WO2023204020A1 - Compound, composition, surface treating agent, method for producing article, and article - Google Patents

Compound, composition, surface treating agent, method for producing article, and article Download PDF

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Publication number
WO2023204020A1
WO2023204020A1 PCT/JP2023/013997 JP2023013997W WO2023204020A1 WO 2023204020 A1 WO2023204020 A1 WO 2023204020A1 JP 2023013997 W JP2023013997 W JP 2023013997W WO 2023204020 A1 WO2023204020 A1 WO 2023204020A1
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group
carbon atoms
aromatic ring
compound
ring
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PCT/JP2023/013997
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French (fr)
Japanese (ja)
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愛理 榊原
雄二郎 富塚
元志 青山
弘毅 渡邉
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Agc株式会社
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Publication of WO2023204020A1 publication Critical patent/WO2023204020A1/en

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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02Silicon compounds
    • C07F7/21Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/18Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material

Definitions

  • the present disclosure relates to compounds, compositions, surface treatment agents, methods of manufacturing articles, and articles.
  • Patent Document 1 describes a surface treatment agent containing an organosilane compound having a phenyl group.
  • Patent Document 2 describes a coating composition containing a silane compound having a specific structure having an aromatic ring.
  • the present disclosure relates to a compound capable of imparting good wear resistance to a substrate, a composition and a surface treatment agent containing the compound, and an article using the surface treatment agent and a method for manufacturing the article.
  • the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents independently has a halogen atom, a hydroxyl group, or a carbon number 1 to 10.
  • alkyl group having 1 to 10 carbon atoms haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where , R s are each independently a hydrogen atom or an alkyl group, the compound according to ⁇ 1> or ⁇ 2>.
  • Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms
  • a divalent group containing at least one partial structure selected from Y 1 is a single bond when g is 1, and is a (g + 1) valent linking group when g is 2 or more, R is each independently a monovalent hydrocarbon group, L is each independently a hydrolyzable group or a hydroxyl group, n is an integer from 0 to 2, g is an integer of 1 or more.
  • R is each independently a monovalent hydrocarbon group
  • L is each independently a hydrolyzable group or a hydroxyl group
  • n is an integer from 0 to 2
  • g is an integer of 1 or more.
  • ⁇ 6> The compound according to ⁇ 4> or ⁇ 5>, wherein the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group is a benzene ring, a naphthalene ring, or a pyridine ring.
  • the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents independently has a halogen atom, a hydroxyl group, a carbon number 1 to 10 alkyl group having 1 to 10 carbon atoms, haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where , R s are each independently a hydrogen atom or an alkyl group, the compound according to any one of ⁇ 4> to ⁇ 6>.
  • Ar-Z-Y 11 (D) g1 ...(1-1)
  • Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms
  • a composition comprising the compound according to any one of ⁇ 1> to ⁇ 7> and a liquid medium.
  • a surface treatment agent comprising the compound according to any one of ⁇ 1> to ⁇ 7>.
  • ⁇ 12> A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent described in ⁇ 10> or ⁇ 11> to manufacture an article in which a surface treatment layer is formed on the base material. .
  • An article comprising a base material and a surface treatment layer disposed on the base material and surface treated with the surface treatment agent according to ⁇ 10>.
  • ⁇ 14> The article according to ⁇ 13>, wherein the article is an optical member.
  • ⁇ 15> The article according to ⁇ 14>, wherein the article is a display or a touch panel.
  • a compound that can impart good wear resistance to a substrate a composition and a surface treatment agent containing the compound, and an article and a method for manufacturing the article using the surface treatment agent.
  • step includes not only a step that is independent from other steps, but also a step that cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved. .
  • numerical ranges indicated using “ ⁇ ” include the numerical values written before and after " ⁇ " as minimum and maximum values, respectively.
  • each component may contain multiple types of corresponding substances. If there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition, unless otherwise specified. means quantity.
  • the term “layer” or “film” refers to the case where the layer or film is formed only in a part of the region, in addition to the case where the layer or film is formed in the entire region when observing the region where the layer or film is present. This also includes cases where it is formed.
  • the term “surface treated layer” refers to a layer formed on the surface of a base material by surface treatment.
  • a compound or group is represented by a specific formula (X)
  • the compound or group represented by the formula (X) may be referred to as a compound (X) and a group (X), respectively.
  • the carbon number X in the expression "an aromatic ring group having carbon number X" represents the carbon number of the atomic group constituting the ring, and does not include the carbon number of the substituent.
  • a (poly)oxyalkylene group means an oxyalkylene group or a polyoxyalkylene group.
  • a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms will also be referred to as a "specific aromatic ring group”.
  • the specific aromatic ring group and the reactive silyl group are present at the end of the compound.
  • the specific partial structure is preferably present inside the compound, and between the specific aromatic ring group and the reactive silyl group.
  • the specific partial structure may be directly bonded to each of the specific aromatic ring group and the reactive silyl group, or may be bonded to each of the specific aromatic ring group and the reactive silyl group via a linking group. Therefore, the compound of the present disclosure is preferably a compound in which a specific aromatic ring group, a specific partial structure, and a reactive silyl group are bonded in this order directly or via a linking group.
  • the monovalent aromatic ring group in the specific aromatic ring group means a monovalent group obtained by removing one hydrogen atom from an aromatic ring.
  • a linking group such as a biphenyl group, phenylmethylphenyl group, or phenoxyphenyl group
  • the monovalent group that is the terminal aromatic ring is used as the compound of the present disclosure. It shall be classified as a specific aromatic ring group.
  • the aromatic ring in the specific aromatic ring group may be an aromatic hydrocarbon ring or an aromatic heterocycle, and from the viewpoint of excellent water repellency and lipophilicity, an aromatic hydrocarbon ring that does not contain a hetero atom is preferred. preferable.
  • the aromatic ring in the specific aromatic ring group may be a monocyclic ring or a condensed polycyclic ring.
  • the specific aromatic ring group preferably has 5 to 10 carbon atoms, more preferably 6 to 8 carbon atoms.
  • the aromatic rings include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, an indene ring, an azulene ring, a fluorene ring, a pyrene ring; a furan ring, a thiophene ring, a pyrrole ring, an imidazole ring, a pyridine ring, a pyrimidine ring, and a pyrazine ring.
  • benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, indene rings, azulene rings, and fluorene rings are preferred.
  • benzene rings, naphthalene rings, and pyridine rings are preferred, benzene rings and naphthalene rings are more preferred, and benzene rings are even more preferred.
  • the aromatic ring may or may not have a substituent.
  • the number of substituents may be 1 to 15, preferably 1 to 9, and more preferably 1 to 7.
  • substituents include halogen atoms, hydroxyl groups, alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, haloalkyl groups having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O) R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , -C (O)Rs etc.
  • each R s is independently a hydrogen atom or an alkyl group (preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and still more preferably a methyl group).
  • the substituent is preferably a substituent that does not contain a halogen atom (for example, a fluorine atom), such as a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, -OC(O) R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and - C(O) Rs is more preferred.
  • a halogen atom for example, a fluorine atom
  • the substituent is preferably a substituent that does not contain a hetero atom (eg, an oxygen atom, a nitrogen atom, and a sulfur atom), and an alkyl group is preferable.
  • a hetero atom eg, an oxygen atom, a nitrogen atom, and a sulfur atom
  • the aromatic ring has no substituent.
  • each substituent may be the same or different from each other.
  • the number of specific aromatic ring groups in the compound of the present disclosure may be one or more, and is preferably one.
  • each specific aromatic ring group may be the same or different from each other.
  • the specific partial structure is selected from the following structures.
  • A Straight chain alkylene group having 17 or more carbon atoms (hereinafter also referred to as “specific partial structure A”).
  • C Substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms (hereinafter also referred to as “specific partial structure C").
  • the compound of the present disclosure may contain any one specific partial structure, or may contain two or more specific partial structures. When the compound of the present disclosure contains two or more specific partial structures, each specific partial structure may be the same or different from each other.
  • the compound of the present disclosure includes two or more specific partial structures means that the compound of the present disclosure includes two or more specific partial structures A, two or more specific partial structures B, and the specific partial structure C. Examples include cases in which two or more of the specific partial structures A to C are included, and cases in which any combination of specific partial structures A to C is included.
  • the linear alkylene group in specific partial structure A means an unsubstituted linear alkylene group.
  • the number of carbon atoms in the specific partial structure A is preferably 18 or more from the viewpoint of improving water repellency. From the viewpoint of ease of manufacture, the carbon number is preferably 36 or less, more preferably 28 or less, and even more preferably 24 or less. From this point of view, the number of carbon atoms is preferably 17 to 36, more preferably 18 to 28, and even more preferably 18 to 24. The number of carbon atoms may be 21 or more.
  • a plurality of specific partial structures B may be adjacent to each other to form a conjugated double bond.
  • the plurality of specific partial structures B do not need to form a conjugated double bond.
  • the specific partial structure B may be either cis or trans, and preferably trans.
  • the position of the specific partial structure B in the compound is not particularly limited.
  • the specific partial structure B is preferably located adjacent to the specific aromatic ring group (ie, -CH ⁇ CH- is directly bonded to the aromatic ring of the specific aromatic ring group). This expands the conjugated structure of the specific aromatic ring group, so it is thought that better lipophilicity and lower fingerprint visibility are exhibited.
  • the specific partial structure C is a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms.
  • the divalent aromatic ring group in the specific partial structure C means a divalent group obtained by removing two hydrogen atoms from an aromatic ring.
  • the position of the specific partial structure C in the compound is not particularly limited, and the specific partial structure C may or may not be adjacent to a specific aromatic ring group, and may or may not be adjacent to a reactive silyl group.
  • the aromatic ring is preferably located adjacent to the specific aromatic ring group. This expands the conjugated structure of the specific aromatic ring group, so it is thought that better lipophilicity and lower fingerprint visibility are exhibited.
  • the substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms in the specific partial structure C includes the aromatic rings exemplified as the aromatic ring in the specific aromatic ring group.
  • aromatic rings exemplified as the aromatic ring in the specific aromatic ring group.
  • benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, indene rings, azulene rings, and fluorene rings are preferred.
  • benzene rings, naphthalene rings, and pyridine rings are preferred, benzene rings and naphthalene rings are more preferred, and benzene rings are even more preferred.
  • the aromatic ring may or may not have a substituent.
  • the number of substituents may be 1 to 14, preferably 1 to 8, and more preferably 1 to 6.
  • the substituent include the substituents exemplified as substituents that the aromatic ring in the specific aromatic ring group may have.
  • the substituent is preferably a substituent that does not contain a hetero atom (eg, an oxygen atom, a nitrogen atom, and a sulfur atom), and an alkyl group is preferable.
  • a hetero atom eg, an oxygen atom, a nitrogen atom, and a sulfur atom
  • it is preferable that the aromatic ring has no substituent.
  • each substituent may be the same or different from each other.
  • a reactive silyl group means a group in which a reactive group is bonded to a Si atom.
  • the reactive group is preferably a hydrolyzable group or a hydroxyl group.
  • Hydrolyzable is a group that becomes a hydroxyl group through a hydrolysis reaction. That is, the hydrolyzable silyl group represented by Si-L becomes a silanol group represented by Si-OH through a hydrolysis reaction. The silanol groups further react among themselves to form Si--O--Si bonds. Further, the silanol group can undergo a dehydration condensation reaction with a silanol group derived from an oxide present on the surface of the base material to form a Si--O--Si bond.
  • the hydrolyzable group include an alkoxy group, an aryloxy group, a halogen atom, an acyl group, an acyloxy group, and an isocyanato group (-NCO).
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
  • the aryl group of the aryloxy group includes a heteroaryl group.
  • the halogen atom is preferably a chlorine atom.
  • the acyl group is preferably an acyl group having 1 to 6 carbon atoms.
  • the acyloxy group is preferably an acyloxy group having 1 to 6 carbon atoms.
  • the reactive silyl group is preferably an alkoxysilyl group or a trichlorosilyl group. From the viewpoint of ease of handling by-products generated in the reaction with the base material, the reactive silyl group is more preferably an alkoxysilyl group.
  • the alkoxysilyl group is preferably a dialkoxysilyl group or a trialkoxysilyl group, and more preferably a trialkoxysilyl group.
  • the number of reactive silyl groups that the compound of the present disclosure has is one or more.
  • the number of reactive silyl groups is preferably 1 to 15, more preferably 1 to 6, from the viewpoint of the surface treatment layer having excellent abrasion resistance and fingerprint removability.
  • the number of reactive silyl groups is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3. preferable.
  • the number of reactive silyl groups is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1. preferable.
  • R is each independently a monovalent hydrocarbon group
  • L is each independently a hydrolyzable group or a hydroxyl group
  • n is an integer from 0 to 2.
  • the multiple groups (2) may be the same or different. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of groups (2) are the same.
  • Each R is independently a monovalent hydrocarbon group, preferably a monovalent saturated hydrocarbon group.
  • the number of carbon atoms in R is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.
  • the hydrolyzable group is preferably the one described above.
  • L is preferably an alkoxy group (preferably an alkoxy group having 1 to 4 carbon atoms) or a halogen atom from the viewpoint of ease of manufacturing the compound.
  • L is preferably an alkoxy group having 1 to 4 carbon atoms, from the viewpoint of less outgassing during coating and better storage stability of the compound.
  • L is more preferably an ethoxy group.
  • L is more preferably a methoxy group.
  • at least one L is preferably the above group, and more preferably all L are the above groups.
  • n is an integer of 0 to 2, preferably 0 or 1, and more preferably 0.
  • the presence of a plurality of L's makes the adhesion of the surface treatment layer to the base material stronger.
  • n is 1 or less, the plurality of L's present in one molecule may be the same or different from each other. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of L's are the same.
  • n is 2
  • multiple R's present in one molecule may be the same or different from each other. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that a plurality of R's are the same.
  • the specific partial structure may be bonded to the specific aromatic ring group and the reactive silyl group directly or via a linking group.
  • a linking group that connects the specific partial structure and the specific aromatic ring group "a divalent linking group that may exist between the specific partial structure and Ar” in Z in formula (1) described below is Can be mentioned.
  • the linking group that connects the specific partial structure and the reactive silyl group "existing between the specific partial structure and Y 1 [-Si(R) n L 3-n ] g " in formula (1) described below is used. (g+1)-valent linking group represented by Y 1 , and combinations thereof.
  • the linking group that connects the specific partial structure and the reactive silyl group may or may not have an organosiloxane residue.
  • the two or more specific partial structures may be bonded directly or via a linking group.
  • the linking group that connects specific partial structures include "a divalent linking group that may exist between a plurality of specific partial structures" in Z in formula (1) described below.
  • the linking group that connects the specific partial structures may or may not have an organosiloxane residue.
  • the compound of the present disclosure may or may not contain a halogen atom (for example, a fluorine atom).
  • a halogen atom for example, a fluorine atom
  • the compound of the present disclosure preferably does not contain a halogen atom (eg, a fluorine atom).
  • the compound of the present disclosure may or may not have an organosiloxane residue.
  • the compound of the present disclosure is preferably a compound represented by the following formula (1) from the viewpoint of excellent wear resistance.
  • Ar-Z-Y 1 [-Si(R) n L 3-n ] g ...(1)
  • Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms
  • a divalent group containing at least one partial structure selected from Y 1 is a single bond when g is 1, and is a (g + 1) valent linking group when g is 2 or more, R is each independently a monovalent hydrocarbon group, L is each independently a hydrolyzable group or a hydroxyl group, n is an integer from 0 to 2, g is an integer of 1 or more.
  • Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms. Details of Ar are the same as those of the specific aromatic ring group described above.
  • (A) to (C) have the same meanings as the above-mentioned specific partial structures A to C, respectively.
  • Z may include any one specific partial structure, or may include two or more specific partial structures. When Z includes two or more specific partial structures, the specific partial structures may be the same or different from each other. Cases in which "Z includes two or more specific substructures" include cases where Z includes two or more specific substructures A, two or more specific substructures B, and two or more specific substructures C. , and any combination of specific partial structures A to C.
  • the specific partial structure in Z and Ar may be bonded directly or may be bonded via a divalent linking group.
  • the specific partial structure in Z and Y 1 [-Si(R) n L 3-n ] g may be directly bonded or may be bonded via a divalent linking group.
  • the plurality of specific partial structures may be directly bonded or may be bonded via a divalent linking group.
  • any of the above-mentioned "divalent linking groups" in Z does not include a specific partial structure. Further, it is assumed that no alkylene group in the "bivalent linking group" is adjacent to the specific partial structure A. Z may or may not have an organosiloxane residue.
  • Divalent linking groups that may exist between the specific partial structure and Ar include -O-, -S-, -SO 2 -, -N(R d )-, -C(O)- , -Si(R a ) 2 -, and combinations thereof; divalent hydrocarbon groups; divalent organopolysiloxane residues; and combinations thereof.
  • the above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group.
  • the R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • Examples of the divalent hydrocarbon group include a saturated hydrocarbon group and an unsaturated hydrocarbon group.
  • the divalent hydrocarbon group may be linear, branched, or cyclic.
  • Examples of the divalent hydrocarbon group include an alkylene group and an alkynylene group.
  • the alkylene group preferably has 1 to 16 carbon atoms, and the alkynylene group preferably has 2 to 20 carbon atoms.
  • the combinations of -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, and -Si(R a ) 2 - include -OC(O)-, -C(O)O-, -C(O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, - Examples include N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, and the like.
  • the divalent linking group includes an alkylene group having 1 to 16 carbon atoms, -OC(O)-, -O-, -N(R d )C(O)-, -NR d -, -S-, -SC(O)-, and combinations thereof are preferred.
  • the divalent linking group that may exist between the specific partial structure in Z and Y 1 [-Si(R) n L 3-n ] g is the divalent linking group that exists between the specific partial structure and Ar.
  • the divalent linking group includes an alkylene group having 1 to 16 carbon atoms; and -OC(O)-, -C(O)O-, -C(O)N(R d )- , -N(R d )C(O)-, and combinations of these with an alkylene group having 1 to 16 carbon atoms are preferred.
  • the divalent linking group that may exist between a plurality of specific partial structures include those mentioned above as the divalent linking group that may exist between the specific partial structure and Ar.
  • the divalent linking group includes an alkylene group having 1 to 16 carbon atoms, -OC(O)-, -O-, -N(R d )C(O)-, -NR d -, -S-, -SC(O)-, and combinations thereof are preferred.
  • Z contains a plurality of the divalent linking groups
  • the plurality of divalent linking groups may be the same or different from each other.
  • Y 1 is a single bond when g is 1, and is a (g+1)-valent linking group when g is 2 or more.
  • the (g+1)-valent linking group represented by Y 1 includes a hydrocarbon group; a carbon atom, a nitrogen atom, a silicon atom, a cyclic group, and a di- to octa-valent organopolysiloxane residue; and combinations thereof.
  • R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group.
  • the R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • hydrocarbon group examples include a saturated hydrocarbon group and an unsaturated hydrocarbon group.
  • the hydrocarbon group may be linear, branched, or cyclic.
  • Hydrocarbon groups include alkylene groups and alkynylene groups.
  • the alkylene group preferably has 1 to 16 carbon atoms, and the alkynylene group preferably has 2 to 20 carbon atoms.
  • the hydrocarbon group has -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, -Si(R a ) 2 -, Or you may have a combination of these.
  • the combinations of -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, and -Si(R a ) 2 - include -OC(O)-, -C(O)O-, -C(O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, - Examples include N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, and the like.
  • Y 1 Si(R) n L 3-n is excluded from formula (3-1A), formula (3-1B), and formulas (3-1A-2) to (3-1A-7) described later. Other groups may also be mentioned.
  • Y 1 may be groups (g2-1) to (g2-13) described below.
  • g is an integer of 1 or more. In one embodiment, g is preferably from 1 to 15, more preferably from 1 to 6, from the viewpoint of the abrasion resistance and fingerprint removability of the surface treatment layer. In one embodiment, g is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3 from the viewpoint of excellent wear resistance of the surface treatment layer. In one embodiment, g is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1 from the viewpoint of excellent fingerprint removability of the surface treatment layer.
  • the group represented by Y 1 [-Si(R) n L 3-n ] g in formula (1) is [-Si(R) n L 3-n ], the group (3-1A), or the group (3-1B) is preferred.
  • X 31 is a carbon atom, a nitrogen atom, a silicon atom, a di- to octavalent organopolysiloxane residue, or a group having a (h+i+1)-valent ring;
  • Q b is a single bond or a divalent linking group,
  • R 31 is a hydrogen atom, a hydroxyl group or an alkyl group, h is an integer of 2 or more, i is an integer of 0 or more,
  • the definitions and specific examples of R, L, and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
  • R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
  • Q d is a single bond or an alkylene group
  • R 33 is a hydrogen atom or a halogen atom
  • y is an integer from 2 to 10
  • the definitions and specific examples of R, L, and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
  • X 31 is a carbon atom, a nitrogen atom, a silicon atom, a 2- to 8-valent organopolysiloxane residue, or a group having a (h+i+1)-valent ring.
  • divalent to octavalent organopolysiloxane residues include divalent organopolysiloxane residues and (w2+1)-valent organopolysiloxane residues described below.
  • the ring in X 31 may be a monocyclic ring, a fused polycyclic ring, a bridged ring, a spiro ring, or an assembled polycyclic ring, and the atoms constituting the ring may be a carbocyclic ring consisting only of carbon atoms, or a divalent ring.
  • a heterocycle consisting of a heteroatom having the above valence and a carbon atom may also be used.
  • the bond between atoms constituting the ring may be a single bond or a multiple bond.
  • the ring may be an aromatic ring or a non-aromatic ring.
  • the monocyclic ring is preferably a 4- to 8-membered ring, more preferably a 5-membered ring or a 6-membered ring.
  • the fused polycyclic ring is preferably a fused polycyclic ring in which two or more 4- to 8-membered rings are fused together, and fused polycyclic rings in which 2 or 3 rings selected from 5-membered rings and 6-membered rings are bonded together; A fused polycyclic ring in which one or two rings selected from membered rings and six-membered rings and one four-membered ring are bonded is more preferred.
  • the bridged ring is preferably a bridged ring whose largest ring is a 5- or 6-membered ring
  • the spiro ring is preferably a spiro ring consisting of two 4- to 6-membered rings.
  • a collective polycyclic ring two or three rings selected from 5-membered rings and 6-membered rings are bonded via a single bond, 1 to 3 carbon atoms, or 1 heteroatom with a valence of 2 or 3.
  • a set of polycyclic rings is preferred.
  • the hetero atoms constituting the ring are preferably nitrogen atoms, oxygen atoms, and sulfur atoms, and more preferably nitrogen atoms and oxygen atoms.
  • the number of heteroatoms constituting the ring is preferably 3 or less. Furthermore, when the number of heteroatoms constituting the ring is two or more, these heteroatoms may be the same or different.
  • the ring in X 31 is a 3- to 8-membered aliphatic ring, a benzene ring, a 3- to 8-membered aliphatic ring, from the viewpoint of easy production of the compound, and from the viewpoint of further improving the abrasion resistance, light resistance, and chemical resistance of the surface treatment layer.
  • 8-membered heterocycles fused rings in which two or three of these rings are fused together, bridged rings in which the largest ring is a 5- or 6-membered ring, and two of these rings
  • One type selected from the group consisting of an aggregated polycyclic ring having the above and whose connecting group is a single bond, an alkylene group having 3 or less carbon atoms, an oxygen atom or a sulfur atom is preferable.
  • Preferred rings include a benzene ring, a 5- or 6-membered aliphatic ring, a 5- or 6-membered heterocycle having a nitrogen atom or an oxygen atom, and a 5- or 6-membered carbon ring and a 4- to 6-membered heterocycle.
  • rings include the rings shown below, 1,3-cyclohexadiene ring, 1,4-cyclohexadiene ring, anthracene ring, cyclopropane ring, decahydronaphthalene ring, norbornene ring, norbornadiene ring, furan ring, Examples include a pyrrole ring, a thiophene ring, a pyrazine ring, a morpholine ring, an aziridine ring, an isoquinoline ring, an oxazole ring, an isoxazole ring, a thiazole ring, an imidazole ring, a pyrazole ring, a pyran ring, a pyridazine ring, a pyrimidine ring, and an indene ring.
  • any two of Z, (-Q b -Si(R) n L 3-n ), and -R 31 may be bonded to that one carbon atom. It is preferable that Z and Q b are bonded to different ring constituent atoms.
  • Each of the i R 31s may be bonded to a separate ring atom, or two of the i R 31s may be bonded to one ring carbon atom. There may be two or more ring-constituting carbon atoms to which two R 31s are bonded.
  • X 31 is a group having a carbon atom, a nitrogen atom, a silicon atom, a 4- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring, from the viewpoint of improving the abrasion resistance of the surface treatment layer. is preferable, and carbon atom is more preferable.
  • Q b is a single bond or a divalent linking group.
  • divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof.
  • the above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group.
  • R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • divalent hydrocarbon groups include saturated hydrocarbon groups and unsaturated hydrocarbon groups.
  • the hydrocarbon group may be linear, branched, or cyclic.
  • Hydrocarbon groups include alkylene groups and alkynylene groups.
  • the alkylene group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms.
  • the alkynylene group preferably has 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms.
  • Examples of groups combining two or more of the above-mentioned types include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )-, - N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, a combination of these and an alkylene group, and the like.
  • Q b is preferably a single bond or an alkylene group.
  • R 31 is a hydrogen atom, a hydroxyl group or an alkyl group.
  • the number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.
  • h is an integer of 2 or more, and i is an integer of 0 or more.
  • X 31 is a nitrogen atom, h is 2 and i is 1.
  • X 31 is a group having a (h+i+1)-valent ring
  • h is an integer of 2 to 7
  • i is an integer of 0 to 5
  • Two or more (-Q b -Si(R) n L 3-n ) may be the same or different.
  • two or more (-R 31 )s may be the same or different.
  • i is preferably 0 from the viewpoint of improving the wear resistance of the surface treatment layer.
  • R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
  • the alkyl group a methyl group is preferred.
  • Q d is a single bond or an alkylene group.
  • the alkylene group preferably has 1 to 16 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 carbon atoms. From the viewpoint of easy production of the compound, Q d is preferably a single bond or -CH 2 -.
  • R 33 is a hydrogen atom or a halogen atom, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
  • y is an integer from 2 to 10, preferably from 2 to 6.
  • Two or more [C(R 32 )(-Q d -Si(R) n L 3-n )-CH 2 -] may be the same or different.
  • the group represented by Y 1 [-Si(R) n L 3-n ] g in formula (1) is preferably groups (3-1A-1) to (3-1A-7).
  • Y 1 [-Si(R) n L 3-n ] g is a group (3-1A-1).
  • Groups (3-1A-2) to (3-1A-7) are specific examples of group (3-1A).
  • Q b2 is an alkylene group or a group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b2 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the number of carbon atoms in the group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b2 is 2 to 20. is preferable, 2 to 10 is more preferable, and 2 to 6 is even more preferable.
  • the two [-Q b2 -Si(R) n L 3-n ] may be the same or different.
  • group (3-1A-2) include the following groups.
  • * represents the bonding position with Z.
  • ⁇ in (CH 2 ) ⁇ bonded to the reactive silyl group is an integer representing the number of methylene groups, preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, It may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • a plurality of ⁇ 's contained in the same compound may be the same or different, but are preferably the same. For example, all of the plurality of ⁇ s contained in the same compound are 2, 3, 8, 9, and 11. The same applies below.
  • R g is a hydrogen atom, a hydroxyl group, or an alkyl group. From the viewpoint of easy production of the compound, R g is preferably a hydrogen atom or an alkyl group.
  • the alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably a methyl group.
  • Q b3 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b3 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms, represented by Q b3 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
  • Q b3 is preferably -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, or -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound.
  • the two [-Q b3 -Si(R) n L 3-n ] may be the same or different.
  • group (3-1A-3) include the following groups.
  • * represents the bonding position with Z.
  • Q b4 is an alkylene group, and the alkylene group is -O-, -C(O)N(R d )- (the definition of R d is as described above) ), may or may not have a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group.
  • the alkylene group has -O- or a silphenylene skeleton group, it is preferable to have -O- or a silphenylene skeleton group between carbon atoms.
  • the terminal between carbon atoms or the side bonded to (O) u4 preferably has these groups.
  • the number of carbon atoms in the alkylene group represented by Q b4 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the range may be from 1 to 10.
  • u4 is 0 or 1.
  • -(O) u4 -Q b4 - includes -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 from the viewpoint of easy production of the compound.
  • OCH 2 CH 2 CH 2 CH 2 CH 2 -, -OCH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -- and --CH 2 CH 2 CH 2 Si(CH 3 ) 2 PhSi(CH 3 ) 2 CH 2 CH 2 -- are preferred (however, the right side is bonded to Si).
  • w1 is 0 or 1, and 0 is more preferable. If there are two or more [-(O) u4 -Q b4 -Si(R) n L 3-n ], two or more [-(O) u4 -Q b4 -Si(R) n L 3- n ] may be the same or different. When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
  • group (3-1A-4) include the following groups.
  • * represents the bonding position with Z.
  • Q b5 is an alkylene group, or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms. It is.
  • the number of carbon atoms in the alkylene group represented by Q b5 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the number of carbon atoms in the group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b5 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable. From the viewpoint of easy production of the compound, Q b5 is preferably -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - (provided that the right side is Si(R) n L 3- bond to n ).
  • the three [-Q b5 -Si(R) n L 3-n ] may be the same or different.
  • group (3-1A-5) include the following groups.
  • * represents the bonding position with Z.
  • Z a is a (w2+1)-valent organopolysiloxane residue, or a (w2+1)-valent organopolysiloxane residue between the organopolysiloxane residues. It is a group having an alkylene group. w2 is an integer from 2 to 7. Examples of (w2+1)-valent organopolysiloxane residues and (w2+1)-valent groups having an alkylene group between organopolysiloxane residues include the following groups: . However, R a in the following formula is as described above.
  • Q b6 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
  • the number of carbon atoms in the alkylene group represented by Q b6 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
  • the carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b6 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
  • Q b6 -CH 2 CH 2 - and -CH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound.
  • w2 [-Q b6 -Si(R) n3 L 3-n ] may be the same or different.
  • group (3-1A-6) include the following groups.
  • * represents the bonding position with Z.
  • Z c is a (w3+w4+1)-valent hydrocarbon group.
  • w3 is an integer of 4 or more.
  • w4 is an integer greater than or equal to 0.
  • the definitions and preferred ranges of Q b4 and u4 are the same as the definitions of each symbol in group (3-1A-4).
  • Z c may consist of a hydrocarbon chain, may have an ether oxygen atom between carbon atoms of the hydrocarbon chain, and is preferably composed of a hydrocarbon chain.
  • the valence of Z c is preferably 5 to 20, more preferably 5 to 10, even more preferably 5 to 8, particularly preferably 5 to 6.
  • the number of carbon atoms in Z c is preferably 3 to 50, more preferably 4 to 40, even more preferably 5 to 30.
  • w3 is preferably from 4 to 20, more preferably from 4 to 16, even more preferably from 4 to 8, particularly preferably from 4 to 5.
  • w4 is preferably 0 to 10, more preferably 0 to 8, even more preferably 0 to 6, particularly preferably 0 to 3, and most preferably 0 to 1.
  • Two or more [-(O-Q b4 ) u4 -Si(R 1 ) n L 3-n ] may be the same or different.
  • group (3-1A-7) include the following groups.
  • * represents the bonding position with Z.
  • Y 1 in formula (1) may be groups (g2-1) to (g2-6).
  • * represents a bonding site with Z.
  • the * side is connected to Z, and the Q 22 , Q 23 , Q 24 , or Q 25 side is connected to [-Si(R) n L 3-n ].
  • Q 11 is a single bond, -O-, an alkylene group, or a bond between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 -, or It is a group having O-.
  • Q 22 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms, an alkylene group A group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si, or between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si and -C(O)NR 6 -, -C(O) It is a group having -, -NR 6 - or O-, and when two or more Q 22s exist, two or more Q 22s may be the same or different.
  • Q 23 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , two Q23s may be the same or different.
  • Q 24 is Q 22 when the atom in Z 1 to which Q 24 is bonded is a carbon atom, and is Q 23 when the atom in Z 1 to which Q 24 is bonded is a nitrogen atom, and two or more Q 24 exist. In this case, two or more Q24 's may be the same or different.
  • Q 25 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , Q 25 exists, two or more Q 25 may be the same or different.
  • Z 1 is a group having a (h2+1)-valent ring structure in which Z has a carbon atom or nitrogen atom to which Z is directly bonded, and Q 24 has a carbon atom or nitrogen atom to which Q 24 is directly bonded.
  • R e1 is a hydrogen atom or an alkyl group, and when two or more R e1s exist, two or more R e1s may be the same or different.
  • R e2 is a hydrogen atom, a hydroxyl group, an alkyl group, or an acyloxy group.
  • R e3 is an alkyl group.
  • R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
  • d2 is an integer from 0 to 3, preferably 1 or 2.
