WO2023223955A1 - 圧電素子及び超音波トランスデューサ - Google Patents

圧電素子及び超音波トランスデューサ Download PDF

Info

Publication number
WO2023223955A1
WO2023223955A1 PCT/JP2023/017878 JP2023017878W WO2023223955A1 WO 2023223955 A1 WO2023223955 A1 WO 2023223955A1 JP 2023017878 W JP2023017878 W JP 2023017878W WO 2023223955 A1 WO2023223955 A1 WO 2023223955A1
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric element
outer edge
piezoelectric
lower electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/017878
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
優作 清水
悠佑 長田
清 山腰
隆文 福井
清彦 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2024521723A priority Critical patent/JPWO2023223955A1/ja
Publication of WO2023223955A1 publication Critical patent/WO2023223955A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Definitions

  • the present disclosure relates to a piezoelectric element and an ultrasonic transducer, and more particularly to a piezoelectric element having a lower electrode and an upper electrode, and an ultrasonic transducer including the piezoelectric element.
  • Patent Document 1 describes an aerial ultrasonic transmitter/receiver using a piezoelectric element, which includes a piezoelectric ceramic, a silver electrode formed by sintering conductive paste provided on both sides of the piezoelectric ceramic, and a bottomed cylindrical case.
  • An ultrasonic transmitter/receiver (ultrasonic transducer) is disclosed.
  • An object of the present disclosure is to provide a piezoelectric element and an ultrasonic transducer that can increase the operating frequency of the piezoelectric element.
  • a piezoelectric element includes a metal substrate, a lower electrode, a piezoelectric layer, and an upper electrode.
  • the metal substrate contains at least iron and chromium.
  • the lower electrode is provided on the metal substrate.
  • the piezoelectric layer is provided on the lower electrode.
  • the upper electrode is provided on the piezoelectric layer.
  • the first outer edge of the lower electrode is located inside the second outer edge of the metal substrate.
  • the third outer edge of the piezoelectric layer is located inside the first outer edge of the lower electrode.
  • the fourth outer edge of the upper electrode is located inside the third outer edge of the piezoelectric layer.
  • An ultrasonic transducer includes the piezoelectric element, a diaphragm section, a first conductive member, a second conductive member, a first conductive joint, a second conductive joint, Equipped with.
  • the diaphragm portion is joined to the metal substrate of the piezoelectric element.
  • the first conductive member is connected to the lower electrode of the piezoelectric element.
  • the second conductive member is connected to the upper electrode of the piezoelectric element.
  • the first conductive joint portion joins the lower electrode and the first conductive member.
  • the second conductive joint portion joins the upper electrode and the second conductive member.
  • FIG. 1 is a plan view of a piezoelectric element according to a first embodiment.
  • FIG. 2 is a sectional view taken along line A1-A1 in FIG. 1 regarding the piezoelectric element same as above.
  • FIG. 3 is an explanatory diagram of a method of manufacturing the same piezoelectric element as above.
  • FIG. 4 is a plan view of an ultrasonic transducer including the same piezoelectric element as above.
  • FIG. 5 is a cross-sectional view taken along the line A2-A2 in FIG. 4 regarding an ultrasonic transducer including the piezoelectric element mentioned above.
  • FIG. 6 is a plan view of the piezoelectric element according to the second embodiment.
  • FIG. 7 is a sectional view taken along line A3-A3 in FIG.
  • FIG. 8 is a plan view of an ultrasonic transducer including the same piezoelectric element as above.
  • FIG. 9 is a sectional view taken along the line A4-A4 in FIG. 8 regarding an ultrasonic transducer including the piezoelectric element mentioned above.
  • FIG. 10 is a plan view of a piezoelectric element according to Embodiment 3.
  • FIG. 11 is a sectional view taken along line A5-A5 in FIG. 10 regarding the piezoelectric element same as above.
  • FIG. 12 is a sectional view of an ultrasonic transducer according to Embodiment 4.
  • the piezoelectric element 1 includes a metal substrate 2, an alumina layer 3, a lower electrode 4, a piezoelectric layer 5, and an upper electrode 6. , is provided.
  • Metal substrate 2 contains at least iron and chromium.
  • the lower electrode 4 is provided on the metal substrate 2.
  • the piezoelectric layer 5 is provided on the lower electrode 4 .
  • the upper electrode 6 is provided on the piezoelectric layer 5.
  • the outer edge of the piezoelectric element 1 has, for example, a square shape.
  • “In plan view” has the same meaning as "as seen from above the metal substrate 2 in the direction along the thickness direction of the metal substrate 2.” In other words, "in plan view” has the same meaning as "in plan view from the thickness direction of the metal substrate 2.”
  • the ultrasonic transducer 100 includes a piezoelectric element 1, a diaphragm section 120, a first lead wire 141, a second lead wire 142, a first conductive joint 131, and a first conductive joint 131. 2 conductive joint portion 132.
  • the first lead wire 141 constitutes a first conductive member
  • the second lead wire 142 constitutes a second conductive member.
  • the diaphragm section 120 is joined to the metal substrate 2 of the piezoelectric element 1. More specifically, the diaphragm section 120 is joined to the metal substrate 2 of the piezoelectric element 1 by the joining section 105.
  • the first lead wire 141 is connected to the lower electrode 4 of the piezoelectric element 1 .
  • the second lead wire 142 is connected to the upper electrode 6 of the piezoelectric element 1 .
  • the first conductive joint 131 joins the lower electrode 4 and the first lead wire 141.
  • the second conductive joint 132 joins the upper electrode 6 and the second lead wire 142.
  • the ultrasonic transducer 100 transmits ultrasonic waves by converting a first electric signal (AC voltage with a predetermined drive frequency) into a first mechanical vibration in the piezoelectric element 1.
  • a first electric signal AC voltage with a predetermined drive frequency
  • the diaphragm part 120 vibrates in the vertical direction due to the horizontal expansion and contraction movement of the piezoelectric element 1. It vibrates in the thickness direction, and ultrasonic waves are transmitted.
  • the ultrasonic transducer 100 includes, for example, a piezoelectric element 1 that accompanies vibration in the thickness direction of the diaphragm section 120 when a reflected wave of an ultrasonic wave transmitted from the ultrasonic transducer 100 is incident on the diaphragm section 120. is converted into a second electrical signal in the piezoelectric element 1.
  • the diaphragm portion 120 has a flat plate shape.
  • the ultrasonic transducer 100 further includes a case 101 housing the piezoelectric element 1.
  • Case 101 has a bottom plate portion 102 and a cylinder portion 103.
  • the bottom plate portion 102 has a flat plate shape.
  • the cylindrical portion 103 protrudes from the periphery of one surface of the bottom plate portion 102 in the thickness direction of the bottom plate portion 102 and surrounds the piezoelectric element 1 .
