WO2023167440A1

WO2023167440A1 - Substrate processing device and method

Info

Publication number: WO2023167440A1
Application number: PCT/KR2023/001592
Authority: WO
Inventors: 임유성
Original assignee: 피에스케이홀딩스 (주)
Priority date: 2022-03-03
Filing date: 2023-02-03
Publication date: 2023-09-07
Also published as: TW202336902A; KR20230130335A

Abstract

A substrate processing device for processing a substrate, according to one embodiment of the present disclosure, may comprise: a support unit for supporting a substrate; a fixing unit positioned at a location adjacent to a circumferential region of the substrate supported on the support unit, so as to fix the substrate; and an adsorption unit, which absorbs at the bottom surface of the substrate so as to apply force in the vertical direction to a central region of the substrate, and thus changes a warpage state of the substrate.

Description

Substrate processing apparatus and method

The present disclosure relates to a substrate processing apparatus and method, and more particularly, to a substrate processing apparatus and method capable of changing and changing a warpage state of a substrate.

Semiconductor integrated circuits such as wafers are generally very small and thin silicon chips, but they are composed of various electronic components, such as an alignment process, photo process, etching process, deposition process, package process, etc. until a single semiconductor chip is produced. It goes through various manufacturing processes, including At this time, warpage may occur in the substrate due to factors such as different thermal expansion rates during the process, and this warpage may act as a cause of reducing the yield of the substrate.

On the other hand, on the other hand, there is also a process in which bending deformation must be intentionally generated in the board. In order to deform the board, physical damage of electronic components on the board as well as physical properties such as strength/stiffness and brittleness of the board must be considered. Furthermore, in order to carry out the process while maintaining the current state of the substrate from which bending deformation has occurred or been removed, a device capable of finely controlling the shape of the substrate without interfering with the conventional process is required.

In order to solve the above problems, the present disclosure provides a substrate processing apparatus and method capable of measuring a current bending strain state of a substrate and changing the bending strain state of the substrate based on the measurement result.

According to an embodiment of the present disclosure, a substrate processing apparatus for processing a substrate includes a support portion for supporting a substrate, a fixing portion positioned adjacent to a circumferential region of a substrate supported on the support portion and configured to fix the substrate, and a lower surface of the substrate. and an adsorption unit configured to change a bending deformation state of the substrate by being adsorbed to and applying force in a vertical direction to a central region of the substrate.

According to an embodiment, a substrate processing apparatus for processing a substrate includes a sensing unit that measures a variable associated with a bending deformation state of a substrate and a control unit that controls driving of a fixing unit and an adsorption unit based on the variable measured by the sensing unit. may further include.

According to one embodiment, the sensing unit may include a sensor for measuring a distance to a central region of the substrate.

According to an embodiment, when the distance to the central region of the substrate is greater than or equal to the reference distance, the adsorption unit may change the bending deformation state of the substrate by adhering to the lower surface of the substrate and applying downward force to the central region of the substrate.

According to one embodiment, when the distance to the central region of the substrate is less than or equal to the reference distance, the fixing unit fixes the substrate by applying force to the circumferential region of the substrate, and the adsorption unit adsorbs to the lower surface of the substrate to move upward to the central region of the substrate. By applying a force, the bending deformation state of the substrate can be changed.

According to an embodiment, one surface of the adsorption unit may include a flexible member that is deformed in a form corresponding to the bending deformation state of the substrate when the adsorption unit is adsorbed to the lower surface of the substrate.

According to an embodiment, the bending deformation state may include at least one of a flat state in which the substrate is flat, a smile state in which the substrate is concave, and a cry state in which the substrate is convex.

According to one embodiment, the fixing portion is movable to apply force to the circumferential region of the substrate in a direction for maintaining the changed bending deformation state.

A substrate processing method of processing a substrate by a substrate processing apparatus according to another embodiment of the present disclosure includes controlling driving of a fixing unit and an adsorption unit based on a variable measured by a sensing unit, wherein the fixing unit controls the operation of the substrate. It is located adjacent to the circumferential region and is configured to fix the substrate, the adsorption unit is adsorbed on the substrate and applies force in a vertical direction to the central region of the substrate to change the bending deformation state of the substrate, and the sensing unit changes the variable related to the bending deformation state can be measured

A computer program recorded on a computer-readable recording medium may be provided to execute a substrate processing method of processing a substrate by a substrate processing apparatus according to another embodiment of the present disclosure.

