WO2023127585A1 - Display device manufacturing jig, display device manufacturing method, display device manufactured using display device manufacturing jig, and display device manufactured using display device manufacturing method - Google Patents

Display device manufacturing jig, display device manufacturing method, display device manufactured using display device manufacturing jig, and display device manufactured using display device manufacturing method Download PDF

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Publication number
WO2023127585A1
WO2023127585A1 PCT/JP2022/046788 JP2022046788W WO2023127585A1 WO 2023127585 A1 WO2023127585 A1 WO 2023127585A1 JP 2022046788 W JP2022046788 W JP 2022046788W WO 2023127585 A1 WO2023127585 A1 WO 2023127585A1
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Prior art keywords
display device
manufacturing
light
jig
back surface
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PCT/JP2022/046788
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French (fr)
Japanese (ja)
Inventor
直樹 野畑
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株式会社東海理化電機製作所
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Publication of WO2023127585A1 publication Critical patent/WO2023127585A1/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a display device manufacturing jig, a display device manufacturing method, a display device manufactured using the display device manufacturing jig, and a display device manufactured using the display device manufacturing method.
  • a micro LED (Light Emitting Diode) chip conveying method using a micro LED (Light Emitting Diode) chip conveying film having a first resin cured product is known (see, for example, Patent Document 1).
  • This method of transporting the micro LED chip includes a step of pressing a micro LED chip transporting film against the micro LED chip on the base material to adhere the micro LED chip to the first cured resin material, and and transferring the micro LED chips attached to the substrate onto another substrate.
  • An object of the present invention is to provide a jig for manufacturing a display device, a method for manufacturing a display device, a display device manufactured using the jig for manufacturing a display device, and a method for manufacturing a display device, which can reduce manufacturing costs.
  • An object of the present invention is to provide a display device manufactured by
  • a jig for manufacturing a display device is arranged such that the back surface is in contact with a material dispersion liquid in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of a display device is dispersed.
  • a material dispersion is prepared in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of the display device is dispersed, and the light is incident from the surface.
  • a light-shielding region that does not transmit light to the outside of the back surface, and a light-emitting element material that transmits incident light from the front surface and is integrated and adhered by the transmitted light are arranged in the same manner as the two-dimensional arrangement of pixels in a display device.
  • the back surface of a jig for manufacturing a display device having a transmissive region is brought into contact with the material dispersion liquid, light is irradiated from the surface of the jig for manufacturing a display device, and the transmitted light is integrated around the transmissive region. is attached to the back surface.
  • a display device according to another embodiment of the present invention is manufactured using the jig for manufacturing a display device described above. Further, a display device according to another embodiment of the present invention is manufactured using the method for manufacturing a display device described above.
  • a jig for manufacturing a display device that reduces manufacturing costs, a method for manufacturing a display device, a display device manufactured using the jig for manufacturing a display device, and a display A method of manufacturing a device can be provided.
  • FIG. 1A is an explanatory diagram showing a display device according to an embodiment.
  • FIG. 1B is an explanatory diagram enlarging a part of pixels forming a display image in the display device according to the embodiment.
  • FIG. 1C is a cross-sectional view showing micro LEDs in the display device according to the embodiment.
  • FIG. 2A is an explanatory diagram showing a jig for manufacturing a display device according to the embodiment.
  • FIG. 2B is a cross-sectional view of the display device manufacturing jig according to the embodiment.
  • FIG. 2C is an explanatory diagram showing a through-hole according to a modification of the jig for manufacturing a display device.
  • 3A is a cross-sectional view showing a manufacturing process of the display device according to the embodiment.
  • FIG. 3B is a cross-sectional view showing a manufacturing process of the display device according to the embodiment
  • FIG. 3C is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. 3D is a cross-sectional view showing a manufacturing process of the display device according to the embodiment;
  • FIG. 3E is a cross-sectional view showing a manufacturing process of the display device according to the embodiment.
  • FIG. 3F is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. FIG. 4A is a cross-sectional view showing the manufacturing process of the display device.
  • 4B is a cross-sectional view showing a manufacturing process of the display device according to the embodiment;
  • FIG. 4C is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. 4D is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. 4E is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. 4F is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • FIG. 4G is a cross-sectional view showing the manufacturing process of the display device according to the embodiment.
  • a jig for manufacturing a display device is arranged so that the rear surface thereof is in contact with a material dispersion liquid in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of a display device is dispersed.
  • a light-shielding region provided in the base that does not transmit light incident from the front surface of the base to the outside of the back surface; and a transmissive region in which the material of the light-emitting element is the same as the two-dimensional arrangement of the pixels of the display device.
  • a material dispersion liquid in which a material forming at least the light emitting layer of the light emitting element arranged corresponding to the pixel of the display device is dispersed is prepared, and light incident from the surface is dispersed.
  • the back surface of a jig for manufacturing a display device having a region is brought into contact with the material dispersion liquid, light is irradiated from the surface of the jig for manufacturing a display device, and the material of the light-emitting elements integrated around the transmission region is deposited on the back surface by the transmitted light. It includes a manufacturing method for adhering to.
  • the display device of the embodiment is at least one of a display device manufactured using the above-described display device manufacturing jig and a display device manufactured using the display device manufacturing method.
  • At least one of the display device manufactured using this display device manufacturing jig and the display device manufactured using the display device manufacturing method is provided with a transmissive region corresponding to a pixel of the display device. Since the light-emitting element materials are integrated around the transmissive region, a large number of light-emitting element materials corresponding to pixels can be arrayed at once and arranged on the circuit board. Therefore, the jig for manufacturing the display device and the method for manufacturing the display device require fewer steps than the case of arranging the light emitting elements one by one, and the misalignment of the light emitting elements is suppressed, so that the manufacturing cost can be suppressed. can be done.
  • FIG. 1A is an explanatory diagram showing a display device according to an embodiment
  • FIG. 1B is an explanatory diagram enlarging a part of pixels forming a display image in the display device according to an embodiment
  • FIG. 3 is a cross-sectional view showing a micro LED in the display device according to the embodiment
  • FIG. 2A is an explanatory view showing a jig for manufacturing a display device according to an embodiment
  • FIG. 2B is a cross-sectional view of the jig for manufacturing a display device according to an embodiment
  • FIG. FIG. 11 is an explanatory diagram showing a through-hole according to a modified example of the jig
  • 3A to 4G are diagrams showing manufacturing steps of the display device according to the embodiment.
  • the manufacturing method of the display device 9 is to form micro-sized self-luminous structures 22 (LEDs or quantum dots) on the display device manufacturing jig 1 processed with fine holes by the method described below, and In this method, the structure 22 is transferred to the circuit board 5 after the metal layer 4 for bonding to the circuit board 5 is processed.
  • LEDs or quantum dots micro-sized self-luminous structures 22
  • a through hole 14, which will be described later, is formed as a fine hole.
  • the display device manufacturing jig 1 is made of a material that does not transmit the light of the wavelength of the laser beam 3 described later, or is coated with a material that does not transmit the light.
  • the through holes 14 are formed at intervals corresponding to the pitch P at which the micro LEDs 7 as light emitting elements are arranged. Also, the size of the through hole 14 is slightly smaller than the size of the micro LED 7 .
  • the display device manufacturing jig 1 and the method of manufacturing the display device 9 using the display device manufacturing jig 1 will be described more specifically.
  • the display device 9 manufactured using the display device manufacturing jig 1 and the display device 9 manufactured using the manufacturing method of the display device 9 are not limited to the display device 9 shown below. It may be a display that displays only a specific image, or a light-emitting device that emits light such as an illumination light or a backlight.
  • the display device 9 is a micro LED display.
  • a micro LED display is a display in which micro LEDs 7 are arranged as a plurality of pixels 91 forming a display image 90, as shown in FIGS. 1A-1C.
  • the display device 9 for example, if the resolution is 1920 ⁇ 1080, approximately 2 million micro LEDs 7 are required for each color. When the display device 9 is arranged in three colors of RGB for color display, it is necessary to arrange approximately 6 million micro LEDs 7 at an accurate pitch. In the display device 9 of the present embodiment, instead of arranging the micro LEDs 7 one by one, it is possible to arrange the micro LEDs 7 in an array using a display device manufacturing jig 1 described below.
  • the display device manufacturing jig 1 is a material dispersion liquid described later in which a material forming at least the light emitting layer of the micro LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed.
  • the base 10 is arranged so that the back surface 12 is in contact with the base 10; and a transmissive region in which light incident from the surface 11 is transmitted, and the material of the micro LEDs 7 integrated and adhered by the transmitted light has the same arrangement as the two-dimensional arrangement of the pixels 91 of the display device 9 .
  • the transmissive region of the present embodiment penetrates from the front surface 11 to the back surface 12 so as to transmit the light incident from the front surface 11, and adheres to the micro LED 7 by the blown gas 8.
  • a plurality of through holes 14 provided in the base 10 for material release.
  • the base 10 when the transmissive region is not the through hole 14, as an example, the base 10 is formed of a transparent material, and at least one of the front surface 11 and the back surface 12 thereof transmits light. A non-transmissive coating is applied, and the corresponding area is peeled off with a laser or the like to form a transmissive area.
