WO2023210470A1 - Compound, composition, surface treatment agent, method for producing article, and article - Google Patents

Compound, composition, surface treatment agent, method for producing article, and article Download PDF

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Publication number
WO2023210470A1
WO2023210470A1 PCT/JP2023/015681 JP2023015681W WO2023210470A1 WO 2023210470 A1 WO2023210470 A1 WO 2023210470A1 JP 2023015681 W JP2023015681 W JP 2023015681W WO 2023210470 A1 WO2023210470 A1 WO 2023210470A1
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group
compound
surface treatment
carbon atoms
article
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PCT/JP2023/015681
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French (fr)
Japanese (ja)
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亮平 小口
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Agc株式会社
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32Polymers modified by chemical after-treatment
    • C08G65/329Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336Polymers modified by chemical after-treatment with organic compounds containing silicon

Definitions

  • the present disclosure relates to compounds, compositions, surface treatment agents, methods of manufacturing articles, and articles.
  • Patent Document 1 a cured film containing a specific organosilicone compound as a matrix resin is provided on the outermost surface of a base material, and the two-dimensional surface roughness when a fingerprint is attached to the cured film is set in a specific range.
  • a substrate with a cured coating is described.
  • Patent Document 2 describes a fingerprint-resistant transparent substrate having a lipophilic coating containing a compound in which a specific monool or polyol and a silicon compound are bonded.
  • compositions used as surface treatment agents and the like are required to have abrasion resistance in addition to the property of reducing the visibility of fingerprints in the surface treatment layer formed.
  • the present disclosure has been made in view of these circumstances, and the problem to be solved by an embodiment of the present invention is to provide a base material with properties that reduce fingerprint visibility and abrasion resistance.
  • An object of the present invention is to provide novel compounds and compositions useful as surface treatment agents capable of forming surface treatment layers.
  • the problem to be solved by an embodiment of the present invention is to provide a surface treatment agent that can form a surface treatment layer on a base material that has both characteristics of reducing fingerprint visibility and wear resistance. be.
  • the problem to be solved by one embodiment of the present invention is to provide an article having a surface treatment layer that has both characteristics of reducing fingerprint visibility and wear resistance, and a method for manufacturing the same.
  • the present disclosure includes the following aspects.
  • ⁇ 1> A compound having a reactive silyl group, an ethylene oxide unit, an alkylene oxide unit having 3 to 6 carbon atoms, and a hydroxy group bonded to a carbon atom,
  • the ratio of Ma to the total of Ma and Mb is Ma/(Ma+Mb)
  • ⁇ 3> A compound represented by the following formula (1).
  • R 2 is each independently an alkylene group having 3 to 6 carbon atoms
  • Q 1 is a (d+e)-valent linking group
  • Y 1 is a (g+1)-valent linking group
  • R 1 is each independently a monovalent hydrocarbon group
  • L 2 is each independently a hydrolyzable group or a hydroxyl group
  • a1, a2, b1, and b2 are each independently an integer of 1 to 300
  • d and e are each independently an integer of 1 to 10
  • n is an integer from 0 to 2
  • g is an integer greater than or equal to 1
  • (OCH 2 CH 2 ) b1 (OR 2 ) a1 is such that (OCH 2 CH 2 ) and (OR 2 ) may be combined in any order, and when at least one of a1 and b1 is 2 or more, It can be combined randomly or in blocks, (R 2 O) a2 (CH 2 CH 2 O) b2 , (R 2 O) and (CH 2 CH 2 O
  • the value is between 0.2 and 0.8.
  • ⁇ 4> The compound according to ⁇ 3>, wherein g in the formula (1) is 2 or more.
  • ⁇ 5> A composition comprising the compound according to any one of ⁇ 1> to ⁇ 4> and a liquid medium.
  • ⁇ 6> A surface treatment agent comprising the compound according to any one of ⁇ 1> to ⁇ 4>.
  • ⁇ 7> The surface treatment agent according to ⁇ 6>, further comprising a liquid medium.
  • a method for manufacturing an article comprising performing a surface treatment on a base material using the surface treatment agent described in ⁇ 6> or ⁇ 7>, and manufacturing an article in which a surface treatment layer is formed on the base material. .
  • novel compounds and compositions useful as surface treatment agents capable of forming a surface treatment layer on a substrate that has both characteristics of reducing fingerprint visibility and wear resistance is provided.
  • a surface treatment agent is provided that can form a surface treatment layer on a base material that has both characteristics of reducing fingerprint visibility and wear resistance.
  • an article and a method for manufacturing the article are provided, which have a surface treatment layer that has both properties that reduce fingerprint visibility and wear resistance.
  • numerical ranges indicated using “ ⁇ ” include the numerical values written before and after " ⁇ " as minimum and maximum values, respectively.
  • each component may contain multiple types of corresponding substances. If there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition, unless otherwise specified. means quantity.
  • the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of another numerical range described step by step.
  • the upper limit or lower limit of the numerical range may be replaced with the values shown in the Examples.
  • the term “layer” or “film” refers to the case where the layer or film is formed only in a part of the region, in addition to the case where the layer or film is formed in the entire region when observing the region where the layer or film is present. This also includes cases where it is formed.
  • the term “surface treated layer” refers to a layer formed on the surface of a base material by surface treatment.
  • the compound or group represented by the formula (X) may be referred to as a compound (X) or a group (X), respectively.
  • the compound of the present disclosure has a reactive silyl group, an ethylene oxide unit, an alkylene oxide unit having 3 to 6 carbon atoms, and a hydroxy group bonded to a carbon atom, and the carbon atoms contained in the compound of the present disclosure have a
  • the number of moles of alkylene oxide units of numbers 3 to 6 is Ma
  • the number of moles of the ethylene oxide unit is Mb
  • the value of the ratio Ma/(Ma+Mb) to the total of Ma and Mb is 0.2 to 0. It is .8.
  • ethylene oxide units i.e.
  • EO units alkylene oxide units with 3 to 6 carbon atoms
  • R 2 O alkylene oxide units with 3 to 6 carbon atoms
  • the alkylene group) is also referred to as the "RO unit”.
  • the compound of the present disclosure has a reactive silyl group that has high adhesion to the substrate, and thus can form a surface treatment layer that adheres to the surface of the substrate. Since the compound of the present disclosure has an EO unit and a hydroxy group bonded to a carbon atom, it can have particularly high hydrophilicity compared to a compound in which all hydroxy groups are silylated. Therefore, a highly hydrophilic surface treatment layer can be formed, and even if fingerprint stains adhere to the surface of the surface treatment layer, the adhered fingerprint stains will easily spread and become difficult to form into droplets. Further, since diffuse reflection of light due to fingerprint stains is less likely to occur, fingerprint stains are less noticeable, and the surface treatment layer has a good property of reducing fingerprint visibility.
  • the compounds of the present disclosure have not only EO units but also RO units and have a value of Ma/(Ma+Mb) of 0.2 to 0.8. Therefore, the compound of the present disclosure can form a surface treatment layer with higher abrasion resistance than, for example, a compound without an RO unit, and can achieve both the property of reducing fingerprint visibility and the abrasion resistance in the surface treatment layer. It is believed that this can be achieved.
  • the compounds of the present disclosure have a polyalkylene oxide chain composed of one or more EO units and one or more RO units.
  • a polyalkylene oxide chain composed of one or more EO units and one or more RO units will also be referred to as a "specific polyalkylene oxide chain.”
  • the compound of the present disclosure has a partial structure D in which an oxygen atom at one end of a specific polyalkylene oxide chain is bonded to a reactive silyl group via a single bond or a linking group Y1 , and a partial structure D in which an oxygen atom at one end of a specific polyalkylene oxide chain is It is preferable to have a partial structure E bonded to a hydrogen atom.
  • partial structure D when the specific alkylene oxide chain is bonded to the reactive silyl group via a linking group, the linking group between the specific alkylene oxide chain and the reactive silyl group is a group that does not impair the purpose of the present disclosure. Any linking group may be used, and examples thereof include a linking group explained as Y 1 in formula (1) below.
  • the hydroxy group formed by bonding the oxygen atom at one end of the specific polyalkylene oxide chain to a hydrogen atom becomes the above-mentioned "hydroxy group bonded to a carbon atom.”
  • one or more partial structures D and one or more partial structures E are bonded via a linking group Q.
  • the carbon atom at the other end of the specific alkylene oxide chain in partial structure D and the carbon atom at the other end of the specific alkylene oxide chain in partial structure E are connected via a linking group Q.
  • the linking group may be any group that does not impair the purpose of the present disclosure, and examples thereof include the linking group explained as Q 1 in formula (1) below.
  • the compound of the present disclosure may have only one partial structure D in one molecule, or may have two or more partial structures D.
  • the number d of partial structures D that the compound of the present disclosure has in one molecule is, for example, 1 to 10, preferably 1 to 6, and more preferably 1 to 3 from the viewpoint of material availability.
  • the compound of the present disclosure may have only one partial structure E in one molecule, or may have two or more partial structures E.
  • the number e of partial structures E that the compound of the present disclosure has in one molecule is, for example, from 1 to 10, preferably from 1 to 6, and more preferably from 1 to 3 from the viewpoint of material availability.
  • the total number (d+e) of partial structures D and partial structures E that the compound of the present disclosure has in one molecule is, for example, 2 to 20, preferably 2 to 20 from the viewpoint of material availability, and 2 to 20. 6 is more preferred.
  • the ratio of e to the sum of d and e is e. /(d+e) is preferably 0.05 to 0.9, more preferably 0.25 to 0.75, from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance.
  • the compound of the present disclosure may have only one reactive silyl group in one molecule, or may have two or more reactive silyl groups.
  • the compound of the present disclosure preferably has two or more reactive silyl groups in one molecule from the viewpoint of improving wear resistance in the surface treatment layer.
  • the number of reactive silyl groups that the compound of the present disclosure has in one molecule is 1 or more, and from the viewpoint of further improving the abrasion resistance of the surface treatment layer, it is preferably 1 to 18, more preferably 2 to 12, 2 to 8 are more preferred.
  • the number of reactive silyl groups that the compound of the present disclosure has may be one.
  • the compound of the present disclosure has two or more reactive silyl groups attached to the oxygen atom at one end of one specific polyalkylene oxide chain via a trivalent or higher valent linking group, from the viewpoint of improving wear resistance in the surface treatment layer. Preferably, they are bonded.
  • the compound of the present disclosure has a partial structure D
  • one partial structure D has two or more reactive silyl groups.
  • the number g of reactive silyl groups that one partial structure D has is 1 or more, preferably 1 to 3, more preferably 2 to 3, from the viewpoint of improving wear resistance in the surface treatment layer.
  • the number of hydroxy groups bonded to carbon atoms that the compound of the present disclosure has in one molecule is 1 or more, and preferably 1 to 10 from the viewpoint of improving the property of reducing fingerprint visibility in the surface treatment layer. 1 to 6 are more preferred, and 1 to 3 are even more preferred.
  • the ratio of e to the sum of f and e. e/(f+e) is preferably 0.17 to 0.83, more preferably 0.33 to 0.67, from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance.
  • the number f of reactive silyl groups in one molecule is the product of the number g of reactive silyl groups in one partial structure D and the number d of partial structures D in one molecule (g ⁇ d). corresponds to
  • Reactive silyl group Compounds of the present disclosure contain reactive silyl groups.
  • the reactive silyl group is located at the end of the compound.
  • a reactive silyl group means a group in which a reactive group is bonded to a Si atom.
  • the reactive group is preferably a hydrolyzable group or a hydroxyl group.
  • a hydrolyzable group is a group that becomes a hydroxyl group through a hydrolysis reaction. That is, the hydrolyzable silyl group represented by Si-L becomes a silanol group represented by Si-OH through a hydrolysis reaction.
  • the silanol groups further react among themselves to form Si--O--Si bonds.
  • the silanol group can undergo a dehydration condensation reaction with a silanol group derived from an oxide present on the surface of the base material to form a Si--O--Si bond.
  • the hydrolyzable group include an alkoxy group, an aryloxy group, a halogen atom, an acyl group, an acyloxy group, and an isocyanato group (-NCO).
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
  • the aryl group of the aryloxy group includes a heteroaryl group.
  • the halogen atom is preferably a chlorine atom.
  • the acyl group is preferably an acyl group having 1 to 6 carbon atoms.
  • the acyloxy group is preferably an acyloxy group having 1 to 6 carbon atoms.
  • the reactive silyl group is preferably an alkoxysilyl group or a trichlorosilyl group.
  • the reactive silyl group is more preferably an alkoxysilyl group.
  • the alkoxysilyl group is preferably a dialkoxysilyl group or a trialkoxysilyl group, and more preferably a trialkoxysilyl group.
  • R 1 is each independently a monovalent hydrocarbon group
  • L 2 is each independently a hydrolyzable group or a hydroxyl group
  • n is an integer of 0 to 2.
  • the multiple reactive silyl groups may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of reactive silyl groups are the same.
  • Each R 1 is independently a monovalent hydrocarbon group, and a monovalent saturated hydrocarbon group is preferable.
  • the number of carbon atoms in R 1 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.
  • Each L 2 is independently a hydrolyzable group or a hydroxyl group.
  • hydrolyzable group those mentioned above are preferred.
  • L 2 is preferably an alkoxy group or a halogen atom, more preferably an alkoxy group having 1 to 4 carbon atoms or a halogen atom, from the viewpoint of ease of manufacturing the compound.
  • L 2 is preferably an alkoxy group having 1 to 4 carbon atoms, from the viewpoint of less outgassing during coating and better storage stability of the compound.
  • L 2 is more preferably an ethoxy group.
  • L 2 is more preferably a methoxy group.
  • at least one of L 2 is preferably the above group, and more preferably all of L 2 are the above groups.
  • n is an integer of 0 to 2, preferably 0 or 1, and more preferably 0.
  • the presence of a plurality of L 2 makes the adhesion of the surface treatment layer to the base material stronger.
  • n is 1 or less, the plurality of L2s present in one molecule may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of L 2 's are the same.
  • n is 2
  • multiple R 1s present in one molecule may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that a plurality of R 1 's are the same.
  • hydroxy group bonded to carbon atom examples include a hydroxy group formed by bonding an oxygen atom at one end of a specific polyalkylene oxide chain described below with a hydrogen atom.
  • a hydroxy group formed by bonding an oxygen atom at one end of a specific polyalkylene oxide chain with a hydrogen atom is also referred to as a "specific hydroxy group.”
  • the hydroxy group bonded to the carbon atom may be a hydroxy group other than the specific hydroxy group.
  • Examples of compounds having a hydroxy group other than the specific hydroxy group include compounds having a linking group containing a hydroxy group bonded to a carbon atom as a linking group such as the above-mentioned linking group Y 1 and linking group Q.
  • the compound of the present disclosure preferably has at least a specific hydroxy group as a hydroxy group bonded to a carbon atom, from the viewpoint of reducing fingerprint visibility in the surface treatment layer.
  • the compounds of the present disclosure include ethylene oxide units (ie, EO units) and alkylene oxide units having 3 to 6 carbon atoms (ie, RO units).
  • EO units ethylene oxide units
  • RO units alkylene oxide units having 3 to 6 carbon atoms
  • the compounds of the present disclosure have a specific polyalkylene oxide chain composed of one or more EO units and one or more RO units.
  • the specific polyalkylene oxide chain is represented by the following formula (A). -(R 2 O) a (CH 2 CH 2 O) b -...(A)
  • R 2 is each independently an alkylene group having 3 to 6 carbon atoms
  • a and b are each independently an integer of 1 to 300
  • (R 2 O) and (CH 2 CH 2 O) may be combined in any order, and may be combined randomly or in blocks when at least one of a and b is 2 or more.
  • the number of carbon atoms in the alkylene group represented by R 2 in formula (A) is 3 to 6, preferably 3 to 5, more preferably 3 to 4, from the viewpoint of improving the abrasion resistance of the surface treatment layer. 3 is more preferred.
  • the alkylene group may be linear, branched, or cyclic, and among these, from the viewpoint of excellent wear resistance, linear or branched is preferable, and branched is more preferable.
  • alkylene group examples include n-propylene group, isopropylene group, n-butylene group, isobutylene group, cyclobutanediyl group, n-pentylene group, isopentylene group, sec-pentylene group, cyclopentanediyl group, n-hexylene group, Examples include isohexylene group, sec-hexylene group, and cyclohexanediyl group.
  • (R 2 O) examples include -C 3 H 6 O-, -C 4 H 8 O-, -C 5 H 10 O-, -C 6 H 12 O-, -CH(CH 3 )CH 2 O-, -CH(CH 3 )CH 2 CH 2 O-, -cycloC 4 H 6 -O-, -cycloC 5 H 8 -O, and -cycloC 6 H 10 -O-.
  • -cycloC 4 H 6 - means a cyclobutanediyl group.
  • the cyclobutanediyl group include a cyclobutane-1,2-diyl group and a cyclobutane-1,3-diyl group.
  • -cycloC 5 H 8 - means a cyclopentanediyl group.
  • the cyclopentanediyl group include a cyclopentane-1,2-diyl group and a cyclopentane-1,3-diyl group.
  • -cycloC 6 H 10 - means a cyclohexanediyl group.
  • the cyclohexanediyl group include a cyclohexane-1,2-diyl group, a cyclohexane-1,3-diyl group, and a cyclohexane-1,4-diyl group.
  • the number a of RO units contained in one specific polyalkylene oxide chain is an integer of 1 to 300, preferably an integer of 2 to 300 from the viewpoint of wear resistance of the surface treatment layer, and an integer of 2 to 100. More preferably, an integer of 2 to 50 is even more preferable.
  • the number b of EO units contained in one specific polyalkylene oxide chain is an integer of 1 to 300, preferably an integer of 2 to 300 from the viewpoint of the property of reducing fingerprint visibility in the surface treatment layer, and 2 to 300. An integer of 50 is more preferred, and an integer of 2 to 20 is even more preferred.
  • the total a+b of the number a of RO units and the number b of EO units contained in one specific polyalkylene oxide chain is an integer of 2 to 600, and the property of reducing fingerprint visibility and abrasion resistance are both compatible. From the viewpoint of feasibility, an integer of 4 to 600 is preferable, an integer of 4 to 150 is more preferable, and an integer of 4 to 70 is even more preferable.
  • the ratio a/(a+b) of the number a of RO units to the sum of the number a of RO units and the number b of EO units contained in one specific polyalkylene oxide chain is a characteristic that reduces the fingerprint visibility of the surface treatment layer. From the viewpoint of achieving both wear resistance and abrasion resistance, the range is preferably 0.2 to 0.8, more preferably 0.3 to 0.8, and even more preferably 0.3 to 0.7.
  • the number Sa of RO units that the compound of the present disclosure has in one molecule is preferably an integer of 2 to 50, more preferably an integer of 4 to 30, from the viewpoint of wear resistance of the surface treatment layer.
  • the number Sb of EO units that the compound of the present disclosure has in one molecule is preferably an integer of 2 to 50, more preferably an integer of 4 to 30, from the viewpoint of the property of reducing fingerprint visibility in the surface treatment layer.
  • the ratio Sa/(Sa+Sb) of Sa to the sum of the number Sa of RO units and the number Sb of EO units that the compound of the present disclosure has in one molecule, that is, the value of Ma/(Ma+Mb) is 0. .2 to 0.8, preferably 0.3 to 0.8, more preferably 0.3 to 0.7 from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance. preferable.
  • the specific polyalkylene oxide chain may contain only one type of RO unit, or may contain two or more types of RO units, and preferably contains only one type of RO unit from the viewpoint of ease of synthesis.
  • the bonding order of the two or more types of RO units is not limited, and may be arranged randomly, alternately, or in blocks.
  • Containing two or more types of RO units means that two or more types of RO units with different numbers of carbon atoms exist in a specific polyalkylene oxide chain, and even if the number of carbon atoms is the same, the presence or absence of a side chain or the side chain This refers to the presence of two or more types of RO units with different types (for example, number of side chains, number of carbon atoms in the side chain, etc.).
  • the bonding order of the EO units and RO units contained in the specific polyalkylene oxide chain is not limited, and may be arranged randomly, alternately, or in blocks.
  • the bonding order of the EO units and RO units contained in the specific polyalkylene oxide chain is preferably block from the viewpoint of ease of synthesis and functional separation.
  • Examples of the structure of a specific polyalkylene oxide chain in which EO units and RO units are arranged in blocks include the following structures. -(R 2 O) a -(CH 2 CH 2 O) b - -(CH 2 CH 2 O) b - (R 2 O) a - -(R 2 O) a11 -(CH 2 CH 2 O) b -(R 2 O) a12 - -(CH 2 CH 2 O) b11 -(R 2 O) a -(CH 2 CH 2 O) b12 - -(R 2 O) a11 -(CH 2 CH 2 O) b11 -(R 2 O) a12 -(CH 2 CH 2 O) b12 - -(CH 2 CH 2 O) b11 -(R 2 O) a11 -(CH 2 CH 2 O) b12 - -(CH 2 CH 2 O) b11 -(R 2 O) a11 -(CH 2 CH
  • the structure represented by "-(R 2 O) a -" means a block in which a number of RO units are consecutively bonded.
  • the oxygen atom at the right end of the above formula is bonded to the reactive silyl group via a single bond or linking group Y1 , and the above formula
  • the oxygen atom at the right end of the above formula combines with a hydrogen atom to form a hydroxy group.
  • the compound of the present disclosure is preferably a compound represented by the following formula (1) from the viewpoint of forming a surface treatment layer that has both the property of reducing fingerprint visibility and abrasion resistance.
  • R 2 is each independently an alkylene group having 3 to 6 carbon atoms
  • Q 1 is a (d+e)-valent linking group
  • Y 1 is a (g+1)-valent linking group
  • R 1 is each independently a monovalent hydrocarbon group
  • L 2 is each independently a hydrolyzable group or a hydroxyl group
  • a1, a2, b1, and b2 are each independently an integer of 1 to 300
  • d and e are each independently an integer of 1 to 10
  • n is an integer from 0 to 2
  • g is an integer greater than or equal to 1
  • (OCH 2 CH 2 ) b1 (OR 2 ) a1 is such that (OCH 2 CH 2 ) and (OR 2 ) may be combined in any order, and when at least one of a1 and b1 is 2 or more, It can be combined randomly or in blocks, (R 2 O) a2 (CH 2 CH 2 O) b2 , (R 2 O) and (CH 2 CH 2 O
  • R 2 in formula (1) is the same as R 2 in formula (A), and multiple R 2 included in formula (1) may be the same or different from each other.
  • d and e in formula (1) are the same as the number of partial structures D in one molecule and the number of partial structures E in one molecule, respectively, which are described above.
  • the (d+e) specific polyalkylene oxide chains contained in the compound represented by formula (1) may be the same or different from each other.
  • R 1 , L 2 , and n in formula (1) are the same as R 1 , L, and n in formula (2) described above as the reactive silyl group.
  • the value of the ratio Sa/(Sa+Sb) is the same as the value of the ratio Ma/(Ma+Mb) described above.
  • Q 1 in formula (1) is a (d+e)-valent linking group.
  • the linking group represented by Q 1 includes an alkylene group, an arylene group, a carbonyl group, an ether bond, a thioether bond, a sulfonyl group, -NR 4 -, -N ⁇ , -SiR 4 2 -, >SiR 4 -, > Examples include Si ⁇ , polyhydric alcohol residues, polyhydric phenol residues, polyamine residues, and combinations thereof.
  • R 4 is a hydrogen atom or a hydrocarbon group.
  • the above-mentioned alkylene group may be linear, branched, or cyclic, and among these, linear or branched is preferable, and branched is more preferable.
  • the number of carbon atoms in the alkylene group is, for example, 2 to 10, preferably 2 to 8, and more preferably 2 to 6.
  • the hydrocarbon group represented by R 4 includes, for example, an aliphatic hydrocarbon group and an aromatic hydrocarbon group, with an aliphatic hydrocarbon group being preferred, an alkyl group being more preferred, and a methyl group being even more preferred.
  • the above arylene group is a group obtained by removing two hydrogen atoms from an aromatic ring. Examples of aromatic rings include benzene ring, naphthalene ring, fluorene ring, anthracene ring, furan ring, thiophene ring, and pyridine ring.
  • the linking group represented by Q1 is preferably a polyhydric alcohol residue, a polyhydric phenol residue, or a polyamine residue, more preferably a polyhydric alcohol residue or a polyamine residue, and a polyhydric alcohol residue. is even more preferable.
  • the linking group represented by Q 1 is preferably a polyhydric alcohol residue represented by the following formula (Q1-1) or a polyamine residue represented by the following formula (Q1-2).
  • Q 11 and Q 12 are each independently a (d+e)-valent linking group
  • E * is a bond bonding to partial structure E in formula (1)
  • * D is formula (1) This is a bonding portion that connects to the partial structure D inside.
  • the linking group represented by Q 11 or Q 12 includes an alkylene group, an arylene group, an ether bond, -NR 4 -, a combination thereof, and the like. R 4 is as described above.
  • the polyhydric alcohol residue refers to a group obtained by removing hydrogen atoms from all hydroxyl groups contained in a polyhydric alcohol.
  • a glycerin residue is represented by -OCH 2 -CH(-O-)-CH 2 O-.
  • the polyhydric alcohol may be a monomer or a polymer.
  • the monomer polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, 1 , 4-cyclohexanediol, neopentyl glycol, diethanolamine, and other diols; trihydric or higher alcohols such as glycerin, diglycerin, trimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, and hexitol; glucose, sorbitol, dextrose, Saccharides or derivatives thereof such as fructose, sucrose, methyl glucoside, trehalose; hydroxyl group-containing compounds such as fatty acid triglycerides or condensates thereof having hydroxyl groups such as castor
  • polyhydric alcohols that are polymers include polyethylene glycol, polypropylene glycol, polyoxytetramethylene glycol, polycarbonate diol, polyether polycarbonate diol, and polyether polyol obtained by adding alkylene oxide to polyoxytetramethylene glycol.
  • polyester polyols include polyester polyols made of condensates of dibasic acids and alcohols, polycaprolactone polyols that are ring-opening polymers of cyclic ester compounds, and the like.
  • polycarbonate diols include condensation products of alcohols and carbonate compounds, and reaction products of alcohols and cyclic esters with carbonate compounds.
  • polyether polycarbonate diol examples include a condensate of a polyether polyol and a carbonate compound.
  • polyether carbonate polyols examples include products obtained by adding alkylene oxide and carbon dioxide to an initiator having a hydroxyl group.
  • the number average molecular weight of the polyhydric alcohol, which is a polymer, is, for example, in the range of 400 to 19,700.
  • the polyhydric phenol residue refers to a group obtained by removing hydrogen atoms from all phenolic hydroxyl groups contained in a polyhydric phenol.
  • polyhydric phenols include phenols such as bisphenol A, bisphenol F, bisphenol S, novolak, resol, and resorcinol.
  • the polyamine residue refers to a group obtained by removing one hydrogen atom from all amino groups contained in a polyamine. Examples of the polyamine include ethylene diamine, diethylene diamine, diaminodiphenylmethane, hexamethylene diamine, propylene diamine, and methylbenzenediamine.
  • linking group represented by Q 1 include, for example, organic groups having the following structure.
  • the linking group represented by Q 1 is not limited to the specific examples below.
  • * is a bond bonding to R 2 of partial structure D or partial structure E in formula (1).
  • Y 1 is a single bond or a (g+1)-valent linking group.
  • Y 1 is, for example, a group containing an etheric oxygen atom or an alkylene group which may have a divalent organopolysiloxane residue, a carbon atom, a nitrogen atom, a silicon atom, a divalent to octavalent organopolysiloxane.
  • Y 1 may be groups (g2-1) to (g2-14) described below.
  • Y 1 is preferably one containing a silyl group from the viewpoint of wear resistance, and is a group obtained by removing Si(R 1 ) n L 2 3-n from formula (3-1A-3), or a group of formula ( The group obtained by removing Si(R 1 ) n L 2 3-n from 3-1A-5), the group (g2-5), and the groups (g2-7) to (g2-14) are more preferable, and g2-5 is even more preferable.
  • g is an integer of 1 or more. In one embodiment, g is preferably from 1 to 15, more preferably from 1 to 6, from the viewpoint of the surface treatment layer's ability to reduce fingerprint visibility and abrasion resistance. In one embodiment, g is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3 from the viewpoint of excellent wear resistance of the surface treatment layer. In one embodiment, g is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1 from the viewpoint of the surface treatment layer having excellent properties of reducing fingerprint visibility. .
  • two or more (-Si(R 1 ) n L 2 3-n ) contained in the compound represented by formula (1) may be the same or different from each other. Good too.
  • the group represented by Y 1 (-Si(R 1 ) n L 2 3-n ) g in formula (1) is preferably group (3-1A) or group (3-1B).
  • the terminal of group (3-1A) or group (3-1B) that is bonded to the specific polyalkylene oxide chain is not -O-.
  • Q a is a single bond or a divalent linking group
  • X 31 is a group having a single bond, an alkylene group, a carbon atom, a nitrogen atom, a silicon atom, a 2- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring
  • Q b is a single bond or a divalent linking group
  • R 31 is a hydrogen atom, a hydroxyl group or an alkyl group
  • h is an integer of 1 or more
  • i is an integer of 0 or more
  • the definitions and specific examples of R 1 , L 2 , and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
  • Q c is a single bond or a divalent linking group
  • R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
  • Q d is a single bond or an alkylene group
  • R 33 is a hydrogen atom or a halogen atom
  • y is an integer from 1 to 10
  • the definitions and specific examples of R 1 , L 2 , and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
  • Q a is a single bond or a divalent linking group.
  • divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof. Excludes the case where the terminal of Q a that is bonded to the specific polyalkylene oxide chain is -O-.
  • the divalent hydrocarbon group may be a divalent saturated hydrocarbon group, a divalent aromatic hydrocarbon group, an alkenylene group, or an alkynylene group.
  • the divalent saturated hydrocarbon group may be linear, branched, or cyclic, and includes, for example, an alkylene group.
  • the divalent saturated hydrocarbon group preferably has 1 to 20 carbon atoms.
  • the divalent aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, such as a phenylene group.
  • the divalent hydrocarbon group may be an alkenylene group having 2 to 20 carbon atoms or an alkynylene group having 2 to 20 carbon atoms.
  • the above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group.
  • the above R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • Examples of groups combining two or more of the above-mentioned types include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )-, - N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, an alkylene group having -N(R d )C(O)- an alkylene group having an etheric oxygen atom, an alkylene group having -OC(O)-, an alkylene group having -C(O)O-, an alkylene group having -C(O)S-, - Examples include an alky
  • Q a is a single bond, -O-, -S-, -N(R d )-, -C(O)N(R d )-, -OC(O)N(R d ) -, -C(O)O-, -OC(O)-, and -C(O)S- are preferred, and single bonds, -C(O)N(R d )-, -OC(O)N( R d )- and -OC(O)- are more preferred.
  • X 31 is an alkylene group, a carbon atom, a nitrogen atom, a silicon atom, a di- to octavalent organopolysiloxane residue, or a group having a (h+i+1)-valent ring.
  • the alkylene group may have -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group.
  • the alkylene group may have a plurality of groups selected from the group consisting of -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, and a dialkylsilylene group.
  • the alkylene group represented by X 31 preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms.
  • Examples of the divalent to octavalent organopolysiloxane residues include divalent organopolysiloxane residues and (w2+1)-valent organopolysiloxane residues described below.
  • the ring is a ring other than an organopolysiloxane ring.
  • the ring in X 31 means a ring other than an organopolysiloxane ring.
  • the ring in X 31 may be a monocyclic ring, a fused polycyclic ring, a bridged ring, a spiro ring, or an assembled polycyclic ring, and the atoms constituting the ring may be a carbocyclic ring consisting only of carbon atoms, or a divalent ring.
  • a heterocycle consisting of a heteroatom having the above valence and a carbon atom may also be used.
  • the bond between atoms constituting the ring may be a single bond or a multiple bond.
  • the ring may be an aromatic ring or a non-aromatic ring.
  • the monocyclic ring is preferably a 4- to 8-membered ring, more preferably a 5-membered ring or a 6-membered ring.
  • the fused polycyclic ring is preferably a fused polycyclic ring in which two or more 4- to 8-membered rings are fused together, and fused polycyclic rings in which 2 or 3 rings selected from 5-membered rings and 6-membered rings are bonded together; A fused polycyclic ring in which one or two rings selected from membered rings and six-membered rings and one four-membered ring are bonded is more preferred.
  • the bridged ring is preferably a bridged ring whose largest ring is a 5- or 6-membered ring
  • the spiro ring is preferably a spiro ring consisting of two 4- to 6-membered rings.
  • a collective polycyclic ring two or three rings selected from 5-membered rings and 6-membered rings are bonded via a single bond, 1 to 3 carbon atoms, or 1 heteroatom with a valence of 2 or 3.
  • a set of polycyclic rings is preferred.
  • the heteroatom constituting the ring is preferably a nitrogen atom, an oxygen atom, or a sulfur atom, and more preferably a nitrogen atom or an oxygen atom.
  • the number of heteroatoms constituting the ring is preferably 3 or less. Furthermore, when the number of heteroatoms constituting the ring is two or more, these heteroatoms may be the same or different.
  • the ring in X 31 may be a 3- to 8-membered aliphatic ring, a benzene ring, or a 3- to 8-membered aliphatic ring, from the viewpoint of easy production of the compound and superior abrasion resistance, light resistance, and chemical resistance of the surface treatment layer.
  • Heterocycle of a membered ring, a condensed ring in which two or three of these rings are fused together, a bridged ring in which the largest ring is a 5- or 6-membered ring, and two or more of these rings One type selected from the group consisting of a single bond, an alkylene group having 3 or less carbon atoms, an oxygen atom, or a sulfur atom as a connecting group is preferable.
  • Preferred rings include a benzene ring, a 5- or 6-membered aliphatic ring, a 5- or 6-membered heterocycle having a nitrogen atom or an oxygen atom, and a 5- or 6-membered carbon ring and a 4- to 6-membered heterocycle. It is a fused ring with a ring.
  • Specific rings include the rings shown below, a 1,3-cyclohexadiene ring, a 1,4-cyclohexadiene ring, an anthracene ring, a cyclopropane ring, a decahydronaphthalene ring, a norbornene ring, a norbornadiene ring, a furan ring, Examples include a pyrrole ring, a thiophene ring, a pyrazine ring, a morpholine ring, an aziridine ring, an isoquinoline ring, an oxazole ring, an isoxazole ring, a thiazole ring, an imidazole ring, a pyrazole ring, a pyran ring, a pyridazine ring, a pyrimidine ring, and an indene ring.
  • Q a and Q b are bonded to different ring constituent atoms.
  • Each of the i R 31s may be bonded to a separate ring atom, or two of the i R 31s may be bonded to one ring carbon atom. There may be two or more ring-constituting carbon atoms to which two R 31s are bonded.
  • X 31 is a group having a carbon atom, a nitrogen atom, a silicon atom, a 4- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring, from the viewpoint of improving the wear resistance of the surface treatment layer. is preferable, and carbon atom is more preferable.
  • Q b is a single bond or a divalent linking group.
  • divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof.
  • the divalent hydrocarbon group may be a divalent saturated hydrocarbon group, a divalent aromatic hydrocarbon group, an alkenylene group, or an alkynylene group.
  • the divalent saturated hydrocarbon group may be linear, branched, or cyclic, and includes, for example, an alkylene group.
  • the number of carbon atoms in the divalent saturated hydrocarbon group is preferably 1 to 30, more preferably 1 to 20.
  • the alkylene group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms.
  • the alkynylene group preferably has 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms.
  • the divalent aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, such as a phenylene group.
  • the divalent hydrocarbon group may be an alkenylene group having 2 to 20 carbon atoms or an alkynylene group having 2 to 20 carbon atoms.
  • R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group.
  • the above R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • groups combining two or more of the above include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )- , -N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N( R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, -N(R d )C(O )-, an alkylene group having an etheric oxygen atom, an
  • Q c is a single bond, -O-, -S-, -N(R d )-, -C(O)N(R d )-, -OC(O)N(R d ) -, -C(O)O-, -OC(O)-, and -C(O)S- are preferred, and single bonds, -OC(O)N(R d )-, and -OC(O)- is more preferable. Excludes the case where the terminal of Q c that is bonded to the specific polyalkylene oxide chain is -O-.
  • R 31 is a hydrogen atom, a hydroxyl group or an alkyl group.
  • the number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.
  • h is an integer greater than or equal to 1
  • i is an integer greater than or equal to 0.
  • X 31 is a single bond or an alkylene group
  • h is 1 and i is 0.
  • X 31 is a nitrogen atom
  • h is an integer of 1 to 2
  • i is an integer of 0 to 1
  • X 31 is a carbon atom or a silicon atom
  • h is an integer of 1 to 3
  • i is an integer of 0 to 2
  • X 31 is a divalent to octavalent organopolysiloxane residue
  • h is an integer of 1 to 7
  • i is an integer of 0 to 6
  • X 31 is a group having a (h+i+1)-valent ring
  • h is an integer of 1 to 7
  • i is an integer of 0 to 6
  • two or more (-Q b -Si(R 1 ) n L 2 3-n ) are the same. It may be different or different.
  • two or more (-R 31 )s may be the same or different.
  • i is preferably 0 from the viewpoint of improving the wear resistance of the surface treatment layer.
  • Q c is a single bond or a divalent linking group.
  • the definition and details of the divalent linking group are the same as those explained in Q a above.
  • R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
  • the alkyl group a methyl group is preferred.
  • Q d is a single bond or an alkylene group.
  • the alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms. From the viewpoint of easy production of the compound, Q d is preferably a single bond or -CH 2 -.
  • R 33 is a hydrogen atom or a halogen atom, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
  • y is an integer from 1 to 10, preferably from 1 to 6.
  • Two or more [CH 2 C(R 32 )(-Q d -Si(R 1 ) n L 2 3-n )] may be the same or different.
  • groups (3-1A-1) to (3-1A-7) are preferable.
  • X 32 is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)-, -C(O)N(R d )-, -S-, -C(O)S-, or -N(R d )- (however, N in the formula is bonded to Q b1 do).
  • the definition of R d is as described above. s1 is 0 or 1.
  • Q b1 is an alkylene group.
  • the alkylene group may have -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group.
  • the alkylene group may have a plurality of groups selected from the group consisting of -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, and a dialkylsilylene group.
  • alkylene group has -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group
  • Q b1 preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 2 to 6 carbon atoms.
  • (X 32 ) s1 is -C(O)N(R d )-, it is preferably an alkylene group having 2 to 6 carbon atoms (however, N in the formula is bonded to Q b1 ).
  • Q b1 is one of these groups, the compound can be easily produced.
  • group (3-1A-1) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • X 33 is -NH-, -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d ) C(O)- or -C(O)N(R d )-.
  • R d is as described above.
  • Q a2 is a single bond, an alkylene group, -C(O)-, or an etheric oxygen atom, -C(O)-, -C(O) between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the alkylene group represented by Q a2 preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms.
  • Ether oxygen atom -C(O)-, -C(O)O-, -OC(O)-, -C between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q a2 (O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O -, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, or -NH-
  • the number of carbon atoms in the group having is preferably 2 to 10, more preferably 2 to 6.
  • Q a2 is -CH 2 -, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 - , -CH 2 NHCH 2 CH 2 - from the viewpoint of easy production of the compound.
  • -CH 2 OC(O)CH 2 CH 2 -, or -C(O)- are preferred.
  • s2 is 0 or 1. However, when s2 is 0, Q a2 is not a single bond, and the terminal of Q a2 that is bonded to the specific polyalkylene oxide chain is not -O-. s2 is preferably 0 from the viewpoint of easy production of the compound.
  • Q b2 is an alkylene group or a group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b2 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the number of carbon atoms in the group having a divalent organopolysiloxane residue, ether oxygen atom or -NH- between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b2 is 2 to 10. is preferable, and 2 to 6 are more preferable.
  • the two [-Q b2 -Si(R 1 ) n L 2 3-n ] may be the same or different.
  • group (3-1A-2) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • ⁇ in (CH 2 ) ⁇ bonded to the reactive silyl group is an integer representing the number of methylene groups, preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, It may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • a plurality of ⁇ 's contained in the same compound may be the same or different, but are preferably the same. For example, all of the plurality of ⁇ s contained in the same compound are 2, 3, 8, 9, and 11. The same applies below.
  • Q a3 is a single bond or an alkylene group which may have an etheric oxygen atom, and a single bond is preferred from the viewpoint of ease of manufacturing the compound.
  • the alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, particularly preferably 2 to 6 carbon atoms.
  • R g is a hydrogen atom, a hydroxyl group, or an alkyl group. From the viewpoint of easy production of the compound, R g is preferably a hydrogen atom or an alkyl group.
  • the alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably a methyl group.
  • Q b3 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b3 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms, represented by Q b3 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
  • Q b3 is preferably -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, or -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound.
  • the two [-Q b3 -Si(R 1 ) n L 2 3-n ] may be the same or different.
  • group (3-1A-3) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • Q e is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)- or -C(O)N(R d )-.
  • R 31 is as described above.
  • s4 is 0 or 1.
  • Q a4 is a single bond or an alkylene group which may have an etheric oxygen atom.
  • the alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, more preferably 2 to 6 carbon atoms.
  • t4 is 0 or 1 (however, when Q a4 is a single bond, it is 0).
  • -Q a4 -(O) t4 - is a single bond, -CH 2 O-, -CH 2 OCH 2 -, -CH 2 OCH 2 CH 2 when s4 is 0, from the viewpoint of easy production of the compound.
  • O-, -CH 2 OCH 2 CH 2 OCH 2 -, -CH 2 OCH 2 CH 2 CH 2 CH 2 OCH 2 - are preferred (however, the left side is bonded to the specific polyalkylene oxide chain), and s4 is 1.
  • a single bond, -CH 2 -, and -CH 2 CH 2 - are preferable.
  • Q b4 is an alkylene group, and the alkylene group is -O-, -C(O)N(R d )- (the definition of R d is as described above), a silphenylene skeleton group, a divalent It may or may not have an organopolysiloxane residue or a dialkylsilylene group.
  • the alkylene group has -O- or a silphenylene skeleton group, it is preferable to have -O- or a silphenylene skeleton group between carbon atoms.
  • the terminal between carbon atoms or the side bonded to (O) u4 preferably has these groups.
  • the number of carbon atoms in the alkylene group represented by Q b4 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the range may be from 1 to 10.
  • u4 is 0 or 1.
  • -(O) u4 -Q b4 - includes -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 from the viewpoint of easy production of the compound.
  • OCH 2 CH 2 CH 2 CH 2 CH 2 -, -OCH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -- and --CH 2 CH 2 CH 2 Si(CH 3 ) 2 PhSi(CH 3 ) 2 CH 2 CH 2 -- are preferred (however, the right side is bonded to Si).
  • w1 is an integer from 0 to 2, preferably 0 or 1, and more preferably 0. If there are two or more [-(O) u4 -Q b4 -Si(R 1 ) n L 2 3-n ], two or more [-(O) u4 -Q b4 -Si(R 1 ) n L 2 3-n ] may be the same or different. When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
  • group (3-1A-4) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • X 34 is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)-, -C(O)N(R d )-, -S-, -C(O)S-, or -N(R d )- (however, N in the formula is bonded to Q b1 do).
  • the definition of R d is as described above.
  • s3 is 0 or 1.
  • Q a5 is an alkylene group which may have an ether oxygen atom.
  • the alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, particularly preferably 2 to 6 carbon atoms.
  • Q a5 from the viewpoint of easy production of the compound, when s3 is 0, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH 2 CH 2- , -CH 2 CH 2 CH 2 - are preferred (however, the right side is bonded to Si).
  • Q a5 is preferably -CH 2 CH 2 CH 2 - or -CH 2 CH 2 OCH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound.
  • Q a5 is preferably an alkylene group having 2 to 6 carbon atoms from the viewpoint of easy production of the compound (however, N in the formula Q a5 ).
  • Q b5 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b5 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the number of carbon atoms in the group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b5 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
  • Q b5 is preferably -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - (provided that the right side is Si(R 1 ) n L 2 3-n .).
  • the three [-Q b5 -Si(R 1 ) n L 2 3-n ] may be the same or different.
  • group (3-1A-5) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • Q a6 is an alkylene group which may have an ether oxygen atom.
  • the alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, more preferably 2 to 6 carbon atoms.
  • Q a6 is -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH 2 CH 2 - , -CH 2 CH 2 from the viewpoint of easy production of the compound. 2 CH 2 - is preferred (provided that the right side is bonded to Z a ).
  • Z a is a (w2+1)-valent organopolysiloxane residue or a (w2+1)-valent group having an alkylene group between the organopolysiloxane residues.
  • w2 is an integer from 2 to 7.
  • Examples of (w2+1)-valent organopolysiloxane residues and (w2+1)-valent groups having an alkylene group between organopolysiloxane residues include the following groups: .
  • R a in the following formula is as described above.
  • Q b6 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b6 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b6 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
  • Q b6 -CH 2 CH 2 - and -CH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound.
  • w2 [-Q b6 -Si(R 1 ) n3 L 2 3-n ] may be the same or different.
  • group (3-1A-6) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • Z c is a (w3+w4+1)-valent hydrocarbon group.
  • w3 is an integer of 4 or more.
  • w4 is an integer greater than or equal to 0.
  • the definitions and preferred ranges of Q e , s4, Q a4 , t4, Q b4 , and u4 are the same as the definitions of each symbol in group (3-1A-4).
