WO2023189017A1 - Temperature adjustment unit and bonding member - Google Patents

Temperature adjustment unit and bonding member Download PDF

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Publication number
WO2023189017A1
WO2023189017A1 PCT/JP2023/006181 JP2023006181W WO2023189017A1 WO 2023189017 A1 WO2023189017 A1 WO 2023189017A1 JP 2023006181 W JP2023006181 W JP 2023006181W WO 2023189017 A1 WO2023189017 A1 WO 2023189017A1
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WO
WIPO (PCT)
Prior art keywords
base material
rod
shaped member
joining member
temperature control
Prior art date
Application number
PCT/JP2023/006181
Other languages
French (fr)
Japanese (ja)
Inventor
英輝 森内
Original Assignee
株式会社巴川製紙所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社巴川製紙所 filed Critical 株式会社巴川製紙所
Publication of WO2023189017A1 publication Critical patent/WO2023189017A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

Definitions

  • the present invention relates to a temperature control unit and a joining member.
  • temperature control units have been used in electrical equipment, electronic equipment, semiconductor equipment, etc. to protect circuits etc. that are susceptible to heat generation. More specifically, as the amount of power used by electrical equipment increases, the amount of heat generated also increases, so the temperature inside the electrical equipment has been adjusted by cooling the generated heat with a temperature control unit.
  • a temperature control unit one is known that is formed by attaching a plurality of rod-like members to a flat base material so as to extend in parallel at intervals.
  • Patent Documents 1 and 2 are known as joining members used when attaching a plurality of rod-shaped members to a base material.
  • Japanese Patent Publication No. 10-106722 JPH10-106722A discloses a technique for bonding a porous body and other materials using a paste-like bonding silver conductor.
  • Japanese Patent Publication No. 2003-240473 JP2003-240473A discloses a heat exchanger that satisfactorily joins a metal porous member and a metal flat plate to significantly increase heat exchange efficiency. has been done.
  • Conventional bonding members were generally composed of a molten metal body formed by melting and fixing metal particles.
  • the heat transfer part when the heat transfer part is attached to the base material using such a joining member, when the base material expands or contracts due to heat, the joining member may follow the expansion or contraction of the base material. Otherwise, there was a risk of warping, peeling, cracking, etc.
  • the present invention has been made with these points in mind, and it is possible for the joining member to follow the expansion and contraction of the base material, and also to maintain sufficient strength and heat between the base material and the heat transfer part. It is an object of the present invention to provide a temperature control unit and a joining member that can obtain conductivity.
  • the temperature control unit of the present invention includes: a heat transfer part; base material and a joining member for attaching the heat transfer part to the base material; Equipped with The joining member is composed of a plurality of metal particles having a primary particle size of less than 100 nm and a metal melt, It is characterized in that the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.5 to 0.9.
  • the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member may be within the range of 0.55 to 0.85.
  • the ratio of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material is 0.25 or more, Good too.
  • the material of the joining member may include silver or a silver alloy.
  • the heat transfer section may have a rod-like member or a plate-like member including a metal fiber structure.
  • the base material may include metal, glass, or ceramic.
  • the joining member of the present invention is A joining member for attaching a heat transfer part to a base material, Consisting of a plurality of metal particles with a primary particle size of less than 100 nm and a metal melt, It is characterized in that the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.5 to 0.9.
  • the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member may be within the range of 0.55 to 0.85.
  • FIG. 1 is a front view showing the configuration of a temperature control unit according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA of the temperature control unit shown in FIG. 1.
  • FIG. FIG. 2 is a schematic configuration diagram showing a first example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1.
  • FIG. FIG. 2 is a schematic configuration diagram showing a second example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1.
  • FIG. 2 is a schematic configuration diagram showing a third example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1.
  • FIG. It is a schematic block diagram which shows the 4th example of the joint part of the rod-shaped member (heat transfer part) and base material in the temperature control unit shown in FIG. 2 is a schematic configuration diagram schematically showing the configuration of a rod-shaped member (heat transfer section) and a connecting member in the temperature control unit shown in FIG. 1.
  • FIG. 2 is a configuration diagram showing the configuration of a first side wall member in the temperature control unit shown in FIG. 1.
  • FIG. FIG. 2 is an enlarged view showing a joining member and a base material according to an embodiment of the present invention.
  • FIG. 3 is a diagram showing metal particles constituting a joining member according to an embodiment of the present invention.
  • FIG. 2 is an enlarged view showing a joining member and a base material mainly made of molten metal.
  • FIG. 1 to 10 are diagrams showing a temperature control unit and a joining member according to an embodiment of the present invention.
  • FIG. 1 is a front view showing the configuration of the temperature control unit according to the present embodiment
  • FIG. 2 is a sectional view taken along the line AA of the temperature control unit shown in FIG.
  • FIGS. 3 to 6 are schematic configuration diagrams showing first to fourth examples of joint locations between the rod-shaped member (heat transfer portion) and the base material in the temperature control unit shown in FIG. 1, respectively.
  • FIG. 7 is a configuration diagram showing the configuration of a rod-shaped member (heat transfer part) and a connecting member in the temperature control unit shown in FIG. 1, and FIG.
  • FIG. 8 is a configuration diagram showing the structure of the first side wall member in the temperature control unit shown in FIG. It is a block diagram which shows a structure. Further, FIG. 9 is an enlarged view showing the joining member and the base material according to the present embodiment, and FIG. 10 is a diagram showing metal particles constituting the joining member according to the present embodiment. Note that FIG. 11 is an enlarged view showing a joining member and a base material mainly made of molten metal.
  • the temperature control unit 10 includes a pair of flat base members 20, a pair of flat first side wall members 22, and a pair of flat second side wall members 22. It has a substantially rectangular parallelepiped shape with side wall members 24, and the fluid flows into the internal region 16 formed between the pair of base members 20, the pair of first side wall members 22, and the pair of second side wall members 24.
  • FIG. 8 is a configuration diagram showing the configuration of the first side wall member 22.
  • one of the pair of base materials 20 is formed with a fluid inlet section 12 and a fluid outlet section 14, respectively, and this base material 20 has a fluid inlet section 12 and a fluid outlet section 14 formed therein.
  • An opening 20p through which the fluid passes and an opening 20q through which the fluid sent from the internal region 16 to the fluid outlet section 14 passes are formed. Further, between the pair of base materials 20, a plurality of rod-shaped members 40 are arranged as heat transfer portions so as to extend in parallel to each other. Each rod-shaped member 40 has a cylindrical shape, and is arranged so as to be located at the intersection of the grids in the cross section of the temperature control unit 10 shown in FIG.
  • the fluid that enters the internal area 16 of the temperature control unit 10 from the fluid inlet 12 through the opening 20p flows in the internal area 16 in the right direction in FIGS. 1 and 2, and is sent to the fluid outlet 14 through the opening 20q. It looks like this.
  • the fluid flowing inside the internal region 16 includes, for example, water, air, antifreeze, organic solvents, fluorinated solvents (eg, Fluorinert, Freon), and the like.
  • Each base material 20 includes, for example, metal, glass, or ceramic.
  • metals include stainless steel, copper, nickel, aluminum, and alloys containing at least one of these.
  • the glass include quartz glass, soda glass, and glass containing any metal oxide.
  • the ceramic include alumina, magnesia, zirconia, aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (SiN), and porous ceramics thereof.
  • the temperature control unit 10 of the present embodiment includes a plurality of rod-shaped members 40 that extend parallel to each other at intervals, and a connecting member 20m (see FIGS. 3 to 6) that connects each of the rod-shaped members 40. It is formed by combining ladder-shaped structures.
  • FIG. 7 is a schematic configuration diagram schematically showing a ladder-shaped structure composed of a plurality of rod-like members 40 and a connecting member 20m that connects each rod-like member 40. As shown in FIG.
  • Each base material 20 is a combination of connection members 20m in a plurality of ladder-shaped structures.
  • Each rod-shaped member 40 includes a metal fiber structure formed from metal fibers such as copper fibers.
  • Metal-coated fibers may be used as such metal fibers.
  • the metal fiber structure may be formed into a nonwoven fabric, woven fabric, mesh, or the like using a wet or dry manufacturing method, and then processed into a metal fiber structure.
  • a metal fiber structure in which metal fibers are integrated and then bound is used as the metal fiber structure.
  • the term "metal fibers bound together" means that the metal fibers are physically fixed to each other to form a bound portion.
  • the metal fibers may be directly fixed to each other at a binding part, or some of the metal fibers may be indirectly fixed to each other via a component other than the metal component. .
  • the metal fiber structure is formed from metal fibers, voids exist inside the metal fiber structure. This allows the fluid flowing through the internal region 16 to pass through the inside of the metal fiber structure of the rod-shaped member 40, making it easier to improve heat exchange performance with the fluid. Moreover, in the metal fiber structure, when the metal fibers are bound together, voids are more likely to be formed between the metal fibers constituting the metal fiber structure. Such voids may be formed, for example, by intertwining metal fibers. Further, in the metal fiber structure, it is preferable that the metal fibers are sintered at the binding portion. By sintering the metal fibers, the thermal conductivity and homogeneity of the metal fiber structure become more stable.
