WO2023157559A1 - Composition, couche de protection, stratifié et dispositif d'affichage - Google Patents

Composition, couche de protection, stratifié et dispositif d'affichage Download PDF

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WO2023157559A1
WO2023157559A1 PCT/JP2023/001665 JP2023001665W WO2023157559A1 WO 2023157559 A1 WO2023157559 A1 WO 2023157559A1 JP 2023001665 W JP2023001665 W JP 2023001665W WO 2023157559 A1 WO2023157559 A1 WO 2023157559A1
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group
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composition
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acid
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崇夫 土谷
真芳 ▲徳▼田
良永 裕佳子 西川
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住友化学株式会社
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters

Definitions

  • the present invention relates to a composition and a protective layer formed therefrom.
  • the present invention also relates to a laminate including the protective layer and a display device including the laminate.
  • Patent Document 1 describes a curable resin composition containing quantum dots and a wavelength conversion film formed using the curable resin composition.
  • Wavelength conversion layers containing luminescent inorganic semiconductor particles such as quantum dots are prone to deterioration in light emission characteristics due to heat.
  • One object of the present invention is a composition used for forming a protective layer disposed on a wavelength conversion layer, which can form a protective layer capable of suppressing a decrease in emission intensity due to heat of the wavelength conversion layer.
  • the object is to provide a composition.
  • Another object of the present invention is to provide a protective layer formed from the composition, a laminate containing the protective layer, and a display device containing the laminate.
  • the present invention provides the following.
  • a composition comprising a polyfunctional polymerizable compound having two or more ethylenically unsaturated bonds in the molecule or a polymer thereof.
  • the polyfunctional polymerizable compound is a polyfunctional (meth)acrylic compound.
  • the composition according to [1] or [2], wherein the polyfunctional polymerizable compound has an acidic functional group.
  • composition according to any one of [1] to [3], wherein the polyfunctional polymerizable compound has 3 or more ethylenically unsaturated bonds in the molecule [5] A protective layer formed from the composition according to any one of [1] to [4]. [6] a wavelength conversion layer containing luminescent inorganic semiconductor particles; a protective layer according to [5] disposed on the wavelength conversion layer; A laminate comprising: [7] A display device including the laminate according to [6].
  • a method for forming a protective layer disposed on a wavelength conversion layer containing luminescent inorganic semiconductor particles comprising: The protective layer is formed from a composition, A method for forming a protective layer, wherein the composition does not contain luminescent inorganic semiconductor particles and contains a polyfunctional polymerizable compound having two or more ethylenically unsaturated bonds in the molecule or a polymer thereof.
  • compositions for forming a protective layer disposed on a wavelength converting layer containing luminescent inorganic semiconductor particles Use of a composition, wherein the composition does not contain luminescent inorganic semiconductor particles and contains a polyfunctional polymerizable compound having two or more ethylenically unsaturated bonds in the molecule or a polymer thereof.
  • composition that is used to form a protective layer disposed on a wavelength conversion layer and that can form a protective layer capable of suppressing a decrease in emission intensity due to heat.
  • a protective layer formed from the composition, a laminate containing the protective layer, and a display device containing the laminate can be provided.
  • FIG. 4 is a schematic cross-sectional view showing another example of the laminate according to the present invention
  • FIG. 5 is a schematic cross-sectional view showing still another example of the laminate according to the present invention
  • FIG. 5 is a schematic cross-sectional view showing still another example of the laminate according to the present invention
  • 1 is a schematic cross-sectional view showing an example of a display device according to the present invention
  • the present invention provides a composition used for forming a protective layer disposed on a wavelength conversion layer, a protective layer (overcoat layer) formed from the composition, a laminate containing the protective layer, and the
  • the present invention relates to a display device including a laminate.
  • the invention also relates to a method of forming a protective layer using the composition and the use of the composition to form a protective layer.
  • Composition I used to form the wavelength conversion layer is a layer that absorbs the primary light from the primary light source and emits light with a wavelength different from that of the primary light. This is the layer that converts the wavelength of light.
  • the wavelength conversion layer is preferably a layer that emits green or red light.
  • the wavelength conversion layer contains luminescent inorganic semiconductor particles (A) (hereinafter also simply referred to as “semiconductor particles (A)”) that absorb the primary light and emit light with a wavelength different from that of the primary light. It can be formed from a layer-forming composition (hereinafter also referred to as “composition I”). Composition I can contain components other than the semiconductor particles (A). Composition I may be a curable composition that is cured by light irradiation or heat. Composition I is described in more detail below.
  • Luminescent inorganic semiconductor particles (A) The semiconductor particles (A) contained in the composition I emit light of a wavelength different from that of the primary light, and preferably convert the wavelength of blue light, which is the primary light, into a wavelength of light of a different color. .
  • the semiconductor particles (A) preferably emit green or red light, and more preferably absorb blue light and emit green or red light.
  • blue refers to light in general that is visually recognized as blue (in general, light having intensity in the blue wavelength range, for example, 380 nm to 495 nm), and is not limited to light of a single wavelength.
  • green refers to all light that is visually recognized as green (all light having an intensity in the green wavelength range, eg, 495 nm to 585 nm), and is not limited to light of a single wavelength.
  • red refers to all light visible as red (all light having intensity in the red wavelength range, eg, 585 nm to 780 nm), and is not limited to light of a single wavelength.
  • yellow refers to light in general that is visually recognized as yellow (light in general that has an intensity in the yellow wavelength range, eg, 560 nm to 610 nm), and is not limited to light of a single wavelength.
  • the emission spectrum of the semiconductor particles (A) emitting green light preferably includes a peak having a maximum value in a wavelength range of 500 nm or more and 560 nm or less, more preferably a peak having a maximum value in a wavelength range of 520 nm or more and 545 nm or less. and more preferably a peak having a maximum value in a wavelength range of 525 nm or more and 535 nm or less.
  • the emission intensity of green light from the display device can be further improved.
  • the peak has a full width at half maximum of preferably 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, particularly preferably 15 nm to 45 nm. As a result, the emission intensity of green light from the display device can be further improved.
  • the emission spectrum of the semiconductor particles (A) emitting red light preferably includes a peak having a maximum value in a wavelength range of 610 nm or more and 750 nm or less, more preferably a peak having a maximum value in a wavelength range of 620 nm or more and 650 nm or less. and more preferably a peak having a maximum value in a wavelength range of 625 nm or more and 645 nm or less.
  • the emission intensity of the red light of the display device can be further improved.
  • the peak has a full width at half maximum of preferably 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, particularly preferably 15 nm to 45 nm. Thereby, the emission intensity of the red light of the display device can be further improved.
  • the emission spectrum of the semiconductor particles (A) is measured according to the method described in the Examples section below.
  • Examples of the semiconductor particles (A) include particles composed of quantum dots and compounds having a perovskite crystal structure (hereinafter also referred to as "perovskite compounds”), preferably quantum dots.
  • Quantum dots are light-emitting semiconductor fine particles having a particle diameter of 1 nm or more and 100 nm or less, and are fine particles that emit light by absorbing ultraviolet light or visible light (eg, blue light) using the bandgap of semiconductors.
  • Quantum dots include, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnS e, CdZnTe , CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, CdHgSeS, C
  • quantum dots When quantum dots contain S or Se, quantum dots surface-modified with metal oxides or organic substances may be used. The use of surface-modified quantum dots can prevent the abstraction of S and Se by reactive components contained or to be contained in composition I. Moreover, the quantum dot may combine the above compounds to form a core-shell structure. Such combinations include fine particles having a core of CdSe and a shell of ZnS, and fine particles having a core of InP and a shell of ZnSeS.
  • quantum dots Since the energy state of quantum dots depends on their size, it is possible to freely select the emission wavelength by changing the particle diameter. In addition, since the spectrum width of light emitted from the quantum dots is narrow, it is advantageous for widening the color gamut of the display device. Furthermore, since quantum dots are highly responsive, they are also advantageous in terms of primary light utilization efficiency.
  • a perovskite compound is a compound having A, B and X as components and having a perovskite crystal structure.
  • A is a component located at each vertex of a hexahedron centered on B in the perovskite crystal structure, and is a monovalent cation.
  • X represents a component located at each vertex of an octahedron centered on B in the perovskite crystal structure, and is at least one type of ion selected from the group consisting of halide ions and thiocyanate ions.
  • B is a metal ion, which is a component located at the center of the hexahedron with A at its vertex and the octahedron with X at its vertex in the perovskite crystal structure.
  • the perovskite compound containing A, B and X as components is not particularly limited, and may be a compound having any of a three-dimensional structure, a two-dimensional structure and a pseudo-two-dimensional structure.
  • perovskite compounds are represented by ABX (3+ ⁇ ) .
  • perovskite compounds are represented by A 2 BX (4+ ⁇ ) .
  • ⁇ is a number that can be appropriately changed according to the charge balance of B, and is from -0.7 to 0.7.
  • Preferred specific examples of perovskite compounds having a two-dimensional perovskite-type crystal structure represented by A 2 BX (4+ ⁇ ) include: ( C4H9NH3 ) 2PbBr4 , ( C4H9NH3 ) 2PbCl4 , ( C4H9NH3 ) 2PbI4 , ( C7H15NH3 ) 2PbBr4 , ( C 7H15NH3 ) 2PbCl4 , ( C7H15NH3 ) 2PbI4 , ( C4H9NH3 ) 2Pb (1-a) LiaBr ( 4 + ⁇ ) (0 ⁇ a ⁇ 0.
  • composition I may contain two or more types of semiconductor particles (A).
  • composition I may contain only one type of semiconductor particles (A) that absorb primary light and emit green light, or may contain two or more types in combination.
  • Composition I may contain only one type of semiconductor particles (A) that absorb primary light and emit red light, or may contain two or more types in combination.
  • the content of the semiconductor particles (A) in composition I is, for example, 1% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, relative to the total solid content of composition I. It is preferably 15% by mass or more and 50% by mass or less, more preferably 20% by mass or more and 50% by mass or less, and still more preferably 20% by mass or more and 40% by mass or less.
  • the content of the semiconductor particles (A) means the total content of the two or more types of semiconductor particles (A).
  • the total content Or means the total content.
  • Composition II which will be described later.
  • the total solid content of the composition means the sum of the components contained in the composition excluding the solvent (J).
  • the content in the solid content of the composition can be measured by known analytical means such as liquid chromatography or gas chromatography.
  • the content of each component in the solid content of the composition may be calculated from the formulation when the composition is prepared.
  • composition I may further contain an organic ligand (G), and the semiconductor particles (A) may be present in the composition I in a state coordinated with the organic ligand (G).
  • the organic ligand (G) is, for example, an organic compound having a polar group capable of coordinating the semiconductor particles (A).
  • the organic ligand (G) can be coordinated, for example, to the surfaces of the semiconductor particles (A).
  • Composition I can contain one or more organic ligands (G).
  • At least part of the molecules of the organic ligand (G) in the composition I are preferably coordinated to the semiconductor particles (A), and all or substantially all of the molecules are coordinated to the semiconductor particles (A).
  • You may be Including the organic ligand (G) coordinated to the semiconductor particles (A) is advantageous from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the emission intensity of the wavelength conversion layer. obtain.
  • the polar group of the organic ligand (G) is, for example, at least one group selected from the group consisting of a thiol group (--SH), a carboxy group (--COOH) and an amino group ( --NH.sub.2 ). .
  • a polar group selected from the group can be advantageous in enhancing coordination to the semiconductor particles (A).
  • a high coordinating property can contribute to improving the stability and dispersibility of the semiconductor particles (A) in the composition I, improving the emission intensity of the wavelength conversion layer, and the like.
  • the polar group is more preferably at least one group selected from the group consisting of thiol groups and carboxy groups.
  • the organic ligand (G) may have one or more polar groups.
  • the organic ligand (G) is, for example, the following formula (x): X A -R X (x) It can be an organic compound represented by In the formula, X A is the above polar group, and R X is a monovalent hydrocarbon group optionally containing a heteroatom (N, O, S, halogen atom, etc.).
  • the hydrocarbon group may have one or more unsaturated bonds such as carbon-carbon double bonds.
  • the hydrocarbon group may have a linear, branched or cyclic structure.
  • the number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 40 or less, and may be 1 or more and 30 or less.
  • the group R X may contain a polar group.
  • the polar group the above description of the polar group XA is cited.
  • organic ligands having a carboxy group as the polar group X A include formic acid, acetic acid, propionic acid, and saturated or unsaturated fatty acids.
  • saturated or unsaturated fatty acids include butyric acid, pentanoic acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, behenic acid, and lignoserine.
  • saturated fatty acids such as acids; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, icosenoic acid, erucic acid, nervonic acid; linoleic acid, ⁇ -linolenic acid, ⁇ -linolenic acid, stearic acid, dihomo- It contains polyunsaturated fatty acids such as ⁇ -linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, and adrenic acid (docosatetraenoic acid).
  • a specific example of the organic ligand having a thiol group or an amino group as the polar group XA is the above-exemplified organic ligand having a carboxy group as the polar group XA , in which the carboxy group is replaced with a thiol group or an amino group. Contains organic ligands.
  • examples of the organic ligand represented by the above formula (x) include compound (G-1) and compound (G-2).
  • Compound (G-1) is a compound having a first functional group and a second functional group.
  • the first functional group is a carboxy group (--COOH) and the second functional group is a carboxy group or a thiol group (--SH). Since the compound (G-1) has a carboxy group and/or a thiol group, it can serve as a ligand that coordinates to the semiconductor particles (A).
  • Composition I may contain only one type of compound (G-1), or may contain two or more types.
  • Compound (G-1) is a compound represented by the following formula (G-1a).
  • Compound (G-1) may be an acid anhydride of the compound represented by formula (G-1a).
  • RB represents a divalent hydrocarbon group. When multiple RBs are present, they may be the same or different.
  • the hydrocarbon group may have one or more substituents. When there are multiple substituents, they may be the same or different, and they may be bonded together to form a ring with the atoms to which each is attached.
  • -CH 2 - contained in the above hydrocarbon group may be replaced with at least one of -O-, -S-, -SO 2 -, -CO- and -NH-.
  • p represents an integer from 1 to 10; ]
  • Examples of the divalent hydrocarbon group represented by RB include chain hydrocarbon groups, alicyclic hydrocarbon groups and aromatic hydrocarbon groups.
  • chain hydrocarbon groups include linear or branched alkanediyl groups, which usually have 1 to 50 carbon atoms, preferably 1 to 20 carbon atoms, and more preferably 1 to 10 carbon atoms.
  • the alicyclic hydrocarbon group includes, for example, a monocyclic or polycyclic cycloalkanediyl group, which usually has 3 to 50 carbon atoms, preferably 3 to 20 carbon atoms, more preferably 3 to 10 carbon atoms. is.
  • the aromatic hydrocarbon group includes, for example, a monocyclic or polycyclic arenediyl group, which usually has 6 to 20 carbon atoms.
  • Examples of the substituent that the hydrocarbon group may have include an alkyl group having 1 to 50 carbon atoms, a cycloalkyl group having 3 to 50 carbon atoms, an aryl group having 6 to 20 carbon atoms, a carboxy group, an amino groups, halogen atoms, and the like.
  • the substituent which the hydrocarbon group may have is preferably a carboxy group, an amino group or a halogen atom.
  • —CH 2 — contained in the hydrocarbon group is replaced with at least one of —O—, —CO— and —NH—
  • —CH 2 — is preferably replaced with —CO— and —NH—. It is at least one, more preferably -NH-.
