WO2023181143A1

WO2023181143A1 - Electronic device

Info

Publication number: WO2023181143A1
Application number: PCT/JP2022/013361
Authority: WO
Inventors: 熙大坪; 茂之金谷
Original assignee: 三菱電機株式会社
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2023-09-28

Abstract

This electronic device comprises: a substrate (10) having a ground pattern (11) provided on a surface so as to surround the periphery of a mounted electronic component (20); and a shield case (30) that has spring leg parts (40A) that extend from lower edges of side plates (32, 33) toward the surface of the substrate (10) via a plurality of bent parts (44, 45), the shield case (30) being attached to the surface of the substrate (10) via fixing surfaces of fixing parts (36) so as to cover the periphery of the electronic component (20). The spring leg parts (40A) extend toward the outside of the shield case (30) from a second bent part (45) that is disposed on the frontmost end side among the plurality of bent parts (44, 45), and have flat surfaces on flat parts (43) that come into contact with the ground pattern (11). The flat surfaces of the flat parts (43) are disposed further toward the substrate (10) side than the fixing surfaces of the fixing parts (36) and are parallel to the contact surface of the ground pattern (11).

Description

Electronics

The present disclosure relates to an electronic device including an electromagnetic shielding structure.

Electronic devices are equipped with various electronic components. Such electronic components may emit electromagnetic waves. Electromagnetic waves emitted from electronic components cause electromagnetic interference to other electronic devices. For this reason, some electronic devices are equipped with an electromagnetic shielding structure for suppressing leakage of electromagnetic waves emitted from electronic components to the outside of the device. An example of an electromagnetic shielding structure for electronic equipment is disclosed in Patent Document 1.

JP2002-176282A

The electromagnetic shield structure disclosed in Patent Document 1 includes a conductive shield case and a bottom plate. The shield case is attached to cover the electronic components mounted on the bottom plate. Further, the shield case has a plurality of projecting pieces projecting from the lower end of the side plate. These projecting pieces come into contact with the surface of the bottom plate when the shield case is attached to the bottom plate. As a result, the bottom plate and the casing are electrically connected to each other, so the electromagnetic shielding structure disclosed in Patent Document 1 has high electromagnetic shielding properties.

However, in the electromagnetic shielding structure disclosed in Patent Document 1, depending on the bending accuracy of the shield case, the shape and bending accuracy of the protrusion, the protrusion may not make appropriate contact with the bottom plate. In this case, the contact of the protruding piece with the bottom plate becomes unstable, which may lead to a decrease in electromagnetic shielding properties.

The present disclosure has been made to solve the above-mentioned problems, and aims to provide an electronic device that can suppress deterioration of electromagnetic shielding performance even if variations occur in the processing accuracy of the shield case. purpose.

An electronic device according to the present disclosure includes a substrate on which a ground pattern is provided on the surface so as to surround the electronic components to be mounted, and a spring leg that extends from the lower side of the side plate toward the surface of the substrate via a plurality of bent portions. and a shield case that is attached to the surface of the board via a fixing surface so as to cover the periphery of the electronic component, and the spring leg is located at the tip end of the plurality of bent parts. It has a flat surface that extends from the most extreme bent part toward the outside of the shield case and comes into contact with the ground pattern, and the flat surface is located closer to the board than the fixed surface and is parallel to the contact surface of the ground pattern. This is the result.

According to the present disclosure, even if variations occur in the processing accuracy of the shield case, it is possible to suppress the deterioration of electromagnetic shielding properties.

1 is a perspective view of an electronic device according to Embodiment 1. FIG. FIG. 3 is a plan view of the substrate. It is a perspective view of a shield case. FIG. 3 is a perspective view of the spring leg. FIG. 3 is a front view of the shield case. FIG. 3 is a left side view of the shield case. It is a figure showing the cross-sectional structure of a shield case. FIG. 7A is a sectional view taken along the line VII-VII in FIG. 3. FIG. 7B is an enlarged view of the main part of FIG. 7A. FIGS. 8A to 8C are diagrams sequentially showing the operation of attaching the shield case to the board. FIG. 7 is a perspective view showing a modification of the shield case. It is a figure which shows the modification of a spring leg part. It is a figure which shows the other modification of a spring leg part. FIG. 7 is a front view of a spring leg of an electronic device according to a second embodiment. 13A to 13C are front views of the spring leg according to the third embodiment. FIG. 7 is a front view of a spring leg of an electronic device according to Embodiment 4;

Hereinafter, in order to explain the present disclosure in more detail, embodiments for carrying out the present disclosure will be described with reference to the accompanying drawings.

