WO2023179441A1

WO2023179441A1 - Camera module

Info

Publication number: WO2023179441A1
Application number: PCT/CN2023/081803
Authority: WO
Inventors: 缪伟亮; 罗振东; 韩磊
Original assignee: 华为技术有限公司
Priority date: 2022-03-22
Filing date: 2023-03-16
Publication date: 2023-09-28
Also published as: CN116847184A

Abstract

The present application relates to the technical fields of photographing and view screens, and in particular to a camera module, comprising a lens module, a printed circuit board, a first pad, a sensor, and a second pad. The printed circuit board is mounted on one side of the lens module; the printed circuit board is provided with a through slot; the first pad is connected to the printed circuit board; the sensor is mounted in the through slot; the second pad is connected to the sensor; the first pad and the second pad are electrically connected by means of spot welding or a conductive adhesive. In the camera module of the present application, the first pad and the second pad are electrically connected by means of spot welding or a conductive adhesive to realize an electrical connection between the sensor and the printed circuit board; the spot welding manner or the conductive adhesive manner does not occupy the height space; compared with the prior art, the occupation of the height of the camera module by a wire loop of a gold wire is saved, the height of the camera module is reduced, an installation space of the camera module in a mobile terminal is saved, and miniaturization and thinning development of the mobile terminal is facilitated.

Description

A camera module

This application claims priority to the Chinese patent application submitted to the China Patent Office on March 22, 2022, with the application number 202210287903.7 and the invention name "a camera module", the entire content of which is incorporated into this application by reference.

Technical field

The present application relates to the technical fields of photography and video, and in particular to a camera module.

Background technique

Mobile terminals such as mobile phones and tablets usually have camera modules to take pictures. Currently, the miniaturization and ultra-thin design of mobile terminals such as mobile phones and tablets continues to advance. However, the miniaturization of camera modules fails to meet the ultra-thin design requirements of the entire machine. This results in the rear camera modules of existing mobile terminals They all highlight the back shell of the mobile terminal, which will affect the overall design aesthetics of the mobile terminal as well as the user's feel and experience. In particular, current mobile phone applications with high screen-to-body ratios and full-screen designs, front-mounted automatic lifting modules, and ultra-short back focus require further reducing the module height based on existing modules to meet architectural and UI requirements. Therefore, how to reduce the overall size of the camera module to adapt to the miniaturized mobile terminal has become an urgent problem in the industry.

Application content

This application provides a camera module to solve the problem that the camera module is not conducive to the miniaturization design of mobile terminals due to its large size.

According to the first aspect of the application, the application provides a camera module, including a lens module, a printed circuit board, a first pad, a sensor and a second pad, and the printed circuit board is installed on one side of the lens module; A through slot is provided on the printed circuit board; the first soldering pad is connected to the printed circuit board; the sensor is installed in the through slot; the second soldering pad is connected to the sensor; the first soldering pad and the second soldering pad are spot welded or Conductive glue for electrical connections.

The camera module of this solution installs the sensor in the slot of the printed circuit board, so that the sensor does not occupy space in the height direction and saves height space. At the same time, by designing the first welding pad and the second welding pad, connect the first welding pad to the printed circuit board, connect the second welding pad to the sensor, and then connect the first welding pad and the second welding pad through spot welding or Conductive glue is used for electrical connection to realize the electrical connection between the sensor and the printed circuit board. The spot welding method or the conductive glue method does not occupy the height space. Compared with the existing technology, it saves the gold wire arc occupying the height of the camera module and realizes The reduced height of the camera module saves the installation space of the camera module in the mobile terminal, which is more conducive to the development of mobile terminals towards miniaturization and thinness.

In a possible design, the sensor has a first surface and a second surface, the first surface faces the lens module, and the second surface faces away from the lens module; the printed circuit board has a third surface and a fourth surface, and the third surface Facing the lens module, the fourth surface faces away from the lens module; the first surface does not extend beyond the third surface.

In this solution, in order to allow the through slot to have a wider space in the height direction for the arrangement of the first pad and the second pad, when installing the sensor in the through slot, ensure that the first surface does not exceed the third surface, so that the through groove reserves a certain height of installation space between the first surface and the third surface.

In a possible design, the first soldering pad is parallel to the second soldering pad; one end of the first soldering pad is connected to the printed circuit board, and the other end extends toward the through-slot direction.

In this solution, in order to make the connection between the first pad and the second pad more stable and convenient, the first pad and the second pad are made parallel during design.

In a possible design, the first soldering pad and the second soldering pad are electrically connected through spot welding; the first soldering pad is provided with a first spot welding hole.

In this solution, spot welding is facilitated by opening a first spot welding hole on the first pad.

In a possible design, a reinforcement layer is provided on the first pad.

In this solution, by arranging a reinforcement layer on the first bonding pad, the strength of the first bonding pad can be increased and its resistance to deformation can be improved.