  • a portion of the bottom plate portion 102 surrounded by the cylindrical portion 103 also serves as a diaphragm portion 120.
  • the ultrasonic transducer 100 includes a sound absorbing member 150 disposed above the piezoelectric element 1 in the case 101, and a sealing portion disposed on the sound absorbing member 150 in the case 101. 160. Note that in FIG. 4, illustration of the sound absorbing member 150 and the sealing part 160 is omitted.
  • the metal substrate 2 has a flat plate shape.
  • the metal substrate 2 has an upper surface (first main surface) 21 and a lower surface (second main surface) 22, as shown in FIG.
  • the outer edge 20 of the metal substrate 2 has, for example, a square shape (for example, a rectangular shape) in plan view.
  • the thickness of the metal substrate 2 is, for example, 0.1 mm, but is not limited thereto.
  • the metal substrate 2 contains iron, chromium, and aluminum.
  • the metal substrate 2 is a stainless steel substrate containing iron as a main component, and contains chromium and aluminum in addition to iron.
  • the stainless steel substrate constituting the metal substrate 2 is, for example, an aluminum-containing ferritic stainless steel substrate.
  • the aluminum-containing ferritic stainless steel substrate has, for example, a chromium content of 18 wt% and an aluminum content of 3 wt%.
  • the content of chromium is not limited to 18 wt%.
  • the aluminum content is not limited to 3 wt%.
  • the metal substrate 2 may further contain elements other than iron, chromium, and aluminum.
  • the alumina layer 3 is provided on the upper surface 21 (see FIG. 2) of the metal substrate 2. As shown in FIG. 1, the outer edge 30 of the alumina layer 3 has a square shape (for example, a rectangular shape) in plan view. The thickness of the alumina layer 3 is, for example, 1 ⁇ m, but is not limited thereto.
  • the main phase of alumina forming the alumina layer 3 is a ⁇ -alumina phase. That is, the alumina layer 3 is mainly formed of particles of ⁇ -alumina phase. "Mainly formed of ⁇ -alumina phase particles” means that more than 50% by weight of the alumina layer 3 is formed of ⁇ -alumina phase particles.
  • the crystalline phase of the material (particles) constituting the alumina layer 3 can be identified by measuring the X-ray diffraction pattern of the exposed portion of the alumina layer 3 using an X-ray diffraction device.
  • the upper surface of the alumina layer 3 includes a part of the surface of a plurality of scale-like particles of the alumina layer 3. Considering the SEM (Scanning Electron Microscope) image of the upper surface of the alumina layer 3 and the measurement results of the X-ray diffraction pattern, it is estimated that the scale-like particles are ⁇ -alumina particles.
  • the lower electrode 4 is provided on the upper surface 31 (see FIG. 2) of the alumina layer 3. As shown in FIG. 1, the outer edge 40 of the lower electrode 4 has, for example, a rectangular shape in plan view, but the shape is not limited to this.
  • the thickness of the lower electrode 4 is, for example, 3 ⁇ m, but is not limited thereto.
  • the material of the lower electrode 4 includes, for example, silver (Ag) and palladium (Pd). More specifically, the material of the lower electrode 4 includes, for example, an Ag--Pd alloy.
  • the piezoelectric layer 5 is provided on the upper surface 41 (see FIG. 2) of the lower electrode 4. As shown in FIG. 1, the outer edge 50 of the piezoelectric layer 5 has, for example, a rectangular shape in plan view, but the shape is not limited to this.
  • the thickness of the piezoelectric layer 5 is, for example, 5 ⁇ m or more and 40 ⁇ m or less, preferably 10 ⁇ m or more and 30 ⁇ m or less.
  • the thickness of the piezoelectric layer 5 is, for example, 11 ⁇ m, but is not limited thereto.
  • the material of the piezoelectric layer 5 includes, for example, Pb, Zr, Zn, Nb, and O, but is not limited thereto. More specifically, the material of the piezoelectric layer 5 includes, for example, Pb 1.015 Zr 0.44 (Zn 1/3 Nb 2/3 ) 0.10 O 3.015; The composition ratio is not limited to this.
  • the upper electrode 6 is provided on the upper surface 51 (see FIG. 2) of the piezoelectric layer 5. As shown in FIG. 1, the outer edge 60 of the upper electrode 6 has, for example, a rectangular shape in plan view, but the shape is not limited to this.
  • the thickness of the upper electrode 6 is, for example, 3 ⁇ m, but is not limited thereto.
  • the material of the upper electrode 6 includes, for example, Ag and Pd. More specifically, the material of the upper electrode 6 includes, for example, an Ag--Pd alloy.
  • the outer edge 40 (first outer edge) of the lower electrode 4 is , located inside the outer edge 20 (second outer edge) of the metal substrate 2.
  • the outer edge 50 (third outer edge) of the piezoelectric layer 5 is located inside the outer edge 40 of the lower electrode 4.
  • the outer edge 60 (fourth outer edge) of the upper electrode 6 is located inside the outer edge 50 of the piezoelectric layer 5.
  • the area of the upper surface 41 (see FIG. 2) of the lower electrode 4 is smaller than the area of the upper surface 21 (see FIG.
  • orthogonal coordinates having three axes, the X-axis, Y-axis, and Z-axis that are orthogonal to each other, are defined, and in particular, the axis along the thickness direction of the metal substrate 2 is referred to as the "Z-axis".
  • the axis along the longitudinal direction of the metal substrate 2 is referred to as the "X axis”
  • the axis along the width direction of the metal substrate 2 is referred to as the "Y axis”.
  • the X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X,” “Y,” and “Z” in the drawings are only shown for explanation. , none of which involve substance.
  • a part of the portion 411 of the upper surface 41 of the lower electrode 4 that is not covered with the piezoelectric layer 5 also serves as a terminal portion for external connection.
  • the distance between the outer edge 40 of the lower electrode 4 and the outer edge 50 of the piezoelectric layer 5 is not uniform in plan view, and the first width W1 is wider than the second width W2. wide.
  • the first width W1 is the width between the outer edge 40 of the lower electrode 4 and the outer edge 50 of the piezoelectric layer 5 at the first end of the piezoelectric element 1 in the direction along the X axis.
  • the second width W2 is the width between the outer edge 40 of the lower electrode 4 and the outer edge 50 of the piezoelectric layer 5 at the second end of the piezoelectric element 1 in the direction along the X axis.
  • a metal substrate 2A (see FIG. 3) from which a large number of metal substrates 2 can be produced is prepared, and then a first step, a second step, and a third step are performed. , the fourth step, the fifth step, and the sixth step are performed sequentially.
  • the metal substrate 2A containing iron, chromium, and aluminum is heat-treated in the atmosphere to form an alumina layer 3A (see FIG. 3) that covers the entire upper surface 21A of the metal substrate 2A.
  • the heat treatment temperature is, for example, 850° C. or more and 900° C. or less
  • the heat treatment time is, for example, 2 hours.
  • a second alumina layer may be formed that covers the entire lower surface 22A of the metal substrate 2A.