  • the base 10 when the transmission region is not the through hole 14, as an example, the base 10 is formed of a transparent material, and at least one of the front surface 11 and the back surface 12 is coated with a coating that does not transmit light. , and corresponding areas are not printed to form transmissive areas.
  • the material forming at least the light-emitting layer of the integrated micro LEDs 7 is, for example, the self-light-emitting structure 22 shown in FIG. 1C. Also, the light incident from the surface 11 is the laser light 3 shown in FIGS. 3C and 3D.
  • the display device manufacturing jig 1 has a plate-shaped base portion 10 .
  • the base 10 is formed using a material that has high flatness and is less likely to warp.
  • the base 10 is formed using, for example, a resin material such as polycarbonate, a metal material such as stainless steel, or glass.
  • the thickness H of the base 10 shown in FIG. 2B is about 5 nm, but the thickness H is not limited to this.
  • the size of the surface 11 of the base 10 is arbitrary, but it is made larger than the diameter of the laser beam 3 to be irradiated.
  • the base portion 10 may be formed of a light-shielding material, or may be formed by containing a light-shielding material. A membrane may be formed.
  • the base 10 of the present embodiment is made of, for example, a material that does not transmit the laser beam 3 . Therefore, the base portion 10 other than the through holes 14 is the light shielding region 13 .
  • the through holes 14 are provided in the base 10 according to the arrangement of the pixels 91 of the display device 9, that is, the arrangement of the micro LEDs 7, as described above.
  • the through-hole 14 of the present embodiment has a diameter of 20 ⁇ m as an example, but is not limited to this.
  • This through-hole 14 is configured as a hole smaller than the material of the integrated micro-LED 7, as indicated by the dashed circle in FIG. 2A. As shown in FIGS. 2A and 2B, the through-hole 14 is formed in a columnar shape having the same circular top surface and bottom surface by removing the base portion 10 .
  • the shape of the through-hole 14 is not limited to this, and may be a rectangular shape, a triangular shape, a star shape, a polygonal shape other than these, or the like.
  • the through hole 14 may be formed as an assembly of micro through holes 140 as a plurality of micro transmissive regions, as shown in FIG. 2C.
  • the through-holes 14 indicated by dotted lines in FIG. 2C are formed as aggregates of a plurality of fine through-holes 140 .
  • the minute through-holes 140 are, for example, holes having a diameter of 1 to 10 ⁇ m.
  • the pitch P of the through-holes 14 is the same in the vertical and horizontal directions, as shown in FIG. 2A. Also, the number of through-holes 14 depends on the resolution of the display device 9 .
  • the pitch P in this embodiment is, for example, 60 to 250 ⁇ m. It is preferable that the pitch P has an error of several ⁇ m or less.
  • the through-holes 14 are formed so that the centers are positioned on a straight line as indicated by the dashed line in FIG. 2A, and that the deviation in the distance between the centers is small and the error is several ⁇ m or less.
  • the micro LEDs 7 are formed in the through holes 14 . After the micro LEDs 7 are formed and pressed against the electrode pads 6 of the circuit board 5 , the gas 8 blown from the front surface 11 side flows and the micro LEDs 7 are emitted from the back surface 12 . Promotes exfoliation.
  • the material dispersion liquid 20 is a solution in which the material of the micro LEDs 7 to be integrated is dispersed in the container 2 as colloidal particle-like quantum dots 21 .
  • This quantum dot 21 is, for example, a semiconductor with a diameter of 2 to 10 nm.
  • self-luminous structures 22 are integrated and adhered to back surface 12 of jig 1 for manufacturing a display device by utilizing the phenomenon that quantum dots 21 are integrated and solidified by irradiation with laser light 3 .
  • the wavelength of the laser light 3 is determined according to the quantum dots 21 to be integrated.
  • the laser beam 3 may have a spread that irradiates the entire jig 1 for manufacturing a display device, or may irradiate a part thereof.
  • the metal layer 4 is, for example, formed by vapor deposition of a conductive metal material such as nickel or gold.
  • the metal layer 4 is brought into pressure contact with the electrode pads 6 of the circuit board 5 when the display device manufacturing jig 1 and the circuit board 5 are pressed together.
  • the display device manufacturing jig 1 is pressed against the circuit board 5, but the present invention is not limited to this. Also good.
  • the circuit board 5 is a rigid board on which the electrode pads 6 and wiring are formed on the surface 50 .
  • the circuit board 5 is provided with control elements for controlling the driving of the micro LEDs 7 and the like.
  • Electrode pads 6 are formed on the circuit board 5 according to the micro LEDs 7 .
  • the electrode pads 6 are formed, for example, using paste of a conductive material such as solder, or a conductive metal material such as aluminum, copper, or gold.
  • the electrode pad 6 is, for example, a pad-shaped electrode.
  • the micro LED 7 has a metal layer 4 and a self-luminous structure 22, as shown in FIG. 1C.
  • the self-luminous structure 22 is configured such that the quantum dots 21 form at least a light-emitting layer.
  • the self-luminous structure 22 of the present embodiment includes a P-type semiconductor, an N-type semiconductor, and a light-emitting layer sandwiched between the P-type semiconductor and the N-type semiconductor.
  • the gas 8 is, for example, air, but is not limited to this, and may be an inert gas such as a rare gas that does not affect the micro LED 7 or the like.
  • the method of manufacturing the display device 9 prepares a material dispersion liquid 20 in which a material forming at least the light emitting layer of the micro LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed. Then, a light shielding region 13 that does not transmit the laser light 3 incident from the front surface 11 to the outside of the back surface 12, and a material of the micro LED 7 that transmits the light incident from the front surface 11 and is accumulated and adhered by the transmitted laser light 3 is displayed.
  • the rear surface 12 of the display device manufacturing jig 1 having a transmission region having the same arrangement as the two-dimensional arrangement of the pixels 91 of the device 9 is brought into contact with the material dispersion liquid 20, and the front surface 11 of the display device manufacturing jig 1
  • a manufacturing method is included in which the laser light 3 is irradiated from the laser light 3 and the material of the integrated micro LEDs 7 is adhered to the rear surface 12 by the transmitted laser light 3 .
  • the transmission region of the present embodiment is a plurality of through holes 14 penetrating from the surface 11 to the back surface 12 so as to transmit the laser beam 3 incident from the surface 11 .
  • the transmissive area is formed by painting or removing the light shielding area 13
  • the material of the integrated micro LEDs 7 is peeled off without blowing the gas 8 in the next manufacturing method.
  • the method for manufacturing the display device 9 further comprises forming a conductive metal layer 4 on the back surface 12 of the jig for manufacturing the display device 1, forming the metal layer 4 on the attached material of the micro LEDs 7,
  • a circuit board 5 having an electrode pad 6 as a conductive metal region is prepared at the position of the pixel 91, pressure is applied to the display device manufacturing jig 1 and the circuit board 5, and if necessary, heating is performed.
  • a material dispersion liquid 20 in which a material forming at least the light emitting layer of the micro LED 7 is dispersed is prepared.
  • Quantum dots 21 in the form of colloidal particles are dispersed in this material dispersion liquid 20 as described above.
  • the rear surface 12 of the display device manufacturing jig 1 is brought into contact with the material dispersion liquid 20 .
  • the surface 11 of the display device manufacturing jig 1 is irradiated with laser light 3 .
  • the laser light 3 does not pass through the light shielding region 13 , but passes through the through hole 14 which is a transmission region to reach the material dispersion liquid 20 .
  • the self-luminous structure 22 which is the material of the micro LEDs 7 integrated by the transmitted laser light 3, is attached to the back surface 12.
  • the self-luminous structure 22 has an upper surface shape centered on the through hole 14 and slightly larger than the through hole 14, as indicated by the dotted line in the top view of FIG. 2B.
  • the display device manufacturing jig 1 is taken out from the material dispersion liquid 20.
  • the display device manufacturing jig 1 is taken out from the material dispersion liquid 20.
  • a conductive metal layer 4 is formed on the rear surface 12 of the jig 1 for manufacturing a display device, and the metal layer 4 is formed on the adhered material of the micro LEDs 7 .
  • This metal layer 4 is formed by vapor deposition.
  • the metal layer 4 is formed on the rear surface 12 and the self-luminous structure 22 of the display device manufacturing jig 1 .
  • the circuit board 5 having the electrode pads 6 at the positions of the pixels 91 of the display device 9 is prepared.
  • the display device manufacturing jig 1 is precisely aligned with the circuit board 5 so that the positions of the through holes 14 are aligned with the positions of the electrode pads 6 .
  • the metal layer 4 formed on the self-luminous structure 22 of the display manufacturing jig 1 and the electrode pads 6 of the circuit board 5 are brought into contact with each other.
  • the metal layer 4 of the self-luminous structure 22 and the electrode pad 6 are adhered by applying pressure while heating the display device manufacturing jig 1 and the circuit board 5 .
  • the bonding between the metal layer 4 and the electrode pad 6 is by pressure bonding, but is not limited to this, and may be performed via a conductive adhesive or the like.
  • gas 8 is blown onto the surface 11 of the jig 1 for manufacturing display devices.
  • This gas 8 is blown over the entire surface 11 .
  • the self-luminous structure 22 having the metal layer 4, that is, the micro LED 7 can be easily peeled from the jig 1 for manufacturing the display device.
