WO2023169840A1 - Dispositif de génération de ligne laser définie sur un plan de travail - Google Patents

Dispositif de génération de ligne laser définie sur un plan de travail Download PDF

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Publication number
WO2023169840A1
WO2023169840A1 PCT/EP2023/054703 EP2023054703W WO2023169840A1 WO 2023169840 A1 WO2023169840 A1 WO 2023169840A1 EP 2023054703 W EP2023054703 W EP 2023054703W WO 2023169840 A1 WO2023169840 A1 WO 2023169840A1
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WO
WIPO (PCT)
Prior art keywords
axis
optical element
laser
working plane
profile
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PCT/EP2023/054703
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German (de)
English (en)
Inventor
Andreas Heimes
Original Assignee
Trumpf Laser- Und Systemtechnik Gmbh
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Publication of WO2023169840A1 publication Critical patent/WO2023169840A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0911—Anamorphotic systems

Definitions

  • the present invention relates to a device for generating a defined laser line on a working plane, with a laser light source that is set up to generate a raw laser beam, and with an optical arrangement that receives the raw laser beam and forms an illuminating beam along an optical axis deformed, wherein the illumination beam defines a beam direction that intersects the working plane, the illumination beam in the area of the working plane having a beam profile which has a long axis with a long-axis beam width and a short axis with a short-axis beam width perpendicular to the beam direction, the working plane being relative to the optical arrangement can be moved along a direction of movement in order to process a workpiece with the aid of the illumination beam, and wherein the beam profile has a defined intensity profile over the short-axis beam width, which has a leading edge in the direction of movement, a trailing edge in the direction of movement and an edge between the leading edge and the trailing edge has a plateau, the plateau in the area of the leading edge having a different intensity level than
  • the known device generates a line-shaped laser illumination on a working plane in order to process a workpiece.
  • the workpiece can in particular contain amorphous silicon, which is arranged on a carrier plate.
  • the amorphous silicon is melted line by line using the laser line and converted into polycrystalline silicon when it cools.
  • SLA solid state laser annealing
  • ELA excimer laser annealing
  • a laser line is required on the working plane which is as long as possible in one direction in order to cover the widest possible working surface and which, in comparison, is very short in the other direction in order to provide one for the respective area To provide the required energy density for the process.
  • a long, thin laser line parallel to the working plane is therefore desirable.
  • the direction in which the laser line runs is usually referred to as the long axis and the line thickness as the short axis.
  • the laser line in the area of the working plane should have a defined intensity curve in both axes. It is often desirable for the laser line to have an intensity profile that is as rectangular as possible in the long axis (so-called top hat profile).
  • a top hat profile is also often desired for SLA/ELA applications, which has a leading edge in the direction of movement, a trailing edge in the direction of movement and a plateau that is as flat as possible between the leading edge and the trailing edge.
  • DE 10 2018 115 126 B4 discloses a device for generating such a laser line with an optical arrangement that contains a plate-like formed body made of a material that is transparent to the laser radiation.
  • the forming body has a front side and a parallel back side, each of which has a coating that reflects the laser radiation.
  • An area of the front serves as a light coupling surface and thus provides an input aperture through which a laser beam can be coupled into the forming body.
  • the coupled laser beam is reflected several times in the forming body between the front and the back, with part of the laser beam being able to emerge from the forming body at the back.
  • the coupled-in laser beam thus emerges in segments at the rear, with the respective coupled-out beam segments lying laterally offset from one another and having traveled through different path lengths in the forming body.
  • the coupled laser beam is thereby expanded in a direction that corresponds to the long axis in the further beam path.
  • US 2014/0027417 A1 describes that a modified, so to speak two-stage top hat profile is advantageous for an SLA or ELA process because the formation of the polycrystalline silicon takes place in several successive steps during the relative movement of the laser line and the optimal one Reduce energy density for melting the material during the movement.
  • the laser line is generated in pulses as it moves relative to the workpiece and each section of the workpiece is illuminated with approximately 20 laser pulses during the movement. The laser pulses melt the silicon several times and change its properties.
