WO2023189210A1

WO2023189210A1 - High-frequency module, and method for manufacturing high-frequency module

Info

Publication number: WO2023189210A1
Application number: PCT/JP2023/008088
Authority: WO
Inventors: 崇弥根本; 英樹上田; 通春横山
Original assignee: 株式会社村田製作所
Priority date: 2022-03-28
Filing date: 2023-03-03
Publication date: 2023-10-05

Abstract

In this invention, a support member covers a first component. The support member has a first surface. A wiring board is disposed non-parallel to the first surface, and at least a partial region of one surface is covered with the support member. A second component is mounted on the surface of the wiring board which is covered with the support member. The second component is also covered with the support member. A first external connection terminal connected to the first component is exposed on the first surface. A second external connection terminal is exposed on the first surface or disposed on a virtual plane extending from the first surface, and electrically connected to the second component.

Description

High frequency module and high frequency module manufacturing method

The present invention relates to a high frequency module and a method for manufacturing a high frequency module.

A communication device that can increase the degree of freedom in the arrangement of antenna modules within a communication device such as a mobile terminal is disclosed in Patent Document 1 below. The communication device disclosed in Patent Document 1 uses a connecting member in which a bent portion is formed. The antenna device is mounted on one part with the bent part in between, and the front end module is mounted on the other part. The part where the front-end module is mounted is connected to the motherboard.

International Publication No. 2022/004080

As mobile terminals become thinner, there is a demand for further miniaturization and lower height of high-frequency modules installed in mobile terminals. The height of the antenna module disclosed in Patent Document 1 is higher than the sum of the thickness of the connection member on which the front end module is mounted and the height of the front end module itself. An object of the present invention is to provide a high frequency module that can achieve further reduction in height, and a method for manufacturing the same.

According to one aspect of the invention:
a first part;
a support member having a first surface and covering the first component;
a wiring board arranged non-parallel to the first surface,
at least a portion of one surface of the wiring board is covered with the support member;
moreover,
a second component mounted on the side of the wiring board covered by the support member and covered by the support member;
a first external connection terminal exposed on the first surface and connected to the first component;
A high frequency module is provided, including a second external connection terminal exposed on the first surface or placed on a virtual plane extending from the first surface and electrically connected to the second component. .

According to another aspect of the invention:
A temporary board having a plurality of lands on a first mounting surface; a wiring board connected to the temporary board and having a plurality of internal terminals on a second mounting surface non-parallel to the first mounting surface; producing an intermediate product including a first component connected to one of the lands and mounted on the temporary board; a second component connected to at least one of the internal terminals and mounted on the wiring board;
After producing the intermediate product, covering the first mounting surface, the second mounting surface, the first component, and the second component with a support member,
A method of manufacturing a high frequency module is provided, which comprises polishing or grinding the temporary substrate after covering it with the support member until at least the land is exposed.

Since the first surface where the first external connection terminal to which the first component is connected is exposed is not parallel to the wiring board on which the second component is mounted, there is a degree of freedom in the arrangement of the first component and the second component. increases. Furthermore, after the first component is mounted on the temporary substrate, the temporary substrate is polished or ground, thereby making it possible to reduce the height of the high-frequency module.

FIG. 1A is a schematic sectional view of the high frequency module according to the first embodiment, FIGS. 1B and 1C are front and rear views of the wiring board, respectively, and FIG. 1D is a schematic cross-sectional view of the high frequency module according to the first embodiment. FIG. 3 is a schematic cross-sectional view of the device mounted on a board. The drawings from FIG. 2A to FIG. 2D are schematic cross-sectional views of the high-frequency module according to the first embodiment at an intermediate stage of manufacture. FIG. 3 is a schematic sectional view of a portion of a high frequency module according to a modification of the first embodiment. FIG. 4 is a schematic sectional view of a high frequency module according to another modification of the first embodiment. FIG. 5 is a schematic sectional view of a high frequency module according to a second embodiment. FIG. 6 is a perspective view of a temporary board and a wiring board used as an intermediate product of a high frequency module according to the second embodiment. The drawings from FIG. 7A to FIG. 7D are schematic cross-sectional views of the high-frequency module according to the second embodiment at an intermediate stage of manufacture. FIG. 8 is a schematic sectional view of a high frequency module according to a modification of the second embodiment. FIG. 9 is a schematic sectional view of a high frequency module according to a third embodiment. FIG. 10 is a schematic sectional view of a high frequency module according to a fourth embodiment. FIG. 11 is a schematic sectional view of a high frequency module according to a fifth embodiment. FIG. 12 is a schematic sectional view of a high frequency module according to a sixth embodiment. FIG. 13 is an equivalent circuit diagram of a part of the high frequency module according to the sixth embodiment. FIG. 14 is a schematic cross-sectional view of a high frequency module according to a seventh embodiment. FIG. 15 is a schematic sectional view of a high frequency module according to a modification of the seventh embodiment. FIG. 16 is a schematic sectional view of a high frequency module according to the eighth embodiment. FIG. 17 is a perspective view of a temporary board and a wiring board used in manufacturing the high frequency module according to the eighth embodiment. The drawings from FIG. 18A to FIG. 18D are cross-sectional views of the high-frequency module according to the eighth embodiment at an intermediate stage of manufacture.

[First example]
A high frequency module and a manufacturing method thereof according to a first embodiment will be described with reference to the drawings from FIG. 1A to FIG. 2D.