In one possible design, the reinforcement layer is provided with a second spot welding hole communicating with the first spot welding hole.

In this solution, a second spot welding hole connected to the first spot welding hole is opened on the reinforcement layer to facilitate the spot welding liquid to enter the solder joint of the second pad more smoothly.

In one possible design, the second surface is flush with the fourth surface.

In this solution, in order to allow the through slot to reserve a higher installation space between the first surface and the third surface, when the sensor is installed in the through slot, the second surface and the fourth surface are kept flush.

In one possible design, the first pad does not extend beyond the third surface.

In this solution, in order to ensure that the first soldering pad does not occupy the height space of the camera module during installation, the design is such that the first soldering pad does not exceed the third surface.

In one possible design, a solder joint is formed at the welding point between the first solder pad and the second solder pad; the solder joint does not extend beyond the third surface.

In this solution, in order to ensure that the height of the solder joints does not affect the height dimensions of the camera module, the solder joints do not exceed the third surface during spot welding.

In a possible design, the first bonding pad and the second bonding pad are electrically connected through a first conductive glue; the first conductive glue is disposed between the first bonding pad and the second bonding pad.

In a possible design, the first soldering pad and the second soldering pad are electrically connected through a second conductive glue; the first soldering pad is connected to the third surface; one end of the second conductive glue is connected to the first soldering pad, and the other end of the second conductive glue is connected to the first soldering pad. Bend it into the through slot to connect with the second pad.

In one possible design, the outer side wall of the sensor is connected to the inner side wall of the printed circuit board through a first connecting glue.

In this solution, in order to install the sensor in the slot more stably, the outer side wall of the sensor and the inner side wall of the printed circuit board can be connected through the first connecting glue. This can reduce the use of steel sheets in the existing technology and further Reduce the height of the camera module.

One possible design also includes:

The infrared filter is connected to the third surface through the second connecting glue and covers the through groove or is integrated into the lens module;

Electronic component, one end of the electronic component is connected to the printed circuit board.

In this solution, the infrared filter plays the role of infrared cutoff. In order to reduce the design of the bracket support platform in the existing technology and thereby reduce the height and size of the camera module, the infrared filter can be connected to the camera through a second connecting glue. The third surface covers the slot. In order to further reduce the height of the camera module, the infrared filter can also be integrated into the lens module, which can reduce the height impact caused by the height of the infrared filter itself.

In one possible design, the lens module and the printed circuit board are connected through a support;

The lens module includes a voice coil motor and a lens assembly. The lens assembly is installed on the voice coil motor. The voice coil motor can drive the lens assembly to move. One end of the support member supports the voice coil motor, and the other end is connected to the printed circuit board.

In this solution, the design of the support member can play a role in supporting the lens module, and can also form a certain height of installation space between the lens module and the printed circuit board to accommodate the installation of electronic components. Compared with the existing technology, since there is no need to avoid gold wires in the height direction, and there is no need to design a receiving platform on the bracket, the design height of the support in this application can be further reduced by 0.3mm-0.4mm, as long as the installation height of the electronic components can be met. That's it. At the same time, if the infrared filter is integrated into the lens module, the assembly height of the lens module to the sensor can be further reduced, and the overall height of the camera module can be reduced by 0.8mm-1mm.

In one possible design, a gap is formed between the support member, the voice coil motor and the printed circuit board; the electronic components are arranged in the gap.

In this solution, in order to realize the installation of electronic components, a gap can be formed between the support, the voice coil motor and the printed circuit board. The height of the gap can be slightly higher than the height of the electronic components to facilitate the placement of electronic components in the gap. .

In one possible design, a mounting slot is provided in the support member; the electronic components are embedded in the mounting slot.

In one possible design, the support member is provided with a through hole at a position aligned with the through slot, and the through hole is connected to the through slot;

The lens assembly includes a first lens and a lens group composed of a plurality of second lenses. The lens group is installed on the voice coil motor. The first lens is installed on the support and covers the through hole.

In this solution, in order to prevent particles from falling onto the sensor surface, the sensor is sealed by splitting the optical structure of the lens assembly, installing the first lens of the lens assembly on the support and covering the through hole.

In one possible design, the lens module is connected to the printed circuit board by injection molding, and an injection molded part is provided between the lens module and the printed circuit board; the electronic components are embedded in the injection molded part.

According to the second aspect of the application, the application also provides a camera module, including a lens module, a printed circuit board, a sensor and a second pad. The printed circuit board is installed on one side of the lens module; on the printed circuit board A through slot is provided; a conductive interface is provided on the printed circuit board; the sensor is installed in the through slot; the second pad is connected to the sensor; the second pad is installed aligned with the conductive interface.

In this solution, a conductive interface is provided on the printed circuit board, and the conductive interface is connected to the second pad. When used, it is only necessary to insert a conductive connector into the conductive interface so that the conductive connector contacts the sensor, and the printed circuit board can be realized Electrical connection to the sensor. Such an electrical connection method does not occupy height space. Compared with the existing technology, it saves the gold wire arc from occupying the height of the camera module, reduces the height of the camera module, and saves the installation space of the camera module in the mobile terminal. , which is more conducive to the development of mobile terminals towards miniaturization and thinness.