Embodiment 1.
An electronic device according to Embodiment 1 will be described using FIGS. 1 to 11.

First, FIG. 1 is a perspective view of an electronic device according to a first embodiment. FIG. 2 is a plan view of the substrate 10. FIG. 3 is a perspective view of the shield case 30. FIG. 4 is a perspective view of the spring leg 40A. FIG. 5 is a front view of the shield case 30. FIG. 6 is a left side view of the shield case 30. FIG. 7 is a diagram showing a cross-sectional structure of the shield case 30.

As shown in FIG. 1, the electronic device includes a board 10, an electronic component 20, and a shield case 30. The electronic component 20 is mounted on the board 10. This electronic component 20 may emit electromagnetic waves when driven. For this reason, a shield case 30 is provided on the board 10 so as to cover the electronic component 20 .

As shown in FIGS. 1 and 2, the substrate 10 has a ground pattern 11, a screw hole 12, and a positioning slit 13.

The ground pattern 11 is provided on the surface of the substrate 10. This ground pattern 11 is formed in a rectangular frame shape so as to surround the electronic component 20 . Further, the ground pattern 11 is electrically connected to another ground pattern 11 provided on the surface of the substrate 10. Note that the ground pattern 11 is made of, for example, a conductive metal material.

The screw holes 12 are for attaching the shield case 30 to the surface of the substrate 10. A screw (not shown) can be tightened into this screw hole 12. A plurality of screw holes 12 are provided in the substrate 10 so as to penetrate through the ground pattern 11 . 1 and 2 show an example in which the substrate 10 has four screw holes 12. Two screw holes 12 are arranged on the left side of the shield case 30, and the remaining two screw holes 12 are arranged on the right side of the shield case 30.

The positioning slit 13 is for positioning the shield case 30 in the front-back and left-right directions with respect to the board 10 when the shield case 30 is attached to the surface of the board 10. A plurality of positioning slits 13 are provided so as to penetrate through the substrate 10 and the ground pattern 11. FIG. 2 shows an example in which the substrate 10 has two positioning slits 13. One positioning slit 13 is arranged on the front side of the shield case 30, and the other positioning slit 13 is arranged on the left side of the shield case 30. Note that the positioning slit 13 may at least penetrate the substrate 10.

The shield case 30 shown in FIG. 3 is made of, for example, a conductive and elastic metal material. Specifically, the shield case 30 is a box that can cover the electronic component 20 by bending a sheet metal such as a zinc steel sheet or a phosphor bronze steel sheet for springs multiple times containing the above-mentioned metal material. It is formed in the shape of

As shown in FIGS. 3 to 7, the shield case 30 includes a top plate 31, a front plate 32, a rear plate 33, a left side plate 34, a right side plate 35, a fixing part 36, a positioning projection 37, and a spring leg part 40A. have.

The shield case 30 absorbs electromagnetic waves radiated from the electronic component 20 by at least one of the top plate 31, the front plate 32, the rear plate 33, the left side plate 34, and the right side plate 35. Further, the shield case 30 releases the absorbed electromagnetic waves to the ground pattern 11 via the spring leg portion 40A.

The top plate 31 has a rectangular shape. A front side plate 32, a rear side plate 33, a left side plate 34, and a right side plate 35 are connected to each of the four sides of this top plate 31, respectively. The opposite side of the top plate 31 in the shield case 30 is open and serves as the side to which the board 10 is attached.

