WO2023200200A1 - Composition de billes polymères et procédé de fabrication de billes polymères l'utilisant - Google Patents
Composition de billes polymères et procédé de fabrication de billes polymères l'utilisant Download PDFInfo
- Publication number
- WO2023200200A1 WO2023200200A1 PCT/KR2023/004804 KR2023004804W WO2023200200A1 WO 2023200200 A1 WO2023200200 A1 WO 2023200200A1 KR 2023004804 W KR2023004804 W KR 2023004804W WO 2023200200 A1 WO2023200200 A1 WO 2023200200A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymer
- bead composition
- weight
- parts
- polymer bead
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 148
- 239000011324 bead Substances 0.000 title claims abstract description 98
- 239000000203 mixture Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 51
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 26
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 25
- -1 (meth)acrylic acid fluoroalkyl ester Chemical class 0.000 claims abstract description 21
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000012986 chain transfer agent Substances 0.000 claims description 26
- 239000003431 cross linking reagent Substances 0.000 claims description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims description 16
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 12
- 230000000379 polymerizing effect Effects 0.000 claims description 12
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 11
- 150000002989 phenols Chemical class 0.000 claims description 9
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 8
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 4
- 150000007513 acids Chemical class 0.000 claims description 4
- 229920001748 polybutylene Polymers 0.000 claims description 4
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims description 3
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 claims description 2
- KFQPRNVTVMCYEH-UHFFFAOYSA-N 1-amino-3-(4-methoxyphenoxy)propan-2-ol Chemical compound COC1=CC=C(OCC(O)CN)C=C1 KFQPRNVTVMCYEH-UHFFFAOYSA-N 0.000 claims description 2
- OYKPJMYWPYIXGG-UHFFFAOYSA-N 2,2-dimethylbutane;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(C)(C)C OYKPJMYWPYIXGG-UHFFFAOYSA-N 0.000 claims description 2
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 claims description 2
- ASZWPJNAVQTHGP-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)CO ASZWPJNAVQTHGP-UHFFFAOYSA-N 0.000 claims description 2
- MZGMQAMKOBOIDR-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCO MZGMQAMKOBOIDR-UHFFFAOYSA-N 0.000 claims description 2
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 2
- ZJCZFAAXZODMQT-UHFFFAOYSA-N 2-methylpentadecane-2-thiol Chemical compound CCCCCCCCCCCCCC(C)(C)S ZJCZFAAXZODMQT-UHFFFAOYSA-N 0.000 claims description 2
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims description 2
- HTWRFCRQSLVESJ-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCOC(=O)C(C)=C HTWRFCRQSLVESJ-UHFFFAOYSA-N 0.000 claims description 2
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 claims description 2
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 claims description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- XAMCLRBWHRRBCN-UHFFFAOYSA-N 5-prop-2-enoyloxypentyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCOC(=O)C=C XAMCLRBWHRRBCN-UHFFFAOYSA-N 0.000 claims description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 2
- PLGOYNXHSRQDOG-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCC(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCC(CO)(CO)CO PLGOYNXHSRQDOG-UHFFFAOYSA-N 0.000 claims description 2
- BVVRPVFKRUVCJX-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)CO BVVRPVFKRUVCJX-UHFFFAOYSA-N 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 claims description 2
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 claims description 2
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 claims 1
- 239000004971 Cross linker Substances 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000002253 acid Substances 0.000 description 14
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005979 thermal decomposition reaction Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000004793 Polystyrene Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- 238000002411 thermogravimetry Methods 0.000 description 7
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 6
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- XFTALRAZSCGSKN-UHFFFAOYSA-M sodium;4-ethenylbenzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=C(C=C)C=C1 XFTALRAZSCGSKN-UHFFFAOYSA-M 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- BITHHVVYSMSWAG-KTKRTIGZSA-N (11Z)-icos-11-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCC(O)=O BITHHVVYSMSWAG-KTKRTIGZSA-N 0.000 description 2
- KXVFBCSUGDNXQF-DZDBOGACSA-N (2z,4z,6z,8z,10z)-tetracosa-2,4,6,8,10-pentaenoic acid Chemical compound CCCCCCCCCCCCC\C=C/C=C\C=C/C=C\C=C/C(O)=O KXVFBCSUGDNXQF-DZDBOGACSA-N 0.000 description 2
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 2
- DQGMPXYVZZCNDQ-KBPWROHVSA-N (8E,10E,12Z)-octadecatrienoic acid Chemical compound CCCCC\C=C/C=C/C=C/CCCCCCC(O)=O DQGMPXYVZZCNDQ-KBPWROHVSA-N 0.000 description 2