  • a first pattern portion including a plurality of lower electrode material portions is formed on the alumina layer 3A by screen printing a paste containing the material of the lower electrode 4 (eg, Ag-Pd alloy paste).
  • a second pattern section including a plurality of piezoelectric material sections is formed on the first pattern section by printing a paste containing the material of the piezoelectric layer 5 with a metal mask.
  • the material of the piezoelectric layer 5 is, for example, Pb 1.015 Zr 0.44 (Zn 1/3 Nb 2/3 ) 0.10 O 3.015 .
  • a third pattern section including a plurality of upper electrode material sections is formed on the second pattern section by screen printing a paste containing the material of the upper electrode 6 (for example, Ag-Pd alloy paste).
  • a structure 1A including a plurality of piezoelectric elements 1 is formed (see FIG. 3).
  • the structure 1A is separated into individual piezoelectric elements 1 by dicing the structure 1A with a dicing blade 200 (see FIG. 3).
  • the metal substrate 2A and the alumina layer 3A are present in the dicing lane, but the lower electrode pattern section 4A, the piezoelectric layer pattern section 5A, and the upper electrode pattern section 6A are not present.
  • the thickness H2 of the dicing blade 200 is smaller than the first distance L1 between two adjacent lower electrodes 4 across the dicing lane in the structure 1A. Further, the thickness H2 of the dicing blade 200 is smaller than the second distance L2 between two adjacent piezoelectric layers 5 across the dicing lane in the structure 1A.
  • the thickness H2 of the dicing blade 200 is smaller than the third distance L3 between two adjacent upper electrodes 6 across the dicing lane in the structure 1A. As described above, in the sixth step, the relationship of thickness H2 of the dicing blade 200 ⁇ first distance L1 ⁇ second distance L2 ⁇ third distance L3 is satisfied.
  • the method for manufacturing the piezoelectric element 1 cracking and chipping of the lower electrode 4, piezoelectric layer 5, and upper electrode 6 are unlikely to occur in the sixth step. Therefore, according to the method for manufacturing the piezoelectric element 1, it is possible to improve the manufacturing yield. In addition, in the piezoelectric element 1, since it is possible to prevent a handling tool from coming into contact with the lower electrode 4, the piezoelectric layer 5, and the upper electrode 6 during handling, the lower electrode 4, the piezoelectric layer 5, and the upper Damage to the electrode 6 can be prevented. Therefore, in the piezoelectric element 1, the piezoelectric layer 5 can be made thinner than a bulk type piezoelectric element.
  • the structure 1A is diced using the dicing blade 200, but the method is not limited to the method using the dicing blade 200. Dicing may also be performed. In both the method using the dicing blade 200 and laser dicing, the first screen printing mask used in the second step, the first A metal mask used in the third step and a second screen printing mask used in the fourth step are designed.
  • the ultrasonic transducer 100 is configured to be capable of both transmitting (transmitting) ultrasonic waves and receiving (receiving) ultrasonic waves.
  • the ultrasonic transducer 100 is used, for example, as an ultrasonic sensor mounted on a vehicle such as an automobile to detect objects (obstacles, etc.) around the vehicle.
  • the ultrasonic sensor includes, for example, an ultrasonic transducer 100, a drive circuit, and a signal processing circuit.
  • the ultrasonic sensor is, for example, a TOF (Time of Flight) type ultrasonic sensor.
  • the drive circuit applies an electric signal to the piezoelectric element 1 of the ultrasonic transducer 100 to cause the ultrasonic transducer 100 to transmit ultrasonic waves.
  • the signal processing circuit processes an electrical signal output from the piezoelectric element 1 when the ultrasonic transducer 100 receives a reflected wave of an ultrasonic wave.
  • the signal processing circuit detects, for example, at least one of the presence or absence of an object within the detection area of the ultrasonic sensor and the distance from the ultrasonic transducer 100 to the object.
  • the ultrasonic transducer 100 of the ultrasonic sensor is attached to the bumper of an automobile, for example.
  • the ultrasonic transducer 100 has, for example, a vertical direction in the X-axis direction (the left-right direction in FIG. 4) and a vertical direction in the Y-axis direction (the vertical direction in FIG. 4).
  • the ultrasonic transducer 100 is installed so that the direction is horizontal, and the Z-axis direction (direction perpendicular to the plane of the paper in FIG. 4) is the detection direction (transmission/reception direction of ultrasonic waves).
  • the mounting direction of the ultrasonic transducer 100 can be changed as appropriate depending on the use of the ultrasonic transducer 100, for example.
  • the ultrasonic transducer 100 may include at least one of a drive circuit and a signal processing circuit.
  • the case 101 has a cylindrical shape with a bottom. In plan view, the outer edge of the case 101 has a circular shape.
  • the diaphragm section 120 has an upper surface 121 and a lower surface 122, as shown in FIG.
  • the thickness of the diaphragm portion 120 is, for example, 0.3 mm or more and 1.0 mm or less, and is, for example, 0.9 mm.
  • the outer diameter of the case 101 is, for example, 14 mm, but is not limited to this, and may be, for example, 15.5 mm.
  • the length of the case 101 in the Z-axis direction is, for example, 9 mm, but is not limited thereto.
  • the lower surface 122 of the diaphragm portion 120 constitutes an ultrasonic wave transmission/reception surface.
  • the material of the case 101 is, for example, an aluminum alloy, but is not limited thereto, and may be, for example, a magnesium alloy, stainless steel, a titanium alloy, or an engineered plastic.
  • the diaphragm portion 120 has a first maximum length R1 in the first direction (X-axis direction) that is larger than a second maximum length R2 in the second direction (Y-axis direction). It has a long shape. Thereby, in the ultrasonic transducer 100, the directivity angle in the X-axis direction can be narrower than the directivity angle in the Y-axis direction.
  • the first maximum length R1 is 12.6 mm
  • the second maximum length R2 is 8 mm, but is not limited to these values.
  • the joint 105 is interposed between the lower surface 22 of the metal substrate 2 of the piezoelectric element 1 and the upper surface 121 of the diaphragm section 120.
  • the material of the bonding portion 105 is, for example, a resin adhesive, a conductive bonding material, or DAF (Die Attach Film).
  • the resin adhesive includes, for example, an epoxy adhesive.
  • the conductive bonding material includes, for example, conductive paste (silver paste, etc.).
  • first lead wire 141 is connected to the lower electrode 4 of the piezoelectric element 1.
  • the second lead wire 142 constitutes a second conductive member connected to the upper electrode 6 of the piezoelectric element 1 .
  • a first end of the first lead wire 141 is joined to the lower electrode 4 by the first conductive joint 131 and is electrically connected to the lower electrode 4 .
