WO2023226527A1 - 红外温度检测方法、装置、终端设备以及存储介质 - Google Patents

红外温度检测方法、装置、终端设备以及存储介质 Download PDF

Info

Publication number
WO2023226527A1
WO2023226527A1 PCT/CN2023/080985 CN2023080985W WO2023226527A1 WO 2023226527 A1 WO2023226527 A1 WO 2023226527A1 CN 2023080985 W CN2023080985 W CN 2023080985W WO 2023226527 A1 WO2023226527 A1 WO 2023226527A1
Authority
WO
WIPO (PCT)
Prior art keywords
detected object
identification mark
infrared
mark
detected
Prior art date
Application number
PCT/CN2023/080985
Other languages
English (en)
French (fr)
Inventor
曾建宏
陈珏良
高涛
周军长
赵政雷
万慧明
Original Assignee
东方电气集团东方电机有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东方电气集团东方电机有限公司 filed Critical 东方电气集团东方电机有限公司
Publication of WO2023226527A1 publication Critical patent/WO2023226527A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means

Definitions

  • This application relates to the field of mechanical equipment, and specifically relates to an infrared temperature detection method, device, terminal equipment and storage medium.
  • temperature sensors are usually used to directly receive the temperature of components inside mechanical equipment, or infrared temperature measurement equipment is used to monitor the inside of mechanical equipment in real time to prevent local temperature increases inside the mechanical equipment.
  • the infrared temperature measurement equipment may be faced with the situation of detecting a large number of devices at the same time.
  • specific devices cannot be effectively located, and the detection accuracy is poor.
  • This application provides an infrared temperature detection method that can effectively detect components in equipment that require temperature detection and avoid safety accidents.
  • this application provides an infrared temperature detection method, which method includes:
  • each identification mark in the area to be measured is identified through the infrared emissivity of a plurality of identification marks that have been preset in the area to be measured.
  • the area to be measured includes a plurality of objects to be detected, and each of the identification marks is The detected object is provided with an identification mark, and the infrared emissivity of each detected object is different from the infrared emissivity of its corresponding identification mark;
  • the method before identifying the position of each identification mark in the area to be measured through the infrared emissivity of a plurality of identification marks that have been preset in the area to be measured, the method further includes :
  • the identification mark corresponding to the detected object is determined, and the addition of the identification mark to the detected object is controlled.
  • determining the infrared emissivity of the mark corresponding to the detected object based on the infrared emissivity of the detected object includes:
  • the infrared emissivity of the mark corresponding to the detected object is determined.
  • control adds the identification mark to the detected object, including:
  • the identification mark is added to adjacent positions around the object to be detected.
  • determining the detected object corresponding to each identification mark based on the position of each identification mark includes:
  • the mapping relationship represents the corresponding relationship between the identification mark and the detected object.
  • identifying the position of each identification mark in the area to be measured through the infrared emissivity of multiple identification marks that have been preset in the area to be measured includes:
  • thermal analysis is performed on the thermal imaging image to determine the position of each identification mark in the thermal imaging image.
  • detecting the temperature of the detected object corresponding to each of the identification marks includes:
  • this application also provides an infrared temperature detection device, which includes:
  • An identification module configured to identify the position of each identification mark in the area to be measured through the infrared emissivity of a plurality of identification marks that have been preset in the area to be measured, and the area to be measured includes a plurality of objects to be detected , each of the detected objects is provided with an identification mark, and the infrared emissivity of each of the detected objects is different from the infrared emissivity of its corresponding identification mark;
  • a determination module configured to determine the detected object corresponding to each identification mark according to the position of each identification mark
  • a detection module is used to detect the temperature of the detected object corresponding to each of the identification marks.
  • the device further includes a mark adding module, and the mark adding module is specifically used to:
  • the identification mark corresponding to the detected object is determined, and the addition of the identification mark to the detected object is controlled.
  • the mark adding module is also specifically used to:
  • the infrared emissivity of the mark corresponding to the detected object is determined.
  • the mark adding module is also specifically used to:
  • the identification mark is added to adjacent positions around the object to be detected.
  • the determination module is specifically used to:
  • the mapping relationship represents the positional correspondence relationship between the identification mark and the detected object.
  • the identification module is specifically used to:
  • thermal analysis is performed on the thermal imaging image to determine the position of each identification mark in the thermal imaging image.
  • the detection module is specifically used for:
  • the present application also provides a terminal device.
  • the terminal device includes a processor, a memory, and a computer program stored in the memory and executable on the processor.
  • the processor executes the computer program. Program to implement the steps in any one of the infrared temperature detection methods.
  • the present application also provides a computer-readable storage medium.
  • a computer program is stored on the computer-readable storage medium.
  • the computer program is executed by a processor to implement any one of the infrared temperature detection methods. A step of.
  • the infrared temperature detection method provided by this application can mark the object to be detected in advance with a material whose infrared emissivity is different from the infrared emissivity of the device.
  • the infrared emissivity of the mark is analyzed. , can effectively locate the specific device through the mark, thereby obtaining the temperature of the specific device, improving the accuracy of infrared temperature measurement.
  • Figure 1 is a schematic diagram of the scene of the infrared temperature detection system provided in the embodiment of the present application.
  • Figure 2 is a schematic flow diagram of an embodiment of the infrared temperature detection method in the embodiment of the present application.
  • Figure 3 is a schematic diagram of a functional module of the infrared temperature detection device in the embodiment of the present application.
  • Figure 4 is a schematic structural diagram of a terminal device in an embodiment of the present application.
  • This application provides an infrared temperature detection method, device, terminal equipment and computer-readable storage medium, which are described in detail below.
  • Infrared detection A method that uses the principle of infrared radiation to detect the surface of materials. Its essence is to scan and record the temperature changes on the surface of the inspected material caused by defects or different thermal properties of the material. It can be used to detect debonding or incomplete welding parts in bonded or welded parts, and defects such as cracks, voids and inclusions in solid materials.
  • Figure 1 is a schematic diagram of an infrared temperature detection system provided by an embodiment of the present application.
  • the infrared temperature detection system may include a terminal device 100 and an infrared sensing device 200.
  • the infrared sensing device 200 may send signals to the terminal.
  • Device 100 transmits infrared images.
  • the infrared image acquired by the infrared sensing device 200 inside the mechanical device can be acquired to perform the infrared temperature detection method in this application.
  • the terminal device 100 includes, but is not limited to, a desktop computer, a portable computer, a network server, a handheld computer (Personal Digital Assistant, PDA), a tablet computer, a wireless terminal device, an embedded device, etc.
  • communication between the terminal device 100 and the infrared sensing device 200 can be achieved through any communication method, including but not limited to, based on the 3rd Generation Partnership Project (3GPP), Long Term Evolution (3GPP) Long Term Evolution (LTE), Worldwide Interoperability for Microwave Access (WiMAX) mobile communications, or based on TCP/IP Protocol Suite (TCP/IP), User Datagram Protocol (User Datagram Protocol, UDP) computer network communication, etc.
  • 3GPP 3rd Generation Partnership Project
  • 3GPP Long Term Evolution
  • LTE Long Term Evolution
  • WiMAX Worldwide Interoperability for Microwave Access
  • TCP/IP Protocol Suite TCP/IP Protocol Suite
  • UDP User Datagram Protocol
  • the scene schematic diagram of the infrared temperature detection system shown in Figure 1 is only an example.
  • the infrared temperature detection system and the scene described in the embodiment of the present application are for the purpose of more clearly illustrating the technical solution of the embodiment of the present application and are not This constitutes a limitation on the technical solutions provided by the embodiments of the present application.
  • Persons of ordinary skill in the art know that with the evolution of infrared temperature detection systems and the emergence of new business scenarios, the technical solutions provided by the embodiments of the present application can also address similar technical problems. Be applicable.
  • FIG. 2 is a schematic flow diagram of an embodiment of the infrared temperature detection method in the embodiment of the present application.
  • the infrared temperature detection method may include the following steps 201 to 203:
  • the area to be measured includes multiple objects to be detected, and each object to be detected is provided with an identification mark. mark, and the infrared emissivity of each detected object is different from the infrared emissivity of its corresponding identification mark.
  • infrared detection is a technology that detects the temperature of an object to determine the current state of the object. Under normal circumstances, if the shooting area of the infrared sensor only covers the object to be detected, the thermal image captured will only include the thermal image of the object to be detected. At this time, it is only necessary to correspond the infrared sensor to the object to be detected, and then the temperature of the object to be detected can be determined.
  • the first disadvantage is that if an infrared sensor is added to each detected object, a large amount of equipment cost and installation cost of the infrared sensor will be required.
  • the second disadvantage is that without considering the cost, it may be that due to the internal space of the equipment, it is impossible to set up an infrared sensor for each detected object. In this case, one infrared sensor needs to be used to detect multiple objects. Temperature detection of the test object. At this time, the thermal imaging image presented by the infrared sensor includes various temperature colors used to express temperature. Obviously, it is necessary to determine which temperature color corresponds to the temperature of the detected object among the various temperature colors. very difficult. Therefore, a means is needed to immediately identify which temperature color among numerous temperature colors corresponds to the detected object.
  • an identification method is needed that can effectively distinguish the temperature of the specific detected object.
  • This embodiment uses the characteristics of infrared detection and adds an identification mark with an infrared emissivity different from that of the object to be detected, so that in the corresponding temperature imaging, the position of the identification mark in the thermal image can be clearly identified. .
  • the infrared emissivity of the identification mark and the detected object are different, in the corresponding thermal imaging image, there will be a significant deviation between the temperature color displayed by the identification mark and the surrounding temperature color, and this deviation can still be carried out.