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 2
- CUXYLFPMQMFGPL-BGDVVUGTSA-N (9Z,11E,13Z)-octadecatrienoic acid Chemical compound CCCC\C=C/C=C/C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-BGDVVUGTSA-N 0.000 description 2
- FDUFQLNPPGRIKX-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CC(C)(CO)CO FDUFQLNPPGRIKX-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- DQGMPXYVZZCNDQ-UVZPLDOLSA-N Calendinsaeure Natural products CCCCCC=C/C=C/C=C/CCCCCCC(=O)O DQGMPXYVZZCNDQ-UVZPLDOLSA-N 0.000 description 2
- CUXYLFPMQMFGPL-WJTNUVGISA-N Catalpic acid Chemical compound CCCC\C=C/C=C/C=C/CCCCCCCC(O)=O CUXYLFPMQMFGPL-WJTNUVGISA-N 0.000 description 2
- 235000021294 Docosapentaenoic acid Nutrition 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- XMHIUKTWLZUKEX-UHFFFAOYSA-N hexacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O XMHIUKTWLZUKEX-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- ISYWECDDZWTKFF-UHFFFAOYSA-N nonadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)=O ISYWECDDZWTKFF-UHFFFAOYSA-N 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- XSXIVVZCUAHUJO-AVQMFFATSA-N (11e,14e)-icosa-11,14-dienoic acid Chemical compound CCCCC\C=C\C\C=C\CCCCCCCCCC(O)=O XSXIVVZCUAHUJO-AVQMFFATSA-N 0.000 description 1
- GWHCXVQVJPWHRF-KTKRTIGZSA-N (15Z)-tetracosenoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-KTKRTIGZSA-N 0.000 description 1
- VJILEYKNALCDDV-OIISXLGYSA-N (1S,4aS,10aR)-1,2,3,4,4a,9,10,10a-octahydro-6-hydroxy-1,4a-dimethylphenanthrene-1-carboxylic acid Chemical compound C1=C(O)C=C2[C@@]3(C)CCC[C@@](C(O)=O)(C)[C@@H]3CCC2=C1 VJILEYKNALCDDV-OIISXLGYSA-N 0.000 description 1
- SZQQHKQCCBDXCG-BAHYSTIISA-N (2e,4e,6e)-hexadeca-2,4,6-trienoic acid Chemical compound CCCCCCCCC\C=C\C=C\C=C\C(O)=O SZQQHKQCCBDXCG-BAHYSTIISA-N 0.000 description 1
- BBWMTEYXFFWPIF-CJBMEHDJSA-N (2e,4e,6e)-icosa-2,4,6-trienoic acid Chemical compound CCCCCCCCCCCCC\C=C\C=C\C=C\C(O)=O BBWMTEYXFFWPIF-CJBMEHDJSA-N 0.000 description 1
- HPSWUFMMLKGKDS-DNKOKRCQSA-N (2e,4e,6e,8e,10e,12e)-tetracosa-2,4,6,8,10,12-hexaenoic acid Chemical compound CCCCCCCCCCC\C=C\C=C\C=C\C=C\C=C\C=C\C(O)=O HPSWUFMMLKGKDS-DNKOKRCQSA-N 0.000 description 1
- LLWKIYGBECGCKZ-FNORWQNLSA-N (3E)-docosa-1,3-diene Chemical class CCCCCCCCCCCCCCCCCC\C=C\C=C LLWKIYGBECGCKZ-FNORWQNLSA-N 0.000 description 1
- HXQHFNIKBKZGRP-URPRIDOGSA-N (5Z,9Z,12Z)-octadecatrienoic acid Chemical compound CCCCC\C=C/C\C=C/CC\C=C/CCCC(O)=O HXQHFNIKBKZGRP-URPRIDOGSA-N 0.000 description 1
- TWSWSIQAPQLDBP-CGRWFSSPSA-N (7e,10e,13e,16e)-docosa-7,10,13,16-tetraenoic acid Chemical compound CCCCC\C=C\C\C=C\C\C=C\C\C=C\CCCCCC(O)=O TWSWSIQAPQLDBP-CGRWFSSPSA-N 0.000 description 1
- WTMLOMJSCCOUNI-QQFSJYTNSA-N (9Z,11E,15Z)-octadeca-9,11,15-trienoic acid Chemical compound CC\C=C/CC\C=C\C=C/CCCCCCCC(O)=O WTMLOMJSCCOUNI-QQFSJYTNSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- IJBFSOLHRKELLR-BQYQJAHWSA-N (e)-dodec-5-enoic acid Chemical compound CCCCCC\C=C\CCCC(O)=O IJBFSOLHRKELLR-BQYQJAHWSA-N 0.000 description 1
- ZVXDGKJSUPWREP-BQYQJAHWSA-N (e)-tetradec-7-enoic acid Chemical compound CCCCCC\C=C\CCCCCC(O)=O ZVXDGKJSUPWREP-BQYQJAHWSA-N 0.000 description 1
- DREPONDJUKIQLX-UHFFFAOYSA-N 1-[ethenyl(ethoxy)phosphoryl]oxyethane Chemical compound CCOP(=O)(C=C)OCC DREPONDJUKIQLX-UHFFFAOYSA-N 0.000 description 1
- CQCXMYUCNSJSKG-UHFFFAOYSA-N 1-dimethoxyphosphorylethene Chemical compound COP(=O)(OC)C=C CQCXMYUCNSJSKG-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AOEYIQINSMMVTP-UHFFFAOYSA-N 2-methylprop-2-enoic acid propane-1,2-diol Chemical compound CC(O)CO.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O AOEYIQINSMMVTP-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- YPJHXRAHMUKXAE-UHFFFAOYSA-N 3-diethoxyphosphorylprop-1-ene Chemical compound CCOP(=O)(CC=C)OCC YPJHXRAHMUKXAE-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- PIFPCDRPHCQLSJ-WYIJOVFWSA-N 4,8,12,15,19-Docosapentaenoic acid Chemical compound CC\C=C\CC\C=C\C\C=C\CC\C=C\CC\C=C\CCC(O)=O PIFPCDRPHCQLSJ-WYIJOVFWSA-N 0.000 description 1
- DQGMPXYVZZCNDQ-KDQYYBQISA-N 8Z,10E,12Z-octadecatrienoic acid Chemical compound CCCCC\C=C/C=C/C=C\CCCCCCC(O)=O DQGMPXYVZZCNDQ-KDQYYBQISA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 241001450758 Ceroplastes Species 0.000 description 1
- PIFPCDRPHCQLSJ-UHFFFAOYSA-N Clupanodonic acid Natural products CCC=CCCC=CCC=CCCC=CCCC=CCCC(O)=O PIFPCDRPHCQLSJ-UHFFFAOYSA-N 0.000 description 1
- 235000021292 Docosatetraenoic acid Nutrition 0.000 description 1
- 235000021297 Eicosadienoic acid Nutrition 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OPGOLNDOMSBSCW-CLNHMMGSSA-N Fursultiamine hydrochloride Chemical compound Cl.C1CCOC1CSSC(\CCO)=C(/C)N(C=O)CC1=CN=C(C)N=C1N OPGOLNDOMSBSCW-CLNHMMGSSA-N 0.000 description 1
- ONLMUMPTRGEPCH-UHFFFAOYSA-N Hentriacontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O ONLMUMPTRGEPCH-UHFFFAOYSA-N 0.000 description 1
- LRKATBAZQAWAGV-UHFFFAOYSA-N Hexatriacontylic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O LRKATBAZQAWAGV-UHFFFAOYSA-N 0.000 description 1