FIG. 1A is a schematic cross-sectional view of a high-frequency module 100 according to the first embodiment, and FIGS. 1B and 1C are a front view and a rear view of a wiring board 40, respectively. A plurality of first parts 20 and at least one second part 30 are covered and supported by a support member 50 made of resin. For example, the support member 50 is in close contact with the surface of the first component 20 and the surface of the second component 30. A plurality of first external connection terminals 61, a plurality of second external connection terminals 62, and wiring 63 are exposed on the first surface 50A, which is one surface of the support member 50. The wiring 63 connects one first external connection terminal 61 and one second external connection terminal 62.

The exposed surfaces of the plurality of first external connection terminals 61, the plurality of second external connection terminals 62, and the wiring 63, and the first surface 50A of the support member 50 are located on a substantially common virtual plane. In other words, these surfaces are almost flush. Note that due to variations in precision during the manufacturing process, minute steps may be formed at the boundaries of these surfaces.

The wiring board 40 is arranged non-parallel to the first surface 50A. The second component 30 is mounted on one surface of the wiring board 40. Here, "the wiring board 40 is not parallel to the first surface 50A" means, for example, that the surface of the wiring board 40 on which the second component 30 is mounted is not parallel to the first surface 50A. It means that. As the wiring board 40, for example, a printed wiring board is used. The surface on which the second component 30 is mounted will be referred to as a second mounting surface 40A. The second mounting surface 40A and the first surface 50A of the support member 50 are non-parallel, and the angle between them is, for example, 90°.

A plurality of lands 43 are arranged on the second mounting surface 40A of the wiring board 40. The second component 30 has a plurality of internal terminals 31. The second component 30 is mounted on the wiring board 40 by connecting the internal terminal 31 to the land 43 via the solder member 32.

The wiring board 40 includes second internal terminals 41 arranged on a second mounting surface 40A and a surface opposite thereto. The second internal terminal 41 is arranged at the edge of the support member 50 on the first surface 50A side. The second internal terminal 41 is connected to the second external connection terminal 62 via the second solder member 42 . The second mounting surface 40A, the second internal terminal 41 on the second mounting surface 40A side, and the second solder member 42 connected thereto are covered with a support member 50. For example, the support member 50 is in close contact with the second mounting surface 40A, the surface of the second internal terminal 41 on the second mounting surface 40A side, and the surface of the second solder member 42 connected thereto.

The plurality of second internal terminals 41 are each connected to a land 43 via a wiring 46 within the wiring board 40. That is, the second external connection terminal 62 is electrically connected to the second component 30.

Each of the first components 20 has a plurality of first internal terminals 21. In FIG. 1A, the plurality of first internal terminals 21 are depicted as being embedded in the main body of the first component 20, but there is a structure in which the plurality of first internal terminals 21 protrude from the surface of the main body of the first component 20. may be adopted. The plurality of first external connection terminals 61 are each connected to the first internal terminal 21 via the first solder member 22. That is, the plurality of first external connection terminals 61 are electrically connected to the first component 20. An intermediate board such as an interposer is not interposed between the first external connection terminal 61 and the first component 20.

FIG. 1D is a schematic cross-sectional view of the high frequency module 100 according to the first embodiment mounted on the mounting board 95. A plurality of lands 96 are arranged on one surface of the mounting board 95. The high frequency module 100 is mounted on the mounting board 95 by connecting the plurality of first external connection terminals 61 and the second external connection terminals 62 to the lands 96 via the solder members 97, respectively. Note that some of the first external connection terminals 61 and the second external connection terminals 62 are not connected to the lands 96.

Next, a method for manufacturing the high frequency module 100 according to the first embodiment will be described with reference to the drawings from FIG. 2A to FIG. 2D. The drawings from FIG. 2A to FIG. 2D are schematic cross-sectional views of the high-frequency module 100 according to the first embodiment at an intermediate stage of manufacture.

As shown in FIG. 2A, a plurality of first external connection terminals 61, a plurality of second external connection terminals 62, and a plurality of lands serving as wiring 63 are provided on the first mounting surface 80A, which is one surface of the temporary board 80. Form. The first external connection terminal 61 and the second external connection terminal 62 are used as lands for mounting the first component 20 and the wiring board 40. For example, a printed wiring board can be used as the temporary board 80. The first internal terminal 21 of the first component 20 is connected to the first external connection terminal 61 via the first solder member 22, thereby fixing the first component 20 to the temporary board 80.

The second component 30 is mounted on the wiring board 40. The wiring board 40 is fixed to the temporary board 80 by connecting the second internal terminal 41 of the wiring board 40 to the second external connection terminal 62 via the second solder member 42 . As a result, an intermediate product 90 shown in FIG. 2B is obtained.

As shown in FIG. 2C, the support member 50 is formed to cover the first mounting surface 80A of the temporary board 80, the second mounting surface 40A of the wiring board 40, the first component 20, and the second component 30. For example, a resin sealant can be used as the support member 50.

As shown in FIG. 2D, by polishing or grinding the temporary substrate 80 from the side opposite to the first mounting surface 80A, the first external connection terminal 61, the second external connection terminal 62, and the wiring 63 are exposed. This also exposes the first surface 50A of the support member 50.