  • FIG. 2 shows the rod-shaped member 40 having a circular cross section
  • the cross-section of the rod-shaped member 40 in this embodiment is not limited to a circular shape.
  • the cross-sectional shape of the rod-shaped member 40 may be a trapezoid, a triangle, a semicircle, or a mountain.
  • the plurality of comb-shaped structures are arranged so that the flow path meander along the direction in which the fluid flows. You can.
  • the fluid flows in a meandering manner along the flow path, so as the heat exchange area of the fluid flowing through the flow path increases, the pressure loss becomes moderately large, and the residence time of the fluid within the flow path increases. Since the length can be increased, the heat transfer effect can be enhanced.
  • a plate-like or rod-like member having no voids may be used as the heat transfer part.
  • the material for such a plate-like or rod-like heat transfer portion having no voids include metals, and specific examples thereof include stainless steel, copper, nickel, aluminum, and alloys containing at least one of these.
  • FIGS. 3 to 6 There are various methods for attaching the rod-shaped member 40 to the connecting member 20m using the joining member 30, as shown in FIGS. 3 to 6.
  • a joining member 30 may be attached to the upper surface of the connecting member 20m, and a rod-shaped member 40 may be attached to the upper surface of this joining member 30.
  • a recess may be formed in the connecting member 20m, the joining member 30 may be accommodated in the recess, and the rod-shaped member 40 may be attached to the upper surface of the joining member 30 accommodated in the recess.
  • a recess may be formed in the connecting member 20m, the joining member 30 may be accommodated in the recess, and the rod-shaped member 40 may be embedded in the joining member 30 accommodated in the recess.
  • the rod-shaped member 40 is arranged on the surface of the connecting member 20m, and the joining member 30 is arranged on the rod-shaped member 40 near the contact point between the connecting member 20m and the rod-shaped member 40. 40 may be joined to the connecting member 20m.
  • the joining member 30 has a paste containing nanosilver particles. More specifically, as shown in FIG. 9, the bonding member 30 includes a plurality of silver particles 30b having a primary particle diameter of less than 100 nm, and a metal melt formed by the silver particles 30b melting and sticking together. 30a.
  • c ie, the value of b/(a+b)
  • a ratio c is a predetermined distance (for example, 1 ⁇ m) from the surface 20a of the base material 20 in the cross section near the location where the rod-shaped member 40 is attached to the base material 20 (specifically, the connecting member 20m). ) (indicated by reference numeral 20a' in FIG.
  • the bonding member 30 is a mixture of the metal melt 30a and the silver particles 30b, the inclusion of the silver particles 30b in the bonding member 30 causes the base material 20 to be heated by the heater attached to the base material 20. Even when the base material 20 expands, the bonding member 30 can follow the expansion of the base material 20, thereby suppressing the occurrence of warping, peeling, cracking, etc. in the bonding member 30. Further, by including the metal melt 30a in the joining member 30, the rod-shaped member 40 can be firmly joined to the base material 20, and sufficient heat transfer from the base material 20 to the rod-shaped member 40 can be obtained.
  • the base material 20 expands due to the heat generated by the heater attached to the base material 20 due to too few silver particles 30b contained in the bonding member 30.
  • the bonding member 30 may not be able to follow the expansion of the base material 20, and warping, peeling, cracking, etc. may occur.
  • the ratio c in the joining member 30 is larger than 0.9, the rod-shaped member 40 cannot be firmly joined to the base material 20 because the molten metal 30a contained in the joining member 30 is too small.
  • the ratio c in the bonding member 30 is within the range of 0.5 to 0.9, these problems are suppressed.
  • the ratio d of the length of the portion where the joining member 30 is attached to the base material 20 to the length of the surface 20a of the base material 20 is 0.25 or more. , preferably 0.5 or more. In the joining member 30 as shown in FIG. 9, the ratio d is approximately 0.7. On the other hand, as shown in FIG. 11, the bonding member 30 may not adhere to the surface of the base material 20 very much, and the ratio d may be smaller than 0.25. More specifically, in FIG. 11, the base material 20 is composed of a metal plate 20c and a thermally sprayed layer 20b in which plating or the like is thermally sprayed on the surface of the metal plate 20c.
  • the length ratio of the portion where the joining member 30 is attached to the sprayed layer 20b is smaller than 0.25.
  • the bonding member 30 is likely to peel off from the base material 20, and therefore, for example, when the base material 20 expands and contracts, the bonding member 30 peels off from the base material 20 and the rod-shaped member 40 is spaced apart from the base material 20, there is a possibility that thermal conductivity will be significantly reduced.
  • a method of joining the rod-shaped member 40 to the connecting member 20m using the joining member 30 having such a configuration will be described.
  • a silver nanopaste is applied between the connecting member 20m and the rod-shaped member 40, and then a temperature difference is applied between the connecting member 20m and the rod-shaped member 40, and the silver nanopaste is applied between the connecting member 20m and the rod-shaped member 40.
  • Some of the silver particles contained in the paste are sintered.
  • the connecting member 20m is cooled by a Peltier element, a ceramic heater is brought into contact with the rod-shaped member 40, and the silver is heated by heat conduction through the rod-shaped member 40. Sinter some of the particles.
  • Thermal gradient conditions vary depending on the particle size of the silver particles and the melting point of the material, but when using silver particles with an average particle size (hydrodynamic particle size) of 10 nm using the dynamic light scattering method, for example, a rod-shaped
  • the temperature at the tip of the member 40 is 250 to 300°C
  • the temperature at the joint between the connecting member 20m and the rod-shaped member 40 is adjusted to 150 to 200°C, and by heating in a nitrogen atmosphere for 30 to 120 minutes.
  • a nanoparticle structure can be obtained by sintering the nanoparticles at this junction.
  • the joining member 30 has a plurality of metal particles (specifically, silver particles) having a primary particle size smaller than 100 nm. 30b) and a molten metal 30a, and the ratio of the area occupied by the metal particles to the ratio occupied by the bonding member 30 is within the range of 0.5 to 0.9, so that the expansion of the base material 20
  • the joining member 30 can follow the shrinkage and contraction, and sufficient strength retention and thermal conductivity can be obtained between the base material 20 and the heat transfer portion (specifically, the rod-shaped member 40).
  • the ratio of the area occupied by the metal particles (specifically, the silver particles 30b) to the ratio occupied by the bonding member 30 is preferably within the range of 0.55 to 0.85.
  • the joining member 30 can further follow the expansion and contraction of the base material 20, and sufficient strength retention and thermal conductivity can be obtained between the base material 20 and the heat transfer section.
  • the length of the surface of the base material 20 is It is preferable that the ratio of the length of the part where the joining member 30 is attached to the base material 20 to the length is 0.25 or more. In this case, even if the base material 20 expands or contracts, it is possible to prevent the bonding member 30 from peeling off from the base material 20, so that there is sufficient space between the base material 20 and the heat transfer section. It is possible to obtain good strength retention and thermal conductivity.
  • the material of the joining member 30 contains silver.
  • the material of the joining member 30 is not limited to silver.
  • a silver alloy may be used as another material for the joining member 30.
  • other materials for the joining member 30 may include copper, nickel, and the like.
  • the heat transfer section (specifically, the rod-shaped member 40) includes a metal fiber structure.
  • the fluid flowing inside the temperature control unit 10 can pass through the inside of the metal fiber structure of the heat transfer section. This makes it easier to improve heat exchange performance with the fluid.
  • a plate-like member may be used as the heat transfer portion.
  • the base material 20 includes metal, glass, or ceramic.
  • the joining member 30 having the above-mentioned configuration can follow the expansion of the base material 20, so that the joining can be performed. It is possible to suppress the occurrence of warping, peeling, cracking, etc. in the member 30.
  • temperature control unit according to this embodiment is not limited to the above-described embodiment. Various other examples of the temperature control unit according to this embodiment will be described below.
  • the above ratio c is within a predetermined distance (for example, 1 ⁇ m) from the surface 20a of the base material 20 in the cross section near the location where the rod-shaped member 40 is attached to the base material 20 (reference numeral 20a' in FIG. 9). It is not limited to calculation based on the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b in the area within the range (displayed). As another example, the ratio c may be calculated based on the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b in the entire area of the cross section of the joining member 30.
  • a temperature control unit having a shape as shown in FIGS. 1 and 2 was created.
  • a joining member was attached to the upper surface of the connecting member, and a rod-shaped member was attached to the upper surface of this joining member.
  • a temperature control unit was manufactured by combining a comb-shaped structure composed of a plurality of rod-shaped members extending parallel to each other at intervals and one connecting member connecting the rod-shaped members.
  • the area of the base material to which the rod-shaped member was attached was 100 cm 2 .
  • each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%.
  • silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 79%.
  • the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 89%.
  • a temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 50%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the second embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 80%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 31%.
  • a temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the third embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 51%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 92%.
  • a temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the fourth embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 53%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 29%.
  • a temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the first comparative example the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 47%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 90%.
