WO2023130873A1 - 超硬材料的激光加工方法及其装置和机床 - Google Patents

超硬材料的激光加工方法及其装置和机床 Download PDF

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WO2023130873A1
WO2023130873A1 PCT/CN2022/136453 CN2022136453W WO2023130873A1 WO 2023130873 A1 WO2023130873 A1 WO 2023130873A1 CN 2022136453 W CN2022136453 W CN 2022136453W WO 2023130873 A1 WO2023130873 A1 WO 2023130873A1
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polarization
laser
processing
focused spot
light
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PCT/CN2022/136453
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English (en)
French (fr)
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孙思叡
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上海名古屋精密工具股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Definitions

  • the invention relates to a method for processing materials with laser, in particular to a method for processing superhard materials with laser to form continuous cutting edges without chipping, and a device and machine tool using the method.
  • the phenomenon that the spatial distribution of the electric vector vibration of the light wave loses symmetry with respect to the propagation direction of the light is called the polarization of light. It is a phenomenon in which the vibration vector (perpendicular to the propagation direction of the wave) of the transverse wave of light deviates in certain directions. In the process of light propagation, the vibration direction of the light vector is limited to a certain plane. This kind of light is called linearly polarized light (or plane polarized light), which only vibrates along a certain direction, and its magnitude varies with the phase change, direction does not change. When the vibration vector changes periodically, it can be divided into elliptically polarized light and circularly polarized light according to the period of change.
  • trajectory of the light vector endpoint When the trajectory of the light vector endpoint is an ellipse, that is, the light vector rotates continuously, and its size and direction change regularly with time, it is elliptically polarized light.
  • trajectory of the light vector endpoint When the trajectory of the light vector endpoint is a circle, that is, the light vector rotates continuously, its size remains constant, and its direction changes regularly with time, it is circularly polarized light.
  • P polarization When the polarization vector of light is in this plane, it is called P polarization.
  • S polarization When the polarization vector is perpendicular to this plane, it is called S polarization.
  • Vector polarized light is a kind of non-uniform polarized light with axisymmetric polarization structure, and the electric field at the optical axis has the same magnitude and opposite polarization direction, and its polarization state at each point on the cross section of the beam is different.
  • the direction of the electric field vector at any point on the beam cross section of radially polarized light is always parallel to the radial direction, that is, all directions passing through the center of the circle, that is, radially polarized light refers to polarized light whose polarization direction is along the radial direction on the cross section.
  • the radial polarization distribution has an annular spot mode distribution, which belongs to the annular beam mode.
  • the light intensity distribution of the ring beam mode is characterized by zero at the optical axis and the strongest intensity on the ring around the optical axis. Its light intensity distribution resembles a ring.
  • Angularly polarized light refers to the polarized light whose polarization direction is perpendicular to the radial direction in the cross section, and its light intensity distribution is also similar to a ring.
  • laser cutting including pulsed laser and continuous laser
  • improving production efficiency has always been an important issue.
  • angularly polarized light (A state) and radially polarized light (R state) are mainly used in non-processing laser optics such as optical tweezers. This is mainly due to the fact that although various technical means can change or modulate the laser polarization state, due to technical conditions and cost factors, the technical means to control the angular polarization and radial polarization of medium and high power lasers have not yet been seen in industrial machining. application report.
  • the current processing of superhard material tools based on diamond tools mainly uses electric discharge wire cutting, grinding and laser.
  • the surface roughness obtained by electrical discharge machining is relatively high, and the layout or complete damage (ie chipping) of the edge of the processing area (ie, edge line) is unavoidable, and the processing efficiency is low.
  • Low and the radius of the arc formed by it is basically determined by the particle size of the material, and it is difficult to obtain a high-quality sharp edge (the arc radius of the edge is less than 1000 nanometers to keep the edge line continuous and free of chipping).
  • the laser technology applied to the processing of superhard material tools currently mainly uses short-pulse and ultra-fast laser sources, which can obtain surface roughness close to grinding and polishing. Thanks to the non-contact and stress-free processing method, it can process any shape of blade, and There is almost no chipping at all. Although its single processing efficiency is very high, due to the influence of laser focusing characteristics, the focused laser is in the shape of a cone, forming a focused light cone, and only at the focused spot on the entire focused light cone (ie The area where the apex of the light cone is located) has the energy density to remove the material. The light energy density in the axial section of the focused light cone is low, and it is difficult to remove the material.
  • the laser usually cannot realize the through-processing of the material in one action in the direction perpendicular to the plane (that is, usually expressed as the thickness), but repeatedly scans the processing surface point by point layer by layer, and vaporizes the material layer by layer until the processing is completed. Through processing of materials, all materials in the direction perpendicular to the plane are removed. What is more complicated is that when the laser processing depth increases with layer-by-layer processing, the processing width on the side close to the initial processing surface is too narrow so that the focused light cone is partially blocked by the surface of the workpiece (that is, the spot cannot touch the material) , the focused spot cannot obtain enough energy density to further remove the material, and eventually the material cannot be completely penetrated.
  • laser processing often requires an initial processing width that is dozens of times larger than the focused spot diameter, which makes the laser in the processing depth and processing Both planes require multiple operations to complete material removal, so laser machining efficiency is generally comparable to wire discharge cutting in superhard material tools.
  • the processing direction for example: the laser acts on the interference surface from the back side of the tool
  • the radius of the cutting edge arc is usually determined at a certain value between 1000nm and 5000nm, which does not have precise and flexible adjustability.
  • An object of the present invention is to provide a laser processing method for superhard materials to facilitate the formation of continuous cutting edge lines without chipping, especially cutting edges with an arc radius of 1,000nm-5,000nm.
  • Another object of the present invention is to provide a laser processing method for superhard materials, so as to improve the processing efficiency of superhard materials.
  • Yet another object of the present invention is to provide a laser processing method for superhard materials, which is applied to multi-axis processing equipment (such as: five-axis machine tools), and is conducive to the implementation of laser precision processing for various specifications of cutting edge arc radii.
  • the fifth object of the present invention is to provide a device for machining superhard materials with laser, which is beneficial to realize the on-demand processing of the arc radius of the cutting edge for superhard materials, which not only reduces the surface roughness, but also effectively reduces the processing cost.
  • the commonly understood laser is the light radiated by atoms due to excitation.
  • the electrons in the atoms absorb energy and jump from a low energy level to a high energy level, and then fall back from a high energy level to a low energy level.
  • the released energy is released in the form of photons .
  • the form of laser can be divided into continuous laser and pulsed laser. According to the pulse width characteristics of the laser, it is divided into thermal laser and cold laser.
  • Laser emitters such as but not limited to nanosecond, femtosecond or picosecond lasers that generate laser light such as infrared, infrared, blue, green, violet or extreme violet.
  • the light source is used to emit a laser beam, including a continuous laser light source or a pulsed laser light source, preferably a pulsed laser light source.
  • a pulsed laser light source the pulse width is 50fs-500ns, 500fs-120ns is preferred, the average power is 10W-500W, 30W-150W is preferred, the pulse repetition frequency is 10kHz-10000kHz, 30kHz-2000kHz is preferred, and the wavelength is 350nm ⁇ 2050nm, preferably 520nm ⁇ 1200nm;
  • the so-called workpiece is usually the material or semi-finished product used to manufacture parts or components, and is the processing object in the machining process. That is, after machining the workpiece, a product that meets the processing or design requirements is obtained.
  • Precision machining refers to the processing technology with extremely high machining accuracy and surface quality. For example: in tool processing, the size, straightness, profile, surface roughness, cutting edge arc radius, and machining accuracy are all less than or reach the micron level.
  • Superhard materials such as: cermet, diamond (especially synthetic polycrystalline diamond) and cubic boron nitride, or composite materials formed of cemented carbide, cermet, diamond and cubic boron nitride.
  • Diamond diamond
  • Diamond it is a mineral composed of carbon elements, is an allotrope of graphite, the chemical formula is C, and is also the original body of common diamonds.
