WO2023157175A1 - Electric motor and air-conditioning device - Google Patents

Electric motor and air-conditioning device Download PDF

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Publication number
WO2023157175A1
WO2023157175A1 PCT/JP2022/006374 JP2022006374W WO2023157175A1 WO 2023157175 A1 WO2023157175 A1 WO 2023157175A1 JP 2022006374 W JP2022006374 W JP 2022006374W WO 2023157175 A1 WO2023157175 A1 WO 2023157175A1
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WO
WIPO (PCT)
Prior art keywords
electric motor
metal plate
substrate
built
motor according
Prior art date
Application number
PCT/JP2022/006374
Other languages
French (fr)
Japanese (ja)
Inventor
隼一郎 尾屋
洋樹 麻生
諒伍 ▲高▼橋
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2024500811A priority Critical patent/JPWO2023157175A1/ja
Priority to PCT/JP2022/006374 priority patent/WO2023157175A1/en
Publication of WO2023157175A1 publication Critical patent/WO2023157175A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to electric motors and air conditioners.
  • FIG. 1 is a cross-sectional view of a conventional electric motor.
  • a conventional electric motor includes a built-in substrate 11 on which a heat radiation substrate pattern 2A is formed, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power IC (Integrated Circuit) 80.
  • Patent Document 1 the technology disclosed in Patent Document 1 is insufficient for the above requirements.
  • the present disclosure has been made in view of the above, and aims to obtain an electric motor capable of improving heat dissipation performance.
  • the electric motor according to the present disclosure incorporates a substrate including an inverter circuit, the substrate is integrally molded with resin, and the solid pattern of the substrate is reflowed.
  • the high voltage part has a metal plate soldered to it, and the pattern to which the metal plate is soldered is the high voltage part.
  • the electric motor according to the present disclosure has the effect of improving heat dissipation performance.
  • FIG. 4 is a diagram showing a processor when a control unit of the electric motor according to Embodiment 1 is realized by the processor;
  • FIG. 4 is a diagram showing a processing circuit when the control unit of the electric motor according to Embodiment 1 is realized by the processing circuit;
  • FIG. 12 is a cross-sectional view of electric motor 1 according to the first embodiment.
  • This electric motor 1 is a brushless DC (Direct Current) motor.
  • the electric motor 1 has an insulator 23 integrally formed with the stator core 21 in order to insulate the stator core 21 and windings 22 which are formed by laminating electromagnetic steel sheets. Winding 22 is wound around each slot of stator core 21 integrally molded with insulator 23 to form stator 20 .
  • Winding 22 is made of copper, aluminum, or the like.
  • a built-in substrate 11 having a circuit including a power IC, a microcomputer, and a magnetic sensor (such as a Hall IC) for detecting the position of the rotor 30 is positioned between the output-side bearing 33 and the stator 20 to rotate the rotation shaft 31. It is arranged perpendicular to the axial direction and fixed to the insulator 23 . Also, the power IC of the built-in substrate 11 and the winding 22 are connected via a winding terminal.
  • the built-in substrate 11 is provided with a lead outlet portion 14 having a lead wire 13 for connection with a host system (for example, a substrate on the unit side of an air conditioner). Passive components such as operational amplifiers, comparators, regulators, diodes, resistors, capacitors, inductors, and fuses are arranged on the built-in substrate 11 .
  • a power IC consists of 6 power transistors, a gate drive circuit, a protection circuit, etc. (also called IPM: Intelligent Power Module). In some cases, six power transistors are individually configured.
  • the gate drive circuit may be composed of one IC or may be composed of three separate ICs for three phases.
  • the gate drive circuit and control unit are composed of a single IC.
  • the control unit may be composed of one dedicated IC (control IC) or a microcomputer.
  • six power transistors, a gate drive circuit, a protection circuit, and a control section are composed of one IC.
  • a power transistor is composed of a superjunction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), a planar MOSFET, and an IGBT (Insulated Gate Bipolar Transistor).
  • MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
  • IGBT Insulated Gate Bipolar Transistor
  • the rotor magnetic flux position is detected by the magnetic pole sensor, but the rotor magnetic pole position may be estimated from the current flowing through the winding 22 and the voltage applied and generated to the winding 22 and controlled (sensorless control).
  • the signal of the shunt resistor and current sensor may be amplified by an operational amplifier or the like.
  • a comparator may also be used to generate a signal to the control unit for overcurrent protection from this current signal.
  • the voltage that drives the gate of the power transistor e.g. 15V
  • the microcomputer power supply voltage e.g. 5V
  • a regulator For example, a 15V power supply is supplied from the outside, and a regulator generates a 5V power supply.
  • This regulator may be incorporated in a gate drive circuit or power IC.
  • the magnetic sensor 50 has two types of output signals: a digital type (hereinafter referred to as Hall IC) and an analog type (Hall element).
  • the Hall IC further includes the following methods. ⁇ The sensor part and the amplifier part are composed of separate semiconductor chips, the sensor part is composed of a semiconductor other than silicon, and the amplifier part is composed of silicon. (hereinafter referred to as non-silicon Hall IC) ⁇ The sensor part and amplifier part are composed of one silicon semiconductor chip. Since the non-silicon Hall IC contains two chips, the center position of the sensor is arranged at a position different from the center of the IC body. A semiconductor such as indium antimonide (InSb) is used for the sensor portion of the non-silicon Hall IC.
  • These non-silicon semiconductors have advantages over silicon semiconductors, such as improved sensitivity and reduced offset due to stress strain.
  • the magnetic pole position is estimated from the current value detected by the current detection resistor, the current detection transformer, or the like, and the control is performed.
  • a signal detected by a current detection resistor, a current detection transformer, or the like may be amplified using an operational amplifier or the like, if necessary.
  • the overcurrent detection unit monitors the voltage of the overcurrent detection resistor, and turns off the power transistor when the voltage reaches a certain level or higher to realize overcurrent protection.
  • the overcurrent detection unit may be built in the control unit or built in the gate drive circuit.
  • a brushless DC motor obtains rotational power by switching six (in the case of three phases) power transistors in a power IC at appropriate timings according to the magnetic pole position of a rotor magnet. This switching signal is generated by the controller. The principle of this operation is shown below. Estimate the magnetic pole position of the rotor 30 from the magnetic sensor 50 or the current value. - The power transistor is switched according to the magnetic pole position of the rotor 30 and the speed command signal output from the system (for example, the board on the unit side).
  • the overcurrent detection unit (control unit or inside the power IC) realizes overcurrent protection by forcibly turning off the power transistor when the voltage across the overcurrent detection resistor exceeds a certain voltage. Overheat protection is realized by forcibly turning off the power transistor in response to a signal from the temperature sensitive element.
  • Energization methods include 120° energization, 150° energization, and sine wave energization.
  • the molded stator 10 is formed by integrally molding the stator 20 and the built-in substrate 11, and is provided with a concave portion formed to accommodate the rotor 30 inside. In some cases, the stator 20 and the built-in substrate 11 are integrally molded separately.
  • a metal plate is attached by soldering to the heat dissipation pattern (solid pattern) connected to the heat dissipation tab of the power transistor, IPM, and power IC (hereinafter referred to as the power transistor, etc.). Since the metal plate can be automatically mounted by reflow in the same way as other surface-mounted parts, it can be attached at a low processing cost.
  • the metal plate may be a non-solderable metal such as aluminum. In some cases, a coating such as plating is applied to make it solderable. If the metal plate is aluminum, it is plated with nickel (Ni) and tin (Sn). For that matter, if the metal plate is a non-solderable metal, the solderable portions of the metal plate may be plated and coated to allow soldering.
  • the metal plate plays a role like a heat sink and can diffuse heat widely, improving heat dissipation. Disposing a metal plate with a larger volume improves heat dissipation.
  • the metal plate on the anti-stator side of the substrate improves heat dissipation, but due to restrictions such as substrate area, it may be necessary to place power transistors, etc., on the stator side.
  • the pattern connected to the heat dissipation tab is connected to the heat dissipation pattern to which the metal plate is soldered through the through hole.
  • Some power transistors do not have heat dissipation tabs. In that case, a heat radiation pattern is provided at the lower part of the package, which is exposed to high temperature, and a metal plate is soldered to the heat radiation pattern connected thereto.
  • the metal plate may be divided into multiple parts and arranged. It may be better to divide the metal plate than to dispose a large metal plate so that the resin can pass through during integral molding, resulting in better molding. Furthermore, by dividing the metal plate, thick and thin portions of the resin are formed on the upper part of the built-in substrate 11, thereby minimizing the deterioration of the heat radiation performance and improving the fluidity during molding of the resin, thereby improving the productivity. can be improved.
