WO2023124522A1 - 雾化装置及其雾化器和发热元件 - Google Patents
雾化装置及其雾化器和发热元件 Download PDFInfo
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- WO2023124522A1 WO2023124522A1 PCT/CN2022/129644 CN2022129644W WO2023124522A1 WO 2023124522 A1 WO2023124522 A1 WO 2023124522A1 CN 2022129644 W CN2022129644 W CN 2022129644W WO 2023124522 A1 WO2023124522 A1 WO 2023124522A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heating element
- layer
- heat equalizing
- heating
- heat
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 178
- 238000000889 atomisation Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 58
- 239000010410 layer Substances 0.000 claims description 163
- 238000003892 spreading Methods 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims description 11
- 238000003618 dip coating Methods 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 29
- 238000009826 distribution Methods 0.000 abstract description 10
- 239000000443 aerosol Substances 0.000 abstract description 7
- 238000000265 homogenisation Methods 0.000 abstract description 2
- 238000002485 combustion reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QMQXDJATSGGYDR-UHFFFAOYSA-N methylidyneiron Chemical compound [C].[Fe] QMQXDJATSGGYDR-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
Definitions
- the invention relates to the field of atomizing devices, more specifically, to an atomizing device, an atomizer and a heating element thereof.
- heating and non-burning of leaf atomizing medium tends to be popular.
- Heating not burning means that the special leaf atomizing medium does not need to be ignited by an open flame.
- the form of aerosol evaporates and can be inhaled by people, which greatly reduces the harmful components released by the high-temperature cracking of the leaf atomization medium. While consumers are satisfied, they reduce the harm to the body.
- a core component for forming aerosol by heating without burning is a heating element, which bakes the aerosol-forming substrate such as leaf atomization medium after heating up.
- resistive heating elements are often used to realize the atomization of leaf atomizing media, which are mainly divided into central sheet type, central needle type and peripheral tubular heating elements.
- the components of a resistive heating element can usually be divided into base material, covering layer, heating circuit, temperature control circuit, mounting seat, pad, lead wire, etc.
- the heat is generated when the heating circuit is powered on, and is limited by the layout and Influenced by the thermal conductivity of the substrate and the covering layer, it is difficult for the heating element to obtain a more uniform temperature distribution field, especially when the thermal conductivity of the substrate is low ( ⁇ 10W/(m*K)) and the wiring area of the heating circuit is small .
- the thermal conductivity of the base material and the covering layer is high, a more uniform temperature field can be obtained, but at the same time, it will cause an increase in the energy dissipated from the mounting seat, etc., resulting in an increase in the energy consumption of the whole machine, and the temperature of the machine shell and the internal circuit control The temperature of the board will be high, and there is an application risk.
- This method is a multi-piece heat soaking film applied to the heat pipe; 2. This method has a single form of heat soaking, which is a metal foil patch, and the structure is clearly marked, and the substrate/ The material of the covering sheet is high temperature resistant plastic film.
- the technical problem to be solved by the present invention is to provide an atomizing device and its atomizer and heating element in view of the above-mentioned defects of the prior art.
- the technical solution adopted by the present invention to solve the technical problem is: to construct a heating element, including a base material, a heating element and a heat equalizing layer arranged on the base material;
- the heating element is provided with an installation area and a heating area on the base material, and the heating element is arranged in the heating area;
- the heat equalizing layer is arranged as a uniform structure, the heat equalizing layer covers the heat generating area, and is arranged adjacent to the heat generating body.
- the substrate is a pipe structure
- the heat equalizing layer is arranged on the outer surface of the substrate
- the heating element is arranged on the outer surface of the heat equalizing layer.
- the heating element is configured to include at least one of the following:
- the base material is a metal pipe body; the middle section of the base material forms the heating area, and the two ends of the base material form the installation area;
- the heating element also includes a protective layer disposed on the outside of the heating element;
- the heating element also includes an infrared layer disposed in the base material.
- the base material is a rod-type or sheet-type structure
- the heating element is arranged on the outer surface of the base material
- the heat equalizing layer is arranged on the outer surface of the heating element.
- the heating element is configured to include at least one of the following:
- the base material includes a main body and a tip connected to one end of the main body, the end of the main body away from the tip forms the installation area, and the end of the main body adjacent to the tip and the tip form the heating area;
- the heating element also includes a protective layer arranged outside the heat equalizing layer;
- the heating element further includes an infrared layer disposed outside the heat-spreading layer, or the heat-spreading layer is an infrared heat-spreading layer.
