JP5715546B2 - Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate by immersing a substrate in a processing solution stored in a processing tank, and a computer-readable storage medium storing a substrate processing program.

  Conventionally, when manufacturing a semiconductor component, a flat panel display, or the like, various processes such as etching are performed on a substrate such as a semiconductor wafer or a liquid crystal substrate using various substrate processing apparatuses.

  In this substrate processing apparatus, a processing liquid obtained by diluting a chemical liquid with a diluting liquid is boiled at a set temperature to set the concentration of the processing liquid to a saturated concentration at the set temperature, and the substrate is processed by immersing the substrate in the processing liquid. A substrate processing apparatus is known. For example, in the substrate processing apparatus (etching apparatus) disclosed in Patent Document 1, the substrate is immersed in a processing liquid (etching liquid) stored in a processing tank and a nitride film formed on the surface of the substrate is etched. ing.

  In this substrate processing apparatus, a phosphoric acid aqueous solution in which phosphoric acid is diluted with pure water to a predetermined concentration is used as a processing liquid.

  And in the said substrate processing apparatus, in order to make the phosphoric acid aqueous solution as a process liquid into a predetermined density | concentration, it is not managing the density | concentration of phosphoric acid aqueous solution directly, but the phosphoric acid aqueous solution which diluted phosphoric acid with the pure water is a processing tank. Is boiled at a set temperature (for example, 160 ° C.), and the concentration of the phosphoric acid aqueous solution is set to the saturation concentration (85% in the case of 160 ° C.) at the set temperature (boiling point).

  In the above-described substrate processing apparatus, when the substrate is repeatedly etched with the phosphoric acid aqueous solution, the silicon concentration in the phosphoric acid aqueous solution increases, and the selectivity between the silicon oxide film and the silicon nitride film changes, thereby etching the substrate. Processing cannot be performed satisfactorily.

  Therefore, in the conventional substrate processing apparatus, when the substrate is repeatedly processed with the processing liquid, a predetermined amount of the processing liquid is discharged from the processing tank, and then an amount of the processing liquid (phosphoric acid and pure water) corresponding to the discharged amount is discharged. ) To the treatment tank. In this case, the treatment liquid to be replenished is replenished with phosphoric acid and pure water to the treatment tank at a predetermined concentration (for example, 85%).

JP 2001-23952 A

  In the above conventional substrate processing apparatus, when the concentration of the processing liquid is set to a predetermined concentration (saturated concentration) by always boiling the processing liquid at the same set temperature, the concentration of the processing liquid can be managed well. .

  However, in the above substrate processing apparatus, in order to be able to change the content of the substrate processing (for example, etching rate), the concentration of the processing solution can be decreased (for example, 68%), that is, When the set temperature can be lowered (120 ° C in the case of 68%), the concentration of the treatment liquid inside the treatment tank gradually increases when a high concentration treatment liquid (for example, 85%) is replenished repeatedly. As a result, the substrate may not be processed satisfactorily.

Therefore, in the present invention, the concentration of the treatment liquid is brought to a saturation concentration at the set temperature by boiling a treatment liquid obtained by diluting a chemical solution with a diluent, and the substrate is immersed in the treatment liquid to treat the substrate. In the substrate processing apparatus, the processing tank for processing the substrate with the processing liquid, the processing liquid heating means for heating the processing liquid stored in the processing tank to the set temperature, and the processing liquid from the processing tank. A boiling point at which the concentration of the processing liquid to be changed becomes a saturated concentration when the concentration of the processing liquid to be processed is changed; the has a set temperature changing means for changing the set temperature, and control means for controlling said processing liquid replenishing means and said processing liquid discharge means, the control means changes the concentration of the processing solution for processing the substrate The case, the treatment liquid the processing solution of a predetermined amount is discharged from the treatment tank with discharge means, said processing liquid replenishing means the processing liquid in a concentration which is a saturation concentration in the changed the set temperature at the set temperature changing means It was decided to control to replenish the treatment tank.

Further, the set temperature changing means sets the set temperature to the boiling point where the set concentration becomes the saturated concentration by setting the concentration of the treatment liquid to be changed .

  Further, the processing liquid replenishing means replenishes the processing tank with the processing liquid that has been diluted in advance with the diluting liquid to a concentration that becomes a saturated concentration at the set temperature changed by the set temperature changing means. Decided to do.

  Further, the treatment liquid replenishing means replenishes the treatment tank with the chemical liquid and the diluting liquid so that the concentration becomes the saturated concentration at the set temperature changed by the set temperature changing means.

  Further, the processing liquid replenishing means replenishes the processing tank while diluting the chemical liquid with the diluting liquid so that the concentration becomes a saturated concentration at the set temperature changed by the set temperature changing means. .

