WO2023177142A1

WO2023177142A1 - Fire detection device and fire detection system comprising semiconductor chip

Info

Publication number: WO2023177142A1
Application number: PCT/KR2023/003135
Authority: WO
Inventors: 조영진
Original assignee: 주식회사 로제타텍
Priority date: 2022-03-14
Filing date: 2023-03-08
Publication date: 2023-09-21
Also published as: KR20230134639A

Abstract

A fire detection device according to one embodiment of the present invention comprises: a sensor that detects whether a fire has occurred and generates fire information; and a semiconductor chip that receives the fire information, wherein the semiconductor chip may comprise: a communication unit that performs radio frequency (RF) communication; a sensing unit that receives the fire information from the sensor; a memory in which an algorithm is stored; a control unit that generates a signal on the basis of the fire information and the algorithm; and a power supply unit that receives power from the outside and supplies the power to the communication unit, the sensing unit, and the control unit.

Description

Fire detection devices and fire detection systems including semiconductor chips

The present invention relates to a fire detection device and a fire detection system including a semiconductor chip with improved power consumption and manufacturing efficiency.

Typically, buildings are equipped with fire alarm devices to reduce casualties in the event of a fire. These fire alarm devices are composed of a signal processing semiconductor that controls the signal from a sensor that detects heat, smoke, flame, etc. generated by a fire, and a communication semiconductor that notifies officials or residents in the building of the occurrence of a fire, so the manufacturing cost is low. As this increases, the manufacturing efficiency of the fire detection device decreases, and power consumption increases to operate a plurality of semiconductors separately.

The purpose of the present invention is to provide a fire detection device and a fire detection system including a semiconductor chip with improved power consumption and manufacturing efficiency.

A fire detection device according to an embodiment of the present invention includes a sensor that detects whether a fire has occurred and generates fire information, and a semiconductor chip that receives the fire information, and the semiconductor chip performs RF communication (radio frequency communication). a communication unit, a sensing unit that receives the fire information from the sensor, a memory in which an algorithm is stored, a control unit that generates a signal based on the fire information and the algorithm, and a control unit that receives power from the outside, the communication unit, the sensing unit , and a power supply unit that supplies the power to the control unit.

When receiving the fire information, the semiconductor chip transmits a signal after a first time period, and the signal includes a confirmation response to the fire information and a control signal for controlling the sensor, and the confirmation response and the control signal include It can be transmitted as a whole.

The control signal may initialize the state of the sensor and the semiconductor chip.

The power supply unit operates in a power saving mode consuming first power and a normal mode consuming a second power higher than the first power, and the communication unit may transmit an activation signal to change the power saving mode to the normal mode. .

The power supply may operate in the power saving mode and operate in the normal mode when the magnitude of the received activation signal is greater than a predetermined value.

The current of the first power may be 1uA (microampere) to 5uA, and the current of the second power may be 20mA (milliampere) to 50mA.

The RF communication can use frequencies in the 400MHz to 900MHz band.

The communication unit receives big data from an external server, the algorithm includes an algorithm that determines the validity of the fire information, and the control unit determines the validity of the fire information based on the big data, the algorithm, and the fire information. can be judged based on different criteria depending on the situation.

The control unit may determine whether the fire information is invalid data such as water vapor, cigarette smoke, and/or exhaust gas based on the fire information, the algorithm, and the big data.

The communication unit may receive digital twin information that virtually represents the building from the outside, and the control unit may calculate fire analysis data based on the digital twin information and the fire information.

The semiconductor chip may be composed of an application-specific integrated circuit (ASIC).

It may further include a temperature compensated crystal oscillator electrically connected to the semiconductor chip.

The RF communication may use a low-power wide-area network (LPWAN).

The fire detection system according to an embodiment of the present invention detects the occurrence of a fire using different address values, generates fire information, performs RF communication (radio frequency communication) with each other, and includes a plurality of fire detection devices including semiconductor chips. , a repeater that performs the RF communication with each of the plurality of sensors, receives the fire information from the plurality of sensors, and includes the semiconductor chip, performs the RF communication with the repeater and includes the semiconductor chip A receiver that performs RF communication with the receiver and a server that includes the semiconductor chip, wherein the semiconductor chip receives the fire information from a communication unit that performs RF communication (radio frequency communication) and the sensor. A sensing unit, a memory in which the algorithm is stored, a control unit that generates a signal based on the fire information and the algorithm, and a power supply that receives power from the outside and supplies the power to the communication unit, the sensing unit, and the control unit. May include wealth.

As described above, a semiconductor chip having the same configuration may be installed in each of the plurality of fire detection devices, repeaters, receivers, and first servers. Algorithms can be stored in the memory of a semiconductor chip. That is, rather than separate, different semiconductor chips being mounted on a plurality of fire detection devices, repeaters, receivers, and first servers, semiconductor chips of the same configuration may be mounted. A semiconductor chip may be composed of an application-specific integrated circuit (ASIC). The custom integrated circuit can be designed to be optimized for fire detection and signal processing. Therefore, product manufacturing costs are reduced, and a fire detection system with reduced power consumption can be provided due to optimized design.

1 is a diagram illustrating a semiconductor chip according to an embodiment of the present invention.

Figure 2 shows a fire detection system according to an embodiment of the present invention.

Figure 3 is a block diagram showing a fire detection device according to an embodiment of the present invention.

Figure 4 is a diagram showing a fire signal and how the signal operates according to an embodiment of the present invention.

Figure 5 shows the operation of the first server according to an embodiment of the present invention.

Figure 6 shows the operation of the first server according to an embodiment of the present invention.

In this specification, when a component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” another component, it is said to be placed/directly on the other component. This means that they can be connected/combined or a third component can be placed between them.

