WO2023145600A1

WO2023145600A1 - Adhesive composition, adhesive layer, and adhesive sheet

Info

Publication number: WO2023145600A1
Application number: PCT/JP2023/001524
Authority: WO
Inventors: 匡哉柴野; 佳之堀内; 普史形見
Original assignee: 日東電工株式会社
Priority date: 2022-01-31
Filing date: 2023-01-19
Publication date: 2023-08-03
Also published as: TW202344653A

Abstract

Provided is an adhesive composition from which an adhesive layer having a low dielectric constant can be formed.　Provided is an adhesive composition which contains a polyester-based resin containing a constituent unit derived from a compound having at least 20 carbon atoms and at least two functional groups capable of forming an ester bond, and which has a dielectric constant at a frequency of 100 kHz of 4.0 or less when the adhesive layer is formed. The adhesive composition preferably has a dielectric loss of 0.0001 to 0.15 at a frequency of 100 kHz when the adhesive layer is formed.

Description

Adhesive composition, adhesive layer, and adhesive sheet

The present invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet. More particularly, it relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive layer, and a pressure-sensitive adhesive sheet that can be preferably used for optical applications.

An image display device such as an organic EL display device is used in combination with a touch panel having a capacitive touch sensor. Capacitive touch sensors are required to have higher performance as they become more popular. For this reason, high performance is also required for the pressure-sensitive adhesive layer applied to the capacitive touch sensor.

However, due to the thinning of the module, the enlargement of the screen, and the high definition of the optical semiconductor element in the image display device, driving noise during display driving of the image display device adversely affects the sensing of the capacitive touch sensor. There is concern that malfunction may occur. Malfunction due to drive noise may occur when the dielectric constant of the pressure-sensitive adhesive layer is high. Therefore, as a pressure-sensitive adhesive that forms a pressure-sensitive adhesive layer with a low dielectric constant, for example, a pressure-sensitive adhesive whose base polymer is a (meth)acrylic polymer whose main component is an alkyl (meth)acrylate having a long-chain alkyl group has been proposed. (For example, Patent Document 1). The pressure-sensitive adhesive layer with a low dielectric constant can reduce the influence of drive noise from the organic EL panel on the capacitive touch sensor.

JP 2013-082880 A

In recent years, there has been a demand for image display devices with even larger screens and higher definition. As the screen size increases, the voltage required to drive the image display device increases, and noise tends to increase. In addition, since the amount of semiconductor elements used increases with the increase in definition, there is a tendency for noise to increase due to the generation of high voltage.

Also, in recent years, there is a tendency to install touch sensors outside the image display device, which used to be installed inside the image display device. Image display devices are required to be lightweight and thin, and when a touch sensor is installed outside the image display device, the thickness of the members used inside and outside the image display device is reduced. Noise emitted from the image display device tends to be transmitted to the touch sensor bonded to the image display device, and the noise of the touch sensor tends to increase. Therefore, the pressure-sensitive adhesive layer is required to have a lower dielectric constant.

The present invention is intended to solve such problems, and its object is to provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer with a low dielectric constant.

The present invention includes a polyester resin containing a structural unit derived from a compound having 20 or more carbon atoms and having two or more functional groups capable of forming an ester bond, and at a frequency of 100 kHz when forming a pressure-sensitive adhesive layer. Provided is a pressure-sensitive adhesive composition having a dielectric constant of 4.0 or less.

A compound containing 20 or more carbon atoms and having two or more functional groups capable of forming an ester bond, which is contained as a structural unit in the polyester resin, tends to have a low polarity because of its large number of carbon atoms. Therefore, a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing the polyester-based resin tends to have a low dielectric constant. The dielectric constant at a frequency of 100 kHz of the pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition is 4.0 or less. As a result, the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition has a low dielectric constant, for example, it is difficult to cause noise amplification, and it is possible to suppress the radiation loss of millimeter waves.

The pressure-sensitive adhesive composition preferably has a dielectric loss of 0.0001 to 0.15 at a frequency of 100 kHz when the pressure-sensitive adhesive layer is formed. When the dielectric loss is within the above range, the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition has little energy loss due to heat, for example, noise amplification is less likely to occur, and millimeter wave radiation loss is suppressed. be able to.

The glass transition temperature of the polyester-based resin is preferably 0°C or lower. By using a polyester-based resin having a low glass transition temperature, the pressure-sensitive adhesive layer formed is more excellent in adhesiveness.

The present invention also provides a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition.

The present invention also provides a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.

According to the adhesive composition of the present invention, an adhesive layer with a low dielectric constant can be formed. Therefore, for example, by using the pressure-sensitive adhesive layer for bonding the touch sensor and the image display device together, it is possible to make noise generated by the image display device less likely to be transmitted to the touch sensor. Further, for example, the radiation loss of millimeter waves can be suppressed by using the pressure-sensitive adhesive layer as a pressure-sensitive adhesive layer that is attached to a millimeter-wave antenna substrate used for a millimeter-wave antenna.

1 is a schematic diagram (cross-sectional view) showing an embodiment of an optical layered body of the present invention. FIG. FIG. 4 is a schematic diagram (cross-sectional view) showing another embodiment of the optical layered body of the present invention. FIG. 4 is a schematic diagram (cross-sectional view) showing still another embodiment of the optical layered body of the present invention. 1 is a schematic diagram (cross-sectional view) showing an embodiment of a millimeter wave antenna of the present invention; FIG. FIG. 4 is a schematic diagram (cross-sectional view) showing another embodiment of the millimeter wave antenna of the present invention; FIG. 4 is a schematic diagram (cross-sectional view) showing still another embodiment of the millimeter wave antenna of the present invention.

[Adhesive composition]
The pressure-sensitive adhesive composition of the present invention contains at least a polyester-based resin. The polyester-based resin contains at least a structural unit derived from a compound having 20 or more carbon atoms and having two or more functional groups capable of forming an ester bond. In addition, in this specification, the said compound may be called "compound (A)." That is, the polyester-based resin is a resin obtained by polymerizing a monomer composition containing the compound (A). The polyester-based resin may contain only one type of structural unit derived from the compound (A), or may contain two or more types thereof.

The dielectric constant at a frequency of 100 kHz of the pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition is 4.0 or less, preferably 3.6 or less, more preferably 3.5 or less, and still more preferably 3.4. Below, more preferably 3.3 or less, particularly preferably 3.2 or less. When the dielectric constant is 4.0 or less, the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition has a low dielectric constant, for example, it is difficult to cause noise amplification, and the radiation loss of millimeter waves is suppressed. can be done. The "relative permittivity" is a value obtained by dividing the "dielectric constant" by the "vacuum permittivity". "relative permittivity" shall be treated as synonymous.

The dielectric loss at a frequency of 100 kHz of the pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition is preferably 0.15 or less, more preferably 0.13 or less, still more preferably 0.12 or less, and still more preferably. is 0.11 or less, more preferably 0.10 or less, still more preferably 0.09 or less, and particularly preferably 0.08 or less. When the dielectric loss is 0.15 or less, the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition has a small energy loss due to heat, for example, it is difficult to cause noise amplification, and the radiation loss of millimeter waves is suppressed. be able to. The dielectric loss is, for example, 0.0001 or more.

In this specification, the dielectric constant and dielectric loss at a frequency of 100 kHz are measured according to JIS K6911, and the dielectric constant and dielectric loss at frequencies of 28 GHz and 60 GHz are measured according to JIS R1660-2. is measured by the method described in Examples below. The dielectric constant and the dielectric loss can be adjusted by adjusting the monomer composition of the polyester-based resin constituting the pressure-sensitive adhesive composition, the types and contents of additives, and the like.

(polyester resin)
The number of carbon atoms in compound (A) is 20 or more, preferably 24 or more, more preferably 26 or more, still more preferably 28 or more, still more preferably 30 or more, and particularly preferably 32 or more. The compound (A) contained as a structural unit in the polyester-based resin has a large number of carbon atoms of 20 or more, and therefore tends to have low polarity. Therefore, the dielectric constant of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition containing the polyester-based resin tends to be low. The number of carbon atoms is, for example, 60 or less, and may be 58 or less, or 56 or less.

The compound (A) is preferably a polyol and/or a polyvalent carboxylic acid that constitute the polyester resin. That is, the compound (A) is preferably a compound having two or more hydroxy groups or carboxy groups as functional groups capable of forming an ester bond, more preferably 2 to 4, still more preferably 2 to 3, particularly preferably 2. .

The compound (A) may or may not have a heteroatom such as an oxygen atom, a nitrogen atom, or a sulfur atom in addition to the functional group capable of forming an ester bond. When the compound (A) has a heteroatom, the ratio of the number of carbon atoms in the compound (A) to the number of heteroatoms excluding a functional group capable of forming an ester bond [number of carbon atoms/number of heteroatoms] is preferably 10 or more, more preferably It is 15 or more, more preferably 20 or more, still more preferably 25 or more, and particularly preferably 30 or more. When the heteroatom is not contained or the ratio is 10 or more, the polarity of the polyester resin becomes low, and the dielectric constant of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition containing it becomes low.

Examples of compound (A), which is a polycarboxylic acid, include dimer acids of unsaturated fatty acids. The number of carbon atoms in the unsaturated fatty acid is preferably 10 or more, more preferably 16 or more. Examples of the unsaturated fatty acid dimer acid include dimer acid of oleic acid, dimer acid of linoleic acid, dimer acid of erucic acid, and dimer acid obtained by combining two kinds of these unsaturated fatty acids.

Examples of compound (A) that is a polyol include dimer diol. Dimer diols include reduced products of dimer acids of unsaturated fatty acids. The unsaturated fatty acid preferably has 10 or more carbon atoms, more preferably 12 or more carbon atoms, still more preferably 14 or more carbon atoms, and particularly preferably 16 or more carbon atoms. Examples of the dimer diol include a reduced form of dimer acid of oleic acid, a reduced form of dimer acid of linoleic acid, a reduced form of dimer acid of erucic acid, and a reduced form of dimer acid obtained by combining two kinds of these unsaturated fatty acids. be done.

The polyester-based resin contains at least structural units derived from the compound (A). The polyester-based resin includes structural units derived from polycarboxylic acids other than the compound (A) (other polycarboxylic acids), structural units derived from polyols other than the compound (A) (other polyols), and these It may contain other structural units other than

The content of the structural units derived from the compound (A) in the polyester resin is preferably 30% by mass or more with respect to 100% by mass of the total amount of structural units derived from the monomers constituting the polyester resin, and more It is preferably 35% by mass or more, more preferably 40% by mass or more, still more preferably 45% by mass or more, and particularly preferably 50% by mass or more. When the content is 30% by mass or more, the polarity of the polyester resin becomes low, and the dielectric constant of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition containing it becomes low.