  • Z c may consist of a hydrocarbon chain, may have an ether oxygen atom between carbon atoms of the hydrocarbon chain, and is preferably composed of a hydrocarbon chain.
  • the valence of Z c is preferably 5 to 20, more preferably 5 to 10, even more preferably 5 to 8, particularly preferably penta or hexavalent.
  • the number of carbon atoms in Z c is preferably 3 to 50, more preferably 4 to 40, even more preferably 5 to 30.
  • w3 is preferably 4 to 20, more preferably 4 to 16, even more preferably 4 to 8, and particularly preferably 4 or 5.
  • w4 is preferably 0 to 10, more preferably 0 to 8, even more preferably 0 to 6, particularly preferably 0 to 3, and most preferably 0 or 1.
  • two or more [-(O-Q b4 ) u4 -Si(R 1 ) n L 2 3-n ] may be the same or different.
  • group (3-1A-7) include the following groups.
  • * represents the bonding position with the specific polyalkylene oxide chain.
  • the A 1 side is connected to the specific polyalkylene oxide chain, and the Q 22 , Q 23 , Q 24 , Q 25 or Q 26 side is (-Si(R 1 ) n L 2 3-n ). Furthermore, in formulas (g2-1) to (g2-7), the terminal bonded to the specific polyalkylene oxide chain is not -O-.
  • a 1 is a single bond, -C(O)NR 6 -, -C(O)-, -NHC(O)O-, -NHC(O)NR 6 -, NR 6 -, or SO 2 NR 6 - It is.
  • Q 11 is a single bond, -O-, an alkylene group, or a bond between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 -, or It is a group having O-.
  • Q 12 has -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of a single bond, an alkylene group, or an alkylene group having 2 or more carbon atoms. It is the basis.
  • Q 13 is a single bond, an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , or a group having -C(O)- at the N-side end of the alkylene group.
  • Q 14 is Q 12 when the atom in Z 1 to which Q 14 is bonded is a carbon atom, and is Q 13 when the atom in Z 1 to which Q 14 is bonded is a nitrogen atom.
  • Q 15 has -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of a single bond, an alkylene group, or an alkylene group having 2 or more carbon atoms. It is the basis.
  • Q 22 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms, an alkylene group A group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si, or between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si and -C(O)NR 6 -, -C(O) It is a group having -, -NR 6 - or O-, and when Y 1 has two or more Q 22s , two or more Q 22s may be the same or different.
  • Q 23 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , two Q23s may be the same or different.
  • Q 24 is Q 22 when the atom in Z 1 to which Q 24 is bonded is a carbon atom, and Q 23 when the atom in Z 1 to which Q 24 is bonded is a nitrogen atom; When there are two or more, two or more Q24 may be the same or different.
  • Q 25 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , Y 1 has two or more Q 25s , the two or more Q 25s may be the same or different.
  • Q 26 is a single bond, an alkylene group, or a carbon-carbon atom of an alkylene group having 2 or more carbon atoms with -C(O)NR 6 -, -C(O)-, -NR 6 - or -O-. It is a group that has However, when A1 is a single bond, Q26 is a group other than a single bond.
  • Z 1 is a group having an h1+h2 valent ring structure in which Q 14 has a carbon atom or nitrogen atom to which Q 24 is directly bonded, and Q 24 has a carbon atom or nitrogen atom to which Q 24 is directly bonded.
  • R e1 is a hydrogen atom or an alkyl group, and when Y 1 has two or more R e1s , the two or more R e1s may be the same or different.
  • R e2 is a hydrogen atom, a hydroxyl group, an alkyl group, or an acyloxy group.
  • R e3 is an alkyl group.
  • R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
  • d1 is an integer from 0 to 1.
  • d2 is an integer from 0 to 3, preferably 1 or 2.
  • d1+d2 is an integer from 1 to 3.
  • d3 is an integer from 0 to 1.
  • d4 is an integer from 0 to 3, preferably 2 or 3.
  • d3+d4 is an integer from 1 to 3.
  • d1+d3 is 1.
  • d2+d4 is an integer from 1 to 5, preferably 4 or 5.
  • e1+e2 is 3 or 4.
  • e1 is 1.
  • e2 is an integer from 1 to 3, preferably 2 or 3.
  • h1 is 1.
  • h2 is an integer of 1 or more, preferably 2 or 3.
  • i1+i2 is 3 or 4.
  • i1 is 1.
  • i2 is an integer from 1 to 3, preferably 2 or 3. i3 is 2 or 3.
  • the number of carbon atoms in the alkylene groups of Q 11 , Q 12 , Q 13 , Q 14 , Q 15 , Q 22 , Q 23 , Q 24 , Q 25 and Q 26 is determined from the viewpoint of easy production of compound (1) and surface treatment. From the viewpoint of further improving the abrasion resistance of the layer, the number is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
  • Examples of the ring structure in Z 1 include the ring structures described above, and preferred forms are also the same.
  • Q 14 and Q 24 are directly bonded to the ring structure in Z 1 , for example, an alkylene group is not connected to the ring structure and Q 14 or Q 24 is not connected to the alkylene group.
  • the number of carbon atoms in the alkyl group of R e1 , R e2 or R e3 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
  • the number of carbon atoms in the alkyl group moiety of the acyloxy group in R e2 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
  • h2 is preferably 2 to 6, more preferably 2 to 4, and even more preferably 2 or 3, from the viewpoint of facilitating the production of compound (1) and the viewpoint of further improving the abrasion resistance of the surface treatment layer.
  • the A 1 side is connected to the specific polyalkylene oxide chain, and the G 1 side is connected to (-Si(R 1 ) n L 2 3-n ).
  • G 1 is a group (g3), and two or more G 1s in Y 1 may be the same or different.
  • the symbols other than G 1 are the same as those in equations (g2-1) to (g2-7).
  • the Si side is connected to Q 22 , Q 23 , Q 24 , Q 25 and Q 26 , and the Q 3 side is connected to (-Si(R 1 ) n L 2 3-n ).
  • R 8 is an alkyl group.
  • Q 3 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or -O- between carbon atoms of an alkylene group having 2 or more carbon atoms, or (OSi(R 9 ) 2 ) p -O-, and two or more Q 3 may be the same or different.
  • R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
  • R 9 is an alkyl group, a phenyl group, or an alkoxy group, and two R 9s may be the same or different.
  • p is an integer from 0 to 5, and when p is 2 or more, two or more (OSi(R 9 ) 2 ) may be the same or different.
  • the terminal bonded to the specific polyalkylene oxide chain is not -O-.
  • the number of carbon atoms in the alkylene group of Q3 is preferably 1 to 30, more preferably 1 to 20, more preferably 2 to 20 is more preferable, and may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
  • the number of carbon atoms in the alkyl group of R 8 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
  • the number of carbon atoms in the alkyl group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
  • the number of carbon atoms in the alkoxy group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent storage stability of compound (1).
  • p is preferably 0 or 1.
  • Examples of the partial structure D of compound (1) include the partial structure of the following formula.
  • a compound having the partial structure of the following formula as partial structure D is preferable from the viewpoints of being easy to industrially produce, easy to handle, and providing a surface treatment layer with excellent abrasion resistance.
  • R t in the compound of the following formula is the same as -(R 2 O) a2 (CH 2 CH 2 O) b2 - in the above-mentioned formula (1), and the preferred forms are also the same.
  • Examples of the partial structure D in which Y 1 is a group (g2-1) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-2) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-3) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-4) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-5) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-6) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-7) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-8) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-9) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-10) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-11) include partial structures of the following formula.
  • Examples of the partial structure D in which Y 1 is a group (g2-12) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-13) include partial structures of the following formula.
  • Examples of partial structure D in which Y 1 is a group (g2-14) include partial structures of the following formula.
  • Examples of the compounds of the present disclosure include the following compounds.
  • a1 to a4 and b1 to b4 are each independently an integer of 1 to 300
  • a11, a12, a21, and a22 are each independently an integer of 1 to 299
  • a11+a12 is 2 to 300.
  • a21+a22 is an integer of 2 to 300.
  • the number average molecular weight (Mn) of the compound of the present disclosure is preferably 400 to 20,000, more preferably 500 to 18,000, even more preferably 600 to 15,000, and even more preferably 700 to 18,000. 10,000 is particularly preferred, and 800 to 6,000 is most preferred. If Mn is 400 or more, the property of reducing fingerprint visibility and the abrasion resistance are excellent. When Mn is 20,000 or less, the viscosity can be easily controlled within an appropriate range, and solubility is improved, resulting in excellent handling properties during film formation.
  • the method for producing the compound of the present disclosure is not particularly limited.
  • An example of a method for producing the compound of the present disclosure includes the following method. Specifically, first, at least one selected from the group consisting of polyhydric alcohols, polyhydric phenols, and polyamines having a linking group structure represented by Q 1 in formula (1) above is used as an initiator. . Then, by polymerizing ethylene oxide and an alkylene oxide having 3 to 6 carbon atoms in the presence of potassium hydroxide, a compound in which a specific polyalkylene oxide chain is bonded to the linking group Q is obtained. Furthermore, the compound of the present disclosure is obtained by reacting a portion of the terminal hydroxy group of the specific polyalkylene oxide chain with a compound having a group capable of reacting with the hydroxy group and a reactive silyl group.
  • examples of the group capable of reacting with a hydroxy group in a compound having a group capable of reacting with a hydroxy group and a reactive silyl group include an isocyanato group, an amino group, a mercapto group, and the like.
  • the value of Ma/(Ma+Mb) in the obtained compound can be controlled by controlling the amount of ethylene oxide and the amount of alkylene oxide having 3 to 6 carbon atoms, which are added when ethylene oxide and alkylene oxide having 3 to 6 carbon atoms are polymerized. Examples include a method of adjusting the ratio to the amount added.
  • some of the terminal hydroxy groups of the specific polyalkylene oxide chain examples include a method of adjusting the amount of the compound having a reactive silyl group added when reacting the compound having a reactive silyl group.
  • compositions of the present disclosure only needs to contain the compound of the present disclosure, and components other than the compound of the present disclosure are not particularly limited.
  • Compositions of the present disclosure preferably include a compound of the present disclosure and a liquid medium.
  • the composition of the present disclosure may be in a liquid state, and may be a solution or a dispersion.
  • the composition of the present disclosure only needs to contain the compound of the present disclosure, and may contain impurities such as by-products generated in the manufacturing process of the compound of the present disclosure.
  • the composition of the present disclosure may contain one type of compound of the present disclosure, or may contain two or more types of compounds of the present disclosure.
  • the content of the compound of the present disclosure is preferably 0.001 to 40% by mass, more preferably 0.01 to 20% by mass, and further preferably 0.1 to 10% by mass, based on the total amount of the composition of the present disclosure.
  • the content of the compound of the present disclosure in the composition of the present disclosure used in the wet coating method may be 0.01 to 10% by mass, and 0.02 to 5% by mass, based on the total amount of the composition of the present disclosure. It may be 0.03 to 3 mass %, or 0.05 to 2 mass %.
  • the liquid medium preferably contains an organic solvent and water.
  • organic solvents include compounds consisting only of hydrogen atoms and carbon atoms, and compounds consisting only of hydrogen atoms, carbon atoms, and oxygen atoms.
  • examples include hydrocarbon-based organic solvents, ketone-based organic solvents, and ethers.
  • examples include organic solvents based on organic solvents, organic solvents based on esters, organic solvents based on glycol, and organic solvents based on alcohol.
  • hydrocarbon organic solvents include pentane, hexane, heptane, octane, hexadecane, isohexane, isooctane, isononane, cycloheptane, cyclohexane, bicyclohexyl, benzene, toluene, ethylbenzene, o-xylene, m-xylene, Examples include p-xylene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene, n-butylbenzene, sec-butylbenzene, and tert-butylbenzene.
  • ketone organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, 2-heptanone, 4-heptanone, 3,5,5-trimethyl-2-cyclohexen-1-one, and 3,5,5-trimethyl-2-cyclohexen-1-one. Examples include 3,5-trimethylcyclohexanone and isophorone.
  • ether organic solvents include diethyl ether, cyclopentyl methyl ether, tetrahydrofuran, and 1,4-dioxane.
  • ester organic solvents include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, tert-butyl acetate, amyl acetate, isoamyl acetate, ethyl 3-ethoxypropionate, and ethyl ethylene glycol lactate.
  • glycol-based organic solvents include ethylene glycol, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and ethylene glycol mono-2.
  • alcoholic organic solvents include methanol, ethanol, 1-propanol, isopropyl alcohol, n-butanol, diacetone alcohol, isobutanol, sec-butanol, tert-butanol, pentanol, 3-methyl-1,3 -Butanediol, 1,3-butanediol, 1,3-butylene glycol, octanediol, 2,4-diethylpentanediol, butylethylpropanediol, 2-methyl-1,3-propanediol, 4-hydroxy-4 -Methyl-2-pentanone, 2-ethyl-1-hexanol, 3,5,5-trimethyl-1-hexanol, isodecanol, isotridecanol, 3-methoxy-3-methyl-1-butanol, 2-methoxybutanol , 3-methoxybutanol, cyclo
  • examples of the organic solvent include halogenated organic solvents, nitrogen-containing compounds, sulfur-containing compounds, and siloxane compounds.
  • halogenated organic solvents include dichloromethane, chloroform, carbon tetrachloride, dichloroethane, chlorobenzene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, m-dichlorobenzene, 1,2,3-trichloropropane. can be mentioned.
  • nitrogen-containing compounds include nitrobenzene, acetonitrile, benzonitrile, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and 1,3-dimethyl-2-imidazolidinone.
  • sulfur-containing compounds include carbon disulfide and dimethyl sulfoxide.
  • siloxane compound include hexamethyldisiloxane, octamethyltrisiloxane, and decamethyltetrasiloxane.
  • Two or more kinds of organic solvents may be mixed, for example, a glycol-based organic solvent and an alcohol-based organic solvent may be mixed.
  • the content of the organic solvent is preferably 90 to 99% by mass, more preferably 93 to 99% by mass, and even more preferably 95 to 99% by mass, based on the total amount of the liquid medium.
  • the water content is preferably 1 to 10% by mass, more preferably 1 to 7% by mass, and even more preferably 1 to 5% by mass, based on the total amount of the liquid medium.
  • the content of the liquid medium is preferably 60 to 99.999% by mass, more preferably 80 to 99.99% by mass, and even more preferably 90 to 99.9% by mass, based on the total amount of the composition of the present disclosure.
  • the content of the liquid medium may be 90-99.99% by weight, 95-99% by weight, based on the total amount of the composition of the present disclosure. It may be .98% by mass, 97 to 99.97% by mass, or 98 to 99.95% by mass.
  • the composition of the present disclosure may contain only one type of liquid medium, or may contain two or more types.
  • composition of the present disclosure may contain other components in addition to the compound of the present disclosure and the liquid medium, as long as the effects of the present disclosure are not impaired.
  • other components include known additives such as acid catalysts and basic catalysts that promote hydrolysis and condensation reactions of reactive silyl groups.
  • acid catalysts include hydrochloric acid, nitric acid, acetic acid, sulfuric acid, phosphoric acid, sulfonic acid, methanesulfonic acid, and p-toluenesulfonic acid.
  • acid catalysts include hydrochloric acid, nitric acid, acetic acid, sulfuric acid, phosphoric acid, sulfonic acid, methanesulfonic acid, and p-toluenesulfonic acid.
  • basic catalysts include sodium hydroxide, potassium hydroxide, and ammonia.
  • a metal compound having a hydrolyzable group is also referred to as a "specific metal compound”
  • Specific metal compounds include the following formulas (M1) to (M3).
  • M represents a trivalent or tetravalent metal atom.
  • Each of X b1 independently represents a hydrolyzable group.
  • Each of X b2 independently represents a siloxane skeleton-containing group.
  • Each of X b3 independently represents a hydrocarbon chain-containing group.
  • m1 is an integer from 2 to 4
  • m2 and m3 are each independently an integer of 0 to 2
  • When M is a trivalent metal atom, m1+m2+m3 is 3, and when M is a tetravalent metal atom, m1+m2+m3 is 4.
  • X b4 represents a hydrolyzable silane oligomer residue.
  • Each of X b5 independently represents a hydrolyzable group or an alkyl group having 1 to 4 carbon atoms.
  • X b6 and X b7 each independently represent a hydrolyzable group or a hydroxyl group.
  • Y b1 represents a divalent organic group.
  • the metal represented by M also includes semimetals such as Si and Ge.
  • M is preferably a trivalent metal or a tetravalent metal, more preferably Al, Fe, In, Hf, Si, Ti, Sn, and Zr, even more preferably Al, Si, Ti, and Zr, and particularly preferably Si. .
  • the hydrolyzable group represented by X b1 is the hydrolyzable group represented by L 2 in (-Si(R 1 ) n L 2 3-n ) in the above reactive silyl group. The same can be mentioned.
  • the siloxane skeleton-containing group represented by X b2 has a siloxane unit (-Si-O-) and may be linear or branched.
  • the siloxane unit is preferably a dialkylsilyloxy group, such as a dimethylsilyloxy group or a diethylsilyloxy group.
  • the number of repeating siloxane units in the siloxane skeleton-containing group is 1 or more, preferably 1 to 5, more preferably 1 to 4, and even more preferably 1 to 3.
  • the siloxane skeleton-containing group may include a divalent hydrocarbon group in a part of the siloxane skeleton.
  • some oxygen atoms in the siloxane skeleton may be replaced with divalent hydrocarbon groups.
  • the divalent hydrocarbon group include alkylene groups such as a methylene group, an ethylene group, a propylene group, and a butylene group.
  • a hydrolyzable group, a hydrocarbon group (preferably an alkyl group), etc. may be bonded to the terminal silicon atom of the siloxane skeleton-containing group.
  • the number of elements in the siloxane skeleton-containing group is preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. The number of elements is preferably 10 or more.
  • the siloxane skeleton-containing group is preferably a group represented by * -(O-Si(CH 3 ) 2 ) n CH 3 , where n is an integer from 1 to 5, and * represents a bond with an adjacent atom. Represents a part.
  • the hydrocarbon chain-containing group represented by X b3 may be a group consisting only of a hydrocarbon chain, or may be a group having an etheric oxygen atom between carbon atoms of the hydrocarbon chain.
  • the hydrocarbon chain may be straight or branched, preferably straight.
  • the hydrocarbon chain may be a saturated hydrocarbon chain or an unsaturated hydrocarbon chain, with a saturated hydrocarbon chain being preferred.
  • the number of carbon atoms in the hydrocarbon chain-containing group is preferably 1 to 3, more preferably 1 to 2, and even more preferably 1.
  • the hydrocarbon chain-containing group is preferably an alkyl group, more preferably a methyl group, an ethyl group, or a propyl group.
  • m1 is 3 or 4.
  • compound represented by formula (M1) compounds represented by the following formulas (M1-1) to (M1-5) where M is Si are preferable, and the compound represented by formula (M1-1) is More preferred.
  • compound represented by formula (M1-1) tetraethoxysilane, tetramethoxysilane, and triethoxymethylsilane are preferred.
  • the number of silicon atoms contained in the hydrolyzable silane oligomer residue represented by X b4 is preferably 3 or more, more preferably 5 or more, and even more preferably 7 or more.
  • the number of silicon atoms is preferably 15 or less, more preferably 13 or less, and even more preferably 10 or less.
  • the hydrolyzable silane oligomer residue may have an alkoxy group bonded to a silicon atom. Examples of the alkoxy group include methoxy group, ethoxy group, propoxy group, butoxy group, and methoxy group and ethoxy group are preferred.
  • the hydrolyzable silane oligomer residue may have one or more types of these alkoxy groups, and preferably has one type. Examples of the hydrolyzable silane oligomer residue include (C 2 H 5 O) 3 Si-(OSi(OC 2 H 5 ) 2 ) 4 O- * and the like.
  • * represents a bonding site with an adjacent atom.
  • the hydrolyzable group represented by X b5 is the hydrolyzable group represented by L 2 in (-Si(R 1 ) n L 2 3-n ) in the above reactive silyl group.
  • Examples include those similar to , a cyano group, a hydrogen atom, and an allyl group, with an alkoxy group or an isocyanato group being preferred.
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
  • X b5 a hydrolyzable group is preferable.
  • Examples of the compound represented by formula (M2) include (H 5 C 2 O) 3 -Si-(OSi(OC 2 H 5 ) 2 ) 4 OC 2 H 5 and the like.
  • the compound represented by formula (M3) is a compound having a reactive silyl group at both ends of a divalent organic group, that is, bissilane.
  • the hydrolyzable groups represented by X b6 and X b7 include an alkoxy group, an acyloxy group, a ketoxime group, an alkenyloxy group, an amino group, an aminoxy group, an amide group, an isocyanato group, and a halogen atom.
  • an alkoxy group and an isocyanato group are preferred.
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms, more preferably a methoxy group or an ethoxy group.
  • X b6 and X b7 may be the same group or different groups. From the viewpoint of availability, it is preferable that X b6 and X b7 are the same group.
  • Y b1 is a divalent organic group that connects the reactive silyl groups at both ends.
  • the number of carbon atoms in Y b1 of the divalent organic group is preferably 1 to 8, more preferably 1 to 3.
  • Examples of Y b1 include an alkylene group, a phenylene group, and an alkylene group having an etheric oxygen atom between carbon atoms.
  • Examples of the compound represented by formula (M3) include (CH 3 O) 3 Si(CH 2 ) 2 Si(OCH 3 ) 3 , (C 2 H 5 O) 3 Si(CH 2 ) 2 Si(OC 2 H 5 ) 3 , (OCN) 3Si ( CH2 ) 2Si ( NCO ) 3 , Cl3Si( CH2 ) 2SiCl3 , ( CH3O ) 3Si ( CH2 ) 6Si ( OCH3 ) 3 , ( C2H5O ) 3Si ( CH2 ) 6Si ( OC2H5 ) 3 is mentioned.
  • the content of other components that may be included in the composition of the present disclosure is preferably 10% by mass or less, more preferably 1% by mass or less, based on the total amount of the composition of the present disclosure.
  • the content of the specific metal compound is preferably 0.01 to 30% by mass, more preferably 0.01 to 10% by mass based on the total amount of the composition of the present disclosure. , more preferably 0.05 to 5% by mass.
  • the total content of the compound of the present disclosure and other components is preferably 0.001 to 40% by mass, and 0.01% by mass, based on the total amount of the composition of the present disclosure. ⁇ 20% by mass is more preferred, and 0.1 ⁇ 10% by mass is even more preferred.
  • the solid content concentration of the composition of the present disclosure is a value calculated from the mass of the composition before heating and the mass after heating in a convection dryer at 120° C. for 4 hours.
  • composition of the present disclosure contains a liquid medium, it is useful for coating purposes and can be used as a coating liquid.
  • the surface treatment agent of the present disclosure comprises a compound of the present disclosure.
  • the surface treatment agent of the present disclosure may include the compound of the present disclosure and a liquid medium.
  • the surface treating agent of the present disclosure may be a composition of the present disclosure. Preferred embodiments of the liquid medium contained in the surface treatment agent are the same as those of the liquid medium contained in the composition of the present disclosure.
  • the compound of the present disclosure has the above-mentioned structure, by using a surface treatment agent containing the compound of the present disclosure, it is possible to form a surface treatment layer with excellent properties of reducing fingerprint visibility and excellent abrasion resistance.
  • the article of the present disclosure includes a base material and a surface treatment layer surface treated with the surface treatment agent.
  • the surface treatment layer may be formed on a part of the surface of the base material, or may be formed on the entire surface of the base material.
  • the surface treatment layer may be spread over the surface of the base material in the form of a film, or may be scattered in the form of dots.
  • the compound of the present disclosure is contained in a state in which hydrolysis of some or all of the reactive silyl groups has proceeded, and a dehydration condensation reaction of the silanol groups has proceeded.
  • the thickness of the surface treatment layer is preferably 1 to 100 nm, more preferably 1 to 50 nm. If the thickness of the surface treatment layer is 1 nm or more, the effect of the surface treatment is likely to be sufficiently obtained. If the thickness of the surface treatment layer is 100 nm or less, the utilization efficiency is high.
  • the thickness of the surface treatment layer is determined by using an X-ray diffractometer for thin film analysis (product name "ATX-G", manufactured by RIGAKU) to obtain an interference pattern of reflected X-rays by the X-ray reflectance method. It can be calculated from the vibration period of
  • the contact angle of water on the surface of the surface treatment layer is preferably 7 degrees or less, more preferably 6 degrees or less, and even more preferably 5 degrees or less.
  • the lower limit of the contact angle of water on the surface of the surface treatment layer is not particularly limited, and may be, for example, 2 degrees.
  • the water contact angle is a value measured in accordance with JIS R 3257:1999 "Method for testing wettability of substrate glass surface.” Specifically, water droplets are placed at five locations on the surface of the surface treatment layer to be measured, and the contact angle of water is measured for each water droplet by the sessile drop method. The amount of water droplets is approximately 2 ⁇ L/drop, and the measurement is performed in an environment at a temperature of 23° C., and the average value of the measured values at 5 locations is defined as the above-mentioned “water contact angle”.
  • the type of base material is not particularly limited, and includes, for example, base materials that are required to have characteristics that reduce fingerprint visibility.
  • a base material for example, a base material that may be used in contact with another article (e.g., a stylus) or a person's fingers; a base material that may be held by a person's fingers during operation; , a mounting table).
  • the base material include metal, resin, glass, sapphire, ceramic, stone, fiber, nonwoven fabric, paper, wood, natural leather, artificial leather, and composite materials thereof.
  • the glass may be chemically strengthened.
  • Base materials include building materials, decorative building materials, interior goods, transportation equipment (e.g. automobiles), signboards/bulletin boards, drinking vessels/tableware, aquariums, ornamental equipment (e.g. frames, boxes), laboratory equipment, furniture, textile products. , Packaging containers; Glass or resin used for art, sports, games, etc.; Used for the exterior parts (excluding display parts) of devices such as mobile phones (e.g. smartphones), personal digital assistants, game consoles, remote controls, etc. Examples include glass or resin.
  • the shape of the base material may be a plate shape or a film shape.
  • touch panel base materials As the base material, touch panel base materials, display base materials, and eyeglass lenses are suitable, and touch panel base materials are particularly suitable.
  • touch panel base materials As the material for the touch panel base material, glass or transparent resin is preferable.
  • the base material may be a base material that has been subjected to surface treatment such as corona discharge treatment, plasma treatment, plasma graft polymerization treatment, etc. on one surface or both surfaces.
  • the surface-treated base material has better adhesion with the surface-treated layer, and the abrasion resistance of the surface-treated layer is further improved. Therefore, it is preferable to perform surface treatment on the surface of the base material that is in contact with the surface treatment layer. Further, when the surface-treated base material is provided with a base layer, which will be described later, the adhesion with the base layer is better, and the wear resistance of the surface-treated layer is further improved. Therefore, when a base layer is provided, it is preferable to perform a surface treatment on the surface of the base material that is in contact with the base layer.
  • the surface treatment layer may be provided directly on the surface of the base material, or a base layer may be provided between the base material and the surface treatment layer.
  • the article of the present disclosure includes a base material, a base layer disposed on the base material, and a base layer disposed on the base layer. It is preferable to include a surface treatment layer whose surface is treated with the surface treatment agent of the present disclosure.
  • the base layer includes silicon and at least one selected from the group consisting of a group 1 element, a group 2 element, a group 4 element, a group 5 element, a group 13 element, and a group 15 element of the periodic table.
  • a layer containing an oxide containing a specific element is preferable.
  • Group 1 elements of the periodic table mean lithium, sodium, potassium, rubidium, and cesium.
  • Group 1 elements lithium, sodium, and potassium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • the underlayer may contain two or more types of Group 1 elements.
  • Group 2 elements of the periodic table mean beryllium, magnesium, calcium, strontium, and barium.
  • Group 2 elements magnesium, calcium, and barium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • magnesium and calcium are more preferable.
  • the underlayer may contain two or more types of Group 2 elements.
  • Group 4 elements of the periodic table mean titanium, zirconium, and hafnium.
  • Group 4 element titanium and zirconium are preferable from the viewpoint of being able to form a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Titanium is more preferred.
  • the base layer may contain two or more types of Group 4 elements.
  • Group 5 elements of the periodic table mean vanadium, niobium, and tantalum.
  • Group 5 element vanadium is particularly preferable from the viewpoint of providing better wear resistance of the surface treatment layer.
  • the underlayer may contain two or more types of Group 5 elements.
  • Group 13 elements of the periodic table mean boron, aluminum, gallium, and indium.
  • Group 13 elements boron, aluminum, and gallium are selected from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects, or from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • boron and aluminum are more preferable.
  • the base layer may contain two or more types of Group 13 elements.
  • Group 15 elements of the periodic table mean nitrogen, phosphorus, arsenic, antimony, and bismuth.
  • Group 15 elements, phosphorus, antimony, and bismuth are used from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • phosphorus and bismuth are more preferable.
  • the base layer may contain two or more types of Group 15 elements.
  • Group 1 elements, Group 2 elements, and Group 13 elements are preferable because the wear resistance of the surface treatment layer is better, and Group 1 elements and Group 2 elements are more preferable. , Group 1 elements are more preferred. As the specific element, only one type of element may be included, or two or more types of elements may be included.
  • the oxide contained in the base layer may be a mixture of oxides of the above elements (silicon and specific elements) alone (for example, a mixture of silicon oxide and an oxide of a specific element), or a mixture of the above elements (silicon and specific elements). It may be a composite oxide containing two or more types, or a mixture of an oxide of the above element alone and a composite oxide.
  • the ratio of the total molar concentration of the specific element in the underlayer to the molar concentration of silicon in the underlayer (specific element/silicon) is 0.02 to 2.90 from the viewpoint of better wear resistance of the surface treatment layer. It is preferably 0.10 to 2.00, even more preferably 0.20 to 1.80.
  • the molar concentration (mol %) of each element in the underlayer can be measured, for example, by depth direction analysis using X-ray photoelectron spectroscopy (XPS) using ion sputtering.
  • the base layer may be a single layer or a multilayer.
  • the base layer may have an uneven surface.
  • the thickness of the underlayer is preferably 1 to 100 nm, more preferably 1 to 50 nm, and even more preferably 2 to 20 nm. If the thickness of the base layer is equal to or greater than the above lower limit, the adhesion of the surface treatment layer to the base layer will be further improved, and the wear resistance of the surface treatment layer will be more excellent. If the thickness of the base layer is below the above upper limit, the base layer itself will have excellent wear resistance.
  • the thickness of the base layer is measured by observing a cross section of the base layer using a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • the base layer can be formed, for example, by a vapor deposition method using a vapor deposition material or a wet coating method.
  • the vapor deposition material used in the vapor deposition method preferably contains an oxide containing silicon and a specific element.
  • Specific examples of the form of the vapor deposition material include powder, molten body, sintered body, granulated body, and crushed body, and from the viewpoint of ease of handling, molten body, sintered body, and granulated body are preferable.
  • the melt means a solid obtained by melting the powder of the vapor deposition material at a high temperature and then cooling and solidifying the powder.
  • a sintered body means a solid obtained by firing a powder of a vapor deposition material, and if necessary, a molded body obtained by press-molding the powder may be used instead of a powder of a vapor deposition material.
  • the granule refers to a solid material obtained by kneading a powder of a vapor deposition material and a liquid medium (for example, water, an organic solvent) to obtain particles, and then drying the particles.
  • the vapor deposition material can be manufactured, for example, by the following method.
  • ⁇ Powders containing silicon e.g. powder of silicon oxide, silica sand, silica gel
  • powders containing specific elements e.g.
  • ⁇ Powders containing silicon e.g. powder of silicon oxide, silica sand, silica gel
  • powders containing specific elements e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid
  • a specific example of a vapor deposition method using a vapor deposition material includes a vacuum vapor deposition method.
  • the vacuum deposition method is a method in which a deposition material is evaporated in a vacuum chamber and adhered to the surface of a base material.
  • the temperature during vapor deposition (for example, the temperature of the boat in which the vapor deposition material is placed when using a vacuum vapor deposition apparatus) is preferably 100 to 3,000°C, more preferably 500 to 3,000°C.
  • the pressure during vapor deposition (for example, when using a vacuum vapor deposition apparatus, the pressure in the tank in which the vapor deposition material is placed) is preferably 1 Pa or less, more preferably 0.1 Pa or less.
  • one vapor deposition material may be used, or two or more vapor deposition materials containing different elements may be used.
  • evaporation methods include resistance heating, in which the evaporation material is melted and evaporated on a resistance heating boat made of high-melting-point metal, and irradiation of an electron beam onto the evaporation material to directly heat the evaporation material on the surface.
  • An example is the electron gun method, which melts and evaporates.
  • the method of evaporating the deposition material is that it can evaporate high-melting point substances because it can be heated locally, and that there is no risk of reaction with the container or contamination with impurities because the area that is not hit by the electron beam is at a low temperature. Gun law is preferred.
  • a plurality of boats may be used, or all the evaporation materials may be placed in a single boat.
  • the vapor deposition method may be codeposition, alternate vapor deposition, or the like. Specifically, examples include mixing silica and a specific element source in the same boat, co-evaporating silica and a specific element source in separate boats, and alternately depositing silica and a specific element source in separate boats. can be mentioned.
  • the conditions, order, etc. of vapor deposition are appropriately selected depending on the structure of the underlying layer.
  • the base layer on the base material by a wet coating method using a coating liquid containing a compound containing silicon, a compound containing a specific element, and a liquid medium.
  • silicon compounds include silicon oxide, silicic acid, partial condensates of silicic acid, alkoxysilanes, and partially hydrolyzed condensates of alkoxysilanes.
  • Specific examples of compounds containing specific elements include oxides of specific elements, alkoxides of specific elements, carbonates of specific elements, sulfates of specific elements, nitrates of specific elements, oxalates of specific elements, and water of specific elements. Examples include oxides.
  • liquid medium examples include those similar to the liquid medium contained in the composition of the present disclosure described above.
  • the content of the liquid medium is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the total amount of the coating liquid used to form the base layer.
  • wet coating methods for forming the base layer include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet, flow coating, roll coating, Examples include the cast method, Langmuir-Blodgett method, and gravure coating method.
  • the drying temperature of the coating film is preferably 20 to 200°C, more preferably 80 to 160°C.
  • the article of the present disclosure is preferably an optical member.
  • optical components include medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • Examples include personal appliances, copying machines, PCs, displays (eg, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
  • the article is preferably a display or a touch panel.
  • a method for producing an article of the present disclosure is, for example, a method of surface-treating a base material using the surface treatment agent of the present disclosure to produce an article in which a surface-treated layer is formed on the base material.
  • Surface treatments include dry coating methods and wet coating methods.
  • dry coating methods include vacuum deposition, CVD, and sputtering.
  • a vacuum evaporation method is preferable from the viewpoint of suppressing decomposition of the compound and the simplicity of the apparatus.
  • a pellet-like substance obtained by impregnating a porous metal body such as iron or steel with the compound of the present disclosure may be used.
  • a pellet-like material impregnated with the compound of the present disclosure may be used by impregnating a porous metal body such as iron or steel with a composition containing the compound of the present disclosure and a liquid medium, and drying the liquid medium.
  • wet coating methods include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet coating, flow coating, roll coating, casting, and Langmuir-Blodgett methods. , gravure coating method.
  • an operation may be performed to accelerate the reaction between the compound of the present disclosure and the base material, if necessary.
  • Such operations include heating, humidification, light irradiation, and the like.
  • a hydrolysis reaction of hydrolyzable groups, a reaction between hydroxyl groups, etc. on the surface of the base material and silanol groups, and a condensation reaction of silanol groups. can promote reactions such as the formation of siloxane bonds.
  • compounds in the surface treatment layer that are not chemically bonded to other compounds or the base material may be removed as necessary. Examples of the removal method include a method of pouring a solvent onto the surface treatment layer, a method of wiping with a cloth impregnated with a solvent, and the like.
  • Example 1 Synthesis of compound (1-2)] Using 58 g (1 mol) of propylene glycol as an initiator, 580 g (10 mol) of propylene oxide is polymerized in the presence of potassium hydroxide, and then 440 g (10 mol) of ethylene oxide is polymerized, neutralized, and the neutralized salt is removed. As a result, a compound (1-1) having a number average molecular weight of about 1,100 was obtained.
  • Compound (1-1) was a compound having two specific polyalkylene oxide chains in which five RO units and five EO units were bonded in blocks.
  • Example 2 Synthesis of compound (2-2)] Using 92 g (1 mol) of glycerin as an initiator, polymerize 870 g (15 mol) of propylene oxide in the presence of potassium hydroxide, then polymerize 660 g (15 mol) of ethylene oxide, neutralize and remove the neutralized salt. Compound (2-1) having a number average molecular weight of 1,600 was obtained. Compound (2-1) was a compound having three specific polyalkylene oxide chains in which five RO units and five EO units were connected in blocks.
  • Example 3 Synthesis of compound (3-2)] 16.2 g (10 mmol) of the compound (2-1) and 2.0 g (10 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 0.18 g (1.8 mmol) of 1% by mass triethylamine was added to the obtained mixture, and the mixture was stirred at 80° C. for 16 hours.
  • trimethoxysilylpropyl isocyanate manufactured by Tokyo Kasei Co., Ltd.
  • Example 4 Synthesis of compound (4-2)]
  • 16.2 g (10 mmol) of the compound (2-1) 7-(3-isocyanatopropyl)-3,3,11,11-tetramethoxy-7-(3-(trimethoxy 6.0 g (10 mmol) of silyl)propyl)-2,12-dioxa-3,7,11-trisilatridecane was added.
  • 2.2 g (2.2 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours.
  • Example 5 Synthesis of compound (5-2)]
  • 16.2 g (10 mmol) of the compound (2-1) 7-(3-isocyanatopropyl)-3,3,11,11-tetramethoxy-7-(3-(trimethoxy 12.0 g (20 mmol) of silyl)propyl)-2,12-dioxa-3,7,11-trisilatridecane was added.
  • 3.8 g (3.8 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours.
  • Example 6 Synthesis of compound (C1-1)] Using 58 g (1 mol) of propylene glycol as an initiator, 880 g (20 mol) of ethylene oxide is polymerized in the presence of potassium hydroxide, followed by neutralization and removal of the neutralized salt, resulting in a number average molecular weight of about 940. Compound (C1-1) was obtained. Compound (C1-1) was a compound having two polyalkylene oxide chains each consisting of 10 EO units.
  • Example 7 Synthesis of compound (C2-2)] Using 92 g (1 mol) of glycerin as an initiator, 1320 g (30 mol) of ethylene oxide was polymerized in the presence of potassium hydroxide, and then neutralized and the neutralized salt was removed to obtain compound (C2-1).
  • Compound (C2-1) was a compound having three polyalkylene oxide chains each consisting of 10 EO units.
  • Example 8 Compound (C3-1)] The compound (C1-1) was used as it was to prepare a compound (C3-1).
  • Example 9 Synthesis of compound (C4-2)] After polymerizing 1,160 g (20 mol) of propylene oxide in the presence of potassium hydroxide using 58 g (1 mol) of propylene glycol as an initiator, neutralization and removal of the neutralized salt resulted in a number average molecular weight of approx. A compound (C4-1) having a molecular weight of 1,200 was obtained. Compound (C4-1) was a compound having two polyalkylene oxide chains each consisting of 10 RO units.
  • Example 10 Synthesis of compound (C5-2)] After polymerizing 1,740 g (30 mol) of propylene oxide in the presence of potassium hydroxide using 92 g (1 mol) of glycerin as an initiator, neutralization and removal of the neutralized salt resulted in a number average molecular weight of 1,800. Compound (C5-1) was obtained. Compound (C5-1) was a compound having three polyalkylene oxide chains each consisting of 10 RO units.
  • Example 11 Compound (C6-1)] Hydroxy(polyethylene oxide)propyltriethoxysilane (manufactured by Azumax Co., Ltd.) was used as it was to prepare compound (C6-1). HO(CH 2 CH 2 O) 8-12 -(CH 2 ) 3 -Si(OC 2 H 5 ) 3 (C6-1)
  • a composition for forming a surface layer (that is, a surface treatment agent) was prepared using each compound obtained in Examples 1 to 11. Specifically, each compound obtained in Examples 1 to 11 was added to a solvent in which propylene glycol monomethyl ether, diacetone alcohol, and 0.1% by mass nitric acid aqueous solution were mixed at a mass ratio of 51:9:40, and the solid content concentration was adjusted. The mixture was added in an amount of 10% by mass and stirred at 50° C. for 16 hours to obtain a liquid composition containing a partially hydrolyzed condensate of the compound. Further, this liquid composition was dissolved in a mixed solvent of propylene glycol monomethyl ether and diacetone alcohol at a ratio of 85:15 (mass ratio) so that the solid content concentration was 1.0% by mass. It was made into a composition.
  • a composition for forming a surface layer prepared using each compound obtained in Examples 1 to 11 was applied by dip coating onto the surface of a cleaned glass plate measuring 23 mm in length, 25 mm in width, and 3 mm in thickness. A coating was formed on the object. Next, this was dried in a hot air circulation oven at 150°C for 1 hour to form a surface treatment layer with a thickness of 1.8 nm, to obtain glass substrates with surface treatment layers, which are the articles of Examples 1 to 11. . Further, a washed glass plate having a length of 23 mm, a width of 25 mm, and a thickness of 3 mm was used as it was to prepare an article of Example 12. The obtained article was evaluated by the following method. The results are shown in Table 1.
  • the initial contact angle of water was measured on the surfaces of the surface treatment layers of the articles of Examples 1 to 11 and the surface of the glass plate of Example 12. Specifically, the contact angle of about 2 ⁇ L of distilled water placed on the surface was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). The smaller the initial water contact angle, the higher the hydrophilicity.
  • ⁇ Abrasion resistance (steel wool)>
  • the surface of the surface treatment layer in the articles of Examples 1 to 11 and the surface of the glass plate of Example 12 were tested using an abrasion tester ("HEIDON-14DR (product name)” manufactured by Shinto Kagaku) and coated with steel wool Bonstar (#0000).
  • HEIDON-14DR product name
  • steel wool Bonstar #0000
  • an artificial fingerprint liquid was applied with an artificial finger as described in the fingerprint visibility evaluation above, and then the surface was subjected to an abrasion test.
  • a machine (“HEIDON-14DR (product name)” manufactured by Shinto Kagaku)
  • steel wool Bonstar (#0000) was moved back and forth 10 times at a pressure of 25 kPa and a speed of 320 cm/min, and then 3 times with a wet tissue. Visibility after wiping and rubbing was visually confirmed.
  • the evaluation criteria are the same as those for the initial visibility evaluation.
  • Examples 1 to 5 are examples, and Examples 6 to 12 are comparative examples.
  • the contact angle of water at the initial stage is small, so the hydrophilicity is high, and the visibility of fingerprints at the initial stage is reduced, and the value of the contact angle after rubbing is lower than that at the initial stage. The value is close to that of the contact angle, and the visibility of fingerprints is reduced even after rubbing.
  • Examples 1 to 5 both the property of reducing fingerprint visibility and the abrasion resistance are good.
  • Examples 6 to 12 cannot achieve both the property of reducing fingerprint visibility and the excellent abrasion resistance.
  • Sb the contact angle of water at the initial stage was large and the hydrophilicity was insufficient, and the reduction in fingerprint visibility was insufficient.
  • the compounds of the present disclosure are useful as surface treatment agents.
  • the surface treatment agent can be used, for example, for substrates in display devices such as touch panel displays, optical elements, semiconductor elements, building materials, automobile parts, nanoimprint technology, and the like.
  • the surface treatment agent can be used for bodies, window glasses (windshields, side glasses, rear glasses), mirrors, bumpers, etc. of transportation equipment such as trains, automobiles, ships, and airplanes.
  • the surface treatment agent can be used for outdoor articles such as building exterior walls, tents, solar power generation modules, sound insulation boards, and concrete; fishing nets, insect nets, and aquariums.
  • the surface treatment agent can be used for various indoor equipment such as kitchens, bathrooms, washstands, mirrors, toilet peripheral parts; ceramics such as chandeliers and tiles; artificial marble, and air conditioners.
  • the surface treatment agent can be used as an antifouling treatment for jigs, inner walls, piping, etc. in a factory.
  • the surface treatment agent can be used for goggles, glasses, helmets, pachinko machines, textiles, umbrellas, play equipment, and soccer balls.
  • the surface treatment agent can also be used as an adhesion prevention agent for various packaging materials such as food packaging materials, cosmetic packaging materials, and the inside of pots.
  • surface treatment agents are used for medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. It can be used for optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
  • medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.

