WO2023214504A1

WO2023214504A1 - Electronic component

Info

Publication number: WO2023214504A1
Application number: PCT/JP2023/015175
Authority: WO
Inventors: 真也立花
Original assignee: 株式会社村田製作所
Priority date: 2022-05-02
Filing date: 2023-04-14
Publication date: 2023-11-09

Abstract

The present disclosure provides an electronic component in which variations of the capacitance of a capacitor in a manufacturing process are reduced while suppressing the proportion of the area occupied by the capacitor in the electronic component. A filter device (100) as an example of the electronic component according to the present disclosure comprises: an insulator (3) that has a pair of main surfaces opposing each other and a side surface that connects the main surfaces; and a capacitor (C1) in which elements constituted by electrodes respectively formed in at least three layers in the insulator (3) are connected in series. In the capacitor (C1), electrode patterns (5f to 5h) formed in the respective layers are disposed in positions overlapping each other when viewed in plan from a stacking direction, and at least one wiring pattern (6h) is electrically connected to the electrode pattern (5h) formed in at least one layer. At least a portion of the wiring pattern (6h) extends beyond a side of the electrode pattern (5g) that overlaps thereon when viewed in plan from the stacking direction.

Description

electronic components

The present disclosure relates to electronic components.

An electronic component is known that is an integrated filter device in which an inductor (coil) and a capacitor (capacitor) are provided inside an insulator made by laminating a plurality of insulator layers. As an example of a filter device, Japanese Unexamined Patent Publication No. 2013-21449 (Patent Document 1) describes a filter device in which an inductor and a capacitor are built into an insulator on which external electrodes are formed. In this filter device, when the insulator is viewed from above, the inductor is stacked on the capacitor.

Japanese Patent Application Publication No. 2013-21449

When realizing a filter device using small parts, it is necessary to design each electrode to be small while ensuring the desired capacitance in the part constituting the capacitor. Factors that change the capacitance of a capacitor in the process of manufacturing components include the area of the electrodes and the distance between the electrodes. In particular, factors that cause the area of the electrode to vary include misalignment of the electrode and variations in the dimensions of the electrode. When miniaturizing electronic components, it is desired to have a structure that reduces the variation in capacitance of the capacitor during the manufacturing process while suppressing the area occupied by the capacitor in the electronic component.

Therefore, an object of the present disclosure is to provide an electronic component that can reduce fluctuations in the capacitance of the capacitor during the manufacturing process while suppressing the area occupied by the capacitor in the electronic component.

An electronic component according to an embodiment of the present disclosure includes an insulator having a pair of principal surfaces facing each other and a side surface connecting the principal surfaces, and electrodes formed in each of at least three layers within the insulator. A capacitor in which elements are connected in series. The capacitor is arranged such that electrodes formed on each layer overlap each other when viewed in plan from the stacking direction, and at least one wiring pattern is electrically connected to the electrode formed on at least one layer. Ru. At least a portion of the wiring pattern protrudes from one side of the overlapping electrodes when viewed in plan from the stacking direction.

According to one embodiment of the present disclosure, in a capacitor in which elements constituted by electrodes formed in at least three layers are connected in series, an electrode connected to a wiring pattern protruding from one side of the overlapping electrodes is provided. Therefore, it is possible to reduce the variation in capacitance of the capacitor during the manufacturing process while suppressing the area occupied by the capacitor in the electronic component.

FIG. 1 is a perspective view of a filter device according to an embodiment. FIG. 2 is a side view of a filter device according to an embodiment. FIG. 2 is a circuit diagram of a filter device according to an embodiment. FIG. 1 is an exploded plan view showing the configuration of a filter device according to an embodiment. FIG. 2 is a plan view of an electrode that constitutes a capacitor of a filter device according to an embodiment. FIG. 3 is a plan view of an electrode constituting a capacitor for comparison. 7 is a plan view of an electrode constituting a capacitor according to Modification 1. FIG. FIG. 7 is a plan view of an electrode constituting a capacitor according to a second modification.

Below, a filter device will be described in detail as an example of an electronic component according to an embodiment with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated. Further, the electronic component according to the embodiment is not limited to a filter device.

(Embodiment)
[Structure of filter device]
First, a filter device according to an embodiment will be described with reference to the drawings. FIG. 1 is a perspective view of a filter device 100 according to an embodiment. FIG. 2 is a side view of the filter device 100 according to the embodiment. Here, in FIGS. 1 and 2, the short side direction of the filter device 100 is the X direction, the long side direction is the Y direction, and the height direction is the Z direction.

The filter device 100 is a rectangular parallelepiped-shaped chip component in which two inductors and one capacitor are stacked in the Z direction. The filter device 100 includes an insulator 3 in which a plurality of insulating substrates (insulator layers) on which a conductor pattern of an inductor L1, a conductor pattern of an inductor L2, and an electrode pattern of a capacitor C1 are formed are laminated, as shown in FIGS. 1 and 2. Consists of. Note that the stacking direction of the insulating substrates is the Z direction, and the direction of the arrow indicates the upper layer direction. Further, the insulating substrate is made of, for example, an insulating material containing borosilicate glass as a main component, or an insulating resin such as alumina, zirconia, or polyimide resin. Further, in the insulator 3, the interface between the plurality of insulating substrates may not be clearly defined due to processing such as firing or hardening.