  • Graphite can form synthetic diamond under high temperature and high pressure.
  • the hardness of diamond is directional.
  • the hardness of the octahedral crystal plane is greater than that of the rhombohedral dodecahedral crystal plane, and the hardness of the rhombohedral dodecahedral crystal plane is greater than that of the hexahedral crystal plane.
  • Diamond composite sheet also known as polycrystalline diamond composite sheet, is sintered by diamond micropowder and cemented carbide substrate under ultra-high pressure and high temperature conditions. It not only has the high hardness, high wear resistance and thermal conductivity of diamond, but also has Excellent strength and impact toughness, it is an ideal material for making cutting tool blades, and generally has a mirror-polished upper surface to facilitate the production of knives.
  • Machining equipment is a processing equipment with multiple axes of motion. That is, in the right-handed rectangular coordinate system, the X, Y, and Z axes that move along the straight line, and the A, B, and C axes that rotate around the X, Y, and Z axes respectively, such as: CNC machine tools, are usually loaded with various Item control software, which receives and sends out various instructions in the form of codes to implement automatic processing of workpieces.
  • a laser processing method for superhard materials which uses the movement of the focused spot with linear polarization characteristics and the change of its polarization azimuth angle to decouple the direct relationship between the workpiece surface contour processing track direction and the polarization direction, so that the polarization direction is only consistent with the galvanometer Motion-related, the difference between linearly polarized light (P state, S state), circularly polarized light (C state), angularly polarized light (A state) and radially polarized light (R state) is dynamically changed during laser direct writing processing. Polarization-like feature control, switching and mixing are realized on the processed graphics.
  • the focused spot of the linearly polarized laser moves along the sweeping path in the plane, and the polarization angle of the laser is controlled in real time while sweeping, so that each focused spot has its own polarization angle.
  • each laser beam with its own polarization angle arranged along the scanning path passes through this
  • the processing pattern formed by the focused spot of the linearly polarized laser can be used to replace other polarization states of the laser to process the material as a whole, which can achieve considerable processing quality and efficiency.
  • the laser linear polarization state is the P polarization state
  • this method can also be used to obtain the processing pattern, and the processing quality and efficiency equivalent to the S polarization state can be obtained, which is beneficial to apply one kind of linear polarization to various processing needs.
  • the movement of the focus spot changes synchronously with the polarization angle, so that the processing effect obtained by processing graphics is similar to the processing effect obtained by directly using angular polarized light and radial polarized light processing. Then move along the processing track of the workpiece surface contour with the processing graphics to remove the superhard material in the laser processing plane, thereby shortening the total processing track length, increasing the single processing depth, and realizing the required edge processing of the arc radius of the cutting edge .
  • the focused spot of the laser emitted by the galvanometer acts on the laser processing plane, so that the focused spot sweeps along the set sweeping path and forms a processing pattern, and then the processing pattern along the workpiece
  • the surface profiling trajectory moves to remove superhard material within the laser processing plane.
  • the correlation between the polarization direction and the sweeping path is also set, so that the focused spot moves around the center of the processing pattern, generating and directly using P-state polarization characteristics and S-state polarization Characteristics, A-state polarization characteristics, R-state polarization characteristics, C-state polarization characteristics, elliptical polarization state characteristics, and processing graphics with comparable processing effects to the composite polarization state focusing spot of class A and class R.
  • the dependence of polarization direction on the swept path includes:
  • the polarization directions of the focused light spots arranged in sequence along the sweeping path are the same, so that the generated processing pattern has linear polarization characteristics as a whole.
  • the polarization direction is set not to be related to the sweeping path but perpendicular to the incident plane of the laser processing plane, so as to obtain a processing pattern with similar P-state polarization characteristics.
  • the polarization direction is set to be independent of the sweeping path but parallel to the incident plane of the laser processing plane to obtain processing patterns with similar S-state polarization characteristics.
  • the trajectories of the light vector endpoints of each focused spot on a plane perpendicular to the propagation direction are all located on the tangent to the sweeping path of the focused spot, so that the processed graphics as a whole have angular polarization characteristics.
  • the trajectories of the light vector endpoints of each focused spot on the plane perpendicular to the propagation direction are located on the straight line at the center of the processed graphics, so that the processed graphics as a whole have radial polarization characteristics
  • the trajectories of the light vector end points of each focused spot on the plane perpendicular to the propagation direction are periodically and continuously changed, so that the processed graphics as a whole have circular polarization or elliptical polarization characteristics.
  • a polarization driving device is used to change the polarization azimuth angle of the outgoing (referring to passing through the polarization driving device) laser light in real time.
  • a mechanical device consisting of a hollow rotating motor and a polarizing optical element (such as a half-wave plate or a Faraday rotator, etc.) placed therein is preferred.
  • the laser beam passes through the central through hole of the motor and the polarized optical element placed on the motor, and the polarization direction of the outgoing light is changed by controlling the motor to drive the polarized optical element to rotate.
  • the present invention also provides a device, comprising
  • Laser light source used to generate laser light speed
  • Reflector used to change the direction of laser light speed
  • the focusing mirror is used to receive the incident laser fiber and form a focused spot
  • the vibrating mirror is used to control the sweeping range of the focused spot
  • the polarization driving device is used to change the polarization azimuth angle of the outgoing laser light.
  • the reflecting mirror of the present invention is installed on an optical adjustment frame or a vibrating mirror so as to change the scanning direction of the focused spot and form a processing pattern as required.
  • the focusing lens of the present invention is composed of at least one lens, preferably a multi-lens field lens.
  • the focused light spot with linear polarization characteristics is continuously scanned on the laser processing plane along the scanning path, and a processing pattern is formed. During this period, the movement of the focused spot is also changed synchronously with the polarization angle, so that the processing effect obtained by processing graphics is equivalent to that obtained by directly using angular polarization and radial polarization processing. Then move along the processing track of the workpiece surface contour with the processing graphics, so as to shorten the total processing track length, increase the single processing depth, and realize the required edge processing of the arc radius of the cutting edge.
  • the method provided by the present invention decouples the direct relationship between the workpiece surface contour processing track direction and the polarization direction, so that the polarization direction is only related to the scanning direction of the focused spot controlled by the vibrating mirror.
  • the reciprocating motion of the high-speed vibrating mirror replaces the movement of the low-speed mechanical axis, which greatly reduces the length of the processing track in the width and depth directions and improves the processing efficiency.
  • the method provided by the present invention achieves the same result as only the conical total reflection mirror or intracavity shaping technology by combining the movement of the linearly polarized light beam and the change of its polarization azimuth angle without using complex optical elements such as conical total reflection mirrors. Similar processing patterns for angularly polarized light features and radially polarized light features. While obtaining higher processing efficiency than circularly polarized light processing in superhard material tool processing applications, the controllable and variable arc radius of the cutting edge is realized.
  • applying the method of the present invention can not only significantly improve the material removal rate of the existing laser direct writing processing technology, at least 20%. It also improves the depth of material removal in a single pass, reduces the division of cutters in the plane direction, significantly shortens the total processing path length by more than 50%, and improves the overall processing efficiency by more than 50% on average.
  • Applying the method of the present invention also significantly improves the flexibility of the existing laser direct writing processing technology, and can control the surface roughness and edge sharpness of the laser processing place on demand under the premise of constant parameters such as power, frequency and pulse width .
  • the surface roughness of the processing can be as low as Ra0.05 micron, and the radius of the cutting edge arc is as low as 1000 nanometers or less.
  • Fig. 1 is the schematic diagram of an embodiment of focusing spot
  • Fig. 2 is the schematic diagram of an embodiment of laser processing plane
  • FIG. 3 is a schematic diagram of an embodiment of a processing pattern formed by scanning the focused spot along the sweeping path;
  • FIG. 4 is a schematic diagram of another embodiment of a processing pattern formed by scanning a laser processing plane with a focused spot;
  • FIG. 5 is a schematic diagram of an embodiment of a linearly polarized focused spot
  • Fig. 6 is the schematic diagram of the computer simulation graphics of sweeping the laser processing plane with the focused spot having the linear deviation normal characteristic
  • FIG. 7 is a schematic diagram of an embodiment of adjusting linear polarization using a driving polarization device
  • Fig. 8 is a schematic diagram of an embodiment of scanning the laser processing plane by adjusting the linear polarization state obtained in Fig. 7;
  • Fig. 9 is a schematic diagram of the distribution of polarization azimuth angles on the processing graphics of the P-like or S-like polarization state processing effect obtained by the method of the present invention.