  • US 2014/0027417 A1 suggests generating the beam profile of the laser line using two raw laser beams that overlap in the area of the working plane.
  • the optical arrangement includes a separate beam path for each of the two raw laser beams.
  • Each of the two beam paths creates a largely top hat-shaped beam profile in the short axis.
  • the two top hat beam profiles are placed offset from one another on the working plane in the direction of the short axis, so that the overall result is a beam profile with a defined step that separates two largely flat plateau sections.
  • a disadvantage of this solution is the very rough two-stage adjustment of the beam profile to the increasing heating of the workpiece as a result of the multiple laser pulses.
  • a device of the type mentioned at the outset is proposed to solve this problem, wherein the optical arrangement has a beam transformer which is set up to divide the raw laser beam into a plurality of beam segments which are in the long axis are arranged next to each other, and wherein the optical arrangement further comprises an optical element which is designed to selectively influence selected beam segments.
  • the new device accordingly has an optical element that makes it possible to specifically change individual beam segments from the large number of beam segments at the output of the beam transformer, while other beam segments from the large number of beam segments remain largely unaffected.
  • the optical element is set up to specifically change the intensity of the individual beam segments.
  • the change can be a reduction in the intensity of the individual beam segments compared to their intensity without the optical element, in particular a reduction or even a blanking out of individual beam segments.
  • the change can lead to a changed intensity profile of individual beam segments, such as a selective reversal/mirroring of the intensity profile.
  • the advantage here is that the change does not affect all beam segments at the output of the beam transformer in the same way.
  • the optical element is designed to change some beam segments at the output of the beam transformer in a different way than other beam segments at the output of the same beam transformer.
  • the optical element therefore contributes to influencing the ratio of the beam segments at the output of the beam transformer relative to one another or to change. This has an impact on the intensity curve, which results from the known superposition of the beam segments in the beam path.
  • the illumination beam is here preferably generated in pulses, in particular in that the laser light source emits the raw laser beam in pulses. Regardless of this, the new device makes it possible to generate a beam profile with an intensity curve in the short axis that falls largely linearly from a higher first level to a lower second level.
  • the optical element is therefore set up to selectively change the beam segments in the short axis so that the intensity curve of the beam profile in the area of the leading edge in the direction of movement has a higher intensity level than in the area of the trailing edge, so that a defined Point of the workpiece surface can be illuminated during the relative movement with temporally successive laser pulses, the intensity and fluence of which decreases.
  • the new device it is also possible to realize an intensity curve in the short axis that increases from the leading edge to the trailing edge by selectively changing the beam segments at the output of the beam transformer.
  • the intensity curve of the beam profile of the new device resembles a lean-to roof in the preferred exemplary embodiments.
  • a pent roof is a roof shape with only one sloping roof surface.
  • the beam profile here preferably has a pitched roof-shaped intensity curve in the short axis.
  • the plateau is therefore preferably step-free. It is clear to the experts that in reality the intensity curve is not ideally linear/flat, but can have small waves and ripples in the plateau that is inclined against the direction of movement. Small waves and ripples are unavoidable due to diffraction effects and manufacturing tolerances. However, the waves and ripples here are small compared to the height of the plateau and can be ignored in an idealized view.
  • the waves and ripples are less than 10%, preferably less than 5%, based on the intensity level of the plateau. Accordingly, in preferred embodiments of the new device, the plateau falls on average counter to the direction of movement continuously, especially when considering a regression line drawn by the waves and ripples.
  • the decreasing intensity curve is achieved here by a selective, therefore non-uniform influence on the beam segments at the output of the beam transformer.
  • the beam transformer as such is known, for example, from the above-mentioned DE 10 2018 115 126 B4 and is referred to there as a forming body.
  • What is new is the targeted, non-uniform modification of beam segments at the output of the beam transformer and the resulting modification of the beam profile in the area of the working plane.
  • the optical element of the new device makes it possible to modify the illumination intensity and fluence over the short axis in a very large adjustment range . In preferred embodiments, this is possible with very low power losses or even without any power losses.