Further, in the filter device 100, an external electrode 4a (first external electrode) and an external electrode 4b (second external electrode) as shown in FIG. 1 are formed on the insulator 3 at two locations in the Y direction. Note that the insulator 3 has a pair of main surfaces facing each other, and the lower main surface in FIG. 1 is the mounting surface, and this surface faces the circuit board. In this embodiment, the lower main surface in FIG. 1 is also referred to as a bottom surface, and the upper main surface in FIG. 1 is also referred to as a top surface.

For the

external electrodes

4a and 4b, not only are electrode patterns formed on the bottom surface of the insulator 3, but also electrode patterns are formed on the side surfaces connecting the main surfaces of the insulator 3. When the insulator 3 is viewed from the short side (XZ plane), the

external electrodes

4a and 4b are U-shaped. Therefore, the electrode patterns of the external electrodes 4a provided on the opposing side surfaces of the insulator 3 and the bottom surface of the insulator 3 are at the same potential. Similarly, the electrode patterns of the external electrodes 4b provided on the opposing side surfaces of the insulator 3 and the bottom surface of the insulator 3 are at the same potential.

It has been explained that the external electrode 4a and the external electrode 4b are both provided with electrode patterns on three sides of the insulator 3. However, the present invention is not limited thereto, and it is sufficient that both the external electrode 4a and the external electrode 4b have an electrode pattern on at least one surface of the insulator 3. For example, the external electrode 4a is provided with an electrode pattern on two sides of the long side (YZ plane) of the insulator 3, and the external electrode 4b is provided with an electrode pattern on one side of the short side (XZ plane) of the insulator 3. The electrode pattern may be provided only on the surface.

The conductor pattern 1a of the inductor L1 and the external electrode 4a are electrically connected on the side surface of the insulator 3 via the wiring pattern 11a, as shown in FIG. Although not shown in FIG. 1, the conductor pattern 1c of the inductor L1 and the external electrode 4b are electrically connected on the side surface of the insulator 3 via the wiring pattern 11c (see FIG. 4). Further, the conductor pattern 2d of the inductor L2 and the external electrode 4b are electrically connected on the side surface of the insulator 3 via the wiring pattern 12d, although not shown in FIG. 1 (see FIG. 4).

As shown in FIG. 1, the electrode pattern 5f of the capacitor C1 is electrically connected to the conductor pattern 2e of the inductor L2 via a via conductor 34 (interlayer conductor). The electrode pattern 5h of the capacitor C1 and the external electrode 4a are electrically connected on the side surface of the insulator 3 via the wiring pattern 6h, as shown in FIG. The electrode pattern 5h and the external electrode 4a are also electrically connected on the bottom surface of the insulator 3 via the via conductor 35 and the via conductor 37 (see FIG. 4).

As shown in FIG. 2, the inductor L1 has a plurality of

conductor patterns

1a, 1b, and 1c stacked in parallel to the main surface of the insulator 3. The conductor pattern 1a and the conductor pattern 1b are electrically connected by a via conductor 31, and the conductor pattern 1b and the conductor pattern 1c are electrically connected by a via conductor 32. As shown in FIG. 2, the inductor L2 has a plurality of

conductor patterns

2d and 2e stacked below the inductor L1 in parallel to the main surface of the insulator 3. The conductor pattern 2d and the conductor pattern 2e are electrically connected through a via conductor 33.

As shown in FIG. 2, the capacitor C1 has a plurality of

electrode patterns

5f, 5g, and 5h stacked on top of each other with an insulating layer interposed therebetween below the inductor L2. That is, the capacitor C1 has a structure in which two capacitor elements constituted by

electrode patterns

5f, 5g, and 5h formed in each of three layers are connected in series. The capacitor C1 is provided in a region where there is little overlap with the inductor L1 and the inductor L2 when viewed in plan from the stacking direction. Note that the inductor L1 and the inductor L2 are provided so as to overlap when viewed in plan from the stacking direction. Further, the inductor L2 and the capacitor C1 are connected in series within the insulator 3 to form an LC series circuit.

FIG. 3 is a circuit diagram of the filter device 100 according to the embodiment. The filter device 100 includes a first terminal P1, an inductor L1 connected to the first terminal P1, an inductor L2 connected in parallel to the inductor L1 and the first terminal P1, and a capacitor C1 connected in series with the inductor L2. and a second terminal P2 connected to the inductor L1 and the capacitor C1. Note that the first terminal P1 corresponds to the external electrode 4b shown in FIG. 1, and the second terminal P2 corresponds to the external electrode 4a shown in FIG.

Note that the inductor L1 and the inductor L2 are magnetically coupled to each other (coupling coefficient k). As a result, mutual inductance M is generated between inductor L1 and inductor L2. Of course, the filter device 100 is not limited to the case where the inductor L1 and the inductor L2 are magnetically coupled to each other, and may have a configuration where the inductor L1 and the inductor L2 are not magnetically coupled to each other. Further, when a current flows from the wiring pattern 11c, the direction in which the magnetic field is generated in the inductor L1 and the direction in which the magnetic field is generated in the inductor L2 are not limited to the opposite directions as shown in FIG. 1, but may be the same direction. good.

[Exploded plan view of filter device]
Next, the structure of each layer will be explained using an exploded plan view. FIG. 4 is an exploded plan view showing the configuration of the filter device 100 according to the embodiment. First, as shown in FIG. 4, each of conductor patterns 1a to 1c, 2d, 2e,

wiring patterns

11a, 11c, 12d, 6h, 7h, 8h to 8j, 9i, 9j, and

electrode patterns

5f, 5g, 5h are , are formed on the insulating substrates 3a to 3j by a printing method.

