WO2023184725A1 - 印制电路板及其制备方法 - Google Patents

印制电路板及其制备方法 Download PDF

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Publication number
WO2023184725A1
WO2023184725A1 PCT/CN2022/099824 CN2022099824W WO2023184725A1 WO 2023184725 A1 WO2023184725 A1 WO 2023184725A1 CN 2022099824 W CN2022099824 W CN 2022099824W WO 2023184725 A1 WO2023184725 A1 WO 2023184725A1
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WIPO (PCT)
Prior art keywords
board
ordinary
core
frequency
printed circuit
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PCT/CN2022/099824
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English (en)
French (fr)
Inventor
陈硕千
陶晓辉
陈霞元
宋祥群
Original Assignee
生益电子股份有限公司
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Publication of WO2023184725A1 publication Critical patent/WO2023184725A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present application relates to the technical field of printed circuit boards, such as a printed circuit board and its preparation method.
  • PCB Printed Circuit Boards
  • FIG 1 is a schematic structural diagram of a mixed-pressure printed circuit board in the related art.
  • the printed circuit board is subjected to the force F1 of the upper surface steel plate and the lower surface steel plate.
  • the force F2 the force on the upper surface of the ROGERS part of the high-frequency board is FA1
  • the force on the upper surface of the FR4 core board is FB1
  • the L3/L4 ordinary FR4 core board it is affected by the ROGERS sub-board and the L3/L4 ordinary FR4 core board.
  • downward force and at the same time, it is subject to the upward force F3 of the L5/L6 core plate. Since the ROGERS sub-plate is a whole, and the L3/L4 core plate is still isolated from the upper surface steel plate by the L2/L3 layer PP, so FR4 The descending height of the core board is lower than the ROGERS sub-board.
  • the colloid flow directions are S1, S2, S3, S4 and S5.
  • the amount of colloid pushed into the board at the position of the ROGERS sub-plate is slightly greater than the amount of glue pushed out from the L3/L4 core plate.
  • the force between the two causes The flow of glue gradually gathers at the intersection line (position of dotted line box).
  • the colloid gathers and pushes upward, causing the L3/L4 ordinary FR4 core board to deviate upward and simultaneously present a pushing force to the outside of the board, causing the L3/L4 ordinary FR4 core board to deflect; when subjected to the L3/L4 ordinary FR4 core board, Under the oblique upward force of the FR4 core board, the PP between the L2/L3 layers flows out, causing all the molten colloid to flow away, resulting in a short circuit between the L1/L2 ordinary FR4 core board and the L2/L4 ordinary FR4 core board.
  • the present application provides a printed circuit board and a preparation method thereof to solve the problem of uneven stress on the printed circuit board during the lamination process, causing deviation of the core board and short circuit between the core boards.
  • a printed circuit board which includes: at least three ordinary FR4 core boards and high-frequency boards;
  • the high-frequency board and the stack of at least two ordinary FR4 core boards are located on the same layer in the horizontal direction, the high-frequency board and the first ordinary FR4 core board are arranged adjacent to each other in the vertical direction, and the high-frequency board is on
  • the orthographic projection of the printed circuit board covers the part of the first ordinary FR4 core board on the orthographic projection of the printed circuit board, and the ordinary FR4 core board located on the same layer as the high-frequency board is on the printed circuit board.
  • the front projection of the circuit board covers the remaining portion of the first common FR4 core board in the front projection of the printed circuit board;
  • the adhesive layer between the high-frequency board and the first ordinary FR4 core board is provided with a first through groove.
  • the high-frequency board is located on the first ordinary FR4 core board
  • the sum of the thicknesses of at least two ordinary FR4 core boards above the high-frequency board and the first ordinary FR4 core board is equal and they are located on the same layer;
  • the high-frequency board is located under the first ordinary FR4 core board;
  • the sum of the thicknesses of at least two ordinary FR4 core boards below the high-frequency board and the first ordinary FR4 core board is equal and they are located on the same layer.
  • the bonding layer between the ordinary FR4 core boards located on the same layer as the high-frequency board is provided with at least one second through-slot, and the second through-slot is connected to the ordinary FR4 core board located on the same layer as the high-frequency board.
  • the distance between the dividing lines of the FR4 core board is greater than or equal to the preset distance.
  • At least two layers of adhesive layers are provided between the high-frequency board and the first ordinary FR4 core board;
  • the first through-slot is located in an adhesive layer adjacent to the first common FR4 core board in the bonding layer between the high-frequency board and the first common FR4 core board.
  • an adhesive layer is provided between the ordinary FR4 core boards located on the same layer as the high-frequency boards.
  • the first through-slot is arranged symmetrically with respect to the dividing line between the high-frequency board and the ordinary FR4 core board located on the same layer.
  • the printed circuit board is provided with at least two positioning holes, the depth of the positioning holes is equal to the ordinary FR4 core board located on the same layer as the high-frequency board and the high-frequency board and the first The thickness of the partial bonding layer between ordinary FR4 core boards;
  • the printed circuit board also includes a fixing structure, the fixing structure includes at least two positioning rivets, the positioning rivets are arranged in one-to-one correspondence with the positioning holes, and the positioning rivets are located in the positioning holes.
  • the printed circuit board further includes pin holes and pins, the pins and the pin holes are arranged in one-to-one correspondence, and the depth of the pin holes is equal to the thickness of the printed circuit board; One end is located on the surface of the printed circuit board, the other end of the pin is located in the pin hole, and the pin is configured to fix the printed circuit board.
  • a method for preparing a printed circuit board includes:
  • a first through-groove is prepared in the bonding layer between the high-frequency board and the first common FR4 core board, wherein the high-frequency board and the first common FR4 core board are arranged adjacent to each other in the vertical direction;
  • the at least three ordinary FR4 core boards and the high-frequency board are pressed together, wherein the high-frequency board and the lamination of the at least two ordinary FR4 core boards are located on the same layer in the horizontal direction, and the high-frequency board is on the same layer.
  • the front projection of the printed circuit board covers the first ordinary FR4 core board on the front projection of the printed circuit board, and the ordinary FR4 core board located on the same layer as the high-frequency board is on the printed circuit board.
  • the orthographic projection covers the first common FR4 core board over the remainder of the orthographic projection of the PCB.
  • laminating the at least three ordinary FR4 core boards and high-frequency boards includes:
  • the high-frequency board, the ordinary FR4 core board located on the same layer as the high-frequency board and at least one adhesive layer are fixed through a fixed structure, wherein the ordinary FR4 core board located on the same layer as the high-frequency board is provided There are at least two positioning holes.
  • the depth of the positioning holes is equal to the thickness of the ordinary FR4 core board located on the same layer as the high-frequency board and at least one adhesive layer.
  • the fixing structure includes at least two positioning rivets. The positioning rivets are arranged in one-to-one correspondence with the positioning holes, and the positioning rivets are located in the positioning holes;
  • the at least three ordinary FR4 core boards and the high-frequency board are pressed together, wherein the first ordinary FR4 core board is located on the side of the high-frequency board on which the adhesive layer is fixed, and the high-frequency board and the third There are at least two layers of adhesive layers between an ordinary FR4 core board, and the first through-slot is located in the adhesive layer between the high-frequency board and the first ordinary FR4 core board, adjacent to the first ordinary FR4 core board. In the adhesive layer of FR4 core board.
  • preparing at least three ordinary FR4 core boards includes:
  • At least one second through-slot is formed in the bonding layer between the common FR4 core board located on the same layer as the high-frequency board, wherein the second through-slot and the high-frequency board are located on the same layer as the common FR4 core board.
  • the distance between the dividing lines of the FR4 core board is greater than or equal to the preset distance;
  • a first ordinary FR4 core board is prepared, wherein the high frequency board and the first ordinary FR4 core board are arranged adjacent to each other in the vertical direction, and the high frequency board covers the first ordinary FR4 core board in the orthographic projection of the printed circuit board.
  • An ordinary FR4 core board is in the orthographic projection of the printed circuit board, and an ordinary FR4 core board located on the same layer as the high-frequency board covers the first ordinary FR4 core in the orthographic projection of the printed circuit board. The rest of the board is in the orthographic projection of the PCB.
  • a first through-groove is provided in the adhesive layer between the ROGERS high-frequency board and the first ordinary FR4 core board arranged adjacent to the high-frequency board, so that during the lamination process of the printed circuit board, the colloid When flowing, it can flow to the first channel, which reduces the aggregation of colloids and can reduce the upward pushing force of the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding the common FR4 core board located on the same layer as the high-frequency board.
  • the offset of the core board makes the stress of the ordinary FR4 core board located on the same layer as the high-frequency board reach a balanced state, reducing the colloid loss between the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding contact with the high-frequency board.