- the heat spreading layer is formed by one of dip coating, sintering, magnetron sputtering and spray coating.
- the thermal conductivity of the heat equalizing layer is higher than 10 W/(m*K) at room temperature.
- the thickness of the heat-spreading layer may range from 1 ⁇ m to 1000 ⁇ m.
- the heat equalizing layer covers the heating element.
- an infrared material is compounded in the heat equalizing layer to increase its infrared radiation performance.
- the material of the substrate is zirconia.
- a lead wire electrically connected to the heating element is also included.
- the heat leveling layer has electrical conductivity, and the heat leveling layer is separated from the heating element by a non-conductive medium layer.
- the heat equalizing layer has electrical conductivity
- a dielectric layer is provided between the heat equalizing layer and the heating element
- a glaze layer is arranged outside the heat equalizing layer.
- the heat equalizing layer has electrical conductivity, and a non-conductive glaze layer is provided between the heat equalizing layer and the heating element.
- the material of the heat equalizing layer is a metal material.
- the heat equalizing layer is an insulating material heat equalizing layer, and the heat equalizing layer is arranged on the heating element.
- the heat equalizing layer has no electrical conductivity
- a dielectric layer is provided between the heat equalizing layer and the heating element
- a glaze layer is arranged outside the heat equalizing layer, or, the heat equalizing layer and the heating element
- a glaze layer is arranged between the heating elements.
- the heat equalizing layer is one of organic polymer materials, inorganic non-metallic materials and composite materials.
- the heating body is at least one of a heating circuit board, a heating wire, and a heating plate.
- An atomizer including the heating element.
- An atomization device comprising the atomizer.
- the heat uniform layer obtains a more uniform temperature field distribution, which is conducive to the uniformity of the temperature distribution field of the heating element, and is conducive to improving the aerosol formation matrix. Effective utilization of roasting and atomized mouthfeel.
- Fig. 1 is a three-dimensional schematic diagram when the atomizer is inserted into an aerosol to form a matrix
- Fig. 2 is a schematic cross-sectional view when the atomizer in Fig. 1 is plugged with an aerosol to form a matrix;
- Fig. 3 is a three-dimensional structural schematic diagram of the first embodiment of the heating element of the present invention.
- Fig. 4 is a schematic diagram of an exploded structure of the heating element in Fig. 3;
- Fig. 5 is a schematic perspective view of the second embodiment of the heating element of the present invention.
- Fig. 6 is a schematic diagram of an exploded structure of the heating element in Fig. 5 .
- the atomization device in a preferred embodiment of the present invention includes an atomizer 100, which can be used to bake and heat the aerosol-forming substrate 200 inserted therein at a low temperature, The aerosol extract in the aerosol-forming substrate 200 is released in a non-combustible state.
- the aerosol-forming substrate 200 can be in the shape of a cylinder, and the atomizer 100 can be roughly in the shape of a square column. It can be understood that, in other embodiments, the atomizer 100 is not limited to be in the shape of a square column, and it can also be in other shapes such as a cylinder, an ellipse, and the like.
- the atomizer 100 includes a housing 30 , a heating element 10 accommodated in the housing 30 , a storage tube 20 , a battery 40 , and a main board 50 .
- the inner wall of the housing tube 20 defines a housing space 21 for accommodating the aerosol-forming substrate 200, and the top wall of the housing 30 is provided with a socket 31 for inserting the aerosol-forming substrate 200, and the aerosol-forming substrate 200 can be inserted through the socket. 31 is inserted into the receiving space 21.
- the upper end of the heating element 10 can extend into the receiving space 21 and be inserted into the aerosol-forming substrate 200 for baking and heating the aerosol-forming substrate 200 after being energized to generate heat.
- the main board 50 is electrically connected to the battery 40 and the heating element 10 respectively.
- a related control circuit is arranged on the main board 50 , and the on-off connection between the battery 40 and the heating element 10 can be controlled by a switch on the casing 30 .
- the atomizer includes a heating element 10 for atomizing the aerosol-forming substrate stored in the atomizing device.
- the heating element 10 includes a base material 11 , a heating element 12 disposed on the base material 11 , and a heat equalizing layer 13 covering the outside of the heating element 12 .
- the material of the substrate 11 is zirconia.
- the heating element is provided with an installation area and a heating area on the base material 11, the heating element 12 is arranged in the heating area, and the installation area can be assembled with other assembly parts.