  • ⁇ Second comparative example> A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the second comparative example the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 46%. Further, in the cross section of the part where the rod-shaped member is attached to the base material, the ratio d of the length of the part where the joining member is attached to the base material to the length of the surface of the base material was 21%.
  • ⁇ Third comparative example> A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter all the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the third comparative example the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 0%. That is, the silver particles were completely sintered into a metal melt. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 62%.
  • ⁇ Fourth comparative example> A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste.
  • the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes.
  • the temperature control unit according to the fourth comparative example the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 ⁇ m from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material.
  • the ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 98%. That is, the silver particles were hardly melted and occupied most of the bonding member. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 52%.
  • the heat transfer coefficients before and after the thermal shock test were calculated for the temperature control units according to the first to fourth examples and the temperature control units according to the first to fourth comparative examples, and changes in the heat transfer coefficients were determined.
  • the method for calculating the heat transfer coefficient is to pass ethylene glycol as a refrigerant at a temperature of 25°C through the evaluation unit, apply 100W of heat input from the heater, and connect the liquid inlet (IN side) and exhaust of the evaluation unit. The fluid temperature near the outlet (OUT side) and the contact temperature between the heater and the evaluation unit were measured, and the heat transfer coefficient and thermal resistance were calculated.
  • heat input W heat transfer coefficient h ⁇ transfer area S ⁇ (surface temperature Ts - fluid average temperature Tw) I asked for it.
  • the thermal conductivity was calculated before and after the thermal shock test.
  • the evaluation unit is placed in a highly accelerated thermal shock device made by Espec, and the bonded members are subjected to thermal shock by continuously applying temperature changes from -40°C to 120°C and from 120°C to -40°C. Ta.
  • the temperature return time to -40°C and 120°C was 10 minutes, the holding time at each temperature was 30 seconds, and the number of cycles was 1,000 times.
  • the difference between the thermal conductivity measured before the thermal conductivity and the thermal conductivity measured after the thermal shock test is calculated as follows: Very good when the rate of change, which is the value divided by thermal conductivity, is 5% or less, good when it is greater than 5% and less than 20%, and poor when it is greater than 20%. bad). The smaller this rate of change is, the less there is a change in thermal conductivity before and after the thermal shock test, and the more the bond between the base material and the rod-shaped member is It can be said that no problems have occurred.
  • the temperature control units according to Examples 1 to 4 can be used for a long period of time because there is not much change in thermal conductivity before and after the thermal shock test, and the strength of the bonded members is sufficient. It is considered that no major problem will occur in the bonding between the base material and the rod-shaped member even if the base material and the rod-shaped member are bonded to each other.
  • the thermal conductivity changes significantly before and after the thermal shock test, and the strength of the joint member is not sufficient, so if used for a long period of time, the base material and the rod-shaped member It is thought that there is a possibility that the bond between the two parts may not be sufficient.

Abstract

A temperature adjustment unit (10) is provided with a heat transfer portion (for example, a bar-like member (40)), a base material (20), and a bonding member (30) for attaching the heat transfer portion to the base material. The bonding member (30) is composed of a plurality of metal particles (for example, silver particles (30b)) having a primary particle size of less than 100 nm, and a metal melt (30a), wherein the proportion of the area occupied by the metal particles to the proportion occupied by the bonding member (30) is in the range of 0.5-0.9.

Description

温調ユニットおよび接合部材Temperature control unit and joining parts
 本発明は、温調ユニットおよび接合部材に関する。 The present invention relates to a temperature control unit and a joining member.
 従来から、電気機器、電子機器および半導体機器等において、発熱に弱い回路等を保護するために温調ユニットが用いられている。より詳細には、電気機器等が使用する電力量が多くなると発熱量も多くなるため、発生した熱を温調ユニットによって冷却することにより電気機器等の内部の温度を調整していた。温調ユニットの一例として、平板状の基材に複数の棒状部材を互いに間隔を空けて平行に延びるよう取り付けることによって形成されるものが知られている。 Conventionally, temperature control units have been used in electrical equipment, electronic equipment, semiconductor equipment, etc. to protect circuits etc. that are susceptible to heat generation. More specifically, as the amount of power used by electrical equipment increases, the amount of heat generated also increases, so the temperature inside the electrical equipment has been adjusted by cooling the generated heat with a temperature control unit. As an example of a temperature control unit, one is known that is formed by attaching a plurality of rod-like members to a flat base material so as to extend in parallel at intervals.
 複数の棒状部材を基材に取り付ける際に用いられる接合部材として例えば特許文献1、2等に開示されるものが知られている。日本国特許公開公報の特開平10-106722号公報(JPH10-106722A)には、多孔質体と他の材料をペースト状の接合用銀導体で接合する技術が開示されている。また、日本国特許公開公報の特開2003-240473号公報(JP2003-240473A)には、金属多孔質部材と金属平板とを良好に接合し、熱交換効率を大幅にアップさせる熱交換器が開示されている。 For example, those disclosed in Patent Documents 1 and 2 are known as joining members used when attaching a plurality of rod-shaped members to a base material. Japanese Patent Publication No. 10-106722 (JPH10-106722A) discloses a technique for bonding a porous body and other materials using a paste-like bonding silver conductor. In addition, Japanese Patent Publication No. 2003-240473 (JP2003-240473A) discloses a heat exchanger that satisfactorily joins a metal porous member and a metal flat plate to significantly increase heat exchange efficiency. has been done.
 従来の接合部材は、概して金属粒子が溶融して固着することにより形成される金属溶融体から構成されていた。しかしながら、このような接合部材を用いて伝熱部を基材に取り付けた場合は、熱により基材が膨張したり収縮したりしたときに接合部材が基材の膨張や収縮に追随することができず反り、剥がれ、割れ等が生じるおそれがあった。 Conventional bonding members were generally composed of a molten metal body formed by melting and fixing metal particles. However, when the heat transfer part is attached to the base material using such a joining member, when the base material expands or contracts due to heat, the joining member may follow the expansion or contraction of the base material. Otherwise, there was a risk of warping, peeling, cracking, etc.
 本発明は、このような点を考慮してなされたものであり、基材の膨張や収縮に接合部材が追随することができるとともに基材と伝熱部との間で十分な強度保持および熱伝導性を得ることができる温調ユニットおよび接合部材を提供することを目的とする。 The present invention has been made with these points in mind, and it is possible for the joining member to follow the expansion and contraction of the base material, and also to maintain sufficient strength and heat between the base material and the heat transfer part. It is an object of the present invention to provide a temperature control unit and a joining member that can obtain conductivity.
 本発明の温調ユニットは、
 伝熱部と、
 基材と、
 前記伝熱部を前記基材に取り付けるための接合部材と、
 を備え、
 前記接合部材は、1次粒径が100nmよりも小さい複数の金属粒子と、金属溶融体とから構成され、
 前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.5~0.9の範囲内の大きさであることを特徴とする。
The temperature control unit of the present invention includes:
a heat transfer part;
base material and
a joining member for attaching the heat transfer part to the base material;
Equipped with
The joining member is composed of a plurality of metal particles having a primary particle size of less than 100 nm and a metal melt,
It is characterized in that the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.5 to 0.9.
 本発明の温調ユニットにおいては、
 前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.55~0.85の範囲内の大きさであってもよい。
In the temperature control unit of the present invention,
The ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member may be within the range of 0.55 to 0.85.
 本発明の温調ユニットにおいては、
 前記伝熱部が前記基材に取り付けられる箇所の断面において、前記基材の表面の長さに対する、前記接合部材が前記基材に取り付けられる箇所の長さの割合が0.25以上であってもよい。
In the temperature control unit of the present invention,
In the cross section of the portion where the heat transfer part is attached to the base material, the ratio of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material is 0.25 or more, Good too.
 本発明の温調ユニットにおいては、
 前記接合部材の材料は銀または銀の合金を含んでいてもよい。
In the temperature control unit of the present invention,
The material of the joining member may include silver or a silver alloy.
 本発明の温調ユニットにおいては、
 前記伝熱部は、金属繊維構造体を含む棒状部材、または板状部材を有していてもよい。
In the temperature control unit of the present invention,
The heat transfer section may have a rod-like member or a plate-like member including a metal fiber structure.
 本発明の温調ユニットにおいては、
 前記基材は、金属、ガラスまたはセラミックを含むものであってもよい。
In the temperature control unit of the present invention,
The base material may include metal, glass, or ceramic.
 本発明の接合部材は、
 伝熱部を基材に取り付けるための接合部材であって、
 1次粒径が100nmよりも小さい複数の金属粒子と、金属溶融体とから構成され、
 前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.5~0.9の範囲内の大きさであることを特徴とする。
The joining member of the present invention is
A joining member for attaching a heat transfer part to a base material,
Consisting of a plurality of metal particles with a primary particle size of less than 100 nm and a metal melt,
It is characterized in that the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.5 to 0.9.
 本発明の接合部材においては、
 前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.55~0.85の範囲内の大きさであってもよい。
In the joining member of the present invention,
The ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member may be within the range of 0.55 to 0.85.