In a possible design, the printed circuit board includes a first printed circuit board part and a second printed circuit board part connected as one body, and the first printed circuit board part and the second printed circuit board part are directed toward the lens along the printed circuit board. The directions of the modules are arranged in sequence; the first printed circuit board part is provided with a first groove, the second printed circuit board part is provided with a second groove connected with the first groove, and the diameter of the first groove is larger than the diameter of the second groove. Form a stepped channel;

The second printed circuit board part has a protruding part protruding toward the longitudinal axis of the slot relative to the first printed circuit board part. The second pad is aligned with the protruding part. The sensor is installed in the first slot. The conductive interface is disposed on the protruding part. .

It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application.

Description of the drawings

Figure 1 is a schematic three-dimensional structural diagram of a camera module provided by the present application in a first embodiment;

Figure 2 is a top view of a camera module provided by the present application in an embodiment;

Figure 3 is a cross-sectional view of the camera module in Figure 2 along the A-A direction in the first embodiment;

Figure 4 is a schematic three-dimensional structural diagram of the first bonding pad and the second bonding pad of the present application;

Figure 5 is a schematic structural diagram of the first pad in an implementation manner according to the embodiment of the present application;

Figure 6 is a schematic three-dimensional structural diagram of a camera module provided by the present application in a second embodiment;

Figure 7 is a schematic diagram of the connection between the printed circuit board and the sensor in the first implementation manner according to the embodiment of the present application;

Figure 8 is a schematic diagram of the connection between the printed circuit board and the sensor in the second embodiment of the present application;

Figure 9 is a schematic three-dimensional structural diagram of the spot welding connection between the first pad and the second pad in the embodiment of the present application;

Figure 10 is a schematic diagram of the connection between the first pad and the second pad in the first embodiment of the present application;

Figure 11 is a schematic diagram of the connection between the first pad and the second pad in the second embodiment of the present application;

Figure 12 is a schematic diagram of the connection between the first pad and the second pad in the third embodiment of the present application;

Figure 13 is a schematic diagram of the connection between the first pad and the second pad in the fourth embodiment of the present application;

Figure 14 is a cross-sectional view of the camera module provided by the present application in the second embodiment;

Figure 15 is a cross-sectional view of the camera module provided by this application in the third embodiment;

Figure 16 is a cross-sectional view of the camera module provided by the present application in the fourth embodiment;

Figure 17 is a cross-sectional view of the camera module provided by this application in the fifth embodiment;

Figure 18 is a cross-sectional view of the camera module provided by the present application in a sixth embodiment;

Figure 19 is a cross-sectional view of the camera module provided by the present application in a seventh embodiment;

Figure 20 is a cross-sectional view of the camera module provided by the present application in an eighth embodiment;

Figure 21 is a cross-sectional view of the camera module provided by this application in the ninth embodiment;

Figure 22 is a cross-sectional view of the camera module provided by the present application in a tenth embodiment;

Figure 23 is a schematic diagram of the connection between the first pad and the second pad in the fifth implementation manner in the embodiment of the present application;

Figure 24 is a cross-sectional view of the camera module provided by the present application in an eleventh embodiment.

Reference signs:
1-Lens module;
100-voice coil motor;
101-Lens assembly;
1011-First lens;
1012-lens set;
2-Printed circuit board;
20-Through slot;
201-first slot;
202-Second slot;
21-Third surface;
22-Fourth surface;
25-First Printed Circuit Board Department;
26-Second Printed Circuit Board Department;
261-Protuberance;
3-First pad;
30-The first spot welding hole;
31-pad unit;
4-sensor;
41-First surface;
42-Second surface;
5-Second pad;
6-Reinforcement layer;
60-Second spot welding hole;
7-solder joint;
8-The first conductive glue;
9-Second conductive glue;
10-First connecting glue;
11-Infrared filter;
12-Second connecting glue;
13-Electronic components;
130-gap;
14-Support;
140-installation slot;
141-through hole;
142-Installation platform;
16-Injection molded parts;
17-Connect the circuit board;
24-Conductive interface;
27-Protective board.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

Detailed ways

In order to better understand the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In related technology, a camera module generally includes a lens module, a printed circuit board, an infrared filter and a sensor. The lens module is installed on the side where the printed circuit board is installed through a bracket, and the sensor is attached to the side of the printed circuit board through a steel sheet. In the installation slot and electrically connected through gold wires, in order to install the infrared filter between the lens module and the sensor, a support platform is generally provided on the bracket. The design of the support platform will lead to the height dimension of the entire camera module. The increase is about 0.3mm. At the same time, the bracket and the infrared filter need to avoid the gold wire in the height direction. The height of the steel sheet itself and the height of the gold wire itself all occupy the height space of the camera module, causing the total height of the camera module to increase.

