WO2023123198A1 - 一种半导体塑封自动上料系统及其控制方法 - Google Patents

一种半导体塑封自动上料系统及其控制方法 Download PDF

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Publication number
WO2023123198A1
WO2023123198A1 PCT/CN2021/143039 CN2021143039W WO2023123198A1 WO 2023123198 A1 WO2023123198 A1 WO 2023123198A1 CN 2021143039 W CN2021143039 W CN 2021143039W WO 2023123198 A1 WO2023123198 A1 WO 2023123198A1
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WIPO (PCT)
Prior art keywords
manipulator
feeding
rack
plastic sealing
plastic
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PCT/CN2021/143039
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English (en)
French (fr)
Inventor
麦有海
邱焕枢
姚剑锋
李伟光
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佛山市蓝箭电子股份有限公司
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Priority to PCT/CN2021/143039 priority Critical patent/WO2023123198A1/zh
Publication of WO2023123198A1 publication Critical patent/WO2023123198A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • the invention relates to the field of semiconductor production and manufacturing, in particular to a semiconductor plastic packaging and feeding system.
  • the object of the present invention is to provide an automatic feeding system for semiconductor plastic packaging and its control method, aiming at improving the production efficiency of semiconductor plastic packaging and reducing the labor intensity of workers.
  • a control method for an automatic feeding system for semiconductor plastic packaging comprising the following steps: A01. When the manipulator detects that the film arranging device is in an empty state, the manipulator recognizes and grabs the empty loading rack and puts it into the film arranging device, and the film arranging device performs the process on the empty feeding rack Film arrangement; A02. When the manipulator detects that the film arrangement device has completed the film arrangement, the manipulator grabs the finished film loading rack from the film arrangement device and puts it into the first plastic sealing device, and the first plastic sealing device feeds back the first signal to the manipulator; A03.
  • the robot When the manipulator detects The feeding device is in an empty state, the robot recognizes and grabs the empty feeding rack and puts it into the feeding device, and the feeding device discharges the empty feeding rack; The feeding rack of the material is fed into the first plastic sealing device for feeding. After the manipulator completes feeding, the feeding rack is put back into the feeding device and enters the standby state. The feeding device performs the next round of feeding on the feeding rack, while the first plastic sealing device The products on the material rack are plastic-sealed; A05.
  • the manipulator detects that the first plastic sealing device has completed the plastic sealing, the manipulator grabs the plastic-sealed material rack from the first plastic sealing device and puts it into the degumming device and enters the standby state.
  • the products on the loading rack are degummed; A06.
  • the manipulator detects that the degumming device has completed the degumming, the manipulator grabs the degumming completed feeding rack from the degumming device and transfers it to the workbench; if the production task is completed, it ends. Otherwise, repeat steps A01 to A06.
  • the control method of the semiconductor plastic packaging automatic feeding system wherein, in the process of performing steps A01 to A06, when the manipulator is in the standby state, the following steps are performed: B01. If the manipulator detects that the sheet arrangement device is in an empty state, the manipulator Identify and grab the empty loading rack and put it on the film arranging device, and the film arranging device will arrange the empty feeding rack; B02. If the manipulator detects that the film arranging device has completed the film arranging and the second plastic sealing device is in an empty state, the manipulator will finish grabbing from the film arranging device Put the loading rack of the sheet into the second plastic sealing device, and the second plastic sealing device feeds back the second signal to the manipulator; B03.
  • the manipulator grabs from the feeding device.
  • the feeding rack for feeding is fed into the second plastic sealing device for feeding. After the manipulator finishes feeding, put the feeding rack back into the feeding device, and the feeding device performs the next round of feeding on the feeding rack; B04.
  • the manipulator detects the second plastic sealing device After the plastic sealing is completed and the glue removal device is in an empty state, the manipulator grabs the plastic-sealed loading rack from the second plastic sealing device and puts it into the glue removal device.
  • the glue removal device removes glue from the products on the feeding rack.