本発明の実施の形態による温調ユニットの構成を示す正面図である。FIG. 1 is a front view showing the configuration of a temperature control unit according to an embodiment of the present invention. 図1に示す温調ユニットのA-A矢視による断面図である。FIG. 2 is a cross-sectional view taken along the line AA of the temperature control unit shown in FIG. 1. FIG. 図1に示す温調ユニットにおける棒状部材(伝熱部)と基材との接合箇所の第1の例を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a first example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1. FIG. 図1に示す温調ユニットにおける棒状部材(伝熱部)と基材との接合箇所の第2の例を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a second example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1. FIG. 図1に示す温調ユニットにおける棒状部材(伝熱部)と基材との接合箇所の第3の例を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a third example of a joint location between a rod-shaped member (heat transfer section) and a base material in the temperature control unit shown in FIG. 1. FIG. 図1に示す温調ユニットにおける棒状部材(伝熱部)と基材との接合箇所の第4の例を示す概略構成図である。It is a schematic block diagram which shows the 4th example of the joint part of the rod-shaped member (heat transfer part) and base material in the temperature control unit shown in FIG. 図1に示す温調ユニットにおける棒状部材(伝熱部)および接続部材の構成を概略的に示す概略構成図である。2 is a schematic configuration diagram schematically showing the configuration of a rod-shaped member (heat transfer section) and a connecting member in the temperature control unit shown in FIG. 1. FIG. 図1に示す温調ユニットにおける第1側壁部材の構成を示す構成図である。2 is a configuration diagram showing the configuration of a first side wall member in the temperature control unit shown in FIG. 1. FIG. 本発明の実施の形態による接合部材および基材を拡大して示す図である。FIG. 2 is an enlarged view showing a joining member and a base material according to an embodiment of the present invention. 本発明の実施の形態による接合部材を構成する金属粒子を示す図である。FIG. 3 is a diagram showing metal particles constituting a joining member according to an embodiment of the present invention. 主に金属溶融体からなる接合部材および基材を拡大して示す図である。FIG. 2 is an enlarged view showing a joining member and a base material mainly made of molten metal.
 以下、図面を参照して本発明の実施の形態について説明する。図1乃至図10は、本発明の実施の形態による温調ユニットおよび接合部材を示す図である。このうち、図1は、本実施の形態による温調ユニットの構成を示す正面図であり、図2は、図1に示す温調ユニットのA-A矢視による断面図である。また、図3乃至図6は、それぞれ、図1に示す温調ユニットにおける棒状部材(伝熱部)と基材との接合箇所の第1~第4の例を示す概略構成図である。また、図7は、図1に示す温調ユニットにおける棒状部材(伝熱部)および接続部材の構成を示す構成図であり、図8は、図1に示す温調ユニットにおける第1側壁部材の構成を示す構成図である。また、図9は、本実施の形態による接合部材および基材を拡大して示す図であり、図10は、本実施の形態による接合部材を構成する金属粒子を示す図である。なお、図11は、主に金属溶融体からなる接合部材および基材を拡大して示す図である。 Embodiments of the present invention will be described below with reference to the drawings. 1 to 10 are diagrams showing a temperature control unit and a joining member according to an embodiment of the present invention. Of these, FIG. 1 is a front view showing the configuration of the temperature control unit according to the present embodiment, and FIG. 2 is a sectional view taken along the line AA of the temperature control unit shown in FIG. Further, FIGS. 3 to 6 are schematic configuration diagrams showing first to fourth examples of joint locations between the rod-shaped member (heat transfer portion) and the base material in the temperature control unit shown in FIG. 1, respectively. Further, FIG. 7 is a configuration diagram showing the configuration of a rod-shaped member (heat transfer part) and a connecting member in the temperature control unit shown in FIG. 1, and FIG. 8 is a configuration diagram showing the structure of the first side wall member in the temperature control unit shown in FIG. It is a block diagram which shows a structure. Further, FIG. 9 is an enlarged view showing the joining member and the base material according to the present embodiment, and FIG. 10 is a diagram showing metal particles constituting the joining member according to the present embodiment. Note that FIG. 11 is an enlarged view showing a joining member and a base material mainly made of molten metal.
 図1および図2に示すように、本実施の形態による温調ユニット10は、一対の平板状の基材20と、一対の平板状の第1側壁部材22と、一対の平板状の第2側壁部材24とを有する略直方体形状のものであり、これらの一対の基材20、一対の第1側壁部材22および一対の第2側壁部材24の間に形成される内部領域16に流体が流されるようになっている。図8は、第1側壁部材22の構成を示す構成図である。また、一対の基材20のうち一方の基材20には流体入口部12および流体出口部14がそれぞれ形成されており、この基材20には、流体入口部12から内部領域16に送られる流体が通過する開口20pおよび内部領域16から流体出口部14に送られる流体が通過する開口20qがそれぞれ形成されている。また、一対の基材20の間には、伝熱部として複数の棒状部材40が互いに平行に延びるよう配置されている。各棒状部材40は円柱形状であり、図2に示す温調ユニット10の断面において各棒状部材40は格子の交点に位置するよう配置されている。流体入口部12から開口20pを介して温調ユニット10の内部領域16に入った流体は内部領域16において図1および図2における右方向に流れ、開口20qを介して流体出口部14に送られるようになっている。内部領域16の内部を流れる流体は、例えば水、空気、不凍液、有機溶剤、フッ素系溶媒(例えば、フロリナート、フロン)等を含む。 As shown in FIGS. 1 and 2, the temperature control unit 10 according to the present embodiment includes a pair of flat base members 20, a pair of flat first side wall members 22, and a pair of flat second side wall members 22. It has a substantially rectangular parallelepiped shape with side wall members 24, and the fluid flows into the internal region 16 formed between the pair of base members 20, the pair of first side wall members 22, and the pair of second side wall members 24. It is now possible to FIG. 8 is a configuration diagram showing the configuration of the first side wall member 22. As shown in FIG. Further, one of the pair of base materials 20 is formed with a fluid inlet section 12 and a fluid outlet section 14, respectively, and this base material 20 has a fluid inlet section 12 and a fluid outlet section 14 formed therein. An opening 20p through which the fluid passes and an opening 20q through which the fluid sent from the internal region 16 to the fluid outlet section 14 passes are formed. Further, between the pair of base materials 20, a plurality of rod-shaped members 40 are arranged as heat transfer portions so as to extend in parallel to each other. Each rod-shaped member 40 has a cylindrical shape, and is arranged so as to be located at the intersection of the grids in the cross section of the temperature control unit 10 shown in FIG. The fluid that enters the internal area 16 of the temperature control unit 10 from the fluid inlet 12 through the opening 20p flows in the internal area 16 in the right direction in FIGS. 1 and 2, and is sent to the fluid outlet 14 through the opening 20q. It looks like this. The fluid flowing inside the internal region 16 includes, for example, water, air, antifreeze, organic solvents, fluorinated solvents (eg, Fluorinert, Freon), and the like.
 各基材20は、例えば金属、ガラスまたはセラミックを含むものである。これらの例示としては、金属としてはステンレス、銅、ニッケル、アルミニウムまたはこれらを少なくとも1種含む合金が挙げられる。また、ガラスとしては石英ガラス、ソーダガラス、任意の金属酸化物を含有したガラスが挙げられる。また、セラミックとしては、アルミナ、マグネシア、ジルコニア、アルミナイトライド(AlN)、シリコンカーバイド(SiC)、シリコンナイトライド(SiN)またはこれらのポーラスセラミックが挙げられる。 Each base material 20 includes, for example, metal, glass, or ceramic. Examples of these metals include stainless steel, copper, nickel, aluminum, and alloys containing at least one of these. Examples of the glass include quartz glass, soda glass, and glass containing any metal oxide. Examples of the ceramic include alumina, magnesia, zirconia, aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (SiN), and porous ceramics thereof.
 温調ユニット10における基材20の外面にヒータ(図示せず)が取り付けられており、ヒータから基材20を介して各棒状部材40に伝達された熱によって内部領域16を流れる流体が加熱させられるようになっている。ここで、本実施の形態の温調ユニット10は、間隔を空けて互いに平行に延びる複数の棒状部材40および各棒状部材40を接続する接続部材20m(図3乃至図6参照)から構成される梯子形状の構造体が組み合わせられることにより形成されるようになっている。図7は、複数の棒状部材40および各棒状部材40を接続する接続部材20mから構成される梯子形状の構造体を概略的に示す概略構成図である。そして、各基材20は、複数の梯子形状の構造体における各接続部材20mが組み合わせられたものである。 A heater (not shown) is attached to the outer surface of the base material 20 in the temperature control unit 10, and the fluid flowing in the internal region 16 is heated by the heat transferred from the heater to each rod-shaped member 40 via the base material 20. It is now possible to Here, the temperature control unit 10 of the present embodiment includes a plurality of rod-shaped members 40 that extend parallel to each other at intervals, and a connecting member 20m (see FIGS. 3 to 6) that connects each of the rod-shaped members 40. It is formed by combining ladder-shaped structures. FIG. 7 is a schematic configuration diagram schematically showing a ladder-shaped structure composed of a plurality of rod-like members 40 and a connecting member 20m that connects each rod-like member 40. As shown in FIG. Each base material 20 is a combination of connection members 20m in a plurality of ladder-shaped structures.
