WO2023169358A1 - 密封结构和电子设备 - Google Patents

密封结构和电子设备 Download PDF

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Publication number
WO2023169358A1
WO2023169358A1 PCT/CN2023/079838 CN2023079838W WO2023169358A1 WO 2023169358 A1 WO2023169358 A1 WO 2023169358A1 CN 2023079838 W CN2023079838 W CN 2023079838W WO 2023169358 A1 WO2023169358 A1 WO 2023169358A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
hole
sealing structure
sealing ring
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/079838
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English (en)
French (fr)
Inventor
易海平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2023169358A1 publication Critical patent/WO2023169358A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • This application belongs to the field of communication technology, and specifically relates to a sealing structure and electronic equipment.
  • a plurality of small holes can be opened in the area of the casing of the electronic device corresponding to the speaker, or a large hole can be opened in the area of the casing corresponding to the speaker.
  • the purpose of the embodiments of the present application is to provide a sealing structure and electronic equipment that can solve the problem of poor waterproof performance of electronic equipment.
  • a sealing structure including: a spacer, which is provided with a grid-like through hole; a sealing bracket, which includes a bracket body and a first sealing ring.
  • a first through hole is provided that penetrates both end surfaces of the body, an annular groove is provided on the side of the stent body, a first sealing ring is injection molded on the stent body, and part of the first sealing ring is accommodated in the annular groove;
  • the first end surface of the bracket body close to the annular groove is sealingly connected to the edge area of the partition;
  • the sealing member is sealingly connected to the second end surface of the bracket body away from the partition, and the sealing component is provided with a first through hole that communicates with the first through hole the second through hole.
  • embodiments of the present application provide an electronic device, including the sealing structure described in the first aspect.
  • the sealing structure may include: a partition, a sealing bracket and a sealing member.
  • the partition is provided with a grid-like through hole;
  • the sealing bracket includes a bracket body and a first sealing ring, and the bracket body is provided with a A first through hole penetrates both end surfaces of the body, an annular groove is provided on the side of the stent body, a first sealing ring is injection molded on the stent body, and part of the first sealing ring is accommodated in the annular groove;
  • the stent body The first end surface close to the annular groove is sealingly connected to the edge area of the barrier;
  • the sealing member is sealingly connected to the second end surface of the bracket body facing away from the barrier, and the sealing component is provided with a second through hole communicating with the first through hole.
  • the first waterproofing of the electronic device can be achieved through the sealing connection between the partition and the device shell, and between the sealing structure and the relevant components in the device.
  • the first sealing ring Interference with the casing can achieve the second level of waterproofing of electronic equipment, thereby improving the waterproof performance of electronic equipment.
  • Figure 1 is a schematic structural diagram of a sealing structure provided by an embodiment of the present application.
  • Figure 2 is a schematic structural diagram of the sealing bracket in the sealing structure provided by the embodiment of the present application.
  • Figure 3 is an exploded view of the sealing bracket in the sealing structure provided by the embodiment of the present application.
  • Figure 4 is a schematic structural diagram of the sealing member in the sealing structure provided by the embodiment of the present application.
  • Figure 5 is an exploded view of the sealing component in the sealing structure provided by the embodiment of the present application.
  • Figure 6 is a structural representation of the barrier member, the third solid adhesive member and the fourth solid adhesive member in the sealing structure provided by the embodiment of the present application;
  • Figure 7 is an exploded view of the barrier member, the third solid adhesive member and the fourth solid adhesive member in the sealing structure provided by the embodiment of the present application;
  • Figure 8 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 9 is a second structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 10 is an enlarged schematic diagram of the structure shown as B in Figure 9;
  • the reference numbers in Figures 1 to 10 are: 1000-Electronic equipment; 100-sealed structure; 110 - spacer; 120-Sealing bracket; 121-Bracket body; 122-First sealing ring; 123-First through hole; 130-Sealing member; 131-Second sealing ring; 132-Supporting member; 133-First solid bonding member; 134-Dust-proof net; 135-the second solid adhesive member; 136-the second through hole; 140-Third solid adhesive; 150-The fourth solid adhesive piece; 200-shell; 210-target through hole; 300 - target device.
