WO2023140095A1 - Capacitor module and power converter - Google Patents

Capacitor module and power converter Download PDF

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Publication number
WO2023140095A1
WO2023140095A1 PCT/JP2022/048647 JP2022048647W WO2023140095A1 WO 2023140095 A1 WO2023140095 A1 WO 2023140095A1 JP 2022048647 W JP2022048647 W JP 2022048647W WO 2023140095 A1 WO2023140095 A1 WO 2023140095A1
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WO
WIPO (PCT)
Prior art keywords
support
capacitor
laminate film
capacitor element
fixing
Prior art date
Application number
PCT/JP2022/048647
Other languages
French (fr)
Japanese (ja)
Inventor
賢 城岸
甲児 ▲高▼垣
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2023575178A priority Critical patent/JPWO2023140095A1/ja
Publication of WO2023140095A1 publication Critical patent/WO2023140095A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/66—Current collectors
    • H01G11/72—Current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation

Definitions

  • the present invention relates to capacitor modules and power converters.
  • a capacitor that uses a laminate film as an exterior material is known.
  • a surface-mount capacitor disclosed in Patent Document 1 has a capacitor element covered with a laminate film.
  • the surface mount capacitor described in Patent Document 1 has room for improvement in terms of improving durability.
  • a capacitor module and a power conversion device with improved durability are provided.
  • a capacitor module includes one or more capacitor elements covered with a laminate film, and a support having a frame portion for fixing the laminate film.
  • the laminate film has a covering portion that covers the surface of the capacitor elements and a flange portion that extends from the outer edge of the covering portion.
  • a power conversion device includes a power semiconductor module, a capacitor element electrically connected to the power semiconductor module and covered with a laminate film, a housing having a first housing portion housing the power semiconductor module, and a second housing portion housing the capacitor element, wherein the laminate film has a covering portion covering the surface of the capacitor element and a flange portion extending outward from the outer edge of the covering portion, the second housing portion of the housing is surrounded by a frame portion for fixing the laminate film, and the housing includes: The capacitor element is held by fixing the flange portion of the laminate film to the end face of the frame portion.
  • FIG. 1 is a perspective view showing a capacitor module 1 according to Embodiment 1 of the present invention
  • FIG. 2 is an exploded perspective view of the capacitor module 1 of FIG. 1
  • FIG. 4A is an enlarged view of a region R2 of the capacitor module 1A of FIG. 4A
  • FIG. 5A is an enlarged view of a region R3 of the capacitor module 1B in FIG. 5A
  • FIG. 5A is an enlarged view of a region R3 of the capacitor module 1B in FIG. 5A
  • FIG. 5A is an enlarged view of a region R3 of the capacitor module 1B in FIG. 5A
  • FIG. 5A is an enlarged view of
  • FIG. 2 is a perspective view showing a capacitor module 2 according to Embodiment 2 of the present invention
  • FIG. 7 is an exploded perspective view of the capacitor module 2 of FIG. 6 Enlarged view of region R4 in FIG. CC sectional view of the capacitor module 2 of FIG.
  • FIG. 4 is an enlarged view of a part of a cross section of a capacitor module according to a modification of the second embodiment
  • FIG. 4 is a perspective view showing a capacitor module 3 according to a third embodiment
  • FIG. 5 is a cross-sectional schematic diagram showing a power conversion device 4 according to a fifth embodiment
  • Patent Literature 1 discloses a surface-mount capacitor including a capacitor element having lead-out leads and covered with a laminate film, and a fixing plate provided with external connection terminals.
  • the present inventors have studied a capacitor module that prevents the laminate film from being damaged and has improved durability, resulting in the following invention.
  • a capacitor module includes one or more capacitor elements covered with a laminate film, and a support having a frame portion for fixing the laminate film.
  • the laminate film has a covering portion that covers the surfaces of the capacitor elements and a flange portion that extends from the outer edge of the covering portion.
  • the support includes a first support and a second support, and may be fixed by sandwiching the flange between the frame of the first support and the frame of the second support.
  • the flange portion can be sandwiched and fixed, so the capacitor element can be held without using an adhesive or the like.
  • fixing portions for fixing the first support and the second support may be provided on the outer surface of the frame of the first support and the outer surface of the frame of the second support.
  • the tip of the flange portion may be positioned within the width of the end surface of the frame portion.
  • the support may be cylindrical.
  • the support may be formed in a box shape having a facing surface facing the covering portion of the laminate film.
  • the capacitor element can be supported on the facing surface, and the vibration resistance of the capacitor element can be improved.
  • a gap may be formed between the facing surface of the support and the capacitor element.
  • the position of the first end portion of the flange portion closer to the covering portion may be different from the position of the second end portion opposite to the first end portion.
  • the capacitor element can be pressed against the opposing surface without applying excessive force. Therefore, the vibration resistance of the capacitor module can be improved.
  • the support may have a plurality of housing portions separated by the frame, and the capacitor element may be housed in each of the plurality of housing portions.
  • the number of capacitor elements can be increased so as to obtain desired electrical characteristics.
  • At least part of the flange portions of two adjacent capacitor elements may overlap.
  • Such a configuration contributes to the miniaturization of the capacitor module.
  • the support may include a plurality of supports, the plurality of supports may be stacked in a direction intersecting with the direction in which the flanges extend, and the flanges of the plurality of capacitor elements may be sandwiched and fixed between the frame portions of the plurality of supports.
  • a power conversion device includes a power semiconductor module, a capacitor element that is electrically connected to the power semiconductor module and covered with a laminate film, a housing that includes a first housing portion that houses the power semiconductor module, and a second housing portion that houses the capacitor element.
  • the capacitor element is held by fixing the flange portion of the laminate film to the end surface of the frame portion.
  • the housing of the power conversion device can be used to fix the capacitor element, so the number of parts of the power conversion device can be reduced, and the manufacturing cost can be suppressed.
  • FIG. 1 is a perspective view showing a capacitor module 1 according to Embodiment 1 of the present invention.
  • 2 is an exploded perspective view of the capacitor module 1 of FIG. 1.
  • FIG. 3A is a cross-sectional view of the capacitor module 1 of FIG. 1 taken along the line AA.
  • FIG. 3B is a BB cross-sectional view of the capacitor module 1 of FIG.
  • FIG. 3C is an enlarged view of region R1 in FIG. 3A.
  • the X, Y, and Z directions in the drawing indicate the horizontal direction, height direction, and vertical direction of the capacitor module 1, respectively.
  • the capacitor module 1 includes a capacitor element 31 and supports 11 and 21.
  • Capacitor element 31 is covered with laminate film 32 .
  • Laminate film 32 has, as shown in FIG.
  • the capacitor element 31 is, for example, a film capacitor composed of a dielectric film wound body or laminated body.
  • capacitor element 31 is a columnar film capacitor having an oval cross section.
  • a plastic film such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate can be used.
  • Metal such as aluminum or zinc can be used as the metal deposition film formed on the surface of the plastic film.
  • Electrodes 36 shown in FIG. 3B are formed on both end surfaces of the capacitor element 31 .
  • capacitor element 31 has two terminal electrodes 35 electrically connected to two electrodes 36 formed on both end faces.
  • the terminal electrode 35 is preferably coated with a sealant material (not shown) for improving adhesion, airtightness, and insulation at the portion to be adhered to the laminate film 32 . Even when a relatively thick terminal electrode is used, the moisture resistance can be improved without forming an opening between the laminate film 32 and the terminal electrode 35 . Moreover, when the laminate film 32 includes a metal layer, the insulation between the terminal electrode 35 and the metal layer can be improved.
  • the sealant material for example, polypropylene containing an acid-modified resin can be used.
  • the capacitor element 31 has a rectangular shape when viewed from the height direction (Y direction), and is held by rectangular supports 11 and 21, which will be described later.
  • the laminate film 32 is an exterior material that covers the capacitor element 31 to improve the moisture resistance of the capacitor element 31 .
  • a film obtained by bonding a resin film and an aluminum foil together can be used.
  • an aluminum laminate film obtained by laminating an aluminum foil between a heat-sealable resin film such as unstretched polypropylene (CPP) and a resin film having excellent strength such as nylon or polyethylene terephthalate with an adhesive or by thermocompression can be used.
  • An aluminum layer has excellent water vapor barrier properties, and by covering the capacitor element 31 with an aluminum laminate film having an aluminum layer, the moisture resistance of the capacitor element 31 can be improved.
  • the effects of the present invention are not limited by the constituent materials of the laminate film, and materials having high adhesiveness between laminate films, vapor barrier properties, strength, or durability can be appropriately employed.
  • Laminate film 32 has covering portion 33 covering the surface of capacitor element 31 and flange portion 34 extending from the outer edge of covering portion 33 as described above.
  • capacitor element 31 can be covered with laminate film 32 by sandwiching capacitor element 31 between two films and adhering them by heat sealing. At this time, the film adheres to the capacitor element 31 to form the covering portion 33 .
  • a flange portion 34 is formed on the outer edge of the covering portion 33 by bonding two sheets of film together. Therefore, the flange portion 34 is a glued or fused portion in which films are overlapped and glued or fused together.
  • the width of the flange portion 34 is preferably 1 mm or more, for example. By setting the width of the flange portion 34 to 1 mm or more, the flange portion 34 can be easily fixed by the frame portions 12 and 22 of the supports 11 and 21 as will be described later.
  • the flange portions 34 are formed on the four sides of the capacitor element 31 .
  • the flange portions 34 are formed on the four sides of the rectangular capacitor element 31, which are continuously connected to form an annular shape.
  • the flange portions 34 do not necessarily have to be formed on all four sides of the capacitor element 31 .
  • the terminal electrode 35 is exposed from one side of the flange portion 34 . Therefore, an external substrate or device can be electrically connected to the capacitor element 31 via the terminal electrode 35 .
  • the supports 11 and 21 are for holding the capacitor element 31 and attaching the capacitor module 1 to an external substrate, device, or the like.
  • the supports 11 and 21 are formed in a rectangular shape when viewed from the height direction (Y direction).
  • the supports 11 and 21 include the first support 11 and the second support 21 .
  • the first support 11 and the second support 21 have the same shape. Therefore, since the first support 11 and the second support 21 can be formed with the same mold, the manufacturing cost of the capacitor module 1 can be reduced.
  • the supports 11 and 21 fix the flange portion 34 of the laminate film 32 .
  • the flange portion 34 of the laminate film 32 is sandwiched and fixed between the two supports 11 and 21 .
  • the first support 11 has a frame portion 12 that holds the laminate film 32 .
  • the second support 21 has a frame portion 22 that holds the laminate film 32 .
  • the flange portion 34 of the laminate film 32 is sandwiched between the end surface 12a of the frame portion 12 of the first support member 11 and the end surface 22a of the frame portion 22 of the second support member 21 and fixed.
  • the supports 11 and 21 are cylindrical. Therefore, a portion of capacitor element 31 is exposed from supports 11 and 21 . Since the capacitor element 31 is covered with the laminate film 32, even if it is exposed from the supports 11 and 21, the size and weight of the capacitor module 1 can be reduced without impairing the moisture resistance and airtightness of the capacitor element 31.
  • the fixing portion 14 is provided on the outer surface 13 of the first support 11
  • the fixing portion 24 is provided on the outer surface 23 of the second support 21 .
  • the first support 11 and the second support 21 can be fixed by fastening the fixing portion 14 and the fixing portion 24 with screws or the like.
  • the flange portion 34 can be sandwiched and fixed without using an adhesive or the like.
  • the fixing portions 14 and 24 have the role of fixing the first support 11 and the second support 21, and also fixing the capacitor module 1 to an external board or device.
  • the supports 11 and 21 for example, resins such as polyphenylene sulfide, polybutylene terephthalate, or liquid crystal polymers, or metals such as aluminum alloys can be used.
  • resins such as polyphenylene sulfide, polybutylene terephthalate, or liquid crystal polymers, or metals such as aluminum alloys
  • the dimensional stability or strength of the supports 11 and 21 can be improved by adding glass fiber, inorganic filler, or the like to the resin.
  • metal is used as the material for the supports 11 and 21
  • insulation between the terminal electrode 35 and the supports 11 and 21 can be ensured by providing a sufficient space between the terminal electrode 35 and the supports 11 and 21 or by sandwiching an insulating material.
  • the flange portion 34 is sandwiched and fixed between the end surface 12a of the frame portion 12 of the first support 11 and the end surface 22a of the frame portion 22 of the second support 21. Since the flange portion 34 is a portion in which two films are superimposed, it is more difficult to tear than the covering portion 33 . Therefore, by fixing the flange portion 34 instead of the covering portion 33, damage to the laminate film 32 can be suppressed.
  • the capacitor element 31 is formed in a rectangular shape when viewed from the height direction (Y direction), and the flange portion 34 is formed so as to surround the four sides of the capacitor element 31 .
  • flange portions 34 arranged on all sides of capacitor element 31 are fixed to frames 12 and 22 of supports 11 and 21 . By fixing the flange portions 34 on the four sides with the frames 12 and 22 of the supports 11 and 21, the capacitor element 31 can be held more stably.
  • the capacitor module 1 includes a capacitor element 31 and supports 11 and 21.
  • Capacitor element 31 is covered with laminate film 32 .
  • Supports 11 and 21 have frames 12 and 22 to which laminate films 32 are fixed.