In order to solve the problem in the existing technology that the camera module is large in height and is not conducive to the miniaturization design of mobile terminals, the applicant found that the electrical connection between the sensor and the printed circuit board can be achieved through spot welding or conductive adhesive connection. Save the gold wire arc from occupying the height of the camera module and reduce the height of the camera module.

Based on the above considerations, the inventor designed a camera module after in-depth research. The camera module includes a lens module, a printed circuit board, a first pad, a sensor and a second pad. The printed circuit board is installed on the lens module. On one side of the group, a through slot is provided on the printed circuit board. The first soldering pad is connected to the printed circuit board. The sensor is installed in the through slot. The second soldering pad is connected to the sensor. The first soldering pad and the second soldering pad Electrical connection through spot welding or conductive glue.

This kind of camera module installs the sensor in the slot of the printed circuit board, so that the sensor does not occupy space in the height direction and saves height space. At the same time, by designing the first welding pad and the second welding pad, connect the first welding pad to the printed circuit board, connect the second welding pad to the sensor, and then connect the first welding pad and the second welding pad through spot welding or Conductive glue is used for electrical connection to realize the electrical connection between the sensor and the printed circuit board. The spot welding method or the conductive glue method does not occupy the height space. Compared with the existing technology, it saves the gold wire arc occupying the height of the camera module and realizes The reduced height of the camera module saves the installation space of the camera module in the mobile terminal, which is more conducive to the development of mobile terminals towards miniaturization and thinness.

The camera modules disclosed in the embodiments of this application can be, but are not limited to, FF, AF, telephoto, etc. modules. The camera modules can be, but are not limited to, used in camera systems of mobile terminals such as mobile phones, tablets, and televisions.

According to some embodiments of the present application, as shown in Figures 1-3, Figure 1 is a schematic three-dimensional structural diagram of a camera module according to some embodiments of the present application, and Figure 2 is a top view of a camera module according to some embodiments of the present application. Figure 3 is a cross-sectional view along the A-A direction in Figure 2 . The camera module includes a lens module 1, a printed circuit board 2 and a sensor 4. The lens module 1 can present the light image of the observed target on the sensor 4. The sensor 4 is used to convert the optical signal into an electrical signal. When the camera module is in use, ambient light passes through the lens module 1 and is incident on the sensor 4. The sensor 4 converts the ambient light signal into an electrical signal, and after further processing, an image of the subject can be formed. The printed circuit board 2 is installed on one side of the lens module 1 . The printed circuit board 2 is mainly used to support and connect various electronic components including the sensor 4 . The printed circuit board 2 is provided with a vertical through-slot 20, and the sensor 4 is installed in the through-slot 20. In this way, the sensor 4 does not occupy space in the height direction, and can save the height design space of the camera module.

As shown in Figure 3, the camera module also includes a first soldering pad 3 and a second soldering pad 5, wherein the first soldering pad 3 is connected to the printed circuit board 2, the second soldering pad 5 is connected to the sensor 4, and the The first pad 3 and the second pad 5 can be electrically connected through spot welding to realize the electrical connection between the sensor 4 and the printed circuit board 2. The spot welding method can use conductive particles such as tin or gold for spot welding. The first pad 3 and the second pad 5 can also be electrically connected through conductive glue. The conductive glue is an adhesive that has a certain conductivity after curing or drying. It can combine a variety of Conductive materials are connected together to form an electrical path between the connected materials. The spot welding method or the conductive glue method does not occupy height space. Compared with the existing technology, it saves the gold wire arc occupying the height of the camera module, reduces the height of the camera module, and saves the space of the camera module in the mobile terminal. The installation space is more conducive to the development of mobile terminals towards miniaturization and thinness.

Specifically, the first bonding pad 3 and the second bonding pad 5 may independently be, but are not limited to, copper, gold-plated copper, or aluminum pads. The arrangement of the first pads 3 corresponds to that of the second pads 5 .

As shown in Figure 4, the first pad 3 can be an integral pad structure. The overall pad structure can include but is not limited to a single row/double row/three rows/all around arrangement, and the number of single row pads is not limited, in which a single pad The number of solder points on the disk is not limited.

As shown in FIG. 5 , the first pad 3 may also independently include multiple pad units 31 . The multiple pad units 31 may be arranged at intervals. Each pad unit 31 of the first pad 3 corresponds to a second pad unit 31 . Pad unit for pad 5.

As shown in Figure 6, the camera module also includes a connecting circuit board 17. The connecting circuit board 17 is electrically connected to the printed circuit board 2. The camera module can be connected to the entire machine through the connecting circuit board 17.