  • Fig. 10 is a schematic diagram of the distribution of polarization azimuth angles at various places on the processing pattern obtained by the method of the present invention to obtain a C-like polarization state processing effect;
  • Fig. 11 is a schematic diagram of the distribution of polarization azimuth angles at various locations on the processing graphics of the A-like polarization state processing effect obtained by the method of the present invention
  • Fig. 12 is a schematic diagram of the distribution of polarization azimuth angles on the processing graphics of the R-like polarization state processing effect obtained by the method of the present invention
  • Fig. 13 is a schematic diagram of the distribution of polarization azimuth angles at various places on the processed graphics of the processing effect of the compound polarization state of class A and class R obtained by the method of the present invention
  • Fig. 14 is a schematic diagram of the distribution of polarization azimuth angles in various places on the processing graphics obtained when the method of the present invention is applied to a square boundary;
  • Fig. 15 is a schematic diagram of the distribution of polarization azimuth angles on the processing graphics of the processing effect of multiple polarization state mixing features obtained by the method of the present invention
  • Fig. 16 is a schematic diagram of an embodiment of the path of laser machining slits in the prior art
  • Fig. 17 is a schematic diagram of an embodiment of implementing a slit laser processing path in the method of the present invention.
  • FIG. 18 is another perspective view of the laser processing path shown in FIG. 17 .
  • the superhard material structure to be processed and removed is determined, and the contour of the superhard material structure is obtained.
  • the workpiece plane where the focused spot is located is the laser processing plane, and the contour of the plane limits the laser processing.
  • the first boundary of the laser, the total travel of the laser from the first contact with the structure to the last complete pass through the structure is the second boundary, which is also generally considered as the processing depth of the laser.
  • the contour of the superhard material structure to be processed and removed is a cylinder, and the plane where the contour intersects the incident direction of the laser is the laser processing plane, which is a circle.
  • the circular outline is the first boundary of laser processing, and the focused laser spot 100 (its shape is shown in FIG. 1 ) will act on the first boundary, so that the hard material inside the first boundary can be removed.
  • the area of the focused spot acting on the laser processing plane is smaller than or equal to the first boundary.
  • the area of the focused spot is equal to the first boundary, all the superhard materials in the laser processing plane are removed through one action, that is, where the energy of the focused spot is accessible.
  • the area of the focused spot applied to the laser processing plane is smaller than the first boundary, it is usually necessary to apply the focused spot to the laser processing plane multiple times in order to remove the superhard material where the energy of the focused spot reaches. With the increase of the processing depth, it appears that the laser is processing the superhard material along the first boundary and removing it layer by layer.
  • Overlapping several focused light spots 100 can enlarge the area of material removal. For example, if the figure shown in Figure 2 is taken as an example, if the area defined by its circular boundary 400 acts on the superhard material as a whole, the efficiency of removing the superhard material can be improved and the processing time can be shortened. In order to achieve this purpose, it is necessary to move the focused spot along the sweeping path to form a processing pattern within the circular boundary 400 .
  • the laser spot can form a processing pattern along the sweeping path.
  • the focused spot 100 is swept along an annular sweeping path 300 , that is, a processing pattern 200 is formed.
  • the focused light spots act on and superimpose each other more than 100 times to form a processing pattern. Comparing FIG. 3 and FIG. 4, it can be seen that if the superhard material in the circular boundary 400 is to be completely removed, it is necessary to increase the frequency of action of the focused spot 100, that is, to increase the density.
  • the focus spot is combined at each moment, for example: through computer simulation, you can see a Complete machining graphics within boundary 400.
  • a complete processing pattern located within the circular boundary 400 can be produced, thereby enlarging the area acting on the superhard material, and the whole processing pattern is carried out on the superhard material.
  • a structure can be formed, such as a wider slit (compared to the slit produced by a single focused spot in a superhard material).
  • This kind of graphics can usually be obtained by drawing.
  • the drawing efficiency can be improved, and the processing data of the focused spot can be formed, such as; processing coordinates, moving speed, etc., which is conducive to the implementation of automatic laser processing on CNC machine tools. That is, the focused spot sweeps along the laser processing plane along the processing pattern that has been set to remove the superhard material.
  • the laser beam After the laser beam is emitted from the light source, after a series of (conventional) changes such as beam expansion and collimation, it passes through the polarization drive device, and then enters the galvanometer, and the beam direction is changed by the mirror in the galvanometer controlled by the computer to facilitate the desired
  • the obtained processing pattern is scanned, and the laser beam that changes direction is finally focused through the field lens to form a specific processing pattern composed of the scanning path of the focused spot.
  • the focused spot of the laser emitted by the galvanometer acts on the laser processing plane, so that the focused spot sweeps along the set sweeping path and forms a processing pattern, and then moves along the workpiece surface contour processing track with the processing pattern to remove the laser processing plane. superhard material inside.
  • FIG. 5 shows a focused spot 110 with linear polarization characteristics in this embodiment, which processes superhard materials within a circular boundary, and the polarization azimuth angle of the focused spot remains unchanged at each moment, as shown in FIG. 6 .
  • the processing graphics it generates can be obtained by computer simulation, and when processing, sweeping according to the sweeping path can obtain the processing effect consistent with the processing graphics.
  • the polarization azimuth angle of the laser should be controlled in real time according to the scanning speed of the focused spot or the feedback signal of the position of the mirror, so as to ensure that the polarization direction of the outgoing linearly polarized light is consistent with the scanning speed.
  • the intersection angle of the moving direction of the currently focused spot on the grazing path always meets the required processing angle.
  • processing angles are usually set according to the requirements of processing, so that various processing patterns can be obtained by adjusting the scanning path of the focused spot and the angle between the polarization direction and the scanning path. These processing patterns are similar to those with polarization characteristics.
  • the processing effect of laser processing on superhard materials is equivalent.
  • the polarization direction is set not to be related to the sweeping path but to be perpendicular or parallel to the incident plane of the laser processing plane, so as to obtain processing patterns with similar P-state or S-state polarization characteristics.
  • the pattern shown in FIG. 9 is equivalent to the effect of laser processing with P polarization state or S polarization state, so it is called a processing pattern similar to P polarization state or a processing pattern similar to S polarization state.
  • the locus of the light vector endpoints of each focused spot on a plane perpendicular to the propagation direction changes periodically and continuously, so as to obtain a processed pattern similar to C-state polarization characteristics.
  • the pattern shown in FIG. 10 is equivalent to the effect of laser processing with C polarization state, so it is called a processing pattern similar to C polarization state.
  • the trajectories of the light vector end points of each focused spot on a plane perpendicular to the propagation direction are all located on the tangent to the sweeping path of the focused spot, so that the processed graphics as a whole have angular polarization characteristics.
  • A-like polarization state processing pattern is equivalent to the effect of laser processing with A polarization state, so it is called A-like polarization state processing pattern.
  • the sweeping pattern shown in FIG. 12 is equivalent to the effect of laser processing with R polarization state, so it is called a processing pattern similar to R polarization state. By adjusting the processing angle, it is also possible to make the scanning pattern have a similar effect to laser processing that combines A polarization state and R polarization state.
  • A-like and R-like composite polarization state processing graphics as shown in Figure 13 Show.
  • various graphics can be formed, such as: squares, circles, dots, line graphics and their combinations, etc., as shown in Figure 14, so that various processing of complex shapes.
  • a processing pattern with a mixed characteristic processing effect of various polarization states can be obtained, as shown in Figure 15, so as to meet the requirements of complex processing.