A conductor pattern 1a that constitutes a part of the inductor L1 is formed on the insulating substrate 3a. The conductor pattern 1a is formed so as to extend approximately 3/4 of the way clockwise from the upper left side in the figure of the insulating substrate 3a. The starting end of the conductor pattern 1a is electrically connected to the external electrode 4a via the wiring pattern 11a. A connecting portion 31a connected to the via conductor 31 is provided near the end of the conductive pattern 1a.

A conductor pattern 1b that constitutes a part of the inductor L1 is formed on the insulating substrate 3b. The conductor pattern 1b is formed so as to extend approximately 3/4 of the way clockwise from the lower left side in the figure of the insulating substrate 3b. A connecting portion 31b connected to the via conductor 31 is provided near the starting end of the conductive pattern 1b. A connection portion 32b connected to the via conductor 32 is provided near the end of the conductor pattern 1b.

A conductor pattern 1c forming a part of the inductor L1 is formed on the insulating substrate 3c. The conductor pattern 1c is formed so as to extend approximately 3/4 of the way clockwise from the lower right side in the figure of the insulating substrate 3c. A connecting portion 32c that connects to the via conductor 32 is provided near the starting end of the conductor pattern 1c. The terminal end of the conductor pattern 1c is electrically connected to the external electrode 4b via the wiring pattern 11c. The inductor L1 has conductor patterns 1a to 1c connected in series to form a coil with approximately two turns.

A conductor pattern 2d forming a part of the inductor L2 is formed on the insulating substrate 3d. The conductor pattern 2d is formed so as to go around about 3/4 clockwise from the upper right side in the figure of the insulating substrate 3d. The starting end of the conductor pattern 2d is electrically connected to the external electrode 4b via the wiring pattern 12d. A connection portion 33d that connects to the via conductor 33 is provided near the end of the conductor pattern 2d.

A conductor pattern 2e that constitutes a part of the inductor L2 is formed on the insulating substrate 3e. The conductor pattern 2e is formed so as to extend approximately 3/4 of the way clockwise from the upper left side in the figure of the insulating substrate 3e. A connecting portion 33e that connects to the via conductor 33 is provided near the starting end of the conductor pattern 2e. A connection portion 34e connected to the via conductor 34 is provided near the end of the conductor pattern 2e. The inductor L2 has conductor patterns 2e and 2f connected in series to form a coil with about 1.5 turns.

An electrode pattern 5f that constitutes one electrode (first electrode) of the capacitor C1 is formed on the insulating substrate 3f. Since the electrode pattern 5f is provided at a position that does not overlap with the center of the area where the openings of the inductors L1 and L2 overlap when viewed in plan from the stacking direction, it is particularly affected by the magnetic field created by the inductors L1 and L2. The filter device 100 can be realized using small components without interfering with the magnetic field at the center of the opening, which is easily received. The electrode pattern 5f has a connecting portion 34f that connects to the via conductor 34.

An electrode pattern 5g that constitutes one electrode (second electrode) of the capacitor C1 is formed on the insulating substrate 3g. The electrode pattern 5g is provided at a position overlapping the electrode pattern 5f formed on the insulating substrate 3f when viewed in plan from the stacking direction. The area of the electrode pattern 5g is larger than the area of the electrode pattern 5f.

An electrode pattern 5h that constitutes one electrode (third electrode) of the capacitor C1 is formed on the insulating substrate 3h. The electrode pattern 5h is provided at a position overlapping with the electrode pattern 5g formed on the insulating substrate 3g when viewed in plan from the stacking direction. The area of the electrode pattern 5h is smaller than the area of the electrode pattern 5g. The electrode pattern 5h is electrically connected to the external electrode 4a via a wiring pattern 6h. Although the wiring pattern 6h is illustrated as two wirings extending from the long side of the electrode pattern 5h to the external electrode 4a, it may be composed of one wiring or three or more wirings. Further, the wiring pattern 6h has a connecting portion 35h that connects to the via conductor 35.

In the capacitor C1, two capacitor elements constituted by three electrodes are connected in series by arranging the electrode patterns 5f to 5h formed in each of the three layers so as to overlap when viewed from the stacking direction in plan. The structure is as follows. In the capacitor C1, the electrode pattern 5g (the electrode pattern of the second electrode) has a larger electrode area than the electrode pattern 5f (the electrode pattern of the first electrode) and the electrode pattern 5h (the electrode pattern of the third electrode). . Furthermore, at least a portion of the wiring pattern 6h connected to the electrode pattern 5h protrudes from one side of the electrode pattern 5g. By configuring the capacitor C1 in this way, as will be described later, it is possible to suppress the proportion of the area occupied by the capacitor C1 in the filter device 100, and to reduce fluctuations in the capacitance of the capacitor C1 during the manufacturing process.

A wiring pattern 7h and a wiring pattern 8h are further formed on the insulating substrate 3h. The wiring pattern 7h and the wiring pattern 8h partially overlap and are electrically connected. Further, the wiring pattern 8h has a connecting portion 36h that connects to the via conductor 36. The wiring pattern 7h is electrically connected to an external electrode 4b (see FIG. 1) formed on the long side of the insulating substrate 3h. Therefore, the wiring pattern 7h functions as a wiring that electrically connects the external electrode 4b and the wiring pattern 8h.

