WO2023174255A1 - 电镀夹具以及可垂直挂镀和水平旋转电镀的流水线 - Google Patents

电镀夹具以及可垂直挂镀和水平旋转电镀的流水线 Download PDF

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Publication number
WO2023174255A1
WO2023174255A1 PCT/CN2023/081307 CN2023081307W WO2023174255A1 WO 2023174255 A1 WO2023174255 A1 WO 2023174255A1 CN 2023081307 W CN2023081307 W CN 2023081307W WO 2023174255 A1 WO2023174255 A1 WO 2023174255A1
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WO
WIPO (PCT)
Prior art keywords
support plate
plate
sealing
electroplating
groove
Prior art date
Application number
PCT/CN2023/081307
Other languages
English (en)
French (fr)
Inventor
马盛林
王其强
Original Assignee
厦门大学
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Filing date
Publication date
Application filed by 厦门大学 filed Critical 厦门大学
Publication of WO2023174255A1 publication Critical patent/WO2023174255A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating

Definitions

  • the present application relates to the technical field of electroplating equipment, in particular to electroplating fixtures and assembly lines capable of vertical rack plating and horizontal rotating plating.
  • electroplating is a common method of depositing thin films of metal on substrates. Especially in the field of advanced packaging, electroplating is generally used to fill and deposit metal on the substrate to achieve circuit interconnection due to its advantages such as simple process, low cost, and diverse deposited metals.
  • Electroplating fixtures are an important part of the electroplating process. Good electroplating fixtures can help improve the quality of electroplating. There are more or less various problems with the electroplating fixtures currently on the market. For example, when the electroplating fixture clamps the substrate, the plating solution often leaks due to factors such as poor sealing, which in turn causes contamination of the cathode contacts and unnecessary plating. The substrate area affects the effect of electroplating.
  • This application aims to provide an electroplating fixture and an assembly line capable of vertical rack plating and horizontal rotation plating, which can solve the problem of electroplating liquid leakage caused by poor sealing of the electroplating fixture, thereby contaminating cathode contacts and substrate areas that do not require electroplating.
  • this application provides an electroplating fixture that adopts the following technical solution:
  • An electroplating fixture includes a support plate and a seal
  • the support plate has a cavity along its thickness direction; the substrate is placed on the support plate and one edge of the cavity is blocked; a conductive component for conducting electricity in contact with the substrate is installed on the support plate;
  • the sealing member includes a sealing plate for shielding the substrate and a driving member that drives the sealing plate close to or away from the support plate;
  • a first sealing ring and a second sealing ring are provided between the support plate and the sealing member; the sealing plate abuts and supports The first sealing ring is clamped between the support plate and the sealing plate, and the first sealing ring surrounds the periphery of the base plate; the second sealing ring is clamped between the support plate and the base plate, and the second sealing ring Located inside the base plate.
  • the driving member includes a driving housing with a gas nozzle; a pneumatic chamber connected to the gas nozzle is provided on one side of the driving housing close to the support plate, and the sealing plate is slidably installed in the pneumatic chamber to form a Piston structure; the air pressure intensity in the air pressure chamber is controlled through the air nozzle connected to an external pneumatic circuit to drive the sealing plate closer to or away from the support plate;
  • a connector is provided on the support plate for maintaining or releasing the connection between the seal and the support plate.
  • the connecting member includes a connecting rod and a rotating rod, one end of the connecting rod is connected to the support plate, and the other end extends toward the seal; corresponding to the connecting rod, a clearance gap is provided on the peripheral side of the drive housing, The connecting rod is enclosed around the peripheral side of the driving housing to restrict the movement of the driving housing perpendicular to the axis of the connecting rod and away from the enclosed area of the connecting rod; one end of the rotating rod is rotationally connected to the connecting rod, and the other end is free end;
  • connection state between the seal and the support plate is released; when the axial projection of the rotating rod along the connecting rod overlaps with the driving housing, the seal is maintained The connection status with the support plate.
  • a polygonal convex block is provided on the side wall of the sealing plate away from the support plate, and a convex edge surrounding the convex block is provided on the cavity wall of the air pressure chamber, and the convex edge is connected with the A sliding connection is formed between the bumps.
  • a first annular groove is provided on the side wall of the support plate close to the sealing plate or the side wall of the sealing plate close to the support plate, and the first sealing ring is embedded in the first annular groove; the support plate
  • a second annular groove is provided on the side wall close to the sealing plate, and the second sealing ring is arranged in the second annular groove.
  • the height of the groove wall of the first annular groove close to the second annular groove is lower than that of the groove wall far away from the second annular groove; the height of the groove wall of the second annular groove close to the first annular groove is low. on one side of the groove wall away from the first annular groove.
  • the conductive component includes a conductive rod, a conductive ring connected to one end of the conductive rod, and an elastic contact piece;
  • the support plate is provided with an electrode introduction hole for the conductive rod to be inserted;
  • the support plate is close to the sealing plate.
  • a conductive ring groove is provided on one side wall for the conductive ring to be installed, and the conductive ring groove is connected with the electrode introduction hole;
  • the conductive ring groove is located between the first ring groove and the second ring groove;
  • the elastic contact piece is along the circumference of the conductive ring Set at intervals for conductive connection to the substrate.
  • the outer peripheral part of the substrate is located in the conductive ring groove; the diameter of the electrode introduction hole is larger than the diameter of the conductive rod; the size of the conductive ring groove is larger than the conductive ring; an external vacuum machine is connected through the electrode introduction hole so that The pressure in the conductive ring groove becomes smaller.
  • connection member includes a support column and a limiting plate, one end of the support column is connected to the support plate, and the other end is connected to the support plate.
  • One end faces the seal;
  • the side wall of the support column is provided with a relief groove for the limit plate to rotate and snap in or move out;
  • the circumferential side of the limit plate is provided with limit holes at intervals;
  • the support column is provided with a relief groove that extends into the relief groove. limit bolt;
  • the internal pressure of the air pressure chamber is controlled by an external pneumatic circuit.
  • the sealing plate is driven toward the support plate, the internal pressure of the air pressure chamber continues to increase, and the drive shell moves away from the support plate under its reaction force, so that the limiting plate
  • the upper limit hole is set on the limit bolt, and the limit plate is pressed against the wall of the relief groove;
  • this application provides an assembly line capable of vertical rack plating and horizontal rotation plating, adopting the following technical solution:
  • An assembly line capable of vertical rack plating and horizontal rotation plating including an assembly line platform and the above-mentioned cathode clamp; a plurality of movable platforms with X/Y/Z direction movement functions are arranged at intervals along the assembly line movement direction on the assembly line platform,
  • the cathode clamp is detachably connected to a movable platform, and a horizontal moving unit, a vertical driving unit and a horizontal rotating unit are provided on the movable platform.