- the heat equalizing layer 13 is arranged in a uniform structure, and the heat equalizing layer 13 covers the heating area and is arranged adjacent to the heating element 12 .
- the heat equalizing layer 13 obtains a more uniform temperature field distribution, which is conducive to improving the uniformity of the temperature distribution field of the heating element, and is conducive to improving the effective utilization rate of the aerosol-forming substrate for baking and the taste of atomization.
- the thermal conductivity of the heat-spreading layer 13 is higher than 10 W/(m*K) at room temperature, and the thermal conductivity of the heat-spreading layer 13 is relatively high, which is conducive to the homogenization of the temperature distribution field of the heating element 12, and is especially suitable for low-temperature heating without burning To achieve a more uniform temperature field distribution, improve the effective utilization rate of aerosol-forming matrix baking and the taste of atomization.
- the material of the heat spreading layer 13 can be a metal material, such as gold, silver, copper, aluminum, iron, tungsten, nickel, zinc, platinum, palladium and other pure metals, iron-carbon alloy, copper-zinc alloy, copper Alloys such as tin alloys can also be organic polymer materials, such as high thermal conductivity fibers, plastics, rubber, etc., or inorganic non-metallic materials, such as silicon, graphite, silicon carbide, aluminum oxide, aluminum nitride, copper oxide, arsenic Gallium chloride, gallium phosphide, functional ceramics, etc., can also be composite materials, such as metal matrix composite materials, glass fibers, etc.
- a metal material such as gold, silver, copper, aluminum, iron, tungsten, nickel, zinc, platinum, palladium and other pure metals, iron-carbon alloy, copper-zinc alloy, copper Alloys such as tin alloys can also be organic polymer materials, such as high thermal conductivity fibers, plastics, rubber,
- infrared materials can be compounded in the heat equalizing layer 13 to increase its infrared radiation performance and improve the energy utilization rate of the heating element 12 .
- the heat equalizing layer 13 is formed by one of dip coating, sintering, magnetron sputtering and spraying, and is attached to the heating element 12 .
- the thickness of the heat equalizing layer 13 may range from 1 ⁇ m to 1000 ⁇ m.
- the heating element 12 is at least one of a heating circuit board, a heating wire, and a heating plate.
- the heat spreading layer 13 covers the heating element 12 to improve the uniformity of the temperature distribution field of the heating element.
- the position of the heat equalizing layer 13 in the structure of the heating element 12 can be flexibly adjusted, and can be located in the inner layer, the middle layer or the outer layer of the heating element 12 .
- the heating element 10 also includes a lead wire 14 electrically connected to the heating element 12 , which is connected to a power source to supply power to the heating element 12 to generate heat.
- the base material 11 is a rod structure
- the heating element 12 is arranged on the outer surface of the base material 11
- the heat spreading layer 13 is arranged on the outer surface of the heating element 12 .
- the substrate 11 includes a main body 111 and a tip 112 connected to one end of the main body 111 .
- the end of the main body 111 away from the tip 112 forms an installation area, and the end of the main body 111 near the tip 112 and the tip 112 form a heating area.
- the heat equalizing layer 13 has electrical conductivity, and the material is mainly silver with high thermal conductivity, and the heat equalizing layer 13 is attached to the heating element 12 through a dip coating/sintering process.
- the heat equalizing layer 13 is separated from the heating element 12 by a non-conductive medium layer 15 , and the heat equalizing layer 13 is further provided with a glaze layer 16 .
- the heat soaking layer 13 is located between the dielectric layer 15 and the glaze layer 16, with a thickness of 10 ⁇ m to 50 ⁇ m and a length of 10 mm to 18 mm, completely covering the heating film area, and the dielectric layer 15 is non-conductive, isolating the heat soaking layer 13 and Heating parts.
- a non-conductive glaze layer 16 may also be provided between the heat equalizing layer 13 and the heating element 12 , so that the heat insulating layer is located outside the glaze layer 16 , or the heat insulating layer replaces the material of the glaze layer 16 .
- the heating element further includes a protective layer disposed outside the heat equalizing layer 13 to protect the inner heat equalizing layer 13 and the like.
- the heating element also includes an infrared layer outside the heat equalizing layer 13 , or, the infrared material can be compounded in the heat equalizing layer 13 as the infrared heat equalizing layer 13 to increase its infrared radiation performance.