According to some embodiments of the present disclosure, process efficiency may be increased by transforming a substrate into a shape suitable for a specific process.

According to some embodiments of the present disclosure, a substrate processing apparatus may be applied to various processes by variously changing a warpage state of a substrate.

According to some embodiments of the present disclosure, a warpage state suitable for a specific process may be continuously maintained by applying force to the substrate in an appropriate direction and intensity according to the bending state of the substrate.

According to some embodiments of the present disclosure, the bending deformation state of the substrate can be finely controlled by stably maintaining the adsorption force of the adsorption unit moving the substrate.

1 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present disclosure.

2 illustrates an example in which a bending deformation state of a substrate is changed to a smile state according to an embodiment of the present disclosure.

FIG. 3 shows an example in which an adsorption unit is detached from a substrate changed to a smile state according to an embodiment of the present disclosure.

4 illustrates an example in which a bending deformation state of a substrate is changed to a cry state according to an embodiment of the present disclosure.

5 illustrates an example in which an adsorption unit is detached from a substrate changed to a cry state according to an embodiment of the present disclosure.

6 shows an example of a flexible member included in an adsorption unit according to an embodiment of the present disclosure.

Hereinafter, specific details for the implementation of the present disclosure will be described in detail with reference to the accompanying drawings. However, in the following description, if there is a risk of unnecessarily obscuring the gist of the present disclosure, detailed descriptions of well-known functions or configurations will be omitted.

In the accompanying drawings, identical or corresponding elements are given the same reference numerals. In addition, in the description of the following embodiments, overlapping descriptions of the same or corresponding components may be omitted. However, omission of a description of a component does not intend that such a component is not included in an embodiment.

Advantages and features of the disclosed embodiments, and methods of achieving them, will become apparent with reference to the following embodiments in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below and may be implemented in various different forms, only the present embodiments make the present disclosure complete, and the present disclosure fully covers the scope of the invention to those skilled in the art. It is provided only to inform you.

Terms used in this specification will be briefly described, and the disclosed embodiments will be described in detail. The terms used in this specification have been selected from general terms that are currently widely used as much as possible while considering the functions in the present disclosure, but they may vary according to the intention of a person skilled in the related field, a precedent, or the emergence of new technologies. In addition, in a specific case, there is also a term arbitrarily selected by the applicant, and in this case, the meaning will be described in detail in the description of the invention. Therefore, terms used in the present disclosure should be defined based on the meaning of the term and the general content of the present disclosure, not simply the name of the term.

Expressions in the singular number in this specification include plural expressions unless the context clearly dictates that they are singular. Also, plural expressions include singular expressions unless the context clearly specifies that they are plural. When it is said that a certain part 'includes' a certain element in the entire specification, it means that other elements may be further included without excluding other elements unless otherwise stated.

Also, the term 'module' or 'unit' used in the specification means a software or hardware component, and the 'module' or 'unit' performs certain roles. However, 'module' or 'unit' is not meant to be limited to software or hardware. A 'module' or 'unit' may be configured to reside in an addressable storage medium and may be configured to reproduce one or more processors. Thus, as an example, 'module' or 'unit' refers to components such as software components, object-oriented software components, class components, and task components, processes, functions, properties, It may include at least one of procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, or variables. Functions provided within components and 'modules' or 'units' may be combined into a smaller number of components and 'modules' or 'units', or further components and 'modules' or 'units'. can be further separated.

According to an embodiment of the present disclosure, a 'module' or 'unit' may be implemented as a processor and a memory. 'Processor' should be interpreted broadly to include general-purpose processors, central processing units (CPUs), microprocessors, digital signal processors (DSPs), controllers, microcontrollers, state machines, and the like. In some circumstances, 'processor' may refer to an application specific integrated circuit (ASIC), programmable logic device (PLD), field programmable gate array (FPGA), or the like. 'Processor' refers to a combination of processing devices, such as, for example, a combination of a DSP and a microprocessor, a combination of a plurality of microprocessors, a combination of one or more microprocessors in conjunction with a DSP core, or a combination of any other such configurations. You may. Also, 'memory' should be interpreted broadly to include any electronic component capable of storing electronic information. 'Memory' includes random access memory (RAM), read-only memory (ROM), non-volatile random access memory (NVRAM), programmable read-only memory (PROM), erasable-programmable read-only memory (EPROM), It may also refer to various types of processor-readable media, such as electrically erasable PROM (EEPROM), flash memory, magnetic or optical data storage, registers, and the like. A memory is said to be in electronic communication with the processor if the processor can read information from and/or write information to the memory. Memory integrated with the processor is in electronic communication with the processor.