 各棒状部材40は、銅繊維等の金属繊維から形成される金属繊維構造体を含む。このような金属繊維として、金属被覆繊維が用いられてもよい。また、金属繊維構造体は、湿式または乾式製法を用いて不織布、織布およびメッシュ等に形成した後に、金属繊維構造体に加工したものであってもよい。好ましくは、金属繊維構造体として、金属繊維が集積された後に、結着された金属繊維構造体が用いられる。金属繊維が結着されているとは、金属繊維同士が物理的に固定され、結着部を形成していることを意味する。金属繊維構造体は、金属繊維同士が結着部で直接的に固定されていてもよいし、金属繊維の一部同士が、金属成分以外の成分を介して間接的に固定されていてもよい。 Each rod-shaped member 40 includes a metal fiber structure formed from metal fibers such as copper fibers. Metal-coated fibers may be used as such metal fibers. Further, the metal fiber structure may be formed into a nonwoven fabric, woven fabric, mesh, or the like using a wet or dry manufacturing method, and then processed into a metal fiber structure. Preferably, as the metal fiber structure, a metal fiber structure in which metal fibers are integrated and then bound is used. The term "metal fibers bound together" means that the metal fibers are physically fixed to each other to form a bound portion. In the metal fiber structure, the metal fibers may be directly fixed to each other at a binding part, or some of the metal fibers may be indirectly fixed to each other via a component other than the metal component. .
 棒状部材40において、金属繊維構造体が金属繊維から形成されているため、金属繊維構造体の内部には空隙が存在する。このことにより、内部領域16を流れる流体は、棒状部材40の金属繊維構造体の内部を通れるようになり、流体に対する熱交換性を高めやすくなる。また、金属繊維構造体において、金属繊維が結着されている場合には、金属繊維構造体を構成している金属繊維の間に空隙がより一層形成されやすくなる。このような空隙は、例えば金属繊維が交絡することにより形成されてもよい。また、金属繊維構造体は、結着部で金属繊維が焼結されていることが好ましい。金属繊維が焼結されていることにより、金属繊維構造体の熱伝導性および均質性が安定しやすくなる。 In the rod-shaped member 40, since the metal fiber structure is formed from metal fibers, voids exist inside the metal fiber structure. This allows the fluid flowing through the internal region 16 to pass through the inside of the metal fiber structure of the rod-shaped member 40, making it easier to improve heat exchange performance with the fluid. Moreover, in the metal fiber structure, when the metal fibers are bound together, voids are more likely to be formed between the metal fibers constituting the metal fiber structure. Such voids may be formed, for example, by intertwining metal fibers. Further, in the metal fiber structure, it is preferable that the metal fibers are sintered at the binding portion. By sintering the metal fibers, the thermal conductivity and homogeneity of the metal fiber structure become more stable.
 なお、図2では、棒状部材40として断面が円形のものを示したが、本実施の形態は棒状部材40の断面は円形に限定されることはない。棒状部材40の断面形状が台形形状、三角形形状、半円形状または山形状であってもよい。また、複数の棒状部材40の間に流体の流路が形成される際に、この流路が流体の流れる方向に沿って蛇行するよう複数の櫛形状の構造体が配置されるようになっていてもよい。この場合には、流体は流路に沿って蛇行しながら流れるため、流路を流れる流体の熱交換面積の増大に伴い、圧力損失が適度に大きくなり、流路内での流体の滞留時間を長くすることができるため、伝熱効果を高めることができる。 Although FIG. 2 shows the rod-shaped member 40 having a circular cross section, the cross-section of the rod-shaped member 40 in this embodiment is not limited to a circular shape. The cross-sectional shape of the rod-shaped member 40 may be a trapezoid, a triangle, a semicircle, or a mountain. Further, when a fluid flow path is formed between the plurality of rod-shaped members 40, the plurality of comb-shaped structures are arranged so that the flow path meander along the direction in which the fluid flows. You can. In this case, the fluid flows in a meandering manner along the flow path, so as the heat exchange area of the fluid flowing through the flow path increases, the pressure loss becomes moderately large, and the residence time of the fluid within the flow path increases. Since the length can be increased, the heat transfer effect can be enhanced.
 また、伝熱部として、空隙を有さない板状または棒状のものが用いられてもよい。このような空隙を有さない板状または棒状の伝熱部の素材としては金属が挙げられ、具体的にはステンレス、銅、ニッケル、アルミニウムまたはこれらを少なくとも1種含む合金が例示される。 Furthermore, a plate-like or rod-like member having no voids may be used as the heat transfer part. Examples of the material for such a plate-like or rod-like heat transfer portion having no voids include metals, and specific examples thereof include stainless steel, copper, nickel, aluminum, and alloys containing at least one of these.
 次に、接合部材30により棒状部材40を基材20(具体的には、基材20を構成する各接続部材20m)に取り付ける方法について説明する。接合部材30により棒状部材40を接続部材20mに取り付ける方法としては図3乃至図6に示すように様々な方法がある。図3に示すように、接続部材20mの上面に接合部材30を付着させ、この接合部材30の上面に棒状部材40を付着させてもよい。また、図4に示すように、接続部材20mに凹部を形成し、この凹部に接合部材30を収容させ、凹部に収容されている接合部材30の上面に棒状部材40を付着させてもよい。また、図5に示すように、接続部材20mに凹部を形成し、この凹部に接合部材30を収容させ、凹部に収容されている接合部材30に棒状部材40を埋め込むようにしてもよい。また、図6に示すように、接続部材20mの表面に棒状部材40を配置し、接続部材20mと棒状部材40との接触箇所の近傍における棒状部材40に接合部材30を配置することにより棒状部材40を接続部材20mに接合してもよい。 Next, a method of attaching the rod-shaped member 40 to the base material 20 (specifically, each connecting member 20m that constitutes the base material 20) using the joining member 30 will be described. There are various methods for attaching the rod-shaped member 40 to the connecting member 20m using the joining member 30, as shown in FIGS. 3 to 6. As shown in FIG. 3, a joining member 30 may be attached to the upper surface of the connecting member 20m, and a rod-shaped member 40 may be attached to the upper surface of this joining member 30. Alternatively, as shown in FIG. 4, a recess may be formed in the connecting member 20m, the joining member 30 may be accommodated in the recess, and the rod-shaped member 40 may be attached to the upper surface of the joining member 30 accommodated in the recess. Further, as shown in FIG. 5, a recess may be formed in the connecting member 20m, the joining member 30 may be accommodated in the recess, and the rod-shaped member 40 may be embedded in the joining member 30 accommodated in the recess. Further, as shown in FIG. 6, the rod-shaped member 40 is arranged on the surface of the connecting member 20m, and the joining member 30 is arranged on the rod-shaped member 40 near the contact point between the connecting member 20m and the rod-shaped member 40. 40 may be joined to the connecting member 20m.
 接合部材30は、ナノ銀粒子を含むペーストを有している。より詳細には、図9に示すように、接合部材30は、1次粒径が100nmよりも小さい複数の銀粒子30bと、銀粒子30bが溶融して固着することにより形成される金属溶融体30aとから構成されている。図10は、図9に示す複数の銀粒子30bを拡大して示す図である。なお、銀粒子30bの1次粒径は、SEM写真にて、粒子の長径及び短径の平均値を粒子径として、サンプリング粒子数n=100の平均値を算出したものである。ここで、本実施の形態では、接合部材30の断面において、金属溶融体30aが占める面積aおよび銀粒子30bが占める面積bの合計の面積(a+b)に対する、銀粒子30bが占める面積bの割合c(すなわち、b/(a+b)の値)が、0.5~0.9の範囲内の大きさ、好ましくは0.55~0.85の範囲内の大きさとなっている。ここで、このような割合cは、棒状部材40が基材20(具体的には、接続部材20m)に取り付けられる箇所の近傍の断面における基材20の表面20aから所定の距離(例えば、1μm)の範囲(図9において参照符号20a´で表示)内の領域における、金属溶融体30aが占める面積aおよび銀粒子30bが占める面積bに基づいて算出される。本実施の形態では、接合部材30が金属溶融体30aおよび銀粒子30bの混合物であるため、銀粒子30bが接合部材30に含まれることにより基材20に取り付けられたヒータによる熱によって基材20が膨張した場合でも接合部材30が基材20の膨張に追随することができ、よって接合部材30に反り、剥がれ、割れ等が生じることが抑制される。また、金属溶融体30aが接合部材30に含まれることにより棒状部材40を基材20に強固に接合することができ、また基材20から棒状部材40への十分な伝熱性が得られる。 The joining member 30 has a paste containing nanosilver particles. More specifically, as shown in FIG. 9, the bonding member 30 includes a plurality of silver particles 30b having a primary particle diameter of less than 100 nm, and a metal melt formed by the silver particles 30b melting and sticking together. 30a. FIG. 10 is an enlarged view of the plurality of silver particles 30b shown in FIG. Note that the primary particle size of the silver particles 30b is determined by calculating the average value of the number of sampled particles n=100, using the average value of the long axis and short axis of the particles as the particle size in the SEM photograph. Here, in the present embodiment, in the cross section of the joining member 30, the ratio of the area b occupied by the silver particles 30b to the total area (a+b) of the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b. c (ie, the value of b/(a+b)) is within the range of 0.5 to 0.9, preferably within the range of 0.55 to 0.85. Here, such a ratio c is a predetermined distance (for example, 1 μm) from the surface 20a of the base material 20 in the cross section near the location where the rod-shaped member 40 is attached to the base material 20 (specifically, the connecting member 20m). ) (indicated by reference numeral 20a' in FIG. 9), it is calculated based on the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b. In this embodiment, since the bonding member 30 is a mixture of the metal melt 30a and the silver particles 30b, the inclusion of the silver particles 30b in the bonding member 30 causes the base material 20 to be heated by the heater attached to the base material 20. Even when the base material 20 expands, the bonding member 30 can follow the expansion of the base material 20, thereby suppressing the occurrence of warping, peeling, cracking, etc. in the bonding member 30. Further, by including the metal melt 30a in the joining member 30, the rod-shaped member 40 can be firmly joined to the base material 20, and sufficient heat transfer from the base material 20 to the rod-shaped member 40 can be obtained.