  • the metal plate may have a shape in which the cross-sectional area of the part away from the substrate is larger than the cross-sectional area of the soldered part. In that case, the metal plate and the different voltage pattern are close to each other, but since the substrate is integrally molded with resin, the metal plate and the different voltage pattern are insulated by the resin.
  • a metal plate having a larger volume can be arranged in such a shape while there are restrictions on the substrate area and height, and heat dissipation is further improved.
  • a heat sink may be provided on the opposite side of the board from the stator.
  • the heat sink is integrally molded with resin.
  • resin is placed between the metal plate and the heat sink to maintain insulation between the heat sink (metal such as aluminum) and the metal plate.
  • the heat sink may be attached to the molded stator 10 via a heat dissipation sheet or heat dissipation silicon instead of being integrally molded.
  • the rotor 30 has a magnet composed of a permanent magnet arranged inside the molded stator 10 and arranged on the outer peripheral side of the rotating shaft 31 so as to face the stator core 21 .
  • the magnet is manufactured by injection molding a ferrite magnet or a bond magnet composed of a mixture of a rare earth magnet (samarium iron nitrogen, neodymium, etc.) and a thermoplastic resin material. A magnet is incorporated in the mold for injection molding, and molding is performed while applying orientation.
  • the outer diameter of the built-in substrate 11 on the magnetic sensor 50 side is smaller than the other outer diameter (main magnet portion) (sensor magnet portion), and the magnetic flux flows into the magnetic sensor 50 mounted on the built-in substrate 11. It's getting easier.
  • the magnetic sensor 50 is arranged at a position far from the windings 22 , that is, at a position close to the rotating shaft 31 in order to minimize the influence of the magnetic flux generated from the windings 22 of the stator 20 .
  • the main magnet part and the sensor magnet part are composed of one magnet, but they may be composed of separate magnets.
  • An output-side bearing 33 is provided at one end of the rotating shaft 31 to support it rotatably.
  • a non-output side bearing 34 is provided at the other end of the rotary shaft 31 to support it rotatably.
  • the conductive bracket is fitted into the inner peripheral portion of the molded stator 10 so as to block the opening of the concave portion of the molded stator 10, and the outer ring of the anti-output side bearing 34 is fitted inside.
  • FIG. 12 also shows the mold resin 12, the rotor insulating portion 32, the rotor magnet 40, the bracket 60 and the press-fitting portion 61.
  • FIG. 2 is a cross-sectional view of the electric motor according to Embodiment 1.
  • the electric motor shown in FIG. 2 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 and a metal plate 3 .
  • FIG. 3 is a cross-sectional view of the electric motor according to Embodiment 1.
  • the electric motor shown in FIG. 3 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 and a metal plate 3 .
  • FIG. 3 also shows the path of the resin.
  • FIG. 4 is a cross-sectional view of the electric motor according to Embodiment 1.
  • the electric motor shown in FIG. 4 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 , a metal plate (modification 1) 3A, and a substrate pattern 2 .
  • FIG. 4 also shows the phrase "it is OK because it is close to other patterns with different voltages but there is resin".
  • FIG. 5 is a cross-sectional view of the electric motor according to Embodiment 1.
  • the electric motor shown in FIG. 5 includes a built-in board 11 on which a heat radiation board pattern 2A is formed, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 , a metal plate 3 and a heat sink 6 .
  • FIG. 5 also shows the phrase "there is resin between the heat sink (metal) and the metal plate to insulate".
  • FIG. 6 is a built-in board circuit diagram of the electric motor according to the first embodiment.
  • FIG. 6 shows a control unit 70 connected to ground 79, a power IC 80 connected to control unit 70, a winding 22 connected to power IC 80, a magnetic sensor 50, and one of the control unit
  • An overcurrent detection resistor 75 connected to 70 and power IC 80 and the other to ground 79, a high voltage power supply 77, and a low voltage power supply 78 are shown.
  • the control unit 70 receives a speed command signal (system->electric motor) and transmits a rotation speed signal (electric motor->system).
  • the control unit 70 is connected to a low voltage power supply 78 .
  • the power IC 80 has a power transistor 81 , a gate drive circuit 82 and a protection circuit 83 .
  • Gate drive circuit 82 is connected to control section 70 , high voltage power supply 77 , low voltage power supply 78 , ground 79 and power transistor 81 .
  • One end of the protection circuit or the like 83 is connected to the gate drive circuit 82, another end of the protection circuit or the like 83 is connected to ground 79, and yet another end of the protection circuit or the like 83 is connected to ground 79.
  • the end is connected to wiring that connects the control unit 70 and the overcurrent detection resistor 75 .
  • An overcurrent detection signal flows through wiring connecting the control unit 70 and the overcurrent detection resistor 75 .
  • Power transistors 81 include a U-phase upper arm power transistor 81A, a V-phase upper arm power transistor 81B, a W-phase upper arm power transistor 81C, a U-phase lower arm power transistor 81D, a V-phase lower arm power transistor 81E and a W-phase lower arm power transistor. It has a transistor 81F. Also shown in FIG. 6 are “U” for U phase, “V” for V phase and "W” for W phase. Winding 22 has a U-phase winding 22U, a V-phase winding 22V and a W-phase winding 22W.
  • FIG. 7 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1.
  • a heat dissipation board pattern 2A is formed on each of the two planes of the built-in board 11 .
  • a plurality of through holes 4 are formed inside the built-in substrate 11 .
  • a metal plate 3 is arranged on one plane of the built-in substrate 11 .
  • a power transistor 81 and a heat dissipation tab terminal 81T are arranged on the other plane of the built-in substrate 11 .
  • the heat radiation tab terminal 81T is in contact with the heat radiation substrate pattern 2A on the other plane side of the built-in substrate 11 .
  • a part of the power transistor 81 is positioned on a plane other than the built-in substrate 11 side of the two planes of the heat radiation tab terminal 81T. Another part of the power transistor 81 is in contact with the other plane of the built-in substrate 11 and the heat dissipation substrate pattern 2A on the other plane side of the built-in substrate 11 .
  • FIG. 8 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1.
  • a heat radiation board pattern 2A is formed on each of the two planes of the built-in board 11 .
  • a plurality of through holes 4 are formed inside the built-in substrate 11 .
  • a metal plate 3 is arranged on one plane of the built-in substrate 11 .
  • a power IC (without heat dissipation tab) 80A is arranged on the other plane of the built-in substrate 11 .
  • FIG. 9 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1.
  • a substrate pattern 2A for heat dissipation is formed on one of the two planes of the built-in substrate 11.
  • a metal plate 3 As shown in FIG. A metal plate 3, a power transistor 81, and a heat dissipation tab terminal 81T are arranged on the heat dissipation substrate pattern 2A.
  • a part of the power transistor 81 is positioned on a plane other than the heat radiation substrate pattern 2A side of the two planes of the heat radiation tab terminal 81T. Another part of the power transistor 81 is in contact with one of the two planes of the built-in substrate 11 and the heat dissipation substrate pattern 2A.
  • FIG. 10 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1.
  • a substrate pattern 2A for heat radiation is formed on one of the two planes of the built-in substrate 11.
  • a metal plate 3 and a power IC (without a heat radiation tab) 80A are arranged on the heat radiation substrate pattern 2A.
  • FIG. 11 is a schematic diagram of a built-in substrate of the electric motor according to Embodiment 1.
  • FIG. A rotary shaft through-hole 35 is formed in the central portion of the disk-shaped internal substrate 11 shown in FIG. 11 .
  • a metal plate soldering portion 5 to which a metal plate (modification 1) 3A is attached is positioned on one of the two planes of the built-in substrate 11 .
  • the metal plate (modification 1) 3A is attached to the metal plate soldering portion 5 .
  • the electric motor according to Embodiment 1 will be further described below.
  • the electric motor according to Embodiment 1 incorporates a substrate including an inverter circuit, and the substrate is integrally molded with resin.
  • the electric motor according to the first embodiment has a metal plate soldered to the solid pattern of the substrate by reflow.
  • the pattern for soldering the metal plate is the high voltage part.
  • the electric motor according to Embodiment 1 can improve heat dissipation performance. Since the metal plate can be solder-mounted by reflow in the same manner as the other surface-mounted parts, the processing cost of the electric motor according to the first embodiment is low.
  • the metal plate is treated as high voltage, but since it is molded with resin, there is no problem with the insulation distance.
  • Embodiment 2 An air conditioner (air conditioner) according to Embodiment 2 will be described.
  • An air conditioner includes an indoor unit and an outdoor unit connected to the indoor unit.
  • the indoor unit is equipped with an indoor unit fan
  • the outdoor unit is equipped with an outdoor unit fan.