Specifically, the polyester-based resin includes (i) structural units derived from the compound (A) as a polyol, structural units derived from other polyvalent carboxylic acids, and, if necessary, other polyols. (ii) a structural unit derived from the compound (A) as a polyvalent carboxylic acid, a structural unit derived from another polyol, and optionally derived from another polyvalent carboxylic acid (iii) a structural unit derived from the compound (A) as a polyol, a structural unit derived from the compound (A) as a polyvalent carboxylic acid, and, if necessary, other poly Examples thereof include polyester-based resins containing structural units derived from a carboxylic acid and/or structural units derived from other polyols.

Examples of the above-mentioned other polyvalent carboxylic acids include dicarboxylic acids and trivalent or higher carboxylic acids. Examples of dicarboxylic acids include malonic acid, succinic acid, glutaric acid, dimethylglutaric acid, adipic acid, trimethyladipic acid, pimelic acid, suberic acid, azelaic acid, dodecanedioic acid, sebacic acid, thiodipropionic acid, and diglycol. Aliphatic dicarboxylic acids such as acids; dimer acids having 19 or less carbon atoms; 1,2-cyclopentanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 4 - alicyclic dicarboxylic acids such as methyl-1,2-cyclohexanedicarboxylic acid, norbornanedicarboxylic acid, adamantanedicarboxylic acid; unsaturated such as maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic acid, dodecenylsuccinic anhydride Dicarboxylic acids; aromatics such as isophthalic acid, terephthalic acid, orthophthalic acid, benzylmalonic acid, 2,2′-biphenyldicarboxylic acid, 4,4′-biphenyldicarboxylic acid, 4,4′-dicarboxydiphenyl ether, and naphthalene dicarboxylic acid dicarboxylic acids; derivatives thereof, and the like. Examples of the above derivatives include carboxylates, carboxylic acid anhydrides, carboxylic acid halides, carboxylic acid esters, and the like. Trivalent or higher carboxylic acids include trimellitic acid, pyromellitic acid, adamantanetricarboxylic acid, trimesic acid, and trimeric acid. Only one kind of the other polyvalent carboxylic acids may be used, or two or more kinds thereof may be used.

A plant-derived polycarboxylic acid may be used as the polycarboxylic acid (the compound (A) which is a polycarboxylic acid and the other polycarboxylic acid). Examples of the above plant-derived polycarboxylic acids include polycarboxylic acids produced using glucose (e.g., succinic acid, adipic acid, itaconic acid, etc.), vegetable oils (e.g., palm oil, coconut oil, rapeseed oil, etc.) Examples include dimer acids of saturated fatty acids (eg, oleic acid, linoleic acid, erucic acid, etc.), sebacic acid derived from castor oil, and the like.

Examples of the above-mentioned other polyols include diols and trivalent or higher polyols. Examples of diols include (poly)alkylene glycols such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, and polytetramethylene glycol; 1,3-propanediol, 2- Methyl-1,3-propanediol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2-isobutyl- 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,6- Hexanediol, 2-methyl-1,3-hexanediol, 2,2,4-trimethyl-1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, etc. dimer diols having 19 or less carbon atoms; 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, spiroglycol, tricyclodecanedimethanol, adamantanediol, 2 , 2,4,4-tetramethyl-1,3-cyclobutanediol; 4,4'-thiodiphenol, 4,4'-methylenediphenol, 4,4'-dihydroxybiphenyl, o -, m-, and p-dihydroxybenzene, 2,5-naphthalenediol, p-xylenediol, and aromatic diols such as ethylene oxide and propylene oxide adducts thereof. Trivalent or higher polyols include pentaerythritol, dipentaerythritol, tripentaerythritol, glycerin, trimethylolpropane, trimethylolethane, 1,3,6-hexanetriol, and adamantanetriol. Only one kind of the other polyols may be used, or two or more kinds thereof may be used.

Plant-derived polyols may be used as the polyols (compound (A) which is a polyol and the other polyols). Examples of the plant-derived polyols include polyols produced using glucose (e.g., ethylene glycol, propylene glycol, butanediol, isosorbide, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, etc.), vegetable oils (e.g., palm oil, coconut oil). dimer diol, which is a reductant of dimer acid of unsaturated fatty acids (e.g., oleic acid, linoleic acid, erucic acid, etc.) derived from rapeseed oil, etc.; 1,10-decanediol, which is a reductant of sebacic acid derived from castor oil; is mentioned.

The total content of structural units derived from dicarboxylic acids and structural units derived from diols in the polyester resin is 90% with respect to 100% by mass of the total amount of structural units derived from monomers constituting the polyester resin. It is preferably at least 95% by mass, more preferably at least 98% by mass, particularly preferably at least 99% by mass (eg, 99 to 100% by mass).

When the compound (A) is a polyvalent carboxylic acid, the content of structural units derived from the compound (A) in the polyester resin is the proportion of the structural units derived from the polyvalent carboxylic acid that constitutes the polyester resin. With respect to the total amount of 100% by mass, for example, it is 30% by mass or more, may be 40% by mass or more, and may be 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass. % by mass or more, more preferably 85% by mass or more, particularly preferably 90% by mass or more, and may be 95% by mass or more.

When the compound (A) is a polyol, the content of structural units derived from the compound (A) in the polyester resin is based on the total amount of structural units derived from the polyol constituting the polyester resin, 100% by mass. For example, it is 30% by mass or more, and may be 40% by mass or more, 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably is 85% by mass or more, particularly preferably 90% by mass or more, and may be 95% by mass or more.

The content of the structural unit derived from the polycarboxylic acid in the polyester resin is, for example, 0.5 equivalent or more, preferably 0.58 equivalent or more, more preferably 0.66 equivalent or more per equivalent of polyol. , more preferably 0.83 equivalents or more, more preferably 0.88 equivalents or more, and particularly preferably 0.95 equivalents or more. In addition, the content is, for example, 2.0 equivalents or less, preferably 1.7 equivalents or less, more preferably 1.5 equivalents or less, still more preferably 1.2 equivalents or less, still more preferably 1.2 equivalents or less per equivalent of polyol. It is 1.1 equivalents or less, particularly preferably 1.05 equivalents or less.

The equivalent ratio of the structural units derived from the polycarboxylic acid in the polyester resin and the structural units derived from the polyol is not particularly limited. An equivalence ratio can be set. When the equivalent ratio of the polycarboxylic acid is high, the properties based on the polycarboxylic acid can be easily exhibited. Further, when the equivalent ratio of the polyol is high, the properties based on the polyol can be easily exhibited.

The weight average molecular weight (Mw) of the polyester resin is preferably 3,000 or more, more preferably 5,000 or more, still more preferably 10,000 or more, still more preferably 15,000 or more, and particularly preferably 20,000 or more. When the weight average molecular weight is 3,000 or more, the cohesive force of the pressure-sensitive adhesive layer increases, and the holding power and high-temperature holding power are improved. The weight average molecular weight is, for example, 300,000 or less, preferably 250,000 or less, more preferably 200,000 or less, and even more preferably 150,000 or less.

The glass transition temperature (Tg) of the polyester resin is preferably 10° C. or less, more preferably 5° C. or less, more preferably 0° C. or less, still more preferably −5° C. or less, and particularly preferably −10° C. or less. . By using a polyester-based resin having a low Tg, the pressure-sensitive adhesive layer formed has excellent adhesiveness. From the viewpoint of the cohesive strength of the adhesive layer, the Tg of the polyester resin is preferably -60°C or higher, more preferably -55°C or higher, still more preferably -50°C or higher, and particularly preferably -45°C or higher. be. The Tg of the polyester-based resin can be adjusted by appropriately changing the monomer composition (that is, the types and usage ratio of the monomers used in the synthesis of the polyester-based resin). The Tg of the polyester-based resin is measured as the Tg of the pressure-sensitive adhesive layer, specifically, for example, by the method described in Examples.

The adhesive composition preferably contains the polyester resin as a base polymer. The content of the polyester resin is preferably more than 50% by mass, more preferably 60% by mass or more, and still more preferably 70% by mass or more with respect to 100% by mass of the total amount of all resins contained in the pressure-sensitive adhesive composition. , 80% by mass or more.

The method for obtaining the polyester-based resin is not particularly limited, and a known or commonly used polyester-based resin polymerization method can be appropriately employed. Specifically, the polyester-based resin can be obtained by polycondensation of a polyvalent carboxylic acid and a polyol, like general polyesters. More specifically, the reaction between the carboxy group of the polyvalent carboxylic acid and the hydroxy group of the polyol is allowed to proceed while removing the water generated by the above reaction (generated water) and the like out of the reaction system, thereby producing a polyester resin. can be synthesized. As a method for removing the generated water out of the reaction system, an inert gas is blown into the reaction system and the generated water is taken out of the reaction system together with the inert gas. A method of dehydration by boiling, a method of distilling off the water produced from the reaction system under reduced pressure (decompression method), and the like can be mentioned. In addition, the above polyester-based resin can employ a transesterification reaction using a polyvalent ester and a polyol.

Examples of the above-mentioned polyvalent esters include esters of the above-mentioned polyvalent carboxylic acids. Examples of the above esters include alkyl esters such as methyl ester and ethyl ester; and hydroxyalkyl esters such as 2-hydroxyethyl ester. Among them, hydroxyalkyl ester is preferred, and 2-hydroxyethyl ester is more preferred. In this case, the melting point tends to be lower than that of polyvalent carboxylic acids and their alkyl esters, and the resulting polyester-based resin has excellent handleability. It has the advantages of excellent reactivity and excellent hydrolysis resistance of polyester resins. In addition, bis(2-hydroxyethyl)terephthalate bis can be synthesized by chemically recycling PET, and thus has excellent environmental adaptability.

The reaction temperature and reaction time when performing various reactions such as the above polycondensation, and the degree of pressure reduction (pressure in the reaction system) when adopting the pressure reduction method, the polyester resin with the desired characteristics (e.g. molecular weight) is efficiently used. can be set as appropriate. Although not particularly limited, the above reaction temperature is usually suitable to be 150° C. or higher (for example, 180° C. to 260° C.). By setting the reaction temperature within the above range, a favorable reaction rate is obtained, productivity is improved, and deterioration of the produced polyester-based resin is easily prevented or suppressed. The reaction time is not particularly limited, and is about 3 to 48 hours. When the depressurization method is employed, the degree of depressurization can be, for example, 4 kPa to 0.1 kPa, although it is not particularly limited. By setting the pressure in the reaction system within the above range, the water produced by the reaction can be efficiently distilled out of the system, and a favorable reaction rate can be easily maintained. In addition, when the reaction temperature is relatively high, the pressure in the reaction system is set to the lower limit value or higher to easily prevent the starting polycarboxylic acid or polyol from being distilled out of the system. From the viewpoint of stably maintaining the pressure in the reaction system, it is usually appropriate to set the pressure in the reaction system to 0.1 kPa or more.

For the above reaction, a suitable amount of a known or commonly used catalyst can be used for esterification and condensation, as in general polyester synthesis. Examples of the catalyst include metal compounds such as titanium, germanium, antimony, tin and zinc; strong acids such as p-toluenesulfonic acid and sulfuric acid. The amount of catalyst used can be appropriately set according to the reaction rate and the like.