  • p is preferably 1 or 2;
  • Examples of the compound represented by formula (G-1a) include compounds represented by the following formulas (1-1) to (1-9).
  • Specific examples of the compound represented by formula (G-1a) are represented by chemical names such as mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutanoic acid, 4-mercaptobutanoic acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-mercapto 3-methoxybutyl propionate, 3-mercapto-2-methylpropionic acid and the like.
  • 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.
  • Another example of the compound (G-1) is a polyvalent carboxylic acid compound, preferably a compound represented by the above formula (G-1a), wherein —SH in formula (G-1a) is a carboxy group ( —COOH) is replaced with a compound (G-1b).
  • Compound (G-1b) includes, for example, the following compounds. Succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, dodecafluorosuberic acid, 3-ethyl- 3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenedioic acid, sebacic acid, hexadecafluorosebacic acid, acetylenedicarboxylic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo [2.2 .2] octane-1,4-dicarboxylic acid, cis-4-cycl
  • the molecular weight of the compound (G-1) is preferably 3000 or less, more preferably 2500 or less, and even more preferably 2000 or less, even more preferably 1000 or less, particularly preferably 800 or less, most preferably 500 or less.
  • the molecular weight of compound (G-1) is usually 100 or more.
  • the above molecular weight may be a number average molecular weight or a weight average molecular weight.
  • the number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC), respectively.
  • the content ratio of the compound (G-1) to the semiconductor particles (A) in the composition I is preferably 0.001 or more and 1 or less, in terms of mass ratio. It is more preferably 0.01 or more and 0.5 or less, and still more preferably 0.02 or more and 0.45 or less. When the content ratio is in this range, it can be advantageous from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the emission intensity of the wavelength conversion layer.
  • the content of the compound (G-1) in the composition I affects the stability and dispersibility of the semiconductor particles (A), and the emission intensity of the wavelength conversion layer. From the viewpoint of improving the % by mass or more and 10% by mass or less, more preferably 0.5% by mass or more and 10% by mass or less, and particularly preferably 0.5% by mass or more and 8% by mass or less.
  • the compound (G-2) is a compound different from the compound (G-1), containing a polyalkylene glycol structure and having a polar group at the molecular end.
  • the molecular terminal is preferably the terminal of the longest carbon chain (a carbon atom in the carbon chain may be replaced with another atom such as an oxygen atom) in the compound (G-2).
  • Composition I may contain one type of compound (G-2), or may contain two or more types.
  • Composition I may contain compound (G-1) or compound (G-2), or may contain compound (G-1) and compound (G-2).
  • the compound containing a polyalkylene glycol structure and having the first functional group and the second functional group belongs to the compound (G-1).
  • the polyalkylene glycol structure is the following formula:
  • R 1 C is an alkylene group such as an ethylene group and a propylene group.
  • compound (G-2) examples include polyalkylene glycol-based compounds represented by the following formula (G-2a).
  • X is a polar group
  • Y is a monovalent group
  • Z C is a divalent or trivalent group.
  • n is an integer of 2 or more.
  • the polar group X is preferably at least one group selected from the group consisting of a thiol group (--SH), a carboxy group (--COOH) and an amino group ( --NH.sub.2 ).
  • a polar group selected from the group can be advantageous in enhancing coordination to the semiconductor particles (A).
  • the polar group X is at least one group selected from the group consisting of thiol groups and carboxy groups. is more preferable.
  • the group Y is a monovalent group.
  • the group Y is not particularly limited, and may be a monovalent hydrocarbon group optionally having a substituent (N, O, S, halogen atom, etc.).
  • the number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 12 or less.
  • the hydrocarbon group may have an unsaturated bond.
  • Examples of the group Y include an alkyl group having 1 to 12 carbon atoms having a linear, branched or cyclic structure; an alkoxy group having 1 to 12 carbon atoms having a linear, branched or cyclic structure, and the like. mentioned.
  • the number of carbon atoms in the alkyl group and alkoxy group is preferably 1 or more and 8 or less, more preferably 1 or more and 6 or less, and still more preferably 1 or more and 4 or less.
  • the group Y is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms, and is preferably a linear alkoxy group having 1 to 4 carbon atoms. more preferred.
  • Group Y may contain a polar group.
  • the polar group includes at least one group selected from the group consisting of a thiol group (--SH), a carboxy group (--COOH) and an amino group ( --NH.sub.2 ).
  • the compound containing the polyalkylene glycol structure and having the first functional group and the second functional group belongs to the compound (G-1).
  • the polar group is preferably arranged at the end of the group Y.
  • the group Z C is a divalent or trivalent group.
  • the group Z C is not particularly limited and includes divalent or trivalent hydrocarbon groups optionally containing heteroatoms (N, O, S, halogen atoms, etc.).
  • the carbon number of the hydrocarbon group is, for example, 1 or more and 24 or less.
  • the hydrocarbon group may have an unsaturated bond.
  • the divalent group Z C is an alkylene group having 1 to 24 carbon atoms having a linear, branched or cyclic structure; and 1 or more carbon atoms having a linear, branched or cyclic structure.
  • Examples include alkenylene groups of 24 or less.
  • the number of carbon atoms in the alkyl group and alkenylene group is preferably 1 or more and 12 or less, more preferably 1 or more and 8 or less, and still more preferably 1 or more and 4 or less.
  • Examples of the trivalent group Z C include groups obtained by removing one hydrogen atom from the above divalent group Z C .
  • the group Z C may have a branched structure.
  • the group Z C having a branched structure has a polyalkylene glycol structure represented by the above formula (G-2a) in a branched chain different from the branched chain containing the polyalkylene glycol structure represented by the above formula (G-2a). may have another polyalkylene glycol structure.
  • the group Z C is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and is a linear alkylene group having 1 to 4 carbon atoms. is more preferred.
  • R C is an alkylene group, preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and a linear alkylene group having 1 to 4 carbon atoms. is more preferable.
  • n in formula (G-2a) is an integer of 2 or more, preferably 2 or more and 540 or less, more preferably 2 or more and 120 or less, and still more preferably 2 or more and 60 or less.
  • the molecular weight of the compound (G-2) can be, for example, about 150 or more and 10,000 or less. or less, and more preferably 150 or more and 4000 or less.
  • the molecular weight may be a number average molecular weight or a weight average molecular weight.
  • the number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight in terms of standard polystyrene measured by GPC, respectively.
  • the content ratio of the compound (G-2) to the semiconductor particles (A) in the composition I is preferably 0.001 or more and 2 or less, in terms of mass ratio. It is more preferably 0.01 or more and 1.5 or less, still more preferably 0.1 or more and 1 or less. When the content ratio is in this range, it can be advantageous from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the emission intensity of the wavelength conversion layer.
  • the content of the compound (G-2) in the composition I affects the stability and dispersibility of the semiconductor particles (A), and the emission intensity of the wavelength conversion layer. From the viewpoint of improvement, it is preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.1% by mass or more and 20% by mass or less, and still more preferably 1% by mass, relative to the total solid content of composition I. 15% by mass or less, more preferably 2% by mass or more and 12% by mass or less.
  • the content ratio of the organic ligand (G) to the semiconductor particles (A) in the composition I is preferably 0.001 or more in mass ratio. 1 or less, more preferably 0.01 or more and 0.8 or less, and still more preferably 0.02 or more and 0.5 or less.
  • the content of the organic ligand (G) referred to here is the total content of all organic ligands contained in the composition I.
  • the total content of the semiconductor particles (A) and the organic ligand (G) in composition I is determined from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the emission intensity of the wavelength conversion layer. It is preferably 10% by mass or more and 75% by mass or less, more preferably 12% by mass or more and 70% by mass or less, and still more preferably 15% by mass or more and 65% by mass or less, relative to the total amount of solid content of substance I.
  • Composition I can further comprise a light scattering agent (B).
  • a wavelength conversion layer formed from the composition can exhibit light scattering properties.
  • Composition I may contain two or more light scattering agents (B). From the viewpoint of improving the emission intensity of the wavelength conversion layer, it is preferable that the composition I further contains a light scattering agent (B).
  • Examples of the light scattering agent (B) include inorganic particles such as metal or metal oxide particles and glass particles.
  • metal oxides include TiO 2 , SiO 2 , BaTiO 3 , ZnO, etc. TiO 2 particles are preferable because they efficiently scatter light.
  • the particle size of the light scattering agent (B) is, for example, about 0.03 ⁇ m or more and 20 ⁇ m or less, preferably 0.05 ⁇ m or more and 1 ⁇ m or less, more preferably 0.05 ⁇ m or more and 0.5 ⁇ m or less.
  • a dispersing agent may be used in which the light scattering agent is previously dispersed in part or all of the solvent (J).
  • a commercial item can be used as a dispersing agent. Examples of commercially available products include: BYK-Chemie Japan DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, 2001, 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250,; BYK-P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; SOLSPERSE-3
  • the content of the light scattering agent (B) in composition I is, for example, 0.001% by mass or more and 50% by mass or less with respect to the total solid content of composition I, and the light scattering ability and emission intensity of the wavelength conversion layer From the viewpoint of improving the % by mass or less.
  • composition I can further comprise a resin (C). From the viewpoint of forming a wavelength conversion layer from composition I, composition I preferably contains resin (C). Resin (C) may contain one or more resins. Examples of the resin (C) include the following resins [K1] to [K4].
  • Resin [K1] at least one (a) selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides (hereinafter also referred to as "(a)"), and copolymerizable with (a) A copolymer with a monomer (c) (but different from (a)) (hereinafter also referred to as “(c)”); Resin [K2]; a monomer (b) having a cyclic ether structure having 2 to 4 carbon atoms and an ethylenically unsaturated bond in a copolymer of (a) and (c) (hereinafter referred to as "(b)” Also called.) reacted resin; Resin [K3]; a resin obtained by reacting (a) with a copolymer of (b) and (c); Resin [K4]: A resin obtained by reacting a copolymer of (b) and (c) with (a) and further with a carboxylic anhydride
  • (a) includes, for example, (meth)acrylic acid, crotonic acid, and unsaturated monocarboxylic acids such as o-, m-, and p-vinylbenzoic acid; Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinyl phthalic acid, 4-vinyl phthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyl Unsaturated dicarboxylic acids such as tetrahydrophthalic acid and 1,4-cyclohexenedicarboxylic acid; methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-eth
  • (meth)acrylic acid as used herein means acrylic acid and/or methacrylic acid.
  • (meth)acryloyl means acrylic acid and/or methacrylic acid.
  • (meth)acrylate means acrylic acid and/or methacrylic acid.
  • (b) is, for example, a monomer having a cyclic ether structure having 2 to 4 carbon atoms (eg, at least one selected from the group consisting of an oxirane ring, an oxetane ring and a tetrahydrofuran ring) and an ethylenically unsaturated bond; be.
  • (b) is preferably a monomer having a cyclic ether structure with 2 to 4 carbon atoms and a (meth)acryloyloxy group.
  • the carbon number of the cyclic ether structure means the carbon number of the condensed ring.
  • Examples of (b) include glycidyl (meth)acrylate, ⁇ -methylglycidyl (meth)acrylate, ⁇ -ethylglycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p -vinylbenzyl glycidyl ether, ⁇ -methyl-o-vinylbenzyl glycidyl ether, ⁇ -methyl-m-vinylbenzyl glycidyl ether, ⁇ -methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene , 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxy
  • (c) includes, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth) Acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 2,6 ]decane-8-yl (meth)acrylate (in the technical field, it is commonly referred to as "dicyclopentanyl (meth)acrylate”.
  • tricyclodecyl (meth)acrylate tricyclo[5.2.1.0 2,6 ]decen-8-yl (meth)acrylate (in the art, it is commonly called “dicyclopentenyl (meth)acrylate”.
  • dicyclopentanyloxyethyl (meth)acrylate isobornyl (meth)acrylate, adamantyl (meth)acrylate, allyl (meth)acrylate, propargyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, benzyl (meth)acrylic acid ester such as (meth)acrylate; Hydroxy group-containing (meth)acrylic acid esters such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, and diethyl itaconate; bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5- Hydroxybicyclo[2.2.1]hept-2-ene, 5-
  • the carbon number of the cyclic ether structure means the carbon number of the condensed ring.
  • (c) includes styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo [2. 2.1]hept-2-ene and the like are preferred.
  • the ratio of structural units derived from each of the total structural units constituting the resin [K1] is Structural units derived from (a); 2 mol% or more and 60 mol% or less Structural units derived from (c); preferably 40 mol% or more and 98 mol% or less, Structural units derived from (a): 10 mol % or more and 50 mol % or less Structural units derived from (c): More preferably 50 mol % or more and 90 mol % or less.
  • the ratio of the constituent units of the resin [K1] is within the above range, the storage stability of the composition I and the solvent resistance of the wavelength conversion layer tend to be excellent.
  • the resin [K1] is, for example, the method described in the document "Experimental Methods for Polymer Synthesis” (written by Takayuki Otsu, Published by Kagaku Dojin, 1st Edition, 1st Edition, March 1, 1972) and the document It can be manufactured with reference to the cited document described in .
  • a polymerization initiator e.g., a polymerization initiator, a solvent, and the like are placed in a reaction vessel, and, for example, by replacing oxygen with nitrogen, a deoxygenated atmosphere is created, and while stirring, A method of heating and keeping warm can be mentioned.
  • the polymerization initiator, solvent, and the like to be used are not particularly limited, and those commonly used in the field can be used.
  • polymerization initiators include azo compounds (2,2′-azobisisobutyronitrile, 2,2′-azobis(2,4-dimethylvaleronitrile), etc.) and organic peroxides (benzoyl peroxide, etc.).
  • the solvent any solvent can be used as long as it dissolves each monomer.
  • the obtained copolymer may be used as a solution after the reaction as it is, may be used as a concentrated or diluted solution, or may be taken out as a solid (powder) by a method such as reprecipitation. may be used. If the solvent (J) described later is used as a solvent for polymerization, the solution after the reaction can be used as it is for the preparation of composition I, so that the production process of composition I can be simplified.
  • Resin [K2] is a copolymer of (a) and (c), and the cyclic ether having 2 to 4 carbon atoms of (b) is added to the carboxylic acid and/or carboxylic anhydride of (a). It can be manufactured by First, a copolymer of (a) and (c) is produced in the same manner as the method for producing resin [K1]. In this case, the ratio of structural units derived from each is preferably the same as the ratio described for resin [K1].
  • part of the carboxylic acid and/or carboxylic acid anhydride derived from (a) in the copolymer is reacted with the cyclic ether having 2 to 4 carbon atoms of (b).
  • the atmosphere in the flask was replaced from nitrogen to air, and (b) a reaction catalyst (e.g., organic phosphorus compound, metal complex, amine compound, etc.) and a polymerization inhibitor (e.g., hydroquinone, etc.), for example, at 60° C. or higher and 130° C. or lower for 1 hour or longer and 10 hours or shorter, to produce a resin [K2]. be able to.
  • a reaction catalyst e.g., organic phosphorus compound, metal complex, amine compound, etc.
  • a polymerization inhibitor e.g., hydroquinone, etc.
  • the amount of (b) used is preferably 5 mol or more and 80 mol or less, more preferably 10 mol or more and 75 mol or less per 100 mol of (a). Within this range, the storage stability of composition I and the balance of solvent resistance, heat resistance and mechanical strength of the wavelength conversion layer tend to be improved.
  • the amine compound as the reaction catalyst for example, an aliphatic tertiary amine compound or an aliphatic quaternary ammonium salt compound can be used. Specific examples thereof include tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, tetrabutylammonium chloride and the like.
