WO2023125062A1 - 散热器及照明装置 - Google Patents
散热器及照明装置 Download PDFInfo
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- WO2023125062A1 WO2023125062A1 PCT/CN2022/139495 CN2022139495W WO2023125062A1 WO 2023125062 A1 WO2023125062 A1 WO 2023125062A1 CN 2022139495 W CN2022139495 W CN 2022139495W WO 2023125062 A1 WO2023125062 A1 WO 2023125062A1
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- Prior art keywords
- heat dissipation
- substrate
- content
- fins
- heat
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 181
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000009826 distribution Methods 0.000 claims abstract description 21
- 230000014509 gene expression Effects 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 65
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 17
- 239000011777 magnesium Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 230000000052 comparative effect Effects 0.000 description 13
- 238000013461 design Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
Definitions
- the present disclosure relates to the technical field of heat dissipation devices, in particular to a heat sink and a lighting device.
- Heat dissipation and control of junction temperature are one of the most important issues in the design and manufacture of vehicle lighting devices.
- the light decay or lifespan of vehicle lighting devices is directly related to its junction temperature. Poor heat dissipation will directly lead to higher junction temperature and shortened lifespan.
- the shape of vehicle lighting devices is becoming more and more diverse and complex. Radiators with better heat dissipation and smaller volume can make the shape design of vehicle lighting devices more market-leading, and at the same time have higher mileage and promote the process of vehicle lightweighting. .
- the heat sinks in existing vehicle lighting devices cannot meet the increasing performance requirements for heat dissipation thereof.
- the present disclosure provides a radiator and a lighting device.
- the present disclosure provides a heat sink, comprising a first substrate and a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are spaced and arranged on the first substrate along a first preset direction,
- the heat sink satisfies the constraints of the following relational formula 1 and relational formula 2:
- L is the length of the first substrate in the first preset direction, in mm;
- N is the distribution number of the first cooling fins, and N takes a positive integer
- ⁇ 1 is the maximum value of the thickness of the first cooling fin, in mm;
- ⁇ 2 is the minimum value of the thickness of the first cooling fin, in mm;
- ⁇ is the draft angle of the first cooling fin, unit degree
- H is the distribution height of the first cooling fins, in mm.
- the heat sink further includes a second substrate and a plurality of second heat dissipation fins, and a plurality of the first heat dissipation fins are spaced and arranged on the first substrate along the first predetermined direction.
- the second substrate is disposed on the other side surface of the first substrate, and a plurality of second cooling fins are spaced and arranged on one side surface of the second substrate along a second preset direction,
- the heat sink satisfies the constraints of the following relation 3 and relation 4:
- L' is the length of the second substrate in the second preset direction, in mm;
- N' is the distribution number of the second cooling fins, and N' takes a positive integer
- ⁇ 1 ' is the maximum thickness of the second cooling fin, in mm;
- ⁇ 2 ' is the minimum value of the thickness of the second cooling fin, in mm;
- ⁇ ' is the draft angle of the second cooling fin, in degrees
- H' is the distribution height of the second cooling fins, in mm.
- a plurality of first heat dissipation holes and a plurality of second heat dissipation holes are opened on the first substrate, and a single first heat dissipation hole is arranged between two adjacent first heat dissipation fins
- a single second heat dissipation hole is disposed between two adjacent first heat dissipation fins
- a single second heat dissipation hole is disposed between two adjacent second heat dissipation fins.
- the other side surface of the first substrate is sequentially formed with a first heat dissipation area, a heat conduction contact area, and a second heat dissipation area along a direction perpendicular to the first predetermined direction, and the first substrate
- the intersection line with the second substrate is parallel to the first preset direction and the second preset direction, a plurality of the first heat dissipation holes are arranged in the first heat dissipation area, and the heat conduction contact area
- the second substrate is disposed between the heat conduction contact area and the second heat dissipation area, and a plurality of second heat dissipation fins are located on the second substrate away from the heat conduction contact area
- the second heat dissipation fins are connected to the second heat dissipation area, and a plurality of second heat dissipation holes are arranged in the second heat dissipation area.
- a first connecting flap and a second connecting flap are respectively provided on both sides of the second base plate along the second predetermined direction, and a first connecting flap is opened on the first connecting flap.