  • the sealing structure provided by the embodiment of the present application can be applied to electronic equipment. Specifically, it can be applied to scenarios where electronic equipment is equipped with devices that require opening holes in the housing of the electronic equipment.
  • the electronic device in the embodiment of the present application may be a mobile electronic device or a non-mobile electronic device.
  • the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle-mounted electronic device, a wearable device (such as a smart watch), an ultra-mobile personal computer (UMPC), a netbook or a personal computer.
  • the non-mobile electronic device can be a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., and the embodiments of this application are not specifically limited.
  • FIG. 1 shows a possible structural diagram of a sealing structure 100 provided by an embodiment of the present application.
  • the sealing structure 100 provided by the embodiment of the present application may include: a spacer 110, a sealing bracket 120 and a sealing member 130.
  • the spacer 110 is provided with grid-like through holes; in conjunction with Figure 1, as shown in Figure 2 and 3, the sealing bracket 120 includes a bracket body 121 and a first sealing ring 122.
  • the bracket body 121 is provided with a first through hole 123 that penetrates both end surfaces of the body.
  • the bracket body 121 is provided with an annular recess on the side thereof. groove, the first sealing ring 122 is injection molded on the bracket body 121, and part of the first sealing ring 122 is accommodated in the annular groove.
  • the first end surface of the bracket body 121 close to the annular groove is sealingly connected to the edge area of the partition 110; the sealing member 130 is sealingly connected to the second end surface of the bracket body 121 away from the partition 110, as shown in Figure 4 As shown, the sealing member 130 is provided with a second through hole 136 that communicates with the first through hole 123 .
  • the sealing structure provided by the embodiments of the present application is achieved by injecting the first sealing ring into the stent body.
  • the annular groove on the bracket can simplify the assembly and maintenance between the bracket body and the sealing ring, and can improve the sealing degree between the bracket body and the sealing ring to achieve IP68 sealing.
  • IP68 is the highest level of dustproof and waterproof grade standard in GB/T 4208-2017 enclosure protection grade.
  • the first sealing ring when the sealing structure is provided in an electronic device, the first sealing ring can be in close contact with/that is, abut against the inner wall of the electronic device housing to achieve interference sealing with the housing, thereby achieving IP68 seal.
  • the sealing member is used for sealing connection with the device provided corresponding to the sealing structure in the electronic equipment.
  • the stent body may be a plastic body.
  • the first sealing ring can be injection molded on the plastic body by liquid silicone.
  • the first sealing ring can also be made of other materials with good elasticity after injection molding.
  • the bracket body can play a role of supporting and limiting the first sealing ring to ensure that the first sealing ring can achieve interference sealing with the inner wall of the housing of the electronic device.
  • the bracket body can realize the function of sound/light guidance through the first through hole.
  • the partition needs to have a certain degree of rigidity.
  • the material of the partition may be metal or non-metal.
  • the metal when the material of the partition is metal, can be steel, Iron, platinum, etc.
  • the grid-like through holes on the spacers can be realized by etching technology.
  • the barriers When the barriers are made of steel, the barriers may also be referred to as steel mesh structures.
  • the grid-shaped through hole of the partition can block the first through hole on the bracket body, thereby preventing components that are disposed in the first through hole or are disposed opposite to the through hole. ; This prevents the user from seeing the internal features in the first through hole from the outside, thereby improving the appearance experience.
  • the grid-shaped through hole of the barrier member can prevent foreign matter from the external environment from entering the first through hole, and protect the device structure and function provided on the side of the first through hole away from the barrier member.
  • the above-mentioned grid-like through holes are arranged and distributed on the entire barrier member.
  • grid-like through holes may be distributed in the middle area of the barrier member 130 , that is, no through holes are provided in the edge areas of the barrier member 130 . In this way, the contact area between the barrier member 130 and the bracket body can be increased, thereby improving the sealing strength.