According to an embodiment of the present disclosure, 'upper', 'lower', 'upper', 'lower', 'side', 'vertical' and 'horizontal' mean relative directions and/or positions with respect to any reference. That is, it is not interpreted as being limited to the absolute direction and / or position shown in the drawings. For example, 'B' adsorbed on the lower surface of 'A' can be interpreted as 'B' adsorbed on the upper surface of 'A' at the same time. For another example, the vertical movement of 'C' can be interpreted as the horizontal movement of 'C' at the same time.

1 is a schematic cross-sectional view of a substrate processing apparatus 100 according to an embodiment of the present disclosure. As shown, the substrate processing apparatus 100 is a device that performs a process of processing the substrate 140 . For example, the substrate processing apparatus 100 may perform an align process, a plasma process, a package process, a reflow process, a vision process, a deposition process, a photo process, or a heat treatment process. It may include a device that performs For another example, the substrate processing apparatus 10 may be provided as a separate device for changing the bending deformation state of the substrate 140 . In addition, the substrate 140 processed by the substrate processing apparatus 100 may be provided as a semiconductor wafer, a mask, a glass substrate, or a liquid crystal display (LCD) panel, but is not limited thereto.

According to an embodiment, the substrate processing apparatus 100 includes

support parts

124 and 134 provided in the chamber 110, fixing

parts

126 and 136, a plurality of driving

members

122, 128, 132 and 138, adsorption. It may include a unit 150 and a processing unit 160 . Here, the chamber 110 may have a processing space in which the substrate 140 is positioned and processed. Additionally, in the substrate processing apparatus 100 , various member(s) required for processing the substrate 140 according to the type of process may be provided inside and/or outside the chamber 110 . For example, when the substrate processing apparatus 100 is a device for processing the substrate 140 using plasma, a configuration for providing a process gas for generating plasma into the chamber 110 and converting the process gas into plasma At least one of a component (for example, a high-frequency generator) or a component for exhausting process gas and plasma in the chamber 110 may be provided.

According to one embodiment, the

supports

124 and 134 may be provided to support the substrate 140 . For example, the

support units

124 and 134 may be provided with a plurality of support pins or electrostatic chucks that support the lower surface of the circumferential region of the substrate 140 . For another example, the

support portions

124 and 134 may be provided as guide rings that support the lower surface of the circumferential region of the substrate 140 .

According to an embodiment, the fixing

parts

126 and 136 may be provided to fix the substrate 140 by being positioned adjacent to a circumferential area of the substrate 140 supported on the

support parts

124 and 134 . Specifically, the fixing

parts

126 and 136 may fix the substrate 140 or release the fixation to the substrate 140 by moving in a vertical direction by the driving

members

122 , 128 , 132 , and 138 . To this end, the fixing

parts

126 and 136 may have a weight capable of preventing bending deformation of the substrate 140 . According to one embodiment, the fixing

parts

126 and 136 may be provided as clamp rings, respectively. Here, the clamp ring may include a ring-shaped disc and a load applying plate extending downward from an inner diameter of the disc to apply a load to the circumference of the substrate 140 and having a cylindrical or square cylinder shape. In this case, the load application plate may be provided in the same shape as the circumferential area of the substrate 140 .

According to an embodiment, the adsorption unit 150 may change a warpage state of the substrate 140 by applying force to the substrate 140 while being adsorbed to the lower surface of the substrate 140 . Specifically, when the interior 152 of the adsorption unit 150 is converted to a vacuum state, the adsorption unit 150 may be adsorbed to the central region of the substrate 140 . Then, the adsorption unit 150 may be configured to change the bending deformation state of the substrate 140 by moving downward and applying tension downward to the central region of the substrate 140 . In the present disclosure, as examples of the bending deformation state, a flat state in which the substrate 140 is flat, a smile state in which the substrate 140 is concave, and a cry state in which the substrate 140 is convex are disclosed, but are not limited thereto. For example, the bending deformation state may refer to any shape of the substrate 140 deformed by applying a certain force.