The fixing part 36 is for attaching the shield case 30 to the surface of the board 10. This fixing portion 36 is provided to correspond to the screw hole 12. In this case, as shown in FIG. 3, two fixing parts 36 are provided on each of the lower side of the left side plate 34 and the lower side of the right side plate 35. In addition, in FIG. 3, among the two fixing parts 36 provided on the lower side of the left side plate 34, the fixing part 36 on the front side plate side is visible, but the fixing part 36 on the rear side plate side is not attached to the top plate 31. Hidden and invisible.

The fixing portion 36 is formed to be bent toward the outside of the shield case 30 from the lower side of the left side plate 34 and the lower side of the right side plate 35. Furthermore, the fixing portion 36 has a screw hole 36a. This screw hole 36a is provided to correspond to the screw hole 12 of the substrate 10. That is, the screw can pass through the screw hole 36a.

Therefore, when the shield case 30 is placed inside the ground pattern 11 on the substrate 10, the fixed surface, which is the lower surface of the fixed part 36, comes into contact with the contact surface, which is the upper surface of the ground pattern 11. At this time, the screw hole 12 and the screw hole 36a face each other, and the screw can be tightened into the screw hole 12 from the screw hole 36a side. As a result, the shield case 30 is attached to the surface of the substrate 10.

The positioning protrusion 37 is for positioning the shield case 30 with respect to the substrate 10 when attaching the shield case 30 to the surface of the substrate 10. This positioning protrusion 37 is provided so as to correspond to the positioning slit 13. That is, the positioning protrusion 37 can be inserted into the positioning slit 13. In this case, as shown in FIG. 5, one positioning projection 37 is provided on each of the lower side of the front side plate 32 and the lower side of the left side plate 34. The positioning protrusion 37 is formed to protrude downward from the shield case 30 from the lower side of the front side plate 32 and the lower side of the left side plate 34.

A plurality of spring leg portions 40A are provided on each of the lower side of the front side plate 32 and the lower side of the rear side plate 33. The plurality of spring legs 40A are arranged at regular intervals in the length direction of each lower side. Moreover, the plurality of spring leg parts 40A are provided alternately between the front side plate 32 and the rear side plate 33 that face each other. Note that the lower side of the front side plate 32 and the lower side of the rear side plate 33 are arranged at a higher position than the lower side of the left side plate 34 and the lower side of the right side plate 35.

Here, the spring leg portion 40A may be provided on at least one side plate among the front side plate 32, the rear side plate 33, the left side plate 34, and the right side plate 35. Furthermore, one or more spring leg portions 40A may be provided on one side plate on which the spring leg portions 40A are provided.

The spring leg portion 40A has a plurality of bent portions, so that the spring leg portion 40A is gradually inclined toward the outside of the shield case 30 as it goes downward from the lower side of the side plate. Further, the plurality of bent portions are arranged on the outer side of the shield case 30 as they approach the tip of the spring leg portion 40A. In this way, the spring leg portion 40A has a plurality of bent portions, thereby becoming an elastic structure, which absorbs variations in processing accuracy of the shield case 30 and allows the absorbed electromagnetic waves to escape to the ground pattern 11. I can do it.

The spring leg portion 40A has, for example, two

bent portions

44 and 45. Specifically, the spring leg portion 40A has a root portion 41, an inclined portion 42, a flat portion 43, a first bent portion 44, and a second bent portion 45.

The root portion 41 is formed continuously from the lower side of the front side plate 32 and the lower side of the rear side plate 33. The root portion 41 extends downward from the lower side of the shield case 30 from the lower side of the front side plate 32 and the lower side of the rear side plate 33 so as to be parallel to the front side plate 32 and the rear side plate 33.

The inclined portion 42 is formed continuously from the lower end of the root portion 41. The slope portion 42 gradually slopes toward the outside of the shield case 30 (root portion 41) as it goes downward from the lower end of the root portion 41 of the shield case 30.

The flat part 43 is formed continuously from the lower end of the inclined part 42. The flat portion 43 extends from the lower end of the sloped portion 42 toward the outside of the shield case 30 (slanted portion 42). A flat surface serving as a lower surface of the flat portion 43 is arranged parallel to the top plate 31. Further, the flat surface is located at a lower position than the fixing surface of the fixing part 36, that is, on the substrate 10 side.

