WO2023226751A1 - 显示面板与显示装置 - Google Patents

显示面板与显示装置 Download PDF

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Publication number
WO2023226751A1
WO2023226751A1 PCT/CN2023/093067 CN2023093067W WO2023226751A1 WO 2023226751 A1 WO2023226751 A1 WO 2023226751A1 CN 2023093067 W CN2023093067 W CN 2023093067W WO 2023226751 A1 WO2023226751 A1 WO 2023226751A1
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WIPO (PCT)
Prior art keywords
layer
touch
display
metal
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/093067
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English (en)
French (fr)
Other versions
WO2023226751A9 (zh
Inventor
石佳凡
陈立强
张胜星
杨阳
柳文良
张鑫
万杨杰
尹倩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/701,940 priority Critical patent/US12379803B2/en
Publication of WO2023226751A1 publication Critical patent/WO2023226751A1/zh
Publication of WO2023226751A9 publication Critical patent/WO2023226751A9/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features

Definitions

  • Embodiments of the present disclosure relate to, but are not limited to, the field of display technology, and in particular, to a display panel and a display device.
  • a display panel generally includes a display substrate and a touch layer.
  • the touch layer is located above the encapsulation layer of the display substrate.
  • the touch layer includes touch electrodes and touch traces.
  • the touch traces are used to connect the touch electrodes and the driving circuit to realize the touch function of the display panel.
  • touch traces are usually laid out in the frame area of the touch layer, which greatly limits the further development of narrow frames for display panels and does not conform to the development trend of narrow frames for display devices.
  • an embodiment of the present disclosure provides a display panel, the display panel having a display area and a non-display area surrounding the display area, the non-display area including a frame area, the display panel including: A substrate, the display substrate includes a first metal layer, and the first metal layer is provided with metal leads; a touch layer is located on the upper layer of the display substrate, and the touch layer is provided with touch electrodes and the touch layer.
  • touch traces connected to control electrodes, and the touch electrodes are located on the display display area; a driving circuit, arranged in the non-display area; a wire hole, the wire hole is located in the frame area, and the touch wiring passes through the wire hole and the metal of the first metal layer Lead wires are connected, and the metal leads are configured to be connected to the driving circuit.
  • via holes are provided in the frame area, so that the touch traces connected to the touch electrodes are connected to the metal leads of the first metal layer through the via holes, and the metal leads are connected to the driving circuit, thereby The touch signal between the touch electrode and the driving circuit is transmitted through the touch wiring and the metal lead.
  • the display substrate further includes a substrate layer, a driving layer, a display layer and an encapsulation layer that are stacked in sequence.
  • the touch layer is located on a side of the encapsulation layer away from the substrate layer
  • the touch traces enter the via holes and are connected to the metal leads in a direction parallel to the encapsulation layer at the frame area.
  • the display panel further includes a first isolation dam, a second isolation dam and a crack dam disposed around the display area.
  • the first isolation dam, the second isolation dam and the crack dam are The crack dam is located in the non-display area, the second isolation dam is located on a side of the first isolation dam away from the display area, and the crack dam is located on a side of the second isolation dam away from the display area.
  • the wire passage hole is located between the second isolation dam and the crack dam.
  • the substrate layer includes a first liner plate and a second liner plate, and the first metal layer is located between the first liner plate and the second liner plate.
  • the display panel further includes a second metal layer, the second metal layer is located on the driving layer, and the via hole includes a first via hole and a second via hole,
  • the touch traces overlap with the second metal layer through the first via holes, and the second metal layer overlaps with the first metal layer through the second via holes.
  • the driving layer includes a stacked first insulating layer, a second insulating layer, an interlayer dielectric layer and a planar layer, and the second metal layer is located between the first insulating layer and the between the second insulating layer, or the second metal layer is located between the second insulating layer and the interlayer dielectric layer.
  • the display panel further includes a second metal layer and a third metal layer, the second metal layer and the third metal layer are located on the driving layer, and the via hole includes The first via hole, the second via hole and the third via hole.
  • the touch trace overlaps the third metal layer through the first via hole.
  • the third metal layer passes through the first via hole.
  • the second via hole overlaps with the second metal layer, and the second metal layer overlaps with the first metal layer through the third via hole.
  • the driving layer includes a stacked first insulating layer, a second insulating layer, an interlayer dielectric layer and a planar layer, and the second metal layer is located between the first insulating layer and the between the second insulating layer, and the third metal layer is located between the second insulating layer and the interlayer dielectric layer.
  • the touch electrodes include touch transmitting electrodes and touch receiving electrodes, the touch transmitting electrodes and the touch receiving electrodes are arranged insulated and crossed, and the touch traces include a third A touch control wire and a second touch control wire, the metal lead includes a first metal lead and a second metal lead, one end of the first touch control wire is connected to the touch emitter electrode, and the third touch control wire The other end of a touch trace is connected to the first metal lead, the first touch trace extends to the wire hole in the first direction, and one end of the second touch trace is connected to the The touch receiving electrode is connected, the other end of the second touch trace is connected to the second metal lead, and the second touch trace extends to the wire hole along the second direction.
  • the driving layer is provided with a thin film transistor in the display area.
  • the thin film transistor includes a gate electrode, an active area, a source electrode and a drain electrode.
  • the source electrode and the drain electrode It is connected to the active area through via holes provided in the first insulating layer, the second insulating layer and the interlayer dielectric layer.
  • the non-display area further includes a bending area and a binding area adjacent to the bending area, and the bending area is located in the border area away from the display area.
  • the binding area is located on the side of the bending area away from the frame area
  • the driving circuit is located in the binding area
  • the bending area is provided with signal leads
  • the signal leads are connected to The driving circuit is connected, and the signal lead is used to transmit signals, and the signal lead and the metal lead are arranged on the same layer.
  • an embodiment of the present disclosure provides a display device, including the display panel according to any of the above embodiments.
  • Figure 1 is a schematic diagram of a display panel provided by an embodiment of the present disclosure
  • Figure 2 is a schematic wiring diagram of a display panel provided by an embodiment of the present disclosure
  • Figure 3 is a cross-sectional view of a display panel taken along line B-B according to the first embodiment of the present disclosure
  • Figure 4 is a cross-sectional view of a display panel taken along D-D according to the first embodiment of the present disclosure
  • Figure 5 is a cross-sectional view of a display panel taken along line B-B according to the second embodiment of the present disclosure
  • Figure 6 is a cross-sectional view of a display panel taken along line B-B according to the third embodiment of the present disclosure
  • FIG. 7 is a cross-sectional view of a display panel taken along line B-B according to the fourth embodiment of the present disclosure.
  • FIG. 8 is a cross-sectional view of a display panel taken along C-C according to an embodiment of the present disclosure.
  • the display panel 10 has a display area AA and a non-display area surrounding the display area AA, and the non-display area includes a frame area BA.