  • the outdoor unit fan and the indoor unit fan each incorporate the electric motor described in the first embodiment as a drive source. That is, the air conditioner according to the second embodiment is equipped with the electric motor described in the first embodiment.
  • FIG. 13 is a schematic diagram of an air conditioner (air conditioner) 200 according to the second embodiment.
  • the air conditioner 200 has an indoor unit 210 on which the electric motor 1 and the indoor unit substrate 211 are mounted, and an outdoor unit 220 on which the outdoor unit blower 223 is mounted.
  • electric motors can also be used by being mounted on, for example, ventilation fans, home appliances, and machine tools.
  • FIG. 14 is a diagram showing the processor 91 when the controller 70 of the electric motor according to Embodiment 1 is realized by the processor 91.
  • the functions of the control unit 70 may be realized by the processor 91 executing programs stored in the memory 92 .
  • the processor 91 is a CPU (Central Processing Unit), processing device, arithmetic device, microprocessor, or DSP (Digital Signal Processor).
  • Memory 92 is also shown in FIG.
  • control unit 70 When the function of the control unit 70 is implemented by the processor 91, the function is implemented by the processor 91 and software, firmware, or a combination of software and firmware. Software or firmware is written as a program and stored in memory 92 .
  • the processor 91 implements the functions of the control unit 70 by reading and executing programs stored in the memory 92 .
  • the motor has a memory 92 for storing programs that result in the execution of the steps performed by the control unit 70. It can be said that the program stored in the memory 92 causes the computer to execute the controller 70 .
  • the memory 92 is non-volatile such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), EEPROM (registered trademark) (Electrically Erasable Programmable Read-Only Memory). Or a volatile semiconductor memory, a magnetic disk, a flexible disk, an optical disk, a compact disk, a mini disk, a DVD (Digital Versatile Disk), or the like.
  • FIG. 15 is a diagram showing the processing circuit 93 when the control unit 70 of the electric motor according to Embodiment 1 is implemented by the processing circuit 93. As shown in FIG. That is, the control unit 70 may be implemented by the processing circuit 93 .
  • the processing circuit 93 is dedicated hardware.
  • the processing circuit 93 is, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination thereof. is.
  • a part of the control unit 70 may be realized by dedicated hardware separate from the rest.
  • control unit 70 part of the functions may be implemented by software or firmware, and the rest of the functions may be implemented by dedicated hardware. Thus, multiple functions of the control unit 70 can be realized by hardware, software, firmware, or a combination thereof.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)

Abstract

This electric motor has an integrated circuit board (11) containing an inverter circuit, and the integrated circuit board (11) is integrally moulded using resin. The electric motor has a metal plate (3) that is reflow-soldered to a solid pattern of the integrated circuit board (11). The pattern to which the metal plate (3) is soldered is a high-voltage part.

Description

電動機および空気調和機electric motors and air conditioners
　本開示は、電動機および空気調和機に関する。 The present disclosure relates to electric motors and air conditioners.
　近年、空気調和機の省エネルギ化、暖房能力向上のため、空気調和機のファンモータ（ファン用電動機）の高出力化が求められている。また、風路の確保のためファンモータの小型化も求められる。これにより、内蔵インバータ基板の温度上昇が課題となっている。 In recent years, in order to save energy and improve heating capacity of air conditioners, there has been a demand for higher power fan motors (fan motors) for air conditioners. In addition, miniaturization of the fan motor is required in order to secure an air passage. As a result, the temperature rise of the built-in inverter board becomes a problem.
　特許文献１では、基板の放熱パターンにて放熱性向上を実現している。 In Patent Document 1, the heat dissipation pattern of the board realizes improved heat dissipation.
　図１は、従来の電動機の断面図である。従来の電動機は、放熱用基板パターン２Ａが形成されている内蔵基板１１と、モールド樹脂１２と、固定子鉄心２１と、巻線２２と、回転軸３１と、ロータマグネット４０と、パワーＩＣ（Integrated　Circuit）８０とを有する。 FIG. 1 is a cross-sectional view of a conventional electric motor. A conventional electric motor includes a built-in substrate 11 on which a heat radiation substrate pattern 2A is formed, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power IC (Integrated Circuit) 80.
国際公開第２０１２／０７７２４６号WO2012/077246
　しかしながら、特許文献１が開示している技術では、上記の要求には不十分である。 However, the technology disclosed in Patent Document 1 is insufficient for the above requirements.
　本開示は、上記に鑑みてなされたものであって、放熱性能を向上させることができる電動機を得ることを目的とする。 The present disclosure has been made in view of the above, and aims to obtain an electric motor capable of improving heat dissipation performance.
　上述した課題を解決し、目的を達成するために、本開示に係る電動機は、インバータ回路を含む基板を内蔵しており、基板は、樹脂にて一体成型されており、基板のベタパターンにリフローにてはんだ付けされた金属板を有し、金属板をはんだ付けするパターンが高電圧部である。 In order to solve the above-described problems and achieve the object, the electric motor according to the present disclosure incorporates a substrate including an inverter circuit, the substrate is integrally molded with resin, and the solid pattern of the substrate is reflowed. The high voltage part has a metal plate soldered to it, and the pattern to which the metal plate is soldered is the high voltage part.
　本開示に係る電動機は、放熱性能を向上させることができるという効果を奏する。 The electric motor according to the present disclosure has the effect of improving heat dissipation performance.
従来の電動機の断面図Cross-sectional view of a conventional electric motor 実施の形態１に係る電動機の断面図Sectional view of the electric motor according to Embodiment 1 実施の形態１に係る電動機の断面図Sectional view of the electric motor according to Embodiment 1 実施の形態１に係る電動機の断面図Sectional view of the electric motor according to Embodiment 1 実施の形態１に係る電動機の断面図Sectional view of the electric motor according to Embodiment 1 実施の形態１に係る電動機の内蔵基板回路図Internal substrate circuit diagram of the electric motor according to the first embodiment 実施の形態１に係る電動機の内蔵基板断面図Sectional view of built-in substrate of electric motor according to Embodiment 1 実施の形態１に係る電動機の内蔵基板断面図Sectional view of built-in substrate of electric motor according to Embodiment 1 実施の形態１に係る電動機の内蔵基板断面図Sectional view of built-in substrate of electric motor according to Embodiment 1 実施の形態１に係る電動機の内蔵基板断面図Sectional view of built-in substrate of electric motor according to Embodiment 1 実施の形態１に係る電動機の内蔵基板模式図Schematic diagram of built-in substrate of electric motor according to Embodiment 1 実施の形態１に係る電動機の断面図Sectional view of the electric motor according to Embodiment 1 実施の形態２に係る空気調和機の模式図Schematic diagram of an air conditioner according to Embodiment 2 実施の形態１に係る電動機が有する制御部がプロセッサによって実現される場合のプロセッサを示す図FIG. 4 is a diagram showing a processor when a control unit of the electric motor according to Embodiment 1 is realized by the processor; 実施の形態１に係る電動機が有する制御部が処理回路によって実現される場合の処理回路を示す図FIG. 4 is a diagram showing a processing circuit when the control unit of the electric motor according to Embodiment 1 is realized by the processing circuit;
　以下に、実施の形態に係る電動機および空気調和機を図面に基づいて詳細に説明する。 The electric motor and air conditioner according to the embodiment will be described in detail below based on the drawings.
実施の形態１．
（構成）
　実施の形態１に係る電動機について説明する。図１２は、実施の形態１に係る電動機１の断面図である。
　この電動機１はブラシレスＤＣ（Direct　Current）モータである。
　電動機１は、電磁鋼板を積層することによって構成される固定子鉄心２１と巻線２２を絶縁するため、固定子鉄心２１と一体成型されたインシュレータ２３を有する。インシュレータ２３と一体成型された固定子鉄心２１の各スロットに巻線２２が巻きつけられ、固定子２０が構成される。巻線２２は、銅またはアルミなどで構成される。パワーＩＣと、マイクロコンピュータと、回転子３０の位置を検知する磁気センサ（ホールＩＣなど）を含む回路を備える内蔵基板１１は、出力側軸受３３と固定子２０との間にて回転軸３１の軸線方向に対して垂直に配置され、インシュレータ２３に固定される。また、内蔵基板１１のパワーＩＣと巻線２２は、巻線端子を介して接続される。内蔵基板１１には、上位システム（例えば、エアーコンディショナのユニット側の基板）と接続するリード線１３を有するリード口出し部１４が配置される。内蔵基板１１には、オペアンプ、コンパレータ、レギュレータ、ダイオード、抵抗、コンデンサ、インダクタ、ヒューズなどの受動部品が配置される。 Embodiment 1.
(composition)
An electric motor according to Embodiment 1 will be described. FIG. 12 is a cross-sectional view of electric motor 1 according to the first embodiment.