  • the polarization azimuth angle of the outgoing (referring to passing through the polarization driving device) laser beam is changed in real time, as shown in FIG. 7 .
  • the distribution of the polarization azimuth angles of the focused light spots at various places on the processed pattern after changing is shown in FIG. 8 , and the focused light spots are all located within the circular boundary 400 .
  • a mechanical device consisting of a hollow rotating motor and a polarizing optical element (such as a half-wave plate or a Faraday rotator, etc.) placed therein is preferred.
  • the laser beam passes through the central through hole of the motor and the polarized optical element placed on the motor, and the polarization direction of the outgoing light is changed by controlling the motor to drive the polarized optical element to rotate.
  • the polarization driving device may also include a quarter-wave plate as a polarizer to ensure that the incident light incident on the polarizing optical element is linearly polarized light; in addition to the aforementioned mechanical gyration structure, the polarization driving device may also be completely generated without Mechanically moving liquid crystal phase retarder or electronic polarization drive device composed of liquid crystal polarization rotator or a combination of mechanical and electronic, technicians can comprehensively determine the specific implementation method according to the bandwidth and cost required by the optical system.
  • the processing pattern similar to R state can be generated, the processing depth of the laser can be increased, or the processing pattern similar to A state can realize the on-demand adjustable processing of the cutting edge arc radius.
  • the processing pattern and the sweeping path of the focused spot can be set according to the required processing width on the laser processing plane, so as to effectively reduce the row-by-row mechanical axis movement of the focused spot on the laser processing plane, such as Figure 17 and Figure 18.
  • the mechanical axis needs to reciprocate N/n times on the laser processing plane to process.
  • the processing depth of the slit of the superhard material reaches 1.6 mm, more than 40 times are required.
  • the polarization-like state of the processing pattern formed by the scanning of the focused spot is set to the R state with a higher material removal rate to obtain a larger single processing depth so as to reduce the layer-by-layer mechanical axis movement of the focused spot in the depth direction.
  • the scanning speed of the pattern controlled by the galvanometer is generally at least 10 times the speed of the mechanical axis motion control, so this processing method will greatly improve the overall processing efficiency.
  • edge arc radii In the finishing of the tool edge, it is often necessary to process tools with different edge arc radii according to different working conditions of the tool (for example: diamond micro milling cutters for fine cutting require an edge arc radius of less than 300 nanometers , and the diamond-replaceable cutter grains used for rough cutting of titanium alloys require a cutting edge arc radius of about 2,500nm to 4,000nm), which requires the comprehensive use of wire cutting, grinding, laser and polishing in general processing.
  • the process is used to manufacture the cutting edge of a certain size range of cutting edge arc radius, which greatly increases the production process and its complexity.
  • the angle between the polarization direction of the linearly polarized light emitted from the polarization driving device and the moving direction of the current focused spot on the scanning path is always obtained. Maintain, and obtain processing graphics with similar A state (that is, the polarization direction is set to be always parallel to the sweep path) or R state polarization characteristics (that is, the polarization direction is set to be always perpendicular to the sweep path) processing graphics, or have similar composite.
