WO2023163531A1 - Digitizer and image display device comprising same - Google Patents

Abstract

This digitizer comprises: a base layer; a lower conductive layer arranged on a top surface of the base layer; a first anti-reflective layer formed on the lower conductive layer and having a reflectivity lower than that of the lower conductive layer; an interlayer insulating layer burying the lower conductive layer and the first anti-reflective layer; an upper conductive layer formed on the interlayer insulating layer; a second anti-reflective layer formed on the upper conductive layer and having a reflectivity lower than that of the upper conductive layer; and a contact electrically connecting the lower conductive layer with the upper conductive layer through the interlayer insulating layer.

Description

Digitizer and image display device having the same

The present invention relates to a digitizer, and more particularly, to a digitizer capable of blocking or minimizing reflection of a conductive layer of the digitizer.

Most image display devices (Display) apply a touch input method in which a user inputs by touching a screen with a finger or an electronic pen.

The touch input method is intuitive and convenient because the user can input by directly touching a specific location on the screen. In particular, a touch input method using a pen can designate more precise coordinates than a touch input method using a finger, so it is suitable for graphic work such as CAD. A touch input method using such a pen includes a digitizer.

1 is a cross-sectional view of a conventional image display device having a digitizer.

As shown in FIG. 1, a conventional image display device includes a display panel 100 and a digitizer 200.

The display panel 100 may implement color by including a pixel electrode (TFT), a pixel defining layer, a display layer, a counter electrode, an encapsulation layer, and the like on a substrate.

The digitizer 200 is coupled to the rear of the display panel 100 and converts the touch coordinates of the pen into digital data. The digitizer 200 may include a base layer 210, an adhesive layer 220, a lower conductive layer 230, an interlayer insulating layer 240, an upper conductive layer 250, a passivation layer 260, and the like.

In a conventional image display device, when light is emitted from pixels of the display panel 100 , the emitted light may be reflected from the lower/upper conductive layers 230 and 250 of the digitizer 200 . Such reflected light may affect the pixel electrodes of the display panel 100 and act as voltage noise on the pixel electrodes, causing screen defects.

Meanwhile, in the digitizer 200, the lower conductive layer 230 is patterned using FCCL (Flexible Copper Clad Laminate), and then the interlayer insulating layer 240 and the upper conductive layer 250 are sequentially laminated. do.

However, FCCL has a structure in which copper foil, which is a conductor, is laminated on polyimide, which is an insulator. The upper conductive layer 250 formed on the interlayer insulating layer 240 is formed through deposition, but the lower conductive layer 230 is mainly formed by patterning a plated copper foil layer. As a result, the surface roughness (roughness) of the lower conductive layer 230 is relatively high. The high surface roughness of the lower conductive layer 230 may increase the light reflection ratio more than that of the upper conductive layer 250 and may further affect the pixel electrode.

An object of the present invention is to block or minimize voltage noise of a pixel electrode (TFT) caused by a conductive layer by lowering light reflectivity of lower/upper conductive layers in a digitizer.

An object of the present invention is to reduce the difference in visibility between the lower and upper conductive layers by minimizing the difference in reflectance between the lower and upper conductive layers according to the difference in thickness and surface roughness of the lower and upper conductive layers in a digitizer.

The digitizer of the present invention for achieving this object may include a base layer, a lower conductive layer, a first anti-reflection layer, an interlayer insulating layer, an upper conductive layer, a second anti-reflection layer, and a contact.

A lower conductive layer is disposed on the upper surface of the substrate layer.

The first antireflection layer is formed on the lower conductive layer and has a reflectance lower than that of the lower conductive layer.

The interlayer insulating layer buries the lower conductive layer and the first antireflection layer.

An upper conductive layer is formed on the interlayer insulating layer.

A second antireflection layer is formed on the upper conductive layer. The second antireflection layer has a reflectance lower than that of the upper conductive layer.

The contact penetrates the interlayer insulating layer and electrically connects the lower conductive layer and the upper conductive layer.