Like reference numerals refer to like elements. Additionally, in the drawings, the thickness, proportions, and dimensions of components are exaggerated for effective explanation of technical content. “And/or” includes all combinations of one or more that can be defined by the associated components.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

Additionally, terms such as “below,” “on the lower side,” “above,” and “on the upper side” are used to describe the relationships between the components shown in the drawings. The above terms are relative concepts and are explained based on the direction indicated in the drawings.

Terms such as “include” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but do not include one or more other features, numbers, or steps. , it should be understood that this does not exclude in advance the possibility of the presence or addition of operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Additionally, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and unless explicitly defined herein, should not be interpreted as having an overly idealistic or overly formal meaning. It shouldn't be.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Referring to FIG. 1, a semiconductor chip (AC) may be composed of an application-specific integrated circuit (ASIC). The semiconductor chip AC may have a surface parallel to a surface defined by the first direction DR1 and the second direction DR2. The thickness direction of the semiconductor chip AC may be indicated by the third direction DR3. The upper and lower surfaces of the semiconductor chip AC may be separated by the third direction DR3. The third direction DR3 may intersect the first direction DR1 and the second direction DR2. For example, the first direction DR1, the second direction DR2, and the third direction DR3 may be orthogonal to each other. Additionally, in this specification, the surface defined by the first direction DR1 and the second direction DR2 is defined as a plane, and “viewed on a plane” may be defined as viewed in the third direction DR3.

The semiconductor chip AC may have a first length L1 in the first direction DR1. The first length L1 may be 5 mm (millimeter) to 10 mm. For example, the first length L1 may be 7 mm.

The semiconductor chip AC may have a second length L2 in the second direction DR2. The second length (L2) may be 5 mm to 10 mm. For example, the second length L2 may be 7 mm.

The semiconductor chip AC may have a first thickness W1 in the third direction DR3. The first thickness W1 may be 1 mm to 5 mm. For example, the first thickness W1 may be 3 mm.

A semiconductor chip (AC) may include a communication unit (RF), a sensing unit (SP), a memory (MM), a control unit (CC), and a power supply unit (PS).

The communication unit (RF) may include a communication function using RF communication (Radio Frequency communication). The RF communication method may be a communication method that exchanges information by radiating radio frequencies. As a broadband communication method using frequencies, stability can be high due to low climate and environmental influences. The RF communication method can link voice or other additional functions and can have a high transmission speed. For example, the RF communication method can use frequencies in the 400MHz to 900MHz band. However, this is an example, and in one embodiment of the present invention, communication methods such as Ethernet, Wifi, LoRA, M2M, 3G, 4G, LTE, LTE-M, Bluetooth, or WiFi Direct may be used.

The RF communication method may include communication using a low-power wide-area network (LPWAN). According to the present invention, a semiconductor chip (AC) can operate at low power by means of a communication unit (RF) that can operate at low power, and a device equipped with the semiconductor chip (AC) can have improved operation time.

In one embodiment of the present invention, the RF communication method may include a Listen Before Transmission (LBT) communication method. This is a frequency selection method that determines whether the selected frequency is being used by another system and reselects another frequency when it is determined to be occupied. For example, a node intending to transmit can first listen to the medium, determine whether it is in an idle state, and then send a backoff protocol before transmitting. By distributing data using this LBT communication method, collisions between signals in the same band can be prevented.

The sensing unit (SP) can receive fire information from an external sensor.

Memory (MM) may include volatile memory or non-volatile memory. Volatile memory may include DRAM, SRAM, flash memory, or FeRAM. Non-volatile memory may include SSD or HDD.

The fire information received from the sensing unit (SP) may be stored in the memory (MM). An algorithm (AL) may be stored in the memory (MM). The algorithm AL may include an algorithm for determining the validity of the fire information and an algorithm for operating the mode of the power supply unit (PS). However, this is an example, and the memory (MM) according to an embodiment of the present invention may further include algorithms necessary for implementing core functions of the semiconductor chip (AC).

The control unit (CC) may generate a signal based on the fire information and algorithm (AL).

The power supply unit (PS) can receive power from the outside and supply the power to the communication unit (RF), the sensing unit (SP), and the control unit (CC).

Referring to FIGS. 1 and 2 , the fire detection system 10 may include a plurality of fire detection devices 100, a repeater 200, a receiver 300, and a first server 400.

Each of the plurality of fire detection devices 100 can detect whether a fire has occurred. FIG. 2 illustrates five fire detection devices 100 by way of example, but is not limited thereto.

Each of the plurality of fire detection devices 100 can detect whether a fire has occurred. Each of the plurality of fire detection devices 100 may include a semiconductor chip (AC-1), a sensor (SS), an amplifier (AMP), a battery cell (TT), and an antenna (ATN-S). Each of the plurality of semiconductor chips (AC-1, AC-2, AC-3, and AC-4) in FIG. 2 may have the same configuration as the semiconductor chip (AC) of FIG. 1.

The sensor SS may detect at least one of smoke, temperature, humidity, and gas. The sensor SS may generate fire information by detecting at least one of smoke, temperature, humidity, and gas. The fire information may include values measured by the sensor SS. In FIG. 3, one sensor SS is shown as an example, but the present invention is not limited thereto. For example, each of the plurality of sensing units SM includes a plurality of sensors, and each of the plurality of sensors can detect at least one of smoke, temperature, humidity, and gas.

The sensor (SS) may be electrically connected to the semiconductor chip (AC-1). The sensing unit (SP) of the semiconductor chip (AC-1) may receive fire information from the sensor (SS).