- Connecting holes the second connecting wing is provided with a second connecting hole
- the two sides of the first heat dissipation area are respectively provided with a first positioning hook and a second positioning hook
- the first positioning hook Both the hook and the second positioning hook are perpendicular to the first substrate
- the first positioning hook is provided with a first slot on the side away from the second substrate
- the second positioning hook is A second card slot is opened on a side away from the second substrate.
- the first connecting flap, the second connecting flap and the second base plate are located on the same plane.
- the first positioning hook and the second positioning hook are used for positioning the front end of the radiator, and the first connecting flap and the second connecting flap are used for the positioning of the front end of the radiator. The positioning and installation of the rear end of the radiator.
- a plurality of positioning posts are arranged on the heat conduction contact area.
- a plurality of thimbles are embedded on the first heat dissipation fin at intervals, the thimbles are perpendicular to the first substrate, and the outer diameter of the thimble is larger than the thickness of the first heat dissipation fin.
- the heat sink is an integral die-cast magnesium alloy piece.
- the magnesium alloy piece includes the following components in mass percentage:
- the content of Al is 1%-5%, the content of Zn is 0-0.2%, the content of Mn is 0-1%, the content of RE is 3%-6%, the content of Mg is 87.7%-96%, other elements
- the total amount is less than 0.1%.
- the magnesium alloy piece includes the following components in mass percentage:
- the content of Al is 1%-5%, the content of Zn is 0-0.2%, the content of Mn is 0-1%, the content of Ce is 0-4.0%, the content of Nd is 0-0.5%, and the content of Mg is 83.2%-96%, the total amount of other elements is less than 0.1%.
- the magnesium alloy piece includes the following components in mass percentage:
- the content of Al is 1%-5%, the content of Zn is 0-0.2%, the content of Mn is 0.8%-1%, the content of Ce is 0.8%-2.5%, the content of Nd is 0-0.5%, and the content of Mg The content is 83.2%-94.4%, and the total amount of other elements is less than 0.1%.
- the present disclosure provides a lighting device, including the heat sink as described above.
- the radiator provided in the present disclosure, since the distribution relationship of the cooling fins on the substrate on the radiator, such as quantity, arrangement interval, height design, etc., have a great influence on the heat dissipation effect of the radiator, therefore, different distribution relationships There is a big difference in the overall heat dissipation effect of the heat sink for the heat sink.
- the inventors of the present disclosure have found through a lot of research that when the length L of the first substrate of the radiator and the weighted average thickness of the first cooling fin
- the distribution number N of the first cooling fins satisfies relational expression 1:
- the designed height H of the first cooling fin, the maximum value of the thickness of the first cooling fin ⁇ 1, the minimum value of the thickness of the first cooling fin ⁇ 2, and the draft angle ⁇ of the first cooling fin satisfy the relation 2: H ⁇ [ ( ⁇ 1 + ⁇ 2 )/2-1.2]/tan2 ⁇ , [( ⁇ 1 + ⁇ 2 )/2+1.2]/tan2 ⁇
- the radiator can obtain the maximum heat dissipation effect, the heat dissipation power can reach more than 60W, and the effective
- the size of the radiator is reduced, the structure is compact, the required occupied space is reduced, and the actual loading requirements are met.
- FIG. 1 is a schematic structural view of a radiator provided by the present disclosure
- FIG. 2 is a schematic diagram of the lower structure of the radiator provided by the present disclosure.
- Fig. 3 is a side view of the radiator provided by the present disclosure.
- Fig. 4 is the enlarged schematic diagram of place A in Fig. 3;
- Fig. 5 is a schematic structural diagram of the lighting device provided by the present disclosure.
- some embodiments of the present disclosure provide a heat sink, including a first substrate 1 and a plurality of first heat dissipation fins 3 . Assuming that the direction is spaced and arranged side by side on the first substrate 1, the heat sink satisfies the constraints of the following relational formula 1 and relational formula 2:
- L is the length of the first substrate in the first predetermined direction, in mm;
- N is the distribution number of the first cooling fins, and N takes a positive integer
- ⁇ 1 is the maximum value of the thickness of the first cooling fin, in mm;
- ⁇ 2 is the minimum value of the thickness of the first cooling fin, in mm;
- ⁇ is the draft angle of the first cooling fin, unit degree
- H is the distribution height of the first cooling fins, in mm.