As shown in FIG. 7 , the sensor 4 has a first surface 41 and a second surface 42 . The first surface 41 faces the lens module 1 , and the second surface 42 faces away from the lens module 1 . The printed circuit board 2 has a third surface 21 and a fourth surface 22 , the third surface 21 faces the lens module 1 , and the fourth surface 22 faces away from the lens module 1 . In order to allow the through groove 20 to have a wider space in the height direction for the arrangement of the first pad 3 and the second pad 5, when the sensor 4 is installed in the through groove 20, it is ensured that the first surface 41 does not exceed The third surface 21 is such that the through groove 20 reserves a certain height of installation space between the first surface 41 and the third surface 21 .

According to some specific embodiments of the present application, as shown in Figure 7, in order to make the connection between the first pad 3 and the second pad 5 more stable and convenient, during design, the first pad 3 and the second pad 5 are connected. Disk 5 is parallel. In order to enable the first pad 3 to be vertically connected to the second pad 5 located in the through slot 20 , one end of the first pad 3 is connected to the printed circuit board 2 , and the other end extends toward the through slot 20 to a position located in the through slot 20 . directly above the second pad 5. Specifically, as shown in FIG. 7 , the first pad 3 can be connected to the inner wall of the printed circuit board 2 to ensure that the first pad 3 does not exceed the third surface 21 , that is, keep the third surface 21 flush, or lower than On the third surface 21, as shown in Figure 8, the first pad 3 can also be connected to the third surface 21 to ensure that the first pad 3 can slightly exceed the third surface 21 to save 2 spaces on the printed circuit board in the prior art. The reserved space for gold wire wiring is 0.12-0.15mm to reduce the vertical height size. In this way, the height space can be correspondingly reduced by 0.12-0.15mm to achieve an ultra-thin design of the camera module.

According to some specific embodiments of the present application, as shown in Figures 7-9, the first bonding pad 3 and the second bonding pad 5 are electrically connected through spot welding. When the first pad 3 and the second pad 5 are connected by spot welding, as shown in Figure 7, the first pad 3 and the second pad 5 can be in a bonded state, as shown in Figures 8 and 9. A certain distance can be maintained between the first pad 3 and the second pad 5, and spot welding can be performed according to actual design needs.

As shown in Figure 10, in order to facilitate spot welding, a first spot welding hole 30 is opened on the first pad 3. Specifically, the shape of the first spot welding hole 30 includes but is not limited to circular, square, etc., the first The number of spot welding holes 30 may be one or more. If there are multiple spot welding holes 30 , the plurality of first spot welding holes 30 may be evenly distributed on the first pad 3 in an array. During spot welding, the spot welding liquid flows in along the first spot welding hole 30 to realize the spot welding connection between the first pad 3 and the second pad 5 . The specific implementation process is as follows: the printed circuit board 2 and the sensor 4 are assembled through PR recognition, the first pad 3 and the second pad 5 are array aligned, and the third pad is bonded with gold balls, tin balls, etc. through WB porcelain mouths. The solder joints of one pad 3 and the second pad 5 are electrically connected.

As shown in Figure 11, according to some specific embodiments of the present application, in order to increase the strength of the first pad 3 and improve its resistance to deformation, a reinforcement layer 6 can be provided on the first pad 3, and the reinforcement layer 6 can be designed on The side of the first pad 3 away from the second pad 5 can also be designed on the side close to the second pad 5 .

As shown in FIG. 12 , according to some specific embodiments of the present application, in order to facilitate the spot welding operation, a second spot welding hole 60 connected to the first spot welding hole 30 is opened on the reinforcement layer 6 . In some specific embodiments, the reinforcement layer 6 is designed on the side of the first pad 3 away from the second pad 5 , and the aperture of the second spot welding hole 60 can be larger than the aperture of the first spot welding hole 30 to facilitate spot welding. The liquid enters the solder joint of the second pad 5 more smoothly.

According to some specific embodiments of the present application, in order to reserve a higher installation space between the first surface 41 and the third surface 21 of the through channel 20, as shown in Figures 7 and 8, the sensor 4 is installed in the channel. When the groove 20 is formed, the second surface 42 and the fourth surface 22 are kept flush.

According to some specific embodiments of the present application, as shown in Figures 7 and 9, a welding point 7 is formed at the welding point between the first pad 3 and the second pad 5 through welding. In order to ensure that the height of the solder point 7 does not affect the height dimension of the camera module, the solder point 7 does not exceed the third surface 21 during spot welding.

As shown in Figure 13, according to some specific embodiments of the present application, the first pad 3 and the second pad 5 can also be electrically connected through a first conductive glue 8. During specific design, the first conductive glue 8 can be set Between the first pad 3 and the second pad 5 .

As shown in Figure 14, according to some specific embodiments of the present application, the first pad 3 can be connected to the third surface 21 without extending in the direction of the through groove 20. Such a design structure will not occupy too high a height space. For such a design structure, the first pad 3 and the second pad 5 can be electrically connected through the second conductive glue 9. Specifically, in order to ensure that the second conductive glue 9 does not occupy the height space during the connection process, during the connection , one end of the second conductive glue 9 is connected to the first pad 3 , and the other end is bent into the through groove 20 to be connected to the second pad 5 .

