WO2023124181A1 - 摄像模组及电子装置 - Google Patents

摄像模组及电子装置 Download PDF

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Publication number
WO2023124181A1
WO2023124181A1 PCT/CN2022/116617 CN2022116617W WO2023124181A1 WO 2023124181 A1 WO2023124181 A1 WO 2023124181A1 CN 2022116617 W CN2022116617 W CN 2022116617W WO 2023124181 A1 WO2023124181 A1 WO 2023124181A1
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WO
WIPO (PCT)
Prior art keywords
camera module
conductive
adjustable
circuit
lens
Prior art date
Application number
PCT/CN2022/116617
Other languages
English (en)
French (fr)
Inventor
武斌
张宪先
冯一明
翟羽佳
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210079882.XA external-priority patent/CN116437183A/zh
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22830355.8A priority Critical patent/EP4228239A4/en
Publication of WO2023124181A1 publication Critical patent/WO2023124181A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/14—Picture signal circuitry for video frequency region
    • H04N5/20—Circuitry for controlling amplitude response
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053—Driving means for the movement of one or more optical element
    • G03B2205/0061—Driving means for the movement of one or more optical element using piezoelectric actuators

Definitions

  • the present application relates to the field of camera module technology, in particular, to a camera module and an electronic device using the camera module.
  • the external adjustable lens of the lens group leads to an increase in the total height of the lens, poor anti-static breakdown performance, and a high risk of reliability, which cannot meet the requirements of the mobile terminal. Due to poor focus adjustment, slow focus speed, large volume ratio, and high power consumption, the dual-camera module is not conducive to the requirements of lightweight and low power consumption of the whole machine, and the needs of various users for the hardware quality and safety of smart mobile terminals also increased with it.
  • the first aspect of the present application provides a camera module, which includes:
  • the image sensor and driving circuit are located on the circuit board;
  • the upper group lens barrel and the lower group lens barrel are located on the side of the image sensor away from the circuit board;
  • connection circuit located on the lower group lens barrel;
  • the adjustable lens is built between the upper group lens barrel and the lower group lens barrel.
  • the adjustable lens is electrically connected to the drive circuit through the connection circuit, so as to be deformed under the drive of the drive circuit, thereby adjusting the optical power of the camera module .
  • the adjustable lens is built between the upper lens barrel and the lower lens barrel.
  • the overall height of the module and the small proportion of the volume reduce the difficulty of assembly and coordination, and realize the miniaturization of the module and the light weight of the whole machine.
  • the problem of high risk of failure due to strong magnetic interference of the voice coil motor can be avoided.
  • the adjustable lens in the embodiment of the present application is an electric focus, and does not need a mechanical structure to drive during the focusing process, so the focusing speed is fast and the power consumption is low.
  • the connecting circuit is embedded in the barrel wall of the lower lens barrel.
  • the connecting circuit is formed by an insert injection molding process.
  • the connection circuit is embedded in the wall of the lower group lens barrel, it is protected by the wall of the lower group lens barrel, and the static electricity in the air will not affect the connection circuit. Therefore, the drive circuit and adjustable Lens failure, improve the reliability and stability of the camera module. In this case, it is only necessary to make two electrification lines to electrically connect the positive and negative poles of the adjustable lens respectively, and there is no need to prepare additional components for protection against electrostatic breakdown.
  • the connecting circuit is formed on the outer surface of the lower lens barrel by laser direct forming technology.
  • the outer surface of the lower lens barrel is directly plated with metal conductive lines (for example, gold lines) by laser engraving technology.
  • the connection circuit includes a first conductive reticle and a second conductive reticle that are spaced apart and insulated from each other.
  • the opposite ends of the first conductive reticle are respectively electrically connected to the drive circuit and the positive electrode of the adjustable mirror.
  • the two opposite ends of the conductive line are respectively electrically connected to the driving circuit and the negative electrode of the adjustable lens.
  • the driving circuit can provide electric energy (such as applying a linear voltage) to the adjustable lens through the first conductive score line and the second conductive score line respectively, so that the adjustable lens can produce a change in optical power.
  • the projections of the first conductive line and the second conductive line on the circuit board are both a straight line segment. That is, the first conductive score lines and the second conductive score lines are distributed in a straight line. In this way, the first conductive reticle and the second conductive reticle do not have twists and turns and complicated circuit groove distribution, which ensures that the laser forming of the LDS process can be carried out simply and efficiently and the working voltage of the connecting circuit is stable, and the metal conductive reticle can be produced quickly and automatically, improving the overall Productivity. Moreover, since the first conductive score line and the second conductive score line are distributed in a straight line, compared with the zigzag wire arrangement, the disorder of the wires can be avoided, and the conductive layout is more reasonable and efficient.
  • the camera module further includes an anti-static component to provide protection against Electro-Static Discharge (ESD), preventing external static electricity from causing damage to components such as adjustable lenses.
  • the antistatic component includes a grounding element, and the grounding element is electrically connected to the adjustable lens.
  • the ground element includes a ground wire, which is formed on the outer surface of the lower lens barrel by laser direct forming technology, and the ground wire is electrically connected to the adjustable lens and the driving circuit.
  • the ground wire can be formed in any one of the front, rear, left and right directions of the lower lens barrel.
  • the projection of the ground wire on the circuit board is a straight line segment. That is, the ground wires are distributed in a straight line, so as to quickly and automatically produce metal conductive scribe lines, improve the overall production efficiency, and avoid the phenomenon of messy wires, and the conductive layout is more reasonable and efficient.
  • the grounding element includes a capacitor, one end of the capacitor is grounded, and the other end is electrically connected to the adjustable lens and the driving circuit. Specifically, one end of the capacitor is connected to the circuit board for grounding, and the other end is electrically connected to the adjustable lens. Capacitors and drive circuits are designed in parallel.
  • the antistatic component includes insulating glue, and the insulating glue covers the connecting circuit.
  • the insulating glue can be any one of low-viscosity transparent glue, low-viscosity fluorescent ultraviolet (UV) curing glue, or high-viscosity blue glue or a combination thereof.
  • Transparent insulating glue which is convenient for production line inspection, improves production efficiency, has a significant effect in preventing electrostatic breakdown, and can improve the reliability of camera modules.
  • the camera module also includes a base formed on the circuit board through a molding process, the base covers the driving circuit, the base includes a light hole for allowing light to enter the image sensor, and the lower group of lens barrels is installed on the base superior.
  • the connection circuit when the connection circuit includes the first conductive score line and the second conductive score line, the base includes a first groove and a second groove, and conductive materials are arranged in the first groove and the second groove ; One end of the first conductive line is in direct contact with the conductive material in the first groove, and is electrically connected to the drive circuit through the conductive material in the first groove; one end of the second conductive line is in contact with the second groove.
  • the conductive material in the second groove is in direct contact and is electrically connected to the driving circuit through the conductive material in the second groove.
  • the conductive material is, for example, conductive silver glue, but not limited thereto.
  • the drive circuit provides electrical energy (such as applying a linear voltage) to the adjustable lens through the conductive material in the first groove and the second groove, the first conductive score line and the second conductive score line, so that the adjustable lens can generate light. changes in focus.
  • the base when the grounding element includes a ground wire, the base includes a third groove, and a conductive material is disposed in the third groove, and one end of the ground wire is in direct contact with the conductive material in the third groove, and passes through the third groove.
  • the conductive material in the three grooves is electrically connected to the circuit board.
  • a grounding pad is provided on the circuit board, and the ground wire is electrically connected to the grounding pad through the conductive material in the third groove, so as to realize the grounding process.
  • the camera module further includes a filter, and the filter is mounted on the side of the base away from the circuit board, and is located between the adjustable lens and the image sensor. Furthermore, the filter is located between the lower lens barrel and the image sensor. Filters are used to reduce red light or infrared light from entering the image sensor, suppress stray light, and improve image quality.
  • the adjustable lens includes a transparent support layer, a transparent deformable layer, and a piezoelectric layer that are sequentially stacked.
  • the piezoelectric layer is used to deform the deformable layer after electrification, thereby changing the curvature of the optical surface of the adjustable lens. radius. Since the adjustable lens is electric focusing, and does not need a mechanical structure to drive during the focusing process, the focusing speed is fast and the power consumption is low.
  • the camera module also includes a non-adjustable lens (also known as a conventional lens, or a non-adjustable focus lens), and the non-adjustable lens is built between the upper group lens barrel and the lower group lens barrel; the non-adjustable lens is located between the adjustable lens The side closer to the circuit board; alternatively, the non-adjustable lens is on the side of the adjustable lens away from the circuit board.
  • Non-adjustable and adjustable lenses work together to converge or diverge light.
  • the number of non-adjustable mirrors can be one or more.
  • the adjustable lens may be the lens closest to the image sensor, the lens farthest from the image sensor, or located between two non-adjustable lenses.
  • the second aspect of the present application provides an electronic device, which includes the camera module described in the first aspect.
  • the electronic device is, for example, a mobile phone, or a notebook computer, a car, a home robot, etc., to achieve fast auto-focus and low-power focus.
  • the camera module is not limited to use on the front or back of the electronic device.
  • FIG. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 2 is an exploded view of the camera module in FIG. 1 .
  • FIG. 3 is a schematic diagram of the electrical connection between the adjustable lens and the connecting circuit in FIG. 2 .
  • FIG. 4 is a schematic structural diagram of the adjustable lens in FIG. 2 .
  • FIG. 5 is a schematic circuit diagram when the antistatic component is a ground wire in an embodiment of the present application.
  • FIG. 6 is a schematic circuit diagram when the antistatic component is a capacitor in an embodiment of the present application.
  • FIG. 7 is a schematic circuit diagram of a drive circuit connected to a ground capacitor in an embodiment of the present application.