  • the first sealing ring and the second sealing ring cooperate with the sealing plate and the support plate to seal the non-electroplating area of the substrate, and the resistance plating liquid leaks to the non-electroplating area of the substrate, thereby improving the electroplating effect of the substrate.
  • a movable platform is installed on the assembly line platform, and a horizontal moving unit, a vertical driving unit and a horizontal rotating unit are provided on the movable platform.
  • the cathode clamp is detachably installed on the movable platform. In this way, after one cathode clamp completes electroplating When cleaning, the next movable platform on the assembly line enters the electroplating process along with the moving direction of the assembly line; in this way, work efficiency can be effectively improved.
  • Figure 1 is a schematic diagram of the overall structure of an electroplating fixture according to an embodiment of the present application
  • Figure 2 is a schematic structural view of the electroplating fixture of the embodiment shown in Figure 1 from another perspective;
  • Figure 3 is a top view of the electroplating fixture of the embodiment shown in Figure 1;
  • Figure 4 is a cross-sectional view of the electroplating fixture of the embodiment shown in Figure 1;
  • Figure 5 is a structural schematic diagram of the connector in the embodiment shown in Figure 1;
  • Figure 6 is an enlarged schematic diagram of position A in Figure 4.
  • Figure 7 is a schematic structural diagram of the conductive ring and the substrate in the embodiment shown in Figure 1;
  • Figure 8 is an exploded schematic diagram of the conductive ring and the elastic contact piece in the embodiment shown in Figure 1;
  • Figure 9 is a schematic structural diagram of the elastic contact piece in the embodiment shown in Figure 1;
  • Figure 10 is a schematic structural diagram of an elastic contact piece with a trapezoidal structure
  • Figure 11 is a schematic structural diagram of an elastic contact piece with a V-shaped structure
  • Figure 12 is a structural schematic diagram of the elastic piece of U-shaped structure
  • Figure 13 is a schematic diagram of the overall structure of an electroplating fixture according to another embodiment of the present application.
  • Figure 14 is an enlarged schematic view of B in Figure 13;
  • Figure 15 is a schematic structural diagram of a conductive ring and an elastic contact piece according to another embodiment of the present application.
  • Figure 16 is a schematic structural diagram of another embodiment of the present application when the limiting plate and the support column are separated;
  • Figure 17 is a schematic structural diagram of the limiting plate and the support column of the embodiment shown in Figure 16 when they are connected and fixed;
  • Figure 18 is a schematic diagram of the substrate about to be installed on the fixture in the assembly line according to an embodiment of the present application
  • FIG. 19 is a schematic diagram of the clamp in the assembly line of the embodiment shown in FIG. 18 when it is about to enter the electroplating solution.
  • an embodiment of the present application provides an electroplating fixture, which includes a support plate 1 and a seal 2 .
  • the support plate 1 has a cavity 11 extending through it along its thickness direction.
  • the cavity 11 has a flared structure.
  • the substrate 3 is placed on the support plate 1 and blocks the smaller side of the cavity 11.
  • the support plate 1 is also equipped with a conductive component 4 for electrical conduction with the substrate 3 .
  • the seal 2 includes a sealing plate 21 and a driving component.
  • the sealing plate 21 has a disk structure as a whole.
  • the sealing plate 21 is used to block the side of the base plate 3 away from the support plate 1 .
  • a buffer pad 211 is embedded and fixed on the side of the sealing plate 21 close to the support plate 1.
  • the buffer pad 211 can be made of silicone, PVDF (Polyvinylidene Fluoride, polyvinylidene fluoride) and other materials.
  • the size of the buffer pad 211 is smaller than the size of the sealing plate 21 and is used to contact the substrate 3 to provide a buffering effect and reduce the possibility of damage to the substrate 3 due to external force.
  • the driving member is used to drive the sealing plate 21 close to or away from the support plate 1 .
  • the driving member includes a driving housing 22 with an air nozzle 221 .
  • An air pressure chamber 222 connected to the air nozzle 221 is defined on the side of the drive housing 22 close to the support plate 1 .
  • the side of the sealing plate 21 away from the support plate 1 is concave, and a through groove 213 is provided at its edge, so that when the upper edge of the sealing plate 21 abuts the wall of the air pressure chamber 222, the air nozzle 221 can communicate with the air pressure through the through groove 213.
  • the chambers 222 are connected; the sealing plate 21 is slidably installed in the air pressure chamber 222 to form a piston structure.
  • the air nozzle 221 is connected to an external air source, and the air source can be an air pump. Through the operation of the air pump, the pressure in the air pressure chamber 222 is controlled, thereby driving the sealing plate 21 to move toward or away from the support plate 1 .
  • a protrusion 212 with a polygonal structure protrudes from the middle of the side of the sealing plate 21 away from the support plate 1 .
  • the bumps 212 adopt a square structure.
  • a convex edge 223 protrudes from the cavity wall of the air pressure chamber 222, and the convex edge 223 surrounds the peripheral side of the bump 212, and a sliding connection relationship is formed between the two.
  • a connector 12 is installed on the support plate 1 for maintaining or releasing the connection between the seal 2 and the support plate 1.
  • the connecting member 12 includes a connecting rod 121 and a rotating rod 122 .
  • Four connectors 12 may be provided, and clearance gaps 224 are correspondingly provided at the four corners of the drive housing 22 .
  • the connecting rod 121 is located in the clearance gap 224 to restrict the movement of the driving housing 22 in a direction perpendicular to the axis of the connecting rod 121 and away from the enclosed range of the connecting rod 121 .
  • One end of the connecting rod 121 is fixedly connected to the support plate 1 through bolts, and the other end is rotationally connected to the rotating rod 122 .
  • a rubber sleeve 123 is fixed to the outer wall of the end of the rotating rod 122 away from the connecting rod 121 .
  • One end of the rotating rod 122 rotates and is buckled on the side wall of the drive housing 22.
  • the rubber sleeve 123 can absorb the impact force of the drive housing 22 moving away from the support plate 1; and, Under the reaction force of the internal pressure of the air pressure chamber 222, the rotating rod 122 is pressed against the drive housing 22 and remains motionless; after the internal pressure of the air pressure chamber 222 decreases, the rotating rod 122 can rotate again to release the support plate 1 from the drive shell. body 22 connection.
  • the moving distance of the driving housing 22 along the axial direction of the connecting rod 121 is 0.5-3mm, and the optimal moving distance is 1-1.5mm.
  • the rotation angle of the rotation lever 122 can be designed to be less than 180 degrees.
  • a first sealing ring 5 and a second sealing ring 6 are provided between the support plate 1 and the sealing member 2.
  • the sealing plate 21 abuts the support plate 1
  • the first sealing ring 5 is clamped between the support plate 1 and the sealing plate 21, and the first sealing ring 5 surrounds the periphery of the base plate 3;
  • the second sealing ring 6 is clamped It is tight between the support plate 1 and the base plate 3 , and the second sealing ring 6 is located inside the base plate 3 .