  • the metal layer 4 formed on the rear surface 12 of the display device manufacturing jig 1 is left as it is.
  • the adhered material of the micro LED 7 is removed from the rear surface 12.
  • the micro LED 7 is separated from the display device manufacturing jig 1 and integrated with the electrode pad 6 of the circuit board 5 .
  • the display device manufacturing jig 1 is separated from the circuit board 5, and the next processing is performed.
  • the next processing is, for example, connecting the micro LED 7 to other electrode pads, arranging color filters, etc., as required.
  • the manufacturing method of the display device 9 may include a manufacturing method of changing the types of the display device manufacturing jig 1 and the material dispersion liquid 20 as necessary. For example, when the micro LEDs 7 are separately produced for each of RGB, the display device 9 is manufactured including a production method of preparing and separately producing the display device manufacturing jig 1 and the material dispersion liquid 20 for each of RGB.
  • Display device manufacturing jig 1 according to the present embodiment, method for manufacturing display device 9, display device 9 manufactured using display device manufacturing jig 1, and display device manufactured using display device 9 manufacturing method
  • the display device 9 can suppress the manufacturing cost.
  • the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device manufactured using the manufacturing method of the display device 9 In the display device 9, through holes 14 as transmissive regions are provided in the display device manufacturing jig 1 corresponding to the pixels 91 of the display device 9, and the quantum dots 21 are integrated around the through holes 14.
  • the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 are As compared with the case of arranging the light emitting elements one by one, the number of processes is reduced, and misalignment of the micro LEDs 7 is suppressed, so that the manufacturing cost can be suppressed.

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Abstract

A display device manufacturing jig 1 comprises: a base 10 disposed such that a back surface 12 is in contact with a material-dispersed liquid 20 in which a material for forming at least light-emitting layers of micro LEDs 7 to be disposed to correspond to pixels 91 of a display device 9 is dispersed; light-blocking regions 13 which are provided in the base 10 and cause laser light 3 incident from a front surface 11 of the base 10 not to be transmitted to the outside of the back surface 12; and though-holes 14 as transmission regions which are provided in the base 10 and cause the laser light 3 incident from the front surface 11 to be transmitted therethrough, the material for the micro LEDs 7, which has been accumulated and attached thereto by the transmitted laser light 3, having the same disposition as the two-dimensional disposition of the pixels 91 of the display device 9.

Description

表示装置製造用治具、表示装置の製造方法、表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を用いて製造された表示装置Display device manufacturing jig, display device manufacturing method, display device manufactured using display device manufacturing jig, and display device manufactured using display device manufacturing method 関連出願の相互参照Cross-reference to related applications
本出願は、２０２１年１２月２８日に出願された日本国特許出願２０２１－２１３５９１号の優先権を主張するものであり、日本国特許出願２０２１－２１３５９１号の全内容を本出願に参照により援用する。 This application claims the priority of Japanese Patent Application No. 2021-213591 filed on December 28, 2021, and the entire contents of Japanese Patent Application No. 2021-213591 are incorporated by reference into this application. do.
本発明は、表示装置製造用治具、表示装置の製造方法、表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を用いて製造された表示装置に関する。 The present invention relates to a display device manufacturing jig, a display device manufacturing method, a display device manufactured using the display device manufacturing jig, and a display device manufactured using the display device manufacturing method.
第一の樹脂硬化物を有するマイクロＬＥＤ（Light Emitting Diode）チップ搬送用フィルムを用いたマイクロＬＥＤチップの搬送方法が知られている（例えば、特許文献１参照。）。 A micro LED (Light Emitting Diode) chip conveying method using a micro LED (Light Emitting Diode) chip conveying film having a first resin cured product is known (see, for example, Patent Document 1).
このマイクロＬＥＤチップの搬送方法は、基材上のマイクロＬＥＤチップにマイクロＬＥＤチップ搬送用フィルムを押圧して、第一の樹脂硬化物にマイクロＬＥＤチップを付着させる工程と、第一の樹脂硬化物に付着しているマイクロＬＥＤチップを別の基材上に移行する工程と、を備えている。 This method of transporting the micro LED chip includes a step of pressing a micro LED chip transporting film against the micro LED chip on the base material to adhere the micro LED chip to the first cured resin material, and and transferring the micro LED chips attached to the substrate onto another substrate.
特開２０２１－１７７５０６号公報Japanese Patent Application Laid-Open No. 2021-177506
特許文献１に開示されたマイクロＬＥＤチップの搬送方法は、マイクロＬＥＤチップをマイクロＬＥＤチップ搬送用フィルムに押圧して付着させる際、全てのマイクロＬＥＤチップを付着させると共に、第一の樹脂硬化物に付着しているマイクロＬＥＤチップを別の基材上に移行する際、全てのマイクロＬＥＤチップを移行させなければならず、さらに移行先の基材上に精度良く配置する高い位置決めの精度が要求されるので、製造コストが増加する問題がある。 In the method for transporting the micro LED chips disclosed in Patent Document 1, when the micro LED chips are pressed and attached to the film for transporting the micro LED chips, all the micro LED chips are attached and the first cured resin is attached. When transferring the adhered micro LED chips to another substrate, all the micro LED chips must be transferred, and high positioning accuracy is required to place them on the destination substrate with high accuracy. Therefore, there is a problem that the manufacturing cost increases.
本発明の目的は、製造コストを抑制することができる表示装置製造用治具、表示装置の製造方法、表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を用いて製造された表示装置を提供することにある。 An object of the present invention is to provide a jig for manufacturing a display device, a method for manufacturing a display device, a display device manufactured using the jig for manufacturing a display device, and a method for manufacturing a display device, which can reduce manufacturing costs. An object of the present invention is to provide a display device manufactured by
本発明の一実施形態による表示装置製造用治具は、表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液に、裏面が接触するように配置される基部と、基部に設けられ、基部の表面から入射する光を裏面の外に透過させない遮光領域と、基部に設けられ、表面から入射する光を透過させ、透過した光によって集積して付着した発光素子の材料が表示装置の画素の二次元的な配置と同一の配置となる透過領域と、を有する。 A jig for manufacturing a display device according to an embodiment of the present invention is arranged such that the back surface is in contact with a material dispersion liquid in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of a display device is dispersed. A base to be arranged, a light-shielding region provided in the base that does not transmit light incident from the surface of the base to the outside of the back surface, and a light-shielding region provided in the base that transmits light incident from the surface and integrates the transmitted light. and a transmissive region in which the attached light-emitting element material has the same arrangement as the two-dimensional arrangement of the pixels of the display device.
本発明の他の実施形態による表示装置の製造方法は、表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液を用意し、表面から入射する光を裏面の外に透過させない遮光領域、及び表面から入射する光を透過させ、透過した光によって集積して付着した発光素子の材料が表示装置の画素の二次元的な配置と同一の配置となる透過領域を有する表示装置製造用治具の裏面を材料分散液に接触させ、表示装置製造用治具の表面から光を照射し、透過した光によって透過領域を中心として集積した発光素子の材料を裏面に付着させる製造方法を含んでいる。 In a method of manufacturing a display device according to another embodiment of the present invention, a material dispersion is prepared in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of the display device is dispersed, and the light is incident from the surface. A light-shielding region that does not transmit light to the outside of the back surface, and a light-emitting element material that transmits incident light from the front surface and is integrated and adhered by the transmitted light are arranged in the same manner as the two-dimensional arrangement of pixels in a display device. The back surface of a jig for manufacturing a display device having a transmissive region is brought into contact with the material dispersion liquid, light is irradiated from the surface of the jig for manufacturing a display device, and the transmitted light is integrated around the transmissive region. is attached to the back surface.
また本発明の他の実施形態による表示装置は、上述の表示装置製造用治具を用いて製造される。さらに本発明の他の実施形態による表示装置は、上述の表示装置の製造方法を用いて製造される。 A display device according to another embodiment of the present invention is manufactured using the jig for manufacturing a display device described above. Further, a display device according to another embodiment of the present invention is manufactured using the method for manufacturing a display device described above.
本発明の一実施形態及び他の実施形態によれば、製造コストを抑制する表示装置製造用治具、表示装置の製造方法、表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を提供することができる。 According to one embodiment and another embodiment of the present invention, a jig for manufacturing a display device that reduces manufacturing costs, a method for manufacturing a display device, a display device manufactured using the jig for manufacturing a display device, and a display A method of manufacturing a device can be provided.