A wiring pattern 8i and a wiring pattern 9i are formed on the insulating substrate 3i. The wiring pattern 8i is provided at a position overlapping the wiring pattern 8h formed on the insulating substrate 3h when viewed in plan from the stacking direction. The wiring pattern 9i is provided at a position overlapping the wiring pattern 6h formed on the insulating substrate 3h when viewed in plan from the stacking direction. The wiring pattern 8i has a connecting portion 36i that connects to the via conductor 36. The wiring pattern 9i has a connecting portion 35i that connects to the via conductor 35 and a connecting portion 37i that connects to the via conductor 37.

A wiring pattern 8j and a wiring pattern 9j are formed on the insulating substrate 3j. The wiring pattern 8j is provided at a position overlapping the wiring pattern 8i formed on the insulating substrate 3i when viewed in plan from the stacking direction. The wiring pattern 9j is provided at a position overlapping the wiring pattern 9i formed on the insulating substrate 3i when viewed in plan from the stacking direction. The wiring pattern 8j has a connecting portion 36j that connects to the via conductor 36. The wiring pattern 9j has a connecting portion 37j that connects to the via conductor 37.

A connecting portion 37k that connects the external electrode 4a and the via conductor 37, and a connecting portion 36k that connects the external electrode 4b and the via conductor 36 are formed on the insulating substrate 3k. The wiring pattern 6h is not only electrically connected to the side surface of the external electrode 4a, but also electrically connected to the bottom surface of the external electrode 4a via the via conductor 35 and the via conductor 37. As a result, even if the electrical connection is broken in the path passing between the external electrode 4a formed on the side surface of the insulator 3 and the external electrode 4a formed on the bottom surface of the insulator 3, the wiring inside the insulator 3 Electrical connection can be maintained through the path passing through pattern 6h, via conductor 35, and via conductor 37. Of course, if such a redundant configuration is unnecessary, the

wiring patterns

9i, 9j and the via

conductors

35, 37 may not be provided.

The wiring pattern 7h is not only electrically connected to the side surface of the external electrode 4b, but also electrically connected to the bottom surface of the external electrode 4b via the wiring pattern 8h and the via conductor 36. As a result, even if the electrical connection is broken in the path passing between the external electrode 4b formed on the side surface of the insulator 3 and the external electrode 4b formed on the bottom surface of the insulator 3, the wiring inside the insulator 3 Electrical connection can be maintained through the paths passing through

patterns

7h, 8h and via conductor 36. Of course, if such a redundant configuration is unnecessary, the

wiring patterns

7h, 8h to 8j and the via conductor 36 may not be provided.

[Configuration of capacitor C1]
The filter device 100 employs a capacitor C1 having a structure in which two capacitor elements constituted by three electrodes (electrode patterns 5f to 5h) are connected in series. Furthermore, the capacitor C1 is configured such that at least a portion of the wiring pattern 6h connected to the electrode pattern 5h protrudes from one side of the electrode pattern 5g. The configuration of this capacitor C1 will be explained in more detail.

FIG. 5 is a plan view of the electrodes forming the capacitor C1 of the filter device 100 according to the embodiment. FIG. 6 is a plan view of an electrode forming a capacitor to be compared. The capacitor C1 is constructed by arranging the electrode patterns 5f to 5h shown in FIG. This structure has a structure in which a capacitor element C1b including a part of the pattern 6h) and a capacitor element C1b are connected in series. In the capacitor C1,

electrode patterns

5f and 5h with small areas are arranged above and below the electrode pattern 5g with a large area in the stacking direction.

Since the capacitance of a capacitor is determined by the overlapping area of opposing electrodes, in the capacitor element C1a composed of an electrode pattern 5g with a large area and an electrode pattern 5f with a small area, the capacitance is determined by the area of the electrode pattern 5f. . Similarly, in the capacitor element C1b composed of the electrode pattern 5g having a large area and the electrode pattern 5h having a small area (including a part of the wiring pattern 6h), the electrode pattern 5h (including a part of the wiring pattern 6h) Capacity is determined by area.

Therefore, as shown in FIG. 5, even if the electrode pattern 5g has a large area like the electrode pattern 51g due to dimensional variations due to the manufacturing process, the capacitance of the capacitor C1 does not change. On the other hand, if the

electrode patterns

5f and 5h have a large area like the

electrode patterns

51f and 51h due to dimensional variations due to the manufacturing process, the capacitance of the capacitor C1 will fluctuate.

As shown in FIG. 6(a), a capacitor Ca made up of an electrode pattern 5a and an electrode pattern 5b is made up of two layers of electrodes with the same interlayer distance as the electrode pattern 5f and the electrode pattern 5g shown in FIG. Therefore, in order to have the same capacity as the capacitor C1 shown in FIG. 5, it is necessary to reduce the area of each electrode of the capacitor Ca. Since dimensional variations due to the manufacturing process are constant regardless of the electrode size, when the electrode pattern 5a changes to the electrode pattern 51a, the capacitance of the capacitor Ca changes. In the capacitor Ca, since the area of the electrode pattern 5a, which is smaller than the area of the

electrode patterns

5f and 5h shown in FIG. 5, varies, the rate of change in the capacitance of the capacitor Ca varies greatly. In other words, in this embodiment,

electrode patterns

5f and 5h having a larger area than electrode pattern 5a shown in FIG. The fluctuation rate of the capacitance of the capacitor C1 is reduced compared to the above.

In addition, by configuring the capacitor C1 by arranging the

electrode patterns

5f and 5h, which have smaller areas than the electrode pattern 5g, above and below in the stacking direction, the positions of the

electrode patterns

5f and 5h with respect to the electrode pattern 5g can be adjusted due to the manufacturing process. Even if it deviates, the capacitance of the capacitor C1 does not change as long as it overlaps with the electrode pattern 5g.