  • the reaction catalyst is preferably an organophosphorus compound.
  • the amount of the reaction catalyst used is preferably 0.001 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total amount of (a), (b) and (c).
  • the amount of the polymerization inhibitor used is preferably 0.001 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total amount of (a), (b) and (c).
  • Reaction conditions such as the preparation method, reaction temperature and time can be appropriately adjusted in consideration of the production equipment and the amount of heat generated by polymerization.
  • the charging method and the reaction temperature can be appropriately adjusted in consideration of the production equipment, the amount of heat generated by the polymerization, and the like.
  • a copolymer of (b) and (c) is obtained in the same manner as in the method for producing resin [K1] described above.
  • the obtained copolymer may be used as a solution after the reaction as it is, may be used as a concentrated or diluted solution, or may be converted into a solid (powder) by a method such as reprecipitation. You may use what was taken out as.
  • Resin [K3] is prepared by adding a carboxylic acid or It can be obtained by reacting a carboxylic acid anhydride.
  • the amount of (a) to be reacted with the copolymer is preferably 5 mol or more and 80 mol or less per 100 mol of (b).
  • Resin [K4] is a resin obtained by reacting resin [K3] with a carboxylic acid anhydride.
  • the hydroxy group generated by the reaction of the cyclic ether with the carboxylic acid or carboxylic anhydride is reacted with the carboxylic anhydride.
  • carboxylic anhydrides include maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic anhydride, 4-vinyl phthalic anhydride, and 3,4,5,6-tetrahydrophthalic anhydride.
  • the amount of carboxylic acid anhydride to be used is preferably 0.5 to 1 mol per 1 mol of (a).
  • resin [K1], resin [K2], resin [K3] and resin [K4] include benzyl (meth)acrylate/(meth)acrylic acid copolymer, styrene/(meth)acrylic acid copolymer, etc.
  • Resin (C) preferably contains resin [K1].
  • the resin (C) include resins described in JP-A-2018-123274.
  • the resin has a double bond in its side chain, and has a structural unit ( ⁇ ) represented by the following formula (I) and a structural unit ( ⁇ ) represented by the following formula (II) in the main chain. and further containing an acid group (hereinafter also referred to as "resin (Ca)").
  • the acid group is, for example, a resin (Ca) that is introduced into the resin by including a structural unit ( ⁇ ) derived from an acid group-containing monomer (for example, (meth)acrylic acid, etc.). can.
  • the resin (Ca) preferably contains structural units ( ⁇ ), ( ⁇ ) and ( ⁇ ) in its main chain skeleton.
  • R A and R B are the same or different and represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms.
  • n represents the average number of repeating units of the structural unit represented by formula (I), and is a number of 1 or more.
  • R 2 C is the same or different and represents a hydrogen atom or a methyl group.
  • RD which may be the same or different, represents a linear or branched hydrocarbon group having 4 to 20 carbon atoms.
  • m represents the average number of repeating units of the structural unit represented by formula (II), and is a number of 1 or more.
  • the content of the structural unit ( ⁇ ) is, from the viewpoint of the heat resistance and storage stability of the resin (Ca), the total amount of all monomer units that provide the main chain skeleton of the resin (Ca) is 100 mass. %, for example, 0.5% by mass or more and 50% by mass or less, preferably 1% by mass or more and 40% by mass or less, more preferably 5% by mass or more and 30% by mass or less.
  • n in formula (I) represents the average number of repeating units of the structural unit ( ⁇ ) in the resin (Ca), and n can be set so that the content of the structural unit ( ⁇ ) is within the above range. can.
  • the content ratio of the structural unit ( ⁇ ) is, for example, 10% by mass or more and 90 % by mass or less, preferably 20% by mass or more and 80% by mass or less, more preferably 30% by mass or more and 75% by mass or less.
  • m in the formula (II) represents the average number of repeating units of the structural unit ( ⁇ ) in the resin (Ca), and is set so that the content of the structural unit ( ⁇ ) is within the range described above. can be done.
  • the content of the structural unit ( ⁇ ) is For example, it is 0.5% by mass or more and 50% by mass or less, preferably 2% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 45% by mass or less.
  • the resin (C) can contain one or more selected from the group consisting of the above resin [K1], resin [K2], resin [K3], resin [K4] and resin (Ca).
  • the resin (C) has a standard polystyrene equivalent weight average molecular weight Mw measured by GPC of, for example, 1000 or more and 20000 or less, and from the viewpoint of the developability of the composition I and the emission intensity of the wavelength conversion layer, it is preferably 2000 or more. It is 15000 or less, more preferably 3000 or more and 13000 or less.
  • the Mw of the resin (C) can be adjusted by appropriately combining reaction conditions such as selection of raw materials to be used, charging method, reaction temperature and time.
  • the Mw of the resin (C) can be measured according to the measuring method described in the Examples section below.
  • the Mw of the resin (C) contained in composition I may be measured using GPC.
  • the molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] of the resin (C) measured by GPC is, for example, 1.0 or more and 6.0 or less, and improves the emission intensity of the wavelength conversion layer. From the viewpoint, it is preferably 1.2 or more and 4.0 or less.
  • the acid value of the resin (C) is preferably 90 mgKOH/g or more and 150 mgKOH/g or less, more preferably 95 mgKOH/g or more and 140 mgKOH/g or less. More preferably, it is 100 mgKOH/g or more and 130 mgKOH/g or less.
  • the acid value of resin (C) can be adjusted by the content of the monomer component having an acid group (for example, (a) above).
  • the acid value of resin (C) is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin (C), and is determined, for example, by titration using an aqueous potassium hydroxide solution. be able to. Specifically, it can be measured according to the measuring method described in the section of Examples below.
  • the acid value may be determined by, for example, structural analysis.
  • the resin (C) preferably contains a resin having a double bond equivalent of 300 g/eq or more and 2000 g/eq or less, and is 500 g/eq or more and 1500 g/eq or less. More preferably, it contains a resin. Resins having a double bond equivalent weight of 300 g/eq or more and 2000 g/eq or less include (meth)acrylic resins.
  • the resin (C) preferably consists of a (meth)acrylic resin.
  • the content of the resin (C) in the composition I is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 70% by mass or less, relative to the total solid content of the composition I. It is more preferably 13% by mass or more and 60% by mass or less, and still more preferably 17% by mass or more and 55% by mass or less.
  • the content of the resin (C) is within the above range, the semiconductor particles (A) are easily dispersed, and the emission intensity of the wavelength conversion layer tends to be high.
  • the mass ratio (solid content ratio) of the resin (C) to the polymerizable compound (D) described later is, for example, 1 or more, and from the viewpoint of the developability of the composition I and the emission intensity of the wavelength conversion layer , preferably 1.5 or more, more preferably 2 or more.
  • Polymerizable compound (D) can further comprise a polymerizable compound (D).
  • the polymerizable compound (D) is a compound that can be polymerized by an active radical generated from the polymerization initiator (E) described below, an acid, or the like.
  • Examples of the polymerizable compound (D) include photopolymerizable compounds such as compounds having an ethylenically unsaturated bond, such as (meth)acrylate compounds.
  • Another example of the polymerizable compound (D) is a thermally polymerizable compound.
  • Composition I may contain two or more polymerizable compounds (D).
  • the polymerizable compound (D) is preferably a photopolymerizable compound having 3 or more ethylenically unsaturated bonds in the molecule.
  • the weight average molecular weight of the polymerizable compound (D) is preferably 150 or more and 2900 or less, more preferably 250 or more and 1500 or less.
  • a compound (Da) having 3 or more ethylenically unsaturated bonds in the molecule and having an acidic functional group A compound (Db) having 3 or more ethylenically unsaturated bonds and no acidic functional group is exemplified.
  • the polymerizable compound (D) preferably contains at least one of the compound (Da) and the compound (Db), two or more of the compound (Da), two or more of the compound (Db), or the compound (Da) and at least one compound (Db).
  • the acidic functional group include a carboxy group, a sulfonic acid group, a phosphoric acid group, and the like. Among them, the acidic functional group is preferably a carboxy group.
  • the dispersibility of the semiconductor particles (A) in the composition I can be improved, and the emission intensity of the wavelength conversion layer can be improved.
  • the curability and heat resistance of the composition I can be improved by including the compound (Da) in the polymerizable compound (D).
  • the ethylenically unsaturated bond possessed by the compound (Da) is preferably a (meth)acryloyloxy group.
  • the number of ethylenically unsaturated bonds per molecule of compound (Da) is preferably 3 to 5, more preferably 3.
  • One molecule of the compound (Da) has one or more acidic functional groups. When it has two or more acidic functional groups, each acidic functional group may be different or the same, but preferably has at least one carboxy group.
  • the compound (Da) is obtained by modifying a compound having three or more (meth)acryloyloxy groups and hydroxy groups, such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate, with a polybasic acid.
  • examples of the compound include monoesterified compounds of pentaerythritol tri(meth)acrylate and dibasic acid (e.g., succinic acid, maleic acid) or their acid anhydrides, dipentaerythritol penta(meth)acrylate and dibasic Acids (eg, succinic acid, maleic acid) or monoesterified compounds with acid anhydrides thereof, and the like.
  • the ethylenically unsaturated bond possessed by compound (Db) is preferably a (meth)acryloyloxy group.
  • the number of ethylenically unsaturated bonds per molecule of compound (Db) is preferably 3-6.
  • Examples of the compound (Db) include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth) Acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tris(2-(meth)acryloyloxyethyl) isocyanate Nurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol he
  • the content of the polymerizable compound (D) in composition I is preferably 7% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 45% by mass or less, relative to the total solid content of composition I. More preferably, it is 13% by mass or more and 30% by mass or less.
  • the content of the polymerizable compound (D) is within the above range, the developability of composition I and the solvent resistance of the wavelength conversion layer tend to improve.
  • the polymerizable compound (D) preferably contains 50% by mass or more of the compound (Db). From the viewpoint of improving the solvent resistance of the wavelength conversion layer, the polymerizable compound (D) preferably contains the compound (Da) and the compound (Db).
  • composition I can further comprise a polymerization initiator (E).
  • the polymerization initiator (E) is a compound capable of initiating polymerization of the polymerizable compound (D) by generating an active radical, acid or the like by the action of light or heat.
  • Composition I may contain one or more polymerization initiators (E).
  • the polymerization initiator (E) includes photopolymerization initiators such as oxime compounds, biimidazole compounds, triazine compounds and acylphosphine compounds, and thermal polymerization initiators such as azo compounds and organic peroxides.
  • oxime compound (1) An example of the oxime compound is an oxime compound having a first molecular structure represented by the following formula (1).
  • the oxime compound is also referred to as "oxime compound (1)”.
  • Inclusion of the oxime compound (1) as the polymerization initiator (E) can be advantageous from the viewpoint of improving the emission intensity of the wavelength conversion layer.
  • One of the reasons why such an effect can be exhibited is that the oxime compound (1) is necessary when the oxime compound (1) initiates photopolymerization due to the unique molecular structure of the oxime compound (1). Since the absorption wavelength of the oxime compound (1) changes greatly before and after the cleavage (decomposition) of the oxime compound (1), it is presumed that the oxime compound (1) has a high ability to initiate radical photopolymerization.
  • R 1 represents R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN.
  • R 11 , R 12 and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or an aralkyl group having 2 to 20 carbon atoms. represents a heterocyclic group.
  • R 21 , R 22 and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or an aralkyl group having 2 to 20 carbon atoms. represents a heterocyclic group.
  • a hydrogen atom in the group represented by R 21 , R 22 or R 23 may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
  • the alkylene moiety is -O-, -S-, -COO-, -OCO-, It may be interrupted 1 to 5 times by -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO-.
  • R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms.
  • the alkyl moiety may be branched or cyclic.
  • R 12 and R 13 and R 22 and R 23 may together form a ring.
  • * represents a bond with the second molecular structure, which is a molecular structure other than the first molecular structure possessed by the oxime compound (1).
  • alkyl groups having 1 to 20 carbon atoms represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 in formula (1) include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, isopentyl group, tert-pentyl group, hexyl group, heptyl group, octyl group, isooctyl group, 2-ethylhexyl group, tert -octyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group, tetradecyl group, hexadecyl group, octadecyl group, icosyl group, cyclopentyl group
  • Examples of aryl groups having 6 to 30 carbon atoms represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 in formula (1) include phenyl, tolyl and xylyl. group, ethylphenyl group, naphthyl group, anthryl group, phenanthryl group, phenyl group substituted with one or more of the above alkyl groups, biphenylyl group, naphthyl group, anthryl group, and the like.
  • Examples of aralkyl groups having 7 to 30 carbon atoms represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 in formula (1) include benzyl group, ⁇ -methylbenzyl group, ⁇ , ⁇ -dimethylbenzyl group, phenylethyl group and the like.
  • Examples of the heterocyclic group having 2 to 20 carbon atoms represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 in formula (1) include pyridyl group, pyrimidyl group, furyl group, thienyl group, tetrahydrofuryl group, dioxolanyl group, benzoxazol-2-yl group, tetrahydropyranyl group, pyrrolidyl group, imidazolidyl group, pyrazolidyl group, thiazolidyl group, isothiazolidyl group, oxazolidyl group, isoxazolidyl group, A piperidyl group, a piperazyl group, a morpholinyl group, etc., and preferably a 5- to 7-membered heterocyclic ring.
  • R 12 and R 13 and R 22 and R 23 in formula (1) may together form a ring means that R 12 and R 13 and R 22 and R 23 may together It means that a ring may be formed together with the nitrogen atom, carbon atom or oxygen atom to which it is connected.
  • rings that can be formed by Ra 12 and Ra 13 and Ra 22 and Ra 23 together in formula (1) include a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a benzene ring, a piperidine ring, a morpholine ring, A lactone ring, a lactam ring and the like can be mentioned, and a 5- to 7-membered ring is preferred.
  • the halogen atoms which R 11 , R 12 , R 13 , R 21 , R 22 and R 23 in formula (1) may have as substituents include fluorine, chlorine, bromine and iodine atoms. be done.
  • R 1 in formula (1) is preferably R 11 , more preferably an alkyl group having 1 to 20 carbon atoms, still more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably 1 ⁇ 6 alkyl groups.
  • the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (2) below.
  • the second molecular structure means a portion of the molecular structure other than the first molecular structure of the oxime compound (1).
  • the bond represented by "*" in formula (2) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is a structure represented by formula (2), the benzene ring having "-*" in formula (2) and the carbonyl group having "-*" in formula (1) are directly connected.
  • R 2 and R 3 are each independently R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , CN or a halogen atom.
  • R 2 When multiple R 2 are present, they may be the same or different.
  • R3 When two or more R3 are present, they may be the same or different.
  • R 11 , R 12 and R 13 have the same meanings as above.
  • s and t each independently represent an integer of 0 to 4;
  • L represents a sulfur atom, CR 31 R 32 , CO or NR 33 ;
  • R 31 , R 32 and R 33 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms.
  • R 31 , R 32 or R 33 has an alkyl moiety, the alkyl moiety may be branched or cyclic, and R 31 , R 32 and R 33 may each independently form a ring together with either adjacent benzene ring.
  • R 4 is a hydroxy group, a carboxy group or the following formula (2-1)
  • L 1 represents -O-, -S-, -NR 22 -, -NR 22 CO-, -SO 2 -, -CS-, -OCO- or -COO- .
  • R 22 has the same meaning as above.
