WO2023151751A1 - Dispositif onduleur comprenant une barre omnibus stratifiée ou une carte de circuit imprimé à courant élevé - Google Patents

Dispositif onduleur comprenant une barre omnibus stratifiée ou une carte de circuit imprimé à courant élevé Download PDF

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Publication number
WO2023151751A1
WO2023151751A1 PCT/DE2023/100078 DE2023100078W WO2023151751A1 WO 2023151751 A1 WO2023151751 A1 WO 2023151751A1 DE 2023100078 W DE2023100078 W DE 2023100078W WO 2023151751 A1 WO2023151751 A1 WO 2023151751A1
Authority
WO
WIPO (PCT)
Prior art keywords
inverter device
conductor structure
current
input unit
circuit board
Prior art date
Application number
PCT/DE2023/100078
Other languages
German (de)
English (en)
Inventor
Bao Ngoc AN
Jens KROITZSCH
Andreas HUMBERT
Original Assignee
Schaeffler Technologies AG & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaeffler Technologies AG & Co. KG filed Critical Schaeffler Technologies AG & Co. KG
Publication of WO2023151751A1 publication Critical patent/WO2023151751A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors

Definitions

  • Inverter device with a laminated bus bar or a high current circuit board
  • the invention relates to a (largely integrated) inverter device for an electric drive machine, i.e. for controlling and supplying an electric drive machine in a motor vehicle.
  • the motor vehicle is preferably implemented as a purely electrically or hybrid motor vehicle.
  • a basic requirement for generic inverter devices is to achieve the lowest possible electrical resistance, which is increased in particular by existing connection points/contact points between separately formed conductors. At the same time, the inverter device should continue to be manufacturable and mountable in as few steps as possible.
  • an inverter device for an electric drive motor of a motor vehicle which inverter device has a DC input unit having a first conductor structure, an AC output unit having a second conductor structure and an AC output unit inserted between the DC input unit and the AC output unit, to the two Has conductor structures electrically connected power semiconductor device.
  • the two conductor structures are also formed as separately formed (particularly spaced apart) laminated busbars or as separately formed (particularly spaced apart) current conductors of a high-current printed circuit board.
  • a laminated busbar is to be understood as meaning a conductor structure that has a number of plies/layers that are insulated from one another and that each form a pole that is separate from one another and are joined together to form a composite.
  • An inverter device is thus made available which can be manufactured efficiently and assembled in as few work steps as possible. In addition, the electrical resistances are significantly reduced.
  • first conductor structure and/or the second conductor structure bear against a (preferably actively or passively cooled) housing by means of a thermal layer. This leads to skilful dissipation of excess heat during operation of the inverter device, so that the efficiency is further increased.
  • the thermal layer is formed by a thermally conductive (but preferably electrically insulating) film or a thermally conductive (but preferably electrically insulating) potting compound. This makes the thermal layer easy to attach.
  • the DC input unit has a (first) current sensor that is integrated into the first conductor structure.
  • the first current sensor is preferably applied, for example glued, directly to a surface of the first conductor structure (usually made of a copper material).
  • a (first) sensor housing accommodating the first current sensor is also in contact with the housing of the inverter device and is therefore thermally coupled, for example with the interposition of a thermal layer.
  • the AC output unit has a (second) current sensor which is integrated into the second conductor structure.
  • the second current sensor is preferably applied directly to a surface of the second conductor structure (usually made of a copper material), for example applied sticks.
  • a (second) sensor housing accommodating the second current sensor is also in contact with the housing of the inverter device and is therefore thermally coupled, for example with the interposition of a thermal layer.
  • the DC input unit has an EMC filter device.
  • That EMC filter device is typically equipped with a magnetic core running around the first conductor structure and/or with a capacitor. This further increases the efficiency of the inverter device.
  • the DC input unit has a capacitor arrangement, with capacitors of the capacitor arrangement more preferably being electrically connected directly to the first conductor structure, the first conductor structure is coupled directly to the capacitor arrangement, as a result of which the efficiency is further increased.
  • the AC output unit has an output filter device.
  • the output filter means typically comprises a magnetic core running around the second conductor structure and/or a capacitor. This also increases the efficiency of the inverter device.
  • a highly integrated inverter is formed on the basis of a laminated busbar (busbar/current busbar) or a high-current printed circuit board.