Abstract

Provided is a compound having: a reactive silyl group; an ethylene oxide unit; a C3-C6 alkylene oxide unit; and a hydroxy group bonded to a carbon atom, wherein when the number of moles of the C3-C6 alkylene oxide unit, and the number of moles of the ethylene oxide unit, which are contained in the compound are represented as Ma and Mb respectively, the ratio of Ma to the sum of Ma and Mb, Ma/(Ma+Mb), is 0.2-0.8. Also provided are: a composition and a surface treatment agent each comprising the compound; and an article and a method for producing an article using the surface treatment agent.

Description

化合物、組成物、表面処理剤、物品の製造方法、及び物品Compounds, compositions, surface treatment agents, methods for producing articles, and articles
 本開示は、化合物、組成物、表面処理剤、物品の製造方法、及び物品に関する。 The present disclosure relates to compounds, compositions, surface treatment agents, methods of manufacturing articles, and articles.
 近年、外観、視認性等の性能を向上させるために、物品の表面に付着した指紋汚れ等の汚れを目立ちにくくする技術が求められている。具体的な方法として、物品の表面に表面処理剤を用いて表面処理を行う方法が知られている。 In recent years, in order to improve performance such as appearance and visibility, there has been a demand for technology that makes stains such as fingerprint stains on the surface of articles less noticeable. As a specific method, a method is known in which the surface of an article is subjected to surface treatment using a surface treatment agent.
 例えば、特許文献1には、特定のオルガノシリコーン化合物をマトリクス樹脂として含む硬化被膜を基材の最表面に備え、硬化被膜上に指紋付着させた場合の2次元表面粗さを特定の範囲とした硬化被膜付き基材が記載されている。特許文献2には、特定のモノオール又はポリオールとケイ素化合物とが結合した化合物を有する親油性被膜を有する耐指紋性透明基材が記載されている。 For example, in Patent Document 1, a cured film containing a specific organosilicone compound as a matrix resin is provided on the outermost surface of a base material, and the two-dimensional surface roughness when a fingerprint is attached to the cured film is set in a specific range. A substrate with a cured coating is described. Patent Document 2 describes a fingerprint-resistant transparent substrate having a lipophilic coating containing a compound in which a specific monool or polyol and a silicon compound are bonded.
特開2011-006653号公報Japanese Patent Application Publication No. 2011-006653 特開2014-237228号公報JP2014-237228A
 一方、表面処理剤等に用いられる組成物には、形成される表面処理層の指紋視認性を低減する特性に加えて、耐摩耗性も併せ持つことが求められる。 On the other hand, compositions used as surface treatment agents and the like are required to have abrasion resistance in addition to the property of reducing the visibility of fingerprints in the surface treatment layer formed.
 本開示はこのような事情に鑑みてなされたものであり、本発明の一実施形態が解決しようとする課題は、基材に対して、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成し得る表面処理剤として有用な新規な化合物及び組成物を提供することにある。
 本発明の一実施形態が解決しようとする課題は、基材に対して、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成し得る表面処理剤を提供することにある。
 本発明の一実施形態が解決しようとする課題は、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を有する物品及びその製造方法を提供することにある。
The present disclosure has been made in view of these circumstances, and the problem to be solved by an embodiment of the present invention is to provide a base material with properties that reduce fingerprint visibility and abrasion resistance. An object of the present invention is to provide novel compounds and compositions useful as surface treatment agents capable of forming surface treatment layers.
The problem to be solved by an embodiment of the present invention is to provide a surface treatment agent that can form a surface treatment layer on a base material that has both characteristics of reducing fingerprint visibility and wear resistance. be.
The problem to be solved by one embodiment of the present invention is to provide an article having a surface treatment layer that has both characteristics of reducing fingerprint visibility and wear resistance, and a method for manufacturing the same.
 本開示は以下の態様を含む。
<1> 反応性シリル基と、エチレンオキシド単位と、炭素数3~6のアルキレンオキシド単位と、炭素原子に結合するヒドロキシ基と、を有する化合物であって、
 前記化合物に含まれる、前記炭素数3~6のアルキレンオキシド単位のモル数をMaとし、前記エチレンオキシド単位のモル数をMbとしたとき、MaとMbとの合計に対するMaの割合Ma/(Ma+Mb)の値が0.2~0.8である、化合物。
<2> 前記反応性シリル基を1分子中に2以上有する、<1>に記載の化合物。
<3> 下記式(1)で表される化合物。
The present disclosure includes the following aspects.
<1> A compound having a reactive silyl group, an ethylene oxide unit, an alkylene oxide unit having 3 to 6 carbon atoms, and a hydroxy group bonded to a carbon atom,
When the number of moles of the alkylene oxide unit having 3 to 6 carbon atoms contained in the compound is Ma, and the number of moles of the ethylene oxide unit is Mb, the ratio of Ma to the total of Ma and Mb is Ma/(Ma+Mb) A compound having a value of 0.2 to 0.8.
<2> The compound according to <1>, which has two or more of the reactive silyl groups in one molecule.
<3> A compound represented by the following formula (1).

 

 
 式(1)中、
 Rはそれぞれ独立に炭素数3~6のアルキレン基であり、
 Qは(d+e)価の連結基であり、
 Yは(g+1)価の連結基であり、
 Rはそれぞれ独立に1価の炭化水素基であり、
 Lはそれぞれ独立に加水分解性基又は水酸基であり、
 a1、a2、b1、及びb2はそれぞれ独立に1~300の整数であり、
 d及びeはそれぞれ独立に1~10の整数であり、
 nは0~2の整数であり、
 gは1以上の整数であり、
 (OCHCHb1(ORa1は、(OCHCH)と(OR)とがいずれの順序で結合してもよく、a1及びb1の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
 (RO)a2(CHCHO)b2は、(RO)と(CHCHO)とがいずれの順序で結合してもよく、a2及びb2の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
 d個のa2とe個のa1との合計をSaとし、d個のb2とe個のb1との合計をSbとしたとき、SaとSbとの合計に対するSaの割合Sa/(Sa+Sb)の値が0.2~0.8である。
<4> 前記式(1)中のgが2以上である、<3>に記載の化合物。
<5> <1>~<4>のいずれか1つに記載の化合物と、液状媒体と、を含む組成物。<6> <1>~<4>のいずれか1つに記載の化合物を含む、表面処理剤。
<7> さらに液状媒体を含む、<6>に記載の表面処理剤。
<8> 基材に対して、<6>又は<7>に記載の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造する、物品の製造方法。
<9> 基材と、前記基材上に配置され、<6>に記載の表面処理剤で表面処理された表面処理層と、を含む物品。
<10> 前記表面処理層の表面における水の接触角が7度以下である、<9>に記載の物品。
<11> 前記物品が光学部材である、<9>又は<10>に記載の物品。
<12> 前記物品がディスプレイ又はタッチパネルである、<9>又は<10>に記載の物品
In formula (1),
R 2 is each independently an alkylene group having 3 to 6 carbon atoms,
Q 1 is a (d+e)-valent linking group,
Y 1 is a (g+1)-valent linking group,
R 1 is each independently a monovalent hydrocarbon group,
L 2 is each independently a hydrolyzable group or a hydroxyl group,
a1, a2, b1, and b2 are each independently an integer of 1 to 300,
d and e are each independently an integer of 1 to 10,
n is an integer from 0 to 2,
g is an integer greater than or equal to 1,
(OCH 2 CH 2 ) b1 (OR 2 ) a1 is such that (OCH 2 CH 2 ) and (OR 2 ) may be combined in any order, and when at least one of a1 and b1 is 2 or more, It can be combined randomly or in blocks,
(R 2 O) a2 (CH 2 CH 2 O) b2 , (R 2 O) and (CH 2 CH 2 O) may be bonded in any order, and at least one of a2 and b2 is 2 or more If , it can be combined randomly or in blocks,
When the sum of d a2 and e a1 is Sa, and the sum of d b2 and e b1 is Sb, the ratio of Sa to the sum of Sa and Sb is Sa/(Sa+Sb). The value is between 0.2 and 0.8.
<4> The compound according to <3>, wherein g in the formula (1) is 2 or more.
<5> A composition comprising the compound according to any one of <1> to <4> and a liquid medium. <6> A surface treatment agent comprising the compound according to any one of <1> to <4>.
<7> The surface treatment agent according to <6>, further comprising a liquid medium.
<8> A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent described in <6> or <7>, and manufacturing an article in which a surface treatment layer is formed on the base material. .
<9> An article comprising a base material and a surface treatment layer disposed on the base material and surface treated with the surface treatment agent according to <6>.
<10> The article according to <9>, wherein the surface treatment layer has a water contact angle of 7 degrees or less.
<11> The article according to <9> or <10>, wherein the article is an optical member.
<12> The article according to <9> or <10>, wherein the article is a display or a touch panel.
 本発明の一実施形態によれば、基材に対して、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成し得る表面処理剤として有用な新規な化合物及び組成物が提供される。
 本発明の一実施形態によれば、基材に対して、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成し得る表面処理剤が提供される。
 本発明の一実施形態によれば、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を有する物品及び物品の製造方法が提供される。
According to one embodiment of the present invention, novel compounds and compositions useful as surface treatment agents capable of forming a surface treatment layer on a substrate that has both characteristics of reducing fingerprint visibility and wear resistance. is provided.
According to one embodiment of the present invention, a surface treatment agent is provided that can form a surface treatment layer on a base material that has both characteristics of reducing fingerprint visibility and wear resistance.
According to one embodiment of the present invention, an article and a method for manufacturing the article are provided, which have a surface treatment layer that has both properties that reduce fingerprint visibility and wear resistance.
 以下、本発明の一実施形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素(要素ステップ等も含む)は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明の実施形態を制限するものではない。 Hereinafter, one embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including elemental steps and the like) are not essential unless otherwise specified. The same applies to numerical values and their ranges, and they do not limit the embodiments of the present invention.
 本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
 本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
 本開示に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
 本開示において「層」又は「膜」との語には、当該層又は膜が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
 本開示において「表面処理層」とは、基材の表面に、表面処理によって形成される層を意味する。
 本開示において、化合物又は基が特定の式(X)で表される場合、当該式(X)で表される化合物又は基をそれぞれ化合物(X)又は基(X)と記すことがある。
In the present disclosure, numerical ranges indicated using "~" include the numerical values written before and after "~" as minimum and maximum values, respectively.
In the present disclosure, each component may contain multiple types of corresponding substances. If there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition, unless otherwise specified. means quantity.
In the numerical ranges described step by step in the present disclosure, the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of another numerical range described step by step. Furthermore, in the numerical ranges described in this disclosure, the upper limit or lower limit of the numerical range may be replaced with the values shown in the Examples.
In this disclosure, the term "layer" or "film" refers to the case where the layer or film is formed only in a part of the region, in addition to the case where the layer or film is formed in the entire region when observing the region where the layer or film is present. This also includes cases where it is formed.
In the present disclosure, the term "surface treated layer" refers to a layer formed on the surface of a base material by surface treatment.
In the present disclosure, when a compound or group is represented by a specific formula (X), the compound or group represented by the formula (X) may be referred to as a compound (X) or a group (X), respectively.
[化合物]
 本開示の化合物は、反応性シリル基と、エチレンオキシド単位と、炭素数3~6のアルキレンオキシド単位と、炭素原子に結合するヒドロキシ基と、を有し、本開示の化合物に含まれる、前記炭素数3~6のアルキレンオキシド単位のモル数をMaとし、前記エチレンオキシド単位のモル数をMbとしたとき、MaとMbとの合計に対するMaの割合Ma/(Ma+Mb)の値が0.2~0.8である。
 以下、エチレンオキシド単位(すなわち-(CHCHO)-)を「EO単位」、炭素数3~6のアルキレンオキシド単位(すなわち -(RO)- (Rは炭素数3~6のアルキレン基))を「RO単位」ともいう。
 本開示の化合物を含む組成物を用いて基材表面の表面処理を行うと、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成できる。この理由は定かではないが、以下のように推測される。
[Compound]
The compound of the present disclosure has a reactive silyl group, an ethylene oxide unit, an alkylene oxide unit having 3 to 6 carbon atoms, and a hydroxy group bonded to a carbon atom, and the carbon atoms contained in the compound of the present disclosure have a When the number of moles of alkylene oxide units of numbers 3 to 6 is Ma, and the number of moles of the ethylene oxide unit is Mb, the value of the ratio Ma/(Ma+Mb) to the total of Ma and Mb is 0.2 to 0. It is .8.
Hereinafter, ethylene oxide units (i.e. -(CH 2 CH 2 O)-) will be referred to as "EO units", and alkylene oxide units with 3 to 6 carbon atoms (i.e. -(R 2 O)- (R 2 is 3 to 6 carbon atoms). The alkylene group)) is also referred to as the "RO unit".
When the surface of a substrate is treated using a composition containing the compound of the present disclosure, a surface treatment layer can be formed that has both the property of reducing fingerprint visibility and abrasion resistance. Although the reason for this is not certain, it is assumed as follows.
 本開示の化合物は、基材と密着性が高い反応性シリル基を有することで、基材上の表面に密着する表面処理層を形成できる。そして、本開示の化合物は、EO単位を有するとともに、炭素原子に結合するヒドロキシ基を有することで、特にヒドロキシ基がすべてシリル化された化合物に比べて高い親水性が得られる。そのため、親水性の高い表面処理層が形成でき、表面処理層の表面に指紋汚れが付着しても、付着した指紋汚れが濡れ広がりやすく液滴になりにくくなる。そして、指紋汚れに起因する光の乱反射が起こりにくいことで指紋汚れが目立ちにくく、表面処理層における指紋視認性を低減する特性が良好となる。
 加えて、本開示の化合物は、EO単位だけでなくRO単位も有し、Ma/(Ma+Mb)の値が0.2~0.8である。そのため、本開示の化合物は、例えばRO単位を有さない化合物に比べ、耐摩耗性の高い表面処理層を形成でき、表面処理層における指紋視認性を低減する特性と耐摩耗性との両立を実現できると考えられる。
The compound of the present disclosure has a reactive silyl group that has high adhesion to the substrate, and thus can form a surface treatment layer that adheres to the surface of the substrate. Since the compound of the present disclosure has an EO unit and a hydroxy group bonded to a carbon atom, it can have particularly high hydrophilicity compared to a compound in which all hydroxy groups are silylated. Therefore, a highly hydrophilic surface treatment layer can be formed, and even if fingerprint stains adhere to the surface of the surface treatment layer, the adhered fingerprint stains will easily spread and become difficult to form into droplets. Further, since diffuse reflection of light due to fingerprint stains is less likely to occur, fingerprint stains are less noticeable, and the surface treatment layer has a good property of reducing fingerprint visibility.
In addition, the compounds of the present disclosure have not only EO units but also RO units and have a value of Ma/(Ma+Mb) of 0.2 to 0.8. Therefore, the compound of the present disclosure can form a surface treatment layer with higher abrasion resistance than, for example, a compound without an RO unit, and can achieve both the property of reducing fingerprint visibility and the abrasion resistance in the surface treatment layer. It is believed that this can be achieved.
 本開示の化合物は、1以上のEO単位及び1以上のRO単位で構成されるポリアルキレンオキシド鎖を有することが好ましい。以下、1以上のEO単位及び1以上のRO単位で構成されるポリアルキレンオキシド鎖を「特定ポリアルキレンオキシド鎖」ともいう。
 本開示の化合物は、特定ポリアルキレンオキシド鎖における一端の酸素原子が単結合又は連結基Yを介して反応性シリル基に結合した部分構造Dと、特定ポリアルキレンオキシド鎖における一端の酸素原子が水素原子と結合した部分構造Eと、を有することが好ましい。
 部分構造Dにおいて、特定アルキレンオキシド鎖が連結基を介して反応性シリル基に結合する場合、特定アルキレンオキシド鎖と反応性シリル基との間の連結基は、本開示の目的を損なわない基であればよく、後述の式(1)中のYとして説明される連結基が挙げられる。
 なお、部分構造Eにおいては、特定ポリアルキレンオキシド鎖における一端の酸素原子が水素原子と結合して形成されるヒドロキシ基が前記「炭素原子に結合するヒドロキシ基」となる。
Preferably, the compounds of the present disclosure have a polyalkylene oxide chain composed of one or more EO units and one or more RO units. Hereinafter, a polyalkylene oxide chain composed of one or more EO units and one or more RO units will also be referred to as a "specific polyalkylene oxide chain."
The compound of the present disclosure has a partial structure D in which an oxygen atom at one end of a specific polyalkylene oxide chain is bonded to a reactive silyl group via a single bond or a linking group Y1 , and a partial structure D in which an oxygen atom at one end of a specific polyalkylene oxide chain is It is preferable to have a partial structure E bonded to a hydrogen atom.
In partial structure D, when the specific alkylene oxide chain is bonded to the reactive silyl group via a linking group, the linking group between the specific alkylene oxide chain and the reactive silyl group is a group that does not impair the purpose of the present disclosure. Any linking group may be used, and examples thereof include a linking group explained as Y 1 in formula (1) below.
In addition, in partial structure E, the hydroxy group formed by bonding the oxygen atom at one end of the specific polyalkylene oxide chain to a hydrogen atom becomes the above-mentioned "hydroxy group bonded to a carbon atom."
 本開示の化合物は、1以上の部分構造Dと1以上の部分構造Eとが連結基Qを介して結合したものであることが好ましい。本開示の化合物は、具体的には、部分構造Dにおける特定アルキレンオキシド鎖における他端の炭素原子と、部分構造Eにおける特定アルキレンオキシド鎖における他端の炭素原子と、が連結基Qを介して結合したものであることが好ましい。
 本開示の化合物が連結基Qを有する場合、連結基は、本開示の目的を損なわない基であればよく、後述の式(1)中のQとして説明される連結基が挙げられる。
In the compound of the present disclosure, it is preferable that one or more partial structures D and one or more partial structures E are bonded via a linking group Q. Specifically, in the compound of the present disclosure, the carbon atom at the other end of the specific alkylene oxide chain in partial structure D and the carbon atom at the other end of the specific alkylene oxide chain in partial structure E are connected via a linking group Q. Preferably, they are combined.
When the compound of the present disclosure has a linking group Q, the linking group may be any group that does not impair the purpose of the present disclosure, and examples thereof include the linking group explained as Q 1 in formula (1) below.
 本開示の化合物が部分構造Dを有する場合、本開示の化合物は、1分子中に部分構造Dを1つのみ有してもよく、2つ以上有してもよい。本開示の化合物が1分子中に有する部分構造Dの数dとしては、例えば1~10が挙げられ、材料入手容易性の観点から、1~6が好ましく、1~3がより好ましい。
 本開示の化合物が部分構造Eを有する場合、本開示の化合物は、1分子中に部分構造Eを1つのみ有してもよく、2つ以上有してもよい。本開示の化合物が1分子中に有する部分構造Eの数eとしては、例えば1~10が挙げられ、材料入手容易性の観点から、1~6が好ましく、1~3がより好ましい。
 本開示の化合物が1分子中に有する部分構造D及び部分構造Eの合計数(d+e)としては、例えば2~20が挙げられ、材料入手容易性の観点から、2~20が好ましく、2~6がより好ましい。
 本開示の化合物が1分子中に有する部分構造Dの数をd、本開示の化合物が1分子中に有する部分構造Eの数をeとしたとき、dとeとの合計に対するeの割合e/(d+e)は、表面処理層における指紋視認性を低減する特性と耐摩耗性とを両立する観点から、0.05~0.9が好ましく、0.25~0.75がより好ましい。
When the compound of the present disclosure has a partial structure D, the compound of the present disclosure may have only one partial structure D in one molecule, or may have two or more partial structures D. The number d of partial structures D that the compound of the present disclosure has in one molecule is, for example, 1 to 10, preferably 1 to 6, and more preferably 1 to 3 from the viewpoint of material availability.
When the compound of the present disclosure has a partial structure E, the compound of the present disclosure may have only one partial structure E in one molecule, or may have two or more partial structures E. The number e of partial structures E that the compound of the present disclosure has in one molecule is, for example, from 1 to 10, preferably from 1 to 6, and more preferably from 1 to 3 from the viewpoint of material availability.
The total number (d+e) of partial structures D and partial structures E that the compound of the present disclosure has in one molecule is, for example, 2 to 20, preferably 2 to 20 from the viewpoint of material availability, and 2 to 20. 6 is more preferred.
When the number of partial structures D that the compound of the present disclosure has in one molecule is d, and the number of partial structures E that the compound of the present disclosure has in one molecule is e, the ratio of e to the sum of d and e is e. /(d+e) is preferably 0.05 to 0.9, more preferably 0.25 to 0.75, from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance.
 本開示の化合物は、1分子中に反応性シリル基を1つのみ有してもよく、2つ以上有してもよい。本開示の化合物は、表面処理層における耐摩耗性の向上の観点から、1分子中に反応性シリル基を2つ以上有することが好ましい。
 本開示の化合物が1分子中に有する反応性シリル基の数は、1以上であり、表面処理層の耐摩耗性をより向上させる観点から、1~18が好ましく、2~12がより好ましく、2~8がさらに好ましい。本開示の化合物が有する反応性シリル基の数は、1であってもよい。
 本開示の化合物は、表面処理層における耐摩耗性の向上の観点から、1つの特定ポリアルキレンオキシド鎖における一端の酸素原子に、3価以上の連結基を介して2以上の反応性シリル基が結合していることが好ましい。本開示の化合物が部分構造Dを有する場合、1つの部分構造Dが2以上の反応シリル基を有することが好ましい。
 1つの部分構造Dが有する反応性シリル基の数gは、1以上であり、表面処理層における耐摩耗性の向上の観点から、1~3が好ましく、2~3がより好ましい。
 本開示の化合物が1分子中に有する、炭素原子に結合するヒドロキシ基の数は、1以上であり、表面処理層における指紋視認性を低減する特性の向上の観点から、1~10が好ましく、1~6がより好ましく、1~3がさらに好ましい。
 本開示の化合物が1分子中に有する反応性シリル基の数をf、本開示の化合物が1分子中に有する部分構造Eの数をeとしたとき、fとeとの合計に対するeの割合e/(f+e)は、表面処理層における指紋視認性を低減する特性と耐摩耗性とを両立する観点から、0.17~0.83が好ましく、0.33~0.67がより好ましい。
 なお、1分子中に有する反応性シリル基の数fは、1つの部分構造Dが有する反応性シリル基の数gと1分子中に有する部分構造Dの数dとの積(g×d)に相当する。
The compound of the present disclosure may have only one reactive silyl group in one molecule, or may have two or more reactive silyl groups. The compound of the present disclosure preferably has two or more reactive silyl groups in one molecule from the viewpoint of improving wear resistance in the surface treatment layer.
The number of reactive silyl groups that the compound of the present disclosure has in one molecule is 1 or more, and from the viewpoint of further improving the abrasion resistance of the surface treatment layer, it is preferably 1 to 18, more preferably 2 to 12, 2 to 8 are more preferred. The number of reactive silyl groups that the compound of the present disclosure has may be one.
The compound of the present disclosure has two or more reactive silyl groups attached to the oxygen atom at one end of one specific polyalkylene oxide chain via a trivalent or higher valent linking group, from the viewpoint of improving wear resistance in the surface treatment layer. Preferably, they are bonded. When the compound of the present disclosure has a partial structure D, it is preferred that one partial structure D has two or more reactive silyl groups.
The number g of reactive silyl groups that one partial structure D has is 1 or more, preferably 1 to 3, more preferably 2 to 3, from the viewpoint of improving wear resistance in the surface treatment layer.
The number of hydroxy groups bonded to carbon atoms that the compound of the present disclosure has in one molecule is 1 or more, and preferably 1 to 10 from the viewpoint of improving the property of reducing fingerprint visibility in the surface treatment layer. 1 to 6 are more preferred, and 1 to 3 are even more preferred.
When the number of reactive silyl groups that the compound of the present disclosure has in one molecule is f, and the number of partial structures E that the compound of the present disclosure has in one molecule is e, the ratio of e to the sum of f and e. e/(f+e) is preferably 0.17 to 0.83, more preferably 0.33 to 0.67, from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance.
The number f of reactive silyl groups in one molecule is the product of the number g of reactive silyl groups in one partial structure D and the number d of partial structures D in one molecule (g×d). corresponds to
(反応性シリル基)
 本開示の化合物は、反応性シリル基を含む。反応性シリル基は、化合物の末端に位置する。
 反応性シリル基とは、Si原子に反応性基が結合した基を意味する。反応性基としては、加水分解性基又は水酸基が好ましい。
 加水分解性基とは、加水分解反応により水酸基となる基である。すなわち、Si-Lで表される加水分解性を有するシリル基は、加水分解反応によりSi-OHで表されるシラノール基となる。シラノール基は、さらにシラノール基間で反応してSi-O-Si結合を形成する。また、シラノール基は、基材の表面に存在する酸化物に由来するシラノール基と脱水縮合反応して、Si-O-Si結合を形成できる。加水分解性基としては、例えば、アルコキシ基、アリールオキシ基、ハロゲン原子、アシル基、アシルオキシ基、及びイソシアナト基(-NCO)が挙げられる。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましい。ただし、アリールオキシ基のアリール基は、ヘテロアリール基を含む。ハロゲン原子は、塩素原子であることが好ましい。アシル基は、炭素数1~6のアシル基であることが好ましい。アシルオキシ基は、炭素数1~6のアシルオキシ基であることが好ましい。
 均一な膜を作製しやすく、耐久性に優れる観点からは、反応性シリル基としてはアルコキシシリル基又はトリクロロシリル基が好ましい。基材との反応において生じる副生物の取り扱いやすさの観点から、反応性シリル基は、アルコキシシリル基であることがより好ましい。アルコキシシリル基としてはジアルコキシシリル基又はトリアルコキシシリル基が好ましく、トリアルコキシシリル基がより好ましい。
(Reactive silyl group)
Compounds of the present disclosure contain reactive silyl groups. The reactive silyl group is located at the end of the compound.
A reactive silyl group means a group in which a reactive group is bonded to a Si atom. The reactive group is preferably a hydrolyzable group or a hydroxyl group.
A hydrolyzable group is a group that becomes a hydroxyl group through a hydrolysis reaction. That is, the hydrolyzable silyl group represented by Si-L becomes a silanol group represented by Si-OH through a hydrolysis reaction. The silanol groups further react among themselves to form Si--O--Si bonds. Further, the silanol group can undergo a dehydration condensation reaction with a silanol group derived from an oxide present on the surface of the base material to form a Si--O--Si bond. Examples of the hydrolyzable group include an alkoxy group, an aryloxy group, a halogen atom, an acyl group, an acyloxy group, and an isocyanato group (-NCO). The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms. However, the aryl group of the aryloxy group includes a heteroaryl group. The halogen atom is preferably a chlorine atom. The acyl group is preferably an acyl group having 1 to 6 carbon atoms. The acyloxy group is preferably an acyloxy group having 1 to 6 carbon atoms.
From the viewpoint of easy production of a uniform film and excellent durability, the reactive silyl group is preferably an alkoxysilyl group or a trichlorosilyl group. From the viewpoint of ease of handling by-products generated in the reaction with the base material, the reactive silyl group is more preferably an alkoxysilyl group. The alkoxysilyl group is preferably a dialkoxysilyl group or a trialkoxysilyl group, and more preferably a trialkoxysilyl group.
 反応性シリル基としては、下記式(2)で表される基が好ましい。
 -Si(R 3-n  (2)
 式(2)中、Rはそれぞれ独立に1価の炭化水素基であり、Lはそれぞれ独立に加水分解性基又は水酸基であり、nは0~2の整数である。
As the reactive silyl group, a group represented by the following formula (2) is preferable.
-Si(R 1 ) n L 2 3-n (2)
In formula (2), R 1 is each independently a monovalent hydrocarbon group, L 2 is each independently a hydrolyzable group or a hydroxyl group, and n is an integer of 0 to 2.
 反応性シリル基が1分子中に複数ある場合、複数の反応性シリル基は、同じであってもよく、互いに異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性の観点からは、複数の反応性シリル基は、同じであることが好ましい。 When there are multiple reactive silyl groups in one molecule, the multiple reactive silyl groups may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of reactive silyl groups are the same.
 Rはそれぞれ独立に1価の炭化水素基であり、1価の飽和炭化水素基が好ましい。Rの炭素数は、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。 Each R 1 is independently a monovalent hydrocarbon group, and a monovalent saturated hydrocarbon group is preferable. The number of carbon atoms in R 1 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.
 Lはそれぞれ独立に加水分解性基又は水酸基である。加水分解性基としては、上述したものが好ましい。 Each L 2 is independently a hydrolyzable group or a hydroxyl group. As the hydrolyzable group, those mentioned above are preferred.
 なかでも、Lは、化合物の製造容易性の観点から、アルコキシ基又はハロゲン原子であることが好ましく、炭素数1~4のアルコキシ基又はハロゲン原子であることがより好ましい。Lは、塗布時のアウトガスが少なく、化合物の保存安定性がより優れる観点から、炭素数1~4のアルコキシ基であることが好ましい。化合物の長期の保存安定性が必要な場合には、Lは、エトキシ基であることがより好ましい。塗布後の反応時間を短時間とする場合には、Lは、メトキシ基であることがより好ましい。式(2)において、Lの少なくとも1つが上記基であることが好ましく、Lのすべてが上記基であることがより好ましい。 Among these, L 2 is preferably an alkoxy group or a halogen atom, more preferably an alkoxy group having 1 to 4 carbon atoms or a halogen atom, from the viewpoint of ease of manufacturing the compound. L 2 is preferably an alkoxy group having 1 to 4 carbon atoms, from the viewpoint of less outgassing during coating and better storage stability of the compound. When long-term storage stability of the compound is required, L 2 is more preferably an ethoxy group. When the reaction time after coating is to be shortened, L 2 is more preferably a methoxy group. In formula (2), at least one of L 2 is preferably the above group, and more preferably all of L 2 are the above groups.
 nは、0~2の整数であり、0又は1が好ましく、0がより好ましい。本開示の化合物を表面処理剤に用いる場合、Lが複数存在することによって、表面処理層の基材への密着性がより強固になる。
 nが1以下である場合、1分子中に存在する複数のLは、同じであってもよく、互いに異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性の観点から、複数のLは同じであることが好ましい。nが2である場合、1分子中に存在する複数のRは同じであってもよく、互いに異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性の観点から、複数のRは同じであることが好ましい。
n is an integer of 0 to 2, preferably 0 or 1, and more preferably 0. When the compound of the present disclosure is used as a surface treatment agent, the presence of a plurality of L 2 makes the adhesion of the surface treatment layer to the base material stronger.
When n is 1 or less, the plurality of L2s present in one molecule may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of L 2 's are the same. When n is 2, multiple R 1s present in one molecule may be the same or different from each other. From the viewpoint of easy availability of raw materials and ease of manufacturing the compound, it is preferable that a plurality of R 1 's are the same.
(炭素原子に結合するヒドロキシ基)
 炭素原子に結合するヒドロキシ基としては、例えば、後述する特定ポリアルキレンオキシド鎖における一端の酸素原子が水素原子と結合することで形成されるヒドロキシ基が挙げられる。以下、特定ポリアルキレンオキシド鎖における一端の酸素原子が水素原子と結合することで形成されるヒドロキシ基を「特定ヒドロキシ基」ともいう。
 炭素原子に結合するヒドロキシ基は、特定ヒドロキシ基以外のヒドロキシ基であってもよい。特定ヒドロキシ基以外のヒドロキシ基を有する化合物としては、前述の連結基Y、連結基Q等の連結基として、炭素原子に結合するヒドロキシ基を含む連結基を有する化合物が挙げられる。
 本開示の化合物は、表面処理層における指紋視認性を低減する観点から、炭素原子に結合するヒドロキシ基として、少なくとも特定ヒドロキシ基を有することが好ましい。
(Hydroxy group bonded to carbon atom)
Examples of the hydroxy group bonded to a carbon atom include a hydroxy group formed by bonding an oxygen atom at one end of a specific polyalkylene oxide chain described below with a hydrogen atom. Hereinafter, a hydroxy group formed by bonding an oxygen atom at one end of a specific polyalkylene oxide chain with a hydrogen atom is also referred to as a "specific hydroxy group."
The hydroxy group bonded to the carbon atom may be a hydroxy group other than the specific hydroxy group. Examples of compounds having a hydroxy group other than the specific hydroxy group include compounds having a linking group containing a hydroxy group bonded to a carbon atom as a linking group such as the above-mentioned linking group Y 1 and linking group Q.
The compound of the present disclosure preferably has at least a specific hydroxy group as a hydroxy group bonded to a carbon atom, from the viewpoint of reducing fingerprint visibility in the surface treatment layer.
(エチレンオキシド単位及び炭素数3~6のアルキレンオキシド単位)
 本開示の化合物は、エチレンオキシド単位(つまりEO単位)及び炭素数3~6のアルキレンオキシド単位(つまりRO単位)を含む。本開示の化合物は、1以上のEO単位及び1以上のRO単位で構成される特定ポリアルキレンオキシド鎖を有することが好ましい。
(Ethylene oxide unit and alkylene oxide unit having 3 to 6 carbon atoms)
The compounds of the present disclosure include ethylene oxide units (ie, EO units) and alkylene oxide units having 3 to 6 carbon atoms (ie, RO units). Preferably, the compounds of the present disclosure have a specific polyalkylene oxide chain composed of one or more EO units and one or more RO units.
<特定ポリアルキレンオキシド鎖>
 特定ポリアルキレンオキシド鎖は、下記式(A)で表される。
 -(RO)(CHCHO)-  …(A)
 式(A)中、Rは、それぞれ独立に炭素数3~6のアルキレン基であり、a及びbはそれぞれ独立に1~300の整数であり、(RO)と(CHCHO)とがいずれの順序で結合してもよく、a及びbの少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよい。
<Specific polyalkylene oxide chain>
The specific polyalkylene oxide chain is represented by the following formula (A).
-(R 2 O) a (CH 2 CH 2 O) b -...(A)
In formula (A), R 2 is each independently an alkylene group having 3 to 6 carbon atoms, a and b are each independently an integer of 1 to 300, and (R 2 O) and (CH 2 CH 2 O) may be combined in any order, and may be combined randomly or in blocks when at least one of a and b is 2 or more.
 式(A)中Rで表されるアルキレン基の炭素数は、3~6であり、表面処理層の耐摩耗性を向上させる観点から、3~5が好ましく、3~4がより好ましく、3がさらに好ましい。
 アルキレン基は、直鎖状、分岐鎖状、及び環状のいずれであってもよく、その中でも、耐摩耗性に優れる観点から、直鎖状又は分岐鎖状が好ましく、分岐鎖状がより好ましい。
 アルキレン基としては、n-プロピレン基、イソプロピレン基、n-ブチレン基、イソブチレン基、シクロブタンジイル基、n-ペンチレン基、イソペンチレン基、sec-ペンチレン基、シクロペンタンジイル基、n-へキシレン基、イソへキシレン基、sec-ヘキシレン基、シクロヘキサンジイル基等が挙げられる。
The number of carbon atoms in the alkylene group represented by R 2 in formula (A) is 3 to 6, preferably 3 to 5, more preferably 3 to 4, from the viewpoint of improving the abrasion resistance of the surface treatment layer. 3 is more preferred.
The alkylene group may be linear, branched, or cyclic, and among these, from the viewpoint of excellent wear resistance, linear or branched is preferable, and branched is more preferable.
Examples of the alkylene group include n-propylene group, isopropylene group, n-butylene group, isobutylene group, cyclobutanediyl group, n-pentylene group, isopentylene group, sec-pentylene group, cyclopentanediyl group, n-hexylene group, Examples include isohexylene group, sec-hexylene group, and cyclohexanediyl group.
 (RO)の具体例としては、-CO-、-CO-、-C10O-、-C12O-、-CH(CH)CHO-、-CH(CH)CHCHO-、-cycloC-O-、-cycloC--O、及び-cycloC10-O-等が挙げられる。
 ここで、-cycloC-は、シクロブタンジイル基を意味する。シクロブタンジイル基としては、シクロブタン-1,2-ジイル基、及びシクロブタン-1,3-ジイル基が挙げられる。-cycloC-は、シクロペンタンジイル基を意味する。シクロペンタンジイル基としては、シクロペンタン-1,2-ジイル基、及びシクロペンタン-1,3-ジイル基が挙げられる。-cycloC10-は、シクロヘキサンジイル基を意味する。シクロヘキサンジイル基としては、シクロヘキサン-1,2-ジイル基、シクロヘキサン-1,3-ジイル基、及びシクロヘキサン-1,4-ジイル基が挙げられる。
Specific examples of (R 2 O) include -C 3 H 6 O-, -C 4 H 8 O-, -C 5 H 10 O-, -C 6 H 12 O-, -CH(CH 3 )CH 2 O-, -CH(CH 3 )CH 2 CH 2 O-, -cycloC 4 H 6 -O-, -cycloC 5 H 8 -O, and -cycloC 6 H 10 -O-.
Here, -cycloC 4 H 6 - means a cyclobutanediyl group. Examples of the cyclobutanediyl group include a cyclobutane-1,2-diyl group and a cyclobutane-1,3-diyl group. -cycloC 5 H 8 - means a cyclopentanediyl group. Examples of the cyclopentanediyl group include a cyclopentane-1,2-diyl group and a cyclopentane-1,3-diyl group. -cycloC 6 H 10 - means a cyclohexanediyl group. Examples of the cyclohexanediyl group include a cyclohexane-1,2-diyl group, a cyclohexane-1,3-diyl group, and a cyclohexane-1,4-diyl group.
 1つの特定ポリアルキレンオキシド鎖に含まれるRO単位の数aは、1~300の整数であり、表面処理層の耐摩耗性の観点から、2~300の整数が好ましく、2~100の整数がより好ましく、2~50の整数がさらに好ましい。
 1つの特定ポリアルキレンオキシド鎖に含まれるEO単位の数bは、1~300の整数であり、表面処理層における指紋視認性を低減する特性の観点から、2~300の整数が好ましく、2~50の整数がより好ましく、2~20の整数がさらに好ましい。
 1つの特定ポリアルキレンオキシド鎖に含まれるRO単位の数aとEO単位の数bとの合計a+bは、2~600の整数であり、指紋視認性を低減する特性と耐摩耗性との両立を実現可能性にする観点から、4~600の整数が好ましく、4~150の整数がより好ましく、4~70の整数がさらに好ましい。
 1つの特定ポリアルキレンオキシド鎖に含まれるRO単位の数aとEO単位の数bとの合計に対するRO単位の数aの割合a/(a+b)は、表面処理層の指紋視認性を低減する特性と耐摩耗性との両立の観点から、0.2~0.8が好ましく、0.3~0.8がより好ましく、0.3~0.7がさらに好ましい。
The number a of RO units contained in one specific polyalkylene oxide chain is an integer of 1 to 300, preferably an integer of 2 to 300 from the viewpoint of wear resistance of the surface treatment layer, and an integer of 2 to 100. More preferably, an integer of 2 to 50 is even more preferable.
The number b of EO units contained in one specific polyalkylene oxide chain is an integer of 1 to 300, preferably an integer of 2 to 300 from the viewpoint of the property of reducing fingerprint visibility in the surface treatment layer, and 2 to 300. An integer of 50 is more preferred, and an integer of 2 to 20 is even more preferred.
The total a+b of the number a of RO units and the number b of EO units contained in one specific polyalkylene oxide chain is an integer of 2 to 600, and the property of reducing fingerprint visibility and abrasion resistance are both compatible. From the viewpoint of feasibility, an integer of 4 to 600 is preferable, an integer of 4 to 150 is more preferable, and an integer of 4 to 70 is even more preferable.
The ratio a/(a+b) of the number a of RO units to the sum of the number a of RO units and the number b of EO units contained in one specific polyalkylene oxide chain is a characteristic that reduces the fingerprint visibility of the surface treatment layer. From the viewpoint of achieving both wear resistance and abrasion resistance, the range is preferably 0.2 to 0.8, more preferably 0.3 to 0.8, and even more preferably 0.3 to 0.7.
 本開示の化合物が1分子中に有するRO単位の数Saは、表面処理層の耐摩耗性の観点から、2~50の整数が好ましく、4~30の整数がより好ましい。
 本開示の化合物が1分子中に有するEO単位の数Sbは、表面処理層における指紋視認性を低減する特性の観点から、2~50の整数が好ましく、4~30の整数がより好ましい。
 本開示の化合物が1分子中に有するRO単位の数SaとEO単位の数Sbとの合計に対するSaの割合Sa/(Sa+Sb)、つまり、Ma/(Ma+Mb)の値は、前記の通り、0.2~0.8であり、表面処理層における指紋視認性を低減する特性と耐摩耗性との両立の観点から、0.3~0.8が好ましく、0.3~0.7がより好ましい。
The number Sa of RO units that the compound of the present disclosure has in one molecule is preferably an integer of 2 to 50, more preferably an integer of 4 to 30, from the viewpoint of wear resistance of the surface treatment layer.
The number Sb of EO units that the compound of the present disclosure has in one molecule is preferably an integer of 2 to 50, more preferably an integer of 4 to 30, from the viewpoint of the property of reducing fingerprint visibility in the surface treatment layer.
As mentioned above, the ratio Sa/(Sa+Sb) of Sa to the sum of the number Sa of RO units and the number Sb of EO units that the compound of the present disclosure has in one molecule, that is, the value of Ma/(Ma+Mb) is 0. .2 to 0.8, preferably 0.3 to 0.8, more preferably 0.3 to 0.7 from the viewpoint of achieving both the property of reducing fingerprint visibility in the surface treatment layer and the abrasion resistance. preferable.
 式(A)中のaが2以上である場合、2以上のRは、互いに同じであってもよく、異なっていてもよい。合成容易性の観点からは、2以上のRが同じであることが好ましい。つまり、特定ポリアルキレンオキシド鎖は、RO単位を1種のみ含んでもよく、2種以上のRO単位を含んでもよく、合成容易性の観点からRO単位を1種のみ含むことが好ましい。
 特定ポリアルキレンオキシド鎖が2種以上のRO単位を含む場合、2種以上のRO単位の結合順序は限定されず、ランダム、交互、及びブロックのいずれに配置されていてもよい。2種以上のRO単位を含むとは、特定ポリアルキレンオキシド鎖において、炭素数の異なる2種以上のRO単位が存在すること、及び、炭素数が同一であっても側鎖の有無や側鎖の種類(例えば、側鎖の数、側鎖の炭素数等)が異なる2種以上のRO単位が存在することをいう。
When a in formula (A) is 2 or more, two or more R 2 's may be the same or different. From the viewpoint of ease of synthesis, it is preferable that two or more R 2 are the same. That is, the specific polyalkylene oxide chain may contain only one type of RO unit, or may contain two or more types of RO units, and preferably contains only one type of RO unit from the viewpoint of ease of synthesis.
When the specific polyalkylene oxide chain contains two or more types of RO units, the bonding order of the two or more types of RO units is not limited, and may be arranged randomly, alternately, or in blocks. Containing two or more types of RO units means that two or more types of RO units with different numbers of carbon atoms exist in a specific polyalkylene oxide chain, and even if the number of carbon atoms is the same, the presence or absence of a side chain or the side chain This refers to the presence of two or more types of RO units with different types (for example, number of side chains, number of carbon atoms in the side chain, etc.).
 特定ポリアルキレンオキシド鎖に含まれるEO単位とRO単位との結合順序は限定されず、ランダム、交互、及びブロックのいずれに配置されていてもよい。
 特定ポリアルキレンオキシド鎖に含まれるEO単位とRO単位との結合順序は、合成容易性及び機能分離性の観点から、ブロックであることが好ましい。
The bonding order of the EO units and RO units contained in the specific polyalkylene oxide chain is not limited, and may be arranged randomly, alternately, or in blocks.
The bonding order of the EO units and RO units contained in the specific polyalkylene oxide chain is preferably block from the viewpoint of ease of synthesis and functional separation.
 EO単位とRO単位とがブロックで配列された特定ポリアルキレンオキシド鎖の構造としては、例えば下記構造が挙げられる。
 -(RO)-(CHCHO)
 -(CHCHO)-(RO)
 -(RO)a11-(CHCHO)-(RO)a12
 -(CHCHO)b11-(RO)-(CHCHO)b12
 -(RO)a11-(CHCHO)b11-(RO)a12-(CHCHO)b12
 -(CHCHO)b11-(RO)a11-(CHCHO)b12-(RO)a12
 上記式中、a及びbは、それぞれ式(A)中のa及びbと同じであり、a11、b11、a12、及びb12は、それぞれ独立に1~299の整数であり、a11+a12=a、b11+b12=bである。
 なお、上記式中における各単位の配置について、例えば「-(RO)-」で表される構造は、RO単位がa個連続して結合したブロックを意味する。
 上記式で表される特定ポリアルキレンオキシド鎖が部分構造Dを構成する場合、上記式の右側末端における酸素原子が単結合又は連結基Yを介して反応性シリル基に結合し、上記式で表される特定ポリアルキレンオキシド鎖が部分構造Eを構成する場合、上記式の右側末端における酸素原子が水素原子と結合してヒドロキシ基を形成する。
Examples of the structure of a specific polyalkylene oxide chain in which EO units and RO units are arranged in blocks include the following structures.
-(R 2 O) a -(CH 2 CH 2 O) b -
-(CH 2 CH 2 O) b - (R 2 O) a -
-(R 2 O) a11 -(CH 2 CH 2 O) b -(R 2 O) a12 -
-(CH 2 CH 2 O) b11 -(R 2 O) a -(CH 2 CH 2 O) b12 -
-(R 2 O) a11 -(CH 2 CH 2 O) b11 -(R 2 O) a12 -(CH 2 CH 2 O) b12 -
-(CH 2 CH 2 O) b11 -(R 2 O) a11 -(CH 2 CH 2 O) b12 -(R 2 O) a12 -
In the above formula, a and b are the same as a and b in formula (A), a11, b11, a12, and b12 are each independently an integer from 1 to 299, and a11+a12=a, b11+b12 =b.
Regarding the arrangement of each unit in the above formula, for example, the structure represented by "-(R 2 O) a -" means a block in which a number of RO units are consecutively bonded.
When the specific polyalkylene oxide chain represented by the above formula constitutes partial structure D, the oxygen atom at the right end of the above formula is bonded to the reactive silyl group via a single bond or linking group Y1 , and the above formula When the specific polyalkylene oxide chain represented constitutes partial structure E, the oxygen atom at the right end of the above formula combines with a hydrogen atom to form a hydroxy group.
(式(1)で表される化合物)
 本開示の化合物は、指紋視認性を低減する特性と耐摩耗性とを両立する表面処理層を形成する観点から、下記式(1)で表される化合物であることが好ましい。
(Compound represented by formula (1))
The compound of the present disclosure is preferably a compound represented by the following formula (1) from the viewpoint of forming a surface treatment layer that has both the property of reducing fingerprint visibility and abrasion resistance.