  • the sealing member 130 may include: a second sealing ring 131 , and the second sealing ring 131 and the bracket body 121 are away from the barrier member 110 The second end face sealing connection.
  • the sealing member 130 may include a second sealing ring 131 and a support member 132 .
  • the second sealing ring 131 is injection molded on one surface of the support member 132 .
  • the second through hole 136 penetrates the second sealing ring 131 and the support member 132.
  • the target surface of the support member 132 facing away from the second sealing ring 131 is sealingly connected to the second end surface of the bracket body facing away from the barrier member.
  • the second sealing ring can be injection molded on the support member by in-mold injection molding.
  • the support member may be made of plastic, such as polycarbonate (PC for short in English), or any hard material with good surface adhesion.
  • the second sealing ring may be made of silicone.
  • liquid silicone may be used for in-mold injection molding to inject the second sealing ring on the support body.
  • the number of second through holes is the same as the number of first through holes.
  • the sealing member 130 may also include: a first solid adhesive member 133 disposed between the support member 132 and the stent body 121 to sealingly connect the target surface. (the surface of the support member 132 facing away from the second sealing ring 131) and the second end face (the end face of the bracket body 121 facing away from the barrier member 110).
  • a first solid adhesive member 133 disposed between the support member 132 and the stent body 121 to sealingly connect the target surface. (the surface of the support member 132 facing away from the second sealing ring 131) and the second end face (the end face of the bracket body 121 facing away from the barrier member 110).
  • the above-mentioned sealing member 130 may also include: Dust-proof net 134 and second solid adhesive member 135 .
  • the dust-proof net 134 is disposed between the first solid adhesive member 133 and the bracket body 121 , and the first solid adhesive member 133 sealingly connects the dust-proof net 134 and the support body.
  • the second solid adhesive member 135 is disposed between the dust-proof net 134 and the bracket body 121 to sealingly connect the dust-proof net 134 and the bracket body 121 .
  • the dust-proof net can further prevent foreign objects in the environment from entering the interior of the electronic device.
  • the sealing structure 100 may further include: a third solid adhesive member 140 and a fourth solid adhesive member 150 .
  • the third solid adhesive member 140 is disposed between the barrier member 110 and the bracket body 121 to sealingly connect the barrier member 110 and the sealing bracket 120 .
  • the fourth solid adhesive member 150 is disposed on the surface of the barrier member 110 facing away from the sealing bracket 120 to sealingly connect the barrier member 110 and the housing 200 of the electronic device 1000 .
  • the barrier member, the third solid adhesive member and the fourth solid adhesive member may be assembled together first to form a barrier assembly, and then the barrier assembly may be connected to the bracket body.
  • the fourth solid adhesive member is used to sealingly connect the barrier member and the housing of the electronic device to achieve the first IP68 sealing structure between the sealing structure and the electronic device.
  • the first sealing connection of the electronic device when the sealing structure is installed in the device, the first sealing connection of the electronic device can be realized through the sealing connection between the partition and the device shell, and between the sealing structure and the relevant components in the device.
  • the second level of waterproofing of the electronic device can be achieved through the interference between the first sealing ring and the casing, thereby improving the waterproof performance of the electronic device.
  • FIG. 1 shows a possible structural diagram of an electronic device 1000 provided by an embodiment of the present application.
  • an electronic device 1000 provided by an embodiment of the present application may include: the above-mentioned sealing structure 100 .
  • the electronic device 1000 may further include a housing 200 , and a target through hole 210 is provided on the first side wall of the housing 200 .
  • the sealing structure 100 is disposed in the housing 200, and the first through hole 123 is aligned with the target through hole 210; the barrier 110 in the sealing structure 100 is sealingly connected to the first side wall, and the sealing structure 110 The first sealing ring 122 is in contact with the second side wall of the housing.
  • the second side wall is arranged around the first side wall, and the second side wall is perpendicular to the first side wall.
  • the numbers of target through holes, first through holes and second through holes are all the same. For example, both are two.
  • the first sealing ring is in contact with the second side wall of the housing, that is, the first sealing ring and the second side wall interfere in sealing.