A solvent may or may not be used in the above process of synthesizing a polyester-based resin by reacting a polyol with a polycarboxylic acid or a polyvalent ester. The above syntheses can be carried out substantially free of organic solvents, ie intentionally free of organic solvents.

(crosslinking agent)
The pressure-sensitive adhesive composition may contain a cross-linking agent. The cross-linking agent has the effect of cross-linking the polyester-based resins, and can also function as a chain extender for the polyester-based resin. When the above-mentioned cross-linking agent is included, a cross-linked structure of the polyester-based resin is formed in the pressure-sensitive adhesive layer to be formed, and the cohesive force is improved. Only one kind of the crosslinking agent may be used, or two or more kinds thereof may be used.

Examples of the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, and metal salt-based cross-linking agents. Examples include cross-linking agents, carbodiimide cross-linking agents, oxazoline cross-linking agents, aziridine cross-linking agents, amine cross-linking agents, silicone cross-linking agents, and silane cross-linking agents. As the cross-linking agent, an isocyanate-based cross-linking agent is preferable from the viewpoint of excellent impact resistance of the pressure-sensitive adhesive layer to be formed.

The number of functional groups in the cross-linking agent is 2 or more, preferably 2-4, more preferably 2-3. In particular, an isocyanate-based cross-linking agent having the number of functional groups within the above range is preferable from the viewpoint of particularly excellent impact resistance of the pressure-sensitive adhesive layer to be formed.

Examples of the isocyanate-based cross-linking agent (polyfunctional isocyanate compound) include lower aliphatic Polyisocyanates; Alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate , 4,4′-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic polyisocyanates. Examples of the isocyanate-based crosslinking agent also include lower aliphatic polyisocyanate-modified isocyanurates such as 1,5-pentamethylene diisocyanate-modified isocyanurate and 1,6-hexamethylene diisocyanate-modified isocyanurate. Furthermore, lower aliphatic polyisocyanate adducts such as ethylene glycol/1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate, 1,4- Butanediol/lower aliphatic polyisocyanate adducts such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate and 1,6-hexamethylene diisocyanate, 1,6-hexanediol/ lower aliphatic polyisocyanate adducts such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate and 1,6-hexamethylene diisocyanate; trimethylolpropane/tolylene diisocyanate adducts; Also included are trimethylolpropane/hexamethylene diisocyanate adducts and trimethylolpropane/xylylene diisocyanate adducts.

Examples of the epoxy-based cross-linking agent (polyfunctional epoxy compound) include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidyl aminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether , glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalate diglycidyl ester, triglycidyl-tris(2 -hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule.

The content of the cross-linking agent in the pressure-sensitive adhesive composition is preferably 0.1 parts by mass or more with respect to 100 parts by mass of the polyester resin. In addition, the content is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, still more preferably 16 parts by mass or less with respect to the total amount of 100 parts by mass of the polyester resin. , more preferably 12 parts by mass or less, and particularly preferably 10 parts by mass or less. When the content of the cross-linking agent is 0.1 parts by mass or more, the cohesive force of the pressure-sensitive adhesive layer is improved. On the other hand, when the content of the cross-linking agent is 30 parts by mass or less, the pressure-sensitive adhesive layer has appropriate flexibility, and the pressure-sensitive adhesive strength tends to be improved.

(crosslinking catalyst)
The pressure-sensitive adhesive composition may contain a cross-linking catalyst in addition to the cross-linking agent in order to allow the cross-linking reaction to proceed more effectively. Only one kind of the above-mentioned crosslinking catalyst may be used, or two or more kinds thereof may be used.

Examples of the crosslinking catalyst include zirconium-containing compounds (zirconium-based catalysts) such as zirconium tetraacetylacetonate, zirconium monoacetylacetonate, zirconium ethylacetoacetate, and zirconium octylate compounds; dioctyltin dilaurate, dibutyltin dilaurate, and dibutyltin diacetate. , dibutyltin diacetylacetonate, tetra-n-butyltin, trimethyltin hydroxide, butyltin oxide, and other tin (Sn)-containing compounds (tin-based catalysts); aluminum-sec-butoxide, aluminum trisacetylacetonate, aluminum bisethylacetoacetate , Aluminum-containing compounds (aluminum-based catalysts) such as aluminum trisethylacetoacetate; Iron-containing compounds (iron-based catalysts) such as Nasem ferric iron; , titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetoacetate, and other titanium-containing compounds (titanium-based catalysts).

The content of the crosslinking catalyst in the adhesive composition is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, and still more preferably 100 parts by mass in total of the polyester resin. It is 0.01 part by mass or more. The content of the cross-linking catalyst is preferably 3 parts by mass or less, more preferably 2 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass as the total amount of the polyester resin.

(Hydrolysis resistant agent)
The pressure-sensitive adhesive composition may contain a hydrolysis-resistant agent (anti-hydrolysis agent). By adding a hydrolysis-resistant agent, the hydrolysis reaction in the pressure-sensitive adhesive composition or pressure-sensitive adhesive layer is suppressed, and good durability is likely to be obtained. Only one type of the hydrolysis stabilizer may be used, or two or more types may be used.

The hydrolysis-resistant agent is not particularly limited, and known or commonly used hydrolysis-resistant agents can be used. Examples of the anti-hydrolysis agent include oxazoline group-containing compounds, epoxy group-containing compounds, and carbodiimide group-containing compounds. Among them, carbodiimide group-containing compounds are preferred.

Examples of the carbodiimide group-containing compounds include dicyclohexylcarbodiimide, diisopropylcarbodiimide, dimethylcarbodiimide, diisobutylcarbodiimide, dioctylcarbodiimide, t-butylisopropylcarbodiimide, diphenylcarbodiimide, di-t-butylcarbodiimide, di-β-naphthylcarbodiimide, polycarbodiimide, cyclic Examples include structural carbodiimides. The above polycarbodiimide is a compound in which two or more carbodiimide groups are bonded via a linking group composed of an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof. In addition, the cyclic structure carbodiimide has one or more carbodiimide groups in its molecular structure, and the first carbodiimide group is bound by a linking group composed of an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof. It is a compound in which one nitrogen atom and a second nitrogen atom are bonded to form a ring structure. The bonding group may have a heteroatom or a substituent.

The content of the hydrolysis resistant agent in the pressure-sensitive adhesive composition is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, with respect to 100 parts by mass of the polyester resin. Preferably, it is 0.3 parts by mass or more. The content of the anti-hydrolysis agent is, for example, 5 parts by mass or less, preferably 3 parts by mass or less, and more preferably 1 part by mass or less.

(tackifying resin)
The pressure-sensitive adhesive composition may contain a tackifying resin. By adding a tackifying resin, the adhesive strength to the adherend is improved. Only one type of the tackifying resin may be used, or two or more types may be used.

The tackifying resin is not particularly limited, and known or commonly used tackifying resins can be used. Examples of the tackifying resin include phenol-based tackifying resins, terpene-based tackifying resins, rosin-based tackifying resins, hydrocarbon-based tackifying resins, epoxy-based tackifying resins, polyamide-based tackifying resins, elastomer-based tackifying resins, A ketone-based tackifying resin and the like can be mentioned.

Examples of the phenol-based tackifier resin include terpene phenol resins, hydrogenated terpene phenol resins, alkylphenol resins, and rosin phenol resins. The terpene phenol resin is a polymer containing a terpene residue and a phenol residue, and is a copolymer of a terpene and a phenol compound (terpene-phenol copolymer resin), a homopolymer or a copolymer of a terpene. Phenol-modified ones (phenol-modified terpene resins) can be mentioned. Examples of terpenes constituting the terpene phenol resin include monoterpenes such as α-pinene, β-pinene, and limonene (d-form, l-form, d/l-form (dipentene), etc.). The above hydrogenated terpene phenol resin is a resin having a structure obtained by hydrogenating the above terpene phenol resin. The above alkylphenol resin is a resin (oily phenolic resin) obtained from alkylphenol and formaldehyde. Examples of the alkylphenol resin include novolac type and resol type. The rosin phenol resin is a phenol-modified rosin or various rosin derivatives described later. The rosin phenol resin can be obtained, for example, by adding phenol to rosins or various rosin derivatives described later with an acid catalyst and thermally polymerizing them.

Examples of the terpene-based tackifying resin include polymers of terpenes (typically monoterpenes) such as α-pinene, β-pinene, d-limonene, l-limonene and dipentene. The polymer of terpenes may be a homopolymer of one kind of terpenes or a copolymer of two or more kinds of terpenes. Examples of homopolymers of terpenes include α-pinene polymer, β-pinene polymer, and dipentene polymer. The modified terpene-based tackifying resin is a modified terpene resin (modified terpene resin). Examples of the modified terpene resins include styrene-modified terpene resins and hydrogenated terpene resins.

The rosin-based tackifying resins include rosins and rosin derivative resins. Examples of the rosins include unmodified rosins (fresh rosins) such as gum rosin, wood rosin and tall oil rosin; disproportionated rosin, polymerized rosin, other chemically modified rosins, etc.). Examples of the rosin derivative resin include derivatives of the above rosins. Examples of the rosin derivative resin include rosin esters such as an unmodified rosin ester that is an ester of an unmodified rosin and an alcohol, and a modified rosin ester that is an ester of a modified rosin and an alcohol; Unsaturated fatty acid-modified rosins modified with fatty acids; Unsaturated fatty acid-modified rosin esters obtained by modifying rosin esters with unsaturated fatty acids; Rosins or rosin alcohols obtained by reducing the carboxy groups of the above rosin derivatives; Rosins Alternatively, metal salts of the various rosin derivatives described above may be used. Specific examples of the rosin esters include unmodified rosin or modified rosin methyl ester, triethylene glycol ester, glycerin ester, pentaerythritol ester, and the like.

Examples of the hydrocarbon-based tackifying resin include aliphatic hydrocarbon resins, aromatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, and aliphatic/aromatic petroleum resins (styrene-olefin copolymers, etc.). , aliphatic/alicyclic petroleum resins, hydrogenated hydrocarbon resins, coumarone-based resins, and coumarone-indene-based resins.

The content of the tackifying resin in the pressure-sensitive adhesive composition is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and still more preferably 15 parts by mass with respect to 100 parts by mass as the total amount of the polyester resin. That's it. The content of the tackifying resin is, for example, 70 parts by mass or less, preferably 60 parts by mass or less, and more preferably 50 parts by mass or less.

The above pressure-sensitive adhesive composition may contain other components other than the components described above, as necessary, within a range that does not impair the effects of the present invention. Examples of the other components include resins other than the polyester resins, curing catalysts, cross-linking accelerators, polymerization initiators, oligomers, anti-aging agents, fillers (metal powder, organic fillers, inorganic fillers, etc.), Colorants (pigments, dyes, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, UV absorbers, polymerization inhibitors, rust inhibitors, Granules, foils, flame retardants, silane coupling agents, ion trapping agents and the like. Only one kind of each of the other components may be used, or two or more kinds thereof may be used.