  • Laminate film 32 has a covering portion 33 covering capacitor element 31 and a flange portion 34 extending from the outer edge of covering portion 33 .
  • Supports 11 and 21 hold capacitor element 31 by fixing flange portion 34 of laminate film 32 with end surfaces 12 a and 22 a of frame portions 12 and 22 .
  • the support is fixed by sandwiching the flange portion 34 between the frame portion 12 of the first support member 11 and the frame portion 22 of the second support member 21 including the first support member 11 and the second support member 21 .
  • the flange portion 34 can be easily fixed to hold the capacitor element 31 .
  • Fixing parts 14 and 24 for fixing the first support 11 and the second support 21 are provided on the outer surface 13 of the frame 12 of the first support 11 and the outer surface 23 of the frame 22 of the second support 21 .
  • the supports 11 and 21 are cylindrical.
  • Such a configuration contributes to weight reduction of the capacitor module 1. Moreover, since the capacitor element 31 is covered with the laminate film 32, weather resistance can be ensured even if the capacitor element 31 is exposed from the supports 11 and 21. FIG.
  • the capacitor module 1 includes one capacitor element 31 has been described, but the present invention is not limited to this.
  • the capacitor module 1 may have a plurality of capacitor elements.
  • the laminate film 32 is adhered by heat sealing
  • the laminate film 32 may be laminated using an adhesive or the like.
  • the flange portions 34 arranged on the four sides of the capacitor element 31 are fixed has been described, but at least a part of the flange portions 34 arranged on the four sides of the capacitor element 31 may be fixed by the supports 11 and 21.
  • the flange portions 34 arranged on two opposite sides may be fixed by the supports 11 and 21 .
  • Capacitor element 31 may have other shapes, such as a cylindrical shape or a square prism shape, for example.
  • first support 11 and the second support 21 have the same shape
  • present invention is not limited to this.
  • the first support 11 and the second support 21 may have different shapes as long as they have a shape that can hold the capacitor element 31 .
  • FIG. 4A is a cross-sectional view showing a capacitor module 1A according to Modification 1 of Embodiment 1.
  • FIG. 4B is an enlarged view of region R2 of capacitor module 1A in FIG. 4A.
  • the first support 111 and the second support 121 may be box-shaped.
  • the first support 111 may be formed in a box shape having a facing surface 112b that faces the covering portion 33 of the laminate film 32 .
  • the second support 121 may also be shaped like a box having a facing surface 122b that faces the covering portion 33 of the laminate film 32 .
  • a gap G1 may be formed between the facing surface 112b of the first support 111 and the covering portion 33 facing the facing surface 112b. Due to the gap G1, a constant clearance can be secured between the supports 111 and 121 and the capacitor element 31 even if thermal expansion occurs due to the environment in which the capacitor element 31 is used. Therefore, it is possible to suppress breakage of the covering portion 33 of the laminate film 32 due to thermal expansion of the capacitor element 31 .
  • the capacitor element 31 is pressed against the facing surface 122b by the flange portion 34 sandwiched between the frame portions 112 and 122. Therefore, the facing surface 122b of the second support 121 and the covering portion 33 facing the facing surface 122b are in contact with each other.
  • the tip 34a of the flange portion 34 may be arranged so as to fit within the width W1 of the end surfaces 112a and 122a of the frame portions 112 and 122. With such a configuration, it is possible to suppress protrusion of the flange portion 34 from the supports 111 and 121 due to manufacturing variations.
  • FIG. 5A is a cross-sectional view showing a capacitor module 1B according to Modification 2 of Embodiment 1.
  • FIG. FIG. 5B is an enlarged view of region R3 of capacitor module 1B in FIG. 5A.
  • the height direction is a direction intersecting with the extending direction of the flange portion 234 .
  • the position P1 of the first end portion 234c of the flange portion 234 and the position P2 of the second end portion 234d of the flange portion 234 are shifted in the height direction.
  • the end face 212a of the frame 212 of the first support 211 and the end face 222a of the frame 222 of the second support 221 are arranged at positions different from the position of the first end 234c of the flange 234 in the height direction. Therefore, when the flange portion 234 is sandwiched between the frame portions 212 and 222 and fixed, the flange portion 234 is pulled and the capacitor element 31 can be pressed against the facing surface 222b of the second support 221 without applying excessive force. Therefore, the vibration resistance of the capacitor module 1B can be improved.
  • the number of capacitor elements 31 and the shapes of the supports 311 and 321 are different from those of the first embodiment. Further, the capacitor module 2 differs from the first embodiment in that each of the supports 311 and 321 has three accommodating portions 315 and 325 that accommodate three capacitor elements 31 .
  • the supports include a first support 311 and a second support 321 .
  • the first support 311 and the second support 321 are formed in the same shape. Therefore, the first support 311 and the second support 321 can be used in common.
  • the first support 311 has three housings 315 separated by a frame 312 .
  • the second support 321 has three housings 325 separated by a frame 322 .
  • Capacitor element 31 is accommodated in each of accommodating portions 315 and 325 .
  • three capacitor elements 31 can be arranged side by side in the horizontal direction (X direction). Space saving can be realized by supporting the three capacitor elements 31 by the common supports 311 and 321 .
  • a fixing portion 314 is provided on the outer side surface 313 of the first support 311 , and a fixing portion 324 is provided on the outer side surface 323 of the second support 321 .
  • FIG. 8 is an enlarged view of region R4 in FIG.
  • cutouts 316 and 326 for inserting the terminal electrodes 35 of the capacitor element 31 are formed in the end surface 312a of the frame portion 312 of the first support member 311 and the end surface 322a of the frame portion 322 of the second support member 321.
  • the notches 316 and 326 are formed in the end faces 312a and 322a, so that the contact of the terminal electrodes 35 with the supports 311 and 321 can be suppressed.
  • FIG. 9A is a CC cross-sectional view of the capacitor module 2 of FIG.
  • FIG. 9B is an enlarged view of region R5 in FIG. 9A.
  • the frame portions 312b and 322b arranged between two adjacent capacitor elements 31 may be wider than the frame portions 312c and 322c arranged at the ends of the supports 311 and 321.
  • the flange portions 34 can be fixed without overlapping each other.
  • the flange portions 34 of two adjacent capacitor elements 31 are fixed by a pair of frame portions 312b and 322b. Therefore, the two capacitor elements 31 can be held by the pair of frame portions 312b and 322b, which contributes to miniaturization of the capacitor module 2.
  • FIG. 9A is a CC cross-sectional view of the capacitor module 2 of FIG.
  • FIG. 9B is an enlarged view of region R5 in FIG. 9A.
  • the frame portions 312b and 322b arranged between two adjacent capacitor elements 31 may be wider than the frame portions 312c and 322c
  • the supports 311 and 321 have a plurality of housing sections 315 and 325 separated by frames 312 and 322 .
  • Capacitor element 31 is accommodated in each of a plurality of accommodating portions 315 and 325 .
  • the number of capacitor elements can be increased so as to obtain desired electrical characteristics.
  • manufacturing man-hours can be reduced compared to arranging a plurality of capacitor modules 1 of Embodiment 1, which contributes to space saving.
  • capacitor elements 31 are arranged so that the terminal electrodes 35 are arranged in the horizontal direction (X direction), a large number of capacitor elements 31 can be arranged in the horizontal direction.
  • the present invention is not limited to this.
  • the support may have any shape that can hold two or more capacitor elements 31 .
  • the present invention is not limited to this.
  • the shape of the support may be such that the capacitor elements 31 can be arranged side by side in the vertical direction (Z direction).
  • the shape of the support may be such that a plurality of capacitor elements 31 can be arranged in the vertical and horizontal directions.
  • FIG. 10 is an enlarged view of a part of the cross section of the capacitor module according to the modification of the second embodiment. As shown in FIG. 10, at least a portion of the flange portions 34 of two adjacent capacitor elements 31 may overlap. With such a configuration, it is possible to further save space.
  • Embodiment 3 differences from Embodiment 1 will be mainly described.
  • the same reference numerals are assigned to the same or equivalent configurations as in the first embodiment.
  • the description overlapping with that in the first embodiment is omitted.
  • FIG. 11 is a perspective view showing the capacitor module 3 according to the third embodiment.
  • FIG. 12 is a perspective view of the capacitor module 3 of FIG. 11 from another direction.
  • Embodiment 3 differs from Embodiment 1 in that a plurality of capacitor elements 31 are held by stacking a plurality of supports in the height direction (Y direction).
  • the capacitor module 3 includes a first support 411, a second support 421, a third support 431, and a fourth support 441 as four supports.
  • the first support 411 and the fourth support 441 have the same shape and can be used in common.
  • the second support 421 and the third support 431 have different shapes and cannot be used in common.
  • the four supports 411 to 441 are stacked in the height direction (Y direction).
  • One capacitor element 31 is held by the first support 411 and the second support 421, one capacitor element 31 is held by the second support 421 and the third support 431, and one capacitor element 31 is held by the third support 431 and the fourth support 441. Therefore, in the capacitor module 3, the three capacitor elements 31 can be held by the four supports 411-441.
  • Two fixing parts 414 are provided on the outer surface 413 of the first support 411 .
  • Two fixing portions 424 and two fixing portions 425 are provided on the outer surface 423 of the second support 421 .
  • Two fixing portions 434 and two fixing portions 435 are provided on the outer surface 433 of the third support 431 .
  • Two fixing portions 444 are provided on the outer surface 443 of the fourth support 441 .
  • the first support 411 and the second support 421 are fixed by fastening the fixing portion 414 and the fixing portion 424 .
  • the second support 421 and the third support 431 are fixed by fastening the fixing portion 425 and the fixing portion 435 .
  • the third support 431 and the fourth support 441 are fixed by fastening the fixing portion 434 and the fixing portion 444 .
  • the first support 411 at the top and the fourth support 441 at the bottom each have two fixing portions 414 and 444, and the second support 421 and the third support 431 at the middle have four fixing portions 424, 425, 434 and 435 respectively.
  • the positions of the two fixing parts 414 provided on the first support 411 are different in the vertical direction (Z direction). Specifically, one fixing portion 414a is arranged at position Z1 in the vertical direction, and the other fixing portion 414b is arranged at position Z2 in the vertical direction. Similarly, the two fixing portions 444 provided on the fourth support 441 also have different positions in the vertical direction. One fixing portion 444a is arranged at position Z1 in the vertical direction, and the other fixing portion 444b is arranged at position Z2 in the vertical direction.
  • the positions of the two fixing portions 424 provided on the second support 421 are different in the vertical direction (Z direction).
  • One fixing portion 424a is arranged at position Z1 in the vertical direction
  • the other fixing portion 424b is arranged at position Z2 in the vertical direction.
  • the two fixing portions 425 provided on the second support 421 also have different positions in the vertical direction.
  • One fixing portion 425a is arranged at position Z1 in the vertical direction
  • the other fixing portion 425b is arranged at position Z2 in the vertical direction.
  • the two fixing portions 434 provided on the third support 431 have different positions in the vertical direction (Z direction).
  • One fixing portion 434a is arranged at position Z1 in the vertical direction
  • the other fixing portion 434b is arranged at position Z2 in the vertical direction.
  • the two fixing portions 435 provided on the third support 431 also have different positions in the vertical direction.
  • One fixing portion 435a is arranged at position Z1 in the vertical direction
  • the other fixing portion 435b is arranged at position Z2 in the vertical direction.
  • the supports include a plurality of supports 411, 421, 431, 441.
  • the plurality of supports 411, 421, 431, and 441 are stacked in a direction intersecting the extending direction of the flange portion (the Y direction).
  • the flange portions of the plurality of capacitor elements 31 are sandwiched and fixed between the frame portions of the plurality of supports 411 , 421 , 431 and 441 .
  • all fixing parts may be arranged at the same position in the vertical direction.
  • the fixed portion 514 provided on the first support 511, the fixed portion 524 provided on the second support 521, the fixed portion 534 provided on the third support 531, and the fixed portion 544 provided on the fourth support 541 are arranged in a straight line in the vertical direction.
  • Embodiment 4 A power conversion device 4 according to Embodiment 4 of the present invention will be described.
  • Embodiment 4 mainly different points from Embodiment 1 will be described.
  • the same reference numerals are given to the same or equivalent configurations as in the first embodiment. Further, in the fourth embodiment, the description overlapping with the first embodiment is omitted.
  • FIG. 15 is a schematic cross-sectional view showing the power converter 4 according to the fourth embodiment.
  • the fourth embodiment is different from the first embodiment in that the housing 61 of the power converter 4 holds the capacitor element 31 .
  • the power conversion device 4 includes a power semiconductor module 51, a capacitor element 31, and a housing 61.
  • the power semiconductor module 51 converts DC power and AC power and controls frequency and voltage.
  • Capacitor element 31 is covered with laminate film 32 .
  • Laminate film 32 has a covering portion 33 covering the capacitor element and a flange portion 34 extending outward from the outer edge of covering portion 33 .
  • the power semiconductor module 51 and the capacitor element 31 are housed in a housing 61.
  • the housing 61 has a first accommodation portion 62 that accommodates the power semiconductor module 51 and a second accommodation portion 63 that accommodates the capacitor element 31 .
  • the second accommodation portion 63 is surrounded by frame portions 64 and 65 for fixing the laminate film 32 .
  • the capacitor element 31 is held in the housing 61 by sandwiching the flange portion 34 between the end surface 64 a of the frame portion 64 and the end surface 65 a of the frame portion 65 .