This electric motor 1 is a brushless DC (Direct Current) motor.
The electric motor 1 has an insulator 23 integrally formed with the stator core 21 in order to insulate the stator core 21 and windings 22 which are formed by laminating electromagnetic steel sheets. Winding 22 is wound around each slot of stator core 21 integrally molded with insulator 23 to form stator 20 . Winding 22 is made of copper, aluminum, or the like. A built-in substrate 11 having a circuit including a power IC, a microcomputer, and a magnetic sensor (such as a Hall IC) for detecting the position of the rotor 30 is positioned between the output-side bearing 33 and the stator 20 to rotate the rotation shaft 31. It is arranged perpendicular to the axial direction and fixed to the insulator 23 . Also, the power IC of the built-in substrate 11 and the winding 22 are connected via a winding terminal. The built-in substrate 11 is provided with a lead outlet portion 14 having a lead wire 13 for connection with a host system (for example, a substrate on the unit side of an air conditioner). Passive components such as operational amplifiers, comparators, regulators, diodes, resistors, capacitors, inductors, and fuses are arranged on the built-in substrate 11 .
　パワーＩＣは、パワートランジスタ６個、ゲートドライブ回路、保護回路などで構成される（ＩＰＭ：インテリジェント・パワー・モジュールとも呼ぶ）。パワートランジスタが６個個別に構成される場合がある。このときゲートドライブ回路は一つのＩＣで構成される場合と三相別々のＩＣ３個で構成される場合もある。 A power IC consists of 6 power transistors, a gate drive circuit, a protection circuit, etc. (also called IPM: Intelligent Power Module). In some cases, six power transistors are individually configured. At this time, the gate drive circuit may be composed of one IC or may be composed of three separate ICs for three phases.
　ゲートドライブ回路と制御部が一つのＩＣで構成される場合もある。また、制御部は一つの専用ＩＣ（制御ＩＣ）、または、マイクロコンピュータなどで構成される場合がある。 In some cases, the gate drive circuit and control unit are composed of a single IC. Also, the control unit may be composed of one dedicated IC (control IC) or a microcomputer.
　パワートランジスタ６個、ゲートドライブ回路、保護回路、制御部が一つのＩＣで構成される場合もある。 In some cases, six power transistors, a gate drive circuit, a protection circuit, and a control section are composed of one IC.
　パワートランジスタは、スーパージャンクションＭＯＳＦＥＴ（Metal-Oxide-Semiconductor　Field-Effect　Transistor）、プレーナＭＯＳＦＥＴ、および、ＩＧＢＴ（Insulated　Gate　Bipolar　Transistor）などで構成される。 A power transistor is composed of a superjunction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), a planar MOSFET, and an IGBT (Insulated Gate Bipolar Transistor).
　パワートランジスタには大きな電流が流れるので、発熱が多く放熱が問題となる場合がある。 Because a large amount of current flows through the power transistor, it generates a lot of heat and heat dissipation can be a problem.
　前記では、ロータ磁束位置を磁極センサにて検出しているが、巻線２２に流れる電流、巻線２２に印加および発生する電圧よりロータ磁極位置を推測し制御（センサレス制御）する場合もある。電流検出のため、シャント抵抗、および、電流センサの信号をオペアンプなどで増幅する場合がある。また、この電流信号から過電流保護のための制御部への信号を生成するためコンパレータを用いる場合がある。 In the above description, the rotor magnetic flux position is detected by the magnetic pole sensor, but the rotor magnetic pole position may be estimated from the current flowing through the winding 22 and the voltage applied and generated to the winding 22 and controlled (sensorless control). For current detection, the signal of the shunt resistor and current sensor may be amplified by an operational amplifier or the like. A comparator may also be used to generate a signal to the control unit for overcurrent protection from this current signal.
　パワートランジスタのゲートを駆動する電圧（例えば、１５Ｖ）とマイクロコンピュータ電源電圧（例えば、５Ｖ）が異なる場合があるので、その場合、外部から供給される一つの電源からもう一つの電源を生成するため、レギュレータを用いる。例えば、外部から１５Ｖ電源が供給され、レギュレータで５Ｖ電源を生成する。このレギュレータはゲートドライブ回路、または、パワーＩＣに内蔵される場合もある。 Since the voltage that drives the gate of the power transistor (e.g. 15V) and the microcomputer power supply voltage (e.g. 5V) may differ, in that case, to generate another power supply from one power supply supplied from the outside , using a regulator. For example, a 15V power supply is supplied from the outside, and a regulator generates a 5V power supply. This regulator may be incorporated in a gate drive circuit or power IC.
　磁気センサ５０は、出力信号がデジタルのもの（以下、ホールＩＣ）とアナログのもの（ホール素子）の２つの方式がある。ホールＩＣには更に以下の方式がある。
・センサ部と増幅部が別々の半導体チップで構成され、センサ部はシリコン以外の半導体で構成され、増幅部はシリコンで構成される。（以下、非シリコン型ホールＩＣ）
・センサ部と増幅部が一つのシリコン半導体チップで構成される。
　非シリコン型ホールＩＣは、２つのチップが内蔵されるため、センサ中心位置がＩＣボディの中心と異なった位置に配置される。非シリコン型ホールＩＣのセンサ部は、アンチモン化インジウム（ＩｎＳｂ）などの半導体が用いられる。これらの非シリコン半導体には、シリコン半導体と比べ、感度向上、応力歪みによるオフセットが小さいなどの長所がある。 The magnetic sensor 50 has two types of output signals: a digital type (hereinafter referred to as Hall IC) and an analog type (Hall element). The Hall IC further includes the following methods.
・The sensor part and the amplifier part are composed of separate semiconductor chips, the sensor part is composed of a semiconductor other than silicon, and the amplifier part is composed of silicon. (hereinafter referred to as non-silicon Hall IC)
・The sensor part and amplifier part are composed of one silicon semiconductor chip.
Since the non-silicon Hall IC contains two chips, the center position of the sensor is arranged at a position different from the center of the IC body. A semiconductor such as indium antimonide (InSb) is used for the sensor portion of the non-silicon Hall IC. These non-silicon semiconductors have advantages over silicon semiconductors, such as improved sensitivity and reduced offset due to stress strain.
　磁気センサ５０がないセンサレス制御の場合もある。この場合電流検出抵抗や電流検出用トランスなどで検出された電流値から磁極位置を推定し制御を行う。必要に応じて電流検出抵抗や電流検出用トランスなどで検出された信号をオペアンプなどを用いて増幅する場合もある。 There is also a case of sensorless control without the magnetic sensor 50. In this case, the magnetic pole position is estimated from the current value detected by the current detection resistor, the current detection transformer, or the like, and the control is performed. A signal detected by a current detection resistor, a current detection transformer, or the like may be amplified using an operational amplifier or the like, if necessary.
　過電流検出部は、過電流検出抵抗の電圧を監視し、一定以上の電圧となったらパワートランジスタをＯＦＦすることにより過電流保護を実現する。過電流検出部は、制御部に内蔵される場合と、ゲートドライブ回路に内蔵される場合がある。 The overcurrent detection unit monitors the voltage of the overcurrent detection resistor, and turns off the power transistor when the voltage reaches a certain level or higher to realize overcurrent protection. The overcurrent detection unit may be built in the control unit or built in the gate drive circuit.
　ブラシレスＤＣモータは、回転子マグネットの磁極位置に応じて、パワーＩＣ内の６つ（３相の場合）のパワートランジスタを適切なタイミングでスイッチングすることにより回転動力を得る。このスイッチング信号は制御部が生成する。この動作原理を以下に示す。
・磁気センサ５０、または、電流値により回転子３０の磁極位置を推測する。
・回転子３０の磁極位置、および、システム（例えば、ユニット側の基板）から出力される速度指令信号に応じてパワートランジスタをスイッチングする。 A brushless DC motor obtains rotational power by switching six (in the case of three phases) power transistors in a power IC at appropriate timings according to the magnetic pole position of a rotor magnet. This switching signal is generated by the controller. The principle of this operation is shown below.
Estimate the magnetic pole position of the rotor 30 from the magnetic sensor 50 or the current value.
- The power transistor is switched according to the magnetic pole position of the rotor 30 and the speed command signal output from the system (for example, the board on the unit side).
　過電流検出部（制御部、または、パワーＩＣ内部）は過電流検出抵抗の両端電圧が一定電圧以上になったとき、パワートランジスタを強制的にＯＦＦすることにより過電流保護を実現する。また、感温素子からの信号を受け、パワートランジスタを強制的にＯＦＦすることにより過熱保護を実現する。 The overcurrent detection unit (control unit or inside the power IC) realizes overcurrent protection by forcibly turning off the power transistor when the voltage across the overcurrent detection resistor exceeds a certain voltage. Overheat protection is realized by forcibly turning off the power transistor in response to a signal from the temperature sensitive element.