  • computational For example: If the infrared emissivity of the detected object is 10% greater than the infrared emissivity of the identification mark, then in the thermal imaging image, the difference between two adjacent temperature areas is 10%, and the area with the lower temperature in the two areas is Identification mark. In thermal imaging images, the performance of temperature is reflected by color. Therefore, to determine the identification mark, image recognition technology can be used to identify the pixel color in the thermal imaging image, thereby identifying the corresponding identification mark.
  • the location of the identification mark can also be located in other ways.
  • the temperature data can not be sent to the device that generates the thermal imaging map, but the temperature data can be Directly into the equipment for temperature analysis, since the infrared emissivity of the identification mark and the object to be detected are different, the temperatures of the two are also different. Therefore, the identification mark can be located based on this characteristic by temperature analysis.
  • the positioning at this time is an abstract positioning.
  • the corresponding temperature analysis equipment can directly analyze the temperature of the identification mark according to different temperatures, so it is enough to directly position the corresponding temperature as the temperature of the identification mark.
  • the infrared emissivity of the detected object is still 10% greater than the infrared emissivity of the identification mark, then during thermal analysis, the difference between two adjacent temperature areas will be 10% The area can be positioned as the location where the identification mark and the detected object coexist. If the infrared emissivity of the detected object is higher than the identification mark, the lower temperature is the temperature of the identification mark. If the infrared emissivity of the detected object is low For identification marks, the higher temperature is the temperature of the identification mark.
  • the detected object since the detected object has an identification mark added to it, after the identification of the identification mark is completed, since the identification mark can be added to the corresponding position on the object being detected, it is possible to determine the position of the identification mark. Then determine the location of the object to be detected.
  • the specific positioning method is the same as the positioning method in step 201 above, and will not be described again here.
  • the corresponding temperature can be detected.
  • the infrared emissivity of the detected object is greater than the infrared emissivity of the identification mark by 10%
  • the difference between the two adjacent temperature areas is 10%
  • the area with higher temperature among the two areas is the corresponding detected object.
  • the position of the detected object in the thermal image can be determined, so that real-time temperature detection can be performed based on the color of the thermal image; Or you can directly perform corresponding temperature detection based on the area in the temperature area that satisfies the infrared emissivity temperature difference.
  • the infrared emissivity of the detected object is determined. According to the infrared emissivity of the detected object, the infrared emissivity of the mark corresponding to the detected object is determined; according to the marked infrared emissivity, the detected object is determined. Corresponding identification mark, and control the addition of the identification mark to the detected object.
  • the infrared emissivity of the identification mark and the detected object are different, it can be effectively determined which color in the thermal image represents the detected temperature, thereby realizing monitoring of the temperature of the detected object. Therefore, it is necessary to determine the infrared emissivity of the two to ensure that when the identification mark is added, the infrared emissivity of the two is different.
  • the infrared emissivity of the object to be detected can be determined based on detection by corresponding detection equipment, the physical characteristics of the surface of the object to be detected, or based on relevant manual experiments.
  • the material used for the identification mark of the mark can also be determined based on the physical properties of the material or manual experiments, and there is no specific limit here.
  • identification marks can be added to the object to be detected by controlling the corresponding equipment for welding, spraying, joining, patching, etc.
  • the shapes of each identification mark can be different, so that each identification mark is unique.
  • each identification mark can be made to have its own corresponding shape.
  • the corresponding relationship between the detected objects is also unique.
  • the advantage of this method is that if an infrared sensor performs the temperature detection task of multiple detected objects, the corresponding relationship between each mark and each detected object is unique, so that the detected temperature can correspond to Each specific object to be detected avoids confusion in the corresponding relationship, which may lead to detection failure. Therefore, when adding identification marks, you can ensure the uniqueness of each identification mark by setting different numbers, graphics, and text.
  • a relationship comparison table can be generated to reflect the mapping relationship between the identification mark and the detected object.
  • the relationship comparison table may include specific values of each identification mark that are different from the infrared emissivity of the detected object, the shape of the identification mark corresponding to each detected object, and so on.
  • the relationship comparison table is stored in the corresponding storage device.
  • the detection device can call the relationship comparison table from the storage device to perform accurate temperature monitoring.
  • the relationship comparison table can be generated manually, and the details are not limited here.
  • the infrared emissivity of the mark corresponding to the detected object is determined according to the infrared emissivity of the detected object, including:
  • the infrared emissivity of the detected object is compared with a preset infrared emissivity threshold to obtain a comparison result; based on the comparison result, the infrared emissivity of the mark corresponding to the detected object is determined.
  • a material whose infrared emissivity is significantly greater or less than the infrared emissivity of the object to be detected can be selected, so that During the identification process, the temperature color of the table with the identification mark can be significantly different from the surrounding temperature color, thereby improving the identification effect and efficiency.
  • a material whose infrared emissivity difference between the two is greater than or equal to 20% can be selected as the material for the identification mark.
  • the infrared emissivity of the surface material of the object to be detected is 50%
  • the infrared emissivity of the material selected as the identification mark needs to be less than or equal to 30%, or greater than or equal to 70%. Therefore, the data with a 20% difference in infrared emissivity can be used as the preset infrared emissivity threshold.
  • the identification mark is added to the detected object, including:
  • the identification mark is added to adjacent positions around the object to be detected.
  • adding labels to the objects to be detected can improve detection accuracy.
  • identification markers can be set at adjacent positions around the object to be detected. For example: If an identification mark cannot be added to a detected object A, and there are static objects adjacent to the detected object A, including a shell wall similar to a safety shell, then the identification mark A will be set on the static object first.
  • the specific identification mark A can also measure the actual distance between the location where the specific identification mark A is set and the detected object A, and associate the identification mark A, the detected object A, and the actual distance between the two, so that the corresponding program can be used in thermal imaging.
  • it can be determined based on the specific actual distance that the identification mark A is the mark corresponding to the detected object A, thereby avoiding the problem that the distance between the identification mark A and the detected object is too far and the two cannot be matched.
  • the circumstances in which tags cannot be added include other circumstances, which are not limited here.
  • the association may not be based on the specific actual distance, and the specifics are not limited here.
  • the method of detecting whether the detected object can be marked can be determined manually.
  • the way of adding marks can also be through welding, spraying, etc. in the above embodiments; the way of association can also be done by establishing a corresponding association table.
  • the detected object corresponding to each identification mark is determined according to the position of each identification mark, including:
  • the mapping relationship represents the corresponding relationship between the identification mark and the detected object.
  • the infrared sensor covers a small number of detected objects when performing a temperature detection task, that is, when the number of colors used to display temperature in the thermal image is small, precise positioning and identification marks are not required to determine the temperature. The color corresponding to the detected object.
  • the infrared sensor covers a large number of detected objects when performing a temperature detection task, the number of temperature colors used for temperature presentation in the thermal imaging image will increase. At this time, if the identification mark is still not positioned, it will This leads to deviations in the detection of the temperature of the object to be detected based on the mark.
  • the positioning method can still be performed through image recognition. Therefore, the specific pixel color coordinates of the color corresponding to each mark in the thermal imaging image can be located through image recognition, thereby determining the specific pixel coordinates of the identification mark.
  • the relationship between the identification mark and the detected object is determined based on the mapping relationship, such as the positional relationship between the identification mark and the detected object, whether the mark is set on the detected object or near the detected object, the shape of the mark and the detected object.
  • the detected pixel coordinates corresponding to the pixel coordinates of the identification mark can be detected, so as to obtain the corresponding temperature data.
  • the position of each identification mark in the area to be measured is identified through the infrared emissivity of multiple identification marks that have been preset in the area to be measured, including:
  • the thermal imaging image of the area to be measured is obtained; based on the infrared emissivity of each identification mark, the thermal imaging image is thermally analyzed to determine the position of each identification mark in the thermal imaging image.
  • thermal analysis can be performed directly on the thermal imaging map without using image recognition. For example: according to the mapping relationship, the infrared emissivity difference relationship between each identification mark and each detected object is obtained. Through thermal analysis, the heat area in the thermal image that matches the mapping relationship can be analyzed as the location of the identification mark.
  • Temperature detection including:
  • the position of each detected object in the thermal imaging image is determined; according to the position of each detected object in the thermal imaging image, the temperature corresponding to each detected object is obtained. and conduct testing.
  • the solution of using the surrounding color temperature directly as the detected object after locating the position of the identification mark is described.
  • the accuracy of temperature detection can be ensured.
  • the detection accuracy will become worse. For this reason, it is also possible to complete the positioning of the detected object after the positioning of the identification mark is completed first.
  • the shape of the detected object can also be added.
  • the shape of the temperature color used to express the temperature conforms to the shape of the detected object.