  • the first housing portion 62 and the second housing portion 63 are formed by combining the first housing 61a and the second housing 61b.
  • the first housing 61a and the second housing 61b can be fixed by fastening with screws or the like, for example.
  • the capacitor element 31 is electrically connected to the power semiconductor module 51 inside the housing 61 .
  • the power conversion device 4 includes a power semiconductor module 51, a capacitor element 31, and a housing 61.
  • Capacitor element 31 is electrically connected to power semiconductor module 51 .
  • Capacitor element 31 is covered with a laminate film.
  • the housing 61 has a first accommodation portion 62 that accommodates the power semiconductor module 51 and a second accommodation portion 63 that accommodates the capacitor element 31 .
  • the second accommodating portion 63 of the housing 61 is surrounded by frame portions 64, 64 for fixing the laminate film.
  • the housing 61 holds the capacitor element 31 by fixing the flange portion 34 of the laminate film with the end surfaces 64 a and 65 a of the frame portions 64 and 64 .
  • the present invention is useful for capacitor modules used in various electronic devices, electrical devices, industrial devices, vehicle devices, and the like.

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  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

This capacitor module comprises one or more capacitor elements covered by a laminate film, and a support having frame portions for securing the laminate film. The laminate film has a covering portion that covers the surface of the capacitor element, and a flange portion that extends from an outer edge of the covering portion. The support retains the capacitor element by securing the flange portion of the laminate film via the end surfaces of the frame portions.

Description

コンデンサモジュールおよび電力変換装置Capacitor module and power converter
　本発明は、コンデンサモジュールおよび電力変換装置に関する。 The present invention relates to capacitor modules and power converters.
　外装材としてラミネートフィルムを使用したコンデンサが知られている。例えば、特許文献１に記載の面実装形コンデンサは、ラミネートフィルムで外装されたコンデンサ素子を有する。 A capacitor that uses a laminate film as an exterior material is known. For example, a surface-mount capacitor disclosed in Patent Document 1 has a capacitor element covered with a laminate film.
特許第４３５４２４０号公報Japanese Patent No. 4354240
　特許文献１に記載の面実装形コンデンサは、耐久性向上の点で、改善の余地がある。 The surface mount capacitor described in Patent Document 1 has room for improvement in terms of improving durability.
　本発明によると、耐久性を向上させたコンデンサモジュールおよび電力変換装置を提供する。 According to the present invention, a capacitor module and a power conversion device with improved durability are provided.
　本発明の一態様にかかるコンデンサモジュールは、ラミネートフィルムで被覆された１つまたは複数のコンデンサ素子と、ラミネートフィルムを固定する枠部を有する支持体と、を備え、ラミネートフィルムは、コンデンサ素子の表面を覆う被覆部と、被覆部の外縁から延びるフランジ部と、を有し、支持体は、枠部の端面でラミネートフィルムのフランジ部を固定することによりコンデンサ素子を保持する。 A capacitor module according to one aspect of the present invention includes one or more capacitor elements covered with a laminate film, and a support having a frame portion for fixing the laminate film. The laminate film has a covering portion that covers the surface of the capacitor elements and a flange portion that extends from the outer edge of the covering portion.
　本発明の一態様にかかる電力変換装置は、パワー半導体モジュールと、パワー半導体モジュールに電気的に接続され、ラミネートフィルムで被覆されたコンデンサ素子と、パワー半導体モジュールを収容する第１収容部と、コンデンサ素子を収容する第２収容部と、を有する筐体と、を備え、ラミネートフィルムは、コンデンサ素子の表面を覆う被覆部と、前記被覆部の外縁から外側に延びるフランジ部と、を有し、筐体の前記第２収容部は、ラミネートフィルムを固定する枠部に囲まれ、筐体は、前記枠部の端面で前記ラミネートフィルムの前記フランジ部を固定することにより前記コンデンサ素子を保持する。 A power conversion device according to an aspect of the present invention includes a power semiconductor module, a capacitor element electrically connected to the power semiconductor module and covered with a laminate film, a housing having a first housing portion housing the power semiconductor module, and a second housing portion housing the capacitor element, wherein the laminate film has a covering portion covering the surface of the capacitor element and a flange portion extending outward from the outer edge of the covering portion, the second housing portion of the housing is surrounded by a frame portion for fixing the laminate film, and the housing includes: The capacitor element is held by fixing the flange portion of the laminate film to the end face of the frame portion.
　本発明によると、耐久性を向上させたコンデンサモジュールおよび電力変換装置を提供することができる。 According to the present invention, it is possible to provide a capacitor module and a power converter with improved durability.
本発明の実施の形態１にかかるコンデンサモジュール１を示す斜視図1 is a perspective view showing a capacitor module 1 according to Embodiment 1 of the present invention; FIG. 図１のコンデンサモジュール１の分解斜視図2 is an exploded perspective view of the capacitor module 1 of FIG. 1; FIG. 図１のコンデンサモジュール１のＡ－Ａ断面図AA sectional view of the capacitor module 1 of FIG. 図１のコンデンサモジュール１のＢ－Ｂ断面図BB sectional view of the capacitor module 1 of FIG. 図３Ａの領域Ｒ１を拡大した図Enlarged view of region R1 in FIG. 3A 実施の形態１の変形例１にかかるコンデンサモジュール１Ａを示す断面図Sectional view showing capacitor module 1A according to Modification 1 of Embodiment 1 図４Ａのコンデンサモジュール１Ａの領域Ｒ２を拡大した図FIG. 4A is an enlarged view of a region R2 of the capacitor module 1A of FIG. 4A 実施の形態１の変形例２にかかるコンデンサモジュール１Ｂを示す断面図Sectional view showing a capacitor module 1B according to Modification 2 of Embodiment 1 図５Ａのコンデンサモジュール１Ｂの領域Ｒ３を拡大した図FIG. 5A is an enlarged view of a region R3 of the capacitor module 1B in FIG. 5A 本発明の実施の形態２にかかるコンデンサモジュール２を示す斜視図FIG. 2 is a perspective view showing a capacitor module 2 according to Embodiment 2 of the present invention; 図６のコンデンサモジュール２の分解斜視図FIG. 7 is an exploded perspective view of the capacitor module 2 of FIG. 6 図６の領域Ｒ４を拡大した図Enlarged view of region R4 in FIG. 図６のコンデンサモジュール２のＣ－Ｃ断面図CC sectional view of the capacitor module 2 of FIG. 図９Ａの領域Ｒ５を拡大した図The figure which expanded the area|region R5 of FIG. 9A 実施の形態２の変形例にかかるコンデンサモジュールの断面の一部を拡大した図FIG. 4 is an enlarged view of a part of a cross section of a capacitor module according to a modification of the second embodiment; 実施の形態３にかかるコンデンサモジュール３を示す斜視図FIG. 4 is a perspective view showing a capacitor module 3 according to a third embodiment; 図１１のコンデンサモジュール３の別の方向からの斜視図A perspective view of the capacitor module 3 of FIG. 11 from another direction 実施の形態３の変形例にかかるコンデンサモジュール３Ａを示す斜視図A perspective view showing a capacitor module 3A according to a modification of the third embodiment. 図１３のコンデンサモジュール３Ａの別の方向からの斜視図A perspective view from another direction of the capacitor module 3A of FIG. 13 実施の形態５にかかる電力変換装置４を示す断面模式図FIG. 5 is a cross-sectional schematic diagram showing a power conversion device 4 according to a fifth embodiment;
（本発明に至った経緯）
　コンデンサ素子の外装材としてラミネートフィルムを用いたフィルムコンデンサが知られている。例えば、特許文献１には、引き出しリードを有し、ラミネートフィルムで外装されたコンデンサ素子と、外部接続端子を備えた固定板と、を備える面実装形コンデンサが開示されている。 (Circumstances leading to the present invention)
A film capacitor using a laminate film as an exterior material for a capacitor element is known. For example, Patent Literature 1 discloses a surface-mount capacitor including a capacitor element having lead-out leads and covered with a laminate film, and a fixing plate provided with external connection terminals.
　特許文献１に記載の面実装形コンデンサのような、ラミネートフィルムで外装されたコンデンサを、例えば、電力変換装置などに搭載する際に、コンデンサ素子に過剰な力が加わって、ラミネートフィルムが破損してしまうという課題がある。 There is a problem that when a capacitor covered with a laminate film, such as the surface-mounted capacitor described in Patent Document 1, is mounted on, for example, a power conversion device, excessive force is applied to the capacitor element and the laminate film is damaged.
　そこで、本発明者（ら）は、ラミネートフィルムの破損を防止して耐久性を向上させたコンデンサモジュールについて検討し、以下の発明に至った。 Therefore, the present inventors (and others) have studied a capacitor module that prevents the laminate film from being damaged and has improved durability, resulting in the following invention.
　本発明の第１態様にかかるコンデンサモジュールは、ラミネートフィルムで被覆された１つまたは複数のコンデンサ素子と、ラミネートフィルムを固定する枠部を有する支持体と、を備え、ラミネートフィルムは、コンデンサ素子の表面を覆う被覆部と、被覆部の外縁から延びるフランジ部と、を有し、支持体は、枠部の端面でラミネートフィルムのフランジ部を固定することによりコンデンサ素子を保持する。 A capacitor module according to a first aspect of the present invention includes one or more capacitor elements covered with a laminate film, and a support having a frame portion for fixing the laminate film. The laminate film has a covering portion that covers the surfaces of the capacitor elements and a flange portion that extends from the outer edge of the covering portion.
　このような構成により、ラミネートフィルムの破損を防止して耐久性を向上させたコンデンサモジュールを提供することができる。 With such a configuration, it is possible to provide a capacitor module that prevents damage to the laminate film and improves durability.
　本発明の第２態様にかかるコンデンサモジュールにおいて、支持体は、第１支持体と第２支持体と、を含み、第１支持体の枠部と第２支持体の枠部とにより、フランジ部を挟んで固定してもよい。 In the capacitor module according to the second aspect of the present invention, the support includes a first support and a second support, and may be fixed by sandwiching the flange between the frame of the first support and the frame of the second support.
　このような構成により、フランジ部を挟んで固定することができるため、接着剤等を使用せずにコンデンサ素子を保持することができる。 With such a configuration, the flange portion can be sandwiched and fixed, so the capacitor element can be held without using an adhesive or the like.
　本発明の第３態様にかかるコンデンサモジュールにおいて、第１支持体の枠部の外側面および第２支持体の枠部の外側面に、第１支持体と第２支持体とを固定する固定部が設けられていてもよい。 In the capacitor module according to the third aspect of the present invention, fixing portions for fixing the first support and the second support may be provided on the outer surface of the frame of the first support and the outer surface of the frame of the second support.
　このような構成により、第１支持体と第２支持体との固定、および外部装置へのコンデンサモジュールの固定を同時に行うことができる。 With such a configuration, it is possible to simultaneously fix the first support and the second support and fix the capacitor module to the external device.
　本発明の第４態様にかかるコンデンサモジュールにおいて、フランジ部の先端は、枠部の端面の幅内に位置してもよい。 In the capacitor module according to the fourth aspect of the present invention, the tip of the flange portion may be positioned within the width of the end surface of the frame portion.
　このような構成によると、製造ばらつきにより、支持体からフランジ部がはみ出すことを抑制することができる。 According to such a configuration, it is possible to suppress protrusion of the flange portion from the support body due to manufacturing variations.
　本発明の第５態様にかかるコンデンサモジュールにおいて、支持体は、筒状に形成されていてもよい。 In the capacitor module according to the fifth aspect of the present invention, the support may be cylindrical.
　このような構成により、コンデンサモジュールの軽量化を図ることができる。また、コンデンサ素子がラミネートフィルムで覆われているため、耐候性を確保することができる。 With such a configuration, it is possible to reduce the weight of the capacitor module. Moreover, since the capacitor element is covered with the laminate film, weather resistance can be ensured.
　本発明の第６態様にかかるコンデンサモジュールにおいて、支持体は、ラミネートフィルムの被覆部に対向する対向面を有する箱状に形成されていてもよい。 In the capacitor module according to the sixth aspect of the present invention, the support may be formed in a box shape having a facing surface facing the covering portion of the laminate film.
　このような構成により、対向面でコンデンサ素子を支持することができ、コンデンサ素子の耐振動性を向上させることができる。 With such a configuration, the capacitor element can be supported on the facing surface, and the vibration resistance of the capacitor element can be improved.
　本発明の第７態様にかかるコンデンサモジュールにおいて、支持体の対向面とコンデンサ素子との間に隙間が形成されていてもよい。 In the capacitor module according to the seventh aspect of the present invention, a gap may be formed between the facing surface of the support and the capacitor element.
　このような構成により、コンデンサ素子の熱膨張によるラミネートフィルムの損傷を抑制することができる。 With such a configuration, damage to the laminate film due to thermal expansion of the capacitor element can be suppressed.
　本発明の第８態様にかかるコンデンサモジュールにおいて、フランジ部の延びる方向と交差する方向において、フランジ部における被覆部に近い側の第１端部の配置されている位置と、第１端部と反対側の第２端部の配置されている位置と、が異なってもよい。 In the capacitor module according to the eighth aspect of the present invention, in the direction intersecting with the extending direction of the flange portion, the position of the first end portion of the flange portion closer to the covering portion may be different from the position of the second end portion opposite to the first end portion.