  • the processing patterns of A state and R state polarization characteristics that is, the polarization direction is set to always maintain a fixed angle with the sweep path
  • the laser processing method of this embodiment significantly improves the processing efficiency, and at the same time can selectively obtain a specific edge arc radius, and takes into account the surface roughness (Ra ⁇ 50nm) and significantly reduces edge chipping. Blade happens.
  • the laser light emitted by the laser emitter is first injected into a section of the cavity, and then emitted from the cavity, and then enters the laser projection relay part, and the laser projection relay part changes the propagation path of the laser light and then emits the laser light , and finally received by the light-emitting component and then emitted to process the workpiece.
  • the laser beam propagates in the cavity, either along a straight line or along a folded line.
  • the laser propagates along a straight line at the exit end of the cavity.
  • the rotation axis is A axis, B axis or C axis, so that the laser emitted by the light-emitting part is distributed around the direction of the rotation axis, and the laser is focused on the range of the rotation axis.
  • Inner that is, in the plane of revolution (circle) with a radius of 100 mm from the center of the axis of rotation, especially focusing on the axis of rotation. Realize laser machining in a rotary manner.
  • the cavity is arranged on the Y axis
  • the rotation axis is the B axis
  • the light emitting component rotates around the B axis.
  • machining equipment for example: a spatial five-axis laser machining solution is formed by combining three linear motion axes, one rotary motion axis for fixing the workpiece, and one laser beam rotary axis,
  • the workpiece can be machined in a multi-axis manner, and products with complex and diverse structures can be manufactured.
  • the machine tool has at least three linear axes, wherein the device of the present invention is installed on one of the linear axes (for example: arranged on the plane determined by the X axis and the Z axis, and moves linearly along the Z axis), and the rotation is installed on the other linear axis Positioning mechanism, which drives the positioning of the workpiece to be processed (for example: setting the workpiece on the plane determined by the X-axis and Y-axis), and eliminates factors such as stress, vibration, elastic deformation or temperature that cause the relative position of the beam and the rotary axis of the turntable to be unable to maintain In this case, improving the precision of laser processing is conducive to the implementation of laser processing on various specifications of parts.

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Abstract

一种超硬材料的激光加工方法，以具有线偏振特性的聚焦光斑（100）的移动和其偏振方位角的改变，将工件表面轮廓加工轨迹方向和偏振方向直接关系解耦，使偏振方向只和振镜运动相关。

Description

超硬材料的激光加工方法及其装置和机床 技术领域
本发明涉及一种以激光实施材料加工的方法，尤其涉及一种以激光实施超硬材料加工的方法以形成连续无崩刃的刃口，以及采用此方法的装置和机床。
背景技术
光波电矢量振动的空间分布对于光的传播方向失去对称性的现象称为光的偏振。它是一种光的横波的振动矢量(垂直于波的传播方向)偏于某些方向的现象。在光的传播过程中，光矢量的振动方向只局限在一确定的平面内，这种光称为线偏振光(或平面偏振光)，其只沿着一个确定的方向振动，其大小随相位变化、方向不变。当振动矢量呈周期性变化时，根据变化周期又可以分为椭圆偏振光和圆偏振光。当光矢量端点的轨迹为一椭圆，即光矢量不断旋转，其大小、方向随时间有规律的变化时，为椭圆偏振光。当光矢量端点的轨迹为一圆，即光矢量不断旋转，其大小不变，方向随时间有规律的变化时，为圆偏振光。
用含有输入和反射光束的那个平面定义的坐标系。当光的偏振矢量在这个平面内，则称为P偏振。当偏振矢量垂直于该平面，则称为S偏振。
矢量偏振光是一种非均匀的偏振光，具有轴对称偏振结构，并且光轴处电场大小相同、偏振方向相反，它在光束的横截面上的每一点的偏振状态不尽相同。径向偏振光的光束横截面上任意一点电场矢量方向始终与径向平行，即通过圆心的各个方向，即径向偏振光是指偏振方向在横截面上沿着径向的偏振光。径向偏振分布具有环形光斑模式分布，属于环形光束模式。与常见的基膜高斯光束不同，环形光束模式的光强分布的特点是光轴处为零，环绕光轴的环状上强度最强。其光强分布类似于一个环。角向偏振光是指偏振方向在横截面上垂直于径向的偏振光，其光强分布也类似于一个环。
目前激光切割(包括脉冲激光和连续激光)广泛应用于金属钣金及型材的切割和打标加工，也有应用于如超硬材料刀具加工等其他领域。对于工业化生产而言，提高生产效率一直是重要课题。在研究中技术人员意识到，除了脉冲激光束的功率、频率及脉宽外，光束的偏振态也会对加工效率和加工质量造成影响，如：华中理工大学激光技术研究所范等人(《激光技术Vol.12 No.5》)和西安理工大学理学院李等人(《激光应用技术第四十期第12卷》)的研究均表明，圆偏振态(C态)光束的加工效率和加工质量均比线偏振态(P态和S态)要有所提高，并且线偏振态的激光在不同加工方向上会有不同程度的切缝宽窄和挂渣程度等特性。虽然也有一些研究表明，径向偏振光(R态)光束的加工效率和加工质量优于圆偏振态(C态)光束，但在实际工业化的激光加工应用中目前使用最广泛的仍然是圆偏振光，而角向偏振光(A态)和径向偏振光(R态)主要用于光镊等非加工类激光光学中。这主要是 由于虽然现有多种技术手段可以改变或调制激光偏振态，但受制于技术条件和成本因素，中高功率激光器的角向偏振光和径向偏振光控制的技术手段尚未见工业机加工应用报道。