  • Ordinary FR4 core boards on the same layer are short-circuited.
  • Figure 1 is a schematic structural diagram of a hybrid printed circuit board in the related art
  • Figure 2 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present application.
  • Figure 3 is a schematic structural diagram of another printed circuit board provided by an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of yet another printed circuit board provided by an embodiment of the present application.
  • Figure 5 is a top view of the PP between the L2/L3 layers in Figure 4;
  • Figure 6 is a schematic structural diagram of another printed circuit board provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of yet another printed circuit board provided by an embodiment of the present application.
  • Figure 8 is a flow chart of a printed circuit board preparation method provided by an embodiment of the present application.
  • Figure 9 is a flow chart of another printed circuit board preparation method provided by an embodiment of the present application.
  • Figure 10 is a flow chart of yet another printed circuit board preparation method provided by an embodiment of the present application.
  • 11 to 20 are structural schematic diagrams corresponding to each step of the printed circuit board preparation method provided by the embodiment of the present application.
  • the embodiment of the present application provides a printed circuit board, which includes: at least three ordinary FR4 core boards and a high-frequency board; the lamination of the high-frequency board and at least two ordinary FR4 core boards is located in the horizontal direction On the same layer, the high-frequency board and the first ordinary FR4 core board are arranged adjacent to each other in the vertical direction, and the orthographic projection of the high-frequency board on the printed circuit board covers the orthographic projection of the first ordinary FR4 core board on the printed circuit board.
  • the orthographic projection of the ordinary FR4 core board on the printed circuit board on the same layer as the high-frequency board covers the rest of the orthographic projection of the first ordinary FR4 core board on the printed circuit board; the high-frequency board and the first ordinary FR4 core board
  • the adhesive layer between them is provided with a first through groove.
  • the data transmission frequency of the ordinary FR4 core board is lower than the data transmission frequency of the high-frequency board.
  • the ordinary FR4 core board on the same layer as the high-frequency board is pushed upward, and during the melting process of the adhesive layer between the ordinary FR4 core boards, the colloid will move toward the high-frequency board. It gathers at the dividing line with the ordinary FR4 core board on the same layer as the high-frequency board, and the colloid flows, pushing the ordinary FR4 core board on the same layer as the high-frequency board to deflect.
  • the colloid By arranging a first through-slot in the adhesive layer between the high-frequency board and the first ordinary FR4 core board, the colloid can flow to the first through-slot during the lamination process of the printed circuit board, thereby reducing the risk of colloid
  • the aggregation can reduce the upward pushing force of the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding the deviation of the ordinary FR4 core board, allowing the stress of the ordinary FR4 core board to reach a balanced state, and reducing colloid loss. This can prevent the colloid from flowing out between ordinary FR4 core boards located on the same layer as the high-frequency board, and avoid short circuits between ordinary FR4 core boards located on the same layer as the high-frequency board.
  • Figure 2 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present application.
  • the printed circuit board includes a high-frequency board 101, an L1/L2 ordinary FR4 core board, an L3/L4 ordinary FR4 core board and L5/L6 ordinary FR4 core board, the first ordinary FR4 core board is L5/L6 ordinary FR4 core board; high frequency board is ROGERS high frequency board, high frequency board 101 and L1/L2 ordinary FR4 core board It is located on the same layer as the L3/L4 ordinary FR4 core board.
  • the front projection of the high-frequency board 101 on the printed circuit board covers the front projection of the L5/L6 ordinary FR4 core board on the printed circuit board.
  • the front projection of the L3/L4 ordinary FR4 core board on the printed circuit board covers the rest of the front projection of the L5/L6 ordinary FR4 core board on the printed circuit board.
  • the adhesive layer 102 between the high-frequency board 101 and the L5/L6 ordinary FR4 core board is provided with a first through groove 103, so that during the lamination process of the printed circuit board, the adhesive layer 102, such as the colloid in PP, can flow.
  • the flow to the first channel 103 reduces the aggregation of colloid, which can reduce its upward pushing force on the L3/L4 ordinary FR4 core board, thereby preventing the L3/L4 ordinary FR4 core board from deflecting, making the L3/L4 ordinary FR4 core board
  • the stress of the board reaches a balanced state, reducing the colloid loss in the PP between the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board, thereby avoiding the L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4
  • the colloid flows out between the core boards to avoid short circuit of L1/L2 ordinary FR4 core boards and L3/L4 ordinary FR4 core boards.
  • Figure 2 only shows the situation where the printed circuit board includes three ordinary FR4 core boards.
  • the position of the first through slot 103 should avoid circuits and holes to ensure that the printed circuit board can be used normally.
  • a first through-slot is provided in the adhesive layer between the ROGERS high-frequency board and the first common FR4 core board adjacent to the high-frequency board, so that the colloid flows during the lamination process of the printed circuit board. It can flow to the first channel, which reduces the aggregation of colloids and reduces the upward pushing force of the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding the common FR4 core board located on the same layer as the high-frequency board.
  • the board offset allows the stress of the ordinary FR4 core board located on the same layer as the high-frequency board to reach a balanced state, reducing the colloid loss between the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding contact with the high-frequency board.
  • Ordinary FR4 core boards located on the same layer are short-circuited.
  • the high-frequency board is located on the first ordinary FR4 core board; the sum of the thicknesses of the high-frequency board and at least two ordinary FR4 core boards on the first ordinary FR4 core board is equal and are located on the same layer;
  • the high-frequency board is located under the first ordinary FR4 core board; the sum of the thicknesses of the high-frequency board and at least two ordinary FR4 core boards under the first ordinary FR4 core board is equal and they are located on the same layer.
  • the high-frequency board may be located above or below the first common FR4 core board.
  • the actual position relationship may be determined according to actual conditions.
  • the first common FR4 core board is the L5/L6 common FR4 core board.
  • the high frequency board 101 is located on the L5/L6 common FR4 core board.
  • the high frequency board 101 and the L5/L6 common FR4 core board The sum of the thicknesses of the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board on the board is equal, and the high-frequency board 101 is located on the same layer as the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board.
  • Figure 3 is a schematic structural diagram of another printed circuit board provided by an embodiment of the present application.
  • the first ordinary FR4 core board is an L1/L2 ordinary FR4 core board
  • the high-frequency board 101 is located at the L1/L2 ordinary FR4 core board.
  • the sum of the thicknesses of the high frequency board and the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board under the L1/L2 ordinary FR4 core board is equal, and the high frequency board 101 and L3/L4 Ordinary FR4 core boards and L5/L6 ordinary FR4 core boards are located on the same layer.
  • the bonding layer between the ordinary FR4 core board located on the same layer as the high-frequency board is provided with at least one second through-slot, and the second through-slot is the dividing line between the high-frequency board and the ordinary FR4 core board located on the same layer.
  • the distance is greater than or equal to the preset distance.
  • Figure 4 is a schematic structural diagram of another printed circuit board provided by the embodiment of the present application.
  • the high-frequency board 101 is located at the same location as the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board.
  • layer, the bonding layer PP between the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board is provided with at least one second through slot 104, the high frequency board 101 and the L1/L2 ordinary FR4 core board and L3/L4
  • the dividing line between ordinary FR4 core boards is H1.
  • the distance between the second through-slot 104 and the dividing line H1 is greater than or equal to the preset distance.
  • the preset distance is, for example, 5mm.
  • the length of the second through-slot 104 is, for example, 5mm.
  • the width is, for example, 2 mm.
  • Figure 5 is a top view of the L2/L3 interlayer PP in Figure 4.
  • the second through grooves 104 are, for example, a row of second through grooves 104.
  • the spacing between adjacent second through grooves 104 For example, it is 5mm.
  • a flow space can be provided for the colloid of PP between the L2/L3 layers, thereby avoiding the deviation of the ordinary FR4 core board of L3/L4.
  • the second through-slots 104 may or may not be on the same straight line, which can be determined according to the actual situation.
  • At least two bonding layers are provided between the high-frequency board and the first common FR4 core board; the first through-slot is located in the bonding layer between the high-frequency board and the first common FR4 core board, adjacent to the first In the adhesive layer of ordinary FR4 core board.
  • the first common FR4 core board is an L5/L6 common FR4 core board, and a first adhesive layer 1021 and a second adhesive layer are provided between the high frequency board 101 and the L5/L6 common FR4 core board.
  • the junction layer 1022 and the first slot 103 are located in the first adhesive layer 1021 adjacent to the L5/L6 ordinary FR4 core board, which can ensure the support of the high-frequency board 101 and prevent the high-frequency board 101 from losing balance.
  • the first adhesive layer 1021 is PP
  • the second adhesive layer 1022 is PP.