　通電方式には、１２０°通電、１５０°通電、正弦波通電がある。 Energization methods include 120° energization, 150° energization, and sine wave energization.
　モールド固定子１０は、固定子２０と内蔵基板１１を一体成型すると共に、内部に回転子３０を収容可能に形成された凹部が設けられる。また、固定子２０と内蔵基板１１を別々に一体成型する場合もある。 The molded stator 10 is formed by integrally molding the stator 20 and the built-in substrate 11, and is provided with a concave portion formed to accommodate the rotor 30 inside. In some cases, the stator 20 and the built-in substrate 11 are integrally molded separately.
　パワートランジスタ、ＩＰＭ、および、パワーＩＣ（以下、パワートランジスタなど）の放熱タブに接続される放熱パターン（ベタパターン）に金属板がはんだにて取り付けられる。金属板は他の面実装部品と同じようにリフローにて自動実装可能なため安い加工費で取り付け可能である。金属板はアルミなどはんだ付け不可な金属な場合もある。はんだ付け可能とするためメッキなどのコーティングを施す場合がある。金属板がアルミである場合は、ニッケル（Ｎｉ）と錫（Ｓｎ）のメッキを施す。更に言うと、金属板がはんだ付け不可な金属である場合、金属板のはんだ付け部にはんだ付け可能となるような、メッキおよびコーティングが施されてもよい。 A metal plate is attached by soldering to the heat dissipation pattern (solid pattern) connected to the heat dissipation tab of the power transistor, IPM, and power IC (hereinafter referred to as the power transistor, etc.). Since the metal plate can be automatically mounted by reflow in the same way as other surface-mounted parts, it can be attached at a low processing cost. The metal plate may be a non-solderable metal such as aluminum. In some cases, a coating such as plating is applied to make it solderable. If the metal plate is aluminum, it is plated with nickel (Ni) and tin (Sn). For that matter, if the metal plate is a non-solderable metal, the solderable portions of the metal plate may be plated and coated to allow soldering.
　金属板を配置することにより金属板がヒートシンクのような役割を果たし、広く熱を拡散することができ放熱性が向上する。より体積の大きい金属板を配置するとより放熱性が向上する。 By arranging the metal plate, the metal plate plays a role like a heat sink and can diffuse heat widely, improving heat dissipation. Disposing a metal plate with a larger volume improves heat dissipation.
　金属板は基板の反ステータ側に配したほうがより放熱性が向上するが、基板面積などの制約によりパワートランジスタなどをステータ側に配置しなければいけない場合がある。その場合、放熱タブに接続されるパターンはスルーホールを介して、金属板がはんだ付けされる放熱パターンに接続される。 Placing the metal plate on the anti-stator side of the substrate improves heat dissipation, but due to restrictions such as substrate area, it may be necessary to place power transistors, etc., on the stator side. In that case, the pattern connected to the heat dissipation tab is connected to the heat dissipation pattern to which the metal plate is soldered through the through hole.
　パワートランジスタなどでは放熱タブを備えていないものもある。その場合は高温となるパッケージ下部に放熱パターンを設け、それと接続される放熱パターンに金属板がはんだ付けされる。 Some power transistors do not have heat dissipation tabs. In that case, a heat radiation pattern is provided at the lower part of the package, which is exposed to high temperature, and a metal plate is soldered to the heat radiation pattern connected thereto.
　金属板は複数に分割して配置される場合もある。大きな金属板を配置するよりも分割した方が、一体成型時の樹脂の通り道ができ成型が良いとなる場合がある。更に言うと、金属板を分割することにより、内蔵基板１１の上部に樹脂の厚みが厚いところと薄いところができ、放熱性能低下を最小限に抑え、樹脂成型時の流動性を良くし生産性を向上することができる。 The metal plate may be divided into multiple parts and arranged. It may be better to divide the metal plate than to dispose a large metal plate so that the resin can pass through during integral molding, resulting in better molding. Furthermore, by dividing the metal plate, thick and thin portions of the resin are formed on the upper part of the built-in substrate 11, thereby minimizing the deterioration of the heat radiation performance and improving the fluidity during molding of the resin, thereby improving the productivity. can be improved.
　金属板ははんだ付け部の断面積より、基板から離れた部分の断面積が大きい形状でもよい。その場合、金属板と異電圧パターンが近接するが、基板を樹脂にて一体成型しているため金属板と異電圧パターンの間はその樹脂にて絶縁される。このような形状に基板面積、高さ制約がある中で、より大きい体積の金属板を配置でき放熱性がより向上する。 The metal plate may have a shape in which the cross-sectional area of the part away from the substrate is larger than the cross-sectional area of the soldered part. In that case, the metal plate and the different voltage pattern are close to each other, but since the substrate is integrally molded with resin, the metal plate and the different voltage pattern are insulated by the resin. A metal plate having a larger volume can be arranged in such a shape while there are restrictions on the substrate area and height, and heat dissipation is further improved.
　基板に対しステータと反対側にヒートシンクが設けられる場合がある。ヒートシンクは樹脂にて一体成型される。この場合、金属板とヒートシンクの間に樹脂が配置されヒートシンク（金属、例えばアルミ）と金属板の絶縁が保たれる。 A heat sink may be provided on the opposite side of the board from the stator. The heat sink is integrally molded with resin. In this case, resin is placed between the metal plate and the heat sink to maintain insulation between the heat sink (metal such as aluminum) and the metal plate.
　ヒートシンクは一体成型ではなく、放熱シート、または、放熱シリコンを介してモールド固定子１０に取り付けられる場合もある。 The heat sink may be attached to the molded stator 10 via a heat dissipation sheet or heat dissipation silicon instead of being integrally molded.
　回転子３０は、モールド固定子１０の内側に配置され固定子鉄心２１と対向して回転軸３１の外周側に配置された永久磁石で構成されるマグネットを有する。マグネットは、フェライト磁石、または、希土類磁石（サマリウム鉄窒素、ネオジウムなど）を熱可塑性の樹脂材料と混合して構成されるボンド磁石を射出成型にて作製される。射出成型用の金型には磁石が組み込まれており、配向をかけながら成型が行われる。 The rotor 30 has a magnet composed of a permanent magnet arranged inside the molded stator 10 and arranged on the outer peripheral side of the rotating shaft 31 so as to face the stator core 21 . The magnet is manufactured by injection molding a ferrite magnet or a bond magnet composed of a mixture of a rare earth magnet (samarium iron nitrogen, neodymium, etc.) and a thermoplastic resin material. A magnet is incorporated in the mold for injection molding, and molding is performed while applying orientation.
　マグネットは、内蔵基板１１の磁気センサ５０側の外径はそれ以外の外径（メインマグネット部）より小さくなっており（センサマグネット部）、内蔵基板１１に実装される磁気センサ５０に磁束が流入しやすくなっている。磁気センサ５０は固定子２０の巻線２２から発生する磁束の影響を極力小さくするため、巻線２２から遠い位置、つまり、回転軸３１に近い位置に配置される。 In the magnet, the outer diameter of the built-in substrate 11 on the magnetic sensor 50 side is smaller than the other outer diameter (main magnet portion) (sensor magnet portion), and the magnetic flux flows into the magnetic sensor 50 mounted on the built-in substrate 11. It's getting easier. The magnetic sensor 50 is arranged at a position far from the windings 22 , that is, at a position close to the rotating shaft 31 in order to minimize the influence of the magnetic flux generated from the windings 22 of the stator 20 .
　図面ではメインマグネット部とセンサマグネット部が一つのマグネットで構成されているが、別々のマグネットで構成してもよい。 In the drawing, the main magnet part and the sensor magnet part are composed of one magnet, but they may be composed of separate magnets.
　回転軸３１の一端には回転自在に支持する出力側軸受３３が設けられている。回転軸３１の他端には回転自在に支持する反出力側軸受３４が設けられている。 An output-side bearing 33 is provided at one end of the rotating shaft 31 to support it rotatably. A non-output side bearing 34 is provided at the other end of the rotary shaft 31 to support it rotatably.
　導電性ブラケットは、モールド固定子１０の凹部の開口部を塞ぐようにしてモールド固定子１０の内周部に嵌め込まれると共に、反出力側軸受３４の外輪が内側に嵌め込まれる。 The conductive bracket is fitted into the inner peripheral portion of the molded stator 10 so as to block the opening of the concave portion of the molded stator 10, and the outer ring of the anti-output side bearing 34 is fitted inside.