  Further, the processing liquid replenishing means has a heating means for preheating the chemical liquid and / or the diluted liquid.

  Further, the control means heats the diluted solution by the heating means immediately before diluting the chemical solution with the diluted solution.

  In addition, the control means heats the chemical solution by the heating means to a temperature that compensates for the temperature that decreases due to the addition of the diluent.

  Further, the control means dilutes the chemical solution with an amount of the diluent that compensates for the amount of evaporation due to boiling of the diluent.

Further, in the present invention, the treatment liquid obtained by diluting the chemical liquid with the diluent is boiled at a set temperature to bring the concentration of the treatment liquid to the saturated concentration at the set temperature, and the substrate is immersed in the treatment liquid stored in the treatment tank. in the substrate processing method for performing processing of said substrate Te, the concentration of the treatment liquid to be changed to change the concentration of the processing solution for processing the substrate and can change the set temperature to the boiling point of the saturation concentration, said substrate When changing the concentration of the processing liquid to be processed, the set temperature is changed , a predetermined amount of the processing liquid is discharged from the processing tank, and the processing liquid having a concentration that becomes a saturated concentration at the changed set temperature is removed. The treatment tank was replenished.

  In addition, the replenishment of the treatment liquid is performed by replenishing the treatment tank with the treatment liquid that has been diluted in advance with the diluent and having a concentration that becomes a saturated concentration at the changed set temperature.

  The replenishment of the treatment liquid is performed by replenishing the treatment tank with the chemical solution and the diluting solution so that the concentration becomes a saturated concentration at the changed set temperature.

  In addition, the treatment solution is replenished to the treatment tank while the chemical solution is diluted with the diluent so that the concentration becomes a saturated concentration at the changed set temperature.

  In addition, the chemical solution and / or the diluent is preheated.

  In addition, the diluent is heated immediately before the drug solution is diluted with the diluent.

  In addition, the chemical solution is heated to a temperature that compensates for the temperature that decreases due to the addition of the diluent.

  Further, the chemical solution is diluted with an amount of the diluent that compensates for the amount of evaporation due to boiling of the diluent.

Further, in the present invention, the treatment liquid obtained by diluting the chemical liquid with the diluent is boiled at a set temperature to bring the concentration of the treatment liquid to the saturated concentration at the set temperature, and the substrate is immersed in the treatment liquid stored in the treatment tank. In the computer-readable storage medium storing the substrate processing program for processing the substrate, the setting is made to the boiling point at which the concentration of the processing liquid to be changed becomes the saturated concentration when the concentration of the processing liquid to process the substrate is changed. When the temperature can be changed and the concentration of the processing liquid for processing the substrate is changed , the set temperature is changed , a predetermined amount of the processing liquid is discharged from the processing tank, and saturation at the changed set temperature is performed. It was decided to replenish the treatment tank with the treatment liquid having a concentration.

  ADVANTAGE OF THE INVENTION According to this invention, the density | concentration of the process liquid which processes a board | substrate with a processing tank can be maintained, and a board | substrate can be processed favorably.

Cross-sectional explanatory drawing which shows a substrate processing apparatus. The flowchart which shows a substrate processing program. Cross-sectional explanatory drawing which shows a substrate processing method typically. Cross-sectional explanatory drawing which shows a substrate processing method typically. Cross-sectional explanatory drawing which shows a substrate processing method typically. Cross-sectional explanatory drawing which shows a substrate processing method typically. Cross-sectional explanatory drawing which shows a substrate processing apparatus. Cross-sectional explanatory drawing which shows a substrate processing apparatus.

  A specific configuration of a substrate processing apparatus, a substrate processing method, and a substrate processing program according to the present invention will be described below with reference to the drawings.

  As shown in FIG. 1, the substrate processing apparatus 1 includes a processing tank 2, a substrate transport means 3, a processing liquid circulation means 4, a processing liquid heating means 5, a processing liquid discharge means 6, a processing liquid replenishing means 7, and a set temperature changing means. 8 and control means 9. Here, the processing tank 2 processes the substrate 10 with the stored processing liquid. The substrate transfer means 3 carries the substrate 10 into the processing tank 2 and carries the substrate 10 out of the processing tank 2. The processing liquid circulation means 4 circulates the processing liquid stored in the processing tank 2. The processing liquid heating unit 5 heats the processing liquid stored in the processing tank 2. The processing liquid discharge means 6 discharges the processing liquid stored in the processing tank 2 from the processing tank 2 to the outside. The processing liquid replenishing means 7 replenishes the processing tank 2 with a new processing liquid. The set temperature changing means 8 sets the temperature of the processing liquid stored in the processing tank 2 to be changeable. The control means 9 controls each means 3-8.