Information about the sensor SS may be stored in the memory MM of the semiconductor chip AC-1. The control unit (CC) of the semiconductor chip (AC-1) can automatically determine a modulation method for the signal generated by the sensor (SS) mounted on the fire detection device 100 based on the above information. Through this automatic modulation method, fire information can be easily generated regardless of what type of sensor (SS) is mounted on the fire detection device 100.

The control unit (CC) of the semiconductor chip (AC-1) may generate the first fire detection signal (SG-1) based on fire information.

The antenna (ATN-S) can be electrically connected to the semiconductor chip (AC-1). The communication unit (RF) of the semiconductor chip (AC-1) may transmit the first fire detection signal (SG-1) to the antenna (ATN-S). The first fire detection signal (SG-1) may include a first signal (SG-1a) and a second signal (SG-1b).

The antenna (ATN-S) may transmit the first signal (SG-1a) to the repeater 200. The antenna ATN-S may transmit the first signal SG-1a to at least one of the plurality of adjacent fire detection devices 100.

When the fire detection device 100 and the repeater 200 are far away from each other and it is difficult for the repeater 200 to directly receive the first fire detection signal (SG-1), the semiconductor chip (AC-1) detects other nearby fires. The device 100 can be controlled to transmit the first fire detection signal (SG-1). The fire detection device 100 can stably transmit signals to the repeater 200. The antenna ATN-S may receive the first fire detection signal SG-1 from another adjacent fire detection device 100 and provide the first fire detection signal SG-1 to the communication unit RF of the semiconductor chip AC-1.

The amplification unit (AMP) may amplify the first signal (SG-1a) and convert it into the second signal (SG-1b).

The antenna ATN-S may receive the first signal SG-1a from another fire detection device 100. The transmission rate and/or accuracy of the received first signal (SG-1a) may be reduced due to transmission distance and noise during the process of being transmitted from another adjacent fire detection device 100. The amplification unit (AMP) may amplify the first signal (SG-1a) of reduced quality and convert it into the second signal (SG-1b). The second signal (SG-1b) may have improved transmission rate and/or accuracy. The antenna (ATN-S) may transmit the second signal (SG-1b) to the repeater 200. The antenna ATN-S may transmit the second signal SG-1b to at least one of the plurality of adjacent fire detection devices 100. The second signal (SG-1b) can increase the accuracy, transmission rate, and transmission distance of signals transmitted between the plurality of fire detection devices 100 and the repeater 200.

The second signal (SG-1b) according to an embodiment of the present invention may be transmitted to another adjacent fire detection device 100 and amplified again in the amplifier (AMP) of the other adjacent fire detection device 100.

According to the present invention, each of the plurality of fire detection devices 100 can stably transmit data to adjacent fire detection devices 100 and the repeater 200 using an amplifier (AMP). Accordingly, a plurality of fire detection devices 100 with improved reliability can be provided.

The battery unit (TT) can supply power to the semiconductor chip (AC-1), sensor (SS), amplifier (AMP), and antenna (ATN-S). The battery unit (TT) may be electrically connected to the power supply unit (PS) of the semiconductor chip (AC-1).

The fire detection device 100 according to an embodiment of the present invention may use an RF communication method. The RF communication method may consume less power. The power usage of the fire detection device 100 can be minimized, and the fire detection device 100 can be operated with low power. Accordingly, the battery unit (TT) can stably supply power to the sensor (SS), semiconductor chip (AC-1), amplifier (AMP), and antenna (ATN-S) for a long time.

The power supply unit (PS) of the semiconductor chip (AC-1) can operate in power saving mode and normal mode. The power saving mode may be referred to as standby mode. The normal mode may be referred to as active mode.

The semiconductor chip (AC-1) and the fire detection device 100 may stand by in the power saving mode that minimizes power consumption in situations where a fire is not detected. The power saving mode may consume first power. The first current of the first power may be 1uA (microampere) to 5uA. For example, the first current may be 3uA.

When a fire situation is detected or an activation signal is received, the semiconductor chip (AC-1) and the fire detection device 100 may be activated in a normal mode state. For example, when the sensor SS detects a fire and generates fire information, the semiconductor chip AC-1 and the fire detection device 100, which were on standby in power saving mode, may be activated in normal mode. The normal mode may consume second power. The second power may be higher than the first power. The second current of the second power may be 20mA (milliampere) to 50mA.

When the sensor SS detects a fire, it can generate fire information and transmit it to the sensor unit SP of the semiconductor chip AC-1. When receiving fire information, the control unit (CC) of the semiconductor chip (AC-1) may generate an activation signal for changing from the power saving mode to the normal mode and a signal including the fire information received by the sensor unit (SP). there is.

The communication unit (RF) of the semiconductor chip (AC-1) may transmit the signal to the antenna (ATN-S). The signal may be included in the first fire detection signal (SG-1).

After transmitting the signal, the semiconductor chip (AC-1) and the fire detection device 100 can standby again in power saving mode.

Additionally, the fire detection device 100 may standby in power saving mode. When the fire detection device 100 receives the activation signal from another adjacent fire detection device 100, it may change to the normal mode.

When the magnitude of the activation signal is less than a predetermined value, the control unit (CC) of the semiconductor chip (AC-1) continues to operate in the power saving mode, and when the magnitude of the activation signal is greater than a predetermined value, the power supply unit (PS) can operate in the normal mode.

The control unit (CC) of the semiconductor chip (AC-1) may compare the activation signal with a reference value when the magnitude of the activation signal is greater than a predetermined value. If the activation signal does not match the reference value, the control unit (CC) may determine the activation signal to be another signal and operate in the power saving mode again. The control unit (CC) may operate the power supply unit (PS) in the normal mode if the activation signal matches the reference value.

The power supply unit (PS) of the semiconductor chip (AC-1) may operate in the power saving mode and then in the normal mode when the received activation signal is an appropriate value.