  • Both the first sealing ring 5 and the second sealing ring 6 have certain corrosion resistance and elasticity. It can be made of fluorine rubber, silicone, polyvinylidene fluoride (PVDF) and other materials.
  • the compression ratio of the first sealing ring 5 and the second sealing ring 6 is controlled at 10%-30%, and the optimal range is 15%-25%.
  • the support plate 1 is provided with a first annular groove 13 and a second annular groove 14 .
  • the diameter of the first annular groove 13 is larger than that of the second annular groove 14 .
  • the first sealing ring 5 is embedded and fixed in the first annular groove 13
  • the second sealing ring 6 is embedded and fixed in the second annular groove 14 .
  • the first sealing ring 5 can prevent the electroplating liquid from leaking from the joint between the support plate 1 and the sealing plate 21 to the non-electroplating area of the substrate 3
  • the second sealing ring 6 can prevent the electroplating liquid in the cavity 11 from leaking from the support plate 1 and the substrate.
  • the joint seam of 3 leaks to the non-plated area of substrate 3.
  • the side wall of the first annular groove 13 close to the second annular groove 14 is lower than the side wall away from the second annular groove 14 .
  • the groove wall of the second annular groove 14 close to the first annular groove 13 is lower than the groove wall away from the first annular groove 13 .
  • the groove walls on both sides of the first annular groove 13 form a stepped shape, with the outer circumference being high and the inner circumference being low, that is, the groove wall close to the outer circumference side of the support plate 1 is higher; the second annular groove 14 is having a low outer circumference and a high inner circumference. That is, the groove wall on the side close to the cavity 11 is higher.
  • the deformation amount of the first sealing ring 5 is greater on the inner periphery and there is not enough space on the outer periphery. If the first sealing ring 5 undergoes greater deformation, the outer periphery will be squeezed stronger and the sealing performance will be higher.
  • the second sealing ring 6 is deformed, since the higher groove wall is on the inner circumference and is closer to the cavity 11, the deformation amount of the second sealing ring 6 is greater on the outer circumference and the inner circumference is not enough. If there is more space for the second sealing ring 6 to deform, the inner circumference will be squeezed stronger and the sealing performance will be stronger.
  • the conductive component 4 includes a conductive rod 41 , a conductive ring 42 and an elastic contact piece 43 .
  • the support plate 1 is provided with an electrode introduction hole 15 for the conductive rod 41 to be inserted.
  • a conductive ring groove 16 is provided on a side wall of the support plate 1 close to the sealing plate 21 for the conductive ring 42 to be installed and fixed.
  • the conductive annular groove 16 is located between the first annular groove 13 and the second annular groove 14 .
  • the conductive ring groove 16 is connected with the electrode introduction hole 15 .
  • the conductive ring 42 includes an opening gasket 421 , a conductive ring 422 and a conductive block 423 .
  • the conductive block 423 and the conductive ring 422 are connected through threads, and the conductive block 423 is located at the opening of the opening gasket 421 .
  • the opening gasket 421 is fixed to the bottom of the conductive ring groove 16 through bolts.
  • the conductive ring 422 is fixed on the opening gasket 421 through bolts.
  • the pressing block is pressed onto the conductive ring 422, and bolts are passed through the pressing block, the conductive ring 422 and the conductive block 423 to lock and fix.
  • the conductive ring 42 can be made of materials with low resistivity, such as gold, silver, copper, Stainless steel, platinum, or gold plating on iron, stainless steel and other materials to achieve good conductivity.
  • one end of the elastic contact piece 43 is embedded between the conductive ring 422 and the opening gasket 421 , and the other end is used to make electrical contact with the substrate 3 .
  • the elastic contact pieces 43 are evenly spaced on the conductive ring 422 along the circumferential direction, and their number can range from 16 to 202. In other embodiments, they can also be adjusted according to the size of different substrates 3 .
  • the elastic contact piece 43 has an S-shaped structure. When the substrate 3 receives pressure from the sealing plate 21, the side wall of the substrate 3 contacts the elastic contact piece 43, causing the elastic contact piece 43 to deform. Along the movement direction of the sealing plate 21, the deformation displacement of the elastic contact piece 43 is within 0-2 mm. . The service life of the elastic contact piece 43 is more than 10,000 times.
  • the elastic contact piece 43 may adopt an overall U-shaped structure, a trapezoid-like structure, a V-like structure, etc.
  • the deformation amount of the elastic contact piece 43 of the trapezoid-like structure and the V-type structure is 0-3.5mm when pressed; in Figure 12, the deformation amount of the elastic contact piece 43 of the U-shaped structure is 0-3.5mm. 3mm.
  • the structure of the elastic contact piece 43 is not limited to the above structural design.
  • the outer peripheral portion of the substrate 3 extends into the conductive annular groove 16 .
  • the diameter of the electrode introduction hole 15 is larger than the diameter of the conductive rod 41 .
  • the size of the conductive ring groove 16 is also larger than the conductive ring 42 .
  • the end of the electrode introduction hole 15 away from the conductive ring groove 16 is connected to an external vacuum machine through a pipeline.
  • the pressure in the air pressure chamber 222 increases, and the sealing plate 21 exerts pressure on the substrate 3 .
  • the air is extracted from the conductive ring groove 16 through an external vacuum machine; in this way, the side of the substrate 3 facing the sealing plate 21 is subject to positive pressure, and the part facing the conductive ring groove 16 is subject to negative pressure, so that the substrate 3 can be more stably fixed on the support. on board 1.
  • the pressure ratio of positive pressure to negative pressure can be 1:1, 2:1 or 3:1.
  • the positive pressure range is 1-3bar, and the negative pressure vacuum degree is less than 2kpa.
  • the non-electroplating area of the substrate 3 can be sealed, preventing the electroplating liquid from leaking to the non-electroplating area, and improving the electroplating effect of the substrate 3 .
  • the first annular groove 13 is opened on a side wall of the sealing plate 21 close to the support plate 1 .
  • the first sealing ring 5 is embedded and fixed in the first annular groove 13 .
  • the height of the outer peripheral groove wall of the first annular groove 13 is higher than that of the inner peripheral groove wall.
  • the conductive ring 42 is an integral ring structure, and the conductive ring 42 is integrally connected to the elastic contact piece 43. 42 and the conductive rod 41 can be fixed by welding.
  • One end of the elastic contact piece 43 is connected to the inner wall of the conductive ring 42 , the other end is arched toward the sealing plate 21 and then extends away from the sealing plate 21 , and the entire end extends axially along the conductive ring 42 .
  • the elastic contact piece 43 has a curved lath-like structure as a whole.
  • the connector 12 includes a support column 18 and a limiting plate 17.
  • One end of the support column 18 is connected to the support plate 1, and the other end faces the seal.
  • Limit The plate 17 is fixedly installed on the side of the drive housing 22 away from the support plate 1 .
  • the limiting plate 17 has a square structure as a whole, and its middle is hollow.