  The treatment tank 2 forms an overflow tank 12 at the outer peripheral edge of the storage tank 11 having an open upper end. The storage tank 11 has a treatment liquid inlet / outlet 13 formed at the bottom. The overflow tank 12 has a processing liquid outlet 14 formed at the bottom. Between the treatment liquid inlet / outlet 13 and the treatment liquid outlet / outlet 14, a treatment liquid circulation means 4 is provided. A treatment liquid discharge means 6 is provided at the treatment liquid inlet / outlet 13. The overflow tank 12 is provided with a processing liquid replenishing means 7.

  The processing tank 2 stores the processing liquid in the storage tank 11 and processes the substrate 10 carried into the storage tank 11 by the substrate transport means 3 with the processing liquid. A part of the processing liquid stored in the storage tank 11 overflows from the storage tank 11 and flows into the overflow tank 12, and then flows again from the overflow tank 12 into the storage tank 11 by the processing liquid circulation means 4.

  The substrate transfer means 3 has four substrate holders 16 attached horizontally to the lower end of a vertically movable transfer arm 15. The substrate transfer means 3 holds a plurality of substrates 10 in parallel in a vertical state by a plurality of (for example, 50) grooves 17 formed on the upper surface of the substrate holder 16. A lift mechanism 18 is connected to the transfer arm 15. The elevating mechanism 18 is connected to the control means 9 and is controlled to be raised and lowered by the control means 9.

  The substrate transfer means 3 carries the substrate 10 into the processing tank 2 (storage tank 11) by lowering the substrate holding body 16 by the lifting mechanism 18 in a state where the substrate 10 is held by the substrate holding body 16, and performs processing. The substrate 10 is immersed in the processing liquid stored in the tank 2 to process the substrate 10, and the substrate holder 16 is lifted by the lifting mechanism 18 after the processing, whereby the substrate 10 is unloaded from the processing tank 2.

  The treatment liquid circulation means 4 forms a circulation channel 19 between the treatment liquid outlet 14 of the overflow tank 12 and the treatment liquid inlet / outlet 13 of the storage tank 11, and a pump 20, a heater 21 and a filter are provided in the circulation channel 19. 22 is provided. The pump 20 and the heater 21 are connected to the control means 9 and are driven and controlled by the control means 9.

  The processing liquid circulating means 4 sucks the processing liquid from the processing liquid outlet 14 of the overflow tank 12 by the pump 20 and supplies the processing liquid to the processing liquid inlet / outlet 13 of the storage tank 11 through the heater 21 and the filter 22. Thereby, the processing liquid circulation means 4 circulates the processing liquid stored in the processing tank 2 and stirs and mixes the chemical liquid (for example, phosphoric acid) and the diluting liquid (for example, pure water). The concentration of the diluted processing solution is kept uniform.

  The treatment liquid heating means 5 is provided with a heater 23 on the outer periphery of the storage tank 11 and a temperature sensor 24 inside the storage tank 11. The heater 23 and the temperature sensor 24 are connected to the control means 9, and the drive control of the heater 23 is performed by the control means 9, and the liquid temperature of the processing liquid inside the storage tank 11 detected by the temperature sensor 24 is controlled. Input to means 9.

  The treatment liquid heating means 5 measures the liquid temperature of the treatment liquid stored in the storage tank 11 with the temperature sensor 24, and the treatment liquid is heated to, for example, 110 ° C. or higher by the heater 23 so that the temperature set by the set temperature changing means 8 is obtained. Heat to. The processing liquid heating means 5 boils the processing liquid inside the storage tank 11 at the temperature set by the set temperature changing means 8 and sets the concentration of the processing liquid to the saturated concentration of the processing liquid at the set temperature (boiling point). For example, when the set temperature is 120 ° C., the treatment liquid is boiled at 120 ° C., so that the concentration of the treatment liquid is 68%. When the set temperature is 160 ° C., the treatment liquid is boiled at 160 ° C. Thus, the concentration of the treatment liquid is set to 85%.

  The processing liquid discharge means 6 is connected to the drain 26 via the discharge flow path 25 at the treatment liquid inlet / outlet 13 of the storage tank 11, and a flow rate regulator 27 is connected to the middle of the discharge flow path 25. Note that the upstream end of the discharge channel 25 also serves as the downstream end of the circulation channel 19. The flow rate regulator 27 is connected to the control means 9 and is controlled to open and close and the flow rate is controlled by the control means 9.

  The processing liquid discharge means 6 stores a predetermined amount of processing liquid adjusted by the flow rate regulator 27 in a state where the processing liquid circulation means 4 is stopped when the processing liquid stored in the processing tank 2 deteriorates. Then, the liquid is discharged from the treatment liquid inlet / outlet 13 to the drain 26.