According to the present invention, the plurality of fire detection devices 100 operate in a power saving mode that does not consume power and a normal mode that operates in a fire situation to minimize power use of each of the plurality of fire detection devices 100. can do. Accordingly, each of the plurality of fire detection devices 100 can be driven at low power.

In addition, according to the present invention, the plurality of fire detection devices 100, repeater 200, and receiver 300 are equipped with semiconductor chips (AC-1, AC-2, AC-3, AC-4) having the same configuration. ) can be implemented. An algorithm for driving the device in normal mode or power saving mode may be stored in the memory (MM) of the semiconductor chip (AC-1, AC-2, AC-3, and AC-4). The power supply unit (PS) of the semiconductor chip (AC-1, AC-2, AC-3, AC-4) can drive the device in normal mode or power saving mode based on the above algorithm. That is, rather than different semiconductor chips being mounted on the plurality of fire detection devices 100, repeater 200, and receiver 300, semiconductor chips of the same configuration (AC-1, AC-2, AC-3, AC -4) can be implemented. Semiconductor chips (AC-1, AC-2, AC-3, AC-4) may be composed of application-specific integrated circuits (ASICs). The application-specific integrated circuit may be designed to be optimized for power control for low-power operation. Accordingly, the product manufacturing cost is reduced, and the fire detection system 10 with reduced power consumption can be provided due to the optimized design.

Additionally, according to the present invention, the semiconductor chip AC-1 of each of the plurality of fire detection devices 100 can determine whether the activation signal is an appropriate signal. When the activation signal is not suitable, the plurality of fire detection devices 100 may maintain the power saving mode, and when the activation signal is suitable, they may operate in the normal mode. The plurality of fire detection devices 100 can prevent unnecessary power consumption. Each of the plurality of fire detection devices 100 is capable of low-power operation. Accordingly, it is possible to provide a fire detection device 100 including a semiconductor chip (AC-1) with improved reliability.

The repeater 200 can communicate with a plurality of fire detection devices 100. For example, the repeater 200 can communicate with 40 fire detection devices 100. The repeater 200 can convert the first fire detection signal (SG-1) into the second fire detection signal (SG-2). The repeater 200 may transmit the second fire detection signal (SG-2) to the receiver 300.

The repeater 200 may include a semiconductor chip (AC-2) and an antenna (ATN-G). The antenna (ATN-G) may be electrically connected to the communication unit (RF) of the semiconductor chip (AC-2). The semiconductor chip AC-2 may have the same configuration as the semiconductor chip AC-1 of the fire detection device 100.

The antenna (ATN-G) can communicate with a plurality of fire detection devices 100 and the receiver 300. The antenna ATN-G may receive the first fire detection signal SG-1 from each of the plurality of fire detection devices 100. The antenna (ATN-G) and the antenna (ATN-S) of each of the plurality of fire detection devices 100 may communicate wirelessly through RF communication. The antenna (ATN-G) can transmit the second fire detection signal (SG-2) to the receiver 300. The antenna (ATN-G) and the antenna (ATN-R) of the receiver 300 can communicate wirelessly through RF communication.

The control unit (CC) of the semiconductor chip (AC-2) can convert the first fire detection signal (SG-1) into the second fire detection signal (SG-2). The communication unit (RF) may provide the second fire detection signal (SGa) to the antenna (ATN-G).

The receiver 300 may receive the second fire detection signal (SG-2) from the repeater 200. The receiver 300 can communicate with a plurality of repeaters 200. For example, receiver 300 may communicate with 24 repeaters 200. That is, the receiver 300 can communicate with 960 fire detection devices 100. The receiver 300 can convert the second fire detection signal (SG-2) into the third fire detection signal (SG-3). The receiver 300 may transmit the third fire detection signal (SG-3) to the first server 400.

The receiver 300 may include a display unit (DA-R), a semiconductor chip (AC-3), and an antenna (ATN-R). The antenna (ATN-R) may be electrically connected to the communication unit (RF) of the semiconductor chip (AC-3). The semiconductor chip AC-3 may have the same configuration as the semiconductor chip AC-1 of the fire detection device 100 and the semiconductor chip AC-2 of the repeater 300.

The antenna (ATN-R) can communicate with the repeater 200 and the first server 400. The antenna (ATN-R) can receive the second fire detection signal (SG-2) from the repeater 200. The antenna (ATN-R) and the antenna (ATN-G) of the repeater 200 can communicate wirelessly through RF communication. The antenna (ATN-R) may transmit the third fire detection signal (SG-3) to the first server 400. The antenna (ATN-R) and the first server 400 can communicate wirelessly through RF communication.

The display unit DA-R may provide image information corresponding to the status of the plurality of fire detection devices 100 and/or the status of the repeater 200. The display unit DA-R may include a liquid crystal display panel or an organic light emitting display panel. The display unit (DA-R) can receive input from the outside provided by the user. For example, the display unit DA-R may further include a touch unit. For example, the user may receive information about the location where each of the plurality of fire detection devices 100 is placed and the type of value detected by each of the plurality of fire detection devices 100 through the display unit DA-R. Information and/or information about whether each of the plurality of fire detection devices 100 is operating normally can be obtained and controlled.

The control unit (CC) of the semiconductor chip (AC-E) may be electrically connected to the display unit (DA-R). The control unit (CC) can control the receiver 300 based on input from the display unit (DA-R).

The control unit (CC) of the semiconductor chip (AC-3) can convert the second fire detection signal (SG-2) into the third fire detection signal (SG-3). The communication unit (RF) can provide the third fire detection signal (SG-3) to the antenna (ATN-R).

The receiver 300 can control a plurality of fire detection devices 100 deployed in various locations through the repeater 200.