Further, in this embodiment, as shown in FIG. 5, a wiring pattern 6h is connected to the electrode pattern 5h. Therefore, the portion where the wiring pattern 6h and the electrode pattern 5g overlap when viewed in plan from the stacking direction is also included in the capacitance of the capacitor C1. When the area of the wiring pattern 6h changes due to dimensional variations due to the manufacturing process, the wiring pattern 6h changes to a wiring pattern 61h as shown in FIG. 5. When changing from the wiring pattern 6h to the wiring pattern 61h, the area of the wiring pattern 6h that overlaps with the electrode pattern 5g changes only in the direction of the wiring width of the wiring pattern 6h, and the area of the wiring pattern 6h that overlaps with the electrode pattern 5g changes only in the direction of the wiring width of the wiring pattern 6h, and the area of the wiring pattern 6h that overlaps with the electrode pattern 5g changes only in the direction of the wiring width of the wiring pattern 6h. There is no change in the length direction of the wiring pattern 6h that protrudes from the wiring pattern 6h.

On the other hand, as shown in FIG. 6(b), in the capacitor Cb composed of the electrode pattern 5c, the electrode pattern 5d, and the electrode pattern 5e, no wiring pattern is connected to the electrode pattern 5e. Therefore, the area of the electrode pattern 5e that is not connected to the wiring pattern also varies as it overlaps with the electrode pattern 5g, and the variation in the dimensions of the electrodes affects the variation in the capacitance of the capacitor Cb. Therefore, in the present embodiment, by connecting the wiring pattern 6h to the electrode pattern 5h, variations in the area of the wiring pattern 6h with respect to the length direction of the wiring pattern 6h can be ignored, and therefore variations in the capacitance of the capacitor C1 can be reduced. .

Furthermore, it will be explained that the fluctuation in the capacitance of the capacitor C1 can be reduced using specific numerical values. By applying the error propagation theory, the variation in the capacitance of the capacitor C1 can be expressed as shown in Equation 1.

Here, the capacitance of the capacitor C1 is C, the relative permittivity is ε _r , the area of the electrode patterns is S, and the distance between the electrode patterns is D.

As can be seen from Equation 1, in order to suppress the variation in the capacitance C of the capacitor C1, at least one of the variation in the relative permittivity ε _r , the variation in the area S of the electrode patterns, and the variation in the distance D between the electrode patterns is suppressed. need to be reduced. In this embodiment, fluctuations in the capacitance C of the capacitor C1 are suppressed by focusing on fluctuations in the area S of the electrode pattern.

In the following explanation, if the area S of the electrode pattern is constant, we will discuss whether it is possible to reduce the variation in the capacitance C of the capacitor C1 by evaluating the amount of variation ΔS in the area that varies due to dimensional variations due to the manufacturing process. confirm. The simulation results described below are calculated assuming that the dimensional variation due to the manufacturing process is 50 μm and the positional deviation is 50 μm.

In the capacitor C1 shown in FIG. 5, the area of the electrode pattern 5f is 150 μm x 300 μm, the area of the electrode pattern 5g is 200 μm x 350 μm, the area of the electrode pattern 5h is 150 μm x 300 μm, and the area of the wiring pattern 6h extending from the electrode pattern 5h. is 100 μm x 100 μm x 2 pieces. In the capacitor element C1a composed of the electrode pattern 5f and the electrode pattern 5g, the effective area of the electrode as a capacitor is the area of the smaller electrode pattern 5f (150 μm×300 μm). In the capacitor (part of capacitor element C1b) composed of the electrode pattern 5g and the electrode pattern 5h, the effective area of the electrode as a capacitor is the area of the smaller electrode pattern 5h (150 μm×300 μm). Further, in the capacitor (a part of the capacitor element C1b) constituted by the wiring pattern 6h extending from the electrode pattern 5h and the electrode pattern 5g, the effective area of the electrode as a capacitor is 25 μm×100 μm×2.

In the capacitor C1, a capacitor element C1a composed of an electrode pattern 5f and an electrode pattern 5g, and a capacitor element C1b composed of an electrode pattern 5g and an electrode pattern 5h (including a part of a wiring pattern 6h) are connected in series. It has a similar structure. Therefore, the capacitance of the capacitor C1 can be determined by the product of the sum of the capacitance of the capacitor element C1a and the capacitance of the capacitor element C1b. Similarly, the area of the electrode that is effective as a capacitor in capacitor C1 is the area of the electrode that is effective as capacitor element C1a (the area of electrode pattern 5f), and the area of the electrode that is effective as capacitor element C1b (the area of electrode pattern 5h and the wiring pattern). (area including part of 6h). Therefore, in the specific example described above, the area of the electrode that is effective as a capacitor in the capacitor C1 can be determined to be approximately 23684 μm ² .

In order to make the area of the electrode effective as a capacitor in the capacitor Cb shown in FIG. 6(b) approximately 23684 ^μm2 , the area of the electrode pattern 5c is 150 μm x 315.8 μm, and the area of the electrode pattern 5d is 200 μm x 365 μm. .8 μm, and the area of the electrode pattern 5e needs to be 150 μm×315.8 μm.