  The treatment liquid replenishing means 7 connects a chemical liquid supply source 28 for supplying a chemical liquid and a diluent supply source 29 for supplying a diluent to a replenishing tank 30 via flow regulators 31 and 32, respectively. The flow rate adjusters 31 and 32 are connected to the control means 9, and the opening and closing control and the flow rate control are performed by the control means 9.

  Further, the processing liquid replenishing means 7 has an upstream end and a downstream end of the circulation flow path 33 connected to the replenishment tank 30, and a pump 34 and a heating means 35 (heater) are provided in the middle of the circulation flow path 33. Yes. The pump 34 and the heating means 35 are connected to the control means 9 and are driven and controlled by the control means 9. The heating means 35 heats the treatment liquid, that is, the chemical liquid and the dilution liquid.

  Further, the processing liquid replenishing means 7 connects the upstream end of the supply flow path 36 to the replenishment tank 30, and a flow rate regulator 37 is provided in the middle of the supply flow path 36, and the downstream end of the supply flow path 36 is provided. It is connected to the overflow tank 12 of the processing tank 2. The flow rate regulator 37 is connected to the control means 9 and is controlled to open and close and the flow rate is controlled by the control means 9. In addition, the upstream end of the supply channel 36 also serves as the downstream end of the circulation channel 33.

  The processing liquid replenishing means 7 supplies the chemical liquid having the flow rate adjusted by the flow rate adjuster 31 from the chemical liquid supply source 28 to the replenishing tank 30, and the dilution liquid having the flow rate adjusted by the flow rate adjuster 32 from the diluent supply source 29. Supply to replenishing tank 30. Further, the pump 34 and the heating means 35 are driven to circulate the chemical solution and the dilution solution inside the replenishing tank 30 through the circulation channel 33, and the chemical solution and the dilution solution are stirred and mixed, so that the chemical solution is diluted with the dilution solution. While maintaining the concentration of the diluted processing liquid to be uniform, the temperature of the processing liquid is maintained at a predetermined temperature. Further, a predetermined amount of the processing liquid adjusted by the flow rate regulator 37 is supplied from the supply channel 36 to the overflow tank 12 of the processing tank 2 while the pump 34 and the heating means 35 are stopped. As a result, the processing liquid replenishing means 7 supplies the processing liquid having a predetermined concentration obtained by diluting the chemical liquid having the flow rate adjusted by the flow rate regulator 31 with the diluent having the flow rate adjusted by the flow rate regulator 32 from the replenishing tank 30 to the processing tank Refill to 2.

  The set temperature changing means 8 is means for changing the set temperature at which the processing liquid is boiled, and a rotary type analog input component, a switch type digital input component, or the like can be used. The set temperature changing means 8 is not limited to the case where the set temperature for boiling the processing liquid can be directly set, but the concentration of the processing liquid may be set. When setting the concentration of the treatment liquid, the boiling point at which the set concentration becomes the saturated concentration is obtained by the set temperature changing means 8 or the control means 9, and the boiling point is set as the set temperature.

  The set temperature changing means 8 notifies the control means 9 of the set temperature, and the control means 9 controls each means (the processing liquid circulation means 4, the processing liquid heating means 5, the processing liquid replenishing means 7, etc.) based on the set temperature. Let me control.

  The control means 9 comprises a computer and controls the substrate processing apparatus 1 according to the substrate processing program stored in the computer-readable storage medium 38 to process the substrate 10. The storage medium 38 may be any medium that can store various programs such as a substrate processing program. Even if it is a semiconductor memory type storage medium such as a ROM or RAM, a disk type storage medium such as a hard disk or CD-ROM. It may be.

  In the substrate processing program, as shown in FIG. 2, the substrate loading process, the substrate processing process, and the substrate unloading process are repeatedly executed to process the substrate 10 (see FIG. 1).

  Here, in the substrate carrying-in process, the substrate processing apparatus 1 controls the elevating mechanism 18 of the substrate transfer means 3 by the control means 9 to lower the transfer arm 15 and to hold the substrate 10 held by the substrate holder 16 in the processing tank. 2 (into storage tank 11).

  Further, in the substrate processing step, the substrate processing apparatus 1 controls the lifting mechanism 18 of the substrate transfer means 3 by the control means 9, stops the lifting and lowering of the transfer arm 15 for a predetermined time, and adds the substrate to the processing liquid stored in the storage tank 11. Immerse 10 for a predetermined time. Thereby, the substrate 10 is processed with the processing liquid.