 接合部材30において割合cが0.5よりも小さい場合には、接合部材30に含まれる銀粒子30bが少な過ぎることにより、基材20に取り付けられたヒータによる熱によって基材20が膨張した場合に接合部材30が基材20の膨張に追随することができず反り、剥がれ、割れ等が生じるおそれがある。また、接合部材30において割合cが0.9よりも大きい場合には、接合部材30に含まれる金属溶融体30aが少な過ぎることにより、棒状部材40を基材20に強固に接合することができず、また基材20から棒状部材40への十分な伝熱性を得ることができないという問題がある。これに対し、接合部材30において割合cが0.5~0.9の範囲内の大きさである場合には、これらの問題が生じることが抑制される。 When the ratio c is smaller than 0.5 in the bonding member 30, the base material 20 expands due to the heat generated by the heater attached to the base material 20 due to too few silver particles 30b contained in the bonding member 30. The bonding member 30 may not be able to follow the expansion of the base material 20, and warping, peeling, cracking, etc. may occur. Further, if the ratio c in the joining member 30 is larger than 0.9, the rod-shaped member 40 cannot be firmly joined to the base material 20 because the molten metal 30a contained in the joining member 30 is too small. First, there is also the problem that sufficient heat conductivity from the base material 20 to the rod-shaped member 40 cannot be obtained. On the other hand, if the ratio c in the bonding member 30 is within the range of 0.5 to 0.9, these problems are suppressed.
 また、棒状部材40が基材20に取り付けられる箇所の断面において、基材20の表面20aの長さに対する、接合部材30が基材20に取り付けられる箇所の長さの割合dが0.25以上、好ましくは0.5以上となっていることが好ましい。図9に示すような接合部材30では、割合dが概ね0.7程度となっている。一方、図11に示すように、基材20の表面に接合部材30があまり付着しておらず、割合dが0.25より小さくなる場合がある。より詳細には、図11において、基材20は、金属板20cおよびこの金属板20cの表面にメッキ等が溶射された溶射層20bから構成されているが、溶射層20bの表面の長さに対する、接合部材30が溶射層20bに取り付けられる箇所(図11において参照符号30cで表示)の長さの割合が0.25より小さくなっている。このように、割合dが0.25よりも小さい場合には、接合部材30が基材20から剥がれやすくなり、よって例えば基材20の伸縮時に接合部材30が基材20から剥離して棒状部材40が基材20から離間することにより熱伝導性が大幅に低下してしまうおそれがある。 Further, in the cross section of the portion where the rod-shaped member 40 is attached to the base material 20, the ratio d of the length of the portion where the joining member 30 is attached to the base material 20 to the length of the surface 20a of the base material 20 is 0.25 or more. , preferably 0.5 or more. In the joining member 30 as shown in FIG. 9, the ratio d is approximately 0.7. On the other hand, as shown in FIG. 11, the bonding member 30 may not adhere to the surface of the base material 20 very much, and the ratio d may be smaller than 0.25. More specifically, in FIG. 11, the base material 20 is composed of a metal plate 20c and a thermally sprayed layer 20b in which plating or the like is thermally sprayed on the surface of the metal plate 20c. , the length ratio of the portion where the joining member 30 is attached to the sprayed layer 20b (indicated by reference numeral 30c in FIG. 11) is smaller than 0.25. In this way, when the ratio d is smaller than 0.25, the bonding member 30 is likely to peel off from the base material 20, and therefore, for example, when the base material 20 expands and contracts, the bonding member 30 peels off from the base material 20 and the rod-shaped member 40 is spaced apart from the base material 20, there is a possibility that thermal conductivity will be significantly reduced.
 次に、このような構成の接合部材30により棒状部材40を接続部材20mに接合する方法について説明する。まず、図3乃至図6に示すように、接続部材20mと棒状部材40との間に銀ナノペーストを塗布し、次に接続部材20mと棒状部材40との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結する。接続部材20mと棒状部材40との間に温度差を与える方法として、例えば接続部材20mをペルチェ素子によって冷却するとともに、棒状部材40にセラミックヒーターを接触させ、棒状部材40を介した熱伝導によって銀粒子の一部を焼結させる。熱勾配の条件は銀粒子の粒子径、材料の融点によって異なるが、動的光散乱法を用いた平均粒子径(流体力学的な粒子径)が10nmの銀粒子を用いた場合は、例えば棒状部材40の先端温度を250~300℃とした場合、接続部材20mと棒状部材40との接合箇所の温度を150~200℃となるよう調整し、窒素雰囲気下で30~120分間加熱することにより、この接合箇所でナノ粒子が焼結されることによってナノ粒子構造体を得ることができる。 Next, a method of joining the rod-shaped member 40 to the connecting member 20m using the joining member 30 having such a configuration will be described. First, as shown in FIGS. 3 to 6, a silver nanopaste is applied between the connecting member 20m and the rod-shaped member 40, and then a temperature difference is applied between the connecting member 20m and the rod-shaped member 40, and the silver nanopaste is applied between the connecting member 20m and the rod-shaped member 40. Some of the silver particles contained in the paste are sintered. As a method of creating a temperature difference between the connecting member 20m and the rod-shaped member 40, for example, the connecting member 20m is cooled by a Peltier element, a ceramic heater is brought into contact with the rod-shaped member 40, and the silver is heated by heat conduction through the rod-shaped member 40. Sinter some of the particles. Thermal gradient conditions vary depending on the particle size of the silver particles and the melting point of the material, but when using silver particles with an average particle size (hydrodynamic particle size) of 10 nm using the dynamic light scattering method, for example, a rod-shaped When the temperature at the tip of the member 40 is 250 to 300°C, the temperature at the joint between the connecting member 20m and the rod-shaped member 40 is adjusted to 150 to 200°C, and by heating in a nitrogen atmosphere for 30 to 120 minutes. , a nanoparticle structure can be obtained by sintering the nanoparticles at this junction.
 以上のような構成からなる本実施の形態の温調ユニット10および接合部材30によれば、接合部材30が、1次粒径が100nmよりも小さい複数の金属粒子(具体的には、銀粒子30b)と、金属溶融体30aとから構成され、接合部材30が占める割合に対する金属粒子が占める面積の割合が0.5~0.9の範囲内の大きさであるため、基材20の膨張や収縮に接合部材30が追随することができるとともに基材20と伝熱部(具体的には、棒状部材40)との間で十分な強度保持および熱伝導性を得ることができる。なお、接合部材30が占める割合に対する金属粒子(具体的には、銀粒子30b)が占める面積の割合が0.55~0.85の範囲内の大きさであることが好ましい。この場合は、より一層、基材20の膨張や収縮に接合部材30が追随することができるとともに基材20と伝熱部との間で十分な強度保持および熱伝導性を得ることができる。 According to the temperature control unit 10 and the joining member 30 of the present embodiment having the above-described configuration, the joining member 30 has a plurality of metal particles (specifically, silver particles) having a primary particle size smaller than 100 nm. 30b) and a molten metal 30a, and the ratio of the area occupied by the metal particles to the ratio occupied by the bonding member 30 is within the range of 0.5 to 0.9, so that the expansion of the base material 20 The joining member 30 can follow the shrinkage and contraction, and sufficient strength retention and thermal conductivity can be obtained between the base material 20 and the heat transfer portion (specifically, the rod-shaped member 40). Note that the ratio of the area occupied by the metal particles (specifically, the silver particles 30b) to the ratio occupied by the bonding member 30 is preferably within the range of 0.55 to 0.85. In this case, the joining member 30 can further follow the expansion and contraction of the base material 20, and sufficient strength retention and thermal conductivity can be obtained between the base material 20 and the heat transfer section.