図１Ａは、実施の形態に係る表示装置を示す説明図である。FIG. 1A is an explanatory diagram showing a display device according to an embodiment. 図１Ｂは、実施の形態に係る表示装置における表示画像を形成する画素の一部を拡大した説明図である。FIG. 1B is an explanatory diagram enlarging a part of pixels forming a display image in the display device according to the embodiment. 図１Ｃは、実施の形態に係る表示装置におけるマイクロＬＥＤを示す断面図である。FIG. 1C is a cross-sectional view showing micro LEDs in the display device according to the embodiment. 図２Ａは、実施の形態に係る表示装置製造用治具を示す説明図である。FIG. 2A is an explanatory diagram showing a jig for manufacturing a display device according to the embodiment. 図２Ｂは、実施の形態に係る表示装置製造用治具の断面図である。FIG. 2B is a cross-sectional view of the display device manufacturing jig according to the embodiment. 図２Ｃは、表示装置製造用治具の変形例に係る貫通孔を示す説明図である。FIG. 2C is an explanatory diagram showing a through-hole according to a modification of the jig for manufacturing a display device. 図３Ａは、実施の形態に係る表示装置の製造工程を示す断面図である。3A is a cross-sectional view showing a manufacturing process of the display device according to the embodiment. FIG. 図３Ｂは、実施の形態に係る表示装置の製造工程を示す断面図である。3B is a cross-sectional view showing a manufacturing process of the display device according to the embodiment; FIG. 図３Ｃは、実施の形態に係る表示装置の製造工程を示す断面図である。3C is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図３Ｄは、実施の形態に係る表示装置の製造工程を示す断面図である。3D is a cross-sectional view showing a manufacturing process of the display device according to the embodiment; FIG. 図３Ｅは、実施の形態に係る表示装置の製造工程を示す断面図である。3E is a cross-sectional view showing a manufacturing process of the display device according to the embodiment. FIG. 図３Ｆは、実施の形態に係る表示装置の製造工程を示す断面図である。3F is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図４Ａは、表示装置の製造工程を示す断面図である。FIG. 4A is a cross-sectional view showing the manufacturing process of the display device. 図４Ｂは、実施の形態に係る表示装置の製造工程を示す断面図である。4B is a cross-sectional view showing a manufacturing process of the display device according to the embodiment; FIG. 図４Ｃは、実施の形態に係る表示装置の製造工程を示す断面図である。4C is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図４Ｄは、実施の形態に係る表示装置の製造工程を示す断面図である。4D is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図４Ｅは、実施の形態に係る表示装置の製造工程を示す断面図である。4E is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図４Ｆは、実施の形態に係る表示装置の製造工程を示す断面図である。4F is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG. 図４Ｇは、実施の形態に係る表示装置の製造工程を示す断面図である。4G is a cross-sectional view showing the manufacturing process of the display device according to the embodiment. FIG.
（実施の形態の要約）
実施の形態に係る表示装置製造用治具は、表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液に、裏面が接触するように配置される基部と、基部に設けられ、基部の表面から入射する光を裏面の外に透過させない遮光領域と、基部に設けられ、表面から入射する光を透過させ、透過した光によって集積して付着した発光素子の材料が表示装置の画素の二次元的な配置と同一の配置となる透過領域と、を有する。 (Summary of embodiment)
A jig for manufacturing a display device according to an embodiment is arranged so that the rear surface thereof is in contact with a material dispersion liquid in which a material forming at least a light emitting layer of a light emitting element arranged corresponding to a pixel of a display device is dispersed. a light-shielding region provided in the base that does not transmit light incident from the front surface of the base to the outside of the back surface; and a transmissive region in which the material of the light-emitting element is the same as the two-dimensional arrangement of the pixels of the display device.
また実施の形態に係る表示装置の製造方法は、表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液を用意し、表面から入射する光を裏面の外に透過させない遮光領域、及び表面から入射する光を透過させ、透過した光によって集積して付着した発光素子の材料が表示装置の画素の二次元的な配置と同一の配置となる透過領域を有する表示装置製造用治具の裏面を材料分散液に接触させ、表示装置製造用治具の表面から光を照射し、透過した光によって透過領域を中心として集積した発光素子の材料を裏面に付着させる製造方法を含んでいる。 Further, in the manufacturing method of the display device according to the embodiment, a material dispersion liquid in which a material forming at least the light emitting layer of the light emitting element arranged corresponding to the pixel of the display device is dispersed is prepared, and light incident from the surface is dispersed. A light-shielding region that does not transmit to the outside of the back surface, and a light-emitting element material that transmits light incident from the front surface and is integrated and adhered by the transmitted light. The back surface of a jig for manufacturing a display device having a region is brought into contact with the material dispersion liquid, light is irradiated from the surface of the jig for manufacturing a display device, and the material of the light-emitting elements integrated around the transmission region is deposited on the back surface by the transmitted light. It includes a manufacturing method for adhering to.
さらに実施の形態の表示装置は、上述の表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を用いて製造された表示装置の少なくとも一方である。 Furthermore, the display device of the embodiment is at least one of a display device manufactured using the above-described display device manufacturing jig and a display device manufactured using the display device manufacturing method.
この表示装置製造用治具を用いて製造された表示装置、及び表示装置の製造方法を用いて製造された表示装置の少なくとも一方は、透過領域が表示装置の画素に対応して設けられ、この透過領域を中心とした周囲に発光素子の材料を集積させるので、画素に応じた多数の発光素子の材料を一度にアレイ化して回路基板に配置することができる。従って表示装置製造用治具、及び表示装置の製造方法は、発光素子を１つずつ配置する場合と比べて、工程が少なく、また発光素子の位置ずれを抑制するので、製造コストを抑制することができる。 At least one of the display device manufactured using this display device manufacturing jig and the display device manufactured using the display device manufacturing method is provided with a transmissive region corresponding to a pixel of the display device. Since the light-emitting element materials are integrated around the transmissive region, a large number of light-emitting element materials corresponding to pixels can be arrayed at once and arranged on the circuit board. Therefore, the jig for manufacturing the display device and the method for manufacturing the display device require fewer steps than the case of arranging the light emitting elements one by one, and the misalignment of the light emitting elements is suppressed, so that the manufacturing cost can be suppressed. can be done.
[実施の形態]
（表示装置製造用治具１の概要）
図１Ａは、実施の形態に係る表示装置を示す説明図であり、図１Ｂは、実施の形態に係る表示装置における表示画像を形成する画素の一部を拡大した説明図であり、図１Ｃは、実施の形態に係る表示装置におけるマイクロＬＥＤを示す断面図である。図２Ａは、実施の形態に係る表示装置製造用治具を示す説明図であり、図２Ｂは、実施の形態に係る表示装置製造用治具の断面図であり、図２Ｃは、表示装置製造用治具の変形例に係る貫通孔を示す説明図である。図３Ａ～図４Ｇは、実施の形態に係る表示装置の製造工程を示す図である。 [Embodiment]
(Overview of jig 1 for manufacturing display device)
FIG. 1A is an explanatory diagram showing a display device according to an embodiment, FIG. 1B is an explanatory diagram enlarging a part of pixels forming a display image in the display device according to an embodiment, and FIG. 3 is a cross-sectional view showing a micro LED in the display device according to the embodiment; FIG. 2A is an explanatory view showing a jig for manufacturing a display device according to an embodiment, FIG. 2B is a cross-sectional view of the jig for manufacturing a display device according to an embodiment, and FIG. FIG. 11 is an explanatory diagram showing a through-hole according to a modified example of the jig. 3A to 4G are diagrams showing manufacturing steps of the display device according to the embodiment.
なお以下に記載する実施の形態に係る各図において、図形間の比率や形状は、実際の比率や形状とは異なる場合がある。また数値範囲を示す「Ａ～Ｂ」は、Ａ以上Ｂ以下の意味で用いるものとする。 Note that the ratios and shapes between figures in the drawings according to the embodiments described below may differ from the actual ratios and shapes. Also, "A to B" indicating a numerical range is used in the sense of A or more and B or less.
表示装置９の製造方法は、微細孔の加工を施した表示装置製造用治具１に、微小サイズの自発光構造体２２（ＬＥＤや量子ドット）を以下に示す方法によって形成すると共に、自発光構造体２２に回路基板５への接着用の金属層４などを加工した後、回路基板５に転写する方法である。 The manufacturing method of the display device 9 is to form micro-sized self-luminous structures 22 (LEDs or quantum dots) on the display device manufacturing jig 1 processed with fine holes by the method described below, and In this method, the structure 22 is transferred to the circuit board 5 after the metal layer 4 for bonding to the circuit board 5 is processed.
本実施の形態の表示装置製造用治具１は、微細孔として後述する貫通孔１４が形成される。そして表示装置製造用治具１は、後述するレーザ光３の波長の光を透過させない材質で形成、又は透過させない材質で塗装される。貫通孔１４は、発光素子としてのマイクロＬＥＤ７が配置されるピッチＰに相当する間隔を開けて形成される。また貫通孔１４の大きさは、マイクロＬＥＤ７の大きさより僅かに小さい程度の大きさを有している。以下では、より具体的に表示装置製造用治具１、及びこの表示装置製造用治具１を用いた表示装置９の製造方法について説明する。なお表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、以下に示す表示装置９に限定されず、一例として、特定の画像のみを表示する表示器、及び照明用のライトやバックライトなどの光を発する発光装置などであっても良い。 In the display device manufacturing jig 1 of the present embodiment, a through hole 14, which will be described later, is formed as a fine hole. The display device manufacturing jig 1 is made of a material that does not transmit the light of the wavelength of the laser beam 3 described later, or is coated with a material that does not transmit the light. The through holes 14 are formed at intervals corresponding to the pitch P at which the micro LEDs 7 as light emitting elements are arranged. Also, the size of the through hole 14 is slightly smaller than the size of the micro LED 7 . Below, the display device manufacturing jig 1 and the method of manufacturing the display device 9 using the display device manufacturing jig 1 will be described more specifically. Note that the display device 9 manufactured using the display device manufacturing jig 1 and the display device 9 manufactured using the manufacturing method of the display device 9 are not limited to the display device 9 shown below. It may be a display that displays only a specific image, or a light-emitting device that emits light such as an illumination light or a backlight.