- DQGMPXYVZZCNDQ-XUAYTHHASA-N Jacaric acid Natural products CCCCCC=C/C=C/C=CCCCCCCC(=O)O DQGMPXYVZZCNDQ-XUAYTHHASA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 235000021353 Lignoceric acid Nutrition 0.000 description 1
- CQXMAMUUWHYSIY-UHFFFAOYSA-N Lignoceric acid Natural products CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 CQXMAMUUWHYSIY-UHFFFAOYSA-N 0.000 description 1
- XJXROGWVRIJYMO-SJDLZYGOSA-N Nervonic acid Natural products O=C(O)[C@@H](/C=C/CCCCCCCC)CCCCCCCCCCCC XJXROGWVRIJYMO-SJDLZYGOSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000021319 Palmitoleic acid Nutrition 0.000 description 1
- 239000005643 Pelargonic acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VJILEYKNALCDDV-UHFFFAOYSA-N Podocarpic acid Natural products C1=C(O)C=C2C3(C)CCCC(C(O)=O)(C)C3CCC2=C1 VJILEYKNALCDDV-UHFFFAOYSA-N 0.000 description 1
- HXQHFNIKBKZGRP-UHFFFAOYSA-N Ranuncelin-saeure-methylester Natural products CCCCCC=CCC=CCCC=CCCCC(O)=O HXQHFNIKBKZGRP-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- TWSWSIQAPQLDBP-UHFFFAOYSA-N adrenic acid Natural products CCCCCC=CCC=CCC=CCC=CCCCCCC(O)=O TWSWSIQAPQLDBP-UHFFFAOYSA-N 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010504 bond cleavage reaction Methods 0.000 description 1
- UOKRBSXOBUKDGE-UHFFFAOYSA-N butylphosphonic acid Chemical compound CCCCP(O)(O)=O UOKRBSXOBUKDGE-UHFFFAOYSA-N 0.000 description 1
- SECPZKHBENQXJG-UHFFFAOYSA-N cis-palmitoleic acid Natural products CCCCCCC=CCCCCCCCC(O)=O SECPZKHBENQXJG-UHFFFAOYSA-N 0.000 description 1
- GWHCXVQVJPWHRF-UHFFFAOYSA-N cis-tetracosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- DZQISOJKASMITI-UHFFFAOYSA-N decyl-dioxido-oxo-$l^{5}-phosphane;hydron Chemical compound CCCCCCCCCCP(O)(O)=O DZQISOJKASMITI-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- GZNJJEODYYLYSA-UHFFFAOYSA-N diethyl prop-2-enyl phosphate Chemical compound CCOP(=O)(OCC)OCC=C GZNJJEODYYLYSA-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KPGGPQIHJCHVLZ-UHFFFAOYSA-N docos-15-enoic acid Chemical compound CCCCCCC=CCCCCCCCCCCCCCC(O)=O KPGGPQIHJCHVLZ-UHFFFAOYSA-N 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- SVMUEEINWGBIPD-UHFFFAOYSA-N dodecylphosphonic acid Chemical compound CCCCCCCCCCCCP(O)(O)=O SVMUEEINWGBIPD-UHFFFAOYSA-N 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- IQLUYYHUNSSHIY-HZUMYPAESA-N eicosatetraenoic acid Chemical compound CCCCCCCCCCC\C=C\C=C\C=C\C=C\C(O)=O IQLUYYHUNSSHIY-HZUMYPAESA-N 0.000 description 1
- PRHHYVQTPBEDFE-UHFFFAOYSA-N eicosatrienoic acid Natural products CCCCCC=CCC=CCCCCC=CCCCC(O)=O PRHHYVQTPBEDFE-UHFFFAOYSA-N 0.000 description 1
- 229940108623 eicosenoic acid Drugs 0.000 description 1
- BITHHVVYSMSWAG-UHFFFAOYSA-N eicosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCC(O)=O BITHHVVYSMSWAG-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- FARYTWBWLZAXNK-WAYWQWQTSA-N ethyl (z)-3-(methylamino)but-2-enoate Chemical compound CCOC(=O)\C=C(\C)NC FARYTWBWLZAXNK-WAYWQWQTSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 235000021299 gondoic acid Nutrition 0.000 description 1
- YEXZTHNGURCFSJ-UHFFFAOYSA-N henicosa-2,4,6,8,10-pentaenoic acid Chemical compound CCCCCCCCCCC=CC=CC=CC=CC=CC(O)=O YEXZTHNGURCFSJ-UHFFFAOYSA-N 0.000 description 1
- VXZBFBRLRNDJCS-UHFFFAOYSA-N heptacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O VXZBFBRLRNDJCS-UHFFFAOYSA-N 0.000 description 1
- JDPSFRXPDJVJMV-UHFFFAOYSA-N hexadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCP(O)(O)=O JDPSFRXPDJVJMV-UHFFFAOYSA-N 0.000 description 1
- GJWAEWLHSDGBGG-UHFFFAOYSA-N hexylphosphonic acid Chemical compound CCCCCCP(O)(O)=O GJWAEWLHSDGBGG-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- SDEZNODBTRWJQZ-UHFFFAOYSA-N n,n'-dibenzylhexane-1,6-diamine Chemical compound C=1C=CC=CC=1CNCCCCCCNCC1=CC=CC=C1 SDEZNODBTRWJQZ-UHFFFAOYSA-N 0.000 description 1
- 235000021290 n-3 DPA Nutrition 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- IHEJEKZAKSNRLY-UHFFFAOYSA-N nonacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O IHEJEKZAKSNRLY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- NJGCRMAPOWGWMW-UHFFFAOYSA-N octylphosphonic acid Chemical compound CCCCCCCCP(O)(O)=O NJGCRMAPOWGWMW-UHFFFAOYSA-N 0.000 description 1
- 229960002969 oleic acid Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- MWMPEAHGUXCSMY-UHFFFAOYSA-N pentacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC(O)=O MWMPEAHGUXCSMY-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- JBYXPOFIGCOSSB-UQGDGPGGSA-N rumenic acid Chemical compound CCCCCC\C=C/C=C/CCCCCCCC(O)=O JBYXPOFIGCOSSB-UQGDGPGGSA-N 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- JIWBIWFOSCKQMA-UHFFFAOYSA-N stearidonic acid Natural products CCC=CCC=CCC=CCC=CCCCCC(O)=O JIWBIWFOSCKQMA-UHFFFAOYSA-N 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- OGQIJHRKHPDBAV-UHFFFAOYSA-N tetracos-17-enoic acid Chemical compound CCCCCCC=CCCCCCCCCCCCCCCCC(O)=O OGQIJHRKHPDBAV-UHFFFAOYSA-N 0.000 description 1
- RZHACVKGHNMWOP-ZWZRQGCWSA-N tetracosatetraenoic acid n-6 Chemical compound CCCCCCCCCCCCCCC\C=C\C=C\C=C\C=C\C(O)=O RZHACVKGHNMWOP-ZWZRQGCWSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- CUXYLFPMQMFGPL-UYWAGRGNSA-N trichosanic acid Natural products CCCCC=C/C=C/C=CCCCCCCCC(=O)O CUXYLFPMQMFGPL-UYWAGRGNSA-N 0.000 description 1