  • the partition member may be sealingly connected to the first side wall through a fourth solid adhesive member.
  • the barrier in the sealing structure is sealingly connected to the first side wall of the housing, the electronic The first IP68 seal of the device; due to the interference seal between the first sealing ring in the sealing structure and the second side wall of the housing, the second IP68 seal of the electronic device can be achieved, thus improving the sealing performance of the electronic device .
  • the electronic device 1000 may also include: a target device 300, which is provided in the housing 200 corresponding to the target through hole 210, and the sealing structure 100 is located between target via 210 and target device 300 .
  • the second sealing ring 131 in the sealing structure 100 abuts on the surface of the target device 300 facing the target through hole 210 .
  • the second sealing ring is in contact with the surface of the target device facing the target through hole, that is, there is an interference seal between the second sealing ring and the surface of the target device facing the target through hole.
  • the target device may include any of the following: a speaker, a sound hole, a receiver, or any other device that requires opening a hole in the casing of the electronic device.
  • the sealing between the sealing bracket and the target device in the sealing structure is achieved through a sealing member, and the sealing member is sealingly connected to the bracket body through a solid adhesive. Therefore, after the support member is added to the sealing member, when the sealing bracket is in close contact with the sealing member, misalignment between the second sealing ring and the solid adhesive member can be avoided, thereby increasing the sealing performance of the sealing structure.
  • the spacer assembly Through the spacer, the third solid-state adhesive member and the fourth solid-state adhesive member (hereinafter collectively referred to as the spacer assembly), the appearance of the target device in the electronic device with a large hole is realized, and at the same time, the problem caused by the large hole is solved The internal structure and the problem of foreign matter entering the inside of the whole machine are clearly seen, which not only solves the appearance problem, but also improves the reliability problem in use.