In the digitizer of the present invention, the surface roughness of the lower conductive layer may be greater than that of the upper conductive layer.

In the digitizer of the present invention, the first anti-reflection layer and the second anti-reflection layer may include a copper-oxygen-containing composite material.

In the digitizer of the present invention, the copper-oxygen-containing composite material may further contain additional metals. The additional metal may be at least one selected from the group consisting of indium (In), lanthanum (La), cesium (Ce), chromium (Cr), molybdenum (Mo), tungsten (W), magnesium (Mg), and calcium (Ca). can

In the digitizer of the present invention, the first anti-reflection layer may have a lower copper content than the second anti-reflection layer.

In the digitizer of the present invention, the copper-oxygen-containing composite material may include indium (In) as an additional metal. The first anti-reflection layer may have a higher indium (In) content than the second anti-reflection layer.

In the digitizer of the present invention, the lower conductive layer and the upper conductive layer may be copper electrodes.

In the digitizer of the present invention, the lower conductive layer may include a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer. The upper conductive layer may include a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction parallel to the top surface of the base layer and perpendicular to the second direction.

In the digitizer of the present invention, the contact may include first contacts and second coatacles. The first contacts may electrically connect the first upper conductive lines and the second lower conductive lines to form a first conductive coil. The second contacts electrically connect the first lower conductive lines and the second upper conductive lines and may form a second conductive coil.

In the digitizer of the present invention, the first conductive coil extends in the first direction, and a plurality of first conductive coils may be arranged along the second direction. The second conductive coil extends in the second direction, and a plurality of second conductive coils may be arranged along the first direction.

In the digitizer of the present invention, each of the first conductive coils may include a plurality of first conductive loops. Each of the second conductive coils may include a plurality of second conductive loops.

An image display device of the present invention may include a display panel and the above-described digitizer disposed under the display panel.

The digitizer of the present invention having such a configuration can reduce light reflected from the conductive layer by forming an antireflection layer on the conductive layer. As a result, the present invention can block or minimize the occurrence of voltage noise in the pixel electrode (TFT) of the display panel due to the light reflection of the conductive layer.

In addition, when the digitizer of the present invention forms the first anti-reflection layer on the lower conductive layer, the copper (Cu) content is lowered and the indium (In) content is increased than the second anti-reflection layer, so that the lower conductive layer has high surface roughness and a large thickness. It is possible to minimize the difference in reflectance due to As a result, visibility of the conductive layer can be blocked or minimized.

1 is a cross-sectional view of a conventional image display device having a digitizer.

2 is a cross-sectional view of an image display device having a digitizer according to the present invention.

3 to 6 are plan views and cross-sectional views showing specific embodiments of a digitizer according to the present invention.

7 shows a result of testing the voltage of a pixel electrode in an image display device having a digitizer according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of an image display device having a digitizer according to the present invention.

As shown in FIG. 2 , the image display device according to the present invention may include a display panel 100 , a digitizer 200 , an antireflection layer 300 , and the like.

The display panel 100 generates an image, and may include a pixel electrode, a pixel defining layer, a display layer, a counter electrode, an encapsulation layer, and the like.

The pixel electrode causes the display layer to emit light by applying a voltage or current to the display layer, and may be electrically connected to the drain electrode of the thin film transistor TFT.

The pixel defining layer may define a pixel area by exposing a pixel electrode.

The display layer emits color and may include, for example, a liquid crystal layer or an organic light emitting layer.

The opposite electrode may be disposed on the pixel defining layer and the display layer. The counter electrode may serve as, for example, a common electrode or a cathode of an image display device.

The encapsulation layer protects components of the lower display panel and may be stacked on the opposite electrode.

In addition, the display panel 100 may include a spacer or the like.

Although not shown in FIG. 1 , the image display device may include a touch panel (not shown), a window panel (not shown), and the like on top of the display panel 100 .