  • a first end of the second lead wire 142 is joined to the upper electrode 6 by the second conductive joint 132 and is electrically connected to the upper electrode 6 .
  • the first lead wire 141 and the second lead wire 142 are flexible electric wires. A portion of the first lead wire 141 and a portion of the second lead wire 142 are led out of the case 101. The second end of the first lead wire 141 and the second end of the second lead wire 142 are connected to, for example, a drive circuit included in the ultrasonic sensor and a signal processing circuit included in the ultrasonic sensor.
  • the material of the first conductive joint 131 and the second conductive joint 132 includes, for example, solder.
  • the ultrasonic transducer 100 when the ultrasonic transducer 100 is used for transmitting ultrasonic waves, the ultrasonic transducer 100 is connected to a drive circuit. Furthermore, in the ultrasonic sensor, when the ultrasonic transducer 100 is used for receiving ultrasonic waves, the ultrasonic transducer 100 is connected to a signal processing circuit.
  • the sound absorbing member 150 is arranged above the piezoelectric element 1 in the case 101.
  • the material of the sound absorbing member 150 includes, for example, foam. Examples of the foam include urethane foam and silicone foam.
  • the sealing section 160 is arranged on the sound absorbing member 150 within the case 101.
  • the material of the sealing part 160 includes, for example, silicone resin.
  • the piezoelectric element 1 according to the first embodiment includes a metal substrate 2 containing iron, chromium, and aluminum.
  • the outer edge 40 (first outer edge) of the lower electrode 4 is located inside the outer edge 20 (second outer edge) of the metal substrate 2
  • the outer edge 50 (third outer edge) is located inside the outer edge 40 of the lower electrode 4
  • the outer edge 60 (fourth outer edge) of the upper electrode 6 is located inside the outer edge 50 (third outer edge) of the piezoelectric layer 5.
  • the piezoelectric element 1 according to the first embodiment it is possible to increase the operating frequency (resonant frequency) of the piezoelectric element 1. More specifically, in the piezoelectric element 1 according to the first embodiment, since the piezoelectric layer 5 can be made thinner, the resonance frequency of the piezoelectric element 1 can be made higher, and the driving frequency can be made higher. becomes possible.
  • the piezoelectric element 1 according to the first embodiment includes an alumina layer 3 interposed between the lower electrode 4 and the metal substrate 2, and the upper surface 31 of the alumina layer 3 has a plurality of scale-like shapes that the alumina layer 3 has. Since the lower electrode 4 includes a part of the surface of the particles, peeling of the lower electrode 4 can be suppressed.
  • the alumina layer 3 covers the entire upper surface 21 of the metal substrate 2, it is possible to improve piezoelectric characteristics. More specifically, in the piezoelectric element 1 according to the first embodiment, it is possible to suppress thermal diffusion between the metal substrate 2 and the piezoelectric layer 5 during manufacturing, and it is possible to improve the piezoelectric characteristics.
  • the ultrasonic transducer 100 includes the piezoelectric element 1 and the diaphragm portion 120 joined to the metal substrate 2 of the piezoelectric element 1. It becomes possible to increase the operating frequency (resonant frequency). Thereby, in the ultrasonic transducer 100, it becomes possible to make the drive frequency of the piezoelectric element 1 higher, and it becomes possible to narrow the directivity angle of the ultrasonic waves. Therefore, for example, when an ultrasonic sensor including the ultrasonic transducer 100 is installed and used in a car, it is possible to suppress the ultrasonic waves transmitted from the ultrasonic transducer 100 from entering the road surface, curb, etc.
  • FIGS. 6 and 7 A piezoelectric element 1a according to the second embodiment will be described with reference to FIGS. 6 and 7, and then an ultrasonic transducer 100a including the piezoelectric element 1a will be described with reference to FIGS. 8 and 9.
  • the same components as those of the piezoelectric element 1 according to the first embodiment are given the same reference numerals, and the description thereof will be omitted.
  • the ultrasonic transducer 100a according to the second embodiment the same components as those in the ultrasonic transducer 100 according to the first embodiment (see FIGS. 4 and 5) are given the same reference numerals, and the description thereof will be omitted as appropriate.
  • the piezoelectric element 1a according to the second embodiment is different from the first embodiment in that it further includes a terminal electrode 7 and a wiring part 8. This is different from the piezoelectric element 1 (see FIGS. 1 and 2).
  • the terminal electrode 7 is provided on the piezoelectric layer 5 and is separated from the upper electrode 6. More specifically, the terminal electrode 7 is provided on the upper surface 51 of the piezoelectric layer 5 and is separated from the upper electrode 6 in the X-axis direction. A gap 9 is formed between the terminal electrode 7 and the upper electrode 6. The portion of the terminal electrode 7 that is connected to the wiring portion 8 is not surrounded by the upper electrode 6 in the X-axis direction, for example.
  • the terminal electrode 7 is arranged on the upper surface 51 of the piezoelectric layer 5 at the first end in the direction along the X-axis.
  • the terminal electrode 7 is located inside the outer edge 50 of the piezoelectric layer 5 in plan view.
  • the terminal electrode 7 has, for example, a square shape, but is not limited to this, and may have a circular shape.
  • the thickness of the terminal electrode 7 is the same as the thickness of the upper electrode 6.
  • the thickness of the terminal electrode 7 is the same as the thickness of the upper electrode 6
  • the thickness of the terminal electrode 7 is 95% of the thickness of the upper electrode 6. This includes cases where the thickness is within a range of 105% or more.
  • the first height from the upper surface 21 of the metal substrate 2 to the upper surface 71 of the terminal electrode 7 is It is the same as the second height from the upper surface 21 to the upper surface 61 of the upper electrode 6.
  • the first height being the same as the second height is not limited to strictly the same case, but the first height is within the range of 95% or more and 105% or less of the second height. Including some cases.
  • the material of the terminal electrode 7 is the same as that of the upper electrode 6, and includes, for example, Ag and Pd.
  • the wiring section 8 is provided across the upper surface 41 of the lower electrode 4, the side surface 53 of the piezoelectric layer 5, and the upper surface 51 of the piezoelectric layer 5, and connects the lower electrode 4 and the terminal electrode 7. Therefore, the wiring section 8 includes a portion 81 formed on the upper surface 51 of the piezoelectric layer 5. The wiring portion 8 is not formed on the lower surface 52 of the piezoelectric layer 5.
  • the material of the wiring part 8 is the same as the material of the upper electrode 6 and the material of the terminal electrode 7, and includes, for example, Ag and Pd.