  • the position of the object to be detected can be located, but this method still has shortcomings.
  • the same type of components may include multiple components, such as multiple components with the same shape and size. However, among these same components, only some of them need to be inspected. For example: some components may be installed in a location with high security, and some components may be located in a location with low security. In this case, it is necessary to detect the components in the location with low security. If the infrared sensor in the area to be detected includes the same components mentioned above that do not need to be detected during detection, then when positioning is performed, the components with a temperature that does not need to be detected may be regarded as the detected object, so it is still possible. When establishing a mapping relationship, it is necessary to match the shape of the corresponding identification mark with the detected shape.
  • the temperature color presented in the temperature area satisfies the shape of the temperature color of the detected object and the temperature color of the identification mark, and the temperature color shape of the two satisfies the mapping relationship.
  • the position of the object to be detected can be accurately determined, and the temperature of the object to be detected can be accurately determined for detection.
  • detecting the temperature of the detected object corresponding to each identification mark includes:
  • each identification mark in the thermal imaging image determines the position of each corresponding detected object in the thermal imaging image; according to the position of each corresponding detected object in the thermal imaging image, perform a test on each corresponding detected object temperature check.
  • detection is carried out through thermal imaging or directly through temperature.
  • detection directly through temperature lacks the intuitiveness of visualization.
  • the corresponding equipment can directly complete the monitoring task, it also requires manual labor.
  • manual inspection is more difficult due to the lack of intuitiveness of thermal imaging images.
  • the temperature of the object to be detected can be obtained directly based on the positioning of the object in the thermal imaging image, and then the detection can be performed.
  • the infrared temperature detection method provided by this application can mark the object to be detected in advance with a material whose infrared emissivity is different from the infrared emissivity of the device.
  • the infrared emissivity of the mark is analyzed. , can effectively locate the specific device through the mark, thereby obtaining the temperature of the specific device, improving the accuracy of infrared temperature measurement.
  • the method further includes:
  • each temperature can also be uploaded to a monitoring device for monitoring, such as an alarm device, a display device, and other equipment that can be monitored.
  • a monitoring device for monitoring, such as an alarm device, a display device, and other equipment that can be monitored.
  • the monitoring device receives the temperature information of each detected object, it can perform corresponding monitoring.
  • the display device can display each temperature for reference by relevant staff.
  • confidentiality means can also be added.
  • the corresponding personnel can only enter special matching instructions to view the temperature of each detected device.
  • the embodiment of the present application also provides an infrared temperature detection device.
  • the device 300 includes:
  • the identification module 301 is used to identify the position of each identification mark in the area to be measured through the infrared emissivity of multiple identification marks that have been preset in the area to be measured.
  • the area to be measured includes multiple objects to be detected, each of which is detected.
  • the objects are provided with identification marks, and the infrared emissivity of each detected object is different from the infrared emissivity of its corresponding identification mark;
  • the determination module 302 is used to determine the detected object corresponding to each identification mark according to the position of each identification mark;
  • the detection module 303 is used to detect the temperature of the detected object corresponding to each identification mark.
  • the infrared temperature detection device can pre-mark the objects that need to be detected with materials whose infrared emissivity is different from the infrared emissivity of the device, so that in the case of infrared detection, it can be effectively identified by the identification module 301
  • Each mark is output, so that the position of the identification mark and the detected object can be determined through the determination module 302, and then the infrared emissivity of the mark is analyzed through the detection module 303, so that the specific device can be effectively positioned through the mark, thereby obtaining the specific device. temperature, improving the accuracy of infrared temperature measurement.
  • the device also includes a mark adding module 304.
  • the mark adding module 304 is specifically used to:
  • For each detected object determine the infrared emissivity of the detected object, and determine the infrared emissivity of the mark corresponding to the detected object based on the infrared emissivity of the detected object;
  • the identification mark corresponding to the detected object is determined, and the addition of the identification mark to the detected object is controlled.
  • the mark adding module 304 is also specifically used to:
  • the infrared emissivity of the mark corresponding to the detected object is determined.
  • the mark adding module 304 is also specifically used to:
  • the identification mark is added to adjacent positions around the object to be detected.
  • the determination module 302 is specifically used to:
  • the mapping relationship represents the corresponding relationship between the identification mark and the detected object.
  • the determination module 302 is also specifically used to:
  • thermal analysis is performed on the thermal imaging image to determine the position of each identification mark in the thermal imaging image.
  • the identification module 301 is specifically used to:
  • thermal analysis is performed on the thermal imaging image to determine the position of each identification mark in the thermal imaging image.
  • the detection module 303 is specifically used to:
  • each identification mark in the thermal imaging image determines the position of each corresponding detected object in the thermal imaging image
  • the temperature of each corresponding detected object is detected.
  • Embodiments of the present application also provide a terminal device.
  • the device includes a processor, a memory, and a computer program stored in the memory and executable on the processor.
  • the processor executes the computer program to implement any infrared method in any embodiment of the present application. Steps in temperature detection.
  • the terminal device integrates any infrared temperature detection provided by the embodiment of the present application, as shown in Figure 4, which shows a schematic structural diagram of the terminal device involved in the embodiment of the present application. Specifically:
  • the terminal device may include components such as a processor 401 of one or more processing cores, a memory 402 of one or more computer-readable storage media, a power supply 403, and an input unit 404.
  • a processor 401 of one or more processing cores a memory 402 of one or more computer-readable storage media
  • a power supply 403 a power supply 403
  • an input unit 404 an input unit 404.
  • the processor 401 is the control center of the terminal equipment, using various interfaces and lines to connect various parts of the entire terminal equipment, by running or executing software programs and/or modules stored in the memory 402, and calling the software programs stored in the memory 402. Data, perform various functions of the terminal device and process data, thereby overall monitoring the terminal device.
  • the processor 401 may include one or more processing cores; the processor 401 may be a central processing unit (Central Processing Unit, CPU), or other general-purpose processor, digital signal processor (Digital Signal Processor, DSP). ), Application Specific Integrated Circuit (ASIC), off-the-shelf programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.
  • CPU Central Processing Unit
  • DSP Digital Signal Processor
  • ASIC Application Specific Integrated Circuit
  • FPGA off-the-shelf programmable gate array
  • FPGA field-Programmable Gate Array
  • the general processor can be a microprocessor or the processor can be any conventional processor, etc.
  • the processor 401 can integrate an application processor and a modem processor, where the application processor mainly processes the operating system,
  • the user interface is the interface and applications, etc.
  • the modem processor mainly handles wireless communications. It can be understood that the above modem processor may not be integrated into the processor 401.
  • the memory 402 can be used to store software programs and modules.
  • the processor 401 executes various functional applications and data processing by running the software programs and modules stored in the memory 402 .
  • the memory 402 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the storage data area may store a program based on Data created by the use of terminal equipment, etc.
  • memory 402 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 402 may also include a memory controller to provide the processor 401 with access to the memory 402 .
  • the terminal device also includes a power supply 403 that supplies power to various components.
  • the power supply 403 can be logically connected to the processor 401 through a power management system, so that functions such as charging, discharging, and power consumption management can be implemented through the power management system.
  • the power supply 403 may also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.
  • the terminal device may also include an input unit 404 that may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.
  • an input unit 404 may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.
  • the terminal device may also include a display unit and the like, which will not be described again here.
  • the processor 401 in the terminal device will load the executable files corresponding to the processes of one or more application programs into the memory 402 according to the following instructions, and the processor 401 will run the executable files stored in Application programs in memory 402 to implement various functions, such as:
  • each identification mark in the area to be measured is identified through the infrared emissivity of multiple identification marks that have been preset in the area to be measured.
  • the area to be measured includes multiple objects to be detected, and each object to be detected is provided with an identification mark. And the infrared emissivity of each detected object is different from the infrared emissivity of its corresponding identification mark;
  • each identification mark determines the detected object corresponding to each identification mark
  • embodiments of the present application provide a computer-readable storage medium, which may include: read-only memory (ROM, Read Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk, etc. .
  • a computer program is stored thereon, and the computer program is loaded by the processor to perform any of the steps in infrared temperature detection provided by the embodiments of the present application.
  • a computer program loaded by a processor may perform the following steps:
  • each identification mark in the area to be measured is identified through the infrared emissivity of multiple identification marks that have been preset in the area to be measured.
  • the area to be measured includes multiple objects to be detected, and each object to be detected is provided with an identification mark. And the infrared emissivity of each detected object is different from the infrared emissivity of its corresponding identification mark;
  • each identification mark determines the detected object corresponding to each identification mark
  • each of the above units or structures can be implemented as an independent entity, or can be combined in any way and implemented as the same or several entities.
  • each of the above units or structures please refer to the previous method embodiments. Here No longer.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)

