WO2023223716A1

WO2023223716A1 - Method for manufacturing glass plate, and device for manufacturing glass plate

Info

Publication number: WO2023223716A1
Application number: PCT/JP2023/014713
Authority: WO
Inventors: 宏明田中
Original assignee: 日本電気硝子株式会社
Priority date: 2022-05-17
Filing date: 2023-04-11
Publication date: 2023-11-23
Also published as: TW202348575A

Abstract

In the method for manufacturing a glass plate 5 having a processed portion (through hole 5e), a replenishing solution W, which is stored in a replenishing tank 3 and the temperature of which has been adjusted by a second temperature control device 8, is supplied to an etching tank 2 in an etching step in which the glass plate 5 is immersed in an etching solution E, which is stored in the etching tank 2 and the temperature of which has been adjusted by a first temperature control device 7, to form a processed portion (through hole 5e) by etching.

Description

Glass plate manufacturing method and glass plate manufacturing device

The present invention relates to a glass plate manufacturing method and a glass plate manufacturing apparatus configured to immerse the glass plate in an etching solution for etching.

In recent years, the use of glass plates having fine through holes for wiring (through electrodes, etc.) has been promoted as substrates for tiling displays (micro LEDs, etc.), bezel-less displays, glass interposers, etc.

For example, as disclosed in

Patent Documents

1 and 2, this glass plate manufacturing method involves modifying a portion of a glass plate where a through hole is to be formed by irradiating a laser beam to form a modified portion. and an etching step of forming a through hole in a portion to be formed by etching. This etching process also allows the glass plate to be made thinner.

This type of etching process is performed by immersing a glass plate in an etching solution in an etching tank, for example, as disclosed in Patent Document 3.

Specifically, the publication states that the etching tank is equipped with an etching tank that stores an etching solution and a chemical tank (replenishment tank) that supplies a chemical solution (replenisher) into the etching tank, and that the replenisher is supplied from the replenishment tank into the etching tank. A configuration is disclosed in which the concentration of the etching solution is adjusted by supplying the etching solution.

Japanese Patent Application Publication No. 2018-199605 JP2020-66551A Japanese Patent Application Publication No. 2017-14041

However, even if the concentration of the etching solution in the etching tank is adjusted by supplying a replenisher as disclosed in Patent Document 3 mentioned above, if the temperature of the etching solution changes, the etching rate will change significantly. Therefore, large variations occur in the etching process on the glass plates, making it difficult to continuously manufacture glass plates that are products of the same quality.

In view of the above, an object of the present invention is to suppress fluctuations in the etching rate and reduce variations in the etching process on a glass plate in a configuration in which a replenisher is supplied from a replenishment tank to the etching solution in the etching tank. It is.

(1) A first aspect of the present invention devised to solve the above problems is a method for manufacturing a glass plate having a first principal surface, a second principal surface, and a processed portion, the method comprising: The part includes a through hole penetrating between the first main surface and the second main surface, and a recess and a groove provided in at least one of the first main surface and the second main surface. a modification step of modifying the portion to be formed in the processing portion by irradiation with laser light; and a modification step in which the glass plate is placed in an etching solution stored in an etching tank and whose temperature is adjusted by a first temperature control device. and an etching step of forming the processed portion in the planned formation portion by immersion and etching, and in the etching step, the replenisher solution stored in a replenishment tank and whose temperature has been adjusted by a second temperature control device is added to the replenisher solution. It is characterized by being supplied into an etching tank.

According to such a configuration, the temperature of the etching solution in the etching tank is adjusted by the first temperature controller, and the temperature of the replenisher in the replenishment tank is adjusted by the second temperature controller. It becomes easier to maintain the temperature of the etching solution inside at a constant temperature. As a result, fluctuations in the etching rate can be suppressed, and variations in the process of forming processed parts on the glass plate can be reduced. As a result, it becomes possible to continuously manufacture glass plates having the same dimensions and the same form of processed parts.

(2) In the configuration of (1) above, the processed portion may be the through hole.

In this way, variations in the process of forming through holes in the glass plate can be reduced.

(3) In the configuration of (1) above, the processed portion may be the recess or the groove.

In this way, variations in the process of forming recesses or grooves on the glass plate can be reduced.

(4) In any one of the configurations (1) to (3) above, the second temperature controller adjusts the temperature of the etching solution in the etching tank based on the temperature of the etching solution adjusted by the first temperature controller. The temperature of the replenisher in the replenishment tank may be adjusted.