Next, the excellent effects of the first embodiment will be explained.
The high frequency module 100 according to the first embodiment does not include an interposer, and the first component 20 is mounted on a mounting board 95 (FIG. 1D), for example, a motherboard, without using an interposer. Therefore, it is possible to reduce the height of the high frequency module 100. The internal terminal 31 of the second component 30 does not face the mounting board 95, but faces in a direction parallel to the mounting board 95 (lateral direction). In this way, the degree of freedom in the posture and arrangement of components included in the high-frequency module 100 can be increased. Here, "posture" means, for example, the state of the rotation angle from the reference angle in the rotation direction around each of three mutually orthogonal axes.

If the dimension of the second component 30 in the direction perpendicular to the plane on which the internal terminal 31 is arranged is larger than the dimension in other directions, the second component 30 is arranged with the internal terminal 31 facing in the horizontal direction. By doing so, it is possible to reduce the height of the high frequency module 100.

The internal terminal 31 of the second component 30 is electrically connected to the second external connection terminal 62 exposed on the first surface 50A via the wiring 46 in the wiring board 40. Therefore, even if the second component 30 is placed horizontally, the high frequency module 100 can be surface mounted on the mounting board 95 by connecting the first external connection terminal 61 and the second external connection terminal 62 to the land 96 of the mounting board 95. Thus, the second component 30 can be electrically connected to the land 96 on the mounting board 95.

By arranging the wiring 63 on the first surface 50A of the support member 50, it is possible to close the high frequency module 100 and connect the first external connection terminal 61 and the second external connection terminal 62. Thereby, the first component 20 and the second component 30 can be electrically connected without going through the wiring within the mounting board 95.

Next, a high frequency module according to a modification of the first embodiment will be described with reference to FIG. FIG. 3 is a schematic sectional view of a portion of the high frequency module 100 according to a modification of the first embodiment. In the first embodiment (FIG. 1A), second internal terminals 41 are arranged on the second mounting surface 40A of the wiring board 40 and the surface opposite thereto. On the other hand, in the modification shown in FIG. 3, the third internal terminal 44 is arranged on the end surface 40B of the wiring board 40 facing in the same direction as the first surface 50A. The third internal terminal 44 is connected to the land 43 via a wiring 46 within the wiring board 40.

The third internal terminal 44 can be formed by laser direct structuring (LDS), for example. Alternatively, the third internal terminal 44 may be formed by stacking the wiring and vias in the wiring board 40. The third internal terminal 44 is connected to the second external connection terminal 62 via a third solder member 45.

As in the modification shown in FIG. 3, the third internal terminal 44 of the wiring board 40 may be arranged on the end surface 40B of the wiring board 40.

Next, with reference to FIG. 4, a high frequency module according to another modification of the first embodiment will be described. FIG. 4 is a schematic cross-sectional view of a high frequency module 100 according to another modification of the first embodiment.

In the first embodiment (FIG. 1A), the first external connection terminal 61 exposed on the first surface 50A of the support member 50 is connected to the first internal terminal 21 of the first component 20 via the first solder member 22. ing. In contrast, in this modification, the first internal terminal 21 of the first component 20 is exposed on the first surface 50A, and the first internal terminal 21 is used as the first external connection terminal 61. Furthermore, the third internal terminal 44 disposed on the end surface 40B (FIG. 3) of the wiring board 40 is exposed on the first surface 50A and is used as the second external connection terminal 62.

In the high frequency module 100 according to this modification, after the support member 50 is exposed in the process of polishing or grinding the temporary substrate 80 shown in FIG. 21 is exposed. The third internal terminal 44 of the wiring board 40 is also exposed when the first internal terminal 21 of the first component 20 is exposed. In this modification, lands are formed on the first mounting surface 80A of the temporary substrate 80 in place of the first external connection terminals 61 and the second external connection terminals 62 in the step shown in FIG. 2A. This land is removed in the polishing or grinding process shown in FIG. 2D.

In this modification, the height of the high frequency module 100 can be further reduced compared to the first embodiment (FIG. 1A). The polishing or grinding of the temporary substrate 80 shown in FIG. 2D may be stopped when the first solder member 22 and the second solder member 42 are exposed. In this case, the first solder member 22 is used as the first external connection terminal 61 and the second solder member 42 is used as the second external connection terminal 62.

[Second example]
Next, a high frequency module according to a second embodiment will be described with reference to the drawings from FIG. 5 to FIG. 7D. Hereinafter, a description of the configuration common to the high frequency module 100 according to the first embodiment described with reference to the drawings from FIG. 1A to FIG. 2D will be omitted.

FIG. 5 is a schematic cross-sectional view of the high frequency module 100 according to the second embodiment. In the support member 50 of the high frequency module 100 according to the second embodiment, the surface in close contact with the second mounting surface 40A of the wiring board 40 and the first surface 50A are connected via a curved surface 50R having an R-chamfered shape. has been done. The wiring board 40 includes a flat first portion 40F, a second portion 40R, and a third portion 40E. The third portion 40E and the second portion 40R extend in the same direction from the first portion 40F at the base connected to the first portion 40F. The second portion 40R curves away from the first portion 40F and is in close contact with the curved surface 50R. That is, the third portion 40E and the second portion 40R extend in mutually different directions at portions other than the base connected to the first portion 40F. The third portion 40E and the first portion 40F have a second mounting surface 40A that is a common continuous plane.