  • the wiring portion 8 is located inside the outer edge 20 of the metal substrate 2 in plan view.
  • the width of the wiring portion 8 in the Y-axis direction is narrower than the width of the terminal electrode 7 in the Y-axis direction.
  • the wiring portion 8 has an inverted L shape when viewed from the side in the Y-axis direction.
  • the terminal electrode 7 and the wiring portion 8 are formed in the same process as the upper electrode 6 by screen printing.
  • the manufacturing method of the piezoelectric element 1a is almost the same as the manufacturing method of the piezoelectric element 1, and instead of the screen mask used in the fourth step in the manufacturing method of the piezoelectric element 1, an opening for forming the upper electrode 6 and a terminal electrode 7 are used. A screen mask having an opening for forming the wiring portion 8 and an opening for forming the wiring portion 8 is used.
  • the third pattern portion includes a plurality of terminal electrode material portions and a plurality of wiring material portions in addition to the plurality of upper electrode material portions.
  • the lower electrode pattern portion including the plurality of lower electrodes 4 is formed by firing the first pattern portion, the second pattern portion, and the third pattern portion at a predetermined firing temperature (for example, 875° C.).
  • a piezoelectric layer pattern section 5A (see FIG. 3) including a plurality of piezoelectric layers 5, an upper electrode pattern section 6A (see FIG. 3) including a plurality of upper electrodes 6, and a plurality of terminal electrodes 7.
  • a terminal electrode pattern section including a terminal electrode pattern section and a wiring pattern section including a plurality of wiring sections 8 are formed.
  • a structure including a plurality of piezoelectric elements 1a is formed.
  • the ultrasonic transducer 100a according to the second embodiment is different from the embodiment in that the first conductive joint 131a is disposed on the terminal electrode 7. This is different from the ultrasonic transducer 100 according to No. 1 (see FIGS. 4 and 5).
  • the first lead wire 141 and the terminal electrode 7 are joined by the first conductive joint 131a.
  • the material of the first conductive joint 131a includes, for example, solder.
  • the piezoelectric element 1a according to the second embodiment includes a metal substrate 2 containing iron, chromium, and aluminum.
  • the outer edge 40 of the lower electrode 4 is located inside the outer edge 20 of the metal substrate 2
  • the outer edge 50 of the piezoelectric layer 5 is located inside the outer edge 40 of the lower electrode 4.
  • the outer edge 60 of the upper electrode 6 is located inside the outer edge 50 of the piezoelectric layer 5, and the terminal electrode 7 and the wiring portion 8 are located inside the outer edge 20 of the metal substrate 2.
  • the piezoelectric element 1a according to the second embodiment it is possible to increase the operating frequency (resonant frequency) of the piezoelectric element 1a. More specifically, in the piezoelectric element 1a according to the second embodiment, the piezoelectric layer 5 can be made thinner, similar to the piezoelectric element 1 according to the first embodiment, so that the resonant frequency of the piezoelectric element 1a can be made higher. This makes it possible to increase the driving frequency.
  • the piezoelectric element 1a includes the terminal electrode 7 and the wiring part 8, and since the terminal electrode 7 and the wiring part 8 are located inside the outer edge 20 of the metal substrate 2, there is no need to form a folded electrode. Manufacturing becomes easier, and it becomes possible to prevent damage to the terminal electrode 7 and wiring portion 8 during handling of the piezoelectric element 1a.
  • the first height from the upper surface 21 of the metal substrate 2 to the upper surface 71 of the terminal electrode 7 is the same as the second height from the upper surface 21 of the metal substrate 2 to the upper surface 61 of the upper electrode 6.
  • mounting on a flexible printed wiring board including a first lead electrode (first conductor part) and a second lead electrode (second conductor part) becomes easier, and connection reliability can be improved.
  • the first lead electrode (first conductor part) and the second lead electrode (second conductor part) included in the flexible printed wiring board are connected to the first lead wire 141.
  • the second lead wire 142 it is joined to the terminal electrode 7 and the upper electrode 6 of the piezoelectric element 1a by the first conductive joint 131a and the second conductive joint 132.
  • the terminal electrode 7 is located inside the outer edge 50 of the piezoelectric layer 5 in plan view.
  • the wiring portion 8 includes a portion 81 provided on the upper surface 51 of the piezoelectric layer 5 .
  • the terminal electrode 7 connected to the lower electrode 4 is arranged on the upper surface 51 of the piezoelectric layer 5 without adopting the folded electrode structure disclosed in Patent Document 1. It is possible to realize the following configuration.
  • the ultrasonic transducer 100a includes the piezoelectric element 1a and the diaphragm portion 120 joined to the metal substrate 2 of the piezoelectric element 1a. It becomes possible to increase the operating frequency (resonant frequency). Thereby, in the ultrasonic transducer 100a, it becomes possible to increase the driving frequency of the piezoelectric element 1a, and it becomes possible to narrow the directivity angle of the ultrasonic waves. Therefore, for example, when an ultrasonic sensor including the ultrasonic transducer 100a is installed and used in a car, it is possible to suppress the ultrasonic waves transmitted from the ultrasonic transducer 100a from entering the road surface and being reflected. Thereby, it becomes possible to improve the S/N ratio of the ultrasonic sensor, and it becomes possible to further increase the distance at which an object can be detected.
  • the first height from the upper surface 21 of the metal substrate 2 to the upper surface 71 of the terminal electrode 7 in the piezoelectric element 1a is from the upper surface 21 of the metal substrate 2 to the upper surface of the upper electrode 6. It is the same as the second height up to 61.
  • the first lead wire of the flexible printed wiring board is used instead of the first lead wire 141 and the second lead wire 142 as the first conductive member and the second conductive member. (first conductor part) and second lead electrode (second conductor part), mounting on a flexible printed wiring board becomes easy and connection reliability can be improved.
  • FIG. 10 A piezoelectric element 1b according to Embodiment 3 will be described with reference to FIG. 10.
  • the same components as those of the piezoelectric element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.
  • the piezoelectric element 1b according to the third embodiment is different from the piezoelectric element 1 according to the first embodiment in that the piezoelectric layer 5 has an opening 54 that exposes a part of the upper surface 41 of the lower electrode 4. do.
  • the opening 54 of the piezoelectric layer 5 is formed along the thickness direction of the piezoelectric layer 5.