In this way, it becomes easier to maintain the temperature of the etching solution in the etching tank at a constant temperature. Here, when an alkaline etching solution to be described later is used as the etching solution, the temperature of the etching solution is preferably 80° C. to 120° C. in order to increase the etching rate. Under such temperature conditions, if the temperature of the etching solution is below the maximum temperature within the range where the replenisher does not boil, it is preferable to set the temperature of the replenisher to the same temperature as the etching solution. . On the other hand, if the temperature of the etching solution exceeds the maximum temperature within the range where the replenisher does not boil, the temperature of the replenisher may be set to around the maximum temperature within the range where the replenisher does not boil. preferable.

(5) In any of the configurations (1) to (4) above, the water level of the etching solution in the etching tank is detected by a water level detection device, and based on the detection result, the water level of the etching solution is transferred from the replenishing tank to the etching tank. The water level of the etching solution in the etching tank may be adjusted by supplying a replenisher.

In this way, by using the water level detection device, it becomes possible to maintain the water level of the etching solution in the etching tank at a constant height. Thereby, the shortage of etching solution in the etching tank can be accurately supplemented with the replenishing solution supplied from the replenishing tank.

(6) In any of the configurations (1) to (5) above, the period from when the glass plate is immersed in the etching solution to when the glass plate is taken out from the etching solution, and when the glass plate is immersed in the etching solution. The adjusted water level may be different depending on the period from when the glass plate is taken out from the etching solution to when the glass plate is immersed in the etching solution.

In this way, the period from when the glass plate is immersed in the etching liquid until the time when the glass plate is taken out from the etching liquid, and the period from when the glass plate is taken out from the etching liquid until the time when the glass plate is immersed in the etching liquid can be reduced. This avoids problems caused by keeping the water level of the etching solution in the etching tank the same. In other words, when a glass plate is removed from the etching solution, the amount equivalent to the volume of the glass plate is combined with the amount of etching solution that adheres to the glass plate and is taken out of the etching tank as the glass plate is removed. (including the volume when the glass plate is set on a jig, etc.). In this case, if the water level of the etching solution is adjusted between the time the glass plate is taken out of the etching solution and the time the glass plate is immersed in the etching solution, the water level of the etching solution will be the same as when the glass plate had been immersed. The amount of replenisher supplied into the tank increases, and the concentration of the etching solution changes. Therefore, by adjusting the water level between the time the glass plate is immersed in the etching solution and the time the glass plate is removed from the etching solution, the water level is different from that when the glass plate was immersed. The concentration of the etching solution during the period from when the glass plate is immersed in the glass plate to when it is taken out from the etching liquid can be made to be the same concentration as the concentration of the etching liquid when the glass plate is being immersed. Thereby, when the subsequent glass plate is immersed in the etching solution, it becomes possible to perform the process of forming a processed portion on the subsequent glass plate in the same manner as the preceding glass plate.

(7) In any of the configurations (1) to (6) above, the etching solution in the etching tank is an alkaline etching solution, and by supplying the replenisher from the replenishment tank into the etching tank. , the concentration of the etching solution in the etching bath may be adjusted. As the alkaline etching solution, a NaOH solution, a KOH solution, or the like is used.

In this way, the characteristics of the alkaline etching solution can be effectively utilized to appropriately adjust the concentration of the etching solution. That is, as the etching solution, not only an alkaline etching solution but also an HF etching solution can be used. In this case, the alkaline etching solution has a lower etching rate than the HF etching solution. Therefore, even when performing an etching process using a highly concentrated etching solution, by using an alkaline etching solution, it is possible to maintain an etching rate that makes it easy to control the etching amount of the processed portion. Furthermore, by performing etching at a high concentration, the influence of deterioration of the etching solution can be reduced.

(8) In any of the configurations (1) to (7) above, the concentration of the alkaline component of the alkaline etching solution may be 8 mol/L or more and 20 mol/L or less.

In this way, the etching rate can be increased, so the working time can be shortened. Further, by setting the concentration of the alkaline component to 8 mol/L or more, the evaporation rate when controlling the temperature of the etching solution can be suppressed. Furthermore, by setting the amount to 20 mol/L or less, it is possible to suppress the precipitation of alkali components when the etching solution is brought to room temperature.

(9) In any of the configurations (1) to (8) above, the replenishment liquid in the replenishment tank may be pure water.

In this way, there is no need to use a chemical solution as a replenisher, so the cost required for the process of forming the processed portion on the glass plate can be reduced.