 

 
 式(1)中、
 Rはそれぞれ独立に炭素数3~6のアルキレン基であり、
 Qは(d+e)価の連結基であり、
 Yは(g+1)価の連結基であり、
 Rはそれぞれ独立に1価の炭化水素基であり、
 Lはそれぞれ独立に加水分解性基又は水酸基であり、
 a1、a2、b1、及びb2はそれぞれ独立に1~300の整数であり、
 d及びeはそれぞれ独立に1~10の整数であり、
 nは0~2の整数であり、
 gは1以上の整数であり、
 (OCHCHb1(ORa1は、(OCHCH)と(OR)とがいずれの順序で結合してもよく、a1及びb1の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
 (RO)a2(CHCHO)b2は、(RO)と(CHCHO)とがいずれの順序で結合してもよく、a2及びb2の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
 d個のa2とe個のa1との合計をSaとし、d個のb2とe個のb1との合計をSbとしたとき、SaとSbとの合計に対するSaの割合Sa/(Sa+Sb)の値が0.2~0.8である。
In formula (1),
R 2 is each independently an alkylene group having 3 to 6 carbon atoms,
Q 1 is a (d+e)-valent linking group,
Y 1 is a (g+1)-valent linking group,
R 1 is each independently a monovalent hydrocarbon group,
L 2 is each independently a hydrolyzable group or a hydroxyl group,
a1, a2, b1, and b2 are each independently an integer of 1 to 300,
d and e are each independently an integer of 1 to 10,
n is an integer from 0 to 2,
g is an integer greater than or equal to 1,
(OCH 2 CH 2 ) b1 (OR 2 ) a1 is such that (OCH 2 CH 2 ) and (OR 2 ) may be combined in any order, and when at least one of a1 and b1 is 2 or more, It can be combined randomly or in blocks,
(R 2 O) a2 (CH 2 CH 2 O) b2 , (R 2 O) and (CH 2 CH 2 O) may be bonded in any order, and at least one of a2 and b2 is 2 or more If , it can be combined randomly or in blocks,
When the sum of d a2 and e a1 is Sa, and the sum of d b2 and e b1 is Sb, the ratio of Sa to the sum of Sa and Sb is Sa/(Sa+Sb). The value is between 0.2 and 0.8.
 式(1)における「-(OCHCHb1(ORa1-」及び「-(RO)a2(CHCHO)b2」は、上述した特定ポリアルキレンオキシド鎖と同様である
ため、説明を省略する。なお、式(1)中のa1及びa2は、いずれも前記式(A)中のaと同じであり、d個のa2及びe個のa1は、同一であってもよく、互いに異なっていてもよい。式(1)中のb1及びb2は、いずれも前記式(A)中のbと同じであり、d個のb2及びe個のb1は、同一であってもよく、互いに異なっていてもよい。式(1)中のRは、前記式(A)中のRと同じであり、式(1)に含まれる複数のRは、同一であってもよく、互いに異なっていてもよい。
 式(1)におけるd及びeは、それぞれ、上述した、1分子中における部分構造Dの数及び1分子中における部分構造Eの数と同じである。
 式(1)で表される化合物に含まれる(d+e)個の特定ポリアルキレンオキシド鎖は、同一であってもよく、互いに異なっていてもよい。
 式(1)におけるR、L、及びnは、反応性シリル基として上述した式(2)におけるR、L、及びnと同じである。
 上記割合Sa/(Sa+Sb)の値は、前述の割合Ma/(Ma+Mb)の値と同じである。
 なお、式(1)における「-(RO)a2(CHCHO)b2-Y(-Si(R 3-n」が前述の部分構造Dに相当する。また、式(1)における「H-(OCHCHb1(ORa1」が前述の部分構造Eに相当する。
"-(OCH 2 CH 2 ) b1 (OR 2 ) a1 -" and "-(R 2 O) a2 (CH 2 CH 2 O) b2 " in formula (1) are the same as the above-mentioned specific polyalkylene oxide chain Therefore, the explanation will be omitted. Note that a1 and a2 in formula (1) are both the same as a in formula (A), and d a2 and e a1 may be the same or different from each other. Good too. b1 and b2 in formula (1) are both the same as b in formula (A), and d b2 and e b1 may be the same or different from each other. . R 2 in formula (1) is the same as R 2 in formula (A), and multiple R 2 included in formula (1) may be the same or different from each other. .
d and e in formula (1) are the same as the number of partial structures D in one molecule and the number of partial structures E in one molecule, respectively, which are described above.
The (d+e) specific polyalkylene oxide chains contained in the compound represented by formula (1) may be the same or different from each other.
R 1 , L 2 , and n in formula (1) are the same as R 1 , L, and n in formula (2) described above as the reactive silyl group.
The value of the ratio Sa/(Sa+Sb) is the same as the value of the ratio Ma/(Ma+Mb) described above.
Note that "-(R 2 O) a2 (CH 2 CH 2 O) b2 -Y 1 (-Si(R 1 ) n L 2 3-n ) g " in formula (1) corresponds to the above-mentioned partial structure D. do. Further, "H-(OCH 2 CH 2 ) b1 (OR 2 ) a1 " in formula (1) corresponds to the above-mentioned partial structure E.
<式(1)におけるQ
 式(1)におけるQは、(d+e)価の連結基である。
 Qで表される連結基としては、アルキレン基、アリーレン基、カルボニル基、エーテル結合、チオエーテル結合、スルホニル基、-NR-、-N<、-SiR -、>SiR-、>Si<、多価アルコール残基、多価フェノール残基、ポリアミン残基、これらの組み合わせ等が挙げられる。なお、Rは、水素原子又は炭化水素基である。
<Q 1 in formula (1)>
Q 1 in formula (1) is a (d+e)-valent linking group.
The linking group represented by Q 1 includes an alkylene group, an arylene group, a carbonyl group, an ether bond, a thioether bond, a sulfonyl group, -NR 4 -, -N<, -SiR 4 2 -, >SiR 4 -, > Examples include Si<, polyhydric alcohol residues, polyhydric phenol residues, polyamine residues, and combinations thereof. Note that R 4 is a hydrogen atom or a hydrocarbon group.
 上記アルキレン基は、直鎖状、分岐鎖状、及び環状のいずれであってもよく、その中でも直鎖状又は分岐鎖状が好ましく、分岐鎖状がより好ましい。アルキレン基の炭素数としては、例えば2~10が挙げられ、2~8が好ましく、2~6がより好ましい。
 Rで表される炭化水素基としては、例えば、脂肪族炭化水素基及び芳香族炭化水素基が挙げられ、脂肪族炭化水素基が好ましく、アルキル基がより好ましく、メチル基がさらに好ましい。
 上記アリーレン基は、芳香環から水素を2つ除いた基である。芳香環としては、ベンゼン環、ナフタレン環、フルオレン環、アントラセン環、フラン環、チオフェン環、ピリジン環等が挙げられる
The above-mentioned alkylene group may be linear, branched, or cyclic, and among these, linear or branched is preferable, and branched is more preferable. The number of carbon atoms in the alkylene group is, for example, 2 to 10, preferably 2 to 8, and more preferably 2 to 6.
The hydrocarbon group represented by R 4 includes, for example, an aliphatic hydrocarbon group and an aromatic hydrocarbon group, with an aliphatic hydrocarbon group being preferred, an alkyl group being more preferred, and a methyl group being even more preferred.
The above arylene group is a group obtained by removing two hydrogen atoms from an aromatic ring. Examples of aromatic rings include benzene ring, naphthalene ring, fluorene ring, anthracene ring, furan ring, thiophene ring, and pyridine ring.
 Qで表される連結基は、これらの中でも、多価アルコール残基、多価フェノール残基、ポリアミン残基が好ましく、多価アルコール残基、ポリアミン残基がより好ましく、多価アルコール残基がさらに好ましい。
 Qで表される連結基は、下記式(Q1-1)で表される多価アルコール残基及び下記式(Q1-2)で表されるポリアミン残基が好ましい。
  (*-O-)11(-O-*   (Q1-1)
  (*-N-)12(-N-*   (Q1-2)
 上記式中、Q11及びQ12はそれぞれ独立に(d+e)価の連結基であり、*は式(1)中の部分構造Eに結合する結合部であり、*は式(1)中の部分構造Dに結合する結合部である。
 Q11又はQ12で表される連結基としては、アルキレン基、アリーレン基、エーテル結合、-NR-、これらの組み合わせ等が挙げられる。Rは、前述の通りである。
Among these, the linking group represented by Q1 is preferably a polyhydric alcohol residue, a polyhydric phenol residue, or a polyamine residue, more preferably a polyhydric alcohol residue or a polyamine residue, and a polyhydric alcohol residue. is even more preferable.
The linking group represented by Q 1 is preferably a polyhydric alcohol residue represented by the following formula (Q1-1) or a polyamine residue represented by the following formula (Q1-2).
( E *-O-) e Q 11 (-O-* D ) d (Q1-1)
( E *-N-) e Q 12 (-N-* D ) d (Q1-2)
In the above formula, Q 11 and Q 12 are each independently a (d+e)-valent linking group, E * is a bond bonding to partial structure E in formula (1), and * D is formula (1) This is a bonding portion that connects to the partial structure D inside.
The linking group represented by Q 11 or Q 12 includes an alkylene group, an arylene group, an ether bond, -NR 4 -, a combination thereof, and the like. R 4 is as described above.
 多価アルコール残基とは、多価アルコールに含まれる全ての水酸基から水素原子を除いた基を意味する。例えば、グリセリン残基は、-OCH-CH(-O-)-CHO-で表される。
 多価アルコールは、モノマーでもよく、ポリマーでもよい。
 モノマーである多価アルコールとしては、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、1,3-プロパンジオール、1,3-ブタンジオール、1,4-ブタンジオール、1,6-ヘキサンジオール、1,4-シクロヘキサンジオール、ネオペンチルグリコール、ジエタノールアミン等のジオール;グリセリン、ジグリセリン、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリペンタエリスリトール、ヘキシトール等の3価以上のアルコール;グルコース、ソルビトール、デキストロース、フラクトース、ショ糖、メチルグルコシド、トレハロース等の糖類又はその誘導体;ひまし油又はひまし油縮合物等の水酸基を有する脂肪酸トリグリセリド又はその縮合物などの水酸基含有化合物などが挙げられる。
The polyhydric alcohol residue refers to a group obtained by removing hydrogen atoms from all hydroxyl groups contained in a polyhydric alcohol. For example, a glycerin residue is represented by -OCH 2 -CH(-O-)-CH 2 O-.
The polyhydric alcohol may be a monomer or a polymer.
The monomer polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, 1 , 4-cyclohexanediol, neopentyl glycol, diethanolamine, and other diols; trihydric or higher alcohols such as glycerin, diglycerin, trimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, and hexitol; glucose, sorbitol, dextrose, Saccharides or derivatives thereof such as fructose, sucrose, methyl glucoside, trehalose; hydroxyl group-containing compounds such as fatty acid triglycerides or condensates thereof having hydroxyl groups such as castor oil or castor oil condensates;
 ポリマーである多価アルコールとしては、ポリエチレングリコール、ポリプロピレングリコール、ポリオキシテトラメチレングリコール、ポリカーボネートジオール、ポリエーテルポリカーボネートジオール、ポリオキシテトラメチレングリコールにアルキレンオキシドを付加させたポリエーテルポリオール等が挙げられる。
 ポリエステルポリオールとしては、例えば、二塩基酸とアルコールとの縮合物からなるポリエステルポリオール、環状エステル化合物の開環重合物であるポリカプロラクトンポリオール等が挙げられる。
 ポリカーボネートジオールとしては、例えば、アルコールとカーボネート化合物との縮重合物、並びに、アルコール及び環状エステルとカーボネート化合物との反応生成物等が挙げられる。
 ポリエーテルポリカーボネートジオールとしては、例えば、ポリエーテルポリオールとカーボネート化合物との縮合物等が挙げられる。
 ポリエーテルカーボネートポリオールとしては、例えば、水酸基を有する開始剤にアルキレンオキシドと二酸化炭素を付加させて得られる生成物等が挙げられる。
 ポリマーである多価アルコールの数平均分子量としては、例えば400~19,700の範囲が挙げられる。
Examples of polyhydric alcohols that are polymers include polyethylene glycol, polypropylene glycol, polyoxytetramethylene glycol, polycarbonate diol, polyether polycarbonate diol, and polyether polyol obtained by adding alkylene oxide to polyoxytetramethylene glycol.
Examples of polyester polyols include polyester polyols made of condensates of dibasic acids and alcohols, polycaprolactone polyols that are ring-opening polymers of cyclic ester compounds, and the like.
Examples of polycarbonate diols include condensation products of alcohols and carbonate compounds, and reaction products of alcohols and cyclic esters with carbonate compounds.
Examples of the polyether polycarbonate diol include a condensate of a polyether polyol and a carbonate compound.
Examples of polyether carbonate polyols include products obtained by adding alkylene oxide and carbon dioxide to an initiator having a hydroxyl group.
The number average molecular weight of the polyhydric alcohol, which is a polymer, is, for example, in the range of 400 to 19,700.
 多価フェノール残基とは、多価フェノールに含まれる全てのフェノール性水酸基から水素原子を除いた基を意味する。
 多価フェノールとしては、ビスフェノールA、ビスフェノールF、ビスフェノールS、ノボラック、レゾール、レゾルシン等のフェノール類が挙げられる。
 ポリアミン残基とは、ポリアミンに含まれるすべてのアミノ基から水素原子を1つずつ除いた基を意味する。
 ポリアミンとしては、エチレンジアミン、ジエチレンジアミン、ジアミノジフェニルメタン、ヘキサメチレンジアミン、プロピレンジアミン、メチルベンゼンジアミン等が挙げられる。
The polyhydric phenol residue refers to a group obtained by removing hydrogen atoms from all phenolic hydroxyl groups contained in a polyhydric phenol.
Examples of polyhydric phenols include phenols such as bisphenol A, bisphenol F, bisphenol S, novolak, resol, and resorcinol.
The polyamine residue refers to a group obtained by removing one hydrogen atom from all amino groups contained in a polyamine.
Examples of the polyamine include ethylene diamine, diethylene diamine, diaminodiphenylmethane, hexamethylene diamine, propylene diamine, and methylbenzenediamine.
 Qで表される連結基の具体例としては、例えば下記構造の有機基が挙げられる。Qで表される連結基は、下記具体例に限定されるものではない。ただし、下記式中、*は式(1)中における部分構造D又は部分構造EのRに結合する結合部である。 Specific examples of the linking group represented by Q 1 include, for example, organic groups having the following structure. The linking group represented by Q 1 is not limited to the specific examples below. However, in the following formula, * is a bond bonding to R 2 of partial structure D or partial structure E in formula (1).

 