  • the display panel 10 includes a display substrate, a touch layer 500 , a driving circuit 900 and a via hole 700 .
  • the display substrate includes a first metal layer 600, and the first metal layer 600 is provided with metal leads.
  • the touch layer 500 is located on the upper layer of the display substrate.
  • the touch layer 500 is provided with touch electrodes 510 and touch traces 520 connected to the touch electrodes 510 .
  • the touch electrode 510 is located in the display area AA.
  • the driving circuit 900 is provided in the non-display area.
  • the via hole 700 is located in the frame area BA.
  • the touch trace 520 is connected to the metal lead of the first metal layer 600 through the via hole 700.
  • the metal lead Set to be connected to the driving circuit 900.
  • the touch wires 520 are connected to the metal leads after passing through the wire holes 700, thereby preventing the touch wires 520 from extending on the packaging layer 400 along the vertical direction of the packaging layer 400, reducing the The flatness of the encapsulation layer 400 in the frame area BA requires reducing the size of the frame area BA.
  • the display panel further includes a substrate layer 100, a driving layer 200, a display layer 300 and an encapsulation layer 400 that are stacked in sequence.
  • the touch layer 500 is located on a side of the encapsulation layer 400 away from the substrate layer 100 .
  • the touch trace 520 enters the wire hole 700 and is connected to the metal lead in a direction parallel to the packaging layer 400 at the frame area BA (eg, the slope direction)
  • the impact of the leveling slope on the touch control can be reduced.
  • the influence of the wiring 520 reduces the flatness requirement of the packaging layer 400 in the frame area BA and reduces the size of the frame area BA.
  • an embodiment of the first aspect of the present disclosure provides a display panel 10 .
  • the display panel 10 has a display area AA and a non-display area surrounding the display area AA, and the non-display area includes a frame area BA.
  • the display panel 10 includes a display substrate, a touch layer 500 , a driving circuit 900 and a via hole 700 .
  • the display substrate includes a substrate layer 100, a driving layer 200, a display layer 300 and an encapsulation layer 400 that are stacked in sequence.
  • the touch layer 500 is located on a side of the encapsulation layer 400 away from the display layer 300 .
  • the touch layer 500 is provided with touch electrodes 510 and touch traces 520 connected to the touch electrodes 510 .
  • the touch electrode 510 is located in the display area AA.
  • the driving circuit 900 is provided in the non-display area.
  • the via hole 700 is located in the frame area BA.
  • the display substrate also includes a first metal layer 600.
  • the first metal layer 600 is provided with metal leads.
  • the touch traces 520 are connected to the metal leads through the via holes 700.
  • the metal leads are arranged to connect to the driver. Circuit 900 connection.
  • the display panel 10 of the embodiment of the present disclosure provides wire via holes 700 in the frame area BA, so that the touch traces 520 connected to the touch electrodes 510 are connected to the metal leads of the first metal layer 600 through the wire holes 700.
  • the leads are connected to the drive circuit 900, so that the touch signal between the touch electrode 510 and the drive circuit 900 is transmitted through the touch traces 520 and the metal leads.
  • the encapsulation layer 400 generally includes an organic encapsulation layer 402.
  • the thickness consistency of the organic encapsulation layer 402 in the frame area BA is poor and there is a leveling slope.
  • the touch traces 520 will move along the process of being connected to the driving circuit 900.
  • the touch traces 520 extending in the direction perpendicular to the leveling slope are prone to short circuit or open circuit. Therefore, in related technologies, the requirements for the flatness of the organic encapsulation layer 402 in the frame area BA are relatively high. Accordingly, in order to ensure Due to the flatness of the organic encapsulation layer 402 and the safe wiring space for the touch traces 520, the design size of the frame area BA is relatively large.
  • the embodiment of the present disclosure sets the via hole 700 so that the touch trace 520 enters the via hole 700 in a direction parallel to the leveling slope and then is connected to the metal lead, thereby preventing the touch trace 520 from being exposed in the package.
  • the layer 400 extends in a direction perpendicular to the leveling slope to reduce the impact of the leveling slope on the touch traces 520, thereby reducing the flatness requirements of the packaging layer 400 in the frame area BA and reducing the size of the frame area BA.
  • the metal leads can be located not only in the frame area BA but also in the display area AA, which can further reduce the size of the frame area BA and reduce the size of the touch traces 520 and metal Difficulty of routing the leads.
  • the touch layer 500 is directly formed on the display substrate using Flexible Multilayer On Cell (FMLOC) technology.
  • the touch layer 500 may include a touch metal layer, a touch insulation layer 503, a barrier layer 501, a protective film layer 505, etc. These film layers are directly formed on the packaging layer of the display substrate through deposition, exposure, development, etching and other processes. 400, thereby achieving integration with the display substrate, which is beneficial to the thinning of the display device.
  • the touch metal layer is used to form the touch electrode 510 in the display area AA, and the touch wiring 520 is formed in the frame area BA.
  • the touch layer 500 may also have more film layers or less film layers, as long as it includes the necessary touch metal layers for forming the touch electrodes 510 and the touch traces 520 . .
  • the touch electrode 510 includes a touch emitting electrode 511 and a touch receiving electrode 512 , and the touch emitting electrode 511 and the touch receiving electrode 512 are arranged in an insulated and crossed manner.
  • the touch trace 520 includes a first touch trace 521 and a second touch trace 522.
  • the metal lead includes a first metal lead 601 and a second metal lead 602. One end of the first touch trace 521 is connected to the touch transmitter.
  • the electrode 511 is connected, the other end of the first touch trace 521 is connected to the first metal lead 601 , and the first touch trace 521 extends in the vertical direction to the wire hole 700 .
  • the touch function is implemented using the mutual capacitance touch principle.
  • the capacitance between the touch transmitting electrode 511 and the touch receiving electrode 512 at the touch position will change, and the driving circuit 900 emits touch light through the first metal lead 601 and the first touch trace 521
  • the electrode 511 transmits the transmit signal, and receives the signal from the touch receiving electrode 512 through the second touch trace 522 and the second metal lead 602, thereby obtaining the capacitance value at the intersection of the touch transmitting electrode 511 and the touch receiving electrode 512. , that is, the capacitance value of the entire two-dimensional plane of the display panel 10. According to the change in the capacitance value, the coordinates of the touch point are calculated, thereby realizing the touch function.
  • the touch layer 500 includes a buffer layer 501 , a first touch metal layer 502 , a touch insulation layer 503 , a second touch metal layer 504 and a protective film layer 505 .
  • the touch emitting electrode 511 and the touch receiving electrode 512 are located on the second touch metal layer 504.
  • the touch emitting electrode 511 and the touch receiving electrode 512 are arranged insulated and crossed on the second touch metal layer 504.