  • the step S06 further includes: when the manipulator completes the transfer of the loading rack, the manipulator recognizes and grabs the cleaning tool to clean the glue removal device.
  • An automatic feeding system for semiconductor plastic packaging including a PLC control device, a manipulator, and a chip arrangement device, a feeding device, a first plastic packaging device, a glue removal device and a workbench arranged around the manipulator.
  • the feeding rack and the feeding rack are taken; the manipulator is respectively connected to the sheet arrangement device, the feeding device, the first plastic sealing device, and the glue removal device through the PLC control device; the semiconductor plastic sealing automatic feeding system can be used to perform the above-mentioned A control method for an automatic feeding system for semiconductor plastic encapsulation.
  • the semiconductor plastic packaging automatic feeding system further includes a second plastic packaging device arranged around the manipulator, and the manipulator communicates with the second plastic packaging device through a PLC control device.
  • a cleaning tool that can be grasped by a robot is provided on the deglue device, and the cleaning tool is used to clean waste materials on the deglue device.
  • the cleaning tool is set as an air blow gun.
  • the invention provides an automatic feeding system for semiconductor plastic packaging and a control method thereof. Compared with the prior art, by setting a sheet arrangement device, a feeding device, a first plastic packaging device, a glue removal device and a workbench around the manipulator, the manipulator is realized through the control method. Operate multiple production equipment to realize production automation, which greatly improves production efficiency, reduces the work intensity of workers, and reduces labor costs at the same time. One person can complete the monitoring and operation of the plastic sealing process.
  • FIG. 1 is a schematic diagram of the steps of a control method for an automatic feeding system for semiconductor plastic packaging according to the present invention.
  • FIG. 2 is a schematic structural view of an automatic feeding system for semiconductor plastic packaging according to the present invention.
  • the present invention provides an automatic feeding system for semiconductor plastic packaging and its control method.
  • the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the protection scope of the present invention.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection.
  • Connected, or integrally connected may be mechanically connected, may also be electrically connected or may communicate with each other; may be directly connected, or indirectly connected through an intermediary, may be the internal communication of two components or the interaction of two components relation.
  • the present invention provides a control method for automatic feeding system of semiconductor plastic packaging, including the following steps:
  • the manipulator 10 detects that the sheet arranging device 20 is in an empty state, the manipulator 10 identifies and grabs the empty loading rack 80 and puts it into the sheet arranging device 20.
  • the sheet arranging device 20 arranges the empty feeding rack 80.
  • the sheet arranging device 20 is used for The lead frame is discharged on the loading frame 80 which has a fixing function.
  • the manipulator 10 detects that the film arranging device 20 has completed the film arranging, the manipulator 10 grabs the loading rack 80 that has completed the film arranging from the film arranging device 20 and puts it into the first plastic sealing device 40, and the first plastic sealing device 40 feeds back the first signal to the manipulator 10;
  • the first feedback signal is used to indicate that the loading rack 80 has been placed in the first molding device 40 .
  • the manipulator 10 detects that the feeding device 30 is in an empty state, the manipulator 10 recognizes and grabs the empty feeding rack 90 and puts it into the feeding device 30.
  • the feeding device 30 discharges the empty feeding rack 90.
  • the feeding device 30 is used for The plastic-encapsulated particles are put into the feeding rack 90.
  • the manipulator 10 detects that the feeding device 30 has finished discharging, the manipulator 10 grabs the feeding rack 90 from the feeding device 30 and sends it into the first plastic sealing device 40 for feeding. Put into the mold hole corresponding to the lead frame on the feeding rack 80; after the manipulator 10 finishes feeding, put the feeding rack 90 back into the feeding device 30 and enter the standby state, the feeding device 30 carries out the next round of discharging to the feeding rack 90, and the first A plastic sealing device 40 plastic-seals the products on the loading rack 80 , and clamps the molds of the semiconductor devices on the loading rack 80 .
  • the manipulator 10 waits until it detects that the first plastic sealing device 40 has completed the plastic sealing.
  • the first plastic sealing device 40 opens the mold.