- the heating element 10 may also include a flange 17, the flange 17 is used to support the substrate 11, the heating element 12, and the heat equalizing layer 13, etc., and a through hole 170 is formed longitudinally through it, and the substrate 11 The lower end portion of the through hole 170 is accommodated.
- the flange 17 can be used to cooperate with the external structure to locate the position of the flange 17 on the external structure.
- the substrate 11 is a tube structure
- the heat spreading layer 13 is arranged on the outer surface of the substrate 11
- the heating element 12 is arranged on the outer surface of the heat spreading layer 13 .
- the base material 11 is a metal pipe body, which can improve the conduction performance of heating.
- the middle section of the base material 11 forms a heating area
- the heating element 12 is disposed in the heating area
- the two ends of the base material 11 form an installation area
- the heating element further includes a protective layer disposed outside the heating element 12 to protect the inner heat equalizing layer 13 and the like.
- the heating element further includes an infrared layer disposed in the base material 11 to increase its infrared radiation performance.
- the heat equalizing layer 13 has electrical conductivity, and the material is silver with high thermal conductivity, and is covered on the surface of the substrate 11 by dip coating and sintering.
- the infrared layer is covered by dip coating and sintering to improve the heat transfer coefficient of the tubular heating element 12 , while the infrared layer serves as the dielectric layer 15 .
- the heating element 12 is located outside the infrared layer. Usually, the heating element 12 is formed by silk printing on the infrared layer, and then the covering layer 17 is added by silk printing or dip coating for heat insulation and circuit protection.
- the heat equalizing layer 13 only covers the heating area, and does not completely cover the entire heating body 12, so as to reduce the dissipation of excess energy.
- the heat equalizing layer 13 is disposed on the base material 11, and the heat equalizing layer 13 may not have electrical conductivity, and further, the heat equalizing layer 13 may also have infrared properties.
- the heat equalizing layer 13 can be used as the dielectric layer 15 at the same time, and the heating element 12 is arranged on the heat equalizing layer 13 , and usually, the heating element 12 is formed by silk-screen printing on the heat equalizing layer 13 .
- the heat equalizing layer 13 is preferably arranged on the surface of the base material 11, and the heat equalizing layer 13 can also be directly added after the conventional tubular heating element 12 is prepared, and the material of the conductive heat equalizing layer 13 is isolated by adding a dielectric layer 15. Electrical properties or use non-conductive thermal layer 13 material.
- the substrate 11 has a sheet structure
- the heating element 12 is disposed on the outer surface of the substrate 11
- the heat equalizing layer 13 is disposed on the outer surface of the heating element 12 .
- the substrate 11 includes a main body 111 and a tip 112 connected to one end of the main body 111 .
- the end of the main body 111 away from the tip 112 forms an installation area, and the end of the main body 111 near the tip 112 and the tip 112 form a heating area.
- the heat spreading layer 13 has electrical conductivity, and the material is silver with high thermal conductivity, which is covered on the substrate 11 by silk printing/sintering.
- the thickness of the heat spreading layer 13 is 10 ⁇ m ⁇ 50 ⁇ m, and the area only covers Hot zone needed.
- the dielectric layer 15 is located outside the heat equalizing layer 13
- the heating element 12 is located outside the dielectric layer 15
- the cover layer 17 covers the outside of the heating element 12 .
- the dielectric layer 15 , wiring and cover layer 17 are formed by silk screen printing.
- the dielectric layer 15 and the cover layer 17 can be replaced to maximize the heat equalizing effect.
- the heating element further includes a protective layer disposed outside the heat equalizing layer 13 to protect the inner heat equalizing layer 13 and the like.
- the heating element also includes an infrared layer outside the heat equalizing layer 13 , or, the infrared material can be compounded in the heat equalizing layer 13 as the infrared heat equalizing layer 13 to increase its infrared radiation performance.