The touch panel may be coupled to the front of the display panel to sense a user's touch input through the front surface. The touch panel may include sensing electrodes or sensing channels having a thickness smaller than that of the conductive layer included in the digitizer so as not to be recognized by a user. The touch panel may be coupled to the display panel through an adhesive layer.

The window panel is coupled to the front of the touch panel, and may include, for example, a hard coating film or thin glass. A light-shielding pattern may be formed on a peripheral portion of one surface of the window panel. An image display device can define a bezel part or a non-display area by a light-shielding pattern.

Although not shown in FIG. 1 , an image display device may dispose a polarization layer between a window panel and a touch panel. The polarization layer may include a coated polarizer or polarizer. The polarization layer may be directly bonded to one surface of the window panel or attached via an adhesive layer. The polarization layer may be coupled to the touch panel through an adhesive layer.

In an image display device including these configurations, a window panel (not shown), a polarization layer (not shown), a touch panel (not shown), a display panel 100, and a digitizer 200 are disposed in the order from the user's viewing side. can

The digitizer 200 may be disposed under the display panel 100 so as not to be visually recognized by a user. In this case, the digitizer 200 may be disposed between the display panel 100 and a rear cover (not shown).

The digitizer 200 may include a base layer 210, an adhesive layer 220, a lower conductive layer 230, an interlayer insulating layer 240, an upper conductive layer 250, a passivation layer 260, and the like.

The base layer 210 is a support layer for forming the lower/upper conductive layers 230 and 250 and the interlayer insulating layer 240, and may be in the form of a film. The base layer 210 is a polymer material applicable to a flexible display, for example, cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), and the like. Among these materials, since polyimide exhibits the most stable bending properties, it may be preferable to use polyimide.

The adhesive layer 220 may be selectively included according to the type of FCCL (Flexible Copper Clad Laminate) used.

FCCL usually has a structure in which copper foil, which is a conductor, is laminated on polyimide, which is an insulator. FCCL has a form such as a single side FCCL (Single Side FCCL) in which copper foil exists on only one side and a double side FCCL (Double Side FCCL) in which copper foil is present on both sides. In the present invention, a single side FCCL can be used.

Single-sided FCCL may have various laminated structures, such as a three-layer laminated FCCL with an adhesive layer between a polyimide film and copper foil, and a two-layer casting FCCL in which polyimide resin is melted and attached to copper foil. In such a laminated structure, since the copper foil is usually formed by electroforming or rolling, the thickness may be as thick as 12 to 18 μm.

In this way, since the FCCL has a form with and without an adhesive layer, the digitizer 200 of the present invention may or may not include the adhesive layer 220 depending on the FCCL used.

In the case of including the adhesive layer 220, the adhesive layer 220 may be composed of an insulating adhesive. The insulating layer adhesive may include a thermosetting resin such as an epoxy resin, and may also include a curing agent, a binder, a flame retardant, and the like.

The adhesive layer 220 may have a thickness of 5 to 50 μm. If the thickness is less than 5 μm, the thickness may not be sufficient to form the circuit pattern, that is, the lower conductive layer 230 . If the thickness exceeds 50 μm, flexibility may deteriorate.

The lower conductive layer 230 forms, for example, a transmission electrode and may be a conductive metal layer having a circuit pattern. Conductive metals include, for example, silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W) , Niobium (Nb), Tantalum (Ta), Vanadium (V), Iron (Fe), Manganese (Mn), Cobalt (Co), Nickel (Ni), Zinc (Zn), Tin (Sn), Molybdenum (Mo) , calcium (Ca) or an alloy containing at least two or more of these may be used, preferably copper or a copper alloy.

The interlayer insulating layer 240 buries and protects the lower conductive layer 230, and is an organic insulating material such as an epoxy-based resin, an acrylic-based resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic material such as silicon oxide or silicon nitride. It can be composed of an insulating material or the like.

The interlayer insulating layer 240 is preferably formed of an organic insulating material in order to increase flexibility, and may have a thickness of 15 to 20 μm.