对于超硬材料刀具的加工而言，目前以金刚石刀具为主的超硬材料刀具的加工主要采用放电线切割、磨削和激光等手段。
以制造应用于微细加工的精密金刚石铣刀来说，放电加工获得的加工表面粗糙度较高，加工区域边缘(即刃口线)发生布局或全部损坏(即崩刃)难以避免，加工效率偏低且其所形成的刃口圆弧半径基本由材料粒度决定，难以获得高质量的尖锐刃口(刃口圆弧半径1000纳米以下保持刃口线连续且无崩刃现象)。
磨削加工通过工艺控制可以获得极佳的加工表面粗糙度和足够小的刃口圆弧半径，但仍然容易发生崩刃，加工效率极低(不到放电线切割效率的1/3)且无法加工复杂形状(即除直线或圆弧外的2维轮廓)。
应用于超硬材料刀具加工的激光工艺目前主要采用短脉冲及超快激光光源，可以获得接近研磨抛光的表面粗糙度，得益于非接触无应力的加工方式，其可以加工任意形状刀刃，也几乎完全不会产生崩刃，虽然其单次加工效率很高，但受激光聚焦特性影响，聚焦后的激光呈圆锥状，形成聚焦光锥，在整个聚焦光锥上仅在聚焦光斑处(即在光锥的锥顶点所在的区域)具有实现对材料实施去除的能量密度，在聚焦光锥轴向截面各处的光能量密度低，难以实现对材料实施去除，因此在材料的加工深度上，激光通常无法在与平面垂直的方向上(即通常表现为厚度)一次作用就实现对材料的贯穿加工，而是在加工面上逐点逐层反复扫描，将材料逐层气化，直至完成对材料的贯穿加工，将与平面垂直的方向上的材料全部去除。更为繁琐的是，当激光加工深度随着逐层加工加大时，位于靠近初始加工表面一侧的加工宽度过于狭窄以至于聚焦光锥被工件表面部分遮挡时(即光斑无法接触到材料)，聚焦光斑就无法获得足够的能量密度来进一步去除材料并最终导致材料无法完全被贯穿，因此激光加工往往需要一个大于聚焦光斑直径数十倍的起始加工宽度，这使得激光在加工深度和加工平面都需要多次加工以完成材料去除，因此在超硬材料刀具中激光加工效率与放电线切割总体相当。虽然，加大激光功率即增加激光光锥各处的能量密度是一种解决方案，但是功率的增大使得表面粗糙度亦提高，精细加工(表面粗糙度，Ra＝20nm-50nm)无法实现。另一方面虽然也有一些研究表明，通过控制加工方向(例如：激光从刀具后侧干涉面进行作用)可以获得刃口圆弧半径小于1000纳米的激光加工刀刃，但普遍而言通过激光所加工获得的刃口圆弧半径通常都被确定在1000nm～5000nm之间的某一数值，不具有精确灵活的可调节性。
为了提高加工质量及加工效率，虽然现有技术也对激光束的偏振态进行调制，如：CN103189160B，但其技术手段是获得圆偏振或随机偏振光的聚焦光斑并以该光斑沿着被加工工件表面的轮廓轨迹连续移动来进行激光加工。在CN209424743U及CN111730214A等现有技术中，虽然也对激光束的偏振态进行调制，但其技术手段均是利用聚焦光斑直接沿着被加工工件表面的轮廓轨迹连续移动，并在移动中使激光束的线偏振方向与轮廓加工轨迹始终保持相切，但未充分考虑实际加工生产中激光在平面以及与平面垂直的2个维度上对加工效率和效果的影响。
因此如何更高效率地工业化制造无崩刃、形状任意，后刀面光滑(即接近研磨抛光的表 面粗糙度)，且可选择性地获得各种刃口圆弧半径的超硬材料刀具技术方案是一个目前并未见诸报道，也并未为技术人员所周知的，亟需解决的技术问题。
发明内容
本发明的一个目的在于提供一种超硬材料的激光加工方法，以利于形成连续的无崩刃的刃口线，尤其是圆弧半径1,000nm～5,000nm的刃口。
本发明的另一个目的在于提供一种超硬材料的激光加工方法，对超硬材料实施精细加工(表面粗糙度，Ra＝20nm-50nm)。
本发明的再一个目的在于提供一种超硬材料的激光加工方法，提高对超硬材料的加工效率。
本发明的又一个目的在于提供一种超硬材料的激光加工方法，应用于多轴加工设备(如：五轴机床)上，利于对各种规格刃口圆弧半径实施激光精密加工。
本发明的第五目的在于提供一种以激光实施超硬材料机加工的装置，利于对超硬材料实现刃口圆弧半径的按需加工，既降低表面粗糙度，也有效降低加工成本。
通常理解的激光，系原子因受激而辐射的光，原子中的电子吸收能量后从低能级跃迁到高能级，再从高能级回落到低能级的时候，所释放的能量以光子的形式放出。激光的形态可分为连续激光和脉冲激光。依据激光的脉冲宽度特性分为热激光和冷激光。
激光发射器如：但不限于纳秒、飞秒或皮秒激光器，产生的激光如：红外、红外、蓝光、绿光、紫光或极紫光。
光源，用于发射出激光束，包括连续激光光源或脉冲激光光源，优先选择脉冲激光光源。当采用脉冲激光光源时，脉宽为50fs～500ns，优先选择500fs～120ns，平均功率为10W～500W，优先选择30W～150W，脉冲重复频率为10kHz～10000kHz，优先选择30kHz～2000kHz，波长为350nm～2050nm，优先选择520nm～1200nm；
在机加工中，所称的工件通常是用于制造零件或部件的材料或半成品，是机械加工过程中的加工对象。即对工件实施机加工后，得到符合加工或设计要求的产品。
精密加工，指加工精度和表面质量达到极高程度的加工技术。比如：刀具加工中，尺寸、直线度、轮廓度、表面粗糙度、刃口圆弧半径、加工精度均小于或达到微米级。
超硬材料如：金属陶瓷、金刚石(尤其是人造聚晶金刚石)和立方氮化硼，或者硬质合金与金属陶瓷、金刚石和立方氮化硼之一种或几种的形成的复合材料。
金刚石(diamond)，它是一种由碳元素组成的矿物，是石墨的同素异形体，化学式为C，也是常见的钻石的原身。石墨可以在高温、高压下形成人造金刚石。金刚石硬度具有方向性，八面体晶面硬度大于菱形十二面体晶面硬度，菱形十二面体晶面硬度大于六面体晶面硬度。
金刚石复合片又称聚晶金刚石复合片，采用金刚石微粉与硬质合金基片在超高压 高温条件下烧结而成，既具有金刚石的高硬度、高耐磨性与导热性，又具有硬质合金的强度与抗冲击韧性，是制造切削刀具刃部的理想材料，一般都具有镜面抛光上表面以利于制作刀具。
机加工设备(或机加工中心)，系具有多个运动轴的加工设备。即在右手直角坐标系中，沿直线方向移动的X、Y和Z轴，以及分别绕X、Y和Z轴的回转的A轴、B轴和C轴，如：数控机床，通常加载了各项控制软件，以代码形式接收和发出各项指令对工件实施自动化加工。
一种超硬材料的激光加工方法，以具有线偏振特性的聚焦光斑的移动和其偏振方位角的改变，将工件表面轮廓加工轨迹方向和偏振方向直接关系解耦，使偏振方向只和振镜运动相关，在激光直写加工中动态地将线偏振光(P态、S态)、圆偏振光(C态)、角向偏振光(A态)到径向偏振光(R态)的不同类偏振特征控制、切换和混合等在加工图形上得以实现。
另一种超硬材料的激光加工方法，以线偏振态激光的聚焦光斑在平面沿扫掠路径移动，以及在扫掠的同时实时控制激光的偏振角度，使得各个聚焦光斑均以各自的偏振角度沿着扫掠路径依次排布而产生加工图形，接着再以该加工图形为一个整体在材料表面移动，并去除移动路径上的材料以获得所需的构造。
与直接采用其它偏振态激光(如：角向偏振态、径向偏振态、椭圆偏振态和圆偏振态)对材料实施加工，沿着扫掠路径排布的各个具有各自偏正角度的通过此方式在不同特定偏振角度下可以利用线偏振激光的聚焦光斑形成的加工图形来取代其它偏振态激光为一个整体对材料实施的加工能够取得相当的加工质量和效率。此外，当激光线偏振态为P偏振态时，则同样可以采用此方式获得加工图形，并取得与S偏正态相当的加工质量和效率，利于将1种线偏振光就能适用于各种加工需求。
聚焦光斑移动与偏振角度同步改变，以使得由加工图形得到的加工效果与直接使用角向偏振光和径向偏振光加工取得的加工效果类似。再以加工图形沿着工件表面轮廓加工轨迹移动，以去除激光加工平面内的超硬材料，从而缩短总加工轨迹长度，增加单次加工深度，以及实现所需的刃口圆弧半径的刀刃加工。
另一种超硬材料的激光加工方法，将激光经振镜出射的聚焦光斑作用于激光加工平面，使得聚焦光斑沿设定的扫掠路径扫掠并形成加工图形，再以加工图形沿着工件表面轮廓加工轨迹移动，以去除激光加工平面内的超硬材料。在聚焦光斑沿设定的扫掠路径扫掠时，还对偏振方向与扫掠路径的相关性进行设定，使聚焦光斑围绕加工图形中心移动，产生与直接使用P态偏振特性、S态偏振特性、A态偏振特性、R态偏振特性、C态偏振特性、椭圆偏振态特性和类A与类R复合偏振态聚焦光斑加工效果相当的加工图形。
偏振方向与扫掠路径的相关性包括：
沿着扫掠路径依次排布的各聚焦光斑的偏振方向相同，使产生的加工图形整体上具有线偏振特性。偏振方向设定为与扫掠路径不相关而是与激光加工平面的入射面垂直，获得具有类似P态偏振特性的加工图形。偏振方向设定为与扫掠路径不相关而是与激光加工 平面的入射面平行，获得具有类似S态偏振特性的加工图形。
各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于聚焦光斑扫掠路径的切线上，使加工图形整体上具有角向偏振特性。
各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于过加工图形中心的直线上，使加工图形整体上具有径向偏振特性，
各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均与聚焦光斑扫掠路径的切线相交，交角大于0°且小于180°，使加工图形整体上兼有角向偏振和径向偏振特性。
各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹呈周期性连续变化，使加工图形整体上具有圆偏振特性或椭圆偏振特性。
