WO2023116688A1 - System and method for integrated circuit failure positioning based on continuous laser source - Google Patents

System and method for integrated circuit failure positioning based on continuous laser source Download PDF

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WO2023116688A1
WO2023116688A1 PCT/CN2022/140337 CN2022140337W WO2023116688A1 WO 2023116688 A1 WO2023116688 A1 WO 2023116688A1 CN 2022140337 W CN2022140337 W CN 2022140337W WO 2023116688 A1 WO2023116688 A1 WO 2023116688A1
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circuit
tested
sample
scanning
integrated circuit
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PCT/CN2022/140337
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French (fr)
Chinese (zh)
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陈睿
韩建伟
杨涵
陈钱
梁亚楠
马英起
上官士鹏
朱翔
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中国科学院国家空间科学中心
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

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  • the invention belongs to the field of integrated circuit failure location, in particular to an integrated circuit failure location system and method based on a continuous laser source.
  • Modern integrated circuits have a very wide range of applications. For integrated circuits, it is very important to ensure that they can work stably for a long time.
  • the standard for measuring stable work is called the reliability of integrated circuits.
  • the level of reliability depends mostly on the manufacturing quality of integrated circuits. In the manufacturing technology of modern integrated circuits, the manufacture of chips needs to go through a series of technological processes, and each process may introduce different defects to the chip. The existence of defects does not necessarily lead to direct damage to the chip, but the failure of one or several specific units is more likely. In the wafer testing and packaging testing stages of chips, performing failure analysis on failed chips, locating failure points, and detecting failure causes can greatly help improve the yield rate of chip production.
  • an integrated circuit failure location system and method based on a continuous laser source including:
  • the scanning data is compared with the circuit layout diagram to obtain failure location points.
  • the circuit sample to be tested based on the infrared laser, it also includes,
  • obtaining the scan data of the circuit sample to be tested includes,
  • the method further includes,
  • a current variation distribution diagram is obtained; based on an abnormal change point in the current variation distribution diagram, the failure location point is obtained.
  • obtaining the scan data of the circuit sample to be tested includes,
  • the sample of the circuit to be tested is irradiated with laser light to obtain voltage scanning change data.
  • the method further includes,
  • a voltage variation distribution diagram is obtained; based on an abnormal change point in the voltage variation distribution diagram, the failure location point is obtained.
  • An integrated circuit failure localization system based on a continuous laser source comprising,
  • An infrared laser is used to scan the circuit sample to be tested to obtain scanning data
  • An infrared camera is used to take pictures of the circuit sample to be tested to obtain a circuit layout diagram
  • a power supply system configured to supply power to the failure location system
  • the test system is used to monitor the change of the circuit sample to be tested during the scanning process.
  • the failure location system further includes,
  • the optical path adjustment system is used to focus the laser light of the infrared laser on the active area of the circuit sample to be tested, so as to realize the accurate incidence of the laser light;
  • Programmable mobile platform used to carry the integrated circuit samples to be tested, and move in three axes according to the preset method
  • the computer control system is used to set the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform to realize the change of the parameters of the infrared laser and the movement of the position of the programmable mobile platform.
  • the power supply system includes a DC voltage source and a DC current source, the DC voltage source is used to provide a constant voltage, and the DC current source is used to provide a constant current.
  • the test system includes a voltmeter and an ammeter, and the voltmeter is used to monitor the voltage change of the circuit sample to be tested during the scanning process under constant current power supply to obtain voltage scanning change data; the ammeter is used for constant voltage Under the power supply, monitor the current change of the circuit sample to be tested during the scanning process, and obtain the current scanning change data.
  • the integrated circuit failure location system and method based on a continuous laser source provided by the present invention can be used for resistive failure point location of VLSI.
  • the present invention adopts multiple test conditions, and provides an analysis method for locating the failure point under the condition of whether there is a good product or not, and the locating result obtained is more reliable.
  • the detection accuracy of the invention reaches nA level and mV level, and the positioning accuracy reaches 0.1 ⁇ m, which improves the testing and positioning accuracy of integrated circuit failure positioning.
  • the invention applies the principle of thermal effect in the interaction between the laser scanning technology and the semiconductor material to the positioning technology, and realizes the positioning monitoring effect of high positioning accuracy, high detection efficiency and low-cost testing. It solves the problem of locating the failure point of the resistive failure of the integrated circuit, realizes the fast, accurate and reliable location of the failure point of the resistive failure of the integrated circuit and the gate damage of the transistor, and provides technical support for the research of the failure analysis of the integrated circuit.
  • Fig. 1 is a schematic diagram of the system structure of an embodiment of the present invention.
  • Fig. 2 is the technical schematic diagram of the embodiment of the present invention.
  • Fig. 3 is a test result diagram of the embodiment of the present invention.
  • An integrated circuit failure location method based on a continuous laser source comprising:
  • Obtaining scan data for a circuit sample under test includes,
  • the laser of the infrared laser of the circuit sample to be tested is focused on the active area of the circuit sample to be tested;
  • the circuit sample to be tested is irradiated with laser light to obtain the current scanning change data.
  • the method of the circuit sample to be tested also includes,
  • the current variation distribution diagram is obtained; based on the abnormal change points of the current variation distribution diagram of the circuit sample to be tested, the failure location point of the circuit sample to be tested is obtained.
  • Obtaining scan data for a circuit sample under test includes,
  • the laser of the infrared laser of the circuit sample to be tested is focused on the active area of the circuit sample to be tested;
  • the circuit sample to be tested is irradiated with laser light to obtain the voltage scanning change data.