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Abstract
一种雾化装置及其雾化器和发热元件，发热元件包括基材（11）、以及设置在基材（11）上的发热体（12）、均热层（13）；发热元件在基材（11）设有安装区域及发热区域，发热体（12）设置于发热区域；均热层（13）设置为均一结构，均热层（13）覆盖发热区域，并与发热体（12）相邻设置。均热层（13）有利于发热体（12）温度分布场的均匀化，尤其适用于低温加热不燃烧雾化领域，从而获得更均匀的温度场分布，提升气溶胶形成基质烘烤时的有效利用率和雾化口感。
Description
本发明涉及雾化装置领域，更具体地说，涉及一种雾化装置及其雾化器和发热元件。
随健康理念普及，叶类雾化介质加热不燃烧趋于流行，加热不燃烧就是指通过特制的叶类雾化介质不需通过明火点燃，在300℃的加热烘烤下，使得物质和香味以气溶胶形式蒸发出来，可供人抽吸，大幅减少叶类雾化介质高温裂解释放的有害成分。消费者在满足感获得的同时，减少了对身体的危害性。
而通过加热不燃烧形成气溶胶的一个核心部件为加热元件，其升温后对叶类雾化介质等气溶胶形成基材进行烘烤。
目前，常采用电阻式加热元件来实现叶类雾化介质的雾化，主要分为中心片式、中心针式和外周管状加热元件。
电阻式加热元件的组成部分通常可分为基材、覆盖层、发热线路、控温线路、安装座、焊盘、引线等，热量由发热线路通电工作时产生，受限于发热线路的布局和基材、覆盖层的导热系数的影响，发热元件很难获得较均匀的温度分布场，尤其是当基材的导热系数较低（＜10W/(m*K)）和发热线路可布线区域小时。
当基材和覆盖层导热系数较高时，可获得较均匀的温度场，但同时会引起从安装座等处耗散的能量增加，导致整机能耗增加，且机器外壳温度和内部电路控制板温度会偏高，存在应用风险。
有的是通过在发热丝片下增加金属箔贴片来实现均热效果。差异点：1. 该方式为应用于发热管的多片式均热发热膜；2. 该方式的均热实现形式单一，为金属箔贴片，且对结构有明确标识，并限制基片/包覆片材料均为耐高温塑料膜。
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种雾化装置及其雾化器和发热元件。
本发明解决其技术问题所采用的技术方案是：构造一种发热元件，包括基材、以及设置在所述基材上的发热体、均热层；
所述发热元件在所述基材设有安装区域及发热区域，所述发热体设置于所述发热区域；
所述均热层设置为均一结构，所述均热层覆盖所述发热区域，并与所述发热体相邻设置。
优选地，所述基材为管体结构，所述均热层设置在所述基材外表面，所述发热体设置在所述均热层外表面。
优选地，所述发热元件设置为包括如下至少一项：
所述基材为金属管体；所述基材的中段形成所述发热区域，所述基材的两端形成所述安装区域；
所述发热元件还包括设于所述发热体外的保护层；
所述发热元件还包括设于所述基材内的红外层。
优选地，所述基材为杆式或片式结构，所述发热体设置于所述基材外表面，所述均热层设置于所述发热体外表面。
优选地，所述发热元件设置为包括如下至少一项：
所述基材包括主体及连接主体一端的尖端，所述主体远离所述尖端的一端形成所述安装区域，所述主体临近所述尖端的一端及所述尖端形成所述发热区域；
所述发热元件还包括设于所述均热层外的保护层；
所述发热元件还包括设于所述均热层外的红外层，或者，所述均热层为红外均热层。
优选地，所述均热层通过浸涂、烧结、磁控溅射、喷涂中的其中一种工艺形成。
优选地，所述均热层的导热系数在室温下高于10 W/(m*K)。
优选地，所述均热层厚度范围可为1µm-1000µm。
优选地，所述均热层覆盖所述发热体。
优选地，所述均热层中复合红外材料，增加其红外辐射性能。
优选地，所述基材的材质为氧化锆。
优选地，还包括与所述发热体电性连接的引线。
优选地，所述均热层具有导电性能，所述均热层与所述发热体之间设有不导电的介质层分隔。
优选地，所述均热层具有导电性能，所述均热层与所述发热体之间设有介质层，所述均热层外设有釉层。
优选地，所述均热层具有导电性能，所述均热层与所述发热体之间设有不导电的釉层。
优选地，所述均热层的材料为金属材料。
优选地，所述均热层为绝缘材质均热层，所述均热层布置在发热体上。
优选地，所述均热层不具有导电性，所述均热层与所述发热体之间设有介质层，所述均热层外设有釉层，或，所述均热层与所述发热体之间设有釉层。
优选地，所述均热层为有机高分子材料、无机非金属材料、复合材料中的一种。
优选地，所述发热体为发热线路板、发热丝、发热板中的至少一种。
一种雾化器，包括所述的发热元件。
一种雾化装置，包括所述的雾化器。
实施本发明的雾化装置及其雾化器和发热元件，具有以下有益效果：均热层获得更均匀的温度场分布，有利于发热体温度分布场的均匀化，有利于提高气溶胶形成基质烘烤的有效利用率和雾化口感。