Abstract

本申请提供一种红外温度检测方法、装置、终端设备以及存储介质，该方法包括：通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，待测区域包括多个被检测物，每个被检测物设置有识别标记，且各被检测物的红外发射率和与其对应的识别标记的红外发射率不同；根据各识别标记的位置，确定各识别标记对应的被检测物；检测各识别标记对应的被检测物的温度。本方法，可以预先对需要被检测的物体，使用红外发射率与器件的红外发射率不同的材料进行标记，在红外检测的情况下，通过对标记的红外发射率进行分析，能够有效的通过标记，定位至具体的器件，从而得到具体器件的温度，提高了红外测温的精确性。

Description

红外温度检测方法、装置、终端设备以及存储介质 技术领域
本公开要求于2022年5月27日提交中国专利局、申请号为202210594657.X、发明名称为“红外温度检测方法、装置、终端设备以及存储介质”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
本申请涉及机械设备领域，具体涉及一种红外温度检测方法、装置、终端设备以及存储介质。
 背景技术
大多数的机械设备在运作时，机械设备的内部由于各个器件的工作，这些器件本身均会产生不同的热量。当器件的热量过高时，机械设备的安全风险也是随之增加的。因此，为了避免机械设备内部的器件温度过高，要么建立相应的散热机制，要么实时监控各个器件的温度，当温度过高时，停止设备的运转。从而避免相应的事故发生。
现有技术中，实时监控器件的温度，通常会使用温度传感器直接接收机械设备内部器件的温度，或者通过红外测温设备，实时监控机械设备的内部，防止机械设备内部的局部温度升高。
 技术问题
在需要使用红外测温设备的场景中，红外测温设备可能面临同时检测的器件数量较多的情况。当检测的器件数量较多，便无法有效定位至具体器件，检测的精确性较差。
 技术解决方案
本申请提供了一种红外温度检测方法，能够有效的检测设备中需要进行温度检测的器件，避免安全事故的发生。
第一方面，本申请提供了一种红外温度检测方法，所述方法包括：
通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，所述待测区域包括多个被检测物，每个所述被检测物设置有识别标记，且各所述被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
根据各所述识别标记的位置，确定各所述识别标记对应的被检测物；
检测各所述识别标记对应的被检测物的温度。
在本申请一些实施例中，所述通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置之前，所述方法还包括：
针对所述每个被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；
根据所述标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
在本申请一些实施例中，所述根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率，包括：
将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；
根据所述比较结果，确定该被检测物对应的标记红外发射率。
在本申请一些实施例中，所述控制将该识别标记添加至该被检测物，包括：
若该被检测物无法添加该识别标记，则对所述该被检测物的周围相邻的位置添加该识别标记。
在本申请一些实施例中，所述根据各所述识别标记的位置，确定各所述识别标记对应的被检测物，包括：
根据各所述识别标记的位置以及预设的映射关系，确定得到各所述识别标记对应的被检测物的位置；所述映射关系表征识别标记与被检测物的对应关系。
在本申请一些实施例中，所述通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，包括：
通过预设的红外传感装置，获取所述待测区域的热成像图；
基于各所述识别标记的红外发射率，对所述热成像图进行热量分析，确定各所述识别标记在所述热成像图中的位置。
在本申请一些实施例中，所述检测各所述识别标记对应的被检测物的温度，包括：
根据各所述识别标记在所述热成像图中的位置，确定各所述对应的被检测物在所述热成像图中的位置；
根据各所述对应的被检测物在所述热成像图中的位置，对各所述对应的被检测物进行温度检测。
第二方面，本申请还提供了一种红外温度检测装置，所述装置包括：
识别模块，用于通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，所述待测区域包括多个被检测物，每个所述被检测物设置有识别标记，且各所述被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
确定模块，用于根据各所述识别标记的位置，确定各所述识别标记对应的被检测物；
检测模块，用于检测各所述识别标记对应的被检测物的温度。
在本申请一些实施方式中，所述装置还包括标记添加模块，所述标记添加模块具体用于：
针对每个所述被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；
根据所述标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
在本申请一些实施方式中，所述标记添加模块具体还用于：
将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；
根据所述比较结果，确定该被检测物对应的标记红外发射率。
在本申请一些实施方式中，所述标记添加模块具体还用于：
若该被检测物无法添加该识别标记，则对所述该被检测物的周围相邻的位置添加该识别标记。
在本申请一些实施方式中，所述确定模块具体用于：
根据各所述识别标记的位置以及预设的映射关系，确定得到各所述识别标记对应的被检测物的位置；所述映射关系表征识别标记与被检测物的位置对应关系。
在本申请一些实施方式中，所述识别模块具体用于：
通过预设的红外传感装置，获取所述待测区域的热成像图；
基于各所述识别标记的红外发射率，对所述热成像图进行热量分析，确定各所述识别标记在所述热成像图中的位置。
在本申请一些实施方式中，所述检测模块具体用于：
根据各所述识别标记在所述热成像图中的位置，确定各所述对应的被检测物在所述热成像图中的位置；
根据各所述对应的被检测物在所述热成像图中的位置，对各所述对应的被检测物进行温度检测。
第三方面，本申请还提供一种终端设备，所述终端设备包括处理器、存储器以及存储于所述存储器中并可在所述处理器上运行的计算机程序，所述处理器执行所述计算机程序以实现任一项所述的红外温度检测方法中的步骤。
第四方面，本申请还提供一种计算机可读存储介质，所述计算机可读存储介质上存储有计算机程序，所述计算机程序被处理器执行以实现任一项所述的红外温度检测方法中的步骤。
 有益效果
本申请提供的红外温度检测方法，可以预先对需要被检测的物体，使用红外发射率与器件的红外发射率不同的材料进行标记，在红外检测的情况下，通过对标记的红外发射率进行分析，能够有效的通过标记，定位至具体的器件，从而得到具体器件的温度，提高了红外测温的精确性。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例中提供的红外温度检测系统的场景示意图；
图2是本申请实施例中红外温度检测方法的一个实施例流程示意图；
图3是本申请实施例中红外温度检测装置的一个功能模块示意图；
图4是本申请实施例中终端设备的结构示意图。
本申请的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，“示例性”一词用来表示“用作例子、例证或说明”。本申请中被描述为“示例性”的任何实施例不一定被解释为比其它实施例更优选或更具优势。为了使本领域任何技术人员能够实现和使用本申请，给出了以下描述。在以下描述中，为了解释的目的而列出了细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实例中，不会对公知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理和特征的最广范围相一致。
本申请提供了一种红外温度检测方法、装置、终端设备及计算机可读存储介质，以下分别进行详细说明。
首先，介绍本申请中出现的一些概念：
红外检测：利用红外辐射原理对材料表面进行检测的方法。其实质是扫描记录被检材料表面上由于缺陷或材料不同的热性质所引起的温度变化。可用于检测胶接或焊接件中的脱粘或未焊透部位，固体材料中的裂纹、空洞和夹杂物等缺陷。
请参阅图1，图1为本申请实施例所提供的红外温度检测系统的场景示意图，该红外温度检测系统可以包括终端设备100和红外传感设备200，该红外传感设备200可以向该终端设备100传输红外图像。如图1中的终端设备100，可以获取该红外传感设备200在机械设备内部获取的红外图像，以执行本申请中的红外温度检测方法。
本申请实施例中，终端设备100其包括但不限可以是台式机、便携式电脑、网络服务器、掌上电脑（Personal Digital Assistant，PDA）、平板电脑、无线终端设备、嵌入式设备等。
本申请的实施例中，终端设备100和红外传感设备200之间可通过任何通信方式实现通信，包括但不限于，基于第三代合作伙伴计划（3rd Generation Partnership Project，3GPP）、长期演进（Long Term Evolution，LTE)、全球互通微波访问（Worldwide Interoperability for Microwave Access，WiMAX）的移动通信，或基于TCP/IP协议族（TCP/IP Protocol Suite，TCP/IP）、用户数据报协议（User Datagram Protocol，UDP）的计算机网络通信等。
需要说明的是，图1所示的红外温度检测系统的场景示意图仅仅是一个示例，本申请实施例描述的红外温度检测系统以及场景是为了更加清楚的说明本申请实施例的技术方案，并不构成对于本申请实施例提供的技术方案的限定，本领域普通技术人员可知，随着红外温度检测系统的演变和新业务场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
如图2所示，图2为本申请实施例中红外温度检测方法的一个实施例流程示意图，红外温度检测方法可以包括如下步骤201～203：
201、通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，待测区域包括多个被检测物，每个被检测物设置有识别标记，且各被检测物的红外发射率和与其对应的识别标记的红外发射率不同。