表示装置９は、マイクロＬＥＤディスプレイである。マイクロＬＥＤディスプレイは、図１Ａ～図１Ｃに示すように、表示画像９０を形成する複数の画素９１としてマイクロＬＥＤ７が配置されたディスプレイである。 The display device 9 is a micro LED display. A micro LED display is a display in which micro LEDs 7 are arranged as a plurality of pixels 91 forming a display image 90, as shown in FIGS. 1A-1C.
表示装置９は、一例として、解像度が１９２０×１０８０である場合、１色に付き約２００万個のマイクロＬＥＤ７が必要となる。なお表示装置９がカラー表示のためにＲＧＢの三色で配置される場合、約６００万個のマイクロＬＥＤ７を正確なピッチで並べる必要がある。本実施の形態の表示装置９は、マイクロＬＥＤ７を１つずつ配置するのではなく、以下の表示装置製造用治具１を用いてアレイ状のマイクロＬＥＤ７を配置することを可能としている。 For the display device 9, for example, if the resolution is 1920×1080, approximately 2 million micro LEDs 7 are required for each color. When the display device 9 is arranged in three colors of RGB for color display, it is necessary to arrange approximately 6 million micro LEDs 7 at an accurate pitch. In the display device 9 of the present embodiment, instead of arranging the micro LEDs 7 one by one, it is possible to arrange the micro LEDs 7 in an array using a display device manufacturing jig 1 described below.
表示装置製造用治具１は、図２Ａ及び図２Ｂに示すように、表示装置９の画素９１に対応して配置されるマイクロＬＥＤ７の少なくとも発光層を形成する材料が分散した後述する材料分散液２０に、裏面１２が接触するように配置される基部１０と、基部１０に設けられ、基部１０の表面１１から入射する光を裏面１２の外に透過させない遮光領域１３と、基部１０に設けられ、表面１１から入射する光を透過させ、透過した光によって集積して付着したマイクロＬＥＤ７の材料が表示装置９の画素９１の二次元的な配置と同一の配置となる透過領域と、を有する。 As shown in FIGS. 2A and 2B, the display device manufacturing jig 1 is a material dispersion liquid described later in which a material forming at least the light emitting layer of the micro LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed. 20, the base 10 is arranged so that the back surface 12 is in contact with the base 10; and a transmissive region in which light incident from the surface 11 is transmitted, and the material of the micro LEDs 7 integrated and adhered by the transmitted light has the same arrangement as the two-dimensional arrangement of the pixels 91 of the display device 9 .
本実施の形態の透過領域は、図２Ａ及び図２Ｂに示すように、表面１１から入射する光を透過させるように表面１１から裏面１２に貫通し、吹き付けられた気体８により付着したマイクロＬＥＤ７の材料を剥離させるように基部１０に設けられた複数の貫通孔１４である。 As shown in FIGS. 2A and 2B, the transmissive region of the present embodiment penetrates from the front surface 11 to the back surface 12 so as to transmit the light incident from the front surface 11, and adheres to the micro LED 7 by the blown gas 8. A plurality of through holes 14 provided in the base 10 for material release.
なお変形例として、表示装置製造用治具１は、透過領域が貫通孔１４ではない場合、一例として、基部１０が透明な材料で形成され、その表面１１及び裏面１２の少なくとも一方に光を透過させない塗装が行われ、対応する領域をレーザなどで剥離されて透過領域が形成される。また同様に表示装置製造用治具１は、透過領域が貫通孔１４ではない場合、一例として、基部１０が透明な材料で形成され、その表面１１及び裏面１２の少なくとも一方に光を透過させない塗料で印刷が行われ、また対応する領域が印刷されないことにより透過領域が形成される。 As a modification, in the display device manufacturing jig 1, when the transmissive region is not the through hole 14, as an example, the base 10 is formed of a transparent material, and at least one of the front surface 11 and the back surface 12 thereof transmits light. A non-transmissive coating is applied, and the corresponding area is peeled off with a laser or the like to form a transmissive area. Similarly, in the display device manufacturing jig 1, when the transmission region is not the through hole 14, as an example, the base 10 is formed of a transparent material, and at least one of the front surface 11 and the back surface 12 is coated with a coating that does not transmit light. , and corresponding areas are not printed to form transmissive areas.
また集積するマイクロＬＥＤ７の少なくとも発光層を形成する材料は、一例として、図１Ｃに示す自発光構造体２２である。また表面１１から入射する光は、図３Ｃ及び図３Ｄに示すレーザ光３である。 The material forming at least the light-emitting layer of the integrated micro LEDs 7 is, for example, the self-light-emitting structure 22 shown in FIG. 1C. Also, the light incident from the surface 11 is the laser light 3 shown in FIGS. 3C and 3D.
（表示装置製造用治具１の構成）
表示装置製造用治具１は、図２Ａ及び図２Ｂに示すように、基部１０が板形状を有している。この基部１０は、平面度が高く、反りが生じ難い材料を用いて形成される。基部１０は、一例として、ポリカーボネートなどの樹脂材料やステンレスなどの金属材料、又はガラスを用いて形成される。 (Structure of jig 1 for manufacturing display device)
As shown in FIGS. 2A and 2B, the display device manufacturing jig 1 has a plate-shaped base portion 10 . The base 10 is formed using a material that has high flatness and is less likely to warp. The base 10 is formed using, for example, a resin material such as polycarbonate, a metal material such as stainless steel, or glass.
基部１０は、一例として、図２Ｂに示す厚みＨが５ｎｍ程度であるがこれに限定されない。また基部１０は、表面１１の大きさが任意であるが照射するレーザ光３の径よりも大きくされる。また基部１０は、遮光性を有する材料で形成されても良いし、遮光性を有する材料を含有して形成されても良いし、表面１１及び裏面１２の少なくとも一方に遮光性の塗料などで遮光膜が形成されても良い。本実施の形態の基部１０は、一例として、レーザ光３を透過させない材料で形成されている。従って貫通孔１４以外の基部１０は、遮光領域１３である。 As an example, the thickness H of the base 10 shown in FIG. 2B is about 5 nm, but the thickness H is not limited to this. The size of the surface 11 of the base 10 is arbitrary, but it is made larger than the diameter of the laser beam 3 to be irradiated. The base portion 10 may be formed of a light-shielding material, or may be formed by containing a light-shielding material. A membrane may be formed. The base 10 of the present embodiment is made of, for example, a material that does not transmit the laser beam 3 . Therefore, the base portion 10 other than the through holes 14 is the light shielding region 13 .
貫通孔１４は、上述のように、表示装置９の画素９１の配置、つまりマイクロＬＥＤ７の配置に応じて基部１０に設けられている。本実施の形態の貫通孔１４は、一例として、直径が２０μｍであるがこれに限定されない。 The through holes 14 are provided in the base 10 according to the arrangement of the pixels 91 of the display device 9, that is, the arrangement of the micro LEDs 7, as described above. The through-hole 14 of the present embodiment has a diameter of 20 μm as an example, but is not limited to this.
この貫通孔１４は、図２Ａに点線の円で示すように、集積したマイクロＬＥＤ７の材料よりも小さい孔として構成されている。貫通孔１４は、図２Ａ及び図２Ｂに示すように、上面と底面とが同じ円形状となる円柱状に基部１０を除去して形成されている。なお貫通孔１４の形状は、これに限定されず、矩形状、三角形状、星形状、これら以外の多角形状などであっても良い。 This through-hole 14 is configured as a hole smaller than the material of the integrated micro-LED 7, as indicated by the dashed circle in FIG. 2A. As shown in FIGS. 2A and 2B, the through-hole 14 is formed in a columnar shape having the same circular top surface and bottom surface by removing the base portion 10 . The shape of the through-hole 14 is not limited to this, and may be a rectangular shape, a triangular shape, a star shape, a polygonal shape other than these, or the like.
ここで変形例として貫通孔１４は、図２Ｃに示すように、さらに複数の微小透過領域としての微小貫通孔１４０の集合体として形成されても良い。図２Ｃにおいて点線で示す貫通孔１４は、複数の微小貫通孔１４０の集合体として形成されていることを意味している。この微小貫通孔１４０は、一例として、１～１０μｍの直径を有する孔である。 Here, as a modification, the through hole 14 may be formed as an assembly of micro through holes 140 as a plurality of micro transmissive regions, as shown in FIG. 2C. The through-holes 14 indicated by dotted lines in FIG. 2C are formed as aggregates of a plurality of fine through-holes 140 . The minute through-holes 140 are, for example, holes having a diameter of 1 to 10 μm.
貫通孔１４のピッチＰは、図２Ａに示すように、縦方向と横方向で同じピッチである。また貫通孔１４の数は、表示装置９の解像度に依存している。本実施の形態のピッチＰは、一例として、６０～２５０μｍである。なおピッチＰは、誤差が数μｍ以下にすることが好ましい。 The pitch P of the through-holes 14 is the same in the vertical and horizontal directions, as shown in FIG. 2A. Also, the number of through-holes 14 depends on the resolution of the display device 9 . The pitch P in this embodiment is, for example, 60 to 250 μm. It is preferable that the pitch P has an error of several μm or less.