  • an adhesive layer is provided between the ordinary FR4 core boards located on the same layer as the high-frequency boards.
  • the thickness of the high-frequency board 101 is the same as that of the ordinary FR4 core board located on the same layer, so in order to match the thickness of the high-frequency board 101, it is placed between the ordinary FR4 core board located on the same layer as the high-frequency board 101.
  • the number of bonding layers between ordinary FR4 core boards located on the same layer as the high-frequency board can also be other layers, which can be determined according to the thickness of the high-frequency board.
  • the first through-slot is arranged symmetrically with respect to the dividing line between the high-frequency board and the ordinary FR4 core board located on the same layer.
  • the first through-slot 103 is symmetrically arranged with respect to the dividing line H1 between the high-frequency board 101 and its ordinary FR4 core board located on the same layer, so that during the lamination process of the printed circuit board, the colloid can flow in the direction Evenly distributed on the surface of the L5/L6 ordinary FR4 core board, which reduces the aggregation of colloids and can reduce the upward pushing force on the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding being located on the same layer as the high-frequency board.
  • the offset of the ordinary FR4 core board makes the stress of the ordinary FR4 core board located on the same layer as the high-frequency board reach a balanced state, reducing the colloid loss between the ordinary FR4 core board located on the same layer as the high-frequency board, thereby avoiding The ordinary FR4 core board located on the same layer as the high-frequency board is short-circuited.
  • Figure 4 only shows the situation where the printed circuit board includes five ordinary FR4 core boards.
  • Figure 6 is a schematic structural diagram of another printed circuit board provided by an embodiment of the present application.
  • the printed circuit board is provided with at least two positioning holes, and the depth of the positioning holes is equal to the height.
  • the frequency board 101 is located on the same layer as the ordinary FR4 core board and the thickness of the partial adhesive layer 1022 between the high frequency board and the first ordinary FR4 core board;
  • the printed circuit board also includes a fixing structure, and the fixing structure includes at least two positioning rivets 107.
  • the positioning rivets 107 are arranged in one-to-one correspondence with the positioning holes, and the positioning rivets 107 are located in the positioning holes.
  • the printed circuit board includes positioning holes.
  • Two positioning holes 1061 can be provided at the intersection between the ordinary FR4 core board and the high-frequency board 101.
  • the distance between the positioning holes 1061 and the dividing line is, for example, 6 mm.
  • Two positioning holes 1062 are provided on the edge of an ordinary FR4 core board.
  • the center distance between the additional positioning hole 1061 and the original positioning hole 1060 is greater than 6 mm, and the center distance between the additional positioning hole 1062 and the original positioning hole 1060 is greater than 6 mm.
  • a case including four positioning holes is shown in Figure 5 .
  • the positioning hole 1061 is, for example, on a straight line with the original positioning hole 1060
  • the positioning hole 1062 is, for example, on a straight line with the original positioning hole 1060 .
  • the printed circuit board includes a fixed structure 107.
  • the fixed structure 107 includes a positioning rivet 1071 and a positioning rivet 1072.
  • the positioning rivet 1071 is arranged corresponding to the positioning hole 1061.
  • the positioning rivet 1072 is arranged corresponding to the positioning hole 1062.
  • the positioning rivet 1071 and the positioning rivet 1071 are arranged correspondingly.
  • the rivets 1072 fix the high-frequency board 101 and the partial adhesive layer 1022 of the L1/L2 ordinary FR4 core board, the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board located on the same layer as the high-frequency board 101, for example, PP. , to prevent the ordinary FR4 core board located on the same layer as the high-frequency board 101 from deflecting when it is pushed upward, thereby avoiding the deflection and short circuit of the ordinary FR4 core board and reducing colloid loss.
  • Figure 7 is a schematic structural diagram of yet another printed circuit board provided by an embodiment of the present application.
  • the printed circuit board also includes pin holes 1081 and pins 1082, and pins 1082 and pin holes 1081.
  • the depth of the pin hole 1081 is equal to the thickness of the printed circuit board, and it is a through hole; one end of the pin 1082 is located on the surface of the printed circuit board, and the other end of the pin 1082 is located in the pin hole 1081, and the pin is set to The printed circuit board is fixed.
  • the pin 1082 is, for example, an unbloomed pin. When arranging the printed circuit board, the pin 1082 is placed in the pin hole 1081 .
  • the height of unbloomed pins should be ⁇ designed thickness after pressing The thickness after pressing is too thin, otherwise local pressure loss will occur.
  • the pin hole 1081 has a diameter of approximately 6.0 mm. It should be noted that the orthographic projection of the pin hole 1081 on the printed circuit board and the orthographic projection of the high-frequency board 101 on the printed circuit board do not overlap, so as to prevent the pin hole 1081 and the pin 1082 from affecting the electrical performance of the high-frequency board 101.
  • the pin hole 1081 penetrates the printed circuit board.
  • the pin 1082 is located in the pin hole 1081 to fix all layers of the printed circuit board to ensure that there is no gap between ordinary FR4 core boards. Relative movement occurs, and after the pressing is completed, the pin 1082 can be removed or retained.
  • the printed circuit board also includes a plurality of rivets 1083.
  • the rivets 1083 are arranged in one-to-one correspondence with the original positioning holes 1060.
  • the multiple rivets 1083 can fix the high-frequency board 101 and all ordinary FR4 core boards. , to facilitate lamination of printed circuit boards.
  • Figure 8 is a flow chart of a method for preparing a printed circuit board provided by an embodiment of the present application.
  • Figures 11-20 are schematic structural diagrams corresponding to each step of the method of preparing a printed circuit board provided by an embodiment of the present application. See Figure 8.
  • the preparation method of printed circuit boards includes:
  • S210 provides high frequency board.
  • a high-frequency board 101 is provided.
  • the high-frequency board 101 can transmit data quickly.
  • the high-frequency board 101 is, for example, a ROGERS high-frequency board.
  • the high-frequency board 101 can also be of other types. high frequency board.
  • Ordinary FR4 core boards include FR4 copper-clad laminates composed of glass cloth, epoxy resin and copper foil. The size of ordinary FR4 core boards can be determined according to the actual situation.
  • Figure 13 is a top view of the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board in Figure 12.
  • the high-frequency board 101 is located at the same location as the L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4 core board. layer, the high-frequency board 101 is shown in Figure 13 to illustrate the positional relationship between the high-frequency board and the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board.
  • the bonding layer between the high-frequency board 101 and the first common FR4 core board is close to the bonding layer 1021 of the first common FR4 core board, such as PP to prepare the first through groove 103, so that the printed During the lamination process of the circuit board, the colloid in the PP can flow to the first through groove 103, which reduces the aggregation of the colloid and reduces the upward pushing force on the L3/L4 ordinary FR4 core board, thereby avoiding the L3/L4 ordinary FR4 core board.
  • the offset of the L4 ordinary FR4 core board makes the stress of the L3/L4 ordinary FR4 core board reach a balanced state, reducing the colloid loss in the PP between the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board. It can prevent colloid from flowing out between L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4 core board, and avoid short circuit between L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4 core board.
  • the adhesive layer will be slightly solidified by heat around the cutting position of the milling cutter during processing, so it is not allowed to use controlled depth milling on the same adhesive layer.
  • the high-frequency board and at least two ordinary FR4 core boards are on the same layer in the horizontal direction, and the high-frequency board is on the front side of the printed circuit board.
  • the projection covers the front projection of the first common FR4 core board on the printed circuit board.
  • the front projection of the common FR4 core board on the same layer as the high-frequency board covers the front projection of the first common FR4 core board on the printed circuit board. The rest of the plate's orthographic projection.
  • the first core board is an L5/L6 ordinary FR4 core board. Place the high-frequency board 101 on the same layer as the L1/L2 ordinary FR4 core board and the L3/L4 ordinary FR4 core board. Place the high-frequency board 101 on the same layer. 101 is placed on the L5/L6 ordinary FR4 core board, and the L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4 core board are placed on the L5/L6 ordinary FR4 core board.
  • the high frequency board 101 and L1/L2 Ordinary FR4 core boards and L3/L4 ordinary FR4 core boards are placed adjacent to each other, and the high frequency board 101, L1/L2 ordinary FR4 core board, L3/L4 ordinary FR4 core board and L5/L6 ordinary FR4 core board are pressed together.
  • Figure 9 is a flow chart of another method for preparing a printed circuit board provided by an embodiment of the present application. This embodiment is a modification of S240 in the above embodiment.
  • Figure 9 for a method of preparing a printed circuit board include:
  • S310 provides high frequency board.
  • a high frequency board 101 is provided.