The above pressure-sensitive adhesive composition may have any form, and examples thereof include solvent-type, emulsion-type, hot-melt-type, and non-solvent-type.

As described above, the pressure-sensitive adhesive composition of the present invention may be solvent-based, that is, it may contain an organic solvent. The organic solvent is not particularly limited as long as it is an organic compound used as a solvent. Examples include hydrocarbon solvents such as cyclohexane, hexane, heptane, and methylcyclohexane; aromatic solvents such as toluene and xylene; ester solvents such as ethyl acetate and methyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; alcohol solvents such as methanol, ethanol, propanol, butanol and isopropyl alcohol; carbonate solvents such as dimethyl carbonate and diethyl carbonate etc. Only one kind of the organic solvent may be used, or two or more kinds thereof may be used.

[Adhesive layer]
A pressure-sensitive adhesive layer can be formed using the pressure-sensitive adhesive composition. A pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition of the present invention may be referred to as "the pressure-sensitive adhesive layer of the present invention". The pressure-sensitive adhesive layer is formed, for example, by coating the pressure-sensitive adhesive composition on the release-treated surface of the release liner or the substrate to form the pressure-sensitive adhesive composition layer, and then solidifying the pressure-sensitive adhesive composition layer by removing the solvent by heating. It can be made by

The pressure-sensitive adhesive layer preferably contains the polyester-based resin (especially as a base polymer). The content of the polyester resin is preferably more than 50% by mass, more preferably 60% by mass or more, and still more preferably 70% by mass or more, relative to the total amount of 100% by mass of all resins contained in the pressure-sensitive adhesive layer. It may be 80% by mass or more, 90% by mass or more, or 95% by mass or more.

The content of the polyester resin in the pressure-sensitive adhesive layer is preferably more than 50% by mass, more preferably 60% by mass or more, and still more preferably 70% by mass or more with respect to 100% by mass of the total amount of the pressure-sensitive adhesive layer. and may be 80% by mass or more.

The pressure-sensitive adhesive layer may contain components other than the polyester-based resin within a range that does not impair the effects of the present invention. Examples of the other components include those exemplified and explained as components that the pressure-sensitive adhesive composition may contain. Only one kind of the other components may be used, or two or more kinds thereof may be used.

The total light transmittance of the pressure-sensitive adhesive layer (according to JIS K7361-1) is not particularly limited, but is preferably 88% or higher, more preferably 89% or higher, and still more preferably 90% or higher. When the total light transmittance is 88% or more, excellent transparency and excellent appearance can be obtained, and it can be preferably used for optical applications.

The total light transmittance of the adhesive layer can be measured by evaluating the total light transmittance by the same method as described above using a laminate in which the adhesive layer and the optical film are laminated. . Specifically, for example, when the total light transmittance of the optical film is close to 100%, it can be determined that the total light transmittance of the laminate and the total light transmittance of the adhesive layer are approximately the same.

The haze of the pressure-sensitive adhesive layer (according to JIS K7136) is not particularly limited, but is preferably 1.5% or less, more preferably 1.4% or less, still more preferably 1.3% or less, and still more preferably 1.2% or less, more preferably 1.0% or less, more preferably 0.9% or less, still more preferably 0.8% or less, even more preferably 0.7% or less, particularly preferably 0.6% or less is. When the haze is 1.5% or less, excellent transparency and excellent appearance can be obtained, and it can be preferably used for optical applications.

The haze value of the pressure-sensitive adhesive layer can be estimated by evaluating the haze by the same method as described above using a laminate in which the pressure-sensitive adhesive layer and the optical film are laminated. Specifically, for example, when the haze value of the optical film is close to 0%, it can be determined that the haze value of the laminate and the haze value of the adhesive layer are approximately the same.

Regarding the hue of the pressure-sensitive adhesive layer, b ^* indicated by the L ^* a ^* b ^* color system is preferably in the range of 0.0 to 2.0, more preferably 0.0 to 1.5, More preferably 0.0 to 1.2, more preferably 0.0 to 1.0, still more preferably 0.0 to 0.8, and particularly preferably 0.0 to 0.5. b ^* indicates the yellow-blue axis, and in the range of 0.0 to 2.0, the smaller the value, the smaller the yellowness, the better the transparency and appearance, and the better the optical applications. In this specification, b ^* indicated by the L ^* a ^* b ^* color system of the pressure-sensitive adhesive layer is a value calculated from the linear transmittance of the pressure-sensitive adhesive layer.

The hue (b*) ^of the pressure-sensitive adhesive layer can be determined by evaluating the hue (b ^* ) by the same method as described above using a laminate in which the pressure-sensitive adhesive layer and the optical film are laminated. can be done. Specifically, for example, when the hue of the optical film is close to 0, it can be determined that the hue (b ^* ) of the laminate and the hue (b ^* ) of the pressure-sensitive adhesive layer are approximately the same.

The total light transmittance, haze, and b ^* of the pressure-sensitive adhesive layer are adjusted by adjusting the monomer composition of the polyester-based resin constituting the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer, the type and content of additives, etc. can be adjusted accordingly.

The 180° peel adhesive strength of the pressure-sensitive adhesive layer to a glass plate at a tensile speed of 300 mm/min is not particularly limited, but is preferably 1 N/20 mm or more, more preferably 2 N/20 mm or more, and still more preferably 3 N/20 mm or more. be. When the 180° peel adhesive strength is a certain value or more, the adhesiveness to glass and the ability to prevent lifting on steps are further improved. Although the 180° peel adhesive strength is not particularly limited, it is preferably 20 N/20 mm or less, more preferably 18 N/20 mm or less, and even more preferably 16 N/20 mm or less.

The 180° peel adhesive strength of the adhesive layer is determined by evaluating the 180° peel adhesive strength in the same manner as described above using a laminate in which the adhesive layer and the optical film are laminated. be able to.

Although the glass plate is not particularly limited, for example, the product name "Soda Lime Glass #0050" (manufactured by Matsunami Glass Industry Co., Ltd.) can be mentioned. In addition, non-alkali glass, chemically strengthened glass, and the like can also be used.

The 180 ° peel adhesive strength is determined by the monomer composition, weight average molecular weight, amount of crosslinking agent used (addition amount) of the polyester resin that constitutes the adhesive composition for forming the adhesive layer, and the type of other additives. and content can be controlled.

The storage modulus of the pressure-sensitive adhesive layer at 23° C. is not particularly limited, but is preferably 5.0×10 ⁴ Pa or more, more preferably 7.5×10 ⁴ Pa or more, still more preferably 1.0×10 ^{5 .} Pa or more. When the storage elastic modulus is 5.0×10 ⁴ Pa or more, dents are less likely to occur during handling, and favorable adhesion reliability can be easily obtained, which is preferable. In addition, from the viewpoint of conformability to unevenness and absorption of foreign substances, the storage elastic modulus of the adhesive layer at 25° C. is preferably 2.0×10 ⁶ Pa or less, more preferably 1.5×10 ⁶ Pa or less, and further preferably 1.5×10 6 Pa or less. It is preferably 1.0×10 ⁶ Pa or less. The storage modulus of the adhesive layer is measured when dynamic viscoelasticity is performed at a frequency of 1 Hz. The above storage modulus is the real part of the shear modulus represented by a complex number, and the tensile modulus can be converted in consideration of the Poisson's ratio of the sample.

The storage elastic modulus of the pressure-sensitive adhesive layer is determined by the monomer composition of the polyester resin constituting the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer, the weight average molecular weight, the amount (addition amount) of the cross-linking agent, and other additives. can be controlled by the type and content of

The gel fraction (proportion of insoluble components) of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 3% or more, more preferably 5% or more, still more preferably 10% or more, and particularly preferably 15% or more. The gel fraction (proportion of insoluble components) of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 95% or less, more preferably 90% or less, and still more preferably 85% or less. When the gel fraction is 3% or more, the cohesive force of the pressure-sensitive adhesive layer is improved, and dents are less likely to occur during handling. When the gel fraction is 95% or less, appropriate flexibility is obtained, adhesiveness and conformability to irregularities are improved, and foreign substances are less likely to be absorbed.

The gel fraction is determined, for example, by the monomer composition of the polyester resin constituting the adhesive composition for forming the adhesive layer, the weight average molecular weight, the amount of the cross-linking agent used (addition amount), the type of other additives, and the It can be controlled by the content or the like.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 10 to 250 μm, more preferably 10 to 200 μm, still more preferably 10 to 175 μm, still more preferably 10 to 150 μm, still more preferably 10 to 125 μm, and particularly preferably 10 to 125 μm. is 10-100 μm. When the thickness is at least a certain value, it is preferable because the conformability to irregularities and the adhesion reliability are improved. When the thickness is less than a certain value, it is preferable because foreign substances are less likely to be absorbed during handling, and the handleability and manufacturability are particularly excellent. Further, the pressure-sensitive adhesive layer can suppress noise amplification even when the thickness is thin.

The method for producing the pressure-sensitive adhesive layer is not particularly limited. After forming, if necessary, the solvent is removed by heating or heat curing is performed to solidify the coating layer.

[Adhesive sheet]
A pressure-sensitive adhesive sheet can be obtained using the pressure-sensitive adhesive layer of the present invention. A pressure-sensitive adhesive sheet provided with the pressure-sensitive adhesive layer of the present invention may be referred to as "the pressure-sensitive adhesive sheet of the present invention". The pressure-sensitive adhesive sheet may be a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layer surfaces on both sides, or may be a single-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layer surfaces on only one side. Among them, a double-sided pressure-sensitive adhesive sheet is preferable from the viewpoint of bonding two members together. In this specification, the term "adhesive sheet" includes a tape-like one, that is, "adhesive tape". Moreover, in this specification, the adhesive layer surface may be called an "adhesive surface."

The pressure-sensitive adhesive sheet may be a so-called "base-less type" pressure-sensitive adhesive sheet (hereinafter sometimes referred to as a "base-less pressure-sensitive adhesive sheet") that does not have a base material (base material layer), or may be a so-called "base-less pressure-sensitive adhesive sheet". It may be a type of pressure-sensitive adhesive sheet having a material (hereinafter sometimes referred to as a "base-attached pressure-sensitive adhesive sheet"). Examples of the substrate-less pressure-sensitive adhesive sheet include, for example, a double-sided pressure-sensitive adhesive sheet consisting of only the pressure-sensitive adhesive layer of the present invention, a pressure-sensitive adhesive layer of the present invention and a pressure-sensitive adhesive layer other than the pressure-sensitive adhesive layer of the present invention ("other pressure-sensitive adhesive layer ”) and the like. On the other hand, examples of the pressure-sensitive adhesive sheet with a substrate include a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer of the present invention on at least one side of a substrate. Among them, a substrate-less pressure-sensitive adhesive sheet (a substrate-less double-sided pressure-sensitive adhesive sheet) is preferable, and a substrate-less double-sided pressure-sensitive adhesive sheet comprising only the pressure-sensitive adhesive layer of the present invention is more preferable. A pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides of a substrate (double-sided pressure-sensitive adhesive sheet with substrate) is also preferable. The pressure-sensitive adhesive layers on both sides of the double-sided pressure-sensitive adhesive sheet with a substrate may be the pressure-sensitive adhesive layers of the present invention, or one side may be the pressure-sensitive adhesive layer of the present invention and the other side may be another pressure-sensitive adhesive layer. good too. The above-mentioned "base material (base material layer)" does not include a release liner that is peeled off when the adhesive sheet is used (attached).