- XEZVDURJDFGERA-UHFFFAOYSA-N tricosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC(O)=O XEZVDURJDFGERA-UHFFFAOYSA-N 0.000 description 1
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- UBMUZYGBAGFCDF-UHFFFAOYSA-N trimethoxy(2-phenylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=C1 UBMUZYGBAGFCDF-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
Definitions
- This specification relates to a polymer bead composition and a method of manufacturing polymer beads using the same.
- Polymer beads based on polymer materials are highly versatile particles and are used for various purposes in the electrical and electronic fields, as well as in the chemical and bio fields. Currently, it is used as a light diffuser in displays and lighting equipment, and is also widely used as an additive in various industrial fields such as paints, plastic molded products, and cosmetics. Various physical properties are required depending on the intended use.
- thermal decomposition of polymer beads is divided into chain end unzipping at 250 ⁇ 300°C and unzipping by random scission above 300°C.
- Thermal decomposition by chain end unzipping at around 300°C is a polymer bead manufactured by suspension polymerization. Due to the nature of radical polymerization, it involves an unequal reaction involving a vinyl group having an unsaturated bond at the end of the polymer chain, which is generated during the termination reaction, and generates radicals, which cause unzipping from the end of the chain and cause thermal decomposition, thereby reducing heat resistance.
- a chain transfer agent and a silane monomer are added to a composition containing a specific vinyl monomer, the stirring conditions are adjusted to prepare a suspension, and then polymerization is performed using the suspension, resulting in thermogravimetric analysis (TGA: Thermogravimetric Analysis)
- TGA Thermogravimetric Analysis
- the above polymer beads had somewhat poor heat resistance at 320°C, and optical properties such as refractive index changed due to copolymerization of silane added to improve heat resistance, resulting in a change in refractive index when applied to an optical film or diffusion plate. Differences in luminance and concealment may occur.
- the present inventor confirmed that by implementing a polymer bead composition containing a specific monomer, a chain transfer agent, a phenolic compound, and a surface coating agent, a highly heat-resistant polymer bead with low weight loss while improving heat resistance at a temperature of 310 °C or higher was manufactured, , the present invention was completed.
- Patent Document 1 Korean Patent Publication No. 10-2012-0010366
- One embodiment of the present invention provides a polymer bead composition and a method of manufacturing polymer beads using the same.
- One embodiment of the present invention is one or more vinyl-based monomers selected from the group consisting of aromatic vinyl-based monomers, (meth)acrylic acid alkyl ester monomers having 1 to 20 carbon atoms, and (meth)acrylic acid fluoroalkyl ester monomers having 1 to 20 carbon atoms. polymer seeds derived from monomers;
- a polymer bead composition including a surface coating agent is provided.
- R is a straight or branched alkyl group having 10 to 30 carbon atoms.
- an exemplary embodiment of the present invention includes preparing the polymer bead composition described above; and polymerizing the polymer bead composition.
- One embodiment of the present invention seeks to provide a polymer bead composition that has excellent heat resistance at a temperature of 310 ° C. or higher and has no color change.
- One embodiment of the present invention seeks to provide a polymer bead composition having a uniform particle size distribution.
- Another embodiment of the present invention seeks to provide a method of manufacturing polymer beads using the polymer bead composition.
- Figure 1 shows the particle shape of polymer beads according to Example 2 of the present invention.
- Figure 2 shows the results of TGA analysis of the polymer beads according to Comparative Example 1.
- Figures 3 to 6 show the results of TGA analysis of polymer beads according to Examples 1 to 4 of the present invention.
- the terms comprise, comprises, and comprise mean to include the mentioned article, step, or group of articles, and steps, and any other article. , it is not used in the sense of excluding a step, a group of objects, or a group of steps.
- (meth)acrylic acid means acrylic acid, methacrylic acid, or a combination thereof.
- One embodiment of the present invention is one or more vinyl-based monomers selected from the group consisting of aromatic vinyl-based monomers, (meth)acrylic acid alkyl ester monomers having 1 to 20 carbon atoms, and (meth)acrylic acid fluoroalkyl ester monomers having 1 to 20 carbon atoms.
- polymer seeds derived from monomers A chain transfer agent of Formula 1 below; A phenol-based compound containing the following formula (2) at both ends and the middle chain (3) and (4) below; and a surface coating agent.