  • prepare at least three ordinary FR4 core boards for example, prepare L1/L2 ordinary FR4 core boards, L3/L4 ordinary FR4 core boards and L5/L6 ordinary FR4 core boards.
  • the bonding layer 102 between the high frequency board 101 and the first common FR4 core board prepares a first through groove 103 close to the PP of the first common FR4 core board.
  • the fixing structure includes at least two positioning rivets.
  • the positioning rivets and positioning holes are set in one-to-one correspondence. Positioning The rivet is located in the pilot hole.
  • the printed circuit board includes positioning holes.
  • Two positioning holes 1061 can be provided at the intersection between the ordinary FR4 core board and the high-frequency board 101.
  • the distance between the positioning holes 1061 and the dividing line is, for example, 6 mm.
  • Two positioning holes 1062 are provided on the edge of an ordinary FR4 core board.
  • the center distance between the additional positioning hole 1061 and the original positioning hole 1060 is greater than 6 mm, and the center distance between the additional positioning hole 1062 and the original positioning hole 1060 is greater than 6 mm.
  • the original positioning hole 1060 can be drilled using a 3.2mm-4.0mm tool diameter, and can be processed according to the actual situation.
  • the fixing structure 107 includes a positioning rivet 1071 and a positioning rivet 1072.
  • the positioning rivet 1071 is provided correspondingly to the positioning hole 1061.
  • the positioning rivet 1072 is provided correspondingly to the positioning hole 1062.
  • the positioning rivet 1071 and the positioning rivet 1072 connect the high frequency board 101 and the The high-frequency board 101 is located on the same layer as the L1/L2 ordinary FR4 core board, the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board.
  • the ordinary FR4 core board of the first layer is deflected when it is pushed upward, thereby avoiding the deflection and short circuit of the ordinary FR4 core board and reducing colloid loss.
  • Laminate at least three ordinary FR4 core boards and high-frequency boards.
  • the first ordinary FR4 core board is located on the side of the high-frequency board with the adhesive layer fixed, and is set between the high-frequency board and the first ordinary FR4 core board.
  • a first adhesive layer 1021 and a second adhesive layer 1022 are provided between the high-frequency board and the first ordinary FR4 core board.
  • the first adhesive layer 1021 is an adhesive layer adjacent to the first ordinary FR4 core board.
  • the second adhesive layer 1022 is an adhesive layer adjacent to the high-frequency board 101 .
  • Figure 16 is a top view of the PP adjacent to L4 between the L4/L5 layers in Figure 18. Referring to Figure 16, the high-frequency board 101 covers part of the second adhesive layer 1022.
  • the second adhesive layer 1022 is provided with positioning holes 1061 and positioning holes.
  • the hole 1062 is convenient for fixing the high-frequency board 101 and part of the adhesive layer 1022 of the L1/L2 ordinary FR4 core board, the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board located on the same layer as the high-frequency board 101.
  • the second adhesive layer 1022 also includes a plurality of original positioning holes 1060, which can facilitate the fixation of all ordinary FR4 core boards during lamination.
  • the second adhesive layer 1022 also includes pin holes 1081, which facilitates the fixation of all ordinary FR4 core boards during lamination. Fix all common FR4 core boards and high frequency boards 101.
  • Figure 17 is a top view of the PP adjacent to L5 between the L4/L5 layers in Figure 18.
  • the first adhesive layer 1021 also includes a plurality of original positioning holes 1060, which can facilitate the fixation of all ordinary FR4 cores during lamination. board, the first adhesive layer 1021 also includes pin holes 1081, which facilitates the fixation of all ordinary FR4 core boards and high-frequency boards 101 during lamination.
  • the high-frequency board 101, the L1/L2 ordinary FR4 core board, the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board located on the same layer as the high-frequency board 101 to ensure high
  • the good alignment of frequency board 101 and the L1/L2 ordinary FR4 core board, L3/L4 ordinary FR4 core board and L5/L6 ordinary FR4 core board located on the same layer as the high frequency board 101 enables better fixation of the high frequency board and At least three ordinary FR4 core boards.
  • a first adhesive layer 1021 and a second adhesive layer 1022 are provided between the high-frequency board 101 and the L5/L6 ordinary FR4 core board.
  • the first through-slot 103 is located adjacent to the first adhesive layer of the L5/L6 ordinary FR4 core board.
  • the support for the high-frequency board 101 can be guaranteed to prevent the high-frequency board 101 from losing balance.
  • the first adhesive layer 1021 is PP
  • the second adhesive layer 1022 is PP.
  • Figure 10 is a flow chart of yet another printed circuit board preparation method provided by an embodiment of the present application. This embodiment is a modification of S220 in the above embodiment.
  • Figure 10 for a printed circuit board preparation method include:
  • S410 provides high frequency board.
  • a high frequency board 101 is provided.
  • S420 Form at least one second through-groove in the bonding layer between the ordinary FR4 core board located on the same layer as the high-frequency board, wherein the second through-groove is connected to the high-frequency board and the ordinary FR4 core board located on the same layer.
  • the distance of the dividing line is greater than or equal to the preset distance.
  • At least one second through groove 104 is formed in the bonding layer 105 between the ordinary FR4 core boards located on the same layer as the high frequency board 101.
  • the PP colloid between the L2/L3 layers can flow into the second through groove 104, preventing the L3/L4 ordinary FR4 core board from being squeezed to a smaller position and deflecting, thereby preventing the colloid from being completely flow away, resulting in short circuit between L1/L2 ordinary FR4 core board and L3/L4 ordinary FR4 core board.
  • the second through grooves 104 are, for example, a row of second through grooves 104.
  • the distance between adjacent second through grooves 104 is, for example, 5 mm.
  • the colloid of PP between the L3 layers provides flow space and avoids the deviation of the L3/L4 ordinary FR4 core board.
  • the second through-slots 104 may or may not be on the same straight line, which can be determined according to the actual situation.
  • a first common FR4 core board such as an L5/L6 common FR4 core board.
  • L5/L6 ordinary FR4 core boards L7/L8 ordinary FR4 core boards and L9/L10 ordinary FR4 core boards can also be prepared.
  • the number of ordinary FR4 core boards can be determined according to the actual situation.
  • a first through-groove 103 is prepared in the bonding layer 102 between the high-frequency board 101 and the L5/L6 common FR4 core board close to the first bonding layer 1021 of the L5/L6 common FR4 core board.
  • the fixing structure includes at least two positioning rivets.
  • the positioning rivets and positioning holes are set in one-to-one correspondence. Positioning The rivet is located in the pilot hole.
  • the high-frequency board 101 and the core board on the same layer as the high-frequency board 101 and at least one adhesive layer 1022 are fixed through the fixing structure 107 , such as PP.
  • Laminate at least three ordinary FR4 core boards and high-frequency boards.
  • the first ordinary FR4 core board is located on the side of the high-frequency board with an adhesive layer fixed on it. There is an adhesive layer between the high-frequency board and the first ordinary FR4 core board.
  • the high frequency board 101, the L1/L2 ordinary FR4 core board, the L3/L4 ordinary FR4 core board and the L5/L6 ordinary FR4 core board located on the same layer as the high frequency board 101 are pressed together.
  • all layers of the printed circuit board can be fixed by placing the pin 1082 in the pin hole 1081 before lamination to ensure that there will be no relative movement between ordinary FR4 core boards.
  • the pins can be removed 1082, pin 1082 can also be retained.
  • the depth of the pin hole 1081 is equal to the thickness of the printed circuit board, which is a through hole; one end of the pin 1082 is located on the surface of the printed circuit board, and the other end of the pin 1082 is located in the pin hole 1081, and the pin is configured to conduct the printing on the printed circuit board. fixed.
  • the pin 1082 is, for example, an unbloomed pin. When arranging the printed circuit board, the pin 1082 is placed in the pin hole 1081 .
  • the height of unbloomed pins should be ⁇ designed thickness after pressing The thickness after pressing is too thin, otherwise local pressure loss will occur.
  • the pin hole 1081 has a diameter of approximately 6.0 mm. It should be noted that the orthographic projection of the pin hole 1081 on the printed circuit board and the orthographic projection of the high-frequency board 101 on the printed circuit board do not overlap, so as to prevent the pin hole 1081 and the pin 1082 from affecting the electrical performance of the high-frequency board 101.
  • the printed circuit board also includes a plurality of rivets 1083.
  • the rivets 1083 are arranged in one-to-one correspondence with the original positioning holes 1060.
  • the multiple rivets 1083 can fix the high-frequency board 101 and all ordinary FR4 core boards.
  • the portion of the positioning rivets 1071 , rivets 1083 , and pins 1082 of the fixing structure 107 located on the surface of the side of the printed circuit board where the high-frequency board 101 is disposed is the rivet cap surface.