Dimensional variation due to the manufacturing process occurs as an independent event with respect to the electrode pattern, so if we calculate that the dimensional variation is 50 μm based on the concept of error propagation, the amount of variation ΔS in the electrode area of capacitor C1 is , approximately 35355 ^μm2 . On the other hand, the amount of variation ΔS in the area of the electrode in the capacitor Cb shown in FIG. 6(b) is approximately 36471 μm ² .

The capacitor C1 was able to suppress the variation ΔS in the electrode area by about 3% compared to the capacitor Cb. This is because, in the capacitor C1, variations in the area of the wiring pattern 6h in the length direction of the wiring pattern 6h can be ignored. Therefore, since the capacitor C1 has the wiring pattern 6h protruding from the side of the overlapping electrode pattern 5g when viewed in plan from the stacking direction, variations in the capacitance of the capacitor C1 can be reduced in the manufacturing process.

Further, the area of the electrode pattern 5g of the capacitor C1 is 200 μm x 350 μm = 70000 μm ² , but the area of the electrode pattern 5d of the capacitor Cb shown in FIG. 6(b) is because there is no wiring pattern 6h of the capacitor C1. It is necessary to increase the size of the electrode pattern 5e, and the size is 200 μm×365.8 μm=73160 μm ² by including a margin in consideration of deviations during manufacturing. Therefore, the area of the capacitor C1 when viewed in plan from the stacking direction can be made smaller than that of the capacitor Cb, so that the proportion of the area occupied by the capacitor in the electronic component can be suppressed.

[Modified example of capacitor C1]
Next, a modification of the capacitor C1 will be described. FIG. 7 is a plan view of the electrodes forming the capacitor C1 according to the first modification. FIG. 7A shows an electrode in which a wiring pattern 6ha protrudes from the center of the long side of the electrode pattern 5h. Note that the wiring pattern 61ha indicated by a broken line shows the shape of the wiring pattern 6ha after dimensional variations have occurred. The electrode pattern 5h has a rectangular shape when viewed in plan from the stacking direction, and the wiring width of the wiring pattern 6ha is shorter than the length of one side of the electrode pattern 5h. Therefore, when the combined shape of the electrode pattern 5h and the wiring pattern 6ha shown in FIG. 7(a) is viewed in plan from the stacking direction, it has a cross shape. Moreover, as shown in FIG. 7A, the connection position of the upper and lower wiring patterns 6ha with respect to the electrode pattern 5h does not have to be at the center, and furthermore, the connection positions may be at different positions on the upper and lower sides.

In the wiring pattern 6ha shown in FIG. 7(a), the wiring width is shorter than the length of one side of the electrode pattern 5h, but in the wiring pattern 6hb shown in FIG. 7(b), the wiring width is shorter than the length of one side of the electrode pattern 5h. It is the same as the length. FIG. 7B shows an electrode in which a wiring pattern 6hb protrudes from the long side of the electrode pattern 5h. Note that the wiring pattern 61hb indicated by a broken line shows the shape of the wiring pattern 6hb after dimensional variations have occurred. When the combined shape of the electrode pattern 5h and the wiring pattern 6hb is viewed in plan from the stacking direction, it has a rectangular shape. In the case of FIG. 7(b), in the actual structure, the boundary between the electrode pattern 5h and the wiring pattern 6hb is unclear, so when viewed from the stacking direction, the electrode pattern 5h and the wiring It is sufficient that the integrated pattern 6hb protrudes from any side of the electrode pattern 5g.

In FIG. 7A, the wiring pattern 6ha is connected to each of the two long sides (two opposing sides) of the electrode pattern 5h, but the wiring pattern 6ha is connected to one of the long sides. But that's fine. Similarly, in FIG. 7(b), the wiring pattern 6hb is connected to each of the two long sides (two opposing sides) of the electrode pattern 5h, but the wiring pattern 6hb is connected to one of the long sides. It may also be a configuration in which

Further, the wiring pattern is not limited to the configuration in which it is connected to the long side of the electrode pattern 5h, but may be configured to be connected to the short side of the electrode pattern 5h. FIG. 7C shows an electrode in which a wiring pattern 6hc protrudes from the short side of the electrode pattern 5h. Note that the wiring pattern 61hc indicated by a broken line shows the shape of the wiring pattern 6hc after dimensional variations have occurred. When the combined shape of the electrode pattern 5h and the wiring pattern 6hc is viewed in plan from the stacking direction, it has a T-shape. Of course, in FIG. 7(c), the wiring pattern 6hc is connected to one short side of the electrode pattern 5h, but a configuration may be adopted in which the wiring pattern 6hc is connected to two short sides. As shown in FIG. 7C, the connection position of the wiring pattern 6hc with respect to the electrode pattern 5h does not have to be in the center, but may be shifted to either the upper or lower side.

It has been explained that the capacitor C1 has a structure in which two capacitor elements constituted by the electrode pattern 5f, the electrode pattern 5g, and the electrode pattern 5h formed in each of three layers are connected in series. A structure may be employed in which a plurality of capacitor elements each formed by an electrode pattern are connected in series. FIG. 8 is a plan view of an electrode configuring a capacitor C1A according to modification 2. As shown in FIG. 8, the capacitor C1A has a structure in which four capacitor elements each formed by electrode patterns 5i to 5m formed in five layers are connected in series.

The electrode pattern 5i has a rectangular shape, and the wiring pattern 6i is connected to two short sides (two opposing sides). Note that the electrode pattern 51i indicated by a broken line indicates the shape of the electrode pattern 5i after dimensional variations have occurred. The wiring pattern 61i indicated by a broken line shows the shape of the wiring pattern 6i after dimensional variations have occurred. The electrode pattern 5j has a rectangular shape with a larger area than the electrode pattern 5i. Note that the electrode pattern 51j indicated by a broken line indicates the shape of the electrode pattern 5j after dimensional variations have occurred.