- the heat dissipation fins with different distribution relations have a great influence on the overall performance of the heat sink. There is a big difference in the cooling effect.
- the distribution number N of the first cooling fins satisfies relational expression 1:
- the designed height H of the first cooling fin, the maximum value of the thickness of the first cooling fin ⁇ 1, the minimum value of the thickness of the first cooling fin ⁇ 2, and the draft angle ⁇ of the first cooling fin satisfy the relation 2: H ⁇ [ ( ⁇ 1 + ⁇ 2 )/2-1.2]/tan2 ⁇ , [( ⁇ 1 + ⁇ 2 )/2+1.2]/tan2 ⁇
- the radiator can obtain the maximum heat dissipation effect, the heat dissipation power can reach more than 60W, and the effective
- the size of the radiator is reduced, the structure is compact, the required occupied space is reduced, and the actual loading requirements are met.
- the shapes of the plurality of first heat dissipation fins 3 may be the same or different, and when there are multiple shapes of the plurality of first heat dissipation fins 3, they should be respectively Satisfy the limitation of the relational expression 2.
- the plurality of first cooling fins 3 on the first substrate 1 have the same shape, so as to facilitate manufacturing.
- the heat sink further includes a second substrate 2 and a plurality of second heat dissipation fins 4, and a plurality of the first heat dissipation fins 3 are arranged along the first The preset direction is spaced and arranged on one side surface of the first substrate 1, and the second substrate 2 is arranged on the other side surface of the first substrate 1.
- the second substrate 2 and the first substrate A substrate 1 is vertical, and a plurality of second heat dissipation fins 4 are spaced and arranged on one side surface of the second substrate 2 along a second predetermined direction, and the heat sink satisfies the constraints of the following relational formula 3 and relational formula 4 :
- L' is the length of the second substrate in the second predetermined direction, in mm;
- N' is the distribution number of the second cooling fins, and N' takes a positive integer
- ⁇ 1 ' is the maximum thickness of the second cooling fin, in mm;
- ⁇ 2 ' is the minimum thickness of the second cooling fin, in mm;
- ⁇ ' is the draft angle of the second cooling fin, unit degree
- H' is the distribution height of the second cooling fins, in mm.
- the first substrate 1 is used for installing a light source
- the second substrate 2 is used for auxiliary heat dissipation of the first substrate 1 .
- the shapes of the plurality of second heat dissipation fins 4 may be the same or different, and when there are multiple shapes of the plurality of second heat dissipation fins 4 , they should respectively satisfy The limitation of the relation 4.
- the plurality of second cooling fins 4 on the second substrate 2 have the same shape, so as to facilitate manufacturing.
- the terms “draft angle ⁇ ” and “draft angle ⁇ '” are the angles designed for easy removal of the workpiece when it is demoulding, specifically as shown in Figure 4, the draft angle ⁇ ' is The inclination angle between the side surface of the second heat dissipation fin and the central axis.
- the first substrate 1 is provided with a plurality of first heat dissipation holes 14 and a plurality of second heat dissipation holes 15, and a single first heat dissipation hole 14 is arranged between two adjacent first heat dissipation holes. Between the fins 3, a single second cooling hole 15 is arranged between two adjacent first cooling fins 3, and a single second cooling hole 15 is arranged between two adjacent second cooling fins 3. Between the cooling fins 4.
- the first heat dissipation holes 14 are used for auxiliary heat dissipation of the first heat dissipation fins 3
- the second heat dissipation holes 15 are used for auxiliary heat dissipation of the first heat dissipation fins 3 and the second heat dissipation fins 4 , in the heat dissipation process of the heat sink, it mainly relies on the direct contact between the first substrate 1 and the light source for heat conduction, and then the first substrate 1, the second substrate 2, the first heat dissipation fins 3 and The heat conduction between the second heat dissipation fins 4 disperses heat, and then through the first substrate 1, the second substrate 2, the first heat dissipation fins 3 and the second heat dissipation fins 4 respectively Contacting the air for heat exchange, during the process of heat exchange between the first heat dissipation fin 3 and the second heat dissipation fin 4, the air around them will be heated, and the heated air has a tendency to rise.