Meanwhile, in FIG. 1 , one adsorption unit 150 is illustrated as being adsorbed to the central region of the substrate 140, but is not limited thereto, and the adsorption unit 150 may include a plurality of adsorption members. For example, the adsorption unit 150 includes a plurality of adsorption members, and the plurality of adsorption members are arranged at regular intervals around the midpoint of the substrate 140 so as to apply a uniform force to the substrate 140. can For another example, the plurality of suction members may be arranged in a type corresponding to the shape of the substrate 140 based on the shape of the substrate 140 . At this time, the adsorption force of each of the plurality of adsorption members to the substrate 140 may be controlled to have different magnitudes. With this configuration, the substrate processing apparatus 100 can change the substrate 140 into various bending deformation states by more finely adjusting the shape of the substrate 140 .

According to an embodiment, the sensing unit 170 may measure and acquire variables related to the bending deformation state of the substrate 140 . For example, the sensing unit 170 may measure the distance d0 to the substrate 140 (or a central area of the substrate 140). For another example, the detector 170 may measure a value related to the curvature of the substrate 140 .

Meanwhile, in FIG. 1 , the sensing unit 170 is shown to be located on the lower part of the substrate 140, but is not limited thereto, and the substrate 140 may be located in various places such as the upper part and/or the side part of the substrate 140. . In addition, in FIG. 1, the sensing unit 170 is shown as a separate configuration distinct from the adsorption unit 150, but is embedded in and/or attached to the center of the adsorption unit 150, or the chamber 110, the support unit 122, 132), fixing

parts

126, 136, etc. may be configured in a form attached to one surface.

Additionally, the sensing unit 170 may measure and acquire variables related to the position of the substrate 140 . For example, when the substrate processing apparatus 100 is an aligning device that performs a function of arranging the substrate 140 at a predetermined location, the detector 170 measures a variable related to the position of the substrate 140. and can be obtained. Furthermore, when the substrate 140 is disposed at a predetermined position, the sensor 170 may start an operation of measuring a variable associated with a bending deformation state of the substrate 140 .

According to an embodiment, the controller 180 may be connected to the substrate processing apparatus 100 wirelessly and/or wired, and may receive data and/or signals from the substrate processing apparatus 100 . For example, the controller 180 may refer to a separate system configured to control the substrate processing apparatus 100 and/or at least one processor of a user terminal. For another example, the controller 180 may refer to an internal processor mounted in the substrate processing apparatus 100 to control the substrate processing apparatus 100 .

According to an embodiment, the control unit 180 generates a control signal for controlling the operation of the substrate processing apparatus 100 based on data and/or signals received from the substrate processing apparatus 100 to generate a substrate processing apparatus ( 100) can be transmitted. Here, data and/or signals may refer to data and/or signals received from the substrate processing apparatus 100 . In this case, the substrate processing apparatus 100 controls the driving

members

122, 128, 132, and 138, the fixing

units

126 and 138, and/or adsorption, based on data and/or signals received from the sensing unit 170. Driving of the unit 150 may be controlled.

According to an embodiment, the control unit 180 calculates data for controlling the operation of the substrate processing apparatus 100 based on data associated with the substrate 140, and calculates data for controlling the operation of the substrate processing apparatus 100 based on the data. You can control the action. Here, the data related to the substrate 140 may include data related to a process type, a substrate type, physical properties, and/or a target bending strain state. Here, the process type refers to a classification code representing the type of process such as a plasma process, a package process, a reflow process, an etching process, a deposition process, a photo process, a heat treatment process, and the like, and a substrate type refers to a semiconductor wafer, mask, glass substrate or It may refer to a classification code indicating the type of substrate 140, such as a liquid crystal display. In addition, physical properties of the substrate 140 may include the material, size, thickness, stiffness/strength of the substrate 140 .

According to one embodiment, the control unit 180 calculates data for controlling the operation of the substrate processing apparatus 100 based on data associated with the fixing

units

126 and 138, and based on the data, the substrate processing apparatus ( 100) can be controlled. Here, the data associated with the fixing

parts

126 and 138 may include the load of the fixing

parts

126 and 138, the number of members (eg, clamp rings) included in the fixing

parts

126 and 138, and the like. .

With the configuration described above, the substrate processing apparatus 100 may increase process efficiency of the substrate 140 by changing the bending deformation state of the substrate 140 in a form suitable for a specific process. In addition, since the bending deformation state of the substrate 140 can be changed in various ways, the substrate processing apparatus 100 can be applied to various processes.