  • d4 is an integer from 0 to 3, preferably 2 or 3.
  • d2+d4 is an integer from 2 to 5, preferably 4 or 5.
  • e2 is 2 or 3.
  • h2 is an integer of 2 or more, preferably 2 or 3.
  • i2 is 2 or 3.
  • i3 is 2 or 3.
  • the number of carbon atoms in the alkylene groups of Q 11 , Q 22 , Q 23 , Q 24 , and Q 25 is preferably 1 to 30 from the viewpoint of excellent ease of manufacturing the compound and from the viewpoint of further improving the abrasion resistance of the surface treatment layer. It is preferably 1 to 20, more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
  • Examples of the ring structure in Z 1 include the ring structures described above, and preferred forms are also the same. Note that since Z and Q 24 are directly bonded to the ring structure of Z 1 , for example, an alkylene group is not bonded to the ring structure and Z and Q 24 are not bonded to the alkylene group.
  • the number of carbon atoms in the alkyl group of R e1 , R e2 or R e3 is preferably from 1 to 6, more preferably from 1 to 3, even more preferably from 1 to 2, from the viewpoint of excellent ease of manufacturing the compound.
  • the number of carbon atoms in the alkyl group portion of the acyloxy group of R e2 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
  • h2 is preferably 2 to 6, more preferably 2 to 4, and even more preferably 2 or 3, from the viewpoint of excellent ease of manufacturing the compound and further excellent wear resistance of the surface treatment layer.
  • Y 1 in formula (1) may be groups (g2-7) to (g2-13).
  • * indicates a bonding site with Z.
  • G 1 is a group (g3), and two or more G 1s in Y 1 may be the same or different.
  • the symbols other than G 1 are the same as those in equations (g2-1) to (g2-6).
  • -Si(R 8 ) 3-k3 (-Q 3 -) k3 ...(g3)
  • the Si side is connected to Q 22 , Q 23 , Q 24 , and Q 25 , and the Q 3 side is connected to [-Si(R) n L 3-n ].
  • R 8 is an alkyl group.
  • Q 3 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or -O- between carbon atoms of an alkylene group having 2 or more carbon atoms, or (OSi(R 9 ) 2 ) p -O-, and two or more Q 3 may be the same or different.
  • k3 is 2 or 3.
  • R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
  • R 9 is an alkyl group, a phenyl group, or an alkoxy group, and two R 9s may be the same or different.
  • p is an integer from 0 to 5, and when p is 2 or more, two or more (OSi(R 9 ) 2 ) may be the same or different.
  • the number of carbon atoms in the alkylene group of Q 3 is preferably 1 to 30, more preferably 1 to 20, more preferably 2 to 20, from the viewpoint of excellent ease of manufacturing the compound and from the viewpoint of further excellent wear resistance of the surface treatment layer. is more preferable, and may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
  • the number of carbon atoms in the alkyl group of R 8 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
  • the number of carbon atoms in the alkyl group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
  • the number of carbon atoms in the alkoxy group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent storage stability of the compound.
  • p is preferably 0 or 1.
  • Examples of the compound (1) include compounds of the following formula.
  • the compound of the following formula is preferred from the viewpoints of easy industrial production, ease of handling, and superior abrasion resistance of the surface treatment layer.
  • W in the compound of the following formula is the same as Ar-Z- in formula (1), and its preferred form is also the same.
  • Examples of the compound (1) in which Y 1 is a group (g2-1) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-2) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-3) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-4) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-5) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-6) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-7) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-8) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-9) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-10) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-11) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-12) include compounds of the following formula.
  • Examples of the compound (1) in which Y 1 is a group (g2-13) include compounds of the following formula.
  • Examples of the compounds of the present disclosure in which g is 2 or more in formula (1) and Y 1 is a group (3-1A-4) include the following compounds.
  • Examples of the compounds of the present disclosure in which g is 2 or more in formula (1) and Y 1 is a group (3-1A-6) include the following compounds.
  • the number average molecular weight (Mn) of the compound of the present disclosure is preferably 400 to 20,000, more preferably 500 to 18,000, and even more preferably 600 to 1,5000.
  • Mn is 400 or more, water repellency and abrasion resistance are excellent.
  • Mn is 20,000 or less, the viscosity can be easily controlled within an appropriate range, and solubility is improved, resulting in excellent handling properties during film formation.
  • Method for producing compound The method for producing the compound of the present disclosure is not particularly limited. Examples of synthetic schemes for compounds of the present disclosure are shown below.
  • the compound of the present disclosure is obtained by hydrosilylation of an intermediate represented by the following formula (1-1).
  • a divalent group containing at least one partial structure selected from Y11 is a single bond when g1 is 1, and is a (g1+1) valent linking group when g1 is 2 or more,
  • compositions of the present disclosure only needs to contain the compound of the present disclosure, and components other than the compound of the present disclosure are not particularly limited.
  • Compositions of the present disclosure preferably include a compound of the present disclosure and a liquid medium.
  • the composition of the present disclosure may be in a liquid state, and may be a solution or a dispersion.
  • the composition of the present disclosure only needs to contain the compound of the present disclosure, and may contain impurities such as by-products generated in the manufacturing process of the compound of the present disclosure.
  • the composition of the present disclosure may contain one type of compound of the present disclosure, or may contain two or more types of compounds of the present disclosure.
  • the content of the compound of the present disclosure is preferably 0.001 to 40% by mass, more preferably 0.01 to 20% by mass, and further preferably 0.1 to 10% by mass, based on the total amount of the composition of the present disclosure. preferable.
  • the content of the compound of the present disclosure may be 0.01 to 10% by mass, based on the total amount of the composition of the present disclosure, and 0. It may be 0.02 to 5% by weight, 0.03 to 3% by weight, or 0.05 to 2% by weight.
  • the liquid medium is preferably an organic solvent.
  • organic solvents include compounds consisting only of hydrogen atoms and carbon atoms, and compounds consisting only of hydrogen atoms, carbon atoms, and oxygen atoms.
  • examples include hydrocarbon-based organic solvents, ketone-based organic solvents, and ethers.
  • examples include organic solvents based on organic solvents, organic solvents based on esters, organic solvents based on glycol, and organic solvents based on alcohol.
  • hydrocarbon organic solvents include pentane, hexane, heptane, octane, hexadecane, isohexane, isooctane, isononane, cycloheptane, cyclohexane, bicyclohexyl, benzene, toluene, ethylbenzene, o-xylene, m-xylene, Examples include p-xylene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene, n-butylbenzene, sec-butylbenzene, and tert-butylbenzene.
  • ketone organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, 2-heptanone, 4-heptanone, 3,5,5-trimethyl-2-cyclohexen-1-one, and 3,5,5-trimethyl-2-cyclohexen-1-one. Examples include 3,5-trimethylcyclohexanone and isophorone.
  • ether organic solvents include diethyl ether, cyclopentyl methyl ether, tetrahydrofuran, and 1,4-dioxane.
  • ester organic solvents include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, tert-butyl acetate, amyl acetate, isoamyl acetate, ethyl 3-ethoxypropionate, and ethyl ethylene glycol lactate.
  • glycol-based organic solvents include ethylene glycol, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and ethylene glycol mono-2.
  • alcoholic organic solvents include methanol, ethanol, 1-propanol, isopropyl alcohol, n-butanol, diacetone alcohol, isobutanol, sec-butanol, tert-butanol, pentanol, 3-methyl-1,3 -Butanediol, 1,3-butanediol, 1,3-butylene glycol, octanediol, 2,4-diethylpentanediol, butylethylpropanediol, 2-methyl-1,3-propanediol, 4-hydroxy-4 -Methyl-2-pentanone, 2-ethyl-1-hexanol, 3,5,5-trimethyl-1-hexanol, isodecanol, isotridecanol, 3-methoxy-3-methyl-1-butanol, 2-methoxybutanol , 3-methoxybutanol, cyclo
  • examples of the organic solvent include halogenated organic solvents, nitrogen-containing compounds, sulfur-containing compounds, and siloxane compounds.
  • halogenated organic solvents include dichloromethane, chloroform, carbon tetrachloride, dichloroethane, chlorobenzene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, m-dichlorobenzene, 1,2,3-trichloropropane. can be mentioned.
  • nitrogen-containing compounds include nitrobenzene, acetonitrile, benzonitrile, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and 1,3-dimethyl-2-imidazolidinone.
  • sulfur-containing compounds include carbon disulfide and dimethyl sulfoxide.
  • siloxane compound include hexamethyldisiloxane, octamethyltrisiloxane, and decamethyltetrasiloxane.
  • the content of the liquid medium is preferably 60 to 99.999% by mass, more preferably 85 to 99.99% by mass, and even more preferably 90 to 99.9% by mass, based on the total amount of the composition of the present disclosure.
  • the content of the liquid medium may be 90-99.99% by weight, 95-99% by weight, based on the total amount of the composition of the present disclosure. It may be .98% by mass, 97 to 99.97% by mass, or 98 to 99.95% by mass.
  • the composition of the present disclosure may contain only one type of liquid medium, or may contain two or more types.
  • composition of the present disclosure may contain other components in addition to the compound of the present disclosure and the liquid medium, as long as the effects of the present disclosure are not impaired.
  • other components include known additives such as acid catalysts and basic catalysts that promote hydrolysis and condensation reactions of reactive silyl groups.
  • a metal compound having a hydrolyzable group is also referred to as a "specific metal compound”
  • Specific metal compounds include the following formulas (M1) to (M3).
  • M represents a trivalent or tetravalent metal atom.
  • Each of X b1 independently represents a hydrolyzable group.
  • Each of X b2 independently represents a siloxane skeleton-containing group.
  • Each of X b3 independently represents a hydrocarbon chain-containing group.
  • m1 is an integer from 2 to 4
  • m2 and m3 are each independently an integer of 0 to 2
  • When M is a trivalent metal atom, m1+m2+m3 is 3, and when M is a tetravalent metal atom, m1+m2+m3 is 4.
  • X b4 represents a hydrolyzable silane oligomer residue.
  • Each of X b5 independently represents a hydrolyzable group or an alkyl group having 1 to 4 carbon atoms.
  • X b6 and X b7 each independently represent a hydrolyzable group or a hydroxyl group.
  • Y b1 represents a divalent organic group.
  • the metal represented by M also includes semimetals such as Si and Ge.
  • M is preferably a trivalent metal or a tetravalent metal, more preferably Al, Fe, In, Hf, Si, Ti, Sn, and Zr, even more preferably Al, Si, Ti, and Zr, and particularly preferably Si. .
  • the hydrolyzable group represented by X b1 is the same as the hydrolyzable group represented by L in [-Si(R 1 ) n L 3-n ] in the above reactive silyl group. Examples include:
  • the siloxane skeleton-containing group represented by X b2 has a siloxane unit (-Si-O-) and may be linear or branched.
  • the siloxane unit is preferably a dialkylsilyloxy group, such as a dimethylsilyloxy group or a diethylsilyloxy group.
  • the number of repeating siloxane units in the siloxane skeleton-containing group is 1 or more, preferably 1 to 5, more preferably 1 to 4, and even more preferably 1 to 3.
  • the siloxane skeleton-containing group may include a divalent hydrocarbon group in a part of the siloxane skeleton.
  • some oxygen atoms in the siloxane skeleton may be replaced with divalent hydrocarbon groups.
  • the divalent hydrocarbon group include alkylene groups such as a methylene group, an ethylene group, a propylene group, and a butylene group.
  • a hydrolyzable group, a hydrocarbon group (preferably an alkyl group), etc. may be bonded to the terminal silicon atom of the siloxane skeleton-containing group.
  • the number of elements in the siloxane skeleton-containing group is preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. The number of elements is preferably 10 or more.
  • the siloxane skeleton-containing group is preferably a group represented by * -(O-Si(CH 3 ) 2 ) n CH 3 , where n is an integer from 1 to 5, and * represents a bond with an adjacent atom. Represents a part.
  • the hydrocarbon chain-containing group represented by X b3 may be a group consisting only of a hydrocarbon chain, or may be a group having an etheric oxygen atom between carbon atoms of the hydrocarbon chain.
  • the hydrocarbon chain may be straight or branched, preferably straight.
  • the hydrocarbon chain may be a saturated hydrocarbon chain or an unsaturated hydrocarbon chain, with a saturated hydrocarbon chain being preferred.
  • the number of carbon atoms in the hydrocarbon chain-containing group is preferably 1 to 3, more preferably 1 to 2, and even more preferably 1.
  • the hydrocarbon chain-containing group is preferably an alkyl group, more preferably a methyl group, an ethyl group, or a propyl group.
  • m1 is 3 or 4.
  • compound represented by formula (M1) compounds represented by the following formulas (M1-1) to (M1-5) where M is Si are preferable, and the compound represented by formula (M1-1) is More preferred.
  • compound represented by formula (M1-1) tetraethoxysilane, tetramethoxysilane, and triethoxymethylsilane are preferred.
  • the number of silicon atoms contained in the hydrolyzable silane oligomer residue represented by X b4 is preferably 3 or more, more preferably 5 or more, and even more preferably 7 or more.
  • the number of silicon atoms is preferably 15 or less, more preferably 13 or less, and even more preferably 10 or less.
  • the hydrolyzable silane oligomer residue may have an alkoxy group bonded to a silicon atom. Examples of the alkoxy group include methoxy group, ethoxy group, propoxy group, butoxy group, and methoxy group and ethoxy group are preferred.
  • the hydrolyzable silane oligomer residue may have one or more types of these alkoxy groups, and preferably has one type. Examples of the hydrolyzable silane oligomer residue include (C 2 H 5 O) 3 Si-(OSi(OC 2 H 5 ) 2 ) 4 O- * and the like.
  • * represents a bonding site with an adjacent atom.
  • the hydrolyzable group represented by X b5 is the same as the hydrolyzable group represented by L in [-Si(R 1 ) n L 3-n ] in the above reactive silyl group.
  • Examples include a cyano group, a hydrogen atom, and an allyl group, with an alkoxy group or an isocyanato group being preferred.
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
  • X b5 a hydrolyzable group is preferable.
  • Examples of the compound represented by formula (M2) include (H 5 C 2 O) 3 -Si-(OSi(OC 2 H 5 ) 2 ) 4 OC 2 H 5 and the like.
  • the compound represented by formula (M3) is a compound having a reactive silyl group at both ends of a divalent organic group, that is, bissilane.
  • the hydrolyzable groups represented by X b6 and X b7 include an alkoxy group, an acyloxy group, a ketoxime group, an alkenyloxy group, an amino group, an aminoxy group, an amide group, an isocyanato group, and a halogen atom.
  • an alkoxy group and an isocyanato group are preferred.
  • the alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms, more preferably a methoxy group or an ethoxy group.
  • X b6 and X b7 may be the same group or different groups. From the viewpoint of availability, it is preferable that X b6 and X b7 are the same group.
  • Y b1 is a divalent organic group that connects the reactive silyl groups at both ends.
  • the number of carbon atoms in Y b1 of the divalent organic group is preferably 1 to 8, more preferably 1 to 3.
  • Examples of Y b1 include an alkylene group, a phenylene group, and an alkylene group having an etheric oxygen atom between carbon atoms.
  • Examples of the compound represented by formula (M3) include (CH 3 O) 3 Si(CH 2 ) 2 Si(OCH 3 ) 3 , (C 2 H 5 O) 3 Si(CH 2 ) 2 Si(OC 2 H 5 ) 3 , (OCN) 3Si ( CH2 ) 2Si ( NCO ) 3 , Cl3Si( CH2 ) 2SiCl3 , ( CH3O ) 3Si ( CH2 ) 6Si ( OCH3 ) 3 , ( C2H5O ) 3Si ( CH2 ) 6Si ( OC2H5 ) 3 is mentioned.
  • the content of other components that may be included in the composition of the present disclosure is preferably 10% by mass or less, more preferably 1% by mass or less, based on the total amount of the composition of the present disclosure.
  • the content of the specific metal compound is preferably 0.01 to 30% by mass, more preferably 0.01 to 10% by mass based on the total amount of the composition of the present disclosure. , more preferably 0.05 to 5% by mass.
  • the total content of the compound of the present disclosure and other components is preferably 0.001 to 40% by mass, and 0.01% by mass, based on the total amount of the composition of the present disclosure.
  • the amount is more preferably 20% by weight, and even more preferably 0.01% to 10% by weight.
  • the solid content concentration of the composition of the present disclosure is a value calculated from the mass of the composition before heating and the mass after heating in a convection dryer at 120° C. for 4 hours.
  • composition of the present disclosure is useful for coating purposes and can be used as a coating liquid.
  • the surface treatment agent of the present disclosure comprises a compound of the present disclosure.
  • the surface treatment agent of the present disclosure may include the compound of the present disclosure and a liquid medium.
  • the surface treating agent of the present disclosure may be a composition of the present disclosure. Preferred embodiments of the liquid medium contained in the surface treatment agent are the same as those of the liquid medium contained in the composition of the present disclosure.
  • a surface treatment layer with excellent water repellency and abrasion resistance can be formed by using a surface treatment agent containing the compound of the present disclosure.
  • the article of the present disclosure includes a base material and a surface treatment layer surface treated with the surface treatment agent.
  • the surface treatment layer may be formed on a part of the surface of the base material, or may be formed on the entire surface of the base material.
  • the surface treatment layer may be spread over the surface of the base material in the form of a film, or may be scattered in the form of dots.
  • the compound of the present disclosure is contained in a state in which hydrolysis of some or all of the reactive silyl groups has proceeded, and a dehydration condensation reaction of the silanol groups has proceeded.
  • the thickness of the surface treatment layer is preferably 1 to 100 nm, more preferably 1 to 50 nm. If the thickness of the surface treatment layer is 1 nm or more, the effect of the surface treatment is likely to be sufficiently obtained. If the thickness of the surface treatment layer is 100 nm or less, the utilization efficiency is high.
  • the thickness of the surface treatment layer is determined by using an X-ray diffractometer for thin film analysis (product name "ATX-G", manufactured by RIGAKU) to obtain an interference pattern of reflected X-rays by the X-ray reflectance method. It can be calculated from the vibration period of
  • the type of base material is not particularly limited, and includes, for example, base materials that are required to have water repellency.
  • a base material for example, a base material that may be used in contact with another article (e.g., a stylus) or a person's fingers; a base material that may be held by a person's fingers during operation; , a mounting table).
  • the base material include metal, resin, glass, sapphire, ceramic, stone, fiber, nonwoven fabric, paper, wood, natural leather, artificial leather, and composite materials thereof.
  • the glass may be chemically strengthened.
  • Base materials include building materials, decorative building materials, interior goods, transportation equipment (e.g. automobiles), signboards, bulletin boards, drinking vessels, tableware, aquariums, ornamental equipment (e.g. frames, boxes), laboratory equipment, furniture, and textile products.
  • Packaging containers Glass or resin used for art, sports, games, etc.; Used for the exterior parts (excluding display parts) of devices such as mobile phones (e.g. smartphones), personal digital assistants, game consoles, remote controls, etc. Examples include glass or resin.
  • the shape of the base material may be plate-like or film-like.
  • touch panel base materials As the base material, touch panel base materials, display base materials, and eyeglass lenses are suitable, and touch panel base materials are particularly suitable.
  • touch panel base materials As the material for the touch panel base material, glass or transparent resin is preferable.
  • the base material may be a base material that has been subjected to surface treatment such as corona discharge treatment, plasma treatment, plasma graft polymerization treatment, etc. on one surface or both surfaces.
  • a surface-treated base material has better adhesion with the surface-treated layer, and the abrasion resistance of the surface-treated layer is further improved. Therefore, it is preferable to perform surface treatment on the surface of the base material that is in contact with the surface treatment layer.
  • the surface-treated base material is provided with a base layer, which will be described later, the adhesion with the base layer is better, and the wear resistance of the surface-treated layer is further improved. Therefore, when a base layer is provided, it is preferable to perform a surface treatment on the surface of the base material that is in contact with the base layer.
  • the surface treatment layer may be provided directly on the surface of the base material, or a base layer may be provided between the base material and the surface treatment layer.
  • the article of the present disclosure includes a base material, a base layer disposed on the base material, and a surface treatment of the present disclosure disposed on the base layer. It is preferable to include a surface treatment layer whose surface is treated with an agent.
  • the base layer includes silicon and at least one selected from the group consisting of a group 1 element, a group 2 element, a group 4 element, a group 5 element, a group 13 element, and a group 15 element of the periodic table.
  • a layer containing an oxide containing a specific element is preferable.
  • Group 1 elements of the periodic table mean lithium, sodium, potassium, rubidium, and cesium.
  • Group 1 elements lithium, sodium, and potassium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • the underlayer may contain two or more types of Group 1 elements.
  • Group 2 elements of the periodic table mean beryllium, magnesium, calcium, strontium, and barium.
  • Group 2 elements magnesium, calcium, and barium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • magnesium and calcium are more preferable.
  • the underlayer may contain two or more types of Group 2 elements.
  • Group 4 elements of the periodic table mean titanium, zirconium, and hafnium.
  • Group 4 element titanium and zirconium are preferable from the viewpoint of being able to form a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Titanium is more preferred.
  • the base layer may contain two or more types of Group 4 elements.
  • Group 5 elements of the periodic table mean vanadium, niobium, and tantalum.
  • Group 5 element vanadium is particularly preferable from the viewpoint of providing better wear resistance of the surface treatment layer.
  • the underlayer may contain two or more types of Group 5 elements.
  • Group 13 elements of the periodic table mean boron, aluminum, gallium, and indium.
  • Group 13 elements boron, aluminum, and gallium are selected from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects, or from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • boron and aluminum are more preferable.
  • the base layer may contain two or more types of Group 13 elements.
  • Group 15 elements of the periodic table mean nitrogen, phosphorus, arsenic, antimony, and bismuth.
  • Group 15 elements, phosphorus, antimony, and bismuth are used from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples.
  • phosphorus and bismuth are more preferable.
  • the base layer may contain two or more types of Group 15 elements.
  • Group 1 elements, Group 2 elements, and Group 13 elements are preferable because the wear resistance of the surface treatment layer is better, and Group 1 elements and Group 2 elements are more preferable. , Group 1 elements are more preferred. As the specific element, only one type of element may be included, or two or more types of elements may be included.
  • the oxide contained in the base layer may be a mixture of oxides of the above elements (silicon and specific elements) alone (for example, a mixture of silicon oxide and an oxide of a specific element), or a mixture of the above elements (silicon and specific elements). It may be a composite oxide containing two or more types, or a mixture of an oxide of the above element alone and a composite oxide.
  • the ratio of the total molar concentration of the specific element in the underlayer to the molar concentration of silicon in the underlayer (specific element/silicon) is 0.02 to 2.90 from the viewpoint of better wear resistance of the surface treatment layer. It is preferably 0.10 to 2.00, even more preferably 0.20 to 1.80.
  • the molar concentration (mol %) of each element in the underlayer can be measured, for example, by depth direction analysis using X-ray photoelectron spectroscopy (XPS) using ion sputtering.
  • the base layer may be a single layer or a multilayer.
  • the base layer may have an uneven surface.
  • the thickness of the underlayer is preferably 1 to 100 nm, more preferably 1 to 50 nm, and even more preferably 2 to 20 nm. If the thickness of the base layer is equal to or greater than the above lower limit, the adhesion of the surface treatment layer to the base layer will be further improved, and the wear resistance of the surface treatment layer will be more excellent. If the thickness of the base layer is below the above upper limit, the base layer itself will have excellent wear resistance.
  • the thickness of the base layer is measured by observing a cross section of the base layer using a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • the base layer can be formed, for example, by a vapor deposition method using a vapor deposition material or a wet coating method.
  • the vapor deposition material used in the vapor deposition method preferably contains an oxide containing silicon and a specific element.
  • Specific examples of the form of the vapor deposition material include powder, molten body, sintered body, granulated body, and crushed body, and from the viewpoint of ease of handling, molten body, sintered body, and granulated body are preferable.
  • the melt means a solid obtained by melting the powder of the vapor deposition material at a high temperature and then cooling and solidifying the powder.
  • a sintered body means a solid obtained by firing a powder of a vapor deposition material, and if necessary, a molded body obtained by press-molding the powder may be used instead of a powder of a vapor deposition material.
  • the granule refers to a solid material obtained by kneading a powder of a vapor deposition material and a liquid medium (for example, water, an organic solvent) to obtain particles, and then drying the particles.
  • the vapor deposition material can be manufactured, for example, by the following method.
  • ⁇ Powders containing silicon e.g. powder of silicon oxide, silica sand, silica gel
  • powders containing specific elements e.g.
  • ⁇ Powders containing silicon e.g. powder of silicon oxide, silica sand, silica gel
  • powders containing specific elements e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid
  • a specific example of a vapor deposition method using a vapor deposition material includes a vacuum vapor deposition method.
  • the vacuum deposition method is a method in which a deposition material is evaporated in a vacuum chamber and adhered to the surface of a base material.
  • the temperature during vapor deposition (for example, the temperature of the boat in which the vapor deposition material is placed when using a vacuum vapor deposition apparatus) is preferably 100 to 3,000°C, more preferably 500 to 3,000°C.
  • the pressure during vapor deposition (for example, when using a vacuum vapor deposition apparatus, the pressure in the tank in which the vapor deposition material is placed) is preferably 1 Pa or less, more preferably 0.1 Pa or less.
  • one vapor deposition material may be used, or two or more vapor deposition materials containing different elements may be used.
  • evaporation methods include resistance heating, in which the evaporation material is melted and evaporated on a resistance heating boat made of high-melting-point metal, and irradiation of an electron beam onto the evaporation material to directly heat the evaporation material on the surface.
  • An example is the electron gun method, which melts and evaporates.
  • the method of evaporating the deposition material is that it can evaporate high-melting point substances because it can be heated locally, and that there is no risk of reaction with the container or contamination with impurities because the area that is not hit by the electron beam is at a low temperature. Gun law is preferred.
  • a plurality of boats may be used, or all the evaporation materials may be placed in a single boat.
  • the vapor deposition method may be codeposition, alternate vapor deposition, or the like. Specifically, examples include mixing silica and a specific element source in the same boat, co-evaporating silica and a specific element source in separate boats, and alternately depositing silica and a specific element source in separate boats. can be mentioned.
  • the conditions, order, etc. of vapor deposition are appropriately selected depending on the structure of the underlying layer.
  • the base layer on the base material by a wet coating method using a coating liquid containing a compound containing silicon, a compound containing a specific element, and a liquid medium.
  • silicon compounds include silicon oxide, silicic acid, partial condensates of silicic acid, alkoxysilanes, and partially hydrolyzed condensates of alkoxysilanes.
  • Specific examples of compounds containing specific elements include oxides of specific elements, alkoxides of specific elements, carbonates of specific elements, sulfates of specific elements, nitrates of specific elements, oxalates of specific elements, and water of specific elements. Examples include oxides.
  • liquid medium examples include those similar to the liquid medium contained in the composition of the present disclosure described above.
  • the content of the liquid medium is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the total amount of the coating liquid used to form the base layer.
  • wet coating methods for forming the base layer include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet, flow coating, roll coating, Examples include the cast method, Langmuir-Blodgett method, and gravure coating method.
  • the drying temperature of the coating film is preferably 20 to 200°C, more preferably 80 to 160°C.
  • the article of the present disclosure is preferably an optical member.
  • optical components include medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • Examples include personal appliances, copying machines, PCs, displays (eg, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
  • the article is preferably a display or a touch panel.
  • a method for producing an article of the present disclosure is, for example, a method of surface-treating a base material using the surface treatment agent of the present disclosure to produce an article in which a surface-treated layer is formed on the base material.
  • Surface treatments include dry coating methods and wet coating methods.
  • dry coating methods include vacuum deposition, CVD, and sputtering.
  • a vacuum evaporation method is preferable from the viewpoint of suppressing decomposition of the compound and the simplicity of the apparatus.
  • a pellet-like substance obtained by impregnating a porous metal body such as iron or steel with the compound of the present disclosure may be used.
  • a pellet-like material impregnated with the compound of the present disclosure may be used by impregnating a porous metal body such as iron or steel with a composition containing the compound of the present disclosure and a liquid medium, and drying the liquid medium.
  • wet coating methods include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet coating, flow coating, roll coating, casting, and Langmuir-Blodgett methods. , gravure coating method.
  • an operation may be performed to accelerate the reaction between the compound of the present disclosure and the base material, if necessary.
  • Such operations include heating, humidification, light irradiation, and the like.
  • a hydrolysis reaction of hydrolyzable groups, a reaction between hydroxyl groups, etc. on the surface of the base material and silanol groups, and a condensation reaction of silanol groups. can promote reactions such as the formation of siloxane bonds.
  • compounds in the surface treatment layer that are not chemically bonded to other compounds or the base material may be removed as necessary. Examples of the removal method include a method of pouring a solvent onto the surface treatment layer, a method of wiping with a cloth impregnated with a solvent, and the like.
  • 1,3-bistrifluoromethylbenzene (10 g) was added again, and after stirring, a toluene solution of platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum content 3 %, 0.1g), aniline (0.1g), and vinyltrimethoxysilane (3.0g), and after stirring at 40°C for 24 hours, the following compound (5A) was obtained by distilling off the solvent under reduced pressure. 5.9g was obtained.
  • the substrates were surface treated using compounds (1B), (2D), (3C), (4C), (5A), (6C) and (7A) to obtain articles of Examples 1 to 7, respectively.
  • a surface treatment method the following dry coating method was used for each example. Chemically strengthened glass was used as the base material.
  • the obtained article was evaluated by the following method. The results are shown in Table 1.
  • the dry coating was performed using a vacuum evaporation device (VTR350M, manufactured by ULVAC) (vacuum evaporation method).
  • VTR350M vacuum evaporation device
  • 0.5 g of a 20% ethyl acetate solution of each compound was filled into a molybdenum boat in a vacuum evaporation apparatus, and the inside of the vacuum evaporation apparatus was evacuated to 1 ⁇ 10 ⁇ 3 Pa or less.
  • the boat containing the compound is heated at a temperature increase rate of 10°C/min or less, and when the deposition rate exceeds 1 nm/sec using a crystal oscillation film thickness meter, the shutter is opened to form a film on the surface of the substrate. started.
  • the shutter was closed to complete the film formation on the surface of the substrate.
  • the substrate on which the compound was deposited was heat-treated at 150° C. for 30 minutes to obtain an article having a surface layer on the surface of the substrate.
  • the contact angle of about 2 ⁇ L of distilled water placed on the surface of the surface treatment layer was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). Measurements were made at five different locations on the surface of the surface treatment layer, and the average value was calculated. The 2 ⁇ method was used to calculate the contact angle.
  • the evaluation criteria are as follows. A and B are at levels that pose no practical problems. A: It is 100 degrees or more. B: 90 degrees or more and less than 100 degrees. C: Less than 90 degrees.
  • ⁇ Lipophilicity> The contact angle of about 2 ⁇ L of oleic acid placed on the surface of the surface treatment layer was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). Measurements were made at five different locations on the surface of the surface layer, and the average value was calculated. The 2 ⁇ method was used to calculate the contact angle.
  • the evaluation criteria are as follows. A and B are at levels that pose no practical problems. A: Less than 10 degrees. B: 10 degrees or more and less than 15 degrees. C: 15 degrees or more.
  • Examples 1 to 6 are examples, and example 7 is a comparative example.
  • the surface treatment layers prepared in Examples 1 to 6 have excellent abrasion resistance, but the surface treatment layer prepared in Example 7 has poor abrasion resistance.
  • the surface treated layers prepared in Examples 1 to 6 are also excellent in water repellency, lipophilicity, and low fingerprint visibility.
  • the surface treatment layers made in Examples 2 and 3 have particularly good lipophilicity and low fingerprint visibility. The reason for this is not clear, but it is due to the fact that Compound 2 further has an aromatic ring near the terminal aromatic ring group, and Compound 3 has a double bond near the terminal aromatic ring group. It is assumed that.
  • the surface treatment layer produced in Example 5 has particularly good abrasion resistance.
  • Example 6 The surface treated layer produced in Example 6 has particularly excellent water repellency. Although the reason for this is not clear, it is presumed that water repellency is improved by having a relatively long-chain alkyl group in the molecule.
  • the compounds of the present disclosure are useful as surface treatment agents.
  • the surface treatment agent can be used, for example, for substrates in display devices such as touch panel displays, optical elements, semiconductor elements, building materials, automobile parts, nanoimprint technology, and the like.
  • the surface treatment agent can be used for bodies, window glasses (windshields, side glasses, rear glasses), mirrors, bumpers, etc. of transportation equipment such as trains, automobiles, ships, and airplanes.
  • the surface treatment agent can be used for outdoor articles such as building exterior walls, tents, solar power generation modules, sound insulation boards, and concrete; fishing nets, insect nets, and aquariums.
  • the surface treatment agent can be used for various indoor equipment such as kitchens, bathrooms, washstands, mirrors, toilet peripheral parts; ceramics such as chandeliers and tiles; artificial marble, and air conditioners.
  • the surface treatment agent can be used as an antifouling treatment for jigs, inner walls, piping, etc. in a factory.