As shown in Figure 15, according to some specific embodiments of the present application, in order to install the sensor 4 in the through slot 20 more stably, the outer side wall of the sensor 4 and the inner side wall of the printed circuit board 2 can be connected through the first connecting glue 10 , thus reducing the use of steel sheets in the prior art and further reducing the height of the camera module.

As shown in Figure 16, according to some specific embodiments of the present application, in the actual application process, in order to protect the printed circuit board 2 and increase the strength of the printed circuit board 2, the printed circuit board 2 can also be positioned away from the lens. A protective plate 27 is provided on one side of the module 1 . Specifically, the protective plate 27 may be a steel plate.

According to some specific embodiments of the present application, as shown in Figure 17, the camera module also includes an infrared filter 11. The infrared filter 11 plays the role of infrared cutoff. In order to reduce the friction of the bracket support platform in the prior art, Designed to further reduce the height of the camera module, the infrared filter 11 can be connected to the third surface 21 through the second connecting glue 12 and cover the through groove 20 . The camera module also includes an electronic component 13 , one end of which is connected to the printed circuit board 2 .

In order to further reduce the height of the camera module, as shown in Figure 18, the infrared filter 11 can also be integrated into the lens module 1, which can reduce the height impact caused by the height of the infrared filter 11 itself.

As shown in Figure 18, according to some specific embodiments of the present application, the lens module 1 and the printed circuit board 2 can be connected through the support 14. The design of the support 14 can play a role in supporting the lens module 1, and can also be used to support the lens module 1. An installation space of a certain height is formed between the lens module 1 and the printed circuit board 2 to accommodate the installation of the electronic components 13 . Compared with the existing technology, because there is no need to avoid gold wires in the height direction, and there is no need to design a receiving platform on the bracket, this application The design height of the support member 14 can be further reduced by 0.3mm-0.4mm, as long as it can meet the installation height of the electronic component 13. At the same time, if the infrared filter 11 is integrated into the lens module 1, the lens can be further lowered. The assembly height from module 1 to sensor 4 can generally reduce the height of the camera module by 0.8mm-1mm.

In some specific embodiments, as shown in FIG. 18 , the support member 14 may be integrally designed with the lens module 1 . As shown in FIG. 19 , the support member 14 may also be a separate support frame structure.

Specifically, as shown in Figures 18 and 19, the lens module 1 includes a voice coil motor 100 and a lens assembly 101. The lens assembly 101 is installed on the voice coil motor 100. The voice coil motor 100 can drive the lens assembly 101 to move to achieve For zooming of the lens assembly 101, one end of the support member 14 supports the voice coil motor 100, and the other end is connected to the printed circuit board 2. According to some specific embodiments of the present application, in order to realize the installation of the electronic component 13, as shown in Figure 18, a gap 130 can be formed between the support 14, the voice coil motor 100 and the printed circuit board 2, and the height of the gap 130 can be Slightly higher than the height of the electronic component 13 to facilitate the placement of the electronic component 13 in the gap 130 . According to other specific embodiments of the present application, as shown in FIG. 19 , a mounting groove 140 can also be opened in the support member 14 along the longitudinal axis direction, so that the electronic component 13 is embedded in the mounting groove 140 .

As shown in Figure 20, according to some specific embodiments of the present application, the lens module 1 and the printed circuit board 2 can also be connected by injection molding. An injection molded part 16 is provided between the lens module 1 and the printed circuit board 2. The electronic component 13 is embedded in the injection molded part 16 .

According to some specific embodiments of the present application, as shown in Figure 19, when the infrared filter 11 is integrated into the lens module 1, so that the gap between the sensor 4 and the lens module 1 is in an open state, then the lens assembly 101 is Particles may be generated during movement driven by the voice coil motor 100 , and these particles may fall to the surface of the sensor 4 , thus affecting the normal use of the sensor 4 . In order to prevent particles from falling onto the surface of the sensor 4, this application disassembles the optical structure of the lens assembly 101 so that a piece of lens can be fixed on the support 14 or the printed circuit board 2, so that the sensor 4 is in a sealed state. Specifically, in some specific embodiments, as shown in Figure 21, a through hole 141 is opened in the position of the support member 14 aligned with the through slot 20 to ensure that the through hole 141 is connected to the through slot 20, thus ensuring that the light passes through the lens assembly. 101 to sensor 4 for smooth conduction. The lens assembly 101 includes a first lens 1011 and a lens group 1012 composed of a plurality of second lenses. The first lens 1011 and the lens group 1012 can form a complete optical system. The lens group 1012 is installed on the voice coil motor 100. A lens 1011 is installed on the support member 14 and covers the through hole 141. The first lens 1011 can keep the sensor 4 in a sealed state. In order to enable the first lens 1011 to be stably installed on the support member 14, the support member 14 includes a mounting platform 142 parallel to the sensor 4, and the first lens 1011 can rest on the mounting platform 142. In other specific embodiments, if the through groove 20 still has a certain installation space between the first surface 41 and the third surface 21 , the first lens 1011 can be supported on the third surface 21 of the printed circuit board 2 And covers the through groove 20 to achieve sealing of the sensor 4 .