  • the optical element is set up to generate the plateau with an intensity level that on average continuously decreases against the direction of movement
  • the largely linear drop of the plateau which is inclined against the direction of movement, means that the fluence of pulsed laser illumination decreases with each additional laser console. This reduces the heat input into the workpiece from one laser pulse to the next.
  • the optical element is displaceable transversely to the optical axis.
  • the optical element is arranged in the beam path after the beam transformer and is displaceable in the direction of the long axis. In other exemplary embodiments, the optical element is arranged in the beam path in front of the beam transformer and is preferably displaceable in the direction of the short axis. In all exemplary embodiments of this embodiment, the optical element can be used specifically to influence individual beam segments at the output of the beam transformer, for example to completely or partially mask them out or to selectively modify them in some other way. The modified beam segments no longer contribute to the beam profile in the area of the working plane or in a different way. Accordingly, this configuration changes the intensity curve in the short axis in a very simple and cost-effective manner. The ability to move offers new flexibility and makes it possible to optimally adjust the beam profile for the desired processing.
  • the optical element is set up to reflect selected beam segments from the plurality of beam segments about the long axis.
  • the mirroring around the long axis here means that the selected beam segments are reflected around an axis in the area of the beam transformer, which runs parallel to the long axis.
  • the design has the advantage that the beam segments can be changed largely or even completely without loss.
  • Investigations by the applicant have shown that the beam segments at the output of the beam transformer often have a segment-specific intensity curve that is asymmetrical along the short axis.
  • a mirroring of the respective intensity curve of the selected beam segments with respect to the long axis leads to a reversal of the asymmetrical segment-specific intensity curve and thus to a very efficient change in the beam profile in the area of the working plane.
  • the optical element includes a prism, in particular a Dove prism.
  • This configuration enables an efficient and spatially compact implementation of the optical element of the new device. As a result, this configuration is well suited to retrofitting existing devices of the type described above.
  • the optical element includes a lens set with an intermediate focus.
  • This configuration enables a very individual and precise influence on the output-side beam segments of the beam transformer.
  • the optical element includes a set of mirrors.
  • This configuration enables a very compact and precise influencing of the output-side beam segments of the beam transformer.
  • the optical element includes a diaphragm.
  • a cover can be easily retrofitted and can be moved and/or opened quickly and easily.
  • the optical element is arranged downstream of the beam transformer.
  • optical element is arranged upstream of the beam transformer.
  • This configuration enables cost-effective and compact integration of the optical element into the beam path of the new device.
  • the laser light source includes a pumped solid-state laser and a control unit that controls the pumped solid-state laser depending on the optical element.
  • control unit is set up to optimally adapt the pulse repetition rate of the laser light source to the set plateau inclination in order to keep the workpiece surface in the desired process window with high accuracy.
  • FIG. 1a shows a simplified and schematic representation of the short-axis beam path in various exemplary embodiments of the new device
  • 1b shows a simplified representation of the beam profile in the area of the working plane according to exemplary embodiments of the new device
  • 1c shows a simplified representation of a beam transformer to explain exemplary embodiments of the new device
  • 2a shows the heating of a workpiece increasing over time during pulsed illumination with locally overlapping laser pulses of the same fluence
  • FIG. 2b shows the locally overlapping laser pulses in the situation according to FIG. 2a when the workpiece moves relative to the beam profile
  • FIG. 2c shows a situation similar to that in FIG. 2a with pulsed illumination with locally overlapping laser pulses of decreasing fluence
  • FIG. 2d shows the locally overlapping laser pulses in exemplary embodiments of the new device in the situation corresponding to FIG. 2b
  • 3a shows a simplified representation of the optical element in an exemplary embodiment of the new device
  • Fig. 3b is a simplified representation of the optical element in another
  • Fig. 3c is a simplified representation of the optical element in another
  • Fig. 5 shows a simplified representation of the optical element in another
  • an exemplary embodiment of the new device is designated in its entirety by reference number 10.
  • the device 10 generates a laser line 12 in the area of a working plane 14 in order to process a workpiece 16, which is placed here in the area of the working plane 14.
  • the laser line 12 runs here in the direction of an x-axis (Fig. 1b) and the line width is considered here in the direction of the y-axis.