  • FIG. 8 is a simulation curve diagram of electric field distribution of contact discharge when the camera module does not include a ground wire and does not include a capacitor.
  • FIG. 9 is a comparison graph of the contact discharge electric field distribution simulation of the camera module under the premise that the anti-static component does not include a capacitor, and when the ground wire is included and the ground wire is not included.
  • Fig. 10 is a comparison graph of the contact discharge electric field distribution simulation of the camera module under the premise that the anti-static component does not include a ground wire, when the capacitor is included and when the capacitor is not included.
  • Fig. 11 is a comparison graph of the contact discharge electric field distribution simulation curve of the camera module under the premise that the anti-static component includes a ground wire, includes a capacitor and does not include a capacitor.
  • FIG. 12 is a parameter table of capacitors included in the comparison of simulations in FIG. 10 and FIG. 11 .
  • FIG. 13 is a schematic diagram of the connecting circuit inside the barrel wall of the lower lens barrel in other embodiments of the present application.
  • the first aspect of the embodiment of the present application provides a camera module, which aims to solve the problem of poor fast focusing and anti-static interference caused by the external adjustable lens in the prior art and no electrostatic protection measures or ineffective protection measures.
  • a camera module which aims to solve the problem of poor fast focusing and anti-static interference caused by the external adjustable lens in the prior art and no electrostatic protection measures or ineffective protection measures.
  • the second aspect of the embodiments of the present application further provides an electronic device, which includes the camera module of the first aspect.
  • the electronic device is, for example, a mobile phone.
  • the above-mentioned camera module can also be applied to notebook computers, automobiles, household robots, etc., to achieve fast auto-focus and low-power focus. Since the adjustable lens is located between the upper lens barrel and the lower lens barrel in the aforementioned camera module, the overall height of the camera module is relatively low, and it is convenient to be placed inside the electronic device. In addition, the camera module can be used on the front and back of the electronic device.
  • FIG. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • the camera module 100 includes a circuit board 10 , a base 40 located on the circuit board 10 , a lower group lens barrel 61 located on the side of the base 40 away from the circuit board 10 , and a lower group lens barrel 61 located away from the circuit board 10 .
  • the upper group lens barrel 62 on one side.
  • the lower lens barrel 61 includes a connecting portion 611 and a carrying portion 612 for carrying lenses (such as adjustable lenses and/or non-adjustable lenses hereinafter).
  • the connecting part 611 and the carrying part 612 are connected to each other and can be integrally formed.
  • the connecting portion 611 is substantially rectangular and is fixedly connected to the base 40 .
  • the outer contour of the carrying portion 612 is substantially a circular boss.
  • the bearing part 612 is fixedly connected with the upper lens barrel 62 .
  • the outer surface of the lower group lens barrel 61 is provided with a first conductive reticle 71 , a second conductive reticle 72 and a third conductive reticle 73 at intervals, and the first conductive reticle 71 , the second conductive reticle 72 and the third Each of the conductive marking lines 73 extends directly from the outer surface of the bearing portion 612 to the junction of the connecting portion 611 and the base 40 .
  • the base 40 has a portion extending beyond the lower lens barrel 61, on this portion, the base 40 includes first grooves 41 respectively corresponding to the first conductive score line 71, the second conductive score line 72 and the third conductive score line 73 , the second groove 42 and the third groove 43 .
  • the first groove 41 , the second groove 42 and the third groove 43 all pass through two opposite surfaces of the base 40 and expose the surface of the circuit board 10 .
  • FIG. 2 is an exploded view of the camera module in FIG. 1 .
  • the camera module 100 includes an image sensor 30 and a driving circuit 20 arranged at intervals on the circuit board 10 , an optical filter 50 located between the lower lens barrel 61 and the image sensor 30 , and an optical filter 50 located between the upper lens barrel 61 . 62 and the adjustable mirror 80 between the lower group lens barrel 61.
  • the carrying portion 612 of the lower lens barrel 61 includes a receiving groove 6121 recessed toward the connecting portion 611 .
  • the accommodating groove 6121 is used for accommodating the adjustable lens 80 .
  • the circuit board 10 can be a flexible circuit board, a rigid circuit board or a rigid-flex board.
  • the image sensor 30 is a device that converts optical signals into electrical signals, for example, a charge-coupled device (Charge-coupled Device, CCD) or a complementary metal-oxide semiconductor (Complementary Metal-Oxide Semiconductor, CMOS) photosensitive chip.
  • CCD Charge-coupled Device
  • CMOS complementary metal-oxide semiconductor
  • the image sensor 30 is electrically connected to the circuit board 10 through wires, for example.
  • other electronic components may also be installed on the circuit board 10 .
  • the electronic components are, for example, resistors, capacitors, diodes, triodes, potentiometers, relays, or drivers.
  • the driving circuit 20 is, for example, a driver integrated chip (driver IC).
  • the circuit board 10 can also connect the camera module 100 to the main board of the electronic device, for example, the image sensor 30 and the adjustable lens 80 are electrically connected to the main board of the electronic device, so that the camera module 100 and the electronic device communicate with the motherboard.
  • the image sensor 30 forms an image under the control of the main board
  • the adjustable mirror 80 adjusts the focus under the control of the main board.
  • the base 40 is formed on the circuit board 10 through a molding process.
  • the base 40 covers the driving circuit 20 , and the base 40 includes a light hole 46 for allowing light to enter the image sensor 30 .
  • the lower lens barrel 61 and the upper lens barrel 62 are located on a side of the image sensor 30 away from the circuit board 10 .
  • the lower lens barrel 61 is mounted on the base 40 .
  • the base 40 includes a substantially rectangular ring-shaped main body portion 44 and a support portion 45 extending inward from the main body portion 44 (the inward extension can be understood as extending toward the optical center of the camera module 100 ).
  • the main body 44 is fixedly connected to the lower lens barrel 61 , and a side edge of the main body 44 has a portion extending beyond the lower lens barrel 61 .
  • the first groove 41 , the second groove 42 and the third groove 43 are formed on the main body 44 and pass through two opposite surfaces of the main body 44 .
  • the supporting portion 45 is also substantially in the shape of a rectangular ring.
  • the light hole 46 is opened at a position of the base 40 corresponding to the image sensor 30 and is roughly rectangular.
  • An L-shaped step is formed at the junction of the main body portion 44 and the supporting portion 45 .
  • the filter 50 is used to reduce red light or infrared light from entering the image sensor 30 , suppress stray light, and improve imaging quality.
  • the optical filter 50 is substantially rectangular, and the optical filter 50 is mounted on the L-shaped step of the base 40 .
  • the filter 50 is located between the adjustable mirror 80 and the image sensor 30 .
  • the filter 50 is located between the lower lens barrel 61 and the image sensor 30 .
  • the setting of the L-shaped step facilitates quick assembly of the optical filter 50 and the base 40 .
  • the side wall of the step can also realize the position limitation of the optical filter 50 to ensure the accuracy of the relative position of the optical filter 50 and the image sensor 30 .
  • the adjustable lens 80 is used for deforming after electrification to adjust the focal length.
  • the adjustable lens 80 is built between the upper group lens barrel 62 and the lower group lens barrel 61 , and is accommodated in the receiving groove 6121 of the lower group lens barrel 61 .
  • the adjustable lens 80 and the lower lens barrel 61 are fixed by gluing or fitting, so as to facilitate the assembly of the adjustable lens 80 and the stability of imaging. Since in the camera module 100, the adjustable lens 80 is located between the upper group lens barrel 62 and the lower group lens barrel 61, the total height of the camera module 100 can be reduced, the volume is saved, and it is convenient to be placed inside the electronic device.
  • the camera module 100 can also reduce the structural complexity and assembly difficulty, and has a compact structure, which is beneficial to realize the miniaturization design of the module. Moreover, the problem of high risk of failure due to strong magnetic interference of the voice coil motor can also be avoided.
  • the external adjustable lens of the lens group it also has the advantages of the overall height of the camera module and the compact structure. Compared with the dual-camera module, it also has the advantages of overall height and compact structure of the camera module.
  • the adjustable lens 80 is electrically adjustable, and does not need a mechanical structure to drive during the focusing process, so the focusing speed is fast and the power consumption is low.
  • the lower lens barrel 61 is provided with a connecting circuit 70, and the adjustable lens 80 is electrically connected to the driving circuit 20 through the connecting circuit 70, so as to be deformed under the driving of the driving circuit 20, thereby adjusting the camera module. 100 focal power.
  • FIG. 4 is a schematic structural diagram of the adjustable lens in FIG. 2 .
  • the adjustable lens 80 includes a support layer 81 , a piezoelectric layer 82 and a glass plate 83 which are sequentially stacked.
  • the supporting layer 81 is substantially rectangular, and is transparent, and its material is, for example, glass, so as to support various film layers (eg, the piezoelectric layer 82 and the glass plate 83 ) thereon.
  • the piezoelectric layer 82 is approximately circular and can be deformed after electrification, and the material is, for example, piezoelectric polymer or piezoelectric ceramic.
  • the glass plate 83 is approximately circular and is located on the piezoelectric layer 82 .
  • the piezoelectric layer 82 is partly covered by the glass plate 83 and partly exposed from the hole formed in the inner circle of the glass plate 83 .
  • the adjustable lens 80 includes a first current-carrying element 841 and a second current-conducting element 842 distributed at two corners of the adjustable lens 80 at intervals.
  • One end of the first electrical member 841 partially covers the glass plate 83, and is electrically connected to the piezoelectric layer 82 (or in other words, electrically connected to the adjustable mirror 80) through a via hole (not shown) passing through the glass plate 83. negative electrode).
  • the other end of the first electrical member 841 extends to cover the support layer 81 for electrical connection with the driving circuit 20 .