  • the opening shape of the opening portion 54 is square, but is not limited to this, and may be circular, for example.
  • a portion of the lower electrode 4 (portion 411b) exposed through the opening 54 of the piezoelectric layer 5 constitutes a terminal portion.
  • the method for manufacturing the piezoelectric element 1b is substantially the same as the method for manufacturing the piezoelectric element 1, and by changing the pattern of the screen mask used in the third step in the method for manufacturing the piezoelectric element 1, the openings 54 of the piezoelectric layer 5 are can be formed.
  • the piezoelectric element 1b according to the third embodiment includes a metal substrate 2 containing iron, chromium, and aluminum.
  • the outer edge 40 of the lower electrode 4 is located inside the outer edge 20 of the metal substrate 2
  • the outer edge 50 of the piezoelectric layer 5 is located inside the outer edge 40 of the lower electrode 4.
  • the outer edge 60 of the upper electrode 6 is located inner than the outer edge 50 of the piezoelectric layer 5 .
  • the piezoelectric layer 5 can be made thinner, similar to the piezoelectric element 1 according to the first embodiment, so that the resonant frequency of the piezoelectric element 1b can be made higher. This makes it possible to increase the driving frequency.
  • the piezoelectric element 1b according to the third embodiment since the piezoelectric layer 5 has an opening 54 that exposes a part of the upper surface 41 of the lower electrode 4, the part of the upper surface 41 of the lower electrode 4 can be used as a terminal part. Can be used for both purposes. As a result, the piezoelectric element 1b according to the third embodiment can have a narrower region functioning as a terminal part than the piezoelectric element 1 according to the first embodiment, and can suppress variations in characteristics during use. It becomes possible.
  • Embodiment 4 An ultrasonic transducer 100c according to Embodiment 4 will be described below with reference to FIG. 12. Regarding the ultrasonic transducer 100c according to the fourth embodiment, the same components as those of the ultrasonic transducer 100 according to the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.
  • the ultrasonic transducer 100c according to the fourth embodiment includes a conical diaphragm section 120c with an open bottom in place of the diaphragm section 120 in the ultrasonic transducer 100 according to the first embodiment.
  • the ultrasonic transducer 100c according to the fourth embodiment includes a case 101c instead of the case 101 in the ultrasonic transducer 100 according to the first embodiment.
  • the piezoelectric element 1 and the diaphragm portion 120c are housed in the case 101c.
  • the diaphragm portion 120c is joined to the lower surface 22 of the metal substrate 2 of the piezoelectric element 1.
  • the diaphragm portion 120c is a separate member from the case 101c and is separated from the case 101c.
  • the case 101c includes a pedestal 170, a cap 106, and a mesh member 165.
  • the ultrasonic transducer 100c also includes a support portion 180 that protrudes from the pedestal 170 and supports the piezoelectric element 1.
  • the ultrasonic transducer 100c also includes a first conductive joint 131 and a second conductive joint 132, a first lead wire 141 and a second lead wire 142, a first lead terminal 191 and a second lead terminal 192. , is provided.
  • the pedestal 170 is disc-shaped.
  • the material of the pedestal 170 is, for example, an aluminum alloy, but is not limited thereto, and may be, for example, a magnesium alloy, stainless steel, a titanium alloy, or an engineered plastic.
  • the cap 106 has a bottomed cylindrical shape having a bottom wall 161 and a cylindrical peripheral wall 162, and is fixed to the pedestal 170 so as to cover the piezoelectric element 1 and the diaphragm portion 120c.
  • the material of the cap 106 is, for example, an aluminum alloy, but is not limited thereto, and may be, for example, a magnesium alloy, stainless steel, a titanium alloy, or an engineered plastic.
  • the mesh member 165 is disposed within a window hole 163 formed in the bottom wall 161 of the cap 106, and is located in front of the diaphragm portion 120c.
  • the mesh member 165 has a plurality of openings 166 to allow ultrasound to pass therethrough.
  • the first lead wire 141 and the second lead wire 142 are flexible electric wires.
  • the first end of the first lead wire 141 is joined and electrically connected to the lower electrode 4 of the piezoelectric element 1 by the first conductive joint 131, and the second end of the first lead wire 141 The end is joined to the first lead terminal 191 and electrically connected.
  • the first end of the second lead wire 142 is joined and electrically connected to the upper electrode 6 of the piezoelectric element 1 by the second conductive joint portion 132. The second end is joined to and electrically connected to the second lead terminal 192.
  • Each of the first lead terminal 191 and the second lead terminal 192 is pin-shaped.
  • the first lead terminal 191 and the second lead terminal 192 penetrate the base 170 in the thickness direction of the base 170.
  • the first lead terminal 191 and the second lead terminal 192 are electrically insulated.
  • the first lead terminal 191 and the second lead terminal 192 are electrically connected to the pedestal 170 by the first insulating part and the second insulating part interposed between the first lead terminal 191 and the second lead terminal 192 and the pedestal 170.
  • it is insulated, it is not limited to this.
  • one of the first lead terminal 191 and the second lead terminal 192 may be electrically connected to the base 170.
  • the ultrasonic transducer 100c includes the piezoelectric element 1 and the diaphragm portion 120c joined to the metal substrate 2 of the piezoelectric element 1, so that the operating frequency (resonant frequency) of the piezoelectric element 1 can be adjusted to a high speed. This makes it possible to achieve Thereby, in the ultrasonic transducer 100c, it becomes possible to increase the driving frequency of the piezoelectric element 1, and it becomes possible to narrow the directivity angle of the ultrasonic waves.
  • Embodiments 1-4 are just one of various embodiments of the present disclosure. Embodiments 1 to 4 can be modified in various ways depending on the design, etc., as long as the objective of the present disclosure can be achieved.
  • the outer edge 20 of the metal substrate 2 in plan view is not limited to a rectangular shape, and may be, for example, square, circular, elliptical, or oval.
  • the metal substrate 2 does not necessarily need to contain aluminum, but only needs to contain at least iron and chromium.
  • the piezoelectric elements 1, 1a, and 1b include the alumina layer 3. That is, the piezoelectric elements 1, 1a, and 1b may not include the alumina layer 3, and the lower electrode 4 may be provided directly on the metal substrate 2.
  • the material of the piezoelectric layer 5 is a material containing Pb, Zr, Zn, Nb, and O, for example, Pb 1.015 Zr 0.44 (Zn 1/3 Nb 2/3 ) 0.10 O 3. 015 , but may be lead zirconate titanate (PZT), barium titanate, lead magnesium niobate (PMN), KNbO 3 , NaNbO 3 or K 0.5 Na 0.5 NbO 3 .