  • the touch receiving electrode 512 is directly Connected on the second touch metal layer 504, the touch emitter electrode 511 is connected through the first touch metal layer 502, and the first touch metal layer 502 is configured to form a bridge layer.
  • the first touch trace 521 is formed by the first touch metal layer 502 and the second touch metal layer 504 in the non-display area.
  • the second touch trace 522 is formed by the first touch metal layer 502 and the second touch metal layer 504 in the non-display area.
  • the second touch metal layer 504 is formed together, thereby making the diameter of the touch trace 520 larger and reducing the impedance.
  • the display panel 10 further includes a first isolation dam 800 , a second isolation dam 801 and a crack dam 802 arranged around the display area AA.
  • the first isolation dam 800 , the second isolation dam 801 and the crack dam 802 are located in the non-display area, the second isolation dam 801 is located on the side of the first isolation dam 800 away from the display area AA, and the crack dam 802 is located on the side of the second isolation dam 801 away from the display area AA.
  • the cable hole 700 is located between the second isolation dam 801 and the crack dam 802 .
  • the organic encapsulation layer 402 is blocked by setting the first isolation dam 800, and the organic encapsulation layer 402 is further blocked by setting the second isolation dam 801 to prevent the organic encapsulation layer 402 from crossing the first isolation dam 800, and by setting cracks.
  • the dam 802 prevents cracks in the non-display area from extending to the display area AA.
  • the first isolation dam 800 and the second isolation dam 801 are protrusions with a certain height.
  • the driving layer 200 includes a flat layer 204
  • the display layer 300 includes a pixel definition layer 301 and a spacer 302
  • the encapsulation layer 400 includes a stacked first inorganic encapsulation layer 401, an organic Encapsulation layer 402 and second inorganic encapsulation layer 403.
  • the first isolation dam 800 is formed by superimposing the pixel definition layer 301 and the spacer 302 of the display layer 300. That is, the first part of the first isolation dam 800 is formed when the pixel definition layer 301 is formed, and the third part of the first isolation dam 800 is formed when the spacer 302 is formed.
  • the second part of an isolation dam 800 Since the organic encapsulation layer 402 usually has certain fluidity, the main function of the first isolation dam 800 is to block organic matter in the encapsulation layer 400 .
  • the second isolation dam 801 is formed by superimposing the flat layer 204 of the driving layer 200, the pixel definition layer 301 of the display layer 300 and the spacers 302. That is, the first part of the second isolation dam 801 is formed when the flat layer 204 is formed.
  • the pixel definition layer 301 forms the second part of the second isolation dam 801
  • the spacer 302 forms the third part of the second isolation dam 801 .
  • the second isolation dam 801 is used to further block the organic encapsulation layer 402 and prevent the organic encapsulation layer 402 from crossing the first isolation dam 800 .
  • the crack dam 802 includes a plurality of cutting channels, and the crack dam 802 is provided to prevent cracks in the non-display area from extending to the display area AA.
  • the substrate layer 100 may include a first liner plate 101 and a second liner plate 102 that are stacked, and the first metal layer 600 is located between the first liner plate 101 and the second liner plate 102 .
  • the first metal layer 600 by disposing the first metal layer 600 between the first lining plate 101 and the second lining plate 102, the arrangement of the metal leads is facilitated.
  • the first lining board 101 and the second lining board 102 may be formed of flexible insulating materials.
  • it can be formed from polymer materials such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate or glass fiber reinforced plastics. .
  • the substrate layer 100 may also include a buffer layer 103, which is used to block water oxygen and alkaline ions.
  • the display panel 10 further includes a second metal layer 610 , the second metal layer 610 is located on the driving layer 200 , and the via hole 700 includes a first via hole and a The second via hole, the touch trace 520 (522 in the figure) overlaps with the second metal layer 610 through the first via hole, and the second metal layer 610 overlaps with the first metal layer 600 through the second via hole .
  • the size of the first via hole and the second via hole are shorter in the direction perpendicular to the display panel 10 , which is beneficial to improving the size of the via hole 700 . machining accuracy.
  • the driving layer 200 includes a first insulating layer 201 , a second insulating layer 202 , an interlayer dielectric layer 203 and a planarization layer 204 that are stacked in sequence.
  • the metal layer 610 is located between the first insulation layer 201 and the second insulation layer 202 .
  • the driving layer 200 generally includes a thin film transistor 210.
  • the gate electrode 211 of the thin film transistor 210 is usually disposed between the first insulating layer 201 and the second insulating layer 202.
  • the second metal layer 610 is disposed between the first insulating layer 201 and the second insulating layer 202. Between the second insulating layer 202, the second metal layer 610 and the gate electrode 211 are conveniently arranged on the same layer, thereby facilitating the processing of the second metal layer 610.
  • the driving layer 200 includes a first insulating layer 201 , a second insulating layer 202 , an interlayer dielectric layer 203 and a planarization layer 204 that are stacked in sequence.
  • the metal layer 610 is located between the second insulating layer 202 and the interlayer dielectric layer 203 .
  • the driving layer 200 generally includes a capacitive electrode 220 for storing charges.
  • the capacitive electrode 220 is usually disposed between the second insulating layer 202 and the interlayer dielectric layer 203, and the second metal layer 610 is disposed on the second insulating layer 202 and the interlayer dielectric layer 203.
  • the second metal layer 610 and the capacitor electrode 220 are conveniently arranged on the same layer, thereby facilitating the processing of the second metal layer 610.
  • the first insulating layer 201, the second insulating layer 202 and the interlayer dielectric layer 203 can be made of materials such as silicon nitride or silicon oxide, and can be a single layer, or can be a multi-layer structure of silicon nitride or silicon oxide.
  • the flat layer 204 can be made of organic materials such as polyimide, acrylic, or polyethylene terephthalate.
  • the display panel 10 includes a second metal layer 610 and a third metal layer 620 .
  • the second metal layer 610 and the third metal layer 620 are located on the display layer 200 and have wire holes.
  • 700 includes a first via hole, a second via hole and a third via hole.
  • the touch trace 520 (522 in the figure) overlaps the third metal layer 620 through the first via hole.
  • the third metal layer 620 The second via hole overlaps with the second metal layer 610 , and the second metal layer 610 overlaps with the first metal layer 600 through the third via hole.
  • the first via hole, the second via hole and the third via hole are arranged in a direction perpendicular to the display panel 10
  • the size is shorter, which is beneficial to improving the processing accuracy of the wire through hole 700 .
  • the driving layer 200 includes a first insulating layer 201, a second insulating layer 202, an interlayer dielectric layer 203 and a planarization layer 204 that are stacked in sequence, wherein the first insulating layer 201 and the second insulating layer 202 can also be called a gate insulating layer.
  • the second metal layer 610 is located between the first gate insulating layer 201 and the second gate insulating layer 202.