- the first substrate 1 is horizontally placed in the application state, which will block the rising hot air.
- the heat dissipation holes 14 and the second heat dissipation holes 15 on the first substrate 1 By opening the first heat dissipation holes 14 and the second heat dissipation holes 15 on the first substrate 1, the heat dissipation can be reduced.
- the shielding effect of the first substrate 1 on the hot air improves the air flow efficiency, which in turn facilitates the improvement of the heat exchange efficiency.
- the other side surface of the first substrate 1 is sequentially formed with a first heat dissipation area 11 , a heat conduction contact area 12 and a second heat dissipation area 13 along a direction perpendicular to the first preset direction, so The intersection line of the first substrate 1 and the second substrate 2 is parallel to the first predetermined direction and the second predetermined direction, and a plurality of the first heat dissipation holes 14 are arranged on the first heat dissipation area 11, the heat conduction contact area 12 is used to install the light source, the second substrate 2 is arranged between the heat conduction contact area 12 and the second heat dissipation area 13, and a plurality of the second heat dissipation fins 4 are located On the side of the second substrate 2 away from the heat conduction contact area 12, the second heat dissipation fins 4 are connected to the second heat dissipation area 13, and a plurality of second heat dissipation holes 15 are arranged on the second heat dissipation area
- a direction perpendicular to the first preset direction should be interpreted in a broad sense. Substantially the same, can also be understood as “a direction perpendicular to the first preset direction”.
- the heat conduction contact area 12 is used for the installation of the light source on the one hand, and is used for heat conduction between the first heat dissipation area 11, the second heat dissipation area 13 and the second substrate 2 on the other hand. Therefore, The heat conduction contact area 12 should have an area fully in contact with the light source, and at the same time have a larger connection cross section with the first heat dissipation area 11 , the second heat dissipation area 13 and the second substrate 2 .
- the first heat dissipation fins 3 When the radiator is in use, the first heat dissipation fins 3 are vertically arranged, and the hot air after heat exchange through the first heat dissipation fins 3 flows along the side walls of the first heat dissipation fins 3 Rising, through the multiple first heat dissipation holes 14 and the second heat dissipation holes 15 opened in the first heat dissipation area 11 and the second heat dissipation area 13, hot air can be promoted from below the first substrate 1 and The flow between the upper and lower sides, thereby promoting the air convection above the first substrate 1, and improving the heat dissipation efficiency for the space where the light source is located; The convection of the air below after the hot air rises improves the heat dissipation efficiency of the second heat dissipation fins 4 .
- a first connecting flap 21 and a second connecting flap 22 are respectively provided on both sides of the second substrate 2 along the second predetermined direction, and the first connecting flap 21 is A first connecting hole 211 is opened, and a second connecting hole 221 is opened on the second connecting wing 22 .
- the first connecting flap 21 and the second connecting flap 22 are located on the same plane as the second substrate 2, and the two sides of the first heat dissipation area 11 are respectively provided with first positioning The hook 16 and the second positioning hook 17, the first positioning hook 16 and the second positioning hook 17 are located on both sides of the end of the first substrate 1, the first positioning hook 16 and the The second positioning hooks 17 are all perpendicular to the first substrate 1, and a first locking groove 161 is opened on the side of the first positioning hooks 16 away from the second substrate 2, and the second positioning A second locking groove 171 is defined on a side of the hook 17 away from the second substrate 2 .
- the first positioning hook 16 and the second positioning hook 17 are used for positioning the front end of the radiator, and the first connecting flap 21 and the second connecting flap 22 are used for positioning the radiator. Positioning and installation of the rear end of the lighting device. When installing, respectively insert the first card slot 161 and the second card slot 171 into the positioning structure of the lighting device, and set screws to penetrate the first connection hole 211 and the The second connecting hole 221 is used for fixing.
- a plurality of positioning posts 18 are arranged on the heat conduction contact area 12 to facilitate the installation and positioning of the light source.
- a plurality of thimbles 31 are embedded at intervals on the first heat dissipation fin 3 , the thimbles 31 are perpendicular to the first substrate 1 , and the outer diameter of the thimbles 31 is larger than that of the first heat dissipation fin. Sheet 3 thickness.