 また、本実施の形態の温調ユニット10および接合部材30においては、伝熱部(具体的には、棒状部材40)が基材20に取り付けられる箇所の断面において、基材20の表面の長さに対する、接合部材30が基材20に取り付けられる箇所の長さの割合が0.25以上であることが好ましい。この場合には、例えば基材20が膨張や収縮した場合でも、接合部材30が基材20から剥離してしまうことを抑制することができるため、基材20と伝熱部との間で十分な強度保持および熱伝導性を得ることができる。 Furthermore, in the temperature control unit 10 and the joining member 30 of the present embodiment, the length of the surface of the base material 20 is It is preferable that the ratio of the length of the part where the joining member 30 is attached to the base material 20 to the length is 0.25 or more. In this case, even if the base material 20 expands or contracts, it is possible to prevent the bonding member 30 from peeling off from the base material 20, so that there is sufficient space between the base material 20 and the heat transfer section. It is possible to obtain good strength retention and thermal conductivity.
 また、本実施の形態の温調ユニット10および接合部材30においては、接合部材30の材料は銀を含んでいる。なお、接合部材30の材料は銀に限定されることはない。接合部材30の他の材料として銀の合金が用いられてもよい。また、接合部材30の更に他の材料として、銅、ニッケル等が用いられてもよい。 Furthermore, in the temperature control unit 10 and the joining member 30 of this embodiment, the material of the joining member 30 contains silver. Note that the material of the joining member 30 is not limited to silver. A silver alloy may be used as another material for the joining member 30. Furthermore, other materials for the joining member 30 may include copper, nickel, and the like.
 また、本実施の形態の温調ユニット10においては、伝熱部(具体的には、棒状部材40)は、金属繊維構造体を含んでいる。この場合は、温調ユニット10の内部を流れる流体は、伝熱部の金属繊維構造体の内部を通れるようになる。このことにより、流体に対する熱交換性を高めやすくなる。また、伝熱部として板状部材が用いられてもよい。 Furthermore, in the temperature control unit 10 of this embodiment, the heat transfer section (specifically, the rod-shaped member 40) includes a metal fiber structure. In this case, the fluid flowing inside the temperature control unit 10 can pass through the inside of the metal fiber structure of the heat transfer section. This makes it easier to improve heat exchange performance with the fluid. Further, a plate-like member may be used as the heat transfer portion.
 また、本実施の形態の温調ユニット10においては、基材20は、金属、ガラスまたはセラミックを含むものである。この場合には、例えば基材20に取り付けられたヒータによって当該基材20が膨張した場合でも、上記の構成の接合部材30によって、基材20の膨張に接合部材30が追随することにより、接合部材30に反り、剥がれ、割れ等が生じることを抑制することができる。 Furthermore, in the temperature control unit 10 of this embodiment, the base material 20 includes metal, glass, or ceramic. In this case, even if the base material 20 is expanded by a heater attached to the base material 20, for example, the joining member 30 having the above-mentioned configuration can follow the expansion of the base material 20, so that the joining can be performed. It is possible to suppress the occurrence of warping, peeling, cracking, etc. in the member 30.
 なお、本実施の形態による温調ユニットは上述した態様のものに限定されることはない。本実施の形態による温調ユニットの他の様々な例について以下に説明する。 Note that the temperature control unit according to this embodiment is not limited to the above-described embodiment. Various other examples of the temperature control unit according to this embodiment will be described below.
 例えば、上記の割合cは、棒状部材40が基材20に取り付けられる箇所の近傍の断面における基材20の表面20aから所定の距離(例えば、1μm)の範囲(図9において参照符号20a´で表示)内の領域における、金属溶融体30aが占める面積aおよび銀粒子30bが占める面積bに基づいて算出されることに限定されない。他の例として、接合部材30の断面の全領域における金属溶融体30aが占める面積aおよび銀粒子30bが占める面積bに基づいて割合cが算出されてもよい。 For example, the above ratio c is within a predetermined distance (for example, 1 μm) from the surface 20a of the base material 20 in the cross section near the location where the rod-shaped member 40 is attached to the base material 20 (reference numeral 20a' in FIG. 9). It is not limited to calculation based on the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b in the area within the range (displayed). As another example, the ratio c may be calculated based on the area a occupied by the metal melt 30a and the area b occupied by the silver particles 30b in the entire area of the cross section of the joining member 30.
 以下、本発明について実施例および比較例を用いてより詳細に説明する。 Hereinafter, the present invention will be explained in more detail using Examples and Comparative Examples.
<第1実施例>
 図1および図2に示すような形状の温調ユニットを作成した。この際に、図3に示すように、接続部材の上面に接合部材を付着させ、この接合部材の上面に棒状部材を付着させた。そして、間隔を空けて互いに平行に延びる複数の棒状部材および各棒状部材を接続する一本の接続部材から構成される櫛形状の構造体を組み合わせることにより温調ユニットを製造した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は51%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第1実施例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが79%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは89%であった。
<First example>
A temperature control unit having a shape as shown in FIGS. 1 and 2 was created. At this time, as shown in FIG. 3, a joining member was attached to the upper surface of the connecting member, and a rod-shaped member was attached to the upper surface of this joining member. Then, a temperature control unit was manufactured by combining a comb-shaped structure composed of a plurality of rod-shaped members extending parallel to each other at intervals and one connecting member connecting the rod-shaped members. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the first embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 79%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 89%.
<第2実施例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は50%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第2実施例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが80%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは31%であった。
<Second example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 50%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the second embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 80%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 31%.
<第3実施例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は52%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第3実施例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが51%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは92%であった。
<Third Example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the third embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 51%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 92%.
<第4実施例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は51%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第4実施例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが53%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは29%であった。
<Fourth Example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the fourth embodiment, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 53%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 29%.
<第1比較例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は52%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第1比較例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが47%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは90%であった。
<First comparative example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the first comparative example, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 47%. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 90%.
<第2比較例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は52%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第2比較例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが46%であった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは21%であった。
<Second comparative example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 52%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the second comparative example, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 46%. Further, in the cross section of the part where the rod-shaped member is attached to the base material, the ratio d of the length of the part where the joining member is attached to the base material to the length of the surface of the base material was 21%.
<第3比較例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は51%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子を全て焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子を全て焼結させた。第3比較例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが0%であった。すなわち、銀粒子は完全に焼結して金属溶融体となった。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは62%であった。
<Third comparative example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter all the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, all the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the third comparative example, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 0%. That is, the silver particles were completely sintered into a metal melt. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 62%.
<第4比較例>
 第1実施例と同様の方法により温調ユニットを作成した。この際に、棒状部材が取り付けられている基材の面積は100cm 2であった。また、各棒状部材は銅繊維からなる金属繊維構造体を含み、銅繊維の占積率は51%であった。また、棒状部材を接合部材により接続部材に接合するにあたり、接続部材と棒状部材との間に粒子径が6nmである銀ナノペーストを塗布し、次に接続部材と棒状部材との間に温度差を与えて銀ナノペーストに含まれる銀粒子の一部を焼結した。具体的には、接続部材をペルチェ素子によって冷却するとともに、棒状部材にセラミックヒーターを接触させ、棒状部材の先端温度271℃、棒状部材と接続部材との接合箇所の温度を165℃とし、60分間維持することによって、棒状部材を介した熱伝導によって銀粒子の一部を焼結させた。第4比較例に係る温調ユニットでは、棒状部材が基材に取り付けられる箇所の近傍の断面における基材の表面から1μmの範囲内の領域において、金属溶融体が占める面積aおよび銀粒子が占める面積bの合計の面積(a+b)に対する、銀粒子が占める面積bの割合cが98%であった。すなわち、銀粒子はほとんど溶融しておらず接合部材の大部分を銀粒子が占めた。また、棒状部材が基材に取り付けられる箇所の断面において、基材の表面の長さに対する、接合部材が基材に取り付けられる箇所の長さの割合dは52%であった。
<Fourth comparative example>
A temperature control unit was created by the same method as in the first example. At this time, the area of the base material to which the rod-shaped member was attached was 100 cm 2 . Further, each rod-shaped member included a metal fiber structure made of copper fibers, and the space factor of the copper fibers was 51%. In addition, when joining the rod-shaped member to the connecting member using the joining member, silver nanopaste with a particle size of 6 nm is applied between the connecting member and the rod-shaped member, and then there is a temperature difference between the connecting member and the rod-shaped member. was applied to sinter some of the silver particles contained in the silver nanopaste. Specifically, the connecting member was cooled by a Peltier element, a ceramic heater was brought into contact with the rod-shaped member, the temperature at the tip of the rod-shaped member was 271°C, and the temperature at the joint between the rod-shaped member and the connecting member was 165°C for 60 minutes. By maintaining the temperature, some of the silver particles were sintered by heat conduction through the rod-shaped member. In the temperature control unit according to the fourth comparative example, the area a occupied by the molten metal and the area occupied by the silver particles in the area within 1 μm from the surface of the base material in the cross section near the location where the rod-shaped member is attached to the base material. The ratio c of area b occupied by the silver particles to the total area (a+b) of area b was 98%. That is, the silver particles were hardly melted and occupied most of the bonding member. Further, in the cross section of the portion where the rod-shaped member is attached to the base material, the ratio d of the length of the portion where the joining member is attached to the base material to the length of the surface of the base material was 52%.