  • the x-axis hereinafter denotes the long axis
  • the y-axis denotes the short axis of the beam profile 18 formed on the working plane 14 (FIG. 1b).
  • the workpiece 16 may contain a layer of amorphous silicon, which is melted using the laser line 12 and converted into polycrystalline silicon.
  • Fig. 1a shows the device 10 in a simplified and schematic representation of the short-axis beam path, which forms the short axis of the laser line. Accordingly, the laser line 12 is only visible as a point in the “side view” of FIG. 1a (along the x-axis). To process the workpiece 16, the laser line 12 can be moved relative to the workpiece 16 in the direction of the arrow 20.
  • the device 10 has a laser light source 22, which can be, for example, a solid-state laser that generates laser light in the infrared range or in the UV range.
  • the laser light source 22 may include an Nd:YAG laser with a wavelength in the range of 1030 nm.
  • the laser light source 22 may include diode lasers, excimer lasers, or solid-state lasers that generate laser light with wavelengths between 150 nm and 360 nm, 500 nm and 530 nm, or 900 nm to 1070 nm.
  • the laser light source 22 emits a raw laser beam 24, which can be coupled into an optical arrangement 26, for example via a glass fiber.
  • the device can have several laser sources 22, each of which generates one or more raw laser beams 24 and couples them into the optical arrangement 26. For the sake of simplicity, only one raw laser beam 24 is mentioned below.
  • the raw laser beam 24 is transformed with the optical arrangement 26 into an illumination beam 28, which defines a beam direction 29.
  • the beam direction 29 intersects the working plane 14.
  • the optical arrangement 26 includes a beam transformer 30, which expands the raw laser beam 24 in the x-direction (corresponding to the long axis).
  • the beam transformer 30 can be implemented in preferred embodiments as follows Beam transformer, which is described in detail in the aforementioned DE 102018 115 126 B4 or also in WO 2018/019374 A1. Accordingly, DE 102018 115 126 B4 and WO 2018/019374 A1 are incorporated by reference here in relation to the beam transformer and also in relation to further details of the optical arrangement, such as in particular the long-axis beam shaping, which is only shown in simplified form here.
  • the beam transformer 30 here has a transparent, preferably monolithic, plate-shaped element for the raw laser beam 24 with a front side 32 and a back side 34, which are essentially parallel to one another.
  • the plate-shaped element can be arranged at an acute angle to the raw laser beam 24, so that the raw laser beam is coupled obliquely into the plate-shaped element.
  • the front side 32 and the back side 34 each have a reflective coating here, so that the raw laser beam 24, which is coupled obliquely into the plate-shaped element on the front side 32, experiences multiple reflections in the plate-shaped element. In this case, a partial segment of the raw laser beam 24 is coupled out on the back 34.
  • the respective decoupled partial segments emerge from the rear side 34 of the beam transformer laterally offset from one another, as in FIG. 1c. is shown schematically. 1c shows an example of how 4 parallel raw laser beams 24 are coupled into the front side 32 of the beam transformer. On the back 34, a large number of beam segments 36a, 36b emerge from the beam transformer laterally offset from one another in the direction of the long axis. Overall, a raw laser beam 24 coupled in at the front 32 is thus fanned out into beam segments 36a, 36b, ..., which are arranged side by side in the direction of the long axis.
  • the optical arrangement 26 contains a long-axis optics, not shown in detail here, which shapes the raw laser beam 24, which is fanned out into beam segments 36a, 36b... in the long axis.
  • the long-axis optics can contain one or more microlens arrays 38, 40, which extend in the x direction and, in preferred embodiments, together with a Fourier lens 42 form an imaging homogenizer.
  • the long-axis optics 38, 40, 42 mixes and superimposes the beam segments 36a, 36b... and advantageously produces a top hat intensity profile in the long axis, as shown in simplified form in FIG. 1b.
  • the optical arrangement 26 further includes a number of optical elements which shape the expanded raw laser beam in the short axis and focus it onto the working plane 14.
  • the optical arrangement 26 includes an objective lens 44 which focuses the illumination beam 28 onto the working plane 14.