If the above pressure-sensitive adhesive sheet is a pressure-sensitive adhesive sheet with a substrate, it is preferable that the pressure-sensitive adhesive sheet be a substrate-less pressure-sensitive adhesive sheet because the substrate may cause radiation loss of millimeter waves. However, when the base material is made of a material with a low dielectric constant and low dielectric loss, the pressure-sensitive adhesive sheet with a base material may be used.

The base material is an element that functions as a support for the adhesive layer in the adhesive sheet. Substrates include, for example, plastic substrates (especially plastic films). The base material may be a single layer or a laminate of the same or different base materials.

The substrate is not particularly limited, but includes various optical films such as plastic films, antireflection (AR) films, antiglare (AG) films, polarizing plates, and retardation plates. Materials for the plastic film include, for example, polyester resins such as polyethylene terephthalate (PET), acrylic resins such as polymethyl methacrylate (PMMA), polycarbonate, triacetyl cellulose (TAC), polysulfone, polyarylate, polyimide, Polyvinyl chloride, polyvinyl acetate, polyethylene, polypropylene, ethylene-propylene copolymer, trade name “Arton” (cyclic olefin polymer, manufactured by JSR Corporation), trade name “Zeonor” (cyclic olefin polymer, Nippon Zeon Co., Ltd.) (manufactured by the company) and other plastic materials such as cyclic olefin polymers and fluoropolymers. These plastic materials may be used alone or in combination of two or more.

The surface of the substrate on which the pressure-sensitive adhesive layer is provided may be subjected to, for example, corona discharge treatment, plasma treatment, sand mat treatment, ozone exposure treatment, flame treatment, etc., for the purpose of enhancing adhesion, retention, etc. with the pressure-sensitive adhesive layer. Physical treatments such as exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; The surface treatment for enhancing adhesion is preferably applied to the entire surface of the adhesive layer side of the substrate.

The base material may be a noise reduction film. The noise reduction film is not particularly limited as long as it has noise reduction performance, and examples thereof include those having a noise reduction layer formed on at least one side of a film substrate. The noise reduction layer may be a single layer or multiple layers, and is not particularly limited as long as it has a function of reducing electromagnetic noise, but from the viewpoint of transparency, a transparent conductive layer is preferred. As the transparent conductive layer, a thin film layer formed of a conductive organic or inorganic material, or a conductive layer formed by partially contacting a conductive organic or inorganic material can be employed.

The adhesive sheet may have a release liner on the adhesive surface until use. The release liner protects the adhesive surface in contact with the pressure-sensitive adhesive layer until use, and is peeled off when the pressure-sensitive adhesive layer is used. When the above-mentioned adhesive sheet is a double-sided adhesive sheet, each adhesive surface may be protected by two release liners, respectively, or a roll of one release liner having release surfaces on both sides may be used. It may be protected in a wound form. A release liner is used as a protective material for the pressure-sensitive adhesive layer, and is peeled off when applied to an adherend. In addition, when the pressure-sensitive adhesive sheet is a substrate-less pressure-sensitive adhesive sheet, the release liner also serves as a support for the pressure-sensitive adhesive layer. Note that the release liner may not necessarily be provided.

Examples of base materials for the release liner include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, poly Butylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, A fluorine resin film etc. are mentioned. Moreover, these crosslinked films are also mentioned. Furthermore, a laminated film of these may be used.

The release surface of the release liner (especially the surface in contact with the pressure-sensitive adhesive layer) is preferably subjected to a release treatment. Examples of release agents used in the release treatment include alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based release agents.

Although the thickness of the release liner is not particularly limited, it is, for example, about 20 to 150 μm.

[Use]
Applications of the pressure-sensitive adhesive composition of the present invention, the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive sheet of the present invention are not particularly limited, and they can be used for any purpose. For example, it can be used for optical purposes, that is, for bonding to optical members. By using the pressure-sensitive adhesive composition of the present invention, the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive sheet of the present invention for optical applications, the reliability is excellent. For example, unlike acrylic resins, polyester resins are presumed to have no carbon-carbon double bonds, are less likely to yellow over time, and are particularly suitable for optical applications.

The pressure-sensitive adhesive composition of the present invention, the pressure-sensitive adhesive layer of the present invention, and the pressure-sensitive adhesive sheet of the present invention can be used, for example, in optical members such as electric and electronic devices, where various members or parts are attached to predetermined sites (e.g., housings, front plates, etc.). , window part, etc.). It should be noted that "electrical/electronic equipment" refers to equipment corresponding to at least one of electric equipment and electronic equipment. Examples of the electric/electronic devices include image display devices such as liquid crystal displays, organic/inorganic electroluminescence displays, and plasma displays, and mobile electronic devices. Examples of the image display device include an image display device for the portable electronic device, an in-vehicle display, and a digital signage (electronic signboard/electronic bulletin board). The image display device may have a form (structure) such as a so-called "rigid type" or a so-called "flexible type". It may be of a form (structure) that can be folded.

Examples of the portable electronic devices include mobile phones, smartphones, tablet computers, notebook computers, and various wearable devices (for example, wrist wear types that are worn on the wrist like wristwatches, clips, straps, etc. that are attached to a part of the body) Modular type to be worn, eyewear type including eyeglass type (monocular type and binocular type, including head-mounted type), clothing type that can be attached to shirts, socks, hats, etc. in the form of accessories, ears such as earphones earwear type, etc.), digital cameras, digital video cameras, audio equipment (portable music players, IC recorders, etc.), calculators (calculators, etc.), portable game devices, electronic dictionaries, electronic notebooks, electronic books, in-vehicle information equipment, Examples include portable radios, portable televisions, portable printers, portable scanners, and portable modems. In this specification, the term “portable” means not only being able to be carried but also having a level of portability that allows individuals (standard adults) to relatively easily carry it. shall mean.

Specifically, the use of the pressure-sensitive adhesive layer of the present invention and the pressure-sensitive adhesive sheet of the present invention is preferably for bonding a touch sensor and an image display device provided between the touch sensor and the image display device. It is particularly preferable that the pressure-sensitive adhesive layer of the present invention is directly laminated on the touch sensor. Moreover, the pressure-sensitive adhesive layer of the present invention may be directly laminated on the image display device, or may be laminated via another layer such as a polarizing film. Since the pressure-sensitive adhesive layer of the present invention hardly causes noise amplification, it is possible to make it difficult for noise emitted from the image display device to be transmitted to the touch sensor.

In addition, the pressure-sensitive adhesive layer of the present invention and the pressure-sensitive adhesive sheet of the present invention are useful for bonding members constituting an antenna (millimeter wave antenna) used for millimeter wave communication. Since the pressure-sensitive adhesive layer of the present invention has low dielectric constant and low dielectric loss in a high frequency band such as millimeter waves, it is possible to suppress radiation loss of millimeter waves. As used herein, “millimeter wave communication” means communication in the frequency band from 20 GHz to 300 GHz.

[Optical laminate]
By providing the pressure-sensitive adhesive layer of the present invention or the pressure-sensitive adhesive sheet of the present invention between the touch sensor and the image display device, an optical laminate ( optical laminate) is obtained. The above-mentioned optical layered body may be provided with a touch sensor and an adhesive layer each as a single layer, or may be provided with multiple layers. When a plurality of touch sensors are provided, it is preferable that the touch sensors are laminated via an adhesive layer. When a plurality of pressure-sensitive adhesive layers are provided, the plurality of pressure-sensitive adhesive layers may be the same layer or different layers in terms of composition, thickness, and the like. When multiple pressure-sensitive adhesive layers are provided, at least one layer is the pressure-sensitive adhesive layer of the present invention. All pressure-sensitive adhesive layers provided between the touch sensor and the image display device are preferably pressure-sensitive adhesive layers of the present invention.

Examples of the image display device include those described above. The touch sensor is a capacitive type touch sensor, and is, for example, a transparent conductive film in which a transparent conductive layer is provided on a glass plate or a transparent plastic film (especially PET film, polycarbonate film, cyclic olefin polymer film). be. The pressure-sensitive adhesive layer of the present invention is preferably attached so as to be in contact with the transparent conductive layer.

Examples of the transparent conductive layer include thin films of ITO (indium tin oxide), ZnO, SnO, and CTO (cadmium tin oxide). In addition, the transparent conductive layer can be formed of silver, copper, CNT (carbon nanotube), or the like. Also, a metal mesh sensor such as Ag nanowires or Ag/Cu can be employed for the transparent conductive layer. Further, the touch sensor may have lead-out wiring formed of a thin film of copper or silver paste at its end.

The optical laminate may include a cover member. The cover member is provided on the surface of the touch sensor opposite to the image display device side, and protects the touch sensor and the image display device in the optical layered body. Examples of the cover member include a cover glass and a plastic cover. The cover member may be attached to a layer constituting the optical laminate such as a touch sensor via an adhesive layer. The pressure-sensitive adhesive layer may be the pressure-sensitive adhesive layer of the present invention, but other pressure-sensitive adhesive layers may be used because the function of suppressing the amplification of noise generated by the image display device is not required. Further, the optical laminate may include a polarizing film on the surface of the image display device (the surface on the side where the touch sensor is provided).

The optical laminate may include a noise reduction layer (noise reduction film, etc.). The noise reduction layer is preferably provided between the touch sensor and the image display device from the viewpoint that a function of suppressing amplification of noise generated by the image display device is required. The noise reduction layer and the touch sensor, and the noise reduction layer and the image display device are each laminated via an adhesive layer (preferably the adhesive layer of the present invention). The noise reduction layer may be a single layer or multiple layers. When a plurality of noise reduction layers are provided, the plurality of noise reduction layers may be the same layer or different layers with respect to composition, thickness, and the like.

1 to 3 show an embodiment of the optical laminate of the present invention. The optical laminate 1 shown in FIG. 1 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a touch sensor 41, a touch sensor 42, and a cover member 3 in this order. The polarizing film 6 and the touch sensor 41 are bonded together by an adhesive layer (adhesive sheet) 21 , and the touch sensor 41 and the touch sensor 42 are bonded together by an adhesive layer (adhesive sheet) 22 . The adhesive layers 21 and 22 are the adhesive layers of the present invention. Also, the touch sensor 42 and the cover member 3 are bonded together by an adhesive layer (adhesive sheet) 23 . The adhesive layer 23 is another adhesive layer.