　このような構成により、過度な力を加えずにコンデンサ素子を対向面に押さえつけることができる。このため、コンデンサモジュールの耐振動性を向上させることができる。 With such a configuration, the capacitor element can be pressed against the opposing surface without applying excessive force. Therefore, the vibration resistance of the capacitor module can be improved.
　本発明の第９態様にかかるコンデンサモジュールにおいて、支持体は、枠部で区切られた複数の収容部を有し、複数の収容部のそれぞれにコンデンサ素子が収容されてもよい。 In the capacitor module according to the ninth aspect of the present invention, the support may have a plurality of housing portions separated by the frame, and the capacitor element may be housed in each of the plurality of housing portions.
　このような構成により、所望の電気特性が得られるよう、コンデンサ素子の数を増やすことができる。 With such a configuration, the number of capacitor elements can be increased so as to obtain desired electrical characteristics.
　本発明の第１０態様にかかるコンデンサモジュールにおいて、隣接する２つのコンデンサ素子のフランジ部の少なくとも一部が重なっていてもよい。 In the capacitor module according to the tenth aspect of the present invention, at least part of the flange portions of two adjacent capacitor elements may overlap.
　このような構成により、コンデンサモジュールの小型化に寄与する。 Such a configuration contributes to the miniaturization of the capacitor module.
　本発明の第１１態様のコンデンサモジュールにおいて、支持体は、複数の支持体を含み、複数の支持体は、フランジ部の延びる方向と交差する方向に重ねて配置され、複数のコンデンサ素子のフランジ部は、複数の支持体の枠部に挟まれて固定されてもよい。 In the capacitor module of the eleventh aspect of the present invention, the support may include a plurality of supports, the plurality of supports may be stacked in a direction intersecting with the direction in which the flanges extend, and the flanges of the plurality of capacitor elements may be sandwiched and fixed between the frame portions of the plurality of supports.
　このような構成により、コンデンサモジュールにおけるコンデンサ素子の配置の自由度を向上させることができる。 With such a configuration, it is possible to improve the degree of freedom in arranging the capacitor elements in the capacitor module.
　本発明の第１２態様にかかる電力変換装置は、パワー半導体モジュールと、パワー半導体モジュールに電気的に接続され、ラミネートフィルムで被覆されたコンデンサ素子と、パワー半導体モジュールを収容する第１収容部と、コンデンサ素子を収容する第２収容部と、を有する筐体と、を備え、ラミネートフィルムは、コンデンサ素子の表面を覆う被覆部と、被覆部の外縁から外側に延びるフランジ部と、を有し、筐体の第２収容部は、ラミネートフィルムを固定する枠部に囲まれ、筐体は、枠部の端面でラミネートフィルムのフランジ部を固定することによりコンデンサ素子を保持する。 A power conversion device according to a twelfth aspect of the present invention includes a power semiconductor module, a capacitor element that is electrically connected to the power semiconductor module and covered with a laminate film, a housing that includes a first housing portion that houses the power semiconductor module, and a second housing portion that houses the capacitor element. The capacitor element is held by fixing the flange portion of the laminate film to the end surface of the frame portion.
　このような構成により、電力変換装置の筐体をコンデンサ素子の固定に使用することができるため、電力変換装置の部品数を削減することができ、製造コストを抑制することができる。 With such a configuration, the housing of the power conversion device can be used to fix the capacitor element, so the number of parts of the power conversion device can be reduced, and the manufacturing cost can be suppressed.
（実施の形態１）
［全体構成］
　図１は、本発明の実施の形態１にかかるコンデンサモジュール１を示す斜視図である。図２は、図１のコンデンサモジュール１の分解斜視図である。図３Ａは、図１のコンデンサモジュール１のＡ－Ａ断面図である。図３Ｂは、図１のコンデンサモジュール１のＢ－Ｂ断面図である。図３Ｃは、図３Ａの領域Ｒ１を拡大した図である。なお、図中のＸ、Ｙ、Ｚ方向はそれぞれ、コンデンサモジュール１の横方向、高さ方向、縦方向を示す。 (Embodiment 1)
[overall structure]
FIG. 1 is a perspective view showing a capacitor module 1 according to Embodiment 1 of the present invention. 2 is an exploded perspective view of the capacitor module 1 of FIG. 1. FIG. FIG. 3A is a cross-sectional view of the capacitor module 1 of FIG. 1 taken along the line AA. FIG. 3B is a BB cross-sectional view of the capacitor module 1 of FIG. FIG. 3C is an enlarged view of region R1 in FIG. 3A. The X, Y, and Z directions in the drawing indicate the horizontal direction, height direction, and vertical direction of the capacitor module 1, respectively.
　図１～図２に示すように、コンデンサモジュール１は、コンデンサ素子３１と、支持体１１、２１と、を備える。 As shown in FIGS. 1 and 2, the capacitor module 1 includes a capacitor element 31 and supports 11 and 21.
＜コンデンサ素子＞
　コンデンサ素子３１は、ラミネートフィルム３２で被覆されている。ラミネートフィルム３２は、図２に示すように、コンデンサ素子３１の表面を覆う被覆部３３と、被覆部３３の外縁から延びるフランジ部３４と、を有する。 <Capacitor element>
Capacitor element 31 is covered with laminate film 32 . Laminate film 32 has, as shown in FIG.
　コンデンサ素子３１は、例えば誘電体フィルムの巻回体または積層体により構成されるフィルムコンデンサである。本実施の形態では、図２に示すように、コンデンサ素子３１は、長円形状の断面を有する柱状のフィルムコンデンサである。コンデンサ素子３１を構成する誘電体フィルムとして、例えば、ポリエチレンテレフタレート、ポリプロピレン、ポリフェニレンサルファイド、または、ポリエチレンナフタレート等のプラスチックフィルムを使用することができる。プラスチックフィルムの表面に形成される金属蒸着膜として、例えば、アルミニウムまたは亜鉛等の金属を使用することができる。 The capacitor element 31 is, for example, a film capacitor composed of a dielectric film wound body or laminated body. In the present embodiment, as shown in FIG. 2, capacitor element 31 is a columnar film capacitor having an oval cross section. As the dielectric film forming the capacitor element 31, for example, a plastic film such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate can be used. Metal such as aluminum or zinc can be used as the metal deposition film formed on the surface of the plastic film.
　コンデンサ素子３１の両端面のそれぞれには、図３Ｂに示す電極３６が形成されている。本実施の形態では、コンデンサ素子３１は、両端面に形成された２つの電極３６のそれぞれに電気的に接続された２つの端子電極３５を有する。端子電極３５にはラミネートフィルム３２との接着する部分において、接着性、気密性、および絶縁性を高めるためのシーラント材（図示省略）が被覆されていることが好ましい。比較的厚い端子電極を用いた場合にも、ラミネートフィルム３２と端子電極３５との間に開口が生じることなく、耐湿性を向上させることができる。また、ラミネートフィルム３２が金属層を含む場合には端子電極３５と金属層との絶縁性を向上することができる。シーラント材としては、例えば、酸変性樹脂を含むポリプロピレンなどを使用することができる。 Electrodes 36 shown in FIG. 3B are formed on both end surfaces of the capacitor element 31 . In the present embodiment, capacitor element 31 has two terminal electrodes 35 electrically connected to two electrodes 36 formed on both end faces. The terminal electrode 35 is preferably coated with a sealant material (not shown) for improving adhesion, airtightness, and insulation at the portion to be adhered to the laminate film 32 . Even when a relatively thick terminal electrode is used, the moisture resistance can be improved without forming an opening between the laminate film 32 and the terminal electrode 35 . Moreover, when the laminate film 32 includes a metal layer, the insulation between the terminal electrode 35 and the metal layer can be improved. As the sealant material, for example, polypropylene containing an acid-modified resin can be used.
　コンデンサ素子３１は、図１および図２に示すように、高さ方向（Ｙ方向）から見たときに矩形状であり、後述する矩形状の支持体１１、２１で保持されている。 As shown in FIGS. 1 and 2, the capacitor element 31 has a rectangular shape when viewed from the height direction (Y direction), and is held by rectangular supports 11 and 21, which will be described later.
＜ラミネートフィルム＞
　ラミネートフィルム３２は、コンデンサ素子３１を被覆して、コンデンサ素子３１の耐湿性を向上させる外装材である。ラミネートフィルム３２としては、樹脂フィルムとアルミニウム箔とを貼り合わせたフィルムを使用することができる。具体的には、無延伸ポリプロピレン（ＣＰＰ）などのヒートシール性を有する樹脂フィルムとナイロンまたはポリエチレンテレフタレートなどの強度に優れる樹脂フィルムとの間にアルミニウム箔を接着剤または熱圧着により貼り合わせたアルミラミネートフィルムを使用することができる。アルミニウムの層は水蒸気バリア性に優れており、アルミニウム層を有するアルミラミネートフィルムでコンデンサ素子３１を被覆することで、コンデンサ素子３１の耐湿性を向上させることができる。本発明の効果は、ラミネートフィルムの構成材料によって限定されるものではなく、ラミネートフィルム同士の接着性、水蒸気バリア性、強度、または耐久性の高い材料を適宜採用することができる。 <Laminated film>
The laminate film 32 is an exterior material that covers the capacitor element 31 to improve the moisture resistance of the capacitor element 31 . As the laminate film 32, a film obtained by bonding a resin film and an aluminum foil together can be used. Specifically, an aluminum laminate film obtained by laminating an aluminum foil between a heat-sealable resin film such as unstretched polypropylene (CPP) and a resin film having excellent strength such as nylon or polyethylene terephthalate with an adhesive or by thermocompression can be used. An aluminum layer has excellent water vapor barrier properties, and by covering the capacitor element 31 with an aluminum laminate film having an aluminum layer, the moisture resistance of the capacitor element 31 can be improved. The effects of the present invention are not limited by the constituent materials of the laminate film, and materials having high adhesiveness between laminate films, vapor barrier properties, strength, or durability can be appropriately employed.
　ラミネートフィルム３２によりコンデンサ素子３１を被覆することで、コンデンサ素子３１の耐候性を向上することができる。ラミネートフィルム３２は、上述したように、コンデンサ素子３１の表面を覆う被覆部３３と、被覆部３３の外縁から延びるフランジ部３４と、を有する。例えば、２枚のフィルムでコンデンサ素子３１を挟んで、熱融着により接着することにより、ラミネートフィルム３２でコンデンサ素子３１を被覆することができる。このとき、フィルムがコンデンサ素子３１に密着して被覆部３３が形成される。また、被覆部３３の外縁に、２枚のフィルムが重なって接着されたフランジ部３４が形成される。したがって、フランジ部３４は、フィルム同士が重なって接着または融着された、接着部または融着部である。フランジ部３４の幅は、例えば１ｍｍ以上であるとよい。フランジ部３４の幅を１ｍｍ以上とすることで、後述するように支持体１１、２１の枠部１２、２２でフランジ部３４を容易に固定することができる。 By covering the capacitor element 31 with the laminate film 32, the weather resistance of the capacitor element 31 can be improved. Laminate film 32 has covering portion 33 covering the surface of capacitor element 31 and flange portion 34 extending from the outer edge of covering portion 33 as described above. For example, capacitor element 31 can be covered with laminate film 32 by sandwiching capacitor element 31 between two films and adhering them by heat sealing. At this time, the film adheres to the capacitor element 31 to form the covering portion 33 . A flange portion 34 is formed on the outer edge of the covering portion 33 by bonding two sheets of film together. Therefore, the flange portion 34 is a glued or fused portion in which films are overlapped and glued or fused together. The width of the flange portion 34 is preferably 1 mm or more, for example. By setting the width of the flange portion 34 to 1 mm or more, the flange portion 34 can be easily fixed by the frame portions 12 and 22 of the supports 11 and 21 as will be described later.
　本実施の形態では、２枚のフィルムでコンデンサ素子３１を挟んで熱融着するため、コンデンサ素子３１の四方にフランジ部３４が形成される。言い換えると、高さ方向（Ｙ方向）から見たときに、矩形状であるコンデンサ素子３１の四辺にフランジ部３４が形成されており、連続的につながって環状に形成される。フランジ部３４は必ずしもコンデンサ素子３１の四辺すべてに形成されていなくてもよい。 In the present embodiment, since the capacitor element 31 is heat-sealed between two films, the flange portions 34 are formed on the four sides of the capacitor element 31 . In other words, when viewed from the height direction (Y direction), the flange portions 34 are formed on the four sides of the rectangular capacitor element 31, which are continuously connected to form an annular shape. The flange portions 34 do not necessarily have to be formed on all four sides of the capacitor element 31 .
　本実施の形態では、フランジ部３４の一辺から端子電極３５が露出している。このため、端子電極３５を介して、外部の基板または装置等とコンデンサ素子３１とを電気的に接続することができる。 In this embodiment, the terminal electrode 35 is exposed from one side of the flange portion 34 . Therefore, an external substrate or device can be electrically connected to the capacitor element 31 via the terminal electrode 35 .