 
<式(1)におけるY(-Si(R 3-n
 Yは単結合又は(g+1)価の連結基である。Yとしては、例えば、エーテル性酸素原子又は2価のオルガノポリシロキサン残基を有していてもよいアルキレン基を含む基、炭素原子、窒素原子、ケイ素原子、2~8価のオルガノポリシロキサン残基、及び、後述する式(3-1A)、式(3-1B)、又は式(3-1A-1)~(3-1A-7)からSi(R 3-nを除いた基が挙げられる(Yのうち特定ポリアルキレンオキシド鎖に結合する末端が-O-である場合を除く)。
 また、Yは、後述する基(g2-1)~基(g2-14)であってもよい。
<Y 1 (-Si(R 1 ) n L 2 3-n ) g in formula (1)>
Y 1 is a single bond or a (g+1)-valent linking group. Y 1 is, for example, a group containing an etheric oxygen atom or an alkylene group which may have a divalent organopolysiloxane residue, a carbon atom, a nitrogen atom, a silicon atom, a divalent to octavalent organopolysiloxane. Si(R 1 ) n L 2 3-n from the residue and formula (3-1A), formula (3-1B), or formula (3-1A-1) to (3-1A-7) described later (Excluding the case where the terminal of Y 1 bonded to the specific polyalkylene oxide chain is -O-).
Further, Y 1 may be groups (g2-1) to (g2-14) described below.
 Yは、これらの中でも、耐摩耗性の観点から、シリル基を含むものが好ましく、式(3-1A-3)からSi(R 3-nを除いた基、式(3-1A-5)からSi(R 3-nを除いた基、基(g2-5)、及び基(g2-7)~(g2-14)がより好ましく、g2-5がさらに好ましい。 Among these, Y 1 is preferably one containing a silyl group from the viewpoint of wear resistance, and is a group obtained by removing Si(R 1 ) n L 2 3-n from formula (3-1A-3), or a group of formula ( The group obtained by removing Si(R 1 ) n L 2 3-n from 3-1A-5), the group (g2-5), and the groups (g2-7) to (g2-14) are more preferable, and g2-5 is even more preferable.
 gは1以上の整数である。一態様において、表面処理層の指紋視認性を低減する特性及び耐摩耗性の観点からは、gは、1~15であることが好ましく、1~6であることがより好ましい。一態様において、表面処理層の耐摩耗性に優れる観点からは、gは2以上であることが好ましく、2~4であることがより好ましく、2又は3であることがさらに好ましい。一態様において、表面処理層の指紋視認性を低減する特性に優れる観点からは、gは、1~3であることが好ましく、1又は2であることがより好ましく、1であることがさらに好ましい。 g is an integer of 1 or more. In one embodiment, g is preferably from 1 to 15, more preferably from 1 to 6, from the viewpoint of the surface treatment layer's ability to reduce fingerprint visibility and abrasion resistance. In one embodiment, g is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3 from the viewpoint of excellent wear resistance of the surface treatment layer. In one embodiment, g is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1 from the viewpoint of the surface treatment layer having excellent properties of reducing fingerprint visibility. .
 gが2以上である場合、式(1)で表される化合物に含まれる2以上の(-Si(R 3-n)は、同一であってもよく、互いに異なっていてもよい。 When g is 2 or more, two or more (-Si(R 1 ) n L 2 3-n ) contained in the compound represented by formula (1) may be the same or different from each other. Good too.
 式(1)におけるY(-Si(R 3-nで表される基は、基(3-1A)又は基(3-1B)が好ましい。
 -Q-X31(-Q-Si(R 3-n(-R31  …(3-1A)
 -Q-[CHC(R32)(-Q-Si(R 3-n)]-R33 
 …(3-1B)
 なお、基(3-1A)又は基(3-1B)のうち、特定ポリアルキレンオキシド鎖と結合する末端は-O-ではない。
The group represented by Y 1 (-Si(R 1 ) n L 2 3-n ) g in formula (1) is preferably group (3-1A) or group (3-1B).
-Q a -X 31 (-Q b -Si(R 1 ) n L 2 3-n ) h (-R 31 ) i ...(3-1A)
-Q c -[CH 2 C(R 32 )(-Q d -Si(R 1 ) n L 2 3-n )] y -R 33
...(3-1B)
Note that the terminal of group (3-1A) or group (3-1B) that is bonded to the specific polyalkylene oxide chain is not -O-.
 式(3-1A)において、
 Qは、単結合又は2価の連結基であり、
 X31は、単結合、アルキレン基、炭素原子、窒素原子、ケイ素原子、2~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基であり、
 Qは、単結合又は2価の連結基であり、
 R31は、水素原子、水酸基又はアルキル基であり、
 hは1以上の整数であり、iは0以上の整数であり、
 R、L、及びnの定義及び具体例は、反応性シリル基内の各符号の定義及び具体例と同じである。
In formula (3-1A),
Q a is a single bond or a divalent linking group,
X 31 is a group having a single bond, an alkylene group, a carbon atom, a nitrogen atom, a silicon atom, a 2- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring,
Q b is a single bond or a divalent linking group,
R 31 is a hydrogen atom, a hydroxyl group or an alkyl group,
h is an integer of 1 or more, i is an integer of 0 or more,
The definitions and specific examples of R 1 , L 2 , and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
 式(3-1B)において、
 Qは、単結合又は2価の連結基であり、
 R32は、水素原子又は炭素数1~10のアルキル基であり、
 Qは、単結合又はアルキレン基であり、
 R33は、水素原子又はハロゲン原子であり、
 yは、1~10の整数であり、
 R、L、及びnの定義及び具体例は、反応性シリル基内の各符号の定義及び具体例と同じである。
In formula (3-1B),
Q c is a single bond or a divalent linking group,
R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms,
Q d is a single bond or an alkylene group,
R 33 is a hydrogen atom or a halogen atom,
y is an integer from 1 to 10,
The definitions and specific examples of R 1 , L 2 , and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
 Qは、単結合又は2価の連結基である。
 2価の連結基としては、例えば、2価の炭化水素基、2価の複素環基、-O-、-S-、-SO-、-N(R)-、-C(O)-、-Si(R-及び、これらを2種以上組み合わせた基が挙げられる。Qのうち特定ポリアルキレンオキシド鎖に結合する末端が-O-である場合を除く。
 上記2価の炭化水素基としては、2価の飽和炭化水素基、2価の芳香族炭化水素基、アルケニレン基、アルキニレン基であってもよい。2価の飽和炭化水素基は、直鎖状、分岐鎖状又は環状であってもよく、例えば、アルキレン基が挙げられる。2価の飽和炭化水素基の炭素数は、1~20が好ましい。また、2価の芳香族炭化水素基としては、炭素数5~20のものが好ましく、例えば、フェニレン基が挙げられる。それ以外にも、2価の炭化水素基は、炭素数2~20のアルケニレン基、炭素数2~20のアルキニレン基であってもよい。
 上記Rは、アルキル基(好ましくは炭素数1~10)又はフェニル基である。上記Rは、水素原子又はアルキル基(好ましくは炭素数1~10)である。
 上記これらを2種以上組み合わせた基としては、例えば、-OC(O)-、-C(O)O-、-C(O)S-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-、-C(O)N(R)-を有するアルキレン基、-N(R)C(O)-を有するアルキレン基、エーテル性酸素原子を有するアルキレン基、-OC(O)-を有するアルキレン基、-C(O)O-を有するアルキレン基、-C(O)S-を有するアルキレン基、-SON(R)-を有するアルキレン基、アルキレン基-Si(R-フェニレン基-Si(R等が挙げられる。
 一態様において、Qとしては、単結合、-O-、-S-、-N(R)-、-C(O)N(R)-、-OC(O)N(R)-、-C(O)O-、-OC(O)-、及び-C(O)S-が好ましく、単結合、-C(O)N(R)-、-OC(O)N(R)-、及び-OC(O)-がより好ましい。
Q a is a single bond or a divalent linking group.
Examples of divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof. Excludes the case where the terminal of Q a that is bonded to the specific polyalkylene oxide chain is -O-.
The divalent hydrocarbon group may be a divalent saturated hydrocarbon group, a divalent aromatic hydrocarbon group, an alkenylene group, or an alkynylene group. The divalent saturated hydrocarbon group may be linear, branched, or cyclic, and includes, for example, an alkylene group. The divalent saturated hydrocarbon group preferably has 1 to 20 carbon atoms. Furthermore, the divalent aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, such as a phenylene group. In addition, the divalent hydrocarbon group may be an alkenylene group having 2 to 20 carbon atoms or an alkynylene group having 2 to 20 carbon atoms.
The above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group. The above R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Examples of groups combining two or more of the above-mentioned types include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )-, - N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, an alkylene group having -N(R d )C(O)- an alkylene group having an etheric oxygen atom, an alkylene group having -OC(O)-, an alkylene group having -C(O)O-, an alkylene group having -C(O)S-, - Examples include an alkylene group having SO 2 N(R d )-, an alkylene group -Si(R a ) 2 -phenylene group -Si(R a ) 2 , and the like.
In one embodiment, Q a is a single bond, -O-, -S-, -N(R d )-, -C(O)N(R d )-, -OC(O)N(R d ) -, -C(O)O-, -OC(O)-, and -C(O)S- are preferred, and single bonds, -C(O)N(R d )-, -OC(O)N( R d )- and -OC(O)- are more preferred.
 X31は、アルキレン基、炭素原子、窒素原子、ケイ素原子、2~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基である。
 なお、上記アルキレン基は、-O-、シルフェニレン骨格基、2価のオルガノポリシロキサン残基又はジアルキルシリレン基を有していてもよい。アルキレン基は、-O-、シルフェニレン骨格基、2価のオルガノポリシロキサン残基及びジアルキルシリレン基からなる群から選択される基を複数有していてもよい。
 X31で表されるアルキレン基の炭素数は、1~20が好ましく、1~10がより好ましい。
 2~8価のオルガノポリシロキサン残基としては、2価のオルガノポリシロキサン残基、及び、後述する(w2+1)価のオルガノポリシロキサン残基が挙げられる。
X 31 is an alkylene group, a carbon atom, a nitrogen atom, a silicon atom, a di- to octavalent organopolysiloxane residue, or a group having a (h+i+1)-valent ring.
The alkylene group may have -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group. The alkylene group may have a plurality of groups selected from the group consisting of -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, and a dialkylsilylene group.
The alkylene group represented by X 31 preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms.
Examples of the divalent to octavalent organopolysiloxane residues include divalent organopolysiloxane residues and (w2+1)-valent organopolysiloxane residues described below.
 X31が(h+i+1)価の環を有する基である場合、Q、(-Q-Si(R 3-n)、及び-R31(i=1以上の場合)は該環を構成する原子に直接結合している。ただし、該環はオルガノポリシロキサン環以外の環である。以下、特に言及しない限り、X31における環は、オルガノポリシロキサン環以外の環を意味する。
 X31における環は、単環、縮合多環、橋かけ環、スピロ環及び集合多環のいずれであってもよく、環を構成する原子は、炭素原子のみからなる炭素環でもよく、2価以上の原子価を有するヘテロ原子と炭素原子とからなるヘテロ環でもよい。また、環を構成する原子間の結合は、単結合であってもよく、多重結合であってもよい。さらに、環は芳香族性の環であってもよく、非芳香族性の環であってもよい。
 単環としては、4員環~8員環が好ましく、5員環及び6員環がより好ましい。縮合多環としては、4員環~8員環の2以上が縮合した縮合多環が好ましく、5員環及び6員環から選ばれる環の2又は3個結合した縮合多環、及び、5員環及び6員環から選ばれる環の1又は2個と4員環1個が結合した縮合多環がより好ましい。橋かけ環としては、5員環又は6員環を最大の環とする橋かけ環が好ましく、スピロ環としては、4員環~6員環の2つからなるスピロ環が好ましい。集合多環としては、5員環及び6員環から選ばれる環の2又は3個が単結合、炭素原子の1~3個、又は原子価が2又は3のヘテロ原子1個を介して結合した集合多環が好ましい。なお、集合多環においては、各環にQ、(-Q-Si(R 3-n)及びR31(i=1以上の場合)のいずれかが結合していることが好ましい。
 上記環を構成するヘテロ原子としては、窒素原子、酸素原子及び硫黄原子が好ましく、窒素原子及び酸素原子がより好ましい。環を構成するヘテロ原子の数は3個以下が好ましい。また、環を構成するヘテロ原子の数が2個以上の場合、それらのヘテロ原子は同じでも異なっていてもよい。
When X 31 is a group having a (h+i+1)-valent ring, Q a , (-Q b -Si(R 1 ) n L 2 3-n ), and -R 31 (when i=1 or more) are It is directly bonded to the atoms constituting the ring. However, the ring is a ring other than an organopolysiloxane ring. Hereinafter, unless otherwise specified, the ring in X 31 means a ring other than an organopolysiloxane ring.
The ring in X 31 may be a monocyclic ring, a fused polycyclic ring, a bridged ring, a spiro ring, or an assembled polycyclic ring, and the atoms constituting the ring may be a carbocyclic ring consisting only of carbon atoms, or a divalent ring. A heterocycle consisting of a heteroatom having the above valence and a carbon atom may also be used. Further, the bond between atoms constituting the ring may be a single bond or a multiple bond. Furthermore, the ring may be an aromatic ring or a non-aromatic ring.
The monocyclic ring is preferably a 4- to 8-membered ring, more preferably a 5-membered ring or a 6-membered ring. The fused polycyclic ring is preferably a fused polycyclic ring in which two or more 4- to 8-membered rings are fused together, and fused polycyclic rings in which 2 or 3 rings selected from 5-membered rings and 6-membered rings are bonded together; A fused polycyclic ring in which one or two rings selected from membered rings and six-membered rings and one four-membered ring are bonded is more preferred. The bridged ring is preferably a bridged ring whose largest ring is a 5- or 6-membered ring, and the spiro ring is preferably a spiro ring consisting of two 4- to 6-membered rings. As a collective polycyclic ring, two or three rings selected from 5-membered rings and 6-membered rings are bonded via a single bond, 1 to 3 carbon atoms, or 1 heteroatom with a valence of 2 or 3. A set of polycyclic rings is preferred. In addition, in a set polycycle, either Q a , (-Q b -Si(R 1 ) n L 2 3-n ), or R 31 (when i=1 or more) is bonded to each ring. It is preferable.
The heteroatom constituting the ring is preferably a nitrogen atom, an oxygen atom, or a sulfur atom, and more preferably a nitrogen atom or an oxygen atom. The number of heteroatoms constituting the ring is preferably 3 or less. Furthermore, when the number of heteroatoms constituting the ring is two or more, these heteroatoms may be the same or different.
 X31における環としては、化合物を製造しやすい点及び表面処理層の耐摩耗性、耐光性及び耐薬品性がさらに優れる観点から、3~8員環の脂肪族環、ベンゼン環、3~8員環のヘテロ環、これらの環のうちの2又は3個が縮合した縮合環、5員環又は6員環を最大の環とする橋かけ環、及び、これらの環のうちの2つ以上を有し、連結基が単結合、炭素数3以下のアルキレン基、酸素原子又は硫黄原子である集合多環からなる群より選択される1種が好ましい。
 好ましい環は、ベンゼン環、5員又は6員の脂肪族環、窒素原子又は酸素原子を有する5員又は6員のヘテロ環、及び、5員又は6員の炭素環と4~6員のヘテロ環との縮合環である。
 具体的な環としては、以下に示す環と、1,3-シクロヘキサジエン環、1,4-シクロヘキサジエン環、アントラセン環、シクロプロパン環、デカヒドロナフタレン環、ノルボルネン環、ノルボルナジエン環、フラン環、ピロール環、チオフェン環、ピラジン環、モルホリン環、アジリジン環、イソキノリン環、オキサゾール環、イソオキサゾール環、チアゾール環、イミダゾール環、ピラゾール環、ピラン環、ピリダジン環、ピリミジン環、及びインデン環が挙げられる。なお、以下には、オキソ基(=O)を有する環も示す。
The ring in X 31 may be a 3- to 8-membered aliphatic ring, a benzene ring, or a 3- to 8-membered aliphatic ring, from the viewpoint of easy production of the compound and superior abrasion resistance, light resistance, and chemical resistance of the surface treatment layer. Heterocycle of a membered ring, a condensed ring in which two or three of these rings are fused together, a bridged ring in which the largest ring is a 5- or 6-membered ring, and two or more of these rings One type selected from the group consisting of a single bond, an alkylene group having 3 or less carbon atoms, an oxygen atom, or a sulfur atom as a connecting group is preferable.
Preferred rings include a benzene ring, a 5- or 6-membered aliphatic ring, a 5- or 6-membered heterocycle having a nitrogen atom or an oxygen atom, and a 5- or 6-membered carbon ring and a 4- to 6-membered heterocycle. It is a fused ring with a ring.
Specific rings include the rings shown below, a 1,3-cyclohexadiene ring, a 1,4-cyclohexadiene ring, an anthracene ring, a cyclopropane ring, a decahydronaphthalene ring, a norbornene ring, a norbornadiene ring, a furan ring, Examples include a pyrrole ring, a thiophene ring, a pyrazine ring, a morpholine ring, an aziridine ring, an isoquinoline ring, an oxazole ring, an isoxazole ring, a thiazole ring, an imidazole ring, a pyrazole ring, a pyran ring, a pyridazine ring, a pyrimidine ring, and an indene ring. In addition, below, a ring having an oxo group (=O) is also shown.

 

 
 X31における環を構成する原子の環を構成しない結合手は、Q、(-Q-Si(R 3-n)又はR31(i=1以上の場合)に結合する結合手であり、残余の結合手がある場合は水素原子や置換基に結合している。該置換基としては、ハロゲン原子、アルキル基(炭素-炭素原子間にエーテル性酸素原子を含んでいてもよい。)、シクロアルキル基、アルケニル基、アリル基、アルコキシ基、オキソ基(=O)等が挙げられる。
 また、環を構成する炭素原子の1個がQ、(-Q-Si(R 3-n)、又は-R31(i=1以上の場合)に結合できる結合手を2つ有する場合、その1個の炭素原子にQ、(-Q-Si(R 3-n)、及び-R31のうちの任意の2つが結合していてもよい。QとQとは別の環構成原子に結合していることが好ましい。i個のR31はそれぞれ別個の環構成原子に結合していてもよく、i個のR31のうちの2個が1個の環構成炭素原子に結合していてもよい。2個のR31が結合した環構成炭素原子が2個以上存在してもよい。
The bond that does not constitute a ring of the atom that constitutes the ring in The remaining bonds, if any, are bonded to hydrogen atoms or substituents. Examples of the substituent include a halogen atom, an alkyl group (which may contain an etheric oxygen atom between carbon atoms), a cycloalkyl group, an alkenyl group, an allyl group, an alkoxy group, and an oxo group (=O). etc.
In addition, a bond in which one of the carbon atoms constituting the ring can be bonded to Q a , (-Q b -Si(R 1 ) n L 2 3-n ), or -R 31 (when i = 1 or more) , even if any two of Q a , (-Q b -Si(R 1 ) n L 2 3-n ), and -R 31 are bonded to that one carbon atom. good. It is preferable that Q a and Q b are bonded to different ring constituent atoms. Each of the i R 31s may be bonded to a separate ring atom, or two of the i R 31s may be bonded to one ring carbon atom. There may be two or more ring-constituting carbon atoms to which two R 31s are bonded.
 なかでも、X31は、表面処理層の耐摩耗性を向上させる観点から、炭素原子、窒素原子、ケイ素原子、4~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基が好ましく、炭素原子がより好ましい。 Among these, X 31 is a group having a carbon atom, a nitrogen atom, a silicon atom, a 4- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring, from the viewpoint of improving the wear resistance of the surface treatment layer. is preferable, and carbon atom is more preferable.
 Qは、単結合又は2価の連結基である。
 2価の連結基としては、例えば、2価の炭化水素基、2価の複素環基、-O-、-S-、-SO-、-N(R)-、-C(O)-、-Si(R-及び、これらを2種以上組み合わせた基が挙げられる。
 上記2価の炭化水素基としては、2価の飽和炭化水素基、2価の芳香族炭化水素基、アルケニレン基、アルキニレン基であってもよい。2価の飽和炭化水素基は、直鎖状、分岐鎖状又は環状であってもよく、例えば、アルキレン基が挙げられる。2価の飽和炭化水素基の炭素数は、1~30が好ましく、1~20がより好ましい。アルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、例えば2、3、8、9、11が挙げられる。アルキニレン基の炭素数は2~20が好ましく、例えば2、3、8、9、11が挙げられる。また、2価の芳香族炭化水素基としては、炭素数5~20のものが好ましく、例えば、フェニレン基が挙げられる。それ以外にも、2価の炭化水素基は、炭素数2~20のアルケニレン基、炭素数2~20のアルキニレン基であってもよい。
 上記Rは、アルキル基(好ましくは炭素数1~10)又はフェニル基である。上記Rは、水素原子又はアルキル基(好ましくは炭素数1~10)である。
 なお、上記これらを2種以上組み合わせた基としては、例えば、-OC(O)-、-C(O)O-、-C(O)S-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-、-C(O)N(R)-を有するアルキレン基、-N(R)C(O)-を有するアルキレン基、エーテル性酸素原子を有するアルキレン基、-OC(O)-を有するアルキレン基、-C(O)O-を有するアルキレン基、-C(O)S-アルキレン基、-SON(R)-を有するアルキレン基、アルキレン基-Si(R-フェニレン基-Si(R等が挙げられる。
 一態様において、Qとしては、単結合、-O-、-S-、-N(R)-、-C(O)N(R)-、-OC(O)N(R)-、-C(O)O-、-OC(O)-、及び-C(O)S-が好ましく、単結合、-OC(O)N(R)-、及び-OC(O)-がより好ましい。Qのうち特定ポリアルキレンオキシド鎖に結合する末端が-O-である場合を除く。
Q b is a single bond or a divalent linking group.
Examples of divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof.
The divalent hydrocarbon group may be a divalent saturated hydrocarbon group, a divalent aromatic hydrocarbon group, an alkenylene group, or an alkynylene group. The divalent saturated hydrocarbon group may be linear, branched, or cyclic, and includes, for example, an alkylene group. The number of carbon atoms in the divalent saturated hydrocarbon group is preferably 1 to 30, more preferably 1 to 20. The alkylene group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms. The alkynylene group preferably has 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms. Furthermore, the divalent aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, such as a phenylene group. In addition, the divalent hydrocarbon group may be an alkenylene group having 2 to 20 carbon atoms or an alkynylene group having 2 to 20 carbon atoms.
The above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group. The above R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Examples of groups combining two or more of the above include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )- , -N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N( R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, -N(R d )C(O )-, an alkylene group having an etheric oxygen atom, an alkylene group having -OC(O)-, an alkylene group having -C(O)O-, a -C(O)S-alkylene group, - Examples include an alkylene group having SO 2 N(R d )-, an alkylene group -Si(R a ) 2 -phenylene group -Si(R a ) 2 , and the like.
In one embodiment, Q c is a single bond, -O-, -S-, -N(R d )-, -C(O)N(R d )-, -OC(O)N(R d ) -, -C(O)O-, -OC(O)-, and -C(O)S- are preferred, and single bonds, -OC(O)N(R d )-, and -OC(O)- is more preferable. Excludes the case where the terminal of Q c that is bonded to the specific polyalkylene oxide chain is -O-.
 R31は、水素原子、水酸基又はアルキル基である。
 アルキル基の炭素数は、1~5が好ましく、1~3がより好ましく、1がさらに好ましい。
R 31 is a hydrogen atom, a hydroxyl group or an alkyl group.
The number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.
 hは1以上の整数であり、iは0以上の整数である。
 X31が単結合又はアルキレン基の場合、hは1、iは0である。
 X31が窒素原子の場合、hは1~2の整数であり、iは0~1の整数であり、h+i=2を満たす。
 X31が炭素原子又はケイ素原子の場合、hは1~3の整数であり、iは0~2の整数であり、h+i=3を満たす。
 X31が2~8価のオルガノポリシロキサン残基の場合、hは1~7の整数であり、iは0~6の整数であり、h+i=1~7を満たす。
 X31が(h+i+1)価の環を有する基の場合、hは1~7の整数であり、iは0~6の整数であり、h+i=1~7を満たす。
 (-Q-Si(R 3-n)が2個以上ある場合は、2個以上の(-Q-Si(R 3-n)は、同一であっても異なっていてもよい。R31が2個以上ある場合は、2個以上の(-R31)は、同一であっても異なっていてもよい。
h is an integer greater than or equal to 1, and i is an integer greater than or equal to 0.
When X 31 is a single bond or an alkylene group, h is 1 and i is 0.
When X 31 is a nitrogen atom, h is an integer of 1 to 2, i is an integer of 0 to 1, and h+i=2 is satisfied.
When X 31 is a carbon atom or a silicon atom, h is an integer of 1 to 3, i is an integer of 0 to 2, and h+i=3 is satisfied.
When X 31 is a divalent to octavalent organopolysiloxane residue, h is an integer of 1 to 7, i is an integer of 0 to 6, and h+i=1 to 7 is satisfied.
When X 31 is a group having a (h+i+1)-valent ring, h is an integer of 1 to 7, i is an integer of 0 to 6, and h+i=1 to 7 is satisfied.
If there are two or more (-Q b -Si(R 1 ) n L 2 3-n ), two or more (-Q b -Si(R 1 ) n L 2 3-n ) are the same. It may be different or different. When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
 なかでも、表面処理層の耐摩耗性を向上させる観点からは、iは0であることが好ましい。 Among these, i is preferably 0 from the viewpoint of improving the wear resistance of the surface treatment layer.
 Qは、単結合又は2価の連結基である。
 2価の連結基の定義及び詳細は、上述したQで説明した定義及び詳細と同じである。
Q c is a single bond or a divalent linking group.
The definition and details of the divalent linking group are the same as those explained in Q a above.
 R32は、水素原子又は炭素数1~10のアルキル基であり、化合物を製造しやすい観点から、水素原子であることが好ましい。
 アルキル基としては、メチル基が好ましい。
R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
As the alkyl group, a methyl group is preferred.
 Qは、単結合又はアルキレン基である。アルキレン基の炭素数は、1~10が好ましく、1~6がより好ましい。化合物を製造しやすい観点から、Qは、単結合又は-CH-であることが好ましい。 Q d is a single bond or an alkylene group. The alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms. From the viewpoint of easy production of the compound, Q d is preferably a single bond or -CH 2 -.
 R33は、水素原子又はハロゲン原子であり、化合物を製造しやすい観点から、水素原子であることが好ましい。 R 33 is a hydrogen atom or a halogen atom, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
 yは、1~10の整数であり、1~6の整数であることが好ましい。
 2個以上の[CHC(R32)(-Q-Si(R 3-n)]は、同一であっても異なってもよい。
y is an integer from 1 to 10, preferably from 1 to 6.
Two or more [CH 2 C(R 32 )(-Q d -Si(R 1 ) n L 2 3-n )] may be the same or different.
 基(3-1A)としては、基(3-1A-1)~(3-1A-7)が好ましい。
 -(X32s1-Qb1-Si(R)3-n  …(3-1A-1)
 -(X33s2-Qa2-N[-Qb2-Si(R)3-n  …(3-1A-2)
 -Qa3-Si(R)[-Qb3-Si(R)3-n  …(3-1A-3)
 -[Qs4-Qa4-(O)t4-C[-(O)u4-Qb4-Si(R)3-n3-w1(-R31w1  …(3-1A-4)
 -(X34s3-Qa5-Si[-Qb5-Si(R)3-n  …(3-1A-5)
 -[Q-Qa6-Z[-Qb6-Si(R)3-nw2  …(3-1A-6)
 -[Qs4-Qa4-(O)t4-Z[-(O-Qb4u4-Si(R)3-nw3(-OH)w4  …(3-1A-7)
As the group (3-1A), groups (3-1A-1) to (3-1A-7) are preferable.
-(X 32 ) s1 -Q b1 -Si(R) n L 3-n ...(3-1A-1)
-(X 33 ) s2 -Q a2 -N [-Q b2 -Si(R) n L 3-n ] 2 ...(3-1A-2)
-Q a3 -Si(R g ) [-Q b3 -Si(R) n L 3-n ] 2 ...(3-1A-3)
-[Q e ] s4 -Q a4 -(O) t4 -C[-(O) u4 -Q b4 -Si(R) n L 3-n ] 3-w1 (-R 31 ) w1 ...(3-1A -4)
-(X 34 ) s3 -Q a5 -Si[-Q b5 -Si(R) n L 3-n ] 3 ...(3-1A-5)
-[Q e ] v -Q a6 -Z a [-Q b6 -Si(R) n L 3-n ] w2 ...(3-1A-6)
-[Q e ] s4 -Q a4 -(O) t4 -Z c [-(O-Q b4 ) u4 -Si(R) n L 3-n ] w3 (-OH) w4 ...(3-1A-7 )
 なお、式(3-1A-1)~(3-1A-7)中、R、L、及び、nの定義は、上述した通りである。
 また、式(3-1A-1)~(3-1A-7)のうち、特定ポリアルキレンオキシド鎖と結合する末端は-O-ではない。
Note that in formulas (3-1A-1) to (3-1A-7), the definitions of R 1 , L 2 , and n are as described above.
Further, in formulas (3-1A-1) to (3-1A-7), the terminal bonded to the specific polyalkylene oxide chain is not -O-.
 基(3-1A-1)において、X32は、-C(O)O-、-SON(R)-、-N(R)SO-、-N(R)C(O)-、-C(O)N(R)-、-S-、-C(O)S-、又は-N(R)-である(ただし、式中のNはQb1に結合する)。
 Rの定義は、上述した通りである。
 s1は、0又は1である。
In the group (3-1A-1), X 32 is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)-, -C(O)N(R d )-, -S-, -C(O)S-, or -N(R d )- (however, N in the formula is bonded to Q b1 do).
The definition of R d is as described above.
s1 is 0 or 1.
 Qb1は、アルキレン基である。なお、アルキレン基は、-O-、シルフェニレン骨格基、2価のオルガノポリシロキサン残基又はジアルキルシリレン基を有していてもよい。アルキレン基は、-O-、シルフェニレン骨格基、2価のオルガノポリシロキサン残基及びジアルキルシリレン基からなる群から選択される基を複数有していてもよい。
 なお、アルキレン基が-O-、シルフェニレン骨格基、2価のオルガノポリシロキサン残基又はジアルキルシリレン基を有する場合、炭素原子-炭素原子間にこれらの基を有することが好ましい。
 Qb1で表されるアルキレン基の炭素数は、1~20が好ましく、1~10がより好ましく、2~6がさらに好ましい。
Q b1 is an alkylene group. Note that the alkylene group may have -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group. The alkylene group may have a plurality of groups selected from the group consisting of -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, and a dialkylsilylene group.
In addition, when the alkylene group has -O-, a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group, it is preferable to have these groups between carbon atoms.
The alkylene group represented by Q b1 preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 2 to 6 carbon atoms.
 Qb1としては、s1が0の場合は、-CHOCHCHCH-、-CHOCHCHOCHCHCH-、-CHCH-、-CHCHCH-、-CHOCHCHCHSi(CHOSi(CHCHCH-が好ましい。(X32s1が-O-の場合は、-CHCHCH-、-CHCHOCHCHCH-が好ましい。(X32s1が-C(O)N(R)-の場合は、炭素数2~6のアルキレン基が好ましい(ただし、式中のNはQb1に結合する)。Qb1がこれらの基であると化合物が製造しやすい。 For Q b1 , when s1 is 0, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH 2 CH 2 - , -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 CH 2 Si(CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 - are preferred. When (X 32 ) s1 is -O-, -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - are preferred. When (X 32 ) s1 is -C(O)N(R d )-, it is preferably an alkylene group having 2 to 6 carbon atoms (however, N in the formula is bonded to Q b1 ). When Q b1 is one of these groups, the compound can be easily produced.
 基(3-1A-1)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-1) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 

 

 
 基(3-1A-2)において、X33は、-NH-、-C(O)O-、-SON(R)-、-N(R)SO-、-N(R)C(O)-、又は、-C(O)N(R)-である。
 Rの定義は、上述した通りである。
In the group (3-1A-2), X 33 is -NH-, -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d ) C(O)- or -C(O)N(R d )-.
The definition of R d is as described above.
 Qa2は、単結合、アルキレン基、-C(O)-、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子、-C(O)-、-C(O)O-、-OC(O)-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-、-C(O)N(R)-、若しくは-NH-を有する基である。
 Qa2で表されるアルキレン基の炭素数は、1~10が好ましく、1~6がより好ましい。
 Qa2で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子、-C(O)-、-C(O)O-、-OC(O)-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-、-C(O)N(R)-、又は-NH-を有する基の炭素数は、2~10が好ましく、2~6がより好ましい。
Q a2 is a single bond, an alkylene group, -C(O)-, or an etheric oxygen atom, -C(O)-, -C(O) between carbon atoms of an alkylene group having 2 or more carbon atoms. )O-, -OC(O)-, -C(O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d ) -, -N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C( O) A group having N(R d )- or -NH-.
The alkylene group represented by Q a2 preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms.
Ether oxygen atom, -C(O)-, -C(O)O-, -OC(O)-, -C between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q a2 (O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O -, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, -C(O)N(R d )-, or -NH- The number of carbon atoms in the group having is preferably 2 to 10, more preferably 2 to 6.
 Qa2は、化合物を製造しやすい観点から、-CH-、-CHCH-、-CHCHCH-、-CHOCHCH-、-CHNHCHCH-、-CHOC(O)CHCH-、又は-C(O)-が好ましい。 Q a2 is -CH 2 -, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 - , -CH 2 NHCH 2 CH 2 - from the viewpoint of easy production of the compound. , -CH 2 OC(O)CH 2 CH 2 -, or -C(O)- are preferred.
 s2は、0又は1である。ただし、s2が0の場合、Qa2は単結合ではなく、かつ、Qa2における特定ポリアルキレンオキシド鎖と結合する末端は-O-ではない。s2は、化合物を製造しやすい観点から、0が好ましい。 s2 is 0 or 1. However, when s2 is 0, Q a2 is not a single bond, and the terminal of Q a2 that is bonded to the specific polyalkylene oxide chain is not -O-. s2 is preferably 0 from the viewpoint of easy production of the compound.
 Qb2は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間に、2価のオルガノポリシロキサン残基、エーテル性酸素原子若しくは-NH-を有する基である。
 Qb2で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb2で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間に、2価のオルガノポリシロキサン残基、エーテル性酸素原子又は-NH-を有する基の炭素数は、2~10が好ましく、2~6がより好ましい。
Q b2 is an alkylene group or a group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b2 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The number of carbon atoms in the group having a divalent organopolysiloxane residue, ether oxygen atom or -NH- between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b2 is 2 to 10. is preferable, and 2 to 6 are more preferable.
 Qb2としては、化合物を製造しやすい観点から、-CHCHCH-、-CHCHOCHCHCH-が好ましい(ただし、右側がSiに結合する。)。 As Q b2 , -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound (provided that the right side is bonded to Si).
 2個の[-Qb2-Si(R 3-n]は、同一であっても異なっていてもよい。 The two [-Q b2 -Si(R 1 ) n L 2 3-n ] may be the same or different.
 基(3-1A-2)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。また、式中、反応性シリル基に結合する(CHαにおけるαはメチレン基の数を表す整数であり、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば、2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。同一化合物中に含まれる複数のαは同一であっても異なっていてもよいが、同一であることが好ましい。例えば、同一化合物中に含まれる複数のαが全て2、3、8、9、11である。以下同様である。 Specific examples of the group (3-1A-2) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain. Further, in the formula, α in (CH 2 ) α bonded to the reactive silyl group is an integer representing the number of methylene groups, preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, It may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10. A plurality of α's contained in the same compound may be the same or different, but are preferably the same. For example, all of the plurality of αs contained in the same compound are 2, 3, 8, 9, and 11. The same applies below.

 

 
 基(3-1A-3)において、Qa3は、単結合、又は、エーテル性酸素原子を有していてもよいアルキレン基であり、化合物を製造しやすい点から、単結合が好ましい。
 エーテル性酸素原子を有していてもよいアルキレン基の炭素数は、1~10が好ましく、2~6が特に好ましい。
In the group (3-1A-3), Q a3 is a single bond or an alkylene group which may have an etheric oxygen atom, and a single bond is preferred from the viewpoint of ease of manufacturing the compound.
The alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, particularly preferably 2 to 6 carbon atoms.
 Rは、水素原子、水酸基、又はアルキル基である。
 Rとしては、化合物を製造しやすい観点からは、水素原子又はアルキル基が好ましい。アルキル基の炭素数は1~10が好ましく、1~4がより好ましく、メチル基がさらに好ましい。
R g is a hydrogen atom, a hydroxyl group, or an alkyl group.
From the viewpoint of easy production of the compound, R g is preferably a hydrogen atom or an alkyl group. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably a methyl group.
 Qb3は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb3で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb3で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb3は、化合物を製造しやすい観点から、-CHCH-、-CHCHCH-、又は-CHCHCHCHCHCHCHCH-が好ましい。
Q b3 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b3 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms, represented by Q b3 , is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
Q b3 is preferably -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, or -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound.
 2個の[-Qb3-Si(R 3-n]は、同一であっても異なっていてもよい。 The two [-Q b3 -Si(R 1 ) n L 2 3-n ] may be the same or different.
 基(3-1A-3)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-3) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 
 基(3-1A-4)において、Qは、-C(O)O-、-SON(R)-、-N(R)SO-、-N(R)C(O)-、又は、-C(O)N(R)-である。
 R31の定義は、上述した通りである。
 s4は、0又は1である。
 Qa4は、単結合、又は、エーテル性酸素原子を有していてもよいアルキレン基である。
 エーテル性酸素原子を有していてもよいアルキレン基の炭素数は、1~10が好ましく、2~6がより好ましい。
 t4は、0又は1(ただし、Qa4が単結合の場合は0である。)である。
 -Qa4-(O)t4-としては、化合物を製造しやすい点から、s4が0の場合は、単結合、-CHO-、-CHOCH-、-CHOCHCHO-、-CHOCHCHOCH-、-CHOCHCHCHCHOCH-が好ましく(ただし、左側が特定ポリアルキレンオキシド鎖に結合する。)、s4が1の場合は、単結合、-CH-、-CHCH-が好ましい。
In the group (3-1A-4), Q e is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)- or -C(O)N(R d )-.
The definition of R 31 is as described above.
s4 is 0 or 1.
Q a4 is a single bond or an alkylene group which may have an etheric oxygen atom.
The alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, more preferably 2 to 6 carbon atoms.
t4 is 0 or 1 (however, when Q a4 is a single bond, it is 0).
-Q a4 -(O) t4 - is a single bond, -CH 2 O-, -CH 2 OCH 2 -, -CH 2 OCH 2 CH 2 when s4 is 0, from the viewpoint of easy production of the compound. O-, -CH 2 OCH 2 CH 2 OCH 2 -, -CH 2 OCH 2 CH 2 CH 2 CH 2 OCH 2 - are preferred (however, the left side is bonded to the specific polyalkylene oxide chain), and s4 is 1. In this case, a single bond, -CH 2 -, and -CH 2 CH 2 - are preferable.
 Qb4は、アルキレン基であり、上記アルキレン基は-O-、-C(O)N(R)-(Rの定義は、上述した通りである。)、シルフェニレン骨格基、2価のオルガノポリシロキサン残基又はジアルキルシリレン基を有していてもよく、有していなくてもよい。
 なお、アルキレン基が-O-又はシルフェニレン骨格基を有する場合、炭素原子-炭素原子間に-O-又はシルフェニレン骨格基を有することが好ましい。また、アルキレン基が-C(O)N(R)-、ジアルキルシリレン基又は2価のオルガノポリシロキサン残基を有する場合、炭素原子-炭素原子間又は(O)u4と結合する側の末端にこれらの基を有することが好ましい。
 Qb4で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記範囲は1~10であってもよい。
Q b4 is an alkylene group, and the alkylene group is -O-, -C(O)N(R d )- (the definition of R d is as described above), a silphenylene skeleton group, a divalent It may or may not have an organopolysiloxane residue or a dialkylsilylene group.
In addition, when the alkylene group has -O- or a silphenylene skeleton group, it is preferable to have -O- or a silphenylene skeleton group between carbon atoms. In addition, when the alkylene group has -C(O)N(R d )-, a dialkylsilylene group, or a divalent organopolysiloxane residue, the terminal between carbon atoms or the side bonded to (O) u4 preferably has these groups.
The number of carbon atoms in the alkylene group represented by Q b4 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the range may be from 1 to 10.
 u4は、0又は1である。
 -(O)u4-Qb4-としては、化合物を製造しやすい観点から、-CHCH-、-CHCHCH-、-CHOCHCHCH-、-CHOCHCHCHCHCH-、-OCHCHCH-、-OSi(CHCHCHCH-、-OSi(CHOSi(CHCHCHCH-、及び-CHCHCHSi(CHPhSi(CHCHCH-が好ましい(ただし、右側がSiに結合する。)。
u4 is 0 or 1.
-(O) u4 -Q b4 - includes -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 from the viewpoint of easy production of the compound. OCH 2 CH 2 CH 2 CH 2 CH 2 -, -OCH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -- and --CH 2 CH 2 CH 2 Si(CH 3 ) 2 PhSi(CH 3 ) 2 CH 2 CH 2 -- are preferred (however, the right side is bonded to Si).
 w1は、0~2の整数であり、0又は1が好ましく、0がより好ましい。
 [-(O)u4-Qb4-Si(R 3-n]が2個以上ある場合は、2個以上の[-(O)u4-Qb4-Si(R 3-n]は、同一であっても異なっていてもよい。
 R31が2個以上ある場合は、2個以上の(-R31)は、同一であっても異なっていてもよい。
w1 is an integer from 0 to 2, preferably 0 or 1, and more preferably 0.
If there are two or more [-(O) u4 -Q b4 -Si(R 1 ) n L 2 3-n ], two or more [-(O) u4 -Q b4 -Si(R 1 ) n L 2 3-n ] may be the same or different.
When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
 基(3-1A-4)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-4) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 

 

 

 

 
 基(3-1A-5)において、X34は、-C(O)O-、-SON(R)-、-N(R)SO-、-N(R)C(O)-、-C(O)N(R)-、-S-、-C(O)S-、又は-N(R)-である(ただし、式中のNはQb1に結合する)。
 Rの定義は、上述した通りである。
 s3は、0又は1である。
In the group (3-1A-5), X 34 is -C(O)O-, -SO 2 N(R d )-, -N(R d )SO 2 -, -N(R d )C( O)-, -C(O)N(R d )-, -S-, -C(O)S-, or -N(R d )- (however, N in the formula is bonded to Q b1 do).
The definition of R d is as described above.
s3 is 0 or 1.
 Qa5は、エーテル性酸素原子を有していてもよいアルキレン基である。
 エーテル性酸素原子を有していてもよいアルキレン基の炭素数は、1~10が好ましく、2~6が特に好ましい。
 Qa5としては、化合物を製造しやすい点から、s3が0の場合は、-CHOCHCHCH-、-CHOCHCHOCHCHCH-、-CHCH-、-CHCHCH-が好ましい(ただし、右側がSiに結合する。)。(X34s3が-O-の場合、化合物を製造しやすい点から、Qa5は、-CHCHCH-、-CHCHOCHCHCH-が好ましい。(X34s3が-C(O)N(R)-の場合、化合物を製造しやすい点から、Qa5は、炭素数2~6のアルキレン基が好ましい(ただし、式中のNはQa5に結合する)。
Q a5 is an alkylene group which may have an ether oxygen atom.
The alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, particularly preferably 2 to 6 carbon atoms.
For Q a5 , from the viewpoint of easy production of the compound, when s3 is 0, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH 2 CH 2- , -CH 2 CH 2 CH 2 - are preferred (however, the right side is bonded to Si). When (X 34 ) s3 is -O-, Q a5 is preferably -CH 2 CH 2 CH 2 - or -CH 2 CH 2 OCH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound. When (X 34 ) s3 is -C(O)N(R d )-, Q a5 is preferably an alkylene group having 2 to 6 carbon atoms from the viewpoint of easy production of the compound (however, N in the formula Q a5 ).
 Qb5は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb5で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb5で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb5としては、化合物を製造しやすい観点から、-CHCHCH-、及び-CHCHOCHCHCH-が好ましい(ただし、右側がSi(R 3-nに結合する。)。
Q b5 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b5 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The number of carbon atoms in the group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b5 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
Q b5 is preferably -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - (provided that the right side is Si(R 1 ) n L 2 3-n .).
 3個の[-Qb5-Si(R 3-n]は、同一であっても異なっていてもよい。 The three [-Q b5 -Si(R 1 ) n L 2 3-n ] may be the same or different.
 基(3-1A-5)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-5) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 
 基(3-1A-6)中のQの定義は、上述の基(3-1A-4)において定義した通りである。
 vは、0又は1である。
The definition of Q e in group (3-1A-6) is as defined in group (3-1A-4) above.
v is 0 or 1.
 Qa6は、エーテル性酸素原子を有していてもよいアルキレン基である。
 エーテル性酸素原子を有していてもよいアルキレン基の炭素数は、1~10が好ましく、2~6がより好ましい。
 Qa6としては、化合物を製造しやすい点から、-CHOCHCHCH-、-CHOCHCHOCHCHCH-、-CHCH-、-CHCHCH-が好ましい(ただし、右側がZに結合する。)。
Q a6 is an alkylene group which may have an ether oxygen atom.
The alkylene group which may have an etheric oxygen atom preferably has 1 to 10 carbon atoms, more preferably 2 to 6 carbon atoms.
Q a6 is -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH 2 CH 2 - , -CH 2 CH 2 from the viewpoint of easy production of the compound. 2 CH 2 - is preferred (provided that the right side is bonded to Z a ).
 Zは、(w2+1)価のオルガノポリシロキサン残基、又は、(w2+1)価であって、オルガノポリシロキサン残基とオルガノポリシロキサン残基との間にアルキレン基を有する基である。
 w2は、2~7の整数である。
 (w2+1)価のオルガノポリシロキサン残基、及び、(w2+1)価であって、オルガノポリシロキサン残基とオルガノポリシロキサン残基との間にアルキレン基を有する基としては、下記の基が挙げられる。ただし、下式におけるRは、上述の通りである。
Z a is a (w2+1)-valent organopolysiloxane residue or a (w2+1)-valent group having an alkylene group between the organopolysiloxane residues.
w2 is an integer from 2 to 7.
Examples of (w2+1)-valent organopolysiloxane residues and (w2+1)-valent groups having an alkylene group between organopolysiloxane residues include the following groups: . However, R a in the following formula is as described above.