As described above, since the spring leg portion 40A has the root portion 41, the inclined portion 42, and the flat portion 43, the first bent portion 44 and the second bent portion 45 are formed in the spring leg portion 40A. be done. The first bent portion 44 is a point where the lower end of the root portion 41 and the upper end of the inclined portion 42 connect. The second bent portion 45 is a point where the lower end of the inclined portion 42 and the inner end of the flat portion 43 connect. This second bent portion 45 is a bent portion disposed at the most distal end side (lower end side) of the spring leg portion 40A, and constitutes the most distal bent portion.

At this time, the sum of the intersection angle X between the top plate 31 and the base portion 41 and the bending angle Y with the first bending portion 44 as the base point is larger than 90° and smaller than 180°. It has become. In other words, the bending angle Y based on the first bending portion 44 is the inclination angle of the inclined portion 42 with respect to the root portion 41 (the left side plate 34 or the right side plate 35).

Therefore, when the electronic device brings the spring leg 40A into pressure contact with the contact surface of the ground pattern 11, the spring leg 40A is prevented from entering the inside of the shield case 30, and the spring leg 40A is It can be naturally moved toward the outside of the shield case 30. Further, since the electronic device can prevent the spring leg portion 40A from entering the inside of the shield case 30, the internal space of the shield case 30 can be secured. Therefore, in the electronic device, the electronic components 20 can be compactly packed inside the shield case 30.

Next, the operation of attaching the shield case 30 to the board 10 will be explained using FIG. 8. 8A to 8C are diagrams sequentially showing the operation of attaching the shield case 30 to the board 10.

First, as shown in FIG. 1, the electronic component 20 is mounted in advance inside the ground pattern 11 on the board 10.

Next, as shown in FIG. 8A, the shield case 30 is placed over the electronic component 20 mounted on the surface of the board 10. Further, the positioning protrusion 37 of the shield case 30 is inserted into the positioning slit 13 of the board 10. At this time, the flat surface of the flat portion 43 is still parallel to the contact surface of the ground pattern 11.

Next, as shown in FIG. 8B, when the shield case 30 approaches the substrate 10, the flat surface of the flat portion 43 comes into surface contact with the contact surface of the ground pattern 11. At this time, the fixed surface of the fixed portion 36 has not yet contacted the contact surface of the ground pattern 11.

Next, the screw is tightened into the screw hole 12 through the screw hole 36a of the fixing part 36, and the fixing surface of the fixing part 36 comes into contact with the contact surface of the ground pattern 11, as shown in FIG. 8C. As a result, the shield case 30 is attached to the surface of the substrate 10 so as to cover the periphery of the electronic component 20.

At this time, since the flat surface of the flat portion 43 is arranged at a lower position than the lower fixed surface of the fixed portion 36, the flat surface of the flat portion 43 has its outer end raised from the contact surface of the ground pattern 11, and The second bent portion 45, which is the inner end thereof, is slid outward on the contact surface of the ground pattern 11. That is, the second bent portion 45 of the spring leg portion 40A is always in line contact with the contact surface of the ground pattern 11, and is pressed against the contact surface of the ground pattern 11. Therefore, the spring leg portion 40A and the ground pattern 11 are electrically connected. As a result, the shield case 30 can absorb the electromagnetic waves radiated from the electronic component 20 and release the absorbed electromagnetic waves to the ground pattern 11 of the board 10 via the spring legs 40A.

Therefore, when the electronic device brings the spring leg portion 40A of the shield case 30 into pressure contact with the contact surface of the ground pattern 11, the pressure contact changes from surface contact by the flat surface of the flat portion 43 to line contact by the second bent portion 45. It can be changed. Therefore, the electronic device can reliably obtain a contact point with the ground pattern 11 at the spring leg portion 40A. As a result, in the electronic device, the electrical connection between the spring leg portion 40A and the ground pattern 11 can be stabilized, so that electromagnetic shielding properties can be improved.

Furthermore, when the shield case 30 is attached to the board 10, the positioning protrusion 37 of the shield case 30 is inserted into the positioning slit 13 of the board 10, so the shield case 30 is positioned in the front-rear direction and the left-right direction. Ru. Therefore, the electronic device can prevent the shield case 30 from shifting relative to the board 10 when the shield case 30 is fixed to the board 10 with screws.