　図１２には、モールド樹脂１２、回転子絶縁部３２、ロータマグネット４０、ブラケット６０および圧入部６１も示されている。 FIG. 12 also shows the mold resin 12, the rotor insulating portion 32, the rotor magnet 40, the bracket 60 and the press-fitting portion 61.
　図２は、実施の形態１に係る電動機の断面図である。図２に示される電動機は、放熱用基板パターン２Ａが形成されている内蔵基板１１と、モールド樹脂１２と、固定子鉄心２１と、巻線２２と、回転軸３１と、ロータマグネット４０と、パワーＩＣ８０と、金属板３とを有する。 FIG. 2 is a cross-sectional view of the electric motor according to Embodiment 1. FIG. The electric motor shown in FIG. 2 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 and a metal plate 3 .
　図３は、実施の形態１に係る電動機の断面図である。図３に示される電動機は、放熱用基板パターン２Ａが形成されている内蔵基板１１と、モールド樹脂１２と、固定子鉄心２１と、巻線２２と、回転軸３１と、ロータマグネット４０と、パワーＩＣ８０と、金属板３とを有する。図３には、樹脂の通り道も示されている。 FIG. 3 is a cross-sectional view of the electric motor according to Embodiment 1. FIG. The electric motor shown in FIG. 3 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 and a metal plate 3 . FIG. 3 also shows the path of the resin.
　図４は、実施の形態１に係る電動機の断面図である。図４に示される電動機は、放熱用基板パターン２Ａが形成されている内蔵基板１１と、モールド樹脂１２と、固定子鉄心２１と、巻線２２と、回転軸３１と、ロータマグネット４０と、パワーＩＣ８０と、金属板（変形例１）３Ａと、基板パターン２とを有する。図４には、「異電圧の他パターンと近接するが樹脂があるのでＯＫ」という文言も示されている。 FIG. 4 is a cross-sectional view of the electric motor according to Embodiment 1. FIG. The electric motor shown in FIG. 4 includes a built-in board 11 having a heat radiation board pattern 2A formed thereon, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 , a metal plate (modification 1) 3A, and a substrate pattern 2 . FIG. 4 also shows the phrase "it is OK because it is close to other patterns with different voltages but there is resin".
　図５は、実施の形態１に係る電動機の断面図である。図５に示される電動機は、放熱用基板パターン２Ａが形成されている内蔵基板１１と、モールド樹脂１２と、固定子鉄心２１と、巻線２２と、回転軸３１と、ロータマグネット４０と、パワーＩＣ８０と、金属板３と、ヒートシンク６とを有する。図５には、「ヒートシンク（金属）と金属板の間に樹脂があり絶縁される」という文言も示されている。 FIG. 5 is a cross-sectional view of the electric motor according to Embodiment 1. FIG. The electric motor shown in FIG. 5 includes a built-in board 11 on which a heat radiation board pattern 2A is formed, a mold resin 12, a stator core 21, windings 22, a rotating shaft 31, a rotor magnet 40, a power It has an IC 80 , a metal plate 3 and a heat sink 6 . FIG. 5 also shows the phrase "there is resin between the heat sink (metal) and the metal plate to insulate".
　図６は、実施の形態１に係る電動機の内蔵基板回路図である。図６には、グランド７９に接続されている制御部７０と、制御部７０に接続されているパワーＩＣ８０と、パワーＩＣ８０に接続されている巻線２２と、磁気センサ５０と、一方が制御部７０とパワーＩＣ８０とに接続されていて他方がグランド７９に接続されている過電流検出抵抗７５と、高圧電源７７と、低圧電源７８とが示されている。制御部７０は、速度指令信号（システム→電動機）を受信し、回転数信号（電動機→システム）を送信する。制御部７０は、低圧電源７８に接続されている。パワーＩＣ８０は、パワートランジスタ８１と、ゲートドライブ回路８２と、保護回路など８３を有する。ゲートドライブ回路８２は、制御部７０、高圧電源７７、低圧電源７８、グランド７９およびパワートランジスタ８１に接続されている。保護回路など８３の一つの端部はゲートドライブ回路８２に接続されており、保護回路など８３の別の一つの端部はグランド７９に接続されており、保護回路など８３の更に別の一つの端部は制御部７０と過電流検出抵抗７５とを結ぶ配線に接続されている。制御部７０と過電流検出抵抗７５とを結ぶ配線には、過電流検出信号が流れる。パワートランジスタ８１は、Ｕ相上アームパワートランジスタ８１Ａ、Ｖ相上アームパワートランジスタ８１Ｂ、Ｗ相上アームパワートランジスタ８１Ｃ、Ｕ相下アームパワートランジスタ８１Ｄ、Ｖ相下アームパワートランジスタ８１ＥおよびＷ相下アームパワートランジスタ８１Ｆを有する。図６には、Ｕ相を意味する「Ｕ」、Ｖ相を意味する「Ｖ」およびＷ相を意味する「Ｗ」も示されている。巻線２２は、Ｕ相巻線２２Ｕ、Ｖ相巻線２２ＶおよびＷ相巻線２２Ｗを有する。 FIG. 6 is a built-in board circuit diagram of the electric motor according to the first embodiment. FIG. 6 shows a control unit 70 connected to ground 79, a power IC 80 connected to control unit 70, a winding 22 connected to power IC 80, a magnetic sensor 50, and one of the control unit An overcurrent detection resistor 75 connected to 70 and power IC 80 and the other to ground 79, a high voltage power supply 77, and a low voltage power supply 78 are shown. The control unit 70 receives a speed command signal (system->electric motor) and transmits a rotation speed signal (electric motor->system). The control unit 70 is connected to a low voltage power supply 78 . The power IC 80 has a power transistor 81 , a gate drive circuit 82 and a protection circuit 83 . Gate drive circuit 82 is connected to control section 70 , high voltage power supply 77 , low voltage power supply 78 , ground 79 and power transistor 81 . One end of the protection circuit or the like 83 is connected to the gate drive circuit 82, another end of the protection circuit or the like 83 is connected to ground 79, and yet another end of the protection circuit or the like 83 is connected to ground 79. The end is connected to wiring that connects the control unit 70 and the overcurrent detection resistor 75 . An overcurrent detection signal flows through wiring connecting the control unit 70 and the overcurrent detection resistor 75 . Power transistors 81 include a U-phase upper arm power transistor 81A, a V-phase upper arm power transistor 81B, a W-phase upper arm power transistor 81C, a U-phase lower arm power transistor 81D, a V-phase lower arm power transistor 81E and a W-phase lower arm power transistor. It has a transistor 81F. Also shown in FIG. 6 are "U" for U phase, "V" for V phase and "W" for W phase. Winding 22 has a U-phase winding 22U, a V-phase winding 22V and a W-phase winding 22W.
　図７は、実施の形態１に係る電動機の内蔵基板断面図である。図７に示される内蔵基板１１について、内蔵基板１１の二つの平面の各々には放熱用基板パターン２Ａが形成されている。内蔵基板１１の内部には、複数のスルーホール４が形成されている。内蔵基板１１の一方の平面には、金属板３が配置されている。内蔵基板１１の他方の平面には、パワートランジスタ８１と、放熱タブ端子８１Ｔとが配置されている。放熱タブ端子８１Ｔは、内蔵基板１１の他方の平面の側の放熱用基板パターン２Ａに接している。パワートランジスタ８１の一部は、放熱タブ端子８１Ｔの二つの平面のうちの内蔵基板１１の側でない平面に位置している。パワートランジスタ８１の別の一部は、内蔵基板１１の他方の平面と内蔵基板１１の他方の平面の側の放熱用基板パターン２Ａとに接している。 FIG. 7 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1. FIG. As for the built-in board 11 shown in FIG. 7, a heat dissipation board pattern 2A is formed on each of the two planes of the built-in board 11 . A plurality of through holes 4 are formed inside the built-in substrate 11 . A metal plate 3 is arranged on one plane of the built-in substrate 11 . A power transistor 81 and a heat dissipation tab terminal 81T are arranged on the other plane of the built-in substrate 11 . The heat radiation tab terminal 81T is in contact with the heat radiation substrate pattern 2A on the other plane side of the built-in substrate 11 . A part of the power transistor 81 is positioned on a plane other than the built-in substrate 11 side of the two planes of the heat radiation tab terminal 81T. Another part of the power transistor 81 is in contact with the other plane of the built-in substrate 11 and the heat dissipation substrate pattern 2A on the other plane side of the built-in substrate 11 .