 

 
 Qb6は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb6で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb6で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb6としては、化合物を製造しやすい観点から、-CHCH-、及び-CHCHCH-が好ましい。
 w2個の[-Qb6-Si(Rn3 3-n]は、同一であっても異なっていてもよい。
Q b6 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b6 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b6 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
As Q b6 , -CH 2 CH 2 - and -CH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound.
w2 [-Q b6 -Si(R 1 ) n3 L 2 3-n ] may be the same or different.
 基(3-1A-6)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-6) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 
 基(3-1A-7)において、Zは(w3+w4+1)価の炭化水素基である。
 w3は、4以上の整数である。
 w4は、0以上の整数である。
 Q、s4、Qa4、t4、Qb4、及びu4の定義及び好ましい範囲は基(3-1A-4)中の各符号の定義と同じである。
In group (3-1A-7), Z c is a (w3+w4+1)-valent hydrocarbon group.
w3 is an integer of 4 or more.
w4 is an integer greater than or equal to 0.
The definitions and preferred ranges of Q e , s4, Q a4 , t4, Q b4 , and u4 are the same as the definitions of each symbol in group (3-1A-4).
 Zは炭化水素鎖からなってもよく、炭化水素鎖の炭素原子-炭素原子間にエーテル性酸素原子を有してもよく、炭化水素鎖からなることが好ましい。
 Zの価数は5~20価が好ましく、5~10価がより好ましく、5~8価がさらに好ましく、5価又は6価が特に好ましい。
 Zの炭素数は3~50が好ましく、4~40がより好ましく、5~30がさらに好ましい。
 w3は、4~20が好ましく、4~16がより好ましく、4~8がさらに好ましく、4又は5が特に好ましい。
 w4は、0~10が好ましく、0~8がより好ましく、0~6がさらに好ましく、0~3が特に好ましく、0又は1が最も好ましい。
 [-(O-Qb4u4-Si(R 3-n]が2個以上ある場合は、2個以上の[-(O-Qb4u4-Si(R 3-n]は、同一であっても異なっていてもよい。
Z c may consist of a hydrocarbon chain, may have an ether oxygen atom between carbon atoms of the hydrocarbon chain, and is preferably composed of a hydrocarbon chain.
The valence of Z c is preferably 5 to 20, more preferably 5 to 10, even more preferably 5 to 8, particularly preferably penta or hexavalent.
The number of carbon atoms in Z c is preferably 3 to 50, more preferably 4 to 40, even more preferably 5 to 30.
w3 is preferably 4 to 20, more preferably 4 to 16, even more preferably 4 to 8, and particularly preferably 4 or 5.
w4 is preferably 0 to 10, more preferably 0 to 8, even more preferably 0 to 6, particularly preferably 0 to 3, and most preferably 0 or 1.
If there are two or more [-(O-Q b4 ) u4 -Si(R 1 ) n L 2 3-n ], two or more [-(O-Q b4 ) u4 -Si(R 1 ) n L 2 3-n ] may be the same or different.
 基(3-1A-7)の具体例としては、以下の基が挙げられる。下記式中、*は、特定ポリアルキレンオキシド鎖との結合位置を表す。 Specific examples of the group (3-1A-7) include the following groups. In the following formula, * represents the bonding position with the specific polyalkylene oxide chain.

 

 
 式(1)におけるYは、基(g2-1)(ただし、d1+d3=1、d2+d4=gである。)、基(g2-2)(ただし、e1=1、e2=gである。)、基(g2-3)(ただし、g=2である。)、基(g2-4)(ただし、h1=1、h2=gである。)、基(g2-5)(ただし、i1=1、i2=gである。)、基(g2-6)(ただし、g=1である。)、又は、基(g2-7)(ただし、i3=gである。)であってもよい。 Y1 in formula (1) is a group (g2-1) (however, d1+d3=1, d2+d4=g) and a group (g2-2) (however, e1=1, e2=g). , group (g2-3) (however, g=2), group (g2-4) (however, h1=1, h2=g), group (g2-5) (however, i1= 1, i2=g), a group (g2-6) (however, g=1), or a group (g2-7) (however, i3=g). .

 

 
 (-A-Q12-)e1C(Re24-e1-e2(-Q22-)e2  …(g2-2)
 -A-Q13-N(-Q23-)               …(g2-3)
 (-A-Q14-)h1(-Q24-)h2          …(g2-4)
 (-A-Q15-)i1Si(Re34-i1-i2(-Q25-)i2 …(g2-5)
 -A-Q26-                       …(g2-6)
 -A-Q12-CH(-Q22-)-Si(Re33-i3(-Q25-)i3 
 …(g2-7)
(-A 1 -Q 12 -) e1 C(R e2 ) 4-e1-e2 (-Q 22 -) e2 ...(g2-2)
-A 1 -Q 13 -N(-Q 23 -) 2 ...(g2-3)
(-A 1 -Q 14 -) h1 Z 1 (-Q 24 -) h2 ... (g2-4)
(-A 1 -Q 15 -) i1 Si(R e3 ) 4-i1-i2 (-Q 25 -) i2 ...(g2-5)
-A 1 -Q 26 -...(g2-6)
-A 1 -Q 12 -CH(-Q 22 -)-Si(R e3 ) 3-i3 (-Q 25 -) i3
...(g2-7)
 ただし、式(g2-1)~(g2-7)においては、A側が特定ポリアルキレンオキシド鎖に接続し、Q22、Q23、Q24、Q25又はQ26側が(-Si(R 3-n)に接続する。
 また、式(g2-1)~(g2-7)のうち、特定ポリアルキレンオキシド鎖に結合する末端は-O-ではない。
 Aは、単結合、-C(O)NR-、-C(O)-、-NHC(O)O-、-NHC(O)NR-、NR-、又はSONR-である。
 Q11は、単結合、-O-、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基である。
 Q12は、単結合、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基である。
 Q13は、単結合、アルキレン基、炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基、又はアルキレン基のN側の末端に-C(O)-を有する基である。
 Q14は、Q14が結合するZにおける原子が炭素原子の場合、Q12であり、Q14が結合するZにおける原子が窒素原子の場合、Q13である。
 Q15は、単結合、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基である。
 Q22は、アルキレン基、炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基、アルキレン基のSiに接続しない側の末端に-C(O)NR-、-C(O)-、-NR-又はO-を有する基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有しかつSiに接続しない側の末端に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、YがQ22を2以上有する場合、2以上のQ22は同一であっても異なっていてもよい。
 Q23は、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、2個のQ23は同一であっても異なっていてもよい。
 Q24は、Q24が結合するZにおける原子が炭素原子の場合、Q22であり、Q24が結合するZにおける原子が窒素原子の場合、Q23であり、YがQ24を2以上有する場合、2以上のQ24は同一であっても異なっていてもよい。
 Q25は、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、YがQ25を2以上有する場合、2以上のQ25は同一であっても異なっていてもよい。
 Q26は、単結合、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又は-O-を有する基である。ただし、A1が単結合の場合、Q26は単結合以外の基である。
 Zは、Q14が直接結合する炭素原子又は窒素原子を有しかつQ24が直接結合する炭素原子又は窒素原子を有するh1+h2価の環構造を有する基である。
 Re1は、水素原子又はアルキル基であり、YがRe1を2以上有する場合、2以上のRe1は同一であっても異なっていてもよい。
 Re2は、水素原子、水酸基、アルキル基又はアシルオキシ基である。
 Re3は、アルキル基である。
 Rは、水素原子、炭素数1~6のアルキル基又はフェニル基である。
However, in formulas (g2-1) to (g2-7), the A 1 side is connected to the specific polyalkylene oxide chain, and the Q 22 , Q 23 , Q 24 , Q 25 or Q 26 side is (-Si(R 1 ) n L 2 3-n ).
Furthermore, in formulas (g2-1) to (g2-7), the terminal bonded to the specific polyalkylene oxide chain is not -O-.
A 1 is a single bond, -C(O)NR 6 -, -C(O)-, -NHC(O)O-, -NHC(O)NR 6 -, NR 6 -, or SO 2 NR 6 - It is.
Q 11 is a single bond, -O-, an alkylene group, or a bond between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 -, or It is a group having O-.
Q 12 has -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of a single bond, an alkylene group, or an alkylene group having 2 or more carbon atoms. It is the basis.
Q 13 is a single bond, an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , or a group having -C(O)- at the N-side end of the alkylene group.
Q 14 is Q 12 when the atom in Z 1 to which Q 14 is bonded is a carbon atom, and is Q 13 when the atom in Z 1 to which Q 14 is bonded is a nitrogen atom.
Q 15 has -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of a single bond, an alkylene group, or an alkylene group having 2 or more carbon atoms. It is the basis.
Q 22 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms, an alkylene group A group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si, or between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si and -C(O)NR 6 -, -C(O) It is a group having -, -NR 6 - or O-, and when Y 1 has two or more Q 22s , two or more Q 22s may be the same or different.
Q 23 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , two Q23s may be the same or different.
Q 24 is Q 22 when the atom in Z 1 to which Q 24 is bonded is a carbon atom, and Q 23 when the atom in Z 1 to which Q 24 is bonded is a nitrogen atom; When there are two or more, two or more Q24 may be the same or different.
Q 25 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , Y 1 has two or more Q 25s , the two or more Q 25s may be the same or different.
Q 26 is a single bond, an alkylene group, or a carbon-carbon atom of an alkylene group having 2 or more carbon atoms with -C(O)NR 6 -, -C(O)-, -NR 6 - or -O-. It is a group that has However, when A1 is a single bond, Q26 is a group other than a single bond.
Z 1 is a group having an h1+h2 valent ring structure in which Q 14 has a carbon atom or nitrogen atom to which Q 24 is directly bonded, and Q 24 has a carbon atom or nitrogen atom to which Q 24 is directly bonded.
R e1 is a hydrogen atom or an alkyl group, and when Y 1 has two or more R e1s , the two or more R e1s may be the same or different.
R e2 is a hydrogen atom, a hydroxyl group, an alkyl group, or an acyloxy group.
R e3 is an alkyl group.
R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
 d1は、0~1の整数である。d2は、0~3の整数であり、1又は2であることが好ましい。d1+d2は、1~3の整数である。
 d3は、0~1の整数である。d4は、0~3の整数であり、2又は3であることが好ましい。d3+d4は、1~3の整数である。
 d1+d3は、1である。
 d2+d4は、1~5の整数であり、4又は5であることが好ましい。
 e1+e2は、3又は4である。e1は、1である。e2は、1~3の整数であり、2又は3であることが好ましい。
 h1は、1である。h2は、1以上の整数であり、2又は3であることが好ましい。
 i1+i2は、3又は4である。i1は、1である。i2は、1~3の整数であり、2又は3であることが好ましい。
 i3は、2又は3である。
d1 is an integer from 0 to 1. d2 is an integer from 0 to 3, preferably 1 or 2. d1+d2 is an integer from 1 to 3.
d3 is an integer from 0 to 1. d4 is an integer from 0 to 3, preferably 2 or 3. d3+d4 is an integer from 1 to 3.
d1+d3 is 1.
d2+d4 is an integer from 1 to 5, preferably 4 or 5.
e1+e2 is 3 or 4. e1 is 1. e2 is an integer from 1 to 3, preferably 2 or 3.
h1 is 1. h2 is an integer of 1 or more, preferably 2 or 3.
i1+i2 is 3 or 4. i1 is 1. i2 is an integer from 1 to 3, preferably 2 or 3.
i3 is 2 or 3.
 Q11、Q12、Q13、Q14、Q15、Q22、Q23、Q24、Q25及びQ26のアルキレン基の炭素数は、化合物(1)を製造しやすい観点、及び表面処理層の耐摩耗性がさらに優れる観点から、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよく、1~6であってもよく、1~4であってもよい。ただし、炭素-炭素原子間に特定の結合を有する場合のアルキレン基の炭素数の下限値は2である。 The number of carbon atoms in the alkylene groups of Q 11 , Q 12 , Q 13 , Q 14 , Q 15 , Q 22 , Q 23 , Q 24 , Q 25 and Q 26 is determined from the viewpoint of easy production of compound (1) and surface treatment. From the viewpoint of further improving the abrasion resistance of the layer, the number is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
 Zにおける環構造としては、上述した環構造が挙げられ、好ましい形態も同様である。なお、Zにおける環構造にはQ14やQ24が直接結合するため、例えば、環構造にアルキレン基が連結して、そのアルキレン基にQ14やQ24が連結することはない。 Examples of the ring structure in Z 1 include the ring structures described above, and preferred forms are also the same. In addition, since Q 14 and Q 24 are directly bonded to the ring structure in Z 1 , for example, an alkylene group is not connected to the ring structure and Q 14 or Q 24 is not connected to the alkylene group.
 Re1、Re2又はRe3のアルキル基の炭素数は、化合物(1)を製造しやすい観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Re2のアシルオキシ基のアルキル基部分の炭素数は、化合物(1)を製造しやすい観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 h2としては、化合物(1)を製造しやすい観点、並びに、表面処理層の耐摩耗性がさらに優れる観点から、2~6が好ましく、2~4がより好ましく、2又は3がさらに好ましい。
The number of carbon atoms in the alkyl group of R e1 , R e2 or R e3 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
The number of carbon atoms in the alkyl group moiety of the acyloxy group in R e2 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
h2 is preferably 2 to 6, more preferably 2 to 4, and even more preferably 2 or 3, from the viewpoint of facilitating the production of compound (1) and the viewpoint of further improving the abrasion resistance of the surface treatment layer.
 Yの他の形態としては、基(g2-8)(ただし、d1+d3=1、d2×k3+d4×k3=gである。)、基(g2-9)(ただし、e1=1、e2×k3=gである。)、基(g2-10)(ただし、g=2×k3である。)、基(g2-11)(ただし、h1=1、h2×k3=gである。)、基(g2-12)(ただし、i1=1、i2×k3=gである。)、基(g2-13)(ただし、g=k3である。)、又は基(g2-14)(ただし、g=i3×k3である。)が挙げられる。 Other forms of Y 1 include the group (g2-8) (however, d1+d3=1, d2×k3+d4×k3=g), the group (g2-9) (however, e1=1, e2×k3 = g), group (g2-10) (however, g = 2 x k3), group (g2-11) (however, h1 = 1, h2 x k3 = g), group (g2-12) (however, i1=1, i2×k3=g), group (g2-13) (however, g=k3), or group (g2-14) (however, g =i3×k3).

 

 
 (-A-Q12-)e1C(Re24-e1-e2(-Q22-Ge2   …(g2-9)
 -A-Q13-N(-Q23-G               …(g2-10)
 (-A-Q14-)h1(-Q24-Gh2           …(g2-11)
 (-A-Q15-)i1Si(Re34-i1-i2(-Q25-Gi2  …(g2-12)
 -A-Q26-G                       …(g2-13)
 -A-Q12-CH(-Q22-G)-Si(Re33-i3(-Q25-Gi3 …(g2-14)
(-A 1 -Q 12 -) e1 C(R e2 ) 4-e1-e2 (-Q 22 -G 1 ) e2 ...(g2-9)
-A 1 -Q 13 -N (-Q 23 -G 1 ) 2 ... (g2-10)
(-A 1 -Q 14 -) h1 Z 1 (-Q 24 -G 1 ) h2 ...(g2-11)
(-A 1 -Q 15 -) i1 Si(R e3 ) 4-i1-i2 (-Q 25 -G 1 ) i2 ...(g2-12)
-A 1 -Q 26 -G 1 ...(g2-13)
-A 1 -Q 12 -CH(-Q 22 -G 1 )-Si(R e3 ) 3-i3 (-Q 25 -G 1 ) i3 ...(g2-14)
 ただし、式(g2-8)~(g2-14)においては、A側が特定ポリアルキレンオキシド鎖に接続し、G側が(-Si(R 3-n)に接続する。Gは、基(g3)であり、Yが有する2以上のGは同一であっても異なっていてもよい。G以外の符号は、式(g2-1)~(g2-7)における符号と同じである。
 -Si(R3-k3(-Q-)k3  …(g3)
 ただし、式(g3)においては、Si側がQ22、Q23、Q24、Q25及びQ26に接続し、Q側が(-Si(R 3-n)に接続する。Rは、アルキル基である。Qは、アルキレン基、炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-若しくは-O-を有する基、又は(OSi(R-O-であり、2以上のQは同一であっても異なっていてもよい。k3は、2又は3である。Rは、水素原子、炭素数1~6のアルキル基又はフェニル基である。Rは、アルキル基、フェニル基又はアルコキシ基であり、2個のRは同一であっても異なっていてもよい。pは、0~5の整数であり、pが2以上の場合、2以上の(OSi(R)は同一であっても異なっていてもよい。
 また、式(g2-8)~(g2-14)のうち、特定ポリアルキレンオキシド鎖に結合する末端は-O-ではない。
However, in formulas (g2-8) to (g2-14), the A 1 side is connected to the specific polyalkylene oxide chain, and the G 1 side is connected to (-Si(R 1 ) n L 2 3-n ). G 1 is a group (g3), and two or more G 1s in Y 1 may be the same or different. The symbols other than G 1 are the same as those in equations (g2-1) to (g2-7).
-Si(R 8 ) 3-k3 (-Q 3 -) k3 ...(g3)
However, in formula (g3), the Si side is connected to Q 22 , Q 23 , Q 24 , Q 25 and Q 26 , and the Q 3 side is connected to (-Si(R 1 ) n L 2 3-n ). R 8 is an alkyl group. Q 3 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or -O- between carbon atoms of an alkylene group having 2 or more carbon atoms, or (OSi(R 9 ) 2 ) p -O-, and two or more Q 3 may be the same or different. k3 is 2 or 3. R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. R 9 is an alkyl group, a phenyl group, or an alkoxy group, and two R 9s may be the same or different. p is an integer from 0 to 5, and when p is 2 or more, two or more (OSi(R 9 ) 2 ) may be the same or different.
Furthermore, in formulas (g2-8) to (g2-14), the terminal bonded to the specific polyalkylene oxide chain is not -O-.
 Qのアルキレン基の炭素数は、化合物(1)を製造しやすい観点、並びに、表面処理層の耐摩耗性がさらに優れる観点から、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよく、1~6であってもよく、1~4であってもよい。ただし、炭素-炭素原子間に特定の結合を有する場合のアルキレン基の炭素数の下限値は2である。
 Rのアルキル基の炭素数は、化合物(1)を製造しやすい観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Rのアルキル基の炭素数は、化合物(1)を製造しやすい観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Rのアルコキシ基の炭素数は、化合物(1)の保存安定性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 pは、0又は1が好ましい。
The number of carbon atoms in the alkylene group of Q3 is preferably 1 to 30, more preferably 1 to 20, more preferably 2 to 20 is more preferable, and may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
The number of carbon atoms in the alkyl group of R 8 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
The number of carbon atoms in the alkyl group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of ease of producing compound (1).
The number of carbon atoms in the alkoxy group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent storage stability of compound (1).
p is preferably 0 or 1.
 化合物(1)の部分構造Dとしては、例えば、下式の部分構造が挙げられる。下式の部分構造を部分構造Dとして有する化合物は、工業的に製造しやすく、取扱いやすく、表面処理層の耐摩耗性がさらに優れる観点から好ましい。下式の化合物におけるRはそれぞれ、上述した式(1)における-(RO)a2(CHCHO)b2-と同様であり、好ましい形態も同様である。 Examples of the partial structure D of compound (1) include the partial structure of the following formula. A compound having the partial structure of the following formula as partial structure D is preferable from the viewpoints of being easy to industrially produce, easy to handle, and providing a surface treatment layer with excellent abrasion resistance. R t in the compound of the following formula is the same as -(R 2 O) a2 (CH 2 CH 2 O) b2 - in the above-mentioned formula (1), and the preferred forms are also the same.
 Yが基(g2-1)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-1) include partial structures of the following formula.

 

 
 Yが基(g2-2)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-2) include partial structures of the following formula.

 

 
 Yが基(g2-3)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-3) include partial structures of the following formula.

 

 
 Yが基(g2-4)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-4) include partial structures of the following formula.

 

 
 Yが基(g2-5)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-5) include partial structures of the following formula.

 

 
 Yが基(g2-6)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-6) include partial structures of the following formula.

 

 
 Yが基(g2-7)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-7) include partial structures of the following formula.

 

 
 Yが基(g2-8)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-8) include partial structures of the following formula.

 

 
 Yが基(g2-9)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-9) include partial structures of the following formula.

 

 
 Yが基(g2-10)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-10) include partial structures of the following formula.

 

 
 Yが基(g2-11)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-11) include partial structures of the following formula.

 

 
 Yが基(g2-12)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of the partial structure D in which Y 1 is a group (g2-12) include partial structures of the following formula.

 

 
 Yが基(g2-13)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-13) include partial structures of the following formula.

 

 
 Yが基(g2-14)である部分構造Dとしては、例えば、下式の部分構造が挙げられる。 Examples of partial structure D in which Y 1 is a group (g2-14) include partial structures of the following formula.

 

 
 本開示の化合物としては、例えば、以下の化合物が挙げられる。
 なお、下記式中、a1~a4及びb1~b4はそれぞれ独立に1~300の整数であり、a11、a12、a21、及びa22はそれぞれ独立に1~299の整数であり、a11+a12は2~300の整数であり、a21+a22は2~300の整数である。
Examples of the compounds of the present disclosure include the following compounds.
In addition, in the following formula, a1 to a4 and b1 to b4 are each independently an integer of 1 to 300, a11, a12, a21, and a22 are each independently an integer of 1 to 299, and a11+a12 is 2 to 300. is an integer of 2 to 300, and a21+a22 is an integer of 2 to 300.

 

 

 

 

 