(10) In the configuration of (9) above, the amount of the pure water supplied from the replenishment tank to the etching tank is adjusted according to the amount of loss of the etching solution due to evaporation of water from the etching solution in the etching tank. May be adjusted.

In this way, even if the etching solution is heated to a high temperature in order to increase the etching rate, it will be possible to respond appropriately. That is, even if more water evaporates by heating the etching solution to a high temperature, the lack of water will be compensated for by a large amount of pure water supplied from the replenishment tank. Therefore, even when the etching rate is increased, the concentration of the etching solution can be adjusted accurately and easily.

(11) A second aspect of the present invention devised to solve the above-mentioned problems is a method for manufacturing a glass plate, which includes a step of thinning the glass plate, wherein the glass plate is stored in an etching bath and heated to a first temperature. An etching step is provided in which the glass plate is thinned by immersing the glass plate in an etching solution whose temperature is adjusted by a temperature control device, and in the etching step, the glass plate is stored in a replenishing tank and is heated by a second temperature control device. The method is characterized in that a temperature-controlled replenisher is supplied into the etching bath.

According to such a configuration, as in the case described above, it becomes easier to maintain the temperature of the etching solution in the etching tank at a constant temperature, so fluctuations in the etching rate are suppressed. Thereby, variations in the process of thinning the glass plate can be reduced. As a result, it becomes possible to continuously manufacture glass plates having the same thickness.

(12) A third aspect of the present invention devised to solve the above-mentioned problems is a glass plate manufacturing apparatus that includes an etching tank that performs etching by immersing the glass plate in an etching solution stored inside. , a replenishment tank for storing a replenisher to be supplied into the etching tank, a supply path for supplying the replenisher to the etching tank, and a first temperature controller that adjusts the temperature of the etching solution in the etching tank. , and a second temperature control device that adjusts the temperature of the replenisher in the replenisher tank.

According to this device, it is possible to reduce variations in the process of forming through holes in the glass plate, the process of thinning the glass plate, and the process of forming recesses or grooves in the glass plate.

According to the present invention, in the configuration in which the replenisher is supplied from the replenisher tank to the etching solution in the etching tank, fluctuations in the etching rate are suppressed, and variations in etching processing on the glass plate can be reduced.

1 is a schematic front view showing the overall configuration of a glass plate manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged vertical cross-sectional view of a main part showing a situation in which a modification step is being carried out in a method for manufacturing a glass plate according to an embodiment of the present invention. FIG. 2 is an enlarged vertical cross-sectional view of a main part showing a situation in which an early stage of an etching process in a method for manufacturing a glass plate according to an embodiment of the present invention is being carried out. FIG. 2 is an enlarged longitudinal sectional view of a main part showing a situation in which the middle stage of an etching process in a method for manufacturing a glass plate according to an embodiment of the present invention is being carried out. FIG. 2 is an enlarged vertical cross-sectional view of a main part showing a situation in which the final stage of an etching process in a method for manufacturing a glass plate according to an embodiment of the present invention is being carried out. FIG. 2 is a schematic front view showing the overall configuration of another example (first example) of the glass plate manufacturing apparatus according to the embodiment of the present invention. FIG. 3 is a schematic front view showing the overall configuration of another example (second example) of the glass plate manufacturing apparatus according to the embodiment of the present invention. FIG. 3 is a schematic front view showing the overall configuration of another example (third example) of the glass plate manufacturing apparatus according to the embodiment of the present invention. FIG. 7 is an enlarged vertical cross-sectional view of a main part showing a situation in which a modification step is being carried out in a method for manufacturing a glass plate according to another embodiment of the present invention.

Hereinafter, a glass plate manufacturing apparatus and a glass plate manufacturing method according to embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 illustrates a glass plate manufacturing apparatus according to an embodiment of the present invention. The glass plate manufacturing apparatus described here is an apparatus for forming processed parts (through holes, recesses, or grooves) on a glass plate and thinning the glass plate. Matters related to this will be explained in detail in the explanation of the glass plate manufacturing method described later.

As shown in the figure, the glass plate manufacturing apparatus 1 includes an etching tank 2 that stores an etching solution E, a replenishment tank 3 that stores a replenisher W, and a replenisher W from the replenisher tank 3 into the etching tank 2. A supply path 4 is provided.

One or more glass plates 5 are immersed in the etching solution E in the etching tank 2. As a result, these glass plates 5 are subjected to etching treatment (processing for forming processed portions and thinning treatment).

A valve 6 is installed in the supply path 4. The valve 6 may be a flow rate adjustment valve that adjusts the flow rate of the etching solution E supplied from the replenishment tank 3 to the etching tank 2, and may be an on-off valve that only operates to open or shut off the supply path 4. Good too.