The upper conductive layer 250 is formed on the interlayer insulating layer 240 to form a receiving electrode, for example, and may be a conductive metal layer having a circuit pattern like the lower conductive layer 230 . Like the lower conductive layer 230, the conductive metal is silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca) or an alloy containing at least two or more of these, preferably copper or a copper alloy.

The passivation layer 260 buries and protects the upper conductive layer 250, and is an organic insulating material such as an epoxy-based resin, an acrylic-based resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. can be made of matter.

It is preferable to use an organic insulating material for the passivation layer 260 to increase flexibility, and may have a thickness of 1.5 to 20 μm.

In one embodiment, each of the interlayer insulating layer 240 and the passivation layer 260 may include an inorganic insulating material and may have a thickness of about 100 nm to about 500 nm.

In one embodiment, the thickness of the lower conductive layer 230 may be greater than the thickness of the upper conductive layer 250 . For example, the thickness of the first lower conductive line 232 may be greater than that of the first upper conductive line 252 .

In some embodiments, the thickness of the lower conductive layer 230 may be about 5 μm to about 30 μm, preferably about 10 μm to about 25 μm. The thickness of the upper conductive layer 250 may be 6 μm or less, preferably about 1 μm to 6 μm, or 1 μm to 5 μm.

The antireflection layer 300 blocks or minimizes reflected light from the lower/upper conductive layers 230 and 250, and the first antireflection layer 310 formed on the lower conductive layer 230 and the second antireflection layer 310 formed on the upper conductive layer 250 2 antireflection layer 320 may be included.

The anti-reflection layer 300 maintains the electrical conductivity of the lower/upper conductive layers 230 and 250 while lowering the reflectance of the lower/upper conductive layers 230 and 250, and furthermore maintains a contact with the lower/upper conductive layers 230 and 250 made of copper. In order to also lower the contact resistance, it can be composed of a copper-oxygen-containing composite material or a copper-added metal-oxygen-containing composite material. Here, the additional metal is at least one selected from the group consisting of indium (In), lanthanum (La), cesium (Ce), chromium (Cr), molybdenum (Mo), tungsten (W), magnesium (Mg), and calcium (Ca). may contain one. It may be preferable to use indium to reduce the high surface roughness of the lower conductive layer 230 .

When indium is used as the additional metal, the first and second antireflection layers 310 and 320 may have different composition ratios of copper, indium, and oxygen in consideration of the high surface roughness and relatively large thickness of the lower conductive layer 230. . That is, the first anti-reflection layer 310 may have a lower copper (Cu) content and a higher indium (In) content than the second anti-reflection layer 320 . For example, the first antireflection layer 310 includes 20 to 30 parts by weight of copper, 40 to 50 parts by weight of indium, and 27 to 33 parts by weight of oxygen, and the second antireflection layer 320 includes 40 to 45 parts by weight of copper, 15 to 20 parts by weight of indium and 37 to 43 parts by weight of oxygen may be included.

The first and second anti-reflection layers 310 and 320 may have a sheet resistance of 0.1 to 0.2 Ω/□. When the sheet resistance of the first and second anti-reflection layers 310 and 320 exceeds 0.2 Ω/□, electrical conduction characteristics may be deteriorated, and thus sensitivity may deteriorate. If the sheet resistance is less than 0.1 Ω/□, the metal ratio may be high and the antireflection property may deteriorate.

The first and second anti-reflection layers 310 and 320 may be formed to a thickness of 10 to 60 nm.

The first and second anti-reflection layers 310 and 320 may be formed by a deposition process such as sputtering.

The first anti-reflection layer 310 may include, for example, 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen. In this case, the sputtering process can be performed by setting the target to 30% copper, 60% indium, and 10% oxygen, setting the process conditions to 10 sccm of oxygen partial pressure and 30 sccm of argon partial pressure, and setting the plasma power to 50 W. .