The optical laminate 1 shown in FIG. 2 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a touch sensor 43, and a cover member 3 in this order. The touch sensor 43 has the functions of both the

touch sensors

41 and 42 in FIG. 1, for example. The polarizing film 6 and the touch sensor 43 are bonded together with the adhesive layer 21 . The adhesive layer 21 is the adhesive layer of the present invention. Also, the touch sensor 43 and the cover member 3 are bonded together by the adhesive layer 23 . The adhesive layer 23 is another adhesive layer.

The optical laminate 1 shown in FIG. 3 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a noise reduction layer 44, a touch sensor 43, and a cover member 3 in this order. The polarizing film 6 and the noise reduction layer 44 are bonded together by the adhesive layer 21 , and the noise reduction layer 44 and the touch sensor 43 are bonded together by the adhesive layer 22 . The adhesive layers 21 and 22 are the adhesive layers of the present invention. Also, the touch sensor 43 and the cover member 3 are bonded together by the adhesive layer 23 . The adhesive layer 23 is another adhesive layer.

1 to 3, the polarizing film 6 may not be provided. In this case, the image display device 5 and the

touch sensors

41 and 43 or the noise reduction layer 44 are bonded together with the adhesive layer 21 .

[millimeter wave antenna]
A millimeter wave antenna can be obtained using the adhesive layer of the present invention. A millimeter wave antenna provided with the pressure-sensitive adhesive layer of the present invention may be referred to as a "millimeter wave antenna of the present invention". As a member constituting the millimeter wave antenna, a substrate (hereinafter referred to as a “millimeter wave antenna substrate”) having an antenna element (hereinafter sometimes referred to as “millimeter wave antenna element”) for transmitting and receiving millimeter waves on at least one side may be referred to as).

Examples of the millimeter wave antenna substrate include the plastic films exemplified and explained as the above base material. Among them, materials with low dielectric constant and low dielectric loss are preferable from the viewpoint of being able to suppress the radiation loss of millimeter waves. A cyclic olefin-based polymer such as a cyclic olefin-based polymer (manufactured by Nippon Zeon Co., Ltd.) is preferred.

The dielectric constant of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, still more preferably 2.1 to 4.5, from the viewpoint of suppressing radiation loss of millimeter waves. 2.2 to 4.0, more preferably 2.2 to 3.5, more preferably 2.2 to 3.4, still more preferably 2.2 to 3.3, still more preferably 2.2 to 3.3. 2, more preferably 2.2 to 3.1, and particularly preferably 2.2 to 3.0. In addition, the dielectric loss of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 0.0001 to 0.05, more preferably 0.001 to 0.02, more preferably 0.001 to 0.02, from the viewpoint of suppressing the radiation loss of millimeter waves. Preferably 0.002 to 0.019, more preferably 0.003 to 0.018, more preferably 0.004 to 0.017, more preferably 0.005 to 0.016, more preferably 0.006 to 0.015, more preferably 0.007 to 0.014, more preferably 0.008 to 0.013, still more preferably 0.009 to 0.012, particularly preferably 0.01 to 0.011.

The millimeter wave antenna substrate is preferably transparent. The total light transmittance (in accordance with JIS K7361-1) in the visible light wavelength region of the millimeter wave antenna substrate is not particularly limited, but is preferably 85% or more, more preferably 88% or more, still more preferably 89% or more, and It is preferably 90% or more, more preferably 91% or more, and particularly preferably 92% or more. In addition, the haze (according to JIS K7136) of the millimeter wave antenna substrate is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, and still more preferably 1.0% or less. It is 0.9% or less, particularly preferably 0.8% or less.

The thickness of the millimeter wave antenna substrate is preferably 5 to 250 μm from the viewpoint of suppressing radiation loss of millimeter waves while mounting the millimeter wave antenna element. Note that the millimeter wave antenna substrate may have either a single-layer structure or a multilayer structure. Further, the surface of the millimeter wave antenna substrate is appropriately subjected to known or commonly used surface treatments such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as undercoating treatment, and coating layers such as hard coating. may have been

The millimeter wave antenna element provided on the millimeter wave antenna substrate is not particularly limited as long as it can transmit and receive millimeter waves, but from the viewpoint of efficiently receiving millimeter waves with mobile communication devices such as smartphones, it is preferable to use a phased array antenna. can be done. A phased array antenna is an antenna that enables transmission and reception in a desired direction by arranging a plurality of antenna elements in an array and controlling the phase of each antenna element. In other words, a phased array antenna can transmit and receive radio waves in a desired direction by electronically controlling the phase of each antenna element (beam steering) regardless of the direction of the antenna. It becomes possible.

As the millimeter wave antenna element, known antennas can be used without particular limitation. From antenna structures, slot antenna structures, planar inverted-F antenna structures, monopoles, dipoles, helical antenna structures, Yagi (Yagi-Uda) antenna structures, surface integrated waveguide structures, hybrids of these designs, etc. Antenna elements having resonating elements formed thereon may be mentioned. Different types of mm-wave antenna elements may be used for different frequency band combinations. From the viewpoint of efficient reception of millimeter waves by mobile communication devices such as smartphones, a phased array antenna in which patch antenna elements are arranged in an array is preferable.

Materials constituting the millimeter wave antenna element are not particularly limited, and examples include titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, palladium, and platinum. , tungsten, zirconium, tantalum, hafnium, ITO (indium-tin oxide), zinc oxide, tin oxide, and other metal oxides. Furthermore, materials containing two or more of these metals or metal oxides, and alloys containing these metals as main components are also included. Among them, silver, copper, and ITO are preferred from the viewpoint of conductivity, and ITO is more preferred from the viewpoint of transparency and visibility. That is, it is preferable that the millimeter wave antenna element is made of ITO. When the antenna element is made of a metal such as silver or copper, a nitride, oxide, sulfide, or the like of the metal is added for the purpose of concealing the antenna element in order to prevent deterioration of visibility due to reflection of the metal. A blackening treatment may be performed by forming a film of.

In addition, the millimeter wave antenna substrate may include a transmission line path for transferring signals transmitted and received by the millimeter wave antenna elements to the transmitter/receiver circuit. Transmission line paths include coaxial cable paths, microstrip transmission lines, stripline transmission lines, edge-coupled microstrip transmission lines, edge-coupled stripline transmission lines, waveguide structures (e.g. , coplanar waveguides or grounded coplanar waveguides), transmission lines formed from combinations of these types of transmission lines, and the like. The material that constitutes the transmission line path is also not particularly limited, and the material that constitutes the millimeter wave antenna element can be used.

Examples of members that make up the millimeter wave antenna include a cover member laminated on the millimeter wave antenna substrate to protect the millimeter wave antenna elements arranged on the millimeter wave antenna substrate. Although the cover member is not particularly limited, for example, optical films such as glass and plastic films can be used. Examples of materials for plastic films include polyester resins such as polyethylene terephthalate (PET), (meth)acrylic resins such as polymethyl methacrylate (PMMA), polycarbonate, triacetyl cellulose (TAC), polysulfone, polyarylate, Polyimide, transparent polyimide, polyvinyl chloride, polyvinyl acetate, fluororesin, polyethylene, polypropylene, ethylene-propylene copolymer, trade name "Arton" (cyclic olefin polymer, manufactured by JSR Corporation), trade name "Zeonor" (Cyclic olefin polymer, manufactured by Nippon Zeon Co., Ltd.) and other plastic materials such as cyclic olefin polymers. In addition, these plastic materials may use only 1 type, and may use 2 or more types.

The dielectric constant of the cover member at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, still more preferably 2.0 to 5.0, from the viewpoint of suppressing radiation loss of millimeter waves. 2 to 4.0, more preferably 2.2 to 3.5, more preferably 2.2 to 3.4, more preferably 2.2 to 3.3, more preferably 2.2 to 3.2, More preferably 2.2 to 3.1, particularly preferably 2.2 to 3.0. In addition, the dielectric loss of the cover member at 28 GHz and/or 60 GHz is preferably 0.0001 to 0.05, more preferably 0.001 to 0.02, even more preferably 0.001 to 0.02, from the viewpoint of suppressing millimeter-wave radiation loss. is 0.002 to 0.019, more preferably 0.003 to 0.018, more preferably 0.004 to 0.017, more preferably 0.005 to 0.016, more preferably 0.006 to 0 0.015, more preferably 0.007 to 0.014, more preferably 0.008 to 0.013, still more preferably 0.009 to 0.012, and particularly preferably 0.01 to 0.011.

The cover member is preferably transparent. The total light transmittance of the cover member in the visible light wavelength region (according to JIS K7361-1) is not particularly limited, but is preferably 85% or more, more preferably 88% or more, still more preferably 89% or more, and still more preferably It is 90% or more, more preferably 91% or more, and particularly preferably 92% or more. In addition, the haze of the cover member (according to JIS K7136) is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, still more preferably 0.0% or less. It is 9% or less, particularly preferably 0.8% or less.

The thickness of the cover member is preferably 0.025 to 1.5 mm from the viewpoint of suppressing radiation loss of millimeter waves. In addition, the cover member may have either a single-layer structure or a multilayer structure. The surface of the cover member is appropriately subjected to known or conventional surface treatments such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as undercoating, and coating layers such as hard coating. may

The adhesive sheet of the present invention is preferably used for manufacturing millimeter wave antennas used in mobile communication devices. Examples of the mobile communication devices include mobile phones, PHS, smart phones, tablets (tablet computers), mobile computers (mobile PCs), and personal digital assistants (PDAs).

The millimeter wave antenna may have members other than the millimeter wave antenna substrate, the cover member, and the adhesive sheet described above. , reflective film, anti-reflection film, hard coat film, transparent conductive film, design film, decorative film, surface protection plate, prism, lens, color filter, transparent substrate, image display panel (e.g. liquid crystal display panel, organic EL panel , plasma display panel, etc.). The image display panel may have a touch sensor.

The millimeter wave antenna may be placed at any position on the mobile communication device, and specifically, may be placed on the front, back, or side of the mobile communication device. The front surface of the mobile communication device is the surface that faces the user when the user uses the mobile communication device. do. Note that the display panel refers to a structure composed of at least a lens (particularly a glass lens) and a touch panel.

The size (width) of the millimeter wave antenna is not limited either, and it may be formed on the entire surface of each surface of the mobile communication device, or may be arranged partially. Also, the shape of the millimeter wave antenna is not particularly limited, and may be rectangular, circular, or wire-shaped, for example. Alternatively, they may be arranged in a frame shape. Furthermore, the number of millimeter wave antennas arranged in the mobile communication device is not limited, and may be one, or a plurality may be arranged at arbitrary positions. When a plurality of millimeter wave antennas are arranged, the size (width) may be the same or different. A dummy pattern without a millimeter wave antenna may be placed in a portion of the mobile communication device where the millimeter wave antenna is not placed in order to improve visibility.