  • the manipulator 10 grabs the plastic-sealed loading rack 80 from the first plastic sealing device 40 and puts it into the glue removal device 60 and enters it again.
  • the standby state is to wait for the deglue device 60 to complete degumming, and the degumming device 60 degummes the products on the loading rack 80 to remove waste scraps on semiconductor products.
  • the manipulator 10 When the manipulator 10 detects that the degumming device 60 has completed degumming, the manipulator 10 grabs the degumming loading rack 80 from the degumming device 60 and transfers it to the workbench 70, where it is loaded manually or by equipment. The semiconductor devices on the shelf 80 are unloaded; if the production task is completed, then end, otherwise, repeat steps A01 to A06.
  • the above-mentioned chip arranging device 20 , feeding device 30 , first plastic sealing device 40 , and glue removing device 60 are respectively preferably a chip arranging machine, a molding material feeder, a plastic sealing machine and a glue removing machine for semiconductor production.
  • steps A01 to A06 when the manipulator 10 is in a standby state, the following steps are performed:
  • the manipulator 10 detects that the film arranging device 20 is in an empty state, the manipulator 10 recognizes and grabs the empty loading rack 80 and puts it into the film arranging device 20, and the film arranging device 20 arranges the empty feeding rack 80; B02. If the manipulator 10 detects When the sheet arranging device 20 completes the sheet arranging and the second plastic sealing device 50 is in an empty state, the manipulator 10 grabs the feeding rack 80 that has completed the sheet arranging from the sheet arranging device 20 and puts it into the second plastic sealing device 50, and the second plastic sealing device 50 feeds back the second signal To the manipulator 10; B03.
  • the manipulator 10 detects that the feeding device 30 has finished discharging and receives the second signal, the manipulator 10 grabs the feeding rack 90 from the feeding device 30 and sends it into the second plastic sealing device 50 for feeding , after the manipulator 10 completes feeding, put the feeding rack 90 back into the feeding device 30, and the feeding device 30 performs the next round of feeding on the feeding rack 90; B04.
  • the manipulator 10 grabs the plastic-sealed loading rack 80 from the second plastic sealing device 50 and puts it into the glue removal device 60.
  • the glue removal device 60 removes the glue on the products on the feeding rack 80. When the glue removal device detects 60 Complete the glue removal, return to step A06.
  • the manipulator 10 In the process of executing the above steps B01 to B04, when the manipulator 10 exits the standby state, after the manipulator 10 completes any one of the steps B01 to B04 currently being executed, it returns to continue to execute steps A01 to A06 without affecting steps A01 to B04. Execution of A06, until the manipulator 10 enters the standby state again, then continue to execute steps B01 to B04.
  • the standby time period of the manipulator 10 is effectively utilized. This time period mainly includes the plastic sealing and glue removal time. During the production of one round of products, the next round of products is produced, which greatly improves the production efficiency.
  • the step S06 further includes: when the manipulator 10 completes the transfer of the loading rack 80, the manipulator 10 recognizes and grabs the cleaning tool to clean the glue removal device 60, so as to clear the residual plastic packaging waste on the glue removal device 60 , so as to keep the degumming device 60 clean and tidy after degumming, and optimize the production environment.
  • the present invention also provides an automatic feeding system for semiconductor plastic encapsulation, including a PLC control device, a manipulator 10, and a sheet arrangement device 20 arranged around the manipulator 10, a feeding device 30, a first plastic encapsulation device 40, and Gluing device 60 and workbench 70, described workbench 70 is equipped with some feeding racks 80 and feeding racks 90 that can be grasped by manipulator 10;
  • the first plastic sealing device 40 and the glue removing device 60 are connected by communication, so as to realize information exchange between devices.
  • it also includes a second plastic sealing device 50 arranged around the manipulator 10, and the manipulator 10 communicates with the second plastic sealing device 50 through a PLC control device; by setting the second plastic sealing device 50, the manipulator 10 can Or within the glue removal time, start the next round of semiconductor device production to further improve production efficiency.