＜支持体＞
　支持体１１、２１は、コンデンサ素子３１を保持して、外部の基板または装置等にコンデンサモジュール１を取り付けるためのものである。本実施の形態では、支持体１１、２１は、高さ方向（Ｙ方向）から見たときに矩形状に形成されている。また、本実施の形態では、支持体１１、２１は、第１支持体１１と第２支持体２１と、を含む。本実施の形態では、第１支持体１１と第２支持体２１とは同一の形状を有する。このため、第１支持体１１と第２支持体２１とを同じ金型で形成することができるため、コンデンサモジュール１の製造コストを低減することができる。 <Support>
The supports 11 and 21 are for holding the capacitor element 31 and attaching the capacitor module 1 to an external substrate, device, or the like. In this embodiment, the supports 11 and 21 are formed in a rectangular shape when viewed from the height direction (Y direction). Moreover, in the present embodiment, the supports 11 and 21 include the first support 11 and the second support 21 . In this embodiment, the first support 11 and the second support 21 have the same shape. Therefore, since the first support 11 and the second support 21 can be formed with the same mold, the manufacturing cost of the capacitor module 1 can be reduced.
　支持体１１、２１は、ラミネートフィルム３２のフランジ部３４を固定する。本実施の形態では、２つの支持体１１、２１により、ラミネートフィルム３２のフランジ部３４を挟んで固定している。 The supports 11 and 21 fix the flange portion 34 of the laminate film 32 . In this embodiment, the flange portion 34 of the laminate film 32 is sandwiched and fixed between the two supports 11 and 21 .
　第１支持体１１は、ラミネートフィルム３２を保持する枠部１２を有する。同様に、第２支持体２１は、ラミネートフィルム３２を保持する枠部２２を有する。本実施の形態では、図３Ｃに示すように、第１支持体１１の枠部１２の端面１２ａと第２支持体２１の枠部２２の端面２２ａとで、ラミネートフィルム３２のフランジ部３４を挟んで固定する。２つの支持体１１、２１でラミネートフィルム３２のフランジ部３４を固定することで、コンデンサ素子３１を支持体１１、２１で保持することができる。 The first support 11 has a frame portion 12 that holds the laminate film 32 . Similarly, the second support 21 has a frame portion 22 that holds the laminate film 32 . In this embodiment, as shown in FIG. 3C, the flange portion 34 of the laminate film 32 is sandwiched between the end surface 12a of the frame portion 12 of the first support member 11 and the end surface 22a of the frame portion 22 of the second support member 21 and fixed. By fixing flange portion 34 of laminate film 32 with two supports 11 and 21 , capacitor element 31 can be held by supports 11 and 21 .
　図１および図２に示すように、支持体１１、２１は筒状に形成されている。このため、コンデンサ素子３１の一部が支持体１１、２１から露出している。コンデンサ素子３１がラミネートフィルム３２で被覆されているため、支持体１１、２１から露出していても、コンデンサ素子３１の防湿性および気密性を損なわずに、コンデンサモジュール１の小型化および軽量化を図ることができる。 As shown in FIGS. 1 and 2, the supports 11 and 21 are cylindrical. Therefore, a portion of capacitor element 31 is exposed from supports 11 and 21 . Since the capacitor element 31 is covered with the laminate film 32, even if it is exposed from the supports 11 and 21, the size and weight of the capacitor module 1 can be reduced without impairing the moisture resistance and airtightness of the capacitor element 31.
　また、本実施の形態では、第１支持体１１の外側面１３に固定部１４が設けられ、第２支持体２１の外側面２３に固定部２４が設けられている。例えば、固定部１４および固定部２４をねじ等で締結することにより、第１支持体１１と第２支持体２１とを固定することができる。また、固定部１４および固定部２４をねじ等で締結することにより、接着剤等を使用せずにフランジ部３４を挟んで固定することができる。固定部１４、２４は、第１支持体１１と第２支持体２１とを固定するほか、コンデンサモジュール１を外部の基板または装置等に固定する役割も有する。 Further, in the present embodiment, the fixing portion 14 is provided on the outer surface 13 of the first support 11 , and the fixing portion 24 is provided on the outer surface 23 of the second support 21 . For example, the first support 11 and the second support 21 can be fixed by fastening the fixing portion 14 and the fixing portion 24 with screws or the like. Further, by fastening the fixing portion 14 and the fixing portion 24 with screws or the like, the flange portion 34 can be sandwiched and fixed without using an adhesive or the like. The fixing portions 14 and 24 have the role of fixing the first support 11 and the second support 21, and also fixing the capacitor module 1 to an external board or device.
　支持体１１、２１を構成する材料としては、例えば、ポリフェニレンサルファイド、ポリブチレンテレフタレート、または液晶ポリマー等の樹脂、またはアルミニウム合金等の金属を使用することができる。支持体１１、２１の材料として樹脂を使用する場合、ガラス繊維または無機フィラー等を樹脂に配合することにより、支持体１１、２１の寸法安定性または強度を向上させることができる。支持体１１、２１の材料として金属を使用する場合、端子電極３５と支持体１１、２１との間に十分な空間を設けるか、または絶縁材料を挟むことで、端子電極３５と支持体１１、２１との間の絶縁性を確保することができる。 As materials for forming the supports 11 and 21, for example, resins such as polyphenylene sulfide, polybutylene terephthalate, or liquid crystal polymers, or metals such as aluminum alloys can be used. When a resin is used as the material for the supports 11 and 21, the dimensional stability or strength of the supports 11 and 21 can be improved by adding glass fiber, inorganic filler, or the like to the resin. When metal is used as the material for the supports 11 and 21, insulation between the terminal electrode 35 and the supports 11 and 21 can be ensured by providing a sufficient space between the terminal electrode 35 and the supports 11 and 21 or by sandwiching an insulating material.
　図３Ａ～図３Ｃに示すように、フランジ部３４は、第１支持体１１の枠部１２の端面１２ａと、第２支持体２１の枠部２２の端面２２ａと、により挟まれて固定されている。フランジ部３４は、フィルムを２枚重ね合わせた部分であるため、被覆部３３よりも破れにくい。このため、被覆部３３ではなくフランジ部３４を固定することにより、ラミネートフィルム３２の破損を抑制することができる。 As shown in FIGS. 3A to 3C, the flange portion 34 is sandwiched and fixed between the end surface 12a of the frame portion 12 of the first support 11 and the end surface 22a of the frame portion 22 of the second support 21. Since the flange portion 34 is a portion in which two films are superimposed, it is more difficult to tear than the covering portion 33 . Therefore, by fixing the flange portion 34 instead of the covering portion 33, damage to the laminate film 32 can be suppressed.
　上述したように、コンデンサ素子３１は、高さ方向（Ｙ方向）から見たときに矩形状に形成されており、フランジ部３４がコンデンサ素子３１の四辺を囲むように形成されている。本実施の形態では、図１および図２に示すように、コンデンサ素子３１のすべての辺に配置されたフランジ部３４が、支持体１１、２１の枠部１２、２２に固定されている。支持体１１、２１の枠部１２、２２により四辺のフランジ部３４を固定することで、コンデンサ素子３１をより安定して保持することができる。 As described above, the capacitor element 31 is formed in a rectangular shape when viewed from the height direction (Y direction), and the flange portion 34 is formed so as to surround the four sides of the capacitor element 31 . In this embodiment, as shown in FIGS. 1 and 2, flange portions 34 arranged on all sides of capacitor element 31 are fixed to frames 12 and 22 of supports 11 and 21 . By fixing the flange portions 34 on the four sides with the frames 12 and 22 of the supports 11 and 21, the capacitor element 31 can be held more stably.
［効果］
　実施の形態１にかかるコンデンサモジュール１によれば、以下の効果を奏することができる。 [effect]
According to the capacitor module 1 according to the first embodiment, the following effects can be obtained.
　コンデンサモジュール１は、コンデンサ素子３１と支持体１１、２１と、を備える。コンデンサ素子３１は、ラミネートフィルム３２で被覆されている。支持体１１、２１は、ラミネートフィルム３２を固定する枠部１２、２２を有する。ラミネートフィルム３２は、コンデンサ素子３１を覆う被覆部３３と、被覆部３３の外縁から延びるフランジ部３４と、を有する。支持体１１、２１は、枠部１２、２２の端面１２ａ、２２ａでラミネートフィルム３２のフランジ部３４を固定することにより、コンデンサ素子３１を保持する。 The capacitor module 1 includes a capacitor element 31 and supports 11 and 21. Capacitor element 31 is covered with laminate film 32 . Supports 11 and 21 have frames 12 and 22 to which laminate films 32 are fixed. Laminate film 32 has a covering portion 33 covering capacitor element 31 and a flange portion 34 extending from the outer edge of covering portion 33 . Supports 11 and 21 hold capacitor element 31 by fixing flange portion 34 of laminate film 32 with end surfaces 12 a and 22 a of frame portions 12 and 22 .
　このような構成により、ラミネートフィルムの破損を防止して耐久性を向上させたコンデンサモジュールを提供することができる。 With such a configuration, it is possible to provide a capacitor module that prevents damage to the laminate film and improves durability.
　支持体は、第１支持体１１と第２支持体２１と、を含む第１支持体１１の枠部１２と第２支持体２１の枠部２２とにより、フランジ部３４を挟んで固定する。 The support is fixed by sandwiching the flange portion 34 between the frame portion 12 of the first support member 11 and the frame portion 22 of the second support member 21 including the first support member 11 and the second support member 21 .
　このような構成により、容易にフランジ部３４を固定してコンデンサ素子３１を保持することができる。 With such a configuration, the flange portion 34 can be easily fixed to hold the capacitor element 31 .
　第１支持体１１の枠部１２の外側面１３および第２支持体２１の枠部２２の外側面２３に、第１支持体１１と第２支持体２１とを固定する固定部１４、２４が設けられている。 Fixing parts 14 and 24 for fixing the first support 11 and the second support 21 are provided on the outer surface 13 of the frame 12 of the first support 11 and the outer surface 23 of the frame 22 of the second support 21 .
　このような構成により、第１支持体１１と第２支持体２１との固定、および外部の基板または装置等への固定を同時に行うことができる。 With such a configuration, it is possible to simultaneously fix the first support 11 and the second support 21 and fix them to an external substrate or device.
　支持体１１、２１は、筒状に形成されている。 The supports 11 and 21 are cylindrical.
　このような構成により、コンデンサモジュール１の軽量化に寄与する。また、コンデンサ素子３１がラミネートフィルム３２で被覆されているため、コンデンサ素子３１が支持体１１、２１から露出していても耐候性を確保することができる。 Such a configuration contributes to weight reduction of the capacitor module 1. Moreover, since the capacitor element 31 is covered with the laminate film 32, weather resistance can be ensured even if the capacitor element 31 is exposed from the supports 11 and 21. FIG.
［変形例］
　なお、上述した実施の形態では、コンデンサモジュール１が１つのコンデンサ素子３１を備える例について説明したが、これに限定されない。コンデンサモジュール１は、複数のコンデンサ素子を備えていてもよい。 [Modification]
In addition, in the embodiment described above, an example in which the capacitor module 1 includes one capacitor element 31 has been described, but the present invention is not limited to this. The capacitor module 1 may have a plurality of capacitor elements.
　また、上述した実施の形態では、ラミネートフィルム３２を熱融着により接着する例について説明したが、これに限定されない。ラミネートフィルム３２を、接着剤等を使用して貼り合わせた構成であってもよい。 Also, in the above-described embodiment, an example in which the laminate film 32 is adhered by heat sealing has been described, but the present invention is not limited to this. The laminate film 32 may be laminated using an adhesive or the like.
　また、上述した実施の形態では、コンデンサ素子３１の四辺に配置されたフランジ部３４を固定する例について説明したが、コンデンサ素子３１の四辺に配置されたフランジ部３４のうち、少なくとも一部が支持体１１、２１で固定されていればよい。例えば、コンデンサ素子３１が高さ方向（Ｙ方向）から見たときに矩形状である場合、対向する二辺に配置されたフランジ部３４を支持体１１、２１により固定してもよい。 Further, in the above-described embodiment, an example in which the flange portions 34 arranged on the four sides of the capacitor element 31 are fixed has been described, but at least a part of the flange portions 34 arranged on the four sides of the capacitor element 31 may be fixed by the supports 11 and 21. For example, when the capacitor element 31 has a rectangular shape when viewed from the height direction (Y direction), the flange portions 34 arranged on two opposite sides may be fixed by the supports 11 and 21 .
　また、上述した実施の形態では、コンデンサ素子３１が、長円形状の断面を有する柱状に形成されている例について説明したが、これに限定されない。コンデンサ素子３１は、例えば円柱形状または四角柱形状など、その他の形状であってもよい。 Also, in the above-described embodiment, an example in which the capacitor element 31 is formed in a columnar shape having an oval cross section has been described, but the present invention is not limited to this. Capacitor element 31 may have other shapes, such as a cylindrical shape or a square prism shape, for example.
　また、上述した実施の形態では、第１支持体１１と第２支持体２１とが同一の形状である例について説明したが、これに限定されない。コンデンサ素子３１を保持することができる形状であれば、第１支持体１１と第２支持体２１とは異なる形状であってもよい。 Also, in the above-described embodiment, an example in which the first support 11 and the second support 21 have the same shape has been described, but the present invention is not limited to this. The first support 11 and the second support 21 may have different shapes as long as they have a shape that can hold the capacitor element 31 .
　図４Ａは、実施の形態１の変形例１にかかるコンデンサモジュール１Ａを示す断面図である。図４Ｂは、図４Ａのコンデンサモジュール１Ａの領域Ｒ２を拡大した図である。図４Ａに示すように、第１支持体１１１および第２支持体１２１が、箱状に形成されていてもよい。 4A is a cross-sectional view showing a capacitor module 1A according to Modification 1 of Embodiment 1. FIG. FIG. 4B is an enlarged view of region R2 of capacitor module 1A in FIG. 4A. As shown in FIG. 4A, the first support 111 and the second support 121 may be box-shaped.