The second portion 40R is provided in a part of the range in the direction of the generatrix of the second portion 40R (direction perpendicular to the paper surface in FIG. 5). The third portion 40E is provided in a range where the second portion 40R is not provided in the direction of the generatrix of the second portion 40R. A second external connection terminal 62 is arranged on the end surface 40B at the tip of the third portion 40E. The second external connection terminal 62 is arranged on a virtual plane extending from the first surface 50A of the support member 50. That is, a virtual plane that is an extension of the first surface 50A touches the second external connection terminal 62 or passes through the inside of the second external connection terminal 62. In other words, the first external connection terminal 61 and the second external connection terminal 62 are arranged at the same position in the height direction using the first surface 50A as a height reference.

FIG. 6 is a schematic perspective view of a temporary board 80 and a wiring board 40 used as an intermediate product of the high frequency module 100 according to the second embodiment. The wiring board 40 includes a first portion 40F, a plurality of second portions 40R, and a plurality of third portions 40E. The first portion 40F and the temporary substrate 80 are connected by a plurality of second portions 40R. The second mounting surface 40A of the first portion 40F and the first mounting surface 80A of the temporary substrate 80 have a substantially perpendicular positional relationship. The second portion 40R smoothly connects the first mounting surface 80A and the second mounting surface 40A (without unevenness).

A plurality of second portions 40R and a plurality of third portions 40E are arranged alternately in the direction of the generatrix GL of the second portion 40R. The third portion 40E extends from the first portion 40F along a virtual plane including the second mounting surface 40A in a direction intersecting, for example, perpendicular to the generatrix GL. An intermediate product having such a shape can be produced by cutting a portion of a flat substrate to make it thinner, and then curving the thinner portion. The thinned portion corresponds to the second portion 40R.

Next, a method for manufacturing the high frequency module 100 according to the second embodiment will be described with reference to the drawings from FIG. 7A to FIG. 7D. The drawings from FIG. 7A to FIG. 7D are schematic cross-sectional views of the high-frequency module 100 according to the second embodiment at an intermediate stage of manufacture.

As shown in FIG. 7A, a processed board 91 consisting of a temporary board 80 and a wiring board 40 is produced. First, when producing an original substrate that is the source of the processed substrate 91, the wiring 46 and the second external connection terminal 62 are formed in the original substrate. The wiring 46 and the second external connection terminal 62 are constituted by a metal pattern in the wiring layer and a via in the via layer. A first external connection terminal 61 is formed on the surface of the portion of the original board that will become the temporary board 80 (first mounting surface 80A), and a land 43 is formed on the surface of the portion that will become the wiring board 40 (second mounting surface 40A). do.

A portion of the original substrate is removed from the surface opposite to the first mounting surface 80A and the second mounting surface 40A to form a relatively thin portion. This thin portion corresponds to the second portion 40R. As a result, the original board is divided into a portion that will become the temporary board 80 and a portion that will become the wiring board 40. The first component 20 is mounted on the portion of the processed board 91 that will become the temporary board 80, and the second component 30 is mounted on the portion that will become the wiring board 40.

As shown in FIG. 7B, the thinned part of the processed board 91 is curved so that the first mounting surface 80A and the second mounting surface 40A are on the inside, and the wiring board 40 is placed non-parallel to the temporary board 80. state. For example, the second mounting surface 40A is made to stand up perpendicularly to the first mounting surface 80A. At this time, the degree of curvature of the second portion 40R is adjusted so that the first external connection terminal 61 and the second external connection terminal 62 are located at the same height using the first mounting surface 80A as a height reference. .

As shown in FIG. 7C, the support member 50 is formed to cover the first mounting surface 80A, the second mounting surface 40A, the inner surface of the second portion 40R, the first component 20, and the second component 30. For example, sealing resin is used for the support member 50.

As shown in FIG. 7D, the temporary substrate 80 is polished or ground to expose the first external connection terminals 61. This exposes the first surface 50A of the support member 50. Note that a portion of the second portion 40R that is continuous with the temporary substrate 80 is also removed.

Next, the excellent effects of the second embodiment will be explained.
In the second embodiment as well, the height of the high frequency module 100 can be reduced as in the first embodiment. Further, since the temporary board 80 and the wiring board 40 (FIG. 7A) are manufactured from one original board, the process of mounting the wiring board 40 on the temporary board 80 as shown in FIG. 2A of the first embodiment can be omitted.

Next, a modification of the second embodiment will be described.
In the second embodiment, in the bent state shown in FIG. 7B, the tip of the third portion 40E of the wiring board 40 is adjusted to be at the same height as the first mounting surface 80A. The tip of 40E may extend below the first mounting surface 80A. In this case, in the polishing or grinding step shown in FIG. 7D, the tip portion of the third portion 40E may also be polished or ground to align the height of the tip of the third portion 40E with the height of the first surface 50A. . The second external connection terminal 62 may be formed at a position exposed after polishing or grinding the tip portion of the third portion 40E.

Next, another modification of the second embodiment will be described with reference to FIG. 8.
FIG. 8 is a schematic cross-sectional view of a high-frequency module 100 according to a modification of the second embodiment. In the second embodiment (FIG. 5), the inner surface of the second portion 40R is covered with the support member 50, but the outer surface of the second portion 40R and the third portion 40E are covered with the support member 50. exposed to the atmosphere. In contrast, in this modification, the surface of the third portion 40E on the second mounting surface 40A side and the outer surface of the second portion 40R are also covered with the support member 50. With this configuration, the third portion 40E can be supported more stably.

[Third example]
Next, a high frequency module according to a third embodiment will be described with reference to FIG. Hereinafter, a description of the configuration common to the high frequency module 100 (FIG. 5) according to the second embodiment will be omitted.