The first server 400 may determine the fire situation based on the third fire detection signal (SG-3) received from the receiver 300.

The first server 400 may include a semiconductor chip (AC-4). The semiconductor chip (AC-4) is a semiconductor chip (AC-1) of the fire detection device 100, a semiconductor chip (AC-2) of the repeater 200, and a semiconductor chip (AC-3) of the receiver 300. The chips may have the same configuration.

The control unit (CC) of the semiconductor chip (AC-4) can determine the validity of the third fire detection signal (SG-3). This will be described later.

The communication unit (RF) of the semiconductor chip (AC-4) can receive big data from an external second server (BS). The big data may be stored in the memory of the second server (BS). However, this is an example, and the big data according to an embodiment of the present invention may be stored in a separate memory of the first server 400.

The big data may include surrounding environmental data to determine whether a fire has occurred. For example, the surrounding environment data includes data corresponding to the probability of fire occurrence by date, data corresponding to the probability of fire occurrence by time, data corresponding to the probability of fire occurrence by space, data corresponding to the probability of fire occurrence by temperature, and humidity. It may include at least one of data corresponding to the probability of fire occurrence by each weather, data corresponding to the probability of fire occurrence by weather, data corresponding to the probability of fire occurrence by industry, and data corresponding to the probability of fire occurrence by user.

For example, the data corresponding to the fire occurrence probability by date may include the fire occurrence probability by day of the week and the fire occurrence probability by month. The data corresponding to the fire occurrence probability by time may include the fire occurrence probability divided into dawn, morning, afternoon, evening, or late night. Data corresponding to the probability of fire occurrence by space may include the probability of fire occurrence divided into urban areas, mountainous regions, beaches, or rural areas. Data corresponding to the probability of fire occurrence by temperature may include the probability of fire occurrence divided into spring, summer, fall, or winter. The data corresponding to the probability of fire occurrence by humidity may include the probability of fire occurrence by specific humidity level. The data corresponding to the probability of fire occurrence by weather may include the probability of fire occurrence divided into clear days, cloudy days, or rainy days. Data corresponding to the probability of fire occurrence by industry may include the probability of fire occurrence divided into homes, restaurants, factories, or offices. The fire occurrence probability for each user may include the fire occurrence probability classified by age, occupation, or gender.

The big data may be updated periodically.

When the first server 400 determines that the third fire detection signal (SG-3) is a valid signal, it can transmit a warning message and location information to a plurality of parties 20.

The plurality of stakeholders 20 may include, for example, a fire department, officials at a place where a fire occurs, the Ministry of Public Safety and Security (or a public institution related to public safety), etc. A plurality of parties 20 may receive a fire warning message in the form of a text message, video message, or voice message through a landline phone, smartphone, or other mobile terminal.

Referring to FIG. 3, the fire detection device 100 includes a semiconductor chip (AC), a balun (BL), an antenna (ATN), a storage unit (ROM), a first sensor (SS1), a second sensor (SS2), and a speaker. (SPK), an oscillator (OSC), a light emitting unit (LED), and a power source (PW).

The semiconductor chip (AC) may include a communication unit (RF), a control unit (CC), a sensor unit (SP), a memory (MM), and a power supply unit (PS).

The antenna (ATN) may be electrically connected to the communication unit (RF) via the balun (BL). Balun (BL) can convert signals between balanced and unbalanced circuits.

The first sensor SS1 may include a sensor that detects heat and/or smoke.

The second sensor SS2 may be a different sensor from the first sensor SS1. The second sensor SS2 may include an acceleration sensor and/or a tilt sensor. However, this is an example, and the measurement objects of each of the first sensor (SS1) and the second sensor (SS2) according to an embodiment of the present invention are not limited thereto. For example, each of the first sensor SS1 and the second sensor SS2 may include a sensor for configuring the Internet of Things (IoT).

The first sensor SS1 and the second sensor SS2 may be electrically connected to the sensor unit SP of the semiconductor chip AC. The sensor unit (SP) may receive information sensed by each of the first sensor (SS1) and the second sensor (SS2).

The storage unit (ROM) may include volatile memory or non-volatile memory. Volatile memory may include DRAM, SRAM, flash memory, or FeRAM. Non-volatile memory may include SSD or HDD.

The storage unit (ROM) may be electrically connected to the memory (MM).

The speaker (SPK) can emit an alarm sound. The speaker (SPK) may receive a signal about the status of the fire detection device 100 from the control unit (CC) and inform the outside.

The light emitting unit (LED) can display light to the outside. The light emitting unit (LED) may receive a signal about the status of the fire detection device 100 from the control unit (CC) and notify the outside.

The oscillator unit (OSC) may be electrically connected to the control unit (CC). The oscillator may include a temperature compensated crystal oscillator (TCXO). A temperature compensated crystal oscillator can stably provide the frequency characteristics of the crystal oscillator by adding a temperature sensor to determine the temperature characteristics of the frequency that has the greatest impact on frequency stability.

The fire detection device 100 may be installed in a space where a fire may occur. Unlike the present invention, if a fire occurs, the temperature may increase and frequency stability may be reduced due to the temperature characteristics of the frequency. However, according to the present invention, the fire detection device 100 may include a temperature compensated crystal oscillator. Temperature compensated crystal oscillators can control frequency stability by taking temperature into account. Therefore, a fire detection device 100 with improved reliability can be provided.

2 to 4, the memory MM of the semiconductor chip AC-2 may include an acknowledgment processing algorithm for signals. The control unit (CC) of the semiconductor chip (AC-2) may generate a signal (SGa) based on the first fire detection signal (SG-1) received from the fire detection device 100. The communication unit (RF) of the semiconductor chip (AC-2) can transmit the signal (SGa) through the antenna (ATN-G).