  • L 2 is a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. represents a group obtained by removing v hydrogen atoms from or a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms.
  • the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 22 -, -NR 22 COO-, -OCONR 22 - , -SCO-, -COS-, -OCS- or -CSO- may be interrupted 1 to 5 times, and the alkylene moiety may be branched or cyclic.
  • R4a represents OR41 , SR41 , CONR42R43 , NR42COR43 , OCOR41 , COOR41 , SCOR41 , OCSR41 , COSR41 , CSOR41 , CN or a halogen atom.
  • R 41 , R 42 and R 43 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms;
  • the group represented by 42 and R 43 has an alkyl moiety, the alkyl moiety may be branched or cyclic, and R 42 and R 43 together form a ring. may be formed.
  • v represents an integer of 1 to 3;
  • Represents a group represented by * represents a bond with the first molecular structure of the oxime compound (1).
  • Examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, and aralkyl groups having 7 to 30 carbon atoms represented by 41 , R 42 and R 43 are R 11 , Similar to the examples for R 12 , R 13 , R 21 , R 22 , R 23 and R 24 .
  • R 31 , R 32 and R 33 in formula (2) may each independently form a ring together with any adjacent benzene ring means that R 31 , R 32 and R 33 means that each independently may form a ring together with either adjacent benzene ring together with the connecting nitrogen atom.
  • Examples of rings that can be formed together with any of the adjacent benzene rings of R 31 , R 32 and R 33 in formula (2) are Ra 12 , Ra 13 and Ra 22 in formula (1). It is the same as the example for the ring that Ra 23 can form together.
  • L 2 in the above formula (2-1) is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represents a group excluding v hydrogen atoms.
  • the group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms for example, when v is 1, methylene group, ethylene group, propylene group, methylethylene group, butylene group, 1-methylpropylene group , 2-methylpropylene group, 1,2-dimethylpropylene group, 1,3-dimethylpropylene group, 1-methylbutylene group, 2-methylbutylene group, 3-methylbutylene group, 4-methylbutylene group, 2,4 -dimethylbutylene group, 1,3-dimethylbutylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, dodecylene group, tridecylene group, tetradecylene group, pentadecylene group, ethane-1,1- Alkylene groups such as a diyl group and a propane-2,2-diyl group can be mentioned.
  • Examples of groups obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms include, for example, when v is 1, a 1,2-phenylene group, a 1,3-phenylene group, a 1,4-phenylene group, 2,6-naphthylene group, 1,4-naphthylene group, 2,5-dimethyl-1,4-phenylene group, diphenylmethane-4,4'-diyl group, 2,2-diphenylpropane-4,4'-diyl and arylene groups such as diphenylsulfide-4,4'-diyl group and diphenylsulfone-4,4'-diyl group.
  • the group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms for example, when v is 1, a group represented by the following formula (a) and a group represented by the following formula (b) etc.
  • L 3 and L 5 represent an alkylene group having 1 to 10 carbon atoms
  • L 4 and L 6 represent a single bond or an alkylene group having 1 to 10 carbon atoms.
  • alkylene group having 1 to 10 carbon atoms examples include methylene group, ethylene group, propylene group, methylethylene group, butylene group, 1-methylpropylene group, 2-methylpropylene group, 1,2-dimethylpropylene group, 1 , 3-dimethylpropylene group, 1-methylbutylene group, 2-methylbutylene group, 3-methylbutylene group, 4-methylbutylene group, 2,4-dimethylbutylene group, 1,3-dimethylbutylene group, pentylene group, A hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group and the like can be mentioned.
  • Examples of groups obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms include, for example, when v is 1, a 2,5-pyridinediyl group, a 2,6-pyridinediyl group, a 2,5- pyrimidinediyl group, 2,5-thiophenediyl group, 3,4-tetrahydrofurandiyl group, 2,5-tetrahydrofurandiyl group, 2,5-furandiyl group, 3,4-thiazoldiyl group, 2,5-benzofurandiyl group 2,5-benzothiophenediyl group, N-methylindole-2,5-diyl group, 2,5-benzothiazoldiyl group, and 2,5-benzoxazoldiyl group. be done.
  • halogen atoms represented by R 2 and R 3 in formula (2) and R 4a in formula (2-1) above include fluorine, chlorine, bromine and iodine atoms.
  • L′ represents a sulfur atom or NR 50
  • R 50 represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms
  • R 2 , R 3 , R 4 , s and t have the same meanings as above.
  • R 44 is a hydroxy group, a carboxy group, or the following formula (2-2)
  • L 11 represents —O— or *—OCO—
  • * represents a bond with L 12
  • L 12 represents an alkylene group having 1 to 20 carbon atoms
  • the alkylene group may be interrupted by 1 to 3 —O—
  • R 44a represents OR 55 or COOR 55
  • R 55 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms .
  • R 44 is preferably a group represented by formula (2-2).
  • the solubility of the oxime compound (1) in the solvent (J) and the developability of the composition I are advantageous.
  • the alkylene group represented by L 12 preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms.
  • R 44a is preferably a hydroxy group or a carboxy group, more preferably a hydroxy group.
  • the method for producing the oxime compound (1) having the second molecular structure represented by formula (2) is not particularly limited, it can be produced, for example, by the method described in JP-A-2011-132215.
  • Another example of the second molecular structure linked to the first molecular structure represented by Formula (1) is the structure represented by Formula (3) below.
  • the bond represented by "*" in formula (3) is directly bonded to the bond represented by "*” in formula (1). That is, when the second molecular structure is a structure represented by formula (3), the benzene ring having "-*" in formula (3) and the carbonyl group having "-*" in formula (1) are directly connected.
  • R 5 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represents When the group represented by R 5 has an alkyl moiety, the alkyl moiety may be branched or cyclic.
  • R 21 , R 22 and R 23 have the same meanings as above.
  • a hydrogen atom in the group represented by R 21 , R 22 or R 23 may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
  • the groups represented by R 21 , R 22 and R 23 have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO It may be interrupted 1 to 5 times by -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO-.
  • R 24 has the same meaning as above.
  • R 21 , R 22 and R 23 When the groups represented by R 21 , R 22 and R 23 have an alkyl moiety, the alkyl moiety may be branched or cyclic, and R 22 and R 23 are Together they may form a ring.
  • R6 , R7 , R8 and R9 are each independently R61 , OR61 , SR61 , COR62 , CONR63R64 , NR65COR61 , OCOR61 , COOR62 , SCOR61 , OCSR61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.
  • R 61 , R 62 , R 63 , R 64 and R 65 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
  • R 6 and R 7 , R 7 and R 8 , and R 8 and R 9 may together form a ring. * represents a bond with the first molecular structure of the oxime compound (1).
  • R 5 an alkyl group having 1 to 20 carbon atoms represented by R 5 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 in formula (3);
  • Examples of the aryl group having 6 to 30 carbon atoms, the aralkyl group having 7 to 30 carbon atoms, and the heterocyclic group having 2 to 20 carbon atoms are R 11 in formula (1), Similar to the examples for R 12 , R 13 , R 21 , R 22 , R 23 and R 24 .
  • R 22 and R 23 in formula (3) may together form a ring means that R 22 and R 23 together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
  • Examples of rings that can be formed together by R 22 and R 23 in formula (3) are rings that can be formed together by Ra 12 and Ra 13 and Ra 22 and Ra 23 in formula (1) Similar to the example for
  • Examples of halogen atoms which may substitute the hydrogen atoms of include fluorine, chlorine, bromine and iodine atoms.
  • R 5 is a group represented by formula (3-1) below.
  • Z is a group obtained by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, represents a group obtained by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms or a group obtained by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms,
  • the alkylene portion is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 COO-, -OCONR 24 -, optionally interrupted 1 to 5 times by -SCO-, -COS-, -OCS- or -CSO-, the alkylene moiety may be branched or cyclic; R 21 , R 22 and R 24 have the same meanings as above. ]
  • Z in formula (3-1) is preferably a methylene group, ethylene or phenylene group from the same viewpoint as above.
  • R 21 and R 22 in formula (3-1) are preferably an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, more preferably methyl group, ethyl group or phenyl group.
  • R7 is a nitro group.
  • the method for producing the oxime compound (1) having the second molecular structure represented by formula (3) is not particularly limited, but for example, the methods described in JP-A-2000-80068 and JP-A-2011-178776. can be manufactured in
  • R 71 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represent.
  • the alkyl moiety may be branched or cyclic.
  • R 21 , R 22 and R 23 have the same meanings as above.
  • a hydrogen atom in the group represented by R 21 , R 22 or R 23 may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
  • the groups represented by R 21 , R 22 and R 23 have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO It may be interrupted 1 to 5 times by -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO-.
  • R 24 has the same meaning as above.
  • R 72 , R 73 and three R 74 are each independently R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.
  • R 61 , R 62 , R 63 , R 64 and R 65 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
  • R 72 and R 73 and two R 74 may together form a ring. * represents a bond with the first molecular structure of the oxime compound (1).
  • an alkyl group having 1 to 20 carbon atoms represented by R 71 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 in formula (4);
  • Examples of the aryl group having 6 to 30 carbon atoms, the aralkyl group having 7 to 30 carbon atoms, and the heterocyclic group having 2 to 20 carbon atoms are R 11 , R 12 , R 13 , R 21 , R 22 , Similar to the examples for R 23 and R 24 .
  • R 22 and R 23 in formula (4) may together form a ring means that R 22 and R 23 together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
  • Examples of rings that can be formed together by R 22 and R 23 in formula (4) are rings that can be formed together by Ra 12 and Ra 13 and Ra 22 and Ra 23 in formula (1) Similar to the example for
  • halogen atoms represented by R 72 , R 73 and R 74 in formula ( 4 ) ;
  • halogen atoms which may be substituted for include fluorine, chlorine, bromine and iodine atoms.
  • the method for producing the oxime compound (1) having the second molecular structure represented by formula (4) is not particularly limited, for example, the methods described in WO2017/051680 and WO2020/004601. can be manufactured in
  • R 81 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. represent.
  • the alkyl moiety may be branched or cyclic.
  • R 21 , R 22 and R 23 have the same meanings as above.
  • a hydrogen atom in the group represented by R 21 , R 22 or R 23 may be substituted with CN, a halogen atom, a hydroxy group or a carboxy group.
  • the groups represented by R 21 , R 22 and R 23 have an alkylene moiety, the alkylene moiety is -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO -, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or - It may be interrupted 1-5 times by CSO-.
  • R 24 has the same meaning as above.
  • R 21 , R 22 and R 23 When the groups represented by R 21 , R 22 and R 23 have an alkyl moiety, the alkyl moiety may be branched or cyclic, and R 22 and R 23 are Together they may form a ring.
  • R 82 , R 83 , R 84 , R 85 and R 86 are each independently R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.
  • R 61 , R 62 , R 63 , R 64 and R 65 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
  • R 83 and R 84 , R 84 and R 85 , and R 85 and R 86 may each combine to form a ring. * represents a bond with the first molecular structure of the oxime compound (1).
  • alkyl group having 1 to 20 carbon atoms represented by R 81 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 in formula (5);
  • Examples of aryl groups having 6 to 30 carbon atoms, aralkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are R 11 , R 12 , R 13 , R 21 , R 22 , Similar to the examples for R 23 and R 24 .
  • R 22 and R 23 in formula (5) may together form a ring means that R 22 and R 23 together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
  • Examples of rings that can be formed together by R 22 and R 23 in formula (5) are rings that can be formed together by Ra 12 and Ra 13 and Ra 22 and Ra 23 in formula (1) Similar to the example for
  • the method for producing the oxime compound (1) having the second molecular structure represented by formula (5) is not particularly limited, for example, the methods described in WO 2017/051680 and WO 2020/004601. can be manufactured in
  • R 91 , R 92 , R 93 , R 94 , R 95 , R 96 and R 97 are each independently R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , hydroxyl group, nitro group, CN or halogen atom;
  • R 61 , R 62 , R 63 , R 64 and R 65 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or represents a heterocyclic group having 2 to 20 carbon atoms.
  • R 21 , R 22 and R 23 have the same meanings as above.
  • R 92 and R 93 , R 94 and R 95 , R 95 and R 96 and R 96 and R 97 may each combine to form a ring. * represents a bond with the first molecular structure of the oxime compound (1).
  • Alkyl groups having 1 to 20 carbon atoms and aryl groups having 6 to 30 carbon atoms represented by R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 and R 65 in formula (6) , an aralkyl group having 7 to 30 carbon atoms, and a heterocyclic group having 2 to 20 carbon atoms are the examples of R 11 , R 12 , R 13 , R 21 , R 22 and R 23 in formula (1) and It is the same.
  • R 22 and R 23 in formula (6) may together form a ring means that R 22 and R 23 together form a ring together with the connecting nitrogen atom, carbon atom or oxygen atom. It means that it may be formed.
  • Examples of rings that can be formed together by R 22 and R 23 in formula (6) are rings that can be formed together by Ra 12 and Ra 13 and Ra 22 and Ra 23 in formula (1) Similar to the example for
  • the method for producing the oxime compound (1) having the second molecular structure represented by formula (6) is not particularly limited, for example, the methods described in WO 2017/051680 and WO 2020/004601. can be manufactured in
  • photopolymerization initiator is a photopolymerization initiator other than the oxime compound (1).
  • Other photopolymerization initiators include oxime compounds other than oxime compound (1), biimidazole compounds, triazine compounds and acylphosphine compounds.
  • oxime compounds other than oxime compound (1) include oxime compounds having a partial structure represented by the following formula (d1). * represents a bond.
  • Examples of the oxime compound having a partial structure represented by formula (d1) include N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) octan-1-one-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropan-1-one-2-imine, N-acetoxy-1 -[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethan-1-imine, N-acetoxy-1-[9-ethyl-6- ⁇ 2-methyl-4-( 3,3-dimethyl-2,4-dioxacyclopentanylmethyloxy)benzoyl ⁇ -9H-carbazol-3-yl]ethan-1-imine, N-acetoxy-1-[9-ethy
  • oxime compounds having a partial structure represented by formula (d1) include N-benzoyloxy-1-(4-phenylsulfanylphenyl)butan-1-one-2-imine, N-benzoyloxy-1-( At least selected from the group consisting of 4-phenylsulfanylphenyl)octan-1-one-2-imine and N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropan-1-one-2-imine One is preferred, and N-benzoyloxy-1-(4-phenylsulfanylphenyl)octan-1-one-2-imine is more preferred.
  • biimidazole compounds examples include compounds represented by formula (d5).
  • R E to R J represent an aryl group having 6 to 10 carbon atoms which may have a substituent.
  • the aryl group having 6 to 10 carbon atoms includes, for example, phenyl group, toluyl group, xylyl group, ethylphenyl group and naphthyl group, preferably phenyl group.
  • substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms.
  • the halogen atom includes, for example, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a chlorine atom.
  • Examples of the alkoxy group having 1 to 4 carbon atoms include methoxy group, ethoxy group, propoxy group, butoxy group and the like, preferably methoxy group.
  • Biimidazole compounds include, for example, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole, 2,2′-bis(2,3-dichlorophenyl)-4 ,4′,5,5′-tetraphenylbiimidazole (see, for example, JP-A-06-75372 and JP-A-06-75373), 2,2′-bis(2-chlorophenyl)-4, 4′,5,5′-tetraphenylbiimidazole, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetra(alkoxyphenyl)biimidazole, 2,2′-bis( 2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-t
  • triazine compounds examples include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxy naphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl )-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4- Bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-tri
  • acylphosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.