FIG. 9 is a schematic cross-sectional view of the high frequency module 100 according to the third embodiment. In the second embodiment (FIG. 5), a second external connection terminal 62 is arranged at the tip of the third portion 40E of the wiring board 40. In contrast, in the third embodiment, the second external connection terminal 62 is exposed on the first surface 50A of the support member 50. The second external connection terminal 62 is electrically connected to the second component 30 via a wiring 47 arranged in the second portion 40R.

Next, a method for manufacturing the high frequency module 100 according to the third embodiment will be described. In the middle of manufacturing shown in FIG. 7A of the second embodiment, the second external connection terminal 62 is formed on the first mounting surface 80A of the temporary substrate 80. Furthermore, a wiring 47 is formed to connect the land 43 formed on the second mounting surface 40A of the wiring board 40 and the second external connection terminal 62.

Next, the excellent effects of the third embodiment will be explained.
In the third embodiment, as in the second embodiment, it is possible to reduce the height of the high frequency module 100. Furthermore, in the third embodiment, since the second external connection terminal 62 is not arranged at the tip of the third portion 40E of the wiring board 40, the height of the tip of the third portion 40E is strictly equal to the height of the first surface 50A. There is no need to match. Note that the second component 30 can also be mounted on the third portion 40E.

[Fourth example]
Next, a high frequency module according to a fourth embodiment will be described with reference to FIG. Hereinafter, a description of the configuration common to the high frequency module 100 (FIG. 5) according to the second embodiment will be omitted.

FIG. 10 is a schematic cross-sectional view of a high-frequency module 100 according to a fourth embodiment. In the second embodiment (FIG. 5), when the first surface 50A is viewed from above, the first component 20 and the second component 30 do not overlap. In the fourth embodiment, the height of one first component 20 is lower than the height of the other first components 20. When the first surface 50A is viewed in plan, one first component 20 with a low height and one second component 30 overlap.

Furthermore, in the second embodiment (FIG. 5), the first component 20 and the second component 30 are interconnected, for example, via wiring arranged on a mounting board on which the high frequency module 100 is mounted. On the other hand, in the fourth embodiment, one first external connection terminal 61 and one land 43 are connected to each other via a wiring 47 arranged in the second portion 40R. The wiring 47 may be placed on the surface of the second portion 40R, or may be placed on the inner layer of the second portion 40R. The other land 43 is connected to a second external connection terminal 62 arranged on the end surface of the tip of the third portion 40E via a wiring 46 arranged on the wiring board 40.

Next, the excellent effects of the fourth embodiment will be explained.
In the fourth embodiment, as in the second embodiment, it is possible to reduce the height of the high frequency module 100. When the first surface 50A is viewed from above, the first component 20 that overlaps the second component 30 is lower in height than the other first components 20. Therefore, even if one first component 20 and one second component 30 are arranged one on top of the other, an increase in the height of the entire high frequency module 100 is suppressed. Furthermore, since the plurality of first components 20 and second components 30 can be three-dimensionally arranged with high density, it is possible to reduce the size of the high-frequency module 100.

Furthermore, in the fourth embodiment, one first component 20 and one second component 30 are connected to each other via a wiring 47 arranged in the second portion 40R. Therefore, external wiring for connecting the first component 20 and the second component 30 is not required. Further, the wiring 47 connects the first component 20 and the second component 30, which overlap each other when the first surface 50A is viewed from above. Therefore, the length of the wiring connecting the first component 20 and the second component 30 can be shortened.

[Fifth example]
Next, a high frequency module according to a fifth embodiment will be described with reference to FIG. 11. Hereinafter, a description of the configuration common to the high frequency module 100 according to the first embodiment described with reference to the drawings from FIG. 1A to FIG. 2D will be omitted.

FIG. 11 is a schematic cross-sectional view of the high frequency module 100 according to the fifth embodiment. In the first embodiment (FIG. 1A), no circuit components or the like are mounted on the outer surface of the wiring board 40 (the surface opposite to the second mounting surface 40A). In contrast, in the fifth embodiment, the first antenna element 71 is arranged on the outer surface of the wiring board 40. The first antenna element 71 may be covered with a protective film made of a dielectric material, or the first antenna element 71 may be arranged inside the wiring board 40. The first antenna element 71 is, for example, a patch antenna. In FIG. 11, the illustration of the ground conductor constituting the patch antenna is omitted. The radiation pattern of the first antenna element 71 faces in the same direction as the outer surface of the wiring board 40 . Note that a dipole antenna, a monopole antenna, or the like may be used as the first antenna element 71.

The first antenna element 71 is connected to the second component 30 via the wiring 46 in the wiring board 40. In addition, the first antenna element 71 may be connected to the second external connection terminal 62 arranged on the wiring board 40, or the first antenna element 71 may be connected to the second external connection terminal 62 arranged on the wiring board 40, or It may be connected to the first component 20 via wiring 63 (FIG. 1A).

Furthermore, in the fifth embodiment, one first component 20 and one second component 30 overlap when the first surface 50A is viewed from above, as in the fourth embodiment (FIG. 10). The height of the first component 20 overlapping the second component 30 is lower than the height of the other first components 20.

Next, the excellent effects of the fifth embodiment will be explained.
In the fifth embodiment, as in the first embodiment, it is possible to reduce the height of the high frequency module 100. Furthermore, the radiation pattern can be directed in a direction parallel (lateral direction) to the mounting surface of the mounting board on which the high frequency module 100 is mounted. Furthermore, similarly to the fourth embodiment (FIG. 10), it is possible to three-dimensionally mount the first component 20 and the second component 30 with high density.