- R is a straight or branched alkyl group having 10 to 30 carbon atoms.
- polymer beads are prepared by adding a chain transfer agent and a silane monomer to a composition containing a vinyl-based monomer.
- polymer beads manufactured by conventional manufacturing methods have a particle size of several microns or more, and the particle size distribution is medium-dispersed or higher, and have excellent heat resistance at the film processing temperature, especially when the polymer colloid solution is applied to prevent blocking of films. It must have certain properties, but with conventional methods, heat resistance properties could not be secured, such as physical properties changing or yellowing occurring when processed at high temperatures, and the particle size distribution was not monodisperse, which raised the problem of limiting the scope of application.
- the present inventors completed the present invention by confirming that when the above-described polymer bead composition has the above composition, the degree of crosslinking is controlled when used to manufacture polymer beads, has excellent heat resistance properties and has a uniform particle size distribution.
- the vinyl monomer is a group consisting of an aromatic vinyl monomer, a (meth)acrylic acid alkyl ester monomer having 1 to 20 carbon atoms, and a (meth)acrylic acid fluoroalkyl ester monomer having 1 to 20 carbon atoms.
- an aromatic vinyl monomer a (meth)acrylic acid alkyl ester monomer having 1 to 20 carbon atoms
- a (meth)acrylic acid fluoroalkyl ester monomer having 1 to 20 carbon atoms.
- One or more types selected from may be used.
- the vinyl monomer is methyl methacrylate, divinylbenzene, butyl methacrylate, trimethylolmethane tetraacrylate, trimethylolmethane triacrylate, trimethylolbutane triacrylate, and ethylene. It may contain one or more types selected from the group consisting of glycol dimethacrylate. Preferably, styrene can be used as the vinyl monomer.
- the polymer seed may include a solvent.
- the solvent may be an aqueous solvent.
- the aqueous solvent includes water and the like.
- the polymer seed may be a mixture of the polymer seed derived from the vinyl monomer and the solvent.
- the weight of the polymer seed and the solvent may be 40 to 60 parts by weight and 60 to 40 parts by weight, respectively, based on the total weight of the polymer bead composition.
- the polymer bead composition may further include a styrene compound.
- the degree of crosslinking is controlled, so heat resistance properties are excellent and uniform particle size distribution can be achieved.
- the content of the styrene compound may be 10 to 40 parts by weight based on 100 parts by weight of the polymer seed. Preferably, it may be 10 to 35 parts by weight.
- the degree of crosslinking is adjusted, resulting in excellent heat resistance properties and uniform particle size distribution.
- the chain transfer agent is represented by Formula 1, and removes radicals generated from the unsaturated bond of the terminal vinyl group, resulting in uneven termination reaction and unreaction of the terminal vinyl group.
- heat resistance can be improved by removing monomers that decompose at high temperatures.
- R is a straight or branched alkyl group having 10 to 30 carbon atoms.
- R may be a straight-chain alkyl group having 10 to 30 carbon atoms.
- R may be a straight-chain alkyl group.
- the reactivity of the chain transfer agent is improved, making it easier to induce a chain transfer reaction.
- Polymer beads manufactured using these chain transfer agents have excellent heat resistance.
- the chain transfer agent may be one or more selected from the group consisting of 1-dodecanethiol, t-dodecylmercaptan, and t-hexadecylmercaptan.
- the chain transfer agent may be 1-dodecanethiol.
- the chain transfer agent may be CAS 112-55-0.
- the content of the chain transfer agent may be 0.1 to 0.8 parts by weight based on 100 parts by weight of the polymer seed. Preferably, it may be 0.3 to 0.5 parts by weight. If the chain transfer agent is used in excessive amounts, a large amount of polymer with a low molecular weight is produced, thereby increasing the completeness of the reaction, but it has poor solvent resistance, which may cause difficulties in the process when manufacturing an optical film. Therefore, it is important to use an appropriate amount of chain transfer agent to provide heat resistance and solvent resistance. Specifically, within the above numerical range, heat resistance is improved, polymerization stability is maintained, and aggregation of reactants can be prevented.
- the chain transfer agent is particularly used simultaneously with the phenol-based compound of the present invention, thereby preventing the onset of thermal decomposition above 310°C, improving work efficiency, improving heat resistance, and reducing weight loss. You can.
- antioxidants such as phosphorus-based, amine-based, hindered amine-based, and sulfur-based compounds instead of the phenol-based compound of the present invention, heat resistance and reactivity tend to decrease.
- the phenol-based compound may include the following formula (2) at both ends, and the middle chain may include the formula (3) and (4) below. Additionally, the intermediate chain contains 8 to 15 carbon atoms and may be formed as a straight chain.
- the polymer bead composition includes a phenol-based compound containing the following formula (2) at both ends and the middle chain (3) and (4) below.
- the phenol-based compound may reduce the reaction when used alone in a polymer bead composition because the OH group of Formula 2 acts as a radical inhibitor, but when used simultaneously with the chain transfer agent, only the peroxide radicals generated during the polymer decomposition reaction are easily captured and removed. Thus, heat resistance can be improved. That is, the phenol-based compound can be used as an antioxidant.
- the phenol-based compound contains Formula 2 at both ends and Formula 3 and Formula 4 in the middle chain, and the middle chain contains 8 to 15 carbon atoms and has a straight chain structure
- the polymer from which peroxide radicals generated during the polymer decomposition reaction are removed is located at both ends of the phenolic compound, preventing the onset of thermal decomposition, thereby suppressing fume generation, improving heat resistance, suppressing color change, and weight loss. It is expected.
- the content of the phenolic compound may be 0.1 to 1 part by weight based on 100 parts by weight of the polymer seed. Preferably, it may be 0.4 to 0.8 parts by weight. Within the above numerical range, heat resistance is improved, polymerization stability is maintained, and aggregation of reactants can be prevented.
- a representative example of the phenolic compound is antioxidant 245, and its CAS No. is 36443-68-2.
- the polymer bead composition includes a surface coating agent.