  • one end of the second electrical member 842 partially covers the glass plate 83, and is electrically connected to the piezoelectric layer 82 (or in other words, electrically connected to the adjustable mirror) through a via hole (not shown) passing through the glass plate 83. 80 positive pole).
  • the other end of the second conducting member 842 extends to cover the support layer 81 for electrical connection with the driving circuit 20 .
  • the adjustable lens 80 also includes a transparent deformable layer (not shown) between the supporting layer 81 and the piezoelectric layer 82 .
  • the material of the deformation layer is high molecular polymer, such as gel.
  • the driving circuit 20 can apply a voltage to the piezoelectric layer 82 through the first energizing member 841 and the second energizing member 842. After the piezoelectric layer 82 is energized, it deforms due to the piezoelectric effect (such as changing from a plane to a spherical curved surface), and drives The deformation layer is deformed, thereby changing the radius of curvature of the optical curved surface of the adjustable lens 80 .
  • the adjustable lens 80 changes the convergence path or divergence path of the light through the change of the radius of curvature to adjust the optical power.
  • the focused light of the mirror 80 is transmitted to the image sensor 30 through the filter 50 for imaging.
  • the supporting layer 81 can be light-transmitting glass.
  • the piezoelectric layer 82 When the piezoelectric layer 82 is energized, the surface of the deformable layer close to the supporting layer 81 may not be deformed due to the restriction of the supporting layer 81 . In other words, the curvature of the side of the deformable layer attached to the supporting layer 81 does not change, so that the deformation of the deformable layer is concentrated on the surface of the deformable layer away from the supporting layer 81 .
  • the expansion and contraction of the piezoelectric layer 82 will drive the surface of the deformable layer away from the support layer 81 to bulge or sag, and then make the light converge or diverge, so that the adjustable lens 80 is equivalent to a convex lens or a concave lens to achieve the function of focusing.
  • the radius of curvature of the deformed optical curved surface of the adjustable lens 80 is positively correlated with the absolute value of the voltage applied to the adjustable lens 80 . That is, the amount of deformation of the adjustable mirror 80 is proportional to the magnitude of the voltage applied to the piezoelectric layer 82 . In some embodiments, as the voltage applied to the piezoelectric layer 82 gradually increases from 0, 10V, 20V, 30V, 40V, 50V, etc., the optical curved surface of the adjustable mirror 80 gradually moves from a plane to a side farther away from the supporting layer 81. The side is convex, and the radius of curvature of the optical curved surface of the adjustable lens 80 becomes larger gradually.
  • the optical curved surface of the adjustable lens 80 gradually changes from a plane to a side close to the supporting layer 81.
  • the side is concave, and the radius of curvature of the optical curved surface of the adjustable lens 80 becomes larger gradually.
  • the purpose of focusing with low power consumption is to achieve clear far-focus and/or near-focus imaging of the camera module with built-in adjustable lenses.
  • the adjustable lens 80 can realize the electrical connection with the drive circuit 20 on the circuit board 10 through the connection circuit 70 on the lower lens barrel 61 through the first energizing member 841 and the second energizing member 842 . connect.
  • connection circuit 70 is directly formed on the outer surface of the lower group lens barrel 61 by laser direct structuring (Laser-Direct Structuring, LDS) technology.
  • the connection circuit 70 includes a first conductive score line 71 and a second conductive score line 72 .
  • the first conductive score lines 71 and the second conductive score lines 72 can be formed by directly plating metal conductive score lines (for example, gold wires) on the outer surface of the lower lens barrel 61 by using laser engraving technology.
  • the opposite ends of the first conductive reticle 71 are used to electrically connect the drive circuit 20 and the adjustable mirror 80 respectively, and the opposite ends of the second conductive reticle 72 are also used to electrically connect the drive circuit 20 and the adjustable mirror 80 respectively.
  • the drive circuit 20 provides electric energy for the adjustable lens 80 through the first conductive score line 71 and the second conductive score line 72 .
  • the driving circuit 20 includes, for example, a positive pad (not shown) and a negative pad (not shown). Both the first groove 41 and the second groove 42 on the base 40 are provided with conductive material (not shown).
  • the conductive material is, for example, conductive silver glue, but not limited thereto.
  • the conductive material in the first groove 41 is located on the circuit board 10 and is electrically connected to the anode pad of the driving circuit 20 .
  • the conductive material in the second groove 42 is located on the circuit board 10 and is electrically connected to the negative pad of the driving circuit 20 .
  • the camera module 100 includes a first conductive element 851 and a second conductive element 852 .
  • One end of the first conductive member 851 and one end of the second conductive member 852 are electrically connected to the negative pole and the positive pole of the adjustable mirror 80 through the first electric member 841 and the second electric member 842 respectively.
  • the other end of the first conductive member 851 and the other end of the second conductive member 852 are electrically connected to the first conductive score line 71 and the second conductive score line 72 respectively.
  • first conductive line 71 After one end of the first conductive line 71 is connected to the first conductive member 851, it extends along the outer surface of the lower group of lens barrels 61 to directly contact with the conductive material in the first groove 41, and passes through the conductive material in the first groove 41. The material is electrically connected to the anode pad of the driving circuit 20 .
  • second conductive line 72 After one end of the second conductive line 72 is connected to the second conductive member 852, it extends along the outer surface of the lower group lens barrel 61 to directly contact with the conductive material in the second groove 42, and passes through the second groove 42.
  • the conductive material is electrically connected to the negative pad of the driving circuit 20 .
  • the driving circuit 20 on the circuit board 10 can pass through the conductive material in the first groove 41 and the second groove 42, the first conductive line 71 and the second conductive line 72, the first conductive member 851 and the second
  • the conductive element 852 , the first electric element 841 and the second electric element 842 provide electric energy (such as applying a linear voltage) to the adjustable lens 80 , so that the adjustable lens 80 produces a change in optical power.
  • the first conductive member 851 and the second conductive member 852 may be copper wires or conductive cloth.
  • the copper wire or conductive cloth is a conductive wire that is easy to obtain, and has the advantages of being easy to assemble and reducing material costs.
  • the first conductive score lines 71 and the second conductive score lines 72 are distributed in a straight line. That is, the projections of the first conductive score line 71 and the second conductive score line 72 on the circuit board 10 both form a straight line segment. In this way, the first conductive scribe line 71 and the second conductive scribe line 72 do not have twists and turns and complicated line groove distribution, which ensures that the laser forming of the LDS process can be carried out simply and efficiently, and the working voltage of the connecting circuit 70 is stable, which can quickly and automatically produce metal conductive scribe lines , improve the overall production efficiency. Moreover, since the first conductive score lines 71 and the second conductive score lines 72 are arranged in a straight line, compared with the zigzag wire arrangement, the phenomenon of messy wires can be avoided, and the conductive layout is more reasonable and efficient.
  • the current camera module sets the adjustable lens outside the lens barrel without any electrostatic protection measures; or the protective measures are ineffective, resulting in poor fast focusing and anti-static interference capabilities.
  • the following describes in detail the electrostatic protection design of the camera module when the connecting circuit is formed on the outer surface of the lower lens barrel in the embodiment of the present application.
  • the camera module 100 includes an antistatic component to provide protection against Electro-Static Discharge (ESD) and prevent external static electricity from damaging components such as the adjustable lens 80 .
  • ESD Electro-Static Discharge
  • the antistatic component includes a ground element electrically connected to the adjustable lens 80 , and the ground element includes a ground wire.
  • FIG. 5 is a schematic circuit diagram when the antistatic component is a ground wire in an embodiment of the present application. As shown in FIG. 5 , the ground wire is electrically connected to the adjustable lens and the circuit board, so that external static electricity can be discharged through the ground wire.
  • the third conductive line 73 is located between the first conductive line 71 and the second conductive line 72 , which can be formed on the outer surface of the lower lens barrel 61 by LDS technology.
  • the third conductive line 73 is the ground line 74 . That is to say, the ground wire 74 can also be formed by directly plating metal conductive scribe lines (for example, gold wires) on the outer surface of the lower lens barrel 61 by laser engraving technology.
  • Conductive material (such as conductive silver glue) is disposed in the third groove 43 corresponding to the ground wire 74 on the base 40 .
  • ground wire 74 After one end of the ground wire 74 is electrically connected to the adjustable mirror 80, it extends along the outer surface of the lower group lens barrel 61 until it directly contacts the conductive material in the third groove 43, and is electrically connected through the conductive material in the third groove 43. connected to the circuit board 10. Wherein, for example, a grounding pad (not shown) is provided on the circuit board 10 , and the ground wire 74 is electrically connected to the grounding pad through the conductive material in the third groove 43 to realize the grounding process.
  • the third conductive line 73 (ie, the ground line 74 ) is distributed in a straight line. That is, the projection of the third conductive line 73 on the circuit board 10 is a straight line segment. In this way, the setting of the ground wire does not have twists and turns and the distribution of complicated line slots, which ensures that the laser forming of the LDS process can be carried out simply and efficiently and the working voltage of the connecting circuit is stable, and the metal conductive scribe line can be produced quickly and automatically, and the overall production efficiency is improved.
  • the third conductive reticle used as the ground wire is distributed in a straight line, compared with a zigzag wire arrangement, it can also avoid the phenomenon of messy wires, and the conductive layout is more reasonable and efficient.
  • the first conductive reticle 71, the second conductive reticle 72 and the third conductive reticle 73 are formed on the same side of the lower group lens barrel 61 (defined as being formed on the lower group lens barrel 61 in FIG.
  • the front of the base 40), the first groove 41, the second groove 42 and the third groove 43 are formed on the same side of the base 40 (defined as being formed in front of the base 40 in FIG. 3) as an example for illustration.
  • the first conductive score line and the second conductive score line used as the positive and negative electrical circuits of the adjustable lens and the third conductive score line used as the ground line can be formed on the front and rear of the lower group of lens barrels , left, and right in any direction.