采用偏振驱动装置，实时改变出射(指穿过偏振驱动装置的)激光的偏振方位角。优先选择由中空旋转电机及置于其中的偏振光学元件(如：二分之一波片或法拉第旋光器等)组成的机械式装置。激光光束穿过电机中央通孔和置于电机上的偏振光学元件，通过控制电机带动偏振光学元件自转来改变出射光的偏振方向。
为了实施激光加工方法，本发明还提供一种装置，包括
激光光源，用于产生激光光速；
反射镜，用于改变激光光速的方向；
聚焦镜，用于接收入射的激光光纤，并形成聚焦光斑；
振镜，用于控制聚焦光斑的扫掠范围；
偏振驱动装置，用于改变出射激光的偏振方位角。
本发明的反射镜，其安装于光学调整架或振镜之上以实现按需改变聚焦光斑扫掠方向，形成加工图形。
本发明的聚焦镜，至少由一片镜片组成，优先搭载多镜片的场镜。
以超硬材料刀具加工为例，在采用本发明提供的方法的机加工设备上，能以高效率地工业化制造无崩边、形状任意，后刀面光滑，及可选择性地获得各种刃口圆弧半径的超硬材料刀具。
本发明技术方案实现的有益效果：
本发明提供的方法，将具有线偏振特性的聚焦光斑沿扫掠路径在激光加工平面上实施连续扫掠，并形成加工图形。在此期间，还通过聚焦光斑移动与偏振角度同步改变，使得通过加工图形得到的加工效果与直接使用角向偏振光和径向偏振光加工取得的加工效果相当。再以加工图形沿着工件表面轮廓加工轨迹移动，以此缩短总加工轨迹长度，增加单次加工深度，以及实现所需的刃口圆弧半径的刀刃加工。
本发明提供的方法，一方面对工件表面轮廓加工轨迹方向和偏振方向的直接关系进行了解耦，使偏振方向只和受振镜控制的聚焦光斑扫掠方向相关。另一方面，以高速振镜往复运动替代中低速机械轴运动，大幅减少宽度和深度方向上的加工轨迹长度， 提高了加工效率。
本发明提供的方法，在不使用锥形全反镜等复杂光学元件前提下通过结合线偏振光束的移动和其偏振方位角的改变，获得了与只有使用锥形全反镜或腔内整形技术类似的角向偏振光特征的加工图形和径向偏振光特征的加工图形。在超硬材料刀具加工应用中获得比使用圆偏振光加工更高加工效率的同时，实现了刃口圆弧半径的可控和可变。
以超硬材料刀具加工为例，在相同激光输出功率下，应用本发明的方法不仅可以显著提高现有激光直写加工技术的材料去除率，至少20％。还提高了单次材料去除的深度，并减少平面方向分刀，显著缩短加工总路径长度50％以上，综合加工效率平均提高50％以上。
应用本发明的方法，还显著提高现有激光直写加工技术的灵活性，在功率、频率和脉宽等参数不变的前提下，可以按需控制激光加工处的表面粗糙度和边缘锐利程度。以聚晶金刚石材料刀具加工为例，加工表面粗糙度能低至Ra0.05微米，刃口圆弧半径低至1000纳米以下。
附图说明
图1为聚焦光斑一实施例的示意图；
图2为激光加工平面一实施例的示意图；
图3为聚焦光斑沿扫掠路径进行扫掠所成加工图形一实施例的示意图；
图4为聚焦光斑对激光加工平面进行扫掠所成加工图形另一实施例的示意图；
图5为线偏振态聚焦光斑一实施例的示意图；
图6为将具有线偏正态特征的聚焦光斑对激光加工平面进行扫掠的计算机模拟图形示意图；
图7为采用驱动偏振装置调整线偏振的一实施例的示意图；
图8为经图7获得的调整线偏振态对激光加工平面进行扫掠的一实施例的示意图；
图9本发明方法获得的类P或类S偏振态加工效果的加工图形上各处偏振方位角的分布示意图；
图10为本发明方法获得类C偏振态加工效果的加工图形上各处偏振方位角的分布示意图；
图11为本发明方法获得的类A偏振态加工效果的加工图形上各处偏振方位角的分布示意图；
图12为本发明方法获得的类R偏振态加工效果的加工图形上各处偏振方位角的分布示意图；
图13为本发明方法获得的类A与类R复合偏振态加工效果的加工图形上各处偏振方位角的分布示意图；
图14为本发明方法应用于方形边界时获得各类加工效果的加工图形上各处偏振方位角的分布示意图；
图15为本发明方法获得的多个偏振态混合特征的加工效果的加工图形上各处偏振方位角的分布示意图；
图16为现有技术中激光加工切缝的路径一实施例的示意图；
图17为本发明方法实施切缝激光加工路径的一实施例的示意图；
图18为图17所示激光加工路径的另一角度示意图。
具体实施方式
以下结合附图详细描述本发明的技术方案。本发明实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围，其均应涵盖在本发明的权利要求范围中。
采用激光对超硬材料实施加工时，确定待加工去除的超硬材料构造体，获得超硬材料构造体的轮廓，聚焦光斑所在的工件平面即为激光加工平面，该平面的轮廓限定了激光加工的第一边界，激光由首次接触构造体至最后完全通过构造体的总行程即为第二边界，也通常被认为是激光的加工深度。
以加工具有厚度的圆孔为例，其待加工去除的超硬材料构造体的轮廓为圆柱体，轮廓与激光入射方向相交的平面，即为激光加工平面，为圆形。该圆形的轮廓即为激光加工的第一边界，激光的聚焦光斑100(其外形如图1所示)将作用于第一边界内，使得的处于第一边界内的硬质材料得以去除。
通常情况下，作用于激光加工平面的聚焦光斑的面积小于或等于第一边界。当聚焦光斑面积等于第一边界，则通过1次作用，即在聚焦光斑能量可及处将激光加工平面内的超硬材料全部去除。当作用于激光加工平面的聚焦光斑的面积小于第一边界，则通常需要将聚焦光斑多次的作用于激光加工平面，才能将聚焦光斑能量所及处的超硬材料去除。随着加工深度的增加，而呈现出激光沿第一边界对超硬材料实施加工并逐层去除状态。
将若干个聚焦光斑100重叠就能将去除材料的面积扩大。比如：如图2所示图形的为例，若以其圆形边界400所划定的面积整体作用于超硬材料上，就能提高去除超硬材料的效率，缩短加工时间。为了实现此目的，则需要将聚焦光斑沿着扫掠路径进行移动，在圆形边界400内形成加工图形。
通过控制振镜，能使激光光斑沿扫掠路径形成加工图形。如图3所示，聚焦光斑100沿着环形扫掠路径300扫掠，即形成加工图形200。聚焦光斑100多次地作用并互相叠加，而形成加工图形。比较图3和图4可知，若要将圆形边界400内的超硬材料完全去除，则需要提高聚焦光斑100的作用频次，即增加密集度。虽然此等加工图形在构造体上并不能完整的呈现出来，但是随着聚焦光斑的移动，将每一时刻聚焦光斑组合在一起， 比如：通过计算机模拟的方式，就能看到一个位于圆形边界400内的完整的加工图形。因此，在对激光加工平面实施加工之初，就可以产生一个位于圆形边界400内的完整的加工图形，以此扩大作用于超硬材料的面积，将加工图形的整体在超硬材料上进行移动，就能形成构造体，比如：一条更宽的切缝(相比于单一的聚焦光斑在超硬材料上产生的切缝)。这类图形通常可以通过绘制的方式获得，在计算机辅助下，可提高绘制的效率，形成聚焦光斑的加工数据，比如；加工坐标、移动速度等，利于在数控机床上实施自动化激光加工。即，聚焦光斑沿着已经设定的加工图形在激光加工平面上扫掠，去除超硬材料。
激光束从光源射出后，经由扩束准直等一系列(常规)变化后，穿过偏振驱动装置，随后再入射振镜，经由计算机控制的振镜中的反射镜改变光束方向以利于按所要获得的加工图形实施扫掠，改变方向的激光最终经由场镜聚焦以形成由聚焦光斑的扫掠路径所构成的特定加工图形。将激光经振镜出射的聚焦光斑作用于激光加工平面，使得聚焦光斑沿设定的扫掠路径扫掠并形成加工图形，再以加工图形沿着工件表面轮廓加工轨迹移动，以去除激光加工平面内的超硬材料。
聚焦光斑围绕加工图形的中心移动且与偏振角度同步改变，使得各个聚焦光斑均以各自的偏振角度沿着扫略路径依次排布而产生加工图形，再以该加工图形为一个整体在工件表面移动而进行材料去除，使得加工质量和加工效率达到直接采用角向偏振光和径向偏振光进行材料去除相当的加工效果。图5为本实施例的具有线偏振特性的聚焦光斑110，其在圆形边界内对超硬材料进行加工，各个时刻的聚焦光斑的偏振方位角保持不变，如图6所示。当其扫掠激光加工平面前，其产生的加工图形可通过计算机模拟得到，并在实施加工时，按扫掠路径进行扫掠即可得到与加工图形一致的加工效果。在聚焦光斑对超硬材料实施去除的过程中，还应根据聚焦光斑扫掠的速度或者反射镜位置的反馈信号对激光的偏振方位角进行实时控制，确保出射的线偏振光的偏振方向与扫掠路径上当前聚焦光斑的运动方向的交角总是符合所需的加工角度。这些加工角度通常是根据加工的需求进行设定，以此通过调整聚焦光斑的扫掠路径及偏振方向与扫描路径间的夹角来获得各种不同的加工图形，这些加工图形与具有偏振特征的激光对超硬材料实施加工产生的加工效果相当。比如：将偏振方向设定为与扫掠路径不相关而是与激光加工平面的入射面垂直或平行，获得具有类似P态或S态偏振特性的加工图形。如图9所示的图形与具有P偏振态或S偏振态激光加工的效果相当，因此称为类P偏振态加工图形或类S偏振态加工图形。另如：各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹呈周期性连续变化，以获得具有类似C态偏振特征的加工图形。图10所示的图形与具有C偏振态激光加工的效果相当，因此称为类C偏振态加工图形。再如：各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于聚焦光斑扫掠路径的切线上，使加工图形整体上具有角向偏振特性。如图11所示的图形与具有A偏振态激光加工的效果相当，因此称为类A偏振态加工图形。又如：各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于过加工图形中心的直线上，使加工图形整体上具有径向偏振特性。图12所示的扫掠图形与具有R偏振态激光加工的效果相当，因此称为类R偏振态加工图形。通过调整加工角度，还能使扫掠图形同时具有A偏振态和R偏振态相复合的激光加工的效果类似， 各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均与聚焦光斑扫掠路径的切线相交，交角大于0°且小于180°，使加工图形整体上兼有角向偏振和径向偏振特性，因此称为类A与类R复合偏振态加工图形，如图13所示。变更扫掠路径，并结合特定偏振特征的激光，则可以形成各种图形，如：方形、圆形、点、线条状图形及其组合等，如图14所示，以此就能实现对各种复杂形态的加工。将将偏振方向与扫掠路径进行组合设定，则能获得具有多种偏振态相混合特征加工效果的加工图形，如图15所示，以此满足复杂加工的需求。