- the surface coating agent By including the surface coating agent, the stability and dispersibility of the polymer substrate that can be used for various purposes can be improved.
- the surface coating agent may be at least one selected from the group consisting of acrylate-based compounds, silane-based compounds, silicate-based compounds, phosphonate-based compounds, phosphate-based compounds, and acidic compounds.
- specific examples of the surface coating agent include 3-trimethoxysilyl propyl methacrylate, silica, tetraethyl orthosilicate, vinyltrimethoxysilane, vinyltriethoxysilane, and allyltrime.
- the content of the surface coating agent may be 10 to 35 parts by weight based on 100 parts by weight of the polymer seed. Preferably, it may be 18 to 35 parts by weight, 18 to 30 parts by weight, or 20 to 25 parts by weight. Within the above numerical range, the stability and dispersibility of the polymer can be improved.
- the polymer bead composition may include at least one selected from the group consisting of a crosslinking agent and an initiator.
- the crosslinking agent may be a compound containing two or more unsaturated carbons.
- the crosslinking agent is 1,2-ethanediol diacrylate, 1,3-propanediol diacrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, divinylbenzene, ethylene glycol diacrylate, propylene glycol diacrylate, butylene glycol diacrylate, triethylene glycol diacrylate , polyethylene glycol diacrylate, polypropylene glycol diacrylate, polybutylene glycol diacrylate, allyl acrylate, 1,2-ethanediol dimethacrylate, 1,3-propanediol dimethacrylate, 1, 3-Butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol dimethacrylate, 1,6
- the cross-linking agent includes a first cross-linking agent and a second cross-linking agent that are different from each other, and the weight ratio of the first cross-linking agent and the second cross-linking agent may be 1:2 to 2:1.
- the content of the cross-linking agent may be 15 to 75 parts by weight based on 100 parts by weight of the polymer seed. Preferably, it can be used in an amount of 20 to 72 parts by weight. If the content of the cross-linking agent is less than 15 parts by weight, it cannot be expected to function as a cross-linking agent. If it exceeds 75 parts by weight, it may be difficult to control the heat of reaction. If the degree of cross-linking of the particles increases, the reaction may decrease due to an exothermic reaction.
- the initiator includes a radical initiator.
- the radical initiator may be an oil-soluble initiator or a water-soluble initiator.
- the oil-soluble initiator may include one or more selected from the group consisting of benzoyl peroxide, azobisisobutyronitrile, azobisphenylbutyronitrile, and azobiscyclohexanecarbonitrile.
- the water-soluble initiator includes at least one selected from the group consisting of potassium sulfate, sodium sulfate, ammonium persulfate, and azo-based water-soluble initiator.
- the content of the initiator may be 1 to 3 parts by weight based on 100 parts by weight of the polymer seed. If the content of the initiator is less than 0.1 parts by weight, reaction completeness may decrease, and if it exceeds 3 parts by weight, it may be difficult to control the heat of reaction.
- the particle diameter of the polymer seed may be 100 nm to 1,000 nm. Specifically, it may be 100 nm or more, 200 nm or more, 300 nm or more, 400 nm or more, 500 nm or more, 600 nm or more, 700 nm or more, 800 nm or more, 900 nm or more, and 1000 nm or more. Within the above range, the structural stability of the polymer seed is improved and the particle size distribution can be maintained uniformly.
- the polymer bead composition may further include a dispersion stabilizer.
- the dispersion stabilizer may be 1,1-dichloroethane, potassium hydroxide, sodium hydroxide, an adipate-based compound, an amide-based compound, a sulfonate-based compound, or a mixture thereof.
- the dispersion stabilizer is 1,1-dichloroethane, potassium hydroxide, sodium hydroxide, poly(1,6-hexamethylene adipate), N,N'-dibenzyl -1,6-diaminohexane (N,N'-dibenzyl-1,6-diaminohexane), sodium 4-vinylbenzenesulfonate, or mixtures thereof can be used.
- the dispersion stabilizer is 1,1-dichloroethane, potassium hydroxide, sodium hydroxide, poly(1,6-hexamethylene adipate), N,N'-dibenzyl-1,6-diaminohexane, sodium 4-vinylbenzenesulfonate, etc. may be used.
- the content of the dispersion stabilizer may be 0.01 to 1 part by weight based on 100 parts by weight of the polymer seed. Dispersion stability can be improved within the above numerical range.
- the polymer bead composition may be in a colloidal state.
- the colloidal state means that the components included in the polymer bead composition exist in nanoparticle sizes (1 micrometer to 100 micrometers).
- it is derived from one or more vinyl monomers selected from the group consisting of aromatic vinyl monomers, (meth)acrylic acid alkyl ester monomers having 1 to 20 carbon atoms, and (meth)acrylic acid fluoroalkyl ester monomers having 1 to 20 carbon atoms.
- This means that the polymer seed, chain transfer agent, phenol-based compound, or surface coating agent is nanoparticle-sized and exists in a uniformly spread state in the solvent.
- One embodiment of the present invention includes preparing the polymer bead composition described above; and polymerizing the polymer bead composition.
- the step of preparing the polymer bead composition includes an aromatic vinyl monomer, a (meth)acrylic acid alkyl ester monomer having 1 to 20 carbon atoms, and a (meth)acrylic acid fluoroalkyl ester having 1 to 20 carbon atoms. It may include preparing a polymer seed by polymerizing one or more vinyl monomers selected from the group consisting of monomers.
- At this time, at least one vinyl monomer selected from the group consisting of the vinyl monomer, (meth)acrylic acid alkyl ester monomer having 1 to 20 carbon atoms, and (meth)acrylic acid fluoroalkyl ester monomer having 1 to 20 carbon atoms, and the polymer seed are The content described in the above-described polymer bead composition can be applied.
- the step of preparing a polymer seed by polymerizing the vinyl monomer may include performing a polymerization reaction at 50°C to 90°C for 5 to 48 hours. Within the above range, the shape of the prepared polymer seed is maintained and the polymerization reaction can be smoothly initiated.