- the thimble 31 can disrupt the flow of hot air between the first heat dissipation fins 3, and at the same time, the thimble 31 has a higher strength than the first heat dissipation fin 3, and can be used in die-casting As a support point for demoulding during molding.
- the heat sink is an integral die-cast magnesium alloy piece.
- the heat sink By integrally die-casting the heat sink, it is beneficial to reduce the assembly process, and also make the first substrate 1, the second substrate 2, the first heat dissipation fins 3 and the second heat dissipation fins 4 Integrated to improve the efficiency of heat conduction between the various parts, no additional heat-conducting silica gel is required to ensure tight bonding and heat conduction at the joints.
- the first connecting flap 21, the second connecting flap 22, the first positioning hook 16 and the second positioning hook 17 are integrally formed with the first base plate 1, which improves the thermal conductivity. At the same time, the installation accuracy between the light source and the lens of the lamp group is improved.
- Magnesium alloy is used as the material of the heat sink, which has high thermal conductivity and mechanical properties, and can be effectively used in conditions and environments that require high thermal conductivity and light weight.
- the magnesium alloy piece includes the following components in mass percentage:
- the content of Al is 1%-5%, the content of Zn is 0-0.2%, the content of Mn is 0-1%, the content of RE is 3%-6%, the content of Mg is 87.7%-96%, other elements
- the total amount is less than 0.1%.
- RE refers to rare earth elements and is used for grain refinement.
- the magnesium alloy piece includes the following components in mass percentage:
- the content of Al is 1%-5%, the content of Zn is 0-0.2%, the content of Mn is 0.8%-1%, the content of RE is 3%-6%, the content of Mg is 87.7%-95.2%, other The total amount of elements is less than 0.1%.
- the magnesium alloy has both very high thermal conductivity and excellent mechanical properties.
- the magnesium alloy can not only be used in scenarios that require high thermal conductivity and structural mechanics requirements, but also can achieve lightweight and low-cost. Design requirements, especially suitable for making radiators for automotive lighting devices.
- the lightweight design of the radiator is a key technology to improve the cruising range and meet the requirements of the cruising range.
- the surface of the heat sink is sandblasted and anodized to further increase the contact area with the air and enhance the ability to radiate heat to the surrounding air.
- FIG. 5 another aspect of the present disclosure provides a lighting device, including the heat sink as described above.
- the heat dissipation efficiency of the lighting device can be effectively improved, and at the same time, the occupied space required for the lighting device to be installed on the vehicle is reduced, so as to meet the design requirements of light weight and low cost.
- the heat sink includes a first substrate, a second substrate, a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, and a plurality of the first heat dissipation fins
- the fins are spaced and arranged on one side surface of the first substrate along the first predetermined direction
- the second substrate is vertically arranged on the other side surface of the first substrate
- the slices are spaced and arranged on one side surface of the second substrate along the second predetermined direction.
- a plurality of first heat dissipation holes and a plurality of second heat dissipation holes are opened on the first substrate, a single first heat dissipation hole is arranged between two adjacent first heat dissipation fins, a single second heat dissipation hole The heat dissipation hole is arranged between two adjacent first heat dissipation fins, and the single second heat dissipation hole is arranged between two adjacent second heat dissipation fins.
- the other side surface of the first substrate is sequentially formed with a first heat dissipation area, a heat conduction contact area, and a second heat dissipation area along the first predetermined direction, and the junction line between the first substrate and the second substrate and The first predetermined direction is parallel to the second predetermined direction, a plurality of the first heat dissipation holes are arranged in the first heat dissipation area, the heat conduction contact area is used for installing a light source, and the second substrate disposed between the heat conduction contact area and the second heat dissipation area, a plurality of second heat dissipation fins are located on the side of the second substrate away from the heat conduction contact area, the second heat dissipation fins and The second heat dissipation area is connected, and a plurality of the second heat dissipation holes are arranged in the second heat dissipation area.
- the radiator meets the following conditions:
- This embodiment is used to illustrate the radiator disclosed in the present disclosure, including most of the structures in Embodiment 1, and the difference lies in:
- This embodiment is used to illustrate the radiator disclosed in the present disclosure, including most of the structures in Embodiment 1, and the difference lies in:
- This embodiment is used to illustrate the radiator disclosed in the present disclosure, including most of the structures in Embodiment 1, and the difference lies in:
- the first heat dissipation hole and the second heat dissipation hole are not provided on the first substrate.