  • the first sealing ring is injection molded on the stent body, which solves the assembly and maintenance difficulties of conventional stent dispensing sealing methods and is better in design.
  • the sealing bracket achieves sealing with the target device through the sealing member. Specifically, the sealing is achieved through interference between the second sealing ring in the sealing member and the surface of the target device facing the first side wall. Specifically, the second sealing ring in the sealing member is added with an in-mold injection support member toward the surface of the first side wall, and the support member is sealingly connected to the solid adhesive member, and then the solid adhesive member is bonded to the stent body. Since the support member is relatively hard in texture, circumferential misalignment between the second sealing ring and the solid bonding member when squeezed can be avoided, thereby making the sealing between the stent body and the second sealing ring more reliable.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请公开了一种密封结构和电子设备，属于密封防水技术领域。该密封结构包括：隔档件，隔档件上设置有网格状通孔；密封支架，密封支架包括支架本体和第一密封圈，支架本体上设置有贯通本体的两个端面的第一通孔，支架本体的侧面上设置有环形凹槽，第一密封圈注塑成型于支架本体上，且部分第一密封圈容置于环形凹槽内；支架本体靠近环形凹槽的第一端面与隔档件的边缘区域密封连接；密封构件，密封构件与支架本体背离隔档件的第二端面密封连接，密封构件上设置有与第一通孔连通的第二通孔。

Description

密封结构和电子设备
相关申请的交叉引用
本申请主张在2022年03月08日在中国提交的中国专利申请号202210219820.4的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于通信技术领域，具体涉及一种密封结构和电子设备。
背景技术
随着电子产品日益普及人们的日常生活，人们对于电子产品的外观需求越来越高。
例如，为了满足用户的差异化审美需求，可以在电子设备的外壳对应于扬声器的区域开多个小孔，还可以在该壳体对应于扬声器的区域大孔。
然而，在电子设备的外壳上开大孔的方案只能实现常规的防水性能，从而导致电子设备的防水性能较差。
发明内容
本申请实施例的目的是提供一种密封结构和电子设备，能够解决电子设备的防水性能较差的问题。
第一方面，本申请实施例提供了一种密封结构，包括：隔档件，隔档件上设置有网格状通孔；密封支架，密封支架包括支架本体和第一密封圈，支架本体上设置有贯通本体的两个端面的第一通孔，支架本体的侧面上设置有环形凹槽，第一密封圈注塑成型于支架本体上，且部分第一密封圈容置于环形凹槽内；支架本体靠近环形凹槽的第一端面与隔档件的边缘区域密封连接；密封构件，密封构件与支架本体背离隔档件的第二端面密封连接，密封构件上设置有与第一通孔连通的第二通孔。