  In the substrate unloading process, the substrate processing apparatus 1 controls the elevating mechanism 18 of the substrate transfer means 3 by the control means 9 to raise the transfer arm 15 and the substrate 10 held by the substrate holder 16 to the processing tank 2. (Outside storage tank 11)

  In the substrate processing program, when the substrate 10 is processed by repeatedly performing the substrate carrying-in process, the substrate processing process, and the substrate carrying-out process, a part of the processing liquid is replaced. Note that the replacement of the processing liquid may be performed as appropriate based on the number of processing times, the number of processing sheets, the processing time of the substrate 10, or a change in the concentration or composition of the processing liquid.

  In the substrate processing program, as shown in FIGS. 2 and 3, a processing liquid generation step is executed. In this processing liquid generating step, the substrate processing apparatus 1 controls the processing liquid replenishing means 7 based on the set temperature changing means 8 by the control means 9 to generate a processing liquid. That is, the substrate processing apparatus 1 obtains the saturated concentration of the processing liquid at the set temperature from the set temperature set by the set temperature changing means 8, adjusts the flow rate regulators 31 and 32 at the ratio to the concentration, and supplies the chemical solution The chemical solution is supplied from the source 28 to the replenishing tank 30, and the diluent is supplied from the diluent supply source 29 to the replenishing tank 30. Further, the substrate processing apparatus 1 drives the heating unit 35 and the pump 34 so as to reach the set temperature set by the set temperature changing unit 8 with the flow rate regulator 37 closed. If the set temperature is higher than the boiling point of the chemical solution or diluent, the treatment solution is heated to the set temperature and boiled to evaporate part of the chemical solution or diluent with a lower boiling point than the set temperature. As a result, the concentration of the processing solution increases or decreases. For this reason, it is desirable to supply an amount of a chemical solution or diluting solution that compensates in advance for the amount evaporated by boiling of the processing solution.

  Thereby, in the treatment liquid generation step, the chemical solution and dilution liquid supplied to the replenishing tank 30 are circulated through the circulation channel 33, and the chemical liquid and the dilution liquid are stirred and mixed to dilute the chemical liquid with the dilution liquid. The concentration of the liquid is set to the saturated concentration at the set temperature, and the temperature of the treatment liquid is held at the set temperature. The treatment liquid (chemical solution and dilution liquid) is heated to the set temperature by the heating means 35, so that the treatment tank 2 is refilled in the treatment tank 2 in the subsequent treatment liquid replenishment step. A temperature drop can be prevented.

  Next, the substrate processing program executes a processing liquid discharge step as shown in FIGS. In this processing liquid discharging step, the substrate processing apparatus 1 controls the processing liquid discharging means 6 by the control means 9 and supplies the processing liquid to the processing liquid inlet / outlet 13 of the storage tank 11 by a predetermined flow rate adjusted by the flow rate regulator 27. To drain 26.

  Next, as shown in FIGS. 2 and 5, the substrate processing program executes a processing liquid replenishment step. In this processing liquid replenishing step, the substrate processing apparatus 1 controls the processing liquid circulating means 4, the processing liquid heating means 5 and the processing liquid replenishing means 7 on the basis of the set temperature changing means 8 by the control means 9, so that the processing liquid is supplied. Replenish processing tank 2 (storage tank 11). That is, the substrate processing apparatus 1 supplies the processing liquid having the flow rate adjusted by the flow regulator 37 from the replenishing tank 30 to the processing tank 2 (overflow tank 12) so as to be the same amount as the processing liquid discharged in the processing liquid discharging step. To replenish. Further, the substrate processing apparatus 1 drives the heater 21 and the heater 23 and drives the pump 20 so as to reach the set temperature set by the set temperature changing means 8 with the flow rate regulator 27 closed.

  Thereby, in the processing liquid replenishment step, the processing liquid supplied from the replenishing tank 30 to the processing tank 2 is circulated through the circulation channel 19 to mix the processing liquid, and the concentration of the processing liquid is set to the saturation concentration at the set temperature. At the same time, the temperature of the processing liquid is maintained at the set temperature. In addition, the process liquid production | generation process should just be completed before this process liquid replenishment process. Therefore, the process liquid generation process may be performed simultaneously with the substrate carry-in process, the substrate process, the substrate carry-out process, and the process liquid discharge process.

  Thereafter, as shown in FIG. 2, the substrate processing program executes the substrate loading process, the substrate processing process, and the substrate unloading process to process the substrate 10.

  In the substrate processing program, as shown in FIG. 6, before and after the processing of the substrate 10 (during standby) and during the processing of the substrate 10 (during processing), the control liquid 9 is processed by the control unit 9. In addition, while the flow rate regulator 27 is closed by controlling the treatment liquid heating means 5, the heater 21 and the heater 23 are driven to reach the set temperature set by the set temperature changing means 8, and the pump 20 is turned on. Driven. As a result, the concentration of the processing liquid is set to the saturated concentration at the set temperature, and the temperature of the processing liquid is held at the set temperature.