貫通孔１４は、図２Ａに一点鎖線で示すように、直線上に中心が位置するように形成され、中心間の距離のズレが小さく、誤差が数μｍ以下になることが好ましい。 It is preferable that the through-holes 14 are formed so that the centers are positioned on a straight line as indicated by the dashed line in FIG. 2A, and that the deviation in the distance between the centers is small and the error is several μm or less.
この貫通孔１４は、後述するように、マイクロＬＥＤ７が形成され、回路基板５の電極パッド６に押し付けられた後、表面１１側から吹き付けられた気体８が流れることで裏面１２からのマイクロＬＥＤ７の剥離を促進する。 As will be described later, the micro LEDs 7 are formed in the through holes 14 . After the micro LEDs 7 are formed and pressed against the electrode pads 6 of the circuit board 5 , the gas 8 blown from the front surface 11 side flows and the micro LEDs 7 are emitted from the back surface 12 . Promotes exfoliation.
（材料分散液２０の構成）
材料分散液２０は、集積させるマイクロＬＥＤ７の材料がコロイド粒子状の量子ドット２１として容器２の中で分散した溶液である。この量子ドット２１は、一例として、直径が２～１０ｎｍの半導体である。本実施の形態では、量子ドット２１がレーザ光３の照射によって集積固化する現象を利用して自発光構造体２２を表示装置製造用治具１の裏面１２に集積させると共に付着させる。 (Structure of Material Dispersion Liquid 20)
The material dispersion liquid 20 is a solution in which the material of the micro LEDs 7 to be integrated is dispersed in the container 2 as colloidal particle-like quantum dots 21 . This quantum dot 21 is, for example, a semiconductor with a diameter of 2 to 10 nm. In the present embodiment, self-luminous structures 22 are integrated and adhered to back surface 12 of jig 1 for manufacturing a display device by utilizing the phenomenon that quantum dots 21 are integrated and solidified by irradiation with laser light 3 .
（レーザ光３の構成）
レーザ光３は、集積化する量子ドット２１に応じて波長などが定められる。レーザ光３は、一例として、表示装置製造用治具１の全体を照射する広がりを持ったものであっても良いし、部分的に照射するものであっても良い。 (Configuration of laser light 3)
The wavelength of the laser light 3 is determined according to the quantum dots 21 to be integrated. As an example, the laser beam 3 may have a spread that irradiates the entire jig 1 for manufacturing a display device, or may irradiate a part thereof.
（金属層４の構成）
金属層４は、一例として、ニッケルや金などの導電性の金属材料を蒸着法などによって形成したものである。この金属層４は、表示装置製造用治具１と回路基板５とを押し付けて加圧した際に回路基板５の電極パッド６と圧接する。なお本実施の形態では、回路基板５に表示装置製造用治具１を押し当てるがこれに限定されず、互いに押し付けあっても良いし、表示装置製造用治具１に回路基板５を押し付けても良い。 (Structure of metal layer 4)
The metal layer 4 is, for example, formed by vapor deposition of a conductive metal material such as nickel or gold. The metal layer 4 is brought into pressure contact with the electrode pads 6 of the circuit board 5 when the display device manufacturing jig 1 and the circuit board 5 are pressed together. In the present embodiment, the display device manufacturing jig 1 is pressed against the circuit board 5, but the present invention is not limited to this. Also good.
（回路基板５の構成）
回路基板５は、表面５０に電極パッド６や配線などが形成されたリジット基板である。この回路基板５は、一例として、マイクロＬＥＤ７の駆動を制御するための制御素子などが配置されている。 (Configuration of circuit board 5)
The circuit board 5 is a rigid board on which the electrode pads 6 and wiring are formed on the surface 50 . As an example, the circuit board 5 is provided with control elements for controlling the driving of the micro LEDs 7 and the like.
（電極パッド６の構成）
電極パッド６は、マイクロＬＥＤ７に応じて回路基板５に形成されている。電極パッド６は、一例として、ハンダなどの導電性材料のペースト、又はアルミニウム、銅や金などの導電性金属材料を用いて形成されている。この電極パッド６は、一例として、パッド状の電極である。 (Structure of electrode pad 6)
Electrode pads 6 are formed on the circuit board 5 according to the micro LEDs 7 . The electrode pads 6 are formed, for example, using paste of a conductive material such as solder, or a conductive metal material such as aluminum, copper, or gold. The electrode pad 6 is, for example, a pad-shaped electrode.
（マイクロＬＥＤ７の構成）
マイクロＬＥＤ７は、一例として、図１Ｃに示すように、金属層４と、自発光構造体２２と、を有する。 (Configuration of micro LED 7)
As an example, the micro LED 7 has a metal layer 4 and a self-luminous structure 22, as shown in FIG. 1C.
自発光構造体２２は、量子ドット２１によって少なくとも発光層を形成するように構成されている。本実施の形態の自発光構造体２２は、一例として、Ｐ型半導体と、Ｎ型半導体と、Ｐ型半導体とＮ型半導体で挟まれた発光層と、を備えている。 The self-luminous structure 22 is configured such that the quantum dots 21 form at least a light-emitting layer. As an example, the self-luminous structure 22 of the present embodiment includes a P-type semiconductor, an N-type semiconductor, and a light-emitting layer sandwiched between the P-type semiconductor and the N-type semiconductor.
（気体８について）
気体８は、一例として、空気であるがこれに限定されず、マイクロＬＥＤ７などに影響を与えない希ガスなどの不活性ガスでも良い。 (Regarding gas 8)
The gas 8 is, for example, air, but is not limited to this, and may be an inert gas such as a rare gas that does not affect the micro LED 7 or the like.
（表示装置９の製造方法の概要）
表示装置９の製造方法は、図３Ａ～図３Ｅに示すように、表示装置９の画素９１に対応して配置されるマイクロＬＥＤ７の少なくとも発光層を形成する材料が分散した材料分散液２０を用意し、表面１１から入射するレーザ光３を裏面１２の外に透過させない遮光領域１３、及び表面１１から入射する光を透過させ、透過したレーザ光３によって集積して付着したマイクロＬＥＤ７の材料が表示装置９の画素９１の二次元的な配置と同一の配置となる透過領域を有する表示装置製造用治具１の裏面１２を材料分散液２０に接触させ、表示装置製造用治具１の表面１１からレーザ光３を照射し、透過したレーザ光３によって集積したマイクロＬＥＤ７の材料を裏面１２に付着させる製造方法を含んでいる。 (Outline of manufacturing method of display device 9)
As shown in FIGS. 3A to 3E, the method of manufacturing the display device 9 prepares a material dispersion liquid 20 in which a material forming at least the light emitting layer of the micro LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed. Then, a light shielding region 13 that does not transmit the laser light 3 incident from the front surface 11 to the outside of the back surface 12, and a material of the micro LED 7 that transmits the light incident from the front surface 11 and is accumulated and adhered by the transmitted laser light 3 is displayed. The rear surface 12 of the display device manufacturing jig 1 having a transmission region having the same arrangement as the two-dimensional arrangement of the pixels 91 of the device 9 is brought into contact with the material dispersion liquid 20, and the front surface 11 of the display device manufacturing jig 1 A manufacturing method is included in which the laser light 3 is irradiated from the laser light 3 and the material of the integrated micro LEDs 7 is adhered to the rear surface 12 by the transmitted laser light 3 .
本実施の形態の透過領域は、上述のように、表面１１から入射するレーザ光３を透過させるように表面１１から裏面１２に貫通した複数の貫通孔１４である。 As described above, the transmission region of the present embodiment is a plurality of through holes 14 penetrating from the surface 11 to the back surface 12 so as to transmit the laser beam 3 incident from the surface 11 .
なお透過領域が塗装や遮光領域１３の除去などによって形成されている場合、次の製造方法において気体８を吹き付けずに集積したマイクロＬＥＤ７の材料の剥離を行う。 If the transmissive area is formed by painting or removing the light shielding area 13, the material of the integrated micro LEDs 7 is peeled off without blowing the gas 8 in the next manufacturing method.
また表示装置９の製造方法は、さらに表示装置製造用治具１の裏面１２に導電性の金属層４を形成し、付着したマイクロＬＥＤ７の材料の上に金属層４を形成し、表示装置９の画素９１の位置に導電性の金属領域としての電極パッド６を有する回路基板５を用意し、表示装置製造用治具１と回路基板５とに圧力を付加、更に必要に応じて加熱してマイクロＬＥＤ７の材料の金属層４と電極パッド６とを接着させ、表示装置製造用治具１の表面１１に気体８を吹き付けて付着していたマイクロＬＥＤ７の材料を裏面１２から剥離させる製造方法を含んでいる。続いて以下では、表示装置９の具体的な製造方法の一例として説明する。 Further, the method for manufacturing the display device 9 further comprises forming a conductive metal layer 4 on the back surface 12 of the jig for manufacturing the display device 1, forming the metal layer 4 on the attached material of the micro LEDs 7, A circuit board 5 having an electrode pad 6 as a conductive metal region is prepared at the position of the pixel 91, pressure is applied to the display device manufacturing jig 1 and the circuit board 5, and if necessary, heating is performed. A manufacturing method in which the metal layer 4 of the material of the micro LED 7 and the electrode pad 6 are adhered to each other, and the material of the micro LED 7 adhered to the back surface 12 is separated from the back surface 12 by blowing the gas 8 onto the surface 11 of the jig 1 for manufacturing the display device. contains. Subsequently, an example of a specific manufacturing method of the display device 9 will be described below.