<評価>
 第1~第4実施例に係る温調ユニットおよび第1~第4比較例に係る温調ユニットについて熱衝撃試験の前後における熱伝達率をそれぞれ算出し、熱伝達率の変化について判定を行った。熱伝達率の算出方法は、評価用ユニットに、冷媒として25℃に調温したエチレングリコールを通液し、ヒータから100Wの入熱を与え、評価用ユニットの液体導入口(IN側)および排出口(OUT側)近傍の流体温度、ならびにヒータと評価ユニットの接点温度を測定し、熱伝達率および熱抵抗を算出した。具体的には、ヒータから流体への入熱量W、ヒータに隣接する流体通過部の伝達面積S、ヒータ近傍の評価ユニットの筐体の表面温度Ts、通過流体の平均温度Tw(流体の入口温度と出口温度の平均値)を測定し、入熱量W=熱伝達率h×伝達面積S×(表面温度Ts-流体平均温度Tw)の式から熱伝達率h(W/m 2×K)を求めた。
<Evaluation>
The heat transfer coefficients before and after the thermal shock test were calculated for the temperature control units according to the first to fourth examples and the temperature control units according to the first to fourth comparative examples, and changes in the heat transfer coefficients were determined. . The method for calculating the heat transfer coefficient is to pass ethylene glycol as a refrigerant at a temperature of 25°C through the evaluation unit, apply 100W of heat input from the heater, and connect the liquid inlet (IN side) and exhaust of the evaluation unit. The fluid temperature near the outlet (OUT side) and the contact temperature between the heater and the evaluation unit were measured, and the heat transfer coefficient and thermal resistance were calculated. Specifically, the amount of heat input from the heater to the fluid W, the transfer area S of the fluid passing portion adjacent to the heater, the surface temperature Ts of the casing of the evaluation unit near the heater, the average temperature Tw of the passing fluid (the fluid inlet temperature and the average value of the outlet temperature), and calculate the heat transfer coefficient h (W/m 2 ×K) from the formula: heat input W = heat transfer coefficient h × transfer area S × (surface temperature Ts - fluid average temperature Tw) I asked for it.
 また、熱伝導率の算出は、熱衝撃試験の前後でそれぞれ行った。熱衝撃試験は、評価用ユニットをエスペック製の高加速冷熱衝撃装置に入れ、-40℃から120℃、120℃から-40℃の温度変化を連続的に与えることで接合部材に冷熱衝撃を与えた。-40℃ならびに120℃への温度復帰時間は10分とし、各温度の保持時間は30秒とし、サイクル数は1,000回とした。 In addition, the thermal conductivity was calculated before and after the thermal shock test. In the thermal shock test, the evaluation unit is placed in a highly accelerated thermal shock device made by Espec, and the bonded members are subjected to thermal shock by continuously applying temperature changes from -40°C to 120°C and from 120°C to -40°C. Ta. The temperature return time to -40°C and 120°C was 10 minutes, the holding time at each temperature was 30 seconds, and the number of cycles was 1,000 times.
 このようにして算出された熱伝導率の測定結果を以下の表1に示す。熱伝達率の変化について判定を行うにあたり、熱伝導率の前に測定された熱伝導率と、熱衝撃試験の後に測定された熱伝導率との差を、熱伝導率の前に測定された熱伝導率で割った値である変化率が5%以下であるときを極めて良好(very good)、5%より大きく20%以下であるときを良好(good)、20%より大きいときを不良(bad)とした。この変化率が小さいほど、熱衝撃試験の前後における熱伝導率に変化がなく、熱衝撃試験が行われても接合部材が大きく破損していないため基材と棒状部材との間の接合に大きな問題が生じていないといえる。 The measurement results of the thermal conductivity calculated in this way are shown in Table 1 below. In making a judgment about the change in heat transfer coefficient, the difference between the thermal conductivity measured before the thermal conductivity and the thermal conductivity measured after the thermal shock test is calculated as follows: Very good when the rate of change, which is the value divided by thermal conductivity, is 5% or less, good when it is greater than 5% and less than 20%, and poor when it is greater than 20%. bad). The smaller this rate of change is, the less there is a change in thermal conductivity before and after the thermal shock test, and the more the bond between the base material and the rod-shaped member is It can be said that no problems have occurred.
 上記の表1に示すように、第1~第4実施例に係る温調ユニットは、熱衝撃試験の前後における熱伝導率に変化があまりなく、接合部材の強度が十分であるため長期間使用しても基材と棒状部材との間の接合に大きな問題が生じないと考えられる。一方、第1~第4比較例に係る温調ユニットは、熱衝撃試験の前後における熱伝導率の変化が大きく、接合部材の強度が十分ではないため長期間使用すると基材と棒状部材との間の接合が十分ではなくなるおそれがあると考えられる。 As shown in Table 1 above, the temperature control units according to Examples 1 to 4 can be used for a long period of time because there is not much change in thermal conductivity before and after the thermal shock test, and the strength of the bonded members is sufficient. It is considered that no major problem will occur in the bonding between the base material and the rod-shaped member even if the base material and the rod-shaped member are bonded to each other. On the other hand, in the temperature control units according to the first to fourth comparative examples, the thermal conductivity changes significantly before and after the thermal shock test, and the strength of the joint member is not sufficient, so if used for a long period of time, the base material and the rod-shaped member It is thought that there is a possibility that the bond between the two parts may not be sufficient.

Claims (8)

  1.  伝熱部と、
     基材と、
     前記伝熱部を前記基材に取り付けるための接合部材と、
     を備え、
     前記接合部材は、1次粒径が100nmよりも小さい複数の金属粒子と、金属溶融体とから構成され、
     前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.5~0.9の範囲内の大きさである、温調ユニット。
    a heat transfer part;
    base material and
    a joining member for attaching the heat transfer part to the base material;
    Equipped with
    The joining member is composed of a plurality of metal particles having a primary particle size of less than 100 nm and a metal melt,
    A temperature control unit, wherein the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.5 to 0.9.
  2.  前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.55~0.85の範囲内の大きさである、請求項1記載の温調ユニット。 The temperature control unit according to claim 1, wherein the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.55 to 0.85.
  3.  前記伝熱部が前記基材に取り付けられる箇所の断面において、前記基材の表面の長さに対する、前記接合部材が前記基材に取り付けられる箇所の長さの割合が0.25以上である、請求項1または2記載の温調ユニット。 In a cross section of a location where the heat transfer part is attached to the base material, a ratio of the length of the location where the bonding member is attached to the base material to the length of the surface of the base material is 0.25 or more; The temperature control unit according to claim 1 or 2.
  4.  前記接合部材の材料は銀または銀の合金を含む、請求項1乃至3のいずれか一項に記載の温調ユニット。 The temperature control unit according to any one of claims 1 to 3, wherein the material of the joining member includes silver or a silver alloy.
  5.  前記伝熱部は、金属繊維構造体を含む棒状部材、または板状部材を有している、請求項1乃至4のいずれか一項に記載の温調ユニット。 The temperature control unit according to any one of claims 1 to 4, wherein the heat transfer section has a rod-like member or a plate-like member containing a metal fiber structure.
  6.  前記基材は、金属、ガラスまたはセラミックを含むものである、請求項1乃至5のいずれか一項に記載の温調ユニット。 The temperature control unit according to any one of claims 1 to 5, wherein the base material includes metal, glass, or ceramic.
  7.  伝熱部を基材に取り付けるための接合部材であって、
     1次粒径が100nmよりも小さい複数の金属粒子と、金属溶融体とから構成され、
     前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.5~0.9の範囲内の大きさである、接合部材。
    A joining member for attaching a heat transfer part to a base material,
    Consisting of a plurality of metal particles with a primary particle size of less than 100 nm and a metal melt,
    A joining member, wherein the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in a cross section of the joining member is within the range of 0.5 to 0.9.
  8.  前記接合部材の断面において前記接合部材が占める割合に対する前記金属粒子が占める面積の割合が0.55~0.85の範囲内の大きさである、請求項7記載の接合部材。 The joining member according to claim 7, wherein the ratio of the area occupied by the metal particles to the ratio occupied by the joining member in the cross section of the joining member is within the range of 0.55 to 0.85.
PCT/JP2023/006181 2022-03-31 2023-02-21 Temperature adjustment unit and bonding member WO2023189017A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017007011A1 (en) * 2015-07-09 2017-01-12 古河電気工業株式会社 Metal fine particle-containing composition
WO2021241643A1 (en) * 2020-05-29 2021-12-02 株式会社巴川製紙所 Temperature adjustment unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017007011A1 (en) * 2015-07-09 2017-01-12 古河電気工業株式会社 Metal fine particle-containing composition
WO2021241643A1 (en) * 2020-05-29 2021-12-02 株式会社巴川製紙所 Temperature adjustment unit

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