根据前文介绍的红外检测的相关概念可得，红外检测是对物体的温度进行检测，从而确定物体当前的状态的一种技术。在通常的情况中，若将红外传感器的拍摄区域仅覆盖住被检测物时，拍摄出来的热成像图就仅包括被检测物的热量图像。此时，仅需要将红外传感器与被检测物对应，则可以确定被检测物的温度。
然而，这种方式存在相应的弊端。第一种弊端，若将每个被检测物均添加一个红外传感器，需要付出大量红外传感器的设备成本以及安装成本。第二种弊端，在不考虑成本的条件下，可能出现受制于设备内部空间的原因，无法将每个被检测物均设置一个红外传感器进行检测，此时需要将使用一个红外传感器进行多个被检测物的温度检测。此时，红外传感器所呈现的热成像图中，就包括了各种用于表现温度的各种温度颜色，显而易见的，在各种温度颜色中确定具体哪个温度颜色是对应被检测物的温度就非常困难。因此，需要一种手段，可以立即识别出众多的温度颜色中哪些温度颜色对应被检测物。
为了能够从不同的温度颜色中识别出能够对应被检测物的温度颜色，则需要一种识别手段，能够有效的分辨出具体的被检测物的温度。本实施例通过红外检测的特点，通过在被检测物上添加一个与被检测物红外发射率不同的识别标记，使得在相应的温度成像中，能够清晰的识别出识别标记在热成像图的位置。
具体的，由于识别标记与被检测物的红外发射率不同，则在相应的热成像图中，识别标记所展现的温度颜色与周围的温度颜色则会有明显的偏差，且该偏差还是可以进行计算的。例如：若被检测物的红外发射率大于识别标记的红外发射率10%，则在热成像图中，两个相邻温度区域相差10%，且两个区域中温度较低的区域，则为识别标记。而在热成像图中温度的表现均由颜色体现，因此，确定识别标记可以通过图像识别技术，识别热成像图中的像素颜色，从而识别出相应的识别标记。
此外，还可以通过其他的方式定位识别标记的位置，例如：在实际的过程中，红外传感器获取区域的温度数据之后，可以不将温度数据发送至生成热成像图的设备，而可以将温度数据直接送入温度分析的设备中，由于识别标记与被检测物的红外发射率不同，故两者的温度也不同，因此可以根据该特征，通过温度进行特征分析，从而对识别标记进行定位。此时的定位为一种抽象意义的定位，相应的温度分析设备能够根据不同的温度直接分析出识别标记的温度，因此直接定位相应的温度为识别标记的温度即可。例如：依旧通过上述热成像图中的数据进行举例，假设若被检测物的红外发射率依旧大于识别标记的红外发射率10%，则在热量分析中时，两个相邻温度区域相差10%的区域则可以定位为识别标识和被检测物共同存在的位置，若被检测物的红外发射率高于识别标识，则较低的温度为识别标识的温度，若被检测物的红外发射率低于识别标识，则较高的温度为识别标识的温度。
202、根据各识别标记的位置，确定各识别标记对应的被检测物。
根据上述步骤可得，由于被检测物添加了识别标记，当完成识别标记的识别之后，由于识别标记可以添加在被检测上等相应的位置，因此便可以在确定了识别标记的位置之下，再确定被检测物的位置。具体的定位方式与上述步骤201中的定位方式相同，此处不再赘述。
203、检测各识别标记对应的被检测物的温度。
完成了被检测物以及对应的识别标记的定位之后，便可以对相应的温度进行检测。
具体的，依旧根据上述步骤201实施例中数据进行举例，若被检测物的红外发射率大于识别标记的红外发射率10%，则在热成像图中，两个相邻温度区域相差10%，且两个区域中温度较高的区域，则是相应的被检测物，此时便可以确定该被检测物在热成像图中的位置，从而可以根据热成像图的颜色进行实时的温度检测；或直接根据温度区域中满足红外发射率温度差值的区域进行相应的温度检测即可。
为了更好的实现本申请实施例，在一个本申请实施例中，通过待测区域中已预先设置的多个识别标记各自的红外发射率，识别待测区域中的多个识别标记之前，包括：
针对每个被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；根据标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
根据上述实施例可得，识别标记与被检测物在红外发射率不同的情况下，可以有效的确定在热成像图中具体哪个颜色代表被检测的温度，从而实现对被检测物温度的监控。因此，需要确定两者各自红外发射率，才能保证识别标记被添加时，两者的红外发射率不同。
本实施例中，确定被检测物的红外发射率可以根据相应的检测设备检测，根据被检测物表面本身的物理特性进行确定，也可以根据相关的人工实验进行确定。同理用于标记的识别标记的材料也可以根据材料的物理特性，或者人工实验进行确定，具体此处不做限定。
当完成两者各自红外发射率的确定之后，对被检测物添加识别标记可以通过控制相应设备进行焊接、喷涂、把合、贴片等方式进行识别标记的添加。其中，对每个被检测物添加识别标记时，每个识别标记之间的形状可以均不相同，使得每个识别标记具有唯一性，在此基础之上，再使得每个识别标记各自对应的被检测物的对应关系也具有唯一性。该方式的优点在于，若一个红外传感器在进行多个被检测物的温度检测任务时，由于每个标记与每个被检测物之间的对应关系具有唯一性，从而使得检测得到的温度能够对应每个具体的被检测物，避免对应关系混乱，导致检测失败。因此，在识别标记添加之时，可以通过设置不同的数字、图形、文字来保证每个识别标记的唯一性。
由于，可以通过标记与被检测物之间对应关系的唯一性提高检测能力，因此，在标记的建立之初，可以生成一个关系对照表用于体现识别标记与被检测物之间的映射关系，该关系对照表可以包括每个识别标识各自与被检测物红外发射率不同的具体数值、每个被检测物对应的识别标记的形状等等。并将该关系对照表存入相应的存储设备中，当进行温度检测时，检测设备可以从存储设备中调用该关系对照表，以进行精确的温度监控。其中，该关系对照表的生成可以通过人工的方式进行生成，具体此处不做限定。
为了更好的实现本申请实施例，在一个本申请实施例中，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率，包括：
将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；根据比较结果，确定该被检测物对应的标记红外发射率。
然而，为了使得识别标记的在热成像图中能够更有效的被识别出来，在进行标记的添加之前，可以选取一种红外发射率明显大于或小于被检测物红外发射率的一种材料，使得在进行识别过程中，识别标记所带表的温度颜色能与周围的温度颜色有明显的差异，从而提高识别的效果以及效率。此时，可以在进行识别标记的材料选取时，可以选用一种两者红外发射率差值大于或等于20%以上的材料，作为识别标记的材料。例如：若被检测物的表面材料的红外发射率为50%，则选取作为识别标记的材料的红外发射率则需要小于或等于30%，或者大于或等于70%。故，可以将红外发射率相差20%的数据作为该预设的红外发射率阈值。
为了更好的实现本申请实施例，在一个本申请实施例中，并将该识别标记添加至该被检测物，包括：
若该被检测物无法添加该识别标记，则对该被检测物的周围相邻的位置添加该识别标记。
根据上述实施例中可得，对被检测物添加标记可以提高检测精度，然而在众多的被检测物中，可能存在无法直接将识别标记直接添加在被检测物上的情况，例如：被检测物的表面材料比较特殊，无法有效的将识别标记附着在被检测物上。为了依旧保持一定的检测精度，在此情况下，可以将标记设置在被检测物周围相邻的位置。例如：若某被检测物A无法添加识别标记，且该被检测物A周围相邻的位置有静态物体，包括类似于安全保护壳的壳壁，则优先将识别标记A设置在静态物体上，并可以测量出具体的识别标记A设置的位置与被检测物A之间的实际距离，将识别标记A、被检测物A以及两者之间的实际距离进行关联，使得相应的程序在热成像图中进行检测时，能够根据具体的实际距离，判断识别标记A是被检测物A对应的标记，避免识别标记A与被检测物的距离过远，从而无法将两者对应的问题。同时，无法添加标记的情况还包括其他的情况，具体此处不做限定。且在进行将设置在周围相邻位置的识别标记与该被检测物关联时，也可以不根据具体的实际距离进行关联，具体此处不做限定。
其中，检测被检测物是否能够添加标记的方式可以通过人工来进行确定。添加标记的方式也可以通过上述实施例中焊接、喷涂等方式；关联的方式也可以通过建立相应的关联对照表进行关联。
为了更好的实现本申请实施例，在一个本申请实施例中，根据各识别标记的位置，确定各识别标记对应的被检测物，包括：
根据各识别标记的位置以及预设的映射关系，确定得到各识别标记对应的被检测物的位置；映射关系表征识别标记与被检测物的对应关系。
在上述实施例中，描述了通过被检测物与识别标记在红外发射率不同的情况下，通过图像识别的方式，识别热成像图中的不同颜色，从而确定被检测物的温度。
然而，若红外传感器在进行温度检测任务时，覆盖的被检测物数量较少时，即热成像图中，用于展现温度的颜色数量较少时，不需要精准的定位识别标记，也能够确定被检测物对应的颜色。但，若红外传感器在进行温度检测任务时，覆盖的被检测物数量较多时，热成像图中用于温度呈现的温度颜色的数量便会增多，此时若依旧不对识别标记进行定位，则会导致根据标记进行被检测物温度的检测出现偏差。
具体的，定位的方式可以依旧可以通过图像识别手段进行定位，因此可以通过图像识别方式定位每个标记对应的颜色在热成像图中具体的像素颜色的坐标，从而确定识别标记具体的像素坐标。此时在根据映射关系确定识别标记与被检测物的关系，例如该识别标记与被检测物的位置关系，是标记设置在被检测物上，还是设置在被检测物附近，标记的形状与被检测物的对应关系，识别标记与被检测物两者的红外发射率等等。从而再根据图像识别手段，检测识别标记像素坐标对应的被检测的像素坐标即可，从而获取相应的温度数据。
为了更好的实现本申请实施例，在一个本申请实施例中，通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，包括：
通过预设的红外传感装置，获取待测区域的热成像图；基于各识别标记的红外发射率，对热成像图进行热量分析，确定各识别标记在热成像图中的位置。
上述实施例中描述了一种通过图像识别方式，识别两者颜色的方式进行定位的方案。为了提高检测手段的多样性，可以不通过图像识别的方式，直接在热成像图上进行热量分析。例如：根据映射关系获取到每个识别标记与每个被检测物的红外发射率相差关系则，通过热量分析，分析出热成像图中符合映射关系中的热量区域为识别标记的位置即可。
为了更好的实现本申请实施例，在一个本申请实施例中，根据每个识别标记的位置以及预设的识别标记与被检测之间的映射关系，对获取的每个被检测物对应的温度进行检测，包括：
根据每个识别标记与对应被检测的映射关系，确定每个被检测物在热成像图中的位置；根据每个被检测物在热成像图中的位置，获取每个被检测物对应的温度并进行检测。
上述实施例中，描述了在定位识别标记的位置之后，将周围的颜色温度直接作为被检测物的方案。同理，若红外传感器检测的被检测物数量较少时，能够确保温度检测的精确性。然而，在红外传感器检测被检测物的数量增多时，检测精度则会变差。为此，还可以在优先完成识别标记的定位之后，再完成被检测物的定位。