  • the part of the rivet 1083 located on the side surface of the printed circuit board away from the high-frequency board 101 is the rivet blooming surface.
  • the part of the positioning rivet 1071 of the fixing structure 107 located on the surface of the second adhesive layer 1022 is the rivet flower surface.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本申请公开了一种印制电路板及其制备方法。印制电路板包括至少三张普通FR4芯板和高频板；高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，高频板和第一普通FR4芯板在竖直方向相邻设置，且高频板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的部分，与高频板位于同层的普通FR4芯板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的其余部分；高频板和第一普通FR4芯板之间的粘结层设置有第一通槽。

Description

印制电路板及其制备方法
本申请要求在2022年03月30日提交中国专利局、申请号为202210334127.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及印制电路板技术领域，例如一种印制电路板及其制备方法。
背景技术
在印制电路板(Printed Circuit Boards，PCB)产品中，由于局部存在高频及高散热要求，综合整体成本，形成局部混压埋子板设计。
图1为相关技术中混压印制电路板的结构示意图，如图1所示，在混压印制电路板的压合过程中，印制电路板受到上表面钢板作用力F1和下表面钢板作用力F2，高频板ROGERS部位上表面作用力为FA1，FR4芯板部位上表面作用力为FB1，L4/L5层间PP在熔融过程中，受到ROGERS子板、L3/L4普通FR4芯板向下的作用力，且同时受到L5/L6芯板向上的作用力F3，由于ROGERS子板为一个整体，而L3/L4芯板与上表面钢板位置仍然有L2/L3层PP隔离，因此FR4芯板下降高度低于ROGERS子板。
从流胶分析，胶体流动方向为S1、S2、S3、S4和S5，ROGERS子板位置胶体向板中推出量稍大于L3/L4芯板向板中推出的流胶量，两者作用力导致的流胶逐渐在交接线位置聚集(虚线框位置)。此时，胶体聚集后向上方反推，从而导致L3/L4普通FR4芯板向上偏位时同步呈现向板子外的推动力，造成L3/L4普通FR4芯板偏移；在受到L3/L4普通FR4芯板斜向上的作用力下，L2/L3层间PP向外流出，造成熔融状态的胶体全部流走，导致L1/L2普通FR4芯板和L2/L4普通FR4芯板短接。
发明内容
本申请提供了一种印制电路板及其制备方法，以解决印制电路板在压合过程中受力不均，造成芯板偏移和芯板之间短接的问题。
根据本申请的一方面，提供了一种印制电路板，该印制电路板包括：至少三张普通FR4芯板和高频板；
所述高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，所述高 频板和第一普通FR4芯板在竖直方向相邻设置，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分；
所述高频板和所述第一普通FR4芯板之间的粘结层设置有第一通槽。
可选地，所述高频板位于所述第一普通FR4芯板之上；
所述高频板和所述第一普通FR4芯板之上的至少两张普通FR4芯板的厚度之和相等，且位于同一层；
或者，所述高频板位于所述第一普通FR4芯板之下；
所述高频板和所述第一普通FR4芯板之下的至少两张普通FR4芯板的厚度之和相等，且位于同一层。
可选地，与所述高频板位于同层的普通FR4芯板之间的粘结层设置至少一个第二通槽，所述第二通槽与所述高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离。
可选地，所述高频板和所述第一普通FR4芯板之间设置有至少两层粘结层；
所述第一通槽位于所述高频板和所述第一普通FR4芯板之间的粘结层中邻近所述第一普通FR4芯板的粘结层内。
可选地，与所述高频板位于同层的普通FR4芯板之间设置有一层粘结层。
可选地，所述第一通槽关于所述高频板与其位于同层的普通FR4芯板的分界线对称设置。
可选地，所述印制电路板设置有至少两个定位孔，所述定位孔的深度等于与所述高频板位于同层的普通FR4芯板以及所述高频板和所述第一普通FR4芯板之间的部分粘结层的厚度；
所述印制电路板还包括固定结构，所述固定结构包括至少两个定位铆钉，所述定位铆钉与所述定位孔一一对应设置，所述定位铆钉位于所述定位孔内。
可选地，所述印制电路板还包括销钉孔和销钉，所述销钉和所述销钉孔一一对应设置，所述销钉孔的深度等于所述印制电路板的厚度；所述销钉的一端位于所述印制电路板的表面，所述销钉的另一端位于所述销钉孔内,所述销钉被 设置为对所述印制电路板进行固定。
根据本申请的另一方面，提供了一种印制电路板的制备方法，该印制电路板的制备方法包括：
提供高频板；
制备至少三张普通FR4芯板；
在所述高频板和第一普通FR4芯板之间的粘结层制备第一通槽，其中，所述高频板和所述第一普通FR4芯板在竖直方向相邻设置；
压合所述至少三张普通FR4芯板和高频板，其中，所述高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分。
可选地，压合所述至少三张普通FR4芯板和高频板包括：
通过固定结构将所述高频板、与所述高频板位于同层的普通FR4芯板以及至少一层粘结层固定，其中，与所述高频板位于同层的普通FR4芯板设置有至少两个定位孔，所述定位孔的深度等于与所述高频板位于同层的普通FR4芯板以及至少一层粘结层的厚度，所述固定结构包括至少两个定位铆钉，所述定位铆钉与所述定位孔一一对应设置，所述定位铆钉位于所述定位孔内；
压合所述至少三张普通FR4芯板和高频板，其中，所述第一普通FR4芯板位于所述高频板固定有粘结层的一侧，所述高频板和所述第一普通FR4芯板之间设置有至少两层粘结层，所述第一通槽位于所述高频板和所述第一普通FR4芯板之间的粘结层中邻近所述第一普通FR4芯板的粘结层内。
可选地，制备至少三张普通FR4芯板包括：
在与所述高频板位于同层的普通FR4芯板之间的粘结层中形成至少一个第二通槽，其中，所述第二通槽与所述高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离；
制备第一普通FR4芯板，其中，所述高频板和第一普通FR4芯板在竖直方向相邻设置，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4 芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分。
本申请实施例通过在ROGERS高频板和与高频板相邻设置的第一普通FR4芯板之间的粘结层设置有第一通槽，使得印制电路板在压合过程中，胶体流动时可以流向第一通槽，减小了胶体的聚集，可以减小与高频板位于同层的普通FR4芯板受到的向上的推动力，从而避免与高频板位于同层的普通FR4芯板偏移，使得与高频板位于同层的普通FR4芯板受力情况达到平衡状态，减小与高频板位于同层的普通FR4芯板之间的胶体流失，进而避免与高频板位于同层的普通FR4芯板短接。
附图说明
下面将对实施例描述中所需要使用的附图作简单地介绍，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术中混压印制电路板的结构示意图；
图2是本申请实施例提供的一种印制电路板的结构示意图；
图3是本申请实施例提供的另一种印制电路板的结构示意图；
图4是本申请实施例提供的又一种印制电路板的结构示意图；
图5是图4中L2/L3层间PP的俯视图；
图6是本申请实施例提供的又一种印制电路板的结构示意图；
图7是本申请实施例提供的又一种印制电路板的结构示意图；
图8是本申请实施例提供的一种印制电路板的制备方法的流程图；
图9是本申请实施例提供的另一种印制电路板的制备方法的流程图；
图10是本申请实施例提供的又一种印制电路板的制备方法的流程图；
图11-图20是本申请实施例提供的印制电路板的制备方法每个步骤对应的结构示意图。
具体实施方式