The second anti-reflection layer 320 may include, for example, 40 parts by weight of copper, 20 parts by weight of indium, and 40 parts by weight of oxygen. In this case, the sputtering process can be performed by setting the target to 50% copper, 30% indium, and 20% oxygen, setting the process conditions to 1 sccm of oxygen partial pressure and 50 sccm of argon partial pressure, and setting the plasma power to 150 W. .

3 to 6 are plan views and cross-sectional views showing specific embodiments of a digitizer according to the present invention. For example, FIG. 3 is a schematic plan view illustrating a first conductive coil included in a digitizer. 4 is a cross-sectional view taken in the thickness direction along line II' shown in FIG. 3 .

In FIGS. 3 to 6 , two directions that are parallel to the upper surface of the digitizer 100 or the base layer 105 and cross each other are defined as a first direction and a second direction. For example, the first direction and the second direction may perpendicularly cross each other.

The first direction may correspond to a width direction, a row direction, or an X-direction of the digitizer 100 . The second direction may correspond to a longitudinal direction, a column direction, or a Y-direction of the digitizer 100 .

3 to 6, the terms 'row direction' and 'column direction' do not refer to absolute directions, but should be understood as relative meanings designating different directions.

Referring to FIGS. 3 to 5 , the digitizer may include a lower conductive layer 230 and an upper conductive layer 250 formed on a base layer 210 . The lower conductive layer 230 and the upper conductive layer 250 may be separated into different layers with the interlayer insulating layer 240 therebetween.

The lower conductive layer 230 may include a first lower conductive line 232 (see FIG. 5 ) and a second lower conductive line 234 . The upper conductive layer 250 may include a first upper conductive line 252 and a second upper conductive line 254 (see FIG. 5 ).

The first lower conductive line 232 and the second lower conductive line 234 may extend in the second direction. The first upper conductive line 252 and the second upper conductive line 254 may extend in the first direction.

The second lower conductive line 234 and the second upper conductive line 254 may have smaller widths than the first lower conductive line 232 and the first upper conductive line 252 .

As shown in FIG. 3 , the digitizer may include a first conductive coil 50 . The first conductive coil 50 may be provided as a first direction (or row direction) conductive coil. In the first conductive coil 50, the second lower conductive line 234 of the lower conductive layer 230 and the first upper conductive line 252 of the upper conductive layer 250 are combined by first contacts 272. can be defined. The second lower conductive line 234 and the first upper conductive line 252 may be combined together to form an electromagnetic induction coil.

The first upper conductive line 252 and the second lower conductive line 234 together form the first conductive coil 50 and may be provided together as a sensing line for an input pen through electromagnetic induction.

For example, the first upper conductive line 252 and the second lower conductive line 234 may be electrically connected to each other through the first contact 272 . The plurality of first upper conductive lines 252 and the plurality of second lower conductive lines 234 are electrically connected to each other through the plurality of first contacts 272 to form one first conductive coil 50 A plurality of conductive loops may be included therein. For example, four row direction conductive loops may be included in one first conductive coil 50 .

In one embodiment, a first row-wise conductive loop 50a, a second row-wise conduction loop 50b, a third row-direction conduction loop 50c and The fourth row direction conductive loops 50d may be sequentially arranged.

In some embodiments, the row direction conductive loops may have different sizes or areas in the planar direction. For example, the size of the first rowwise conductive loop 50a, the second rowwise conductive loop 50b, the third rowwise conductive loop 50c, and the fourth rowwise conductive loop 50d are sequentially increased in size. can do.

The first contact 272 may pass through the interlayer insulating layer 240 through the first contact hole and be substantially integrally formed with the first upper conductive line 252 .

A first input line 282 and a first output line 284 may be connected to any one of the row direction conductive loops. The current input from the first input line 282 alternately circulates through the lower conductive layer 230 and the upper conductive layer 250 through the row direction conductive loops, and may be discharged through the first output line 284. . For example, the first input line 282 may be connected to the first row conductive loop 50a, and the first output line 284 may be connected to the fourth row conductive loop 50d.