采用偏振驱动装置500，实时改变出射(指穿过偏振驱动装置的)激光束的偏振方位角，如图7所示。改变后加工图形上各处的聚焦光斑偏振方位角分布如图8所示，聚焦光斑均位于圆形边界400内。本实施例中，优先选择由中空旋转电机及置于其中的偏振光学元件(如：二分之一波片或法拉第旋光器等)组成的机械式装置。激光光束穿过电机中央通孔和置于电机上的偏振光学元件，通过控制电机带动偏振光学元件自转来改变出射光的偏振方向。偏振驱动装置还可以包括有作为起偏器的四分之一波片以确保入射到偏振光学元件的入射光为线偏振光；除了前述机械式回转结构，偏振驱动装置也可以是完全由不产生机械运动的液晶相位延迟器或称液晶偏振旋转器构成的电子式偏振驱动装置或是机械式和电子式两者的结合，技术人员可以根据光学系统所需调整带宽及成本综合确定具体实施方式。
通过控制激光的偏振方向与扫掠路径的关系，使得产生具有类似R态的加工图形，增加激光的加工深度，或者类似A态的加工图形实现对刃口圆弧半径的按需可调加工。
在刀具加工中，一般来说受激光聚焦特性影响，必须用聚焦光斑逐点逐层扫描材料的全部待去除区域，这使得激光在加工深度的方向上和平面方向上都需要多次往复加工以完成材料去除，图16所示。而在本实施例中，首先可以根据激光加工平面上所需要的加工宽度设定加工图形以及聚焦光斑的扫掠路径，以此有效减少聚焦光斑在激光加工平面上的逐行机械轴运动，如图17和图18所示。以在超硬材料600上切割一个宽度为N的切缝为例，若直接使用直径为n的聚焦光斑100，则在激光加工平面上需要机械轴往复N/n次才能加工。若该超硬材料的切缝的加工深度达到1.6mm时，则需要40次以上。使用受振镜控制的具有线偏振特性的聚焦光斑110扫掠一个宽度为N的图形，并机械轴只需要沿着切缝的长度方向上实施1次相对移动就能覆盖整个范围内的材料，将其去除，加工效率显著提高。
将聚焦光斑扫掠形成的加工图形的类偏振态设定为有更高材料去除率的R态以获得更大的单次加工深度从而减少聚焦光斑在深度方向上的逐层机械轴运动。通过振镜控制图形扫掠的速度一般至少是机械轴运动控制速度的10倍以上，因此这样的加工方式将大大提高整体加工效率。
在刀具刃部的精加工中，往往需要根据刀具的不同使用工况加工出不同刃口圆弧半径的刀具(例如：用于微细切削的金刚石微铣刀需要小于300纳米的刃口圆弧半径，而用于钛合金粗切的金刚石替换式刀粒需要约2,500nm～4,000nm的刃口圆弧半径)，这在通常加工中需要综合运用线切割、磨削、激光和抛光等不同的加工工艺来针对性的制造某一尺寸范围刃口圆弧半径的刀具刃口，这大大增加了生产工艺环节及其复杂性。在本实施例中，通过对扫掠 图形的类偏振态进行设定，即使得从偏振驱动装置出射的线偏振光的偏振方向总是与扫掠路径上当前聚焦光斑的运动方向的夹角得以保持，而获得具有类似A态(即偏振方向设定为与扫掠路径始终平行)加工图形或R态偏振特征(即偏振方向设定为与扫掠路径始终垂直)加工图形，或具有类似复合A态和R态偏振特征的加工图形(即偏振方向设定为与扫掠路径始终保持一固定夹角)，通过用具有不同偏振特征的加工图形对超硬材料边缘进行去除，能可控的获得不同边缘锐利程度，即不同刃口圆弧半径地切削刃口。进一步地，甚或还可以实现不同部位切削刃锐利程度间的渐变和差异。
以具有如下表1和表2所示加工要求的刀具为例，采用如表3和表4所示的激光加工方案实施加工。
表1
Figure PCTCN2022136453-appb-000001
表2
Figure PCTCN2022136453-appb-000002
表3
Figure PCTCN2022136453-appb-000003
表4
Figure PCTCN2022136453-appb-000004
Figure PCTCN2022136453-appb-000005
综上可见，本实施例的激光加工方法显著提高了加工效率的同时，可有选择性地获得特定刃口圆弧半径，并且兼顾被加工表面粗糙度(Ra≤50nm)及显著减少刃口崩刃发生。
本实施例的激光加工方法，激光发射器射出的激光先射入一段腔道，再自腔道射出后，再进入激光投射中继部件，激光投射中继部件改变激光的传播路径后再射出激光，最后由出光部件接收后射出，用于对工件实施加工。激光在腔道内传播，或沿直线传播，或沿折线传播。激光在腔道的出口端沿着直线传播，在右手直角坐标系中，回转轴为A轴、B轴或C轴，使出光部件射出的激光绕回转轴方向分布，激光聚焦于该回转轴范围内，即以与回转轴为中心半径100mm的回转(圆)面内，尤其是聚焦于回转轴线上。实现激光以回转的方式实施机加工。本实施例中，腔道设置于Y轴上，回转轴为B轴，出光部件绕B轴转动。
上述各项实施例提供的装置安装于机加工设备上，比如：以三个直线运动轴、一个用于固定工件的回转运动轴和一个激光束回转轴相组合形成空间五轴激光机加工方案，就能实现以多轴方式对工件进行机加工，制造复杂和多样构造的产品。比如：机床具有至少三个直线轴，其中一个直线轴上安装本发明的装置(比如：设置在X轴和Z轴确定的平面上，并沿Z轴直线移动)，另一个直线轴上安装转动定位机构，驱动被加工工件回转的定位(比如：将工件设置于X轴和Y轴确定的平面上)，消除应力、振动、弹性形变或温度等因素导致光束与转台回转轴相对位置无法保持的情形，提高激光加工的精密度，利于对各种规格零件实施激光加工。

Claims (11)

  1. 一种超硬材料的激光加工方法，其特征在于以具有线偏振特性的聚焦光斑的移动和其偏振方位角的改变，将工件表面轮廓加工轨迹方向和偏振方向直接关系解耦，使偏振方向只和振镜运动相关。
  2. 根据权利要求1所述的超硬材料的激光加工方法，其特征在于以线偏振态激光的聚焦光斑在平面沿扫掠路径移动，以及在扫掠的同时实时控制激光的偏振角度，使得各个聚焦光斑均以各自的偏振角度沿着扫掠路径依次排布而产生加工图形，接着再以该加工图形为一个整体在材料表面移动，并去除移动路径上的材料以获得所需的构造。
  3. 根据权利要求1所述的超硬材料的激光加工方法，其特征在于以偏振驱动装置实时改变出射激光的偏振方位角，激光光束穿过电机中央通孔和置于电机上的偏振光学元件，通过控制电机带动偏振光学元件自转来改变出射光的偏振方向。
  4. 根据权利要求1所述的超硬材料的激光加工方法，其特征在于聚焦光斑围绕加工图形的中心移动且与偏振角度同步改变，使得各个聚焦光斑均以各自的偏振角度沿着扫略路径依次排布而产生加工图形，再以该加工图形为一个整体在工件表面移动而进行材料去除，使得加工质量和加工效率达到直接采用角向偏振光和径向偏振光进行材料去除相当的加工效果。
  5. 根据权利要求1所述的超硬材料的激光加工方法，其特征在于将激光经振镜出射的聚焦光斑作用于激光加工平面，使得聚焦光斑沿设定的扫掠路径扫掠并形成加工图形，再以加工图形沿着工件表面轮廓加工轨迹移动，以去除激光加工平面内的超硬材料；
    在聚焦光斑沿设定的扫掠路径扫掠时，还对偏振方向与扫掠路径的相关性进行设定，使聚焦光斑围绕加工图形中心移动，
    当沿着扫掠路径依次排布的各聚焦光斑的偏振方向相同，使产生的加工图形整体上具有线偏振特性；或
    各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于过加工图形中心的直线上，使加工图形整体上具有径向偏振特性；或
    各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均位于聚焦光斑扫掠路径的切线上，使加工图形整体上具有角向偏振特性；或
    各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹均与聚焦光斑扫掠路径的切线相交，交角大于0°且小于180°，使加工图形整体上兼有角向偏振和径向偏振特性；或
    各个聚焦光斑的光矢量端点在垂直于传播方向的平面上的轨迹呈周期性连续变化，使加工图形整体上具有圆偏振特性或椭圆偏振特性。
  6. 根据权利要求1所述的超硬材料的激光加工方法应用于机加工设备，以对超硬材料实施加工，形成刀具刃口。
  7. 一种机加工设备，其特征在于采用权利要求1所述的超硬材料的激光加工方法加工。
  8. 一种装置，用于实施权利要求1所述的超硬材料的激光加工方法，其特征在于包括：
    激光光源，用于产生激光光速；
    反射镜，用于改变激光光速的方向；
    聚焦镜，用于接收入射的激光光纤，并形成聚焦光斑；
    振镜，用于控制聚焦光斑的扫掠范围；
    偏振驱动装置，用于改变出射激光的偏振方位角。
  9. 根据权利要求8所述的装置，其特征在于所述反射镜安装于光学调整架或振镜之上以实现按需改变聚焦光斑扫掠方向，形成加工图形。
  10. 根据权利要求8所述的装置，其特征在于所述的聚焦镜搭载多镜片的场镜。
  11. 一种机加工设备，其特征在于包括权利要求10所述的装置。
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