　図８は、実施の形態１に係る電動機の内蔵基板断面図である。図８に示される内蔵基板１１について、内蔵基板１１の二つの平面の各々には放熱用基板パターン２Ａが形成されている。内蔵基板１１の内部には、複数のスルーホール４が形成されている。内蔵基板１１の一方の平面には、金属板３が配置されている。内蔵基板１１の他方の平面には、パワーＩＣ（放熱タブなし）８０Ａが配置されている。 FIG. 8 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1. FIG. As for the built-in board 11 shown in FIG. 8, a heat radiation board pattern 2A is formed on each of the two planes of the built-in board 11 . A plurality of through holes 4 are formed inside the built-in substrate 11 . A metal plate 3 is arranged on one plane of the built-in substrate 11 . A power IC (without heat dissipation tab) 80A is arranged on the other plane of the built-in substrate 11 .
　図９は、実施の形態１に係る電動機の内蔵基板断面図である。図９に示される内蔵基板１１について、内蔵基板１１の二つの平面のうちの一方には放熱用基板パターン２Ａが形成されている。放熱用基板パターン２Ａには、金属板３と、パワートランジスタ８１と、放熱タブ端子８１Ｔとが配置されている。パワートランジスタ８１の一部は、放熱タブ端子８１Ｔの二つの平面のうちの放熱用基板パターン２Ａの側でない平面に位置している。パワートランジスタ８１の別の一部は、内蔵基板１１の二つの平面のうちの一方と放熱用基板パターン２Ａとに接している。 FIG. 9 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1. FIG. As for the built-in substrate 11 shown in FIG. 9, a substrate pattern 2A for heat dissipation is formed on one of the two planes of the built-in substrate 11. As shown in FIG. A metal plate 3, a power transistor 81, and a heat dissipation tab terminal 81T are arranged on the heat dissipation substrate pattern 2A. A part of the power transistor 81 is positioned on a plane other than the heat radiation substrate pattern 2A side of the two planes of the heat radiation tab terminal 81T. Another part of the power transistor 81 is in contact with one of the two planes of the built-in substrate 11 and the heat dissipation substrate pattern 2A.
　図１０は、実施の形態１に係る電動機の内蔵基板断面図である。図１０に示される内蔵基板１１について、内蔵基板１１の二つの平面のうちの一方には放熱用基板パターン２Ａが形成されている。放熱用基板パターン２Ａには、金属板３とパワーＩＣ（放熱タブなし）８０Ａとが配置されている。 FIG. 10 is a cross-sectional view of the built-in substrate of the electric motor according to Embodiment 1. FIG. As for the built-in substrate 11 shown in FIG. 10, a substrate pattern 2A for heat radiation is formed on one of the two planes of the built-in substrate 11. As shown in FIG. A metal plate 3 and a power IC (without a heat radiation tab) 80A are arranged on the heat radiation substrate pattern 2A.
　図１１は、実施の形態１に係る電動機の内蔵基板模式図である。図１１に示される内蔵基板１１について、円盤状の内蔵基板１１の中心部に回転軸貫通穴３５が形成されている。内蔵基板１１の二つの平面のうちの一方には、金属板（変形例１）３Ａが取り付けられる金属板はんだ付け部５が位置している。金属板（変形例１）３Ａは、金属板はんだ付け部５に取り付けられる。 FIG. 11 is a schematic diagram of a built-in substrate of the electric motor according to Embodiment 1. FIG. A rotary shaft through-hole 35 is formed in the central portion of the disk-shaped internal substrate 11 shown in FIG. 11 . A metal plate soldering portion 5 to which a metal plate (modification 1) 3A is attached is positioned on one of the two planes of the built-in substrate 11 . The metal plate (modification 1) 3A is attached to the metal plate soldering portion 5 .
　以下に、実施の形態１に係る電動機を更に説明する。実施の形態１に係る電動機は、インバータ回路を含む基板を内蔵しており、当該基板は、樹脂にて一体成型されている。実施の形態１に係る電動機は、当該基板のベタパターンにリフローにてはんだ付けされた金属板を有する。金属板をはんだ付けするパターンは、高電圧部である。実施の形態１に係る電動機は、放熱性能を向上させることができる。他面実装部品と同様に金属板をリフローにてはんだ実装可能なため、実施の形態１に係る電動機の加工費は安い。金属板が高電圧扱いとなるが、樹脂にてモールドされるので絶縁距離は問題ない。 The electric motor according to Embodiment 1 will be further described below. The electric motor according to Embodiment 1 incorporates a substrate including an inverter circuit, and the substrate is integrally molded with resin. The electric motor according to the first embodiment has a metal plate soldered to the solid pattern of the substrate by reflow. The pattern for soldering the metal plate is the high voltage part. The electric motor according to Embodiment 1 can improve heat dissipation performance. Since the metal plate can be solder-mounted by reflow in the same manner as the other surface-mounted parts, the processing cost of the electric motor according to the first embodiment is low. The metal plate is treated as high voltage, but since it is molded with resin, there is no problem with the insulation distance.
実施の形態２．
（構成）
　実施の形態２に係る空気調和機（エアーコンディショナ）について説明する。
　空気調和機は室内機と、室内機に接続される室外機とを備える。室内機には室内機用送風機が搭載されており、室外機には室外機用送風機が搭載されている。室外機用送風機および室内機用送風機は、それぞれ駆動源として実施の形態１で説明された電動機を内蔵している。すなわち、実施の形態２に係る空気調和機には、実施の形態１で説明された電動機が搭載されている。 Embodiment 2.
(composition)
An air conditioner (air conditioner) according to Embodiment 2 will be described.
An air conditioner includes an indoor unit and an outdoor unit connected to the indoor unit. The indoor unit is equipped with an indoor unit fan, and the outdoor unit is equipped with an outdoor unit fan. The outdoor unit fan and the indoor unit fan each incorporate the electric motor described in the first embodiment as a drive source. That is, the air conditioner according to the second embodiment is equipped with the electric motor described in the first embodiment.
　特に業務用空気調和機はより高出力を求められ高い放熱性能を求められるので、実施の形態２に係る空気調和機が大きく効果を発揮する。 In particular, commercial air conditioners are required to have higher output and high heat dissipation performance, so the air conditioner according to Embodiment 2 is highly effective.
　図１３は、実施の形態２に係る空気調和機（エアーコンディショナ）２００の模式図である。空気調和機２００は、電動機１と室内機基板２１１とが搭載されている室内機２１０と、室外機用送風機２２３が搭載されている室外機２２０とを有する。 FIG. 13 is a schematic diagram of an air conditioner (air conditioner) 200 according to the second embodiment. The air conditioner 200 has an indoor unit 210 on which the electric motor 1 and the indoor unit substrate 211 are mounted, and an outdoor unit 220 on which the outdoor unit blower 223 is mounted.
　なお、電動機は、空気調和機の他にも、例えば換気扇、家電機器、工作機などに搭載して利用することができる。 In addition to air conditioners, electric motors can also be used by being mounted on, for example, ventilation fans, home appliances, and machine tools.
　図１４は、実施の形態１に係る電動機が有する制御部７０がプロセッサ９１によって実現される場合のプロセッサ９１を示す図である。つまり、制御部７０の機能は、メモリ９２に格納されるプログラムを実行するプロセッサ９１によって実現されてもよい。プロセッサ９１は、ＣＰＵ（Central　Processing　Unit）、処理装置、演算装置、マイクロプロセッサ、又はＤＳＰ（Digital　Signal　Processor）である。図１４には、メモリ９２も示されている。 FIG. 14 is a diagram showing the processor 91 when the controller 70 of the electric motor according to Embodiment 1 is realized by the processor 91. As shown in FIG. In other words, the functions of the control unit 70 may be realized by the processor 91 executing programs stored in the memory 92 . The processor 91 is a CPU (Central Processing Unit), processing device, arithmetic device, microprocessor, or DSP (Digital Signal Processor). Memory 92 is also shown in FIG.
　制御部７０の機能がプロセッサ９１によって実現される場合、当該機能は、プロセッサ９１と、ソフトウェア、ファームウェア、又は、ソフトウェアとファームウェアとの組み合わせとによって実現される。ソフトウェア又はファームウェアは、プログラムとして記述され、メモリ９２に格納される。プロセッサ９１は、メモリ９２に記憶されたプログラムを読み出して実行することにより、制御部７０の機能を実現する。 When the function of the control unit 70 is implemented by the processor 91, the function is implemented by the processor 91 and software, firmware, or a combination of software and firmware. Software or firmware is written as a program and stored in memory 92 . The processor 91 implements the functions of the control unit 70 by reading and executing programs stored in the memory 92 .
　制御部７０の機能がプロセッサ９１によって実現される場合、電動機は、制御部７０によって実行されるステップが結果的に実行されることになるプログラムを格納するためのメモリ９２を有する。メモリ９２に格納されるプログラムは、制御部７０をコンピュータに実行させるものであるともいえる。 When the functions of the control unit 70 are implemented by the processor 91, the motor has a memory 92 for storing programs that result in the execution of the steps performed by the control unit 70. It can be said that the program stored in the memory 92 causes the computer to execute the controller 70 .