  • the limiting plate 17 is connected to an external rotation unit to drive the limiting plate 17 to rotate around its central axis.
  • Limiting holes 171 are formed at intervals on the circumferential side of the limiting plate 17 corresponding to the support column 18 .
  • the support column 18 is threadedly connected with a limiting bolt 182 extending into the relief groove 181 .
  • the air pressure chamber 222 controls its internal pressure through an external pneumatic circuit. , when the sealing plate 21 is driven to abut against the support plate 1 , the internal pressure of the air pressure chamber 222 continues to increase, and the driving shell 22 moves away from the support plate 1 under its reaction force, so that the limiting hole 171 on the limiting plate 17 It is sleeved upward on the outer wall of the limit bolt 182, and the limit plate 17 is pressed against the wall of the relief groove 181; thereby maintaining the connection between the limit plate 17 and the support column 18.
  • the driving housing 22 moves toward the support plate 1 under its own weight, so that the limiting hole 171 on the limiting plate 17 is disengaged from the limiting bolt 182 . Then, the rotation unit drives the limiting plate 17 to rotate, so that the limiting hole 171 and the relief groove 181 are separated, and the connection between the limiting plate 17 and the support column 18 can be released.
  • embodiments of the present application also provide an assembly line capable of vertical rack plating and horizontal rotation plating, including an assembly line platform and the plating fixture provided in any of the above embodiments.
  • Multiple (at least two) movable platforms are installed on the assembly line platform at intervals along the moving direction of the assembly line.
  • the movable platforms have X/Y/Z direction movement functions.
  • the movable platform is equipped with a horizontal moving unit, a vertical driving unit and a horizontal rotating unit, and the electroplating fixture can be detachably installed on the movable platform.
  • the horizontal moving unit 7 is installed on the assembly line platform, the vertical driving unit 8 is connected to the horizontal moving unit 7 , and the horizontal rotating unit 9 is connected to the vertical driving unit 8 .
  • the seal 2 of the electroplating fixture is detachably connected to the end of the horizontal rotation unit 9 through the installation clamp.
  • the assembly line platform is equipped with a base plate 3 clamping station.
  • a fixed workbench 101 for limiting the support plate 1 is fixed on the clamping station.
  • the support plate 1 is limited on the fixed workbench 101 , and the seal 2 moves above the support plate 1 under the movement of the horizontal moving unit 7 .
  • the substrate 3 is placed on the support plate 1 by the robot 102 .
  • the sealing member 2 is in contact with the support plate 1 under the movement of the vertical driving unit 8, and clamps the substrate 3.
  • the horizontal rotation unit 9 drives the drive housing 22 to rotate, so that the limit plate 17 is engaged with the support column 18 on the support plate 1, and is inserted into the limit hole 171 through the limit bolt 182.
  • the base plate 3 and the clamp After the connections are fixed, sub-units are formed.