2 shows an example in which the bending deformation state of the substrate 140 is changed to a smile state according to an embodiment of the present disclosure. As shown, when the bending deformation state of the substrate 140 is a smile state, the substrate 140 may be provided in a form in which the relative position of the center region is lower than that of the circumference region. That is, when the bending deformation state of the substrate 140 is a smile state, the substrate 140 may be provided in a concave shape.

According to an embodiment, when the distance to the central region of the substrate 140 measured by the sensing unit 170 (eg, the distance d0 in FIG. 1 or the distance d2 in FIG. 4) is equal to or greater than the reference distance, The adsorption unit 150 may be converted to a vacuum state and adsorbed to the lower surface of the substrate 140 . Here, the case where the distance to the central region of the substrate 140 is greater than or equal to the reference distance may include a case where the substrate 140 is in a flat state or a cry state. Also, the reference distance may refer to a threshold distance previously determined by a user.

According to an embodiment, the suction unit 150 may change the bending deformation state of the substrate 140 into a smile state by applying downward force to the central region of the substrate 140 . Specifically, the adsorbing unit 150 may apply tension to the central region of the substrate 140 by moving downward while being adsorbed to the substrate 140 . At this time, since a vertical drag force is applied vertically upward to the circumferential region of the substrate 140 by the

support portions

124 and 134, the flexible substrate 140 is deformed into a smile shape in which the central region where the tension is applied is concave. can That is, when the bending deformation state of the substrate 140 is changed into a smile shape, fixing of the substrate 140 by the fixing

units

126 and 136 may not be required. Additionally, before or after the bending deformation state of the substrate 140 is changed, the substrate 140 may not move horizontally or the fixing

parts

126 and 136 may be provided to maintain the bending deformation state of the substrate 140. there is. Operations of the fixing

parts

126 and 136 for the above-described embodiments will be described later with reference to FIG. 3 .

According to an embodiment, when the distance to the central region of the substrate 140 is 'd1' when the substrate 140 is in a smiling state, the adsorption unit 150 has a distance to the central region of the substrate 140 'd1'. It can move downward until 'd3' is smaller than d1'. This is to prevent the substrate 140 from deviating from the target smile state as the central region of the substrate 140 rises slightly as the stress of the substrate 140 decreases when the substrate 140 is detached from the adsorption unit 150. In this case, the moving distance of the adsorption unit 150 may be calculated based on data associated with the adsorption force of the adsorption unit 150, the process type, the substrate type, physical properties, and/or the target bending deformation state. For example, when the temperature of the gas used in the process is high according to the process type, the moving distance of the adsorption unit 150 may be calculated as a higher value. For another example, the stronger the rigidity of the substrate 140 is, the higher the moving distance of the adsorption unit 150 may be calculated.

According to an embodiment, the adsorption unit 150 may maintain an adsorption state to the substrate 140 for a predetermined time from when the movement is completed (ie, when the substrate 140 reaches a target bending deformation state). . With this configuration, the time during which the stress due to the adsorption unit 150 acts on the substrate 140 can be adjusted. In this case, the holding time during which the adsorption unit 150 maintains the adsorption state may be calculated based on data associated with the adsorption force of the adsorption unit 150, the process type, the substrate type, physical properties, and/or the target bending deformation state. For example, the higher the rigidity of the substrate 140 is, the higher the retention time may be calculated. For another example, the retention time may be calculated as a higher value as the adsorption force of the adsorption unit 150 is lower.

FIG. 3 shows an example in which the adsorption unit 150 is detached from the substrate 140 changed to a smile state according to an embodiment of the present disclosure. As shown, when the distance d1 to the central region of the substrate 140 measured by the sensing unit 170 while the adsorption unit 150 moves downward reaches the reference distance, the adsorption unit 150 can stop movement and release the vacuum. Here, the reference distance may mean a distance to a central region of the substrate 140 that causes the substrate 140 to be in a smile state. In this case, the fixing

parts

126 and 136 may move downward to apply force (ie, pressure) to the circumferential region of the substrate 140 . With this configuration, the substrate 140 is fixed in the horizontal direction, and processing of the substrate 140 can be performed at a constant position. In addition, the changed bending deformation state (here, a smile state) of the substrate 140 may be maintained, so that the bending deformation state of the substrate 140 suitable for a specific process may be continuously maintained.