- This comparative example is used to compare and illustrate the radiator disclosed in the present disclosure, including most of the structures in Embodiment 1, and the difference lies in:
- This comparative example is used to compare and illustrate the radiator disclosed in the present disclosure, including most of the structures in Embodiment 1, and the difference lies in:
- the heat sink that satisfies the constraints of Relational Expression 1 and Relational Expression 2 provided by the present disclosure has a significant improvement in heat dissipation efficiency, can effectively reduce the core temperature of the LED chip, and has a lower weight , which is conducive to the lightweight of vehicle lighting equipment.
- the core temperature of the LED chip of Example 1 is the lowest, and its weight is the lightest.
- Embodiment 1 differs only in that the number of first heat dissipation fins and second heat dissipation fins in Embodiment 1 is larger.
- Example 1 compared with Comparative Example 1, Example 1 has more cooling fins installed in the same space, and at this time, the core temperature of the LED chip in Example 1 is also lower. Therefore, under the premise of satisfying the constraints of relational expression 1 and relational expression 2 provided by the present disclosure, embodiment 1 not only improves the space utilization rate of the radiator, but also improves the heat dissipation by installing more cooling fins in the same space. The heat dissipation efficiency of the device.
- Example 4 Compared with Comparative Example 2, in Example 4, although the first heat dissipation hole and the second heat dissipation hole are not provided on the first substrate, due to the shorter length of the first substrate in the first predetermined direction and the plurality of first heat dissipation fins The weighted average thickness of the sheet is thinner, and the distribution number of the first cooling fins is smaller, so the volume is smaller and the weight is lighter. It can be seen from the test results in Table 1 that compared with Comparative Example 2, the core temperature of the LED chip in Example 4 is also lower. Therefore, on the premise of satisfying the constraints of relational expression 1 and relational expression 2 provided by the present disclosure, the radiator of embodiment 4 is smaller in size, lighter in weight, and has higher heat dissipation efficiency. In summary, the heat sink disclosed in the present disclosure solves the problems of insufficient space utilization and heat dissipation efficiency.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