  • the third metal layer 620 is located between the second gate insulating layer 202 and the interlayer dielectric layer 203. between. Thus, the arrangement of the second metal layer 610 and the third metal layer 620 is facilitated.
  • the driving layer 200 is provided in the display area AA.
  • a thin film transistor 210 is provided.
  • the thin film transistor 210 includes a gate electrode 211, an active region 212, a source electrode 213 and a drain electrode 214.
  • the source electrode 213 and the drain electrode 214 are disposed on the first insulating layer 201, the second insulating layer 202 and the layer
  • the via holes of the inter-dielectric layer 203 are connected to the active area 212 .
  • the organic light emitting device 310 is controlled by providing the thin film transistor 210 .
  • the thin film transistor 210 may adopt a top gate structure, the active region 212 is disposed above the substrate layer 100, the first insulating layer 201 covers the active region 212, and the gate electrode 211 is disposed above the first insulating layer 201.
  • Two insulating layers 202 cover the gate electrode 211, the source electrode 213 and the drain electrode 214 are disposed above the interlayer dielectric layer 203, and the flat layer 204 covers the source electrode 213 and the drain electrode 214.
  • the source electrode 213 and the drain electrode 214 are connected to the active area 212 through via holes provided in the first insulating layer 201 , the second insulating layer 202 and the interlayer dielectric layer 203 .
  • the display layer 300 is provided with an organic light-emitting device 310 in the display area AA.
  • the organic light-emitting device 310 includes an anode 311, a light-emitting layer 312 and a cathode 313.
  • the anode 311 of the organic light-emitting device 310 is connected to the drain electrode 214 of the thin film transistor 210 through a via hole provided in the planar layer 204 .
  • the thin film transistor 210 further includes a capacitor electrode 220.
  • the capacitor electrode 220 and the gate electrode 211 form a storage capacitor.
  • the storage capacitor is configured to store charge, and the storage capacitor is configured to keep the voltage unchanged when the display screen is refreshed.
  • the second metal layer 610 and the gate electrode 211 are arranged on the same layer, and the third metal layer 620 and the capacitor electrode 220 are arranged on the same layer. Therefore, the second metal layer 610 can be formed with the gate electrode 211 through a patterning process, and the second metal layer 610 can be formed with the capacitor electrode 220 through a patterning process, thereby reducing the preparation process, saving costs, and also conducive to the thinness and lightness of the display device. change.
  • the non-display area also includes a bending area BB and a binding area BC adjacent to the bending area BB.
  • the bending area BB is located in the border area BA.
  • the binding area BC is located on the side of the bending area BB away from the frame area BA.
  • the driving circuit 900 is located on the binding area BC.
  • the bending area BB is provided with signal leads, and the signal leads are connected to the driving circuit 900 Connection, signal leads are used to transmit signals, and signal leads are set on the same layer as metal leads.
  • the signal leads are usually arranged in the same layer as the source electrode 213 and the drain electrode 214 of the display area AA.
  • the film layers of the bend area BB include the substrate layer 100, the source and drain layer, the flat layer 204 and the pixel definition layer 301.
  • the signal lead and the metal lead are arranged in the same layer, so that the touch signal is connected between the metal lead and the signal lead. They can be transferred in the same layer to reduce the number of film layer jumps, which is beneficial to reducing overlap resistance and improving touch sensitivity and process yield.
  • An embodiment of the present disclosure also provides a display device, which includes the display panel 10 of any of the above embodiments.
  • the display device of the embodiment of the present disclosure includes a display panel 10.
  • the display panel 10 is provided with a wire hole 700 in the frame area BA, so that the touch trace 520 connected to the touch electrode 510 is connected to the first metal layer through the wire hole 700.
  • the metal leads 600 are connected, and the metal leads are connected to the drive circuit 900, so that the touch signal between the touch electrode 510 and the drive circuit 900 is transmitted through the touch traces 520 and the metal leads.
  • the encapsulation layer 400 generally includes an organic encapsulation layer 402.
  • the thickness consistency of the organic encapsulation layer 402 in the frame area BA is poor and there is a leveling slope.
  • the touch traces 520 will move along the process of being connected to the driving circuit 900.
  • the touch traces 520 extending in a direction parallel to the leveling slope will also extend in a direction perpendicular to the leveling slope.
  • the touch traces 520 extending in a direction perpendicular to the leveling slope are prone to short circuit or open circuit. Therefore, in the above technology, the The organic encapsulation layer 402 has a high requirement for flatness in the frame area BA. Accordingly, in order to ensure the flatness of the organic encapsulation layer 402 and a safe wiring space for the touch traces 520, the design size of the frame area BA is relatively large.
  • the embodiment of the present disclosure sets the via hole 700 so that the touch trace 520 enters the via hole 700 in a direction parallel to the leveling slope and then is connected to the metal lead, thereby preventing the touch trace 520 from being exposed in the package.
  • the layer 400 extends in a direction perpendicular to the leveling slope to reduce the impact of the leveling slope on the touch traces 520, thereby reducing the flatness requirements of the packaging layer 400 in the frame area BA and reducing the size of the frame area BA.
  • the metal leads can be located in the display area AA when routing, which can further reduce the size of the frame and reduce the wiring difficulty of the touch traces 520 and the metal leads.
  • Parallel refers to a state in which the angle formed by two straight lines is -10° or more and less than 10°. Therefore, it may include a state in which the angle is -5° or more and 5° or less.
  • vertical refers to a state in which the angle formed by two straight lines is 80° or more and 100° or less. Therefore, it may include a state in which the angle is 85° or more and 95° or less.