Each of the plurality of fire detection devices 100 may transmit a first fire detection signal (SG-1) to the repeater 200. When receiving the first fire detection signal (SG-1), the repeater 200 transmits the first fire detection signal (SG-1) based on the fire information included in the first fire alarm signal (SG-1). The fire detection device 100 can be determined. The fire information may include the address value of the fire detection device 100.

The repeater 200 may transmit the signal (SGa) to the fire detection device 100 that transmitted the first fire detection signal (SG-1) after the first time (TM1) has elapsed.

The signal (SGa) may include an acknowledgment (ACK) and a control signal (INF). The acknowledgment (ACK) and control signal (INF) may be transmitted to the plurality of fire detection devices 100 in one piece. That is, the acknowledgment (ACK) and control signal (INF) can be transmitted as one signal.

According to the present invention, an acknowledgment (ACK) and a control signal (INF) can be provided and transmitted in the same data frame. The signal (SGa) is a communication means that can improve the efficiency of signal transmission by transmitting signals with various information, including an acknowledgment (ACK) and a control signal (INF). Additionally, the signal SGa can stably perform signal processing and signal management by excluding cases where one of the acknowledgment (ACK) and control signal (INF) is not delivered. Accordingly, a fire detection system 10 with improved reliability can be provided.

The acknowledgment (ACK) may be a signal confirming to the plurality of fire detection devices (SM) that the first fire detection signal (SG-1) has been normally received.

The control signal INF may be a signal that controls each of the plurality of fire detection devices 100. The control signal INF may be information that initializes the states of the sensor SS and the semiconductor chip AC-1. When each of the plurality of fire detection devices 100 receives the control signal INF, it may stop transmitting the first fire detection signal SG-1 to the repeater 200. However, this is an example and the control signal (INF) according to an embodiment of the present invention is not limited thereto. For example, the control signal INF according to an embodiment of the present invention may include a signal including various pieces of information. Although one control signal (INF) is shown as an example in FIG. 4, the number of control signals (INF) according to an embodiment of the present invention is not limited thereto. For example, a plurality of control signals (INF) according to an embodiment of the present invention may be provided.

The size (SZ-1) of the first fire detection signal (SG-1) may be greater than the size (SZ-2) of the signal (SGa). The traffic density when the signal SGa is transmitted may be lower than the traffic density when the first fire detection signal SG-1 is transmitted.

The first time (TM1) may be a short inter-frame space (SIFS). The first time (TM1) may be the shortest waiting delay time. Accordingly, the signal SGa may have the highest priority when transmitted to the plurality of fire detection devices 100. The first time (TM1) may be the combined time of the processing time of the received first fire detection signal (SG-1) and the time required to transmit the response.

According to the present invention, the first time (TM1) may be the minimum necessary time for transmitting a response as soon as the first fire detection signal (SG-1) is received. The plurality of fire detection devices 100 and the repeater 200 can quickly communicate with each other. In a fire situation, the fire detection system 10 can lead to a rapid response. Accordingly, a fire detection system 10 with improved reliability can be provided.

Unlike the present invention, when the repeater 200 receives the first fire detection signal (SG-1) from the plurality of fire detection devices 100 and transmits a confirmation response and then separately transmits a control signal, the repeater 200 ) and the plurality of signals transmitted between the fire detection devices 100 may increase, thereby increasing traffic density. Accordingly, the plurality of signals transmitted between the repeater 200 and the plurality of fire detection devices 100 may be lost, and the plurality of signals transmitted between the repeater 200 and the plurality of fire detection devices 100 may be lost. Interference may occur between them, and data loss may occur when a plurality of signals transmitted between the repeater 200 and the plurality of fire detection devices 100 are transmitted. However, according to the present invention, when the repeater 200 receives the first fire detection signal (SG-1) from the plurality of fire detection devices 100, the repeater 200 sends an acknowledgment (ACK) and a control signal ( A signal (SGa) including INF) can be transmitted. Because the acknowledgment (ACK) and control signal (INF) are transmitted integrally in one data frame, traffic density can be reduced. The amount of signals transmitted between the repeater 200 and the plurality of fire detection devices 100 can be reduced. The amount of traffic between the repeater 200 and the plurality of fire detection devices 100 may be reduced. Therefore, it is possible to prevent a plurality of signals transmitted between the repeater 200 and the plurality of fire detection devices 100 from being lost, and the signals transmitted between the repeater 200 and the plurality of fire detection devices 100 can be prevented. Interference between multiple signals can be prevented, and data loss can be prevented when multiple signals transmitted between the repeater 200 and the multiple fire detection devices 100 are transmitted. there is. Accordingly, it is possible to provide a fire detection system 10 with improved reliability that delivers a plurality of signals transmitted between the repeater 200 and a plurality of fire detection devices 100.

When each of the plurality of fire detection devices 100 fails to receive the signal SGa, it may retransmit the first fire detection signal SG-1 to the repeater 200 after a second time. The second time may be 1 minute. However, this is an example and the second time according to an embodiment of the present invention is not limited thereto. For example, the second time may be defined in various ways depending on the communication state between the repeater 200 and the plurality of fire detection devices 100.

Additionally, according to the present invention, semiconductor chips AC-1 and AC-2 having the same configuration may be mounted on the plurality of fire detection devices 100 and the repeater 200. The algorithm for signal processing may be stored in the memory MM of the semiconductor chips AC-1 and AC-2. The control unit (CC) of the semiconductor chip (AC-1, AC-2) can easily process signals based on the above algorithm. That is, rather than separate, different semiconductor chips being mounted on the plurality of fire detection devices 100 and the repeater 200, semiconductor chips (AC-1, AC-2) of the same configuration may be mounted. Semiconductor chips (AC-1, AC-2) may be composed of application-specific integrated circuits (ASICs). The custom integrated circuit can be designed to be optimized for fire detection and signal processing. Accordingly, the product manufacturing cost is reduced, and the fire detection system 10 with reduced power consumption can be provided due to the optimized design.