  • the deglue device 60 is provided with a cleaning tool that can be grasped by the manipulator 10, which is convenient for the manipulator 10 to clean the production waste on the degumming device 60 after each round of production; the cleaning tool is used for cleaning Sweeping waste on the glue device 60, the cleaning tool is preferably an air blow gun
  • the above-mentioned semiconductor plastic packaging automatic feeding system can realize the automatic control of multiple production equipment by one manipulator 10, effectively reducing labor costs and improving production efficiency; in addition, the above-mentioned semiconductor plastic packaging automatic feeding system will be used to perform the above The control method of the automatic feeding system for semiconductor plastic packaging is described in detail above, and will not be repeated here.

Abstract

本发明公开了一种半导体塑封自动上料系统及其控制方法，通过围绕机械手设置排片装置、投料装置、第一塑封装置、除胶装置和工作台，通过控制方法实现机械手操作多个生产设备，实现生产自动化，大大提高了生产效率，降低工人的工作强度，同时减少人力成本，一人即可完成对塑封工序的监控和操作。

Description

一种半导体塑封自动上料系统及其控制方法 技术领域
本发明涉及半导体生产制造领域，特别涉及一种半导体塑封上料系统。
背景技术
随着电子产业的蓬勃发展，在半导体后工序塑封封装中，像SOT23-X等这些高密集型的电子半导体封装外形，在传统的塑封过程中，需要将引线框架排到上料架上，排好后盖上上料盖子，再由人工把上料架放入塑封机进行塑封固化，完成塑封后将上料架取出放入除胶机进行打胶，最后完成打胶后由人工将上料架上的半导体件进行下料并移至检验工序。传统的塑封生产方法需要数个工人完成，而且效率低下，由于操作人员劳动强度高，特别是在长期操作状态下，操作人员容易出现疲劳，容易出现误操作导致产品报废，甚至出现生产事故。
可见，现有技术还有待改进和提高。
发明内容
鉴于上述现有技术的不足之处，本发明的目的在于提供一种半导体塑封自动上料系统及其控制方法，旨在提高半导体塑封的生产效率，降低工人的劳动强度。
为了达到上述目的，本发明采取了以下技术方案：
一种半导体塑封自动上料系统的控制方法，包括如下步骤：A01.当机械手检测到排片装置处于空置状态，机械手识别并抓取空上料架放至排片装置，排片装置对空上料架进行排片；A02.当机械手检测到排片装置完成排片，机械手从排片装置抓取完成排片的上料架放入第一塑封装置内，第一塑封装置反馈第一信号至机械手；A03.当机械手检测到投料装置处于空置状态，机械手识别并抓取空投料架放至投料装置，投料装置对空投料架进行放料；A04.当机械手检测到投料装置完成放料，则机械手从投料装置抓取完成放料的投料架送入第一塑封装置内进行投料，机械手完成投料后将投料架放回投料装置并进入待机状态，投料装置对投料架进行下一轮的放料，而第一塑封装置对上料架上的产品进行塑封；A05.当机械手检测到第一塑封装置完成塑封，机械手从第一塑封装置抓取完成塑封的上料架放至除胶装置并进入待机状态，而除胶装置对上料架上的产品进行除胶；A06.当机械手检测到除胶装置完成除胶，机械手从除胶装置抓取完成除胶的上料架移送至工作台；若完成生产任务，则结束，否则重复执行步骤A01至A06。