Here, FIG. 9 is a perspective view showing a modification of the shield case 30. As shown in FIG. 9, the left side plate 34 and the right side plate 35 may include corner bent portions 38. The corner bent portions 38 are provided at the upper portions of the vertical sides on both sides in the width direction of the left side plate 34 and at the upper sides of the vertical sides on both sides in the width direction of the right side plate 35 . This corner bent portion 38 is bent toward the outer surface of the front side plate 32 or the outer surface of the rear side plate 33 to be connected to the outer surface.

Therefore, since the electronic device can improve the rigidity of the shield case 30, the gap between the front side plate 32 and the left side plate 34, the gap between the front side plate 32 and the right side plate 35, and the rear side plate 33 and the left side plate 34, and the gap between the rear side plate 33 and the right side plate 35 can be suppressed. Further, when the electronic device is attached to the substrate 10, it is possible to suppress the bending of the spring leg portion 40A due to pressure contact with the ground pattern 11. As a result, the electronic device can obtain stable electromagnetic shielding properties.

FIG. 10 is a diagram showing a spring leg 40B that is a modification of the spring leg 40A. As shown in FIG. 10, the second bent portion 45 may have a convex portion 45a. One or more convex portions 45a are provided along the ridge line of the second bent portion 45. Therefore, the spring leg portion 40B can always make point contact with the contact surface of the ground pattern 11.

Therefore, when the electronic device presses the spring leg portion 40B of the shield case 30 against the contact surface of the ground pattern 11, the pressure contact is changed from surface contact by the flat surface of the flat portion 43 to the convex portion 45a of the second bent portion 45. It can be changed to a point contact by Therefore, the electronic device can reliably obtain a contact point with the ground pattern 11 at the spring leg portion 40B. As a result, in the electronic device, the electrical connection between the spring leg portion 40B and the ground pattern 11 can be stabilized, so that electromagnetic shielding properties can be improved.

FIG. 11 is a diagram showing a spring leg 40C that is a modification of the spring leg 40A. As shown in FIG. 11, the spring leg portion 40C has three

bent portions

53, 54, and 55. Specifically, the spring leg portion 40C includes a root portion 41, a flat portion 43, a first inclined portion 51, a second inclined portion 52, a first bent portion 53, a second bent portion 54, and a third bent portion 55. have.

The first inclined portion 51 is formed continuously from the lower end of the root portion 41. The first inclined portion 51 is gradually inclined toward the outside of the shield case 30 (root portion 41) as it goes downward from the lower end of the root portion 41 to the shield case 30.

The second inclined part 52 is formed continuously from the lower end of the first inclined part 51. The second inclined part 52 gradually slopes toward the outside of the shield case 30 (root part 41 or first inclined part 51) as it goes downward from the lower end of the first inclined part 51 to the shield case 30. .

The flat part 43 is formed continuously from the lower end of the second inclined part 52. The flat part 43 extends from the lower end of the second inclined part 52 toward the outside of the shield case 30 (second inclined part 52). The flat surface of the flat portion 43 is arranged parallel to the top plate 31. Further, the flat surface is located at a lower position than the fixing surface of the fixing part 36, that is, on the substrate 10 side.

In this way, since the spring leg portion 40C has the root portion 41, the flat portion 43, the first inclined portion 51, and the second inclined portion 52, the spring leg portion 40C has the first bent portion 53, A second bent portion 54 and a third bent portion 55 are formed.

The first bent portion 53 is a point where the lower end of the root portion 41 and the upper end of the first inclined portion 51 connect. The second bent portion 54 is a point where the lower end of the first inclined portion 51 and the upper end of the second inclined portion 52 connect. The third bent portion 55 is a point where the lower end of the second inclined portion 52 and the inner end of the flat portion 43 connect. This third bent portion 55 is a bent portion disposed at the most distal end side (lower end side) of the spring leg portion 40C, and constitutes the most distal bent portion.