　第１支持体１１１は、ラミネートフィルム３２の被覆部３３に対向する対向面１１２ｂを有する箱状に形成されていてもよい。同様に、第２支持体１２１も、ラミネートフィルム３２の被覆部３３に対向する対向面１２２ｂを有する箱状に形成されていてもよい。 The first support 111 may be formed in a box shape having a facing surface 112b that faces the covering portion 33 of the laminate film 32 . Similarly, the second support 121 may also be shaped like a box having a facing surface 122b that faces the covering portion 33 of the laminate film 32 .
　また、第１支持体１１１の対向面１１２ｂと対向面１１２ｂに対向する被覆部３３との間には、隙間Ｇ１が形成されていてもよい。隙間Ｇ１により、コンデンサ素子３１の使用環境により熱膨張が生じても、支持体１１１、１２１とコンデンサ素子３１との間に一定のクリアランスを確保することができる。このため、コンデンサ素子３１の熱膨張によるラミネートフィルム３２の被覆部３３の破損を抑制することができる。 A gap G1 may be formed between the facing surface 112b of the first support 111 and the covering portion 33 facing the facing surface 112b. Due to the gap G1, a constant clearance can be secured between the supports 111 and 121 and the capacitor element 31 even if thermal expansion occurs due to the environment in which the capacitor element 31 is used. Therefore, it is possible to suppress breakage of the covering portion 33 of the laminate film 32 due to thermal expansion of the capacitor element 31 .
　一方、枠部１１２、１２２に挟まれたフランジ部３４により、コンデンサ素子３１が対向面１２２ｂに向かって押し付けられる。このため、第２支持体１２１の対向面１２２ｂと対向面１２２ｂに対向する被覆部３３とは、接触している。 On the other hand, the capacitor element 31 is pressed against the facing surface 122b by the flange portion 34 sandwiched between the frame portions 112 and 122. Therefore, the facing surface 122b of the second support 121 and the covering portion 33 facing the facing surface 122b are in contact with each other.
　また、図４Ｂに示すように、フランジ部３４の先端３４ａが、枠部１１２、１２２の端面１１２ａ、１２２ａの幅Ｗ１に収まるよう配置されていてもよい。このような構成により、製造ばらつきに起因して、支持体１１１、１２１からフランジ部３４がはみ出すことを抑制することができる。 Further, as shown in FIG. 4B, the tip 34a of the flange portion 34 may be arranged so as to fit within the width W1 of the end surfaces 112a and 122a of the frame portions 112 and 122. With such a configuration, it is possible to suppress protrusion of the flange portion 34 from the supports 111 and 121 due to manufacturing variations.
　図５Ａは、実施の形態１の変形例２にかかるコンデンサモジュール１Ｂを示す断面図である。図５Ｂは、図５Ａのコンデンサモジュール１Ｂの領域Ｒ３を拡大した図である。図５Ａに示すように、高さ方向（Ｙ方向）において、フランジ部２３４の被覆部２３３に近い位側の第１端部２３４ｃの配置されている位置と、第１端部２３４ｃと反対側の第２端部２３４ｄの配置されている位置とが異なっている。高さ方向とは、フランジ部２３４の延びる方向と交差する方向である。言い換えると、図５Ｂに示すように、高さ方向において、フランジ部２３４の第１端部２３４ｃの位置Ｐ１と、フランジ部２３４の第２端部２３４ｄの位置Ｐ２とが、ずれて配置されている。 FIG. 5A is a cross-sectional view showing a capacitor module 1B according to Modification 2 of Embodiment 1. FIG. FIG. 5B is an enlarged view of region R3 of capacitor module 1B in FIG. 5A. As shown in FIG. 5A, in the height direction (Y direction), the position where the first end 234c of the flange portion 234 near the covering portion 233 is arranged and the position where the second end 234d on the side opposite to the first end 234c are arranged are different. The height direction is a direction intersecting with the extending direction of the flange portion 234 . In other words, as shown in FIG. 5B, the position P1 of the first end portion 234c of the flange portion 234 and the position P2 of the second end portion 234d of the flange portion 234 are shifted in the height direction.
　コンデンサモジュール１Ｂでは、高さ方向におけるフランジ部２３４の第１端部２３４ｃの位置と異なる位置に、第１支持体２１１の枠部２１２の端面２１２ａと第２支持体２２１の枠部２２２の端面２２２ａとが配置されている。このため、フランジ部２３４を枠部２１２、２２２で挟んで固定すると、フランジ部２３４が引っ張られて、過度な力を加えずにコンデンサ素子３１を第２支持体２２１の対向面２２２ｂに押さえつけることができる。このため、コンデンサモジュール１Ｂの耐振動性を向上させることができる。 In the capacitor module 1B, the end face 212a of the frame 212 of the first support 211 and the end face 222a of the frame 222 of the second support 221 are arranged at positions different from the position of the first end 234c of the flange 234 in the height direction. Therefore, when the flange portion 234 is sandwiched between the frame portions 212 and 222 and fixed, the flange portion 234 is pulled and the capacitor element 31 can be pressed against the facing surface 222b of the second support 221 without applying excessive force. Therefore, the vibration resistance of the capacitor module 1B can be improved.
（実施の形態２）
　本発明の実施の形態２にかかるコンデンサモジュール２について説明する。 (Embodiment 2)
A capacitor module 2 according to a second embodiment of the present invention will be described.
　実施の形態２では、主に実施の形態１と異なる点について説明する。実施の形態２においては、実施の形態１と同一または同等の構成については同じ符号を付して説明する。また、実施の形態２では、実施の形態１と重複する記載は省略する。 In the second embodiment, differences from the first embodiment will be mainly described. In the second embodiment, the same reference numerals are assigned to the same or equivalent configurations as in the first embodiment. In addition, in the second embodiment, the description overlapping with the first embodiment is omitted.
　図６は、本発明の実施の形態２にかかるコンデンサモジュール２を示す斜視図である。図７は、図６のコンデンサモジュール２の分解斜視図である。 FIG. 6 is a perspective view showing a capacitor module 2 according to Embodiment 2 of the present invention. 7 is an exploded perspective view of the capacitor module 2 of FIG. 6. FIG.
　実施の形態２にかかるコンデンサモジュール２では、図６および図７に示すように、コンデンサ素子３１の数、および支持体３１１、３２１の形状が、実施の形態１と異なる。また、コンデンサモジュール２では、支持体３１１、３２１はそれぞれ、３つのコンデンサ素子３１を収容する３つの収容部３１５、３２５を有する点で、実施の形態１と異なる。 In the capacitor module 2 according to the second embodiment, as shown in FIGS. 6 and 7, the number of capacitor elements 31 and the shapes of the supports 311 and 321 are different from those of the first embodiment. Further, the capacitor module 2 differs from the first embodiment in that each of the supports 311 and 321 has three accommodating portions 315 and 325 that accommodate three capacitor elements 31 .
　図６および図７に示すように、コンデンサモジュール２では、支持体は、第１支持体３１１と第２支持体３２１と、を含む。第１支持体３１１と第２支持体３２１とは、同一の形状で形成されている。このため、第１支持体３１１と第２支持体３２１とを共用することができる。第１支持体３１１は、枠部３１２で区切られた３つの収容部３１５を有する。同様に、第２支持体３２１は、枠部３２２で区切られた３つの収容部３２５を有する。それぞれの収容部３１５、３２５には、コンデンサ素子３１が収容される。 As shown in FIGS. 6 and 7, in the capacitor module 2 , the supports include a first support 311 and a second support 321 . The first support 311 and the second support 321 are formed in the same shape. Therefore, the first support 311 and the second support 321 can be used in common. The first support 311 has three housings 315 separated by a frame 312 . Similarly, the second support 321 has three housings 325 separated by a frame 322 . Capacitor element 31 is accommodated in each of accommodating portions 315 and 325 .
　本実施の形態では、横方向（Ｘ方向）にコンデンサ素子３１を３つ並べて配置することができる。３つのコンデンサ素子３１を共通の支持体３１１、３２１で支持することにより、省スペース化を実現することができる。 In this embodiment, three capacitor elements 31 can be arranged side by side in the horizontal direction (X direction). Space saving can be realized by supporting the three capacitor elements 31 by the common supports 311 and 321 .
　また、第１支持体３１１の外側面３１３には固定部３１４が設けられ、第２支持体３２１の外側面３２３には固定部３２４が設けられている。 A fixing portion 314 is provided on the outer side surface 313 of the first support 311 , and a fixing portion 324 is provided on the outer side surface 323 of the second support 321 .
　図８は、図６の領域Ｒ４を拡大した図である。図７～図８に示すように、第１支持体３１１の枠部３１２の端面３１２ａおよび第２支持体３２１の枠部３２２の端面３２２ａには、コンデンサ素子３１の端子電極３５を挿通するための切欠き３１６、３２６が形成されている。端面３１２ａ、３２２ａに切欠き３１６、３２６が形成されていることにより、端子電極３５が支持体３１１、３２１に接触することを抑制することができる。 FIG. 8 is an enlarged view of region R4 in FIG. As shown in FIGS. 7 and 8, cutouts 316 and 326 for inserting the terminal electrodes 35 of the capacitor element 31 are formed in the end surface 312a of the frame portion 312 of the first support member 311 and the end surface 322a of the frame portion 322 of the second support member 321. The notches 316 and 326 are formed in the end faces 312a and 322a, so that the contact of the terminal electrodes 35 with the supports 311 and 321 can be suppressed.
　図９Ａは、図６のコンデンサモジュール２のＣ－Ｃ断面図である。図９Ｂは、図９Ａの領域Ｒ５を拡大した図である。図９Ａ～図９Ｂに示すように、隣接する２つのコンデンサ素子３１の間に配置される枠部３１２ｂ、３２２ｂは、支持体３１１、３２１の端部に配置される枠部３１２ｃ、３２２ｃよりも幅が広く形成されていてもよい。この場合、図９Ｂに示すように、フランジ部３４どうしを重ねずに固定することができる。また、隣接する２つのコンデンサ素子３１のフランジ部３４を、一対の枠部３１２ｂ、３２２ｂで固定する。このため、一対の枠部３１２ｂ、３２２ｂで２つのコンデンサ素子３１の保持することができ、コンデンサモジュール２の小型化に寄与する。 FIG. 9A is a CC cross-sectional view of the capacitor module 2 of FIG. FIG. 9B is an enlarged view of region R5 in FIG. 9A. As shown in FIGS. 9A and 9B, the frame portions 312b and 322b arranged between two adjacent capacitor elements 31 may be wider than the frame portions 312c and 322c arranged at the ends of the supports 311 and 321. In this case, as shown in FIG. 9B, the flange portions 34 can be fixed without overlapping each other. Also, the flange portions 34 of two adjacent capacitor elements 31 are fixed by a pair of frame portions 312b and 322b. Therefore, the two capacitor elements 31 can be held by the pair of frame portions 312b and 322b, which contributes to miniaturization of the capacitor module 2. FIG.
［効果］
　実施の形態２にかかるコンデンサモジュール２によれば、以下の効果を奏することができる。 [effect]
According to the capacitor module 2 according to the second embodiment, the following effects can be obtained.
　支持体３１１、３２１は、枠部３１２、３２２で区切られた複数の収容部３１５、３２５を有する。複数の収容部３１５、３２５のそれぞれには、コンデンサ素子３１が収容される。 The supports 311 and 321 have a plurality of housing sections 315 and 325 separated by frames 312 and 322 . Capacitor element 31 is accommodated in each of a plurality of accommodating portions 315 and 325 .
　このような構成により、所望の電気特性が得られるよう、コンデンサ素子の数を増やすことができる。また、複数のコンデンサ素子を共通の支持体で保持することができるため、実施の形態１のコンデンサモジュール１を複数配置するよりも製造工数を削減することができ、省スペース化にも寄与する。 With such a configuration, the number of capacitor elements can be increased so as to obtain desired electrical characteristics. In addition, since a plurality of capacitor elements can be held by a common support, manufacturing man-hours can be reduced compared to arranging a plurality of capacitor modules 1 of Embodiment 1, which contributes to space saving.
　また、横方向（Ｘ方向）に端子電極３５が並ぶようコンデンサ素子３１を配置することで、横方向に多数のコンデンサ素子３１を並べることができる。 Also, by arranging the capacitor elements 31 so that the terminal electrodes 35 are arranged in the horizontal direction (X direction), a large number of capacitor elements 31 can be arranged in the horizontal direction.
［変形例］
　なお、上述した実施の形態では、コンデンサモジュール２が３つのコンデンサ素子３１を保持することのできる支持体３１１、３２１を有する例について説明したが、これに限定されない。支持体は、２つ以上のコンデンサ素子３１を保持できるような形状であればよい。 [Modification]
In the above-described embodiment, the example in which the capacitor module 2 has the supports 311 and 321 capable of holding the three capacitor elements 31 has been described, but the present invention is not limited to this. The support may have any shape that can hold two or more capacitor elements 31 .