Referring to FIGS. 2, 3, and 5, the memory (MM) of the semiconductor chip (AC-4) may include an algorithm that processes information linked to the digital twin. The communication unit (RF) of the semiconductor chip (AC-4) can receive digital twin information (BIM) from the outside. The control unit (CC) of the semiconductor chip (AC-4) can calculate fire analysis data (DATA) based on digital twin information (BIM) and fire information (FI).

The first server 400 may include a digital twin calculation unit 410, a big data reception unit 420, a communication unit 430, and a semiconductor chip (AC-4).

The digital twin calculation unit 410 can virtually implement buildings and places. The building and location may be a building in which a plurality of fire detection devices 100 and a video capture unit (CT) are arranged. The digital twin calculation unit 410 can provide digital twin information (BIM). The digital twin calculation unit 410 can provide digital twin information (BIM) in the format of a digital twin.

The big data receiving unit 420 may receive big data (BD) from the second server (BS). Big data (BD) can include information about buildings and places. For example, big data (BD) can include information about movie theaters, information about traditional market buildings, information about museums, information about army headquarters, information about air force headquarters, information about warehouses, information about shooting ranges, information about military It may include information about barracks, information about thermal power plants, etc.

Big data (BD) may further include surrounding environmental data to determine the probable cause (FC) of the fire. For example, the surrounding environment data includes data corresponding to the probability of fire occurrence by date, data corresponding to the probability of fire occurrence by time, data corresponding to the probability of fire occurrence by location, data corresponding to the probability of fire occurrence by temperature, and humidity. It may include at least one of data corresponding to the probability of fire occurrence by each weather, data corresponding to the probability of fire occurrence by weather, data corresponding to the probability of fire occurrence by industry, and data corresponding to the probability of fire occurrence by user.

For example, the data corresponding to the fire occurrence probability by date may include the fire occurrence probability by day of the week and the fire occurrence probability by month. The data corresponding to the fire occurrence probability by time may include the fire occurrence probability divided into dawn, morning, afternoon, evening, or late night. Data corresponding to the probability of fire occurrence by space may include the probability of fire occurrence divided into urban areas, mountainous regions, beaches, or rural areas. Data corresponding to the probability of fire occurrence by temperature may include the probability of fire occurrence divided into spring, summer, fall, or winter. Data corresponding to the probability of fire occurrence by humidity may include a fire index by specific humidity level. Data corresponding to the probability of fire occurrence by weather may include the probability of fire occurrence divided into clear days, cloudy days, or rainy days. Data corresponding to the probability of fire occurrence by industry may include the probability of fire occurrence divided into homes, restaurants, factories, or offices. The fire occurrence probability for each user may include the fire occurrence probability classified by age, occupation, or gender.

The control unit (CC) of the semiconductor chip (AC-4) includes digital twin information (BIM) implemented by the digital twin calculation unit 410, big data (BD) received by the big data receiving unit 420, and video capture unit (CT). ) can generate fire analysis data (DATA) based on the measured image (IM) and fire information (FI).

The communication unit (RF) of the semiconductor chip (AC-4) may provide fire analysis data (DATA) to the communication unit 430. The communication unit 430 may provide fire analysis data (DATA) to a plurality of stakeholders 20.

Fire analysis data (DATA) can be linked with digital twin information (BIM) to provide specific fire situations to multiple stakeholders (20).

According to the present invention, the plurality of fire detection devices 100, repeater 200, receiver 300, and first server 400 are equipped with semiconductor chips (AC-1, AC-2, AC-) having the same configuration. 3, AC-4) can be installed. An algorithm for processing digital twin information (BIM) may be stored in the memory (MM) of the semiconductor chip (AC-1, AC-2, AC-3, AC-4). The control unit (CC) of the semiconductor chip (AC-1, AC-2, AC-3, AC-4) can easily interpret and process digital twin information (BIM) based on the above algorithm. That is, rather than separate, different semiconductor chips being mounted on the plurality of fire detection devices 100, repeater 200, receiver 300, and first server 400, the semiconductor chip (AC-1) has the same configuration. , AC-2, AC-3, AC-4) can be mounted. Semiconductor chips (AC-1, AC-2, AC-3, AC-4) may be composed of application-specific integrated circuits (ASICs). The custom integrated circuit can be designed to be optimized for fire detection and signal processing. Accordingly, the product manufacturing cost is reduced, and the fire detection system 10 with reduced power consumption can be provided due to the optimized design.

2, 3, and 6, the communication unit 430 of the first server 400 may receive fire information (FI) from the fire detection device 100. The communication unit 430 may be electrically connected to the communication unit (RF) of the semiconductor chip (AC-4). The communication unit 430 may transmit fire information (FI) to the communication unit (RF) of the semiconductor chip (AC-4).

The memory (MM) of the semiconductor chip (AC-4) may include an algorithm that determines the validity of fire information (FI). Invalid fire information (FI) may be referred to as a non-fire report. The non-fire term means that the fire detection device 10 operates by considering the fire to be a fire even though it is not a fire.

The control unit (CC) of the semiconductor chip (AC-4) includes digital twin information (BIM) implemented by the digital twin calculation unit 410, big data (BD) received by the big data receiving unit 420, and video capture unit (CT). ) Based on the image (IM) and fire information (FI) measured by The validity of information (FI) can be judged by different criteria.