（表示装置９の製造方法）
図３Ａに示すように、マイクロＬＥＤ７の少なくとも発光層を形成する材料が分散した材料分散液２０を用意する。この材料分散液２０には、上述のように、コロイド粒子状となった量子ドット２１が分散している。 (Manufacturing method of display device 9)
As shown in FIG. 3A, a material dispersion liquid 20 in which a material forming at least the light emitting layer of the micro LED 7 is dispersed is prepared. Quantum dots 21 in the form of colloidal particles are dispersed in this material dispersion liquid 20 as described above.
次に図３Ｂに示すように、表示装置製造用治具１の裏面１２を材料分散液２０に接触させる。 Next, as shown in FIG. 3B, the rear surface 12 of the display device manufacturing jig 1 is brought into contact with the material dispersion liquid 20 .
次に図３Ｃに示すように、表示装置製造用治具１の表面１１からレーザ光３を照射する。レーザ光３は、遮光領域１３は透過せず、透過領域である貫通孔１４を透過して材料分散液２０に到達する。 Next, as shown in FIG. 3C, the surface 11 of the display device manufacturing jig 1 is irradiated with laser light 3 . The laser light 3 does not pass through the light shielding region 13 , but passes through the through hole 14 which is a transmission region to reach the material dispersion liquid 20 .
次に図３Ｄに示すように、透過したレーザ光３によって集積したマイクロＬＥＤ７の材料である自発光構造体２２を裏面１２に付着させる。この自発光構造体２２は、図２Ｂの上面視において点線で示すように、上面の形状が貫通孔１４を中心として貫通孔１４より少し大きい形状となる。 Next, as shown in FIG. 3D, the self-luminous structure 22, which is the material of the micro LEDs 7 integrated by the transmitted laser light 3, is attached to the back surface 12. As shown in FIG. The self-luminous structure 22 has an upper surface shape centered on the through hole 14 and slightly larger than the through hole 14, as indicated by the dotted line in the top view of FIG. 2B.
次に図３Ｅに示すように、レーザ光３の照射が終了した後、表示装置製造用治具１を材料分散液２０から取り出す。 Next, as shown in FIG. 3E, after the irradiation of the laser beam 3 is completed, the display device manufacturing jig 1 is taken out from the material dispersion liquid 20. Next, as shown in FIG.
次に図３Ｆに示すように、表示装置製造用治具１の裏面１２に導電性の金属層４を形成し、付着したマイクロＬＥＤ７の材料の上に金属層４を形成する。この金属層４は、蒸着法によって形成される。金属層４は、表示装置製造用治具１の裏面１２と自発光構造体２２に形成される。 Next, as shown in FIG. 3F, a conductive metal layer 4 is formed on the rear surface 12 of the jig 1 for manufacturing a display device, and the metal layer 4 is formed on the adhered material of the micro LEDs 7 . This metal layer 4 is formed by vapor deposition. The metal layer 4 is formed on the rear surface 12 and the self-luminous structure 22 of the display device manufacturing jig 1 .
次に図４Ａに示すように、表示装置９の画素９１の位置に電極パッド６を有する回路基板５を用意する。表示装置製造用治具１は、貫通孔１４の位置が電極パッド６の位置と一致するように回路基板５との位置合わせが精密に行われる。 Next, as shown in FIG. 4A, the circuit board 5 having the electrode pads 6 at the positions of the pixels 91 of the display device 9 is prepared. The display device manufacturing jig 1 is precisely aligned with the circuit board 5 so that the positions of the through holes 14 are aligned with the positions of the electrode pads 6 .
次に図４Ｂに示すように、表示装置製造用治具１の自発光構造体２２に形成された金属層４と回路基板５の電極パッド６とを接触させる。 Next, as shown in FIG. 4B, the metal layer 4 formed on the self-luminous structure 22 of the display manufacturing jig 1 and the electrode pads 6 of the circuit board 5 are brought into contact with each other.
次に図４Ｃに示すように、表示装置製造用治具１と回路基板５とに加熱しながら圧力を付加して自発光構造体２２の金属層４と電極パッド６とを接着する。なお本実施の形態では、金属層４と電極パッド６との接着は、圧着であるがこれに限定されず、導電性接着剤などを介して行われても良い。 Next, as shown in FIG. 4C, the metal layer 4 of the self-luminous structure 22 and the electrode pad 6 are adhered by applying pressure while heating the display device manufacturing jig 1 and the circuit board 5 . In this embodiment, the bonding between the metal layer 4 and the electrode pad 6 is by pressure bonding, but is not limited to this, and may be performed via a conductive adhesive or the like.
次に図４Ｄに示すように、表示装置製造用治具１の表面１１に気体８を吹き付ける。この気体８は、表面１１の全体に吹き付けられる。気体８の吹き付けにより、表示装置製造用治具１からの金属層４を有する自発光構造体２２、つまりマイクロＬＥＤ７の剥離が容易となる。この剥離の際、表示装置製造用治具１の裏面１２に形成された金属層４は、そのまま残される。 Next, as shown in FIG. 4D, gas 8 is blown onto the surface 11 of the jig 1 for manufacturing display devices. This gas 8 is blown over the entire surface 11 . By blowing the gas 8, the self-luminous structure 22 having the metal layer 4, that is, the micro LED 7 can be easily peeled from the jig 1 for manufacturing the display device. At the time of this peeling, the metal layer 4 formed on the rear surface 12 of the display device manufacturing jig 1 is left as it is.
次に図４Ｅに示すように、付着していたマイクロＬＥＤ７の材料を裏面１２から剥離させる。マイクロＬＥＤ７は、表示装置製造用治具１から離れ、回路基板５の電極パッド６と一体となる。 Next, as shown in FIG. 4E, the adhered material of the micro LED 7 is removed from the rear surface 12. Next, as shown in FIG. The micro LED 7 is separated from the display device manufacturing jig 1 and integrated with the electrode pad 6 of the circuit board 5 .
次に図４Ｆに示すように、マイクロＬＥＤ７が表示装置製造用治具１から剥離した後、気体８の吹き付けを終了する。 Next, as shown in FIG. 4F, after the micro LED 7 is separated from the jig 1 for manufacturing the display device, the blowing of the gas 8 is finished.
次に図４Ｇに示すように、表示装置製造用治具１を回路基板５から離し、次の加工処理を行う。次の加工処理は、一例として、必要に応じて、マイクロＬＥＤ７と他の電極パッドとの接続やカラーフィルタの配置などである。 Next, as shown in FIG. 4G, the display device manufacturing jig 1 is separated from the circuit board 5, and the next processing is performed. The next processing is, for example, connecting the micro LED 7 to other electrode pads, arranging color filters, etc., as required.
なお変形例として、表示装置９の製造方法は、必要に応じて表示装置製造用治具１や材料分散液２０の種類を変える製造方法を含んでいても良い。例えば、ＲＧＢごとにマイクロＬＥＤ７を作り分ける場合、表示装置９は、ＲＧＢごとに表示装置製造用治具１と材料分散液２０とを用意して作り分ける製造方法を含んで製造される。 As a modification, the manufacturing method of the display device 9 may include a manufacturing method of changing the types of the display device manufacturing jig 1 and the material dispersion liquid 20 as necessary. For example, when the micro LEDs 7 are separately produced for each of RGB, the display device 9 is manufactured including a production method of preparing and separately producing the display device manufacturing jig 1 and the material dispersion liquid 20 for each of RGB.
（実施の形態の効果）
本実施の形態に係る表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、製造コストを抑制することができる。具体的には、表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、透過領域としての貫通孔１４が表示装置９の画素９１に対応して表示装置製造用治具１に設けられ、この貫通孔１４を中心とした周囲に量子ドット２１を集積させてマイクロＬＥＤ７の自発光構造体２２を形成するので、画素に応じた多数のマイクロＬＥＤ７を一度にアレイ化して回路基板５に配置することができる。従って表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、発光素子を１つずつ配置する場合と比べて、工程が少なく、またマイクロＬＥＤ７の位置ずれを抑制するので、製造コストを抑制することができる。 (Effect of Embodiment)
Display device manufacturing jig 1 according to the present embodiment, method for manufacturing display device 9, display device 9 manufactured using display device manufacturing jig 1, and display device manufactured using display device 9 manufacturing method The display device 9 can suppress the manufacturing cost. Specifically, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device manufactured using the manufacturing method of the display device 9 In the display device 9, through holes 14 as transmissive regions are provided in the display device manufacturing jig 1 corresponding to the pixels 91 of the display device 9, and the quantum dots 21 are integrated around the through holes 14. Since the self-luminous structure 22 of the micro LEDs 7 is formed by using the micro LEDs 7 , a large number of the micro LEDs 7 corresponding to the pixels can be arrayed at once and arranged on the circuit board 5 . Therefore, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 are As compared with the case of arranging the light emitting elements one by one, the number of processes is reduced, and misalignment of the micro LEDs 7 is suppressed, so that the manufacturing cost can be suppressed.