  • the surface treatment agent can be used for goggles, glasses, helmets, pachinko machines, textiles, umbrellas, play equipment, and soccer balls.
  • the surface treatment agent can also be used as an adhesion prevention agent for various packaging materials such as food packaging materials, cosmetic packaging materials, and the inside of pots.
  • surface treatment agents are used for medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. It can be used for optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
  • medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras.
  • optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.

Abstract

Provided are: a compound that contains a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms, at least one partial structure selected from the group consisting of (A) a linear alkynene group having 17 or more carbon atoms, (B) -CH=CH- and (C) a substituted or unsubstituted bivalent aromatic ring group having 4 to 16 carbon atoms, and a reactive silyl group; a composition and a surface treating agent each containing the compound; and an article and a method for producing an article, in each of which the surface treating agent is used.

Description

化合物、組成物、表面処理剤、物品の製造方法、及び物品Compounds, compositions, surface treatment agents, methods for producing articles, and articles
 本開示は、化合物、組成物、表面処理剤、物品の製造方法、及び物品に関する。 The present disclosure relates to compounds, compositions, surface treatment agents, methods of manufacturing articles, and articles.
 近年、外観、視認性等の性能を向上させるために、物品の表面に指紋を付きにくくする技術や、汚れを落としやすくする技術が求められている。具体的な方法として、物品の表面に表面処理剤を用いて表面処理を行う方法が知られている。例えば、特許文献1には、フェニル基を有するオルガノシラン化合物を含む表面処理剤が記載されている。また、特許文献2には、芳香環を有する特定構造のシラン化合物を含む塗布組成物が記載されている。 In recent years, in order to improve performance such as appearance and visibility, there has been a demand for technology that makes it difficult for fingerprints to form on the surface of articles and technology that makes it easier to remove dirt. As a specific method, a method is known in which the surface of an article is subjected to surface treatment using a surface treatment agent. For example, Patent Document 1 describes a surface treatment agent containing an organosilane compound having a phenyl group. Further, Patent Document 2 describes a coating composition containing a silane compound having a specific structure having an aromatic ring.
国際公開第2020/026729号International Publication No. 2020/026729 国際公開第2021/219532号International Publication No. 2021/219532
 一方、表面処理剤には耐摩耗性等の観点からさらなる改良が求められている。かかる状況に鑑み、本開示は基材に良好な耐摩耗性を付与しうる化合物、前記化合物を含む組成物及び表面処理剤、並びに前記表面処理剤を用いた物品及び物品の製造方法に関する。 On the other hand, surface treatment agents are required to be further improved from the viewpoint of wear resistance and the like. In view of this situation, the present disclosure relates to a compound capable of imparting good wear resistance to a substrate, a composition and a surface treatment agent containing the compound, and an article using the surface treatment agent and a method for manufacturing the article.
 上記課題を解決するための手段は、以下の態様を含む。
<1> 置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基と、
 (A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造と、
 反応性シリル基と、
を含む化合物。
<2> 前記1価の芳香環基における炭素数4~16の芳香環が、ベンゼン環、ナフタレン環、又はピリジン環である、<1>に記載の化合物。
<3> 前記1価の芳香環基における炭素数4~16の芳香環が、1~15個の置換基を有し、前記置換基はそれぞれ独立に、ハロゲン原子、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、炭素数1~10のハロアルキル基、-OCF、-SF、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、及び-C(O)Rからなる群より選択され、ここで、Rは、それぞれ独立に、水素原子又はアルキル基である、<1>又は<2>に記載の化合物。
<4> 下記式(1)で表される化合物:
 Ar-Z-Y[-Si(R)3-n …(1)
 式(1)中、
 Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
 Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
 Yは、gが1の場合単結合であり、gが2以上の場合(g+1)価の連結基であり、
 Rはそれぞれ独立に1価の炭化水素基であり、
 Lはそれぞれ独立に加水分解性基又は水酸基であり、
 nは0~2の整数であり、
 gは1以上の整数である。
<5> 式(1)中、gが2以上の整数である、<4>に記載の化合物。
<6> 前記1価の芳香環基における炭素数4~16の芳香環が、ベンゼン環、ナフタレン環、又はピリジン環である、<4>又は<5>に記載の化合物。
<7> 前記1価の芳香環基における炭素数4~16の芳香環が、1~15個の置換基を有し、前記置換基はそれぞれ独立に、ハロゲン原子、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、炭素数1~10のハロアルキル基、-OCF、-SF、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、及び-C(O)Rからなる群より選択され、ここで、Rは、それぞれ独立に、水素原子又はアルキル基である、<4>~<6>のいずれか1項に記載の化合物。
<8> 下記式(1-1)で表される化合物:
 Ar-Z-Y11(D)g1  ・・・(1-1)
 式(1-1)中、
 Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
 Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
 Y11は、g1が1の場合単結合であり、g1が2以上の場合(g1+1)価の連結基であり、 
 Dはそれぞれ独立に、-Q-CH=CHであり、ここでQは単結合又は2価の連結基であり、
 g1は1以上の整数である。
<9> <1>~<7>のいずれか1項に記載の化合物と、液状媒体と、を含む組成物。<10> <1>~<7>のいずれか1項に記載の化合物を含む、表面処理剤。
<11> さらに液状媒体を含む、<10>に記載の表面処理剤。
<12> 基材に対して、<10>又は<11>に記載の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造する、物品の製造方法。
<13> 基材と、前記基材上に配置され、<10>に記載の表面処理剤で表面処理された表面処理層と、を含む物品。
<14> 前記物品が光学部材である、<13>に記載の物品。
<15> 前記物品がディスプレイ又はタッチパネルである、<14>に記載の物品。
Means for solving the above problems include the following aspects.
<1> A monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms;
(A) a linear alkylene group having 17 or more carbon atoms; (B) -CH=CH-; and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. at least one substructure comprising;
a reactive silyl group,
Compounds containing.
<2> The compound according to <1>, wherein the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group is a benzene ring, a naphthalene ring, or a pyridine ring.
<3> The aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents independently has a halogen atom, a hydroxyl group, or a carbon number 1 to 10. alkyl group having 1 to 10 carbon atoms, haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where , R s are each independently a hydrogen atom or an alkyl group, the compound according to <1> or <2>.
<4> Compound represented by the following formula (1):
Ar-Z-Y 1 [-Si(R) n L 3-n ] g ...(1)
In formula (1),
Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
Y 1 is a single bond when g is 1, and is a (g + 1) valent linking group when g is 2 or more,
R is each independently a monovalent hydrocarbon group,
L is each independently a hydrolyzable group or a hydroxyl group,
n is an integer from 0 to 2,
g is an integer of 1 or more.
<5> The compound according to <4>, wherein in formula (1), g is an integer of 2 or more.
<6> The compound according to <4> or <5>, wherein the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group is a benzene ring, a naphthalene ring, or a pyridine ring.
<7> The aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents independently has a halogen atom, a hydroxyl group, a carbon number 1 to 10 alkyl group having 1 to 10 carbon atoms, haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where , R s are each independently a hydrogen atom or an alkyl group, the compound according to any one of <4> to <6>.
<8> Compound represented by the following formula (1-1):
Ar-Z-Y 11 (D) g1 ...(1-1)
In formula (1-1),
Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
Y11 is a single bond when g1 is 1, and is a (g1+1) valent linking group when g1 is 2 or more,
Each D is independently -Q L -CH=CH 2 , where Q L is a single bond or a divalent linking group,
g1 is an integer of 1 or more.
<9> A composition comprising the compound according to any one of <1> to <7> and a liquid medium. <10> A surface treatment agent comprising the compound according to any one of <1> to <7>.
<11> The surface treatment agent according to <10>, further comprising a liquid medium.
<12> A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent described in <10> or <11> to manufacture an article in which a surface treatment layer is formed on the base material. .
<13> An article comprising a base material and a surface treatment layer disposed on the base material and surface treated with the surface treatment agent according to <10>.
<14> The article according to <13>, wherein the article is an optical member.
<15> The article according to <14>, wherein the article is a display or a touch panel.
 本開示によれば、基材に良好な耐摩耗性を付与しうる化合物、前記化合物を含む組成物及び表面処理剤、並びに前記表面処理剤を用いた物品及び物品の製造方法が提供される。 According to the present disclosure, there are provided a compound that can impart good wear resistance to a substrate, a composition and a surface treatment agent containing the compound, and an article and a method for manufacturing the article using the surface treatment agent.
 以下、本開示の実施形態を実施するための形態について詳細に説明する。但し、本開示の実施形態は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素(要素ステップ等も含む)は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本開示の実施形態を制限するものではない。 Hereinafter, modes for carrying out embodiments of the present disclosure will be described in detail. However, the embodiments of the present disclosure are not limited to the following embodiments. In the following embodiments, the constituent elements (including elemental steps and the like) are not essential unless otherwise specified. The same applies to numerical values and their ranges, and they do not limit the embodiments of the present disclosure.
 本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
 本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
 本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
 本開示において「層」又は「膜」との語には、当該層又は膜が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
 本開示において、「表面処理層」とは、基材の表面に、表面処理によって形成される層を意味する。
 本開示において、化合物又は基が特定の式(X)で表される場合、当該式(X)で表される化合物又は基をそれぞれ化合物(X)及び基(X)と記すことがある。
 本開示において、「炭素数Xの芳香環基」との表現における炭素数Xは、環を構成する原子群の炭素数を表し、置換基の炭素数を含まない。
 本開示において、(ポリ)オキシアルキレン基とは、オキシアルキレン基又はポリオキシアルキレン基を意味する。
In this disclosure, the term "step" includes not only a step that is independent from other steps, but also a step that cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved. .
In the present disclosure, numerical ranges indicated using "~" include the numerical values written before and after "~" as minimum and maximum values, respectively.
In the present disclosure, each component may contain multiple types of corresponding substances. If there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition, unless otherwise specified. means quantity.
In this disclosure, the term "layer" or "film" refers to the case where the layer or film is formed only in a part of the region, in addition to the case where the layer or film is formed in the entire region when observing the region where the layer or film is present. This also includes cases where it is formed.
In the present disclosure, the term "surface treated layer" refers to a layer formed on the surface of a base material by surface treatment.
In the present disclosure, when a compound or group is represented by a specific formula (X), the compound or group represented by the formula (X) may be referred to as a compound (X) and a group (X), respectively.
In the present disclosure, the carbon number X in the expression "an aromatic ring group having carbon number X" represents the carbon number of the atomic group constituting the ring, and does not include the carbon number of the substituent.
In the present disclosure, a (poly)oxyalkylene group means an oxyalkylene group or a polyoxyalkylene group.
[化合物]
 本開示の化合物は、置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基と、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造と、反応性シリル基と、を含む。以下、「置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基」を「特定芳香環基」とも記す。また、「(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造」を包括的に「特定部分構造」とも記す。
 本開示の化合物を含む組成物を用いて基材表面の表面処理を行うと、驚くべきことに基材表面の耐摩耗性に優れることが見出された。この理由は明らかではないが、特定部分構造が分子の配向性に寄与し、表面処理層を形成したときの耐摩耗性が良好に発揮されることが一因と推測される。
[Compound]
The compound of the present disclosure comprises a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms, (A) a linear alkylene group having 17 or more carbon atoms, and (B) -CH=CH- , and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms, and a reactive silyl group. Hereinafter, "a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms" will also be referred to as a "specific aromatic ring group". In addition, "a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms,""at least one partial structure selected from the above" is also comprehensively referred to as a "specific partial structure".
It has been surprisingly found that when the surface of a substrate is treated with a composition containing the compound of the present disclosure, the surface of the substrate has excellent wear resistance. Although the reason for this is not clear, it is presumed that one reason is that the specific partial structure contributes to the orientation of the molecules, resulting in good wear resistance when the surface treatment layer is formed.
 本開示の化合物において、特定芳香環基及び反応性シリル基は化合物の末端に存在する。特定部分構造は、化合物の内部に存在し、特定芳香環基及び反応性シリル基の間に存在することが好ましい。特定部分構造は、特定芳香環基及び反応性シリル基のそれぞれと直接結合していてもよく、連結基を介して結合していてもよい。したがって、本開示の化合物は、特定芳香環基、特定部分構造、及び反応性シリル基がこの順に直接又は連結基を介して結合されている化合物であることが好ましい。 In the compound of the present disclosure, the specific aromatic ring group and the reactive silyl group are present at the end of the compound. The specific partial structure is preferably present inside the compound, and between the specific aromatic ring group and the reactive silyl group. The specific partial structure may be directly bonded to each of the specific aromatic ring group and the reactive silyl group, or may be bonded to each of the specific aromatic ring group and the reactive silyl group via a linking group. Therefore, the compound of the present disclosure is preferably a compound in which a specific aromatic ring group, a specific partial structure, and a reactive silyl group are bonded in this order directly or via a linking group.
 特定芳香環基における1価の芳香環基とは、芳香環から1個の水素原子を除いた1価の基を意味する。なお、ビフェニル基、フェニルメチルフェニル基、フェノキシフェニル基など、複数の芳香環が単結合又は連結基を介して連結されている場合、末端の芳香環である1価の基を、本開示の化合物における特定芳香環基に分類するものとする。
 特定芳香環基における芳香環は、芳香族炭化水素環であっても芳香族複素環であってもよく、撥水性及び親油性に優れる観点からは、ヘテロ原子を含まない芳香族炭化水素環が好ましい。
 特定芳香環基における芳香環は、単環であっても縮合多環であってもよい。
 特定芳香環基の炭素数は5~10が好ましく、6~8がより好ましい。
The monovalent aromatic ring group in the specific aromatic ring group means a monovalent group obtained by removing one hydrogen atom from an aromatic ring. In addition, when multiple aromatic rings are connected via a single bond or a linking group, such as a biphenyl group, phenylmethylphenyl group, or phenoxyphenyl group, the monovalent group that is the terminal aromatic ring is used as the compound of the present disclosure. It shall be classified as a specific aromatic ring group.
The aromatic ring in the specific aromatic ring group may be an aromatic hydrocarbon ring or an aromatic heterocycle, and from the viewpoint of excellent water repellency and lipophilicity, an aromatic hydrocarbon ring that does not contain a hetero atom is preferred. preferable.
The aromatic ring in the specific aromatic ring group may be a monocyclic ring or a condensed polycyclic ring.
The specific aromatic ring group preferably has 5 to 10 carbon atoms, more preferably 6 to 8 carbon atoms.
 前記芳香環としては、ベンゼン環、ナフタレン環、アントラセン環、フェナントレン環、インデン環、アズレン環、フルオレン環、ピレン環;フラン環、チオフェン環、ピロール環、イミダゾール環、ピリジン環、ピリミジン環、ピラジン環、インドール環、プリン環、キノリン環、イソキノリン環、クロメン環、フェノチアジン環、フェノキサジン環、アクリジン環、フェナジン環、カルバゾール環等が挙げられる。撥水性及び親油性を向上させる観点からは、ベンゼン環、ナフタレン環、アントラセン環、フェナントレン環、インデン環、アズレン環、及びフルオレン環が好ましい。原料の入手容易性の観点からは、ベンゼン環、ナフタレン環、及びピリジン環が好ましく、ベンゼン環及びナフタレン環がより好ましく、ベンゼン環がさらに好ましい。 The aromatic rings include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, an indene ring, an azulene ring, a fluorene ring, a pyrene ring; a furan ring, a thiophene ring, a pyrrole ring, an imidazole ring, a pyridine ring, a pyrimidine ring, and a pyrazine ring. , an indole ring, a purine ring, a quinoline ring, an isoquinoline ring, a chromene ring, a phenothiazine ring, a phenoxazine ring, an acridine ring, a phenazine ring, a carbazole ring, and the like. From the viewpoint of improving water repellency and lipophilicity, benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, indene rings, azulene rings, and fluorene rings are preferred. From the viewpoint of availability of raw materials, benzene rings, naphthalene rings, and pyridine rings are preferred, benzene rings and naphthalene rings are more preferred, and benzene rings are even more preferred.
 前記芳香環は置換基を有していても有していなくてもよい。芳香環が置換基を有する場合、置換基の数は1~15であってよく、1~9が好ましく、1~7がさらに好ましい。置換基としては、ハロゲン原子、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、炭素数1~10のハロアルキル基、-OCF、-SF、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、-C(O)R等が挙げられる。ここで、Rは、それぞれ独立に、水素原子又はアルキル基(好ましくは炭素数1~10、より好ましくは炭素数1~5、さらに好ましくはメチル基)である。一態様において、置換基としては、ハロゲン原子(例えば、フッ素原子)を含まない置換基が好ましく、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、及び-C(O)Rがより好ましい。一態様において、撥水性及び親油性に優れる観点からは、置換基としては、ヘテロ原子(例えば酸素原子、窒素原子、及び硫黄原子)を含まない置換基が好ましく、アルキル基が好ましい。一態様において、撥水性及び親油性に優れる観点からは、芳香環は置換基を有さないことが好ましい。芳香環が複数の置換基を有する場合、それぞれの置換基は同じであっても互いに異なっていてもよい。 The aromatic ring may or may not have a substituent. When the aromatic ring has a substituent, the number of substituents may be 1 to 15, preferably 1 to 9, and more preferably 1 to 7. Examples of substituents include halogen atoms, hydroxyl groups, alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, haloalkyl groups having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O) R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , -C (O)Rs etc. are mentioned. Here, each R s is independently a hydrogen atom or an alkyl group (preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and still more preferably a methyl group). In one embodiment, the substituent is preferably a substituent that does not contain a halogen atom (for example, a fluorine atom), such as a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, -OC(O) R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and - C(O) Rs is more preferred. In one embodiment, from the viewpoint of excellent water repellency and lipophilicity, the substituent is preferably a substituent that does not contain a hetero atom (eg, an oxygen atom, a nitrogen atom, and a sulfur atom), and an alkyl group is preferable. In one embodiment, from the viewpoint of excellent water repellency and lipophilicity, it is preferable that the aromatic ring has no substituent. When the aromatic ring has a plurality of substituents, each substituent may be the same or different from each other.
 本開示の化合物中の特定芳香環基の数は1であっても複数であってもよく、1であることが好ましい。本開示の化合物が複数の特定芳香環基を含む場合には、それぞれの特定芳香環基は同じであっても互いに異なっていてもよい。 The number of specific aromatic ring groups in the compound of the present disclosure may be one or more, and is preferably one. When the compound of the present disclosure contains a plurality of specific aromatic ring groups, each specific aromatic ring group may be the same or different from each other.
 特定部分構造は、下記構造より選択される。
(A)炭素数17以上の直鎖アルキレン基(以下、「特定部分構造A」とも記す。)。
(B)-CH=CH-(以下、「特定部分構造B」とも記す。)。
(C)置換又は非置換の炭素数4~16の2価の芳香環基(以下、「特定部分構造C」とも記す。)。
The specific partial structure is selected from the following structures.
(A) Straight chain alkylene group having 17 or more carbon atoms (hereinafter also referred to as "specific partial structure A").
(B) -CH=CH- (hereinafter also referred to as "specific partial structure B").
(C) Substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms (hereinafter also referred to as "specific partial structure C").
 本開示の化合物は特定部分構造をいずれか1つ含んでもよく、2つ以上含んでもよい。本開示の化合物が特定部分構造を2つ以上含む場合、それぞれの特定部分構造は同じであっても互いに異なっていてもよい。「本開示の化合物が特定部分構造を2つ以上含む」場合としては、本開示の化合物が特定部分構造Aを2つ以上含む場合、特定部分構造Bを2つ以上含む場合、特定部分構造Cを2つ以上含む場合、及び特定部分構造A~Cの任意の組み合わせを含む場合が挙げられる。 The compound of the present disclosure may contain any one specific partial structure, or may contain two or more specific partial structures. When the compound of the present disclosure contains two or more specific partial structures, each specific partial structure may be the same or different from each other. "The compound of the present disclosure includes two or more specific partial structures" means that the compound of the present disclosure includes two or more specific partial structures A, two or more specific partial structures B, and the specific partial structure C. Examples include cases in which two or more of the specific partial structures A to C are included, and cases in which any combination of specific partial structures A to C is included.
 特定部分構造Aにおける直鎖アルキレン基とは非置換の直鎖アルキレン基を意味する。
 特定部分構造Aの炭素数は、撥水性を向上させる観点からは、18以上が好ましい。前記炭素数は、製造容易性の観点からは、36以下が好ましく、28以下がより好ましく、24以下がさらに好ましい。かかる観点からは、前記炭素数は、17~36が好ましく、18~28がより好ましく、18~24がさらに好ましい。前記炭素数は21以上であってもよい。
The linear alkylene group in specific partial structure A means an unsubstituted linear alkylene group.
The number of carbon atoms in the specific partial structure A is preferably 18 or more from the viewpoint of improving water repellency. From the viewpoint of ease of manufacture, the carbon number is preferably 36 or less, more preferably 28 or less, and even more preferably 24 or less. From this point of view, the number of carbon atoms is preferably 17 to 36, more preferably 18 to 28, and even more preferably 18 to 24. The number of carbon atoms may be 21 or more.
 特定部分構造Bは-CH=CH-である。一態様において、複数の特定部分構造Bが隣接して共役二重結合を形成してもよい。一態様において、複数の特定部分構造Bは共役二重結合を形成しなくてもよい。
 特定部分構造Bはシス型でもトランス型でもよく、トランス型が好ましい。
 化合物中の特定部分構造Bの位置は特に制限されない。一態様において、特定部分構造Bは、特定芳香環基に隣接して位置する(すなわち、-CH=CH-が特定芳香環基の芳香環に直接結合する)ことが好ましい。これにより、特定芳香環基の共役構造が拡張されるため、より優れた親油性及び低指紋視認性が発揮されると考えられる。
Specific partial structure B is -CH=CH-. In one embodiment, a plurality of specific partial structures B may be adjacent to each other to form a conjugated double bond. In one embodiment, the plurality of specific partial structures B do not need to form a conjugated double bond.
The specific partial structure B may be either cis or trans, and preferably trans.
The position of the specific partial structure B in the compound is not particularly limited. In one embodiment, the specific partial structure B is preferably located adjacent to the specific aromatic ring group (ie, -CH═CH- is directly bonded to the aromatic ring of the specific aromatic ring group). This expands the conjugated structure of the specific aromatic ring group, so it is thought that better lipophilicity and lower fingerprint visibility are exhibited.
 特定部分構造Cは、置換又は非置換の炭素数4~16の2価の芳香環基である。特定部分構造Cにおける2価の芳香環基とは、芳香環から2個の水素原子を除いた2価の基を意味する。
 化合物中の特定部分構造Cの位置は特に制限されず、特定部分構造Cは特定芳香環基に隣接していてもいなくてもよく、反応性シリル基に隣接していてもいなくてもよい。一態様において、芳香環は、特定芳香環基に隣接して位置することが好ましい。これにより、特定芳香環基の共役構造が拡張されるため、より優れた親油性及び低指紋視認性が発揮されると考えられる。
The specific partial structure C is a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. The divalent aromatic ring group in the specific partial structure C means a divalent group obtained by removing two hydrogen atoms from an aromatic ring.
The position of the specific partial structure C in the compound is not particularly limited, and the specific partial structure C may or may not be adjacent to a specific aromatic ring group, and may or may not be adjacent to a reactive silyl group. In one embodiment, the aromatic ring is preferably located adjacent to the specific aromatic ring group. This expands the conjugated structure of the specific aromatic ring group, so it is thought that better lipophilicity and lower fingerprint visibility are exhibited.
 特定部分構造Cにおける置換又は非置換の炭素数4~16の芳香環としては、特定芳香環基における芳香環として例示した芳香環が挙げられる。撥水性及び親油性を向上させる観点からは、ベンゼン環、ナフタレン環、アントラセン環、フェナントレン環、インデン環、アズレン環、及びフルオレン環が好ましい。原料の入手容易性に優れる観点からは、ベンゼン環、ナフタレン環、及びピリジン環が好ましく、ベンゼン環及びナフタレン環がより好ましく、ベンゼン環がさらに好ましい。 The substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms in the specific partial structure C includes the aromatic rings exemplified as the aromatic ring in the specific aromatic ring group. From the viewpoint of improving water repellency and lipophilicity, benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, indene rings, azulene rings, and fluorene rings are preferred. From the viewpoint of excellent raw material availability, benzene rings, naphthalene rings, and pyridine rings are preferred, benzene rings and naphthalene rings are more preferred, and benzene rings are even more preferred.
 前記芳香環は置換基を有していても有していなくてもよい。芳香環が置換基を有する場合、置換基の数は1~14であってよく、1~8が好ましく、1~6がさらに好ましい。置換基としては、特定芳香環基における芳香環が有していてもよい置換基として例示した置換基が挙げられる。一態様において、撥水性及び親油性に優れる観点からは、置換基としては、ヘテロ原子(例えば酸素原子、窒素原子、及び硫黄原子)を含まない置換基が好ましく、アルキル基が好ましい。一態様において、撥水性及び親油性に優れる観点からは、芳香環は置換基を有さないことが好ましい。芳香環が複数の置換基を有する場合、それぞれの置換基は同じであっても互いに異なっていてもよい。 The aromatic ring may or may not have a substituent. When the aromatic ring has a substituent, the number of substituents may be 1 to 14, preferably 1 to 8, and more preferably 1 to 6. Examples of the substituent include the substituents exemplified as substituents that the aromatic ring in the specific aromatic ring group may have. In one embodiment, from the viewpoint of excellent water repellency and lipophilicity, the substituent is preferably a substituent that does not contain a hetero atom (eg, an oxygen atom, a nitrogen atom, and a sulfur atom), and an alkyl group is preferable. In one embodiment, from the viewpoint of excellent water repellency and lipophilicity, it is preferable that the aromatic ring has no substituent. When the aromatic ring has a plurality of substituents, each substituent may be the same or different from each other.
 反応性シリル基とは、Si原子に反応性基が結合した基を意味する。反応性基としては、加水分解性基又は水酸基が好ましい。 A reactive silyl group means a group in which a reactive group is bonded to a Si atom. The reactive group is preferably a hydrolyzable group or a hydroxyl group.
 加水分解性とは、加水分解反応により水酸基となる基である。すなわち、Si-Lで表される加水分解性を有するシリル基は、加水分解反応によりSi-OHで表されるシラノール基となる。シラノール基は、さらにシラノール基間で反応してSi-O-Si結合を形成する。また、シラノール基は、基材の表面に存在する酸化物に由来するシラノール基と脱水縮合反応して、Si-O-Si結合を形成できる。加水分解性基としては、例えば、アルコキシ基、アリールオキシ基、ハロゲン原子、アシル基、アシルオキシ基、及びイソシアナト基(-NCO)が挙げられる。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましい。ただし、アリールオキシ基のアリール基は、ヘテロアリール基を含む。ハロゲン原子は、塩素原子であることが好ましい。アシル基は、炭素数1~6のアシル基であることが好ましい。アシルオキシ基は、炭素数1~6のアシルオキシ基であることが好ましい。 Hydrolyzable is a group that becomes a hydroxyl group through a hydrolysis reaction. That is, the hydrolyzable silyl group represented by Si-L becomes a silanol group represented by Si-OH through a hydrolysis reaction. The silanol groups further react among themselves to form Si--O--Si bonds. Further, the silanol group can undergo a dehydration condensation reaction with a silanol group derived from an oxide present on the surface of the base material to form a Si--O--Si bond. Examples of the hydrolyzable group include an alkoxy group, an aryloxy group, a halogen atom, an acyl group, an acyloxy group, and an isocyanato group (-NCO). The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms. However, the aryl group of the aryloxy group includes a heteroaryl group. The halogen atom is preferably a chlorine atom. The acyl group is preferably an acyl group having 1 to 6 carbon atoms. The acyloxy group is preferably an acyloxy group having 1 to 6 carbon atoms.
 均一な膜を作製しやすく、耐久性に優れる観点からは、反応性シリル基としてはアルコキシシリル基又はトリクロロシリル基が好ましい。基材との反応において生じる副生物の取り扱いやすさの観点から、反応性シリル基は、アルコキシシリル基であることがより好ましい。アルコキシシリル基としてはジアルコキシシリル基又はトリアルコキシシリル基が好ましく、トリアルコキシシリル基がより好ましい。 From the viewpoint of easy production of a uniform film and excellent durability, the reactive silyl group is preferably an alkoxysilyl group or a trichlorosilyl group. From the viewpoint of ease of handling by-products generated in the reaction with the base material, the reactive silyl group is more preferably an alkoxysilyl group. The alkoxysilyl group is preferably a dialkoxysilyl group or a trialkoxysilyl group, and more preferably a trialkoxysilyl group.
 本開示の化合物が有する反応性シリル基の数は、1以上である。一態様において、表面処理層の耐摩耗性及び指紋除去性に優れる観点からは、反応性シリル基の数は、1~15であることが好ましく、1~6であることがより好ましい。一態様において、表面処理層の耐摩耗性に優れる観点からは、反応性シリル基の数は2以上であることが好ましく、2~4であることがより好ましく、2又は3であることがさらに好ましい。一態様において、表面処理層の指紋除去性に優れる観点からは、反応性シリル基の数は、1~3であることが好ましく、1又は2であることがより好ましく、1であることがさらに好ましい。 The number of reactive silyl groups that the compound of the present disclosure has is one or more. In one embodiment, the number of reactive silyl groups is preferably 1 to 15, more preferably 1 to 6, from the viewpoint of the surface treatment layer having excellent abrasion resistance and fingerprint removability. In one embodiment, from the viewpoint of excellent wear resistance of the surface treatment layer, the number of reactive silyl groups is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3. preferable. In one embodiment, from the viewpoint of excellent fingerprint removability of the surface treatment layer, the number of reactive silyl groups is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1. preferable.
 反応性シリル基としては、下記式(2)で表される基が好ましい。
 -Si(R)3-n  …(2)
 式(2)中、Rはそれぞれ独立に1価の炭化水素基であり、Lはそれぞれ独立に加水分解性基又は水酸基であり、nは0~2の整数である。
As the reactive silyl group, a group represented by the following formula (2) is preferable.
-Si(R) n L 3-n ...(2)
In formula (2), R is each independently a monovalent hydrocarbon group, L is each independently a hydrolyzable group or a hydroxyl group, and n is an integer from 0 to 2.
 基(2)が1分子中に複数ある場合、複数の基(2)は、同じであっても異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性に優れる観点からは、複数の基(2)は、同じであることが好ましい。 When there are multiple groups (2) in one molecule, the multiple groups (2) may be the same or different. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of groups (2) are the same.
 Rはそれぞれ独立に1価の炭化水素基であり、1価の飽和炭化水素基が好ましい。Rの炭素数は、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。 Each R is independently a monovalent hydrocarbon group, preferably a monovalent saturated hydrocarbon group. The number of carbon atoms in R is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.
 Lが加水分解性基の場合、加水分解性基としては、上述のものが好ましい。 When L is a hydrolyzable group, the hydrolyzable group is preferably the one described above.
 なかでも、Lは、化合物の製造容易性に優れる観点から、アルコキシ基(好ましくは炭素数1~4のアルコキシ基)又はハロゲン原子であることが好ましい。Lは、塗布時のアウトガスが少なく、化合物の保存安定性がより優れる観点から、炭素数1~4のアルコキシ基であることが好ましい。化合物の長期の保存安定性が必要な場合には、Lは、エトキシ基であることがより好ましい。塗布後の反応時間を短時間とする場合には、Lは、メトキシ基であることがより好ましい。式(2)において、Lの少なくとも1つが上記基であることが好ましく、Lのすべてが上記基であることがより好ましい。 Among these, L is preferably an alkoxy group (preferably an alkoxy group having 1 to 4 carbon atoms) or a halogen atom from the viewpoint of ease of manufacturing the compound. L is preferably an alkoxy group having 1 to 4 carbon atoms, from the viewpoint of less outgassing during coating and better storage stability of the compound. When long-term storage stability of the compound is required, L is more preferably an ethoxy group. When the reaction time after coating is to be shortened, L is more preferably a methoxy group. In formula (2), at least one L is preferably the above group, and more preferably all L are the above groups.
 nは、0~2の整数であり、0又は1が好ましく、0がより好ましい。本開示の化合物を表面処理剤に用いる場合、Lが複数存在することによって、表面処理層の基材への密着性がより強固になる。
 nが1以下である場合、1分子中に存在する複数のLは、同じであってもよく、互いに異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性に優れる観点から、複数のLは同じであることが好ましい。nが2である場合、1分子中に存在する複数のRは同じであってもよく、互いに異なっていてもよい。原料の入手容易性、及び、化合物の製造容易性に優れる観点から、複数のRは同じであることが好ましい。
n is an integer of 0 to 2, preferably 0 or 1, and more preferably 0. When the compound of the present disclosure is used as a surface treatment agent, the presence of a plurality of L's makes the adhesion of the surface treatment layer to the base material stronger.
When n is 1 or less, the plurality of L's present in one molecule may be the same or different from each other. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that the plurality of L's are the same. When n is 2, multiple R's present in one molecule may be the same or different from each other. From the viewpoint of excellent availability of raw materials and ease of manufacturing the compound, it is preferable that a plurality of R's are the same.