第二方面，本申请实施例提供了一种电子设备，包括如第一方面所述的密封结构。
在本申请实施例中，密封结构可以包括：隔档件、密封支架和密封构件，隔档件上设置有网格状通孔；密封支架包括支架本体和第一密封圈，支架本体上设置有贯通本体的两个端面的第一通孔，支架本体的侧面上设置有环形凹槽，第一密封圈注塑成型于支架本体上，且部分第一密封圈容置于环形凹槽内；支架本体靠近环形凹槽的第一端面与隔档件的边缘区域密封连接；密封构件与支架本体背离隔档件的第二端面密封连接，密封构件上设置有与第一通孔连通的第二通孔。如此，在将密封结构安装在设备中时，通过隔档件与设备壳体间，以及密封结构与设备中的相关器件间的密封连接可以实现电子设备的第一道防水，通过第一密封圈与壳体间干涉可以实现电子设备的第二道防水，从而可以提高电子设备的防水性能。
附图说明
图1为本申请实施例提供的密封结构的结构示意图；
图2为本申请实施例提供的密封结构中的密封支架的结构示意图；
图3为本申请实施例提供的密封结构中的密封支架的爆炸图；
图4为本申请实施例提供的密封结构中的密封构件的结构示意图；
图5为本申请实施例提供的密封结构中的密封构件的爆炸图；
图6为本申请实施例提供的密封结构中的隔档件、第三固态粘接件和第四固态粘接件的结构示意；
图7为本申请实施例提供的密封结构中的隔档件、第三固态粘接件和第四固态粘接件的爆炸图；
图8为本申请实施例提供的电子设备的结构示意图之一；
图9为本申请实施例提供的电子设备的结构示意图之二；
图10为图9中的B所示的结构的放大示意图；
其中，图1至10中的附图标记分别为：
1000-电子设备；
100-密封结构；
110-隔档件；
120-密封支架；121-支架本体；122-第一密封圈；123-第一通孔；
130-密封构件；131-第二密封圈；132-支撑件；133-第一固态粘接件；134-防尘网；
135-第二固态粘接件；136-第二通孔；
140-第三固态粘接件；
150-第四固态粘接件；
200-壳体；210-目标通孔；
300-目标器件。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
本申请实施例提供的密封结构，可以应用于电子设备中，具体地，可以应用于电子设备中设置有需求对电子设备的壳体进行开孔器件的场景下。
本申请实施例中的电子设备可以为移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备(例如智能手表)、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的密封结构和电子设备进行详细地说明。
本申请实施例提供一种密封结构，图1示出了本申请实施例提供的一种密封结构100的一种可能的结构示意图。如图1所示，本申请实施例提供的密封结构100可以包括：隔档件110、密封支架120和密封构件130，隔档件110上设置有网格状通孔；结合图1，如图2和图3所示，密封支架120包括支架本体121和第一密封圈122，支架本体121上设置有贯通本体的两个端面的第一通孔123，支架本体121的侧面上设置有环形凹槽，第一密封圈122注塑成型于支架本体121上，且部分第一密封圈122容置于环形凹槽内。
本申请实施例中，支架本体121靠近环形凹槽的第一端面与隔档件110的边缘区域密封连接；密封构件130与支架本体121背离隔档件110的第二端面密封连接，如图4所示，密封构件130上设置有与第一通孔123连通的第二通孔136。
需要说明的是，本申请实施例中，相比于传统技术中支架本体与密封圈之间通过点胶进行密封的方式，本申请实施例提供的密封结构通过将第一密封圈注塑于支架本体上的环形凹槽内，可以简化支架本体与密封圈之间的组装和维修，并且可以提高支架本体与密封圈之间的密封度，实现IP68密封。其中，IP68是GB/T 4208-2017外壳防护等级中，防尘防水等级标准的最高级别。
本申请实施例中，当密封结构设置在电子设备中时，第一密封圈可以与电子设备壳体的内壁紧密接触/即抵接在该内壁上，以与壳体实现干涉密封，从而实现IP68密封。密封构件用于与电子设备中，对应于密封结构设置的器件密封连接。
可选地，本申请实施例中，支架本体可以为塑胶本体。第一密封圈可以由液态硅胶注塑于塑胶本体上。实际实现中，第一密封圈还可以由其他注塑后具有较好弹性的材质制成。
如此，一方面支架本体可以起到支撑和限位第一密封圈的作用，以确保第一密封圈可以与电子设备的壳体的内壁实现干涉密封。另一方面，支架本体可以通过第一通孔实现导声/导光的作用。
需要说明的是，本申请实施例中，隔档件需要具有一定的刚性。
可选地，本申请实施例中，隔档件的材质可以为金属或非金属。
进一步可选地，本申请实施例中，当隔档件的材质为金属时，该金属可以为钢、 铁、铂金等。隔档件上的网格状通孔可以通过蚀刻技术实现。
当隔档件由钢制成时，隔档件也可以称为钢网结构。