At this time, the sum of the intersection angle X between the top plate 31 and the base part 41, the bending angle Y1 with the first bending part 53 as the base point, and the bending angle Y2 with the second bending part 54 as the base point is 90 degrees. The angle is larger than 180° and smaller than 180°. In other words, the bending angle Y1 based on the first bending portion 53 is the inclination angle of the first inclined portion 51 with respect to the root portion 41 (the left side plate 34 or the right side plate 35). In other words, the bending angle Y2 based on the second bending portion 54 is the inclination angle of the second slope portion 52 with respect to the first slope portion 51.

Therefore, when the electronic device brings the spring leg 40C into pressure contact with the contact surface of the ground pattern 11, the spring leg 40C is prevented from entering inside the shield case 30, and the spring leg 40C is pressed against the contact surface of the ground pattern 11. It can be naturally moved toward the outside of the shield case 30.

As described above, in the electronic device according to the first embodiment, a plurality of ground patterns 11 are provided on the substrate 10 provided on the surface so as to surround the periphery of the electronic component 20 to be mounted, and from the lower side of the front side plate 32 and the lower side of the rear side plate 33. The spring leg portion 40A extends toward the surface of the substrate 10 through the

bent portions

44 and 45 of The spring leg portion 40A extends toward the outside of the shield case 30 from the second bent portion 45 disposed at the distal end of the plurality of

bent portions

44, 45, and is attached to the ground. It has a flat surface of a flat part 43 that comes into contact with the pattern 11, and the flat surface of the flat part 43 is arranged closer to the substrate 10 than the fixed surface of the fixed part 36, and is parallel to the contact surface of the ground pattern 11. Therefore, even if variations occur in the machining accuracy of the shield case 30, the electronic device can suppress deterioration in electromagnetic shielding performance.

In the electronic device, the plurality of

bent portions

44 and 45 are arranged on the outer side of the shield case 30 as they approach the tip of the spring leg portion 40A. Therefore, in the electronic device, the entire spring leg portion 40A can be made into an elastic structure.

In electronic equipment, the sum of the intersection angle X between the top plate 31 and the front side plate 32 or the rear side plate 33 in the shield case 30 and the bending angle Y with the bending part 44 excluding the leading edge bending part as the base point is 90. The angle is larger than 180° and smaller than 180°. Also, the sum of the intersection angle X between the top plate 31 and the front side plate 32 or the rear side plate 33 in the shield case 30 and the bending angles Y1 and Y2 with each bending

part

53 and 54 as a base point excluding the most extreme bending part is , is larger than 90° and smaller than 180°. Therefore, even if variations occur in the processing accuracy of the shield case 30, the electronic device can absorb the variations.

In the electronic device, the spring legs 40A are provided alternately between the two opposing

side plates

32 and 33. Therefore, the electronic device can efficiently absorb variations in the processing accuracy of the shield case 30.

The electronic device includes a positioning slit 13 that penetrates the substrate 10 and a positioning protrusion 37 that protrudes from the front plate 32 and is inserted into the positioning slit 13. The electronic device can position the shield case 30 with respect to the substrate 10 when attaching the shield case 30 to the surface of the substrate 10. Therefore, the shield case 30 can be attached to the electronic device with high precision.

In the electronic device, the left side plate 34 and the right side plate 35 are bent toward the adjacent front side plate 32 or the rear side plate 33, and include a corner bent portion 38 that connects to the outer surface of the adjacent front side plate 32 or rear side plate 33. . Therefore, the electronic device can suppress the gap between the side plates. Further, when the electronic device is attached to the substrate 10, it is possible to suppress the bending of the spring leg portion 40A due to pressure contact with the ground pattern 11. As a result, the electronic device can obtain stable electromagnetic shielding properties.

The electronic device includes a convex portion 45a provided on the ridgeline of the second bent portion 45, which is the most advanced bent portion. Therefore, the electronic device can reliably obtain a contact point with the ground pattern 11 at the spring leg portion 40B.