- the content of each component described above in the polymer bead composition may be applied.
- the step of polymerizing the polymer bead composition may include conducting a polymerization reaction at 50°C to 90°C for 5 to 48 hours.
- the polymerization temperature range is 60°C to 80°C, and the polymerization reaction time may be 12 to 30 hours.
- the temperature of the reactor containing the emulsion is carried out in the above temperature range under a nitrogen atmosphere, so that the chain transfer agent may react before the phenol-based compound during polymerization compared to the case of polymerization while raising the temperature of the reactor. You can. Accordingly, heat resistance can be improved by preventing the onset of thermal decomposition above 310°C.
- polymerizing the polymer bead composition may include stirring at a stirring speed of 100 rpm to 1,000 rpm.
- the stirring speed may be 200 rpm to 800 rpm or 300 rpm to 600 rpm. In the above range, polymerization stability is excellent and the physical properties of the produced polymer beads are excellent.
- a polymer bead composition was prepared by mixing 0.6 parts by weight of nitrile (Azobisisobutyronitrile) and 22.2 parts by weight each of trimethylolpropane triacrylate and divinylbenzene as a crosslinking agent, for a total of 44.4 parts by weight.
- a polymer bead composition was prepared by mixing 26.2 parts by weight of vinylbenzene for a total of 52.4 parts by weight.
- Example 2 45 parts by weight of the polystyrene polymer seed prepared in Example 2 and 55 parts by weight of water were mixed. Based on 100 parts by weight of the mixed materials, 13 parts by weight of Styrene, 0.4 parts by weight of CAS 112-55-0 as a chain transfer agent, 0.6 parts by weight of CAS 36443-68-2 as a phenolic compound, and 3-part by weight as a surface coating agent. 14 parts by weight of 3-(trimethoxysilyl) propyl acrylate, 0.6 parts by weight of Azobisisobutyronitrile as an initiator, and Trimethylolpropane triacrylate and dimethylolpropane triacrylate as a crosslinking agent.
- a polymer bead composition was prepared by mixing 35.7 parts by weight of vinylbenzene for a total of 71.4 parts by weight.
- Example 2 45 parts by weight of the polystyrene polymer seed prepared in Example 2 and 55 parts by weight of water were mixed. Based on 100 parts by weight of the mixed materials, 32 parts by weight of Styrene, 0.4 parts by weight of CAS 112-55-0 as a chain transfer agent, 0.6 parts by weight of CAS 36443-68-2 as a phenolic compound, and 3-part by weight as a surface coating agent. Mix 14 parts by weight of trimethoxysilyl propyl acrylate, 0.6 parts by weight of Azobisisobutyronitrile as an initiator, and 52.4 parts by weight of Divinylbenzene as a crosslinking agent. A polymer bead composition was prepared.
- Polymer beads were prepared using the polymer bead compositions of the comparative examples and examples, respectively.
- polymer beads were prepared by polymerizing each polymer bead composition at 280 rpm at 70°C for 24 hours under a nitrogen atmosphere. Comparison polymer beads and polymer beads 1 to 4, respectively.
- the polymer beads prepared using the polymer bead compositions of the comparative examples and examples were dried, solid samples were collected, and particle shapes were analyzed through scanning electron microscopy (SEM, COXEM).
- Figure 1 shows the particle shape of polymer beads according to Example 2 of the present invention. Specifically, it can be confirmed that the polymer beads according to Example 2 of the present invention have a uniform particle size and a smooth surface.
- thermogravimetric analysis TGA
- the comparative polymer beads prepared in Comparative Example 1 showed a relatively low thermal decomposition temperature ( Figure 2), but Example 1 ( Figure 3), Example 2 ( Figure 4), Example 3 ( Figure 5), and Example It was confirmed that the thermal decomposition temperature of each of the polymer beads 1 to 4 manufactured in Figure 4 ( Figure 6) was high. Specifically, looking at Figure 2, the comparative polymer beads prepared in Comparative Example 1 undergo thermal decomposition around 307°C, while looking at Figures 3 to 6, the polymer beads 1 to 4 prepared in Examples 1 and 4 undergo thermal decomposition at a temperature of at least 314°C. From the above, it can be confirmed that thermal decomposition proceeds, and in the case of Example 4, it can be confirmed that thermal decomposition proceeds around 330 ° C. In other words, it can be confirmed that the polymer beads according to the present invention have excellent thermal stability, that is, excellent heat resistance.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Inorganic Chemistry (AREA)
Abstract
La présente invention concerne une composition de billes polymères et un procédé de fabrication de billes polymères l'utilisant, la composition de billes polymères comprenant : des germes de polymère dérivés d'au moins un monomère à base de vinyle choisi dans le groupe constitué par un monomère à base de vinyle aromatique, un monomère d'ester d'alkyle d'acide (méth)acrylique de 1 à 20 atomes de carbone, et un monomère d'ester de fluoroalkyle d'acide (méth)acrylique de 1 à 20 atomes de carbone ; un agent de transfert réversible de formule chimique 1 ; un composé à base de phénol comprenant la formule chimique 2 aux deux extrémités et la formule chimique 3 et la formule chimique 4 en milieu de chaîne ; et un agent de revêtement de surface.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220044652A KR102479521B1 (ko) | 2022-04-11 | 2022-04-11 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