 
 本開示の化合物の数平均分子量(Mn)は、400~20,000であることが好ましく、500~18,000であることがより好ましく、600~15,000であることがさらに好ましく、700~10,000が特に好ましく、800~6,000が最も好ましい。Mnが400以上であれば、指紋視認性を低減する特性及び耐摩耗性に優れる。Mnが20,000以下であれば、粘性を適切な範囲内に調節しやすく、また溶解性が向上するので、成膜時のハンドリング性が優れる。 The number average molecular weight (Mn) of the compound of the present disclosure is preferably 400 to 20,000, more preferably 500 to 18,000, even more preferably 600 to 15,000, and even more preferably 700 to 18,000. 10,000 is particularly preferred, and 800 to 6,000 is most preferred. If Mn is 400 or more, the property of reducing fingerprint visibility and the abrasion resistance are excellent. When Mn is 20,000 or less, the viscosity can be easily controlled within an appropriate range, and solubility is improved, resulting in excellent handling properties during film formation.
〔化合物の製造方法〕
 本開示の化合物の製造方法は特に制限されない。本開示の化合物の製造方法の一例としては、例えば以下の方法が挙げられる。
 具体的には、まず、前述の式(1)のQで表される連結基の構造を有する多価アルコール、多価フェノール、及びポリアミンからなる群より選択される少なくとも一種を開始剤として用いる。そして、水酸化カリウムの存在下で、エチレンオキシド及び炭素数3~6のアルキレンオキシドを重合させることで、連結基Qに特定ポリアルキレンオキシド鎖が結合した化合物が得られる。さらに、特定ポリアルキレンオキシド鎖の末端のヒドロキシ基の一部に、当該ヒドロキシ基と反応可能な基と反応性シリル基とを有する化合物を反応させることで、本開示の化合物を得る。
[Method for producing compound]
The method for producing the compound of the present disclosure is not particularly limited. An example of a method for producing the compound of the present disclosure includes the following method.
Specifically, first, at least one selected from the group consisting of polyhydric alcohols, polyhydric phenols, and polyamines having a linking group structure represented by Q 1 in formula (1) above is used as an initiator. . Then, by polymerizing ethylene oxide and an alkylene oxide having 3 to 6 carbon atoms in the presence of potassium hydroxide, a compound in which a specific polyalkylene oxide chain is bonded to the linking group Q is obtained. Furthermore, the compound of the present disclosure is obtained by reacting a portion of the terminal hydroxy group of the specific polyalkylene oxide chain with a compound having a group capable of reacting with the hydroxy group and a reactive silyl group.
 ここで、ヒドロキシ基と反応可能な基と反応性シリル基とを有する化合物における、ヒドロキシ基と反応可能な基としては、イソシアナト基、アミノ基、メルカプト基等が挙げられる。
 得られる化合物におけるMa/(Ma+Mb)の値を制御する方法としては、エチレンオキシド及び炭素数3~6のアルキレンオキシドを重合させる際に添加する、エチレンオキシドの添加量と炭素数3~6のアルキレンオキシドの添加量との比を調整する方法等が挙げられる。
 得られる化合物における部分構造Dの数と部分構造Eの数の合計に対する部分構造Eの割合e/(d+e)の値を制御する方法としては、特定ポリアルキレンオキシド鎖の末端のヒドロキシ基の一部に反応性シリル基を有する化合物を反応させる際に添加する、反応性シリル基を有する化合物の添加量を調整する方法等が挙げられる。
Here, examples of the group capable of reacting with a hydroxy group in a compound having a group capable of reacting with a hydroxy group and a reactive silyl group include an isocyanato group, an amino group, a mercapto group, and the like.
The value of Ma/(Ma+Mb) in the obtained compound can be controlled by controlling the amount of ethylene oxide and the amount of alkylene oxide having 3 to 6 carbon atoms, which are added when ethylene oxide and alkylene oxide having 3 to 6 carbon atoms are polymerized. Examples include a method of adjusting the ratio to the amount added.
As a method of controlling the value of the ratio e/(d+e) of the partial structure E to the total number of the partial structures D and the number of the partial structures E in the obtained compound, some of the terminal hydroxy groups of the specific polyalkylene oxide chain Examples include a method of adjusting the amount of the compound having a reactive silyl group added when reacting the compound having a reactive silyl group.
[組成物]
 本開示の組成物は、本開示の化合物を含んでいればよく、本開示の化合物以外の成分は特に限定されない。本開示の組成物は、本開示の化合物と、液状媒体と、を含むことが好ましい。本開示の組成物が液状媒体を含む場合、本開示の組成物は、液状であればよく、溶液であってもよく、分散液であってもよい。
 本開示の組成物は、本開示の化合物を含んでいればよく、本開示の化合物の製造工程で生成した副生物等の不純物を含んでもよい。
 本開示の組成物は、本開示の化合物を1種含有してもよく、2種以上含有してもよい。
[Composition]
The composition of the present disclosure only needs to contain the compound of the present disclosure, and components other than the compound of the present disclosure are not particularly limited. Compositions of the present disclosure preferably include a compound of the present disclosure and a liquid medium. When the composition of the present disclosure includes a liquid medium, the composition of the present disclosure may be in a liquid state, and may be a solution or a dispersion.
The composition of the present disclosure only needs to contain the compound of the present disclosure, and may contain impurities such as by-products generated in the manufacturing process of the compound of the present disclosure.
The composition of the present disclosure may contain one type of compound of the present disclosure, or may contain two or more types of compounds of the present disclosure.
 本開示の化合物の含有量は、本開示の組成物の全量に対して、0.001~40質量%が好ましく、0.01~20質量%がより好ましく、0.1~10質量%がさらに好ましい。ウェットコーティング法に使用する本開示の組成物における本開示の化合物の含有量は、本開示の組成物の全量に対して、0.01~10質量%であってもよく、0.02~5質量%であってもよく、0.03~3質量%であってもよく、0.05~2質量%であってもよい。 The content of the compound of the present disclosure is preferably 0.001 to 40% by mass, more preferably 0.01 to 20% by mass, and further preferably 0.1 to 10% by mass, based on the total amount of the composition of the present disclosure. preferable. The content of the compound of the present disclosure in the composition of the present disclosure used in the wet coating method may be 0.01 to 10% by mass, and 0.02 to 5% by mass, based on the total amount of the composition of the present disclosure. It may be 0.03 to 3 mass %, or 0.05 to 2 mass %.
 液状媒体は、有機溶媒と水とを含むことが好ましい。 The liquid medium preferably contains an organic solvent and water.
 有機溶媒としては、水素原子及び炭素原子のみからなる化合物、並びに、水素原子、炭素原子及び酸素原子のみからなる化合物が挙げられ、具体的には、炭化水素系有機溶媒、ケトン系有機溶媒、エーテル系有機溶媒、エステル系有機溶媒、グリコール系有機溶媒、及びアルコール系有機溶媒が挙げられる。
 炭化水素系有機溶媒の具体例としては、ペンタン、ヘキサン、へプタン、オクタン、ヘキサデカン、イソヘキサン、イソオクタン、イソノナン、シクロヘプタン、シクロヘキサン、ビシクロヘキシル、ベンゼン、トルエン、エチルベンゼン、o-キシレン、m-キシレン、p-キシレン、o-ジエチルベンゼン、m-ジエチルベンゼン、p-ジエチルベンゼン、n-ブチルベンゼン、sec-ブチルベンゼン、tert-ブチルベンゼンが挙げられる。
 ケトン系有機溶媒の具体例としては、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジイソブチルケトン、シクロヘキサノン、2-ヘプタノン、4-ヘプタノン、3,5,5-トリメチル-2-シクロヘキセン-1-オン、及び3,3,5-トリメチルシクロヘキサノン、イソホロンが挙げられる。
 エーテル系有機溶媒の具体例としては、ジエチルエーテル、シクロペンチルメチルエーテル、テトラヒドロフラン、1,4-ジオキサンが挙げられる。
 エステル系有機溶媒の具体例としては、酢酸メチル、酢酸エチル、酢酸プロピル、酢酸イソプロピル、酢酸ブチル、酢酸イソブチル、酢酸tert‐ブチル、酢酸アミル、酢酸イソアミル、3-エトキシプロピオン酸エチル、乳酸エチルエチレングリコールモノブチルエーテルアセテート、ジエチレングリコールモノブチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテート、3-メトキシ-3-メチルブチルアセテート、3-メトキシブチルアセテート、プロピレングリコールモノメチルアセテート、プロピレングリコールジメチルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、シクロヘキサノールアセテート、プロピレングリコールジアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテルプロピオネート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノブチルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート、プロピレングリコールジアセテート、ジプロピレングリコ-ルメチルエ-テルアセテ-ト、1,3-ブチレングリコールジアセテート、1,4-ブタンジオールジアセテート、1,3-ブチレングリコールジアセテート、1,6-ヘキサンジオールジアセテート、γ-ブチロラクトン、トリアセチン、2,2,4-トリメチル-1,3-ペンタンジオールモノイソブチレートが挙げられる。
 グリコール系有機溶媒の具体例としては、エチレングリコール、エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、トリエチレングリコールモノブチルエーテル、テトラエチレングリコールモノブチルエーテル、エチレングリコールモノヘキシルエーテル、ジエチレングリコールモノヘキシルエーテル、エチレングリコールモノ-2-エチルヘキシルエーテル、ジエチレングリコールモノ-2-エチルヘキシルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノブチルエーテル、プロピレングリコールモノプロピルエーテル、エチレングリコールモノイソプロピルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノtert-ブチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノメチルエーテル、ジエチレングリコールモノイソプロピルエーテル、ジエチレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノブチルエーテル、ジプロピレングリコールモノプロピルエーテル、ジプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノブチルエーテルトリプロピレングリコールモノメチルエーテル、プロピレングリコールモノフェニルエーテル、1,3-ブチレングリコール、プロピレングリコールn-プロピルエーテル、プロピレングリコールn-ブチルエーテル、ジエチレングリコールモノエチルエーテル、ジプロピレングリコールn-プロピルエーテル、ジプロピレングリコールn-ブチルエーテル、トリプロピレングリコールメチルエーテル、トリプロピレングリコールn-ブチルエ-テル、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジブチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールジメチルエーテル、ジプロピレングリコールジメチルエーテル、ジエチレングリコールジブチルエーテル、テトラエチレングリコールジメチルエーテル、ジプロピレングリコールジメチルエーテルペンタン、トリエチレングリコールジメチルエーテル、ポリエチレングリコールジメチルエーテルが挙げられる。
 アルコール系有機溶媒の具体例としては、メタノール、エタノール、1-プロパノール、イソプロピルアルコール、n-ブタノール、ジアセトンアルコール、イソブタノール、sec-ブタノール、tert-ブタノール、ペンタノール、3-メチル-1,3-ブタンジオール、1,3-ブタンジオール、1,3-ブチレングリコール、オクタンジオール、2,4-ジエチルペンタンジオール、ブチルエチルプロパンジオール、2-メチル-1,3-プロパンジオール、4-ヒドロキシ-4-メチル-2-ペンタノン、2-エチル-1-ヘキサノール、3,5,5-トリメチル-1-ヘキサノール、イソデカノール、イソトリデカノール、3-メトキシ-3-メチル-1-ブタノール、2-メトキシブタノール、3-メトキシブタノール、シクロヘキサノール、フルフリルアルコール、テトラヒドロフルフリルアルコール、ベンジルアルコール、及びメチルシクロヘキサノールが挙げられる。
Examples of organic solvents include compounds consisting only of hydrogen atoms and carbon atoms, and compounds consisting only of hydrogen atoms, carbon atoms, and oxygen atoms. Specifically, examples include hydrocarbon-based organic solvents, ketone-based organic solvents, and ethers. Examples include organic solvents based on organic solvents, organic solvents based on esters, organic solvents based on glycol, and organic solvents based on alcohol.
Specific examples of hydrocarbon organic solvents include pentane, hexane, heptane, octane, hexadecane, isohexane, isooctane, isononane, cycloheptane, cyclohexane, bicyclohexyl, benzene, toluene, ethylbenzene, o-xylene, m-xylene, Examples include p-xylene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene, n-butylbenzene, sec-butylbenzene, and tert-butylbenzene.
Specific examples of ketone organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, 2-heptanone, 4-heptanone, 3,5,5-trimethyl-2-cyclohexen-1-one, and 3,5,5-trimethyl-2-cyclohexen-1-one. Examples include 3,5-trimethylcyclohexanone and isophorone.
Specific examples of ether organic solvents include diethyl ether, cyclopentyl methyl ether, tetrahydrofuran, and 1,4-dioxane.
Specific examples of ester organic solvents include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, tert-butyl acetate, amyl acetate, isoamyl acetate, ethyl 3-ethoxypropionate, and ethyl ethylene glycol lactate. Monobutyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, 3-methoxy-3-methylbutyl acetate, 3-methoxybutyl acetate, propylene glycol monomethyl acetate, propylene glycol dimethyl acetate, ethylene glycol Monoethyl ether acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, cyclohexanol acetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether acetate, propylene glycol mono Butyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol diacetate, dipropylene glycol methyl ether acetate, 1,3-butylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butylene glycol diacetate Examples include acetate, 1,6-hexanediol diacetate, γ-butyrolactone, triacetin, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate.
Specific examples of glycol-based organic solvents include ethylene glycol, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and ethylene glycol mono-2. -Ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol monopropyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monotert -Butyl ether, ethylene glycol monopropyl ether, ethylene glycol monomethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, Propylene glycol monobutyl ether tripropylene glycol monomethyl ether, propylene glycol monophenyl ether, 1,3-butylene glycol, propylene glycol n-propyl ether, propylene glycol n-butyl ether, diethylene glycol monoethyl ether, dipropylene glycol n-propyl ether, Propylene glycol n-butyl ether, tripropylene glycol methyl ether, tripropylene glycol n-butyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, diethylene glycol dibutyl ether , tetraethylene glycol dimethyl ether, dipropylene glycol dimethyl ether pentane, triethylene glycol dimethyl ether, and polyethylene glycol dimethyl ether.
Specific examples of alcoholic organic solvents include methanol, ethanol, 1-propanol, isopropyl alcohol, n-butanol, diacetone alcohol, isobutanol, sec-butanol, tert-butanol, pentanol, 3-methyl-1,3 -Butanediol, 1,3-butanediol, 1,3-butylene glycol, octanediol, 2,4-diethylpentanediol, butylethylpropanediol, 2-methyl-1,3-propanediol, 4-hydroxy-4 -Methyl-2-pentanone, 2-ethyl-1-hexanol, 3,5,5-trimethyl-1-hexanol, isodecanol, isotridecanol, 3-methoxy-3-methyl-1-butanol, 2-methoxybutanol , 3-methoxybutanol, cyclohexanol, furfuryl alcohol, tetrahydrofurfuryl alcohol, benzyl alcohol, and methylcyclohexanol.
 また、有機溶媒としては、ハロゲン系有機溶媒、含窒素化合物、含硫黄化合物、シロキサン化合物が挙げられる。
 ハロゲン系有機溶媒の具体例としては、ジクロロメタン、クロロホルム、四塩化炭素、ジクロロエタン、クロロベンゼン、o-クロロトルエン、m-クロロトルエン、p-クロロトルエン、m-ジクロロベンゼン、1,2,3-トリクロロプロパンが挙げられる。
 含窒素化合物としては、ニトロベンゼン、アセトニトリル、ベンゾニトリル、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン、1,3-ジメチル-2-イミダゾリジノンが挙げられる。
 含硫黄化合物としては、二硫化炭素、ジメチルスルホキシドが挙げられる。
 シロキサン化合物としては、ヘキサメチルジシロキサン、オクタメチルトリシロキサン、デカメチルテトラシロキサンが挙げられる。
Further, examples of the organic solvent include halogenated organic solvents, nitrogen-containing compounds, sulfur-containing compounds, and siloxane compounds.
Specific examples of halogenated organic solvents include dichloromethane, chloroform, carbon tetrachloride, dichloroethane, chlorobenzene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, m-dichlorobenzene, 1,2,3-trichloropropane. can be mentioned.
Examples of nitrogen-containing compounds include nitrobenzene, acetonitrile, benzonitrile, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and 1,3-dimethyl-2-imidazolidinone.
Examples of sulfur-containing compounds include carbon disulfide and dimethyl sulfoxide.
Examples of the siloxane compound include hexamethyldisiloxane, octamethyltrisiloxane, and decamethyltetrasiloxane.
 有機溶媒は、2種以上を混合してもよく、例えば、グリコール系有機溶媒とアルコール系有機溶媒とを混合してもよい。
 有機溶媒の含有量は、液状媒体の全量に対して、90~99質量%が好ましく、93~99質量%がより好ましく、95~99質量%がさらに好ましい。また、水の含有量は、液状媒体の全量に対して、1~10質量%が好ましく、1~7質量%がより好ましく、1~5質量%がさらに好ましい。
Two or more kinds of organic solvents may be mixed, for example, a glycol-based organic solvent and an alcohol-based organic solvent may be mixed.
The content of the organic solvent is preferably 90 to 99% by mass, more preferably 93 to 99% by mass, and even more preferably 95 to 99% by mass, based on the total amount of the liquid medium. Further, the water content is preferably 1 to 10% by mass, more preferably 1 to 7% by mass, and even more preferably 1 to 5% by mass, based on the total amount of the liquid medium.
 液状媒体の含有量は、本開示の組成物の全量に対して、60~99.999質量%が好ましく、80~99.99質量%がより好ましく、90~99.9質量%がさらに好ましい。ウェットコーティング法に使用する本開示の組成物の場合には、液状媒体の含有量は、本開示の組成物の全量に対して、90~99.99質量%であってもよく、95~99.98質量%であってもよく、97~99.97質量%であってもよく、98~99.95質量%であってもよい。
 本開示の組成物に含まれる液状媒体は1種のみであってもよく、2種以上であってもよい。
The content of the liquid medium is preferably 60 to 99.999% by mass, more preferably 80 to 99.99% by mass, and even more preferably 90 to 99.9% by mass, based on the total amount of the composition of the present disclosure. In the case of the composition of the present disclosure used in a wet coating method, the content of the liquid medium may be 90-99.99% by weight, 95-99% by weight, based on the total amount of the composition of the present disclosure. It may be .98% by mass, 97 to 99.97% by mass, or 98 to 99.95% by mass.
The composition of the present disclosure may contain only one type of liquid medium, or may contain two or more types.
 本開示の組成物は、本開示の化合物及び液状媒体以外に、本開示の効果を損なわない範囲で、他の成分を含んでいてもよい。
 他の成分としては、例えば、反応性シリル基の加水分解と縮合反応を促進する酸触媒、塩基性触媒等の公知の添加剤が挙げられる。酸触媒の具体例としては、塩酸、硝酸、酢酸、硫酸、燐酸、スルホン酸、メタンスルホン酸、p-トルエンスルホン酸が挙げられる。塩基性触媒の具体例としては、水酸化ナトリウム、水酸化カリウム、アンモニアが挙げられる。
The composition of the present disclosure may contain other components in addition to the compound of the present disclosure and the liquid medium, as long as the effects of the present disclosure are not impaired.
Examples of other components include known additives such as acid catalysts and basic catalysts that promote hydrolysis and condensation reactions of reactive silyl groups. Specific examples of acid catalysts include hydrochloric acid, nitric acid, acetic acid, sulfuric acid, phosphoric acid, sulfonic acid, methanesulfonic acid, and p-toluenesulfonic acid. Specific examples of basic catalysts include sodium hydroxide, potassium hydroxide, and ammonia.
 また、他の成分としては、加水分解性基を有する金属化合物(以下、加水分解性基を有する金属化合物を「特定金属化合物」とも記す。)も挙げられる。本開示の組成物が特定金属化合物を含むと、表面処理層の滑り性及び防汚性をより向上しうる。特定金属化合物としては、下記式(M1)~(M3)が挙げられる。 In addition, other components include a metal compound having a hydrolyzable group (hereinafter, a metal compound having a hydrolyzable group is also referred to as a "specific metal compound"). When the composition of the present disclosure contains a specific metal compound, the slipperiness and antifouling properties of the surface treatment layer can be further improved. Specific metal compounds include the following formulas (M1) to (M3).
 M(Xb1m1(Xb2m2(Xb3m3  …(M1)
 Si(Xb4)(Xb5      …(M2)
 (Xb6Si-(Yb1)-Si(Xb7  …(M3)
M(X b1 ) m1 (X b2 ) m2 (X b3 ) m3 ...(M1)
Si(X b4 )(X b5 ) 3 ...(M2)
(X b6 ) 3 Si-(Y b1 )-Si(X b7 ) 3 ...(M3)
 式(M1)中、
 Mは、3価又は4価の金属原子を表す。
 Xb1はそれぞれ独立に、加水分解性基を表す。
 Xb2はそれぞれ独立に、シロキサン骨格含有基を表す。
 Xb3はそれぞれ独立に、炭化水素鎖含有基を表す。
 m1は2~4の整数であり、
 m2及びm3はそれぞれ独立に、0~2の整数であり、
 Mが3価の金属原子の場合、m1+m2+m3は3であり、Mが4価の金属原子の場合、m1+m2+m3は4である。
In formula (M1),
M represents a trivalent or tetravalent metal atom.
Each of X b1 independently represents a hydrolyzable group.
Each of X b2 independently represents a siloxane skeleton-containing group.
Each of X b3 independently represents a hydrocarbon chain-containing group.
m1 is an integer from 2 to 4,
m2 and m3 are each independently an integer of 0 to 2,
When M is a trivalent metal atom, m1+m2+m3 is 3, and when M is a tetravalent metal atom, m1+m2+m3 is 4.
 式(M2)中、
 Xb4は、加水分解性シランオリゴマー残基を表す。
 Xb5は、それぞれ独立に、加水分解性基又は炭素数1~4のアルキル基を表す。
 式(M3)中、
 Xb6及びXb7は、それぞれ独立に、加水分解性基又は水酸基を表す。
 Yb1は、2価の有機基を表す。
In formula (M2),
X b4 represents a hydrolyzable silane oligomer residue.
Each of X b5 independently represents a hydrolyzable group or an alkyl group having 1 to 4 carbon atoms.
In formula (M3),
X b6 and X b7 each independently represent a hydrolyzable group or a hydroxyl group.
Y b1 represents a divalent organic group.
 式(M1)中、Mで表される金属には、Si、Ge等の半金属も包含される。Mとしては、3価金属及び4価金属が好ましく、Al、Fe、In、Hf、Si、Ti、Sn、及びZrがより好ましく、Al、Si、Ti、及びZrがさらに好ましく、Siが特に好ましい。 In formula (M1), the metal represented by M also includes semimetals such as Si and Ge. M is preferably a trivalent metal or a tetravalent metal, more preferably Al, Fe, In, Hf, Si, Ti, Sn, and Zr, even more preferably Al, Si, Ti, and Zr, and particularly preferably Si. .
 式(M1)中、Xb1で表される加水分解性基としては、上記反応性シリル基における(-Si(R 3-n)中のLで示される加水分解性基と同様のものが挙げられる。 In formula (M1), the hydrolyzable group represented by X b1 is the hydrolyzable group represented by L 2 in (-Si(R 1 ) n L 2 3-n ) in the above reactive silyl group. The same can be mentioned.
 Xb2で表されるシロキサン骨格含有基は、シロキサン単位(-Si-O-)を有し、直鎖状でも分岐鎖状でもよい。シロキサン単位としては、ジアルキルシリルオキシ基が好ましく、ジメチルシリルオキシ基、ジエチルシリルオキシ基等が挙げられる。シロキサン骨格含有基におけるシロキサン単位の繰り返し数は、1以上であり、1~5が好ましく、1~4がより好ましく、1~3がさらに好ましい。
 シロキサン骨格含有基は、シロキサン骨格の一部に2価の炭化水素基を含んでいてもよい。具体的には、シロキサン骨格の一部の酸素原子が2価の炭化水素基で置き換わっていてもよい。前記2価の炭化水素基としては、メチレン基、エチレン基、プロピレン基、ブチレン基等のアルキレン基が挙げられる。
 シロキサン骨格含有基の末端のケイ素原子には、加水分解性基、炭化水素基(好ましくはアルキル基)等が結合していてもよい。
 シロキサン骨格含有基の元素数は、100以下が好ましく、50以下がより好ましく、30以下がさらに好ましい。前記元素数は10以上が好ましい。
 シロキサン骨格含有基としては、-(O-Si(CHCHで表される基が好ましく、ここで、nは1~5の整数であり、*は隣接原子との結合部位を表す。
The siloxane skeleton-containing group represented by X b2 has a siloxane unit (-Si-O-) and may be linear or branched. The siloxane unit is preferably a dialkylsilyloxy group, such as a dimethylsilyloxy group or a diethylsilyloxy group. The number of repeating siloxane units in the siloxane skeleton-containing group is 1 or more, preferably 1 to 5, more preferably 1 to 4, and even more preferably 1 to 3.
The siloxane skeleton-containing group may include a divalent hydrocarbon group in a part of the siloxane skeleton. Specifically, some oxygen atoms in the siloxane skeleton may be replaced with divalent hydrocarbon groups. Examples of the divalent hydrocarbon group include alkylene groups such as a methylene group, an ethylene group, a propylene group, and a butylene group.
A hydrolyzable group, a hydrocarbon group (preferably an alkyl group), etc. may be bonded to the terminal silicon atom of the siloxane skeleton-containing group.
The number of elements in the siloxane skeleton-containing group is preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. The number of elements is preferably 10 or more.
The siloxane skeleton-containing group is preferably a group represented by * -(O-Si(CH 3 ) 2 ) n CH 3 , where n is an integer from 1 to 5, and * represents a bond with an adjacent atom. Represents a part.
 Xb3で表される炭化水素鎖含有基は、炭化水素鎖のみからなる基でもよく、炭化水素鎖の炭素原子-炭素原子間にエーテル性酸素原子を有する基でもよい。炭化水素鎖は直鎖でも分岐鎖でもよく、直鎖が好ましい。炭化水素鎖は飽和炭化水素鎖でも不飽和炭化水素鎖でもよく、飽和炭化水素鎖が好ましい。炭化水素鎖含有基の炭素数は、1~3が好ましく、1~2がより好ましく、1がさらに好ましい。炭化水素鎖含有基としては、アルキル基が好ましく、メチル基、エチル基、又はプロピル基がより好ましい。 The hydrocarbon chain-containing group represented by X b3 may be a group consisting only of a hydrocarbon chain, or may be a group having an etheric oxygen atom between carbon atoms of the hydrocarbon chain. The hydrocarbon chain may be straight or branched, preferably straight. The hydrocarbon chain may be a saturated hydrocarbon chain or an unsaturated hydrocarbon chain, with a saturated hydrocarbon chain being preferred. The number of carbon atoms in the hydrocarbon chain-containing group is preferably 1 to 3, more preferably 1 to 2, and even more preferably 1. The hydrocarbon chain-containing group is preferably an alkyl group, more preferably a methyl group, an ethyl group, or a propyl group.
 m1は3又は4であることが好ましい。 It is preferable that m1 is 3 or 4.
 式(M1)で表される化合物としては、MがSiである下記式(M1-1)~(M1-5)で表される化合物が好ましく、式(M1-1)で表される化合物がより好ましい。式(M1-1)で表される化合物としては、テトラエトキシシラン、テトラメトキシシラン、トリエトキシメチルシランが好ましい。 As the compound represented by formula (M1), compounds represented by the following formulas (M1-1) to (M1-5) where M is Si are preferable, and the compound represented by formula (M1-1) is More preferred. As the compound represented by formula (M1-1), tetraethoxysilane, tetramethoxysilane, and triethoxymethylsilane are preferred.
 Si(Xb1           …(M1-1)
 CH-Si(Xb1         …(M1-2)
 C-Si(Xb1       …(M1-3)
 n-C-Si(Xb1     …(M1-4)
 (CHCH-Si(Xb1   …(M1-5)
Si(X b1 ) 4 ...(M1-1)
CH 3 -Si(X b1 ) 3  ...(M1-2)
C 2 H 5 -Si(X b1 ) 3 ...(M1-3)
n-C 3 H 7 -Si(X b1 ) 3 ...(M1-4)
(CH 3 ) 2 CH-Si(X b1 ) 3 ... (M1-5)
 式(M2)中、Xb4で表される加水分解性シランオリゴマー残基に含まれるケイ素原子の数は、3以上が好ましく、5以上がより好ましく、7以上がさらに好ましい。前記ケイ素原子の数は、15以下が好ましく、13以下がより好ましく、10以下がさらに好ましい。
 加水分解性シランオリゴマー残基は、ケイ素原子に結合するアルコキシ基を有していてもよい。前記アルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、ブトキシ基等が挙げられ、メトキシ基及びエトキシ基が好ましい。加水分解性シランオリゴマー残基は、これらアルコキシ基の1種又は2種以上を有してもよく、1種を有することが好ましい。
 加水分解性シランオリゴマー残基としては、(CO)Si-(OSi(OCO-等が挙げられる。ここで、*は隣接原子との結合部位を表す。
In formula (M2), the number of silicon atoms contained in the hydrolyzable silane oligomer residue represented by X b4 is preferably 3 or more, more preferably 5 or more, and even more preferably 7 or more. The number of silicon atoms is preferably 15 or less, more preferably 13 or less, and even more preferably 10 or less.
The hydrolyzable silane oligomer residue may have an alkoxy group bonded to a silicon atom. Examples of the alkoxy group include methoxy group, ethoxy group, propoxy group, butoxy group, and methoxy group and ethoxy group are preferred. The hydrolyzable silane oligomer residue may have one or more types of these alkoxy groups, and preferably has one type.
Examples of the hydrolyzable silane oligomer residue include (C 2 H 5 O) 3 Si-(OSi(OC 2 H 5 ) 2 ) 4 O- * and the like. Here, * represents a bonding site with an adjacent atom.
 式(M2)中、Xb5で表される加水分解性基としては、上記反応性シリル基における(-Si(R 3-n)中のLで示される加水分解性基と同様のもの、シアノ基、水素原子、アリル基が挙げられ、アルコキシ基又はイソシアナト基が好ましい。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましい。
 Xb5としては、加水分解性基が好ましい。
In formula (M2), the hydrolyzable group represented by X b5 is the hydrolyzable group represented by L 2 in (-Si(R 1 ) n L 2 3-n ) in the above reactive silyl group. Examples include those similar to , a cyano group, a hydrogen atom, and an allyl group, with an alkoxy group or an isocyanato group being preferred. The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
As X b5 , a hydrolyzable group is preferable.
 式(M2)で表される化合物としては、(HO)-Si-(OSi(OCOC等が挙げられる。 Examples of the compound represented by formula (M2) include (H 5 C 2 O) 3 -Si-(OSi(OC 2 H 5 ) 2 ) 4 OC 2 H 5 and the like.
 式(M3)で表される化合物は、2価の有機基の両末端に反応性シリル基を有する化合物、すなわち、ビスシランである。
 式(M3)中、Xb6及びXb7で表される加水分解性基としては、アルコキシ基、アシロキシ基、ケトオキシム基、アルケニルオキシ基、アミノ基、アミノキシ基、アミド基、イソシアナト基、ハロゲン原子が挙げられ、アルコキシ基、イソシアナト基が好ましい。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましく、メトキシ基、エトキシ基がより好ましい。
 式(M3)において、Xb6及びXb7は互いに同じ基でもよく、互いに異なる基でもよい。入手しやすさの点で、Xb6及びXb7は互いに同じ基であることが好ましい。
The compound represented by formula (M3) is a compound having a reactive silyl group at both ends of a divalent organic group, that is, bissilane.
In formula (M3), the hydrolyzable groups represented by X b6 and X b7 include an alkoxy group, an acyloxy group, a ketoxime group, an alkenyloxy group, an amino group, an aminoxy group, an amide group, an isocyanato group, and a halogen atom. an alkoxy group and an isocyanato group are preferred. The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms, more preferably a methoxy group or an ethoxy group.
In formula (M3), X b6 and X b7 may be the same group or different groups. From the viewpoint of availability, it is preferable that X b6 and X b7 are the same group.
 式(M3)中、Yb1は、両末端の反応性シリル基を連結する2価の有機基である。2価の有機基のYb1の炭素数は1~8が好ましく、1~3がより好ましい。
 Yb1としては、アルキレン基、フェニレン基、炭素原子間にエーテル性酸素原子を有するアルキレン基が挙げられる。例えば、-CHCH-、-CHCHCH-、-CHCHCHCH-、-CHCHCHCHCH-、-CHCHCHCHCHCH-、-CHC(CHCH-、-C(CHCHCHC(CH-、-CHCHOCHCH-、-CHCHCHOCHCHCH-、-CH(CH)CHOCHCH(CH)-、-C-が挙げられる。
In formula (M3), Y b1 is a divalent organic group that connects the reactive silyl groups at both ends. The number of carbon atoms in Y b1 of the divalent organic group is preferably 1 to 8, more preferably 1 to 3.
Examples of Y b1 include an alkylene group, a phenylene group, and an alkylene group having an etheric oxygen atom between carbon atoms. For example, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, -CH 2 C(CH 3 ) 2 CH 2 -, -C(CH 3 ) 2 CH 2 CH 2 C(CH 3 ) 2 -, -CH 2 CH 2 OCH 2 CH 2 -, -CH 2 CH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH(CH 3 )CH 2 OCH 2 CH(CH 3 )-, and -C 6 H 4 -.
 式(M3)で表される化合物としては、(CHO)Si(CHSi(OCH、(CO)Si(CHSi(OC、(OCN)Si(CHSi(NCO)、ClSi(CHSiCl、(CHO)Si(CHSi(OCH、(CO)Si(CHSi(OCが挙げられる。 Examples of the compound represented by formula (M3) include (CH 3 O) 3 Si(CH 2 ) 2 Si(OCH 3 ) 3 , (C 2 H 5 O) 3 Si(CH 2 ) 2 Si(OC 2 H 5 ) 3 , (OCN) 3Si ( CH2 ) 2Si ( NCO ) 3 , Cl3Si( CH2 ) 2SiCl3 , ( CH3O ) 3Si ( CH2 ) 6Si ( OCH3 ) 3 , ( C2H5O ) 3Si ( CH2 ) 6Si ( OC2H5 ) 3 is mentioned.
 本開示の組成物に含まれてもよい他の成分の含有量は、本開示の組成物の全量に対して、10質量%以下が好ましく、1質量%以下がより好ましい。本開示の組成物が特定金属化合物を含む場合、特定金属化合物の含有量は本開示の組成物の全量に対して0.01~30質量%が好ましく、0.01~10質量%がより好ましく、0.05~5質量%がさらに好ましい。 The content of other components that may be included in the composition of the present disclosure is preferably 10% by mass or less, more preferably 1% by mass or less, based on the total amount of the composition of the present disclosure. When the composition of the present disclosure includes a specific metal compound, the content of the specific metal compound is preferably 0.01 to 30% by mass, more preferably 0.01 to 10% by mass based on the total amount of the composition of the present disclosure. , more preferably 0.05 to 5% by mass.
 本開示の化合物と他の成分の合計含有量(以下、「固形分濃度」ともいう。)は、本開示の組成物の全量に対して、0.001~40質量%が好ましく、0.01~20質量%がより好ましく、0.1~10質量%がさらに好ましい。本開示の組成物の固形分濃度は、加熱前の組成物の質量と、120℃の対流式乾燥機にて4時間加熱した後の質量とから算出される値である。 The total content of the compound of the present disclosure and other components (hereinafter also referred to as "solid content concentration") is preferably 0.001 to 40% by mass, and 0.01% by mass, based on the total amount of the composition of the present disclosure. ~20% by mass is more preferred, and 0.1~10% by mass is even more preferred. The solid content concentration of the composition of the present disclosure is a value calculated from the mass of the composition before heating and the mass after heating in a convection dryer at 120° C. for 4 hours.
 本開示の組成物は、液状媒体を含むことから、コーティング用途として有用であり、コーティング液として用い得る。 Since the composition of the present disclosure contains a liquid medium, it is useful for coating purposes and can be used as a coating liquid.
[表面処理剤]
 一態様において、本開示の表面処理剤は、本開示の化合物を含む。また、本開示の表面処理剤は、本開示の化合物と、液状媒体と、を含んでいてもよい。本開示の表面処理剤は、本開示の組成物でもよい。表面処理剤に含まれる液状媒体の好ましい態様は、本開示の組成物に含まれる液状媒体の好ましい態様と同様である。
[Surface treatment agent]
In one aspect, the surface treatment agent of the present disclosure comprises a compound of the present disclosure. Furthermore, the surface treatment agent of the present disclosure may include the compound of the present disclosure and a liquid medium. The surface treating agent of the present disclosure may be a composition of the present disclosure. Preferred embodiments of the liquid medium contained in the surface treatment agent are the same as those of the liquid medium contained in the composition of the present disclosure.
 本開示の化合物は上述の構成を有するため、本開示の化合物を含む表面処理剤を用いることにより、指紋視認性を低減する特性及び耐摩耗性に優れた表面処理層を形成できる。 Since the compound of the present disclosure has the above-mentioned structure, by using a surface treatment agent containing the compound of the present disclosure, it is possible to form a surface treatment layer with excellent properties of reducing fingerprint visibility and excellent abrasion resistance.
[物品]
 一態様において、本開示の物品は、基材と、前記表面処理剤で表面処理された表面処理層と、を含む。
[Goods]
In one aspect, the article of the present disclosure includes a base material and a surface treatment layer surface treated with the surface treatment agent.
 表面処理層は、基材の表面の一部に形成されてもよく、基材の表面全体に形成されてもよい。表面処理層は、基材の表面に膜状に拡がっていてもよく、ドット状に点在していてもよい。
 表面処理層において、本開示の化合物は、反応性シリル基の一部又は全部の加水分解が進行し、かつ、シラノール基の脱水縮合反応が進行した状態で含まれる。
The surface treatment layer may be formed on a part of the surface of the base material, or may be formed on the entire surface of the base material. The surface treatment layer may be spread over the surface of the base material in the form of a film, or may be scattered in the form of dots.
In the surface treatment layer, the compound of the present disclosure is contained in a state in which hydrolysis of some or all of the reactive silyl groups has proceeded, and a dehydration condensation reaction of the silanol groups has proceeded.
 表面処理層の厚さは、1~100nmが好ましく、1~50nmがより好ましい。表面処理層の厚さが1nm以上であれば、表面処理による効果が充分に得られやすい。表面処理層の厚さが100nm以下であれば、利用効率が高い。表面処理層の厚さは、薄膜解析用X線回折計(製品名「ATX-G」、RIGAKU社製)を用いて、X線反射率法によって反射X線の干渉パターンを得て、干渉パターンの振動周期から算出できる。 The thickness of the surface treatment layer is preferably 1 to 100 nm, more preferably 1 to 50 nm. If the thickness of the surface treatment layer is 1 nm or more, the effect of the surface treatment is likely to be sufficiently obtained. If the thickness of the surface treatment layer is 100 nm or less, the utilization efficiency is high. The thickness of the surface treatment layer is determined by using an X-ray diffractometer for thin film analysis (product name "ATX-G", manufactured by RIGAKU) to obtain an interference pattern of reflected X-rays by the X-ray reflectance method. It can be calculated from the vibration period of
 表面処理層の表面における水の接触角は、7度以下が好ましく、6度以下がより好ましく、5度以下がさらに好ましい。表面処理層の表面における水の接触角の下限値は特に限定されず、例えば2度が挙げられる。
 上記水の接触角は、JIS R 3257:1999「基板ガラス表面のぬれ性試験方法」に準拠して測定される値である。具体的には、測定対象となる表面処理層の表面の5箇所に水滴を静置し、各水滴について静滴法によって水の接触角を測定する。水滴は約2μL/滴とし、温度23℃の環境下で測定を行い、5箇所の測定値の平均値を、上記「水の接触角」とする。
The contact angle of water on the surface of the surface treatment layer is preferably 7 degrees or less, more preferably 6 degrees or less, and even more preferably 5 degrees or less. The lower limit of the contact angle of water on the surface of the surface treatment layer is not particularly limited, and may be, for example, 2 degrees.
The water contact angle is a value measured in accordance with JIS R 3257:1999 "Method for testing wettability of substrate glass surface." Specifically, water droplets are placed at five locations on the surface of the surface treatment layer to be measured, and the contact angle of water is measured for each water droplet by the sessile drop method. The amount of water droplets is approximately 2 μL/drop, and the measurement is performed in an environment at a temperature of 23° C., and the average value of the measured values at 5 locations is defined as the above-mentioned “water contact angle”.
 基材の種類は特に限定されず、例えば、指紋視認性を低減する特性の付与が求められている基材が挙げられる。基材として、例えば、他の物品(例えば、スタイラス)又は人の手指を接触させて使用することがある基材;操作時に人の手指で持つことがある基材;及び、他の物品(例えば、載置台)の上に置くことがある基材が挙げられる。
 基材の材料としては、金属、樹脂、ガラス、サファイア、セラミック、石、繊維、不織布、紙、木、天然皮革、人工皮革、及びこれらの複合材料が挙げられる。ガラスは化学強化されていてもよい。
The type of base material is not particularly limited, and includes, for example, base materials that are required to have characteristics that reduce fingerprint visibility. As a base material, for example, a base material that may be used in contact with another article (e.g., a stylus) or a person's fingers; a base material that may be held by a person's fingers during operation; , a mounting table).
Examples of the base material include metal, resin, glass, sapphire, ceramic, stone, fiber, nonwoven fabric, paper, wood, natural leather, artificial leather, and composite materials thereof. The glass may be chemically strengthened.
 基材としては、建材、装飾建材、インテリア用品、輸送機器(例えば、自動車)、看板・掲示板、飲用器・食器、水槽、観賞用器具(例えば、額、箱)、実験器具、家具、繊維製品、包装容器;アート、スポーツ、ゲーム等に使用する、ガラス又は樹脂;携帯電話(例えば、スマートフォン)、携帯情報端末、ゲーム機、リモコン等の機器における外装部分(表示部を除く)に使用する、ガラス又は樹脂が挙げられる。基材の形状は、板状であってもよく、フィルム状であってもよい。 Base materials include building materials, decorative building materials, interior goods, transportation equipment (e.g. automobiles), signboards/bulletin boards, drinking vessels/tableware, aquariums, ornamental equipment (e.g. frames, boxes), laboratory equipment, furniture, textile products. , Packaging containers; Glass or resin used for art, sports, games, etc.; Used for the exterior parts (excluding display parts) of devices such as mobile phones (e.g. smartphones), personal digital assistants, game consoles, remote controls, etc. Examples include glass or resin. The shape of the base material may be a plate shape or a film shape.
 基材としては、タッチパネル用基材、ディスプレイ用基材、メガネレンズが好適であり、タッチパネル用基材が特に好適である。タッチパネル用基材の材料としては、ガラス又は透明樹脂が好ましい。 As the base material, touch panel base materials, display base materials, and eyeglass lenses are suitable, and touch panel base materials are particularly suitable. As the material for the touch panel base material, glass or transparent resin is preferable.
 基材は、一方の表面又は両面が、コロナ放電処理、プラズマ処理、プラズマグラフト重合処理等の表面処理が施された基材であってもよい。表面処理が施された基材は、表面処理層との密着性がより優れ、表面処理層の耐摩耗性がより向上する。そのため、基材の表面処理層と接する側の表面に表面処理を施すことが好ましい。また、表面処理が施された基材は、後述する下地層が設けられる場合には、下地層との密着性がより優れ、表面処理層の耐摩耗性がより向上する。そのため、下地層が設けられる場合には、基材の下地層と接する側の表面に表面処理を施すことが好ましい。 The base material may be a base material that has been subjected to surface treatment such as corona discharge treatment, plasma treatment, plasma graft polymerization treatment, etc. on one surface or both surfaces. The surface-treated base material has better adhesion with the surface-treated layer, and the abrasion resistance of the surface-treated layer is further improved. Therefore, it is preferable to perform surface treatment on the surface of the base material that is in contact with the surface treatment layer. Further, when the surface-treated base material is provided with a base layer, which will be described later, the adhesion with the base layer is better, and the wear resistance of the surface-treated layer is further improved. Therefore, when a base layer is provided, it is preferable to perform a surface treatment on the surface of the base material that is in contact with the base layer.
 表面処理層は、基材の表面上に直接設けられていてもよく、基材と表面処理層との間に下地層が設けられていてもよい。表面処理層の指紋視認性を低減する特性及び耐摩耗性をより向上させる観点から、本開示の物品は、基材と、基材上に配置された下地層と、下地層上に配置された本開示の表面処理剤で表面処理された表面処理層と、を含むことが好ましい。 The surface treatment layer may be provided directly on the surface of the base material, or a base layer may be provided between the base material and the surface treatment layer. From the viewpoint of further improving the property of reducing fingerprint visibility and the abrasion resistance of the surface treatment layer, the article of the present disclosure includes a base material, a base layer disposed on the base material, and a base layer disposed on the base layer. It is preferable to include a surface treatment layer whose surface is treated with the surface treatment agent of the present disclosure.
 下地層は、ケイ素と、周期表の第1族元素、第2族元素、第4族元素、第5族元素、第13族元素、及び第15族元素からなる群から選択される少なくとも1つの特定元素とを含む酸化物を含む層が好ましい。 The base layer includes silicon and at least one selected from the group consisting of a group 1 element, a group 2 element, a group 4 element, a group 5 element, a group 13 element, and a group 15 element of the periodic table. A layer containing an oxide containing a specific element is preferable.
 周期表の第1族元素(以下、「第1族元素」ともいう。)とは、リチウム、ナトリウム、カリウム、ルビジウム及びセシウムを意味する。第1族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、リチウム、ナトリウム、カリウムが好ましく、ナトリウム、カリウムがより好ましい。下地層には、第1族元素が2種以上含まれていてもよい。 Group 1 elements of the periodic table (hereinafter also referred to as "Group 1 elements") mean lithium, sodium, potassium, rubidium, and cesium. As Group 1 elements, lithium, sodium, and potassium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, sodium and potassium are more preferable. The underlayer may contain two or more types of Group 1 elements.
 周期表の第2族元素(以下、「第2族元素」ともいう。)とは、ベリリウム、マグネシウム、カルシウム、ストロンチウム及びバリウムを意味する。第2族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、マグネシウム、カルシウム、バリウムが好ましく、マグネシウム、カルシウムがより好ましい。下地層には、第2族元素が2種以上含まれていてもよい。 Group 2 elements of the periodic table (hereinafter also referred to as "Group 2 elements") mean beryllium, magnesium, calcium, strontium, and barium. As Group 2 elements, magnesium, calcium, and barium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, magnesium and calcium are more preferable. The underlayer may contain two or more types of Group 2 elements.
 周期表の第4族元素(以下、「第4族元素」ともいう。)とは、チタン、ジルコニウム、及びハフニウムを意味する。第4族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる観点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、チタン、ジルコニウムが好ましく、チタンがより好ましい。下地層には、第4族元素が2種以上含まれていてもよい。 Group 4 elements of the periodic table (hereinafter also referred to as "Group 4 elements") mean titanium, zirconium, and hafnium. As the Group 4 element, titanium and zirconium are preferable from the viewpoint of being able to form a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Titanium is more preferred. The base layer may contain two or more types of Group 4 elements.
 周期表の第5族元素(以下、「第5族元素」ともいう。)とは、バナジウム、ニオブ及びタンタルを意味する。第5族元素としては、表面処理層の耐摩耗性がより優れる観点から、バナジウムが特に好ましい。下地層には、第5族元素が2種以上含まれていてもよい。 Group 5 elements of the periodic table (hereinafter also referred to as "Group 5 elements") mean vanadium, niobium, and tantalum. As the Group 5 element, vanadium is particularly preferable from the viewpoint of providing better wear resistance of the surface treatment layer. The underlayer may contain two or more types of Group 5 elements.
 周期表の第13族元素(以下、「第13族元素」ともいう。)とは、ホウ素、アルミニウム、ガリウム及びインジウムを意味する。第13族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、ホウ素、アルミニウム、ガリウムが好ましく、ホウ素、アルミニウムがより好ましい。下地層には、第13族元素が2種以上含まれていてもよい。 Group 13 elements of the periodic table (hereinafter also referred to as "Group 13 elements") mean boron, aluminum, gallium, and indium. As Group 13 elements, boron, aluminum, and gallium are selected from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects, or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, boron and aluminum are more preferable. The base layer may contain two or more types of Group 13 elements.
 周期表の第15族元素(以下、「第15族元素」ともいう。)とは、窒素、リン、ヒ素、アンチモン及びビスマスを意味する。第15族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる観点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、リン、アンチモン、ビスマスが好ましく、リン、ビスマスがより好ましい。下地層には、第15族元素が2種以上含まれていてもよい。 Group 15 elements of the periodic table (hereinafter also referred to as "Group 15 elements") mean nitrogen, phosphorus, arsenic, antimony, and bismuth. As Group 15 elements, phosphorus, antimony, and bismuth are used from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, phosphorus and bismuth are more preferable. The base layer may contain two or more types of Group 15 elements.
 下地層に含まれる特定元素としては、第1族元素、第2族元素、第13族元素が表面処理層の耐摩耗性がより優れるため好ましく、第1族元素、第2族元素がより好ましく、第1族元素がさらに好ましい。
 特定元素として、1種のみの元素が含まれていても2種以上の元素が含まれていてもよい。
As the specific elements contained in the underlayer, Group 1 elements, Group 2 elements, and Group 13 elements are preferable because the wear resistance of the surface treatment layer is better, and Group 1 elements and Group 2 elements are more preferable. , Group 1 elements are more preferred.
As the specific element, only one type of element may be included, or two or more types of elements may be included.
 下地層に含まれる酸化物は、上記元素(ケイ素及び特定元素)単独の酸化物の混合物(例えば、酸化ケイ素と、特定元素の酸化物と、の混合物)であってもよいし、上記元素を2種以上含む複合酸化物であってもよいし、上記元素単独の酸化物と複合酸化物との混合物であってもよい。 The oxide contained in the base layer may be a mixture of oxides of the above elements (silicon and specific elements) alone (for example, a mixture of silicon oxide and an oxide of a specific element), or a mixture of the above elements (silicon and specific elements). It may be a composite oxide containing two or more types, or a mixture of an oxide of the above element alone and a composite oxide.
 下地層中のケイ素のモル濃度に対する、下地層中の特定元素の合計モル濃度の比(特定元素/ケイ素)は、表面処理層の耐摩耗性がより優れる観点から、0.02~2.90であるのが好ましく、0.10~2.00であるのがより好ましく、0.20~1.80であるのがさらに好ましい。
 下地層中の各元素のモル濃度(モル%)は、例えば、イオンスパッタリングを用いたX線光電子分光法(XPS)による深さ方向分析によって測定できる。
The ratio of the total molar concentration of the specific element in the underlayer to the molar concentration of silicon in the underlayer (specific element/silicon) is 0.02 to 2.90 from the viewpoint of better wear resistance of the surface treatment layer. It is preferably 0.10 to 2.00, even more preferably 0.20 to 1.80.
The molar concentration (mol %) of each element in the underlayer can be measured, for example, by depth direction analysis using X-ray photoelectron spectroscopy (XPS) using ion sputtering.
 下地層は、単層であっても複層であってもよい。下地層は、表面に凹凸を有していてもよい。
 下地層の厚さは、1~100nmが好ましく、1~50nmがより好ましく、2~20nmがさらに好ましい。下地層の厚さが上記下限値以上であれば、下地層による表面処理層の密着性がより向上して、表面処理層の耐摩耗性がより優れる。下地層の厚さが上記上限値以下であれば、下地層自体の耐摩耗性が優れる。
 下地層の厚さは、透過電子顕微鏡(TEM)による下地層の断面観察によって測定される。
The base layer may be a single layer or a multilayer. The base layer may have an uneven surface.
The thickness of the underlayer is preferably 1 to 100 nm, more preferably 1 to 50 nm, and even more preferably 2 to 20 nm. If the thickness of the base layer is equal to or greater than the above lower limit, the adhesion of the surface treatment layer to the base layer will be further improved, and the wear resistance of the surface treatment layer will be more excellent. If the thickness of the base layer is below the above upper limit, the base layer itself will have excellent wear resistance.
The thickness of the base layer is measured by observing a cross section of the base layer using a transmission electron microscope (TEM).
 下地層は、例えば、蒸着材料を用いた蒸着法、又は、ウェットコーティング法により形成できる。 The base layer can be formed, for example, by a vapor deposition method using a vapor deposition material or a wet coating method.
 蒸着法で用いる蒸着材料は、ケイ素及び特定元素を含む酸化物を含有することが好ましい。
 蒸着材料の形態の具体例としては、粉体、溶融体、焼結体、造粒体、破砕体が挙げられ、取り扱い性の観点から、溶融体、焼結体、造粒体が好ましい。
 ここで、溶融体とは、蒸着材料の粉体を高温で溶融させた後、冷却固化して得られた固形物を意味する。焼結体とは、蒸着材料の粉体を焼成して得られた固形物を意味し、必要に応じて、蒸着材料の粉体の代わりに、粉体をプレス成形して成形体を用いてもよい。造粒体とは、蒸着材料の粉体と液状媒体(例えば、水、有機溶媒)とを混練して粒子を得た後、粒子を乾燥させて得られた固形物を意味する。
The vapor deposition material used in the vapor deposition method preferably contains an oxide containing silicon and a specific element.
Specific examples of the form of the vapor deposition material include powder, molten body, sintered body, granulated body, and crushed body, and from the viewpoint of ease of handling, molten body, sintered body, and granulated body are preferable.
Here, the melt means a solid obtained by melting the powder of the vapor deposition material at a high temperature and then cooling and solidifying the powder. A sintered body means a solid obtained by firing a powder of a vapor deposition material, and if necessary, a molded body obtained by press-molding the powder may be used instead of a powder of a vapor deposition material. Good too. The granule refers to a solid material obtained by kneading a powder of a vapor deposition material and a liquid medium (for example, water, an organic solvent) to obtain particles, and then drying the particles.
 蒸着材料は、例えば、以下の方法で製造できる。
・酸化ケイ素の粉体と、特定元素の酸化物の粉体と、を混合して、蒸着材料の粉体を得る方法。
・上記蒸着材料の粉体及び水を混練して粒子を得た後、粒子を乾燥させて、蒸着材料の造粒体を得る方法。
・ケイ素を含む粉体(例えば、酸化ケイ素からなる粉体、珪砂、シリカゲル)と、特定元素を含む粉体(例えば、特定元素の酸化物の粉体、炭酸塩、硫酸塩、硝酸塩、シュウ酸塩、水酸化物)と、水と、を混合した混合物を乾燥させた後、乾燥後の混合物又はこれをプレス成形した成形体を焼成して、焼結体を得る方法。
・ケイ素を含む粉体(例えば、酸化ケイ素からなる粉体、珪砂、シリカゲル)と、特定元素を含む粉体(例えば、特定元素の酸化物の粉体、炭酸塩、硫酸塩、硝酸塩、シュウ酸塩、水酸化物)と、を高温で溶融させた後、溶融物を冷却固化して、溶融体を得る方法。
The vapor deposition material can be manufactured, for example, by the following method.
・A method of obtaining a vapor deposition material powder by mixing silicon oxide powder and oxide powder of a specific element.
- A method of kneading the powder of the vapor deposition material and water to obtain particles, and then drying the particles to obtain granules of the vapor deposition material.
・Powders containing silicon (e.g. powder of silicon oxide, silica sand, silica gel) and powders containing specific elements (e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid) A method of obtaining a sintered body by drying a mixture of salt, hydroxide) and water, and then firing the dried mixture or a press-molded body of the dried mixture.
・Powders containing silicon (e.g. powder of silicon oxide, silica sand, silica gel) and powders containing specific elements (e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid) (salt, hydroxide) at high temperature, and then cooled and solidified to obtain a molten product.
 蒸着材料を用いた蒸着法の具体例としては、真空蒸着法が挙げられる。真空蒸着法は、蒸着材料を真空槽内で蒸発させ、基材の表面に付着させる方法である。
 蒸着時の温度(例えば、真空蒸着装置を用いる際には、蒸着材料を配置するボートの温度)としては、100~3,000℃が好ましく、500~3,000℃がより好ましい。
 蒸着時の圧力(例えば、真空蒸着装置を用いる際には、蒸着材料を配置する槽内の圧力)としては、1Pa以下が好ましく、0.1Pa以下がより好ましい。
 蒸着材料を用いて下地層を形成する場合、1つの蒸着材料を用いてもよいし、異なる元素を含む2つ以上の蒸着材料を用いてもよい。
A specific example of a vapor deposition method using a vapor deposition material includes a vacuum vapor deposition method. The vacuum deposition method is a method in which a deposition material is evaporated in a vacuum chamber and adhered to the surface of a base material.
The temperature during vapor deposition (for example, the temperature of the boat in which the vapor deposition material is placed when using a vacuum vapor deposition apparatus) is preferably 100 to 3,000°C, more preferably 500 to 3,000°C.
The pressure during vapor deposition (for example, when using a vacuum vapor deposition apparatus, the pressure in the tank in which the vapor deposition material is placed) is preferably 1 Pa or less, more preferably 0.1 Pa or less.
When forming the base layer using a vapor deposition material, one vapor deposition material may be used, or two or more vapor deposition materials containing different elements may be used.
 蒸着材料の蒸発方法の具体例としては、高融点金属製抵抗加熱用ボート上で蒸着材料を溶融し、蒸発させる抵抗加熱法、電子ビームを蒸着材料に照射し、蒸着材料を直接加熱して表面を溶融し、蒸発させる電子銃法が挙げられる。蒸着材料の蒸発方法としては、局所的に加熱できるため高融点物質も蒸発できる点、電子ビームが当たっていないところは低温であるため容器との反応や不純物の混入のおそれがない観点から、電子銃法が好ましい。
 蒸着材料の蒸発方法としては、複数のボートを用いてもよく、単独のボートに全ての蒸着材料を入れて用いてもよい。蒸着方法は、共蒸着であってもよく、交互蒸着等でもよい。具体的には、シリカと特定源を同一のボートに混合して用いる例、シリカと特定元素源とを別々のボートに入れて共蒸着する例、同様に別々のボートに入れて交互蒸着する例が挙げられる。蒸着の条件、順番等は下地層の構成により適宜選択される。
Specific examples of evaporation methods include resistance heating, in which the evaporation material is melted and evaporated on a resistance heating boat made of high-melting-point metal, and irradiation of an electron beam onto the evaporation material to directly heat the evaporation material on the surface. An example is the electron gun method, which melts and evaporates. The method of evaporating the deposition material is that it can evaporate high-melting point substances because it can be heated locally, and that there is no risk of reaction with the container or contamination with impurities because the area that is not hit by the electron beam is at a low temperature. Gun law is preferred.
As a method for evaporating the evaporation materials, a plurality of boats may be used, or all the evaporation materials may be placed in a single boat. The vapor deposition method may be codeposition, alternate vapor deposition, or the like. Specifically, examples include mixing silica and a specific element source in the same boat, co-evaporating silica and a specific element source in separate boats, and alternately depositing silica and a specific element source in separate boats. can be mentioned. The conditions, order, etc. of vapor deposition are appropriately selected depending on the structure of the underlying layer.
 ウェットコーティング法では、ケイ素を含む化合物と、特定元素を含む化合物と、液状媒体と、を含むコーティング液を用いたウェットコーティング法によって、基材上に下地層を形成することが好ましい。 In the wet coating method, it is preferable to form the base layer on the base material by a wet coating method using a coating liquid containing a compound containing silicon, a compound containing a specific element, and a liquid medium.
 ケイ素化合物の具体例としては、酸化ケイ素、ケイ酸、ケイ酸の部分縮合物、アルコキシシラン、アルコキシシランの部分加水分解縮合物が挙げられる。 Specific examples of silicon compounds include silicon oxide, silicic acid, partial condensates of silicic acid, alkoxysilanes, and partially hydrolyzed condensates of alkoxysilanes.
 特定元素を含む化合物の具体例としては、特定元素の酸化物、特定元素のアルコキシド、特定元素の炭酸塩、特定元素の硫酸塩、特定元素の硝酸塩、特定元素のシュウ酸塩、特定元素の水酸化物が挙げられる。 Specific examples of compounds containing specific elements include oxides of specific elements, alkoxides of specific elements, carbonates of specific elements, sulfates of specific elements, nitrates of specific elements, oxalates of specific elements, and water of specific elements. Examples include oxides.
 液状媒体としては、上記本開示の組成物に含まれる液状媒体と同様のものが挙げられる。 Examples of the liquid medium include those similar to the liquid medium contained in the composition of the present disclosure described above.
 液状媒体の含有量は、下地層の形成に使用するコーティング液の全量に対して、0.01~20質量%が好ましく、0.1~10質量%がより好ましい。 The content of the liquid medium is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the total amount of the coating liquid used to form the base layer.
 下地層を形成するためのウェットコーティング法の具体例としては、スピンコート法、ワイプコート法、スプレーコート法、スキージーコート法、ディップコート法、ダイコート法、インクジェット法、フローコート法、ロールコート法、キャスト法、ラングミュア・ブロジェット法、グラビアコート法が挙げられる。 Specific examples of wet coating methods for forming the base layer include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet, flow coating, roll coating, Examples include the cast method, Langmuir-Blodgett method, and gravure coating method.
 コーティング液をウェットコーティングした後、塗膜を乾燥させるのが好ましい。塗膜の乾燥温度としては、20~200℃が好ましく、80~160℃がより好ましい。 After wet coating the coating liquid, it is preferable to dry the coating film. The drying temperature of the coating film is preferably 20 to 200°C, more preferably 80 to 160°C.
 本開示の物品は、光学部材であることが好ましい。光学部材としては、例えば、カーナビゲーション、携帯電話、スマートフォン、デジタルカメラ、デジタルビデオカメラ、PDA、ポータブルオーディオプレーヤー、カーオーディオ、ゲーム機器、眼鏡レンズ、カメラレンズ、レンズフィルター、サングラス、胃カメラ等の医療用器機、複写機、PC、ディスプレイ(例えば、液晶ディスプレイ、有機ELディスプレイ、プラズマディスプレイ、タッチパネルディスプレイ)、タッチパネル、保護フィルム、及び反射防止フィルムが挙げられる。特に、物品は、ディスプレイ又はタッチパネルであることが好ましい。 The article of the present disclosure is preferably an optical member. Examples of optical components include medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. Examples include personal appliances, copying machines, PCs, displays (eg, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films. In particular, the article is preferably a display or a touch panel.
[物品の製造方法]
 本開示の物品の製造方法は、例えば、基材に対して、本開示の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造するという方法である。表面処理としては、ドライコーティング法及びウェットコーティング法が挙げられる。
[Method for manufacturing articles]
A method for producing an article of the present disclosure is, for example, a method of surface-treating a base material using the surface treatment agent of the present disclosure to produce an article in which a surface-treated layer is formed on the base material. . Surface treatments include dry coating methods and wet coating methods.
 ドライコーティング法としては、真空蒸着、CVD、スパッタリング等の手法が挙げられる。ドライコーティング法としては、化合物の分解を抑える点、及び装置の簡便さの観点から、真空蒸着法が好ましい。真空蒸着時には、鉄、鋼等の金属多孔体に、本開示の化合物を含浸させたペレット状物質を用いてもよい。本開示の化合物及び液状媒体を含む組成物を、鉄、鋼等の金属多孔体に含浸させ、液状媒体を乾燥させて、本開示の化合物を含浸させたペレット状物質を用いてもよい。 Examples of dry coating methods include vacuum deposition, CVD, and sputtering. As the dry coating method, a vacuum evaporation method is preferable from the viewpoint of suppressing decomposition of the compound and the simplicity of the apparatus. At the time of vacuum deposition, a pellet-like substance obtained by impregnating a porous metal body such as iron or steel with the compound of the present disclosure may be used. A pellet-like material impregnated with the compound of the present disclosure may be used by impregnating a porous metal body such as iron or steel with a composition containing the compound of the present disclosure and a liquid medium, and drying the liquid medium.
 ウェットコーティング法としては、例えば、スピンコート法、ワイプコート法、スプレーコート法、スキージーコート法、ディップコート法、ダイコート法、インクジェット法、フローコート法、ロールコート法、キャスト法、ラングミュア・ブロジェット法、グラビアコート法が挙げられる。 Examples of wet coating methods include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet coating, flow coating, roll coating, casting, and Langmuir-Blodgett methods. , gravure coating method.
 表面処理層の耐摩耗性を向上させるために、必要に応じて、本開示の化合物と基材との反応を促進させるための操作を行ってもよい。該操作としては、加熱、加湿、光照射等が挙げられる。
 例えば、水分を有する大気中で表面処理層が形成された基材を加熱して、加水分解性基の加水分解反応、基材の表面の水酸基等とシラノール基との反応、シラノール基の縮合反応によるシロキサン結合の生成、等の反応を促進できる。
 表面処理後、表面処理層中の化合物であって、他の化合物又は基材と化学結合していない化合物は、必要に応じて除去してもよい。除去する方法としては、例えば、表面処理層に溶媒をかけ流す方法、溶媒をしみ込ませた布でふき取る方法等が挙げられる。
In order to improve the abrasion resistance of the surface treatment layer, an operation may be performed to accelerate the reaction between the compound of the present disclosure and the base material, if necessary. Such operations include heating, humidification, light irradiation, and the like.
For example, by heating a base material on which a surface treatment layer is formed in a moist atmosphere, a hydrolysis reaction of hydrolyzable groups, a reaction between hydroxyl groups, etc. on the surface of the base material and silanol groups, and a condensation reaction of silanol groups. can promote reactions such as the formation of siloxane bonds.
After the surface treatment, compounds in the surface treatment layer that are not chemically bonded to other compounds or the base material may be removed as necessary. Examples of the removal method include a method of pouring a solvent onto the surface treatment layer, a method of wiping with a cloth impregnated with a solvent, and the like.
 次に本開示の実施形態を実施例により具体的に説明するが、本開示の実施形態はこれらの実施例に限定されるものではない。 Next, embodiments of the present disclosure will be specifically described using Examples, but the embodiments of the present disclosure are not limited to these Examples.
[例1:化合物(1-2)の合成]
 プロピレングリコールの58g(1mol)を開始剤として用い、水酸化カリウムの存在下で580g(10mol)のプロピレンオキシドを重合後、440g(10mol)のエチレンオキシドを重合し、中和及び中和塩を除去することで、数平均分子量が約1,100である化合物(1-1)を得た。化合物(1-1)は、5つのRO単位と5つのEO単位とがブロックで結合した特定ポリアルキレンオキシド鎖を2つ有する化合物であった。
[Example 1: Synthesis of compound (1-2)]
Using 58 g (1 mol) of propylene glycol as an initiator, 580 g (10 mol) of propylene oxide is polymerized in the presence of potassium hydroxide, and then 440 g (10 mol) of ethylene oxide is polymerized, neutralized, and the neutralized salt is removed. As a result, a compound (1-1) having a number average molecular weight of about 1,100 was obtained. Compound (1-1) was a compound having two specific polyalkylene oxide chains in which five RO units and five EO units were bonded in blocks.