  • the piezoelectric layer 5 is provided directly on the lower electrode 4; however, the piezoelectric layer 5 is not limited to this, and the piezoelectric layer 5 may be provided on the lower electrode 4 via a buffer layer. You can leave it there.
  • the buffer layer includes, for example, at least a portion of the material of the lower electrode 4 and at least a portion of the material of the piezoelectric layer 5.
  • the wiring portion 8 is not limited to the configuration in which it is provided across the upper surface 41 of the lower electrode 4, the side surface 53 of the piezoelectric layer 5, and the upper surface 51 of the piezoelectric layer 5.
  • the wiring portion 8 connects the lower electrode 4 and the terminal electrode 7 and is not provided on the lower surface 52 of the piezoelectric layer 5. It suffices if it is provided astride the side surface 53.
  • the piezoelectric element 1b it is not essential for the piezoelectric element 1b to have a narrow portion between the outer edge 50 of the piezoelectric layer 5 near the opening 54 and the opening 54 of the piezoelectric layer 5; and may be opened laterally.
  • the first conductive member and the second conductive member are not limited to the first lead wire 141 and the second lead wire 142, but are, for example, the first lead included in the conductor pattern portion of the flexible printed wiring board. It may be an electrode (first conductor part) and a second lead electrode (second conductor part).
  • the first conductive member and the second conductive member are not limited to the first lead wire 141 and the second lead wire 142, but are, for example, a first conductive wire and a second conductive wire. Good too.
  • the ultrasonic transducer 100c may include a piezoelectric element 1a or a piezoelectric element 1b instead of the piezoelectric element 1.
  • the piezoelectric element (1; 1a; 1b) includes a metal substrate (2), a lower electrode (4), a piezoelectric layer (5), and an upper electrode (6).
  • the metal substrate (2) contains at least iron and chromium.
  • the lower electrode (4) is provided on the metal substrate (2).
  • the piezoelectric layer (5) is provided on the lower electrode (4).
  • the upper electrode (6) is provided on the piezoelectric layer (5).
  • the first outer edge (outer edge 40) of the lower electrode (4) is located inside the second outer edge (outer edge 20) of the metal substrate 2.
  • the third outer edge (outer edge 50) of the piezoelectric layer (5) is located inside the first outer edge (outer edge 40) of the lower electrode (4).
  • the fourth outer edge (outer edge 60) of the upper electrode (6) is located inside the third outer edge (outer edge 50) of the piezoelectric layer (5).
  • the piezoelectric element (1; 1a; 1b) according to the first aspect, it is possible to increase the operating frequency of the piezoelectric element (1; 1a; 1b).
  • the piezoelectric element (1; 1a; 1b) according to the second embodiment further includes an alumina layer (3) in the first embodiment.
  • the alumina layer (3) is interposed between the metal substrate (2) and the lower electrode (4).
  • the metal substrate (2) further contains aluminum.
  • the upper surface (31) of the alumina layer (3) includes a part of the surface of the plurality of scale-like particles of the alumina layer (3).
  • the piezoelectric element (1; 1a; 1b) according to the second aspect can suppress peeling of the lower electrode (4).
  • the alumina layer (3) covers the entire upper surface (21) of the metal substrate (2).
  • the piezoelectric element (1a) according to the fourth aspect in any one of the first to third aspects, further includes a terminal electrode (7) and a wiring part (8).
  • the terminal electrode (7) is provided on the piezoelectric layer (5) and is separated from the upper electrode (6).
  • the wiring section (8) is provided across the upper surface (41) of the lower electrode (4) and the side surface (53) of the piezoelectric layer (5), and is connected between the lower electrode (4) and the terminal electrode (7). are connected.
  • the wiring portion (8) is located inside the second outer edge (outer edge 20) of the metal substrate (2).
  • the piezoelectric element (1a) according to the fourth aspect can be easily mounted on a flexible printed wiring board and can improve connection reliability.
  • the terminal electrode (7) is located inside the third outer edge (outer edge 50) of the piezoelectric layer (5) in plan view.
  • the wiring portion (8) includes a portion (81) provided on the upper surface (51) of the piezoelectric layer (5).
  • the piezoelectric element (1a) according to the fifth aspect it is possible to improve the uniformity of the thickness of the terminal electrode (7).
  • the piezoelectric layer (5) exposes a part of the upper surface (41) of the lower electrode (4). It has an opening (54).
  • the piezoelectric element (1b) since a part of the upper surface (41) of the lower electrode (4) constitutes the terminal part, it is possible to narrow the area that functions as the terminal part, and when in use This makes it possible to suppress variations in the characteristics of.
  • An ultrasonic transducer (100; 100a; 100c) according to a seventh aspect includes a piezoelectric element (1; 1a; 1b) according to any one of the first to sixth aspects, a diaphragm section (120; 120c), Includes a first conductive member (first lead wire 141), a second conductive member (second lead wire 142), a first conductive joint (131), and a second conductive joint (132). .
  • the diaphragm portion (120; 120c) is joined to the metal substrate (2) of the piezoelectric element (1; 1a; 1b).
  • the first conductive member (first lead wire 141) is connected to the lower electrode (4) of the piezoelectric element (1; 1a; 1b).
  • the second conductive member (second lead wire 142) is connected to the upper electrode (6) of the piezoelectric element (1; 1a; 1b).
  • the first conductive joint (131) joins the lower electrode (4) and the first conductive member (first lead wire 141).
  • the second conductive joint (132) joins the upper electrode (6) and the second conductive member (second lead wire 142).
  • the ultrasonic transducer (100; 100a; 100c) according to the seventh aspect can increase the operating frequency of the piezoelectric element (1; 1a; 1b).
  • the ultrasonic transducer (100; 100a) further includes a case (101) housing the piezoelectric element (1; 1a; 1b) in the seventh aspect.
  • the case (101) has a bottom plate part (102) and a cylindrical part (103).
  • the bottom plate portion (102) has a flat plate shape.
  • the cylindrical portion (103) protrudes from the periphery of one surface of the bottom plate portion (102) in the thickness direction of the bottom plate portion (102), and surrounds the piezoelectric element (1; 1a; 1b).
  • a portion of the bottom plate portion (102) surrounded by the cylinder portion (103) also serves as a diaphragm portion (120).
  • the ultrasonic transducer (100; 100a) according to the eighth aspect can be used, for example, as an ultrasonic sensor that is attached to a vehicle and detects objects outside the vehicle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
PCT/JP2023/017878 2022-05-19 2023-05-12 圧電素子及び超音波トランスデューサ Ceased WO2023223955A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024521723A JPWO2023223955A1 (https=) 2022-05-19 2023-05-12

