- Figure 2 (a) is a photograph of the cross-section of the PCT film of Example 2 taken at 3,000 times through a scanning electron microscope
- Figures 2 (b) and (c) are cross-sections of the PCT film of Example 2 through a scanning electron microscope. These photos were taken at 500x and 1000x magnification, respectively.
- Figure 3 (a) is a photograph of the cross-section of the PCT film of Comparative Example 1 taken at 3,000 times through a scanning electron microscope
- Figures 3 (b) and (c) are cross-sections of the PCT film of Comparative Example 1 through a scanning electron microscope. These photos were taken at 500x and 1000x magnification, respectively.
- the dielectric constant and dielectric constant of the PCT films prepared in Examples 1 to 4 and Comparative Example 1 were measured as follows. Samples were prepared by cutting each film to a size of 20 mm ⁇ 20 mm, and space charge distribution was generated using a DETA (DS6000) analyzer from Lacerta Technology at 50 kHz, 100 kHz, 3 GHz to 10 GHz, and 10 The dielectric constant and dielectric constant were measured at room temperature at frequencies exceeding GHz and below 100 GHz, and the results are shown in Tables 2 and 3.
- the shrinkage rate of the PCT films prepared in Examples 1 to 4 and Comparative Example 1 was measured as follows. Samples were cut so that the direction to be measured of each film was 15 mm and the direction perpendicular to it was 1 mm, and each sample was placed in a hot air oven and left at 150°C for 30 minutes. The degree to which the 15 mm length was reduced was measured and the shrinkage rate was calculated according to Equation 1 below, and the results are shown in Table 2.
- Shrinkage rate (%) ⁇ (original length - length after shrinkage)/(original length) ⁇ 100%
- the rigidity of the PCT films prepared in Examples 1 to 4 and Comparative Example 1 was measured as follows. Samples were cut so that the length of each film in the direction to be measured was 117 mm and the direction perpendicular to it was 15 mm, and each sample was mounted in a round shape using a Loop stiffness tester from Toyoseiki. The initial value measured when the rolled film touched the load cell was measured, and the results are shown in Table 2.
- Example 1 3wt% 2.50 / 2.47 0.0031 / 0.0032 1.90 / 0.35 0.50 / 0.58
- Example 2 3wt% 2.51 / 2.48 0.0031 / 0.0031 2.01 / 0.45 0.55 / 0.58
- Example 3 5wt% 2.47 / 2.38 0.0029 / 0.0030 1.75 / 0.26 0.54 / 0.53
- Example 4 5wt% 2.42 / 2.37 0.0029 / 0.0028 1.89 / 0.27 0.56 / 0.54 Comparative Example 1 - 2.65 / 2.55 0.0033 / 0.0035 2.11 / 0.83 0.39 / 0.46
- the PCT films of the examples having an appropriate talc content have a lower dielectric constant and a lower high temperature (150° C.) shrinkage compared to the PCT film of the comparative example containing bulk silica but not talc. It was confirmed that it had improved rigidity.
- the above examples have a low dielectric constant, low high temperature shrinkage, and high rigidity, so they are expected to be excellent for use as antenna films, and are particularly suitable as films for 5G antennas.
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Abstract
Dans un mode de réalisation, l'invention concerne un film de polyester et un procédé de fabrication associé, le film de polyester comprenant une résine de poly(téréphtalate de cyclohexylènediméthylène) et une charge inorganique, comprenant 0,3 à 7 % en poids de talc par rapport à son poids total, et ayant une permittivité de 2,5 ou moins pour une fréquence de 100 kHz. Le film de polyester selon le mode de réalisation comprend la résine de poly(téréphtalate de cyclohexylènediméthylène) et une quantité appropriée de la charge inorganique et peut donc présenter des propriétés diélectriques au retrait à haute température et une rigidité satisfaisantes et satisfait à des propriétés permettant une application à des composants de communication haute fréquence.
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Citations (5)
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KR20120136195A (ko) * | 2011-06-08 | 2012-12-18 | 삼성정밀화학 주식회사 | 전방향족 폴리에스테르 아미드 공중합체 수지, 및 이를 포함하는 고분자 필름, 연성 금속박 적층판 및 인쇄 회로기판 |
KR20210132014A (ko) * | 2019-02-15 | 2021-11-03 | 스미또모 가가꾸 가부시끼가이샤 | 필름 및 적층체 |
KR20220042051A (ko) * | 2019-07-31 | 2022-04-04 | 도레이 카부시키가이샤 | 열가소성 폴리에스테르 수지, 열가소성 폴리에스테르 수지 조성물, 및 성형품 |
KR20220047847A (ko) * | 2019-08-21 | 2022-04-19 | 티코나 엘엘씨 | 저 유전손실 계수를 갖는 중합체 조성물을 포함하는 안테나 시스템 |
KR20220053850A (ko) * | 2020-10-23 | 2022-05-02 | 에스케이씨 주식회사 | 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판 |
-
2023
- 2023-03-24 WO PCT/KR2023/003961 patent/WO2023229188A1/fr unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20120136195A (ko) * | 2011-06-08 | 2012-12-18 | 삼성정밀화학 주식회사 | 전방향족 폴리에스테르 아미드 공중합체 수지, 및 이를 포함하는 고분자 필름, 연성 금속박 적층판 및 인쇄 회로기판 |
KR20210132014A (ko) * | 2019-02-15 | 2021-11-03 | 스미또모 가가꾸 가부시끼가이샤 | 필름 및 적층체 |
KR20220042051A (ko) * | 2019-07-31 | 2022-04-04 | 도레이 카부시키가이샤 | 열가소성 폴리에스테르 수지, 열가소성 폴리에스테르 수지 조성물, 및 성형품 |
KR20220047847A (ko) * | 2019-08-21 | 2022-04-19 | 티코나 엘엘씨 | 저 유전손실 계수를 갖는 중합체 조성물을 포함하는 안테나 시스템 |
KR20220053850A (ko) * | 2020-10-23 | 2022-05-02 | 에스케이씨 주식회사 | 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판 |
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