 

 
 300mLナス型フラスコに、化合物(1-1)の108g(100mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の10.3g(50mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの1.2g(12mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,200である化合物(1-2)を得た。化合物(1-2)の収量は118g、収率は100%であった。 108 g (100 mmol) of compound (1-1) and 10.3 g (50 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 1.2 g (12 mmol) of 1% by mass triethylamine was added to the obtained mixture, followed by stirring at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain Compound (1-2) having a number average molecular weight of about 1,200 as a colorless transparent liquid. The yield of compound (1-2) was 118 g, and the yield was 100%.

 

 
[例2:化合物(2-2)の合成]
 グリセリンの92g(1mol)を開始剤として用い、水酸化カリウムの存在下で870g(15mol)のプロピレンオキシドを重合後、660g(15mol)のエチレンオキシドを重合し、中和及び中和塩を除去することで、数平均分子量が1,600である化合物(2-1)を得た。化合物(2-1)は、5つのRO単位と5つのEO単位とがブロックで結合した特定ポリアルキレンオキシド鎖を3つ有する化合物であった。
[Example 2: Synthesis of compound (2-2)]
Using 92 g (1 mol) of glycerin as an initiator, polymerize 870 g (15 mol) of propylene oxide in the presence of potassium hydroxide, then polymerize 660 g (15 mol) of ethylene oxide, neutralize and remove the neutralized salt. Compound (2-1) having a number average molecular weight of 1,600 was obtained. Compound (2-1) was a compound having three specific polyalkylene oxide chains in which five RO units and five EO units were connected in blocks.

 

 
 300mLナス型フラスコに、化合物(2-1)の16.2g(10mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の4.1g(20mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの0.2g(2mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,800である化合物(2-2)を得た。化合物(2-2)の収量は20.3g、収率は100%であった。 16.2 g (10 mmol) of compound (2-1) and 4.1 g (20 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 0.2 g (2 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain Compound (2-2) having a number average molecular weight of about 1,800 as a colorless transparent liquid. The yield of compound (2-2) was 20.3 g, and the yield was 100%.

 

 
[例3:化合物(3-2)の合成]
 300mLナス型フラスコに、前記化合物(2-1)の16.2g(10mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の2.0g(10mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの0.18g(1.8mmol)を加え、その後80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,700である化合物(3-2)を得た。化合物(3-2)の収量は18.2g、収率は100%であった。
[Example 3: Synthesis of compound (3-2)]
16.2 g (10 mmol) of the compound (2-1) and 2.0 g (10 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 0.18 g (1.8 mmol) of 1% by mass triethylamine was added to the obtained mixture, and the mixture was stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain Compound (3-2) having a number average molecular weight of about 1,700 as a colorless transparent liquid. The yield of compound (3-2) was 18.2 g, and the yield was 100%.

 

 
[例4:化合物(4-2)の合成]
 300mLナス型フラスコに、前記化合物(2-1)の16.2g(10mmol)、7-(3-イソシアナトプロピル)-3,3,11,11-テトラメトキシ-7-(3-(トリメトキシシリル)プロピル)-2,12-ジオキサ-3,7,11-トリシラトリデカンの6.0g(10mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの2.2g(2.2mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,900である化合物(4-2)を得た。化合物(4-2)の収量は22.2g、収率は100%であった。
[Example 4: Synthesis of compound (4-2)]
In a 300 mL eggplant flask, 16.2 g (10 mmol) of the compound (2-1), 7-(3-isocyanatopropyl)-3,3,11,11-tetramethoxy-7-(3-(trimethoxy 6.0 g (10 mmol) of silyl)propyl)-2,12-dioxa-3,7,11-trisilatridecane was added. Subsequently, 2.2 g (2.2 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain Compound (4-2) having a number average molecular weight of about 1,900 as a colorless transparent liquid. The amount of compound (4-2) was 22.2 g, and the yield was 100%.

 

 
[例5:化合物(5-2)の合成]
 300mLナス型フラスコに、前記化合物(2-1)の16.2g(10mmol)、7-(3-イソシアナトプロピル)-3,3,11,11-テトラメトキシ-7-(3-(トリメトキシシリル)プロピル)-2,12-ジオキサ-3,7,11-トリシラトリデカンの12.0g(20mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの3.8g(3.8mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約2,200である化合物(5-2)を得た。化合物(5-2)の収量は38.2g、収率は100%であった。
[Example 5: Synthesis of compound (5-2)]
In a 300 mL eggplant flask, 16.2 g (10 mmol) of the compound (2-1), 7-(3-isocyanatopropyl)-3,3,11,11-tetramethoxy-7-(3-(trimethoxy 12.0 g (20 mmol) of silyl)propyl)-2,12-dioxa-3,7,11-trisilatridecane was added. Subsequently, 3.8 g (3.8 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain Compound (5-2) having a number average molecular weight of about 2,200 as a colorless transparent liquid. The amount of compound (5-2) was 38.2 g, and the yield was 100%.

 

 
[例6:化合物(C1-1)の合成]
 プロピレングリコールの58g(1mol)を開始剤として用い、水酸化カリウムの存在下で880g(20mol)のエチレンオキシドを重合後、中和及び中和塩を除去することで、数平均分子量が約940である化合物(C1-1)を得た。化合物(C1-1)は、10個のEO単位からなるポリアルキレンオキシド鎖を2つ有する化合物であった。
[Example 6: Synthesis of compound (C1-1)]
Using 58 g (1 mol) of propylene glycol as an initiator, 880 g (20 mol) of ethylene oxide is polymerized in the presence of potassium hydroxide, followed by neutralization and removal of the neutralized salt, resulting in a number average molecular weight of about 940. Compound (C1-1) was obtained. Compound (C1-1) was a compound having two polyalkylene oxide chains each consisting of 10 EO units.

 

 
 300mLナス型フラスコに、化合物(C1-1)の94g(100mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の10.3g(50mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの1.0g(10mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,000である化合物(C1-2)を得た。化合物(C1-2)の収量は104g、収率は100%であった。 94 g (100 mmol) of compound (C1-1) and 10.3 g (50 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 1.0 g (10 mmol) of 1% by mass triethylamine was added to the obtained mixture, and the mixture was stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain a compound (C1-2) having a number average molecular weight of about 1,000 as a colorless transparent liquid. The amount of compound (C1-2) was 104 g, and the yield was 100%.

 

 
[例7:化合物(C2-2)の合成]
 グリセリン92g(1mol)を開始剤として用い、水酸化カリウムの存在下で1320g(30mol)のエチレンオキシドを重合後、中和及び中和塩を除去することで、化合物(C2-1)を得た。化合物(C2-1)は、10個のEO単位からなるポリアルキレンオキシド鎖を3つ有する化合物であった。
[Example 7: Synthesis of compound (C2-2)]
Using 92 g (1 mol) of glycerin as an initiator, 1320 g (30 mol) of ethylene oxide was polymerized in the presence of potassium hydroxide, and then neutralized and the neutralized salt was removed to obtain compound (C2-1). Compound (C2-1) was a compound having three polyalkylene oxide chains each consisting of 10 EO units.

 

 
 300mLナス型フラスコに、前記化合物(C2-1)の14.1g(10mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の2.1g(10mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの1.6g(1.6mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,500である化合物(C2-2)を得た。化合物(C2-2)の収量は16.2g、収率は100%であった。 14.1 g (10 mmol) of the compound (C2-1) and 2.1 g (10 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant flask. Subsequently, 1.6 g (1.6 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain a compound (C2-2) having a number average molecular weight of about 1,500 as a colorless transparent liquid. The yield of compound (C2-2) was 16.2 g, and the yield was 100%.

 

 
[例8:化合物(C3-1)]
 前記化合物(C1-1)をそのまま用いて、化合物(C3-1)とした。
[Example 8: Compound (C3-1)]
The compound (C1-1) was used as it was to prepare a compound (C3-1).

 

 
[例9:化合物(C4-2)の合成]
 プロピレングリコールの58g(1mol)を開始剤として用い、水酸化カリウムの存在下で1,160g(20mol)のプロピレンオキシドを重合後、中和及び中和塩を除去することで、数平均分子量が約1,200である化合物(C4-1)を得た。化合物(C4-1)は、10個のRO単位からなるポリアルキレンオキシド鎖を2つ有する化合物であった。
[Example 9: Synthesis of compound (C4-2)]
After polymerizing 1,160 g (20 mol) of propylene oxide in the presence of potassium hydroxide using 58 g (1 mol) of propylene glycol as an initiator, neutralization and removal of the neutralized salt resulted in a number average molecular weight of approx. A compound (C4-1) having a molecular weight of 1,200 was obtained. Compound (C4-1) was a compound having two polyalkylene oxide chains each consisting of 10 RO units.

 

 
 300mLナス型フラスコに、化合物(C4-1)の12g(10mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の2.1g(10mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミン1の4.1g(14mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,300である化合物(C4-2)を得た。化合物(C4-2)の収量は14.1g、収率は100%であった。 12 g (10 mmol) of compound (C4-1) and 2.1 g (10 mmol) of trimethoxysilylpropylisocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 4.1 g (14 mmol) of 1% by mass of triethylamine 1 was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain a compound (C4-2) having a number average molecular weight of about 1,300 as a colorless transparent liquid. The yield of compound (C4-2) was 14.1 g, and the yield was 100%.

 

 
[例10:化合物(C5-2)の合成]
 グリセリン92g(1mol)を開始剤として用い、水酸化カリウムの存在下で1,740g(30mol)のプロピレンオキシドを重合後、中和及び中和塩を除去することで、数平均分子量が1,800である化合物(C5-1)を得た。化合物(C5-1)は、10個のRO単位からなるポリアルキレンオキシド鎖を3つ有する化合物であった。
[Example 10: Synthesis of compound (C5-2)]
After polymerizing 1,740 g (30 mol) of propylene oxide in the presence of potassium hydroxide using 92 g (1 mol) of glycerin as an initiator, neutralization and removal of the neutralized salt resulted in a number average molecular weight of 1,800. Compound (C5-1) was obtained. Compound (C5-1) was a compound having three polyalkylene oxide chains each consisting of 10 RO units.

 

 
 300mLナス型フラスコに、化合物(C5-1)の18g(10mmol)、トリメトキシシリルプロピルイソシアネート(東京化成社製)の2.1g(10mmol)を加えた。続いて、得られた混合物に対して1質量%のトリエチルアミンの20g(2mmol)を加え、その後、80℃で16時間撹拌した。続いて、得られた反応混合物をロータリーエバポレーターによって加熱減圧し、トリエチルアミンを除去して無色透明液体として数平均分子量が約1,900である化合物(C5-2)を得た。化合物(C5-2)の収量は20.1g、収率は100%であった。 18 g (10 mmol) of compound (C5-1) and 2.1 g (10 mmol) of trimethoxysilylpropyl isocyanate (manufactured by Tokyo Kasei Co., Ltd.) were added to a 300 mL eggplant-shaped flask. Subsequently, 20 g (2 mmol) of 1% by mass triethylamine was added to the obtained mixture, and then stirred at 80° C. for 16 hours. Subsequently, the resulting reaction mixture was heated and depressurized using a rotary evaporator to remove triethylamine to obtain a compound (C5-2) having a number average molecular weight of about 1,900 as a colorless transparent liquid. The amount of compound (C5-2) was 20.1 g, and the yield was 100%.

 

 
[例11:化合物(C6-1)]
 ヒドロキシ(ポリエチレンオキシド)プロピルトリエトキシシラン(アヅマックス社製)をそのまま用いて、化合物(C6-1)とした。
 HO(CHCHO)8-12-(CH-Si(OC  (C6-1)
[Example 11: Compound (C6-1)]
Hydroxy(polyethylene oxide)propyltriethoxysilane (manufactured by Azumax Co., Ltd.) was used as it was to prepare compound (C6-1).
HO(CH 2 CH 2 O) 8-12 -(CH 2 ) 3 -Si(OC 2 H 5 ) 3 (C6-1)
[物品の製造及び評価]
 例1~11で得た各化合物を用いて表面層形成用組成物(つまり表面処理剤)を調製した。具体的には、例1~11で得た各化合物を、プロピレングリコールモノメチルエーテルとジアセトンアルコールと0.1質量%硝酸水溶液とを質量比51:9:40で混合した溶媒に、固形分濃度10質量%になるように添加し、50℃、16時間撹拌して、前記化合物の部分加水分解縮合物を含む液状組成物を得た。さらに、この液状組成物を、固形分濃度が1.0質量%となるように、プロピレングリコールモノメチルエーテルとジアセトンアルコールとの85:15(質量比)の混合溶媒に溶解させ、表面層形成用組成物とした。
[Manufacture and evaluation of articles]
A composition for forming a surface layer (that is, a surface treatment agent) was prepared using each compound obtained in Examples 1 to 11. Specifically, each compound obtained in Examples 1 to 11 was added to a solvent in which propylene glycol monomethyl ether, diacetone alcohol, and 0.1% by mass nitric acid aqueous solution were mixed at a mass ratio of 51:9:40, and the solid content concentration was adjusted. The mixture was added in an amount of 10% by mass and stirred at 50° C. for 16 hours to obtain a liquid composition containing a partially hydrolyzed condensate of the compound. Further, this liquid composition was dissolved in a mixed solvent of propylene glycol monomethyl ether and diacetone alcohol at a ratio of 85:15 (mass ratio) so that the solid content concentration was 1.0% by mass. It was made into a composition.
 洗浄した縦23mm、幅25mm、厚さ3mmのガラス板表面に、例1~11で得た各化合物を用いて調製した表面層形成用組成物をディップコート法により塗布し、表面層形成用組成物の塗膜を形成した。次いで、これを、150℃の熱 風循環オーブンで1時間乾燥して、膜厚1.8nmの表面処理層を形成して、例1~11の物品である表面処理層付きガラス基板を得た。また、洗浄した縦23mm、幅25mm、厚さ3mmのガラス板をそのまま用いて、例12の物品とした。得られた物品について、下記の方法で評価した。結果を表1に示す。 A composition for forming a surface layer prepared using each compound obtained in Examples 1 to 11 was applied by dip coating onto the surface of a cleaned glass plate measuring 23 mm in length, 25 mm in width, and 3 mm in thickness. A coating was formed on the object. Next, this was dried in a hot air circulation oven at 150°C for 1 hour to form a surface treatment layer with a thickness of 1.8 nm, to obtain glass substrates with surface treatment layers, which are the articles of Examples 1 to 11. . Further, a washed glass plate having a length of 23 mm, a width of 25 mm, and a thickness of 3 mm was used as it was to prepare an article of Example 12. The obtained article was evaluated by the following method. The results are shown in Table 1.
<親水性>
 前述の方法により、例1~11の物品における表面処理層の表面及び例12のガラス板の表面について、初期における水の接触角を測定した。具体的には、表面に置いた約2μLの蒸留水の接触角を、接触角測定装置(協和界面科学社製、DM-500)を用いて測定した。初期における水の接触角が小さいほど、親水性が高いことを意味する。
<Hydrophilicity>
By the method described above, the initial contact angle of water was measured on the surfaces of the surface treatment layers of the articles of Examples 1 to 11 and the surface of the glass plate of Example 12. Specifically, the contact angle of about 2 μL of distilled water placed on the surface was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). The smaller the initial water contact angle, the higher the hydrophilicity.
<指紋視認性>
 得られた物品の指紋視認性の評価として、以下の初期における視認性評価を行った。
 例1~11の物品における表面処理層の表面及び例12のガラス板の表面について、下記人工指を用い、下記付着条件で下記人工指紋液を付着させ、ウェットティッシュにて3回ふき取り、視認性を目視で確認した。評価基準は下記の通りである。
 A:疑似指紋が目立たない
 B:疑似指紋がわずかに目立つ
 C:疑似指紋が例12のガラス板と同等のレベルで目立つ
 人工指:直径29mmのシリコーンゴム栓の端面を、JIS R6252に規定された基材Cw、研磨材A、粒度P240の研磨紙を用いて粗らしたもの。
 付着条件:上記人工指を、アクリル基板上の膜厚0.5mmの下記人工指紋液に250g/cmで垂直に押し付けて、人工指に人工指紋液を転写させた後、評価対象物である物品の表面に人工指を250g/cmで垂直に押し付けて使用する。
 人工指紋液:オレイン酸
<Fingerprint visibility>
As an evaluation of the fingerprint visibility of the obtained article, the following initial visibility evaluation was performed.
The following artificial fingerprint liquid was applied to the surface of the surface treatment layer of the articles of Examples 1 to 11 and the surface of the glass plate of Example 12 using the following artificial finger under the following adhesion conditions, and wiped 3 times with a wet tissue to improve visibility. was visually confirmed. The evaluation criteria are as follows.
A: Pseudo fingerprints are not noticeable B: Pseudo fingerprints are slightly noticeable C: Pseudo fingerprints are noticeable at the same level as the glass plate of Example 12 Artificial finger: The end surface of a silicone rubber stopper with a diameter of 29 mm was made according to JIS R6252. Roughened using base material Cw, abrasive A, and abrasive paper with a particle size of P240.
Attachment conditions: The above artificial finger was vertically pressed at 250 g/cm 2 onto the following artificial fingerprint liquid with a film thickness of 0.5 mm on an acrylic substrate to transfer the artificial fingerprint liquid to the artificial finger, which was then evaluated. An artificial finger is pressed vertically at 250 g/cm 2 onto the surface of the article.
Artificial fingerprint liquid: oleic acid
<耐摩耗性(スチールウール)>
 例1~11の物品における表面処理層の表面及び例12のガラス板の表面について、摩耗試験機(新東科学製「HEIDON-14DR(製品名)」)を用い、スチールウールボンスター(#0000)を圧力:25kPa、速度:320cm/分で10回往復させた後、前記親水性評価と同様の方法により擦り後における水の接触角を測定した。擦り後における水の接触角の値が初期における水の接触角の値に近いほど、耐摩耗性が良好であることを示す。
 また、例1~11の物品における表面処理層の表面及び例12のガラス板の表面について、前記指紋視認性評価の記載の通り人工指で人工指紋液を付着させた後、表面について、摩耗試験機(新東科学製「HEIDON-14DR(製品名)」)を用い、スチールウールボンスター(#0000)を圧力:25kPa、速度:320cm/分で10回往復させた後、ウェットティッシュにて3回ふき取り、擦り後における視認性を目視で確認した。評価基準は前記初期における視認性評価と同じである。
<Abrasion resistance (steel wool)>
The surface of the surface treatment layer in the articles of Examples 1 to 11 and the surface of the glass plate of Example 12 were tested using an abrasion tester ("HEIDON-14DR (product name)" manufactured by Shinto Kagaku) and coated with steel wool Bonstar (#0000). After reciprocating 10 times at a pressure of 25 kPa and a speed of 320 cm/min, the contact angle of water after rubbing was measured in the same manner as in the hydrophilicity evaluation. The closer the value of the contact angle of water after rubbing to the value of the contact angle of water at the initial stage, the better the wear resistance is.
Further, on the surface of the surface treatment layer of the articles of Examples 1 to 11 and the surface of the glass plate of Example 12, an artificial fingerprint liquid was applied with an artificial finger as described in the fingerprint visibility evaluation above, and then the surface was subjected to an abrasion test. Using a machine ("HEIDON-14DR (product name)" manufactured by Shinto Kagaku), steel wool Bonstar (#0000) was moved back and forth 10 times at a pressure of 25 kPa and a speed of 320 cm/min, and then 3 times with a wet tissue. Visibility after wiping and rubbing was visually confirmed. The evaluation criteria are the same as those for the initial visibility evaluation.

 

 
 表中、Saは1分子中におけるRO単位の数、Sbは1分子中におけるEO単位の数、dは1分子中における部分構造Dの数、eは1分子中における部分構造Eの数、gは1つの部分構造Dが有する反応性シリル基の数を表す。
 上記例において、例1~5は実施例であり、例6~12は比較例である。表1に示されるように、例1~5では、初期における水の接触角が小さいことから親水性が高く、初期において指紋視認性が低減されており、擦り後の接触角の値が初期の接触角の値に近く、かつ、擦り後においても指紋視認性が低減されている。すなわち、例1~5では指紋視認性を低減する特性及び耐摩耗性のいずれも良好である。一方、例6~12では指紋視認性を低減する特性及び優れた耐摩耗性を両立できない。特に、Sbが0である例9、10、及び12では、初期における水の接触角が大きく親水性が不充分であり、指紋視認性の低減が不充分である。また、Saが0である例6~8及び11では、擦り後における接触角の値と初期における接触角の値との差が大きく、擦り後の視認性評価においては疑似指紋が目立ちやすく、耐摩耗性が不充分である。
In the table, Sa is the number of RO units in one molecule, Sb is the number of EO units in one molecule, d is the number of substructures D in one molecule, e is the number of substructures E in one molecule, g represents the number of reactive silyl groups that one partial structure D has.
In the above examples, Examples 1 to 5 are examples, and Examples 6 to 12 are comparative examples. As shown in Table 1, in Examples 1 to 5, the contact angle of water at the initial stage is small, so the hydrophilicity is high, and the visibility of fingerprints at the initial stage is reduced, and the value of the contact angle after rubbing is lower than that at the initial stage. The value is close to that of the contact angle, and the visibility of fingerprints is reduced even after rubbing. That is, in Examples 1 to 5, both the property of reducing fingerprint visibility and the abrasion resistance are good. On the other hand, Examples 6 to 12 cannot achieve both the property of reducing fingerprint visibility and the excellent abrasion resistance. In particular, in Examples 9, 10, and 12 in which Sb was 0, the contact angle of water at the initial stage was large and the hydrophilicity was insufficient, and the reduction in fingerprint visibility was insufficient. In addition, in Examples 6 to 8 and 11 where Sa is 0, the difference between the contact angle value after rubbing and the contact angle value at the initial stage is large, and pseudo fingerprints are easily noticeable in the visibility evaluation after rubbing. Insufficient abrasion resistance.
 本開示の化合物は、表面処理剤として有用である。表面処理剤は、例えば、タッチパネルディスプレイ等の表示装置、光学素子、半導体素子、建築材料、自動車部品、ナノインプリント技術等における基材に対して用いることができる。また、表面処理剤は、電車、自動車、船舶、航空機等の輸送機器におけるボディー、窓ガラス(フロントガラス、サイドガラス、リアガラス)、ミラー、バンパー等に対して用いることができる。さらに、表面処理剤は、建築物外壁、テント、太陽光発電モジュール、遮音板、コンクリート等の屋外物品;漁網、虫取り網、水槽に対して用いることができる。また、表面処理剤は、台所、風呂場、洗面台、鏡、トイレ周辺部品;シャンデリア、タイル等の陶磁器;人工大理石、エアコン等の各種屋内設備に対して用いることができる。また、表面処理剤は、工場内の治具、内壁、配管等の防汚処理としても用いることができる。また、表面処理剤は、ゴーグル、眼鏡、ヘルメット、パチンコ、繊維、傘、遊具、サッカーボールに対して用いることができる。また、表面処理剤は、食品用包材、化粧品用包材、ポットの内部等の各種包材の付着防止剤としても用いることができる。また、表面処理剤は、カーナビゲーション、携帯電話、スマートフォン、デジタルカメラ、デジタルビデオカメラ、PDA、ポータブルオーディオプレーヤー、カーオーディオ、ゲーム機器、眼鏡レンズ、カメラレンズ、レンズフィルター、サングラス、胃カメラ等の医療用器機、複写機、PC、ディスプレイ(例えば、液晶ディスプレイ、有機ELディスプレイ、プラズマディスプレイ、タッチパネルディスプレイ)、タッチパネル、保護フィルム、及び反射防止フィルム等の光学部材に対して用いることができる。 The compounds of the present disclosure are useful as surface treatment agents. The surface treatment agent can be used, for example, for substrates in display devices such as touch panel displays, optical elements, semiconductor elements, building materials, automobile parts, nanoimprint technology, and the like. Furthermore, the surface treatment agent can be used for bodies, window glasses (windshields, side glasses, rear glasses), mirrors, bumpers, etc. of transportation equipment such as trains, automobiles, ships, and airplanes. Furthermore, the surface treatment agent can be used for outdoor articles such as building exterior walls, tents, solar power generation modules, sound insulation boards, and concrete; fishing nets, insect nets, and aquariums. Furthermore, the surface treatment agent can be used for various indoor equipment such as kitchens, bathrooms, washstands, mirrors, toilet peripheral parts; ceramics such as chandeliers and tiles; artificial marble, and air conditioners. Furthermore, the surface treatment agent can be used as an antifouling treatment for jigs, inner walls, piping, etc. in a factory. Furthermore, the surface treatment agent can be used for goggles, glasses, helmets, pachinko machines, textiles, umbrellas, play equipment, and soccer balls. Furthermore, the surface treatment agent can also be used as an adhesion prevention agent for various packaging materials such as food packaging materials, cosmetic packaging materials, and the inside of pots. In addition, surface treatment agents are used for medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. It can be used for optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
 2022年4月26日に出願された日本国特許出願第2022-072203号の開示は、その全体が参照により本明細書に取り込まれる。また、本明細書に記載された全ての文献、特許出願及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。 The disclosure of Japanese Patent Application No. 2022-072203 filed on April 26, 2022 is incorporated herein by reference in its entirety. In addition, all documents, patent applications, and technical standards mentioned herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually indicated to be incorporated by reference. , incorporated herein by reference.

Claims (15)

  1.  反応性シリル基と、エチレンオキシド単位と、炭素数3~6のアルキレンオキシド単位と、炭素原子に結合するヒドロキシ基と、を有する化合物であって、
     前記化合物に含まれる、前記炭素数3~6のアルキレンオキシド単位のモル数をMaとし、前記エチレンオキシド単位のモル数をMbとしたとき、MaとMbとの合計に対するMaの割合Ma/(Ma+Mb)の値が0.2~0.8である、化合物。
    A compound having a reactive silyl group, an ethylene oxide unit, an alkylene oxide unit having 3 to 6 carbon atoms, and a hydroxy group bonded to a carbon atom,
    When the number of moles of the alkylene oxide unit having 3 to 6 carbon atoms contained in the compound is Ma, and the number of moles of the ethylene oxide unit is Mb, the ratio of Ma to the total of Ma and Mb is Ma/(Ma+Mb) A compound having a value of 0.2 to 0.8.
  2.  前記反応性シリル基を1分子中に2以上有する、請求項1に記載の化合物。 The compound according to claim 1, which has two or more of the reactive silyl groups in one molecule.
  3.  下記式(1)で表される化合物。

     
     式(1)中、
     Rはそれぞれ独立に炭素数3~6のアルキレン基であり、
     Qは(d+e)価の連結基であり、
     Yは(g+1)価の連結基であり、
     Rはそれぞれ独立に1価の炭化水素基であり、
     Lはそれぞれ独立に加水分解性基又は水酸基であり、
     a1、a2、b1、及びb2はそれぞれ独立に1~300の整数であり、
     d及びeはそれぞれ独立に1~10の整数であり、
     nは0~2の整数であり、
     gは1以上の整数であり、
     (OCHCHb1(ORa1は、(OCHCH)と(OR)とがいずれの順序で結合してもよく、a1及びb1の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
     (RO)a2(CHCHO)b2は、(RO)と(CHCHO)とがいずれの順序で結合してもよく、a2及びb2の少なくとも一方が2以上である場合にランダムで結合してもブロックで結合してもよく、
     d個のa2とe個のa1との合計をSaとし、d個のb2とe個のb1との合計をSbとしたとき、SaとSbとの合計に対するSaの割合Sa/(Sa+Sb)の値が0.2~0.8である。
    A compound represented by the following formula (1).


    In formula (1),
    R 2 is each independently an alkylene group having 3 to 6 carbon atoms,
    Q 1 is a (d+e)-valent linking group,
    Y 1 is a (g+1)-valent linking group,
    R 1 is each independently a monovalent hydrocarbon group,
    L 2 is each independently a hydrolyzable group or a hydroxyl group,
    a1, a2, b1, and b2 are each independently an integer of 1 to 300,
    d and e are each independently an integer of 1 to 10,
    n is an integer from 0 to 2,
    g is an integer of 1 or more,
    (OCH 2 CH 2 ) b1 (OR 2 ) a1 is such that (OCH 2 CH 2 ) and (OR 2 ) may be combined in any order, and when at least one of a1 and b1 is 2 or more, It can be combined randomly or in blocks,
    (R 2 O) a2 (CH 2 CH 2 O) b2 , (R 2 O) and (CH 2 CH 2 O) may be bonded in any order, and at least one of a2 and b2 is 2 or more If , it can be combined randomly or in blocks,
    When the sum of d a2 and e a1 is Sa, and the sum of d b2 and e b1 is Sb, the ratio of Sa to the sum of Sa and Sb is Sa/(Sa+Sb). The value is between 0.2 and 0.8.
  4.  前記式(1)中のgが2以上である、請求項3に記載の化合物。 The compound according to claim 3, wherein g in the formula (1) is 2 or more.
  5.  請求項1~4のいずれか1項に記載の化合物と、液状媒体と、を含む組成物。 A composition comprising the compound according to any one of claims 1 to 4 and a liquid medium.
  6.  請求項1~4のいずれか1項に記載の化合物を含む、表面処理剤。 A surface treatment agent comprising the compound according to any one of claims 1 to 4.
  7.  さらに液状媒体を含む、請求項6に記載の表面処理剤。 The surface treatment agent according to claim 6, further comprising a liquid medium.
  8.  基材に対して、請求項6に記載の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造する、物品の製造方法。 A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent according to claim 6, and manufacturing an article in which a surface treatment layer is formed on the base material.
  9.  基材に対して、請求項7に記載の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造する、物品の製造方法。 A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent according to claim 7, and manufacturing an article in which a surface treatment layer is formed on the base material.
  10.  基材と、前記基材上に配置され、請求項6に記載の表面処理剤で表面処理された表面処理層と、を含む物品。 An article comprising a base material and a surface treatment layer disposed on the base material and surface treated with the surface treatment agent according to claim 6.
  11.  前記表面処理層の表面における水の接触角が7度以下である、請求項10に記載の物品。 The article according to claim 10, wherein the surface treatment layer has a water contact angle of 7 degrees or less.
  12.  前記物品が光学部材である、請求項10に記載の物品。 The article according to claim 10, wherein the article is an optical member.
  13.  前記物品が光学部材である、請求項11に記載の物品。 The article according to claim 11, wherein the article is an optical member.
  14.  前記物品がディスプレイ又はタッチパネルである、請求項10に記載の物品。 The article according to claim 10, wherein the article is a display or a touch panel.
  15.  前記物品がディスプレイ又はタッチパネルである、請求項11に記載の物品。 The article according to claim 11, wherein the article is a display or a touch panel.
PCT/JP2023/015681 2022-04-26 2023-04-19 Compound, composition, surface treatment agent, method for producing article, and article WO2023210470A1 (en)

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