　また、上述した実施の形態では、横方向（Ｘ方向）にコンデンサ素子３１を並べて配置する例について説明したが、これに限定されない。コンデンサ素子３１を縦方向（Ｚ方向）に並べて配置できるような、支持体の形状であってもよい。または、縦方向および横方向に複数のコンデンサ素子３１を配列できるような支持体の形状であってもよい。 Also, in the above-described embodiment, an example in which the capacitor elements 31 are arranged side by side in the horizontal direction (X direction) has been described, but the present invention is not limited to this. The shape of the support may be such that the capacitor elements 31 can be arranged side by side in the vertical direction (Z direction). Alternatively, the shape of the support may be such that a plurality of capacitor elements 31 can be arranged in the vertical and horizontal directions.
　図１０は、実施の形態２の変形例にかかるコンデンサモジュールの断面の一部を拡大した図である。図１０に示すように、隣接する２つのコンデンサ素子３１のフランジ部３４の少なくとも一部が重なっていてもよい。このような構成により、より省スペース化を図ることができる。 FIG. 10 is an enlarged view of a part of the cross section of the capacitor module according to the modification of the second embodiment. As shown in FIG. 10, at least a portion of the flange portions 34 of two adjacent capacitor elements 31 may overlap. With such a configuration, it is possible to further save space.
（実施の形態３）
　本発明の実施の形態３にかかるコンデンサモジュール３について説明する。 (Embodiment 3)
A capacitor module 3 according to a third embodiment of the present invention will be described.
　実施の形態３では、主に実施の形態１と異なる点について説明する。実施の形態３においては、実施の形態１と同一または同等の構成については同じ符号を付して説明する。また、実施の形態３では、実施の形態１と重複する記載は省略する。 In Embodiment 3, differences from Embodiment 1 will be mainly described. In the third embodiment, the same reference numerals are assigned to the same or equivalent configurations as in the first embodiment. Moreover, in the third embodiment, the description overlapping with that in the first embodiment is omitted.
　図１１は、実施の形態３にかかるコンデンサモジュール３を示す斜視図である。図１２は、図１１のコンデンサモジュール３の別の方向からの斜視図である。実施の形態３では、複数の支持体を高さ方向（Ｙ方向）に重ねることにより複数のコンデンサ素子３１を保持する点で、実施の形態１と異なる。 FIG. 11 is a perspective view showing the capacitor module 3 according to the third embodiment. FIG. 12 is a perspective view of the capacitor module 3 of FIG. 11 from another direction. Embodiment 3 differs from Embodiment 1 in that a plurality of capacitor elements 31 are held by stacking a plurality of supports in the height direction (Y direction).
　図１１および図１２に示すように、コンデンサモジュール３は、４つの支持体として、第１支持体４１１、第２支持体４２１、第３支持体４３１、および第４支持体４４１を含む。本実施の形態では、第１支持体４１１と第４支持体４４１とが同一の形状を有し共用可能である。一方、第２支持体４２１と第３支持体４３１とは異なる形状を有し共用することができない。４つの支持体４１１～４４１は、高さ方向（Ｙ方向）に重ねて配置されている。第１支持体４１１と第２支持体４２１とで、１つのコンデンサ素子３１を保持し、第２支持体４２１と第３支持体４３１とで、１つのコンデンサ素子３１を保持し、第３支持体４３１と第４支持体４４１とで、１つのコンデンサ素子３１を保持する。したがって、コンデンサモジュール３では、４つの支持体４１１～４４１により、３つのコンデンサ素子３１を保持することができる。 As shown in FIGS. 11 and 12, the capacitor module 3 includes a first support 411, a second support 421, a third support 431, and a fourth support 441 as four supports. In this embodiment, the first support 411 and the fourth support 441 have the same shape and can be used in common. On the other hand, the second support 421 and the third support 431 have different shapes and cannot be used in common. The four supports 411 to 441 are stacked in the height direction (Y direction). One capacitor element 31 is held by the first support 411 and the second support 421, one capacitor element 31 is held by the second support 421 and the third support 431, and one capacitor element 31 is held by the third support 431 and the fourth support 441. Therefore, in the capacitor module 3, the three capacitor elements 31 can be held by the four supports 411-441.
　第１支持体４１１の外側面４１３には、２つの固定部４１４が設けられている。第２支持体４２１の外側面４２３には、２つの固定部４２４と２つの固定部４２５とが設けられている。第３支持体４３１の外側面４３３には、２つの固定部４３４と２つの固定部４３５とが設けられている。第４支持体４４１の外側面４４３には、２つの固定部４４４が設けられている。 Two fixing parts 414 are provided on the outer surface 413 of the first support 411 . Two fixing portions 424 and two fixing portions 425 are provided on the outer surface 423 of the second support 421 . Two fixing portions 434 and two fixing portions 435 are provided on the outer surface 433 of the third support 431 . Two fixing portions 444 are provided on the outer surface 443 of the fourth support 441 .
　第１支持体４１１と第２支持体４２１とは、固定部４１４と固定部４２４とを締結することにより固定される。第２支持体４２１と第３支持体４３１とは、固定部４２５と固定部４３５とを締結することにより固定される。第３支持体４３１と第４支持体４４１とは、固定部４３４と固定部４４４とを締結することにより固定される。 The first support 411 and the second support 421 are fixed by fastening the fixing portion 414 and the fixing portion 424 . The second support 421 and the third support 431 are fixed by fastening the fixing portion 425 and the fixing portion 435 . The third support 431 and the fourth support 441 are fixed by fastening the fixing portion 434 and the fixing portion 444 .
　したがって、最上段となる第１支持体４１１と最下段となる第４支持体４４１とはそれぞれ、２つの固定部４１４、４４４を有し、中間に位置する第２支持体４２１と第３支持体４３１とはそれぞれ、合わせて４つの固定部４２４、４２５、４３４、４３５を有する。 Therefore, the first support 411 at the top and the fourth support 441 at the bottom each have two fixing portions 414 and 444, and the second support 421 and the third support 431 at the middle have four fixing portions 424, 425, 434 and 435 respectively.
　第１支持体４１１に設けられた２つの固定部４１４はそれぞれ、縦方向（Ｚ方向）における位置が異なる。具体的には、一方の固定部４１４ａは、縦方向において位置Ｚ１に配置され、他方の固定部４１４ｂは、縦方向において位置Ｚ２に配置される。同様に、第４支持体４４１に設けられた２つの固定部４４４もそれぞれ、縦方向における位置が異なる。一方の固定部４４４ａは、縦方向において位置Ｚ１に配置され、他方の固定部４４４ｂは、縦方向において位置Ｚ２に配置される。 The positions of the two fixing parts 414 provided on the first support 411 are different in the vertical direction (Z direction). Specifically, one fixing portion 414a is arranged at position Z1 in the vertical direction, and the other fixing portion 414b is arranged at position Z2 in the vertical direction. Similarly, the two fixing portions 444 provided on the fourth support 441 also have different positions in the vertical direction. One fixing portion 444a is arranged at position Z1 in the vertical direction, and the other fixing portion 444b is arranged at position Z2 in the vertical direction.
　また、第２支持体４２１に設けられた２つの固定部４２４はそれぞれ、縦方向（Ｚ方向）における位置が異なる。一方の固定部４２４ａは、縦方向において位置Ｚ１に配置され、他方の固定部４２４ｂは、縦方向において位置Ｚ２に配置される。さらに、第２支持体４２１に設けられた２つの固定部４２５もそれぞれ、縦方向における位置が異なる。一方の固定部４２５ａは、縦方向において位置Ｚ１に配置され、他方の固定部４２５ｂは、縦方向において位置Ｚ２に配置される。 Also, the positions of the two fixing portions 424 provided on the second support 421 are different in the vertical direction (Z direction). One fixing portion 424a is arranged at position Z1 in the vertical direction, and the other fixing portion 424b is arranged at position Z2 in the vertical direction. Furthermore, the two fixing portions 425 provided on the second support 421 also have different positions in the vertical direction. One fixing portion 425a is arranged at position Z1 in the vertical direction, and the other fixing portion 425b is arranged at position Z2 in the vertical direction.
　また、第３支持体４３１に設けられた２つの固定部４３４はそれぞれ、縦方向（Ｚ方向）における位置が異なる。一方の固定部４３４ａは、縦方向において位置Ｚ１に配置され、他方の固定部４３４ｂは、縦方向において位置Ｚ２に配置される。さらに、第３支持体４３１に設けられた２つの固定部４３５もそれぞれ、縦方向における位置が異なる。一方の固定部４３５ａは、縦方向において位置Ｚ１に配置され、他方の固定部４３５ｂは、縦方向において位置Ｚ２に配置される。 Also, the two fixing portions 434 provided on the third support 431 have different positions in the vertical direction (Z direction). One fixing portion 434a is arranged at position Z1 in the vertical direction, and the other fixing portion 434b is arranged at position Z2 in the vertical direction. Furthermore, the two fixing portions 435 provided on the third support 431 also have different positions in the vertical direction. One fixing portion 435a is arranged at position Z1 in the vertical direction, and the other fixing portion 435b is arranged at position Z2 in the vertical direction.
　それぞれの固定部の配置される位置をずらすことで、ねじ等による締結を容易に行うことができる。 By shifting the position of each fixed part, it is possible to easily fasten with screws.
［効果］
　実施の形態３にかかるコンデンサモジュール３によれば、以下の効果を奏することができる。 [effect]
According to the capacitor module 3 according to the third embodiment, the following effects can be obtained.
　支持体は複数の支持体４１１、４２１、４３１、４４１を含む。複数の支持体４１１、４２１、４３１、４４１は、フランジ部の延びる方向と交差する方向（Ｙ方向）と交差する方向に重ねて配置される。複数のコンデンサ素子３１のフランジ部は、複数の支持体４１１、４２１、４３１、４４１の枠部に挟まれて固定される。 The supports include a plurality of supports 411, 421, 431, 441. The plurality of supports 411, 421, 431, and 441 are stacked in a direction intersecting the extending direction of the flange portion (the Y direction). The flange portions of the plurality of capacitor elements 31 are sandwiched and fixed between the frame portions of the plurality of supports 411 , 421 , 431 and 441 .
　このような構成により、コンデンサ素子の設置の自由度を向上することができる。 With such a configuration, it is possible to improve the degree of freedom in installing the capacitor element.
［変形例］
　なお、上述した実施の形態では、３つのコンデンサ素子３１を保持する例について説明したが、コンデンサ素子３１の数はこれに限定されない。２つ以上のコンデンサ素子３１を保持するような構成であればよい。 [Modification]
In the above-described embodiment, an example in which three capacitor elements 31 are held has been described, but the number of capacitor elements 31 is not limited to this. Any configuration that holds two or more capacitor elements 31 may be employed.
　図１３は、実施の形態３の変形例にかかるコンデンサモジュール３Ａを示す斜視図である。図１４は、図１３のコンデンサモジュール３Ａの別の方向からの斜視図である。 FIG. 13 is a perspective view showing a capacitor module 3A according to a modified example of the third embodiment. 14 is a perspective view from another direction of the capacitor module 3A of FIG. 13. FIG.
　図１３～図１４に示すように、縦方向において、すべての固定部が同じ位置に配置されていてもよい。具体的には、第１支持体５１１に設けられた固定部５１４、第２支持体５２１に設けられた固定部５２４、第３支持体５３１に設けられた固定部５３４、および第４支持体５４１に設けられた固定部５４４が、縦方向に一直線に並んで配置されている。 As shown in FIGS. 13 and 14, all fixing parts may be arranged at the same position in the vertical direction. Specifically, the fixed portion 514 provided on the first support 511, the fixed portion 524 provided on the second support 521, the fixed portion 534 provided on the third support 531, and the fixed portion 544 provided on the fourth support 541 are arranged in a straight line in the vertical direction.
　このような構成により、コンデンサモジュール３Ａの設計自由度を向上することができる。 With such a configuration, it is possible to improve the degree of freedom in designing the capacitor module 3A.
（実施の形態４）
　本発明の実施の形態４にかかる電力変換装置４について説明する。 (Embodiment 4)
A power conversion device 4 according to Embodiment 4 of the present invention will be described.
　実施の形態４では、主に実施の形態１と異なる点について説明する。実施の形態４においては、実施の形態１と同一または同等の構成については同じ符号を付して説明する。また、実施の形態４では、実施の形態１と重複する記載は省略する。 In Embodiment 4, mainly different points from Embodiment 1 will be described. In the fourth embodiment, the same reference numerals are given to the same or equivalent configurations as in the first embodiment. Further, in the fourth embodiment, the description overlapping with the first embodiment is omitted.
　図１５は、実施の形態４にかかる電力変換装置４を示す断面模式図である。実施の形態４では、電力変換装置４の筐体６１でコンデンサ素子３１を保持している点で、実施の形態１と異なる。 FIG. 15 is a schematic cross-sectional view showing the power converter 4 according to the fourth embodiment. The fourth embodiment is different from the first embodiment in that the housing 61 of the power converter 4 holds the capacitor element 31 .
　電力変換装置４は、パワー半導体モジュール５１と、コンデンサ素子３１と、筐体６１と、を備える。パワー半導体モジュール５１は、直流電力と交流電力とを変換して、周波数や電圧を制御する。コンデンサ素子３１は、ラミネートフィルム３２により被覆されている。ラミネートフィルム３２は、コンデンサ素子を覆う被覆部３３と、被覆部３３の外縁から外側に延びるフランジ部３４と、を有する。 The power conversion device 4 includes a power semiconductor module 51, a capacitor element 31, and a housing 61. The power semiconductor module 51 converts DC power and AC power and controls frequency and voltage. Capacitor element 31 is covered with laminate film 32 . Laminate film 32 has a covering portion 33 covering the capacitor element and a flange portion 34 extending outward from the outer edge of covering portion 33 .