[Sixth Example]
Next, a high frequency module according to a sixth embodiment will be described with reference to FIGS. 12 and 13. Hereinafter, a description of the configuration common to the high frequency module 100 according to the fifth embodiment (FIG. 11) will be omitted.

FIG. 12 is a schematic cross-sectional view of a high-frequency module 100 according to a sixth embodiment. In the fifth embodiment (FIG. 11), there is no mention of the thermal conductivity of the second component 30 that overlaps the first component 20 when the first surface 50A is viewed from above. In the sixth embodiment, the thermal conductivity of the constituent material of the second component 30 that overlaps the first component 20 is higher than the thermal conductivity of the support member 50.

For example, as the second component 30 made of a material with higher thermal conductivity than the support member 50 made of resin, a ceramic capacitor using ceramic as a dielectric material, a chip inductor made of a laminated ceramic material and a coil conductor, etc. may be used. Can be mentioned. Other examples include silicon-based circuit components, such as circuit components in which a DC/DC converter is formed. The first component 20 overlapping the second component 30 is, for example, a radio frequency integrated circuit (RFIC).

FIG. 13 is an equivalent circuit diagram of a part of the high frequency module 100 according to the sixth embodiment. The plurality of second components 30 include a DC/DC converter 30DC, a ceramic capacitor 30C, and a chip inductor 30L. It is preferable to adjust the positional relationship of these components so that at least one of the DC/DC converter 30DC, the ceramic capacitor 30C, and the chip inductor 30L overlaps the high frequency integrated circuit 20RF.

A voltage output terminal of the DC/DC converter 30DC is connected to a power supply terminal of the high frequency integrated circuit 20RF via a chip inductor 30L. A power terminal of the high frequency integrated circuit 20RF is grounded via a ceramic capacitor 30C. DC power is supplied from the DC/DC converter 30DC to the high frequency integrated circuit 20RF. Chip inductor 30L and ceramic capacitor 30C constitute a noise filter that removes switching noise output from DC/DC converter 30DC.

Next, the excellent effects of the sixth embodiment will be explained.
The sixth embodiment also provides excellent effects similar to those of the fifth embodiment. That is, it is possible to reduce the height of the high frequency module 100, it is possible to direct the radiation pattern in a direction parallel to the mounting surface of the mounting board on which the high frequency module 100 is mounted, and the first component 20 It is also possible to mount the second component 30 three-dimensionally and with high density.

Furthermore, in the sixth embodiment, since the thermal conductivity of the second component 30 overlapping with the first component 20 is higher than that of the support member 50, the second component 30 functions as a heat transfer path. For example, heat generated in the first component 20 overlapping the second component 30 passes through the second component 30 and is conducted to the top surface 50B of the support member 50 on the opposite side from the first surface 50A. Therefore, heat dissipation from the first component 20, for example, the high frequency integrated circuit 20RF, can be improved.

Next, a modification of the sixth embodiment will be described. In the sixth embodiment, the second component 30 that overlaps the first component 20 is an electric circuit component. As the second component 30, a heat conductive member may be used instead of the electric circuit component. For example, as the second component 30, a metal member, a heat dissipating resin member, etc. may be used. In the sixth embodiment, the support member 50 is filled between the first component 20 and the second component 30, but the first component 20 and the second component 30 may be brought into contact with each other.

[Seventh Example]
Next, a high frequency module according to a seventh embodiment will be described with reference to FIG. Hereinafter, a description of the configuration common to the high frequency module 100 according to the fifth embodiment (FIG. 11) will be omitted.

FIG. 14 is a schematic cross-sectional view of the high frequency module 100 according to the seventh embodiment. The seventh embodiment includes a second antenna element 72 in addition to the first antenna element 71 arranged on the wiring board 40. The second antenna element 72 is provided on the multilayer wiring layer 48 disposed on the top surface 50B of the support member 50. Although the second antenna element 72 is depicted as being exposed on the surface of the multilayer wiring layer 48 in FIG. 14, the second antenna element 72 may be covered with a protective film made of a dielectric material, or the second antenna element 72 may be The antenna element 72 may be placed inside the multilayer wiring layer 48. The second antenna element 72 is, for example, a patch antenna. In FIG. 14, the description of the ground conductor of the patch antenna is omitted. The radiation pattern of the second antenna element 72 faces in the same direction as the top surface 50B of the support member 50. Note that a dipole antenna, a monopole antenna, or the like may be used as the second antenna element 72.

The second antenna element 72 is connected to the second external connection terminal 62 via the wiring 49 in the multilayer wiring layer 48 and the wiring 46 in the wiring board 40. Note that the second antenna element 72 may be connected to the second component 30.

Next, the excellent effects of the seventh embodiment will be explained.
In the seventh embodiment, the radiation pattern can be directed in the direction in which the outer surface of the wiring board 40 faces (lateral direction) and in the direction in which the top surface 50B of the support member 50 faces (in the upward direction). Therefore, an excellent effect of improving antenna coverage can be obtained.

Next, a high frequency module according to a modification of the seventh embodiment will be described with reference to FIG. 15. FIG. 15 is a schematic cross-sectional view of a high frequency module 100 according to a modification of the seventh embodiment. In the seventh embodiment (FIG. 14), the second antenna element 72 is connected to the second external connection terminal 62 via the wiring 49 in the multilayer wiring layer 48 and the wiring 46 in the wiring board 40. In contrast, in this modification, the second antenna element 72 is connected to the conductor column 25 embedded in the support member 50 via the wiring 49 in the multilayer wiring layer 48.