Furthermore, this manufacturing apparatus 1 includes a first temperature control device 7 that adjusts the temperature of the etching solution E in the etching tank 2, and a second temperature control device 8 that adjusts the temperature of the replenisher W in the replenishment tank 3. Be prepared.

The first temperature control device 7 includes a first temperature detection means (first temperature sensor) 7a that detects the temperature of the etching solution E in the etching bath 2, and a first temperature detection means (first temperature sensor) 7a that detects the temperature of the etching solution E in the etching bath 2. and a first heater 7b that heats the etching solution E therein. Note that a first temperature control device capable of heating and cooling the etching liquid E may be used instead of the first heater 7b.

The second temperature control device 8 includes a second temperature detection means (second temperature sensor) 8a that detects the temperature of the replenisher W in the replenishment tank 3, and a signal B from the second temperature sensor 8a. and a second heater 8b that heats the replenisher W inside. Note that a second temperature control device capable of heating and cooling the replenisher W may be used instead of the second heater 8b.

In addition, this manufacturing apparatus 1 is equipped with a water level adjustment device 9. The water level adjustment device 9 includes a water level detection device (level sensor) 9a that detects the water level of the etching solution E in the etching tank 2 (the height of the liquid level L1), and a supply path 4 based on a signal C from the level sensor 9a. and a control means (controller) 9b for controlling the operation of the valve 6. A signal D for controlling the valve 6 is transmitted from the controller 9b.

The level sensor 9a detects the water level (height of the liquid level L2) of the etching liquid E in the branching tank 2b branching from the vertically intermediate portion of the side wall 2a of the etching tank 2 and moving upward. Since the etching tank 2 and the branch tank 2b are internally connected, the water level of the etching liquid E in the etching tank 2 and the water level of the etching liquid E in the branch tank 2b are the same. Therefore, the water level of the etching liquid E in the etching tank 2 is detected by the level sensor 9a. In the illustrated example, a sensor having a float 9aa is used as the level sensor 9a, but other water level detection devices may be used.

The controller 9b is composed of, for example, a microcomputer (including a personal computer), a sequencer, or other electric circuit.

The etching tank 2 and the replenishment tank 3 are installed in parallel at the same height position. The water level of the replenisher W in the replenisher tank 3 (height of the liquid level L3) is set to always be higher than the water level of the etching solution E in the etching tank 2.

Here, as the etching solution E, an HF-based etching solution, an alkaline-based etching solution, or the like can be used. In this embodiment, the etching solution E is an alkaline etching solution. As the alkaline etching solution, a NaOH solution or a KOH solution is used. The upper limit of the concentration of the alkaline component of the alkaline etching solution is preferably 20 mol/L, more preferably 18 mol/L, and the lower limit is preferably 8 mol/L, more preferably 10 mol/L.

Further, as the replenisher W, a chemical solution having the same composition or components as the etching solution E and having a lower concentration than the etching solution E, pure water, or the like can be used. In this embodiment, the replenisher W is pure water.

In the illustrated example, the supply channel 4 is arranged at the lower ends of the etching tank 2 and the replenishment tank 3, but the height position at which the supply channel 4 is arranged is higher than the liquid level L3 of the replenisher W in the replenishment tank 3. It may be at any other position as long as it is also below. Further, in the illustrated example, the upper end of the etching tank 2 is open, but the upper end of the etching tank 2 may be covered with an openable and closable lid. Similarly, in the illustrated example, the top end of the replenishment tank 3 is open, but the top end of the replenishment tank 3 may be covered with an openable and closable lid.

Furthermore, a stirring device (not shown) for stirring the etching solution E may be provided inside the etching tank 2. Thereby, after the replenisher W is supplied, the concentration of the etching solution E in the etching tank 2 can be quickly made uniform.

Next, a method for manufacturing a glass plate according to an embodiment of the present invention will be described. The method for manufacturing a glass plate includes a modification step and an etching step as main steps.

As shown in FIG. 2, the modification step is performed on a glass plate 5 having a first main surface 5a and a second main surface 5b. Specifically, the modification step is a step of modifying the portion 5c of the glass plate 5 where the through hole is to be formed using the laser light F irradiated from the laser device 10. The modified portion 5c to be formed has a modified portion 5d extending in the thickness direction. The modified portion 5d has a characteristic of being easily etched. The modified portion 5d is preferably formed continuously in the thickness direction from the first principal surface 5a to the second principal surface 5b, as shown in the figure, but is formed intermittently in the thickness direction. may be formed. Furthermore, when a plurality of through holes are formed in the glass plate 5, a plurality of planned formation portions 5c having the modified portions 5d are also formed.