The control unit (CC) of the semiconductor chip (AC-4) determines whether the fire information (FI) is valid, such as water vapor, cigarette smoke, and/or exhaust gas, based on the fire information (FI), the algorithm, and big data (BD). It can be determined whether the data is not valid or not.

In addition, when the first server 400 determines that the third fire detection signal (SG-3) is an invalid signal, the first server 400 prevents the alarms of the plurality of fire detection devices 100 from sounding. A control signal may be transmitted to a plurality of fire detection devices 100.

According to the present invention, big data (BD) may include fire-related data according to the situation, and the control unit (CC) of the semiconductor chip (AC-4) may include the big data (BD) and a plurality of fire detection devices ( 100) The effectiveness of fire detection signals (SG-1, SG-2, SG-3) can be judged based on the fire information (FI) detected by each. Therefore, it is possible to provide a fire detection system 10 that can determine the lowest non-fire alarm for each situation and has improved reliability of non-fire alarm determination.

In addition, according to the present invention, the plurality of fire detection devices 100, repeater 200, receiver 300, and first server 400 include semiconductor chips (AC-1, AC-2, AC-3, AC-4) can be installed. An algorithm for determining non-fire information may be stored in the memory (MM) of the semiconductor chip (AC-1, AC-2, AC-3, AC-4). The control unit (CC) of the semiconductor chip (AC-1, AC-2, AC-3, AC-4) can easily determine a non-fire report based on the above algorithm. That is, rather than separate, different semiconductor chips being mounted on the plurality of fire detection devices 100, repeater 200, receiver 300, and first server 400, the semiconductor chip (AC-1) has the same configuration. , AC-2, AC-3, AC-4) can be mounted. Semiconductor chips (AC-1, AC-2, AC-3, AC-4) may be composed of application-specific integrated circuits (ASICs). The custom integrated circuit can be designed to be optimized for fire detection and signal processing. Accordingly, product manufacturing costs are reduced, and a fire detection system 10 with reduced power consumption can be provided due to an optimized design.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or have ordinary knowledge in the relevant technical field should not deviate from the spirit and technical scope of the present invention as set forth in the claims to be described later. It will be understood that the present invention can be modified and changed in various ways within the scope of the present invention. Therefore, the technical scope of the present invention should not be limited to what is described in the detailed description of the specification, but should be defined by the scope of the patent claims.

A fire detection device for detecting the occurrence of a fire is an essential component for preventing and responding to fire. The present invention can provide a fire detection device and a fire detection system including a semiconductor chip with improved power consumption and manufacturing efficiency. Therefore, the present invention regarding fire detection devices and fire detection systems has high industrial applicability.

Claims

A sensor that detects whether a fire has occurred and generates fire information; and

Includes a semiconductor chip that receives the fire information,

The semiconductor chip is,

A communication unit that performs RF communication (Radio Frequency communication);

a sensing unit that receives the fire information from the sensor;

Memory where algorithms are stored;

a control unit that generates a signal based on the fire information and the algorithm; and

A fire detection device comprising a power supply unit that receives power from the outside and supplies the power to the communication unit, the sensing unit, and the control unit.
According to claim 1,

When the semiconductor chip receives the fire information, it transmits a signal after a first time has elapsed,

The signal includes a confirmation response to the fire information and a control signal for controlling the sensor,

A fire detection device in which the confirmation response and the control signal are transmitted as one unit.
According to clause 2,

A fire detection device wherein the control signal initializes the states of the sensor and the semiconductor chip.
According to claim 1,

The power supply unit operates in a power saving mode consuming first power and a normal mode consuming second power higher than the first power,

A fire detection device wherein the communication unit transmits an activation signal to change the power saving mode to the normal mode.
According to clause 4,

A fire detection device in which the power supply unit operates in the power saving mode and operates in the normal mode when the magnitude of the received activation signal is greater than a predetermined value.
According to clause 4,

The current of the first power is 1uA (microampere) to 5uA,

A fire detection device wherein the current of the second power is 20mA (milliampere) to 50mA.
According to claim 1,

The RF communication is a fire detection device that uses frequencies in the 400MHz to 900MHz band.
According to claim 1,

The communication unit receives big data from an external server,

The algorithm includes an algorithm that determines the validity of fire information,

The control unit is a fire detection device that determines the validity of the fire information based on the big data, the algorithm, and the fire information according to different criteria for each situation.
According to clause 8,

The control unit is a fire detection device that determines whether the fire information is invalid data such as water vapor, cigarette smoke, and/or exhaust gas based on the fire information, the algorithm, and the big data.
According to claim 1,

The communication unit receives digital twin information that virtually represents the building from the outside,

The control unit is a fire detection device that calculates fire analysis data based on the digital twin information and the fire information.
According to claim 1,

The semiconductor chip is a fire detection device comprised of an application-specific integrated circuit (ASIC).
According to claim 1,

A fire detection device further comprising a temperature compensated crystal oscillator electrically connected to the semiconductor chip.
According to claim 1,

The RF communication is a fire detection device that uses a low-power wide-area network (LPWAN).
A plurality of fire detection devices that detect a fire using different address values, generate fire information, perform RF communication (radio frequency communication) with each other, and include a semiconductor chip;

a repeater that performs the RF communication with each of the plurality of sensors, receives the fire information from the plurality of sensors, and includes the semiconductor chip;

a receiver that performs RF communication with the repeater and includes the semiconductor chip; and a server that performs the RF communication with the receiver and includes the semiconductor chip,

The semiconductor chip is,

A communication unit that performs RF communication (Radio Frequency communication);

a sensing unit that receives the fire information from the sensor;

Memory where algorithms are stored;

a control unit that generates a signal based on the fire information and the algorithm; and

A fire detection system comprising a power supply unit that receives power from the outside and supplies the power to the communication unit, the sensing unit, and the control unit.