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施 例中的附图，对本申请实施例中进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本申请保护的范围。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本申请实施例提供了一种印制电路板，该印制电路板包括：至少三张普通FR4芯板和高频板；高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，高频板和第一普通FR4芯板在竖直方向相邻设置，且高频板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的部分，与高频板位于同层的普通FR4芯板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的其余部分；高频板和第一普通FR4芯板之间的粘结层设置有第一通槽。
可选地，普通FR4芯板的数据传输频率小于高频板的数据传输频率。在印制电路板的压合过程中，与高频板位于同层的普通FR4芯板受到向上的推动力，且普通FR4芯板间的粘结层在熔融过程中，胶体会向高频板和与高频板位于同层的普通FR4芯板的分界线处聚集，胶体流动，推动与高频板位于同层的普通FR4芯板发生偏移。通过在高频板和第一普通FR4芯板之间的粘结层设置第一通槽，使得印制电路板在压合过程中，胶体流动时可以流向第一通槽，减小了胶体的聚集，可以减小与高频板位于同层的普通FR4芯板受到的向上的推动力，从而避免普通FR4芯板偏移，使得普通FR4芯板受力情况达到平衡状态，减小胶体流失，从而可以避免与高频板位于同层的普通FR4芯板间胶体流出，避免与高频板位于同层的普通FR4芯板间短接。
示例性的，图2是本申请实施例提供的一种印制电路板的结构示意图，参见图2，该印制电路板包括高频板101、L1/L2普通FR4芯板、L3/L4普通FR4芯板和L5/L6普通FR4芯板，则第一普通FR4芯板为L5/L6普通FR4芯板；高频板例如为ROGERS高频板，高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板位于同层，高频板101在印制电路板的正投影覆盖L5/L6普通FR4芯 板在印制电路板的正投影的部分，L1/L2普通FR4芯板和L3/L4普通FR4芯板在印制电路板的正投影覆盖L5/L6普通FR4芯板在印制电路板的正投影的其余部分。
高频板101和L5/L6普通FR4芯板之间的粘结层102设置有第一通槽103，使得印制电路板在压合过程中，粘结层102例如PP中的胶体流动时可以流向第一通槽103，减小了胶体的聚集，可以减小其对L3/L4普通FR4芯板向上的推动力，从而避免L3/L4普通FR4芯板偏移，使得L3/L4普通FR4芯板受力情况达到平衡状态，减小L1/L2普通FR4芯板以及L3/L4普通FR4芯板之间的PP中的胶体流失，从而可以避免L1/L2普通FR4芯板以及L3/L4普通FR4芯板间胶体流出，避免L1/L2普通FR4芯板以及L3/L4普通FR4芯板短接。
需要说明的是，图2中只示出了印制电路板包括3张普通FR4芯板的情况。第一通槽103的位置要避开线路及孔位，保证印制电路板可以正常使用。
本实施例通过在ROGERS高频板和与高频板相邻设置的第一普通FR4芯板之间的粘结层设置有第一通槽，使得印制电路板在压合过程中，胶体流动时可以流向第一通槽，减小了胶体的聚集，可以减小与高频板位于同层的普通FR4芯板受到的向上的推动力，从而避免与高频板位于同层的普通FR4芯板偏移，使得与高频板位于同层的普通FR4芯板受力情况达到平衡状态，减小与高频板位于同层的普通FR4芯板之间的胶体流失，进而避免与高频板位于同层的普通FR4芯板短接。
可选地，高频板位于第一普通FR4芯板之上；高频板和第一普通FR4芯板之上的至少两张普通FR4芯板的厚度之和相等，且位于同一层；
或者，高频板位于第一普通FR4芯板之下；高频板和第一普通FR4芯板之下的至少两张普通FR4芯板的厚度之和相等，且位于同一层。
在一实施例中，高频板可以位于第一普通FR4芯板之上，也可以位于第一普通FR4芯板之下，实际的位置关系可以根据实际情况进行确定。
示例性的，继续参考图2，第一普通FR4芯板为L5/L6普通FR4芯板，高频板101位于L5/L6普通FR4芯板之上，高频板101和L5/L6普通FR4芯板之上的L1/L2普通FR4芯板和L3/L4普通FR4芯板的厚度之和相等，且高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板位于同层。
或者，图3是本申请实施例提供的另一种印制电路板的结构示意图，参见图3，第一普通FR4芯板为L1/L2普通FR4芯板，高频板101位于L1/L2普通FR4芯板之下，高频板和L1/L2普通FR4芯板之下的L3/L4普通FR4芯板和L5/L6普通FR4芯板的厚度之和相等，且高频板101与L3/L4普通FR4芯板和 L5/L6普通FR4芯板位于同层。
可选地，与高频板位于同层的普通FR4芯板之间的粘结层设置至少一个第二通槽，第二通槽与高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离。
示例性的，图4是本申请实施例提供的又一种印制电路板的结构示意图，参见图4，高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板位于同层，L1/L2普通FR4芯板和L3/L4普通FR4芯板之间的粘结层PP设置有至少一个第二通槽104，高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板之间的分界线为H1，第二通槽104与分界线H1之间的距离大于或等于预设距离，预设距离例如为5mm，第二通槽104的长例如为5mm，宽例如为2mm。通过设置第二通槽104，使得印制电路板在压合过程中，L2/L3层间PP的胶体可以流入第二通槽104，避免L3/L4普通FR4芯板向较小位置挤压而偏移，从而可以避免L2/L3层间PP的胶体全部流走而导致L1/L2普通FR4芯板和L3/L4普通FR4芯板短接。
图5是图4中L2/L3层间PP的俯视图，可选地，参见图5，第二通槽104例如为连排的第二通槽104，相邻第二通槽104之间的间距例如为5mm，通过开连排的第二通槽104，可以为L2/L3层间PP的胶体提供流动空间，避免了L3/L4普通FR4芯板偏移。第二通槽104可以在同一条直线上，也可以不在同一条直线上，可以根据实际情况进行确定。
可选地，高频板和第一普通FR4芯板之间设置有至少两层粘结层；第一通槽位于高频板和第一普通FR4芯板之间的粘结层中邻近第一普通FR4芯板的粘结层内。
示例性的，继续参考图4，第一普通FR4芯板为L5/L6普通FR4芯板，高频板101与L5/L6普通FR4芯板之间设置有第一粘结层1021和第二粘结层1022，第一通槽103位于临近L5/L6普通FR4芯板的第一粘结层1021内，可以保证对高频板101的支撑，避免高频板101失去平衡。示例性的，第一粘结层1021为PP，第二粘结层1022为PP。
可选地，与高频板位于同层的普通FR4芯板之间设置有一层粘结层。
示例性的，参见图4，因为高频板101与位于同层的普通FR4芯板的厚度相同，所以为了匹配高频板101的厚度，与高频板101位于同层的普通FR4芯板之间设置有一层粘结层105例如是PP。但是，在其它一些实施例中，与高频板位于同层的普通FR4芯板之间的粘结层也可以为其它层数，可以根据高频板的厚度进行确定。
可选地，第一通槽关于高频板与其位于同层的普通FR4芯板的分界线对称设置。
示例性的，参见图4，第一通槽103关于高频板101与其位于同层的普通FR4芯板的分界线H1对称设置，使得印制电路板在压合过程中，胶体流动时可以流向均匀分布在L5/L6普通FR4芯板表面，减小了胶体的聚集，可以减小与高频板位于同层的普通FR4芯板受到的向上的推动力，从而避免与高频板位于同层的普通FR4芯板偏移，使得与高频板位于同层的普通FR4芯板受力情况达到平衡状态，减小与高频板位于同层的普通FR4芯板之间的胶体流失，进而避免与高频板位于同层的普通FR4芯板短接。
需要说明的是，图4中只示出了印制电路板包括5张普通FR4芯板的情况。
图6是本申请实施例提供的又一种印制电路板的结构示意图，可选地，参见图5和图6，印制电路板设置有至少两个定位孔，定位孔的深度等于与高频板101位于同层的普通FR4芯板以及高频板和第一普通FR4芯板之间的部分粘结层1022的厚度；印制电路板还包括固定结构，固定结构包括至少两个定位铆钉107，定位铆钉107与定位孔一一对应设置，定位铆钉107位于定位孔内。
示例性的，参见图5，印制电路板包括定位孔，可以在普通FR4芯板与高频板101的交接位置设置2个定位孔1061，定位孔1061距离分界线的距离例如为6mm，在普通FR4芯板的边缘设置2个定位孔1062，增设的定位孔1061与原有的定位孔1060的中心距离大于6mm，且增设的定位孔1062与原有的定位孔1060的中心距离大于6mm。图5中示出了包括四个定位孔的情况。
定位孔1061例如与原有的定位孔1060在一条直线上，定位孔1062例如与原有的定位孔1060在一条直线上。