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是雾化器插接气溶胶形成基质时的立体示意图；
图2是图1中雾化器插接气溶胶形成基质时的剖面示意图；
图3是本发明发热元件第一实施例的立体结构示意图；
图4是图3中发热元件的分解结构示意图；
图5是本发明发热元件第二实施例的立体结构示意图；
图6是图5中发热元件的分解结构示意图。
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图1、图2所示，本发明一个优选实施例中的雾化装置包括雾化器100，该雾化器100可用于对插接于其中的气溶胶形成基质200进行低温烘烤加热，以在不燃烧的状态下释放气溶胶形成基质200中的气溶胶提取物。
该气溶胶形成基质200可呈圆柱状，该雾化器100大致可呈方形柱状。可以理解地，在其他实施例中，该雾化器100并不局限于呈方形柱状，其也可以呈圆柱状、椭圆柱状等其他形状。
该雾化器100包括外壳30以及收容于外壳30的发热元件10、收容管20、电池40、主板50。
收容管20的内壁面界定出一用于收容气溶胶形成基质200的收容空间21，外壳30的顶壁上开设有用于供气溶胶形成基质200插入的插口31，气溶胶形成基质200可经由插口31插入到收容空间21中。
发热元件10的上端可伸入到收容空间21中并插入到气溶胶形成基质200中，用于在通电发热后对气溶胶形成基质200进行烘烤加热。
主板50分别与电池40、发热元件10电连接。主板50上布置有相关的控制电路，可借由设置于外壳30上的开关控制电池40与发热元件10之间的通断。
雾化器包括发热元件10，对雾化装置存储的气溶胶形成基质进行雾化。
结合图3、图4所示，发热元件10包括基材11、设置在基材11上的发热体12、以及覆盖在发热体12外侧的均热层13。优选地，基材11的材质为氧化锆。
发热元件在基材11设有安装区域及发热区域，发热体12设置于发热区域，安装区域可以与其它装配件组装配合。均热层13设置为均一结构，均热层13覆盖发热区域，并与发热体12相邻设置。
均热层13获得更均匀的温度场分布，有利于改善发热元件温度分布场的均匀性，有利于提高气溶胶形成基质烘烤的有效利用率和雾化口感。
均热层13的导热系数在室温下高于10 W/(m*K)，均热层13的导热系数较高，有利于发热体12温度分布场的均匀化，尤其适用于低温加热不燃烧卷烟雾化领域，从而获得更均匀的温度场分布，提升气溶胶形成基质烘烤的有效利用率和雾化口感。
在一些实施例中，均热层13的材料可为金属材料，例如金、银、铜、铝、铁、钨、镍、锌、铂、钯等纯金属，铁碳合金、铜锌合金、铜锡合金等合金，也可为有机高分子材料，例如高导热纤维、塑料、橡胶等，也可为无机非金属材料，例如硅、石墨、碳化硅、氧化铝、氮化铝、氧化铜、砷化镓、磷化镓、功能陶瓷等，也可为复合材料，例如金属基复合材料、玻璃纤维等。
进一步地，均热层13中可复合红外材料，增加其红外辐射性能，提高发热体12的能量利用率。
均热层13通过浸涂、烧结、磁控溅射、喷涂中的其中一种工艺形成，附加到发热体12上。优选地，均热层13厚度范围可为1µm-1000µm。
发热体12为发热线路板、发热丝、发热板中的至少一种，均热层13覆盖发热体12，改善发热元件温度分布场的均匀性。
均热层13在发热体12结构中的位置可灵活调整，可位于发热体12内层、中间层或外层。
进一步地，发热元件10还包括与发热体12电性连接的引线14，与电源连接向发热体12供电后产生热量。
结合图3、图4所示，在第一实施例中，基材11为杆式结构，发热体12设置于基材11外表面，均热层13设置于发热体12外表面。
基材11包括主体111及连接主体111一端的尖端112，主体111远离尖端112的一端形成安装区域，主体111临近尖端112的一端及尖端112形成发热区域。
进一步地，在一些实施例中，均热层13具有导电性能，材料主要为高导热的银，均热层13通过浸涂/烧结工艺附加到发热体12上。优选地，均热层13与发热体12之间设有不导电的介质层15分隔，均热层13外还设有釉层16。
本实施例中，均热层13位于介质层15和釉层16之间，厚度为10µm~50µm，长度为10mm~18mm，完全覆盖发热膜区域，介质层15不导电，隔离均热层13和发热件。
当然，均热层13与发热体12之间也可设有不导电的釉层16，让绝热层位于釉层16外侧，或者让绝热层替代釉层16材料。
优选地，发热元件还包括设于均热层13外的保护层，对内侧的均热层13等起到防护作用。
当然，在一些实施例中，发热元件还包括设于均热层13外的红外层，或者，均热层13中可复合红外材料，作为红外均热层13，增加其红外辐射性能。