所述的半导体塑封自动上料系统的控制方法，其中，在执行步骤A01至A06的过程中，当机械手处于待机状态时，执行以下步骤：B01.若机械手检测到排片装置处于空置状态，则机械手识别并抓取空上料架放至排片装置，排片装置对空上料架进行排片；B02.若机械手检测到排片装置完成排片且第二塑封装置处于空置状态，则机械手从排片装置抓取完成排片的上料架放入第二塑封装置内，第二塑封装置反馈第二信号至机械手；B03.若机械手检测到投料装置完成放料且接收到第二信号，则机械手从投料装置抓取完成放料的投料架送入第二塑封装置内进行投料，机械手完成投料后将投料架放回投料装置，投料装置对 投料架进行下一轮的放料；B04.若机械手检测到第二塑封装置完成塑封且除胶装置处于空置状态，机械手从第二塑封装置抓取完成塑封的上料架放入除胶装置，除胶装置对上料架上的产品进行除胶，当检测到除胶装置完成除胶，返回执行步骤A06；当机械手退出待机状态时，机械手完成当前正在执行的步骤B01至B04中的任一项后，返回继续执行步骤A01至A06，直到机械手再次进入待机状态，则继续执行步骤B01至B04。
所述的半导体塑封自动上料系统的控制方法，其中，所述步骤S06还包括：当机械手完成上料架的移送，机械手识别并抓取清洁工具对除胶装置进行清洁。
一种半导体塑封自动上料系统，包括PLC控制装置、机械手，以及围绕机械手设置的排片装置、投料装置、第一塑封装置、除胶装置和工作台，所述工作台上配置有若干可用机械手抓取的上料架和投料架；所述机械手通过PLC控制装置分别与排片装置、投料装置、第一塑封装置、除胶装置通讯连接；所述半导体塑封自动上料系统可用于执行如上所述的半导体塑封自动上料系统的控制方法。
所述的半导体塑封自动上料系统，其中，还包括围绕机械手设置的第二塑封装置，所述机械手通过PLC控制装置与第二塑封装置通讯连接。
所述的半导体塑封自动上料系统，其中，所述除胶装置上设置有可用机械手抓取的清洁工具，所述清洁工具用于清扫除胶装置上的废料。
所述的半导体塑封自动上料系统，其中，所述清扫工具设置为吹气枪。
有益效果：
本发明提供了一种半导体塑封自动上料系统及其控制方法，相比现有技术，通过围绕机械手设置排片装置、投料装置、第一塑封装置、除胶装置和工作台，通过控制方法实现机械手操作多个生产设备，实现生产自动化，大大提高了生产效率，降低工人的工作强度，同时减少人力成本，一人即可完成对塑封工序的监控和操作。
附图说明
图1为本发明一种半导体塑封自动上料系统的控制方法的步骤示意图。
图2为本发明一种半导体塑封自动上料系统的结构示意图。
主要元件符号说明：10-机械手、20-排片装置、30-投料装置、40-第一塑封装置、50-第二塑封装置、60-除胶装置、70-工作台、80-上料架、90-投料架。
具体实施方式
本发明提供一种半导体塑封自动上料系统及其控制方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明的保护范围。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接连接，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
请参阅图1-2，本发明提供一种半导体塑封自动上料系统的控制方法，包括如下步 骤：
A01.当机械手10检测到排片装置20处于空置状态，机械手10识别并抓取空上料架80放至排片装置20，排片装置20对空上料架80进行排片，所述排片装置20用于将引线框架排放在具有固定功能的上料架80上。
A02.当机械手10检测到排片装置20完成排片，机械手10从排片装置20抓取完成排片的上料架80放入第一塑封装置40内，第一塑封装置40反馈第一信号至机械手10；所述反馈第一信号用表示第一塑封装置40内已放置上料架80。
A03.当机械手10检测到投料装置30处于空置状态，机械手10识别并抓取空投料架90放至投料装置30，投料装置30对空投料架90进行放料，投料装置30用于将用于塑封颗粒放入投料架90内。