In this case, the type and irradiation conditions of the laser beam F are not particularly limited as long as the laser beam F can form a through hole in the formation planned portion 5c. In this embodiment, the laser beam F is a short pulse laser beam (nanosecond laser beam, picosecond laser beam, femtosecond laser beam). The diameter G of the modified portion 5d can be adjusted by adjusting the spot diameter of the laser beam F, etc.

The glass plate 5 can be made of, for example, alkali-free glass, and the glass composition includes, in mass %, SiO ₂ 58-68%, Al ₂ O ₃ 15-23% (particularly 17-21%), B. ₂ O ₃ 0 to 9% (especially 3 to 7%), Li ₂ O + Na ₂ O + K ₂ O 0 to less than 1% (especially 0 to 0.5%), MgO 1 to 6% (especially 1 to 4%), It is preferable to contain 3-13% (especially 5-10%) of CaO, 0-10% (especially 0.1-3%) of SrO, and 0.1-15% (especially 0.1-5%) of BaO. .

In the etching step, by etching the glass plate 5, a through hole is formed in the planned formation portion 5c having the modified portion 5d, passing through in the thickness direction between the first principal surface 5a and the second principal surface 5b. This is the process of Specifically, in the etching process, one or more glass plates 5 set in a jig or the like are immersed in an etching solution E stored in an etching bath 2 shown in FIG. Etching is simultaneously proceeded from both sides of the first principal surface 5a and second principal surface 5b.

At the beginning of the etching process, as shown in FIG. 3, the planned formation portion 5c having the modified portion 5d is gradually removed by etching. At this point, the portion to be formed 5c has not penetrated in the thickness direction. Thereafter, in the middle of the etching process, the portion 5c to be formed penetrates in the thickness direction, as shown in FIG. At the final stage of the etching process, the diameter of the through hole is enlarged, and a through hole 5e as shown in FIG. 5 is finally formed. In this case, the straight lines indicated by symbols 5ax and 5bx in FIGS. 3 to 5 indicate the respective positions of the first principal surface 5a and the second principal surface 5b before etching. Therefore, the glass plate 5 becomes thinner throughout the etching process.

After this, all of the one or more glass plates 5 are taken out from the etching bath 2 shown in FIG. It is immersed in the etching solution E in the etching bath 2, and the etching process is performed in the same manner as above.

In the etching process as described above, each component of the manufacturing apparatus 1 shown in FIG. 1 performs the following operations.

That is, in the etching process, the temperature of the alkaline etching solution E (hereinafter simply referred to as etching solution E) stored in the etching tank 2 and the temperature of the pure water W stored in the replenishment tank 3 are controlled by the first temperature controller. 7 and a second temperature control device 8 adjust the temperature. Then, pure water W is supplied from the replenishment tank 3 to the etching tank 2 through the supply path 4.

In this case, the temperature of the etching solution E is set at 80° C. to 120° C. in order to increase the etching rate. The temperature of the pure water W in the replenishment tank 3 is adjusted by the second temperature control device 8 based on the temperature of the etching solution E in the etching tank 2. Specifically, when the temperature of the etching liquid E is below the maximum temperature within the range where the pure water W does not boil, the second temperature controller 8 sets the temperature of the pure water W to be the same as the temperature of the etching liquid E. temperature. On the other hand, if the temperature of the etching solution E exceeds the maximum temperature within the range where the pure water W does not boil, the second temperature controller 8 adjusts the temperature of the pure water W within the range where the pure water W does not boil. The temperature should be around the maximum temperature within the room.

As described above, whether the temperature of the etching solution E and the temperature of the pure water W are the same or different, the temperature of the etching solution E in the etching bath 2 is adjusted by the first temperature controller 7. Therefore, it becomes easier to maintain the temperature of the etching solution E at a constant temperature. Therefore, the first temperature controller 7 can bring the etching liquid E to an appropriate temperature in a short time from the time when the pure water W is supplied into the etching bath 2. As a result, fluctuations in the etching rate are suppressed, and variations in the process of forming through holes in the plurality of glass plates 5 are reduced.