进一步地，发热元件10还可包括法兰盘17，法兰盘17用于支撑基材11、发热体12、以及均热层13等，其上沿纵向贯穿形成有贯穿孔170，基材11的下端部分收容于贯穿孔170中。法兰盘17可用于与外部结构配合，以定位法兰盘17在外部结构的位置。
结合图5、图6所示，在第二实施例中，基材11为管体结构，均热层13设置在基材11外表面，发热体12设置在均热层13外表面。
优选地，基材11为金属管体，可以提升加热的传导性能。
在本实施例中，基材11的中段形成发热区域，发热体12设置于发热区域，基材11的两端形成安装区域。
优选地，发热元件还包括设于发热体12外的保护层，对内侧的均热层13等起到防护作用。
当然，在一些实施例中，发热元件还包括设于基材11内的红外层，增加其红外辐射性能。
均热层13具有导电性能，材料选择高导热的银，通过浸涂烧结，覆盖到基材11表面。
而后通过浸涂烧结覆盖红外层，用于提高管式发热体12的传热系数，同时红外层充当介质层15。
发热体12位于红外层外，通常，在红外层上丝印线路形成发热体12，而后通过丝印或浸涂增加覆盖层17，用于隔热和保护线路。均热层13仅覆盖发热区域，不完全包覆整个发热体12，减少多余能量的耗散。
当然，均热层13设置在基材11上，均热层13也可不具有导电性能，进一步地，均热层13还可具有红外性能。
均热层13可以同时作为介质层15使用，发热体12设置在均热层13上，通常，在均热层13上丝印线路形成发热体12。
本实施例中，均热层13优选设置在基材11表面，亦可在常规的管式发热体12制备完成后直接添加均热层13，通过增加介质层15隔离导电均热层13材料的电学性能或采用不导电的均热层13材料。
在第三实施例中，基材11为片式结构，发热体12设置于基材11外表面，均热层13设置于发热体12外表面。
基材11包括主体111及连接主体111一端的尖端112，主体111远离尖端112的一端形成安装区域，主体111临近尖端112的一端及尖端112形成发热区域。
进一步地，在一些实施例中，均热层13具有导电性能，材料选择高导热的银，通过丝印/烧结覆盖到基材11上，均热层13厚度为10µm~50µm，区域则仅覆盖所需要的发热区域。介质层15位于均热层13外，发热体12位于介质层15外，覆盖层17覆盖在发热体12外，优选地，介质层15、线路和覆盖层17通过丝印的方式形成。
当然，本实施例中，当均热层13不具有导电性时，可替代介质层15和覆盖层17，使得均热效果更大化。
优选地，发热元件还包括设于均热层13外的保护层，对内侧的均热层13等起到防护作用。
当然，在一些实施例中，发热元件还包括设于均热层13外的红外层，或者，均热层13中可复合红外材料，作为红外均热层13，增加其红外辐射性能。
可以理解地，上述各技术特征可以任意组合使用而不受限制。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (22)
- 一种发热元件，其特征在于，包括基材（11）、以及设置在所述基材（11）上的发热体（12）、均热层（13）；所述发热元件在所述基材（11）设有安装区域及发热区域，所述发热体（12）设置于所述发热区域；所述均热层（13）设置为均一结构，所述均热层（13）覆盖所述发热区域，并与所述发热体（12）相邻设置。
- 根据权利要求1所述的发热元件，其特征在于，所述基材（11）为管体结构，所述均热层（13）设置在所述基材（11）外表面，所述发热体（12）设置在所述均热层（13）外表面。
- 根据权利要求2所述的发热元件，其特征在于，所述发热元件设置为包括如下至少一项：所述基材（11）为金属管体；所述基材（11）的中段形成所述发热区域，所述基材（11）的两端形成所述安装区域；所述发热元件还包括设于所述发热体（12）外的保护层；所述发热元件还包括设于所述基材（11）内的红外层。
- 根据权利要求1所述的发热元件，其特征在于，所述基材（11）为杆式或片式结构，所述发热体（12）设置于所述基材（11）外表面，所述均热层（13）设置于所述发热体（12）外表面。
- 根据权利要求4所述的发热元件，其特征在于，所述发热元件设置为包括如下至少一项：所述基材（11）包括主体（111）及连接主体（111）一端的尖端（112），所述主体（111）远离所述尖端（112）的一端形成所述安装区域，所述主体（111）临近所述尖端（112）的一端及所述尖端（112）形成所述发热区域；所述发热元件还包括设于所述均热层（13）外的保护层；所述发热元件还包括设于所述均热层（13）外的红外层，或者，所述均热层（13）为红外均热层。
- 根据权利要求1所述的发热元件，其特征在于，所述均热层（13）通过浸涂、烧结、磁控溅射、喷涂中的其中一种工艺形成。
- 根据权利要求1所述的发热元件，其特征在于，所述均热层（13）的导热系数在室温下高于10 W/(m*K)。