  In the substrate processing apparatus 1, by changing the set temperature (boiling point) of the processing liquid with the set temperature changing means 8, the concentration (saturated concentration) of the processing liquid for processing the substrate 10 can be changed.

  When the set temperature of the processing liquid is changed by the set temperature changing means 8, the substrate processing apparatus 1 performs the above-described processing liquid generation process, the processing liquid discharge process, and the processing liquid replenishment process, then the substrate carry-in process, the substrate processing process. The substrate unloading process is performed. When the set temperature is changed, all the processing liquids may be discharged from the processing tank 2 in the processing liquid discharging step, and all the processing liquids may be replaced.

  In the substrate processing apparatus 1, the set temperature (saturated concentration) of the processing liquid can be changed by the set temperature changing means 8, and when the set temperature is changed, a predetermined amount of the processing liquid is discharged from the processing tank 2. Then, the treatment tank 2 is replenished with a treatment liquid having a concentration that becomes a saturated concentration at the changed set temperature.

  And in the said substrate processing apparatus 1, the chemical | medical solution is previously diluted with the dilution liquid in the replenishing tank 30, and the processing liquid which made the density | concentration which becomes the saturated density | concentration in the changed preset temperature is produced | generated, The processing tank 2 is replenished from the replenishing tank 30.

  The replenishment of the treatment liquid is not limited to the case of replenishing the treatment liquid generated by diluting the chemical liquid with the diluent in advance, and each of the chemical liquid and the dilution liquid is adjusted so that the concentration becomes a saturated concentration at the changed set temperature. The treatment tank 2 may be replenished, or the treatment tank 2 may be replenished while the chemical solution is diluted with a diluent so as to have a concentration that becomes a saturated concentration at the changed set temperature.

  For example, in the substrate processing apparatus 1 ′ shown in FIG. 7, as the processing liquid supplementing means 7 ′, the chemical liquid supply source 28 and the diluting liquid supply source 29 are added to the overflow tank 12 of the processing tank 2 and the flow rate regulators 31, 32 and the heating means. They are connected via 39 and 40, respectively. The flow rate regulators 31, 32 and the heating means 39, 40 are connected to the control means 9 ′, and are driven and controlled by the control means 9 ′ according to the substrate processing program stored in the storage medium 38 ′. In the substrate processing apparatus 1 ′ shown in FIG. 7, the members having the same functions as those of the substrate processing apparatus 1 shown in FIG.

  Then, the substrate processing program executes the processing liquid discharge process and the processing liquid replenishment process without executing the processing liquid generation process shown in FIG.

  In the processing liquid replenishing step, the control means 9 ′ controls the processing liquid replenishing means 7 ′ based on the set temperature changing means 8 to heat the chemical liquid at the flow rate adjusted by the flow rate regulator 31 from the chemical liquid supply source 28. In addition to heating directly to the overflow tank 12 by heating to a predetermined temperature, the diluent having a flow rate adjusted by the flow rate regulator 32 from the diluent supply source 29 is heated to a predetermined temperature by the heating means 40 and directly supplied to the overflow tank 12 To do.

  At this time, the flow rate of the chemical solution is set so that the treatment liquid (chemical solution and dilution solution) supplied to the overflow tank 12 has a concentration that becomes a saturated concentration at the set temperature set (changed) by the set temperature changing means 8. The flow rate of the diluent is adjusted by the flow rate adjusters 31 and 32.

  Thereby, in the substrate processing apparatus 1 ′, the chemical tank and the diluting liquid are replenished to the processing tank 2 (the overflow tank 12), respectively, so that the concentration becomes the saturated concentration at the changed set temperature.

  In addition, by heating a chemical | medical solution and a dilution liquid with the heating means 39 and 40, when the chemical | medical solution and a dilution liquid are newly replenished to the processing tank 2, it suppresses that the temperature of a processing liquid falls inside the processing tank 2. be able to.

  Further, in the substrate processing apparatus 1 ″ shown in FIG. 8, as the processing liquid replenishing means 7 ″, the chemical liquid supply source 28 and the diluting liquid supply source 29 are added to the mixer 41, and the flow rate adjusters 31, 32 and the heating means 39, 40 are added. The mixer 41 is connected to the overflow tank 12 of the processing tank 2. The flow rate regulators 31, 32 and the heating means 39, 40 are connected to the control means 9 "and are driven and controlled by the control means 9" according to the substrate processing program stored in the storage medium 38 ". In the substrate processing apparatus 1 ″ shown in FIG. 1, the members having the same functions as those of the substrate processing apparatus 1, 1 ′ shown in FIG. 1 or FIG.