As shown in Figure 22, this application also provides a camera module. The camera module includes a lens module 1, a printed circuit board 2, a sensor 4 and a second pad 5. The printed circuit board 2 is installed on the lens module 1 side. The printed circuit board 2 is provided with a through slot 20 . The printed circuit board 2 is provided with a conductive interface 24 . The sensor 4 is installed in the through slot 20 . The second pad 5 is connected to the sensor 4 . The second pad 5 is installed in alignment with the conductive interface 24 .

In this embodiment, a conductive interface 24 is provided on the printed circuit board 2 to connect the conductive interface 24 to the second pad 5. When in use, it is only necessary to insert a conductive connector into the conductive interface 24 to make the conductive connector contact the sensor. Then the electrical connection between the printed circuit board 2 and the sensor 4 can be realized. Such an electrical connection method does not occupy height space. Compared with the existing technology, it saves the gold wire arc from occupying the height of the camera module, reduces the height of the camera module, and saves the installation space of the camera module in the mobile terminal. , which is more conducive to the development of mobile terminals towards miniaturization and thinness.

According to some specific embodiments of the present application, as shown in Figure 23 and combined with Figure 22, the printed circuit board 2 includes a first printed circuit board part 25 and a second printed circuit board part 26 that are connected into one body. The first printed circuit board The first portion 25 and the second printed circuit board portion 26 are sequentially arranged along the printed circuit board 2 toward the lens module 1 . The first printed circuit board part 25 is provided with a first groove 201, and the second printed circuit board part 26 is provided with a second groove 202 connected with the first groove 201. The diameter of the first groove 201 is larger than the diameter of the second groove 202. A stepped through groove 20 is formed.

The second printed circuit board part 26 has a protruding part 261 protruding toward the longitudinal axis center line of the through groove 20 relative to the first printed circuit board part 25 , and the second pad 5 is aligned with the protruding part 261 . The sensor 4 is installed in the first groove 201 . The conductive interface 24 is provided on the protruding portion 261 .

The printed circuit board 2 of this embodiment includes a first printed circuit board part 25 and a second printed circuit board part 26 that are connected together. A first groove 201 is opened in the first printed circuit board part 25, and a first groove 201 is opened in the second printed circuit board part 25. The circuit board part 26 is provided with a second groove 202 connected with the first groove 201 , so that the diameter of the first groove 201 is larger than the diameter of the second groove 202 to form a stepped through groove 20 . The stepped through slot 20 facilitates the arrangement of the conductive interface 24 and the installation of the sensor 4 . Specifically, the second printed circuit board part 26 is provided with a protruding part 261 that protrudes toward the longitudinal axis center line of the through slot 20 relative to the first printed circuit board part 25, and a conductive interface 24 is provided on the protruding part 261. The sensor 4 is installed in the first groove 201 and the second pad 5 is aligned with the protrusion 261. This structural design is reasonable and compact, so that the sensor 4 and the printed circuit board 2 basically occupy no space other than the printed circuit board 2. The height space can reduce the height of the camera module, saving the installation space of the camera module in the mobile terminal, and is more conducive to the development of mobile terminals towards miniaturization and thinness.

As shown in Figure 22, according to some specific embodiments of the present application, the lens module 1 includes a voice coil motor 100 and a lens assembly 101. The lens assembly 101 is installed on the voice coil motor 100. The voice coil motor 100 can drive the lens assembly 101 to move. , to achieve zooming of the lens assembly 101 , one end of the support member 14 supports the voice coil motor 100 , and the other end is connected to the printed circuit board 2 . According to some specific embodiments of the present application, in order to realize the installation of the electronic component 13, a mounting groove 140 can be opened in the support member 14 along the longitudinal axis direction, so that the electronic component 13 is embedded in the mounting groove 140.

As shown in Figure 24, according to some specific embodiments of the present application, the lens module 1 and the printed circuit board 2 can also be connected by injection molding. An injection molded part 16 is provided between the lens module 1 and the printed circuit board 2. The electronic component 13 is embedded in the injection molded part 16 .

The above descriptions are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included in the protection scope of this application.