In some embodiments, the first input line 282 and the first output line 284 may be included in the lower conductive layer 230 . In some embodiments, the lower conductive layer 230 may further include a first internal connection line 234a. For example, neighboring row direction conductive loops may be connected to each other through the first inner connection line 234a.

Referring to FIG. 5 , the digitizer may include a second conductive coil 70 . The second conductive coil 70 may be provided as a second direction (or column direction) conductive coil. In the second conductive coil 70 , the first lower conductive line 232 of the lower conductive layer 230 and the second upper conductive line 254 of the upper conductive layer 250 are combined by second contacts 274 . can be defined. The second upper conductive line 254 and the first lower conductive line 232 may be combined together to form an electromagnetic induction coil.

The first lower conductive line 232 and the second upper conductive line 254 together form the second conductive coil 70 and may be provided together as a sensing line for an input pen through electromagnetic induction.

For example, the first lower conductive line 232 and the second upper conductive line 254 may be electrically connected to each other through the second contact 274 . The plurality of first lower conductive lines 232 and the plurality of second upper conductive lines 254 are electrically connected to each other through the plurality of second contacts 274 to form one second conductive coil 70. A plurality of conductive loops may be included therein. For example, four column direction conductive loops may be included in one second conductive coil 70 .

In one embodiment, a first column direction conductive loop 70a, a second column direction conductive loop 70b, a third column direction conductive loop 70c and The fourth column direction conductive loops 70d may be sequentially arranged.

In some embodiments, the column direction conductive loops may have different sizes or areas in the planar direction. For example, the first column-wise conductive loop 70a, the second column-wise conductive loop 70b, the third column-wise conductive loop 70c, and the fourth column-wise conductive loop 70d sequentially increase in size. can do.

The second contact 274 may pass through the interlayer insulating layer 240 through the second contact hole and be substantially integrally formed with the first lower conductive line 232 .

A second input line 283 and a second output line 285 may be connected to any one of the column direction conductive loops. The current input from the second input line 283 alternately circulates through the lower conductive layer 230 and the upper conductive layer 250 through column-direction conductive loops, and may be discharged through the second output line 285. . For example, the second input line 283 may be connected to the first column direction conductive loop 70a, and the second discharge line 285 may be connected to the fourth column direction conductive loop 70d.

In some embodiments, the second input line 283 and the second output line 285 may be included in the lower conductive layer 230 .

In some embodiments, the upper conductive layer 250 may further include an external connection line 254a. For example, the second input line 283 and the second output line 285 may be connected to the column direction conductive loops through the third contact by the external connection line 254a.

In one embodiment, the external connection line 254a may be connected to two different second conductive coils 70 . For example, the output line 285 connected to one second conductive coil 70 may be connected to the input line 283 of another second conductive coil 70 through an external connection line 254a.

In some embodiments, the upper conductive layer 250 may further include a second internal connection line. For example, adjacent column direction conductive loops within the second conductive coil 70 may be connected to each other by a second internal connection line.

As described with reference to FIGS. 3 to 5 , since a conductive loop is formed by connecting the lower conductive layer 230 and the upper conductive layer 250 through the contacts 272 and 274, the number of loops of the conductive coil within the limited space can be reduced. efficiency and improve the electromagnetic induction efficiency.

3 and 4 show that four conductive loops are included in one conductive coil, the number of conductive loops in the conductive coil may be adjusted in consideration of the size and resolution of the image display device.

FIG. 5 is a schematic plan view illustrating a digitizer according to example embodiments. For convenience of explanation, a detailed structure/configuration of a conductive coil is omitted in FIG. 5 . A plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 210 .

The first conductive coil 50 may extend in a first direction or a row direction. The plurality of first conductive coils 50 may be arranged along the second direction or the column direction.

For example, n first conductive coils 50-1 to 50-n may be sequentially arranged in the second direction (n is a natural number).

The second conductive coil 70 may extend in the second direction or column direction. The plurality of second conductive coils 70 may be arranged along the first direction or row direction.

For example, m second conductive coils 70-1 to 70-m may be sequentially arranged along the first direction.