  • compressed gas is introduced into the gas nozzle 221 to seal the non-electroplating area of the substrate 3 .
  • external power The pole is inserted into the electrode introduction hole 15, and the electrode is turned on.
  • the horizontal moving unit 7 moves the subunit above the electroplating tank 103, and the vertical driving unit 8 lowers the height.
  • the horizontal rotating unit 9 drives the sub-unit to maintain the rotating turntable with a rotating speed of 0-10 rpm.
  • the horizontal rotating unit 9 does not work.
  • the sub-units can enter the cleaning tank and plating tank independently without changing fixtures in between. Regular maintenance of fixtures, disassembly of plating fixtures, and replacement of spare fixtures will not affect the continued use of the plating tank, saving working time and improving work efficiency.
  • the embodiments of the present application include at least one of the following beneficial effects:
  • the elastic contact pieces are arranged at circumferential intervals to ensure good contact and conductivity with the substrate;
  • the sealing plate is slidably installed in the air pressure chamber to form a piston structure. Therefore, the sealing plate exerts a uniform force on the substrate, especially reducing the possibility of breakage of the ultra-thin substrate;
  • the cathode clamp can be detachably installed on the movable platform. In this way, when cleaning a cathode clamp after completing electroplating , the next movable platform on the assembly line enters the electroplating process along with the moving direction of the assembly line; in this way, work efficiency can be effectively improved.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

一种电镀夹具以及可垂直挂镀和水平旋转电镀的流水线，涉及电镀夹具的技术领域。电镀夹具包括支撑板与密封件；支撑板沿其厚度方向开设有空腔；基板放置于支撑板上，并将空腔的一侧边沿遮挡；支撑板上安装有用于与基板接触导电的导电组件；密封件包括用于遮挡基板的密封板以及驱动密封板靠近或远离支撑板的驱动件；支撑板与密封件之间设置有第一密封圈与第二密封圈；密封板抵接支撑板时，第一密封圈被夹紧于支撑板与密封板之间，且第一密封圈围合于基板外围；第二密封圈被夹紧于支撑板与基板之间，且第二密封圈位于基板内侧。上述电镀夹具以及可垂直挂镀和水平旋转电镀的流水线能够提高对基板非电镀区域的密封，提高电镀质量。

Description

电镀夹具以及可垂直挂镀和水平旋转电镀的流水线
相关申请的交叉引用
本公开是以申请号为202210269001.0，申请日为2022年3月18日，发明名称为“电镀夹具以及可垂直挂镀和水平旋转电镀的流水线”的中国专利申请为基础，并主张其优先权，该中国专利申请的公开内容在此作为整体引入本公开中。
技术领域
本申请涉及电镀设备的技术领域，尤其是涉及电镀夹具以及可垂直挂镀和水平旋转电镀的流水线。
背景技术
在半导体制造领域，电镀是一种在基板上沉积金属薄膜的常见方法。特别是在先进封装领域中，由于电镀具有工艺简单、成本低、沉积金属多样等优点，一般采用电镀的方式在基板上填充和沉积金属以实现电路互连。电镀夹具作为电镀工艺中重要的一环，好的电镀夹具能有助于提高电镀的质量。目前市场上的电镀夹具或多或少都存在着各种问题，例如：电镀夹具在夹持基板时，经常因为密封性差等因素，造成电镀液泄露，进而造成污染阴极触点和不需要电镀的基板区域，影响电镀的效果。
发明内容
本申请旨在提供一种电镀夹具以及可垂直挂镀和水平旋转电镀的流水线，可解决电镀夹具密封性差造成的电镀液泄露、进而污染阴极触点和不需要电镀的基板区域的问题。
第一方面，本申请提供一种电镀夹具，采用如下的技术方案：
一种电镀夹具，包括支撑板与密封件；
所述支撑板沿其厚度方向开设有空腔；基板放置于支撑板上，并将空腔的一侧边沿遮挡；所述支撑板上安装有用于与基板接触导电的导电组件；
所述密封件包括用于遮挡基板的密封板以及驱动密封板靠近或远离支撑板的驱动件；
所述支撑板与密封件之间设置有第一密封圈与第二密封圈；所述密封板抵接支撑 板时，第一密封圈被夹紧于支撑板与密封板之间，且第一密封圈围合于基板外围；第二密封圈被夹紧于支撑板与基板之间，且第二密封圈位于基板内侧。
可选的，所述驱动件包括带有气嘴的驱动壳体；所述驱动壳体靠近支撑板的一侧开设有连通气嘴的气压腔，所述密封板滑动安装于气压腔内形成一个活塞结构；所述气压腔内的气压强度通过气嘴连接外接气动回路进行控制，以驱使密封板靠近或远离支撑板；
所述支撑板上设置有连接件，用于保持或解除密封件与支撑板的连接。
可选的，所述连接件包括连接杆与转动杆，所述连接杆的一端与支撑板连接，另一端朝向密封件延伸；对应于连接杆，驱动壳体的周侧设置有让位缺口，所述连接杆围合于驱动壳体周侧，以限制驱动壳体沿垂直于连接杆轴线运动而脱离连接杆的围合区域；所述转动杆的一端与连接杆转动连接，另一端为自由端；
当转动杆沿连接杆轴向的投影不与驱动壳体发生重叠时，解除密封件与支撑板的连接状态；当转动杆沿连接杆轴向的投影与驱动壳体存在重叠时，保持密封件与支撑板的连接状态。
可选的，所述密封板远离支撑板的一侧壁上设置具有多边形的凸块，所述气压腔的腔壁上对应设置有围设在凸块周侧的凸沿，所述凸沿与凸块之间形成滑动连接。