  • the inverter is divided into a DC section (DC input unit), a power module (power semiconductor module/power semiconductor device) and an AC section (AC output unit).
  • the individual components in the DC and AC sections are combined into a larger component with multiple functions. These components can based on the laminated busbar or the high-current printed circuit board.
  • the laminated busbar or high current circuit board is thermally bonded to the surface of the inverter case (housing) using a thermally conductive insulating film/tape or a thermally conductive potting compound.
  • Current sensors are also integrated in the laminated busbar or the high-current circuit board.
  • FIG. 1 shows a schematic longitudinal sectional representation of an inverter device according to the invention according to a first exemplary embodiment, the individual components of the inverter device being clearly visible,
  • FIG. 2 shows a schematic longitudinal sectional illustration of an inverter device according to the invention according to a second exemplary embodiment, with a power semiconductor device now being equipped with a circuit board with high-current contacts, and
  • FIG 3 shows a schematic longitudinal sectional illustration of an inverter device according to the invention according to a third exemplary embodiment, the components of the inverter device now being mounted as a whole on a high-current printed circuit board.
  • the inverter device 1 clearly shows an inverter device 1 according to the invention in a first exemplary embodiment.
  • the inverter device 1 is designed as a module leads, which is more preferably part of a power electronics of an electric drive motor of a motor vehicle, not shown here for the sake of clarity.
  • the inverter device 1 consequently serves to control/supply the electric drive machine during operation.
  • the inverter device 1 has a DC input unit 3 and an AC output unit 5 and a power semiconductor module arranged between the DC input unit 3 and the AC output unit 5 as a power semiconductor device 6 .
  • the power semiconductor device 6 typically serves to convert an alternating current supplied via the DC input unit 3 into a direct current transmitted through the AC output unit 5 and vice versa.
  • the DC input unit 3 has a first conductor structure 2 that runs continuously.
  • the first conductor structure 2 has, in the usual way, a plurality of poles which are formed by layers 18 which are electrically separated/insulated from one another.
  • the first conductor structure 2 is implemented as a laminated (first) busbar 7a in this first exemplary embodiment.
  • the layers 18 are thus arranged one on top of the other in the manner of a sandwich and joined/connected to one another in a materially bonded manner, for example by means of an adhesive.
  • the DC input unit 3 also has an EMC filter device 13 .
  • the EMC filter device 13 has a (first) magnetic core 19 which extends around the layers 18 of the first conductor structure 2/the first conductor structure 2.
  • the first core 19 is accommodated/integrated at least partially in a central housing 22 (inverter housing) of the inverter device 1 .
  • the EMC filter device 13 also has a (first) capacitor 20 which is arranged on the first conductor structure 2 .
  • the DC input unit 3 also has a (first) current sensor 11 which is also attached to the first conductor structure 2 .
  • the first current sensor 11 that can be seen in FIG. 1 is attached, preferably glued, directly to a copper surface of a layer 18 of the first conductor structure 2, for example.
  • a the first (First) sensor housing 21 enclosing current sensor 11 is also accommodated/partially integrated and thermally connected to central housing 22 of inverter device 1 .
  • the DC input unit 3 also has a capacitor arrangement 14 which is connected to the first conductor structure 2 and forms a so-called DC link.
  • the first conductor structure 2 is connected to the power semiconductor device 6 on a side of the capacitor arrangement 14 which is remote from the EMC filter device 13 and the first current sensor 11 .
  • the layers 18 / poles of the first conductor structure 2 are electrically connected to contacts of the power semiconductor device 6 .
  • the power semiconductor device 6 On the output side, the power semiconductor device 6 is in turn connected to the AC output unit 5 , namely to a second conductor structure 4 which is assigned to the AC output unit 5 .
  • FIG. 1 shows in particular a layer 18 with insulation applied thereto.
  • the AC output unit 5 has a second current sensor 12 which is applied (preferably glued) to a copper surface of the second conductor structure 4 .
  • Another (second) sensor housing 23 encloses the second current sensor 12. This second sensor housing 23 is also accommodated/partially integrated and thermally connected to the housing 22 of the inverter device 1.
  • an output filter device 15 which has a (second) magnetic core 24 and a (second) capacitor 25 .
  • both the first conductor structure 2 and the second conductor structure 4 are each thermally connected to the housing 22 by means of thermal layers 10 .