4 illustrates an example in which the bending deformation state of the substrate 140 is changed to a cry state according to an embodiment of the present disclosure. As shown, when the bending deformation state of the substrate 140 is a cry state, the substrate 140 may be provided in a form in which a relative position of the center region is higher than that of the circumference region. That is, when the bending deformation state of the substrate 140 is a cry state, the substrate 140 may be provided in a convex shape.

According to an embodiment, when the distance to the central region of the substrate 140 measured by the sensing unit 170 (eg, the distance d0 in FIG. 1 or the distance d1 in FIG. 2 ) is less than or equal to the reference distance, The adsorption unit 150 may be converted to a vacuum state and adsorbed to the lower surface of the substrate 140 . Here, the case where the distance to the central region of the substrate 140 is equal to or less than the reference distance may include a case where the substrate 140 is in a flat state or a smile state. Also, the reference distance may refer to a threshold distance previously determined by a user.

According to an embodiment, the adsorption unit 150 may change the bending deformation state of the substrate 140 to a cry state by applying force upward to the central region of the substrate 140 . Specifically, the adsorbing unit 150 may apply pressure to the central region of the substrate 140 by moving upward while being adsorbed to the substrate 140 . However, when the bending deformation state of the substrate 140 is changed to a cry state, fixation to the circumferential region of the substrate 140 may be required so that the substrate 140 is not lifted by the pressure of the adsorption unit 150. there is. To this end, when the distance to the central region of the substrate 140 (for example, the distance d0 in FIG. 1 or the distance d1 in FIG. 2) is less than or equal to the reference distance, the fixing

units

126 and 136 move downward, respectively. By applying force (ie, pressure) to the circumferential area of the substrate 140, the substrate 140 may be fixed so that the circumferential area of the substrate 140 is not lifted by the pressure of the suction unit 150. Additionally, the fixing

parts

126 and 136 may be provided so that the substrate 140 does not move horizontally or to maintain the bending deformation state of the substrate 140 even before or after the bending deformation state of the substrate 140 is changed. . Operations of the fixing

parts

126 and 136 for the above-described embodiments will be described later with reference to FIG. 5 .

According to an embodiment, when the distance to the central region of the substrate 140 is 'd1' when the substrate 140 is in a cry state, the adsorbing unit 150 has a distance to the central region of the substrate 140 'd1'. You can move upward until 'd4' is greater than d1'. This is to prevent the substrate 140 from deviating from a target cry state as the central region of the substrate 140 slightly descends as the stress of the substrate 140 decreases when the substrate 140 is detached from the adsorption unit 150. In this case, the moving distance of the adsorption unit 150 may be calculated based on data associated with the adsorption force of the adsorption unit 150, the process type, the substrate type, physical properties, and/or the target bending deformation state. For example, when the temperature of the gas used in the process is high according to the process type, the moving distance of the adsorption unit 150 may be calculated as a higher value. For another example, the stronger the rigidity of the substrate 140 is, the higher the moving distance of the adsorption unit 150 may be calculated.

FIG. 5 shows an example in which the adsorption unit 150 is detached from the substrate 140 changed to a cry state according to an embodiment of the present disclosure. As shown, when the distance d2 to the central region of the substrate 140 measured by the sensing unit 170 while the adsorption unit 150 moves upward reaches the reference distance, the adsorption unit 150 can stop movement and release the vacuum. Here, the reference distance may mean a distance to a central region of the substrate 140 that causes the substrate 140 to be in a cry state. In this case, the fixing

parts

126 and 136 may move downward to apply force (ie, pressure) to the circumferential region of the substrate 140 .

With this configuration, the substrate 140 is fixed in the horizontal direction, and processing of the substrate 140 can be performed at a constant position. In addition, since the changed bending deformation state (here, the cry state) of the substrate 140 is maintained, the substrate 140 can be processed while maintaining a current state suitable for the process. Furthermore, this may lead to an improvement in yield of the substrate 140 .

6 shows an example of a flexible member 154 included in the adsorption unit 150 according to an embodiment of the present disclosure. (a) of FIG. 6 shows the adsorption unit 150 before adsorption to the substrate 140 and/or the adsorption unit 150 after adsorption has been released from the substrate 140 . As shown, a flexible member 154 having flexibility may be provided on the top of the adsorption unit 150 . For example, the flexible member 154 may refer to a part (or all) of the adsorption unit 150 including one side of the adsorption unit 150 in contact with the substrate 140 .