  • the first conductive reticle and the second conductive reticle are located in one of the front, rear, left and right directions of the lower group lens barrel, and the third conductive reticle as a ground line is located at the front, rear, left, and right sides of the lower group lens barrel. Left and right are in different directions from the first conductive reticle and the second conductive reticle.
  • the first groove, the second groove and the third groove are formed on the base in directions corresponding to the first conductive score line, the second conductive score line and the third conductive score line respectively.
  • the first conductive reticle, the second conductive reticle, and the third conductive reticle are respectively located in different directions of the front, rear, left and right of the lower lens barrel.
  • the first conductive reticle, the second conductive reticle, and the third conductive reticle are formed on the same direction of the lower group of lens barrels, and the positive and negative current lines used as the adjustable mirror are the first conductive reticle, the second conductive reticle, and the second conductive reticle.
  • the electrified circuit used as the ground wire is the other one of the first conductive reticle, the second conductive reticle, and the third conductive reticle.
  • the grounding element electrically connected to the adjustable lens 80 includes a grounded capacitor.
  • FIG. 6 is a schematic circuit diagram when the antistatic component is a grounded capacitor in an embodiment of the present application. As shown in FIG. 6 , one end of the grounding capacitor C1 is connected to the circuit board for grounding, and the other end is electrically connected to the adjustable lens. Similarly, one end of the grounding capacitor C2 is connected to the circuit board for grounding, and the other end is electrically connected to the adjustable lens. Both the ground capacitor C1 and the ground capacitor C2 are connected in parallel with the driving circuit. Specifically, the ground capacitor C1 is electrically connected between the driving circuit and the conductive material in the first groove. The ground capacitor C2 is electrically connected between the driving circuit and the conductive material in the second groove.
  • FIG. 7 is a schematic circuit diagram of a capacitor connected to ground in a driving circuit in an embodiment of the present application.
  • Driver IC is the drive circuit
  • Load is the adjustable lens.
  • the circuit board is omitted.
  • Driver IC includes multiple input interfaces and multiple output interfaces.
  • the input interface includes device power supply voltage interface VDD, ground interface GND, serial data line (Serial Data Line, SDA) interface and serial clock line (Derail Clock Line, SCL) interface, but not limited to this.
  • the output interface includes OUTP and OUTN, but is not limited thereto.
  • FIG. 8 is a simulation curve diagram of electric field distribution of contact discharge when the camera module does not include a ground wire and does not include a capacitor. It can be obtained through contact discharge that the peak-to-peak value of static electricity (in Figure 8, the peak-to-peak value of static electricity is the maximum value of the difference between the peak 6.4226831V and the valley -16.935492V) is about 23.3V, which has the risk of electrostatic breakdown.
  • FIG. 9 is a comparison graph of the contact discharge electric field distribution simulation of the camera module under the premise that the anti-static component does not include a capacitor, and when the ground wire is included and the ground wire is not included.
  • the simulation results show the peak-to-peak value of the static electricity after the ground wire is added (in Figure 9, the peak-to-peak value of the static electricity is the peak value of 4.4442305V and the trough
  • the maximum value of the difference between -11.962517V) is about 16.3V, which is 30% lower than the 23.3V before adding the ground wire.
  • Fig. 10 is a comparison graph of the contact discharge electric field distribution simulation of the camera module under the premise that the anti-static component does not include a ground wire, when the capacitor is included and when the capacitor is not included.
  • Fig. 11 is a comparison graph of the contact discharge electric field distribution simulation curve of the camera module under the premise that the anti-static component includes a ground wire, includes a capacitor and does not include a capacitor.
  • FIG. 12 is a parameter table of capacitors included in the comparison of simulations in FIG. 10 and FIG. 11 . As shown in Figure 12, the capacitance of the capacitor is 0.10 ⁇ F, which is 100nF. In other embodiments, specific parameter values of the grounded capacitor are not limited to those shown in FIG. 12 .
  • the antistatic component includes insulating glue (not shown) covering the connection circuit.
  • the insulating glue covers the surfaces of the first conductive line, the second conductive line and the third conductive line to prevent electrostatic breakdown.
  • the insulating glue may be any one of low-viscosity transparent glue, low-viscosity fluorescent ultraviolet (UV) curing glue, or high-viscosity blue glue or a combination thereof.
  • the insulating glue prevents electrostatic breakdown of the driving circuit and the adjustable lens from failure by preventing air static electricity from entering the conductive lines (eg, the first conductive reticle, the second conductive reticle and the third conductive reticle).
  • Transparent insulating glue which is convenient for production line inspection, improves production efficiency, has a significant effect in preventing electrostatic breakdown, and can improve the reliability of camera modules.
  • the anti-static component may include any one of the ground wire, the grounded capacitor, and the insulating glue; or, a combination of any two of the ground wire, the grounded capacitor, and the insulating glue; or The ground wire, grounded capacitor, and insulating glue are all included. That is to say, the antistatic component can be provided with a conductive score line and a linear grounding design on the circuit board in any direction, front, back, left, and right, on the outer surface of the side wall of the lower group of lens barrels. Alternatively, the antistatic component can be grounded with a capacitor connected to the positive and negative poles of the drive circuit to prevent static electricity from breaking down the drive circuit and the adjustable lens. Alternatively, the anti-static component can be coated with insulating glue on the connecting circuit to prevent static electricity from entering the connecting circuit to protect the driving circuit and the static breakdown of the adjustable lens, and facilitate the operability of actual mass production and improve the small head camera. Module reliability.
  • connection circuit 70 electrically connected to the adjustable mirror 80 is embedded in the barrel wall of the lower lens barrel 61 .
  • the connection circuit 70 is formed by an insert molding process. When the body molding of the lower group lens barrel 61 is completed, the assembly of the connection circuit 70 and the lower group lens barrel 61 is completed synchronously, which facilitates production and improves production efficiency.
  • the connection circuit 70 is embedded in the wall of the lower group lens barrel 61, it is protected by the wall of the lower group lens barrel 61, and the static electricity in the air will not affect the connection circuit 70, therefore, driving can be avoided.
  • the failure of the circuit 20 and the adjustable lens 80 improves the reliability and stability of the camera module. In this case, it is only necessary to make two electrification lines to electrically connect the positive and negative poles of the adjustable lens respectively, and there is no need to prepare additional components for protection against electrostatic breakdown.
  • a non-adjustable lens 90 (also called a conventional lens, or a non-adjustable focus lens) is accommodated in the lower lens barrel 61 .
  • the non-adjustable lens 90 and the adjustable lens 80 work together to achieve light convergence or divergence.
  • the number of non-adjustable mirrors 90 may be one or more.
  • the upper and lower positions of the non-adjustable lens 90 and the adjustable lens 80 are not limited.
  • there is one non-adjustable mirror 90 and the adjustable mirror 80 is located above or below the non-adjustable mirror 90 .
  • the quantity of non-adjustable mirror 90 is a plurality of, and adjustable mirror 80 can be the mirror closest to image sensor;
  • the camera module may also include a non-adjustable lens, and the non-adjustable lens is also accommodated in the lower group lens barrel.
  • the number of non-adjustable mirrors can be one or more.
  • the upper and lower positions of the non-adjustable lens and the adjustable lens are not limited.
  • the adjustable lens is built between the upper group lens barrel and the lower group lens barrel for focusing, which is different from the existing voice coil motor, lens group with external adjustable lens, dual Compared with the camera module that performs focusing such as the camera module, the overall height of the module is small, and the volume ratio is small, which reduces the difficulty of assembly and coordination, and realizes the miniaturization of the module and the light weight of the whole machine. In addition, compared with the structure of the voice coil motor, the problem of high risk of failure due to strong magnetic interference of the voice coil motor can be avoided.
  • the adjustable lens in the embodiment of the present application is an electric focus, and does not need a mechanical structure to drive during the focusing process, so the focusing speed is fast and the power consumption is low.
  • the connecting circuit of the adjustable lens is directly formed on the outer surface of the lower lens barrel by LDS technology, and is distributed in a straight line.
  • the connecting circuit of the adjustable lens does not have twists and turns and complicated circuit groove distribution, Ensure that the laser forming of the LDS process can be carried out simply and efficiently and the working voltage of the connecting circuit is stable, which can quickly and automatically produce metal conductive scribe lines and improve the overall production efficiency.
  • the connecting circuit of the adjustable lens is distributed in a straight line, compared with the arrangement of zigzag wires, the phenomenon of messy wires can also be avoided, and the conductive layout is more reasonable and efficient.
  • the camera module can also include an antistatic component, wherein the antistatic component can include a ground wire, a grounded capacitor Any one of the three, insulating glue, or a combination of more than two, to prevent electrostatic breakdown of the drive circuit and adjustable lenses.
  • the ground wire can be directly formed on the outer surface of the lower lens barrel by using LDS technology, and the ground wire is distributed in a straight line, so as to quickly and automatically produce metal conductive scribe lines, improve the overall production efficiency, and avoid the phenomenon of messy wires. Conductive layout is more reasonable and efficient.
  • connection circuit of the adjustable lens is embedded in the barrel wall of the lower lens barrel.
  • the connecting circuit is formed by an insert injection molding process. When the body molding of the lower group lens barrel is completed, the assembly of the connecting circuit and the lower group lens barrel is completed synchronously, which facilitates production and improves production efficiency.
  • the connection circuit since the connection circuit is embedded in the wall of the lower group lens barrel, it is protected by the wall of the lower group lens barrel, and the static electricity in the air will not affect the connection circuit. Therefore, the drive circuit and adjustable Lens failure, improve the reliability and stability of the camera module. In this case, it is only necessary to make two electrification lines to electrically connect the positive and negative poles of the adjustable lens respectively, and there is no need to prepare additional components for protection against electrostatic breakdown.