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Abstract

一种显示面板与显示装置，所述显示面板具有显示区域和围绕所述显示区域的非显示区域，所述非显示区域包括边框区域(BA)，所述显示面板包括显示基板，所述显示基板包括第一金属层(600)；触控层，所述触控层设置有触控电极以及与所述触控电极连接的触控走线，所述触控电极位于所述显示区域；驱动电路(900)，设置在所述非显示区域；过线孔(700)，所述过线孔(700)位于所述边框区域(BA)，所述触控走线通过所述过线孔(700)与所述第一金属层(600)的金属引线连接，所述金属引线设置为与所述驱动电路(900)连接。

Description

显示面板与显示装置
本申请要求于2022年5月26日提交中国专利局、申请号为202210588844.7、发明名称为“一种显示面板与显示装置”的中国专利申请的优先权，其内容应理解为通过引用的方式并入本申请中。
技术领域
本公开的实施例涉及但不限于显示技术领域，尤指一种显示面板与显示装置。
背景技术
目前，随着OLED(Organic Light-Emitting Diode，有机发光二极管)显示行业的快速发展，大量的新型显示装置逐渐涌入市场。为了获得更大的屏占比，给客户提供良好的视觉体验，窄化边框成为了显示面板的重要发展方向。
显示面板一般包括显示基板以及触控层，触控层位于显示基板的封装层的上方。触控层包括触控电极以及触控走线，触控走线用于连接触控电极和驱动电路，以实现显示面板的触控功能。但是，触控走线通常是在触控层的边框区域进行布局，极大地限制了显示面板窄边框的进一步发展，不符合显示装置的窄边框化的发展趋势。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
第一方面，本公开的实施例提供了一种显示面板，所述显示面板具有显示区域和围绕所述显示区域的非显示区域，所述非显示区域包括边框区域，所述显示面板包括：显示基板，所述显示基板包括第一金属层，所述第一金属层设置有金属引线；触控层，位于所述显示基板的上层，所述触控层设置有触控电极以及与所述触控电极连接的触控走线，所述触控电极位于所述显 示区域；驱动电路，设置在所述非显示区域；过线孔，所述过线孔位于所述边框区域，所述触控走线通过所述过线孔与所述第一金属层的金属引线连接，所述金属引线设置为与所述驱动电路连接。
本公开的实施例的显示面板通过在边框区域设置过线孔，使得与触控电极连接的触控走线通过过线孔与第一金属层的金属引线连接，金属引线与驱动电路连接，从而使触控电极与驱动电路之间的触控信号经由触控走线以及金属引线进行传递。
在本公开的一些实施例中，所述显示基板还包括依次层叠设置的衬底层、驱动层、显示层以及封装层。
在本公开的一些实施例中，所述触控层位于所述封装层的远离所述衬底层的一侧，
在本公开的一些实施例中，所述触控走线沿平行于所述封装层在所述边框区域处的方向，进入所述过线孔与所述金属引线连接。
在本公开的一些实施例中，所述显示面板还包括围绕所述显示区域设置的第一隔离坝、第二隔离坝以及裂缝坝，所述第一隔离坝、所述第二隔离坝以及所述裂缝坝位于所述非显示区域，所述第二隔离坝位于所述第一个隔离坝的远离所述显示区域的一侧，所述裂缝坝位于所述第二隔离坝的远离所述显示区域的一侧，所述过线孔位于所述第二隔离坝与所述裂缝坝之间。
在本公开的一些实施例中，所述衬底层包括第一衬板和第二衬板，所述第一金属层位于所述第一衬板与所述第二衬板之间。
在本公开的一些实施例中，所述显示面板还包括第二金属层，所述第二金属层位于所述驱动层，所述过线孔包括第一过线孔和第二过线孔，所述触控走线通过所述第一过线孔与所述第二金属层搭接，所述第二金属层通过所述第二过线孔与所述第一金属层搭接。
在本公开的一些实施例中，所述驱动层包括层叠设置的第一绝缘层、第二绝缘层、层间介质层以及平坦层，所述第二金属层位于所述第一绝缘层与所述第二绝缘层之间，或者，所述第二金属层位于所述第二绝缘层与所述层间介质层之间。
在本公开的一些实施例中，所述显示面板还包括第二金属层以及第三金属层，所述第二金属层以及所述第三金属层位于所述驱动层，所述过线孔包括第一过线孔、第二过线孔以及第三过线孔，所述触控走线通过所述第一过线孔与所述第三金属层搭接，所述第三金属层通过所述第二过线孔与所述第二金属层搭接，所述第二金属层通过所述第三过线孔与所述第一金属层搭接。
在本公开的一些实施例中，所述驱动层包括层叠设置的第一绝缘层、第二绝缘层、层间介质层以及平坦层，所述第二金属层位于所述第一绝缘层与所述第二绝缘层之间，所述第三金属层位于所述第二绝缘层与所述层间介质层之间。
在本公开的一些实施例中，所述触控电极包括触控发射电极和触控接收电极，所述触控发射电极和所述触控接收电极绝缘交叉排列，所述触控走线包括第一触控走线和第二触控走线，所述金属引线包括第一金属引线和第二金属引线，所述第一触控走线的一端与所述触控发射电极连接，所述第一触控走线的另一端与所述第一金属引线连接，所述第一触控走线沿第一方向延伸至所述过线孔，所述第二触控走线的一端与所述触控接收电极连接，所述第二触控走线的另一端与所述第二金属引线连接，所述第二触控走线沿第二方向延伸至所述过线孔。
在本公开的一些实施例中，所述驱动层在所述显示区域设置有薄膜晶体管，所述薄膜晶体管包括栅极、有源区、源极以及漏极，所述源极与所述漏极通过设置在所述第一绝缘层、所述第二绝缘层以及所述层间介质层的过孔与所述有源区连接。
在本公开的一些实施例中，所述非显示区域还包括折弯区域以及与所述折弯区域相邻的绑定区域，所述折弯区域位于所述边框区域的远离所述显示区域的一侧，所述绑定区域位于所述折弯区域的远离所述边框区域的一侧，所述驱动电路位于所述绑定区域，所述折弯区域设置有信号引线，所述信号引线与所述驱动电路连接，所述信号引线用于传递信号，所述信号引线与所述金属引线同层设置。
第二方面，本公开的实施例提供了一种显示装置，包括根据上述任一实施例所述的显示面板。在阅读并理解了附图和详细描述后，可以明白其他方 面。
附图说明
下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的实施例。
图1为本公开的实施例提供的一种显示面板的示意图；
图2为本公开的实施例提供的一种显示面板的走线示意图；
图3为本公开的第一实施例提供的一种显示面板的B-B处的剖视图；
图4为本公开的第一实施例提供的一种显示面板的D-D处的剖视图；
图5为本公开的第二实施例提供的一种显示面板的B-B处的剖视图；
图6为本公开的第三实施例提供的一种显示面板的B-B处的剖视图；
图7为本公开的第四实施例提供的一种显示面板的B-B处的剖视图；
图8为本公开的实施例提供的一种显示面板的C-C处的剖视图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员基于本申请所获得的所有其他实施例，都属于本申请保护的范围。