  • photopolymerization initiators other than the oxime compound (1) include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, o-benzoyl benzoin.
  • methyl acid 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4 benzophenone compounds such as ,4'-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthrenequinone, 2-ethylanthraquinone and camphorquinone; 10-butyl-2-chloroacridone, benzyl, phenylglyoxylic acid Examples include methyl and titanocene compounds.
  • the content of the polymerization initiator (E) in composition I is preferably 0.1 parts by mass or more and 300 parts by mass or less, more preferably 0.1 parts by mass or more, relative to 100 parts by mass of the polymerizable compound (D). It is 200 mass parts or less. Further, the content of the polymerization initiator (E) in the composition I is preferably 0.1 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the total amount of the resin (C) and the polymerizable compound (D). , more preferably 0.5 parts by mass or more and 20 parts by mass or less. When the content of the polymerization initiator (E) is within the above range, the sensitivity of the composition I tends to be high and the exposure time tends to be shortened, so the productivity of the wavelength conversion layer tends to improve.
  • the content of the oxime compound (1) in the polymerization initiator (E) is preferably 30% by mass or more and 100% by mass with respect to the total amount of the polymerization initiator (E).
  • the content of the oxime compound (1) in the polymerization initiator (E) is preferably 30% by mass or more and 100% by mass with respect to the total amount of the polymerization initiator (E).
  • more preferably 50% by mass or more and 100% by mass or less still more preferably 80% by mass or more and 100% by mass or less, still more preferably 90% by mass or more and 100% by mass or less, particularly preferably 95% by mass or more and 100% by mass or less , most preferably 100% by weight.
  • Polymerization initiation aid (E1) Composition I can further contain a polymerization initiation aid (E1) together with the polymerization initiator (E).
  • the polymerization initiation aid (E1) is a compound or a sensitizer used to accelerate the polymerization of the polymerizable compound (D) initiated by the polymerization initiator (E).
  • Examples of the polymerization initiation aid (E1) include photopolymerization initiation aids such as amine compounds, alkoxyanthracene compounds, thioxanthone compounds and carboxylic acid compounds, and thermal polymerization initiation aids.
  • Composition I may contain two or more polymerization initiation aids (E1).
  • amine compounds include triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethylp-toluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Michler's ketone), 4,4'-bis(diethylamino)benzophenone, 4,4'- bis(ethylmethylamino)benzophenone and the like.
  • alkoxyanthracene compounds include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10- dibutoxyanthracene, 2-ethyl-9,10-dibutoxyanthracene and the like.
  • thioxanthone compounds include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone and the like.
  • carboxylic acid compounds include phenylsulfanylacetic acid, methylphenylsulfanylacetic acid, ethylphenylsulfanylacetic acid, methylethylphenylsulfanylacetic acid, dimethylphenylsulfanylacetic acid, methoxyphenylsulfanylacetic acid, dimethoxyphenylsulfanylacetic acid, chlorophenylsulfanylacetic acid, and dichlorophenylsulfanylacetic acid.
  • N-phenylglycine phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthoxyacetic acid and the like.
  • the content of the polymerization initiation aid (E1) in the composition I is preferably 0.1 mass with respect to 100 parts by mass of the polymerizable compound (D). part or more and 300 mass parts or less, more preferably 0.1 mass part or more and 200 mass parts or less. Further, the content of the polymerization initiation aid (E1) in the composition I is preferably 0.1 parts by mass or more and 30 parts by mass with respect to 100 parts by mass of the total amount of the resin (C) and the polymerizable compound (D). Below, it is more preferably 1 mass part or more and 20 mass parts or less. When the content of the polymerization initiation aid (E1) is within the above range, the sensitivity of the composition I can be further increased.
  • Antioxidant (F) Composition I may further comprise an antioxidant (F).
  • the antioxidant (F) is not particularly limited as long as it is an antioxidant that is commonly used industrially, and includes phenol antioxidants, phosphorus antioxidants, phosphorus/phenol composite antioxidants and sulfur antioxidants. An antioxidant or the like can be used.
  • Composition I may contain two or more antioxidants (F).
  • a phosphorus/phenol composite antioxidant is, for example, a compound having one or more phosphorus atoms and one or more phenol structures in the molecule.
  • the antioxidant (F) preferably contains a phosphorus/phenol composite antioxidant.
  • Phenolic antioxidants include, for example, Irganox (registered trademark) 1010 (Irganox 1010: pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], BASF Corporation).
  • Phosphorus-based antioxidants include, for example, Irgafos (registered trademark) 168 (Irgafos 168: Tris (2,4-di-tert-butylphenyl) phosphite, manufactured by BASF Corporation), Irgafos 12 (Irgafos 12: Tris [2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphine-6-yl]oxy]ethyl]amine, BASF Corporation ), Irgafos 38 (Irgafos 38: bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl ester phosphorous acid, manufactured by BASF Corporation), Adekastab (registered trademark) 329K, PEP36, PEP-8 (manufactured by ADEKA Co., Ltd.), Sandstab P-EP
  • Phosphorus/phenol composite antioxidants include, for example, Sumilizer (registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8, 10-tetra-tert-butyldibenz[d,f][1.3.2]dioxaphosphepin) (manufactured by Sumitomo Chemical Co., Ltd.) and the like.
  • sulfur-based antioxidants include dialkylthiodipropionate compounds such as dilauryl thiodipropionate, dimyristyl or distearyl, and ⁇ -alkylmercaptopropionate esters of polyols such as tetrakis[methylene(3-dodecylthio)propionate]methane. compounds and the like.
  • the content of the antioxidant (F) in the composition I is, for example, 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the resin (C), and from the viewpoint of the emission intensity and heat resistance of the wavelength conversion layer , preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 7 parts by mass or more and 30 parts by mass or less.
  • leveling agent (H) Composition I may further comprise a leveling agent (H).
  • the leveling agent (H) include silicone-based surfactants, fluorine-based surfactants, and silicone-based surfactants having fluorine atoms. These may have a polymerizable group in the side chain.
  • the leveling agent (H) is preferably a fluorosurfactant from the viewpoint of the developability of the composition I and the emission intensity of the wavelength conversion layer.
  • Composition I may contain two or more leveling agents (H).
  • silicone-based surfactants include surfactants that have siloxane bonds in their molecules.
  • Toray Silicone DC3PA, Toray SH7PA, Toray DC11PA, Toray SH21PA, Toray SH28PA, Toray SH29PA, Toray SH30PA, Toray SH8400 (trade name: Dow Corning Toray Co., Ltd.), KP321, KP322, KP323, KP324 , KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452 and TSF4460 (manufactured by Momentive Performance Materials Japan LLC), etc. .
  • fluorine-based surfactants include surfactants that have a fluorocarbon chain in the molecule.
  • Florard registered trademark
  • FC430 Florard FC431 (manufactured by Sumitomo 3M Co., Ltd.)
  • Megafac registered trademark
  • F142D Florado F171, Flora F172, Flora F173, Flora F177, Flora F183, Flora F554 F575, R30, RS-718-K
  • F-top registered trademark
  • EF301 EF303
  • EF351, EF352 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.
  • Surflon registered trademark
  • silicone-based surfactants having fluorine atoms include surfactants having siloxane bonds and fluorocarbon chains in the molecule.
  • Megafac registered trademark
  • Megafac BL20 Megafac F475, F477 and F443 (manufactured by DIC Corporation) and the like can be mentioned.
  • the content of the leveling agent (H) in the composition I is, for example, 0.001% by mass or more and 1.0% by mass or less with respect to the total amount of the composition I, It is preferably 0.005% by mass or more and 0.75% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, and still more preferably 0.02% by mass or more and 0.5% by mass or less.
  • the content of the leveling agent (H) is within the above range, the flatness of the wavelength conversion layer can be improved.
  • Solvent (J) Composition I may contain one or more solvents (J).
  • the solvent (J) preferably dissolves the resin (C), polymerizable compound (D) and polymerization initiator (E).
  • Examples of the solvent (J) include ester solvents (solvents containing -COO- in the molecule but not containing -O-), ether solvents (solvents containing -O- in the molecule but not containing -COO-).
  • ether ester solvents solvents containing -COO- and -O- in the molecule
  • ketone solvents solvents containing -CO- in the molecule but not -COO-
  • alcohol solvents solvents containing OH in the molecule solvents containing -O-, -CO- and COO-
  • aromatic hydrocarbon solvents aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide and the like.
  • Ester solvents include methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutanoate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, and isopropyl butyrate.
  • ethyl butyrate n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate and ⁇ -butyrolactone.
  • Ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether.
  • propylene glycol monopropyl ether propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenetol, methylanisole and the like.
  • Ether ester solvents include methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxy ethyl propionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, 2-ethoxy- Ethyl 2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether a
  • Ketone solvents include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone and isophorone. etc.
  • Alcohol solvents include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol and glycerin.
  • Aromatic hydrocarbon solvents include benzene, toluene, xylene and mesitylene.
  • Amide solvents include N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone.
  • Solvent (J) is propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl It preferably contains one or more selected from the group consisting of -2-pentanone and aromatic hydrocarbon solvents.
  • solvent (J) examples include propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4- Methyl-2-pentanone or toluene or mixtures of two or more of these are preferred.
  • the solvent (J) is a component other than the solid content, and includes, for example, the solvent contained in the dispersion of the semiconductor particles (A) and the solution of the resin (C).
  • the content of the solvent (J) in composition I is the ratio of the total mass of all solvents contained in the composition to the total amount of composition I, and is, for example, 40% by mass or more and 95% by mass of the total amount of composition I. % by mass or less, preferably 55% by mass or more and 90% by mass or less.
  • the solid content of composition I is, for example, 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 45% by mass or less.
  • Components Composition I may optionally contain additives known in the art such as polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, chain transfer agents, etc. It may further contain an agent.
  • composition I can be produced by a method including a step of mixing predetermined components and other components used as necessary.
  • the method for producing composition II can further include the step of preparing resin (C).
  • Wavelength conversion layer and its manufacturing method A wavelength conversion layer is formed from the composition I.
  • the wavelength conversion layer is After the wavelength conversion layer is produced by method a comprising the step of applying Composition I to a substrate and then drying, or by a method comprising the step of applying Composition I to a support and then drying, the wavelength conversion layer is supported.
  • Method b Peel off from the body and attach to the substrate via the adhesive layer It can be provided on the substrate by, for example.
  • the composition I is a resin composition R1 further containing a resin (C).
  • the wavelength conversion layer (resin film) formed from the resin composition R1 can be formed by coating the composition I on a base material or support and then drying it.
  • composition I is curable composition R2 further comprising a polymerizable compound (D) and a polymerization initiator (E).
  • the curable composition R2 may further contain a resin (C).
  • the wavelength conversion layer formed from the curable composition R2 is a cured film.
  • the cured film can be obtained by coating the curable composition R2 on a substrate or support, drying it, and curing it by the action of light and/or heat.
  • One aspect of the curable composition R2 is a photocurable composition R3 containing a photopolymerizable compound and a photopolymerization initiator.
  • the photocurable composition R3 may further contain a resin (C).
  • the wavelength conversion layer may be provided on the entire surface of the base material, or may be provided in a pattern on a part of the base material.
  • a photolithography method, an inkjet method, a printing method, etc. are mentioned as a method of forming a wavelength conversion layer in a pattern on a base material.
  • Examples of the printing method include a stencil printing method, a screen printing method, and printing coating using an applicator.
  • substrates include glass plates such as quartz glass, borosilicate glass, alumina silicate glass, and soda-lime glass whose surface is coated with silica; resin plates such as polycarbonate, polymethyl methacrylate, and polyethylene terephthalate; silicon; A material on which an aluminum, silver, silver/copper/palladium alloy thin film or the like is formed;
  • members included or that can be included in the display device include a primary light source (for example, a blue light source), a light guide plate, a diffusion film (diffusion layer), a light reflection member (reflection film, etc.), a brightness enhancement member, a prism sheet, and a barrier. layer, protective layer (overcoat layer), and the like.
  • a patterned resin film (wavelength conversion layer) formed from the resin composition R1 can be formed, for example, on a substrate as follows. First, the resin composition R1 is applied onto a substrate through a mask to form a patterned composition layer. Examples of methods for applying the resin composition include a spin coating method, a slit coating method, a slit and spin coating method, and the like.
  • a resin film (wavelength conversion layer) is obtained by drying the composition layer (removing volatile components such as solvents). Drying methods include heat drying, vacuum drying, or a combination thereof.
  • the temperature for heat drying is preferably 30° C. or higher and 250° C. or lower, more preferably 50° C. or higher and 235° C. or lower.
  • the heating time is preferably 10 seconds or more and 180 minutes or less, more preferably 30 seconds or more and 90 minutes or less.
  • it is preferable to perform under the pressure of 50 Pa or more and 150 Pa or less. Drying of the composition layer may be carried out in a plurality of stages such as carrying out a plurality of drying steps with different drying temperatures.
  • a patterned cured film (wavelength conversion layer) formed from the photocurable composition R3 can be formed on a substrate in the following manner, for example, using a photolithographic method. .
  • the photocurable composition R3 is applied onto the substrate, and dried by heating (prebaking) and/or Alternatively, volatile components such as solvents are removed by drying under reduced pressure to obtain a composition layer. Examples of the coating method include the same methods as described above.
  • the temperature for heat drying is preferably 30°C or higher and 120°C or lower, more preferably 50°C or higher and 110°C or lower.
  • the heating time is preferably 10 seconds or more and 60 minutes or less, more preferably 30 seconds or more and 30 minutes or less.
  • a light source used for exposure is preferably a light source that emits light having a wavelength of 250 nm or more and 450 nm or less.
  • light of around 436 nm, around 408 nm, or around 365 nm may be selectively extracted from the light of this wavelength by a band-pass filter according to the absorption wavelength of the photopolymerization initiator.
  • Specific examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps.
  • the exposed composition layer is cured by polymerization of the photopolymerizable compound contained in the composition layer.
  • the unexposed portion of the composition layer is dissolved in the developer and removed to obtain a patterned cured film (wavelength conversion layer).
  • the developer include aqueous solutions of alkaline compounds such as potassium hydroxide, sodium hydrogen carbonate, sodium carbonate, tetramethylammonium hydroxide, and organic solvents.
  • the concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.03% by mass or more and 5% by mass or less.
  • the organic solvent include those similar to the solvent (J) described above.
  • the developer may contain a surfactant.
  • the developing method may be any of a puddle method, a dipping method, a spray method, and the like.
  • the substrate may be tilted at any angle during development.
  • the heating temperature is preferably 150° C. or higher and 250° C. or lower, more preferably 160° C. or higher and 235° C. or lower.
  • the heating time is preferably 1 minute or more and 120 minutes or less, more preferably 10 minutes or more and 60 minutes or less.
  • a curable composition is applied to the substrate, dried as necessary to form a composition layer, and the composition layer is formed.
  • a method of heating and/or exposing the entire surface of the composition layer may be mentioned.
  • a cured film formed from the curable composition R2 contains a cured reaction product of the polymerizable compound and the polymerization initiator contained in the curable composition R2.
  • the curing reaction product is a substance containing a structure resulting from the structure of the polymerizable compound and the polymerization initiator.
  • the structure resulting from the structure of the polymerizable compound or polymerization initiator is, for example, a skeleton structure or a portion thereof other than the curing reaction site of the polymerizable compound or polymerization initiator.