  Then, the substrate processing program executes the processing liquid discharge process and the processing liquid replenishment process without executing the processing liquid generation process shown in FIG.

  In the processing liquid replenishment step, the control means 9 "controls the processing liquid replenishing means 7" based on the set temperature changing means 8 to heat the chemical liquid at the flow rate adjusted by the flow rate regulator 31 from the chemical liquid supply source 28. And heated to a predetermined temperature and supplied to the mixer 41, and the diluent at a flow rate adjusted by the flow rate regulator 32 from the diluent supply source 29 is heated to a predetermined temperature by the heating means 40 and supplied to the mixer 41, By mixing the chemical solution and the diluent with the mixer 41, the chemical solution is supplied from the mixer 41 to the overflow tank 12 while being diluted with the diluent.

  At this time, the flow rate of the chemical solution is set so that the treatment liquid (chemical solution and dilution solution) supplied to the overflow tank 12 has a concentration that becomes a saturated concentration at the set temperature set (changed) by the set temperature changing means 8. The flow rate of the diluent is adjusted by the flow rate adjusters 31 and 32.

  As a result, the substrate processing apparatus 1 ″ replenishes the processing bath 2 while diluting the chemical solution with the diluent so that the concentration becomes the saturated concentration at the changed set temperature.

  In the substrate processing apparatus 1 ′, 1 ″ shown in FIG. 7 or FIG. 8, the chemical solution and the dilution liquid may be heated to the set temperature by the heating means 39, 40. However, the set temperature is the boiling point of the chemical solution or the dilution liquid. If the temperature is higher than the set temperature, the chemical solution or diluent having a lower boiling point than the set temperature is heated at a temperature lower than the set temperature and the boiling point, while the chemical solution or diluent having a higher boiling point than the set temperature is heated. In this case, it is desirable to heat the chemical solution or diluent having a boiling point lower than the preset temperature immediately before dilution, and the chemical solution or diluent having a boiling point higher than the preset temperature Since the temperature is lowered by the addition of a chemical solution or a diluent having a boiling point lower than the set temperature, it is desirable to heat at a temperature higher than the set temperature so as to compensate for the lowered temperature. Diluted solution in treatment tank 2 By heating to the set temperature after boiling and boiling, the chemical solution or diluent having a boiling point lower than the set temperature evaporates, and the concentration of the generated processing solution increases or decreases. It is desirable to supply an amount of a chemical solution or a diluting solution that has been compensated in advance.

  In the substrate processing apparatus 1 ′, 1 ″ shown in FIG. 7 or FIG. 8, since the chemical solution supply source 28 and the dilution solution supply source 29 are provided with heating means 39, 40, respectively, the chemical solution and the dilution solution are respectively supplied. For example, when phosphoric acid is used as a chemical solution and pure water is used as a diluting solution and the set temperature is 120 ° C., pure water is heated at 80 ° C. and phosphoric acid is heated to 120 ° C. By heating at a higher temperature, the amount of disappearance due to evaporation of pure water can be reduced, and the temperature drop when added to the treatment liquid can also be reduced.

  As described above, in the substrate processing apparatus 1, 1 ′, 1 ″, the set temperature changing means 8 can change the set temperature (saturated concentration) of the processing liquid, and the set temperature is changed. Then, a predetermined amount of the processing liquid is discharged from the processing tank 2, and the processing tank 2 is replenished with a processing liquid having a concentration that becomes a saturated concentration at the changed set temperature.

  Therefore, in the substrate processing apparatus 1, 1 ', 1 ", even if the processing liquid is repeatedly discharged and replenished, an increase in the concentration of the processing liquid due to the replenishment of the processing liquid is suppressed, and the substrate 10 is processed in the processing tank 2. The concentration of the processing liquid can be maintained near the desired concentration, and the substrate 10 can be processed satisfactorily.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Processing tank 5 Process liquid heating means 6 Process liquid discharge means 7 Process liquid replenishment means 8 Set temperature change means 9 Control means
10 Board

Claims (18)