如图1至图8所示，本公开的实施例提供了一种显示面板10。显示面板10具有显示区域AA和围绕显示区域AA的非显示区域，非显示区域包括边框区域BA。显示面板10包括显示基板、触控层500、驱动电路900以及过线孔700。其中，显示基板包括第一金属层600，所述第一金属层600设置有金属引线。触控层500位于所述显示基板的上层，所述触控层500设置有触控电极510以及与触控电极510连接的触控走线520。触控电极510位于显示区域AA。驱动电路900设置在非显示区域。过线孔700位于边框区域BA，触控走线520通过过线孔700与第一金属层600的金属引线连接，金属引线 设置为与驱动电路900连接。
本公开的实施例通过设置过线孔700，使触控走线520通过过线孔700后与金属引线连接，避免触控走线520在封装层400上沿着封装层400垂直方向延伸，降低封装层400在边框区域BA的平坦性要求，减小边框区域BA的尺寸。
在示例性实施例中，所述显示面板还包括依次层叠设置的衬底层100、驱动层200、显示层300以及封装层400。在示例性实施例中，所述触控层500位于所述封装层400的远离衬底层100的一侧。
在示例性实施例中，当触控走线520沿平行于封装层400在边框区域BA处的方向(例如斜坡方向)进入过线孔700与金属引线连接，可以减小流平斜坡对触控走线520的影响，从而降低封装层400在边框区域BA的平坦性要求，减小边框区域BA的尺寸。
在示例性实施例中，如图1和图2所示，本公开第一方面的实施例提供了一种显示面板10。显示面板10具有显示区域AA和围绕显示区域AA的非显示区域，非显示区域包括边框区域BA。显示面板10包括显示基板、触控层500、驱动电路900以及过线孔700。其中，显示基板包括依次层叠设置的衬底层100、驱动层200、显示层300以及封装层400。触控层500位于封装层400远离显示层300的一侧，触控层500设置有触控电极510以及与触控电极510连接的触控走线520。触控电极510位于显示区域AA。驱动电路900设置在非显示区域。过线孔700位于边框区域BA，显示基板还包括第一金属层600，第一金属层600设置有金属引线，触控走线520通过过线孔700与金属引线连接，金属引线设置为与驱动电路900连接。
本公开的实施例的显示面板10通过在边框区域BA设置过线孔700，使得与触控电极510连接的触控走线520通过过线孔700与第一金属层600的金属引线连接，金属引线与驱动电路900连接，从而使触控电极510与驱动电路900之间的触控信号经由触控走线520以及金属引线进行传递。在相关技术中，封装层400一般包括有机封装层402，有机封装层402在边框区域BA的厚度一致性差，存在流平斜坡，触控走线520在连接至驱动电路900的过程中既会沿着平行于流平斜坡的方向延伸，也会沿着垂直于流平斜坡的 方向延伸，但是延伸方向垂直于流平斜坡的触控走线520容易发生短路或者断路，因此在相关技术中，对有机封装层402在边框区域BA的平坦性要求较高，相应地，为了保证有机封装层402的平坦性以及触控走线520的安全布线空间，边框区域BA的设计尺寸较大。与相关技术比较，本公开的实施例通过设置过线孔700，使触控走线520沿平行于流平斜坡的方向进入过线孔700后与金属引线连接，避免触控走线520在封装层400上沿着垂直于流平斜坡的方向延伸，减小流平斜坡对触控走线520的影响，从而降低封装层400在边框区域BA的平坦性要求，减小边框区域BA的尺寸。另外，由于第一金属层600位于显示基板，金属引线不仅可以位于边框区域BA，还可以位于显示区域AA，从而既可以进一步减小边框区域BA的尺寸，又可以降低触控走线520以及金属引线的布线难度。
在本公开的一些实施例中，触控层500采用柔性多层(Flexible Multilayer On Cell，FMLOC)技术直接形成于显示基板。触控层500可以包括触控金属层、触控绝缘层503、阻挡层501以及护膜层505等，这些膜层是通过沉积、曝光、显影、刻蚀等工艺直接制作在显示基板的封装层400上，从而实现与显示基板的一体化，有利于显示装置的薄化。其中，触控金属层用于在显示区域AA形成触控电极510，在边框区域BA形成触控走线520。
在本公开的其他实施例中，触控层500也可以具有更多膜层或者更少膜层，只要包含必要的用于形成触控电极510以及触控走线520的触控金属层即可。
如图1和图2所示，在本公开的一些实施例中，触控电极510包括触控发射电极511和触控接收电极512，触控发射电极511和触控接收电极512绝缘交叉排列。触控走线520包括第一触控走线521和第二触控走线522，金属引线包括第一金属引线601和第二金属引线602，第一触控走线521的一端与触控发射电极511连接，第一触控走线521的另一端与第一金属引线601连接，第一触控走线521沿竖直方向延伸至过线孔700。第二触控走线522的一端与触控接收电极512连接，第二触控走线522的另一端与第二金属引线602连接，第二触控走线522沿水平方向延伸至过线孔700。在本公开的实施例中，触控功能采用互容式触控原理实现。具体地，当用户触碰到 触控层500时，触摸位置处的触控发射电极511和触控接收电极512之间的电容会发生改变，驱动电路900通过第一金属引线601以及第一触控走线521向触控发射电极511传递发射信号，并通过第二触控走线522和第二金属引线602接收来自触控接收电极512的信号，从而得到触控发射电极511与触控接收电极512的交汇点的电容值，即整个显示面板10二维平面的电容值，根据电容值变化量，计算出触摸点的坐标，从而实现触控功能。
如图8所示，在显示区域AA，触控层500包括缓冲层501、第一触控金属层502、触控绝缘层503、第二触控金属层504以及护膜层505。触控发射电极511和触控接收电极512位于第二触控金属层504，触控发射电极511和触控接收电极512在第二触控金属层504上绝缘交叉排列，触控接收电极512直接在第二触控金属层504上连通，触控发射电极511通过第一触控金属层502导通，第一触控金属层502设置为构成桥接层。第一触控走线521由非显示区域的第一触控金属层502和第二触控金属层504共同形成，第二触控走线522由非显示区域的第一触控金属层502和第二触控金属层504共同形成，从而使得触控走线520的直径较大，降低阻抗。
如图3至图7所示，在本公开的一些实施例中，显示面板10还包括围绕显示区域AA设置的第一隔离坝800、第二隔离坝801以及裂缝坝802，第一隔离坝800、第二隔离坝801以及裂缝坝802位于非显示区域，第二隔离坝801位于第一隔离坝800的远离显示区域AA的一侧，裂缝坝802位于第二隔离坝801的远离显示区域AA的一侧，过线孔700位于第二隔离坝801与裂缝坝802之间。在本公开的实施例中，通过设置第一隔离坝800阻挡有机封装层402，通过设置第二隔离坝801进一步阻挡有机封装层402，防止有机封装层402越过第一隔离坝800，通过设置裂缝坝802防止非显示区域的裂缝向显示区域AA延伸，通过将过线孔700设置在第二隔离坝801与裂缝坝802之间，使得过线孔700在加工时无需经过封装层400，过线孔700所在位置处的膜层较少，方便加工。