The conductor column 25 is connected to the first external connection terminal 61 by the first solder member 22 and is fixed. That is, the second antenna element 72 is electrically connected to the first external connection terminal 61 via the wiring 49 in the multilayer wiring layer 48, the conductor column 25, and the first solder member 22. As in this modification, the second antenna element 72 may be electrically connected to the first external connection terminal 61 without using the wiring board 40. The multilayer wiring layer 48 can be formed by, for example, a laser direct structuring (LDS) method.

[Eighth Example]
Next, a high frequency module according to an eighth embodiment will be described with reference to the drawings from FIG. 16 to FIG. 18D. Hereinafter, a description of the components common to the high frequency module 100 according to the first embodiment described with reference to the drawings from FIG. 1A to FIG. 2D will be omitted.

FIG. 16 is a schematic cross-sectional view of a high-frequency module according to the eighth embodiment. In the first embodiment (FIG. 1A), the second external connection terminal 62 is connected to the second internal terminal 41 of the wiring board 40 via the second solder member 42. In contrast, in the eighth embodiment, the second external connection terminal 62 is arranged on the end surface of the wiring board 40 facing in the same direction as the first surface 50A. Further, the second external connection terminal 62 is arranged on a virtual plane that is an extension of the first surface 50A.

Furthermore, in the first embodiment, the land 43 is arranged in a convex shape on the second mounting surface 40A of the wiring board 40. On the other hand, in the eighth embodiment, the land 43 is buried to a depth deeper than the second mounting surface 40A, and its surface is exposed to the second mounting surface 40A. The second external connection terminal 62 is connected to the land 43 via the wiring 46 in the wiring board 40 without using a solder member.

FIG. 17 is a perspective view of a temporary board 80 and a wiring board 40 used in manufacturing the high frequency module 100 according to the eighth embodiment. One end surface of the temporary board 80 and one end surface 40B of the wiring board 40 are connected by a curved second portion 80R. In the second embodiment (FIG. 6), the second portion 40R is provided only in a partial range of the first portion 40F with respect to the direction of the generatrix GL of the second portion 40R. In contrast, in the eighth embodiment, the second portion 80R is provided over the entire area of the wiring board 40 in the direction of the bus line GL of the second portion 80R.

The second portion 80R is smoothly connected to the second mounting surface 40A of the wiring board 40. On the temporary substrate 80 side, a step is provided between the second portion 80R and the first mounting surface 80A. An end surface 40B of the wiring board 40 connected to the second portion 80R is located on a virtual plane in which the first mounting surface 80A of the temporary board 80 extends toward the wiring board 40.

Next, a method for manufacturing the high frequency module 100 according to the eighth embodiment will be described with reference to the drawings from FIG. 18A to FIG. 18D. The drawings from FIG. 18A to FIG. 18D are cross-sectional views of the high-frequency module 100 according to the eighth embodiment at an intermediate stage of manufacture.

As shown in FIG. 18A, a processed substrate 91 consisting of the temporary substrate 80, the second portion 80R, and the wiring board 40 is formed by processing one original substrate. At this stage, the second portion 80R is not curved. When producing the original board, the wiring 46, the land 43, and the second external connection terminal 62 are built into the wiring board 40. Furthermore, a first external connection terminal 61 is formed on the first mounting surface 80A of the portion that will become the temporary substrate 80. When the original board is processed, the lands 43 are exposed on the second mounting surface 40A of the wiring board 40, and the second external connection terminals 62 are exposed on the end surface of the wiring board 40. The first component 20 is mounted on the temporary board 80, and the second component 30 is mounted on the wiring board 40.

As shown in FIG. 18B, the second portion 80R is curved so that the first mounting surface 80A of the temporary board 80 and the second mounting surface 40A of the wiring board 40 are on the inside. The degree of curvature is adjusted so that the virtual plane extending from the second mounting surface 40A and the virtual plane extending from the first mounting surface 80A intersect at a substantially right angle. Further, when the first mounting surface 80A of the temporary board 80 is used as a height reference, the first external connection terminal 61 and the second external connection terminal 62 are arranged at approximately the same position in the height direction. Adjust the shape of the curve.

As shown in FIG. 18C, the first mounting surface 80A, the second mounting surface 40A, the inner surface of the second portion 80R, the first component 20, and the second component 30 are covered with the support member 50.

As shown in FIG. 18D, the temporary substrate 80 is polished or ground until the first external connection terminal 61 is exposed. This exposes the first surface 50A of the support member 50. Furthermore, the second portion 80R and the support member 50 covering the inner surface of the second portion 80R are also removed.

Next, the excellent effects of the eighth embodiment will be explained.
In the eighth embodiment as well, it is possible to reduce the height of the high frequency module 100 as in the first embodiment described with reference to the drawings from FIG. 1A to FIG. 2D. Furthermore, in the eighth embodiment, since almost the entire second mounting surface 40A of the wiring board 40 is in close contact with the support member 50, the wiring board 40 is more stable than in the second embodiment (FIG. 5). can be supported.

Next, a modification of the eighth embodiment will be described.
In the eighth embodiment (FIG. 18A), a step is formed between the surface of the temporary substrate 80 opposite to the first mounting surface 80A and the second portion 80R, but this step may not be formed. good. For example, the surface of the temporary substrate 80 opposite to the first mounting surface 80A and the second portion 80R may be smoothly connected.