具体的，可以在进行相应的映射关系的建立时，也添加被检测物的形状，当进行热成像图的颜色分析或者热量分析时，用于表现温度的温度颜色的形状符合被检测物的形状时，则可以定位被检测物的位置，然而这种方式仍然有缺陷。
例如：在设备中，同一种类型的部件可能包括多种，例如形状、大小均相同的多个部件。然而这些相同的部件中，存在仅要对部分部件进行检测即可。例如：有的部件可能设置在安全性较高的位置，有些部件设置在安全性不高的位置，此时就需要对安全性不高的位置的部件进行检测。若待检测区域中，红外传感器在进行检测时，包括了上述相同的、且不需要检测的部件时，此时进行定位，则可能将不需要检测的温度的部件当作被检测物，因此还需要在建立映射关系时，将对应识别标记的形状与被检测的形状对应。此时，图像识别或热量分析时，仅有温度区域中所呈现的温度颜色同时满足被检测物的温度颜色的形状和识别标记的温度颜色，且两者温度颜色形状满足映射关系时，才能有效的定位被检测物的位置，从而精确的确定被检测物的温度，从而进行检测。
为了更好的实现本申请实施例，在一个本申请实施例中，检测各识别标记对应的被检测物的温度，包括：
根据各识别标记在热成像图中的位置，确定各对应的被检测物在热成像图中的位置；根据各对应的被检测物在热成像图中的位置，对各对应的被检测物进行温度检测。
上述实施例中列举了通过热成像图的方式或者直接通过温度的方式进行检测，然而直接通过温度的方式进行检测缺少了可视化的直观性，虽然相应的设备能直接完成监视任务，但同时需要人工进行同时检测时，缺少热成像图的直观性则，人工检测就比较困难。
此外，根据热成像图中的颜色进行被检测物的温度时，可以根据被检测物在热成像图中的定位，直接根据定位的温度颜色，获取被检测物的温度，从而进行检测即可。
本申请提供的红外温度检测方法，可以预先对需要被检测的物体，使用红外发射率与器件的红外发射率不同的材料进行标记，在红外检测的情况下，通过对标记的红外发射率进行分析，能够有效的通过标记，定位至具体的器件，从而得到具体器件的温度，提高了红外测温的精确性。
为了更好的实现本申请实施例，在一个本申请实施例中，根据每个识别标记的位置以及映射关系，获取每个被检测物对应的温度之后，方法还包括：
将每个被检测物对应的温度上传至对应的监视装置进行监视。
在获取到各个被检测物对应的温度进行检测之后，还可以将各个温度上传至监视装置进行监视，例如：报警装置、显示装置等可以进行监视的设备。当监视设备接收到各个被检测物的温度信息是之后，可以做出相应监视。例如：显示设备可以将各个温度进行显示，供相关的工作人员参考。同时，还可以添加保密手段，例如：相应的人员只能输入特殊的匹配指令，才能查看各个被检测设备的温度等。
为了更好实施本申请实施例中的红外温度检测方法，在红外温度检测方法之上，本申请实施例中还提供了一种红外温度检测装置，如图3所示，装置300包括：
识别模块301，用于通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，待测区域包括多个被检测物，每个被检测物设置有识别标记，且各被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
确定模块302，用于根据各识别标记的位置，确定各识别标记对应的被检测物；
检测模块303，用于检测各识别标记对应的被检测物的温度。
本申请提供的红外温度检测装置，可以预先对需要被检测的物体，使用红外发射率与器件的红外发射率不同的材料进行标记，使得在红外检测的情况下，可以被识别模块301有效的识别出各个标记，从而可以通过确定模块302确定识别标记与被检测物的位置，再通过检测模块303对标记的红外发射率进行分析，能够有效的通过标记，定位至具体的器件，从而得到具体器件的温度，提高了红外测温的精确性。
在本申请一些实施方式中，装置还包括标记添加模块304，标记添加模块304具体用于：
针对每个被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；
根据标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
在本申请一些实施方式中，标记添加模块304具体还用于：
将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；
根据比较结果，确定该被检测物对应的标记红外发射率。
在本申请一些实施方式中，标记添加模块304具体还用于：
若该被检测物无法添加该识别标记，则对该被检测物的周围相邻的位置添加该识别标记。
在本申请一些实施例中，确定模块302具体用于：
根据各识别标记的位置以及预设的映射关系，确定得到各识别标记对应的被检测物的位置；映射关系表征识别标记与被检测物的对应关系。
在本申请一些实施例中，确定模块302具体还用于：
通过预设的红外传感装置，获取待测区域的热成像图；
基于各识别标记的红外发射率，对热成像图进行热量分析，确定各识别标记在热成像图中的位置。
在本申请一些实施方式中，识别模块301具体用于：
通过预设的红外传感装置，获取待测区域的热成像图；
基于各识别标记的红外发射率，对热成像图进行热量分析，确定各识别标记在热成像图中的位置。
在本申请一些实施例中，检测模块303具体用于：
根据各识别标记在热成像图中的位置，确定各对应的被检测物在热成像图中的位置；
根据各对应的被检测物在热成像图中的位置，对各对应的被检测物进行温度检测。
本申请实施例还提供一种终端设备，设备包括处理器、存储器以及存储于存储器中并可在处理器上运行的计算机程序，处理器执行计算机程序以实现本申请实施例中任一项的红外温度检测中的步骤。其中，该终端设备，其集成了本申请实施例所提供的任一种红外温度检测，如图4所示，其示出了本申请实施例所涉及的终端设备的结构示意图，具体来讲：
该终端设备可以包括一个或者一个以上处理核心的处理器401、一个或一个以上计算机可读存储介质的存储器402、电源403和输入单元404等部件。本领域技术人员可以理解，图4中示出的终端设备结构并不构成对终端设备的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。其中：
处理器401是该终端设备的控制中心，利用各种接口和线路连接整个终端设备的各个部分，通过运行或执行存储在存储器402内的软件程序和/或模块，以及调用存储在存储器402内的数据，执行终端设备的各种功能和处理数据，从而对终端设备进行整体监控。可选的，处理器401可包括一个或多个处理核心；处理器401可以是中央处理单元（Central Processing Unit，CPU），还可以是其他通用处理器、数字信号处理器（Digital Signal Processor，DSP）、专用集成电路（Application Specific Integrated Circuit，ASIC）、现成可编程门阵列（Field-Programmable Gate Array，FPGA）或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件等。通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等，优选的，处理器401可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界是面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器401中。
存储器402可用于存储软件程序以及模块，处理器401通过运行存储在存储器402的软件程序以及模块，从而执行各种功能应用以及数据处理。存储器402可主要包括存储程序区和存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序（比如声音播放功能、图像播放功能等）等；存储数据区可存储根据终端设备的使用所创建的数据等。此外，存储器402可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。相应地，存储器402还可以包括存储器控制器，以提供处理器401对存储器402的访问。
终端设备还包括给各个部件供电的电源403，优选的，电源403可以通过电源管理系统与处理器401逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。电源403还可以包括一个或一个以上的直流或交流电源、再充电系统、电源故障检测电路、电源转换器或者逆变器、电源状态指示器等任意组件。
该终端设备还可包括输入单元404，该输入单元404可用于接收输入的数字或字符信息，以及产生与用户设置以及功能控制有关的键盘、鼠标、操作杆、光学或者轨迹球信号输入。
尽管未示出，终端设备还可以包括显示单元等，在此不再赘述。具体在本实施例中，终端设备中的处理器401会按照如下的指令，将一个或一个以上的应用程序的进程对应的可执行文件加载到存储器402中，并由处理器401来运行存储在存储器402中的应用程序，从而实现各种功能，例如：
通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，待测区域包括多个被检测物，每个被检测物设置有识别标记，且各被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
根据各识别标记的位置，确定各识别标记对应的被检测物；
检测各识别标记对应的被检测物的温度。
本领域普通技术人员可以理解，上述实施例的各种方法中的全部或部分步骤可以通过指令来完成，或通过指令控制相关的硬件来完成，该指令可以存储于一计算机可读存储介质中，并由处理器进行加载和执行。
为此，本申请实施例提供一种计算机可读存储介质，该存储介质可以包括：只读存储器（ROM，Read Only Memory）、随机存取记忆体（RAM，Random Access Memory）、磁盘或光盘等。其上存储有计算机程序，计算机程序被处理器进行加载，以执行本申请实施例所提供的任一种红外温度检测中的步骤。例如，计算机程序被处理器进行加载可以执行如下步骤：
通过待测区域中已预先设置的多个识别标记的红外发射率，识别待测区域中的各识别标记的位置，待测区域包括多个被检测物，每个被检测物设置有识别标记，且各被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
根据各识别标记的位置，确定各识别标记对应的被检测物；
检测各识别标记对应的被检测物的温度。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见上文针对其他实施例的详细描述，此处不再赘述。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的方法实施例，在此不再赘述。
以上各个操作的具体实施可参见前面的实施例，在此不再赘述。
以上对本申请实施例所提供的一种红外温度检测及装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (16)