可以理解，本申请实施例中，一方面，隔档件的网格状通孔可以遮挡支架本体上的第一通孔，从而避免设置在第一通孔内，或与通孔相对设置的元件；即可以避免用户从外面看见第一通孔内的内部特征，提升外观体验。另一方面，隔档件的网格状通孔可以阻挡外部环境的异物进入第一通孔内，保护设置在第一通孔背离隔档件的一侧的器件结构和功能。
可选地，本申请实施例中，上述网格状通孔设置分布在整个隔档件上。或者，如图1和图7所示，网格状通孔可以分布在隔档件130的中间区域，即隔档件130的边缘区域不设置通孔。如此可以增加隔档件130与支架本体之间的接触面积，从而可以提高密封强度。
例如，隔档件的边缘0.9-1.0mm的区域不做蚀刻开孔。
可选地，本申请实施例中，结合图1，如图4和图5所示，密封构件130可以包括：第二密封圈131，第二密封圈131与支架本体121背离隔档件110的第二端面密封连接。
可选地，本申请实施例中，如图4和图5所示，密封构件130可以包括第二密封圈131和支撑件132，第二密封圈131注塑成型于支撑件132的一个表面上。
其中，第二通孔136贯穿第二密封圈131和支撑件132，支撑件132背离第二密封圈131的目标表面与支架本体背离隔档件的第二端面密封连接。
进一步可选地，本申请实施例中，第二密封圈可以采用模内注塑的方式，注塑于支撑件上。
可选地，本申请实施例中，支撑件的材质可以为塑料，例如聚碳酸酯(英文简称PC)等，任意硬质的且表面粘接性较好的材质。
可选地，本申请实施例中，第二密封圈可以为硅胶材质，具体的，可以采用液体硅胶，进行模内注塑的方式，将第二密封圈注塑于支撑体上。
可选地，本申请实施例中，第二通孔的数量与第一通孔的数量相同。
如此，通过在密封构件中增设支撑体，可以避免第二密封圈在收到垂直于其轴线方向的挤压力而沿垂直于轴线的方向发生位移的问题，从而可以进一步改善防水密封效果。
可选地，本申请实施例中，如图4和图5所示，密封构件130还可以包括：第一固态粘接件133，设置在支撑件132与支架本体121之间，密封连接目标表面(支撑件132背离所述第二密封圈131的表面)和第二端面(支架本体121背离隔档件110的端面)。如此，通过固态粘接件可以避免省去点胶操作，因此可以简化密封组件的组装工艺。
可选地，本申请实施例中，如图4和图5所示，上述密封构件130还可以包括： 防尘网134和第二固态粘接件135。
其中，防尘网134设置在第一固态粘接件133与支架本体121之间，第一固态粘接件133密封连接防尘网134和支撑体。第二固态粘接件135设置在防尘网134与支架本体121之间，密封连接防尘网134和支架本体121。
可选地，本申请实施例中，防尘网可以进一步避免环境中的异物进入电子设备内部。
可选地，本申请实施例中，结合图1，如图6和图7所示，密封结构100还可以包括：第三固态粘接件140和第四固态粘接件150。
第三固态粘接件140设置在隔档件110与支架本体121之间，密封连接隔档件110与密封支架120。第四固态粘接件150设置在隔档件110背离密封支架120的表面上，密封连接隔档件110与电子设备1000的壳体200。
需要说明的是，本申请实施例中，隔档件、第三固态粘接件和第四固态粘接件可以先组装在一起，构成隔档组件，然后再将隔档组件与支架本体连接。
需要说明的是，第四固态粘接件用于密封连接隔档件和电子设备的壳体，以实现密封结构与电子设备间的第一道IP68密封结构。
本申请实施例提供的密封结构中，在将密封结构安装在设备中时，通过隔档件与设备壳体间，以及密封结构与设备中的相关器件间的密封连接可以实现电子设备的第一道防水，通过第一密封圈与壳体间干涉可以实现电子设备的第二道防水，从而可以提高电子设备的防水性能。
本申请实施例还提供一种电子设备1000，图1示出了本申请实施例提供的一种电子设备1000的一种可能的结构示意图。如图1所示，本申请实施例提供的电子设备1000可以包括：上述的密封结构100。
可选地，本申请实施例中，如图1、图8至图10所示，电子设备1000还可以包括壳体200，壳体200的第一侧壁上设置有目标通孔210。
本申请实施例中，密封结构100设置在壳体200中，且第一通孔123与目标通孔210对齐；密封结构100中的隔档件110与第一侧壁密封连接，密封结构110中的第一密封圈122抵接在壳体的第二侧壁上。
其中，第二侧壁环绕第一侧壁设置，且第二侧壁与第一侧壁垂直。
可以理解，本申请实施例中，目标通孔、第一通孔和第二通孔的数量均相同。例如，均为两个。
本申请实施例中，第一密封圈抵接在壳体的第二侧壁上，即第一密封圈与第二侧壁干涉密封。
可选地，本申请实施例中，隔档件具体可以通过第四固态粘接件与第一侧壁密封连接。
如此，由于密封结构中的隔档件与壳体的第一侧壁密封连接，因此可以实现电子 设备的第一道IP68密封；由于密封结构中的第一密封圈与壳体的第二侧壁间干涉密封，因此可以实现电子设备的第二道IP68密封，如此，可以提高电子设备的密封性能。
可选地，本申请实施例中，如图1、图8至图10所示，电子设备1000还可以包括：目标器件300，对应于目标通孔210设置在壳体200内，密封结构100位于目标通孔210和目标器件300之间。