示例性地，第一隔离坝800和第二隔离坝801是具有一定高度的凸起。在一个实施例中，驱动层200包括平坦层204，显示层300包括像素定义层301以及隔垫物302，封装层400包括层叠设置的第一无机封装层401、有机 封装层402以及第二无机封装层403。第一隔离坝800是由显示层300的像素定义层301和隔垫物302叠加形成，即在形成像素定义层301时形成第一隔离坝800的第一部分，在形成隔垫物302时形成第一隔离坝800的第二部分。由于有机封装层402通常具有一定的流动性，因此，第一隔离坝800的主要作用是用于阻挡封装层400中的有机物。第二隔离坝801是由驱动层200的平坦层204，显示层300的像素定义层301以及隔垫物302叠加形成，即在形成平坦层204时形成第二隔离坝801的第一部分，在形成像素定义层301时形成第二隔离坝801的第二部分，在形成隔垫物302时形成第二隔离坝801的第三部分。第二隔离坝801用于进一步阻挡有机封装层402，防止有机封装层402越过第一隔离坝800。裂缝坝802包括多个切割沟道，通过设置裂缝坝802防止非显示区域的裂缝向显示区域AA延伸。
在本公开的一些实施例中，衬底层100可包括层叠设置的第一衬板101和第二衬板102，第一金属层600位于第一衬板101与第二衬板102之间。在本公开的实施例中，通过将第一金属层600设置在第一衬板101与第二衬板102之间，方便金属引线的布置。
第一衬板101和第二衬板102可以采用柔性的绝缘材料形成。例如，可以由聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料等聚合物材料形成。
进一步地，衬底层100还可以包括缓冲层103，缓冲层103用于阻挡水氧和碱性离子。
如图5和图6所示，在本公开的一些实施例中，显示面板10还包括第二金属层610，第二金属层610位于驱动层200，过线孔700包括第一过线孔和第二过线孔，触控走线520(图中522)通过第一过线孔与第二金属层610搭接，第二金属层610通过第二过线孔与第一金属层600搭接。在本公开的实施例中，通过设置第二金属层610，使得第一过线孔和第二过线孔在垂直于显示面板10的方向上的尺寸较短，从而有利于提高过线孔700的加工精度。
如图6和图8所示，在本公开的一些实施例中，驱动层200包括依次层叠设置的第一绝缘层201、第二绝缘层202、层间介质层203以及平坦层204，第二金属层610位于第一绝缘层201与第二绝缘层202之间。考虑到在显示 区域AA，驱动层200一般包括薄膜晶体管210，薄膜晶体管210的栅极211通常设置在第一绝缘层201与第二绝缘层202之间，将第二金属层610设置在第一绝缘层201与第二绝缘层202之间，方便第二金属层610与栅极211同层设置，从而方便第二金属层610的加工。
如图5和图8所示，在本公开的一些实施例中，驱动层200包括依次层叠设置的第一绝缘层201、第二绝缘层202、层间介质层203以及平坦层204，第二金属层610位于第二绝缘层202与层间介质层203之间。考虑到在显示区域AA，驱动层200一般包括用于储存电荷的电容电极220，电容电极220通常设置在第二绝缘层202与层间介质层203之间，将第二金属层610设置在第二绝缘层202与层间介质层203之间，方便第二金属层610与电容电极220同层设置，从而方便第二金属层610的加工。
示例性地，第一绝缘层201、第二绝缘层202以及层间介质层203可以采用氮化硅或氧化硅等材料，可以是单层，或者可以是氮化硅或氧化硅的多层结构。平坦层204可以采用聚酰亚胺、亚克力或聚对苯二甲酸乙二醇酯等有机材料。
如图7所示，在本公开的一些实施例中，显示面板10包括第二金属层610以及第三金属层620，第二金属层610以及第三金属层620位于显示层200，过线孔700包括第一过线孔、第二过线孔以及第三过线孔，触控走线520(图中522)通过第一过线孔与第三金属层620搭接，第三金属层620通过第二过线孔与第二金属层610搭接，第二金属层610通过第三过线孔与第一金属层600搭接。在本公开的实施例中，通过设置第二金属层610和第三金属层620，使得第一过线孔、第二过线孔以及第三过线孔在垂直于显示面板10的方向上的尺寸较短，从而有利于提高过线孔700的加工精度。
在本公开的一些实施例中，驱动层200包括依次层叠设置的第一绝缘层201、第二绝缘层202、层间介质层203以及平坦层204，其中第一绝缘层201和第二绝缘层202又可称为栅绝缘层，第二金属层610位于第一栅绝缘层201与第二栅绝缘层202之间，第三金属层620位于第二栅绝缘层202与层间介质层203之间。由此，方便第二金属层610和第三金属层620的设置。
如图8所示，在本公开的一些实施例中，驱动层200在显示区域AA设 置有薄膜晶体管210，薄膜晶体管210包括栅极211、有源区212、源极213以及漏极214，源极213与漏极214通过设置在第一绝缘层201、第二绝缘层202以及层间介质层203的过孔与有源区212连接。在本公开的实施例中，通过设置薄膜晶体管210对有机发光器件310进行控制。
示例性地，薄膜晶体管210可以采用顶栅结构，有源区212设置在衬底层100的上方，第一绝缘层201覆盖有源区212，栅极211设置在第一绝缘层201的上方，第二绝缘层202覆盖栅极211，源极213与漏极214设置在层间介质层203的上方，平坦层204覆盖源极213和漏极214。源极213和漏极214通过设置在第一绝缘层201、第二绝缘层202以及层间介质层203的过孔与有源区212连接。显示层300在显示区域AA设置有有机发光器件310，有机发光器件310包括阳极311、发光层312以及阴极313。有机发光器件310的阳极311通过设置在平坦层204的过孔与薄膜晶体管210的漏极214连接。
在本公开的一些实施例中，薄膜晶体管210还包括电容电极220，电容电极220与栅极211构成存储电容，存储电容设置为储存电荷，存储电容设置为在显示画面刷新时保持电压不变。
可选地，第二金属层610与栅极211同层设置，第三金属层620与电容电极220同层设置。由此，第二金属层610可以与栅极211通过一次构图工艺形成，第二金属层610可以与电容电极220通过一次构图工艺形成，从而减少制备过程，节约成本，也有利于显示装置的轻薄化。
如图1和图3所示，在本公开的一些实施例中，非显示区域还包括折弯区域BB以及与折弯区域BB相邻的绑定区域BC，折弯区域BB位于边框区域BA的远离显示区域AA的一侧，绑定区域BC位于折弯区域BB的远离边框区域BA的一侧，驱动电路900位于绑定区域BC，折弯区域BB设置有信号引线，信号引线与驱动电路900连接，信号引线用于传递信号，信号引线与金属引线同层设置。在一些技术中，信号引线通常与显示区域AA的源极213、漏极214同层设置，折弯区域BB的膜层包括衬底层100、源漏极层、平坦层204以及像素定义层301。相较于上述技术，在本公开的实施例中，通过将信号引线与金属引线同层设置，使得触控信号在金属引线与信号引线 之间可以同层传递，减少膜层跳变的次数，从而有利于降低搭接电阻，提高触控灵敏度及工艺良率。