  • the optical arrangement 26 can include further lens and/or mirror elements (not shown here), which in particular implement a telescope arrangement and/or a mirror folding (not shown here).
  • the optical arrangement 26 forms an optical axis 46, which can be folded differently from the simplified representation in FIG. 1c.
  • the optical elements of the long-axis optics and the short-axis optics are arranged along the optical axis 46.
  • the optical arrangement 26 is set up to generate the illumination beam 28 with a defined beam profile 18 in the area of the working plane 14.
  • Fig. 1b shows an advantageous beam profile 18 in an idealized representation.
  • the beam profile 18 describes the intensity I of the laser radiation on the working plane 14 depending on the respective positions along the x-axis and the y-axis.
  • the beam profile 18 forms a laser line with a long axis with a long axis beam width in the x direction and a short axis with a short axis beam width in the y direction.
  • the short-axis beam width can be defined, for example, as the full width at half maximum (FWHM) or as the width between the 90% intensity values (Full Width at 90% Maximum, FW@90%).
  • the beam profile 18 here has a pent roof profile in the short axis with a first flank 48, a second flank 50 and a plateau 52, which here slopes continuously from the first flank 48 to the second flank 50.
  • the plateau 52 drops substantially linearly from the first edge 48 to the second edge 50 by an amount corresponding to a decrease in fluence of between 5% and 70%, in some preferred embodiments a decrease in fluence of at least 10%.
  • the beam profile 18 is moved parallel to the y-axis relative to the working plane 14 for machining a workpiece 16.
  • the workpiece 16 is arranged on a table that can move in the y direction. Accordingly, the first flank 48 advances in the direction of movement 20, the second flank 50 trails in the direction of movement 20 (FIG. 1b).
  • the plateau 52 is inclined against the direction of movement 20 and, in a view parallel to the x-axis, is pent roof-shaped.
  • the short-axis beam profile 18 in FIG. 1a is shown very enlarged for illustration purposes.
  • the short-axis beam width FWHM is in a range between 50 m and 150 m.
  • the long axis beam width can be between 20mm and 1200mm in exemplary embodiments.
  • the device 10 During operation, the device 10 generates the beam profile 18 in the area of the working plane 14 in pulses by a controller 54 correspondingly controlling the laser light source in pulses.
  • a controller 54 correspondingly controlling the laser light source in pulses.
  • Figs. 2a to 2d shows the effect that can be achieved by the pulsed beam profile 18 of the device 10.
  • the laser pulses of the device 10 spatially overlap along the y-axis when the beam profile 18 is moved relative to the workpiece in the short axis direction.
  • 2a and 2b show the case for a top hat with a flat, non-inclined plateau 52. From laser pulse to laser pulse, the beam profile 18 is offset by dy along the direction of movement. Every point on the workpiece is illuminated by N>1 laser pulses.
  • Figure 2a shows the sequential temperature rise across successive laser pulses. In the top hat profile according to FIG. 2b, the fluence with which the workpiece location is illuminated successively with each laser pulse is largely constant.
  • 2c and 2d show a strategy to reduce the temperature input over N>1 pulses.
  • An example is shown in which the beam profile has a plateau 52 that slopes relatively steeply against the direction of movement over the short axis.
  • the fluence with which the workpiece location is illuminated decreases from laser pulse to laser pulse.
  • the temperature input in this case the maximum temperature, remains largely constant.
  • the respective process can be advantageously optimized by appropriately setting the plateau steepness dE, line offset dy and laser pulse repetition rate.
  • the Figs. 3a to 3c show exemplary embodiments of an optical element 56, which can be arranged in the beam path after the beam transformer 30 of the device 10 (FIG. 1a) in order to selectively influence the beam segments 36a, 36b at the output of the beam transformer 30 and thus change them relative to one another .
  • the optical element 56a is a prism, in particular a Dove prism.
  • a Dove prism can be understood as an isosceles, right-angled prism in which the optically ineffective area is cut off. Accordingly, when viewed from the side, a Dove prism has the surface of a trapezoid with side surfaces inclined by 45°.