The electrode pattern 5k has a rectangular shape with a smaller area than the electrode pattern 5j. Note that the electrode pattern 51k indicated by a broken line indicates the shape of the electrode pattern 5k after dimensional variations have occurred. The structure of the electrode patterns 5j to 5k is such that the electrode pattern 5j, which has a large area, is sandwiched between the electrode pattern 5i, which has a small area, and the electrode pattern 5k, above and below in the stacking direction.

Further, the electrode pattern 5l has a rectangular shape with a larger area than the electrode pattern 5k. Note that the electrode pattern 51l indicated by a broken line shows the shape of the electrode pattern 5l after dimensional variations have occurred.

The electrode pattern 5m has a rectangular shape, and the wiring pattern 6m is connected to two long sides (two opposing sides). Note that the electrode pattern 51m indicated by a broken line shows the shape of the electrode pattern 5m after dimensional variations have occurred. The wiring pattern 61m indicated by a broken line shows the shape of the wiring pattern 6m after dimensional variations have occurred. The structure of the electrode patterns 5k to 5m is such that the electrode pattern 5l, which has a large area, is sandwiched between the electrode pattern 5k, which has a small area, and the electrode pattern 5m, above and below in the stacking direction.

By connecting the wiring pattern 6i to the electrode pattern 5i, the capacitor C1A can ignore the variation in the area of the wiring pattern 6i in the length direction of the wiring pattern 6i, and by connecting the wiring pattern 6m to the electrode pattern 5m, the wiring pattern 6i can be ignored. Since variations in the area of the wiring pattern 6m in the length direction of the pattern 6m can be ignored, variations in capacitance can be suppressed.

Capacitor C1A has two structures in which an electrode pattern with a large area is sandwiched between two electrode patterns with a small area above and below in the stacking direction, and a wiring pattern is connected to one of the electrode patterns with a small area in each structure. Any configuration is fine. It is sufficient that at least a portion of the wiring pattern protrudes from one side of the overlapping electrodes when viewed in plan from the stacking direction.

In the capacitor C1A, as shown in FIG. 8, the

electrode patterns

5i, 5k, and 5m provided above and below in the stacking direction of the large-area electrode patterns 5j, 5l may all have the same area or different areas. That is, the areas of the

electrode patterns

5i, 5k, and 5m need only be smaller than the areas of the electrode patterns 5j, 5l.

Similarly, in the capacitor C1, as shown in FIG. 5, the

electrode patterns

5f and 5h provided above and below the electrode pattern 5g having a large area in the stacking direction may have the same area or different areas. In other words, the areas of the

electrode patterns

5f and 5h need only be smaller than the area of the electrode pattern 5g.

Although the capacitor C1 shown in FIG. 1 has been described with a configuration in which the wiring pattern 6h is electrically connected to the external electrode 4a, it may be configured such that the wiring pattern 6h is not electrically connected to the external electrode 4a. Similarly, the

wiring patterns

6i and 6m of the capacitor C1A may also be configured to be electrically connected to the external electrodes or not connected.

The capacitor C1 and the capacitor C1A have been described as an example employed in a filter device, but if the elements constituted by electrodes formed in at least three layers are connected in series to constitute a capacitor, then The structure of capacitor C1 and capacitor C1A may be adopted for any component.

As described above, the filter device 100 according to the embodiment includes an insulator 3 having a pair of main surfaces facing each other and a side surface connecting the main surfaces, and at least three layers formed in each of the insulator 3. and a capacitor C1 in which elements constituted by electrodes are connected in series. The capacitor C1 is arranged at a position where the electrode patterns 5f to 5h formed in each layer overlap each other when viewed in plan from the stacking direction, and the electrode pattern 5h formed in at least one layer has at least one wiring. Pattern 6h is electrically connected. At least a portion of the wiring pattern 6h protrudes from one side of the overlapping electrode pattern 5g when viewed in plan from the stacking direction.

As a result, the filter device 100 according to the embodiment has a capacitor C1 in which elements constituted by the electrode patterns 5f to 5h formed in each of at least three layers are connected in series, and the capacitor C1 protrudes from one side of the overlapping electrode pattern 5g. Since the electrode pattern 5h is connected to the wiring pattern 6h, it is possible to suppress the ratio of the area occupied by the capacitor C1 in the filter device 100, and reduce fluctuations in the capacitance of the capacitor C1 during the manufacturing process.

(mode)
(1) The electronic component according to the present disclosure includes an insulator having a pair of principal surfaces facing each other and a side surface connecting the principal surfaces, and electrodes formed in each of at least three layers within the insulator. a capacitor in which elements are connected in series, the capacitor is arranged in a position where electrodes formed in each layer overlap each other when viewed in plan from the stacking direction, and the capacitor has an electrode formed in at least one layer; In this case, at least one wiring pattern is electrically connected, and at least a part of the wiring pattern protrudes from one side of the overlapping electrodes when viewed in plan from the stacking direction.

Accordingly, the electronic component according to the present disclosure is a capacitor in which elements constituted by electrodes formed in at least three layers are connected in series, and connected to a wiring pattern protruding from one side of the overlapping electrodes. Since the capacitor has an electrode, it is possible to suppress the proportion of the area occupied by the capacitor in the electronic component and reduce fluctuations in capacitance of the capacitor during the manufacturing process.