- 根据权利要求1所述的发热元件，其特征在于，所述均热层（13）厚度范围可为1µm-1000µm。
- 根据权利要求1所述的发热元件，其特征在于，所述均热层（13）覆盖所述发热体（12）。
- 根据权利要求1所述的发热元件，其特征在于，所述均热层（13）中复合红外材料，增加其红外辐射性能。
- 根据权利要求1所述的发热元件，其特征在于，所述基材（11）的材质为氧化锆。
- 根据权利要求1所述的发热元件，其特征在于，还包括与所述发热体（12）电性连接的引线（14）。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）具有导电性能，所述均热层（13）与所述发热体（12）之间设有不导电的介质层（15）分隔。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）具有导电性能，所述均热层（13）与所述发热体（12）之间设有介质层（15），所述均热层（13）外设有釉层（16）。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）具有导电性能，所述均热层（13）与所述发热体（12）之间设有不导电的釉层（16）。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）的材料为金属材料。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）为绝缘材质均热层（13），所述均热层（13）布置在发热体（12）上。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）不具有导电性，所述均热层（13）与所述发热体（12）之间设有介质层（15），所述均热层（13）外设有釉层（16），或，所述均热层（13）与所述发热体（12）之间设有釉层（16）。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述均热层（13）为有机高分子材料、无机非金属材料、复合材料中的一种。
- 根据权利要求1至12任一项所述的发热元件，其特征在于，所述发热体（12）为发热线路板、发热丝、发热板中的至少一种。
- 一种雾化器，其特征在于，包括权利要求1至20任一项所述的发热元件（10）。
- 一种雾化装置，其特征在于，包括权利要求21所述的雾化器。
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| CN110897200A (zh) * | 2019-12-18 | 2020-03-24 | 昂纳自动化技术（深圳）有限公司 | 电子烟的雾化装置 |
| CN111567893A (zh) * | 2020-04-08 | 2020-08-25 | 深圳麦克韦尔科技有限公司 | 发热体及其制备方法、加热不燃烧气雾形成装置 |
| CN212488475U (zh) * | 2020-05-12 | 2021-02-09 | 威滔电子科技（深圳）有限公司 | 一种发热体及气溶胶产生装置 |
| CN113424998A (zh) * | 2021-07-23 | 2021-09-24 | 张立强 | 电加热器及电子烟 |
| WO2021223716A1 (zh) * | 2020-05-06 | 2021-11-11 | 深圳市合元科技有限公司 | 发热体以及包含该发热体的气溶胶生成装置 |
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| CN110897200A (zh) * | 2019-12-18 | 2020-03-24 | 昂纳自动化技术（深圳）有限公司 | 电子烟的雾化装置 |
| CN111567893A (zh) * | 2020-04-08 | 2020-08-25 | 深圳麦克韦尔科技有限公司 | 发热体及其制备方法、加热不燃烧气雾形成装置 |
| WO2021223716A1 (zh) * | 2020-05-06 | 2021-11-11 | 深圳市合元科技有限公司 | 发热体以及包含该发热体的气溶胶生成装置 |
| CN212488475U (zh) * | 2020-05-12 | 2021-02-09 | 威滔电子科技（深圳）有限公司 | 一种发热体及气溶胶产生装置 |
| CN113424998A (zh) * | 2021-07-23 | 2021-09-24 | 张立强 | 电加热器及电子烟 |
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