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Abstract

本申请实施例涉及摄像模组技术领域，以解决摄像模组的小型化问题。本申请实施例提供一种摄像模组及电子装置。该摄像模组包括电路板、位于电路板上的图像传感器和驱动电路、位于图像传感器远离电路板的一侧的上群镜筒和下群镜筒、位于下群镜筒上的连接电路以及内置于上群镜筒和下群镜筒之间的可调镜片。可调镜片通过连接电路电性连接至驱动电路，以在驱动电路的驱动下发生形变，进而调节摄像模组的光焦度。该摄像模组具有体积占比小的优点。

Description

摄像模组及电子装置
相关申请的交叉引用
本申请要求在2021-12-31提交中国专利局、申请号为202111673537.0、申请名称为“摄像模组及电子设备”的中国专利的优先权以及在2022-01-24提交中国专利局、申请号为202210079882.X、申请名称为“摄像模组及电子装置”的中国专利的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及摄像模组技术领域，具体而言，涉及摄像模组及应用该摄像模组的电子装置。
背景技术
由于智能移动终端的迅猛发展和普及，衍生了诸多新兴行业，如直播、Vlog、短视频等需要快速且高质量成像领域，其对智能终端设备提出了强要求：快速自动对焦(auto focus,AF)、AF模组小型化、屏幕开孔极致小、远焦和近焦成像清晰。目前常见的对焦模组因制程能力和成本原因优选音圈马达、镜头组外置可调镜片、双摄模组等。但因音圈马达结构复杂、体积占比较大、机械可靠性较差、组装配合难度高，不利于实现模组小型化且音圈马达强磁干扰失效风险高。镜头组外置可调镜片导致增加镜头总高增加、抗静电击穿性能差、致可靠性风险高，并无法满足在移动终端正面工况下使用。双摄模组因调焦不理想、对焦速度慢、体积占比较大、功耗高，不利于整机轻量化和低功耗等需求，加之各用户对智能移动终端硬件质量与使用安全的需求也与之增大。
发明内容
本申请第一方面提供一种摄像模组，其包括：
电路板；
图像传感器和驱动电路，位于电路板上；
上群镜筒和下群镜筒，位于图像传感器远离电路板的一侧；
连接电路，位于下群镜筒上；以及
可调镜片，内置于上群镜筒和下群镜筒之间，可调镜片通过连接电路电性连接至驱动电路，以在驱动电路的驱动下发生形变，进而调节摄像模组的光焦度。
由于上述的摄像模组中，可调镜片内置于上群镜筒和下群镜筒之间，与现有的音圈马达、镜头组外置可调镜片、双摄模组等结构相比，模组总高低，体积占比小，降低了组装配合难度，利用实现模组的小型化以及整机轻量化的需求。另外，相较于音圈马达的结构，还可避免音圈马达强磁干扰失效风险高的问题。此外，本申请实施例的可调镜片为电动调焦，在对焦过程中，并不需要机械结构进行驱动，对焦速度快，功耗低。
一些实施例中，连接电路内嵌于下群镜筒的筒壁内。连接电路通过嵌件注塑工艺形成。在完成下群镜筒的本体成型时同步完成连接电路与下群镜筒的组装，便于生产，提高生产效 率。此外，由于连接电路内嵌于下群镜筒的筒壁内，其被下群镜筒的筒壁所保护，空气中的静电不会对连接电路造成影响，因此，可避免驱动电路和可调镜片失效，提高摄像模组可靠性和稳定性。该种情况下，只需做两条通电线路，以分别电性连接可调镜片的正负极即可，而无需额外制备防护静电击穿的元件。
一些实施例中，连接电路通过激光直接成型技术形成于下群镜筒的外表面上。利用激光镭雕技术直接在下群镜筒的外表面上镀金属导电刻线(例如，金线)形成。
一些实施例中，连接电路包括间隔设置且相互绝缘的第一导电刻线和第二导电刻线，第一导电刻线的相对两端分别电性连接驱动电路和可调镜片的正极，第二导电刻线的相对两端分别电性连接驱动电路和可调镜片的负极。如此，驱动电路可分别通过第一导电刻线和第二导电刻线向可调镜片提供电能(如施加线性电压)，以使可调镜片产生光焦度的变化。
一些实施例中，第一导电刻线和第二导电刻线在电路板上的投影均呈一条直线段。即，第一导电刻线和第二导电刻线为直线型线路分布。如此，第一导电刻线和第二导电刻线没有曲折和复杂的线路槽分布，保证LDS工艺激光成型可简单高效进行以及连接电路的工作电压稳定，可快速自动化生产金属导电刻线，提高整体生产效率。而且，由于第一导电刻线和第二导电刻线为直线型线路分布，相较于曲折的导线布置，还可避免导线杂乱的现象，导电布局更合理和高效。
一些实施例中，摄像模组还包括防静电组件，以提供静电释放(Electro-Static Discharge，ESD)的保护，防止外界的静电对可调镜片等元件造成损坏。防静电组件包括接地元件，接地元件电性连接可调镜片。
一些实施例中，接地元件包括地线，地线通过激光直接成型技术形成于下群镜筒的外表面上，地线电性连接可调镜片与驱动电路。其中，地线可形成在下群镜筒的前、后、左、右中的任意一方向上。
一些实施例中，地线在电路板上的投影呈一条直线段。即，地线为直线型线路分布，以快速自动化生产金属导电刻线，提高整体生产效率，并避免导线杂乱的现象，导电布局更合理和高效。
一些实施例中，接地元件包括电容，电容一端接地，另一端电性连接可调镜片和驱动电路。具体地，电容一端连接电路板以实现接地处理，另一端电性连接可调镜片。电容和驱动电路并联设计。
一些实施例中，防静电组件包括绝缘胶，绝缘胶覆盖连接电路。绝缘胶可选低粘度透明胶、低粘度荧光紫外光(UV)固化胶、或高粘度蓝胶中的任意之一或其组合。透明的绝缘胶，便于产线检验，提高生产效率，防护静电击穿效果显著，可提升摄像模组可靠性。
一些实施例中，摄像模组还包括经模塑工艺形成于电路板上的底座，底座包覆驱动电路，底座包括用于使光线入射至图像传感器的通光孔，下群镜筒安装于底座上。
一些实施例中，连接电路包括第一导电刻线和第二导电刻线的情况下，底座包括第一凹槽和第二凹槽，第一凹槽和第二凹槽内均设置有导电材料；第一导电刻线的一端与第一凹槽内的导电材料直接接触，并通过第一凹槽内的导电材料电性连接至驱动电路；第二导电刻线的一端与第二凹槽内的导电材料直接接触，并通过第二凹槽内的导电材料电性连接至驱动电路。导电材料例如为导电银胶，但不限于此。如此，驱动电路经第一凹槽和第二凹槽内的导电材料、第一导电刻线和第二导电刻线向可调镜片提供电能(如施加线性电压)，以使可调镜片产生光焦度的变化。
一些实施例中，接地元件包括地线的情况下，底座包括第三凹槽，第三凹槽内设置有导电材料，地线的一端与第三凹槽内的导电材料直接接触，并通过第三凹槽内的导电材料电性连接至电路板。其中，电路板上例如设置有接地焊垫，地线通过第三凹槽内的导电材料电性连接至该接地焊垫，以实现接地处理。
一些实施例中，摄像模组还包括滤光片，滤光片搭载于底座远离电路板的一侧上，并位于可调镜片和图像传感器之间。更进一步地，滤光片位于下群镜筒和图像传感器之间。滤光片用于减少红光或红外线进入图像传感器中，并抑制杂散光，提高成像质量。
一些实施例中，可调镜片包括依次层叠设置的透明的支撑层、透明的变形层以及压电层，压电层用于通电后使变形层发生形变，进而改变可调镜片的光学曲面的曲率半径。由于可调镜片为电动调焦，且在对焦过程中，并不需要机械结构进行驱动，对焦速度快，功耗低。
一些实施例中，摄像模组还包括不可调镜片(也称常规镜片，或者不可调焦镜片)，不可调镜片内置于上群镜筒和下群镜筒之间；不可调镜片位于可调镜片靠近电路板的一侧；或者，不可调镜片位于可调镜片远离电路板的一侧。不可调镜片和可调镜片共同作用，以实现光线的汇聚或发散。不可调镜片的数量可为一个或多个。不可调镜片的数量为多个时，可调镜片可以为最靠近图像传感器的那个镜片、最远离图像传感器的那个镜片或者位于两个不可调镜片之间。
本申请第二方面提供一种电子装置，其包括第一方面所述的摄像模组。电子装置例如为手机，或者笔记本电脑、汽车、家用机器人等，以实现快速自动对焦和低功耗对焦。另外，该摄像模组不限于电子装置的正面还是背面使用。
附图说明
图1为本申请一实施例的摄像模组的结构示意图。
图2为图1中摄像模组的爆炸图。
图3为图2中可调镜片与连接电路电连接的示意图。
图4为图2中可调镜片的结构示意图。
图5为本申请一实施例中，防静电组件为地线时的电路示意图。
图6为本申请一实施例中，防静电组件为电容时的电路示意图。
图7为本申请一实施例中，驱动电路连接接地电容的电路示意图。
图8为摄像模组不包括地线不包括电容时，接触放电电场分布仿真曲线图。
图9为防静电组件不包括电容的前提下，包括地线和不包括地线时，摄像模组的接触放电电场分布仿真对比曲线图。
图10为防静电组件不包括地线的前提下，包括电容和不包括电容时，摄像模组的接触放电电场分布仿真对比曲线图。
图11为防静电组件包括地线的前提下，包括电容和不包括电容时，摄像模组的接触放电电场分布仿真对比曲线图。
图12为图10和图11中仿真对比时，包括的电容的参数表。
图13为本申请另一些实施例中，连接电路在下群镜筒的筒壁内的示意图。
主要元件符号说明：
摄像模组        100
电路板                           10
驱动电路                         20
图像传感器                       30
底座                             40
第一凹槽                         41
第二凹槽                         42
第三凹槽                         43