可选的，所述支撑板靠近密封板的侧壁或密封板靠近支撑板的侧壁上开设有第一环形槽，所述第一密封圈嵌设于第一环形槽内；所述支撑板上靠近密封板的侧壁上开设有第二环形槽，所述第二密封圈设置与第二环形槽内。
可选的，所述第一环形槽靠近第二环形槽的一侧槽壁高度低于远离第二环形槽的一侧槽壁；所述第二环形槽靠近第一环形槽的槽壁高度低于远离第一环形槽的一侧槽壁。
可选的，所述导电组件包括导电棒、连接于导电棒一端的导电环、以及弹性触片；所述支撑板上开设有供导电棒插入的电极引入孔；所述支撑板靠近密封板的一侧壁开设有供导电环安装的导电环槽，导电环槽与电极引入孔连通；所述导电环槽位于第一环形槽与第二环形槽之间；所述弹性触片沿导电环周向间隔设置，用于导电连通基板。
可选的，所述基板的外周部分位于导电环槽内；所述电极引入孔直径大于导电棒直径；所述导电环槽尺寸大于导电环；通过电极引入孔连接外部的抽真空机，以使导电环槽内的压强变小。
可选的，所述连接件包括支承柱与限位板，所述支承柱的一端与支撑板连接，另 一端朝向密封件；所述支承柱沿周向间隔分布有至少两根，所述限位板设置在驱动壳体上，限位板通过外接旋转单元，以驱动限位板绕其中轴线转动；所述支承柱的侧壁上开设有供限位板旋转卡入或移出的让位槽；所述限位板的周侧间隔开设有限位孔；所述支承柱上设置有延伸至让位槽内的限位螺栓；
所述气压腔通过外接气动回路控制其内部压强，当驱使密封板朝向支撑板抵接后，继续增加气压腔内部压强，驱动壳体在其反作用力下朝远离支撑板运动，以使限位板上的限位孔套设在限位螺栓，限位板抵紧在让位槽槽壁上；
当气压腔内压强下降，驱动壳体在其自重下朝向支撑板运动，以使限位板上的限位孔脱离于限位螺栓。
第二方面，本申请提供一种可垂直挂镀和水平旋转电镀的流水线，采用如下技术方案：
一种可垂直挂镀和水平旋转电镀的流水线，包括流水线平台，以及上述的阴极夹具；所述流水线平台上沿流水线移动方向间隔设置有多个具有X/Y/Z方向移动功能的活动平台，所述阴极夹具可拆卸连接于活动平台，所述活动平台上设置有水平移动单元、垂直驱动单元和水平旋转单元。
本申请的电镀夹具中，第一密封圈与第二密封圈配合密封板与支撑板，将基板的非电镀区域密封，阻值电镀液泄露至基板的非电镀区域，从而提高基板的电镀效果。
本申请的流水线中，流水线平台上安装活动平台，并在活动平台上设置水平移动单元、垂直驱动单元和水平旋转单元，阴极夹具可拆卸安装于活动平台上，如此，在一个阴极夹具完成电镀后进行清洗保洁时，流水线上的下一个活动平台随着流水线移动方向进入电镀工序；如此，能够有效提高工作效率。
附图说明
图1是本申请一实施例电镀夹具的整体结构示意图；
图2是图1所示实施例电镀夹具的另一视角结构示意图；
图3是图1所示实施例电镀夹具的俯视图；
图4是图1所示实施例电镀夹具的剖视图；
图5是图1所示实施例中连接件的一种结构示意图；
图6是图4中A处的放大示意图；
图7是图1所示实施例导电环与基板的结构示意图；
图8是图1所示实施例中导电环与弹性触片的爆炸示意图；
图9是图1所示实施例中弹性触片的结构示意图；
图10是类梯形结构的弹性触片的结构示意图；
图11是类V型结构的弹性触片的结构示意图；
图12是U型结构的弹性出片的结构示意图；
图13是本申请又一实施例电镀夹具的整体结构示意图；
图14是图13中B处的放大示意图；
图15是本申请又一实施例的导电环与弹性触片的结构示意图；
图16是本申请又一实施例的限位板与支承柱分离时的结构示意图；
图17是图16所示实施例的限位板与支承柱连接固定时的结构示意图；
图18是本申请一实施例的流水线中基板即将安装在夹具上的示意图；
图19是图18所示实施例的流水线中夹具即将进入电镀液时的示意图。
附图标记说明：1、支撑板；11、空腔；12、连接件；121、连接杆；122、转动杆；123、橡胶套；13、第一环形槽；14、第二环形槽；15、电极引入孔；16、导电环槽；17、限位板；171、限位孔；18、支承柱；181、让位槽；182、限位螺栓；2、密封件；21、密封板；211、缓冲垫；212、凸块；213、通槽；22、驱动壳体；221、气嘴；222、气压腔；223、凸沿；224、让位缺口；3、基板；4、导电组件；41、导电棒；42、导电环；421、开口垫片；422、导电圈；423、导电块；43、弹性触片；5、第一密封圈；6、第二密封圈；7、水平移动单元；8、垂直驱动单元；9、水平旋转单元；101、固定工作台；102、机械手；103、电镀槽。
具体实施方式
以下结合附图对本申请的发明构思作进一步详细说明。
参照图1，本申请实施例提供一种电镀夹具，包括支撑板1与密封件2。
参照图1、图2、图3和图4，支撑板1沿其厚度方向贯穿开设有空腔11。空腔11呈扩口状结构。在安装基板3时，基板3放置于支撑板1上，并将空腔11口径较小的一侧遮挡。支撑板1上还安装有用于与基板3接触导电的导电组件4。
请继续参照图3、图4和图6，密封件2包括密封板21以及驱动件。密封板21整体呈圆盘结构。密封板21用于遮挡基板3远离支撑板1的一侧。由于基板3通常较薄，密封板21靠近支撑板1的一侧嵌设固定有缓冲垫211，缓冲垫211可采用硅胶、 PVDF(Polyvinylidene Fluoride，聚偏氟乙烯)等材料。缓冲垫211尺寸小于密封板21尺寸、用于抵接基板3，起到缓冲效果，减少基板3因外力作用损坏的可能。驱动件用于驱动密封板21靠近或远离支撑板1。
参照图1、图4和图6，驱动件包括带有气嘴221的驱动壳体22。驱动壳体22靠近支撑板1的一侧开设有连通气嘴221的气压腔222。密封板21远离支撑板1的一侧内凹，其边缘位置开设有通槽213，以使得密封板21上端边沿抵接于气压腔222的腔壁时，气嘴221能够通过通槽213与气压腔222连通；密封板21滑动安装于气压腔222内形成一个活塞结构。气嘴221与外界气源连接，气源可采用气泵。通过气泵的工作，进而控制气压腔222内的压强大小，从而驱动密封板21朝向支撑板1靠近或远离。
如图4所示，密封板21远离支撑板1的一侧中部位置凸起有多边形结构的凸块212。在本实施例中，凸块212采用方块结构。对应的，气压腔222的腔壁上凸起有凸沿223，凸沿223围合于凸块212周侧，两者之间形成滑动连接关系。通过凸沿223与凸块212的配合，限制密封板21在运动过程中发生转动。
参照图1、图3和图5，支撑板1上安装有连接件12，用于保持或解除密封件2与支撑板1的连接。连接件12包括连接杆121与转动杆122。连接件12可设置有四个，驱动壳体22的四个边角处对应设置有让位缺口224。连接杆121位于让位缺口224内，以限制驱动壳体22沿垂直于连接杆121轴线方向运动而脱离连接杆121的围合范围。连接杆121的一端与支撑板1可通过螺栓固定连接，另一端与转动杆122转动连接。当转动杆122沿连接杆121轴向的投影不与驱动壳体22发生重叠时，解除密封件与支撑板1的连接状态；当转动杆122沿连接杆121轴向的投影与驱动壳体22存在重叠时，保持密封件2与支撑板1的连接状态。
参照图4和图5，转动杆122远离连接杆121的一端外壁粘接固定有橡胶套123。转动杆122的一端转动并扣接在驱动壳体22侧壁上，当气压腔222内压强突然增大时，橡胶套123能够吸收驱动壳体22朝远离支撑板1运动的冲击力；并且，转动杆122在气压腔222内部压强的反作用力下，抵紧于驱动壳体22上，保持不动；气压腔222内部压强下降后，转动杆122即可再次转动，解除支撑板1与驱动壳体22的连接。在转动杆122的限制下，驱动壳体22沿连接杆121轴向的移动距离为0.5-3mm，最佳移动距离在1-1.5mm。在本实施例中，转动杆122的转动角度可设计为小于180度。