  • the thickness of the wavelength conversion layer is, for example, 1 ⁇ m or more and 20 ⁇ m or less, preferably 1.5 ⁇ m or more and 18 ⁇ m or less, more preferably 2 ⁇ m or more and 14 ⁇ m or less, further preferably 2 ⁇ m or more and 12 ⁇ m or less. m or less. If the thickness of the wavelength conversion layer is excessively small, when the wavelength conversion layer is irradiated with primary light, there is a tendency for the primary light to pass through the wavelength conversion layer without being sufficiently absorbed or scattered by the wavelength conversion layer. be.
  • the shape and dimensions of the patterned wavelength conversion layer are not particularly limited.
  • the patterned wavelength conversion layer has, for example, a square shape in plan view.
  • the wavelength conversion layer is a layer that absorbs primary light from a primary light source and emits green light, and preferably converts the wavelength of blue light, which is the primary light, into the wavelength of green light. layer.
  • the green light emitted by the wavelength conversion layer preferably includes a peak having a maximum value in a wavelength range of 500 nm or more and 560 nm or less, more preferably a peak having a maximum value in a wavelength range of 520 nm or more and 545 nm or less in the emission spectrum. and more preferably a peak having a maximum value in a wavelength range of 525 nm or more and 535 nm or less.
  • the peak has a full width at half maximum of preferably 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, particularly preferably 15 nm to 45 nm.
  • a wavelength conversion layer is a layer that absorbs primary light from a primary light source and emits red light, and preferably converts the wavelength of blue light, which is the primary light, into the wavelength of red light. layer.
  • the red light emitted by the wavelength conversion layer preferably includes a peak having a maximum value in a wavelength range of 610 nm or more and 750 nm or less, more preferably a peak having a maximum value in a wavelength range of 620 nm or more and 650 nm or less in the emission spectrum. and more preferably a peak having a maximum value in a wavelength range of 625 nm or more and 645 nm or less.
  • the peak has a full width at half maximum of preferably 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, particularly preferably 15 nm to 45 nm.
  • a laminate and a display device which will be described later, can include both a wavelength conversion layer that emits green light and a wavelength conversion layer that emits red light.
  • the wavelength conversion layer may be a layer that absorbs part of the primary light and transmits the rest of the primary light.
  • the wavelength conversion layer preferably has a light transmittance at a wavelength of 450 nm of 90% or less, more preferably 85% or less, still more preferably 75% or less, and still more preferably. is 60% or less, particularly preferably 40% or less, more particularly preferably 30% or less, most preferably 20% or less. It is desirable that the amount of primary light transmitted through the wavelength conversion layer is small.
  • composition II used to form a protective layer is a layer disposed on the wavelength converting layer.
  • the protective layer is formed from a protective layer-forming composition (hereinafter also referred to as "composition II") containing a polyfunctional polymerizable compound (K) or a polymer thereof and not containing semiconductor particles (A).
  • Composition II is a curable composition.
  • the surface may be a main surface or a side surface of the wavelength conversion layer.
  • the main surface is preferably the main surface of the wavelength conversion layer on the light extraction direction side.
  • the protective layer may be arranged to cover the entire principal surface of the wavelength conversion layer, or may be arranged to partially cover the principal surface.
  • the protective layer is preferably arranged so as to cover the entire main surface of the wavelength conversion layer on the light extraction direction side.
  • the protective layer may be arranged to cover the entire surface of the wavelength conversion layer.
  • Composition II contains a polyfunctional polymerizable compound (K) having two or more ethylenically unsaturated bonds in the molecule or a polymer thereof.
  • a polymer means an oligomer or polymer obtained by polymerizing a polyfunctional polymerizable compound (K).
  • the ethylenically unsaturated bond includes a (meth)acryloyloxy group, a vinyl group and the like, preferably a (meth)acryloyloxy group.
  • the polyfunctional polymerizable compound (K) is preferably a polyfunctional (meth)acrylic compound having a (meth)acryloyloxy group as an ethylenically unsaturated bond.
  • bifunctional (meth)acrylic compounds include alkylene glycol di(meth)acrylates, polyoxyalkylene glycol di(meth)acrylates, halogen-substituted alkylene glycol di(meth)acrylates, and di(meth)acrylates of aliphatic polyols. , di(meth)acrylate of hydrogenated dicyclopentadiene or tricyclodecanedialkanol, di(meth)acrylate of dioxaneglycol or dioxanedialkanol, di(meth)acrylate of alkylene oxide adduct of bisphenol A or bisphenol F, bisphenol A or bisphenol F epoxy di(meth)acrylate and the like.
  • bifunctional (meth)acrylic compound examples include ethylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate. , 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol di(meth)acrylate , Ditrimethylolpropane di(meth)acrylate, Diethylene glycol di(meth)acrylate, Triethylene glycol di(meth)acrylate, Dipropylene glycol di(meth)acrylate, Tripropylene glycol di(meth)acrylate, Polyethylene glycol di(meth) Acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(
  • Trifunctional or higher (meth)acrylic compounds include, for example, glycerin tri(meth)acrylate, alkoxylated glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, ditri Methylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate , tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(me
  • the polyfunctional polymerizable compound (K) has an ethylenically unsaturated bond in the molecule. It preferably has 3 or more, and more preferably has 3 or more (meth)acryloyloxy groups.
  • the polyfunctional polymerizable compound (K) preferably has 6 or less ethylenically unsaturated bonds.
  • the polyfunctional polymerizable compound (K) preferably has an acidic functional group.
  • acidic functional groups include a carboxy group, a sulfonic acid group, a phosphoric acid group, and the like. Among them, the acidic functional group is preferably a carboxy group.
  • the number of acidic functional groups that the polyfunctional polymerizable compound (K) can have is preferably 1 or more and 3 or less from the viewpoint of more effectively suppressing a decrease in emission intensity due to heat in the wavelength conversion layer. , more preferably one or two. When having two or more acidic functional groups, each acidic functional group may be different or the same.
  • the polyfunctional polymerizable compound (K) having an acidic functional group a compound having two or more (preferably three or more) (meth)acryloyloxy groups and one or more hydroxy groups in the molecule is converted into a polybasic acid.
  • Examples include compounds obtained by modification.
  • Examples of the compound include monoesterified compounds of pentaerythritol tri(meth)acrylate and dibasic acid (e.g., succinic acid, maleic acid) or their acid anhydrides, dipentaerythritol penta(meth)acrylate and dibasic Acids (eg, succinic acid, maleic acid) or monoesterified compounds with acid anhydrides thereof, and the like.
  • polyfunctional polymerizable compound (K) having an acidic functional group examples include, for example, Toagosei Co., Ltd. "Aronix M -510”, and “Aronix M-520D” manufactured by Toagosei Co., Ltd., which is mainly composed of a dibasic acid anhydride adduct of dipentaerythritol penta(meth)acrylate. These commercial products have a carboxy group as an acidic functional group and belong to the polyfunctional polymerizable compound (K) having 3 or more (meth)acryloyloxy groups.
  • the polyfunctional polymerizable compound (K) or its polymer preferably does not contain silicon atoms in its molecule.
  • the content of the polyfunctional polymerizable compound (K) or a polymer thereof in Composition II is preferably 7% by mass or more and 80% by mass or less, more preferably 10% by mass, based on the total solid content of Composition II. 75% by mass or less, more preferably 15% by mass or more and 70% by mass or less, still more preferably 30% by mass or more and 70% by mass or less, particularly preferably 40% by mass or more and 70% by mass or less, most preferably 45% by mass or more It is 65% by mass or less.
  • Composition II preferably further contains a resin (C) and a polymerization initiator (E) in addition to the polyfunctional polymerizable compound (K) or its polymer.
  • the polymerization initiator (E) is preferably a photopolymerization initiator.
  • Composition II may further contain at least one selected from the group consisting of polymerization initiation aid (E1), antioxidant (F), leveling agent (H) and solvent (J).
  • polymerization initiation aid (E1), the antioxidant (F), the leveling agent (H) and the solvent (J) the matters other than the content of these in the composition are described in the composition I Description is quoted.
  • the content of resin (C) in composition II is, for example, 0.00001% by mass or more and 99.99999% by mass or less, preferably 1% by mass or more and 99% by mass, relative to the total solid content of composition II. 1% to 97% by mass, more preferably 1% to 95% by mass, even more preferably 3% to 90% by mass, and particularly preferably 5% to 80% by mass. , most preferably 10% by mass or more and 70% by mass or less.
  • the content of the polymerization initiator (E) in composition II is preferably 0.001% by mass or more and 60% by mass with respect to the total amount of the resin (C) and the polyfunctional polymerizable compound (K) or a polymer thereof. Below, it is more preferably 0.01 mass % or more and 50 mass % or less.
  • the content of the polymerization initiation aid (E1) in the composition II is based on the total amount of the resin (C) and the polyfunctional polymerizable compound (K) or the polymer thereof , preferably 0.00001% by mass or more and 60% by mass or less, more preferably 0.0001% by mass or more and 50% by mass or less.
  • the content of the antioxidant (F) in the composition II is based on the total amount of the resin (C) and the polyfunctional polymerizable compound (K) or the polymer thereof, which is 100 parts by mass. , preferably 1 to 50 parts by mass, more preferably 2 to 40 parts by mass, even more preferably 4 to 30 parts by mass.
  • the content of the leveling agent (H) in composition II is, for example, 0.001% by mass or more and 1.0% by mass or less, preferably 0.001% by mass or more and 1.0% by mass or less, relative to the total amount of composition II. 005 mass % or more and 0.75 mass % or less, more preferably 0.01 mass % or more and 0.5 mass % or less, and still more preferably 0.02 mass % or more and 0.5 mass % or less.
  • the flatness of the protective layer can be improved.
  • Composition II does not contain semiconductor particles (A).
  • Composition II may contain a colorant other than the semiconductor particles (A), but preferably contains no colorant.
  • Colorants may be pigments or dyes.
  • the pigment known pigments can be used, and examples thereof include pigments classified as pigments in the Color Index (published by The Society of Dyers and Colorists). Only one pigment may be used, or two or more pigments may be used in combination.
  • the dye known dyes can be used, and examples thereof include dyes described in Color Index (published by The Society of Dyers and Colorists) and Dye Note (Shikisensha). Only one dye may be used, or two or more dyes may be used in combination.
  • the colorant may be subjected to rosin treatment, surface treatment using a colorant derivative into which an acidic group or basic group is introduced, graft treatment to the surface of the colorant with a polymer compound, etc., sulfuric acid atomization method, or the like.
  • atomization treatment, washing treatment with an organic solvent or water for removing impurities, removal treatment of ionic impurities by an ion exchange method or the like, and the like may be performed. It is preferable that the particle size of the colorant is substantially uniform.
  • the content of the colorant in the composition II is, for example, 0.01% by mass or more and 99.99% by mass or less with respect to the total solid content of the composition II, preferably is 0.1% by mass or more and 99.9% by mass or less, more preferably 1% by mass or more and 99% by mass or less, still more preferably 10% by mass or more and 90% by mass or less, even more preferably 15% by mass or more and 70% by mass or less is.
  • Composition II may further contain additives known in the art such as polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, chain transfer agents, etc. .
  • the solid content of Composition II is preferably 0.01% by mass or more and 100% by mass or less, more preferably 0.1% by mass or more and 99.9% by mass or less, and still more preferably 0% by mass or more, relative to the total amount of Composition II. .1 to 99% by weight, even more preferably 1 to 90% by weight, more preferably 1 to 80% by weight, particularly preferably 1 to 70% by weight, extremely preferably It is 1% by mass or more and 60% by mass or less, most preferably 1% by mass or more and 50% by mass or less.
  • the content of the solvent (J) in composition II is preferably 0% by mass or more and 99.99% by mass or less, more preferably 0.1% by mass or more and 99.9% by mass or less, relative to the total amount of composition II. , more preferably 1% by mass or more and 99.9% by mass or less, even more preferably 10% by mass or more and 99% by mass or less, still more preferably 20% by mass or more and 99% by mass or less, particularly preferably 30% by mass or more and 99% by mass Below, it is most preferably 40% by mass or more and 99% by mass or less, and most preferably 50% by mass or more and 99% by mass or less.
  • composition II can be produced by a method including a step of mixing predetermined components and other components used as necessary.
  • the method of manufacturing composition II can further include the step of preparing resin (C).
  • a colorant is used, the colorant is premixed with part or all of the solvent (J) and dispersed using a bead mill or the like until the average particle size of the colorant is about 0.2 ⁇ m or less. It is preferably used in the form of a dispersion.
  • a dispersant and part or all of the resin (C) may be blended.
  • the dispersant the description of the dispersant described in the section of the light scattering agent (B) is cited.
  • the protective layer is formed from composition II.
  • a protective layer is formed over the wavelength converting layer.
  • the protective layer may be in contact with the wavelength conversion layer, or another layer may be interposed between the wavelength conversion layer and the protective layer.
  • Other layers include a light absorbing layer.
  • composition II is a curable composition comprising a polyfunctional polymerizable compound (K) or a polymer thereof and a polymerization initiator (E).
  • the curable composition may further contain a resin (C).
  • a protective layer formed from the curable composition is a cured film.
  • the cured film can be obtained by coating the curable composition on a substrate, drying it, and curing it by the action of light and/or heat.
  • One aspect of the curable composition is a photocurable composition containing a polyfunctional polymerizable compound (K) or a polymer thereof and a photopolymerization initiator.
  • the photocurable composition may further contain a resin (C).
  • the substrate on which the protective layer is formed is the wavelength conversion layer or a layer (for example, light absorption layer) formed on the wavelength conversion layer.
  • Examples of methods for forming a protective layer on a substrate include a photolithographic method, an inkjet method, and a printing method.
  • Examples of the printing method include a stencil printing method, a screen printing method, and printing coating using an applicator.
  • a patterned protective layer can be formed using the above-described curable composition or photocurable composition that is composition II.
  • the method may be the same as the above method of forming a patterned wavelength conversion layer using the resin composition R1, the curable composition R2, and the photocurable composition R3.
  • the thickness of the protective layer is, for example, 0.1 ⁇ m or more and 20 ⁇ m or less, and is preferably 0.1 ⁇ m or more from the viewpoint of suppressing warping and wrinkles that may occur during curing and from the viewpoint of suppressing a decrease in emission intensity due to heat of the wavelength conversion layer. It is 15 ⁇ m or less, more preferably 0.5 ⁇ m or more and 10 ⁇ m or less, still more preferably 0.5 ⁇ m or more and 6 ⁇ m or less, and even more preferably 0.5 ⁇ m or more and 4.5 ⁇ m or less.
  • Laminate comprises the wavelength conversion layer containing the semiconductor particles (A) and the protective layer according to the present invention. It is an optical laminate including.
  • FIG. 1 is a schematic cross-sectional view showing an example of the laminate according to the present invention
  • FIG. 2 is a schematic cross-sectional view showing another example of the laminate according to the present invention
  • FIG. 3 is a laminate according to the present invention. It is a schematic sectional drawing which shows another example.
  • the laminate shown in FIGS. 1-3 includes a wavelength conversion layer 10 and a protective layer 20 disposed thereon.
  • the protective layer 20 may be directly laminated on the wavelength conversion layer 10 such that the protective layer 20 and the wavelength conversion layer 10 are in contact with each other.
  • another layer may be interposed between the wavelength conversion layer 10 and the protective layer 20 like the laminate shown in FIG.
  • Other layers include the light absorbing layer 30 .
  • heat is applied to the wavelength conversion layer in the process of forming the other layer, which may reduce the emission intensity of the wavelength conversion layer.