 特定部分構造は、特定芳香環基及び反応性シリル基と、それぞれ直接結合していても連結基を介して結合していてもよい。特定部分構造と特定芳香環基とを連結する連結基としては、後述の式(1)におけるZ中の「特定部分構造とArとの間に存在していてもよい2価の連結基」が挙げられる。特定部分構造と反応性シリル基とを連結する連結基としては、後述の式(1)における、「特定部分構造とY[-Si(R)3-nとの間に存在していてもよい2価の連結基」、Yで表される(g+1)価の連結基、及びこれらの組み合わせが挙げられる。特定部分構造と反応性シリル基とを連結する連結基はオルガノシロキサン残基を有していてもよく、有していなくてもよい。
 本開示の化合物が特定部分構造を2つ以上含む場合、2つ以上の特定部分構造は直接結合していても連結基を介して結合していてもよい。特定部分構造どうしを連結する連結基としては、後述の式(1)におけるZ中の「複数の特定部分構造の間に存在していてもよい2価の連結基」が挙げられる。特定部分構造同士を連結する連結基はオルガノシロキサン残基を有していてもよく、有していなくてもよい。
The specific partial structure may be bonded to the specific aromatic ring group and the reactive silyl group directly or via a linking group. As the linking group that connects the specific partial structure and the specific aromatic ring group, "a divalent linking group that may exist between the specific partial structure and Ar" in Z in formula (1) described below is Can be mentioned. As the linking group that connects the specific partial structure and the reactive silyl group, "existing between the specific partial structure and Y 1 [-Si(R) n L 3-n ] g " in formula (1) described below is used. (g+1)-valent linking group represented by Y 1 , and combinations thereof. The linking group that connects the specific partial structure and the reactive silyl group may or may not have an organosiloxane residue.
When the compound of the present disclosure contains two or more specific partial structures, the two or more specific partial structures may be bonded directly or via a linking group. Examples of the linking group that connects specific partial structures include "a divalent linking group that may exist between a plurality of specific partial structures" in Z in formula (1) described below. The linking group that connects the specific partial structures may or may not have an organosiloxane residue.
 本開示の化合物はハロゲン原子(例えばフッ素原子)を含んでいても含んでいなくてもよい。一態様において、環境負荷の低減の観点からは、本開示の化合物はハロゲン原子(例えばフッ素原子)を含まないことが好ましい。 The compound of the present disclosure may or may not contain a halogen atom (for example, a fluorine atom). In one embodiment, from the viewpoint of reducing environmental impact, the compound of the present disclosure preferably does not contain a halogen atom (eg, a fluorine atom).
 本開示の化合物はオルガノシロキサン残基を有していてもよく、有していなくてもよい。 The compound of the present disclosure may or may not have an organosiloxane residue.
 本開示の化合物は、耐摩耗性に優れる観点から、下記式(1)で表される化合物であることが好ましい。
 Ar-Z-Y[-Si(R)3-n …(1)
 式(1)中、
 Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
 Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
 Yは、gが1の場合単結合であり、gが2以上の場合(g+1)価の連結基であり、
 Rはそれぞれ独立に1価の炭化水素基であり、
 Lはそれぞれ独立に加水分解性基又は水酸基であり、
 nは0~2の整数であり、
 gは1以上の整数である。
The compound of the present disclosure is preferably a compound represented by the following formula (1) from the viewpoint of excellent wear resistance.
Ar-Z-Y 1 [-Si(R) n L 3-n ] g ...(1)
In formula (1),
Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
Y 1 is a single bond when g is 1, and is a (g + 1) valent linking group when g is 2 or more,
R is each independently a monovalent hydrocarbon group,
L is each independently a hydrolyzable group or a hydroxyl group,
n is an integer from 0 to 2,
g is an integer of 1 or more.
 式(1)中、Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基である。Arの詳細は、上述した特定芳香環基の詳細と同じである。 In formula (1), Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms. Details of Ar are the same as those of the specific aromatic ring group described above.
 Zは(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基である。(A)~(C)は上述の特定部分構造A~Cとそれぞれ同義である。
 Zは特定部分構造をいずれか1つ含んでもよく、2つ以上含んでもよい。Zが特定部分構造を2つ以上含む場合、それぞれの特定部分構造は同じであっても互いに異なっていてもよい。「Zが特定部分構造を2つ以上含む」場合としては、Zが特定部分構造Aを2つ以上含む場合、特定部分構造Bを2つ以上含む場合、特定部分構造Cを2つ以上含む場合、及び特定部分構造A~Cの任意の組み合わせを含む場合が挙げられる。
Z is from the group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. It is a divalent group containing at least one selected partial structure. (A) to (C) have the same meanings as the above-mentioned specific partial structures A to C, respectively.
Z may include any one specific partial structure, or may include two or more specific partial structures. When Z includes two or more specific partial structures, the specific partial structures may be the same or different from each other. Cases in which "Z includes two or more specific substructures" include cases where Z includes two or more specific substructures A, two or more specific substructures B, and two or more specific substructures C. , and any combination of specific partial structures A to C.
 Z中の特定部分構造とArとは直接結合していてもよく、2価の連結基を介して結合していてもよい。
 Z中の特定部分構造とY[-Si(R)3-nとは直接結合していてもよく、2価の連結基を介して結合していてもよい。
 Zが特定部分構造を2つ以上含む場合、複数の特定部分構造は、直接結合していてもよく、2価の連結基を介して結合していてもよい。
 ただし、Zにおける上記いずれの「2価の連結基」にも、特定部分構造は含まれないものとする。また、特定部分構造Aに「2価の連結基」中のアルキレン基が隣接することはないものとする。
 Zはオルガノシロキサン残基を有していてもよく、有していなくてもよい。
The specific partial structure in Z and Ar may be bonded directly or may be bonded via a divalent linking group.
The specific partial structure in Z and Y 1 [-Si(R) n L 3-n ] g may be directly bonded or may be bonded via a divalent linking group.
When Z contains two or more specific partial structures, the plurality of specific partial structures may be directly bonded or may be bonded via a divalent linking group.
However, any of the above-mentioned "divalent linking groups" in Z does not include a specific partial structure. Further, it is assumed that no alkylene group in the "bivalent linking group" is adjacent to the specific partial structure A.
Z may or may not have an organosiloxane residue.
 特定部分構造とArとの間に存在していてもよい2価の連結基としては、-O-、-S-、-SO-、-N(R)-、-C(O)-、-Si(R-、及びこれらの組み合わせ;2価の炭化水素基;2価のオルガノポリシロキサン残基;並びにこれらの組み合わせが挙げられる。上記Rは、アルキル基(好ましくは炭素数1~10)、又はフェニル基である。前記Rは、水素原子、又はアルキル基(好ましくは炭素数1~10)である。
 前記2価の炭化水素基としては、飽和炭化水素基及び不飽和炭化水素基が挙げられる。前記2価の炭化水素基は、直鎖状、分岐鎖状、又は環状であってもよい。2価の炭化水素基としては、アルキレン基及びアルキニレン基が挙げられる。アルキレン基の炭素数は1~16が好ましく、アルキニレン基の炭素数は2~20が好ましい。
 前記-O-、-S-、-SO-、-N(R)-、-C(O)-、及び-Si(R-の組み合わせとしては、-OC(O)-、-C(O)O-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-等が挙げられる。
 一態様において、前記2価の連結基としては、炭素数1~16のアルキレン基、-OC(O)-、-O-、-N(R)C(O)-、-NR-、-S-、-SC(O)-、及びこれらの組み合わせが好ましい。
Divalent linking groups that may exist between the specific partial structure and Ar include -O-, -S-, -SO 2 -, -N(R d )-, -C(O)- , -Si(R a ) 2 -, and combinations thereof; divalent hydrocarbon groups; divalent organopolysiloxane residues; and combinations thereof. The above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group. The R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Examples of the divalent hydrocarbon group include a saturated hydrocarbon group and an unsaturated hydrocarbon group. The divalent hydrocarbon group may be linear, branched, or cyclic. Examples of the divalent hydrocarbon group include an alkylene group and an alkynylene group. The alkylene group preferably has 1 to 16 carbon atoms, and the alkynylene group preferably has 2 to 20 carbon atoms.
The combinations of -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, and -Si(R a ) 2 - include -OC(O)-, -C(O)O-, -C(O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, - Examples include N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, and the like.
In one embodiment, the divalent linking group includes an alkylene group having 1 to 16 carbon atoms, -OC(O)-, -O-, -N(R d )C(O)-, -NR d -, -S-, -SC(O)-, and combinations thereof are preferred.
 Z中の特定部分構造とY[-Si(R)3-nとの間に存在していてもよい2価の連結基としては、特定部分構造とArとの間に存在していてもよい2価の連結基として上述したものが挙げられる。
 一態様において、前記2価の連結基としては、炭素数1~16のアルキレン基;並びに、-OC(O)-、-C(O)O-、-C(O)N(R)-、-N(R)C(O)-、及びこれらと炭素数1~16のアルキレン基との組み合わせが好ましい。
The divalent linking group that may exist between the specific partial structure in Z and Y 1 [-Si(R) n L 3-n ] g is the divalent linking group that exists between the specific partial structure and Ar. Examples of the divalent linking group that may be used include those mentioned above.
In one embodiment, the divalent linking group includes an alkylene group having 1 to 16 carbon atoms; and -OC(O)-, -C(O)O-, -C(O)N(R d )- , -N(R d )C(O)-, and combinations of these with an alkylene group having 1 to 16 carbon atoms are preferred.
 複数の特定部分構造の間に存在していてもよい2価の連結基としては、特定部分構造とArとの間に存在していてもよい2価の連結基として上述したものが挙げられる。
 一態様において、前記2価の連結基としては、炭素数1~16のアルキレン基、-OC(O)-、-O-、-N(R)C(O)-、-NR-、-S-、-SC(O)-、及びこれらの組み合わせが好ましい。
 Zが前記2価の連結基を複数含む場合、複数の2価の連結基は同じであっても互いに異なっていてもよい。
Examples of the divalent linking group that may exist between a plurality of specific partial structures include those mentioned above as the divalent linking group that may exist between the specific partial structure and Ar.
In one embodiment, the divalent linking group includes an alkylene group having 1 to 16 carbon atoms, -OC(O)-, -O-, -N(R d )C(O)-, -NR d -, -S-, -SC(O)-, and combinations thereof are preferred.
When Z contains a plurality of the divalent linking groups, the plurality of divalent linking groups may be the same or different from each other.
 式(1)中、Yは、gが1の場合単結合であり、gが2以上の場合(g+1)価の連結基である。
 Yで表される(g+1)価の連結基としては、炭化水素基;炭素原子、窒素原子、ケイ素原子、環状基、及び2~8価のオルガノポリシロキサン残基;並びにこれらの組み合わせ等が挙げられる。上記Rは、アルキル基(好ましくは炭素数1~10)、又はフェニル基である。前記Rは、水素原子、又はアルキル基(好ましくは炭素数1~10)である。
 前記炭化水素基としては、飽和炭化水素基及び不飽和炭化水素基が挙げられる。前記炭化水素基は、直鎖状、分岐鎖状、又は環状であってもよい。炭化水素基としては、アルキレン基及びアルキニレン基が挙げられる。アルキレン基の炭素数は1~16が好ましく、アルキニレン基の炭素数は2~20が好ましい。前記炭化水素基は、炭素-炭素原子間に、-O-、-S-、-SO-、-N(R)-、-C(O)-、-Si(R-、又はこれらの組み合わせを有してもよい。
 前記-O-、-S-、-SO-、-N(R)-、-C(O)-、及び-Si(R-の組み合わせとしては、-OC(O)-、-C(O)O-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-等が挙げられる。
 Yとしては、後述する式(3-1A)、式(3-1B)、及び式(3-1A-2)~(3-1A-7)からSi(R)3-nを除いた基も挙げられる。
 Yは、後述する基(g2-1)~基(g2-13)であってもよい。
In formula (1), Y 1 is a single bond when g is 1, and is a (g+1)-valent linking group when g is 2 or more.
The (g+1)-valent linking group represented by Y 1 includes a hydrocarbon group; a carbon atom, a nitrogen atom, a silicon atom, a cyclic group, and a di- to octa-valent organopolysiloxane residue; and combinations thereof. Can be mentioned. The above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group. The R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Examples of the hydrocarbon group include a saturated hydrocarbon group and an unsaturated hydrocarbon group. The hydrocarbon group may be linear, branched, or cyclic. Hydrocarbon groups include alkylene groups and alkynylene groups. The alkylene group preferably has 1 to 16 carbon atoms, and the alkynylene group preferably has 2 to 20 carbon atoms. The hydrocarbon group has -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, -Si(R a ) 2 -, Or you may have a combination of these.
The combinations of -O-, -S-, -SO 2 -, -N(R d )-, -C(O)-, and -Si(R a ) 2 - include -OC(O)-, -C(O)O-, -C(O)N(R d )-, -N(R d )C(O)-, -N(R d )C(O)N(R d )-, - Examples include N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, and the like.
As Y 1 , Si(R) n L 3-n is excluded from formula (3-1A), formula (3-1B), and formulas (3-1A-2) to (3-1A-7) described later. Other groups may also be mentioned.
Y 1 may be groups (g2-1) to (g2-13) described below.
 式(1)中、[-Si(R)3-n]の詳細は上述した基(2)の詳細と同じである。化合物(1)が[-Si(R)3-n]を複数有する場合、複数の[-Si(R)3-n]は同一であってもよく、互いに異なっていてもよい。 In formula (1), the details of [-Si(R) n L 3-n ] are the same as the details of group (2) described above. When compound (1) has a plurality of [-Si(R) n L 3-n ], the plurality of [-Si(R) n L 3-n ] may be the same or different from each other. .
 式(1)中、gは1以上の整数である。一態様において、表面処理層の耐摩耗性及び指紋除去性の観点からは、gは、1~15であることが好ましく、1~6であることがより好ましい。一態様において、表面処理層の耐摩耗性に優れる観点からは、gは2以上であることが好ましく、2~4であることがより好ましく、2又は3であることがさらに好ましい。一態様において、表面処理層の指紋除去性に優れる観点からは、gは、1~3であることが好ましく、1又は2であることがより好ましく、1であることがさらに好ましい。 In formula (1), g is an integer of 1 or more. In one embodiment, g is preferably from 1 to 15, more preferably from 1 to 6, from the viewpoint of the abrasion resistance and fingerprint removability of the surface treatment layer. In one embodiment, g is preferably 2 or more, more preferably 2 to 4, and even more preferably 2 or 3 from the viewpoint of excellent wear resistance of the surface treatment layer. In one embodiment, g is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1 from the viewpoint of excellent fingerprint removability of the surface treatment layer.
 式(1)におけるY[-Si(R)3-nで表される基としては、[-Si(R)3-n]、基(3-1A)、又は基(3-1B)が好ましい。 The group represented by Y 1 [-Si(R) n L 3-n ] g in formula (1) is [-Si(R) n L 3-n ], the group (3-1A), or the group (3-1B) is preferred.
 -X31(-Q-Si(R)3-n(-R31  …(3-1A)
 -[C(R32)(-Q-Si(R)3-n)-CH-]-C(R32)(R33)(-Q-Si(R)3-n) …(3-1B)
-X 31 (-Q b -Si(R) n L 3-n ) h (-R 31 ) i ...(3-1A)
-[C(R 32 )(-Q d -Si(R) n L 3-n )-CH 2 -] y -C(R 32 )(R 33 )(-Q d -Si(R) n L 3 -n ) …(3-1B)
 式(3-1A)において、
 X31は、炭素原子、窒素原子、ケイ素原子、2~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基であり、
 Qは、単結合又は2価の連結基であり、
 R31は、水素原子、水酸基又はアルキル基であり、
 hは2以上の整数であり、iは0以上の整数であり、
 R、L、及びnの定義及び具体例は、反応性シリル基内の各符号の定義及び具体例と同じである。
In formula (3-1A),
X 31 is a carbon atom, a nitrogen atom, a silicon atom, a di- to octavalent organopolysiloxane residue, or a group having a (h+i+1)-valent ring;
Q b is a single bond or a divalent linking group,
R 31 is a hydrogen atom, a hydroxyl group or an alkyl group,
h is an integer of 2 or more, i is an integer of 0 or more,
The definitions and specific examples of R, L, and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
 式(3-1B)において、
 R32は、水素原子又は炭素数1~10のアルキル基であり、
 Qは、単結合又はアルキレン基であり、
 R33は、水素原子又はハロゲン原子であり、
 yは、2~10の整数であり、
 R、L、及びnの定義及び具体例は、反応性シリル基内の各符号の定義及び具体例と同じである。
In formula (3-1B),
R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms,
Q d is a single bond or an alkylene group,
R 33 is a hydrogen atom or a halogen atom,
y is an integer from 2 to 10,
The definitions and specific examples of R, L, and n are the same as the definitions and specific examples of each symbol in the reactive silyl group.
 X31は、炭素原子、窒素原子、ケイ素原子、2~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基である。
 2~8価のオルガノポリシロキサン残基としては、2価のオルガノポリシロキサン残基、及び、後述する(w2+1)価のオルガノポリシロキサン残基が挙げられる。
X 31 is a carbon atom, a nitrogen atom, a silicon atom, a 2- to 8-valent organopolysiloxane residue, or a group having a (h+i+1)-valent ring.
Examples of the divalent to octavalent organopolysiloxane residues include divalent organopolysiloxane residues and (w2+1)-valent organopolysiloxane residues described below.
 X31が(h+i+1)価の環を有する基である場合、Z、(-Q-Si(R)3-n)、及び-R31(i=1以上の場合)は該環を構成する原子に直接結合している。ただし、該環はオルガノポリシロキサン環以外の環である。以下、特に言及しない限り、X31における環は、オルガノポリシロキサン環以外の環を意味する。
 X31における環は、単環、縮合多環、橋かけ環、スピロ環及び集合多環のいずれであってもよく、環を構成する原子は、炭素原子のみからなる炭素環でもよく、2価以上の原子価を有するヘテロ原子と炭素原子とからなるヘテロ環でもよい。また、環を構成する原子間の結合は、単結合であってもよく、多重結合であってもよい。さらに、環は芳香族性の環であってもよく、非芳香族性の環であってもよい。
 単環としては、4員環~8員環が好ましく、5員環及び6員環がより好ましい。縮合多環としては、4員環~8員環の2以上が縮合した縮合多環が好ましく、5員環及び6員環から選ばれる環の2又は3個結合した縮合多環、及び、5員環及び6員環から選ばれる環の1又は2個と4員環1個が結合した縮合多環がより好ましい。橋かけ環としては、5員環又は6員環を最大の環とする橋かけ環が好ましく、スピロ環としては、4員環~6員環の2つからなるスピロ環が好ましい。集合多環としては、5員環及び6員環から選ばれる環の2又は3個が単結合、炭素原子の1~3個、又は原子価が2又は3のヘテロ原子1個を介して結合した集合多環が好ましい。なお、集合多環においては、各環にZ、(-Q-Si(R)3-n)及びR31(i=1以上の場合)のいずれかが結合していることが好ましい。
 上記環を構成するヘテロ原子としては、窒素原子、酸素原子及び硫黄原子が好ましく、窒素原子及び酸素原子がより好ましい。環を構成するヘテロ原子の数は3個以下が好ましい。また、環を構成するヘテロ原子の数が2個以上の場合、それらのヘテロ原子は同じでも異なっていてもよい。
When X 31 is a group having a (h+i+1)-valent ring, Z, (-Q b -Si(R) n L 3-n ), and -R 31 (when i=1 or more) represent the ring. It is directly bonded to its constituent atoms. However, the ring is a ring other than an organopolysiloxane ring. Hereinafter, unless otherwise specified, the ring in X 31 means a ring other than an organopolysiloxane ring.
The ring in X 31 may be a monocyclic ring, a fused polycyclic ring, a bridged ring, a spiro ring, or an assembled polycyclic ring, and the atoms constituting the ring may be a carbocyclic ring consisting only of carbon atoms, or a divalent ring. A heterocycle consisting of a heteroatom having the above valence and a carbon atom may also be used. Further, the bond between atoms constituting the ring may be a single bond or a multiple bond. Furthermore, the ring may be an aromatic ring or a non-aromatic ring.
The monocyclic ring is preferably a 4- to 8-membered ring, more preferably a 5-membered ring or a 6-membered ring. The fused polycyclic ring is preferably a fused polycyclic ring in which two or more 4- to 8-membered rings are fused together, and fused polycyclic rings in which 2 or 3 rings selected from 5-membered rings and 6-membered rings are bonded together; A fused polycyclic ring in which one or two rings selected from membered rings and six-membered rings and one four-membered ring are bonded is more preferred. The bridged ring is preferably a bridged ring whose largest ring is a 5- or 6-membered ring, and the spiro ring is preferably a spiro ring consisting of two 4- to 6-membered rings. As a collective polycyclic ring, two or three rings selected from 5-membered rings and 6-membered rings are bonded via a single bond, 1 to 3 carbon atoms, or 1 heteroatom with a valence of 2 or 3. A set of polycyclic rings is preferred. In addition, in the set polycycle, it is preferable that each ring is bonded with either Z, (-Q b -Si(R) n L 3-n ), or R 31 (when i=1 or more) .
The hetero atoms constituting the ring are preferably nitrogen atoms, oxygen atoms, and sulfur atoms, and more preferably nitrogen atoms and oxygen atoms. The number of heteroatoms constituting the ring is preferably 3 or less. Furthermore, when the number of heteroatoms constituting the ring is two or more, these heteroatoms may be the same or different.
 X31における環としては、化合物を製造しやすい観点、並びに表面処理層の耐摩耗性、耐光性及び耐薬品性がさらに優れる観点から、3~8員環の脂肪族環、ベンゼン環、3~8員環のヘテロ環、これらの環のうちの2又は3個が縮合した縮合環、5員環又は6員環を最大の環とする橋かけ環、及び、これらの環のうちの2つ以上を有し、連結基が単結合、炭素数3以下のアルキレン基、酸素原子又は硫黄原子である集合多環からなる群より選択される1種が好ましい。
 好ましい環は、ベンゼン環、5員又は6員の脂肪族環、窒素原子又は酸素原子を有する5員又は6員のヘテロ環、及び、5員又は6員の炭素環と4~6員のヘテロ環との縮合環である。
 具体的な環としては、以下に示す環と、1,3-シクロヘキサジエン環、1,4-シクロヘキサジエン環、アントラセン環、シクロプロパン環、デカヒドロナフタレン環、ノルボルネン環、ノルボルナジエン環、フラン環、ピロール環、チオフェン環、ピラジン環、モルホリン環、アジリジン環、イソキノリン環、オキサゾール環、イソオキサゾール環、チアゾール環、イミダゾール環、ピラゾール環、ピラン環、ピリダジン環、ピリミジン環、及びインデン環が挙げられる。なお、以下には、オキソ基(=O)を有する環も示す。
The ring in X 31 is a 3- to 8-membered aliphatic ring, a benzene ring, a 3- to 8-membered aliphatic ring, from the viewpoint of easy production of the compound, and from the viewpoint of further improving the abrasion resistance, light resistance, and chemical resistance of the surface treatment layer. 8-membered heterocycles, fused rings in which two or three of these rings are fused together, bridged rings in which the largest ring is a 5- or 6-membered ring, and two of these rings One type selected from the group consisting of an aggregated polycyclic ring having the above and whose connecting group is a single bond, an alkylene group having 3 or less carbon atoms, an oxygen atom or a sulfur atom is preferable.
Preferred rings include a benzene ring, a 5- or 6-membered aliphatic ring, a 5- or 6-membered heterocycle having a nitrogen atom or an oxygen atom, and a 5- or 6-membered carbon ring and a 4- to 6-membered heterocycle. It is a fused ring with a ring.
Specific rings include the rings shown below, 1,3-cyclohexadiene ring, 1,4-cyclohexadiene ring, anthracene ring, cyclopropane ring, decahydronaphthalene ring, norbornene ring, norbornadiene ring, furan ring, Examples include a pyrrole ring, a thiophene ring, a pyrazine ring, a morpholine ring, an aziridine ring, an isoquinoline ring, an oxazole ring, an isoxazole ring, a thiazole ring, an imidazole ring, a pyrazole ring, a pyran ring, a pyridazine ring, a pyrimidine ring, and an indene ring. In addition, below, a ring having an oxo group (=O) is also shown.
 X31における環を構成する原子の環を構成しない結合手は、Z、(-Q-Si(R)3-n)又はR31(i=1以上の場合)に結合する結合手であり、残余の結合手がある場合は水素原子や置換基に結合している。該置換基としては、ハロゲン原子、アルキル基(炭素-炭素原子間にエーテル性酸素原子を含んでいてもよい。)、シクロアルキル基、アルケニル基、アリル基、アルコキシ基、オキソ基(=O)等が挙げられる。
 また、環を構成する炭素原子の1個がZ、(-Q-Si(R)3-n)、又は-R31(i=1以上の場合)に結合できる結合手を2つ有する場合、その1個の炭素原子にZ、(-Q-Si(R)3-n)、及び-R31のうちの任意の2つが結合していてもよい。ZとQとは別の環構成原子に結合していることが好ましい。i個のR31はそれぞれ別個の環構成原子に結合していてもよく、i個のR31のうちの2個が1個の環構成炭素原子に結合していてもよい。2個のR31が結合した環構成炭素原子が2個以上存在してもよい。
The bond that does not constitute a ring of the atom that constitutes the ring in If there are any remaining bonds, they are bonded to hydrogen atoms or substituents. Examples of the substituent include a halogen atom, an alkyl group (which may contain an etheric oxygen atom between carbon atoms), a cycloalkyl group, an alkenyl group, an allyl group, an alkoxy group, and an oxo group (=O). etc.
In addition, one carbon atom constituting the ring has two bonds that can be bonded to Z, (-Q b -Si(R) n L 3-n ), or -R 31 (when i = 1 or more). If it has, any two of Z, (-Q b -Si(R) n L 3-n ), and -R 31 may be bonded to that one carbon atom. It is preferable that Z and Q b are bonded to different ring constituent atoms. Each of the i R 31s may be bonded to a separate ring atom, or two of the i R 31s may be bonded to one ring carbon atom. There may be two or more ring-constituting carbon atoms to which two R 31s are bonded.
 なかでも、X31は、表面処理層の耐摩耗性を向上させる観点から、炭素原子、窒素原子、ケイ素原子、4~8価のオルガノポリシロキサン残基、又は(h+i+1)価の環を有する基が好ましく、炭素原子がより好ましい。 Among these, X 31 is a group having a carbon atom, a nitrogen atom, a silicon atom, a 4- to 8-valent organopolysiloxane residue, or a (h+i+1)-valent ring, from the viewpoint of improving the abrasion resistance of the surface treatment layer. is preferable, and carbon atom is more preferable.
 Qは、単結合又は2価の連結基である。
 2価の連結基としては、例えば、2価の炭化水素基、2価の複素環基、-O-、-S-、-SO-、-N(R)-、-C(O)-、-Si(R-及び、これらを2種以上組み合わせた基が挙げられる。上記Rは、アルキル基(好ましくは炭素数1~10)又はフェニル基である。上記Rは、水素原子又はアルキル基(好ましくは炭素数1~10)である。
 2価の炭化水素基としては、飽和炭化水素基及び不飽和炭化水素基が挙げられる。前記炭化水素基は、直鎖状、分岐鎖状、又は環状であってもよい。炭化水素基としては、アルキレン基及びアルキニレン基が挙げられる。アルキレン基の炭素数は1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、例えば2、3、8、9、11が挙げられる。アルキニレン基の炭素数は2~20が好ましく、例えば2、3、8、9、11が挙げられる。
 上記これらを2種以上組み合わせた基としては、例えば、-OC(O)-、-C(O)O-、-C(O)S-、-C(O)N(R)-、-N(R)C(O)-、-N(R)C(O)N(R)-、-N(R)C(O)O-、-OC(O)N(R)-、-SON(R)-、-N(R)SO-、これらとアルキレン基との組み合わせ等が挙げられる。
 一態様において、Qとしては、単結合及びアルキレン基が好ましい。
Q b is a single bond or a divalent linking group.
Examples of divalent linking groups include divalent hydrocarbon groups, divalent heterocyclic groups, -O-, -S-, -SO 2 -, -N(R d )-, -C(O) -, -Si(R a ) 2 -, and a combination of two or more thereof. The above R a is an alkyl group (preferably having 1 to 10 carbon atoms) or a phenyl group. The above R d is a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Examples of divalent hydrocarbon groups include saturated hydrocarbon groups and unsaturated hydrocarbon groups. The hydrocarbon group may be linear, branched, or cyclic. Hydrocarbon groups include alkylene groups and alkynylene groups. The alkylene group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms. The alkynylene group preferably has 2 to 20 carbon atoms, such as 2, 3, 8, 9, and 11 carbon atoms.
Examples of groups combining two or more of the above-mentioned types include -OC(O)-, -C(O)O-, -C(O)S-, -C(O)N(R d )-, - N(R d )C(O)-, -N(R d )C(O)N(R d )-, -N(R d )C(O)O-, -OC(O)N(R d )-, -SO 2 N(R d )-, -N(R d )SO 2 -, a combination of these and an alkylene group, and the like.
In one embodiment, Q b is preferably a single bond or an alkylene group.
 R31は、水素原子、水酸基又はアルキル基である。
 アルキル基の炭素数は、1~5が好ましく、1~3がより好ましく、1がさらに好ましい。
R 31 is a hydrogen atom, a hydroxyl group or an alkyl group.
The number of carbon atoms in the alkyl group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.
 hは2以上の整数であり、iは0以上の整数である。
 X31が窒素原子の場合、hは2であり、iは1である。
 X31が炭素原子又はケイ素原子の場合、hは2又は3であり、iは0又は1であり、h+i=3を満たす。
 X31が2~8価のオルガノポリシロキサン残基の場合、hは2~7の整数であり、iは0~5の整数であり、h+i=1~7を満たす。
 X31が(h+i+1)価の環を有する基の場合、hは2~7の整数であり、iは0~5の整数であり、h+i=1~7を満たす。
 2個以上の(-Q-Si(R)3-n)は、同一であっても異なっていてもよい。R31が2個以上ある場合は、2個以上の(-R31)は、同一であっても異なっていてもよい。
h is an integer of 2 or more, and i is an integer of 0 or more.
When X 31 is a nitrogen atom, h is 2 and i is 1.
When X 31 is a carbon atom or a silicon atom, h is 2 or 3, i is 0 or 1, and h+i=3 is satisfied.
When X 31 is a divalent to octavalent organopolysiloxane residue, h is an integer of 2 to 7, i is an integer of 0 to 5, and h+i=1 to 7 is satisfied.
When X 31 is a group having a (h+i+1)-valent ring, h is an integer of 2 to 7, i is an integer of 0 to 5, and h+i=1 to 7 is satisfied.
Two or more (-Q b -Si(R) n L 3-n ) may be the same or different. When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
 なかでも、表面処理層の耐摩耗性を向上させる観点からは、iは0であることが好ましい。 Among these, i is preferably 0 from the viewpoint of improving the wear resistance of the surface treatment layer.
 R32は、水素原子又は炭素数1~10のアルキル基であり、化合物を製造しやすい観点から、水素原子であることが好ましい。
 アルキル基としては、メチル基が好ましい。
R 32 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
As the alkyl group, a methyl group is preferred.
 Qは、単結合又はアルキレン基である。アルキレン基の炭素数は、1~16が好ましく、1~10がより好ましく、1~6がさらに好ましい。化合物を製造しやすい観点から、Qは、単結合又は-CH-であることが好ましい。 Q d is a single bond or an alkylene group. The alkylene group preferably has 1 to 16 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 carbon atoms. From the viewpoint of easy production of the compound, Q d is preferably a single bond or -CH 2 -.
 R33は、水素原子又はハロゲン原子であり、化合物を製造しやすい観点から、水素原子であることが好ましい。 R 33 is a hydrogen atom or a halogen atom, and is preferably a hydrogen atom from the viewpoint of easy production of the compound.
 yは、2~10の整数であり、2~6の整数であることが好ましい。
 2個以上の[C(R32)(-Q-Si(R)3-n)-CH-]は、同一であっても異なってもよい。
y is an integer from 2 to 10, preferably from 2 to 6.
Two or more [C(R 32 )(-Q d -Si(R) n L 3-n )-CH 2 -] may be the same or different.