Claims

A camera module is characterized by including:

lens module(1);

A printed circuit board (2) is installed on one side of the lens module (1); a through slot (20) is provided on the printed circuit board (2);

The first pad (3) is connected to the printed circuit board (2);

The sensor (4) is installed in the through slot (20);

The second bonding pad (5) is connected to the sensor (4);

The first soldering pad (3) and the second soldering pad (5) are electrically connected through spot welding or conductive glue.
The camera module of claim 1, wherein the sensor (4) has a first surface (41) and a second surface (42), and the first surface (41) faces the lens module. (1), the second surface (42) faces away from the lens module (1); the printed circuit board (2) has a third surface (21) and a fourth surface (22), and the third surface (22) The surface (21) faces the lens module (1), and the fourth surface (22) faces away from the lens module (1); the first surface (41) does not exceed the third surface (21) ).
The camera module of claim 2, wherein the first soldering pad (3) is parallel to the second soldering pad (5); one end of the first soldering pad (3) is connected to the The other end of the printed circuit board (2) extends in the direction of the through groove (20).
The camera module according to claim 3, characterized in that the first soldering pad (3) and the second soldering pad (5) are electrically connected by spot welding; the first soldering pad (3) A first spot welding hole (30) is provided on the top.
The camera module according to claim 4, characterized in that a reinforcement layer (6) is provided on the first pad (3).
The camera module according to claim 5, characterized in that the reinforcement layer (6) is provided with a second spot welding hole (60) communicating with the first spot welding hole (30).
The camera module of claim 2, wherein the second surface (42) and the fourth surface (22) are flush with each other.
The camera module of claim 7, wherein the first pad (3) does not exceed the third surface (21).
The camera module according to claim 7, wherein a solder joint (7) is formed at the welding point between the first soldering pad (3) and the second soldering pad (5); Point (7) does not extend beyond said third surface (21).
The camera module according to claim 3, characterized in that the first soldering pad (3) and the second soldering pad (5) are electrically connected through a first conductive glue (8); the first conductive glue Glue (8) is disposed between the first soldering pad (3) and the second soldering pad (5).
The camera module of claim 2, wherein the first soldering pad (3) and the second soldering pad (5) are electrically connected through a second conductive glue (9); The disk (3) is connected to the third surface (21); one end of the second conductive glue (9) is connected to the first pad (3), and the other end is bent inward toward the through groove (20) Fold to connect with the second pad (5).
The camera module according to claim 1, characterized in that the outer wall of the sensor (4) and the inner wall of the printed circuit board (2) are connected through a first connecting glue (10).
The camera module of claim 2, further comprising:

The infrared filter (11) is connected to the third surface (21) through the second connecting glue (12) and covers the through groove (20) or is integrated into the lens module (1);

Electronic component (13), one end of the electronic component (13) is connected to the printed circuit board (2).
The camera module according to claim 13, characterized in that the lens module (1) and the printed circuit board (2) are connected through a support (14);

The lens module (1) includes a voice coil motor (100) and a lens assembly (101). The lens assembly (101) is installed on the voice coil motor (100). The voice coil motor (100) can The lens assembly (101) is driven to move. One end of the support member (14) supports the voice coil motor (100), and the other end is connected to the printed circuit board (2).
The camera module according to claim 14, characterized in that a gap is formed between the support member (14), the voice coil motor (100) and the printed circuit board (2); the electronic component (13) Set in the gap.
The camera module of claim 14, wherein a mounting slot (140) is provided in the support member (14); and the electronic component (13) is embedded in the mounting slot (140).
The camera module of claim 16, wherein the support member (14) has a through hole (141) aligned with the through slot (20), and the through hole (141) is connected to the through hole (141). The above-mentioned through slot (20) is connected;

The lens assembly (101) includes a first lens (1011) and a lens group (1012) composed of a plurality of second lenses. The lens group (1012) is installed on the voice coil motor (100). The first lens (1011) is installed on the support member (14) and covers the through hole (141).
The camera module according to claim 13, characterized in that the lens module (1) is injection-molded to the printed circuit board (2), and the lens module (1) is connected to the printed circuit board (2) by injection molding. 2) An injection molded part (16) is arranged between them; the electronic component (13) is embedded in the injection molded part (16).
A camera module is characterized by including:

lens module(1);

The printed circuit board (2) is installed on one side of the lens module (1); the printed circuit board (2) is provided with a through slot (20); the printed circuit board (2) is provided with a conductive interface(24);

The sensor (4) is installed in the through slot (20);

The second soldering pad (5) is connected to the sensor (4); the second soldering pad (5) is installed in alignment with the conductive interface (24).
The camera module according to claim 19, characterized in that the printed circuit board (2) includes a first printed circuit board part (25) and a second printed circuit board part (26) connected together, and the The first printed circuit board part (25) and the second printed circuit board part (26) are arranged sequentially along the direction of the printed circuit board (2) toward the lens module (1); the first printed circuit board The circuit board part (25) is provided with a first groove (201), and the second printed circuit board part (26) is provided with a second groove (202) connected with the first groove (201). The diameter of one groove (201) is larger than the diameter of the second groove (202) to form the stepped through groove (20);

The second printed circuit board part (26) has a protrusion (261) protruding toward the longitudinal axis of the through groove (20) relative to the first printed circuit board part (25), and the second pad (5) Arrange in alignment with the protruding part (261); the sensor (4) is installed in the first groove (201); and the conductive interface (24) is provided on the protruding part (261).