  • the protective layer 20 is laminated directly on the wavelength conversion layer 10 like the laminate shown in FIGS. 1 and 2 .
  • FIG. 4 is a schematic cross-sectional view showing still another example of the laminate according to the present invention.
  • the laminate includes a first wavelength conversion layer 11 that emits red light, a first protective layer 21 disposed thereon, a second wavelength conversion layer 12 that emits green light, and and a second protective layer 22 disposed thereon.
  • Both the first protective layer 21 and the second protective layer 22 are protective layers according to the present invention.
  • one (integral) protective layer may be provided on the first wavelength conversion layer 11 and the second wavelength conversion layer 12 .
  • the light absorption layer 30 may be provided similarly to the laminated body of FIG.2 and FIG.3.
  • the first light absorption layer is provided on the first wavelength conversion layer 11 or the first protective layer 21, and the second wavelength conversion layer 12 or the second protective layer 22
  • a second light absorbing layer may be provided thereon.
  • one (integral) light absorption layer may be provided on the first wavelength conversion layer 11 and the second wavelength conversion layer 12 or on the first protective layer 21 and the second protective layer 22 .
  • the laminate can be suitably used as a color conversion member arranged on the primary light source (blue light source) of the display device. According to the layered product of the present invention, it is possible to suppress a decrease in emission intensity due to heat of the wavelength conversion layer.
  • the light absorption layer is a layer that transmits light in a specific wavelength range and absorbs light in at least a part of the other wavelength ranges.
  • Light emitted from the wavelength conversion layer is emitted from the display device by passing through the light absorption layer.
  • the wavelength range of light transmitted through the light absorption layer is preferably a green or red wavelength range.
  • the green wavelength range is, for example, a wavelength range of 495 nm or more and 585 nm or less.
  • the red wavelength range is, for example, a wavelength range included in the range from 585 nm to 780 nm.
  • the wavelength range of light absorbed by the light absorption layer is preferably a blue wavelength range, more preferably a wavelength range including 450 nm, for example, a wavelength range of 380 nm to 495 nm.
  • Composition III and the light absorbing layer have an average light transmittance of 98% or more in the wavelength range of 520 nm or more and 780 nm or less.
  • the emission intensity can be further increased.
  • the average light transmittance can be determined based on the absorption spectrum measured using an ultraviolet-visible-near-infrared spectrophotometer equipped with an integrating sphere.
  • composition III a composition for forming a light-absorbing layer containing a colorant (hereinafter also referred to as "composition III").
  • Composition III may be a curable composition that is cured by light irradiation or heat.
  • Colorants may be pigments or dyes.
  • pigments known pigments can be used, and examples thereof include pigments classified as pigments in the Color Index (published by The Society of Dyers and Colorists). Only one pigment may be used, or two or more pigments may be used in combination.
  • dye known dyes can be used, and examples thereof include dyes described in Color Index (published by The Society of Dyers and Colorists) and Dye Note (Shikisensha). Only one dye may be used, or two or more dyes may be used in combination.
  • the coloring agent is preferably a yellow coloring agent.
  • Composition III preferably contains a first colorant that satisfies formulas (i) and (ii) below.
  • ⁇ max (nm) represents the wavelength showing the maximum absorbance in the visible light wavelength region of the absorption spectrum.
  • a max represents the maximum absorbance.
  • A480 represents absorbance at a wavelength of 480 nm. 425 ⁇ max ⁇ 470 (i) A480 / Amax ⁇ 0.5 (ii)
  • ⁇ max preferably satisfies any one of the following formulas. 425 ⁇ ⁇ max ⁇ 460, 425 ⁇ ⁇ max ⁇ 450, 425 ⁇ ⁇ max ⁇ 440, 430 ⁇ ⁇ max ⁇ 460, 430 ⁇ ⁇ max ⁇ 450, or 430 ⁇ ⁇ max ⁇ 440
  • a decrease in emission intensity can be suppressed by satisfying the formula (ii).
  • the decrease in emission intensity as used herein means a decrease in emission intensity in the case where the light absorption layer is arranged on the wavelength conversion layer as compared with the case where the light absorption layer is not arranged.
  • the left side of formula (ii) is preferably 0.45 or less, more preferably 0.4 or less, and 0 . It may be 35 or less.
  • the left side of formula (ii) is usually 0.001 or more, and may be 0.005 or more, 0.01 or more, or 0.05 or more.
  • the wavelength conversion layer By providing the light absorption layer formed from Composition III on the wavelength conversion layer, leakage of primary light (for example, blue light) to the viewing side of the light absorption layer can be suppressed, and the light absorption layer can be formed on the wavelength conversion layer. can be suppressed from lowering the emission intensity when compared with the case where the light absorption layer is not arranged.
  • the amount of primary light transmitted through the wavelength conversion layer is small, by disposing a light absorption layer formed of composition III containing a first colorant on the wavelength conversion layer, the amount of primary light can be reduced. Even if the portion transmits the wavelength conversion layer, it is possible to suppress the leakage of the primary light to the viewing side and suppress the decrease in the emission intensity.
  • the wavelength conversion layer may have a light transmittance at a wavelength of 450 nm of 10% or more, further 15% or more, furthermore 20% or more.
  • the composition III preferably satisfies the above formulas (i) and (ii). It is preferred to satisfy formulas (i) and (ii).
  • the absorption spectrum of the light absorption layer can be measured by using a light absorption layer formed on a glass substrate as a measurement sample and using an ultraviolet-visible-near-infrared spectrophotometer equipped with an integrating sphere.
  • the absorption spectrum of composition III can be measured as the absorption spectrum of a composition layer formed by coating the composition on a glass substrate or the like.
  • the absorption spectrum of the first coloring agent can be measured as the absorption spectrum of a light absorbing layer containing only the first coloring agent as a coloring agent.
  • the first coloring agent is preferably a yellow coloring agent.
  • a yellow colorant may be a pigment or a dye.
  • a known pigment can be used as the pigment. Only one pigment may be used, or two or more pigments may be used in combination.
  • a known dye can be used as the dye. Only one dye may be used, or two or more dyes may be used in combination.
  • the yellow pigment that can be used as the first coloring agent is preferably selected from quinophthalone yellow pigments and azo yellow pigments, more preferably quinophthalone yellow pigments.
  • quinophthalone-based yellow pigments include C.I. I. Pigment Yellow 138, 231 and the like.
  • azo yellow pigment include C.I. I. Pigment Yellow 150 and the like.
  • Composition III may contain only the first coloring agent as a coloring agent, or may contain a second coloring agent other than the first coloring agent in addition to the first coloring agent.
  • the combination of the first coloring agent and the second coloring agent is represented by the above formulas (i) and (ii). ) is preferably satisfied.
  • the second coloring agent may be a pigment or a dye. Each of the pigment and the dye may be used alone or in combination of two or more.
  • the second colorant is preferably selected from green colorants and red colorants.
  • C.I. I. Green pigments such as Pigment Green 7, 36, 58, 59, 62, and 63 are included.
  • Other examples of green colorants are the following dyes.
  • C. I. C.I. I. solvent dyes C. I. acid green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109 and the like.
  • I. direct dyes C. I. Basic Green 1 and other C.I. I. basic dyes; C. I. C.I. I. modant dyes; C. I. C.I. I. vat dyes, etc.
  • red coloring agent As a red coloring agent, C.I. I. Pigment Red 9, 97, 105, 122, 123, 144, 149, 166, 168, 176, 177, 178, 179, 180, 190, 192, 209, 215, 216, 224, 242, 254, 255, 264, 265, 266, 268, 269, 273 and other red pigments.
  • Other examples of red colorants are the following dyes.
  • solvent dyes C. I.
  • I. acid dyes C. I. Direct Red 79, 82, 83, 84, 91, 92, 96, 97, 98, 99, 105, 106, 107, 172, 173, 176, 177, 179, 181, 182, 184, 204, 207, 211, 213, 218, 220, 221, 222, 232, 233, 234, 241, 243, 246, 250 and the like.
  • I. direct dyes C. I. C.I., such as Basic Red 1, 9, 10; I. basic dyes; C. I.
  • the colorant may be subjected to rosin treatment, surface treatment using a colorant derivative into which an acidic group or basic group is introduced, graft treatment to the surface of the colorant with a polymer compound, etc., sulfuric acid atomization method, or the like.
  • atomization treatment, washing treatment with an organic solvent or water for removing impurities, removal treatment of ionic impurities by an ion exchange method or the like, and the like may be performed. It is preferable that the particle size of the colorant is substantially uniform.
  • composition III contains a second colorant
  • the second colorant is preferably a green colorant when the wavelength conversion layer is a green-emitting layer, and the wavelength-converting layer is a red-emitting layer. Red colorants are sometimes preferred.
  • Each of the green coloring agent and the red coloring agent may be used alone, or two or more thereof may be used in combination.
  • the content of the colorant in composition III is, for example, 0.01% by mass or more and 99.99% by mass or less, preferably 0.1% by mass or more and 99.9% by mass, relative to the total solid content of composition III. % by mass or less, more preferably 1% by mass or more and 99% by mass or less, still more preferably 10% by mass or more and 90% by mass or less, even more preferably 15% by mass or more and 70% by mass or less, particularly preferably 20% by mass or more and 70% by mass % or less.
  • colorant is meant the first colorant when composition III contains only the first colorant as colorant, and when composition III contains the first colorant and the second colorant, the first colorant and the second colorant are combined. 2 colorants.
  • Composition III preferably contains a resin (C), a polymerizable compound (D) and a polymerization initiator (E) in addition to the colorant.
  • resin (C), the polymerizable compound (D) and the polymerization initiator (E) in the composition III the description of the composition I is referred to for matters other than the contents in the composition.
  • Composition III may further contain at least one selected from the group consisting of polymerization initiation aid (E1), antioxidant (F), leveling agent (H) and solvent (J).
  • polymerization initiation aid (E1), the antioxidant (F), the leveling agent (H) and the solvent (J) in the composition III the matters other than the content of these in the composition are described in the composition I Description is quoted.
  • the content of resin (C) in composition III is, for example, 0.00001% by mass or more and 99.99999% by mass or less, preferably 1% by mass or more and 99% by mass, relative to the total solid content of composition III. 1% to 97% by mass, more preferably 1% to 95% by mass, even more preferably 3% to 90% by mass, and particularly preferably 5% to 80% by mass. , most preferably 10% by mass or more and 70% by mass or less.
  • the content of the polymerizable compound (D) in composition III is, for example, 0.00001% by mass or more and 99.99999% or less, preferably 1% by mass or more and 99% by mass or less, relative to the total solid content of composition III. More preferably 1% by mass or more and 97% by mass or less, still more preferably 1% by mass or more and 95% by mass or less, still more preferably 1% by mass or more and 90% by mass or less, particularly preferably 2% by mass or more and 80% by mass or less, most It is preferably 3% by mass or more and 70% by mass or less.
  • the content of the polymerization initiator (E) in composition III is preferably 0.001% by mass or more and 60% by mass or less, more preferably 0% by mass, relative to the total amount of the resin (C) and the polymerizable compound (D). 01% by mass or more and 50% by mass or less.
  • the content of the polymerization initiation aid (E1) in the composition III is preferably 0.00001 with respect to the total amount of the resin (C) and the polymerizable compound (D). % to 60% by mass, more preferably 0.0001% to 50% by mass.
  • the content of the antioxidant (F) in the composition III is, for example, 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the resin (C), preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 7 parts by mass or more and 30 parts by mass or less.
  • the content of the leveling agent (H) in composition III is, for example, 0.001% by mass or more and 1.0% by mass or less, preferably 0.001% by mass or more and 1.0% by mass or less, relative to the total amount of composition III. 005 mass % or more and 0.75 mass % or less, more preferably 0.01 mass % or more and 0.5 mass % or less, and still more preferably 0.02 mass % or more and 0.5 mass % or less.
  • the content of the leveling agent (H) is within the above range, the flatness of the light absorption layer can be improved.
  • the solid content of Composition III is preferably 0.01% by mass or more and 100% by mass or less, more preferably 0.1% by mass or more and 99.9% by mass or less, and still more preferably 0% by mass, relative to the total amount of Composition III. .1 to 99% by mass, still more preferably 1 to 90% by mass, more preferably 1 to 80% by mass, particularly preferably 1 to 70% by mass, and extremely It is preferably 1% by mass or more and 60% by mass or less.
  • the content of solvent (J) in composition III is preferably 0% by mass or more and 99.99% by mass or less, more preferably 0.1% by mass or more and 99.9% by mass or less, relative to the total amount of composition III. , more preferably 1% by mass or more and 99.9% by mass or less, even more preferably 10% by mass or more and 99% by mass or less, still more preferably 20% by mass or more and 99% by mass or less, particularly preferably 30% by mass or more and 99% by mass Below, it is extremely preferably 40% by mass or more and 99% by mass or less.
  • Composition III may further contain additives known in the art such as polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, chain transfer agents, etc. .
  • composition III can be produced by a method including a step of mixing a colorant and optionally other ingredients.
  • the colorant is used in the form of a colorant dispersion obtained by previously mixing part or all of the solvent (J) and dispersing the colorant using a bead mill or the like until the average particle size of the colorant is about 0.2 ⁇ m or less. is preferred.
  • a dispersant and part or all of the resin (C) may be blended.
  • the dispersant the description of the dispersant described in the section of the light scattering agent (B) is cited.
  • the light-absorbing layer is formed from composition III.
  • a light absorbing layer is formed on the wavelength converting layer.
  • the light absorption layer is arranged, for example, on the light extraction direction side of the wavelength conversion layer.
  • the light absorption layer may be in contact with the wavelength conversion layer, or another layer may be interposed between the wavelength conversion layer and the light absorption layer.
  • Other layers include a protective layer (overcoat layer).
  • the light-absorbing layer can be formed on the wavelength-converting layer by a method including the step of applying composition III to a substrate and then drying it.
  • composition III is resin composition R4, which further comprises resin (C).
  • a light absorbing layer (resin film) formed from the resin composition R4 can be formed by applying the composition III to a substrate and then drying it.
  • composition III is curable composition R5, further comprising a polymerizable compound (D) and a polymerization initiator (E).
  • the curable composition R5 may further contain a resin (C).
  • the light absorbing layer formed from the curable composition R5 is a cured film.
  • the cured film can be obtained by coating the curable composition R5 on a substrate, drying it, and curing it by the action of light and/or heat.
  • One aspect of the curable composition R5 is a photocurable composition R6 containing a photopolymerizable compound and a photopolymerization initiator.
  • the photocurable composition R6 may further contain a resin (C).
  • the substrate on which the light absorption layer is formed is the wavelength conversion layer or a layer (eg, protective layer) formed on the wavelength conversion layer.
  • a photolithographic method, an inkjet method, a printing method, and the like can be given as methods for forming the light absorbing layer on the base material.
  • Examples of the printing method include a stencil printing method, a screen printing method, and printing coating using an applicator.
  • a patterned light absorption layer can be formed using the resin composition R4, the curable composition R5, and the photocurable composition R6.
  • the method may be the same as the above method of forming a patterned wavelength conversion layer using the resin composition R1, the curable composition R2, and the photocurable composition R3.
  • a patterned cured film (light absorbing layer) formed from the photocurable composition R6 can be formed on a substrate in the following manner, for example, using a photolithographic method. .
  • the photocurable composition R6 is coated on a substrate, and volatile components such as solvents are removed by heat drying (prebaking) and/or reduced pressure drying to obtain a composition layer.
  • the coating method includes a spin coating method, a slit coating method, a slit and spin coating method, and the like.