　パワー半導体モジュール５１およびコンデンサ素子３１は、筐体６１に収容されている。筐体６１は、パワー半導体モジュール５１を収容する第１収容部６２と、コンデンサ素子３１を収容する第２収容部６３と、を有する。第２収容部６３は、ラミネートフィルム３２を固定する枠部６４、６５に囲まれている。 The power semiconductor module 51 and the capacitor element 31 are housed in a housing 61. The housing 61 has a first accommodation portion 62 that accommodates the power semiconductor module 51 and a second accommodation portion 63 that accommodates the capacitor element 31 . The second accommodation portion 63 is surrounded by frame portions 64 and 65 for fixing the laminate film 32 .
　枠部６４の端面６４ａと枠部６５の端面６５ａとでフランジ部３４が挟まれることにより、コンデンサ素子３１が筐体６１に保持されている。本実施の形態では、第１の筐体６１ａと第２の筐体６１ｂとを組み合わせることにより、第１収容部６２および第２収容部６３が形成されている。第１の筐体６１ａと第２の筐体６１ｂとは、例えばねじ等により締結することにより固定することができる。 The capacitor element 31 is held in the housing 61 by sandwiching the flange portion 34 between the end surface 64 a of the frame portion 64 and the end surface 65 a of the frame portion 65 . In the present embodiment, the first housing portion 62 and the second housing portion 63 are formed by combining the first housing 61a and the second housing 61b. The first housing 61a and the second housing 61b can be fixed by fastening with screws or the like, for example.
　コンデンサ素子３１は、筐体６１の内部において、パワー半導体モジュール５１と電気的に接続されている。 The capacitor element 31 is electrically connected to the power semiconductor module 51 inside the housing 61 .
［効果］
　実施の形態４にかかる電力変換装置４によれば、以下の効果を奏することができる。 [effect]
According to the power converter 4 according to the fourth embodiment, the following effects can be obtained.
　電力変換装置４は、パワー半導体モジュール５１と、コンデンサ素子３１と、筐体６１と、を備える。コンデンサ素子３１は、パワー半導体モジュール５１と電気的に接続されている。コンデンサ素子３１は、ラミネートフィルムで被覆されている。筐体６１は、パワー半導体モジュール５１を収容する第１収容部６２と、コンデンサ素子３１を収容する第２収容部６３と、を有する。筐体６１の第２収容部６３は、ラミネートフィルムを固定する枠部６４、６４に囲まれている。筐体６１は、枠部６４、６４の端面６４ａ、６５ａでラミネートフィルムのフランジ部３４を固定することにより、コンデンサ素子３１を保持する。 The power conversion device 4 includes a power semiconductor module 51, a capacitor element 31, and a housing 61. Capacitor element 31 is electrically connected to power semiconductor module 51 . Capacitor element 31 is covered with a laminate film. The housing 61 has a first accommodation portion 62 that accommodates the power semiconductor module 51 and a second accommodation portion 63 that accommodates the capacitor element 31 . The second accommodating portion 63 of the housing 61 is surrounded by frame portions 64, 64 for fixing the laminate film. The housing 61 holds the capacitor element 31 by fixing the flange portion 34 of the laminate film with the end surfaces 64 a and 65 a of the frame portions 64 and 64 .
　このような構成により、パワー半導体モジュール５１の筐体６１を、コンデンサ素子３１を保持する支持体として使用することで、部品点数を減らすことができ、小型かつ計量な電力変換装置４を提供することができる。 With such a configuration, by using the housing 61 of the power semiconductor module 51 as a support for holding the capacitor element 31, it is possible to reduce the number of parts and provide a compact and lightweight power conversion device 4.
　本発明は、各種電子機器、電気機器、産業機器、車両装置等に使用されるコンデンサモジュールに有用である。 The present invention is useful for capacitor modules used in various electronic devices, electrical devices, industrial devices, vehicle devices, and the like.
１、１Ａ、１Ｂ、２、３、３Ａ　コンデンサモジュール
４　電力変換装置
１１、１１１、２１１、３１１、４１１、５１１　支持体（第１支持体）
１２、１１２、２１２、３１２　枠部
１２ａ、１１２ａ、２１２ａ、３１２ａ　端面
１１２ｂ　対向面
１３、３１３、４１３　外側面
１４、３１４、４１４、５１４　固定部
３１５　収容部
２１、１２１、２２１、３２１、４２１　支持体（第２支持体）
２２、１２２、２２２、３２２　枠部
２２ａ、１２２ａ、２２２ａ、３２２ａ　端面
１２２ｂ、２２２ｂ　対向面
２３、３２３、４２３　外側面
２４、４２４、４２５、５２４　固定部
３２５　収容部
３１　コンデンサ素子
３２　ラミネートフィルム
３３、２３３　被覆部
３４、２３４　フランジ部
３４ａ　先端
２３４ｃ　第１端部
２３４ｄ　第２端部
５１　パワー半導体モジュール
６１　筐体
６２　第１収容部
６３　第２収容部
６４、６５　枠部
６４ａ、６５ａ　端面
４３１、５３１　第３支持体
４３３　外側面
４３４、５３４　固定部
４３５　固定部
４４１、５４１　第４支持体
４４３　外側面
４４４、５４４　固定部 1, 1A, 1B, 2, 3, 3A capacitor module 4 power converter 11, 111, 211, 311, 411, 511 support (first support)
12, 112, 212, 312 Frames 12a, 112a, 212a, 312a End surface 112b Opposing surface 13, 313, 413 Outer surface 14, 314, 414, 514 Fixing part 315 Accommodating part 21, 121, 221, 321, 421 Support (second support)
22, 122, 222, 322 frame portions 22a, 122a, 222a, 322a end surfaces 122b, 222b facing surfaces 23, 323, 423 outer surfaces 24, 424, 425, 524 fixing portion 325 housing portion 31 capacitor element 32 laminate films 33, 233 covering portions 34, 234 flange portion 34a tip 234 c First end 234d Second end 51 Power semiconductor module 61 Housing 62 First housing 63 Second housing 64, 65 Frames 64a, 65a End surfaces 431, 531 Third support 433 Outer surfaces 434, 534 Fixed part 435 Fixed parts 441, 541 Fourth support 443 Outer surfaces 444, 544 Fixed part

Claims (12)

  1. 　ラミネートフィルムで被覆された１つまたは複数のコンデンサ素子と、
    　前記ラミネートフィルムを固定する枠部を有する支持体と、
    を備え、
    　前記ラミネートフィルムは、前記コンデンサ素子の表面を覆う被覆部と、前記被覆部の外縁から延びるフランジ部と、を有し、
    　前記支持体は、前記枠部の端面で前記ラミネートフィルムの前記フランジ部を固定することにより前記コンデンサ素子を保持する、
    　コンデンサモジュール。     one or more capacitor elements coated with a laminate film;
    a support having a frame for fixing the laminate film;
    with
    The laminate film has a covering portion covering the surface of the capacitor element and a flange portion extending from the outer edge of the covering portion,
    The support holds the capacitor element by fixing the flange portion of the laminate film to the end surface of the frame portion.
    capacitor module.
  2. 　前記支持体は、第１支持体と第２支持体と、を含み、
    　前記第１支持体の枠部と前記第２支持体の枠部とにより、前記フランジ部を挟んで固定する、
    　請求項１に記載のコンデンサモジュール。     the support includes a first support and a second support;
    fixing the flange portion between the frame portion of the first support and the frame portion of the second support;
    The capacitor module according to claim 1.
  3. 　前記第１支持体の前記枠部の外側面および前記第２支持体の前記枠部の外側面に、前記第１支持体と前記第２支持体とを固定する固定部が設けられている、
    　請求項２に記載のコンデンサモジュール。     fixing portions for fixing the first support and the second support are provided on the outer surface of the frame of the first support and the outer surface of the frame of the second support;
    3. The capacitor module according to claim 2.
  4. 　前記フランジ部の先端は、前記枠部の端面の幅内に位置する、
    　請求項１から３のいずれか１項に記載のコンデンサモジュール。     The tip of the flange portion is located within the width of the end surface of the frame portion,
    The capacitor module according to any one of claims 1 to 3.
  5. 　前記支持体は、筒状に形成されている、
    　請求項１から４のいずれか１項に記載のコンデンサモジュール。     The support is formed in a cylindrical shape,
    The capacitor module according to any one of claims 1 to 4.
  6. 　前記支持体は、前記ラミネートフィルムの前記被覆部に対向する対向面を有する箱状に形成されている、
    　請求項１から４のいずれか１項に記載のコンデンサモジュール。     The support is formed in a box shape having a facing surface facing the covering portion of the laminate film,
    The capacitor module according to any one of claims 1 to 4.
  7. 　前記支持体の前記対向面と前記コンデンサ素子との間に隙間が形成されている、
    　請求項６に記載のコンデンサモジュール。     a gap is formed between the facing surface of the support and the capacitor element;
    7. The capacitor module according to claim 6.
  8. 　前記フランジ部の延びる方向と交差する方向において、前記フランジ部における前記被覆部に近い側の第１端部の配置されている位置と、前記第１端部と反対側の第２端部の配置されている位置と、が異なる、
    　請求項７に記載のコンデンサモジュール。     In the direction intersecting with the extending direction of the flange portion, the position where the first end portion of the flange portion near the covering portion is arranged and the position where the second end portion opposite to the first end portion are arranged are different.
    The capacitor module according to claim 7.
  9. 　前記支持体は、前記枠部で区切られた複数の収容部を有し、前記複数の収容部のそれぞれに前記コンデンサ素子が収容される、
    　請求項１から８のいずれか１項に記載のコンデンサモジュール。     The support has a plurality of housing portions separated by the frame portion, and the capacitor element is housed in each of the plurality of housing portions.
    The capacitor module according to any one of claims 1 to 8.
  10. 　隣接する２つの前記コンデンサ素子の前記フランジ部の少なくとも一部が重なっている、
    　請求項９に記載のコンデンサモジュール。     at least a portion of the flange portions of two adjacent capacitor elements overlap;
    10. The capacitor module according to claim 9.
  11. 　前記支持体は、複数の支持体を含み、
    　前記複数の支持体は、前記フランジ部の延びる方向と交差する方向に重ねて配置され、
    　前記複数のコンデンサ素子の前記フランジ部は、前記複数の支持体の前記枠部に挟まれて固定される、
    　請求項９または１０に記載のコンデンサモジュール。     The support comprises a plurality of supports,
    The plurality of support bodies are stacked in a direction intersecting with the direction in which the flange portion extends,
    wherein the flange portions of the plurality of capacitor elements are sandwiched and fixed between the frame portions of the plurality of supports;
    The capacitor module according to claim 9 or 10.
  12. 　パワー半導体モジュールと、
    　前記パワー半導体モジュールに電気的に接続され、ラミネートフィルムで被覆されたコンデンサ素子と、
    　前記パワー半導体モジュールを収容する第１収容部と、前記コンデンサ素子を収容する第２収容部と、を有する筐体と、
    を備え、
    　前記ラミネートフィルムは、前記コンデンサ素子の表面を覆う被覆部と、前記被覆部の外縁から外側に延びるフランジ部と、を有し、
    　前記筐体の前記第２収容部は、前記ラミネートフィルムを固定する枠部に囲まれ、
    　前記筐体は、前記枠部の端面で前記ラミネートフィルムの前記フランジ部を固定することにより前記コンデンサ素子を保持する、

    　電力変換装置。     a power semiconductor module;
    a capacitor element electrically connected to the power semiconductor module and covered with a laminate film;
    a housing having a first accommodating portion that accommodates the power semiconductor module and a second accommodating portion that accommodates the capacitor element;
    with
    The laminate film has a covering portion that covers the surface of the capacitor element and a flange portion that extends outward from the outer edge of the covering portion,
    The second housing portion of the housing is surrounded by a frame portion for fixing the laminate film,
    The housing holds the capacitor element by fixing the flange portion of the laminate film to the end surface of the frame portion.

    Power converter.
PCT/JP2022/048647 2022-01-18 2022-12-28 Capacitor module and power converter WO2023140095A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006155962A (en) * 2004-11-25 2006-06-15 Fuji Heavy Ind Ltd Package structure for storage capacitor cell
WO2007063877A1 (en) * 2005-12-01 2007-06-07 Nec Corporation Method for producing electrical device assembly
JP2017098565A (en) * 2015-10-01 2017-06-01 太陽誘電株式会社 Electricity storage module, metal bonded body, and method for producing metal bonded body
WO2020121872A1 (en) * 2018-12-11 2020-06-18 パナソニックＩｐマネジメント株式会社 Power storage module and method for producing power storage module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006155962A (en) * 2004-11-25 2006-06-15 Fuji Heavy Ind Ltd Package structure for storage capacitor cell
WO2007063877A1 (en) * 2005-12-01 2007-06-07 Nec Corporation Method for producing electrical device assembly
JP2017098565A (en) * 2015-10-01 2017-06-01 太陽誘電株式会社 Electricity storage module, metal bonded body, and method for producing metal bonded body
WO2020121872A1 (en) * 2018-12-11 2020-06-18 パナソニックＩｐマネジメント株式会社 Power storage module and method for producing power storage module

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