主体部                           44
承靠部                           45
通光孔                           46
滤光片                           50
下群镜筒                         61
连接部                           611
承载部                           612
容置槽                           6121
上群镜筒                         62
连接电路                         70
第一导电刻线                     71
第二导电刻线                     72
第三导电刻线                     73
地线                             74
可调镜片                         80
支撑层                           81
压电层                           82
玻璃板片                         83
第一通电件                       841
第二通电件                       842
第一导电件                       851
第二导电件                       852
不可调镜片                       90
电容                             C1、C2
具体实施方式
为实现上述目的，本申请实施例的第一方面提供一种摄像模组，旨在解决现有技术可调镜片外置且未做静电防护措施或防护措施无效导致快速对焦和抗静电干扰能力差的技术问题，并同步实现可调镜片模组前置化满足降低移动终端部件厚度需要；使其在视频直播/自拍应用中实现近焦、远焦都清晰的目标，并实现小型化和低功耗，构筑Vlog竞争力。
本申请实施例的第二方面还提供一种电子装置，其包括第一方面的摄像模组。电子装置例如为手机。此外，上述的摄像模组还可应用于笔记本电脑、汽车、家用机器人等，实现快速自动对焦和低功耗对焦。由于上述的摄像模组中，可调镜片位于上群镜筒和下群镜筒之间，摄像模组总高较低，便于放置在电子装置内部。另外，该摄像模组可于电子装置的正面和背面使用。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。
图1为本申请一实施例的摄像模组的结构示意图。如图1所示，摄像模组100包括电路板10、位于电路板10上的底座40、位于底座40远离电路板10一侧的下群镜筒61以及位于下群镜筒61远离电路板10一侧的上群镜筒62。
下群镜筒61包括连接部611和用于承载镜片(如下文的可调镜片和/或不可调镜片)的承载部612。连接部611和承载部612相互连接，并可一体成型。连接部611大致呈矩形，并与底座40固定连接。承载部612的外部轮廓大致呈圆形凸台。承载部612与上群镜筒62固定连接。
下群镜筒61的外表面上间隔设置有第一导电刻线71、第二导电刻线72和第三导电刻线73，且第一导电刻线71、第二导电刻线72和第三导电刻线73中的每一条均自承载部612的外表面径直延伸至连接部611与底座40的连接处。
底座40具有延伸超出下群镜筒61的部分，在该部分上，底座40包括分别对应第一导电刻线71、第二导电刻线72和第三导电刻线73设置的第一凹槽41、第二凹槽42和第三凹槽43。第一凹槽41、第二凹槽42和第三凹槽43均贯穿底座40的相对两表面，且均暴露出电路板10的表面。
图2为图1中摄像模组的爆炸图。如图2所示，摄像模组100包括间隔设置于电路板10上的图像传感器30和驱动电路20、位于下群镜筒61和图像传感器30之间的滤光片50以及位于上群镜筒62和下群镜筒61之间的可调镜片80。下群镜筒61的承载部612包括朝向连接部611凹陷的容置槽6121。容置槽6121用于收容可调镜片80。
电路板10可以为软性电路板、硬性电路板或软硬结合板。图像传感器30为将光信号转换为电信号的器件，例如，电荷耦合器件(Charge-coupled Device，CCD)或互补金属氧化物半导体(Complementary Metal-Oxide Semiconductor，CMOS)感光芯片。图像传感器30例如通过导线与电路板10电性连接。另外，电路板10上还可安装有其他电子元件(图未示)。电子元件例如为阻、电容、二极管、三极管、电位器、继电器或者驱动器等。驱动电路20例如为驱动集成芯片(driver integrated chip，driver IC)。进一步地，电路板10还可将摄像模组100连接至电子装置的主板上，例如将图像传感器30和可调镜片80电性连接至电子装置的主板上，以使摄像模组100与电子装置的主板进行通信。例如，图像传感器30在主板的控制下成像，可调镜片80在主板的控制下调焦。
一些实施例中，底座40经模塑工艺形成于电路板10上。底座40包覆驱动电路20，且底座40包括用于使光线入射至图像传感器30的通光孔46。下群镜筒61和上群镜筒62位于图像传感器30远离电路板10的一侧。下群镜筒61安装于底座40上。
具体地，底座40包括大致呈矩形环状的主体部44和自主体部44向内延伸(向内延伸可理解为向摄像模组100的光学中心方向延伸)的承靠部45。主体部44与下群镜筒61固定连接，且主体部44的一侧边缘具有延伸超出下群镜筒61的部分。第一凹槽41、 第二凹槽42和第三凹槽43形成在主体部44上，并贯穿主体部44的相对两表面。承靠部45也大致呈矩形环状。通光孔46开设在底座40对应图像传感器30的位置，大致呈矩形。主体部44和承靠部45的连接处形成有L型台阶。
滤光片50用于减少红光或红外线进入图像传感器30中，并抑制杂散光，提高成像质量。滤光片50大致呈矩形，滤光片50搭载在底座40的L型台阶上。滤光片50位于可调镜片80和图像传感器30之间。更进一步地，滤光片50位于下群镜筒61和图像传感器30之间。其中，L型台阶的设置，方便滤光片50与底座40的快速装配。另外，台阶的侧壁还可实现对滤光片50的限位，保证滤光片50与图像传感器30的相对位置的准确性。
可调镜片80用于通电后发生形变以调节焦距。可调镜片80内置于上群镜筒62和下群镜筒61之间，并收容于下群镜筒61的容置槽6121内。可调镜片80与下群镜筒61采用胶合方式或者嵌合方式固定，保便于实现可调镜片80组立和成像稳定性。由于摄像模组100中，可调镜片80位于上群镜筒62和下群镜筒61之间，可降低摄像模组100总高，节省体积，便于其放置在电子装置内部。而且，相较于音圈马达进行调焦的方式，该摄像模组100还可降低结构复杂度和组装难度、结构紧凑，利于实现模组的小型化设计。而且，还可避免音圈马达强磁干扰失效风险高的问题。另外，相较于镜头组外置可调镜片，其同样具有摄像模组总高低，结构紧凑的优点。而相较于双摄模组，其同样具有摄像模组总高低，结构紧凑的优点。此外，可调镜片80为电动调焦，且在对焦过程中，并不需要机械结构进行驱动，对焦速度快，功耗低。
如图3所示，下群镜筒61上设置有连接电路70，可调镜片80通过连接电路70电性连接至驱动电路20，以在驱动电路20的驱动下发生形变，进而调节摄像模组100的光焦度。
图4为图2中可调镜片的结构示意图。如图4所示，可调镜片80包括依次层叠设置的支撑层81、压电层82和玻璃板片83。
支撑层81大致呈矩形，其为透明的，材料例如为玻璃，以起到支撑位于其上的各个膜层(如，压电层82和玻璃板片83)的作用。压电层82大致呈圆形，其通电后能够产生形变，材料例如为压电聚合物或压电陶瓷。玻璃板片83大致呈圆环，其位于压电层82上。压电层82部分被玻璃板片83覆盖，部分从玻璃板片83的内圆形成的孔中暴露出来。
可调镜片80包括间隔分布在可调镜片80的两个角落处的第一通电件841和第二通电件842。第一通电件841的一端部分覆盖玻璃板片83，并通过贯穿玻璃板片83的过孔(图未示)电性连接至压电层82(或者说，电性连接至可调镜片80的负极)。第一通电件841的另一端延伸覆盖支撑层81，以用于与驱动电路20电性连接。同样，第二通电件842的一端部分覆盖玻璃板片83，并通过贯穿玻璃板片83的过孔(图未示)电性连接至压电层82(或者说，电性连接至可调镜片80的正极)。第二通电件842的另一端延伸覆盖支撑层81，以用于与驱动电路20电性连接。
可调镜片80还包括位于支撑层81和压电层82之间的透明的变形层(图未示)。变形层的材料为高分子聚合物，例如凝胶。驱动电路20能够通过第一通电件841和第二通电件842向压电层82施加电压，压电层82通电后由于压电效应发生形变(如，由平面 变成球形的曲面)，并带动变形层发生形变，进而改变可调镜片80的光学曲面的曲率半径。
请结合参阅图1及图2，光经上群镜筒62传递到可调镜片80后，可调镜片80通过曲率半径的变化改变光线的汇聚路径或发散路径，以调节光焦度，经可调镜片80的调焦后的光，再经滤光片50传递到图像传感器30以成像。