Embodiment 2.
An electronic device according to Embodiment 2 will be described using FIG. 12. FIG. 12 is a front view of the spring leg portion 40D of the electronic device according to the second embodiment. FIG. 12 is a view of the spring leg portion 40D viewed from the top plate 31 side. Note that components having the same functions as those described in Embodiment 1 described above are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 12, the spring leg portion 40D has a configuration in which an R shape 61 is added to the configuration of the spring leg portion 40A according to the first embodiment. The rounded shape 61 is formed at the base of the base portion 41 .

Here, when the spring leg portion 40D is pressed against the contact surface of the ground pattern 11 and the first bent portion 44 and the second bent portion 45 of the spring leg portion 40D are bent, the base of the root portion 41 is There is a risk that stress due to the bending will be concentrated. On the other hand, since the electronic device according to the second embodiment has the rounded shape 61 at the base of the root portion 41, the rounded shape 61 disperses the stress and the plasticity of the spring leg portion 40D. Suppress deformation.

As described above, in the electronic device according to the second embodiment, the spring leg portion 40D has the root portion 41 that connects to the lower side of the front side plate 32 or the lower side of the rear side plate 33, and the base of the root portion 41 is shaped like an R. 61. Therefore, the electronic device can disperse stress by the rounded shape 61 and suppress plastic deformation of the spring leg portion 40D.

Embodiment 3.
An electronic device according to Embodiment 3 will be described using FIG. 13. FIG. 13 is a front view of spring legs 40E to 40G of the electronic device according to the third embodiment. Components having the same functions as those described in Embodiment 1 described above are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 13A, the spring leg portion 40E has a configuration in which an R shape 71 is added to the configuration of the spring leg portion 40A according to the first embodiment. The rounded shape 71 is formed in a concave shape at both longitudinal ends of the first bent portion 44 . Therefore, in the electronic device, the elasticity of the spring leg 40E can be improved, and the contact of the spring leg 40E with the contact surface of the ground pattern 11 can be stabilized. As a result, the electronic device can improve electromagnetic shielding properties. Note that the rounded shape 71 may be formed at both ends in the length direction of at least one of the

bent portions

44 and 45.

As shown in FIG. 13B, the spring leg portion 40F has a configuration in which an arcuate shape 72 is added to the configuration of the spring leg portion 40A according to the first embodiment. This arcuate shape 72 forms vertical sides on both sides in the width direction of the root portion 41 . That is, the arcuate shape 72 connects the base (upper end) of the base portion 41 and the first bent portion 44 and becomes concave toward the inside of the base portion 41 . Therefore, in the electronic device, the elasticity of the spring leg portion 40F can be improved, and the contact of the spring leg portion 40F with the contact surface of the ground pattern 11 can be stabilized. As a result, the electronic device can improve electromagnetic shielding properties.

As shown in FIG. 13C, the spring leg portion 40G has a configuration in which a wide portion 73 is added to the configuration of the spring leg portion 40A according to the first embodiment. This wide portion 73 is the widest among the spring leg portions 40G. Further, the wide portion 73 is formed across the inclined portion 42 and the flat portion 43 so as to straddle the second bent portion 45 in the length direction of the spring leg portion 40G. Therefore, in the electronic device, the elasticity of the spring leg 40G can be improved, and the contact of the spring leg 40G with the contact surface of the ground pattern 11 can be stabilized. As a result, the electronic device can improve electromagnetic shielding properties.

As described above, in the electronic device according to the third embodiment, the R shape 71 is formed at both ends in the length direction of at least one bent portion 44 among the plurality of

bent portions

44 and 45. Therefore, in the electronic device, the elasticity of the spring leg portion 40E can be improved, and the contact of the spring leg portion 40E with the contact surface of the ground pattern 11 can be stabilized.

In the electronic device, the spring leg portion 40F has a root portion 41 that connects to the lower side of the front side plate 32 or the lower side of the rear side plate 33, and the vertical sides on both sides in the width direction of the root portion 41 have an arc shape 72. Therefore, the electronic device can stabilize the contact of the spring leg portion 40F with the contact surface of the ground pattern 11.

In the electronic device, the spring leg portion 40G includes a second bent portion 45 at the most extreme bent portion, and has a wide portion 73 that is the widest among the spring leg portions 40G. In the electronic device, the elasticity of the spring leg 40G can be improved, and the contact of the spring leg 40G with the contact surface of the ground pattern 11 can be stabilized.