　メモリ９２は、例えば、ＲＡＭ（Random　Access　Memory）、ＲＯＭ（Read　Only　Memory）、フラッシュメモリ、ＥＰＲＯＭ（Erasable　Programmable　Read　Only　Memory）、ＥＥＰＲＯＭ（登録商標）（Electrically　Erasable　Programmable　Read-Only　Memory）等の不揮発性若しくは揮発性の半導体メモリ、磁気ディスク、フレキシブルディスク、光ディスク、コンパクトディスク、ミニディスク又はＤＶＤ（Digital　Versatile　Disk）等である。 The memory 92 is non-volatile such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), EEPROM (registered trademark) (Electrically Erasable Programmable Read-Only Memory). Or a volatile semiconductor memory, a magnetic disk, a flexible disk, an optical disk, a compact disk, a mini disk, a DVD (Digital Versatile Disk), or the like.
　図１５は、実施の形態１に係る電動機が有する制御部７０が処理回路９３によって実現される場合の処理回路９３を示す図である。つまり、制御部７０は、処理回路９３によって実現されてもよい。 FIG. 15 is a diagram showing the processing circuit 93 when the control unit 70 of the electric motor according to Embodiment 1 is implemented by the processing circuit 93. As shown in FIG. That is, the control unit 70 may be implemented by the processing circuit 93 .
　処理回路９３は、専用のハードウェアである。処理回路９３は、例えば、単一回路、複合回路、プログラム化されたプロセッサ、並列プログラム化されたプロセッサ、ＡＳＩＣ（Application　Specific　Integrated　Circuit）、ＦＰＧＡ（Field-Programmable　Gate　Array）、又はこれらを組み合わせたものである。制御部７０の一部は、残部と別個の専用のハードウェアで実現されてもよい。 The processing circuit 93 is dedicated hardware. The processing circuit 93 is, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination thereof. is. A part of the control unit 70 may be realized by dedicated hardware separate from the rest.
　制御部７０の複数の機能について、当該複数の機能の一部がソフトウェア又はファームウェアで実現され、当該複数の機能の残部が専用のハードウェアで実現されてもよい。このように、制御部７０の複数の機能は、ハードウェア、ソフトウェア、ファームウェア、又はこれらの組み合わせによって実現することができる。 Regarding the functions of the control unit 70, part of the functions may be implemented by software or firmware, and the rest of the functions may be implemented by dedicated hardware. Thus, multiple functions of the control unit 70 can be realized by hardware, software, firmware, or a combination thereof.
　以上の実施の形態に示した構成は、一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、実施の形態同士を組み合わせることも可能であるし、要旨を逸脱しない範囲で、構成の一部を省略又は変更することも可能である。 The configurations shown in the above embodiments are only examples, and can be combined with other known techniques, or can be combined with other embodiments, without departing from the scope of the invention. It is also possible to omit or change part of the configuration.
　１　電動機（モータ）、２　基板パターン、２Ａ　放熱用基板パターン、３　金属板、３Ａ　金属板（変形例１）、４　スルーホール、５　金属板はんだ付け部、６　ヒートシンク、１０　モールド固定子、１１　内蔵基板、１２　モールド樹脂、１３　リード線、１４　リード口出し部、２０　固定子、２１　固定子鉄心、２２　巻線、２２Ｕ　Ｕ相巻線、２２Ｖ　Ｖ相巻線、２２Ｗ　Ｗ相巻線、２３　インシュレータ、３０　回転子、３１　回転軸、３２　回転子絶縁部、３３　出力側軸受、３４　反出力側軸受、３５　回転軸貫通穴、４０　ロータマグネット、５０　磁気センサ、６０　ブラケット、６１　圧入部、７０　制御部、７５　過電流検出抵抗、７７　高圧電源、７８　低圧電源、７９　グランド、８０　パワーＩＣ、８０Ａ　パワーＩＣ（放熱タブなし）、８１　パワートランジスタ、８１Ａ　Ｕ相上アームパワートランジスタ、８１Ｂ　Ｖ相上アームパワートランジスタ、８１Ｃ　Ｗ相上アームパワートランジスタ、８１Ｄ　Ｕ相下アームパワートランジスタ、８１Ｅ　Ｖ相下アームパワートランジスタ、８１Ｆ　Ｗ相下アームパワートランジスタ、８１Ｔ　放熱タブ端子、８２　ゲートドライブ回路、８３　保護回路など、９１　プロセッサ、９２　メモリ、９３　処理回路、２００　空気調和機（エアーコンディショナ）、２１０　室内機、２１１　室内機基板、２２０　室外機、２２３　室外機用送風機。 1 Electric motor (motor), 2 Board pattern, 2A Board pattern for heat dissipation, 3 Metal plate, 3A Metal plate (Modification 1), 4 Through hole, 5 Metal plate soldering part, 6 Heat sink, 10 Molded stator, 11 Built-in Substrate, 12 Mold resin, 13 Lead wire, 14 Lead outlet, 20 Stator, 21 Stator core, 22 Winding, 22U U-phase winding, 22V V-phase winding, 22W W-phase winding, 23 Insulator, 30 Rotor, 31 Rotating shaft, 32 Rotor insulating part, 33 Output side bearing, 34 Anti-output side bearing, 35 Rotating shaft through hole, 40 Rotor magnet, 50 Magnetic sensor, 60 Bracket, 61 Press fitting part, 70 Control part, 75 Overcurrent detection resistor, 77 high-voltage power supply, 78 low-voltage power supply, 79 ground, 80 power IC, 80A power IC (no heat dissipation tab), 81 power transistor, 81A U-phase upper arm power transistor, 81B V-phase upper arm power transistor, 81C W-phase upper arm power transistor, 81D U-phase lower arm power transistor, 81E V-phase lower arm power transistor, 81F W-phase lower arm power transistor, 81T heat dissipation tab terminal, 82 gate drive circuit, 83 protection circuit, etc., 91 processor, 92 Memory, 93 processing circuit, 200 air conditioner (air conditioner), 210 indoor unit, 211 indoor unit substrate, 220 outdoor unit, 223 outdoor unit blower.

Claims (5)

  1. 　インバータ回路を含む基板を内蔵しており、
    　前記基板は、樹脂にて一体成型されており、
    　前記基板のベタパターンにリフローにてはんだ付けされた金属板を備え、
    　前記金属板をはんだ付けするパターンが高電圧部である
    　電動機。     It has a built-in substrate including an inverter circuit,
    The substrate is integrally molded with resin,
    A metal plate soldered to the solid pattern of the substrate by reflow,
    An electric motor, wherein the pattern to which the metal plate is soldered is a high-voltage part.
  2. 　前記金属板は、複数に分割されて配置されている
    　請求項１に記載の電動機。     The electric motor according to claim 1, wherein the metal plate is divided into a plurality of pieces.
  3. 　前記金属板は、はんだ付け部の断面積より、前記基板から離れた部分の断面積のほうが大きい
    　請求項１又は２に記載の電動機。     The electric motor according to claim 1 or 2, wherein the metal plate has a larger cross-sectional area at a portion away from the substrate than a cross-sectional area at the soldered portion.
  4. 　前記金属板がはんだ付け不可な金属であって、前記金属板のはんだ付け部にはんだ付け可能となるような、メッキおよびコーティングが施されている
    　請求項１から３のいずれか１項に記載の電動機。     4. The metal plate according to any one of claims 1 to 3, wherein the metal plate is a non-solderable metal, and the metal plate is plated and coated so that the soldering portion of the metal plate can be soldered. Electric motor.
  5. 　請求項１から４のいずれか１項に記載の電動機が搭載された空気調和機。 An air conditioner equipped with the electric motor according to any one of claims 1 to 4.
PCT/JP2022/006374 2022-02-17 2022-02-17 Electric motor and air-conditioning device WO2023157175A1 (en)

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PCT/JP2022/006374 WO2023157175A1 (en) 2022-02-17 2022-02-17 Electric motor and air-conditioning device

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259666A (en) * 1992-03-12 1993-10-08 Matsushita Electric Ind Co Ltd Heat sink of integrated circuit for motor
JP2005333099A (en) * 2004-04-22 2005-12-02 Matsushita Electric Ind Co Ltd Semiconductor module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259666A (en) * 1992-03-12 1993-10-08 Matsushita Electric Ind Co Ltd Heat sink of integrated circuit for motor
JP2005333099A (en) * 2004-04-22 2005-12-02 Matsushita Electric Ind Co Ltd Semiconductor module

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