Further, in the etching process, water in the etching solution E in the etching tank 2 evaporates, so pure water W is supplied from the replenishment tank 3 to the etching tank 2 in accordance with the amount of the amount of the etching solution E lost due to this evaporation. Specifically, the level sensor 9a of the water level adjustment device 9 detects the water level of the etching solution E in the etching tank 2, and the controller 9b controls the valve 6 based on the signal C from the level sensor 9a, so that the replenishment tank 3 An appropriate amount of pure water W is supplied to the etching bath 2 from the etching tank 2. The reason why the controller 9b can supply the pure water W from the refill tank 3 to the etching tank 2 simply by controlling the valve 6 is because the water level of the pure water W is always higher than the water level of the etching solution E. Note that in order to keep the water level of the pure water W higher than the water level of the etching solution E, the replenishment tank 3 is replenished with pure water W through an opening at its upper end.

Here, when the valve 6 is constituted by a flow rate adjustment valve, the pure water W is made to flow continuously from the replenishment tank 3 to the etching tank 2, and the flow rate of the pure water W at that time is controlled by the controller 9b. At this time, the controller 9b adjusts the opening degree of the valve 6 so that the water level of the etching liquid E is maintained at a preset first reference value. Thereby, the water level of the etching liquid E is always maintained at the first reference value.

On the other hand, when the valve 6 is configured as an on-off valve, the controller 9b opens the supply path 4 at predetermined intervals to intermittently supply pure water from the replenishment tank 3 to the etching tank 2. At this time, the controller 9b controls the valve 6 so that the supply path 4 is opened and closed as shown below. That is, when the water level of the etching liquid E decreases from the first reference value, the water level is set at a predetermined position (a reference value may be set in advance) within a range that does not interfere with the etching process of the glass plate 5. ), the supply path 4 is kept shut off until it descends to .). When the water level falls and reaches the predetermined position, the supply channel 4 is kept open until the water level rises to the first reference value. When the water level rises and reaches the first reference value, the supply path 4 is shut off. By performing such control, the water level of the etching liquid E is maintained at the first reference value at predetermined time intervals.

As described above, the pure water W is supplied to the etching tank 2 in accordance with the evaporation of water from the etching solution E, so that the concentration of the etching solution E in the etching tank 2 is maintained constant. Furthermore, even if the amount of water evaporation increases by heating the etching solution E to a high temperature in order to increase the etching rate, a large amount of pure water W is supplied from the replenishment tank 3 to the etching tank 2 accordingly. , the concentration of etching solution E is maintained constant. Coupled with the fact that the temperature of the etching solution E is maintained constant as described above, fluctuations in the etching rate are significantly suppressed.

Furthermore, in this manufacturing method, there are two times when one or more glass plates 5 are immersed in the etching liquid E and when all one or more glass plates 5 are taken out from the etching liquid E. , the reference value of the water level of the etching solution E is made different. Specifically, when all the glass plates 5 are immersed in the etching liquid E, the water level of the etching liquid E is adjusted based on the above-mentioned first reference value. On the other hand, when all the glass plates 5 are being taken out from the etching solution E, the water level of the etching solution E is adjusted based on the second reference value that is lower than the above-mentioned first reference value.

To be more specific, when all the glass plates 5 are taken out from the etching solution E, an amount equivalent to the volume of the glass plates 5 (including an amount equivalent to the volume of the jig etc.) and a removal amount of the glass plates 5 are removed. Accordingly, the water level of the etching liquid E is lowered by the total amount including the amount of the etching liquid E that adheres to the glass plate 5 and is taken out of the etching bath 2. In this case, if the water level is adjusted based on the above-mentioned first reference value while all the glass plates 5 are being taken out, the amount of pure water W supplied into the etching tank 2 will increase and the etching solution will be The concentration of E decreases. Therefore, while all the glass plates 5 are being taken out, the water level is adjusted based on a second reference value that is lower than the first reference value by a value corresponding to the total amount. Thereby, the concentration of the etching liquid E when all the glass plates 5 are taken out can be made equal to the concentration of the etching liquid E when all the glass plates 5 are immersed. As a result, when one or more succeeding glass plates 5 are impregnated with the etching solution E, the preceding one or more glass plates 5 are It becomes possible to perform a process of forming through holes in the same manner as in the plate 5. Note that, when starting the subsequent etching process, it is preferable to change the setting so that the first reference value is lowered by a value corresponding to the above-mentioned amount of removal. In this way, both the first reference value and the second reference value are lowered by a numerical value corresponding to the above-mentioned amount taken out each time an etching process is performed. Thereby, the amount of etching liquid E is adjusted to constantly decrease by the amount taken out in the etching bath 2, so that the concentration of etching liquid E is more reliably maintained at a constant concentration.