Embodiment 4.
An electronic device according to Embodiment 4 will be described using FIG. 14. FIG. 14 is a front view of the spring leg portion 40H of the electronic device according to the fourth embodiment. Components having the same functions as those described in Embodiments 1 to 3 above are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 14, the spring leg portion 40H has a configuration in which rounded shapes 61 and 71 are added to the configuration of the spring leg portion 40A according to the first embodiment. Therefore, the electronic device can suppress plastic deformation of the spring leg portion 40H and improve electromagnetic shielding properties.

As described above, in the electronic device according to the fourth embodiment, the spring leg portion 40H has a root portion 41 that connects to the lower side of the front side plate 32 or the lower side of the rear side plate 33, and the root portion 41 has an R-shaped base. 61, and an R shape 71 is formed at both ends in the length direction of at least one bent portion 44 among the plurality of

bent portions

44, 45.

Note that within the scope of the present disclosure, each embodiment can be freely combined, any component of each embodiment can be modified, or any component can be omitted from each embodiment. .

In the electronic device according to the present disclosure, by arranging the flat surface closer to the substrate than the fixed surface and parallel to the contact surface of the ground pattern, deterioration in electromagnetic shielding properties can be suppressed, and the electronic device It is suitable for use in

10 Board, 11 Ground pattern, 12 Screw hole, 13 Positioning slit, 20 Electronic components, 30 Shield case, 31 Top plate, 32 Front plate, 33 Rear plate, 34 Left side plate, 35 Right side plate, 36 Fixing part, 36a screw Through hole, 37 Positioning protrusion, 38 Corner bent part, 40A to 40H Spring leg part, 41 Root part, 42 Slanted part, 43 Flat part, 44 First bent part, 45 Second bent part, 45a Convex part, 51th 1 inclined part, 52 second inclined part, 53 first bent part, 54 second bent part, 55 third bent part, 61, 71 R shape, 72 arc shape, 73 wide part.

Claims

A board on the surface of which a ground pattern is provided to surround electronic components to be mounted;
It has a spring leg extending from the lower side of the side plate toward the surface of the board via a plurality of bent parts, and is attached to the surface of the board via a fixing surface so as to cover the periphery of the electronic component. Equipped with a shield case,
The spring leg is
having a flat surface extending toward the outside of the shield case from the most distal end of the plurality of folded parts and in contact with the ground pattern;
The flat surface is
An electronic device, wherein the electronic device is arranged closer to a substrate than the fixed surface, and is parallel to a contact surface of the ground pattern.
The electronic device according to claim 1, wherein the plurality of bent portions are arranged on the outer side of the shield case as they approach the tips of the spring leg portions.
The sum of the intersection angle between the top plate and the side plate in the shield case and the bending angle based on each bending part other than the most extreme bending part is larger than 90° and smaller than 180°. The electronic device according to claim 1, characterized in that the electronic device has an angle.
The electronic device according to claim 1, wherein the spring legs are provided alternately between two opposing side plates.
a positioning slit penetrating the substrate;
The electronic device according to claim 1, further comprising a positioning protrusion that protrudes from the side plate and is inserted into the positioning slit.
The side plate is
The electronic device according to claim 1, further comprising a corner bent portion that is bent toward an adjacent side plate and connected to an outer surface of the adjacent side plate.
The electronic device according to claim 1, further comprising a convex portion provided on a ridgeline of the most extreme bent portion.
The spring leg portion has a root portion that connects to the lower side of the side plate,
The electronic device according to claim 1, wherein the root of the root portion connected to the lower side of the side plate is rounded.
The electronic device according to claim 1, wherein at least one of the plurality of bent portions has an R shape formed at both ends in the length direction.
The spring leg portion has a root portion that connects to the lower side of the side plate,
The electronic device according to claim 1, wherein vertical sides on both sides in the width direction of the root portion are arcuate.
The spring leg is
The electronic device according to claim 1, further comprising a wide portion that includes the most extreme bent portion and is the widest among the spring leg portions.