[Example]

A lower conductive layer having a thickness of 12 μm is formed on a polyimide substrate by copper plating with an adhesive as a medium. The lower conductive layer includes a 40 nm thick first antireflection layer made of a copper alloy composed of 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen. Further, after forming the interlayer insulating layer, the upper conductive layer is formed of copper to a thickness of 2 μm. The upper conductive layer includes a second antireflection layer made of copper alloy having a thickness of 0.04 μm and composed of 40 parts by weight of copper, 20 parts by weight of indium, and 40 parts by weight of oxygen.

[Comparative Example 1]

Except for the first antireflection layer and the second antireflection layer, it was formed under the same conditions as in the Example.

[Comparative Example 2]

The lower conductive layer and the upper conductive layer included an IZO film to a thickness of 0.04 μm instead of the first anti-reflection layer and the second anti-reflection layer, and the rest of the conditions were the same as those of Example.

Table 1 below shows the results of measuring the cotton quality of Examples and Comparative Examples 1 and 2. Here, 'Optimap PSD' was used as the surface roughness measurement equipment, and the measurement conditions were set at 0.1 to 30.3 mm for the incident light wavelength while the distance between the non-contact sample and the measurement equipment was 1 cm. In the measurement method, the light reflected from the light source incident on the sample was detected by the CCD sensor.

	Surface quality of the lower conductive layer	Surface quality of the upper conductive layer	average face
Example	0.5	1.3	0.9
Comparative Example 1	4.2	5.3	4.7
Comparative Example 2	3.3	3.6	3.4

In Table 1 above, in Comparative Example 1, no antireflection layer is formed on the lower conductive layer 230 (single Cu), and in Comparative Example 2, an IZO film is formed as an antireflection layer on the lower conductive layer 230 (Cu /IZO), and the embodiment forms a first anti-reflection layer 310 of copper alloy (including 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen) on the lower conductive layer 230, and the upper conductive layer 250 ) in the case of forming the second antireflection layer 320 of copper alloy (including 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen), and the values in Table 1 are surface quality measurement values for each. If the surface quality is high in the measured value, it indicates that light is reflected in various directions and incident to the pixel area in the panel, resulting in pixel defects (deterioration of panel quality). Looking at the surface quality measurement values in Table 1 above, / It can be seen that when an antireflection layer of copper alloy is formed on the upper conductive layer, the surface quality can be reduced by 100% or more, that is, improved compared to Comparative Examples 1 and 2.

7 shows a result of testing the voltage of a pixel electrode in an image display device having a digitizer according to the present invention. The measurement equipment uses 'HP4155A Semiconductor Parameter Analyzer' to measure the electrical characteristics of TFT according to illumination stress in the voltage range of -20 ~ +20 (V), that is, I (current) -V (voltage) characteristics. measured.

7 shows a case in which an antireflection layer is not formed on the lower conductive layer 230 (single Cu, Comparative Example 1) and a case where an IZO film is formed as an antireflection layer on the lower conductive layer 230 (Cu/IZO, Comparative Example 2). ), and a first antireflection layer 310 of a copper alloy (including 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen) is formed on the lower conductive layer 230, and the copper alloy ( In the case of forming the second antireflection layer 320 (including 25 parts by weight of copper, 45 parts by weight of indium, and 30 parts by weight of oxygen) (Cu/copper alloy, Example), the amount of change in the operating voltage (gate voltage) of the pixel electrode are showing

Referring to FIG. 7 , in the embodiment in which copper alloy is used as the antireflection layer, the TFT is turned on and operates normally in the region where the gate voltage is 0 V, whereas in Comparative Examples 1 and 2, the lower conductive layer 230 ) and the light reflected from the upper conductive layer 250 is incident on the TFT element, and the gate voltage changes in the negative direction of the X-axis up to the -20 V region, and it can be seen that the TFT operates unstablely. In this way, when the copper/indium alloy antireflection layer is formed on the digitizer conductive layer, voltage noise may be hardly induced in the pixel electrode of the display panel.