 式(1)におけるY[-Si(R)3-nで表される基としては、基(3-1A-1)~(3-1A-7)が好ましい。g=1の場合、Y[-Si(R)3-nは基(3-1A-1)である。基(3-1A-2)~(3-1A-7)は基(3-1A)の具体例である。
 -Si(R)3-n  …(3-1A-1)
 -N[-Qb2-Si(R)3-n  …(3-1A-2)
 -Si(R)[-Qb3-Si(R)3-n  …(3-1A-3)
 -C[-(O)u4-Qb4-Si(R)3-n3-w1(-R31w1  …(3-1A-4)
 -Si[-Qb5-Si(R)3-n  …(3-1A-5)
 -Z[-Qb6-Si(R)3-nw2  …(3-1A-6)
 -Z[-(O-Qb4u4-Si(R)3-nw3(-OH)w4  …(3-1A-7)
 なお、式(3-1A-1)~(3-1A-7)中、R、L、及び、nの定義は、上述した通りである。
The group represented by Y 1 [-Si(R) n L 3-n ] g in formula (1) is preferably groups (3-1A-1) to (3-1A-7). When g=1, Y 1 [-Si(R) n L 3-n ] g is a group (3-1A-1). Groups (3-1A-2) to (3-1A-7) are specific examples of group (3-1A).
-Si(R) n L 3-n ...(3-1A-1)
-N[-Q b2 -Si(R) n L 3-n ] 2 ...(3-1A-2)
-Si(R g ) [-Q b3 -Si(R) n L 3-n ] 2 ...(3-1A-3)
-C[-(O) u4 -Q b4 -Si(R) n L 3-n ] 3-w1 (-R 31 ) w1 ...(3-1A-4)
-Si[-Q b5 -Si(R) n L 3-n ] 3 ...(3-1A-5)
-Z a [-Q b6 -Si(R) n L 3-n ] w2 ...(3-1A-6)
-Z c [-(O-Q b4 ) u4 -Si(R) n L 3-n ] w3 (-OH) w4 ...(3-1A-7)
Note that in formulas (3-1A-1) to (3-1A-7), the definitions of R, L, and n are as described above.
 Qb2は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間に、2価のオルガノポリシロキサン残基、エーテル性酸素原子若しくは-NH-を有する基である。
 Qb2で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb2で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間に、2価のオルガノポリシロキサン残基、エーテル性酸素原子又は-NH-を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
Q b2 is an alkylene group or a group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b2 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The number of carbon atoms in the group having a divalent organopolysiloxane residue, an ether oxygen atom, or -NH- between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b2 is 2 to 20. is preferable, 2 to 10 is more preferable, and 2 to 6 is even more preferable.
 Qb2としては、化合物を製造しやすい観点から、-CHCHCH-、-CHCHOCHCHCH-が好ましい(ただし、右側がSiに結合する。)。 As Q b2 , -CH 2 CH 2 CH 2 -, -CH 2 CH 2 OCH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound (provided that the right side is bonded to Si).
 2個の[-Qb2-Si(R)3-n]は、同一であっても異なっていてもよい。 The two [-Q b2 -Si(R) n L 3-n ] may be the same or different.
 基(3-1A-2)の具体例としては、以下の基が挙げられる。下記式中、*はZとの結合位置を表す。また、式中、反応性シリル基に結合する(CHαにおけるαはメチレン基の数を表す整数であり、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば、2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。同一化合物中に含まれる複数のαは同一であっても異なっていてもよいが、同一であることが好ましい。例えば、同一化合物中に含まれる複数のαが全て2、3、8、9、11である。以下同様である。 Specific examples of the group (3-1A-2) include the following groups. In the following formula, * represents the bonding position with Z. Further, in the formula, α in (CH 2 ) α bonded to the reactive silyl group is an integer representing the number of methylene groups, preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, It may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10. A plurality of α's contained in the same compound may be the same or different, but are preferably the same. For example, all of the plurality of αs contained in the same compound are 2, 3, 8, 9, and 11. The same applies below.
 基(3-1A-3)において、Rは、水素原子、水酸基又はアルキル基である。
 Rとしては、化合物を製造しやすい観点からは、水素原子又はアルキル基が好ましい。アルキル基の炭素数は1~10が好ましく、1~4がより好ましく、メチル基がさらに好ましい。
In the group (3-1A-3), R g is a hydrogen atom, a hydroxyl group, or an alkyl group.
From the viewpoint of easy production of the compound, R g is preferably a hydrogen atom or an alkyl group. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably a methyl group.
 Qb3は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb3で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb3で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb3は、化合物を製造しやすい観点から、-CHCH-、-CHCHCH-、又は-CHCHCHCHCHCHCHCH-が好ましい。
Q b3 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b3 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms, represented by Q b3 , is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
Q b3 is preferably -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, or -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 - from the viewpoint of easy production of the compound.
 2個の[-Qb3-Si(R)3-n]は、同一であっても異なっていてもよい。 The two [-Q b3 -Si(R) n L 3-n ] may be the same or different.
 基(3-1A-3)の具体例としては、以下の基が挙げられる。下記式中、*はZとの結合位置を表す。 Specific examples of the group (3-1A-3) include the following groups. In the following formula, * represents the bonding position with Z.
 基(3-1A-4)において、Qb4は、アルキレン基であり、上記アルキレン基は-O-、-C(O)N(R)-(Rの定義は、上述した通りである。)、シルフェニレン骨格基、2価のオルガノポリシロキサン残基又はジアルキルシリレン基を有していてもよく、有していなくてもよい。
 なお、アルキレン基が-O-又はシルフェニレン骨格基を有する場合、炭素原子-炭素原子間に-O-又はシルフェニレン骨格基を有することが好ましい。また、アルキレン基が-C(O)N(R)-、ジアルキルシリレン基又は2価のオルガノポリシロキサン残基を有する場合、炭素原子-炭素原子間又は(O)u4と結合する側の末端にこれらの基を有することが好ましい。
 Qb4で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記範囲は1~10であってもよい。    
In the group (3-1A-4), Q b4 is an alkylene group, and the alkylene group is -O-, -C(O)N(R d )- (the definition of R d is as described above) ), may or may not have a silphenylene skeleton group, a divalent organopolysiloxane residue, or a dialkylsilylene group.
In addition, when the alkylene group has -O- or a silphenylene skeleton group, it is preferable to have -O- or a silphenylene skeleton group between carbon atoms. In addition, when the alkylene group has -C(O)N(R d )-, a dialkylsilylene group, or a divalent organopolysiloxane residue, the terminal between carbon atoms or the side bonded to (O) u4 preferably has these groups.
The number of carbon atoms in the alkylene group represented by Q b4 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the range may be from 1 to 10.
 u4は、0又は1である。
 -(O)u4-Qb4-としては、化合物を製造しやすい観点から、-CHCH-、-CHCHCH-、-CHOCHCHCH-、-CHOCHCHCHCHCH-、-OCHCHCH-、-OSi(CHCHCHCH-、-OSi(CHOSi(CHCHCHCH-、及び-CHCHCHSi(CHPhSi(CHCHCH-が好ましい(ただし、右側がSiに結合する。)。
u4 is 0 or 1.
-(O) u4 -Q b4 - includes -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 OCH 2 CH 2 CH 2 -, -CH 2 from the viewpoint of easy production of the compound. OCH 2 CH 2 CH 2 CH 2 CH 2 -, -OCH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -, -OSi(CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 CH 2 -- and --CH 2 CH 2 CH 2 Si(CH 3 ) 2 PhSi(CH 3 ) 2 CH 2 CH 2 -- are preferred (however, the right side is bonded to Si).
 w1は、0又は1であり、0がより好ましい。
 [-(O)u4-Qb4-Si(R)3-n]が2個以上ある場合は、2個以上の[-(O)u4-Qb4-Si(R)3-n]は、同一であっても異なっていてもよい。
 R31が2個以上ある場合は、2個以上の(-R31)は、同一であっても異なっていてもよい。
w1 is 0 or 1, and 0 is more preferable.
If there are two or more [-(O) u4 -Q b4 -Si(R) n L 3-n ], two or more [-(O) u4 -Q b4 -Si(R) n L 3- n ] may be the same or different.
When there are two or more R 31 s, two or more (-R 31 )s may be the same or different.
 基(3-1A-4)の具体例としては、以下の基が挙げられる。下記式中、*はZとの結合位置を表す。 Specific examples of the group (3-1A-4) include the following groups. In the following formula, * represents the bonding position with Z.
 基(3-1A-5)において、Qb5は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb5で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb5で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb5としては、化合物を製造しやすい観点から、-CHCHCH-、及び-CHCHOCHCHCH-が好ましい(ただし、右側がSi(R)3-nに結合する。)。
In the group (3-1A-5), Q b5 is an alkylene group, or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms. It is.
The number of carbon atoms in the alkylene group represented by Q b5 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The number of carbon atoms in the group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b5 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
From the viewpoint of easy production of the compound, Q b5 is preferably -CH 2 CH 2 CH 2 - and -CH 2 CH 2 OCH 2 CH 2 CH 2 - (provided that the right side is Si(R) n L 3- bond to n ).
 3個の[-Qb5-Si(R)3-n]は、同一であっても異なっていてもよい。 The three [-Q b5 -Si(R) n L 3-n ] may be the same or different.
 基(3-1A-5)の具体例としては、以下の基が挙げられる。下記式中、*はZとの結合位置を表す。 Specific examples of the group (3-1A-5) include the following groups. In the following formula, * represents the bonding position with Z.
 基(3-1A-6)において、Zは、(w2+1)価のオルガノポリシロキサン残基、又は、(w2+1)価であって、オルガノポリシロキサン残基とオルガノポリシロキサン残基との間にアルキレン基を有する基である。
 w2は、2~7の整数である。
 (w2+1)価のオルガノポリシロキサン残基、及び、(w2+1)価であって、オルガノポリシロキサン残基とオルガノポリシロキサン残基との間にアルキレン基を有する基としては、下記の基が挙げられる。ただし、下式におけるRは、上述の通りである。
In the group (3-1A-6), Z a is a (w2+1)-valent organopolysiloxane residue, or a (w2+1)-valent organopolysiloxane residue between the organopolysiloxane residues. It is a group having an alkylene group.
w2 is an integer from 2 to 7.
Examples of (w2+1)-valent organopolysiloxane residues and (w2+1)-valent groups having an alkylene group between organopolysiloxane residues include the following groups: . However, R a in the following formula is as described above.
 Qb6は、アルキレン基、又は、炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子若しくは2価のオルガノポリシロキサン残基を有する基である。
 Qb6で表されるアルキレン基の炭素数は、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよい。
 Qb6で表される炭素数2以上のアルキレン基の炭素原子-炭素原子間にエーテル性酸素原子又は2価のオルガノポリシロキサン残基を有する基の炭素数は、2~20が好ましく、2~10がより好ましく、2~6がさらに好ましい。
 Qb6としては、化合物を製造しやすい観点から、-CHCH-、及び-CHCHCH-が好ましい。
 w2個の[-Qb6-Si(R)n33-n]は、同一であっても異なっていてもよい。
Q b6 is an alkylene group or a group having an ether oxygen atom or a divalent organopolysiloxane residue between carbon atoms of an alkylene group having 2 or more carbon atoms.
The number of carbon atoms in the alkylene group represented by Q b6 is preferably 1 to 30, more preferably 1 to 20, even more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. . Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10.
The carbon number of the group having an ether oxygen atom or a divalent organopolysiloxane residue between the carbon atoms of the alkylene group having 2 or more carbon atoms represented by Q b6 is preferably 2 to 20, and 2 to 20. 10 is more preferable, and 2 to 6 is even more preferable.
As Q b6 , -CH 2 CH 2 - and -CH 2 CH 2 CH 2 - are preferable from the viewpoint of easy production of the compound.
w2 [-Q b6 -Si(R) n3 L 3-n ] may be the same or different.
 基(3-1A-6)の具体例としては、以下の基が挙げられる。下記式中、*は、Zとの結合位置を表す。 Specific examples of the group (3-1A-6) include the following groups. In the following formula, * represents the bonding position with Z.
 基(3-1A-7)において、Zは(w3+w4+1)価の炭化水素基である。
 w3は、4以上の整数である。
 w4は、0以上の整数である。
 Qb4、及びu4の定義及び好ましい範囲は基(3-1A-4)中の各符号の定義と同じである。
In group (3-1A-7), Z c is a (w3+w4+1)-valent hydrocarbon group.
w3 is an integer of 4 or more.
w4 is an integer greater than or equal to 0.
The definitions and preferred ranges of Q b4 and u4 are the same as the definitions of each symbol in group (3-1A-4).
 Zは炭化水素鎖からなってもよく、炭化水素鎖の炭素原子-炭素原子間にエーテル性酸素原子を有してもよく、炭化水素鎖からなることが好ましい。
 Zの価数は5~20価が好ましく、5~10価がより好ましく、5~8価がさらに好ましく、5~6価が特に好ましい。
 Zの炭素数は3~50が好ましく、4~40がより好ましく、5~30がさらに好ましい。
 w3は、4~20が好ましく、4~16がより好ましく、4~8がさらに好ましく、4~5が特に好ましい。
 w4は、0~10が好ましく、0~8がより好ましく、0~6がさらに好ましく、0~3が特に好ましく、0~1が最も好ましい。
 2個以上の[-(O-Qb4u4-Si(R3-n]は、同一であっても異なっていてもよい。
Z c may consist of a hydrocarbon chain, may have an ether oxygen atom between carbon atoms of the hydrocarbon chain, and is preferably composed of a hydrocarbon chain.
The valence of Z c is preferably 5 to 20, more preferably 5 to 10, even more preferably 5 to 8, particularly preferably 5 to 6.
The number of carbon atoms in Z c is preferably 3 to 50, more preferably 4 to 40, even more preferably 5 to 30.
w3 is preferably from 4 to 20, more preferably from 4 to 16, even more preferably from 4 to 8, particularly preferably from 4 to 5.
w4 is preferably 0 to 10, more preferably 0 to 8, even more preferably 0 to 6, particularly preferably 0 to 3, and most preferably 0 to 1.
Two or more [-(O-Q b4 ) u4 -Si(R 1 ) n L 3-n ] may be the same or different.
 基(3-1A-7)の具体例としては、以下の基が挙げられる。下記式中、*はZとの結合位置を表す。 Specific examples of the group (3-1A-7) include the following groups. In the following formula, * represents the bonding position with Z.
 式(1)におけるYは、基(g2-1)~(g2-6)であってもよい。式中、*はZとの結合部位を表す。 Y 1 in formula (1) may be groups (g2-1) to (g2-6). In the formula, * represents a bonding site with Z.
*-C(Re23-e2(-Q22-)e2   …(g2-2)
*-N(-Q23-)          …(g2-3)
*-Z(-Q24-)h2         …(g2-4)
*-Si(Re33-i2(-Q25-)i2  …(g2-5)
*-CH(-Q22-)-Si(Re33-i3(-Q25-)i3  …(g2-6)
*-C(R e2 ) 3-e2 (-Q 22 -) e2 ...(g2-2)
*-N(-Q 23 -) 2 ...(g2-3)
*-Z 1 (-Q 24 -) h2 ...(g2-4)
*-Si(R e3 ) 3-i2 (-Q 25 -) i2 ...(g2-5)
*-CH(-Q 22 -)-Si(R e3 ) 3-i3 (-Q 25 -) i3 ...(g2-6)
 ただし、式(g2-1)~(g2-6)においては、*側がZに接続し、Q22、Q23、Q24、又はQ25側が[-Si(R)3-n]に接続する。
 Q11は、単結合、-O-、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基である。
 Q22は、アルキレン基、炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基、アルキレン基のSiに接続しない側の末端に-C(O)NR-、-C(O)-、-NR-又はO-を有する基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有しかつSiに接続しない側の末端に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、Q22が2以上存在する場合、2以上のQ22は同一であっても異なっていてもよい。
 Q23は、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、2個のQ23は同一であっても異なっていてもよい。
 Q24は、Q24が結合するZにおける原子が炭素原子の場合、Q22であり、Q24が結合するZにおける原子が窒素原子の場合、Q23であり、Q24が2以上存在する場合、2以上のQ24は同一であっても異なっていてもよい。
 Q25は、アルキレン基、又は炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-又はO-を有する基であり、Q25が2以上存在する場合、2以上のQ25は同一であっても異なっていてもよい。
 Zは、Zが直接結合する炭素原子又は窒素原子を有しかつQ24が直接結合する炭素原子又は窒素原子を有する(h2+1)価の環構造を有する基である。
 Re1は、水素原子又はアルキル基であり、Re1が2以上存在する場合、2以上のRe1は同一であっても異なっていてもよい。
 Re2は、水素原子、水酸基、アルキル基又はアシルオキシ基である。
 Re3は、アルキル基である。Rは、水素原子、炭素数1~6のアルキル基又はフェニル基である。
However, in formulas (g2-1) to (g2-6), the * side is connected to Z, and the Q 22 , Q 23 , Q 24 , or Q 25 side is connected to [-Si(R) n L 3-n ]. Connecting.
Q 11 is a single bond, -O-, an alkylene group, or a bond between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 -, or It is a group having O-.
Q 22 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms, an alkylene group A group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si, or between carbon atoms of an alkylene group having 2 or more carbon atoms -C(O)NR 6 -, -C(O)-, -NR 6 - or O- at the end not connected to Si and -C(O)NR 6 -, -C(O) It is a group having -, -NR 6 - or O-, and when two or more Q 22s exist, two or more Q 22s may be the same or different.
Q 23 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , two Q23s may be the same or different.
Q 24 is Q 22 when the atom in Z 1 to which Q 24 is bonded is a carbon atom, and is Q 23 when the atom in Z 1 to which Q 24 is bonded is a nitrogen atom, and two or more Q 24 exist. In this case, two or more Q24 's may be the same or different.
Q 25 is an alkylene group or a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or O- between carbon atoms of an alkylene group having 2 or more carbon atoms; , Q 25 exists, two or more Q 25 may be the same or different.
Z 1 is a group having a (h2+1)-valent ring structure in which Z has a carbon atom or nitrogen atom to which Z is directly bonded, and Q 24 has a carbon atom or nitrogen atom to which Q 24 is directly bonded.
R e1 is a hydrogen atom or an alkyl group, and when two or more R e1s exist, two or more R e1s may be the same or different.
R e2 is a hydrogen atom, a hydroxyl group, an alkyl group, or an acyloxy group.
R e3 is an alkyl group. R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
 d2は、0~3の整数であり、1又は2であることが好ましい。
 d4は、0~3の整数であり、2又は3であることが好ましい。
 d2+d4は、2~5の整数であり、4又は5であることが好ましい。
 e2は、2又は3である。
 h2は、2以上の整数であり、2又は3であることが好ましい。
 i2は、2又は3である。
 i3は、2又は3である。
d2 is an integer from 0 to 3, preferably 1 or 2.
d4 is an integer from 0 to 3, preferably 2 or 3.
d2+d4 is an integer from 2 to 5, preferably 4 or 5.
e2 is 2 or 3.
h2 is an integer of 2 or more, preferably 2 or 3.
i2 is 2 or 3.
i3 is 2 or 3.
 Q11、Q22、Q23、Q24、及びQ25のアルキレン基の炭素数は、化合物の製造容易性に優れる観点、及び表面処理層の耐摩耗性がさらに優れる観点から、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよく、1~6であってもよく、1~4であってもよい。ただし、炭素-炭素原子間に特定の結合を有する場合のアルキレン基の炭素数の下限値は2である。 The number of carbon atoms in the alkylene groups of Q 11 , Q 22 , Q 23 , Q 24 , and Q 25 is preferably 1 to 30 from the viewpoint of excellent ease of manufacturing the compound and from the viewpoint of further improving the abrasion resistance of the surface treatment layer. It is preferably 1 to 20, more preferably 2 to 20, may be 2 to 10, or may be 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
 Zにおける環構造としては、上述した環構造が挙げられ、好ましい形態も同様である。なお、Zにおける環構造にはZやQ24が直接結合するため、例えば、環構造にアルキレン基が連結して、そのアルキレン基にZやQ24が連結することはない。 Examples of the ring structure in Z 1 include the ring structures described above, and preferred forms are also the same. Note that since Z and Q 24 are directly bonded to the ring structure of Z 1 , for example, an alkylene group is not bonded to the ring structure and Z and Q 24 are not bonded to the alkylene group.
 Re1、Re2又はRe3のアルキル基の炭素数は、化合物の製造容易性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Re2のアシルオキシ基のアルキル基部分の炭素数は、化合物の製造容易性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 h2としては、化合物の製造容易性に優れる観点、並びに、表面処理層の耐摩耗性がさらに優れる観点から、2~6が好ましく、2~4がより好ましく、2又は3がさらに好ましい。
The number of carbon atoms in the alkyl group of R e1 , R e2 or R e3 is preferably from 1 to 6, more preferably from 1 to 3, even more preferably from 1 to 2, from the viewpoint of excellent ease of manufacturing the compound.
The number of carbon atoms in the alkyl group portion of the acyloxy group of R e2 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
h2 is preferably 2 to 6, more preferably 2 to 4, and even more preferably 2 or 3, from the viewpoint of excellent ease of manufacturing the compound and further excellent wear resistance of the surface treatment layer.
 式(1)におけるYは、基(g2-7)~(g2-13)であってもよい。式中、*はZとの結合部位を示す。 Y 1 in formula (1) may be groups (g2-7) to (g2-13). In the formula, * indicates a bonding site with Z.
*-C(Re23-e2(-Q22-Ge2  …(g2-8)
*-N(-Q23-G         …(g2-9)
*-Z(-Q24-Gh2        …(g2-10)
*-Si(Re33-i2(-Q25-Gi2 …(g2-11)
*-G                 …(g2-12)
*-CH(-Q22-G)-Si(Re33-i3(-Q25-Gi3 …(g2-13)
*-C(R e2 ) 3-e2 (-Q 22 -G 1 ) e2 ...(g2-8)
*-N(-Q 23 -G 1 ) 2 ...(g2-9)
*-Z 1 (-Q 24 -G 1 ) h2 ...(g2-10)
*-Si(R e3 ) 3-i2 (-Q 25 -G 1 ) i2 ...(g2-11)
*-G 1 ...(g2-12)
*-CH(-Q 22 -G 1 )-Si(R e3 ) 3-i3 (-Q 25 -G 1 ) i3 ...(g2-13)
 ただし、式(g2-7)~(g2-13)においては、*側がZに接続し、G側が[-Si(R)3-n]に接続する。Gは、基(g3)であり、Yが有する2以上のGは同一であっても異なっていてもよい。G以外の符号は、式(g2-1)~(g2-6)における符号と同じである。
 -Si(R3-k3(-Q-)k3  …(g3)
 ただし、式(g3)においては、Si側がQ22、Q23、Q24、及びQ25に接続し、Q側が[-Si(R)3-n]に接続する。Rは、アルキル基である。Qは、アルキレン基、炭素数2以上のアルキレン基の炭素-炭素原子間に-C(O)NR-、-C(O)-、-NR-若しくは-O-を有する基、又は(OSi(R-O-であり、2以上のQは同一であっても異なっていてもよい。k3は、2又は3である。Rは、水素原子、炭素数1~6のアルキル基又はフェニル基である。Rは、アルキル基、フェニル基又はアルコキシ基であり、2個のRは同一であっても異なっていてもよい。pは、0~5の整数であり、pが2以上の場合、2以上の(OSi(R)は同一であっても異なっていてもよい。
However, in formulas (g2-7) to (g2-13), the * side is connected to Z, and the G 1 side is connected to [-Si(R) n L 3-n ]. G 1 is a group (g3), and two or more G 1s in Y 1 may be the same or different. The symbols other than G 1 are the same as those in equations (g2-1) to (g2-6).
-Si(R 8 ) 3-k3 (-Q 3 -) k3 ...(g3)
However, in formula (g3), the Si side is connected to Q 22 , Q 23 , Q 24 , and Q 25 , and the Q 3 side is connected to [-Si(R) n L 3-n ]. R 8 is an alkyl group. Q 3 is an alkylene group, a group having -C(O)NR 6 -, -C(O)-, -NR 6 - or -O- between carbon atoms of an alkylene group having 2 or more carbon atoms, or (OSi(R 9 ) 2 ) p -O-, and two or more Q 3 may be the same or different. k3 is 2 or 3. R 6 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. R 9 is an alkyl group, a phenyl group, or an alkoxy group, and two R 9s may be the same or different. p is an integer from 0 to 5, and when p is 2 or more, two or more (OSi(R 9 ) 2 ) may be the same or different.
 Qのアルキレン基の炭素数は、化合物の製造容易性に優れる観点、並びに、表面処理層の耐摩耗性がさらに優れる観点から、1~30が好ましく、1~20がより好ましく、2~20がさらに好ましく、2~10であってもよく、2~6であってもよい。例えば2、3、8、9、11が挙げられる。また、前記炭素数は1~10であってもよく、1~6であってもよく、1~4であってもよい。ただし、炭素-炭素原子間に特定の結合を有する場合のアルキレン基の炭素数の下限値は2である。
 Rのアルキル基の炭素数は、化合物の製造容易性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Rのアルキル基の炭素数は、化合物の製造容易性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 Rのアルコキシ基の炭素数は、化合物の保存安定性に優れる観点から、1~6が好ましく、1~3がより好ましく、1~2がさらに好ましい。
 pは、0又は1が好ましい。
The number of carbon atoms in the alkylene group of Q 3 is preferably 1 to 30, more preferably 1 to 20, more preferably 2 to 20, from the viewpoint of excellent ease of manufacturing the compound and from the viewpoint of further excellent wear resistance of the surface treatment layer. is more preferable, and may be from 2 to 10, or from 2 to 6. Examples include 2, 3, 8, 9, and 11. Further, the number of carbon atoms may be 1 to 10, 1 to 6, or 1 to 4. However, when the alkylene group has a specific bond between carbon atoms, the lower limit of the number of carbon atoms is 2.
The number of carbon atoms in the alkyl group of R 8 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
The number of carbon atoms in the alkyl group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent ease of manufacturing the compound.
The number of carbon atoms in the alkoxy group of R 9 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2 from the viewpoint of excellent storage stability of the compound.
p is preferably 0 or 1.
 化合物(1)としては、例えば、下式の化合物が挙げられる。下式の化合物は、工業的に製造しやすく、取扱いやすく、表面処理層の耐摩耗性がさらに優れる観点から好ましい。下式の化合物におけるWは、式(1)におけるAr-Z-と同様であり、好ましい形態も同様である。 Examples of the compound (1) include compounds of the following formula. The compound of the following formula is preferred from the viewpoints of easy industrial production, ease of handling, and superior abrasion resistance of the surface treatment layer. W in the compound of the following formula is the same as Ar-Z- in formula (1), and its preferred form is also the same.
 Yが基(g2-1)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-1) include compounds of the following formula.
 Yが基(g2-2)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-2) include compounds of the following formula.

 

 
 Yが基(g2-3)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-3) include compounds of the following formula.
 Yが基(g2-4)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-4) include compounds of the following formula.
 Yが基(g2-5)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-5) include compounds of the following formula.
 Yが基(g2-6)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-6) include compounds of the following formula.
 Yが基(g2-7)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-7) include compounds of the following formula.
 Yが基(g2-8)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-8) include compounds of the following formula.
 Yが基(g2-9)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-9) include compounds of the following formula.
 Yが基(g2-10)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-10) include compounds of the following formula.
 Yが基(g2-11)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-11) include compounds of the following formula.
 Yが基(g2-12)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-12) include compounds of the following formula.
 Yが基(g2-13)である化合物(1)としては、例えば、下式の化合物が挙げられる。 Examples of the compound (1) in which Y 1 is a group (g2-13) include compounds of the following formula.
 式(1)においてg=1である本開示の化合物としては、例えば、以下の化合物が挙げられる。 Examples of the compounds of the present disclosure where g=1 in formula (1) include the following compounds.
 式(1)においてgが2以上であり、Yが基(3-1A-4)である本開示の化合物としては、例えば、以下の化合物が挙げられる。 Examples of the compounds of the present disclosure in which g is 2 or more in formula (1) and Y 1 is a group (3-1A-4) include the following compounds.
 式(1)においてgが2以上であり、Yが基(3-1A-6)である本開示の化合物としては、例えば、以下の化合物が挙げられる。 Examples of the compounds of the present disclosure in which g is 2 or more in formula (1) and Y 1 is a group (3-1A-6) include the following compounds.
 本開示の化合物の数平均分子量(Mn)は、400~20,000であることが好ましく、500~18,000であることがより好ましく、600~1,5000であることがさらに好ましい。Mnが400以上であれば、撥水性かつ耐摩耗性に優れる。Mnが20,000以下であれば、粘性を適切な範囲内に調節しやすく、また溶解性が向上するので、成膜時のハンドリング性が優れる。 The number average molecular weight (Mn) of the compound of the present disclosure is preferably 400 to 20,000, more preferably 500 to 18,000, and even more preferably 600 to 1,5000. When Mn is 400 or more, water repellency and abrasion resistance are excellent. When Mn is 20,000 or less, the viscosity can be easily controlled within an appropriate range, and solubility is improved, resulting in excellent handling properties during film formation.
〔化合物の製造方法〕
 本開示の化合物の製造方法は特に制限されない。本開示の化合物の合成スキームの例を以下に示す。
[Method for producing compound]
The method for producing the compound of the present disclosure is not particularly limited. Examples of synthetic schemes for compounds of the present disclosure are shown below.
 一態様において、本開示の化合物は、下記式(1-1)で表される中間体のヒドロシリル化により得られる。
 Ar-Z-Y11(D)g1  ・・・(1-1)
 式(1-1)中、
 Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
 Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
 Y11は、g1が1の場合単結合であり、g1が2以上の場合(g1+1)価の連結基であり、
 Dはそれぞれ独立に、-Q-CH=CHであり、ここでQは単結合又は2価の連結基であり、
 g1は1以上の整数である。
In one embodiment, the compound of the present disclosure is obtained by hydrosilylation of an intermediate represented by the following formula (1-1).
Ar-Z-Y 11 (D) g1 ...(1-1)
In formula (1-1),
Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
Y11 is a single bond when g1 is 1, and is a (g1+1) valent linking group when g1 is 2 or more,
Each D is independently -Q L -CH=CH 2 , where Q L is a single bond or a divalent linking group,
g1 is an integer of 1 or more.
 式(1-1)におけるY11(D)g1は、式(1)の-Y[-Si(R)3-n における末端が-CH-CH-Si(R)3-n基である場合に、当該-CH-CH-Si(R)3-n基が-CH=CHに置き換えられたものである。 Y 11 (D) g1 in formula (1-1) is -Y 1 [-Si(R) n L 3-n ] g in formula (1) whose terminal is -CH 2 -CH 2 -Si(R) n L 3-n group, the -CH 2 -CH 2 -Si(R) n L 3-n group is replaced with -CH=CH 2 .
 本開示の化合物の中間体の一例を以下に示す。 An example of an intermediate of the compound of the present disclosure is shown below.
[組成物]
 本開示の組成物は、本開示の化合物を含んでいればよく、本開示の化合物以外の成分は特に限定されない。本開示の組成物は、本開示の化合物と、液状媒体と、を含むことが好ましい。本開示の組成物が液状媒体を含む場合、本開示の組成物は、液状であればよく、溶液であってもよく、分散液であってもよい。
 本開示の組成物は、本開示の化合物を含んでいればよく、本開示の化合物の製造工程で生成した副生物等の不純物を含んでもよい。
 本開示の組成物は、本開示の化合物を1種含有してもよく、2種以上含有してもよい。
[Composition]
The composition of the present disclosure only needs to contain the compound of the present disclosure, and components other than the compound of the present disclosure are not particularly limited. Compositions of the present disclosure preferably include a compound of the present disclosure and a liquid medium. When the composition of the present disclosure includes a liquid medium, the composition of the present disclosure may be in a liquid state, and may be a solution or a dispersion.
The composition of the present disclosure only needs to contain the compound of the present disclosure, and may contain impurities such as by-products generated in the manufacturing process of the compound of the present disclosure.
The composition of the present disclosure may contain one type of compound of the present disclosure, or may contain two or more types of compounds of the present disclosure.
 本開示の化合物の含有量は、本開示の組成物の全量に対して、0.001~40質量%が好ましく、0.01~20質量%がより好ましく、0.1~10質量%がさらに好ましい。ウェットコーティング法に使用する本開示の組成物の場合には、本開示の化合物の含有量は、本開示の組成物の全量に対して、0.01~10質量%であってもよく、0.02~5質量%であってもよく、0.03~3質量%であってもよく、0.05~2質量%であってもよい。 The content of the compound of the present disclosure is preferably 0.001 to 40% by mass, more preferably 0.01 to 20% by mass, and further preferably 0.1 to 10% by mass, based on the total amount of the composition of the present disclosure. preferable. In the case of the composition of the present disclosure used in the wet coating method, the content of the compound of the present disclosure may be 0.01 to 10% by mass, based on the total amount of the composition of the present disclosure, and 0. It may be 0.02 to 5% by weight, 0.03 to 3% by weight, or 0.05 to 2% by weight.
 液状媒体は、有機溶媒が好ましい。 The liquid medium is preferably an organic solvent.