In a substrate processing apparatus for processing a substrate by immersing a substrate in the processing solution by setting the concentration of the processing solution to a saturated concentration at the set temperature by boiling a processing solution obtained by diluting a chemical solution with a diluent at a set temperature. ,
A treatment tank for treating the substrate with the treatment liquid;
Treatment liquid heating means for heating the treatment liquid stored in the treatment tank to the set temperature;
Treatment liquid discharge means for discharging the treatment liquid from the treatment tank;
Treatment liquid replenishing means for replenishing the treatment liquid to the treatment tank;
A set temperature changing means for changing the set temperature to a boiling point at which the concentration of the treatment liquid to be changed when the concentration of the treatment liquid for processing the substrate is changed to a saturated concentration ;
Control means for controlling the treatment liquid discharge means and the treatment liquid replenishment means;
Have
The control means
When changing the concentration of the processing liquid for processing the substrate, the processing liquid discharging means discharges a predetermined amount of the processing liquid from the processing tank, and the saturation concentration at the set temperature changed by the set temperature changing means The substrate processing apparatus is controlled to replenish the processing tank with a concentration of a certain amount from the processing liquid replenishing means to the processing tank. 2. The substrate processing apparatus according to claim 1, wherein the set temperature changing means sets the set temperature to a boiling point where the set concentration becomes a saturated concentration by setting the concentration of the processing solution to be changed. .   The treatment liquid replenishing means replenishes the treatment tank with the treatment liquid that has been diluted in advance with the diluent and has a concentration that becomes a saturated concentration at the set temperature changed by the set temperature changing means. The substrate processing apparatus according to claim 1, wherein:   The treatment liquid replenishing means replenishes the treatment tank with the chemical liquid and the diluting liquid so that the concentration becomes a saturated concentration at the set temperature changed by the set temperature changing means. The substrate processing apparatus according to claim 1 or 2.   The processing liquid replenishing means replenishes the processing tank while diluting the chemical liquid with the diluting liquid so that the concentration becomes a saturated concentration at the set temperature changed by the set temperature changing means. The substrate processing apparatus of Claim 1 or Claim 2.   The substrate processing apparatus according to claim 1, wherein the processing liquid replenishing unit includes a heating unit that preheats the chemical solution and / or the diluent.   The substrate processing apparatus according to claim 6, wherein the control unit heats the diluted solution by the heating unit immediately before diluting the chemical solution with the diluted solution.   The substrate processing apparatus according to claim 6, wherein the control unit heats the chemical solution by the heating unit to a temperature that compensates for a temperature that decreases due to the addition of the diluent.   The substrate processing apparatus according to claim 1, wherein the control unit dilutes the chemical solution with an amount of the diluent that compensates for an amount evaporated by boiling of the diluent. The processing solution obtained by diluting the chemical solution with the diluting solution is boiled at a set temperature to set the concentration of the processing solution to the saturated concentration at the set temperature, and the substrate is immersed in the processing solution stored in a processing tank to process the substrate. In the substrate processing method to be performed,
When changing the concentration of the processing liquid for processing the substrate, the set temperature can be changed to a boiling point at which the concentration of the processing liquid to be changed becomes a saturated concentration, and when changing the concentration of the processing liquid for processing the substrate, The substrate is characterized in that the set temperature is changed , a predetermined amount of the processing liquid is discharged from the processing tank, and the processing tank is replenished with the processing liquid having a saturation concentration at the changed set temperature. Processing method.   The replenishment of the treatment liquid is characterized in that the treatment liquid is preliminarily diluted with the diluent and the treatment tank is replenished with the treatment liquid having a concentration that becomes a saturated concentration at the changed set temperature. 10. The substrate processing method according to 10.   11. The substrate according to claim 10, wherein the replenishment of the processing liquid is performed by replenishing the processing tank with the chemical liquid and the diluting liquid so that the concentration becomes a saturated concentration at the changed set temperature. Processing method.   The replenishment of the treatment liquid is performed by replenishing the treatment tank while diluting the chemical liquid with the diluent so that the concentration becomes a saturated concentration at the changed set temperature. Substrate processing method.   The substrate processing method according to claim 10, wherein the chemical solution or / and the dilution solution are heated in advance.   The substrate processing method according to claim 14, wherein the diluent is heated immediately before the chemical is diluted with the diluent.   The substrate processing method according to claim 14, wherein the chemical solution is heated to a temperature that compensates for a temperature that decreases due to the addition of the diluent.   17. The substrate processing method according to claim 10, wherein the chemical solution is diluted with an amount of the diluted solution that compensates for an amount of evaporation due to boiling of the diluted solution. The processing solution obtained by diluting the chemical solution with the diluting solution is boiled at a set temperature to set the concentration of the processing solution to the saturated concentration at the set temperature, and the substrate is immersed in the processing solution stored in a processing tank to process the substrate. In a computer-readable storage medium storing a substrate processing program to be performed,
When changing the concentration of the processing liquid for processing the substrate, the set temperature can be changed to a boiling point at which the concentration of the processing liquid to be changed becomes a saturated concentration, and when changing the concentration of the processing liquid for processing the substrate, The substrate is characterized in that the set temperature is changed , a predetermined amount of the processing liquid is discharged from the processing tank, and the processing tank is replenished with the processing liquid having a saturation concentration at the changed set temperature. A computer-readable storage medium storing a processing program.

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