  • the respective layer 10 is, for example, as an insulating tape or as Casting compound, which is designed to be thermally conductive, is formed. The respective layer 10 thus contacts the first conductor structure 2 or the second conductor structure 4 over a large area and thermally couples them to the housing 22.
  • the power semiconductor device 6 has a cooling plate 26 through which a cooling medium conducted through the housing 22 flows/flows directly during operation.
  • At least one additional cooling channel 27 is formed in the housing 22 for passive cooling of the conductor structures 2, 4 and preferably runs at least partially parallel to the conductor structures 2, 4.
  • FIG. 2 shows an inverter device 1 according to a second exemplary embodiment, the essential structure of which corresponds to that of the first exemplary embodiment.
  • the inverter device 1 of the second exemplary embodiment is implemented differently from the first exemplary embodiment.
  • the power semiconductor device 6 now has a circuit board 28 in which electronic components 29, such as semiconductors, are integrated. High-current contacts 16, 17 are also formed on the power semiconductor device 6, which in turn are each connected to the first or second conductor structure 2, 4.
  • FIG. 3 it can also be seen that instead of the separate conductor structures 2, 4 in the form of separate busbars 7a, 7b, these are alternatively designed as current conductors 8a, 8b, which are integrated in a high-current circuit board 9 could be.
  • a first conductor 8a forming the first conductor structure 2 is then preferably in turn configured so massively that it can alternatively be referred to as a conductor rail.
  • a second current conductor 8b forming the second conductor structure 4 is also preferably designed to be so solid that it can alternatively be referred to as a current rail.
  • the capacitor arrangement 14 and the components 29 of the power semiconductor device 6 are arranged directly on the high-current printed circuit board 9 .
  • an inverter is constructed from three units or assemblies, having a first unit comprising an EMC filter (EMC filter device 13) and a DC link capacitor (capacitor arrangement 14) as a unit on the DC Page; a second unit including power modules (power semiconductor device 6); and a third unit comprising a busbar with current sensor 12 and output filter (output filter device 15) on the AC side.
  • EMC filter device 13 EMC filter device 13
  • DC link capacitor capacitor arrangement 14
  • a conductor structure 2, 4 is based on a laminated busbar (busbar 7a, 7b) or on the basis of a high-current circuit board 9.
  • the structure of the intermediate circuit capacitor (capacitor arrangement 14) consists of discrete components/capacitors.
  • the DC current sensor (first current sensor 11 ) is integrated into the laminated busbar. This means that the busbar of the DC current sensor is part of the laminated busbar.
  • Current sensor electronics (first current sensor 11 and/or second current sensor 12) are applied to a copper layer of the laminated busbar (e.g. by an adhesive bond).
  • the current sensor housing (first sensor housing 21 and/or second sensor housing 23) is also integrated into the inverter housing base (housing 22).
  • the magnetic cores 19, 24 are also integrated into the bottom of the inverter housing.
  • the AC current sensors (second current sensor 12) are integrated into the laminated busbar on the AC side.
  • a thermal connection to the inverter housing or cooling channels takes place via thermal interface materials (e.g. “gap pad”) or by a potting material (partial potting), which is generally referred to as layer 10 in the present case.
  • FIG. 2 there is a further embodiment variant with “chip embedding” technology.
  • the power switches/semiconductors of the power semiconductor device 6 are integrated in a circuit board 28 (PCB).
  • PCB circuit board 28
  • EMC filter and DC link capacitor as a unit on the DC side are connected to the power semiconductor module (power semiconductor device 6) via (first) high-current contacts 16.
  • AC current sensors are integrated in the laminated busbar and also connected to the power semiconductor module via (second) high-current contacts 17 .
  • a high-current printed circuit board 9 with “chip embedding” technology.
  • the high-current printed circuit board 9 is designed with integrated busbars (busbar; current conductors 8a, 8b) and integrated power semiconductors (components 29).
  • An integration of a gate driver logic (gate driver IC) on the high-current printed circuit board 9 is optional.
  • the magnetic cores 19, 24 for the EMC filter or the output filter are printed circuit board 9 out through the high current.
  • Inverter device first conductor structure DC input unit second conductor structure AC output unit
  • Power semiconductor device a first busbar b second busbar a first current conductor b second current conductor high-current circuit board 0 layer 1 first current sensor 2 second current sensor 3
  • EMC filter device 4 capacitor arrangement 5 output filter device 6 first high-current contact 7 second high-current contact 8 layer 9 first core 0 first capacitor 1 first sensor housing 2 housing 3 second sensor housing 4 second core 5 second capacitor 6 cooling plate 7 cooling channel 8 circuit board 9 electronic component 0 gate driver IC 31 seal