图4中，支撑层81可为透光的玻璃，当压电层82通电后，变形层的靠近支撑层81的表面由于支撑层81的限制作用可不发生形变。或者说，变形层与支撑层81贴合的一面的曲率不会发生改变，而使得变形层的形变量集中变形层的远离支撑层81的表面。即，压电层82的伸缩会带动变形层的远离支撑层81的表面上凸或下凹，进而使光线汇聚或发散，使得可调镜片80相当于一个凸透镜或凹透镜，达到对焦的功能。
进一步地，可调镜片80发生形变后的光学曲面的曲率半径与施加在可调镜片80上的电压的绝对值呈正相关。即，可调镜片80的形变量与施加至压电层82上的电压的大小成正比。一些实施例中，随着施加至压电层82上的电压由0、10V、20V、30V、40V、50V等逐渐增大，可调镜片80的光学曲面由平面逐渐向远离支撑层81的一侧上凸，且可调镜片80的光学曲面的曲率半径逐渐变大。随着施加至压电层82上的电压由0、-10V、-20V、-30V、-40V、-50V等逐渐变小，可调镜片80的光学曲面由平面逐渐向靠近支撑层81的一侧下凹，且可调镜片80的光学曲面的曲率半径逐渐变大。如此，可通过调整施加在可调镜片80上的电压的大小及方向，调整可调镜片80的发生形变后的光学曲面的曲率半径，进而调整摄像模组100的光焦度，达到快速自动变焦和低功耗对焦的目的，实现内置可调镜片的摄像模组的远焦和/或近焦成像清晰。
本技术领域的普通技术人员可以理解实现上述对可调镜片施加电压，调节光焦度的方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
请结合参阅图1至图4，可调镜片80可通过第一通电件841和第二通电件842与下群镜筒61上的连接电路70实现与电路板10上的驱动电路20的电性连接。
一些实施例中，连接电路70通过激光直接成型(Laser-Direct Structuring，LDS)技术直接形成于下群镜筒61的外表面上。连接电路70包括第一导电刻线71和第二导电刻线72。第一导电刻线71和第二导电刻线72可利用激光镭雕技术直接在下群镜筒61的外表面上镀金属导电刻线(例如，金线)形成。第一导电刻线71的相对两端分别用于电性连接驱动电路20和可调镜片80，第二导电刻线72的相对两端同样分别用于电性连接驱动电路20和可调镜片80。驱动电路20通过第一导电刻线71和第二导电刻线72为可调镜片80提供电能。
驱动电路20例如包括正极焊垫(图未示)和负极焊垫(图未示)。底座40上第一凹槽41和第二凹槽42内均设置有导电材料(图未示)。导电材料例如为导电银胶，但不限于此。第一凹槽41内导电材料位于电路板10上，并电性连接至驱动电路20的正极焊垫。第二凹槽42内的导电材料位于电路板10上，并电性连接至驱动电路20的负极焊垫。
请结合参阅图3和图4，摄像模组100包括第一导电件851和第二导电件852。第一导电件851的一端和第二导电件852的一端分别通过第一通电件841和第二通电件842 电性连接可调镜片80的负极和正极。第一导电件851的另一端电和第二导电件852的另一端电分别电性连接第一导电刻线71和第二导电刻线72。
第一导电刻线71的一端连接第一导电件851后，沿下群镜筒61的外表面延伸至与第一凹槽41内的导电材料直接接触，并通过第一凹槽41内的导电材料电性连接至驱动电路20的正极焊垫。同样，第二导电刻线72的一端连接第二导电件852后，沿下群镜筒61的外表面延伸至与第二凹槽42内的导电材料直接接触，并通过第二凹槽42内的导电材料电性连接至驱动电路20的负极焊垫。如此，电路板10上的驱动电路20可通过第一凹槽41和第二凹槽42内的导电材料、第一导电刻线71和第二导电刻线72、第一导电件851和第二导电件852、第一通电件841和第二通电件842向可调镜片80提供电能(如施加线性电压)，以使可调镜片80产生光焦度的变化。
一些实施例中，第一导电件851和第二导电件852可为铜线或者导电布等。铜线或者导电布为便于获取的导电线，具有便于组装，降低材料成本的优点。
一些实施例中，第一导电刻线71和第二导电刻线72为直线型线路分布。即，第一导电刻线71和第二导电刻线72在电路板10上的投影均呈一条直线段。如此，第一导电刻线71和第二导电刻线72没有曲折和复杂的线路槽分布，保证LDS工艺激光成型可简单高效进行以及连接电路70的工作电压稳定，可快速自动化生产金属导电刻线，提高整体生产效率。而且，由于第一导电刻线71和第二导电刻线72为直线型线路分布，相较于曲折的导线布置，还可避免导线杂乱的现象，导电布局更合理和高效。
需要说明的是，目前的摄像模组将可调镜片设置于镜筒外部而未做静电防护措施；或者防护措施无效，导致快速对焦和抗静电干扰能力差。以下具体说明本申请实施例中，当连接电路形成于下群镜筒的外表面上时，摄像模组的静电防护设计。
具体地，摄像模组100包括防静电组件，以提供静电释放(Electro-Static Discharge，ESD)的保护，防止外界的静电对可调镜片80等元件造成损坏。
一些实施例中，防静电组件包括电性连接可调镜片80的接地元件，接地元件包括地线。图5为本申请一实施例中，防静电组件为地线时的电路示意图。如图5所示，地线电性连接可调镜片与电路板，以使外部静电经地线释放。
请再次参阅图3，第三导电刻线73位于第一导电刻线71和第二导电刻线72之间，其可通过LDS技术形成于下群镜筒61的外表面上。第三导电刻线73即为地线74。也就是说，地线74也可采用激光镭雕技术直接在下群镜筒61的外表面上镀金属导电刻线(例如，金线)形成。底座40上对应地线74的第三凹槽43内设置有导电材料(如，导电银胶)。地线74的一端电性连接可调镜片80后，沿下群镜筒61的外表面延伸至与第三凹槽43内的导电材料直接接触，并通过第三凹槽43内的导电材料电性连接至电路板10。其中，电路板10上例如设置有接地焊垫(图未示)，地线74通过第三凹槽43内的导电材料电性连接至该接地焊垫，以实现接地处理。
一些实施例中，第三导电刻线73(即地线74)为直线型线路分布。即，第三导电刻线73在电路板10上的投影呈一条直线段。如此，地线的设置没有曲折和复杂的线路槽分布，保证LDS工艺激光成型可简单高效进行以及连接电路的工作电压稳定，可快速自动化生产金属导电刻线，提高整体生产效率。此外，由于作为地线的第三导电刻线为直线型线路分布，相较于曲折的导线布置，还可避免导线杂乱的现象，导电布局更合理和高效。
需要说明的是，图3中以第一导电刻线71、第二导电刻线72及第三导电刻线73形成在下群镜筒61同一侧上(定义图3中为形成在下群镜筒61的前方)，第一凹槽41、第二凹槽42及第三凹槽43形成在底座40的同一侧上(定义图3中为形成在底座40的前方)为例进行说明。其他实施例中，用作可调镜片的正负极通电线路的第一导电刻线和第二导电刻线与用作地线的第三导电刻线均可形成在下群镜筒的前、后、左、右中的任意一方向上。例如，第一导电刻线和第二导电刻线位于下群镜筒的前、后、左、右其中之一方向上，作为地线的第三导电刻线位于下群镜筒的前、后、左、右中与第一导电刻线和第二导电刻线不同的方向上。相对应地，第一凹槽、第二凹槽和第三凹槽形成在底座的分别与第一导电刻线、第二导电刻线和第三导电刻线对应的方向上。或者，第一导电刻线、第二导电刻线、第三导电刻线分别位于下群镜筒的前、后、左、右不同的方向上。又或者，第一导电刻线、第二导电刻线、第三导电刻线形成在下群镜筒的同一方向上，而用作可调镜片的正负极通电线路为第一导电刻线、第二导电刻线、第三导电刻线中的任意二者，用作地线的通电线路为第一导电刻线、第二导电刻线、第三导电刻线中的另一者。
一些实施例中，防静电组件中，电性连接可调镜片80的接地元件包括接地的电容。图6为本申请一实施例中，防静电组件为接地电容时的电路示意图。如图6所示，接地电容C1一端连接电路板以实现接地处理，另一端电性连接可调镜片。同样，接地电容C2一端连接电路板以实现接地处理，另一端电性连接可调镜片。接地电容C1和接地电容C2均与驱动电路并联。具体地，接地电容C1电性连接在驱动电路和第一凹槽内的导电材料之间。接地电容C2电性连接在驱动电路和第二凹槽内的导电材料之间。
图7为本申请一实施例中，驱动电路连接接地的电容的电路示意图。图7中，Driver IC为驱动电路，Load为可调镜片。图7中，省略了电路板。Driver IC包括多个输入接口和多个输出接口。输入接口包括器件电源电压接口VDD、接地接口GND、串行数据线(Serial Data Line，SDA)接口和串行时钟线(Derail Clock Line，SCL)接口，但不限于此。输出接口包括OUTP和OUTN，但不限于此。
图8为摄像模组不包括地线不包括电容时，接触放电电场分布仿真曲线图。通过接触放电可得，其静电的峰峰值(图8中，静电的峰峰值为波峰6.4226831V和波谷-16.935492V之间的差值的最大值)约为23.3V，具有静电击穿风险。
图9为防静电组件不包括电容的前提下，包括地线和不包括地线时，摄像模组的接触放电电场分布仿真对比曲线图。如图9所示，当加接地线后，有一部分能量会明显从上面流走，通过仿真结果看到加地线后的静电峰峰值(图9中，静电的峰峰值为波峰4.4442305V和波谷-11.962517V之间的差值的最大值)约为16.3V，相比于不加地线前的23.3V，降低了30％。
图10为防静电组件不包括地线的前提下，包括电容和不包括电容时，摄像模组的接触放电电场分布仿真对比曲线图。图11为防静电组件包括地线的前提下，包括电容和不包括电容时，摄像模组的接触放电电场分布仿真对比曲线图。图12为图10和图11中仿真对比时，包括的电容的参数表。如图12所示，电容的电容量为0.10μF，即100nF。其他实施例中，接地的电容的具体参数值不限于图12所示。如图10所示，在不加地线的前提下，只加上100nF电容，看到其静电大小有着非常明显的减小。同样，如图11所示， 在加地线的前提下，加上100nF电容，看到其静电大小同样有着非常明显的减小，可见加电容以后，加不加地线，静电都会有很大改善。