Note that while the glass plate 5 is immersed in the etching liquid E and the glass plate 5 is being taken out from the etching liquid E, it is preferable to stop supplying the pure water W to the etching tank 2. If pure water W is supplied to the etching tank 2 when performing these operations, the first reference and the second reference cannot be set accurately.

Although the glass plate manufacturing apparatus and the glass plate manufacturing method according to the embodiments of the present invention have been described above, the embodiments of the present invention are not limited thereto, and may be provided without departing from the gist of the present invention. Various changes are possible.

In the above embodiment, the replenishment tank 3 is replenished with pure water W through the opening at the upper end of the replenishment tank 3. For example, as shown in FIG. It is also possible to connect the replenishment path 12 in which the deionized water supply source 13 is installed and replenish the replenishment tank 3 with pure water W through the replenishment path 12 from the pure water supply source 13. In this case, the replenishment tank 3 is also provided with a water level adjustment device similar to the configuration of the etching tank 2, and the controller controls the valve 6 based on the signal from the water level detection means (level sensor). The water level of pure water W in 3 may be set to an appropriate water level. The controller used here may be the controller 9b that receives the signal C from the level sensor 9a arranged in the branch tank 2b, or may be another controller. Note that the configuration in which the water level adjustment device is provided in the replenishment tank 3 can also be applied to a configuration in which the replenishment tank 3 is refilled with pure water W from the replenishment path 12 through the opening at the upper end of the replenishment tank 3.

In the above embodiment, the water level of the pure water W in the replenishment tank 3 is always higher than the water level of the etching solution E in the etching tank 2, but as shown in FIG. As long as the pure water W is forcibly sent from the replenishment tank 3 to the etching tank 2 by the pump P, the water level of both of the above may be high. The operation of pump P is controlled based on signal H from controller 9b. In this case, if the pump P has the function of adjusting the flow rate of the pure water W and the function of allowing and blocking the flow of the pure water W, the valve 6 shown in the figure need not be installed in the supply path 4. Good too.

In the above embodiment, the etching tank 2 and the replenishment tank 3 are arranged at the same height position, but both 2 and 3 may be arranged at different height positions. As a specific example, as shown in FIG. 8, the replenishment tank 3 may be arranged above the etching tank 2. In this case, a supply path 4 whose lower end is open is connected to the bottom wall 3b of the replenishment tank 3 arranged above the etching tank 2, and a valve 6 is installed in this supply path 4. Regarding the configuration here, as a means for replenishing pure water W into the replenishment tank 3, the above-mentioned replenishment path 12 or a water level adjustment device similar to the configuration for the etching tank 2 may be provided.

Note that in FIGS. 6 to 8, the same reference numerals are given to the same components as those in the manufacturing apparatus 1 shown in FIG. 1.

In the above embodiment, a plurality of glass plates 5 are immersed in the etching liquid E and taken out from the etching liquid E, but one glass plate 5 is immersed in the etching liquid E and taken out from the etching liquid E. Even in this case, the present invention can be applied in the same manner.

In the above embodiment, the glass plate 5 is immersed in the etching solution E in a vertical position, but the glass plate 5 may be immersed in a horizontal position (horizontal position or substantially horizontal position).

In the above embodiment, the etching process was performed after the modification process was performed on the glass plate 5 to form through holes and reduce the thickness, but the present invention is not limited to this. Only the etching process may be performed without performing the modification process, and only the thickness of the glass plate 5 may be reduced.

In the above embodiment, the through hole 5e is formed in the glass plate 5, but the present invention is not limited thereto. A recess (non-through hole) may be formed in at least one of the first main surface 5a and the second main surface 5b of the glass plate 5. Alternatively, the groove portion may be formed by combining a plurality of recesses (non-through holes). Furthermore, one or more of these through holes 5e, recesses (non-through holes), and grooves may be formed in the glass plate 5.

Here, when forming a recessed part in the glass plate 5, for example, as already explained based on FIG. 2, after forming the modified part 5d in the glass plate 5 in the modification process, as shown in FIG. The etching process may be completed when the recesses are formed on the first main surface 5a and the second main surface 5b of the glass plate 5, respectively. For example, after forming a modified portion 5d having a length corresponding to the depth of the recess from at least one of the first main surface 5a and second main surface 5b of the glass plate 5 in the modification step, etching is performed. You may make it form a recessed part in at least one main surface of the 1st main surface 5a and the 2nd main surface 5b of the glass plate 5 in a process. By doing as described above, variations in the process of forming recesses in the glass plate 5 are reduced. In addition, as shown in FIG. 9, when forming recesses and grooves in the glass plate 5, in the modification process, a modified part 5d is formed from one main surface of the glass plate 5 to the middle part in the thickness direction. You may. The depth of the modified portion from the main surface is preferably adjusted depending on the depth of the recess or groove. When forming the modified portion 5d in this manner, the focus of the laser beam F may be adjusted to be located outside the glass plate 5.