 有機溶媒としては、水素原子及び炭素原子のみからなる化合物、並びに、水素原子、炭素原子及び酸素原子のみからなる化合物が挙げられ、具体的には、炭化水素系有機溶媒、ケトン系有機溶媒、エーテル系有機溶媒、エステル系有機溶媒、グリコール系有機溶媒、及びアルコール系有機溶媒が挙げられる。
 炭化水素系有機溶媒の具体例としては、ペンタン、ヘキサン、へプタン、オクタン、ヘキサデカン、イソヘキサン、イソオクタン、イソノナン、シクロヘプタン、シクロヘキサン、ビシクロヘキシル、ベンゼン、トルエン、エチルベンゼン、o-キシレン、m-キシレン、p-キシレン、o-ジエチルベンゼン、m-ジエチルベンゼン、p-ジエチルベンゼン、n-ブチルベンゼン、sec-ブチルベンゼン、tert-ブチルベンゼンが挙げられる。
 ケトン系有機溶媒の具体例としては、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジイソブチルケトン、シクロヘキサノン、2-ヘプタノン、4-ヘプタノン、3,5,5-トリメチル-2-シクロヘキセン-1-オン、及び3,3,5-トリメチルシクロヘキサノン、イソホロンが挙げられる。
 エーテル系有機溶媒の具体例としては、ジエチルエーテル、シクロペンチルメチルエーテル、テトラヒドロフラン、1,4-ジオキサンが挙げられる。
 エステル系有機溶媒の具体例としては、酢酸メチル、酢酸エチル、酢酸プロピル、酢酸イソプロピル、酢酸ブチル、酢酸イソブチル、酢酸tert‐ブチル、酢酸アミル、酢酸イソアミル、3-エトキシプロピオン酸エチル、乳酸エチルエチレングリコールモノブチルエーテルアセテート、ジエチレングリコールモノブチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテート、3-メトキシ-3-メチルブチルアセテート、3-メトキシブチルアセテート、プロピレングリコールモノメチルアセテート、プロピレングリコールジメチルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、シクロヘキサノールアセテート、プロピレングリコールジアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノメチルエーテルプロピオネート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノブチルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート、プロピレングリコールジアセテート、ジプロピレングリコ-ルメチルエ-テルアセテ-ト、1,3-ブチレングリコールジアセテート、1,4-ブタンジオールジアセテート、1,3-ブチレングリコールジアセテート、1,6-ヘキサンジオールジアセテート、γ-ブチロラクトン、トリアセチン、2,2,4-トリメチル-1,3-ペンタンジオールモノイソブチレートが挙げられる。
 グリコール系有機溶媒の具体例としては、エチレングリコール、エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、トリエチレングリコールモノブチルエーテル、テトラエチレングリコールモノブチルエーテル、エチレングリコールモノヘキシルエーテル、ジエチレングリコールモノヘキシルエーテル、エチレングリコールモノ-2-エチルヘキシルエーテル、ジエチレングリコールモノ-2-エチルヘキシルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノブチルエーテル、プロピレングリコールモノプロピルエーテル、エチレングリコールモノイソプロピルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノtert-ブチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノメチルエーテル、ジエチレングリコールモノイソプロピルエーテル、ジエチレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノブチルエーテル、ジプロピレングリコールモノプロピルエーテル、ジプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノブチルエーテルトリプロピレングリコールモノメチルエーテル、プロピレングリコールモノフェニルエーテル、1,3-ブチレングリコール、プロピレングリコールn-プロピルエーテル、プロピレングリコールn-ブチルエーテル、ジエチレングリコールモノエチルエーテル、ジプロピレングリコールn-プロピルエーテル、ジプロピレングリコールn-ブチルエーテル、トリプロピレングリコールメチルエーテル、トリプロピレングリコールn-ブチルエ-テル、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジブチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールジメチルエーテル、ジプロピレングリコールジメチルエーテル、ジエチレングリコールジブチルエーテル、テトラエチレングリコールジメチルエーテル、ジプロピレングリコールジメチルエーテルペンタン、トリエチレングリコールジメチルエーテル、ポリエチレングリコールジメチルエーテルが挙げられる。
 アルコール系有機溶媒の具体例としては、メタノール、エタノール、1-プロパノール、イソプロピルアルコール、n-ブタノール、ジアセトンアルコール、イソブタノール、sec-ブタノール、tert-ブタノール、ペンタノール、3-メチル-1,3-ブタンジオール、1,3-ブタンジオール、1,3-ブチレングリコール、オクタンジオール、2,4-ジエチルペンタンジオール、ブチルエチルプロパンジオール、2-メチル-1,3-プロパンジオール、4-ヒドロキシ-4-メチル-2-ペンタノン、2-エチル-1-ヘキサノール、3,5,5-トリメチル-1-ヘキサノール、イソデカノール、イソトリデカノール、3-メトキシ-3-メチル-1-ブタノール、2-メトキシブタノール、3-メトキシブタノール、シクロヘキサノール、フルフリルアルコール、テトラヒドロフルフリルアルコール、ベンジルアルコール、及びメチルシクロヘキサノールが挙げられる。
Examples of organic solvents include compounds consisting only of hydrogen atoms and carbon atoms, and compounds consisting only of hydrogen atoms, carbon atoms, and oxygen atoms. Specifically, examples include hydrocarbon-based organic solvents, ketone-based organic solvents, and ethers. Examples include organic solvents based on organic solvents, organic solvents based on esters, organic solvents based on glycol, and organic solvents based on alcohol.
Specific examples of hydrocarbon organic solvents include pentane, hexane, heptane, octane, hexadecane, isohexane, isooctane, isononane, cycloheptane, cyclohexane, bicyclohexyl, benzene, toluene, ethylbenzene, o-xylene, m-xylene, Examples include p-xylene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene, n-butylbenzene, sec-butylbenzene, and tert-butylbenzene.
Specific examples of ketone organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, 2-heptanone, 4-heptanone, 3,5,5-trimethyl-2-cyclohexen-1-one, and 3,5,5-trimethyl-2-cyclohexen-1-one. Examples include 3,5-trimethylcyclohexanone and isophorone.
Specific examples of ether organic solvents include diethyl ether, cyclopentyl methyl ether, tetrahydrofuran, and 1,4-dioxane.
Specific examples of ester organic solvents include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, tert-butyl acetate, amyl acetate, isoamyl acetate, ethyl 3-ethoxypropionate, and ethyl ethylene glycol lactate. Monobutyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, 3-methoxy-3-methylbutyl acetate, 3-methoxybutyl acetate, propylene glycol monomethyl acetate, propylene glycol dimethyl acetate, ethylene glycol Monoethyl ether acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, cyclohexanol acetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether acetate, propylene glycol mono Butyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol diacetate, dipropylene glycol methyl ether acetate, 1,3-butylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butylene glycol diacetate Examples include acetate, 1,6-hexanediol diacetate, γ-butyrolactone, triacetin, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate.
Specific examples of glycol-based organic solvents include ethylene glycol, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, and ethylene glycol mono-2. -Ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol monopropyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monotert -Butyl ether, ethylene glycol monopropyl ether, ethylene glycol monomethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, Propylene glycol monobutyl ether tripropylene glycol monomethyl ether, propylene glycol monophenyl ether, 1,3-butylene glycol, propylene glycol n-propyl ether, propylene glycol n-butyl ether, diethylene glycol monoethyl ether, dipropylene glycol n-propyl ether, Propylene glycol n-butyl ether, tripropylene glycol methyl ether, tripropylene glycol n-butyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, diethylene glycol dibutyl ether , tetraethylene glycol dimethyl ether, dipropylene glycol dimethyl ether pentane, triethylene glycol dimethyl ether, and polyethylene glycol dimethyl ether.
Specific examples of alcoholic organic solvents include methanol, ethanol, 1-propanol, isopropyl alcohol, n-butanol, diacetone alcohol, isobutanol, sec-butanol, tert-butanol, pentanol, 3-methyl-1,3 -Butanediol, 1,3-butanediol, 1,3-butylene glycol, octanediol, 2,4-diethylpentanediol, butylethylpropanediol, 2-methyl-1,3-propanediol, 4-hydroxy-4 -Methyl-2-pentanone, 2-ethyl-1-hexanol, 3,5,5-trimethyl-1-hexanol, isodecanol, isotridecanol, 3-methoxy-3-methyl-1-butanol, 2-methoxybutanol , 3-methoxybutanol, cyclohexanol, furfuryl alcohol, tetrahydrofurfuryl alcohol, benzyl alcohol, and methylcyclohexanol.
 また、有機溶媒としては、ハロゲン系有機溶媒、含窒素化合物、含硫黄化合物、シロキサン化合物が挙げられる。
 ハロゲン系有機溶媒の具体例としては、ジクロロメタン、クロロホルム、四塩化炭素、ジクロロエタン、クロロベンゼン、o-クロロトルエン、m-クロロトルエン、p-クロロトルエン、m-ジクロロベンゼン、1,2,3-トリクロロプロパンが挙げられる。
 含窒素化合物としては、ニトロベンゼン、アセトニトリル、ベンゾニトリル、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン、1,3-ジメチル-2-イミダゾリジノンが挙げられる。
 含硫黄化合物としては、二硫化炭素、ジメチルスルホキシドが挙げられる。
 シロキサン化合物としては、ヘキサメチルジシロキサン、オクタメチルトリシロキサン、デカメチルテトラシロキサンが挙げられる。
Further, examples of the organic solvent include halogenated organic solvents, nitrogen-containing compounds, sulfur-containing compounds, and siloxane compounds.
Specific examples of halogenated organic solvents include dichloromethane, chloroform, carbon tetrachloride, dichloroethane, chlorobenzene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, m-dichlorobenzene, 1,2,3-trichloropropane. can be mentioned.
Examples of nitrogen-containing compounds include nitrobenzene, acetonitrile, benzonitrile, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and 1,3-dimethyl-2-imidazolidinone.
Examples of sulfur-containing compounds include carbon disulfide and dimethyl sulfoxide.
Examples of the siloxane compound include hexamethyldisiloxane, octamethyltrisiloxane, and decamethyltetrasiloxane.
 液状媒体の含有量は、本開示の組成物の全量に対して、60~99.999質量%が好ましく、85~99.99質量%がより好ましく、90~99.9質量%がさらに好ましい。ウェットコーティング法に使用する本開示の組成物の場合には、液状媒体の含有量は、本開示の組成物の全量に対して、90~99.99質量%であってもよく、95~99.98質量%であってもよく、97~99.97質量%であってもよく、98~99.95質量%であってもよい。
 本開示の組成物に含まれる液状媒体は1種のみであってもよく、2種以上であってもよい。
The content of the liquid medium is preferably 60 to 99.999% by mass, more preferably 85 to 99.99% by mass, and even more preferably 90 to 99.9% by mass, based on the total amount of the composition of the present disclosure. In the case of the composition of the present disclosure used in a wet coating method, the content of the liquid medium may be 90-99.99% by weight, 95-99% by weight, based on the total amount of the composition of the present disclosure. It may be .98% by mass, 97 to 99.97% by mass, or 98 to 99.95% by mass.
The composition of the present disclosure may contain only one type of liquid medium, or may contain two or more types.
 本開示の組成物は、本開示の化合物及び液状媒体以外に、本開示の効果を損なわない範囲で、他の成分を含んでいてもよい。
 他の成分としては、例えば、反応性シリル基の加水分解と縮合反応を促進する酸触媒、塩基性触媒等の公知の添加剤が挙げられる。
The composition of the present disclosure may contain other components in addition to the compound of the present disclosure and the liquid medium, as long as the effects of the present disclosure are not impaired.
Examples of other components include known additives such as acid catalysts and basic catalysts that promote hydrolysis and condensation reactions of reactive silyl groups.
 また、他の成分としては、加水分解性基を有する金属化合物(以下、加水分解性基を有する金属化合物を「特定金属化合物」とも記す。)も挙げられる。本開示の組成物が特定金属化合物を含むと、表面処理層の滑り性及び防汚性をより向上しうる。特定金属化合物としては、下記式(M1)~(M3)が挙げられる。 In addition, other components include a metal compound having a hydrolyzable group (hereinafter, a metal compound having a hydrolyzable group is also referred to as a "specific metal compound"). When the composition of the present disclosure contains a specific metal compound, the slipperiness and antifouling properties of the surface treatment layer can be further improved. Specific metal compounds include the following formulas (M1) to (M3).
 M(Xb1m1(Xb2m2(Xb3m3  …(M1)
 Si(Xb4)(Xb5      …(M2)
 (Xb6Si-(Yb1)-Si(Xb7  …(M3)
M(X b1 ) m1 (X b2 ) m2 (X b3 ) m3 ...(M1)
Si(X b4 )(X b5 ) 3 ...(M2)
(X b6 ) 3 Si-(Y b1 )-Si(X b7 ) 3 ...(M3)
 式(M1)中、
 Mは、3価又は4価の金属原子を表す。
 Xb1はそれぞれ独立に、加水分解性基を表す。
 Xb2はそれぞれ独立に、シロキサン骨格含有基を表す。
 Xb3はそれぞれ独立に、炭化水素鎖含有基を表す。
 m1は2~4の整数であり、
 m2及びm3はそれぞれ独立に、0~2の整数であり、
 Mが3価の金属原子の場合、m1+m2+m3は3であり、Mが4価の金属原子の場合、m1+m2+m3は4である。
In formula (M1),
M represents a trivalent or tetravalent metal atom.
Each of X b1 independently represents a hydrolyzable group.
Each of X b2 independently represents a siloxane skeleton-containing group.
Each of X b3 independently represents a hydrocarbon chain-containing group.
m1 is an integer from 2 to 4,
m2 and m3 are each independently an integer of 0 to 2,
When M is a trivalent metal atom, m1+m2+m3 is 3, and when M is a tetravalent metal atom, m1+m2+m3 is 4.
 式(M2)中、
 Xb4は、加水分解性シランオリゴマー残基を表す。
 Xb5は、それぞれ独立に、加水分解性基又は炭素数1~4のアルキル基を表す。
In formula (M2),
X b4 represents a hydrolyzable silane oligomer residue.
Each of X b5 independently represents a hydrolyzable group or an alkyl group having 1 to 4 carbon atoms.
 式(M3)中、
 Xb6及びXb7は、それぞれ独立に、加水分解性基又は水酸基を表す。
 Yb1は、2価の有機基を表す。
In formula (M3),
X b6 and X b7 each independently represent a hydrolyzable group or a hydroxyl group.
Y b1 represents a divalent organic group.
 式(M1)中、Mで表される金属には、Si、Ge等の半金属も包含される。Mとしては、3価金属及び4価金属が好ましく、Al、Fe、In、Hf、Si、Ti、Sn、及びZrがより好ましく、Al、Si、Ti、及びZrがさらに好ましく、Siが特に好ましい。 In formula (M1), the metal represented by M also includes semimetals such as Si and Ge. M is preferably a trivalent metal or a tetravalent metal, more preferably Al, Fe, In, Hf, Si, Ti, Sn, and Zr, even more preferably Al, Si, Ti, and Zr, and particularly preferably Si. .
 式(M1)中、Xb1で表される加水分解性基としては、上記反応性シリル基における[-Si(R3-n]中のLで示される加水分解性基と同様のものが挙げられる。 In formula (M1), the hydrolyzable group represented by X b1 is the same as the hydrolyzable group represented by L in [-Si(R 1 ) n L 3-n ] in the above reactive silyl group. Examples include:
 Xb2で表されるシロキサン骨格含有基は、シロキサン単位(-Si-O-)を有し、直鎖状でも分岐鎖状でもよい。シロキサン単位としては、ジアルキルシリルオキシ基が好ましく、ジメチルシリルオキシ基、ジエチルシリルオキシ基等が挙げられる。シロキサン骨格含有基におけるシロキサン単位の繰り返し数は、1以上であり、1~5が好ましく、1~4がより好ましく、1~3がさらに好ましい。
 シロキサン骨格含有基は、シロキサン骨格の一部に2価の炭化水素基を含んでいてもよい。具体的には、シロキサン骨格の一部の酸素原子が2価の炭化水素基で置き換わっていてもよい。前記2価の炭化水素基としては、メチレン基、エチレン基、プロピレン基、ブチレン基等のアルキレン基が挙げられる。
 シロキサン骨格含有基の末端のケイ素原子には、加水分解性基、炭化水素基(好ましくはアルキル基)等が結合していてもよい。
 シロキサン骨格含有基の元素数は、100以下が好ましく、50以下がより好ましく、30以下がさらに好ましい。前記元素数は10以上が好ましい。
 シロキサン骨格含有基としては、-(O-Si(CHCHで表される基が好ましく、ここで、nは1~5の整数であり、*は隣接原子との結合部位を表す。
The siloxane skeleton-containing group represented by X b2 has a siloxane unit (-Si-O-) and may be linear or branched. The siloxane unit is preferably a dialkylsilyloxy group, such as a dimethylsilyloxy group or a diethylsilyloxy group. The number of repeating siloxane units in the siloxane skeleton-containing group is 1 or more, preferably 1 to 5, more preferably 1 to 4, and even more preferably 1 to 3.
The siloxane skeleton-containing group may include a divalent hydrocarbon group in a part of the siloxane skeleton. Specifically, some oxygen atoms in the siloxane skeleton may be replaced with divalent hydrocarbon groups. Examples of the divalent hydrocarbon group include alkylene groups such as a methylene group, an ethylene group, a propylene group, and a butylene group.
A hydrolyzable group, a hydrocarbon group (preferably an alkyl group), etc. may be bonded to the terminal silicon atom of the siloxane skeleton-containing group.
The number of elements in the siloxane skeleton-containing group is preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. The number of elements is preferably 10 or more.
The siloxane skeleton-containing group is preferably a group represented by * -(O-Si(CH 3 ) 2 ) n CH 3 , where n is an integer from 1 to 5, and * represents a bond with an adjacent atom. Represents a part.
 Xb3で表される炭化水素鎖含有基は、炭化水素鎖のみからなる基でもよく、炭化水素鎖の炭素原子-炭素原子間にエーテル性酸素原子を有する基でもよい。炭化水素鎖は直鎖でも分岐鎖でもよく、直鎖が好ましい。炭化水素鎖は飽和炭化水素鎖でも不飽和炭化水素鎖でもよく、飽和炭化水素鎖が好ましい。炭化水素鎖含有基の炭素数は、1~3が好ましく、1~2がより好ましく、1がさらに好ましい。炭化水素鎖含有基としては、アルキル基が好ましく、メチル基、エチル基、又はプロピル基がより好ましい。 The hydrocarbon chain-containing group represented by X b3 may be a group consisting only of a hydrocarbon chain, or may be a group having an etheric oxygen atom between carbon atoms of the hydrocarbon chain. The hydrocarbon chain may be straight or branched, preferably straight. The hydrocarbon chain may be a saturated hydrocarbon chain or an unsaturated hydrocarbon chain, with a saturated hydrocarbon chain being preferred. The number of carbon atoms in the hydrocarbon chain-containing group is preferably 1 to 3, more preferably 1 to 2, and even more preferably 1. The hydrocarbon chain-containing group is preferably an alkyl group, more preferably a methyl group, an ethyl group, or a propyl group.
 m1は3又は4であることが好ましい。 It is preferable that m1 is 3 or 4.
 式(M1)で表される化合物としては、MがSiである下記式(M1-1)~(M1-5)で表される化合物が好ましく、式(M1-1)で表される化合物がより好ましい。式(M1-1)で表される化合物としては、テトラエトキシシラン、テトラメトキシシラン、及びトリエトキシメチルシランが好ましい。 As the compound represented by formula (M1), compounds represented by the following formulas (M1-1) to (M1-5) where M is Si are preferable, and the compound represented by formula (M1-1) is More preferred. As the compound represented by formula (M1-1), tetraethoxysilane, tetramethoxysilane, and triethoxymethylsilane are preferred.
 Si(Xb1           …(M1-1)
 CH-Si(Xb1         …(M1-2)
 C-Si(Xb1       …(M1-3)
 n-C-Si(Xb1     …(M1-4)
 (CHCH-Si(Xb1   …(M1-5)
Si(X b1 ) 4 ...(M1-1)
CH 3 -Si(X b1 ) 3  ...(M1-2)
C 2 H 5 -Si(X b1 ) 3 ...(M1-3)
n-C 3 H 7 -Si(X b1 ) 3 ...(M1-4)
(CH 3 ) 2 CH-Si(X b1 ) 3 ... (M1-5)
 式(M2)中、Xb4で表される加水分解性シランオリゴマー残基に含まれるケイ素原子の数は、3以上が好ましく、5以上がより好ましく、7以上がさらに好ましい。前記ケイ素原子の数は、15以下が好ましく、13以下がより好ましく、10以下がさらに好ましい。
 加水分解性シランオリゴマー残基は、ケイ素原子に結合するアルコキシ基を有していてもよい。前記アルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、ブトキシ基等が挙げられ、メトキシ基及びエトキシ基が好ましい。加水分解性シランオリゴマー残基は、これらアルコキシ基の1種又は2種以上を有してもよく、1種を有することが好ましい。
 加水分解性シランオリゴマー残基としては、(CO)Si-(OSi(OCO-等が挙げられる。ここで、*は隣接原子との結合部位を表す。
In formula (M2), the number of silicon atoms contained in the hydrolyzable silane oligomer residue represented by X b4 is preferably 3 or more, more preferably 5 or more, and even more preferably 7 or more. The number of silicon atoms is preferably 15 or less, more preferably 13 or less, and even more preferably 10 or less.
The hydrolyzable silane oligomer residue may have an alkoxy group bonded to a silicon atom. Examples of the alkoxy group include methoxy group, ethoxy group, propoxy group, butoxy group, and methoxy group and ethoxy group are preferred. The hydrolyzable silane oligomer residue may have one or more types of these alkoxy groups, and preferably has one type.
Examples of the hydrolyzable silane oligomer residue include (C 2 H 5 O) 3 Si-(OSi(OC 2 H 5 ) 2 ) 4 O- * and the like. Here, * represents a bonding site with an adjacent atom.
 式(M2)中、Xb5で表される加水分解性基としては、上記反応性シリル基における[-Si(R3-n]中のLで示される加水分解性基と同様のもの、シアノ基、水素原子、アリル基が挙げられ、アルコキシ基又はイソシアナト基が好ましい。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましい。
 Xb5としては、加水分解性基が好ましい。
In formula (M2), the hydrolyzable group represented by X b5 is the same as the hydrolyzable group represented by L in [-Si(R 1 ) n L 3-n ] in the above reactive silyl group. Examples include a cyano group, a hydrogen atom, and an allyl group, with an alkoxy group or an isocyanato group being preferred. The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms.
As X b5 , a hydrolyzable group is preferable.
 式(M2)で表される化合物としては、(HO)-Si-(OSi(OCOC等が挙げられる。 Examples of the compound represented by formula (M2) include (H 5 C 2 O) 3 -Si-(OSi(OC 2 H 5 ) 2 ) 4 OC 2 H 5 and the like.
 式(M3)で表される化合物は、2価の有機基の両末端に反応性シリル基を有する化合物、すなわち、ビスシランである。
 式(M3)中、Xb6及びXb7で表される加水分解性基としては、アルコキシ基、アシロキシ基、ケトオキシム基、アルケニルオキシ基、アミノ基、アミノキシ基、アミド基、イソシアナト基、ハロゲン原子が挙げられ、アルコキシ基、イソシアナト基が好ましい。アルコキシ基としては、炭素数1~4のアルコキシ基が好ましく、メトキシ基、エトキシ基がより好ましい。
 式(M3)において、Xb6及びXb7は互いに同じ基でもよく、互いに異なる基でもよい。入手しやすさの点で、Xb6及びXb7は互いに同じ基であることが好ましい。
The compound represented by formula (M3) is a compound having a reactive silyl group at both ends of a divalent organic group, that is, bissilane.
In formula (M3), the hydrolyzable groups represented by X b6 and X b7 include an alkoxy group, an acyloxy group, a ketoxime group, an alkenyloxy group, an amino group, an aminoxy group, an amide group, an isocyanato group, and a halogen atom. an alkoxy group and an isocyanato group are preferred. The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms, more preferably a methoxy group or an ethoxy group.
In formula (M3), X b6 and X b7 may be the same group or different groups. From the viewpoint of availability, it is preferable that X b6 and X b7 are the same group.
 式(M3)中、Yb1は、両末端の反応性シリル基を連結する2価の有機基である。2価の有機基のYb1の炭素数は1~8が好ましく、1~3がより好ましい。
 Yb1としては、アルキレン基、フェニレン基、炭素原子間にエーテル性酸素原子を有するアルキレン基が挙げられる。例えば、-CHCH-、-CHCHCH-、-CHCHCHCH-、-CHCHCHCHCH-、-CHCHCHCHCHCH-、-CHC(CHCH-、-C(CHCHCHC(CH-、-CHCHOCHCH-、-CHCHCHOCHCHCH-、-CH(CH)CHOCHCH(CH)-、-C-が挙げられる。
In formula (M3), Y b1 is a divalent organic group that connects the reactive silyl groups at both ends. The number of carbon atoms in Y b1 of the divalent organic group is preferably 1 to 8, more preferably 1 to 3.
Examples of Y b1 include an alkylene group, a phenylene group, and an alkylene group having an etheric oxygen atom between carbon atoms. For example, -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -, -CH 2 C(CH 3 ) 2 CH 2 -, -C(CH 3 ) 2 CH 2 CH 2 C(CH 3 ) 2 -, -CH 2 CH 2 OCH 2 CH 2 -, -CH 2 CH 2 CH 2 OCH 2 CH 2 CH 2 -, -CH(CH 3 )CH 2 OCH 2 CH(CH 3 )-, and -C 6 H 4 -.
 式(M3)で表される化合物としては、(CHO)Si(CHSi(OCH、(CO)Si(CHSi(OC、(OCN)Si(CHSi(NCO)、ClSi(CHSiCl、(CHO)Si(CHSi(OCH、(CO)Si(CHSi(OCが挙げられる。 Examples of the compound represented by formula (M3) include (CH 3 O) 3 Si(CH 2 ) 2 Si(OCH 3 ) 3 , (C 2 H 5 O) 3 Si(CH 2 ) 2 Si(OC 2 H 5 ) 3 , (OCN) 3Si ( CH2 ) 2Si ( NCO ) 3 , Cl3Si( CH2 ) 2SiCl3 , ( CH3O ) 3Si ( CH2 ) 6Si ( OCH3 ) 3 , ( C2H5O ) 3Si ( CH2 ) 6Si ( OC2H5 ) 3 is mentioned.
 本開示の組成物に含まれてもよい他の成分の含有量は、本開示の組成物の全量に対して、10質量%以下が好ましく、1質量%以下がより好ましい。本開示の組成物が特定金属化合物を含む場合、特定金属化合物の含有量は本開示の組成物の全量に対して0.01~30質量%が好ましく、0.01~10質量%がより好ましく、0.05~5質量%がさらに好ましい。 The content of other components that may be included in the composition of the present disclosure is preferably 10% by mass or less, more preferably 1% by mass or less, based on the total amount of the composition of the present disclosure. When the composition of the present disclosure includes a specific metal compound, the content of the specific metal compound is preferably 0.01 to 30% by mass, more preferably 0.01 to 10% by mass based on the total amount of the composition of the present disclosure. , more preferably 0.05 to 5% by mass.
 本開示の化合物と他の成分の合計含有量(以下、「固形分濃度」ともいう。)は、本開示の組成物の全量に対して、0.001~40質量%が好ましく、0.01~20質量%がより好ましく、0.01~10質量%がさらに好ましい。本開示の組成物の固形分濃度は、加熱前の組成物の質量と、120℃の対流式乾燥機にて4時間加熱した後の質量とから算出される値である。 The total content of the compound of the present disclosure and other components (hereinafter also referred to as "solid content concentration") is preferably 0.001 to 40% by mass, and 0.01% by mass, based on the total amount of the composition of the present disclosure. The amount is more preferably 20% by weight, and even more preferably 0.01% to 10% by weight. The solid content concentration of the composition of the present disclosure is a value calculated from the mass of the composition before heating and the mass after heating in a convection dryer at 120° C. for 4 hours.
 本開示の組成物は、コーティング用途として有用であり、コーティング液として用い得る。 The composition of the present disclosure is useful for coating purposes and can be used as a coating liquid.
[表面処理剤]
 一態様において、本開示の表面処理剤は、本開示の化合物を含む。また、本開示の表面処理剤は、本開示の化合物と、液状媒体と、を含んでいてもよい。本開示の表面処理剤は、本開示の組成物でもよい。表面処理剤に含まれる液状媒体の好ましい態様は、本開示の組成物に含まれる液状媒体の好ましい態様と同様である。
[Surface treatment agent]
In one aspect, the surface treatment agent of the present disclosure comprises a compound of the present disclosure. Furthermore, the surface treatment agent of the present disclosure may include the compound of the present disclosure and a liquid medium. The surface treating agent of the present disclosure may be a composition of the present disclosure. Preferred embodiments of the liquid medium contained in the surface treatment agent are the same as those of the liquid medium contained in the composition of the present disclosure.
 本開示の化合物は上述の構成を有するため、本開示の化合物を含む表面処理剤を用いることにより、撥水性及び耐摩耗性に優れた表面処理層を形成できる。 Since the compound of the present disclosure has the above-mentioned structure, a surface treatment layer with excellent water repellency and abrasion resistance can be formed by using a surface treatment agent containing the compound of the present disclosure.
[物品]
 一態様において、本開示の物品は、基材と、前記表面処理剤で表面処理された表面処理層と、を含む。
[Goods]
In one aspect, the article of the present disclosure includes a base material and a surface treatment layer surface treated with the surface treatment agent.
 表面処理層は、基材の表面の一部に形成されてもよく、基材の表面全体に形成されてもよい。表面処理層は、基材の表面に膜状に拡がっていてもよく、ドット状に点在していてもよい。
 表面処理層において、本開示の化合物は、反応性シリル基の一部又は全部の加水分解が進行し、かつ、シラノール基の脱水縮合反応が進行した状態で含まれる。
The surface treatment layer may be formed on a part of the surface of the base material, or may be formed on the entire surface of the base material. The surface treatment layer may be spread over the surface of the base material in the form of a film, or may be scattered in the form of dots.
In the surface treatment layer, the compound of the present disclosure is contained in a state in which hydrolysis of some or all of the reactive silyl groups has proceeded, and a dehydration condensation reaction of the silanol groups has proceeded.
 表面処理層の厚さは、1~100nmが好ましく、1~50nmがより好ましい。表面処理層の厚さが1nm以上であれば、表面処理による効果が充分に得られやすい。表面処理層の厚さが100nm以下であれば、利用効率が高い。表面処理層の厚さは、薄膜解析用X線回折計(製品名「ATX-G」、RIGAKU社製)を用いて、X線反射率法によって反射X線の干渉パターンを得て、干渉パターンの振動周期から算出できる。 The thickness of the surface treatment layer is preferably 1 to 100 nm, more preferably 1 to 50 nm. If the thickness of the surface treatment layer is 1 nm or more, the effect of the surface treatment is likely to be sufficiently obtained. If the thickness of the surface treatment layer is 100 nm or less, the utilization efficiency is high. The thickness of the surface treatment layer is determined by using an X-ray diffractometer for thin film analysis (product name "ATX-G", manufactured by RIGAKU) to obtain an interference pattern of reflected X-rays by the X-ray reflectance method. It can be calculated from the vibration period of
 基材の種類は特に限定されず、例えば、撥水性の付与が求められている基材が挙げられる。基材として、例えば、他の物品(例えば、スタイラス)又は人の手指を接触させて使用することがある基材;操作時に人の手指で持つことがある基材;及び、他の物品(例えば、載置台)の上に置くことがある基材が挙げられる。
 基材の材料としては、金属、樹脂、ガラス、サファイア、セラミック、石、繊維、不織布、紙、木、天然皮革、人工皮革、及びこれらの複合材料が挙げられる。ガラスは化学強化されていてもよい。
The type of base material is not particularly limited, and includes, for example, base materials that are required to have water repellency. As a base material, for example, a base material that may be used in contact with another article (e.g., a stylus) or a person's fingers; a base material that may be held by a person's fingers during operation; , a mounting table).
Examples of the base material include metal, resin, glass, sapphire, ceramic, stone, fiber, nonwoven fabric, paper, wood, natural leather, artificial leather, and composite materials thereof. The glass may be chemically strengthened.
 基材としては、建材、装飾建材、インテリア用品、輸送機器(例えば、自動車)、看板、掲示板、飲用器、食器、水槽、観賞用器具(例えば、額、箱)、実験器具、家具、繊維製品、包装容器;アート、スポーツ、ゲーム等に使用する、ガラス又は樹脂;携帯電話(例えば、スマートフォン)、携帯情報端末、ゲーム機、リモコン等の機器における外装部分(表示部を除く)に使用する、ガラス又は樹脂が挙げられる。基材の形状は、板状であってもよく、フィルム状であってもよい。 Base materials include building materials, decorative building materials, interior goods, transportation equipment (e.g. automobiles), signboards, bulletin boards, drinking vessels, tableware, aquariums, ornamental equipment (e.g. frames, boxes), laboratory equipment, furniture, and textile products. , Packaging containers; Glass or resin used for art, sports, games, etc.; Used for the exterior parts (excluding display parts) of devices such as mobile phones (e.g. smartphones), personal digital assistants, game consoles, remote controls, etc. Examples include glass or resin. The shape of the base material may be plate-like or film-like.