  • the temperature for heat drying is preferably 30°C or higher and 120°C or lower, more preferably 50°C or higher and 110°C or lower.
  • the heating time is preferably 10 seconds or more and 60 minutes or less, more preferably 30 seconds or more and 30 minutes or less.
  • a light source used for exposure is preferably a light source that emits light having a wavelength of 250 nm or more and 450 nm or less.
  • light of around 436 nm, around 408 nm, or around 365 nm may be selectively extracted from the light of this wavelength by a band-pass filter according to the absorption wavelength of the photopolymerization initiator.
  • Specific examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps.
  • the exposed composition layer is cured by polymerization of the photopolymerizable compound contained in the composition layer.
  • the unexposed portions of the composition layer are dissolved in the developer and removed to obtain a patterned cured film (light absorption layer).
  • the developer include aqueous solutions of alkaline compounds such as potassium hydroxide, sodium hydrogen carbonate, sodium carbonate, tetramethylammonium hydroxide, and organic solvents.
  • the concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.03% by mass or more and 5% by mass or less.
  • the organic solvent include those similar to the solvent (J) described above.
  • the developer may contain a surfactant.
  • the developing method may be any of a puddle method, a dipping method, a spray method, and the like. Further, the substrate may be tilted at any angle during development.
  • the heating temperature is preferably 150° C. or higher and 250° C. or lower, more preferably 160° C. or higher and 235° C. or lower.
  • the heating time is preferably 1 minute or more and 120 minutes or less, more preferably 10 minutes or more and 60 minutes or less.
  • the thickness of the light absorption layer is, for example, 0.1 ⁇ m or more and 30 ⁇ m or less, and is preferably 0.1 ⁇ m or more and 20 ⁇ m or less from the viewpoint of effectively suppressing leakage of primary light (blue light) to the viewing side of the light absorption layer. , more preferably 0.5 ⁇ m or more and 10 ⁇ m or less, still more preferably 0.5 ⁇ m or more and 6 ⁇ m or less.
  • the content of the colorant in the light absorbing layer is, for example, 0.01% by mass or more and 99.99% by mass or less, preferably 0.1% by mass or more and 99.9% by mass or less, more preferably 1% by mass or more and 99% by mass or less. % by mass or less, more preferably 10% by mass or more and 90% by mass or less, even more preferably 15% by mass or more and 70% by mass or less.
  • the wavelength range of light transmitted through the light absorption layer is preferably a green or red wavelength range.
  • the green wavelength range is, for example, a wavelength range of 495 nm or more and 585 nm or less.
  • the red wavelength range is, for example, a wavelength range included in the range from 585 nm to 780 nm.
  • the wavelength range of light absorbed by the light absorption layer is preferably a blue wavelength range, more preferably a wavelength range including 450 nm, for example, a wavelength range of 380 nm to 495 nm.
  • Composition III and the light absorbing layer have an average light transmittance of 98% or more in the wavelength range of 520 nm or more and 780 nm or less. When the average light transmittance is 98% or more, the emission intensity can be further increased.
  • a display device includes a primary light source and the laminate according to the present invention.
  • a display device is a device that irradiates a wavelength conversion layer with primary light from a primary light source to cause the wavelength conversion layer to emit light, and extracts the emitted light through a light absorption layer.
  • FIG. 5 is a schematic cross-sectional view showing an example of the display device according to the invention.
  • the display device shown in FIG. 5 includes the laminate shown in FIG.
  • the first wavelength conversion layer 11 arranged on the first region of the light source 40 and emitting, for example, red light, the first protective layer 21 arranged thereon, and the second region of the blue light source 40 arranged on the second region, for example It includes a second wavelength conversion layer 12 emitting green light and a second protective layer 22 disposed thereon.
  • the display device has a red light emitting region (ie, first region), a green light emitting region (ie, second region) and a blue light emitting region (ie, third region).
  • the display device has the blue light source, the wavelength conversion layer, and the protective layer in this order in the optical path of the light from the blue light source 40 .
  • the first wavelength conversion layer 11 and the second wavelength conversion layer 12 may be directly arranged on the blue light source 40, or the blue light source 40, the first wavelength conversion layer 11 and the second wavelength conversion layer 11 may be arranged in the optical path of the light from the blue light source 40. It may be placed on a light guide plate placed between the two-wavelength conversion layer 12 .
  • the display device may further include a transparent layer that transmits blue light or a layer that contains a light diffusing agent, which is arranged above the third region of the blue light source 40 .
  • the laminated body provided in the display device may have the light absorption layer 30 in the same manner as the laminated body shown in FIGS.
  • a third light absorption layer that transmits blue light and absorbs light other than blue light may be provided on the transparent layer that transmits blue light or the layer containing a light diffusing agent.
  • the blue light source 40 for example, a known light source such as a light emitting diode (LED) such as a blue light emitting diode, a laser, or an EL can be used.
  • the blue light source 40 is preferably a light source that emits light having a peak at 495 nm or less, more preferably a light source that emits light having a peak at 425 nm or more and 495 nm or less.
  • the display device may further include, for example, a light guide plate, a diffusion film (diffusion layer), a light reflection member (reflection film, etc.), a brightness enhancement member, a prism sheet, a barrier layer, and the like.
  • a light guide plate for example, a light guide plate, a diffusion film (diffusion layer), a light reflection member (reflection film, etc.), a brightness enhancement member, a prism sheet, a barrier layer, and the like.
  • any appropriate light guide plate is used as the light guide plate.
  • a light guide plate in which a lens pattern is formed on the back side and a light guide plate in which a prism shape or the like is formed on the back side and/or the viewing side is used so that light from the lateral direction can be deflected in the thickness direction.
  • the diffusion film is a film for diffusing primary light or light emitted from the wavelength conversion layer, and may be an amplification diffusion film or the like.
  • the light reflecting member is a member for reflecting primary light toward the wavelength conversion layer, and may be, for example, a reflecting mirror, a film of reflecting particles, a reflecting metal film, or a reflector.
  • a brightness enhancement member is a member for reflecting a portion of light back toward the direction in which the light was transmitted.
  • a prism sheet typically has a base portion and a prism portion.
  • the base portion may be omitted depending on the adjacent member.
  • the prism sheet can be attached to adjacent members via any appropriate adhesive layer (eg, adhesive layer, adhesive layer).
  • the prism sheet is configured by arranging a plurality of unit prisms convex on the opposite side (back side) of the viewing side. By arranging the prism sheet so that the convex portion faces the back side, the light passing through the prism sheet can be easily condensed.
  • the convex portions of the prism sheet are arranged facing the back side, compared with the case where the convex portions are arranged facing the viewing side, less light is reflected without entering the prism sheet, and the emission intensity is high. You can get a display.
  • the barrier layer is a layer that protects the wavelength conversion layer from water vapor in the outside air and oxygen in the atmosphere.
  • a display according to an embodiment includes both a protective layer and a barrier layer for protecting the wavelength converting layer from ambient water vapor and atmospheric oxygen.
  • the display device may include one or more media material layers on the optical path between adjacent elements (layers).
  • One or more media materials such as vacuum, air, gas, optical materials, adhesives, optical adhesives, glasses, polymers, solids, liquids, gels, curable materials, optical bonding materials, refractive index matching or refractive index mismatching material, refractive index gradient material, cladding or anti-cladding material, spacer, silica gel, brightness enhancing material, scattering or diffusing material, reflective or anti-reflective material, wavelength selective material, wavelength selective anti-reflective material or in the art Any suitable material may be included, including, but not limited to, other known suitable media.
  • the display device for example, one provided with a wavelength conversion material for an EL display or a liquid crystal display can be mentioned.
  • the display device is not limited to the example shown using FIG.
  • the wavelength conversion layer is arranged between the blue light source and the light guide plate along the end face (side surface) of the light guide plate to form a backlight that emits white light (on-edge type backlight), and the light absorption layer is placed on the light guide plate side.
  • a backlight (surface mounting method) in which a wavelength conversion layer is placed on a light guide plate, and light emitted from a blue light source placed on the end face (side surface) of the light guide plate irradiates the wavelength conversion layer through the light guide plate as white light.
  • the backlight is turned on, and the spectral radiance spectrum of the light emitted from the wavelength conversion layer or laminate is measured using the spectral radiance meter. From this spectrum, the emission at the maximum peak wavelength of the green emission peak. The intensity EI ( ⁇ W) was calculated.
  • the maximum peak wavelength of the green emission peak described above is the maximum peak wavelength of the green emission peak in the emission spectrum of the semiconductor particles (A) contained in the wavelength conversion layer, and was 530 nm. The full width at half maximum of the green emission peak was 42 nm.
  • the emission spectrum of the semiconductor particles (A) was measured using an absolute PL quantum yield measurement device ("C9920-02" manufactured by Hamamatsu Photonics, excitation light of 450 nm, room temperature, in the atmosphere), and the absorbance at a wavelength of 450 nm was 0.4. A dispersion of semiconductor particles (A) diluted to 10% was measured as a measurement sample.
  • a solution prepared by dissolving 9 parts of a polymerization initiator 2,2-azobis(2,4-dimethylvaleronitrile) in 40 parts of PGMEA was added dropwise over 5 hours. After the completion of dropping the initiator solution, the temperature was kept at 85° C. for 4 hours, and then cooled to room temperature to obtain a copolymer (resin (C1)) solution.
  • the resin (C1) solution had a solid content of 40% and a weight average molecular weight Mw of 11,500.
  • the temperature was kept at 85° C. for 4 hours and then cooled to room temperature to obtain a copolymer (resin (C2)) solution.
  • the resin (C2) solution had a solid content of 37% and a weight average molecular weight Mw of 10,600.
  • ⁇ Preparation Example 1 Preparation of semiconductor particle (A1) dispersion> A toluene dispersion a of semiconductor particles (A1) [green-emitting InP/ZnSeS quantum dots] containing oleic acid as an organic ligand (G1) was prepared. As described above, the maximum peak wavelength of the green emission peak of the quantum dots was 530 nm, and the full width at half maximum of the green emission peak was 42 nm.
  • composition ratio of the semiconductor particles (A1) and the organic ligand (G1) is the remaining amount when the mixture after removing toluene is heated to 550 ° C. at a temperature increase rate of 5 ° C./min by TG-DTA measurement. was measured, and the remaining amount was calculated as the weight of the organic ligand (G1).
  • composition (I) for forming wavelength conversion layer Each component shown in Table 2 was mixed with semiconductor particle (A1) dispersion liquid b to prepare composition (I) for forming a wavelength conversion layer.
  • the number of parts of components other than the solvent (J) indicates the solid content conversion value.
  • Light scattering agent (B1) 60 parts of titanium oxide particles, 10 parts of resin C1 (in terms of solid content), and a total of 30 parts of PGMEA are mixed, and the titanium oxide particles are sufficiently dispersed using a bead mill to prepare a composition. Used for the preparation of (I). The number of parts of the light scattering agent (B1) shown in Table 2 is the number of parts of the titanium oxide particles.
  • Polymerizable compound (D1) Carboxy group-containing polyfunctional (meth)acrylate (trade name “Aronix M-510” manufactured by Toagosei Co., Ltd.)
  • Solvent (J1) Propylene glycol monomethyl ether acetate (PGMEA)
  • Multifunctional polymerizable compound (K1) Carboxy group-containing polyfunctional (meth)acrylate (trade name “Aronix M-510” manufactured by Toagosei Co., Ltd.)
  • M1 2-ethylhexyl acrylate
  • M1 2-eth
  • Example 7 After applying the composition (I) for forming a wavelength conversion layer onto a 5 cm square glass substrate ("Eagle XG" manufactured by Corning) by a spin coating method so that the layer thickness after post-baking is 3 ⁇ m. , and 100° C. for 3 minutes to form a composition layer.
  • the substrate on which this composition layer is formed is irradiated with light at an exposure dose of 80 mJ/cm 2 (365 nm standard) in an air atmosphere using an exposure machine (“TME-150RSK” manufactured by Topcon Co., Ltd.).
  • TAE-150RSK manufactured by Topcon Co., Ltd.
  • the composition for forming a protective layer (II-1) was applied onto the wavelength conversion layer by a spin coating method so that the layer thickness after post-baking was 1 ⁇ m, and then pre-baked at 100° C. for 3 minutes. to form a composition layer.
  • a substrate having a composition layer formed on this wavelength conversion layer is exposed to an exposure amount of 100 mJ/cm 2 (365 nm) in an air atmosphere using an exposure machine (“TME-150RSK” manufactured by Topcon Co., Ltd.). Standard) and post-baking at 180° C. for 30 minutes to form a laminate of the wavelength conversion layer and the protective layer.
  • Emission intensity (emission intensity after lamination of the protective layer) EIa of the obtained laminate was measured, and the maintenance rate of the emission intensity EI before and after lamination of the protective layer was obtained according to the following formula.
  • Examples 8 to 12> A wavelength conversion layer and a protective A laminate was formed with layers, and the maintenance rate of the emission intensity EI before and after lamination of the protective layer was determined. Table 4 shows the results.
  • Example 3 A wavelength conversion layer was formed on a glass substrate in the same manner as in Example 7, and the emission intensity of the wavelength conversion layer (the emission intensity before the protective layer forming step) EIb was measured. Next, without applying the composition for forming a protective layer, baking was performed at 100° C. for 3 minutes, and then using an exposure machine (“TME-150RSK” manufactured by Topcon Corporation) in an air atmosphere. It was irradiated with light at an exposure amount of 100 mJ/cm 2 (365 nm standard), and then baked at 180° C. for 30 minutes. In this way, a wavelength conversion layer was obtained which had undergone the same process as the protective layer forming process, except that the protective layer forming composition was not applied.
  • TAE-150RSK an exposure machine
  • the emission intensity (emission intensity after the protective layer forming step) EIa of the obtained laminate was measured, and the maintenance rate of the emission intensity EI before and after the protective layer forming step was obtained according to the following formula.

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Abstract

L'invention concerne une composition utilisée pour former une couche de protection positionnée sur une couche de conversion de longueur d'onde contenant des particules semi-conductrices inorganiques luminescentes, ladite composition ne comprenant pas de particules semi-conductrices inorganiques luminescentes, mais comprenant un composé polymérisable polyfonctionnel ayant deux liaisons éthyléniquement insaturées ou plus dans une molécule, ou un polymère associé.
PCT/JP2023/001665 2022-02-17 2023-01-20 Composition, couche de protection, stratifié et dispositif d'affichage WO2023157559A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017120358A (ja) * 2015-09-30 2017-07-06 大日本印刷株式会社 光波長変換シート、これを備えるバックライト装置、画像表示装置、および光波長変換シートの製造方法
JP2020506442A (ja) * 2017-02-14 2020-02-27 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． カラーフィルタ、及び画像表示装置
JP2021081607A (ja) * 2019-11-20 2021-05-27 東洋インキＳｃホールディングス株式会社 光波長変換部材及び発光デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017120358A (ja) * 2015-09-30 2017-07-06 大日本印刷株式会社 光波長変換シート、これを備えるバックライト装置、画像表示装置、および光波長変換シートの製造方法
JP2020506442A (ja) * 2017-02-14 2020-02-27 東友ファインケム株式会社Ｄｏｎｇｗｏｏ Ｆｉｎｅ−Ｃｈｅｍ Ｃｏ．， Ｌｔｄ． カラーフィルタ、及び画像表示装置
JP2021081607A (ja) * 2019-11-20 2021-05-27 東洋インキＳｃホールディングス株式会社 光波長変換部材及び発光デバイス

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