According to an embodiment, when the adsorption unit 150 moves in a vertical direction and is adsorbed to the substrate 140, the shape of the flexible member 154 may be deformed into a shape corresponding to the bending deformation state of the substrate 140. there is. For example, when the substrate 140 is in a smile state or a cry state, the flexible member 154 may be adsorbed to the substrate 140 in a concave or convex shape, respectively. For another example, when the substrate 140 is in a flat state, the flexible member 154 may be adsorbed to the substrate 140 in a flat shape. With this configuration, even while the adsorption unit 150 moves in the vertical direction to change the bending deformation state of the substrate 140, the adsorption force of the adsorption unit 150 to the substrate 140 can be stably maintained. there is.

The preceding description of the present disclosure is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications of this disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied in various modifications without departing from the spirit or scope of this disclosure. Thus, the present disclosure is not intended to be limited to the examples set forth herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Although example implementations may refer to utilizing aspects of the presently disclosed subject matter in the context of one or more standalone computer systems, the subject matter is not so limited, but rather in conjunction with any computing environment, such as a network or distributed computing environment. may be implemented. Further, aspects of the presently-disclosed subject matter may be implemented in or across a plurality of processing chips or devices, and storage may be similarly affected across a plurality of devices. Such devices may include PCs, network servers, and handheld devices.

Although the present disclosure has been described in relation to some embodiments in this specification, it should be noted that various modifications and changes can be made without departing from the scope of the present disclosure that can be understood by those skilled in the art. something to do. Moreover, such modifications and variations are intended to fall within the scope of the claims appended hereto.

Claims

In the substrate processing apparatus,

a support portion supporting the substrate;

a fixing portion positioned adjacent to a circumferential region of the substrate supported on the support portion and configured to fix the substrate; and

an adsorption unit configured to change a bending deformation state of the substrate by adhering to a lower surface of the substrate and applying force in a vertical direction to a central region of the substrate; and

A sensing unit for measuring a variable related to the bending deformation state of the substrate

Including, the substrate processing apparatus.
According to claim 1,

A control unit for controlling driving of the fixing unit and the suction unit based on the variable measured by the sensing unit.

Further comprising a substrate processing apparatus.
According to claim 2,

Wherein the sensing unit includes a sensor for measuring a distance to the central region of the substrate.
According to claim 1,

When the distance to the central region of the substrate is equal to or greater than the reference distance, the adsorption unit changes the bending deformation state of the substrate by adhering to the lower surface of the substrate and applying downward force to the central region of the substrate.
According to claim 1,

When the distance to the central region of the substrate is less than or equal to the reference distance, the fixing part fixes the substrate by applying force to the circumferential region of the substrate, and the adsorption part adsorbs to the lower surface of the substrate and moves upward to the central region of the substrate. A substrate processing apparatus for changing a bending deformation state of the substrate by applying a force to the substrate.
According to claim 1,

One side of the adsorption unit includes a flexible member that is deformed in a form corresponding to a bending deformation state of the substrate when the adsorption unit is adsorbed to the lower surface of the substrate.
According to claim 1,

The bending deformation state includes at least one of a flat state in which the substrate is flat, a smile state in which the substrate is concave, and a cry state in which the substrate is convex.
According to claim 1,

The substrate processing apparatus of claim 1 , wherein the distance that the adsorber moves by being adsorbed to the lower surface of the substrate is calculated based on at least one of a process type for the substrate, a substrate type, a physical property of the substrate, or a target bending deformation state.
According to claim 1,

The substrate processing apparatus of claim 1 , wherein the fixing part moves to apply force to a circumferential region of the substrate in a direction for maintaining the changed bending deformation state.
A substrate processing method of processing a substrate by the substrate processing apparatus of claim 1,

Controlling the driving of the fixing unit and the suction unit based on the variable measured by the sensing unit

including,

The fixing part is located adjacent to the circumferential area of the substrate and is configured to fix the substrate,

The adsorbing unit adsorbs on the substrate and applies a force in a vertical direction to a central region of the substrate to change a bending deformation state of the substrate;

Wherein the sensing unit measures the variable associated with the bending deformation state.
A computer-readable non-transitory recording medium on which a program for executing the substrate processing method according to claim 10 is recorded.