参照图4和图6，支撑板1与密封件2之间设置有第一密封圈5与第二密封圈6。 当密封板21抵接支撑板1时，第一密封圈5被夹紧于支撑板1与密封板21之间，且第一密封圈5围合于基板3外围；第二密封圈6被夹紧于支撑板1与基板3之间，且第二密封圈6位于基板3内侧。第一密封圈5与第二密封圈6均具有一定的抗腐蚀性能与弹性。可采用氟胶、硅胶、聚偏氟乙烯(PVDF)等材料制成。第一密封圈5与第二密封圈6的压缩率控制在10％-30％，最佳区间在15％-25％。
支撑板1上开设有第一环形槽13与第二环形槽14。第一环形槽13直径大于第二环形槽14。第一密封圈5嵌设固定于第一环形槽13内，第二密封圈6嵌设固定于第二环形槽14内。第一密封圈5可阻挡电镀液从支撑板1与密封板21的结合缝处泄露至基板3的非电镀区域；第二密封圈6可阻挡空腔11处的电镀液从支撑板1与基板3的结合缝泄露至基板3的非电镀区域。
参照图6，第一环形槽13靠近第二环形槽14的一侧槽壁低于远离第二环形槽14的一侧槽壁。第二环形槽14靠近第一环形槽13的槽壁低于远离第一环形槽13的一侧槽壁。如此，第一环形槽13的两侧槽壁形成阶梯状，外周高、内周低，即靠近支撑板1外周侧的槽壁更高；第二环形槽14则是外周低，内周高，即靠近空腔11的一侧槽壁更高。
以第一环形槽13来说明，当第一密封圈5发生形变时，由于较高的一侧槽壁在外周，则第一密封圈5在内周的形变量更大，外周没有足够的空间供第一密封圈5发生较大的形变，则外周受到的挤压更强，密封性更高。同样的，第二密封圈6发生形变时，由于较高的一侧槽壁在内周，及更靠近空腔11位置，则第二密封圈6在外周的形变量更大，内周没有足够的空间供第二密封圈6发生形变，则内周受到的挤压更强，密封性更强。
参照图1、图4、图6和图7，导电组件4包括导电棒41、导电环42以及弹性触片43。支撑板1上开设有供导电棒41插入的电极引入孔15。支撑板1靠近密封板21的一侧壁开设有供导电环42安装固定的导电环槽16。导电环槽16位于第一环形槽13与第二环形槽14之间。导电环槽16与电极引入孔15连通。
参照图6、图7和图8，导电环42包括开口垫片421、导电圈422以及导电块423。导电块423与导电圈422通过螺纹连接，且导电块423位于开口垫片421的开口处。开口垫片421通螺栓固定于导电环槽16槽底。导电圈422通过螺栓固定于开口垫片421上。通过压块压紧在导电圈422上，并且通过螺栓依次穿过压块、导电圈422以及导电块423锁紧固定。导电环42可采用电阻率低的材料，例如：金、银、铜、不 锈钢、铂金，或者在铁，不锈钢等材料上镀金以实现良好的导电率。
参照图8和图9，弹性触片43的一端嵌设于导电圈422与开口垫片421之间，另一端用于与基板3接触导电。弹性触片43沿周向均匀间隔分布在导电圈422上，其数量可在16-202个，在其他实施例中，也可根据不同基板3的尺寸进行调整。在本实施例中，弹性触片43呈s型结构。当基板3收到来自密封板21的压力时，基板3侧壁抵接弹性触片43，使得弹性触片43发生形变，沿密封板21运动方向，弹性触片43的形变位移在0-2mm。弹性触片43的寿命在1万次以上。
在其他实施例中，弹性触片43可采用整体呈U型结构、类梯形结构、类V型结构等。图10与11中，类梯形结构与类V型结构的弹性触片43在受压时其形变量均在0-3.5mm；图12中，U型结构的弹性触片43形变量在0-3mm。需要说明的是，弹性触片43的结构不限于上述结构设计。
参照图6和图7，基板3的外周部分延伸至导电环槽16内。电极引入孔15的直径大于导电棒41直径。导电环槽16的尺寸同样大于导电环42。电极引入孔15远离导电环槽16的一端与外部抽真空机通过管道连通。
当气泵启动，气压腔222内的压强增大，密封板21施压于基板3上。此时，通过外部抽真空机对导电环槽16抽出空气；如此基板3朝向密封板21的一侧受到正压，朝向导电环槽16的部分受到负压，使得基板3能够更稳定固定在支撑板1上。正压与负压的压力比可以是1:1,2:1或3：1。正压范围在1-3bar，负压真空度少于2kpa。
通过第一密封圈5与第二密封圈6的设置，配合支撑板1与密封板21，能够将基板3的非电镀区域密封，避免电镀液泄露至非电镀区域上，提高基板3的电镀效果。
可选地，参照图13与图14，在本申请提供的另一些实施例中，第一环形槽13开设于密封板21靠近支撑板1的一侧壁上。第一密封圈5嵌设固定于第一环形槽13内。第一环形槽13的外周槽壁高度高于内周槽壁。
可选地，参照图1、图4、图6图15，在本申请提供的又一些实施例中，导电环42为一整体环状结构，导电环42与弹性触片43一体连接，导电环42与导电棒41可通过焊接固定。弹性触片43的一端连接于导电环42的内壁上，另一端朝向密封板21拱起后再朝着远离密封板21方向延伸，且该端整体沿导电环42轴向延伸。弹性触片43整体呈弯曲的板条状结构。
可选地，参照图16和图17，在本申请提供的又一些实施例中，连接件12包括支承柱18与限位板17，支承柱18的一端与支撑板1连接，另一端朝向密封件2。限位 板17固定安装在驱动壳体22远离支撑板1的一侧。限位板17整体呈方形结构，其中部镂空。限位板17通过外接旋转单元，以驱动限位板17绕其中轴线转动。支承柱18沿周向均匀间隔布置有四个，且支承柱18靠近限位板17的侧壁上开设有供限位板17旋转的让位槽181。限位板17周侧对应于支承柱18间隔开设有限位孔171。支承柱18上螺纹连接有延伸至让位槽181内的限位螺栓182。
当旋转单元带动驱动壳体22转动，进而使得限位板17转动，限位孔171移动到让位槽181内，并对准于限位螺栓182，气压腔222通过外接气动回路控制其内部压强，当驱使密封板21朝向支撑板1抵接后，继续增加气压腔222内部压强，驱动壳体22在其反作用力下朝远离支撑板1运动，以使限位板17上的限位孔171向上套设在限位螺栓182外壁上，并且限位板17抵紧在让位槽181槽壁上；从而保持限位板17与支承柱18的连接。
当气压腔222内压强下降，驱动壳体22在其自重下朝向支撑板1运动，以使限位板17上的限位孔171脱离于限位螺栓182。再通过旋转单元驱动限位板17转动，使得限位孔171与让位槽181分离，即可解除限位板17与支承柱18的连接。
进一步地，本申请实施例还提供一种可垂直挂镀和水平旋转电镀的流水线，包括流水线平台以及上述任一实施中提供的电镀夹具。流水线平台上沿流水线移动方向间隔安装有多个(至少两个)活动平台，活动平台具有X/Y/Z方向移动功能。活动平台设置有水平移动单元、垂直驱动单元和水平旋转单元，电镀夹具可拆卸安装于活动平台上。
参照图18和图19，以图16和图17对应的实施例的电镀夹具进行具体说明。水平移动单元7安装于流水线平台上，垂直驱动单元8与水平移动单元7连接，水平旋转单元9与垂直驱动单元8连接。电镀夹具的密封件2通过安装夹口可拆卸连接于水平旋转单元9端部。
流水线平台上设置有基板3装夹工位。装夹工位上固定有用于限位支撑板1的固定工作台101。支撑板1限位在固定工作台101上，密封件2在水平移动单元7的移动下，移动到支撑板1上方。基板3通过机械手102被放置于支撑板1上。
密封件2在垂直驱动单元8的移动下与支撑板1贴合，将基板3夹持。随后通过水平旋转单元9带动驱动壳体22转动，使得限位板17与支撑板1上的支承柱18配合卡接，并通过限位螺栓182插接于限位孔171内，基板3与夹具之间连接固定后形成子单元。随后往气嘴221通入压缩气体，对基板3的非电镀区域进行密封。外部电 极自电极引入孔15插入，电极导通。
随着流水线平台的运转，水平移动单元7将子单元移动至电镀槽103上方，垂直驱动单元8下降高度。基板3采用旋转电镀时，在子单元进入电镀液之前，水平旋转单元9带动子单元保持旋转转台，旋转转速在0-10rpm。采用垂直挂镀时，则水平旋转单元9不工作。
如此，子单元可单独进入清洗槽，电镀槽，中间无需更换夹具。夹具定期维护，拆卸电镀夹具，更换备用夹具，不影响电镀槽继续使用，节省工作时间，提升工作效率。