  1. 一种红外温度检测方法，其特征在于，所述方法包括：
    通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，所述待测区域包括多个被检测物，每个所述被检测物设置有识别标记，且各所述被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
    根据各所述识别标记的位置，确定各所述识别标记对应的被检测物；
    检测各所述识别标记对应的被检测物的温度。
  2. 根据权利要求1所述的红外温度检测方法，其特征在于，所述通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置之前，所述方法还包括：
    针对每个所述被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；
    根据所述标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
  3. 根据权利要求2所述的红外温度检测方法，其特征在于，所述根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率，包括：
    将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；
    根据所述比较结果，确定该被检测物对应的标记红外发射率。
  4. 根据权利要求2所述的红外温度检测方法，其特征在于，所述控制将该识别标记添加至该被检测物，包括：
    若该被检测物无法添加该识别标记，则对所述该被检测物的周围相邻的位置添加该识别标记。
  5. 根据权利要求1所述的红外温度检测方法，其特征在于，所述根据各所述识别标记的位置，确定各所述识别标记对应的被检测物，包括：
    根据各所述识别标记的位置以及预设的映射关系，确定得到各所述识别标记对应的被检测物的位置；所述映射关系表征识别标记与被检测物的位置对应关系。
  6. 根据权利要求1所述的红外温度检测方法，其特征在于，所述通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，包括：
    通过预设的红外传感装置，获取所述待测区域的热成像图；
    基于各所述识别标记的红外发射率，对所述热成像图进行热量分析，确定各所述识别标记在所述热成像图中的位置。
  7. 根据权利要求6所述的红外温度检测方法，其特征在于，所述检测各所述识别标记对应的被检测物的温度，包括：
    根据各所述识别标记在所述热成像图中的位置，确定各所述对应的被检测物在所述热成像图中的位置；
    根据各所述对应的被检测物在所述热成像图中的位置，对各所述对应的被检测物进行温度检测。
  8. 一种红外温度检测装置，其特征在于，所述装置包括：
    识别模块，用于通过待测区域中已预先设置的多个识别标记的红外发射率，识别所述待测区域中的各所述识别标记的位置，所述待测区域包括多个被检测物，每个所述被检测物设置有识别标记，且各所述被检测物的红外发射率和与其对应的识别标记的红外发射率不同；
    确定模块，用于根据各所述识别标记的位置，确定各所述识别标记对应的被检测物；
    检测模块，用于检测各所述识别标记对应的被检测物的温度。
  9. 根据权利要求8所述的红外温度检测装置，其特征在于，所述装置还包括标记添加模块，所述标记添加模块具体用于：
    针对每个所述被检测物，确定该被检测物的红外发射率，根据该被检测物的红外发射率，确定该被检测物对应的标记红外发射率；
    根据所述标记红外发射率，确定该被检测物对应的识别标记，并控制将该识别标记添加至该被检测物。
  10. 根据权利要求9所述的红外温度检测装置，其特征在于，所述标记添加模块具体还用于：
    将该被检测物的红外发射率与预设的红外发射率阈值进行比较，得到比较结果；
    根据所述比较结果，确定该被检测物对应的标记红外发射率。
  11. 根据权利要求8所述的红外温度检测装置，其特征在于，所述标记添加模块具体还用于：
    若该被检测物无法添加该识别标记，则对所述该被检测物的周围相邻的位置添加该识别标记。
  12. 根据权利要求8所述的红外温度检测装置，其特征在于，所述确定模块具体用于：
    根据各所述识别标记的位置以及预设的映射关系，确定得到各所述识别标记对应的被检测物的位置；所述映射关系表征识别标记与被检测物的位置对应关系。
  13. 根据权利要求8所述的红外温度检测装置，其特征在于，所述识别模块具体用于：
    通过预设的红外传感装置，获取所述待测区域的热成像图；
    基于各所述识别标记的红外发射率，对所述热成像图进行热量分析，确定各所述识别标记在所述热成像图中的位置。
  14. 根据权利要求13所述的红外温度检测装置，其特征在于，所述检测模块具体用于：
    根据各所述识别标记在所述热成像图中的位置，确定各所述对应的被检测物在所述热成像图中的位置；
    根据各所述对应的被检测物在所述热成像图中的位置，对各所述对应的被检测物进行温度检测。
  15. 一种终端设备，其特征在于，所述终端设备包括处理器、存储器以及存储于所述存储器中并可在所述处理器上运行的计算机程序，所述处理器执行所述计算机程序以实现权利要求1至7任一项所述的红外温度检测方法中的步骤。
  16. 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质上存储有计算机程序，所述计算机程序被处理器执行以实现权利要求1至7任一项所述的红外温度检测方法中的步骤。
PCT/CN2023/080985 2022-05-27 2023-03-13 红外温度检测方法、装置、终端设备以及存储介质 WO2023226527A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210594657.X 2022-05-27
CN202210594657.XA CN114993480A (zh) 2022-05-27 2022-05-27 红外温度检测方法、装置、终端设备以及存储介质