On the other hand, when forming grooves in the glass plate 5, for example, in the modification step, modified parts 5d are formed at multiple locations on at least one of the first main surface 5a and the second main surface 5b of the glass plate 5. After that, the groove portion may be formed by combining (connecting) a plurality of recesses (a plurality of recesses formed in the same manner as described above) with each other in an etching process. For example, after forming a modified portion 5d linearly extending along at least one of the first main surface 5a and the second main surface 5b in the modification step, the first main surface 5d may be etched in the etching step. A groove may be formed in at least one of the main surface 5a and the second main surface 5b. By doing the above, variations in the process of forming grooves in the glass plate 5 are reduced.

1 Glass plate manufacturing apparatus 2 Etching tank 3 Replenishment tank 4 Supply path 5 Glass plate 5a First main surface 5b Second main surface 5c Formation planned section 5d Modification section 5e Through hole 7 First temperature control device 8 Second temperature control Device 9 Water level adjustment device E Etching solution L1 Liquid level L3 Liquid level W Pure water (replenisher)

Claims

A method for manufacturing a glass plate having a first main surface, a second main surface, and a processed part,
The processed portion includes a through hole penetrating between the first main surface and the second main surface, and a recess and a groove provided in at least one of the first main surface and the second main surface. Contains one or more of the following:
a modification step of modifying the portion where the processing portion is to be formed by irradiation with laser light; and etching by immersing the glass plate in an etching solution stored in an etching tank and whose temperature is adjusted by a first temperature controller. and an etching step of forming the processed portion in the planned formation portion,
In the etching step, a replenishment solution stored in a replenishment tank and whose temperature is adjusted by a second temperature control device is supplied into the etching tank.
The method for manufacturing a glass plate according to claim 1, wherein the processed portion is the through hole.
The method for manufacturing a glass plate according to claim 1, wherein the processed portion is the recess or the groove.
Any one of claims 1 to 3, wherein the second temperature control device adjusts the temperature of the replenisher in the replenishment tank based on the temperature of the etching solution in the etching tank adjusted by the first temperature control device. A method for producing a glass plate as described in .
The water level of the etching solution in the etching tank is detected by a water level detection device, and the replenishment solution is supplied from the replenishment tank into the etching tank based on the detection result, thereby controlling the water level of the etching solution in the etching tank. The method for manufacturing a glass plate according to any one of claims 1 to 3, wherein the glass plate is adjusted.
A period from when the glass plate is immersed in the etching solution to when the glass plate is taken out from the etching liquid, and from when the glass plate is taken out from the etching liquid until when the glass plate is immersed in the etching liquid. 6. The method for manufacturing a glass plate according to claim 5, wherein the adjusted water level is different depending on the period.
The etching solution in the etching tank is an alkaline etching solution,
4. The method for manufacturing a glass plate according to claim 1, wherein the concentration of the etching solution in the etching tank is adjusted by supplying a replenisher into the etching tank from the replenisher tank.
The method for manufacturing a glass plate according to claim 7, wherein the concentration of the alkaline component of the alkaline etching solution is 8 mol/L or more and 20 mol/L or less.
The method for manufacturing a glass plate according to any one of claims 1 to 3, wherein the replenisher in the replenisher tank is pure water.
The glass plate according to claim 9, wherein the amount of the pure water supplied from the replenishment tank to the etching tank is adjusted according to the amount of loss of the etching solution due to evaporation of water from the etching solution in the etching tank. Production method.
an etching step of thinning the glass plate by immersing the glass plate in an etching solution stored in an etching tank and having its temperature adjusted by a first temperature controller;
In the etching step, a replenisher solution stored in a replenishment tank and whose temperature is adjusted by a second temperature control device is supplied into the etching tank.
an etching tank that performs etching by immersing a glass plate in an etching solution stored inside;
a replenishment tank that stores a replenishment solution to be supplied into the etching tank;
a supply path for supplying the replenisher into the etching tank;
a first temperature controller that adjusts the temperature of the etching solution in the etching bath;
A glass plate manufacturing apparatus, comprising: a second temperature controller that adjusts the temperature of the replenisher in the replenisher tank.