 基材としては、タッチパネル用基材、ディスプレイ用基材、メガネレンズが好適であり、タッチパネル用基材が特に好適である。タッチパネル用基材の材料としては、ガラス又は透明樹脂が好ましい。 As the base material, touch panel base materials, display base materials, and eyeglass lenses are suitable, and touch panel base materials are particularly suitable. As the material for the touch panel base material, glass or transparent resin is preferable.
 基材は、一方の表面又は両面が、コロナ放電処理、プラズマ処理、プラズマグラフト重合処理等の表面処理が施された基材であってもよい。表面処理が施された基材は、表面処理層との密着性がより優れ、表面処理層の耐摩耗性がより向上する。そのため、基材の表面処理層と接する側の表面に表面処理を施すことが好ましい。また、表面処理が施された基材は、後述する下地層が設けられる場合には、下地層との密着性がより優れ、表面処理層の耐摩耗性がより向上する。そのため、下地層が設けられる場合には、基材の下地層と接する側の表面に表面処理を施すことが好ましい。 The base material may be a base material that has been subjected to surface treatment such as corona discharge treatment, plasma treatment, plasma graft polymerization treatment, etc. on one surface or both surfaces. A surface-treated base material has better adhesion with the surface-treated layer, and the abrasion resistance of the surface-treated layer is further improved. Therefore, it is preferable to perform surface treatment on the surface of the base material that is in contact with the surface treatment layer. Furthermore, when the surface-treated base material is provided with a base layer, which will be described later, the adhesion with the base layer is better, and the wear resistance of the surface-treated layer is further improved. Therefore, when a base layer is provided, it is preferable to perform a surface treatment on the surface of the base material that is in contact with the base layer.
 表面処理層は、基材の表面上に直接設けられていてもよく、基材と表面処理層との間に下地層が設けられていてもよい。表面処理層の撥水性及び耐摩耗性をより向上させる観点から、本開示の物品は、基材と、基材上に配置された下地層と、下地層上に配置された本開示の表面処理剤で表面処理された表面処理層と、を含むことが好ましい。 The surface treatment layer may be provided directly on the surface of the base material, or a base layer may be provided between the base material and the surface treatment layer. From the perspective of further improving the water repellency and abrasion resistance of the surface treatment layer, the article of the present disclosure includes a base material, a base layer disposed on the base material, and a surface treatment of the present disclosure disposed on the base layer. It is preferable to include a surface treatment layer whose surface is treated with an agent.
 下地層は、ケイ素と、周期表の第1族元素、第2族元素、第4族元素、第5族元素、第13族元素、及び第15族元素からなる群から選択される少なくとも1つの特定元素とを含む酸化物を含む層が好ましい。 The base layer includes silicon and at least one selected from the group consisting of a group 1 element, a group 2 element, a group 4 element, a group 5 element, a group 13 element, and a group 15 element of the periodic table. A layer containing an oxide containing a specific element is preferable.
 周期表の第1族元素(以下、「第1族元素」ともいう。)とは、リチウム、ナトリウム、カリウム、ルビジウム及びセシウムを意味する。第1族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、リチウム、ナトリウム、カリウムが好ましく、ナトリウム、カリウムがより好ましい。下地層には、第1族元素が2種以上含まれていてもよい。 Group 1 elements of the periodic table (hereinafter also referred to as "Group 1 elements") mean lithium, sodium, potassium, rubidium, and cesium. As Group 1 elements, lithium, sodium, and potassium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, sodium and potassium are more preferable. The underlayer may contain two or more types of Group 1 elements.
 周期表の第2族元素(以下、「第2族元素」ともいう。)とは、ベリリウム、マグネシウム、カルシウム、ストロンチウム及びバリウムを意味する。第2族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、マグネシウム、カルシウム、バリウムが好ましく、マグネシウム、カルシウムがより好ましい。下地層には、第2族元素が2種以上含まれていてもよい。 Group 2 elements of the periodic table (hereinafter also referred to as "Group 2 elements") mean beryllium, magnesium, calcium, strontium, and barium. As Group 2 elements, magnesium, calcium, and barium are used because they enable the surface treatment layer to be formed more uniformly on the underlayer without defects, and from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, magnesium and calcium are more preferable. The underlayer may contain two or more types of Group 2 elements.
 周期表の第4族元素(以下、「第4族元素」ともいう。)とは、チタン、ジルコニウム、及びハフニウムを意味する。第4族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる観点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、チタン、ジルコニウムが好ましく、チタンがより好ましい。下地層には、第4族元素が2種以上含まれていてもよい。 Group 4 elements of the periodic table (hereinafter also referred to as "Group 4 elements") mean titanium, zirconium, and hafnium. As the Group 4 element, titanium and zirconium are preferable from the viewpoint of being able to form a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Titanium is more preferred. The base layer may contain two or more types of Group 4 elements.
 周期表の第5族元素(以下、「第5族元素」ともいう。)とは、バナジウム、ニオブ及びタンタルを意味する。第5族元素としては、表面処理層の耐摩耗性がより優れる観点から、バナジウムが特に好ましい。下地層には、第5族元素が2種以上含まれていてもよい。 Group 5 elements of the periodic table (hereinafter also referred to as "Group 5 elements") mean vanadium, niobium, and tantalum. As the Group 5 element, vanadium is particularly preferable from the viewpoint of providing better wear resistance of the surface treatment layer. The underlayer may contain two or more types of Group 5 elements.
 周期表の第13族元素(以下、「第13族元素」ともいう。)とは、ホウ素、アルミニウム、ガリウム及びインジウムを意味する。第13族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、ホウ素、アルミニウム、ガリウムが好ましく、ホウ素、アルミニウムがより好ましい。下地層には、第13族元素が2種以上含まれていてもよい。 Group 13 elements of the periodic table (hereinafter also referred to as "Group 13 elements") mean boron, aluminum, gallium, and indium. As Group 13 elements, boron, aluminum, and gallium are selected from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects, or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, boron and aluminum are more preferable. The base layer may contain two or more types of Group 13 elements.
 周期表の第15族元素(以下、「第15族元素」ともいう。)とは、窒素、リン、ヒ素、アンチモン及びビスマスを意味する。第15族元素としては、下地層上に表面処理層を欠陥なくより均一に形成できる観点、又は、サンプル間での下地層の組成のバラツキがより抑制される観点から、リン、アンチモン、ビスマスが好ましく、リン、ビスマスがより好ましい。下地層には、第15族元素が2種以上含まれていてもよい。 Group 15 elements of the periodic table (hereinafter also referred to as "Group 15 elements") mean nitrogen, phosphorus, arsenic, antimony, and bismuth. As Group 15 elements, phosphorus, antimony, and bismuth are used from the viewpoint of forming a surface treatment layer on the underlayer more uniformly without defects or from the viewpoint of suppressing variations in the composition of the underlayer between samples. Preferably, phosphorus and bismuth are more preferable. The base layer may contain two or more types of Group 15 elements.
 下地層に含まれる特定元素としては、第1族元素、第2族元素、第13族元素が表面処理層の耐摩耗性がより優れるため好ましく、第1族元素、第2族元素がより好ましく、第1族元素がさらに好ましい。
 特定元素として、1種のみの元素が含まれていても2種以上の元素が含まれていてもよい。
As the specific elements contained in the underlayer, Group 1 elements, Group 2 elements, and Group 13 elements are preferable because the wear resistance of the surface treatment layer is better, and Group 1 elements and Group 2 elements are more preferable. , Group 1 elements are more preferred.
As the specific element, only one type of element may be included, or two or more types of elements may be included.
 下地層に含まれる酸化物は、上記元素(ケイ素及び特定元素)単独の酸化物の混合物(例えば、酸化ケイ素と、特定元素の酸化物と、の混合物)であってもよいし、上記元素を2種以上含む複合酸化物であってもよいし、上記元素単独の酸化物と複合酸化物との混合物であってもよい。 The oxide contained in the base layer may be a mixture of oxides of the above elements (silicon and specific elements) alone (for example, a mixture of silicon oxide and an oxide of a specific element), or a mixture of the above elements (silicon and specific elements). It may be a composite oxide containing two or more types, or a mixture of an oxide of the above element alone and a composite oxide.
 下地層中のケイ素のモル濃度に対する、下地層中の特定元素の合計モル濃度の比(特定元素/ケイ素)は、表面処理層の耐摩耗性がより優れる観点から、0.02~2.90であるのが好ましく、0.10~2.00であるのがより好ましく、0.20~1.80であるのがさらに好ましい。
 下地層中の各元素のモル濃度(モル%)は、例えば、イオンスパッタリングを用いたX線光電子分光法(XPS)による深さ方向分析によって測定できる。
The ratio of the total molar concentration of the specific element in the underlayer to the molar concentration of silicon in the underlayer (specific element/silicon) is 0.02 to 2.90 from the viewpoint of better wear resistance of the surface treatment layer. It is preferably 0.10 to 2.00, even more preferably 0.20 to 1.80.
The molar concentration (mol %) of each element in the underlayer can be measured, for example, by depth direction analysis using X-ray photoelectron spectroscopy (XPS) using ion sputtering.
 下地層は、単層であっても複層であってもよい。下地層は、表面に凹凸を有していてもよい。
 下地層の厚さは、1~100nmが好ましく、1~50nmがより好ましく、2~20nmがさらに好ましい。下地層の厚さが上記下限値以上であれば、下地層による表面処理層の密着性がより向上して、表面処理層の耐摩耗性がより優れる。下地層の厚さが上記上限値以下であれば、下地層自体の耐摩耗性が優れる。
 下地層の厚さは、透過電子顕微鏡(TEM)による下地層の断面観察によって測定される。
The base layer may be a single layer or a multilayer. The base layer may have an uneven surface.
The thickness of the underlayer is preferably 1 to 100 nm, more preferably 1 to 50 nm, and even more preferably 2 to 20 nm. If the thickness of the base layer is equal to or greater than the above lower limit, the adhesion of the surface treatment layer to the base layer will be further improved, and the wear resistance of the surface treatment layer will be more excellent. If the thickness of the base layer is below the above upper limit, the base layer itself will have excellent wear resistance.
The thickness of the base layer is measured by observing a cross section of the base layer using a transmission electron microscope (TEM).
 下地層は、例えば、蒸着材料を用いた蒸着法、又は、ウェットコーティング法により形成できる。 The base layer can be formed, for example, by a vapor deposition method using a vapor deposition material or a wet coating method.
 蒸着法で用いる蒸着材料は、ケイ素及び特定元素を含む酸化物を含有することが好ましい。
 蒸着材料の形態の具体例としては、粉体、溶融体、焼結体、造粒体、破砕体が挙げられ、取り扱い性の観点から、溶融体、焼結体、造粒体が好ましい。
 ここで、溶融体とは、蒸着材料の粉体を高温で溶融させた後、冷却固化して得られた固形物を意味する。焼結体とは、蒸着材料の粉体を焼成して得られた固形物を意味し、必要に応じて、蒸着材料の粉体の代わりに、粉体をプレス成形して成形体を用いてもよい。造粒体とは、蒸着材料の粉体と液状媒体(例えば、水、有機溶媒)とを混練して粒子を得た後、粒子を乾燥させて得られた固形物を意味する。
The vapor deposition material used in the vapor deposition method preferably contains an oxide containing silicon and a specific element.
Specific examples of the form of the vapor deposition material include powder, molten body, sintered body, granulated body, and crushed body, and from the viewpoint of ease of handling, molten body, sintered body, and granulated body are preferable.
Here, the melt means a solid obtained by melting the powder of the vapor deposition material at a high temperature and then cooling and solidifying the powder. A sintered body means a solid obtained by firing a powder of a vapor deposition material, and if necessary, a molded body obtained by press-molding the powder may be used instead of a powder of a vapor deposition material. Good too. The granule refers to a solid material obtained by kneading a powder of a vapor deposition material and a liquid medium (for example, water, an organic solvent) to obtain particles, and then drying the particles.
 蒸着材料は、例えば、以下の方法で製造できる。
・酸化ケイ素の粉体と、特定元素の酸化物の粉体と、を混合して、蒸着材料の粉体を得る方法。
・上記蒸着材料の粉体及び水を混練して粒子を得た後、粒子を乾燥させて、蒸着材料の造粒体を得る方法。
・ケイ素を含む粉体(例えば、酸化ケイ素からなる粉体、珪砂、シリカゲル)と、特定元素を含む粉体(例えば、特定元素の酸化物の粉体、炭酸塩、硫酸塩、硝酸塩、シュウ酸塩、水酸化物)と、水と、を混合した混合物を乾燥させた後、乾燥後の混合物又はこれをプレス成形した成形体を焼成して、焼結体を得る方法。
・ケイ素を含む粉体(例えば、酸化ケイ素からなる粉体、珪砂、シリカゲル)と、特定元素を含む粉体(例えば、特定元素の酸化物の粉体、炭酸塩、硫酸塩、硝酸塩、シュウ酸塩、水酸化物)と、を高温で溶融させた後、溶融物を冷却固化して、溶融体を得る方法。
The vapor deposition material can be manufactured, for example, by the following method.
・A method of obtaining a vapor deposition material powder by mixing silicon oxide powder and oxide powder of a specific element.
- A method of kneading the powder of the vapor deposition material and water to obtain particles, and then drying the particles to obtain granules of the vapor deposition material.
・Powders containing silicon (e.g. powder of silicon oxide, silica sand, silica gel) and powders containing specific elements (e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid) A method of obtaining a sintered body by drying a mixture of salt, hydroxide) and water, and then firing the dried mixture or a press-molded body of the dried mixture.
・Powders containing silicon (e.g. powder of silicon oxide, silica sand, silica gel) and powders containing specific elements (e.g. powder of oxides of specific elements, carbonates, sulfates, nitrates, oxalic acid) (salt, hydroxide) at high temperature, and then cooled and solidified to obtain a molten product.
 蒸着材料を用いた蒸着法の具体例としては、真空蒸着法が挙げられる。真空蒸着法は、蒸着材料を真空槽内で蒸発させ、基材の表面に付着させる方法である。
 蒸着時の温度(例えば、真空蒸着装置を用いる際には、蒸着材料を配置するボートの温度)としては、100~3,000℃が好ましく、500~3,000℃がより好ましい。
 蒸着時の圧力(例えば、真空蒸着装置を用いる際には、蒸着材料を配置する槽内の圧力)としては、1Pa以下が好ましく、0.1Pa以下がより好ましい。
 蒸着材料を用いて下地層を形成する場合、1つの蒸着材料を用いてもよいし、異なる元素を含む2つ以上の蒸着材料を用いてもよい。
A specific example of a vapor deposition method using a vapor deposition material includes a vacuum vapor deposition method. The vacuum deposition method is a method in which a deposition material is evaporated in a vacuum chamber and adhered to the surface of a base material.
The temperature during vapor deposition (for example, the temperature of the boat in which the vapor deposition material is placed when using a vacuum vapor deposition apparatus) is preferably 100 to 3,000°C, more preferably 500 to 3,000°C.
The pressure during vapor deposition (for example, when using a vacuum vapor deposition apparatus, the pressure in the tank in which the vapor deposition material is placed) is preferably 1 Pa or less, more preferably 0.1 Pa or less.
When forming the base layer using a vapor deposition material, one vapor deposition material may be used, or two or more vapor deposition materials containing different elements may be used.
 蒸着材料の蒸発方法の具体例としては、高融点金属製抵抗加熱用ボート上で蒸着材料を溶融し、蒸発させる抵抗加熱法、電子ビームを蒸着材料に照射し、蒸着材料を直接加熱して表面を溶融し、蒸発させる電子銃法が挙げられる。蒸着材料の蒸発方法としては、局所的に加熱できるため高融点物質も蒸発できる点、電子ビームが当たっていないところは低温であるため容器との反応や不純物の混入のおそれがない観点から、電子銃法が好ましい。
 蒸着材料の蒸発方法としては、複数のボートを用いてもよく、単独のボートに全ての蒸着材料を入れて用いてもよい。蒸着方法は、共蒸着であってもよく、交互蒸着等でもよい。具体的には、シリカと特定源を同一のボートに混合して用いる例、シリカと特定元素源とを別々のボートに入れて共蒸着する例、同様に別々のボートに入れて交互蒸着する例が挙げられる。蒸着の条件、順番等は下地層の構成により適宜選択される。
Specific examples of evaporation methods include resistance heating, in which the evaporation material is melted and evaporated on a resistance heating boat made of high-melting-point metal, and irradiation of an electron beam onto the evaporation material to directly heat the evaporation material on the surface. An example is the electron gun method, which melts and evaporates. The method of evaporating the deposition material is that it can evaporate high-melting point substances because it can be heated locally, and that there is no risk of reaction with the container or contamination with impurities because the area that is not hit by the electron beam is at a low temperature. Gun law is preferred.
As a method for evaporating the evaporation materials, a plurality of boats may be used, or all the evaporation materials may be placed in a single boat. The vapor deposition method may be codeposition, alternate vapor deposition, or the like. Specifically, examples include mixing silica and a specific element source in the same boat, co-evaporating silica and a specific element source in separate boats, and alternately depositing silica and a specific element source in separate boats. can be mentioned. The conditions, order, etc. of vapor deposition are appropriately selected depending on the structure of the underlying layer.
 ウェットコーティング法では、ケイ素を含む化合物と、特定元素を含む化合物と、液状媒体と、を含むコーティング液を用いたウェットコーティング法によって、基材上に下地層を形成することが好ましい。 In the wet coating method, it is preferable to form the base layer on the base material by a wet coating method using a coating liquid containing a compound containing silicon, a compound containing a specific element, and a liquid medium.
 ケイ素化合物の具体例としては、酸化ケイ素、ケイ酸、ケイ酸の部分縮合物、アルコキシシラン、アルコキシシランの部分加水分解縮合物が挙げられる。 Specific examples of silicon compounds include silicon oxide, silicic acid, partial condensates of silicic acid, alkoxysilanes, and partially hydrolyzed condensates of alkoxysilanes.
 特定元素を含む化合物の具体例としては、特定元素の酸化物、特定元素のアルコキシド、特定元素の炭酸塩、特定元素の硫酸塩、特定元素の硝酸塩、特定元素のシュウ酸塩、特定元素の水酸化物が挙げられる。 Specific examples of compounds containing specific elements include oxides of specific elements, alkoxides of specific elements, carbonates of specific elements, sulfates of specific elements, nitrates of specific elements, oxalates of specific elements, and water of specific elements. Examples include oxides.
 液状媒体としては、上記本開示の組成物に含まれる液状媒体と同様のものが挙げられる。 Examples of the liquid medium include those similar to the liquid medium contained in the composition of the present disclosure described above.
 液状媒体の含有量は、下地層の形成に使用するコーティング液の全量に対して、0.01~20質量%が好ましく、0.1~10質量%がより好ましい。 The content of the liquid medium is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, based on the total amount of the coating liquid used to form the base layer.
 下地層を形成するためのウェットコーティング法の具体例としては、スピンコート法、ワイプコート法、スプレーコート法、スキージーコート法、ディップコート法、ダイコート法、インクジェット法、フローコート法、ロールコート法、キャスト法、ラングミュア・ブロジェット法、グラビアコート法が挙げられる。 Specific examples of wet coating methods for forming the base layer include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet, flow coating, roll coating, Examples include the cast method, Langmuir-Blodgett method, and gravure coating method.
 コーティング液をウェットコーティングした後、塗膜を乾燥させるのが好ましい。塗膜の乾燥温度としては、20~200℃が好ましく、80~160℃がより好ましい。 After wet coating the coating liquid, it is preferable to dry the coating film. The drying temperature of the coating film is preferably 20 to 200°C, more preferably 80 to 160°C.
 本開示の物品は、光学部材であることが好ましい。光学部材としては、例えば、カーナビゲーション、携帯電話、スマートフォン、デジタルカメラ、デジタルビデオカメラ、PDA、ポータブルオーディオプレーヤー、カーオーディオ、ゲーム機器、眼鏡レンズ、カメラレンズ、レンズフィルター、サングラス、胃カメラ等の医療用器機、複写機、PC、ディスプレイ(例えば、液晶ディスプレイ、有機ELディスプレイ、プラズマディスプレイ、タッチパネルディスプレイ)、タッチパネル、保護フィルム、及び反射防止フィルムが挙げられる。特に、物品は、ディスプレイ又はタッチパネルであることが好ましい。 The article of the present disclosure is preferably an optical member. Examples of optical components include medical devices such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game devices, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. Examples include personal appliances, copying machines, PCs, displays (eg, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films. In particular, the article is preferably a display or a touch panel.
[物品の製造方法]
 本開示の物品の製造方法は、例えば、基材に対して、本開示の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造するという方法である。表面処理としては、ドライコーティング法及びウェットコーティング法が挙げられる。
[Method for manufacturing articles]
A method for producing an article of the present disclosure is, for example, a method of surface-treating a base material using the surface treatment agent of the present disclosure to produce an article in which a surface-treated layer is formed on the base material. . Surface treatments include dry coating methods and wet coating methods.
 ドライコーティング法としては、真空蒸着、CVD、スパッタリング等の手法が挙げられる。ドライコーティング法としては、化合物の分解を抑える点、及び装置の簡便さの観点から、真空蒸着法が好ましい。真空蒸着時には、鉄、鋼等の金属多孔体に、本開示の化合物を含浸させたペレット状物質を用いてもよい。本開示の化合物及び液状媒体を含む組成物を、鉄、鋼等の金属多孔体に含浸させ、液状媒体を乾燥させて、本開示の化合物を含浸させたペレット状物質を用いてもよい。 Examples of dry coating methods include vacuum deposition, CVD, and sputtering. As the dry coating method, a vacuum evaporation method is preferable from the viewpoint of suppressing decomposition of the compound and the simplicity of the apparatus. At the time of vacuum deposition, a pellet-like substance obtained by impregnating a porous metal body such as iron or steel with the compound of the present disclosure may be used. A pellet-like material impregnated with the compound of the present disclosure may be used by impregnating a porous metal body such as iron or steel with a composition containing the compound of the present disclosure and a liquid medium, and drying the liquid medium.
 ウェットコーティング法としては、例えば、スピンコート法、ワイプコート法、スプレーコート法、スキージーコート法、ディップコート法、ダイコート法、インクジェット法、フローコート法、ロールコート法、キャスト法、ラングミュア・ブロジェット法、グラビアコート法が挙げられる。 Examples of wet coating methods include spin coating, wipe coating, spray coating, squeegee coating, dip coating, die coating, inkjet coating, flow coating, roll coating, casting, and Langmuir-Blodgett methods. , gravure coating method.
 表面処理層の耐摩耗性を向上させるために、必要に応じて、本開示の化合物と基材との反応を促進させるための操作を行ってもよい。該操作としては、加熱、加湿、光照射等が挙げられる。
 例えば、水分を有する大気中で表面処理層が形成された基材を加熱して、加水分解性基の加水分解反応、基材の表面の水酸基等とシラノール基との反応、シラノール基の縮合反応によるシロキサン結合の生成、等の反応を促進できる。
 表面処理後、表面処理層中の化合物であって、他の化合物又は基材と化学結合していない化合物は、必要に応じて除去してもよい。除去する方法としては、例えば、表面処理層に溶媒をかけ流す方法、溶媒をしみ込ませた布でふき取る方法等が挙げられる。
In order to improve the abrasion resistance of the surface treatment layer, an operation may be performed to accelerate the reaction between the compound of the present disclosure and the base material, if necessary. Such operations include heating, humidification, light irradiation, and the like.
For example, by heating a base material on which a surface treatment layer is formed in a moist atmosphere, a hydrolysis reaction of hydrolyzable groups, a reaction between hydroxyl groups, etc. on the surface of the base material and silanol groups, and a condensation reaction of silanol groups. can promote reactions such as the formation of siloxane bonds.
After the surface treatment, compounds in the surface treatment layer that are not chemically bonded to other compounds or the base material may be removed as necessary. Examples of the removal method include a method of pouring a solvent onto the surface treatment layer, a method of wiping with a cloth impregnated with a solvent, and the like.
 次に本開示の実施形態を実施例により具体的に説明するが、本開示の実施形態はこれらの実施例に限定されるものではない。 Next, embodiments of the present disclosure will be specifically described using Examples, but the embodiments of the present disclosure are not limited to these Examples.
[合成例1:化合物(1A)の合成]
 18-ブロモ-1-オクタデセン(30g)にテトラヒドロフラン(THF。100g)、塩化銅(0.3g)、及びベンジルマグネシウムクロリド(100mL、約16%THF溶液)を加え、室温(約25℃)で24時間撹拌した。反応終了後、溶媒を減圧留去し、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(1A)を22g得た。
[Synthesis Example 1: Synthesis of compound (1A)]
Tetrahydrofuran (THF. 100 g), copper chloride (0.3 g), and benzylmagnesium chloride (100 mL, approximately 16% THF solution) were added to 18-bromo-1-octadecene (30 g), and the mixture was heated at room temperature (approximately 25°C) for 24 hours. Stir for hours. After the reaction was completed, the solvent was distilled off under reduced pressure and flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane) was performed to obtain 22 g of compound (1A).
1H NMR (500 MHz, Chloroform-d) δ 7.34 - 6.98 (m, 5H), 5.80 (tt, J = 13.4, 6.1 Hz, 1H), 5.05 (dddt, J= 78.0, 13.3, 2.1, 1.0 Hz, 2H), 2.58 (tt, J = 7.0, 1.1 Hz, 2H), 2.21 - 1.89 (m, 2H), 1.71 - 1.08 (m, 30H). 1 H NMR (500 MHz, Chloroform-d) δ 7.34 - 6.98 (m, 5H), 5.80 (tt, J = 13.4, 6.1 Hz, 1H), 5.05 (dddt, J= 78.0, 13.3, 2.1, 1.0 Hz, 2H), 2.58 (tt, J = 7.0, 1.1 Hz, 2H), 2.21 - 1.89 (m, 2H), 1.71 - 1.08 (m, 30H).
[合成例2:化合物(1B)の合成]
 上記化合物(1A)(3.0g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(1.5g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(1B)を4.0g得た。
[Synthesis Example 2: Synthesis of compound (1B)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (1A) (3.0 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex Toluene solution (platinum content: 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (1.5 g) were added, and after stirring at 40°C for 24 hours, the solvent was distilled off under reduced pressure. Thus, 4.0 g of the following compound (1B) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.35 - 7.07 (m, 5H), 3.58 (s, 9H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.75 - 1.11 (m, 34H), 0.62 (t, J = 7.0 Hz, 2H). 1 H NMR (500 MHz, Chloroform-d) δ 7.35 - 7.07 (m, 5H), 3.58 (s, 9H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.75 - 1.11 (m, 34H) , 0.62 (t, J = 7.0 Hz, 2H).
[合成例3:化合物(2A)の合成]
 4-(2-フェニルエチル)安息香酸(5.0g)にTHF(20g)、及び水素化リチウムアルミニウム(1g)を加え、20℃で24時間撹拌した。反応終了後、硫酸ナトリウム10水和物、及びジクロロメタンを加えた後、濾過し、溶媒を留去した。シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:メタノール/ジクロロメタン)を行うことで、化合物(2A)を4.2g得た。
[Synthesis Example 3: Synthesis of compound (2A)]
THF (20 g) and lithium aluminum hydride (1 g) were added to 4-(2-phenylethyl)benzoic acid (5.0 g), and the mixture was stirred at 20° C. for 24 hours. After the reaction was completed, sodium sulfate decahydrate and dichloromethane were added, filtered, and the solvent was distilled off. By performing flash column chromatography using silica gel (developing solvent: methanol/dichloromethane), 4.2 g of compound (2A) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.60 (m, 9H), 4.65 (dt, J = 6.4, 1.0 Hz, 2H), 3.05 - 2.65 (m, 4H). 1H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.60 (m, 9H), 4.65 (dt, J = 6.4, 1.0 Hz, 2H), 3.05 - 2.65 (m, 4H).
[合成例4:化合物(2B)の合成]
 上記化合物(2A)(4.2g)にジエチルエーテル(20g)、三臭化リン(8.0g)を加えて室温(約25℃)で1時間撹拌させた。反応終了後、酢酸エチルと水を加えて抽出し、溶媒を留去した。シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(2B)を3.6g得た。
[Synthesis Example 4: Synthesis of compound (2B)]
Diethyl ether (20 g) and phosphorus tribromide (8.0 g) were added to the above compound (2A) (4.2 g), and the mixture was stirred at room temperature (about 25° C.) for 1 hour. After the reaction was completed, ethyl acetate and water were added for extraction, and the solvent was distilled off. By performing flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane), 3.6 g of compound (2B) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.49 - 6.54 (m, 9H), 4.55 (d, J = 1.2 Hz, 2H), 3.03 - 2.63 (m, 4H). 1H NMR (500 MHz, Chloroform-d) δ 7.49 - 6.54 (m, 9H), 4.55 (d, J = 1.2 Hz, 2H), 3.03 - 2.63 (m, 4H).
[合成例5:化合物(2C)の合成]
 上記化合物(2B)(3.6g)にTHF(20g)、塩化銅(0.3g)、10-ウンデセン-1-イルマグネシウムブロミド(30mL、0.5M、THF溶液中)を加え、室温(約25℃)で24時間撹拌した。塩酸、及びジクロロメタンを加え抽出し、溶媒を留去後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(2C)を3.8g得た。
[Synthesis Example 5: Synthesis of compound (2C)]
To the above compound (2B) (3.6 g) were added THF (20 g), copper chloride (0.3 g), and 10-undecen-1-ylmagnesium bromide (30 mL, 0.5 M in THF solution), and at room temperature (approx. The mixture was stirred at 25° C. for 24 hours. After extraction by adding hydrochloric acid and dichloromethane and distilling off the solvent, 3.8 g of compound (2C) was obtained by performing flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane).
1H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.94 (m, 7H), 6.49 (dt, J = 7.6, 1.0 Hz, 2H), 5.80 (tt, J= 13.4, 6.1 Hz, 1H), 5.05 (dddt, J = 78.0, 13.3, 2.1, 0.9 Hz, 2H), 2.96 - 2.49 (m, 6H), 2.12 - 1.85 (m, 2H), 1.78 - 1.06 (m, 16H). 1 H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.94 (m, 7H), 6.49 (dt, J = 7.6, 1.0 Hz, 2H), 5.80 (tt, J= 13.4, 6.1 Hz, 1H), 5.05 (dddt, J = 78.0, 13.3, 2.1, 0.9 Hz, 2H), 2.96 - 2.49 (m, 6H), 2.12 - 1.85 (m, 2H), 1.78 - 1.06 (m, 16H).
[合成例6:化合物(2D)の合成]
 上記化合物(2C)(3.0g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(1.5g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(2D)を3.7g得た。
[Synthesis Example 6: Synthesis of compound (2D)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (2C) (3.0 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex Toluene solution (platinum content: 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (1.5 g) were added, and after stirring at 40°C for 24 hours, the solvent was distilled off under reduced pressure. Thus, 3.7 g of the following compound (2D) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.95 (m, 7H), 6.49 (dt, J = 7.5, 1.0 Hz, 2H), 3.58 (s, 9H), 2.96 - 2.54 (m, 6H), 1.76 - 1.13 (m, 20H), 0.62 (t, J = 7.0Hz, 2H). 1 H NMR (500 MHz, Chloroform-d) δ 7.39 - 6.95 (m, 7H), 6.49 (dt, J = 7.5, 1.0 Hz, 2H), 3.58 (s, 9H), 2.96 - 2.54 (m, 6H) , 1.76 - 1.13 (m, 20H), 0.62 (t, J = 7.0Hz, 2H).
[合成例7:化合物(3A)の合成]
 (E)-シンナミルアルコール(13g)にジエチルエーテル(100g)、三臭化リン(30g)を加えて室温(約25℃)で1時間撹拌させた。反応終了後、酢酸エチルと水を加えて抽出し、溶媒を留去した。シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(3A)を12g得た。
[Synthesis Example 7: Synthesis of compound (3A)]
Diethyl ether (100 g) and phosphorus tribromide (30 g) were added to (E)-cinnamyl alcohol (13 g), and the mixture was stirred at room temperature (about 25° C.) for 1 hour. After the reaction was completed, ethyl acetate and water were added for extraction, and the solvent was distilled off. By performing flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane), 12 g of compound (3A) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.43 - 7.11 (m, 5H), 6.72 - 6.18 (m, 2H), 4.09(dd, J = 6.2, 1.0 Hz, 2H). 1H NMR (500 MHz, Chloroform-d) δ 7.43 - 7.11 (m, 5H), 6.72 - 6.18 (m, 2H), 4.09(dd, J = 6.2, 1.0 Hz, 2H).
[合成例8:化合物(3B)の合成]
 上記化合物(3A)(10g)にTHF(50g)、塩化銅(0.3g)、10-ウンデセン-1-イルマグネシウムブロミド(100mL、0.5M、THF溶液中)を加え、室温(約25℃)で24時間撹拌した。反応終了後、塩酸、及びジクロロメタンを加え抽出し、溶媒を留去後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(3B)を5.3g得た。
[Synthesis Example 8: Synthesis of compound (3B)]
THF (50 g), copper chloride (0.3 g), and 10-undecen-1-ylmagnesium bromide (100 mL, 0.5 M in THF solution) were added to the above compound (3A) (10 g), and room temperature (approximately 25°C) was added. ) for 24 hours. After the reaction was completed, hydrochloric acid and dichloromethane were added for extraction, and the solvent was distilled off, followed by flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane) to obtain 5.3 g of compound (3B). Ta.