表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、表示装置９の画素９１に応じて表示装置製造用治具１に貫通孔１４が設けられているので、発光素子を１つずつ配置する場合と比べて、必要なマイクロＬＥＤ７を必要な位置に任意のオーダーでアレイ状に製造することができる。 The display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9, Since the through-holes 14 are provided in the display device manufacturing jig 1 according to the pixels 91 of the display device 9, the necessary micro LEDs 7 can be placed at desired positions as compared to the case where the light emitting elements are arranged one by one. can be manufactured in an array on the order of
表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、貫通孔１４に気体８を吹き付けてアレイ状のマイクロＬＥＤ７を回路基板５に移し替える転写作業を簡便化することができるので、この構成を採用しない場合と比べて、マイクロＬＥＤディスプレイである表示装置９を簡単に製造することができる。従って表示装置製造用治具１、表示装置９の製造方法、表示装置製造用治具１を用いて製造された表示装置９、及び表示装置９の製造方法を用いて製造された表示装置９は、マイクロＬＥＤディスプレイを非力で簡便な設備で作製することができると共に、設備投資費用を抑制することができる。 The display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9, Since it is possible to simplify the transfer operation for transferring the arrayed micro LEDs 7 to the circuit board 5 by blowing the gas 8 into the through holes 14, the display device 9, which is a micro LED display, can be compared with the case where this configuration is not adopted. can be easily manufactured. Therefore, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 are , the micro LED display can be manufactured with powerless and simple equipment, and equipment investment costs can be suppressed.
以上、本発明のいくつかの実施の形態及び変形例を説明したが、これらの実施の形態及び変形例は、一例に過ぎず、請求の範囲に係る発明を限定するものではない。これら新規な実施の形態及び変形例は、その他の様々な形態で実施されることが可能であり、本発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更などを行うことができる。また、これら実施の形態及び変形例の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない。さらに、これら実施の形態及び変形例は、発明の範囲及び要旨に含まれると共に、請求の範囲に記載された発明とその均等の範囲に含まれる。 Although several embodiments and modifications of the present invention have been described above, these embodiments and modifications are merely examples and do not limit the scope of the invention according to the claims. These novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, etc. can be made without departing from the scope of the present invention. Moreover, not all the combinations of features described in these embodiments and modifications are essential to the means for solving the problems of the invention. Furthermore, these embodiments and modifications are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.
１ 表示装置製造用治具
４ 金属層
５ 回路基板
８ 気体
９ 表示装置
１０ 基部
１１ 表面
１２ 裏面
１３ 遮光領域
１４ 貫通孔
２０ 材料分散液
９１ 画素
１４０ 微小貫通孔 1 jig for manufacturing display device 4 metal layer 5 circuit board 8 gas 9 display device 10 base 11 front surface 12 back surface 13 light shielding region 14 through hole 20 material dispersion liquid 91 pixel 140 minute through hole

Claims (10)

  1. 表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液に、裏面が接触するように配置される基部と、
    前記基部に設けられ、前記基部の表面から入射する光を前記裏面の外に透過させない遮光領域と、
    前記基部に設けられ、前記表面から入射する光を透過させ、透過した光によって集積して付着した前記発光素子の材料が前記表示装置の前記画素の二次元的な配置と同一の配置となる透過領域と、
    を備えた表示装置製造用治具。     a base arranged so that its back surface is in contact with a material dispersion liquid in which a material forming at least a light-emitting layer of a light-emitting element arranged corresponding to a pixel of a display device is dispersed;
    a light-shielding region provided on the base portion that does not transmit light incident from the surface of the base portion to the outside of the back surface;
    Transmissive, which is provided on the base and transmits light incident from the surface, and the materials of the light-emitting elements integrated and adhered by the transmitted light have the same arrangement as the two-dimensional arrangement of the pixels of the display device. area and
    A jig for manufacturing a display device.
  2. 前記透過領域は、集積した前記発光素子の材料よりも小さい領域である、
    請求項１に記載の表示装置製造用治具。     wherein the transmissive area is an area smaller than the material of the integrated light-emitting element;
    A jig for manufacturing a display device according to claim 1 .
  3. 前記透過領域は、さらに複数の微小透過領域の集合体である、
    請求項１又は２に記載の表示装置製造用治具。     The transmissive region is an aggregate of a plurality of micro transmissive regions,
    A jig for manufacturing a display device according to claim 1 or 2.
  4. 前記透過領域は、前記表面から入射する光を透過させるように前記表面から前記裏面に貫通し、吹き付けられた気体により付着した前記発光素子の材料を剥離させるように前記基部に設けられた複数の貫通孔である、
    請求項１乃至３のいずれか１項に記載の表示装置製造用治具。     The transmissive regions are provided on the base so as to penetrate from the front surface to the back surface so as to transmit the light incident from the front surface, and to peel off the material of the light emitting element adhered by the blown gas. is a through hole,
    A jig for manufacturing a display device according to any one of claims 1 to 3.
  5. 表示装置の画素に対応して配置される発光素子の少なくとも発光層を形成する材料が分散した材料分散液を用意し、
    表面から入射する光を裏面の外に透過させない遮光領域、及び前記表面から入射する光を透過させ、透過した光によって集積して付着した前記発光素子の材料が前記表示装置の前記画素の二次元的な配置と同一の配置となる透過領域を有する表示装置製造用治具の前記裏面を前記材料分散液に接触させ、
    前記表示装置製造用治具の前記表面から光を照射し、
    透過した光によって集積した前記発光素子の材料を前記裏面に付着させる、
    表示装置の製造方法。     preparing a material dispersion in which a material forming at least a light-emitting layer of a light-emitting element arranged corresponding to a pixel of a display device is dispersed;
    A light-shielding region that does not transmit light incident from the front surface to the outside of the back surface, and a light-emitting element material that transmits light incident from the front surface and is integrated and adhered by the transmitted light is a two-dimensional pixel of the display device. bringing the back surface of the jig for manufacturing a display device having the same arrangement as the normal arrangement into contact with the material dispersion;
    irradiating light from the surface of the jig for manufacturing a display device;
    Attaching the material of the light emitting element integrated by the transmitted light to the back surface;
    A method for manufacturing a display device.
  6. 前記透過領域は、前記表面から入射する光を透過させるように前記表面から前記裏面に貫通した複数の貫通孔である、
    請求項５に記載の表示装置の製造方法。     The transmissive region is a plurality of through holes penetrating from the front surface to the back surface so as to transmit light incident from the front surface.
    A method of manufacturing a display device according to claim 5 .
  7. 前記透過領域は、前記表示装置製造用治具を透明な材料で形成し、前記表面及び前記裏面の少なくとも一方に光を透過させない塗装を行った後、対応する領域の前記塗装を剥離することにより形成される、又は前記表面及び前記裏面の少なくとも一方に光を透過させない塗料で印刷を行う際に、対応する領域が印刷されないことにより形成される、
    請求項５に記載の表示装置の製造方法。     The transmissive region is formed by forming the jig for manufacturing a display device from a transparent material, coating at least one of the front surface and the back surface with a light impermeable coating, and then removing the coating from the corresponding region. formed, or formed by not printing the corresponding area when printing with a light-impermeable paint on at least one of the front surface and the back surface,
    A method of manufacturing a display device according to claim 5 .
  8. さらに前記表示装置製造用治具の前記裏面に導電性の金属層を形成し、付着した前記発光素子の材料の上に前記金属層を形成し、
    前記表示装置の前記画素の位置に導電性の金属領域を有する回路基板を用意し、
    前記表示装置製造用治具と前記回路基板とに圧力を付加して前記発光素子の材料の前記金属層と前記金属領域とを接着させ、
    前記表示装置製造用治具の前記表面に気体を吹き付けて付着していた前記発光素子の材料を前記裏面から剥離させる、
    請求項６に記載の表示装置の製造方法。     forming a conductive metal layer on the back surface of the jig for manufacturing a display device, forming the metal layer on the attached material of the light emitting element,
    providing a circuit board having conductive metal regions at the pixel locations of the display device;
    applying pressure to the jig for manufacturing a display device and the circuit board to bond the metal layer of the material of the light emitting element and the metal region;
    blowing a gas onto the front surface of the jig for manufacturing a display device to separate the material of the light emitting element attached to the back surface from the back surface;
    7. The method of manufacturing the display device according to claim 6.
  9. 請求項１乃至４のいずれか１項に記載の表示装置製造用治具を用いて製造された表示装置。 A display device manufactured using the jig for manufacturing a display device according to any one of claims 1 to 4.
  10. 請求項５乃至８のいずれか１項に記載の表示装置の製造方法を用いて製造された表示装置。 A display device manufactured using the display device manufacturing method according to any one of claims 5 to 8.
PCT/JP2022/046788 2021-12-28 2022-12-20 Display device manufacturing jig, display device manufacturing method, display device manufactured using display device manufacturing jig, and display device manufactured using display device manufacturing method WO2023127585A1 (en)

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