Table 2 below measures the resistance and reflectance of the loop made of a combination of the lower conductive layer and the upper conductive layer after 24 hours of reliability conditions at a temperature of 60 ° C and a relative humidity of 90% for Examples and Comparative Examples 1 and 2. is a result

	Example	Comparative Example 1	Comparative Example 2
Loop Resistance (Ω)	19.5	202	22.5
Loop reflectance (%)	8.4	57.3	48.5

As shown in Table 2 above, it can be confirmed that the example in which the antireflection layer of copper alloy is formed on the copper conductive layer has significantly improved loop resistance and loop reflectance compared to Comparative Example 1, and compared to Comparative Example 2 Although the loop resistance is similar, it can be seen that the loop reflectivity is remarkably improved.

In the above, the present invention has been described as examples, which are for illustrating the present invention. Those skilled in the art will be able to change or modify these embodiments in other forms. However, since the scope of the present invention is defined by the claims below, such variations or modifications may be construed as being included in the scope of the present invention.

[Description of code]

100: display panel

200: digitizer

210: base layer

220: adhesive layer

230: lower conductive layer

240: interlayer insulating layer

250: upper conductive layer

260: passivation layer

272,274: contact

300: antireflection layer

310: first anti-reflection layer

320: second anti-reflection layer

Claims (12)

1. base layer;

   a lower conductive layer disposed on an upper surface of the base layer;

   a first antireflection layer formed on the lower conductive layer and having a reflectance lower than that of the lower conductive layer;

   an interlayer insulating layer filling the lower conductive layer and the first antireflection layer;

   an upper conductive layer formed on the interlayer insulating layer;

   a second antireflection layer formed on the upper conductive layer and having a reflectance lower than that of the upper conductive layer; and

   A digitizer comprising a contact passing through the interlayer insulating layer and electrically connecting the lower conductive layer and the upper conductive layer.
2. The method according to claim 1, wherein the lower conductive layer

   A digitizer having a surface roughness greater than that of the upper conductive layer.
3. The method according to claim 1, wherein the first anti-reflection layer and the second anti-reflection layer

   A digitizer comprising a copper-oxygen containing composite material.
4. The method of claim 3,

   The copper-oxygen-containing composite material further contains an additional metal,

   The additional metal is at least one selected from the group consisting of indium (In), lanthanum (La), cesium (Ce), chromium (Cr), molybdenum (Mo), tungsten (W), magnesium (Mg), and calcium (Ca) Including, digitizer.
5. The method according to claim 3, wherein the first anti-reflection layer

   A digitizer having a lower copper content than the second antireflection layer.
6. The method of claim 3,

   The copper-oxygen-containing composite material includes indium (In) as an additional metal,

   The first anti-reflection layer has a higher indium (In) content than the second anti-reflection layer, the digitizer.
7. The method according to claim 1, wherein the lower conductive layer and the upper conductive layer

   A digitizer, which is a copper electrode.
8. The method of claim 1,

   The lower conductive layer includes a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the top surface of the base layer,

   The upper conductive layer includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction parallel to the upper surface of the base layer and perpendicular to the second direction, digitizer.
9. The method according to claim 8, wherein the contact,

   first contacts electrically connecting the first upper conductive lines and the second lower conductive lines and forming a first conductive coil; and

   and second contacts electrically connecting the first lower conductive lines and the second upper conductive lines and forming a second conductive coil.
10. The method of claim 9,

    The first conductive coil extends in the first direction, and a plurality of first conductive coils are arranged along the second direction;

    The second conductive coil extends in the second direction, and a plurality of second conductive coils are arranged along the first direction.
11. The method of claim 10,

    The first conductive coils each include a plurality of first conductive loops,

    The digitizer of claim 1 , wherein the second conductive coils each include a plurality of second conductive loops.
12. display panel; and

    An image display device comprising the digitizer according to any one of claims 1 to 11 disposed under the display panel.

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