KR10-2022-0044652 | 2022-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023200200A1 true WO2023200200A1 (fr) | 2023-10-19 |
Family
ID=84539269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2023/004804 WO2023200200A1 (fr) | 2022-04-11 | 2023-04-10 | Composition de billes polymères et procédé de fabrication de billes polymères l'utilisant |
Country Status (2)
Country | Link |
---|---|
KR (2) | KR102479521B1 (fr) |
WO (1) | WO2023200200A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102479521B1 (ko) * | 2022-04-11 | 2022-12-20 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100725306B1 (ko) * | 2001-01-10 | 2007-06-07 | 주식회사 코오롱 | 폴리머 비드의 제조방법 |
KR101853926B1 (ko) * | 2012-02-01 | 2018-06-14 | 코오롱인더스트리 주식회사 | 고내열성 구형 폴리머 비드 및 그 제조방법 |
KR20210067411A (ko) * | 2019-11-29 | 2021-06-08 | (주)에이에스피 | 폴리머 비드 및 그 제조방법 |
KR20220020793A (ko) * | 2020-08-12 | 2022-02-21 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
KR102479521B1 (ko) * | 2022-04-11 | 2022-12-20 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0907372D0 (en) * | 2009-04-29 | 2009-06-10 | Invitrogen Dynal As | Particles |
KR20120010366A (ko) | 2010-07-26 | 2012-02-03 | 울산대학교 산학협력단 | 포도씨 프로안토시아니딘 추출물을 유효성분으로 함유하는 만성폐쇄성 폐질환 치료 및 예방용 약학조성물 |
-
2022
- 2022-04-11 KR KR1020220044652A patent/KR102479521B1/ko active IP Right Grant
- 2022-12-06 KR KR1020220168279A patent/KR102509422B1/ko active IP Right Grant
-
2023
- 2023-04-10 WO PCT/KR2023/004804 patent/WO2023200200A1/fr unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100725306B1 (ko) * | 2001-01-10 | 2007-06-07 | 주식회사 코오롱 | 폴리머 비드의 제조방법 |
KR101853926B1 (ko) * | 2012-02-01 | 2018-06-14 | 코오롱인더스트리 주식회사 | 고내열성 구형 폴리머 비드 및 그 제조방법 |
KR20210067411A (ko) * | 2019-11-29 | 2021-06-08 | (주)에이에스피 | 폴리머 비드 및 그 제조방법 |
KR20220020793A (ko) * | 2020-08-12 | 2022-02-21 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
KR102479521B1 (ko) * | 2022-04-11 | 2022-12-20 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
KR102509422B1 (ko) * | 2022-04-11 | 2023-03-14 | (주)에이에스피 | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102509422B1 (ko) | 2023-03-14 |
KR102479521B1 (ko) | 2022-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2023200200A1 (fr) | Composition de billes polymères et procédé de fabrication de billes polymères l'utilisant | |
WO2012008654A1 (fr) | Procédé de production d'une résine à base de chlorure de vinyle présentant des caractéristiques exceptionnelles d'uniformité des particules et de stabilité à la chaleur | |
WO2018056610A1 (fr) | Procédé de préparation d'un composite polymère à base de chlorure de vinyle, composite polymère à base de chlorure de vinyle, et composition composite polymère à base de chlorure de vinyle | |
WO2012099334A2 (fr) | Charge polymère conductrice contenant une microcapsule de nanotubes carbone encapsulée par une couche de résine thermoplastique et son procédé de formation | |
JP7046947B2 (ja) | ポリマー組成物 | |
WO2015080367A1 (fr) | Procédé pour la préparation de résine à base de chlorure de vinyle | |
WO2024005345A1 (fr) | Particules de résine à base de fluor de type coeur- écorce ayant une aptitude à l'écoulement et une floculation améliorées, et procédé de préparation | |
WO2014038851A1 (fr) | Procédé de préparation de charge conductrice de type microcapsule de résine thermoplastique contenant un nanotube de carbone-graphène exfolié, composition de résine thermoplastique conductrice la contenant et son procédé de préparation | |
EP0810243A1 (fr) | Dispersion de resine aqueuse et son procede d'elaboration | |
WO2017069425A1 (fr) | Polymère à base de chlorure de vinyle présentant une viscosité élevée dans une plage de cisaillement faible, procédé de préparation correspondant et plastisol le comprenant | |
KR20210067411A (ko) | 폴리머 비드 및 그 제조방법 | |
KR102456256B1 (ko) | 폴리머 비드 조성물 및 이를 이용한 폴리머 비드의 제조방법 | |
CN111072316A (zh) | 一种pmma-氢氧化铝-有机磷的亚克力复合基材及其制备方法 | |
WO2015041443A1 (fr) | Composition de nanocomposite à base de chlorure de vinyle et procédé de production d'un nanocomposite à base de chlorure de vinyle | |
WO2018056611A1 (fr) | Procédé de préparation de polymère à base de chlorure de vinyle, polymère à base de chlorure de vinyle et composition de polymère à base de chlorure de vinyle | |
WO2013183895A1 (fr) | Polyalkyle acrylate hydrodispersable de coiffage d'halogène, copolymère bloc à base de chlorure de vinyle et procédé de production correspondant | |
WO2017061829A1 (fr) | Polymère à base de chlorure de vinyle et son procédé de préparation | |
WO2021040253A1 (fr) | Composition adhésive ignifuge aqueuse et procédé pour la production de celle-ci | |
KR20210136868A (ko) | 염화비닐계 중합체 복합체의 제조방법, 염화비닐계 중합체 복합체 및 이를 포함하는 염화비닐계 중합체 복합체 조성물 | |
WO2022005118A1 (fr) | Procédé de production d'un composite polymère à base de chlorure de vinyle | |
WO2018190673A1 (fr) | Procédé de fabrication de poudre à canon composite comprimée à l'aide d'une émulsion de polymère, et poudre à canon composite comprimée ainsi fabriquée | |
WO2016047954A1 (fr) | Polymère à base de chlorure de vinyle et son procédé de production | |
WO2021225394A1 (fr) | Procédé de préparation de composite polymère de chlorure de vinyle, composite polymère de chlorure de vinyle et composition de composite polymère de chlorure de vinyle comprenant celui-ci | |
WO2018056604A1 (fr) | Procédé de production d'un polymère à base de chlorure de vinyle | |
WO2021256867A1 (fr) | Procédé de production d'un composite polymère à base de chlorure de vinyle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23788550 Country of ref document: EP Kind code of ref document: A1 |