样品 | LED芯片中心温度/℃ | 重量/g |
实施例1 | 121.8 | 117 |
实施例2 | 122.0 | 126 |
实施例3 | 121.9 | 135 |
实施例4 | 122.6 | 119 |
对比例1 | 123.4 | 101 |
对比例2 | 123.1 | 143 |
Claims (14)
- 一种散热器,其特征在于,包括第一基板(1)和多个第一散热翅片(3),多个所述第一散热翅片(3)沿第一预设方向间隔并排于所述第一基板(1)上,所述散热器满足以下关系式1和关系式2的限制:其中,L为所述第一基板(1)在所述第一预设方向上的长度,单位mm;N为所述第一散热翅片(3)的分布数量,N取正整数;H∈{[(δ 1+δ 2 )/2-1.2]/tan2θ,[(δ 1+δ 2)/2+1.2]/tan2θ} 关系式2其中,δ 1为所述第一散热翅片(3)厚度最大值,单位mm;δ 2为所述第一散热翅片(3)厚度最小值,单位mm;θ为所述第一散热翅片(3)的拔模角度,单位度;H为所述第一散热翅片(3)的分布高度,单位mm。
- 根据权利要求1所述的散热器,其特征在于,所述散热器还包括第二基板(2)和多个第二散热翅片(4),多个所述第一散热翅片(3)沿所述第一预设方向间隔并排于所述第一基板(1)的一侧表面,所述第二基板(2)设置于所述第一基板(1)的另一侧表面,多个所述第二散热翅片(4)沿第二预设方向间隔并排于所述第二基板(2)的一侧表面,所述散热器满足以下关系式3和关系式4的限制:其中,L'为所述第二基板(2)在所述第二预设方向上的长度,单位mm;N'为所述第二散热翅片(4)的分布数量,N'取正整数;H'∈{[(δ 1'+δ 2')/2-1.2]/tan2θ',[(δ 1'+δ 2')/2+1.2]/tan2θ'} 关系式4其中,δ 1'为所述第二散热翅片(4)厚度最大值,单位mm;δ 2'为所述第二散热翅片(4)厚度最小值,单位mm;θ'为所述第二散热翅片(4)的拔模角度,单位度;H'为所述第二散热翅片(4)的分布高度,单位mm。
- 根据权利要求2所述的散热器,其特征在于,所述第一基板(1)上开设有多个第一散热孔(14)和多个第二散热孔(15),单个所述第一散热孔(14)设置于相邻两个所述第一散热翅片(3)之间,单个所述第二散热孔(15)设置于相邻两个所述第一散热翅片(3)之间,且单个所述第二散热孔(15)设置于相邻两个所述第二散热翅片(4)之间。
- 根据权利要求2或3所述的散热器,其特征在于,所述第一基板(1)的另一侧表面沿垂直于所述第一预设方向的方向依次形成有第一散热区(11)、热传导接触区(12)和第二散热区(13),所述第一基板(1)和所述第二基板(2)的交接线与所述第一预设方向和所述 第二预设方向相平行,多个所述第一散热孔(14)设置于所述第一散热区(11),所述热传导接触区(12)用于安装光源,所述第二基板(2)设置于所述热传导接触区(12)和所述第二散热区(13)之间,多个所述第二散热翅片(4)位于所述第二基板(2)上背离所述热传导接触区(12)的侧面,所述第二散热翅片(4)与所述第二散热区(13)连接,多个所述第二散热孔(15)设置于所述第二散热区(13)。
- 根据权利要求2至4任一项所述的散热器,其特征在于,所述第二基板(2)上沿所述第二预设方向的两侧分别设置有第一连接翼板(21)和第二连接翼板(22),所述第一连接翼板(21)上开设有第一连接孔位(211),所述第二连接翼板(22)上开设有第二连接孔位(221),所述第一散热区(11)的两侧分别设置有第一定位卡勾(16)和第二定位卡勾(17),所述第一定位卡勾(16)和所述第二定位卡勾(17)均垂直于所述第一基板(1),所述第一定位卡勾(16)上背离所述第二基板(2)的一侧开设有第一卡槽(161),所述第二定位卡勾(17)上背离所述第二基板(2)的一侧开设有第二卡槽(171)。
- 根据权利要求5所述的散热器,其特征在于,所述第一连接翼板(21)、所述第二连接翼板(22)和所述第二基板(2)位于同一平面。
- 根据权利要求5或6所述的散热器,其特征在于,所述第一定位卡勾(16)和所述第二定位卡勾(17)用于所述散热器的前端定位,所述第一连接翼板(21)和所述第二连接翼板(22)用于所述散热器的后端定位以及安装。
- 根据权利要求4至7任一项所述的散热器,其特征在于,所述热传导接触区(12)上设置有多个定位柱(18)。
- 根据权利要求1至8任一项所述的散热器,其特征在于,所述第一散热翅片(3)上间隔嵌入有多个顶针(31),所述顶针(31)垂直于所述第一基板(1),所述顶针(31)的外径大于所述第一散热翅片(3)的厚度。
- 根据权利要求1至9任一项所述的散热器,其特征在于,所述散热器为一体压铸成型的镁合金件。
- 根据权利要求10所述的散热器,其特征在于,所述镁合金件包括以下质量百分比的组分:Al的含量为1%-5%、Zn的含量为0-0.2%、Mn的含量为0-1%、RE的含量为3%-6%、Mg的含量为87.7%-96%,其它元素的总量小于0.1%。
- 根据权利要求10所述的散热器,其特征在于,所述镁合金件包括以下质量百分比的组分:Al的含量为1%-5%、Zn的含量为0-0.2%、Mn的含量为0-1%、Ce的含量为0-4.0%、Nd的含量为0-0.5%,Mg的含量为83.2%-96%,其它元素的总量小于0.1%。
- 根据权利要求10所述的散热器,其特征在于,所述镁合金件包括以下质量百分比的组分:Al的含量为1%-5%、Zn的含量为0-0.2%、Mn的含量为0.8%-1%、Ce的含量为0.8%-2.5%、Nd的含量为0-0.5%,Mg的含量为83.2%-94.4%,其它元素的总量小于0.1%。
- 一种照明装置,其特征在于,包括如权利要求1~13任意一项所述的散热器。
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