  • a beam segment running along the longitudinal axis of the prism hits one of the inclined incident surfaces, it is first refracted into the prism and directed to the longest side of the prism. There the beam segment is totally reflected and refracted again in the inclined exit surface.
  • the entering and exiting beam segments are aligned with each other, but are mirrored by a straight line transverse to the beam direction due to the reflection in the prism.
  • the same effect can also be achieved with an untruncated triangular prism, which acts like a Dove prism and is therefore also considered here as a Dove prism.
  • the prism 56a is displaceable relative to the optical axis 46, as indicated by an arrow in FIG. 1a.
  • the prism 56a is displaceable parallel to the long axis (x-axis), so that selected beam segments 36a, 36b can be selectively mirrored with respect to the long axis using the prism 56a. In this way, an asymmetrical intensity curve of a selected beam segment can be changed.
  • the optical element 56b includes a lens set with lens elements 60a, 60b with which selected beam segments can be mirrored.
  • the optical element 56c includes a mirror set with mirror elements 62a, 62b, 62c to reflect and thereby influence selected beam segments relative to the long axis.
  • the Figs. 4a to 4c show further exemplary embodiments for an optical element 56, which can be arranged in the beam path after the beam transformer 30 of the device 10 (FIG. 1a), and/or for an optical element 58, which is in the beam path in front of the beam transformer 30 of the device 10 (Fig. 1a) can be arranged.
  • optical elements 56, 58 of the type shown here are also possible in order to selectively change beam segments 36a, 36b.
  • this is advantageously arranged between the beam transformer 30 and the homogenizer, which contains the microlens arrays 38, 40 in the device from FIG. 1a.
  • the optical element 56 includes one or more diaphragms 56d, which can optionally be pushed from one and/or the other side transversely to the optical axis 46 in front of selected beam segments.
  • the one or more apertures 56d are preferably displaceable parallel to the long axis in order to completely or partially mask out selected beam segments 36a, 36b.
  • the optical element 58 includes one or more apertures 58a, which can optionally be pushed transversely to the optical axis 46 from one and/or the other side, by one or more Raw laser beam 24, which is coupled into the beam transformer 30, to be completely or partially hidden.
  • the one or more apertures 58a are displaceable parallel to the short axis in order to completely or partially change selected beam segments 36a, 36b.
  • the raw laser beam initially has a Gaussian beam profile in the short axis, as indicated at reference number 64.
  • the optical element 58b the raw laser beam 24 is reshaped so that it receives an asymmetrical beam profile in the short axis corresponding to reference number 66.
  • the asymmetrical beam profile 66 of the raw laser beam 24 coupled into the beam transformer 30 leads to modified beam segments 36a, 36b at the output of the beam transformer 30.
  • the optical element 58b includes a combination of one or more aspherical and one or more spherical lenses.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif de génération d'une ligne laser définie (12) sur un plan de travail (14), ledit dispositif comprenant une source de lumière laser (22), qui est conçue pour générer un faisceau brut laser (24), et un agencement optique (26), qui reçoit le faisceau brut laser (24) et le convertit le long d'un axe optique (46) en un faisceau d'éclairage (28). Le faisceau d'éclairage (28) définit une direction de faisceau (29) qui coupe le plan de travail (14) et présente, dans la zone du plan de travail (14), un profil de faisceau (18) qui présente, perpendiculairement à la direction du faisceau (29), un axe long ayant une largeur de faisceau d'axe long et un axe court ayant une largeur de faisceau d'axe court. Le profil de faisceau (18) peut être déplacé le long d'une direction de déplacement (20) par rapport au plan de travail (14) pour usiner une pièce (16) à l'aide du faisceau d'éclairage (28). Le profil de faisceau (18) présente un profil d'intensité défini sur la largeur du faisceau d'axe court, ledit profil d'intensité ayant un côté (48) allant dans la direction du déplacement (20), un côté (50) suivant dans la direction de déplacement (20) et un plateau (52) situé entre le côté menant (48) et le côté suivant (50). Le plateau (52) dans la zone du côté menant (48) présente un niveau d'intensité différent de celui dans la zone du côté suivant (50). L'agencement optique (26) comprend en outre un transformateur de faisceau (30) qui est conçu pour diviser le faisceau brut laser (24) en une pluralité de segments de faisceau (36a, 36b) qui sont disposés les uns à côté des autres dans l'axe long. De plus, l'agencement optique (26) comporte un élément optique (56 ; 58) qui est conçu pour influencer sélectivement des segments de faisceau sélectionnés (36a, 36b).