1H NMR (500 MHz, Chloroform-d) δ 7.42 - 7.13 (m, 5H), 6.44 - 5.69 (m, 3H), 5.05(dddt, J = 78.2, 13.5, 2.3, 1.0 Hz, 2H), 2.37 (tdd, J = 7.1, 6.1, 1.0 Hz, 2H), 2.20 - 1.89 (m, 2H), 1.59 - 1.07 (m, 16H). 1 H NMR (500 MHz, Chloroform-d) δ 7.42 - 7.13 (m, 5H), 6.44 - 5.69 (m, 3H), 5.05(dddt, J = 78.2, 13.5, 2.3, 1.0 Hz, 2H), 2.37 ( tdd, J = 7.1, 6.1, 1.0 Hz, 2H), 2.20 - 1.89 (m, 2H), 1.59 - 1.07 (m, 16H).
[合成例9:化合物(3C)の合成]
 上記化合物(3B)(3.0g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(1.5g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(3C)を4.1g得た。
[Synthesis Example 9: Synthesis of compound (3C)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (3B) (3.0 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex Toluene solution (platinum content: 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (1.5 g) were added, and after stirring at 40°C for 24 hours, the solvent was distilled off under reduced pressure. Thus, 4.1 g of the following compound (3C) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.49 - 7.11 (m, 5H), 6.47 - 6.16 (m, 1H), 5.96 (dt, J = 15.2, 6.1 Hz, 1H), 3.58 (s, 9H), 2.37 (tdd, J = 7.1, 6.2, 1.0 Hz, 2H), 1.61 - 1.06 (m, 20H), 0.62 (t, J = 7.0 Hz, 2H). 1 H NMR (500 MHz, Chloroform-d) δ 7.49 - 7.11 (m, 5H), 6.47 - 6.16 (m, 1H), 5.96 (dt, J = 15.2, 6.1 Hz, 1H), 3.58 (s, 9H) , 2.37 (tdd, J = 7.1, 6.2, 1.0 Hz, 2H), 1.61 - 1.06 (m, 20H), 0.62 (t, J = 7.0 Hz, 2H).
[合成例10:化合物(4A)の合成]
 4-フェニル-1-ブテン(15g)、臭化アリル(70g)、ジクロロメタン(200g)、及び第2世代 HOVEYDA-GRUBBS触媒(1.4g)を加えて室温(約25℃)で6時間撹拌させた。溶媒を減圧留去した後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(4A)を12g得た。
[Synthesis Example 10: Synthesis of compound (4A)]
4-phenyl-1-butene (15 g), allyl bromide (70 g), dichloromethane (200 g), and second generation HOVEYDA-GRUBBS catalyst (1.4 g) were added and stirred at room temperature (about 25° C.) for 6 hours. Ta. After distilling off the solvent under reduced pressure, 12 g of compound (4A) was obtained by performing flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane).
1H NMR (500 MHz, Chloroform-d) δ 7.41 - 6.84 (m, 5H), 5.96 - 5.41 (m, 2H), 4.10 - 3.54 (m, 2H), 2.78 - 2.10 (m, 4H). 1H NMR (500 MHz, Chloroform-d) δ 7.41 - 6.84 (m, 5H), 5.96 - 5.41 (m, 2H), 4.10 - 3.54 (m, 2H), 2.78 - 2.10 (m, 4H).
[合成例11:化合物(4B)の合成]
 上記化合物(4A)(11g)にTHF(50g)、塩化銅(0.3g)、10-ウンデセン-1-イルマグネシウムブロミド(100mL、0.5M、THF溶液中)を加え、室温(約25℃)で24時間撹拌した。反応終了後、塩酸、及びジクロロメタンを加え抽出し、溶媒を留去後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(4B)を6.7g得た。
[Synthesis Example 11: Synthesis of compound (4B)]
To the above compound (4A) (11 g) were added THF (50 g), copper chloride (0.3 g), and 10-undecen-1-ylmagnesium bromide (100 mL, 0.5 M, in THF solution), and at room temperature (approximately 25°C). ) for 24 hours. After the reaction was completed, hydrochloric acid and dichloromethane were added for extraction, and the solvent was distilled off, followed by flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane) to obtain 6.7 g of compound (4B). Ta.
1H NMR (500 MHz, Chloroform-d) δ 7.41 - 6.93 (m, 5H), 5.80 (tt, J = 13.3, 6.1 Hz, 1H), 5.60 - 5.34 (m, 2H), 5.05 (dddt, J = 78.0, 13.4, 2.1, 1.0 Hz, 2H), 2.78 - 1.78 (m, 8H), 1.59 - 1.05 (m, 16H). 1 H NMR (500 MHz, Chloroform-d) δ 7.41 - 6.93 (m, 5H), 5.80 (tt, J = 13.3, 6.1 Hz, 1H), 5.60 - 5.34 (m, 2H), 5.05 (dddt, J = 78.0, 13.4, 2.1, 1.0 Hz, 2H), 2.78 - 1.78 (m, 8H), 1.59 - 1.05 (m, 16H).
[合成例12:化合物(4C)の合成]
 上記化合物(4B)(3.0g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(1.5g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(4C)を4.0g得た。
[Synthesis Example 12: Synthesis of compound (4C)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (4B) (3.0 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex Toluene solution (platinum content: 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (1.5 g) were added, and after stirring at 40°C for 24 hours, the solvent was distilled off under reduced pressure. Thus, 4.0 g of the following compound (4C) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.33 - 6.97 (m, 5H), 5.61 - 5.24 (m, 2H), 3.58 (s, 9H), 2.63 (tt, J = 7.1, 1.0 Hz, 2H), 2.32 - 1.82 (m, 4H), 1.62 - 1.06 (m, 20H), 0.62 (t, J= 7.0 Hz, 2H).  1 H NMR (500 MHz, Chloroform-d) δ 7.33 - 6.97 (m, 5H), 5.61 - 5.24 (m, 2H), 3.58 (s, 9H), 2.63 (tt, J = 7.1, 1.0 Hz, 2H) , 2.32 - 1.82 (m, 4H), 1.62 - 1.06 (m, 20H), 0.62 (t, J= 7.0 Hz, 2H).
[合成例13:化合物(5A)の合成]
 上記化合物(1A)(3.4g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及び2,4,6,8-テトラメチルシクロテトラシロキサン(3.0g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去した。続けて再度1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びビニルトリメトキシシラン(3.0g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで下記化合物(5A)を5.9g得た。
[Synthesis Example 13: Synthesis of compound (5A)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (1A) (3.4 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (Platinum content: 3%, 0.1 g), aniline (0.1 g), and 2,4,6,8-tetramethylcyclotetrasiloxane (3.0 g) were added, and the mixture was stirred at 40°C for 24 hours. After that, the solvent was distilled off under reduced pressure. Subsequently, 1,3-bistrifluoromethylbenzene (10 g) was added again, and after stirring, a toluene solution of platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum content 3 %, 0.1g), aniline (0.1g), and vinyltrimethoxysilane (3.0g), and after stirring at 40°C for 24 hours, the following compound (5A) was obtained by distilling off the solvent under reduced pressure. 5.9g was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.40 - 7.00 (m, 5H), 3.58 (d, J = 2.4 Hz, 27H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.75 - 1.09 (m, 34H), 0.97 - 0.50 (m, 14H), -0.08 (d, J= 4.3 Hz, 12H). 1 H NMR (500 MHz, Chloroform-d) δ 7.40 - 7.00 (m, 5H), 3.58 (d, J = 2.4 Hz, 27H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.75 - 1.09 (m, 34H), 0.97 - 0.50 (m, 14H), -0.08 (d, J= 4.3 Hz, 12H).
[合成例14:化合物(6A)の合成]
 18-ブロモ-1-オクタデセン(30g)をジメチルホルムアミド(200g)に溶解させた後、酢酸ナトリウム(10g)を加え、80℃で24時間撹拌した。ジエチルエーテルと水を加えて抽出し、溶媒を留去した後、メタノール(400g)、及び1M NaOH水溶液を200g加えて60℃で24時間撹拌した。ジエチルエーテルと水を加えて抽出し、溶媒を留去した後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(6A)を22g得た。
[Synthesis Example 14: Synthesis of compound (6A)]
After dissolving 18-bromo-1-octadecene (30 g) in dimethylformamide (200 g), sodium acetate (10 g) was added and the mixture was stirred at 80° C. for 24 hours. After extraction by adding diethyl ether and water and distilling off the solvent, methanol (400 g) and 200 g of 1M NaOH aqueous solution were added and stirred at 60° C. for 24 hours. After extraction by adding diethyl ether and water and distilling off the solvent, 22 g of compound (6A) was obtained by performing flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane).
1H NMR (500 MHz, Chloroform-d) δ 5.80 (tt, J = 13.4, 6.1 Hz, 1H), 5.05 (dddt, J = 78.0, 13.3, 2.1, 1.0 Hz, 2H), 3.55 (q, J = 7.0 Hz, 2H), 2.26 - 1.89 (m, 2H), 1.70 - 1.10 (m, 28H). 1 H NMR (500 MHz, Chloroform-d) δ 5.80 (tt, J = 13.4, 6.1 Hz, 1H), 5.05 (dddt, J = 78.0, 13.3, 2.1, 1.0 Hz, 2H), 3.55 (q, J = 7.0 Hz, 2H), 2.26 - 1.89 (m, 2H), 1.70 - 1.10 (m, 28H).
[合成例15:化合物(6B)の合成]
 上記化合物(6A)(5.5g)にTHF(20g)、及び水素化ナトリウム(0.7g)を加えて20度で10分間撹拌させた。続けて4-フルオロフェニルサルファーペンタフルオリド(4.6g)を加えて20℃で24時間撹拌した。反応終了後、塩酸、及びジクロロメタンを加えて抽出し、溶媒を留去した後、シリカゲルを用いたフラッシュカラムクロマトグラフィー(展開溶媒:酢酸エチル/ヘキサン)を行うことで、化合物(6B)を6.8g得た。
[Synthesis Example 15: Synthesis of compound (6B)]
THF (20 g) and sodium hydride (0.7 g) were added to the above compound (6A) (5.5 g), and the mixture was stirred at 20 degrees for 10 minutes. Subsequently, 4-fluorophenylsulfur pentafluoride (4.6 g) was added and stirred at 20°C for 24 hours. After completion of the reaction, extraction was performed by adding hydrochloric acid and dichloromethane, the solvent was distilled off, and then flash column chromatography using silica gel (developing solvent: ethyl acetate/hexane) was performed to convert compound (6B) into 6. I got 8g.
1H NMR (500 MHz, Chloroform-d) δ 8.17 - 7.56 (m, 2H), 7.43 - 6.83 (m, 2H), 5.80 (tt, J = 13.3, 6.1 Hz, 1H), 5.05 (dddt, J = 78.1, 13.4, 2.1, 1.0 Hz, 2H), 3.99 (t, J = 7.1 Hz, 2H), 2.19 - 1.93 (m, 2H), 1.86 - 1.06 (m, 28H). 1 H NMR (500 MHz, Chloroform-d) δ 8.17 - 7.56 (m, 2H), 7.43 - 6.83 (m, 2H), 5.80 (tt, J = 13.3, 6.1 Hz, 1H), 5.05 (dddt, J = 78.1, 13.4, 2.1, 1.0 Hz, 2H), 3.99 (t, J = 7.1 Hz, 2H), 2.19 - 1.93 (m, 2H), 1.86 - 1.06 (m, 28H).
[合成例16:化合物(6C)の合成]
 上記化合物(6B)(3.0g)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(1.5g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(6C)を3.6g得た。
[Synthesis Example 16: Synthesis of compound (6C)]
After adding 1,3-bistrifluoromethylbenzene (10 g) to the above compound (6B) (3.0 g) and stirring, platinum/1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex Toluene solution (platinum content: 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (1.5 g) were added, and after stirring at 40°C for 24 hours, the solvent was distilled off under reduced pressure. Thus, 3.6 g of the following compound (6C) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 8.18 - 7.60 (m, 2H), 7.36 - 6.72 (m, 2H), 3.99 (t, J= 7.1 Hz, 2H), 3.58 (s, 9H), 1.95 - 0.96 (m, 32H), 0.62 (t, J = 7.0 Hz, 2H). 1 H NMR (500 MHz, Chloroform-d) δ 8.18 - 7.60 (m, 2H), 7.36 - 6.72 (m, 2H), 3.99 (t, J= 7.1 Hz, 2H), 3.58 (s, 9H), 1.95 - 0.96 (m, 32H), 0.62 (t, J = 7.0 Hz, 2H).
[合成例17:化合物(7A)の合成]
 12―フェニルドデセン(4.8g、ゲレスト社製、製品番号ENEP3620)に1,3-ビストリフルオロメチルベンゼン(10g)を加え、撹拌した後、白金/1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体のトルエン溶液(白金含有量3%,0.1g)、アニリン(0.1g)、及びトリメトキシシラン(3.0g)を加え、40℃で24時間撹拌した後、溶媒を減圧留去することで、下記化合物(7A)を6.9g得た。
[Synthesis Example 17: Synthesis of compound (7A)]
1,3-bistrifluoromethylbenzene (10 g) was added to 12-phenyldodecene (4.8 g, manufactured by Gelest, product number ENEP3620), and after stirring, platinum/1,3-divinyl-1,1,3 , 3-Tetramethyldisiloxane complex toluene solution (platinum content 3%, 0.1 g), aniline (0.1 g), and trimethoxysilane (3.0 g) were added, and after stirring at 40 ° C. for 24 hours. By distilling off the solvent under reduced pressure, 6.9 g of the following compound (7A) was obtained.
1H NMR (500 MHz, Chloroform-d) δ 7.46 - 6.99 (m, 5H), 3.58 (s, 9H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.74 - 1.11 (m, 20H), 0.62 (t, J = 7.0 Hz, 2H). 1 H NMR (500 MHz, Chloroform-d) δ 7.46 - 6.99 (m, 5H), 3.58 (s, 9H), 2.58 (tt, J = 7.0, 1.0 Hz, 2H), 1.74 - 1.11 (m, 20H) , 0.62 (t, J = 7.0 Hz, 2H).
[物品の製造及び評価]
 化合物(1B)、(2D)、(3C)、(4C)、(5A)、(6C)及び(7A)を用いて基材を表面処理し、それぞれ例1~7の物品を得た。表面処理方法として、各例について下記のドライコーティング法を用いた。基材としては化学強化ガラスを用いた。得られた物品について、下記の方法で評価した。結果を表1に示す。
[Manufacture and evaluation of articles]
The substrates were surface treated using compounds (1B), (2D), (3C), (4C), (5A), (6C) and (7A) to obtain articles of Examples 1 to 7, respectively. As a surface treatment method, the following dry coating method was used for each example. Chemically strengthened glass was used as the base material. The obtained article was evaluated by the following method. The results are shown in Table 1.
(ドライコーティング法)
 ドライコーティングは、真空蒸着装置(ULVAC社製、VTR350M)を用いて行った(真空蒸着法)。各化合物の20%酢酸エチル溶液の0.5gを真空蒸着装置内のモリブデン製ボートに充填し、真空蒸着装置内を1×10-3Pa以下に排気した。化合物を配置したボートを昇温速度10℃/分以下の速度で加熱し、水晶発振式膜厚計による蒸着速度が1nm/秒を超えた時点でシャッターを開けて基材の表面への製膜を開始させた。膜厚が約50nmとなった時点でシャッターを閉じて基材の表面への製膜を終了させた。化合物が堆積された基材を、150℃で30分間加熱処理し、基材の表面に表面層を有する物品を得た。
(Dry coating method)
The dry coating was performed using a vacuum evaporation device (VTR350M, manufactured by ULVAC) (vacuum evaporation method). 0.5 g of a 20% ethyl acetate solution of each compound was filled into a molybdenum boat in a vacuum evaporation apparatus, and the inside of the vacuum evaporation apparatus was evacuated to 1×10 −3 Pa or less. The boat containing the compound is heated at a temperature increase rate of 10°C/min or less, and when the deposition rate exceeds 1 nm/sec using a crystal oscillation film thickness meter, the shutter is opened to form a film on the surface of the substrate. started. When the film thickness reached approximately 50 nm, the shutter was closed to complete the film formation on the surface of the substrate. The substrate on which the compound was deposited was heat-treated at 150° C. for 30 minutes to obtain an article having a surface layer on the surface of the substrate.
(評価方法)
 <撥水性>
 表面処理層の表面に置いた約2μLの蒸留水の接触角を、接触角測定装置(協和界面科学社製、DM-500)を用いて測定した。表面処理層の表面における異なる5箇所で測定し、その平均値を算出した。接触角の算出には2θ法を用いた。評価基準は下記のとおりである。A及びBは、実用上問題ないレベルである。
 A:100度以上である。
 B:90度以上100度未満である。
 C:90度未満である。
(Evaluation method)
<Water repellency>
The contact angle of about 2 μL of distilled water placed on the surface of the surface treatment layer was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). Measurements were made at five different locations on the surface of the surface treatment layer, and the average value was calculated. The 2θ method was used to calculate the contact angle. The evaluation criteria are as follows. A and B are at levels that pose no practical problems.
A: It is 100 degrees or more.
B: 90 degrees or more and less than 100 degrees.
C: Less than 90 degrees.
<親油性>
 表面処理層の表面に置いた約2μLのオレイン酸の接触角を、接触角測定装置(協和界面科学社製、DM-500)を用いて測定した。表面層の表面における異なる5箇所で測定し、その平均値を算出した。接触角の算出には2θ法を用いた。評価基準は下記のとおりである。A及びBは、実用上問題ないレベルである。
 A:10度未満である。
 B:10度以上15度未満である。
 C:15度以上である。
<Lipophilicity>
The contact angle of about 2 μL of oleic acid placed on the surface of the surface treatment layer was measured using a contact angle measuring device (DM-500, manufactured by Kyowa Interface Science Co., Ltd.). Measurements were made at five different locations on the surface of the surface layer, and the average value was calculated. The 2θ method was used to calculate the contact angle. The evaluation criteria are as follows. A and B are at levels that pose no practical problems.
A: Less than 10 degrees.
B: 10 degrees or more and less than 15 degrees.
C: 15 degrees or more.
<低指紋視認性>
 上記にて作成したガラス基板に1kg荷重で皮脂を付着させ、その視認性について以下4段階にて目視による官能評価を行った。評価基準は下記のとおりである。
 4:指紋がほとんど見えない
 3:指紋がわずかに見える
 2:指紋が薄いがはっきり見える
 1:指紋がはっきり見える
<Low fingerprint visibility>
Sebum was applied to the glass substrate prepared above under a load of 1 kg, and its visibility was visually evaluated in the following four stages. The evaluation criteria are as follows.
4: Fingerprints are almost invisible 3: Fingerprints are slightly visible 2: Fingerprints are thin but clearly visible 1: Fingerprints are clearly visible
<耐摩耗性(スチールウール)>
 物品の表面処理層について、JIS L0849:2013(ISO 105-X12:2001)に準拠して往復式トラバース試験機(ケイエヌテー社製)を用い、スチールウールボンスター(♯0000)を圧力:98.07kPa、速度:320cm/分で1万回往復させた後、前記方法により水接触角を測定した。摩耗後の撥水性(水接触角)の低下が小さいほど摩擦による性能の低下が小さく、耐摩耗性に優れる。評価基準は下記のとおりである。A及びBは、実用上問題ないレベルである。
 A:1万回往復後の水接触角の低下が5度以下である。
 B:1万回往復後の水接触角の低下が5度超から10度以下である。
 C:1万回往復後の水接触角の低下が10度超である。
<Abrasion resistance (steel wool)>
Regarding the surface treatment layer of the article, steel wool Bonstar (#0000) was tested at a pressure of 98.07 kPa using a reciprocating traverse tester (manufactured by KNT) in accordance with JIS L0849:2013 (ISO 105-X12:2001). After reciprocating 10,000 times at a speed of 320 cm/min, the water contact angle was measured by the method described above. The smaller the drop in water repellency (water contact angle) after wear, the smaller the drop in performance due to friction, and the better the wear resistance. The evaluation criteria are as follows. A and B are at levels that pose no practical problems.
A: After 10,000 reciprocations, the water contact angle decreases by 5 degrees or less.
B: After 10,000 reciprocations, the water contact angle decreases from more than 5 degrees to 10 degrees or less.
C: The water contact angle decreases by more than 10 degrees after 10,000 reciprocations.
 例1~6は実施例であり、例7は比較例である。表1に示されるように、例1~6で作製された表面処理層は耐摩耗性に優れるが、例7で作製された表面処理層は耐摩耗性に劣っている。また、例1~6で作製された表面処理層は、撥水性、親油性、及び低指紋視認性にも優れる。
 例2及び3で作製された表面処理層は、特に優れた親油性及び低指紋視認性を有する。この理由は明らかではないが、化合物2は末端の芳香環基の近傍に芳香環をさらに有し、化合物3は末端の芳香環基の近傍に二重結合を有していることに起因するものと推測される。
 例5で作製された表面処理層は、特に優れた耐摩耗性を有する。この理由は明らかではないが、分子中に複数の反応性シリル基が存在することにより耐摩耗性が向上したものと推測される。
 例6で作製された表面処理層は、特に優れた撥水性を有する。この理由は明らかではないが、分子中に比較的長鎖のアルキル基を有することにより撥水性が向上したものと推測される。
Examples 1 to 6 are examples, and example 7 is a comparative example. As shown in Table 1, the surface treatment layers prepared in Examples 1 to 6 have excellent abrasion resistance, but the surface treatment layer prepared in Example 7 has poor abrasion resistance. Furthermore, the surface treated layers prepared in Examples 1 to 6 are also excellent in water repellency, lipophilicity, and low fingerprint visibility.
The surface treatment layers made in Examples 2 and 3 have particularly good lipophilicity and low fingerprint visibility. The reason for this is not clear, but it is due to the fact that Compound 2 further has an aromatic ring near the terminal aromatic ring group, and Compound 3 has a double bond near the terminal aromatic ring group. It is assumed that.
The surface treatment layer produced in Example 5 has particularly good abrasion resistance. Although the reason for this is not clear, it is presumed that the wear resistance is improved due to the presence of a plurality of reactive silyl groups in the molecule.
The surface treated layer produced in Example 6 has particularly excellent water repellency. Although the reason for this is not clear, it is presumed that water repellency is improved by having a relatively long-chain alkyl group in the molecule.
 本開示の化合物は、表面処理剤として有用である。表面処理剤は、例えば、タッチパネルディスプレイ等の表示装置、光学素子、半導体素子、建築材料、自動車部品、ナノインプリント技術等における基材に対して用いることができる。また、表面処理剤は、電車、自動車、船舶、航空機等の輸送機器におけるボディー、窓ガラス(フロントガラス、サイドガラス、リアガラス)、ミラー、バンパー等に対して用いることができる。さらに、表面処理剤は、建築物外壁、テント、太陽光発電モジュール、遮音板、コンクリート等の屋外物品;漁網、虫取り網、水槽に対して用いることができる。また、表面処理剤は、台所、風呂場、洗面台、鏡、トイレ周辺部品;シャンデリア、タイル等の陶磁器;人工大理石、エアコン等の各種屋内設備に対して用いることができる。また、表面処理剤は、工場内の治具、内壁、配管等の防汚処理としても用いることができる。また、表面処理剤は、ゴーグル、眼鏡、ヘルメット、パチンコ、繊維、傘、遊具、サッカーボールに対して用いることができる。また、表面処理剤は、食品用包材、化粧品用包材、ポットの内部等の各種包材の付着防止剤としても用いることができる。また、表面処理剤は、カーナビゲーション、携帯電話、スマートフォン、デジタルカメラ、デジタルビデオカメラ、PDA、ポータブルオーディオプレーヤー、カーオーディオ、ゲーム機器、眼鏡レンズ、カメラレンズ、レンズフィルター、サングラス、胃カメラ等の医療用器機、複写機、PC、ディスプレイ(例えば、液晶ディスプレイ、有機ELディスプレイ、プラズマディスプレイ、タッチパネルディスプレイ)、タッチパネル、保護フィルム、及び反射防止フィルム等の光学部材に対して用いることができる。 The compounds of the present disclosure are useful as surface treatment agents. The surface treatment agent can be used, for example, for substrates in display devices such as touch panel displays, optical elements, semiconductor elements, building materials, automobile parts, nanoimprint technology, and the like. Furthermore, the surface treatment agent can be used for bodies, window glasses (windshields, side glasses, rear glasses), mirrors, bumpers, etc. of transportation equipment such as trains, automobiles, ships, and airplanes. Furthermore, the surface treatment agent can be used for outdoor articles such as building exterior walls, tents, solar power generation modules, sound insulation boards, and concrete; fishing nets, insect nets, and aquariums. Furthermore, the surface treatment agent can be used for various indoor equipment such as kitchens, bathrooms, washstands, mirrors, toilet peripheral parts; ceramics such as chandeliers and tiles; artificial marble, and air conditioners. Furthermore, the surface treatment agent can be used as an antifouling treatment for jigs, inner walls, piping, etc. in a factory. Furthermore, the surface treatment agent can be used for goggles, glasses, helmets, pachinko machines, textiles, umbrellas, play equipment, and soccer balls. Furthermore, the surface treatment agent can also be used as an adhesion prevention agent for various packaging materials such as food packaging materials, cosmetic packaging materials, and the inside of pots. In addition, surface treatment agents are used for medical applications such as car navigation systems, mobile phones, smartphones, digital cameras, digital video cameras, PDAs, portable audio players, car audio, game equipment, eyeglass lenses, camera lenses, lens filters, sunglasses, and gastrocameras. It can be used for optical members such as appliances, copying machines, PCs, displays (for example, liquid crystal displays, organic EL displays, plasma displays, touch panel displays), touch panels, protective films, and antireflection films.
 2022年4月19日に出願された日本国特許出願第2022-069030号の開示は、その全体が参照により本明細書に取り込まれる。また、本明細書に記載された全ての文献、特許出願及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。 The disclosure of Japanese Patent Application No. 2022-069030 filed on April 19, 2022 is incorporated herein by reference in its entirety. In addition, all documents, patent applications, and technical standards mentioned herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually indicated to be incorporated by reference. , incorporated herein by reference.

Claims (15)

  1.  置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基と、
     (A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造と、
     反応性シリル基と、
    を含む化合物。
    a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms;
    (A) a linear alkylene group having 17 or more carbon atoms; (B) -CH=CH-; and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. at least one substructure comprising;
    a reactive silyl group,
    Compounds containing.
  2.  前記1価の芳香環基における炭素数4~16の芳香環が、ベンゼン環、ナフタレン環、又はピリジン環である、請求項1に記載の化合物。 The compound according to claim 1, wherein the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group is a benzene ring, a naphthalene ring, or a pyridine ring.
  3.  前記1価の芳香環基における炭素数4~16の芳香環が、1~15個の置換基を有し、前記置換基はそれぞれ独立に、ハロゲン原子、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、炭素数1~10のハロアルキル基、-OCF、-SF、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、及び-C(O)Rからなる群より選択され、ここで、Rは、それぞれ独立に、水素原子又はアルキル基である、請求項1に記載の化合物。 The aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents is independently a halogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms. , an alkoxy group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where R s The compound according to claim 1, wherein each independently represents a hydrogen atom or an alkyl group.
  4.  下記式(1)で表される化合物:
     Ar-Z-Y[-Si(R)3-n …(1)
     式(1)中、
     Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
     Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
     Yは、gが1の場合単結合であり、gが2以上の場合(g+1)価の連結基であり、
     Rはそれぞれ独立に1価の炭化水素基であり、
     Lはそれぞれ独立に加水分解性基又は水酸基であり、
     nは0~2の整数であり、
     gは1以上の整数である。
    Compound represented by the following formula (1):
    Ar-Z-Y 1 [-Si(R) n L 3-n ] g ...(1)
    In formula (1),
    Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
    Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
    Y 1 is a single bond when g is 1, and is a (g + 1) valent linking group when g is 2 or more,
    R is each independently a monovalent hydrocarbon group,
    L is each independently a hydrolyzable group or a hydroxyl group,
    n is an integer from 0 to 2,
    g is an integer of 1 or more.
  5.  式(1)中、gが2以上の整数である、請求項4に記載の化合物。 The compound according to claim 4, wherein in formula (1), g is an integer of 2 or more.
  6.  前記1価の芳香環基における炭素数4~16の芳香環が、ベンゼン環、ナフタレン環、又はピリジン環である、請求項4に記載の化合物。 The compound according to claim 4, wherein the aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group is a benzene ring, a naphthalene ring, or a pyridine ring.
  7.  前記1価の芳香環基における炭素数4~16の芳香環が、1~15個の置換基を有し、前記置換基はそれぞれ独立に、ハロゲン原子、水酸基、炭素数1~10のアルキル基、炭素数1~10のアルコキシ基、炭素数1~10のハロアルキル基、-OCF、-SF、-OC(O)R、-N(R)C(O)R、-NO、-SO、-NR 、-C(O)OR、-C(O)NR 、及び-C(O)Rからなる群より選択され、ここで、Rは、それぞれ独立に、水素原子又はアルキル基である、請求項4に記載の化合物。 The aromatic ring having 4 to 16 carbon atoms in the monovalent aromatic ring group has 1 to 15 substituents, and each of the substituents independently represents a halogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms. , an alkoxy group having 1 to 10 carbon atoms, a haloalkyl group having 1 to 10 carbon atoms, -OCF 3 , -SF 5 , -OC(O)R s , -N(R s )C(O)R s , -NO 2 , -SO 2 R s , -NR s 2 , -C(O)OR s , -C(O)NR s 2 , and -C(O)R s , where R s 5. The compound according to claim 4, wherein each independently represents a hydrogen atom or an alkyl group.
  8.  下記式(1-1)で表される化合物:
     Ar-Z-Y11(D)g1  ・・・(1-1)
     式(1-1)中、
     Arは置換又は非置換の炭素数4~16の芳香環を有する1価の芳香環基であり、
     Zは、(A)炭素数17以上の直鎖アルキレン基、(B)-CH=CH-、及び(C)置換又は非置換の炭素数4~16の2価の芳香環基、からなる群より選択される少なくとも1つの部分構造を含む2価の基であり、
     Y11は、g1が1の場合単結合であり、g1が2以上の場合(g1+1)価の連結基であり、 
     Dはそれぞれ独立に、-Q-CH=CHであり、ここでQは単結合又は2価の連結基であり、
     g1は1以上の整数である。
    Compound represented by the following formula (1-1):
    Ar-Z-Y 11 (D) g1 ...(1-1)
    In formula (1-1),
    Ar is a monovalent aromatic ring group having a substituted or unsubstituted aromatic ring having 4 to 16 carbon atoms,
    Z is a group consisting of (A) a linear alkylene group having 17 or more carbon atoms, (B) -CH=CH-, and (C) a substituted or unsubstituted divalent aromatic ring group having 4 to 16 carbon atoms. A divalent group containing at least one partial structure selected from
    Y11 is a single bond when g1 is 1, and is a (g1+1) valent linking group when g1 is 2 or more,
    Each D is independently -Q L -CH=CH 2 , where Q L is a single bond or a divalent linking group,
    g1 is an integer of 1 or more.
  9.  請求項1~7のいずれか1項に記載の化合物と、液状媒体と、を含む組成物。 A composition comprising the compound according to any one of claims 1 to 7 and a liquid medium.
  10.  請求項1~7のいずれか1項に記載の化合物を含む、表面処理剤。 A surface treatment agent comprising the compound according to any one of claims 1 to 7.
  11.  さらに液状媒体を含む、請求項10に記載の表面処理剤。 The surface treatment agent according to claim 10, further comprising a liquid medium.
  12.  基材に対して、請求項10に記載の表面処理剤を用いて表面処理を行い、基材上に表面処理層が形成された物品を製造する、物品の製造方法。 A method for manufacturing an article, comprising performing a surface treatment on a base material using the surface treatment agent according to claim 10, and manufacturing an article in which a surface treatment layer is formed on the base material.
  13.  基材と、前記基材上に配置され、請求項10に記載の表面処理剤で表面処理された表面処理層と、を含む物品。 An article comprising a base material and a surface treatment layer disposed on the base material and surface treated with the surface treatment agent according to claim 10.
  14.  前記物品が光学部材である、請求項13に記載の物品。 The article according to claim 13, wherein the article is an optical member.
  15.  前記物品がディスプレイ又はタッチパネルである、請求項14に記載の物品。 The article according to claim 14, wherein the article is a display or a touch panel.
PCT/JP2023/013997 2022-04-19 2023-04-04 Compound, composition, surface treating agent, method for producing article, and article WO2023204020A1 (en)

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