A04.当机械手10检测到投料装置30完成放料，则机械手10从投料装置30抓取完成放料的投料架90送入第一塑封装置40内进行投料，机械手10控制投料架90将塑封颗粒投入上料架80上的引线框架对应的模具孔；机械手10完成投料后将投料架90放回投料装置30并进入待机状态，投料装置30对投料架90进行下一轮的放料，而第一塑封装置40对上料架80上的产品进行塑封，对上料架80上的半导体器件进行合模。
A05.机械手10待机至检测到第一塑封装置40完成塑封，第一塑封装置40开模，机械手10从第一塑封装置40抓取完成塑封的上料架80放至除胶装置60并再次进入待机状态以等待除胶装置60完成除胶，而除胶装置60对上料架80上的产品进行除胶，用于去除半导体产品上的废弃边料。
A06.当机械手10检测到除胶装置60完成除胶，机械手10从除胶装置60抓取完成除胶的上料架80移送至工作台70，在工作台70上通过人工或者设备对上料架80的半导体器件进行下料；若完成生产任务，则结束，否则重复执行步骤A01至A06。
通过上述设置，实现自动化生产，大大提高了塑封工序的生产效率，降低了工人的劳动强度，避免人工引起的误操作，同时减少人力成本，一人即可完成塑封工序的监控和操作。需要说明的是，上述的排片装置20、投料装置30、第一塑封装置40、除胶装置60分别优选为用于半导体生产的排片机、塑封料投料机、塑封机和除胶机。
请参阅图1-2，为进一步提高生产效率，在某些实施方式中，在执行步骤A01至A06的过程中，当机械手10处于待机状态时，执行以下步骤：
B01.若机械手10检测到排片装置20处于空置状态，则机械手10识别并抓取空上料架80放至排片装置20，排片装置20对空上料架80进行排片；B02.若机械手10检测到排片装置20完成排片且第二塑封装置50处于空置状态，则机械手10从排片装置20抓取完成排片的上料架80放入第二塑封装置50内，第二塑封装置50反馈第二信号至机械手10；B03.若机械手10检测到投料装置30完成放料且接收到第二信号，则机械手10从投料装置30抓取完成放料的投料架90送入第二塑封装置50内进行投料，机械手10完成投料后将投料架90放回投料装置30，投料装置30对投料架90进行下一轮的放料；B04.若机械手10检测到第二塑封装置50完成塑封且除胶装置60处于空置状态，机械手10从第二塑封装置50抓取完成塑封的上料架80放入除胶装置60，除胶装置60对上料架80上的产品进行除胶，当检测到除胶装置60完成除胶，返回执行步骤A06。
在执行上述步骤B01至B04的过程中，当机械手10退出待机状态时，机械手10完成 当前正在执行的步骤B01至B04中的任一项后，返回继续执行步骤A01至A06，不影响步骤A01至A06的执行，直到机械手10再次进入待机状态，则继续执行步骤B01至B04。通过上述控制方法，有效利用机械手10的待机时间段，该时间段主要包括塑封和除胶时间，在生产一轮产品的过程中，开始生产下一轮产品，大大提高生产效率。
作为一种优选，所述步骤S06还包括：当机械手10完成上料架80的移送，机械手10识别并抓取清洁工具对除胶装置60进行清洁，以清楚除胶装置60上残留的塑封废料，从而保持除胶装置60除胶后的整洁，优化生产环境。
请参阅图1-2，本发明还提供了一种半导体塑封自动上料系统，包括PLC控制装置、机械手10，以及围绕机械手10设置的排片装置20、投料装置30、第一塑封装置40、除胶装置60和工作台70，所述工作台70上配置有若干可用机械手10抓取的上料架80和投料架90；所述机械手10通过PLC控制装置分别与排片装置20、投料装置30、第一塑封装置40、除胶装置60通讯连接，从而实现设备之间的信息交互。
在某些实施方式中，还包括围绕机械手10设置的第二塑封装置50，所述机械手10通过PLC控制装置与第二塑封装置50通讯连接；通过设置第二塑封装置50，机械手10在塑封时间或除胶时间内，开始下一轮半导体器件的生产，进一步提高生产效率。
作为一种优选，所述除胶装置60上设置有可用机械手10抓取的清洁工具，便于机械手10在每轮生产后对除胶装置60上的生产废料进行清扫；所述清洁工具用于清扫除胶装置60上的废料，所述清扫工具优选为吹气枪