The millimeter-wave antenna is a millimeter-wave antenna having at least the adhesive sheet of the present invention and a substrate, wherein the substrate has an antenna element (millimeter-wave antenna element) on one side, and the antenna of the substrate (millimeter-wave antenna substrate) It is sufficient that the pressure-sensitive adhesive sheet of the present invention is adhered to the side having the element, and other points are not particularly limited. Since the pressure-sensitive adhesive sheet of the present invention in the millimeter wave antenna is a pressure-sensitive adhesive sheet for use, it does not have a release liner.

As the millimeter wave antenna, a millimeter wave antenna substrate may or may not necessarily have the adhesive sheet of the present invention. from the viewpoint of suppressing radiation loss of waves). Further, the separate optical member may be singular or plural.

The mode of bonding the millimeter wave antenna and the another optical member in the above mode is not particularly limited, but for example, (1) the millimeter wave antenna substrate and the another optical member are bonded via the pressure-sensitive adhesive sheet of the present invention. (2) A mode in which the pressure-sensitive adhesive sheet of the present invention including or constituting a millimeter wave antenna substrate is adhered to another optical member; (3) A millimeter wave antenna via the pressure-sensitive adhesive sheet of the present invention. Examples include a mode in which the substrate is attached to a member other than the millimeter wave antenna substrate, and a mode in which (4) the pressure-sensitive adhesive sheet of the present invention containing or constituting the millimeter wave antenna substrate is attached to a member other than the millimeter wave antenna substrate. In addition, in the above aspect (2), the pressure-sensitive adhesive sheet of the present invention is preferably a double-sided pressure-sensitive adhesive sheet whose base material is a millimeter wave antenna substrate.

Next, a preferred embodiment of the millimeter wave antenna will be described with reference to the drawings. FIG. 4 shows a millimeter wave antenna including at least a substrate that is an adhesive sheet (adhesive layer) 11 and a millimeter wave antenna substrate 12, the millimeter wave antenna substrate 12 having a millimeter wave antenna element 13 on one side and an adhesive sheet 11 is attached to the surface of the millimeter wave antenna substrate 12 on the side having the millimeter wave antenna element 13 .

FIG. 5 shows the millimeter wave antenna 10 including the cover member 14, the adhesive sheet 11, and the millimeter wave antenna substrate 12 in this order in contact with each other. The millimeter wave antenna substrate 12 has a millimeter wave antenna element 13 on the surface on the side of the adhesive sheet 11, and the adhesive sheet 11 is adhered to the surface of the millimeter wave antenna substrate 12 on the side having the millimeter wave antenna element 13. ing. The cover member 14 is preferably glass, the millimeter wave antenna substrate 12 is preferably COP in terms of low dielectric constant and low dielectric loss, and the millimeter wave antenna element 13 is copper, silver, or ITO. is preferred.

FIG. 6 shows a millimeter wave antenna including a cover member 14, an adhesive sheet (adhesive layer) 11a, a millimeter wave antenna substrate 12, an adhesive sheet (adhesive layer) 11b, and an image display panel 15 in contact with each other in this order. 10 are listed. The millimeter wave antenna substrate 12 has the millimeter wave antenna element 13 on the surface on the side of the adhesive sheet 11a, and the adhesive sheet 11a is attached to the surface of the millimeter wave antenna substrate 12 on the side having the millimeter wave antenna element 13. ing. The cover member 14 is preferably made of glass, the millimeter wave antenna substrate 12 is preferably made of COP from the viewpoint of low dielectric constant and low dielectric loss, and the millimeter wave antenna element 13 is preferably made of COP from the viewpoint of transparency and visibility. Therefore, it is preferably ITO, or silver or copper blackened with a film of nitride, oxide, sulfide, or the like. The adhesive sheet 11b may be the adhesive sheet of the present invention or may not be the adhesive sheet of the present invention, but is preferably the adhesive sheet of the present invention. The image display panel 15 may have a touch sensor (not shown).

In the millimeter wave antenna 10 shown in FIGS. 4 to 6, the

adhesive sheets

11, 11a, and preferably the adhesive sheet 11b are composed of the adhesive layer of the present invention with low dielectric constant and dielectric loss in a high frequency band. The radiation loss of millimeter waves is suppressed, and millimeter wave communication can be performed efficiently. In addition, since millimeter wave communication can be performed efficiently, the antenna area can be reduced, and the antenna can be miniaturized.

The embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention.

Although the present invention will be described in more detail with reference to examples below, the present invention is not limited by these examples.

Synthesis example 1
(Synthesis of polyester resin (A1))
A three-necked separable flask was equipped with a stirrer, a thermometer, and a vacuum pump. 2033", manufactured by Croda, molecular weight 537, carbon number 36, diol, number of heteroatoms other than hydroxyl group 0) 140 g, titanium tetranormal butoxide as a catalyst (product name "Orgatics TA-21", manufactured by Matsumoto Fine Chemicals Co., Ltd.) 0.2 g was charged, and the temperature was raised to 180° C. while stirring in a nitrogen atmosphere. After reaching 180° C., the temperature was raised to 210° C. while stirring in a reduced pressure atmosphere (2.0 kPa or less), and this temperature was maintained. The reaction was continued for about 4 hours to obtain a polyester resin (A1). The polyester resin (A1) had a weight average molecular weight (Mw) of 41,000 and a glass transition temperature (Tg) of -20°C.

Synthesis example 2
(Synthesis of polyester resin (A2))
A three-necked separable flask was equipped with a stirrer, a thermometer, and a vacuum pump. 2033", manufactured by Croda, molecular weight 537, carbon number 36, diol, number of heteroatoms other than hydroxyl group 0) 140 g, titanium tetranormal butoxide as a catalyst (product name "Orgatics TA-21", manufactured by Matsumoto Fine Chemicals Co., Ltd.) 0.05 g was charged, and the temperature was raised to 180° C. while stirring in a nitrogen atmosphere. After reaching 180° C., the temperature was raised to 210° C. while stirring in a reduced pressure atmosphere (2.0 kPa or less), and this temperature was maintained. The reaction was continued for about 4 hours to obtain a polyester resin (A2). This polyester resin (A2) had an Mw of 59,000 and a Tg of -20°C.

Synthesis example 3
(Synthesis of polyester resin (A3))
A three-necked separable flask was equipped with a stirrer, a thermometer, and a vacuum pump. 2033", manufactured by Croda, molecular weight 537, carbon number 36, diol, number of heteroatoms other than hydroxy group 0) 122.9 g, polytetramethylene glycol (manufactured by Mitsubishi Chemical Corporation, molecular weight 2000) 23.6 g, titanium as catalyst 0.2 g of tetra-normal butoxide (product name “Orgatics TA-21”, manufactured by Matsumoto Fine Chemicals Co., Ltd.) was charged, and the temperature was raised to 180° C. while stirring in a nitrogen atmosphere. After reaching 180° C., the temperature was raised to 210° C. while stirring in a reduced pressure atmosphere (2.0 kPa or less), and this temperature was maintained. The reaction was continued for about 4 hours to obtain a polyester resin (A3). This polyester-based resin (A3) had an Mw of 43,000 and a Tg of -29°C.

Synthesis example 4
(Synthesis of polyester resin (A4))
A three-necked separable flask was equipped with a stirrer, a thermometer, and a vacuum pump. Heteroatom number other than 0) 97.8 g, dimer diol (product name "PRIPOL 2033", manufactured by Croda, molecular weight 537, carbon number 36, diol, heteroatom number other than hydroxy group 0) 102.2 g, oxidation as a catalyst 0.2 g of dibutyltin (manufactured by Kanto Kagaku Co., Ltd.) was added, and the temperature was raised to 200° C. while stirring in a reduced pressure atmosphere (2.0 kPa or less), and this temperature was maintained. The reaction was continued for about 5 hours to obtain a polyester resin (A4). This polyester resin (A4) had an Mw of 30,000 and a Tg of -43°C.

Synthesis example 5
(Synthesis of polyester resin (A5))
A four-necked separable flask was equipped with a stirrer, a thermometer, a nitrogen tube, and a water separator, and 100 g of ethylene glycol (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight 62) and dimer acid (product name: Pripol 1009) were added. , Croda Co., Ltd., molecular weight 567, carbon number 36, divalent carboxylic acid, number of heteroatoms other than carboxy group 0) 700 g, terephthalic acid (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight 166) 63 g, di-n- as a polymerization catalyst 0.46 g of butyltin oxide (manufactured by Kishida Chemical Co., Ltd., molecular weight: 249) and 40 g of xylene as a reaction water discharge solvent were charged, heated to 180° C. while stirring in a nitrogen atmosphere, and maintained at this temperature. After a while, outflow and separation of the reaction water was observed, and the reaction started to progress. The reaction was continued for about 24 hours to obtain a polyester resin (A5). This polyester resin (A5) had an Mw of 100,000 and a Tg of -33°C.

Example 1
To 100 parts by mass of polyester resin (A1), 3 parts by mass of hexamethylene diisocyanate-modified isocyanurate (trade name "Coronate HX", manufactured by Tosoh Corporation) as a cross-linking agent (B1), and an organic zirconium compound (trade name " Orgatics ZC-162", Matsumoto Fine Chemicals Co., Ltd.) 0.03 parts by mass, and toluene were added to prepare an adhesive composition (adhesive solution). This adhesive solution was applied to the release-treated surface of a release-treated polyethylene terephthalate (PET) film (trade name “Diafoil MRF #38”, manufactured by Mitsubishi Chemical Corporation) so that the thickness after drying was 25 μm. and dried at 120° C. for 3 minutes to obtain an adhesive layer. After that, the pressure-sensitive adhesive layer was attached to the release-treated surface of a release-treated PET film (trade name “Diafoil MRE #38”, manufactured by Mitsubishi Chemical Corporation), and left at 60 ° C. for 3 days. A substrate-less pressure-sensitive adhesive sheet was produced.

Example 2
The polyester resin (A2) was used instead of the polyester resin (A1), and the amount of the cross-linking agent used was changed to 2 parts by mass with respect to 100 parts by mass of the polyester resin (A2). The adhesive composition and substrate-less adhesive sheet of Example 2 were prepared in the same manner as in Example 1 except for the above.

Example 3
A polyester resin (A2) was used in place of the polyester resin (A1). The adhesive composition and substrate-less adhesive sheet of Example 3 were prepared in the same manner as in Example 1 except for the above.

Example 4
100 parts by mass of polyester resin (A2), 3 parts by mass of bifunctional isocyanate (trade name "Duranate D101", manufactured by Asahi Kasei Corporation) as a cross-linking agent (B2), and an organic zirconium compound (trade name "Orgatics ZC-162", manufactured by Matsumoto Fine Chemical Co., Ltd.) and toluene were added to prepare an adhesive composition (adhesive solution). Otherwise, the adhesive composition and substrate-less adhesive sheet of Example 4 were produced in the same manner as in Example 1.

Example 5
A polyester resin (A3) was used in place of the polyester resin (A1). Otherwise, the adhesive composition and substrate-less adhesive sheet of Example 5 were produced in the same manner as in Example 1.