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022082625 2022-05-19
JP2022-082625 2022-05-19

Publications (1)

Publication Number Publication Date
WO2023223955A1 true WO2023223955A1 (ja) 2023-11-23

Family

ID=88835379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/017878 Ceased WO2023223955A1 (ja) 2022-05-19 2023-05-12 圧電素子及び超音波トランスデューサ

Country Status (2)

Country Link
JP (1) JPWO2023223955A1 (https=)
WO (1) WO2023223955A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007037007A (ja) * 2005-07-29 2007-02-08 Osaka Prefecture 圧電式音波センサ
JP2007165385A (ja) * 2005-12-09 2007-06-28 Nec Tokin Corp 圧電膜積層構造体およびその製造方法
JP2011250327A (ja) * 2010-05-28 2011-12-08 Murata Mfg Co Ltd 超音波センサ
WO2012111279A1 (ja) * 2011-02-18 2012-08-23 パナソニック株式会社 圧電素子
WO2014076895A1 (ja) * 2012-11-19 2014-05-22 パナソニック株式会社 発電装置
JP2021007117A (ja) * 2017-09-21 2021-01-21 パナソニックＩｐマネジメント株式会社 圧電トランスデューサ及び圧電モジュール
US20210078042A1 (en) * 2019-09-12 2021-03-18 Exo Imaging, Inc. Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007037007A (ja) * 2005-07-29 2007-02-08 Osaka Prefecture 圧電式音波センサ
JP2007165385A (ja) * 2005-12-09 2007-06-28 Nec Tokin Corp 圧電膜積層構造体およびその製造方法
JP2011250327A (ja) * 2010-05-28 2011-12-08 Murata Mfg Co Ltd 超音波センサ
WO2012111279A1 (ja) * 2011-02-18 2012-08-23 パナソニック株式会社 圧電素子
WO2014076895A1 (ja) * 2012-11-19 2014-05-22 パナソニック株式会社 発電装置
JP2021007117A (ja) * 2017-09-21 2021-01-21 パナソニックＩｐマネジメント株式会社 圧電トランスデューサ及び圧電モジュール
US20210078042A1 (en) * 2019-09-12 2021-03-18 Exo Imaging, Inc. Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries

Also Published As

Publication number Publication date
JPWO2023223955A1 (https=) 2023-11-23

Similar Documents

Publication Publication Date Title
US11730451B2 (en) Integrated ultrasonic transducers
JP5384678B2 (ja) 超音波探触子及びこれを用いた超音波診断装置
US8540640B2 (en) Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device
CN113042347B (zh) 一种阵列超声换能器
JP6603092B2 (ja) 超音波プローブ
US12527222B2 (en) Ultrasonic sensor
US20070189761A1 (en) Implementing ic mounted sensor with high attenutation backing
JP4961224B2 (ja) 超音波探触子
WO2019058978A1 (ja) 圧電トランスデューサ及び圧電モジュール
JP2005020315A (ja) 超音波用トランスデューサおよびその製造方法
JP7226154B2 (ja) 超音波センサ
WO2023223955A1 (ja) 圧電素子及び超音波トランスデューサ
JP7088099B2 (ja) 超音波センサ
US7555955B2 (en) Ultrasonic sensor
JP5026770B2 (ja) 超音波探触子及び超音波診断装置
JP2023170692A (ja) 圧電素子及び超音波トランスデューサ
JP2024083009A (ja) 圧電素子及び超音波トランスデューサ
JP6728260B2 (ja) 積層型超音波トランスデューサ及び超音波検査装置
JP2024090251A (ja) 圧電素子及び超音波トランスデューサ
JP4080580B2 (ja) 超音波プローブ
CN217561728U (zh) 一种片上双芯片集成的飞行时间传感器
CN111050666B (zh) 超声波探头及其制造方法
JP7471039B2 (ja) 超音波トランスデューサ
JP2025038706A (ja) 圧電素子、超音波トランスデューサ、超音波センサ、制御方法及びプログラム
JP2017158630A (ja) 超音波プローブ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23807558

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024521723

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 23807558

Country of ref document: EP

Kind code of ref document: A1