(2) In the electronic component described in (1), the capacitor is composed of three layers, including a first electrode formed in the first layer and a second electrode formed in the second layer, when viewed in plan from the stacking direction. a second electrode that overlaps with the first electrode; and a third electrode that is formed in a third layer and overlaps with the second electrode when viewed in plan from the stacking direction, and is connected to the third electrode. At least a portion of the pattern protrudes from one side of the second electrode. As a result, in a capacitor composed of three layers, it is possible to suppress the proportion of the area occupied by the capacitor in the electronic component, and to reduce fluctuations in capacitance of the capacitor during the manufacturing process.

(3) In the electronic component described in (2), in the capacitor, the second electrode has a larger electrode area than the first and third electrodes. As a result, the capacitance of the capacitor is determined by the areas of the first electrode and the third electrode.

(4) In the electronic component according to any one of (1) to (3), the wiring pattern includes one side of the electrodes that overlap when viewed from the stacking direction, and a portion of the wiring pattern from the side opposite to the one side. It's sticking out. As a result, variations in the area of the wiring pattern in the protruding direction do not contribute to variations in the capacitance of the capacitor.

(5) The electronic component according to any one of (1) to (4), further comprising an external electrode provided on a side surface of the insulator, and the wiring pattern is electrically connected to the external electrode. . Thereby, power can be supplied from the external electrode to the electrode via the wiring pattern.

(6) The electronic component according to any one of (1) to (5) further includes an inductor formed in a different layer from the capacitor, and the inductor is connected in series with the capacitor. Thereby, the electronic component can constitute a filter device with the inductor and the capacitor.

(7) In the electronic component according to any one of (1) to (6), the electrode of the capacitor has a rectangular shape when viewed from the stacking direction, and the wiring width of the wiring pattern is shorter than the length of one side of the electrode. This increases the degree of freedom in the position where the wiring pattern is connected to the electrode.

(8) In the electronic component according to any one of (1) to (6), the wiring width of the wiring pattern is the same as the length of one side of the connected electrode. As a result, the shape of the electrode connected to the wiring pattern becomes rectangular.

(9) In the electronic component according to any one of (1) to (7), when the combined shape of the electrode of the capacitor and the wiring pattern connected to the electrode is viewed in plan from the stacking direction, It is cross-shaped or T-shaped. This increases the degree of freedom in the position where the wiring pattern is connected to the electrode.

(10) In the electronic component described in (6), the inductor includes a first inductor and a second inductor connected in parallel to the first inductor. Thereby, the electronic component can constitute a filter device with a plurality of inductors and a capacitor.

(11) In the electronic component described in (10), the second inductor is magnetically coupled to the first inductor. Thereby, the electronic component can utilize mutual inductance between the first inductor and the second inductor.

The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the above description, and it is intended that equivalent meanings and all changes within the scope of the claims are included.

1a to 1c, 2d to 2f conductor pattern, 3 insulator, 3a to 3k insulating substrate, 4a, 4b external electrode, 31 to 37 via conductor, 100 filter device, C1, C1A, Ca, Cb capacitor, C1a, C1b capacitor element , L1, L2 inductor.

Claims

an insulator having a pair of principal surfaces facing each other and a side surface connecting the principal surfaces;
a capacitor in which elements constituted by electrodes formed in each of at least three layers in the insulator are connected in series,
The capacitor is
The electrodes formed in each layer are arranged at positions overlapping each other when viewed from the stacking direction in plan,
At least one wiring pattern is electrically connected to the electrode formed in at least one layer,
An electronic component in which at least a portion of the wiring pattern protrudes from one side of overlapping electrodes when viewed from above in a stacking direction.
The capacitor is composed of three layers,
a first electrode formed in the first layer;
a second electrode formed in a second layer and overlapping the first electrode when viewed in plan from the stacking direction;
a third electrode formed in a third layer and overlapping with the second electrode when viewed in plan from the stacking direction;
The electronic component according to claim 1, wherein at least a portion of the wiring pattern connected to the third electrode protrudes from one side of the second electrode.
The electronic component according to claim 2, wherein in the capacitor, the second electrode has a larger electrode area than the first electrode and the third electrode.
The electronic component according to any one of claims 1 to 3, wherein the wiring pattern partially protrudes from one side of the overlapping electrodes when viewed in plan from the stacking direction, and a side opposite to the one side. .
further comprising an external electrode provided on the side surface of the insulator,
The electronic component according to claim 1, wherein the wiring pattern is electrically connected to the external electrode.
further comprising an inductor formed in a different layer from the capacitor,
The electronic component according to claim 1, wherein the inductor is connected in series with the capacitor.
The electrode of the capacitor has a rectangular shape when viewed in plan from the stacking direction,
7. The electronic component according to claim 1, wherein the wiring width of the wiring pattern is shorter than the length of one side of the connected electrode.
The electronic component according to any one of claims 1 to 6, wherein the wiring width of the wiring pattern is the same as the length of one side of the connected electrode.
Any one of claims 1 to 7, wherein the combined shape of the electrode of the capacitor and the wiring pattern connected to the electrode is cross-shaped or T-shaped when viewed in plan from the stacking direction. Electronic components listed in section.
The electronic component according to claim 6, wherein the inductor includes a first inductor and a second inductor connected in parallel to the first inductor.
The electronic component according to claim 10, wherein the second inductor is magnetically coupled to the first inductor.