综上所述，本申请实施例包括以下至少一种有益效果：
1.在第一密封圈与第二密封圈的设置，配合密封板与支撑板，将基板的非电镀区域密封，阻止电镀液泄露至基板的非电镀区域，从而提高基板的电镀效果；
2.弹性触片周向间隔设置，保证与基板的良好接触导电；
3.通过外接抽真空机，对导电环槽进行抽真空，使得基板两侧的压强差变大，保持基板在电镀过程中的稳定性；
4.密封板滑动安装于气压腔内形成一个活塞结构，因此，密封板向基板施力均匀，特别是降低了超薄基板的破碎的可能性；
5.流水线平台上安装活动平台，并在活动平台上设置水平移动单元、垂直驱动单元和水平旋转单元，阴极夹具可拆卸安装于活动平台上，如此，在一个阴极夹具完成电镀后进行清洗保洁时，流水线上的下一个活动平台随着流水线移动方向进入电镀工序；如此，能够有效提高工作效率。
以上均为本申请的较佳实施例，并非依此限制本申请的保护范围，故：凡依本申请的结构、形状、原理所做的等效变化，均应涵盖于本申请的保护范围之内。

Claims (13)

  1. 一种电镀夹具，包括：
    支撑板(1)，沿其厚度方向开设有空腔(11)，被配置为：基板(3)放置于所述支撑板(1)上，并将所述空腔(11)的一侧及其边沿遮挡；
    导电组件(4)，安装于所述支撑板(1)上，用于与所述基板(3)接触导电；
    密封件(2)，所述密封件(2)包括密封板(21)和驱动件，所述密封板(21)用于遮挡所述基板(3)，所述驱动件驱动所述密封板(21)靠近或远离所述支撑板(1)；
    第一密封圈(5)与第二密封圈(6)，设置于所述支撑板(1)与所述密封件(2)之间，在所述密封板(21)抵接所述支撑板(1)的状态下，所述第一密封圈(5)被夹紧于所述支撑板(1)和所述密封板(21)之间，所述第一密封圈(5)围合于所述基板(3)外围，所述第二密封圈(6)被夹紧于所述支撑板(1)与所述基板(3)之间，所述第二密封圈(6)位于所述基板(3)内侧。
  2. 根据权利要求1所述的电镀夹具，其中所述驱动件包括带有气嘴(221)的驱动壳体(22)；所述驱动壳体(22)靠近所述支撑板(1)的一侧开设有连通所述气嘴(221)的气压腔(222)，所述密封板(21)滑动安装于所述气压腔(222)内形成一个活塞结构；所述气压腔(222)内的气压强度通过所述气嘴(221)连接外接气动回路进行控制，以驱使所述密封板(21)靠近或远离所述支撑板(1)。
  3. 根据权利要求1或2所述的电镀夹具，其中所述支撑板(1)上设置有连接件(12)，所述连接件(12)用于保持或解除所述密封件(2)与所述支撑板(1)的连接。
  4. 根据权利要求3所述的一种电镀夹具，其中所述连接件(12)包括连接杆(121)与转动杆(122)，所述连接杆(121)的一端与所述支撑板(1)连接，另一端朝向所述密封件(2)延伸；对应于所述连接杆(121)，所述驱动壳体(22)的周侧设置有让位缺口(224)，多根所述连接杆(121)围合于所述驱动壳体(22)周侧，以限制所述驱动壳体(22)沿垂直于连接杆轴线运动而脱离所述连接杆(121)的围合区 域；所述转动杆(122)的一端与连接杆(122)转动连接，另一端为自由端；
    所述转动杆(122)被配置为：在所述转动杆(122)沿所述连接杆(121)轴向的投影不与所述驱动壳体(22)发生重叠的状态下，解除所述密封件(2)与支撑板(1)的连接状态；在所述转动杆(122)沿所述连接杆(121)轴向的投影与所述驱动壳体(22)存在重叠的状态下，保持所述密封件(2)与所述支撑板(1)的连接状态。
  5. 根据权利要求2所述的电镀夹具，其中所述密封板(21)远离所述支撑板(1)的一侧的壁上设置多边形的凸块(212)，所述气压腔(222)朝向所述支撑板一侧的腔壁上对应设置有围设在所述凸块(212)周侧的凸沿(223)，所述凸沿(223)与所述凸块(212)之间形成滑动连接。
  6. 根据权利要求1至5中任一项所述的电镀夹具，其中所述支撑板(1)靠近所述密封板(21)的侧壁或所述密封板(21)靠近所述支撑板(1)的侧壁上开设有第一环形槽(13)所述第一密封圈(5)嵌设于所述第一环形槽(13)内；
    所述支撑板(1)上靠近所述密封板(21)的侧壁上开设有第二环形槽(14)，所述第二密封圈(6)设置于所述第二环形槽(14)内。
  7. 根据权利要求6所述的电镀夹具，其中所述第一环形槽(13)靠近所述第二环形槽(14)的一侧槽壁高度低于远离所述第二环形槽(14)的一侧槽壁；所述第二环形槽(14)靠近所述第一环形槽(13)的槽壁高度低于远离所述第一环形槽(13)的一侧槽壁。
  8. 根据权利要求6或7所述的电镀夹具，其中所述导电组件(4)包括导电棒(41)、连接于所述导电棒(41)一端的导电环(42)、以及弹性触片(43)；所述支撑板(1)上开设有供所述导电棒(41)插入的电极引入孔(15)；所述支撑板(1)靠近所述密封板(21)的一侧壁开设有供所述导电环(42)安装的导电环槽(16)，所述导电环槽(16)与所述电极引入孔(15)连通；所述导电环槽(16)位于所述第一环形槽(13)与所述第二环形槽(14)之间；所述弹性触片(43)沿所述导电环(42)周向间隔设置，用于导电连通所述基板(3)和所述导电环(42)。
  9. 根据权利要求8所述的电镀夹具，其中所述弹性触片(43)的一端连接于所述导电环(42)的内壁上，另一端朝向所述密封板(21)拱起后再朝着远离所述密封板(21)的方向延伸，且所述导电环(42)的另一端整体沿所述导电环(42)轴向延伸。
  10. 根据权利要求8或9所述的电镀夹具，其中所述基板(3)的外周部分位于所述导电环槽(16)内；所述电极引入孔(15)直径大于所述导电棒(41)直径；所述导电环槽(16)尺寸大于所述导电环(42)；通过所述电极引入孔(15)连接外部的抽真空机，以使所述导电环槽(16)内的压强变小。
  11. 根据权利要求2或5所述的电镀夹具，其中所述连接件(12)包括支承柱(18)与限位板(17)，所述支承柱(18)的一端与所述支撑板(1)连接，另一端朝向所述密封件(2)；所述支承柱(18)沿周向间隔分布有至少两根，所述限位板(17)设置在所述驱动壳体(22)上，所述限位板(17)通过外接旋转单元，以驱动所述限位板(17)绕其中轴线转动；所述支承柱(18)的侧壁上开设有供所述限位板(17)旋转卡入或移出的让位槽(181)；所述限位板(17)的周侧间隔开设有限位孔(171)；所述支承柱(18)上设置有延伸至所述让位槽(181)内的限位螺栓(182)；
    所述气压腔(222)通过外接气动回路控制其内部压强，在所述密封板(21)被朝向所述支撑板(1)驱动而与所述支撑板(1)抵接的状态下，继续增加所述气压腔(222)内部压强，所述驱动壳体(22)在其反作用力下朝远离所述支撑板(1)的方向运动，以使所述限位板(17)上的所述限位孔(171)套设在所述限位螺栓(182)，所述限位板(17)抵紧在所述让位槽(181)槽壁上；
    当所述气压腔(222)内压强下降，所述驱动壳体(22)在其自重下朝向所述支撑板(1)运动，以使所述限位板(17)上的所述限位孔(171)脱离于所述限位螺栓(182)。
  12. 一种可垂直挂镀和水平旋转电镀的流水线，包括流水线平台，以及权利要求1-11任意一项所述的电镀夹具。
  13. 根据权利要求12所述的流水线，沿流水线移动方向，所述流水线平台上间隔设置有多个具有X/Y/Z方向移动功能的活动平台，所述阴极夹具可拆卸连接于所述活动平台，所述活动平台上设置有水平移动单元(7)、垂直驱动单元(8)和水平旋转单元(9)。
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