Publications (1)

Publication Number Publication Date
WO2023226527A1 true WO2023226527A1 (zh) 2023-11-30

Family

ID=83028613

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/080985 WO2023226527A1 (zh) 2022-05-27 2023-03-13 红外温度检测方法、装置、终端设备以及存储介质

Country Status (2)

Country Link
CN (1) CN114993480A (zh)
WO (1) WO2023226527A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114993480A (zh) * 2022-05-27 2022-09-02 东方电气集团东方电机有限公司 红外温度检测方法、装置、终端设备以及存储介质
CN116563280B (zh) * 2023-07-07 2023-09-12 深圳市鑫典金光电科技有限公司 一种基于数据分析的复合铜散热底板加工检测方法及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101561318A (zh) * 2008-04-16 2009-10-21 弗卢克公司 辐射计和温度补偿系统
CN102954840A (zh) * 2012-11-16 2013-03-06 四川省电力公司技术技能培训中心 一种用于带电设备发热检测的红外标识
JP2013249506A (ja) * 2012-05-31 2013-12-12 Azbil Corp 記号識別方法および記号識別装置
CN111896112A (zh) * 2020-07-08 2020-11-06 江苏方天电力技术有限公司 一种锅炉水冷壁壁温分布快速检测分析评估系统
JP2021143802A (ja) * 2020-03-13 2021-09-24 医療法人浅田レディースクリニック 冷却液体監視システムおよび監視方法
CN114993480A (zh) * 2022-05-27 2022-09-02 东方电气集团东方电机有限公司 红外温度检测方法、装置、终端设备以及存储介质

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101561318A (zh) * 2008-04-16 2009-10-21 弗卢克公司 辐射计和温度补偿系统
JP2013249506A (ja) * 2012-05-31 2013-12-12 Azbil Corp 記号識別方法および記号識別装置
CN102954840A (zh) * 2012-11-16 2013-03-06 四川省电力公司技术技能培训中心 一种用于带电设备发热检测的红外标识
JP2021143802A (ja) * 2020-03-13 2021-09-24 医療法人浅田レディースクリニック 冷却液体監視システムおよび監視方法
CN111896112A (zh) * 2020-07-08 2020-11-06 江苏方天电力技术有限公司 一种锅炉水冷壁壁温分布快速检测分析评估系统
CN114993480A (zh) * 2022-05-27 2022-09-02 东方电气集团东方电机有限公司 红外温度检测方法、装置、终端设备以及存储介质

Also Published As

Publication number Publication date
CN114993480A (zh) 2022-09-02

Similar Documents

Publication Publication Date Title
WO2023226527A1 (zh) 红外温度检测方法、装置、终端设备以及存储介质
US11843904B2 (en) Automated combined display of measurement data
US20210302267A1 (en) Data management method and data management terminal for a laser gas detector
CN111982911B (zh) 一种电路板缺陷的检测方法、装置、终端设备及存储介质
US20080265162A1 (en) Method for displaying a thermal image in a IR camera and an IR camera
KR101316451B1 (ko) 콘크리트 표면 균열 측정장치, 측정방법 및 이를 구현하는 애플리케이션 프로그램이 설치된 스마트 폰 및 컴퓨터
CN102045423A (zh) 移动终端、使用移动终端进行温度检测的方法
WO2022151716A1 (zh) 晶圆量测方法、装置、介质和电子设备
JP2014196926A (ja) 外装材の劣化判定方法および判定装置
JP6151077B2 (ja) 外装材の劣化判定方法
TW201416657A (zh) 測試監控系統及方法
US10395340B2 (en) System and method of generating 3D infrared camera stitching for a thermal mapping
KR20190054698A (ko) 가시광 카메라와 열화상 카메라를 이용한 구조물의 건전도 평가 시스템
JP6619299B2 (ja) 検知装置および検知方法
CN104596578A (zh) 一种基于移动终端的外接件巡检方法、系统及移动终端
CN112461371A (zh) 一种具有激光测距仪的便携式热像仪系统
CN112539840A (zh) 具有温湿度传感器的便携式热像仪系统及热像检测方法
CN114066799A (zh) 检测系统和检测方法
CN213932837U (zh) 一种具有激光测距仪的便携式热像仪系统
KR102328956B1 (ko) 프레스 성형물 두께 분포도 가시화 시스템 및 이를 이용한 가시화 방법
CN205750602U (zh) 一种带电作业工器具智能工具柜及其智能管理系统
JP2014196927A (ja) 外装材の劣化判定方法および判定装置
CN213543813U (zh) 一种具有温湿度传感器的便携式热像仪系统
WO2023153037A1 (ja) 診断方法、診断装置及びプログラム
TWI727324B (zh) 氯離子檢測之藍芽連接裝置及其方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23810602

Country of ref document: EP

Kind code of ref document: A1