参见图6，印制电路板包括固定结构107，固定结构107包括定位铆钉1071和定位铆钉1072，定位铆钉1071与定位孔1061对应设置，定位铆钉1072与定位孔1062对应设置，定位铆钉1071和定位铆钉1072将高频板101、与高频板101位于同层的L1/L2普通FR4芯板和L3/L4普通FR4芯板及L5/L6普通FR4芯板的部分粘结层1022例如是PP固定，避免与高频板101位于同层的普通FR4芯板受到向上的推力时偏移，从而可以避免普通FR4芯板的偏移和短接，减少胶体流失。
图7是本申请实施例提供的又一种印制电路板的结构示意图，可选地，参考图5和图7，印制电路板还包括销钉孔1081和销钉1082，销钉1082和销钉孔1081一一对应设置，销钉孔1081的深度等于印制电路板的厚度，是通孔；销钉1082的一端位于印制电路板的表面，销钉1082的另一端位于销钉孔1081 内,销钉被设置为对印制电路板进行固定。销钉1082例如是未开花销钉，在印制电路板排板时，将销钉1082置于销钉孔1081内。未开花销钉的选用高度＜设计压后厚度×80％，这是因为板子压合过程中胶体会存在流动，板子压后厚度会比压前厚度薄，此时压合前植入的销钉必须比压后厚度偏薄，否则将会产生局部失压问题。销钉孔1081的孔径约为6.0mm。需要注意的是，销钉孔1081在印制电路板的正投影和高频板101在印制电路板的正投影无交叠，避免销钉孔1081和销钉1082影响高频板101的电学性能。
可选地，销钉孔1081贯穿印制电路板，可以在压合印制电路板时，销钉1082位于销钉孔1081内,对印制电路板所有层进行固定，保证普通FR4芯板之间不会发生相对移动，在压合完成后，可以去除销钉1082，也可以保留销钉1082。
可选地，参见图7，印制电路板还包括多个铆钉1083，铆钉1083与原有的定位孔1060一一对应设置，多个铆钉1083可以固定高频板101和所有的普通FR4芯板，便于对印制电路板进行压合。
图8是本申请实施例提供的一种印制电路板的制备方法的流程图，图11-图20是本申请实施例提供的印制电路板的制备方法每个步骤对应的结构示意图，参见图8，印制电路板的制备方法包括：
S210、提供高频板。
可选地，参见图11，提供高频板101，高频板101可以快速传输数据，高频板101例如为ROGERS高频板，在其它一些实施方式中，高频板101也可以为其他类型的高频板。
S220、制备至少三张普通FR4芯板。
可选地，参见图12，根据印制电路板的需求，制备至少三张普通FR4芯板，例如制备L1/L2普通FR4芯板、L3/L4普通FR4芯板和L5/L6普通FR4芯板，普通FR4芯板包括玻璃布、环氧树脂和铜箔构成的FR4覆铜板，普通FR4芯板的尺寸可以根据实际情况进行确定。
图13为图12中L1/L2普通FR4芯板及L3/L4普通FR4芯板的俯视图，参见图13，高频板101与L1/L2普通FR4芯板及L3/L4普通FR4芯板位于同层，图13中示出高频板101是为了说明高频板与L1/L2普通FR4芯板及L3/L4普通FR4芯板的位置关系。
S230、在高频板和第一普通FR4芯板之间的粘结层制备第一通槽，其中，高频板和第一普通FR4芯板在竖直方向相邻设置。
可选地，参见图14，在高频板101和第一普通FR4芯板之间的粘结层靠近第一普通FR4芯板的粘结层1021例如是PP制备第一通槽103，使得印制电路 板在压合过程中，PP中的胶体流动时可以流向第一通槽103，减小了胶体的聚集，可以减小对L3/L4普通FR4芯板向上的推动力，从而避免L3/L4普通FR4芯板偏移，使得L3/L4普通FR4芯板受力情况达到平衡状态，减小L1/L2普通FR4芯板以及L3/L4普通FR4芯板之间的PP中的胶体流失，从而可以避免L1/L2普通FR4芯板以及L3/L4普通FR4芯板间胶体流出，避免L1/L2普通FR4芯板以及L3/L4普通FR4芯板短接。
需要说明的是，粘结层在加工过程铣刀走刀位置周边会受热轻微固化，因此不允许在同一张粘结层上采用控深铣方式制作。
S240、压合至少三张普通FR4芯板和高频板，其中，高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，且高频板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的部分，与高频板位于同层的普通FR4芯板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的其余部分。
可选地，参见图2，第一芯板为L5/L6普通FR4芯板，将高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板同层放置，将高频板101放置在L5/L6普通FR4芯板之上，并将L1/L2普通FR4芯板和L3/L4普通FR4芯板放置在L5/L6普通FR4芯板之上，高频板101与L1/L2普通FR4芯板和L3/L4普通FR4芯板相邻放置，压合高频板101、L1/L2普通FR4芯板、L3/L4普通FR4芯板和L5/L6普通FR4芯板。
图9是本申请实施例提供的另一种印制电路板的制备方法的流程图，本实施方案是对上述实施方案中S240的改动，可选地，参见图9，制电路板的制备方法包括：
S310、提供高频板。
参见图11，提供高频板101。
S320、制备至少三张普通FR4芯板。
参见图15，制备至少三张普通FR4芯板，例如制备L1/L2普通FR4芯板、L3/L4普通FR4芯板和L5/L6普通FR4芯板。
S330、在高频板和第一普通FR4芯板之间的粘结层制备第一通槽，其中，高频板和第一普通FR4芯板在竖直方向相邻设置。
参见图14，在高频板101和第一普通FR4芯板之间的粘结层102靠近第一普通FR4芯板的PP制备第一通槽103。
S340、通过固定结构将高频板、与高频板位于同层的普通FR4芯板以及至 少一层粘结层固定，其中，与高频板位于同层的普通FR4芯板设置有至少两个定位孔，定位孔的深度等于与高频板位于同层的普通FR4芯板以及至少一层粘结层的厚度，固定结构包括至少两个定位铆钉，定位铆钉与定位孔一一对应设置，定位铆钉位于定位孔内。
示例性的，参见图15，印制电路板包括定位孔，可以在普通FR4芯板与高频板101的交接位置设置2个定位孔1061，定位孔1061距离分界线的距离例如为6mm，在普通FR4芯板的边缘设置2个定位孔1062，增设的定位孔1061与原有的定位孔1060的中心距离大于6mm，且增设的定位孔1062与原有的定位孔1060的中心距离大于6mm。
原有的定位孔1060可以采用3.2mm-4.0mm刀径将相关孔位钻出，可以根据实际情况进行加工。
参见图15，固定结构107包括定位铆钉1071和定位铆钉1072，定位铆钉1071与定位孔1061对应设置，定位铆钉1072与定位孔1062对应设置，定位铆钉1071和定位铆钉1072将高频板101、与高频板101位于同层的L1/L2普通FR4芯板和L3/L4普通FR4芯板及L5/L6普通FR4芯板的部分粘结层102例如是PP固定，避免与高频板101位于同层的普通FR4芯板受到向上的推力时偏移，从而可以避免普通FR4芯板的偏移和短接，减少胶体流失。
S350、压合至少三张普通FR4芯板和高频板，其中，第一普通FR4芯板位于高频板固定有粘结层的一侧，高频板和第一普通FR4芯板之间设置有至少两层粘结层，第一通槽位于高频板和第一普通FR4芯板之间的粘结层中邻近第一普通FR4芯板的粘结层内。
示例性的，高频板和第一普通FR4芯板之间设置有第一粘结层1021和第二粘结层1022，第一粘结层1021为邻近第一普通FR4芯板的粘结层，第二粘结层1022为邻近高频板101的粘结层。图16为图18中L4/L5层间邻近L4的PP的俯视图，参见图16，高频板101覆盖第二粘结层1022的部分，第二粘结层1022上设有定位孔1061和定位孔1062，便于将高频板101、与高频板101位于同层的L1/L2普通FR4芯板和L3/L4普通FR4芯板及L5/L6普通FR4芯板的部分粘结层1022固定，第二粘结层1022上还包括多个原有的定位孔1060，可以方便在压合时固定所有普通FR4芯板，第二粘结层1022上还包括销钉孔1081，在压合时，便于固定所有普通FR4芯板和高频板101。图17为图18中L4/L5层间邻近L5的PP的俯视图，参见图17，第一粘结层1021还包括多个原有的定位孔1060，可以方便在压合时固定所有普通FR4芯板，第一粘结层1021上还包括销钉孔1081，在压合时，便于固定所有普通FR4芯板和高频板101。
可选地，参见图18，压合高频板101、与高频板101位于同层的L1/L2普 通FR4芯板和L3/L4普通FR4芯板及L5/L6普通FR4芯板，保证高频板101、与高频板101位于同层的L1/L2普通FR4芯板和L3/L4普通FR4芯板及L5/L6普通FR4芯板的良好对位，使得更好的固定高频板与至少三张普通FR4芯板。高频板101与L5/L6普通FR4芯板之间设置有第一粘结层1021和第二粘结层1022，第一通槽103位于临近L5/L6普通FR4芯板的第一粘结层1021内，可以保证对高频板101的支撑，避免高频板101失去平衡。示例性的，第一粘结层1021为PP，第二粘结层1022为PP。
图10是本申请实施例提供的又一种印制电路板的制备方法的流程图，本实施方案是对上述实施方案中S220的改动，可选地，参见图10，制电路板的制备方法包括：