It goes without saying that each of the above-mentioned embodiments is merely an illustration, and that the configurations shown in the different embodiments can be partially replaced or combined. Similar effects due to similar configurations in a plurality of embodiments will not be mentioned for each embodiment. Furthermore, the invention is not limited to the embodiments described above. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

20 First component 20RF High frequency integrated circuit 21 First internal terminal 22 First solder member 25 Conductor column 30 Second component 30C Ceramic capacitor 30DC DC/DC converter 30L Chip inductor 31 Internal terminal 32 Solder member 40 Wiring board 40A Second mounting surface 40B End surface 40E Third portion 40F First portion 40R Second portion 41 Second internal terminal 42 Second solder member 43 Land 44 Third internal terminal 45

Third solder member

46, 47 Wiring 48 Multilayer wiring layer 49 Wiring 50 Support member

50A First surface

50B Top surface 50R Curved surface 61 First external connection terminal 62 Second external connection terminal 63 Wiring 71 First antenna element 72 Second antenna element 80 Temporary board 80A First mounting surface 80R Second part 90 Intermediate product 91 Processed board 95 Mounting board 96 Land 97 Solder member 100 High frequency module

Claims

a first part;
a support member having a first surface and covering the first component;
a wiring board arranged non-parallel to the first surface,
at least a portion of one surface of the wiring board is covered with the support member;
moreover,
a second component mounted on the side of the wiring board covered by the support member and covered by the support member;
a first external connection terminal exposed on the first surface and connected to the first component;
and a second external connection terminal exposed on the first surface or placed on a virtual plane extending from the first surface and electrically connected to the second component.
the first component has a first internal terminal;
The high frequency module according to claim 1, further comprising a first solder member connecting the first internal terminal and the first external connection terminal.
the second external connection terminal is exposed on the first surface;
The high frequency module according to claim 1 or 2, further comprising wiring exposed on the first surface and connecting the first external connection terminal and the second external connection terminal.
The wiring board has a second internal terminal disposed on a surface covered with the support member,
The high frequency module according to claim 1 or 2, further comprising a second solder member connecting the second internal terminal and the second external connection terminal.
The wiring board is
an end face facing in the same direction as the first face;
and a third internal terminal provided on the end surface,
The high frequency module according to claim 1 or 2, further comprising a third solder member that connects the third internal terminal and the second external connection terminal.
The support member includes a curved surface that connects a surface that is in close contact with the wiring board and the first surface,
The wiring board includes a first portion on which the second component is mounted, a second portion that is connected to an end surface of the first portion and is in close contact with the curved surface of the support member, and a portion from the first portion to the second portion. The high frequency module according to claim 1 or 2, comprising a third portion extending in a direction different from the direction in which the portion extends.
The wiring board includes wiring arranged in the second portion,
The high frequency device according to claim 6, wherein the second external connection terminal is exposed on the first surface and electrically connected to the second component via the wiring arranged in the second part. module.
The wiring board includes wiring arranged in the second portion,
The high frequency module according to claim 6, wherein the first external connection terminal is connected to the second component via the wiring arranged in the second portion.
The high frequency module according to claim 6, wherein a part of the support member is arranged between the second part and the third part.
The high frequency module according to claim 1 or 2, wherein one of the first parts and one of the second parts are arranged to overlap when the first surface is viewed from above.
The high frequency module according to claim 10, wherein the thermal conductivity of the constituent material of the second component is higher than the thermal conductivity of the support member.
The high frequency module according to claim 1 or 2, further comprising a first antenna element arranged on the wiring board.
The high frequency module according to claim 12, further comprising a second antenna element disposed on a top surface of the support member opposite to the first surface.
A temporary board having a plurality of lands on a first mounting surface; a wiring board connected to the temporary board and having a plurality of internal terminals on a second mounting surface non-parallel to the first mounting surface; producing an intermediate product including a first component connected to one of the lands and mounted on the temporary board; a second component connected to at least one of the internal terminals and mounted on the wiring board;
After producing the intermediate product, covering the first mounting surface, the second mounting surface, the first component, and the second component with a support member,
A method for manufacturing a high frequency module, comprising polishing or grinding the temporary substrate after covering it with the support member until at least the lands are exposed.
The step of producing the intermediate product includes:
mounting the first component on the first mounting surface of the temporary substrate;
mounting the second component on the second mounting surface of the wiring board;
connecting and fixing the wiring board to at least one land of the temporary board with the second mounting surface being non-parallel to the first mounting surface;
15. The method of manufacturing a high frequency module according to claim 14, comprising the step of covering the first mounting surface, the second mounting surface, the first component, and the second component with the support member.
The step of producing the intermediate product includes:
forming a plurality of the lands and a plurality of the internal terminals on one original board that will become the temporary board and the wiring board;
removing a portion of the original board to make it thinner, and producing a processed board divided into the temporary board and the wiring board;
Connecting and mounting the first component to the land, connecting and mounting the second component to the internal terminal,
curving a thin portion of the processed board so that the first mounting surface and the second mounting surface are non-parallel;
The first mounting surface, the second mounting surface, the inner surface of the thin part, the first component, and the second component are mounted in a state where the first mounting surface and the second mounting surface are non-parallel. forming the supporting member to cover;
15. The method for manufacturing a high frequency module according to claim 14, further comprising the step of polishing or grinding the temporary substrate after forming the support member.