PCT/EP2023/054703 2022-03-08 2023-02-24 Dispositif de génération de ligne laser définie sur un plan de travail WO2023169840A1 (fr)

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DE102022105342.3A DE102022105342A1 (de) 2022-03-08 2022-03-08 Vorrichtung zum Erzeugen einer definierten Laserlinie auf einer Arbeitsebene
DE102022105342.3 2022-03-08

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US20050134964A1 (en) * 2003-12-23 2005-06-23 Lg.Philips Lcd Co., Ltd. Laser optical system for liquid crystal display device
WO2006066706A2 (fr) * 2004-12-22 2006-06-29 Carl Zeiss Laser Optics Gmbh Systeme d'eclairage optique pour formation de faisceaux lineaires
US20140027417A1 (en) 2012-07-24 2014-01-30 Coherent Gmbh Excimer laser apparatus projecting a beam with a selectively variable short-axis beam profile
WO2015191659A1 (fr) * 2014-06-13 2015-12-17 TeraDiode, Inc. Systèmes et procédés d'alignement optique pour systèmes laser combinant des faisceaux de longueur d'onde
WO2018019374A1 (fr) 2016-07-27 2018-02-01 Trumpf Laser Gmbh Éclairage de ligne laser
DE102018115126B4 (de) 2018-06-22 2020-02-13 Trumpf Laser- Und Systemtechnik Gmbh Optische Anordnung zur Umwandlung eines Eingangslaserstahls in einen linienartigen Ausgangsstrahl sowie Lasersystem mit einer solchen optischen Anordnung
DE102020108648A1 (de) * 2020-03-30 2021-09-30 Trumpf Laser- Und Systemtechnik Gmbh Optische Anordnung und Lasersystem
DE102020126269A1 (de) 2020-10-07 2022-04-07 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Erzeugen einer definierten Laserlinie auf einer Arbeitsebene

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9922576D0 (en) 1999-09-24 1999-11-24 Koninkl Philips Electronics Nv Laser system
JP2020107716A (ja) 2018-12-27 2020-07-09 株式会社ブイ・テクノロジー レーザアニール方法およびレーザアニール装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050134964A1 (en) * 2003-12-23 2005-06-23 Lg.Philips Lcd Co., Ltd. Laser optical system for liquid crystal display device
WO2006066706A2 (fr) * 2004-12-22 2006-06-29 Carl Zeiss Laser Optics Gmbh Systeme d'eclairage optique pour formation de faisceaux lineaires
US20140027417A1 (en) 2012-07-24 2014-01-30 Coherent Gmbh Excimer laser apparatus projecting a beam with a selectively variable short-axis beam profile
WO2015191659A1 (fr) * 2014-06-13 2015-12-17 TeraDiode, Inc. Systèmes et procédés d'alignement optique pour systèmes laser combinant des faisceaux de longueur d'onde
WO2018019374A1 (fr) 2016-07-27 2018-02-01 Trumpf Laser Gmbh Éclairage de ligne laser
DE102018115126B4 (de) 2018-06-22 2020-02-13 Trumpf Laser- Und Systemtechnik Gmbh Optische Anordnung zur Umwandlung eines Eingangslaserstahls in einen linienartigen Ausgangsstrahl sowie Lasersystem mit einer solchen optischen Anordnung
DE102020108648A1 (de) * 2020-03-30 2021-09-30 Trumpf Laser- Und Systemtechnik Gmbh Optische Anordnung und Lasersystem
DE102020126269A1 (de) 2020-10-07 2022-04-07 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Erzeugen einer definierten Laserlinie auf einer Arbeitsebene

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