一些实施例中，防静电组件包括覆盖连接电路的绝缘胶(图未示)。绝缘胶覆盖第一导电刻线、第二导电刻线和第三导电刻线的表面，以防止静电击穿。具体地，绝缘胶可选低粘度透明胶、低粘度荧光紫外光(UV)固化胶、或高粘度蓝胶中的任意之一或其组合。绝缘胶通过防止空气静电进入导电线路(如，第一导电刻线、第二导电刻线和第三导电刻线)，进而避免驱动电路和可调镜片的静电击穿失效。透明的绝缘胶，便于产线检验，提高生产效率，防护静电击穿效果显著，可提升摄像模组可靠性。
一些实施例中，防静电组件可包括地线、接地的电容、绝缘胶三者中的任意一种；或者，包括地线、接地的电容、绝缘胶三者中的任意两者的组合；或者地线、接地的电容、绝缘胶三者均包括。也就是说，防静电组件可为下群镜筒的侧壁的外表面上前、后、左、右任意方向上设置一条导电刻线与电路板直线型接地设计。或者，防静电组件可为在驱动电路的正负极连接接地的电容接地，以防护静电击穿驱动电路和可调镜片。或者，防静电组件可为在连接电路上涂覆绝缘胶，以阻止静电进入连接电路以达到防护驱动电路和可调镜片静击穿作用，并方便实际量产可操作性，提升小头部摄像模组的可靠性。
另一些实施例中，如图13所示，电性连接可调镜片80的连接电路70内嵌于下群镜筒61的筒壁内。连接电路70通过嵌件注塑工艺形成。在完成下群镜筒61的本体成型时同步完成连接电路70与下群镜筒61的组装，便于生产，提高生产效率。此外，由于连接电路70内嵌于下群镜筒61的筒壁内，其被下群镜筒61的筒壁所保护，空气中的静电不会对连接电路70造成影响，因此，可避免驱动电路20和可调镜片80失效，提高摄像模组可靠性和稳定性。该种情况下，只需做两条通电线路，以分别电性连接可调镜片的正负极即可，而无需额外制备防护静电击穿的元件。
如图13所示，下群镜筒61中还收容有不可调镜片90(也称常规镜片，或者不可调焦镜片)。不可调镜片90和可调镜片80共同作用，以实现光线的汇聚或发散。
不可调镜片90的数量可为一个或多个。不可调镜片90与可调镜片80的上下位置不限。例如，不可调镜片90的数量为一个，可调镜片80位于不可调镜片90的上方或下方。或者，如图13中的(a)图所示，不可调镜片90的数量为多个，可调镜片80可以为最靠近图像传感器的镜片；或者如图13中的(b)、(c)、(d)图所示，不可调镜片90的数量为多个，可调镜片80位于两个不可调镜片90之间；又或者如图13中的(e)图所示，不可调镜片90的数量为多个，可调镜片80为最远离图像传感器的镜片。
需要说明的是，连接线路位于下群镜筒的外表面上的情况下，摄像模组也可包括不可调镜片，同样不可调镜片收容于下群镜筒中。不可调镜片的数量可为一个或多个。不可调镜片与可调镜片的上下位置不限。
综上，本申请实施例的摄像模组，可调镜片内置于上群镜筒和下群镜筒之间以进行调焦，与现有的音圈马达、镜头组外置可调镜片、双摄模组等进行调焦的摄像模组相比，模组总高低，体积占比小，降低了组装配合难度，利用实现模组的小型化以及整机轻量化的需求。另外，相较于音圈马达的结构，还可避免音圈马达强磁干扰失效风险高的问题。此外，本申请实施例的可调镜片为电动调焦，在对焦过程中，并不需要机械结构进行驱动，对焦速度快，功耗低。
一些实施例中，可调镜片的连接电路通过LDS技术直接形成于下群镜筒的外表面上，且为直线型线路分布，如此，可调镜片的连接电路没有曲折和复杂的线路槽分布，保证LDS工艺激光成型可简单高效进行以及连接电路的工作电压稳定，可快速自动化生产金属导电刻线，提高整体生产效率。而且，由于可调镜片的连接电路为直线型线路分布，相较于曲折的导线布置，还可避免导线杂乱的现象，导电布局更合理和高效。进一步地，可调镜片的连接电路通过LDS技术直接形成于下群镜筒的外表面上的情况下，摄像模组还可包括防静电组件，其中，防静电组件可包括地线、接地的电容、绝缘胶三者中的任意一种或两者以上的组合，以防护静电击穿驱动电路和可调镜片。而且，地线可选择LDS技术直接形成于下群镜筒的外表面上，且地线为直线型线路分布，以快速自动化生产金属导电刻线，提高整体生产效率，并避免导线杂乱的现象，导电布局更合理和高效。
另一些实施例中，可调镜片的连接电路内嵌于下群镜筒的筒壁内。连接电路通过嵌件注塑工艺形成。在完成下群镜筒的本体成型时同步完成连接电路与下群镜筒的组装，便于生产，提高生产效率。此外，由于连接电路内嵌于下群镜筒的筒壁内，其被下群镜筒的筒壁所保护，空气中的静电不会对连接电路造成影响，因此，可避免驱动电路和可调镜片失效，提高摄像模组可靠性和稳定性。该种情况下，只需做两条通电线路，以分别电性连接可调镜片的正负极即可，而无需额外制备防护静电击穿的元件。
以上实施方式仅用以说明本申请的技术方案而非限制，尽管参照以上较佳实施方式对本申请进行了详细说明，本领域的普通技术人员应当理解，可以对本申请的技术方案进行修改或等同替换都不应脱离本申请技术方案的精神和范围。

Claims (17)

  1. 一种摄像模组，其特征在于，包括：
    电路板；
    图像传感器和驱动电路，位于所述电路板上；
    上群镜筒和下群镜筒，位于所述图像传感器远离所述电路板的一侧；
    连接电路，位于所述下群镜筒上；以及
    可调镜片，内置于所述上群镜筒和所述下群镜筒之间，所述可调镜片通过所述连接电路电性连接至所述驱动电路，以在所述驱动电路的驱动下发生形变，进而调节所述摄像模组的光焦度。
  2. 根据权利要求1所述的摄像模组，其特征在于，所述连接电路内嵌于所述下群镜筒的筒壁内。
  3. 根据权利要求1所述的摄像模组，其特征在于，所述连接电路通过激光直接成型技术形成于所述下群镜筒的外表面上。
  4. 根据权利要求3所述的摄像模组，其特征在于，所述连接电路包括间隔设置且相互绝缘的第一导电刻线和第二导电刻线，所述第一导电刻线的相对两端分别电性连接所述驱动电路和所述可调镜片的正极，所述第二导电刻线的相对两端分别电性连接所述驱动电路和所述可调镜片的负极。
  5. 根据权利要求4所述的摄像模组，其特征在于，所述第一导电刻线和所述第二导电刻线在所述电路板上的投影均呈一条直线段。
  6. 根据权利要求3至5中任意一项所述的摄像模组，其特征在于，所述摄像模组还包括防静电组件，所述防静电组件包括接地元件，所述接地元件电性连接所述可调镜片。
  7. 根据权利要求6所述的摄像模组，其特征在于，所述接地元件包括地线，所述地线通过激光直接成型技术形成于所述下群镜筒的外表面上，所述地线电性连接所述可调镜片与所述驱动电路。
  8. 根据权利要求7所述的摄像模组，其特征在于，所述地线在所述电路板上的投影呈一条直线段。
  9. 根据权利要求6至8中任意一项所述的摄像模组，其特征在于，所述接地元件包括电容，所述电容一端接地，另一端电性连接所述可调镜片和所述驱动电路。
  10. 根据权利要求6至9中任意一项所述的摄像模组，其特征在于，所述防静电组件包括绝缘胶，所述绝缘胶覆盖所述连接电路。
  11. 根据权利要求1至10中任意一项所述的摄像模组，其特征在于，所述摄像模组还包括经模塑工艺形成于所述电路板上的底座，所述底座包覆所述驱动电路，所述底座包括用于使光线入射至所述图像传感器的通光孔，所述下群镜筒安装于所述底座上。
  12. 根据权利要求11所述的摄像模组，其特征在于，所述连接电路包括第一导电刻线和第二导电刻线的情况下，所述底座包括第一凹槽和第二凹槽，所述第一凹槽和所述第二凹槽内均设置有导电材料；所述第一导电刻线的一端与所述第一凹槽内的所述导电材料直接接触，并通过所述第一凹槽内的所述导电材料电性连接至所述驱动电路；所述第二导电刻线的一端与所述第二凹槽内的所述导电材料直接接触，并通过所述第二凹槽内的所述导电材料电性连接至所述驱动电路。
  13. 根据权利要求11或12所述的摄像模组，其特征在于，所述接地元件包括地线的情况下，所述底座包括第三凹槽，所述第三凹槽内设置有导电材料，所述地线的一端与所述第三凹槽内的所述导电材料直接接触，并通过所述第三凹槽内的所述导电材料电性连接至所述电路板。
  14. 根据权利要求11至13中任意一项所述的摄像模组，其特征在于，所述摄像模组还包括滤光片，所述滤光片搭载于所述底座远离所述电路板的一侧上，并位于所述可调镜片和所述图像传感器之间。
  15. 根据权利要求1至14中任意一项所述的摄像模组，其特征在于，所述可调镜片包括依次层叠设置的透明的支撑层、透明的变形层以及压电层，所述压电层用于通电后使所述变形层发生形变，进而改变所述可调镜片的光学曲面的曲率半径。
  16. 根据权利要求1至15中任意一项所述的摄像模组，其特征在于，所述摄像模组还包括不可调镜片，所述不可调镜片内置于所述上群镜筒和所述下群镜筒之间；所述不可调镜片位于所述可调镜片靠近所述电路板的一侧；或者，所述不可调镜片位于所述可调镜片远离所述电路板的一侧。
  17. 一种电子装置，其特征在于，包括如权利要求1至16中任意一项所述的摄像模组。
PCT/CN2022/116617 2021-12-31 2022-09-01 摄像模组及电子装置 WO2023124181A1 (zh)

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