Example 6
A polyester resin (A4) was used instead of the polyester resin (A1). The adhesive composition and substrate-less adhesive sheet of Example 6 were prepared in the same manner as in Example 1 except for the above.

Example 7
A polyester resin (A4) was used instead of the polyester resin (A1), and the amount of the cross-linking agent used was changed to 4 parts by mass with respect to 100 parts by mass of the polyester resin (A4). The adhesive composition and substrate-less adhesive sheet of Example 7 were prepared in the same manner as in Example 1 except for the above.

Example 8
A polyester resin (A5) was used in place of the polyester resin (A1). The adhesive composition and substrate-less adhesive sheet of Example 8 were prepared in the same manner as in Example 1 except for the above.

Example 9
Polyester resin (A1) 100 parts by mass, bifunctional isocyanate (trade name "Duranate D101", manufactured by Asahi Kasei Corporation) 3 parts by mass as a cross-linking agent (B2), an organic zirconium compound (trade name "Orgatics ZC-162", manufactured by Matsumoto Fine Chemical Co., Ltd.) 0.03 parts by mass, hydrogenated terpene phenolic resin ("YS Polyster U115", manufactured by Yasuhara Chemical Co., Ltd.) 20 parts by mass as a tackifying resin (C1), and toluene are added, An adhesive composition (adhesive solution) was prepared. A substrate-less pressure-sensitive adhesive sheet of Example 9 was prepared in the same manner as in Example 1 except for the above.

Example 10
A rosin ester resin (“Pine Crystal KE-359”, manufactured by Arakawa Chemical Co., Ltd.) was used as the tackifier resin (C2) instead of the tackifier resin (C1). Otherwise, the adhesive composition and substrate-less adhesive sheet of Example 10 were produced in the same manner as in Example 9.

Example 11
A rosin ester resin (“Pine Crystal KE-311”, manufactured by Arakawa Chemical Co., Ltd.) was used as the tackifier resin (C3) instead of the tackifier resin (C1). Otherwise, the adhesive composition and substrate-less adhesive sheet of Example 11 were produced in the same manner as in Example 9.

Example 12
The amount of the tackifying resin (C3) used was changed to 40 parts by mass with respect to 100 parts by mass of the polyester resin (A1). Otherwise, the adhesive composition and substrate-less adhesive sheet of Example 12 were produced in the same manner as in Example 11.

<Evaluation>
Evaluation methods for the polyester-based resins prepared in Synthesis Examples and the pressure-sensitive adhesive sheets prepared in Examples are shown below.

(1) weight average molecular weight (Mw)
The weight average molecular weight (Mw) of the polyester resin is a value converted to standard polystyrene obtained by GPC (gel permeation chromatography). As the GPC apparatus, the apparatus name "HLC-8320GPC" (column: TSKgelGMH-H(S), manufactured by Tosoh Corporation) was used, and the following conditions were used.
Column: TSKgelGMH-H (S)
Column temperature: 40°C
Eluent: THF (0.1% by mass of amine component added)
Flow rate: 0.5mL/min
Injection volume: 100 μL
Detector: differential refractometer (RI)
Standard sample: polystyrene (PS)

(2) Dielectric constant and dielectric loss The pressure-sensitive adhesive layer obtained in the example (a PET film that has been subjected to silicone treatment is peeled from the pressure-sensitive adhesive sheet) was sandwiched between a copper foil and an electrode, and was measured at a frequency of 100 kHz using the following device. Dielectric constant and dielectric loss were measured. For the measurement, 3 samples were produced, and the average of the measured values of the 3 samples was taken as the dielectric constant and the dielectric loss.
The dielectric constant of the adhesive layer at a frequency of 100 kHz was measured according to JIS K6911 under the following conditions.
Measurement method: volumetric method (apparatus: Agilent Technologies 4294A Precision Impedance Analyzer)
Electrode configuration: 12.1 mmΦ, 0.5 mm thick aluminum plate Counter electrode: 3 oz copper plate Measurement environment: 23 ± 1°C, 52 ± 1% RH

(3) Total light transmittance and haze From the pressure-sensitive adhesive sheet obtained in the example, one of the peel-treated PET films was peeled off, and the exposed pressure-sensitive adhesive surface was placed on a slide glass (trade name “White polishing No. 1” ( Thickness 0.8 to 1.0 mm, total light transmittance 92%, haze 0.2%, b ^* 0.15), manufactured by Matsunami Glass Industry Co., Ltd.), autoclave treatment (50 ° C., 0.5 MPa) , 15 min) was performed. After the treatment, the other peel-treated PET film was peeled off to prepare a test piece having a layer structure of [adhesive sheet (adhesive layer)/slide glass]. The total light transmittance and haze of the above test piece in the visible light region were measured using a haze meter (device name "HSP-150Vis", manufactured by Murakami Color Research Laboratory Co., Ltd.) at 23 ± 1 ° C. and 52 ± 1% RH environment. Measured below. Three samples were prepared for each specimen, and the average of the measured values of these three samples was taken as the total light transmittance and haze in the visible light region.

(4) Hue (b ^* )
One of the PET films subjected to the release treatment was peeled off from the pressure-sensitive adhesive sheet obtained in the example, and the exposed pressure-sensitive adhesive surface was applied to a slide glass (trade name “White polishing No. 1” (thickness 0.8 to 1.0 mm , total light transmittance 92%, haze 0.2%, b ^* 0.15), manufactured by Matsunami Glass Industry Co., Ltd.) and autoclaved (50° C., 0.5 MPa, 15 minutes). After the treatment, the other peel-treated PET film was peeled off to prepare a test piece having a layer structure of [adhesive sheet (adhesive layer)/slide glass]. The b ^* in the visible light region of the test piece was measured using an ultraviolet-visible near-infrared spectrophotometer (device name "UH4150", manufactured by Hitachi High-Technology Science Co., Ltd.) at 23 ± 1 ° C. and 52 ± 1% RH environment. Measured below. Three samples were prepared for each specimen, and the average of the measured values of these three samples was taken as b ^* in the visible light region.

(5) 180° peel adhesive strength
A sheet piece having a length of 100 mm and a width of 20 mm was cut out from the pressure-sensitive adhesive sheet obtained in the example. Next, the peel-treated PET film on one side of the adhesive sheet was peeled off, and the exposed adhesive surface was pasted (backed) with a PET film (trade name “Lumirror S-10#25” manufactured by Toray Industries, Inc.). Next, the other PET film subjected to the peeling treatment was peeled off, and a glass plate (trade name “soda lime glass #0050”, manufactured by Matsunami Glass Industry Co., Ltd.) was used as a test plate. to prepare a sample composed of [test plate/adhesive layer/PET film]. The obtained sample was autoclaved (50° C., 0.5 MPa, 15 minutes) and then allowed to cool in an atmosphere of 23° C. and 50% RH for 30 minutes. After cooling, using a tensile tester (equipment name "EZ Test/EZ-S", manufactured by Shimadzu Corporation), in accordance with JIS Z0237, under an atmosphere of 23 ° C. and 50% RH, a tensile speed of 300 mm / min. , the adhesive sheet (adhesive layer/PET film) was peeled off from the test plate at a peel angle of 180°, and the 180° peel adhesive strength (N/20 mm) was measured.

(6) Tg and storage elastic modulus The pressure-sensitive adhesive layers obtained in the examples were laminated and punched out to prepare a disc-shaped test piece of 2 mm thickness x 8 mm diameter. This test piece is sandwiched between parallel plates for a shear test, and a dynamic viscoelasticity measuring device (device name "ARES-G2", manufactured by TA Instruments) is used to measure loss elastic modulus G' under the measurement conditions described below. ' and storage modulus G' were measured. The peak value of the ratio of loss modulus to storage modulus (G''/G')=Tan δ was read as the Tg of the pressure-sensitive adhesive layer.
・Measurement: Shear mode ・Temperature range: -50°C to 150°C
・Temperature increase rate: 5°C/min
・Frequency: 1Hz

(7) Gel fraction Approximately 0.1 g of the pressure-sensitive adhesive layer obtained in Examples was sampled and wrapped in a porous tetrafluoroethylene sheet (trade name “NTF1122”, manufactured by Nitto Denko Corporation) having an average pore size of 0.2 μm. After that, it was tied with a kite string, and the weight at that time was measured, and the weight was defined as the weight before immersion (Z). The weight before immersion is the total weight of the adhesive layer (the adhesive layer collected above), the tetrafluoroethylene sheet, and the kite string. In addition, the total weight of the tetrafluoroethylene sheet and the kite string was also measured, and this weight was taken as the wrapper weight (Y).
Next, the adhesive layer was wrapped with a tetrafluoroethylene sheet and tied with kite string (referred to as a "sample"), placed in a 50 ml container filled with ethyl acetate or toluene, and allowed to stand at 23°C for 7 days. After that, remove the sample (after ethyl acetate or toluene treatment) from the container, transfer it to an aluminum cup, dry it in a dryer at 130 ° C. for 2 hours to remove the ethyl acetate or toluene, measure the weight, This weight was defined as the weight after immersion (X).
Then, the gel fraction was calculated from the following formula.
Gel fraction [% (% by weight)] = (XY) / (ZY) x 100

Variations of the invention according to the present disclosure are described below.
[Appendix 1] A polyester resin containing a structural unit derived from a compound having 20 or more carbon atoms and having two or more functional groups capable of forming an ester bond,
A pressure-sensitive adhesive composition having a dielectric constant of 4.0 or less at a frequency of 100 kHz when the pressure-sensitive adhesive layer is formed.
[Appendix 2] The pressure-sensitive adhesive composition according to appendix 1, which has a dielectric loss of 0.0001 to 0.15 at a frequency of 100 kHz when the pressure-sensitive adhesive layer is formed.
[Appendix 3] The pressure-sensitive adhesive composition according to Appendix 1 or 2, wherein the polyester resin has a glass transition temperature of 0° C. or lower.
[Appendix 4] A pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition according to any one of Appendices 1 to 3.
[Appendix 5] A pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer according to Appendix 4.

1

optical laminates

21, 22, 23 adhesive layer (adhesive sheet)
3

cover members

41, 42, 43 touch sensor 44 noise reduction layer 5 image display device 6 polarizing film 10

millimeter wave antennas

11, 11a, 11b adhesive sheet (adhesive layer)
12 millimeter wave antenna substrate 13 millimeter wave antenna element 14 cover member 15 image display panel

Claims

A polyester resin containing a structural unit derived from a compound having 20 or more carbon atoms and having two or more functional groups capable of forming an ester bond,
A pressure-sensitive adhesive composition having a dielectric constant of 4.0 or less at a frequency of 100 kHz when the pressure-sensitive adhesive layer is formed.
The adhesive composition according to claim 1, wherein the dielectric loss at a frequency of 100 kHz when the adhesive layer is formed is 0.0001 to 0.15.
The adhesive composition according to claim 1, wherein the polyester resin has a glass transition temperature of 0°C or lower.
A pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition according to any one of claims 1 to 3.
A pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer according to claim 4.