在本公开的实施例还提供了一种显示装置，显示装置包括上述任一实施例的显示面板10。
本公开的实施例的显示装置包括显示面板10，显示面板10通过在边框区域BA设置过线孔700，使得与触控电极510连接的触控走线520通过过线孔700与第一金属层600的金属引线连接，金属引线与驱动电路900连接，从而使触控电极510与驱动电路900之间的触控信号经由触控走线520以及金属引线进行传递。在一些技术中，封装层400一般包括有机封装层402，有机封装层402在边框区域BA的厚度一致性差，存在流平斜坡，触控走线520在连接至驱动电路900的过程中既会沿着平行于流平斜坡的方向延伸，也会沿着垂直于流平斜坡的方向延伸，但是延伸方向垂直于流平斜坡的触控走线520容易发生短路或者断路，因此在上述技术中，对有机封装层402在边框区域BA的平坦性要求较高，相应地，为了保证有机封装层402的平坦性以及触控走线520的安全布线空间，边框区域BA的设计尺寸较大。与相关技术比较，本公开的实施例通过设置过线孔700，使触控走线520沿平行于流平斜坡的方向进入过线孔700后与金属引线连接，避免触控走线520在封装层400上沿着垂直于流平斜坡的方向延伸，减小流平斜坡对触控走线520的影响，从而降低封装层400在边框区域BA的平坦性要求，减小边框区域BA的尺寸。另外，由于第一金属层600位于显示基板，金属引线在走线时可以位于显示区域AA，从而既可以进一步减小边框尺寸，又可以降低触控走线520以及金属引线的布线难度。
本文所述“平行”是指两条直线形成的角度为-10°以上且10°以下的状态，因此，可以包括该角度为-5°以上且5°以下的状态。另外，“垂直”是指两条直线形成的角度为80°以上且100°以下的状态，因此，可以包括85°以上且95°以下的角度的状态。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、 “包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的过程、方法、物品或者设备中还存在另外的相同要素。
本说明书中的各个实施例均采用相关的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于系统实施例而言，由于其基本相似于方法实施例，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上仅为本申请的可选实施例，并非用于限定本申请的保护范围。凡在本申请的精神和原则之内所作的任何修改、等同替换、改进等，均包含在本申请的保护范围内。

Claims (14)

  1. 一种显示面板，所述显示面板具有显示区域和围绕所述显示区域的非显示区域，所述非显示区域包括边框区域，所述显示面板包括：
    显示基板，所述显示基板包括第一金属层，所述第一金属层设置有金属引线；触控层，位于所述显示基板的上层，所述触控层设置有触控电极以及与所述触控电极连接的触控走线，所述触控电极位于所述显示区域；
    驱动电路，设置在所述非显示区域；
    过线孔，所述过线孔位于所述边框区域，所述触控走线通过所述过线孔与所述第一金属层的金属引线连接，所述金属引线设置为与所述驱动电路连接。
  2. 根据权利要求1所述的显示面板，所述显示基板还包括依次层叠设置的衬底层、驱动层、显示层以及封装层。
  3. 根据权利要求2所述的显示面板，所述触控层位于所述封装层的远离所述衬底层的一侧。
  4. 根据权利要求1-3中任一项所述的显示面板，所述触控走线沿平行于所述封装层在所述边框区域处的方向，进入所述过线孔与所述金属引线连接。
  5. 根据权利要求1所述的显示面板，还包括围绕所述显示区域设置的第一隔离坝、第二隔离坝以及裂缝坝，所述第一隔离坝、所述第二隔离坝以及所述裂缝坝位于所述非显示区域，所述第二隔离坝位于所述第一个隔离坝的远离所述显示区域的一侧，所述裂缝坝位于所述第二隔离坝的远离所述显示区域的一侧，所述过线孔位于所述第二隔离坝与所述裂缝坝之间。
  6. 根据权利要求1所述的显示面板，其中所述衬底层包括第一衬板和第二衬板，所述第一金属层位于所述第一衬板与所述第二衬板之间。
  7. 根据权利要求6所述的显示面板，还包括第二金属层，所述第二金属层位于所述驱动层，所述过线孔包括第一过线孔和第二过线孔，所述触控走线通过所述第一过线孔与所述第二金属层搭接，所述第二金属层通过所述第二过线孔与所述第一金属层搭接。
  8. 根据权利要求7所述的显示面板，其中所述驱动层包括层叠设置的第 一绝缘层、第二绝缘层、层间介质层以及平坦层，所述第二金属层位于所述第一绝缘层与所述第二绝缘层之间，或者，所述第二金属层位于所述第二绝缘层与所述层间介质层之间。
  9. 根据权利要求6所述的显示面板，还包括第二金属层以及第三金属层，所述第二金属层以及所述第三金属层位于所述驱动层，所述过线孔包括第一过线孔、第二过线孔以及第三过线孔，所述触控走线通过所述第一过线孔与所述第三金属层搭接，所述第三金属层通过所述第二过线孔与所述第二金属层搭接，所述第二金属层通过所述第三过线孔与所述第一金属层搭接。
  10. 根据权利要求9所述的显示面板，其中所述驱动层包括层叠设置的第一绝缘层、第二绝缘层、层间介质层以及平坦层，所述第二金属层位于所述第一绝缘层与所述第二绝缘层之间，所述第三金属层位于所述第二绝缘层与所述层间介质层之间。
  11. 根据权利要求1所述的显示面板，其中所述触控电极包括触控发射电极和触控接收电极，所述触控发射电极和所述触控接收电极绝缘交叉排列，所述触控走线包括第一触控走线和第二触控走线，所述金属引线包括第一金属引线和第二金属引线，所述第一触控走线的一端与所述触控发射电极连接，所述第一触控走线的另一端与所述第一金属引线连接，所述第一触控走线沿第一方向延伸至所述过线孔，所述第二触控走线的一端与所述触控接收电极连接，所述第二触控走线的另一端与所述第二金属引线连接，所述第二触控走线沿第二方向延伸至所述过线孔。
  12. 根据权利要求8或10所述的显示面板，其中所述驱动层在所述显示区域设置有薄膜晶体管，所述薄膜晶体管包括栅极、有源区、源极以及漏极，所述源极与所述漏极通过设置在所述第一绝缘层、所述第二绝缘层以及所述层间介质层的过孔与所述有源区连接。
  13. 根据权利要求1所述的显示面板，其中所述非显示区域还包括折弯区域以及与所述折弯区域相邻的绑定区域，所述折弯区域位于所述边框区域的远离所述显示区域的一侧，所述绑定区域位于所述折弯区域的远离所述边框区域的一侧，所述驱动电路位于所述绑定区域，所述折弯区域设置有信号引线，所述信号引线与所述驱动电路连接，所述信号引线用于传递信号，所 述信号引线与所述金属引线同层设置。
  14. 一种显示装置，包括根据权利要求1至13中任一项所述的显示面板。
PCT/CN2023/093067 2022-05-26 2023-05-09 显示面板与显示装置 Ceased WO2023226751A1 (zh)

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