通过上述设置，上述半导体塑封自动上料系统可实现一台机械手10对多台生产设备的自动化操控，有效降低人力成本，提高生产效率；另外地，上述半导体塑封自动上料系统将可用于执行如上所述的半导体塑封自动上料系统的控制方法，由于上文对该半导体塑封自动上料系统的控制方法进行了详细的描述，此处不再赘述。
可以理解的是，对本领域普通技术人员来说，可以根据本发明的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本发明的保护范围。

Claims (7)

  1. 一种半导体塑封自动上料系统的控制方法，其特征在于，包括如下步骤：
    A01.当机械手检测到排片装置处于空置状态，机械手识别并抓取空上料架放至排片装置，排片装置对空上料架进行排片；
    A02.当机械手检测到排片装置完成排片，机械手从排片装置抓取完成排片的上料架放入第一塑封装置内，第一塑封装置反馈第一信号至机械手；
    A03.当机械手检测到投料装置处于空置状态，机械手识别并抓取空投料架放至投料装置，投料装置对空投料架进行放料；
    A04.当机械手检测到投料装置完成放料，则机械手从投料装置抓取完成放料的投料架送入第一塑封装置内进行投料，机械手完成投料后将投料架放回投料装置并进入待机状态，投料装置对投料架进行下一轮的放料，而第一塑封装置对上料架上的产品进行塑封；
    A05.当机械手检测到第一塑封装置完成塑封，机械手从第一塑封装置抓取完成塑封的上料架放至除胶装置并进入待机状态，而除胶装置对上料架上的产品进行除胶；
    A06.当机械手检测到除胶装置完成除胶，机械手从除胶装置抓取完成除胶的上料架移送至工作台；
    若完成生产任务，则结束，否则重复执行步骤A01至A06。
  2. 根据权利要求1所述的半导体塑封自动上料系统的控制方法，其特征在于，在执行步骤A01至A06的过程中，当机械手处于待机状态时，执行以下步骤：
    B01.若机械手检测到排片装置处于空置状态，则机械手识别并抓取空上料架放至排片装置，排片装置对空上料架进行排片；
    B02.若机械手检测到排片装置完成排片且第二塑封装置处于空置状态，则机械手从排片装置抓取完成排片的上料架放入第二塑封装置内，第二塑封装置反馈第二信号至机械手；
    B03.若机械手检测到投料装置完成放料且接收到第二信号，则机械手从投料装置抓取完成放料的投料架送入第二塑封装置内进行投料，机械手完成投料后将投料架放回投料装置，投料装置对投料架进行下一轮的放料；
    B04.若机械手检测到第二塑封装置完成塑封且除胶装置处于空置状态，机械手从第二塑封装置抓取完成塑封的上料架放入除胶装置，除胶装置对上料架上的产品进行除胶，当检测到除胶装置完成除胶，返回执行步骤A06；
    当机械手退出待机状态时，机械手完成当前正在执行的步骤B01至B04中的任一项后，返回继续执行步骤A01至A06，直到机械手再次进入待机状态，则继续执行步骤B01至B04。
  3. 根据权利要求2所述的半导体塑封自动上料系统的控制方法，其特征在于，所述步骤S06还包括：当机械手完成上料架的移送，机械手识别并抓取清洁工具对除胶装置进行清洁。
  4. 一种半导体塑封自动上料系统，其特征在于，包括PLC控制装置、机械手，以及围绕机械手设置的排片装置、投料装置、第一塑封装置、除胶装置和工作台，所述工作台上配置有若干可用机械手抓取的上料架和投料架；所述机械手通过PLC控制装置分别与排片装置、投料装置、第一塑封装置、除胶装置通讯连接。
  5. 根据权利要求4所述的半导体塑封自动上料系统，其特征在于，还包括围绕机械手设置的第二塑封装置，所述机械手通过PLC控制装置与第二塑封装置通讯连接。
  6. 根据权利要求5所述的半导体塑封自动上料系统，其特征在于，所述除胶装置上设置有可用机械手抓取的清洁工具，所述清洁工具用于清扫除胶装置上的废料。
  7. 根据权利要求6所述的半导体塑封自动上料系统，其特征在于，所述清扫工具设置为吹气枪。
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