其中，密封结构100中的第二密封圈131抵接在目标器件300朝向目标通孔210的表面上。
可以理解，本申请实施例中，第二密封圈抵接在目标器件朝向目标通孔的表面上，即第二密封圈与目标器件朝向目标通孔的表面间干涉密封。
可选地，本申请实施例中，目标器件可以包括以下任一项：扬声器、出音孔、受话器等任意需要在电子设备的壳体上开孔的器件。
可以看出，本申请实施例中，密封结构中的密封支架与目标器件之间是通过密封构件实现密封的，而密封构件通过固态粘接件与支架本体密封连接的。因此，在密封构件中增设支撑件之后，当密封支架与密封构件紧密接触时，可以避免第二密封圈与固态粘接件之间发生错位，从而可以增加密封结构的密封性能。
下面对本申请实施例提供的电子设备带来的有意效果进行详细详细说明。
1)通过隔档件、第三固态粘接件和第四固态粘接件(以下统称为隔档组件)实现电子设备中的目标器件开大孔的外观体现，同时解决了开大孔带来的看到内部结构以及异物进入整机内部的问题，即解决了外观体现问题，也改善了使用可靠性问题。
2)通过隔档组件中的第四固态粘接件与壳体的第一侧壁的密封连接，实现了电子设备的第一道IP68密封；通过第一密封圈与壳体的第二侧壁的干涉密封，实现电子设备的第二道IP68密封。使密封更可靠。
3)第一密封圈注塑在支架本体上，解决了常规支架点胶密封方式的组装和维修困难问题，设计上更优。
4)密封支架通过密封构件与目标器件实现密封，具体的，通过密封构件中的第二密封圈与目标器件朝向第一侧壁的表面干涉实现密封。具体的，密封构件中的第二密封圈朝向第一侧壁的表面增加了模内注塑的支撑件，并使支撑件与固态粘接件密封连接，然后在使固态粘接件与支架本体粘接，由于支撑件质地比较硬，因此可以避免第二密封圈与固态粘接件在受挤压时产生周向错位，从而使得支架本体与第二密封圈之间的密封更加可靠。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同 要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种密封结构，所述密封结构包括：
    隔档件，所述隔档件上设置有网格状通孔；
    密封支架，所述密封支架包括支架本体和第一密封圈，所述支架本体上设置有贯通所述本体的两个端面的第一通孔，所述支架本体的侧面上设置有环形凹槽，所述第一密封圈注塑成型于所述支架本体上，且部分所述第一密封圈容置于所述环形凹槽内；所述支架本体靠近所述环形凹槽的第一端面与所述隔档件的边缘区域密封连接；
    密封构件，所述密封构件与所述支架本体背离所述隔档件的第二端面密封连接，所述密封构件上设置有与所述第一通孔连通的第二通孔。
  2. 根据权利要求1所述的密封结构，其中，所述网格状通孔分布在所述隔档件的中间区域。
  3. 根据权利要求1所述的密封结构，其中，所述密封构件包括：第二密封圈和支撑件，所述第二密封圈注塑成型于所述支撑件的一个表面上；
    其中，所述第二通孔贯穿所述第二密封圈和所述支撑件，所述支撑件背离所述第二密封圈的目标表面与所述第二端面密封连接。
  4. 根据权利要求3所述的密封结构，其中，所述密封构件还包括：
    第一固态粘接件，设置在所述支撑件与所述支架本体之间，密封连接所述目标表面和所述第二端面。
  5. 根据权利要求4所述的密封结构，其中，所述密封构件还包括：
    防尘网，设置在所述第一固态粘接件与所述支架本体之间，所述第一固态粘接件密封连接所述防尘网和所述支撑体；
    第二固态粘接件，设置在所述防尘网与所述支架本体之间，密封连接所述防尘网和所述支架本体。
  6. 根据权利要求1至5中任一项所述的密封结构，其中，所述密封结构还包括：
    第三固态粘接件，设置在所述隔档件与所述支架本体之间，密封连接所述隔档件与所述密封支架；
    第四固态粘接件，设置在所述隔档件背离所述密封支架的表面上，密封连接所述隔档件与电子设备的壳体。
  7. 根据权利要求1所述的密封结构，其中，所述支架本体为塑胶本体；所述第一密封圈由液态硅胶注塑于所述塑胶本体上。
  8. 一种电子设备，包括如权利要求1至7中任一项所述的密封结构。
  9. 根据权利要求8所述的电子设备，其中，所述电子设备还包括：
    壳体，所述壳体的第一侧壁上设置有目标通孔；
    所述密封结构设置在所述壳体中，且所述第一通孔与所述目标通孔对齐；所述密封结构中的隔档件与所述第一侧壁密封连接，所述密封结构中的第一密封圈抵接在所 述壳体的第二侧壁上；
    其中，所述第二侧壁环绕所述第一侧壁设置，且所述第二侧壁与所述第一侧壁垂直。
  10. 根据权利要求9所述的电子设备，其中，所述电子设备还包括：
    目标器件，对应于所述目标通孔设置在所述壳体内，所述密封结构位于所述目标通孔和所述目标器件之间；
    其中，所述密封结构中的第二密封圈抵接在所述目标器件朝向所述目标通孔的表面上。
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