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention concerne un dispositif onduleur (1) d'une machine de commande électrique d'un véhicule automobile, ledit dispositif onduleur comprenant : une unité d'entrée CC (3) pourvue d'une première structure conductrice (2) ; une unité de sortie CA (5) pourvue d'une seconde structure conductrice (4) ; et un dispositif à semi-conducteur de puissance (6) implanté entre l'unité d'entrée CC (3) et l'unité de sortie CA (5) et électriquement connecté aux deux structures conductrices (2, 4), les deux structures conductrices (2, 4) étant conçues sous la forme de barres omnibus (7a, 7b) stratifiées qui sont séparées l'une de l'autre ou bien de conducteurs de courant (8a, 8b) d'une carte de circuit imprimé à courant élevé (9), qui sont séparés les uns des autres.
PCT/DE2023/100078 2022-02-11 2023-02-01 Dispositif onduleur comprenant une barre omnibus stratifiée ou une carte de circuit imprimé à courant élevé WO2023151751A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022103218.3A DE102022103218A1 (de) 2022-02-11 2022-02-11 Invertervorrichtung mit einer laminierten Sammelschiene oder einer Hochstrom-leiterplatte
DE102022103218.3 2022-02-11

Publications (1)

Publication Number Publication Date
WO2023151751A1 true WO2023151751A1 (fr) 2023-08-17

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PCT/DE2023/100078 WO2023151751A1 (fr) 2022-02-11 2023-02-01 Dispositif onduleur comprenant une barre omnibus stratifiée ou une carte de circuit imprimé à courant élevé

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DE (1) DE102022103218A1 (fr)
WO (1) WO2023151751A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013100246A1 (de) * 2013-01-11 2014-07-17 Refusol Gmbh Stromsensor- und Entstörfilteranordnung, insbesondere für transformatorlose Photovoltaik-Wechselrichter
US20160149512A1 (en) * 2008-10-31 2016-05-26 Hitachi Automotive Systems, Ltd. Power Module, Power Converter Device, and Electrically Powered Vehicle
WO2021176934A1 (fr) * 2020-03-05 2021-09-10 富士電機株式会社 Dispositif de conversion de puissance
DE102020206199A1 (de) * 2020-05-18 2021-11-18 Zf Friedrichshafen Ag Stromrichter
DE102020208215A1 (de) * 2020-07-01 2022-01-05 Zf Friedrichshafen Ag Leiterplatte, Inverter sowie Elektromotoranordnung
DE102020208438A1 (de) * 2020-07-06 2022-01-27 Zf Friedrichshafen Ag Inverter für einen elektrischen Antrieb eines Elektrofahrzeugs oder eines Hybridfahrzeugs, Baukastensystem und ein Verfahren zum Herstellen des Inverters

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4452953B2 (ja) 2007-08-09 2010-04-21 日立オートモティブシステムズ株式会社 電力変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160149512A1 (en) * 2008-10-31 2016-05-26 Hitachi Automotive Systems, Ltd. Power Module, Power Converter Device, and Electrically Powered Vehicle
DE102013100246A1 (de) * 2013-01-11 2014-07-17 Refusol Gmbh Stromsensor- und Entstörfilteranordnung, insbesondere für transformatorlose Photovoltaik-Wechselrichter
WO2021176934A1 (fr) * 2020-03-05 2021-09-10 富士電機株式会社 Dispositif de conversion de puissance
DE102020206199A1 (de) * 2020-05-18 2021-11-18 Zf Friedrichshafen Ag Stromrichter
DE102020208215A1 (de) * 2020-07-01 2022-01-05 Zf Friedrichshafen Ag Leiterplatte, Inverter sowie Elektromotoranordnung
DE102020208438A1 (de) * 2020-07-06 2022-01-27 Zf Friedrichshafen Ag Inverter für einen elektrischen Antrieb eines Elektrofahrzeugs oder eines Hybridfahrzeugs, Baukastensystem und ein Verfahren zum Herstellen des Inverters

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DE102022103218A1 (de) 2023-08-17

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