S410、提供高频板。
参见图11，提供高频板101。
S420、在与高频板位于同层的普通FR4芯板之间的粘结层中形成至少一个第二通槽，其中，第二通槽与高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离。
可选地，参见图19和图20，在与高频板101位于同层的普通FR4芯板之间的粘结层105中形成至少一个第二通槽104，通过设置第二通槽104，使得印制电路板在压合过程中，L2/L3层间PP的胶体可以流入第二通槽104，避免L3/L4普通FR4芯板向较小位置挤压而偏移，从而可以避免胶体全部流走而导致L1/L2普通FR4芯板和L3/L4普通FR4芯板短接。
参见图5，第二通槽104例如为连排的第二通槽104，相邻第二通槽104之间的间距例如为5mm，通过开连排的第二通槽104，可以为L2/L3层间PP的胶体提供流动空间，避免了L3/L4普通FR4芯板偏移。第二通槽104可以在同一条直线上，也可以不在同一条直线上，可以根据实际情况进行确定。
S430、制备第一普通FR4芯板，其中，高频板和第一普通FR4芯板在竖直方向相邻设置，且高频板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的部分，与高频板位于同层的普通FR4芯板在印制电路板的正投影覆盖第一普通FR4芯板在印制电路板的正投影的其余部分。
可选地，参见图20，制备第一普通FR4芯板，例如L5/L6普通FR4芯板。示例性的，在L5/L6普通FR4芯板的基础上，还可以制备L7/L8普通FR4芯板和L9/L10普通FR4芯板，普通FR4芯板个数可以根据实际情况进行确定。
S440、在高频板和第一普通FR4芯板之间的粘结层制备第一通槽，其中，高频板和第一普通FR4芯板相邻设置。
参见图20，在高频板101和L5/L6普通FR4芯板之间的粘结层102中靠近L5/L6普通FR4芯板的第一粘结层1021制备第一通槽103。
S450、通过固定结构将高频板、与高频板位于同层的普通FR4芯板以及至少一层粘结层固定，其中，与高频板位于同层的普通FR4芯板设置有至少两个定位孔，定位孔的深度等于与高频板位于同层的普通FR4芯板以及至少一层粘结层的厚度，固定结构包括至少两个定位铆钉，定位铆钉与定位孔一一对应设置，定位铆钉位于定位孔内。
参见图6，通过固定结构107将高频板101与高频板101位于同层的芯板以及至少一层粘结层1022例如是PP固定。
S460、压合至少三张普通FR4芯板和高频板，其中第一普通FR4芯板位于高频板固定有粘结层的一侧，高频板和第一普通FR4芯板之间设置有至少两层粘结层，第一通槽位于高频板和第一普通FR4芯板之间的粘结层中邻近第一普通FR4芯板的粘结层内。
可选地，参见图7，压合高频板101、与高频板101位于同层的L1/L2普通FR4芯板和L3/L4普通FR4芯板与L5/L6普通FR4芯板。
可选的，可以压合之前通过将销钉1082位于销钉孔1081内,对印制电路板所有层进行固定，保证普通FR4芯板之间不会发生相对移动，在压合完成后，可以去除销钉1082，也可以保留销钉1082。销钉孔1081的深度等于印制电路板的厚度，是通孔；销钉1082的一端位于印制电路板的表面，销钉1082的另一端位于销钉孔1081内,销钉被设置为对印制电路板进行固定。销钉1082例如是未开花销钉，在印制电路板排板时，将销钉1082置于销钉孔1081内。未开花销钉的选用高度＜设计压后厚度×80％，这是因为板子压合过程中胶体会存在流动，板子压后厚度会比压前厚度薄，此时压合前植入的销钉必须比压后厚度偏薄，否则将会产生局部失压问题。销钉孔1081的孔径约为6.0mm。需要注意的是，销钉孔1081在印制电路板的正投影和高频板101在印制电路板的正投影无交叠，避免销钉孔1081和销钉1082影响高频板101的电学性能。
可选的，印制电路板还包括多个铆钉1083，铆钉1083与原有的定位孔1060一一对应设置，多个铆钉1083可以固定高频板101和所有的普通FR4芯板。
需要说明的是，图7中，固定结构107的定位铆钉1071、铆钉1083、销钉1082位于印制电路板设置有高频板101一侧的表面的部分是铆钉帽面。铆钉1083位于印制电路板远离高频板101一侧表面的部分是铆钉开花面。图6中，固定结构107的定位铆钉1071位于第二粘结层1022表面的部分是铆钉开花面。

Claims (11)

  1. 一种印制电路板，包括：至少三张普通FR4芯板和高频板；
    所述高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，所述高频板和第一普通FR4芯板在竖直方向相邻设置，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分；
    所述高频板和所述第一普通FR4芯板之间的粘结层设置有第一通槽。
  2. 根据权利要求1所述的印制电路板，其中，所述高频板位于所述第一普通FR4芯板之上；
    所述高频板和所述第一普通FR4芯板之上的至少两张普通FR4芯板的厚度之和相等，且位于同一层；
    或者，所述高频板位于所述第一普通FR4芯板之下；
    所述高频板和所述第一普通FR4芯板之下的至少两张普通FR4芯板的厚度之和相等，且位于同一层。
  3. 根据权利要求1所述的印制电路板，其中，与所述高频板位于同层的普通FR4芯板之间的粘结层设置至少一个第二通槽，所述第二通槽与所述高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离。
  4. 根据权利要求1所述的印制电路板，其中，所述高频板和所述第一普通FR4芯板之间设置有至少两层粘结层；
    所述第一通槽位于所述高频板和所述第一普通FR4芯板之间的粘结层中邻近所述第一普通FR4芯板的粘结层内。
  5. 根据权利要求1或3所述的印制电路板，其中，与所述高频板位于同层的普通FR4芯板之间设置有一层粘结层。
  6. 根据权利要求1所述的印制电路板，其中，所述第一通槽关于所述高频板与其位于同层的普通FR4芯板的分界线对称设置。
  7. 根据权利要求1所述的印制电路板，其中，所述印制电路板设置有至少两个定位孔，所述定位孔的深度等于与所述高频板位于同层的普通FR4芯板以及所述高频板和所述第一普通FR4芯板之间的部分粘结层的厚度；
    所述印制电路板还包括固定结构，所述固定结构包括至少两个定位铆钉，所述定位铆钉与所述定位孔一一对应设置，所述定位铆钉位于所述定位孔内。
  8. 根据权利要求1所述的印制电路板，其中，所述印制电路板还包括销钉 孔和销钉，所述销钉和所述销钉孔一一对应设置，所述销钉孔的深度等于所述印制电路板的厚度；所述销钉的一端位于所述印制电路板的表面，所述销钉的另一端位于所述销钉孔内,所述销钉被设置为对所述印制电路板进行固定。
  9. 一种印制电路板的制备方法，包括：
    提供高频板；
    制备至少三张普通FR4芯板；
    在所述高频板和第一普通FR4芯板之间的粘结层制备第一通槽，其中，所述高频板和所述第一普通FR4芯板在竖直方向相邻设置；
    压合所述至少三张普通FR4芯板和高频板，其中，所述高频板与至少两张普通FR4芯板的叠层在水平方向位于同层，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分。
  10. 根据权利要求9所述的印制电路板的制备方法，其中，所述压合所述至少三张普通FR4芯板和高频板，包括：
    通过固定结构将所述高频板、与所述高频板位于同层的普通FR4芯板以及至少一层粘结层固定，其中，与所述高频板位于同层的普通FR4芯板设置有至少两个定位孔，所述定位孔的深度等于与所述高频板位于同层的普通FR4芯板以及至少一层粘结层的厚度，所述固定结构包括至少两个定位铆钉，所述定位铆钉与所述定位孔一一对应设置，所述定位铆钉位于所述定位孔内；
    压合所述至少三张普通FR4芯板和高频板，其中，所述第一普通FR4芯板位于所述高频板固定有粘结层的一侧，所述高频板和所述第一普通FR4芯板之间设置有至少两层粘结层，所述第一通槽位于所述高频板和所述第一普通FR4芯板之间的粘结层中邻近所述第一普通FR4芯板的粘结层内。
  11. 根据权利要求9所述的印制电路板的制备方法，其中，所述制备至少三张普通FR4芯板，包括：
    在与所述高频板位于同层的普通FR4芯板之间的粘结层中形成至少一个第二通槽，其中，所述第二通槽与所述高频板与其位于同层的普通FR4芯板的分界线的距离大于或等于预设距离；
    制备第一普通FR4芯板，其中，所述高频板和第一普通FR4芯板在竖直方向相邻设置，且所述高频板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的部分，与所述高频板位于同层的普通FR4芯 板在所述印制电路板的正投影覆盖所述第一普通FR4芯板在所述印制电路板的正投影的其余部分。
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