  • the method of the circuit sample to be tested also includes,
  • the voltage change distribution diagram is obtained; based on the abnormal change points of the voltage variation distribution diagram of the circuit sample to be tested, the failure location point of the circuit sample to be tested is obtained.
  • An integrated circuit failure location system based on a continuous laser source comprising:
  • the infrared camera is used to take pictures of the circuit samples to be tested and obtain the circuit layout diagram
  • the power supply system is used to supply power to the failure location system of the circuit sample under test
  • the test system is used to monitor the change of the circuit sample to be tested during the scanning process.
  • the circuit sample failure location system under test also includes,
  • the optical path adjustment system is used to focus the laser light of the infrared laser of the circuit sample to be tested on the active area of the circuit sample to be tested, so as to realize the accurate incidence of the laser light of the circuit sample to be tested;
  • Programmable mobile platform used to carry the integrated circuit samples to be tested, and move in three axes according to the preset method
  • the computer control system is used to set the scanning parameters of the infrared laser of the circuit sample to be tested and the scanning program of the programmable mobile platform of the circuit sample to be tested, so as to realize the change of the infrared laser parameters of the circuit sample to be tested and the position of the programmable mobile platform of the circuit sample to be tested of the mobile.
  • the power supply system of the circuit sample to be tested includes a DC voltage source and a DC current source.
  • the DC voltage source of the circuit sample to be tested is used to provide a constant voltage
  • the DC current source of the circuit sample to be tested is used to provide a constant current.
  • the circuit sample testing system includes a voltmeter and an ammeter.
  • the voltmeter of the circuit sample to be tested is used for constant current power supply to monitor the voltage change of the circuit sample to be tested during the scanning process and obtain voltage scanning change data;
  • the ammeter of the circuit sample to be tested is used to Under the constant voltage power supply, monitor the current change of the circuit sample to be tested during the scanning process, and obtain the current scanning change data.
  • laser scanning technology can meet the testing requirements of high positioning accuracy, high detection efficiency, and low cost. Among them, it is a sensitive and efficient way to apply the principle of thermal effect in the interaction between laser and semiconductor materials to positioning technology.
  • the present invention proposes a failure location technology using thermal laser to locate the resistive failure of integrated circuits and transistor gate damage, and develops higher-precision test conditions for the location of failure points of integrated circuits under different failure conditions, which provides a basis for the failure of subsequent integrated circuits. Analysis provides technical support.
  • the present invention provides an integrated circuit failure location system and method based on a near-infrared continuous laser source, wherein the failure location system includes,
  • 1310nm continuous laser used to generate the irradiation source of local temperature change, induce the local resistance change of the integrated circuit and irradiate and scan the semiconductor device;
  • the optical path adjustment system is used to precisely focus the 1310nm continuous laser to the active area of the sample to be tested, and realize the accurate incidence of the 1310nm continuous laser;
  • the infrared camera is used to take pictures of the surface of the integrated circuit and observe the circuit wiring, penetrate the silicon substrate to perform two-dimensional imaging of the active area of the integrated circuit, and compare it with the located failure point;
  • the programmable mobile platform is used to carry the sample of the integrated circuit to be tested, and perform three-dimensional movement along the x, y, and z axes during the laser scanning process according to the preset method;
  • Power supply system including DC voltage source and DC current source, used to provide power supply voltage or current to semiconductor devices;
  • the test system including voltmeter, ammeter, etc., is used to detect the function of the semiconductor device and monitor the change of the current or voltage of the circuit sample under test during the scanning process.
  • the specific steps of the failure location method include,
  • the programmable mobile platform is designed for shock absorption to prevent the vibration during the movement from generating interference signals to the circuit samples to be tested.
  • the laser is focused on the active area of the circuit sample to be tested (because this system uses an infrared laser with a wavelength of 1.3 ⁇ m, which has a very high transmittance in silicon, it can directly pass through the substrate 10x, 50x and 100x objective lenses can be selected for the focusing objective lens; according to the size of the circuit sample to be tested, the scanning parameters of the 1310nm continuous laser and the three-axis scanning program of the movable platform are set through the computer control system , and move the circuit sample to be tested to the initial scanning point.
  • the scanning process is, turn on the power supply, supply power to the sample with the rated voltage of the circuit sample to be tested or 80% of the rated voltage, open the monitoring interface of the computer, wait for the monitoring current/voltage to stabilize and start scanning the sample of the circuit to be tested, monitor the sample
  • the computer system can use the preset software to convert the curve of current changing with time into a distribution surface changing with two-dimensional coordinates, and present it as a color distribution map after scanning;
  • the irradiation of the laser will cause a small change in the current or voltage of the circuit sample under test. If a constant voltage power supply is used, the test system is used to monitor the current change of the sample; if a constant current power supply is used, the test system is used to monitor the voltage change of the sample, and the current or voltage data is recorded through the computer control system;
  • the computer software overlaps the current distribution diagram with the circuit layout diagram captured by the infrared camera to determine the abnormal position of the current change. If you want to confirm the circuit layout of the abnormal area, you can replace the 50x or 100x objective lens and take partial pictures of the abnormal area;
  • the scan mode can be changed, or other power supply voltages can be set, or a constant current source can be used for power supply, and the test can be performed again, and the results of multiple tests can be compared to eliminate errors caused during the test process. If you have a non-failed sample of the same model and batch, you can perform the same test on it, and compare it with the test results of the failed sample to find the abnormal position; if there is no suitable non-failed sample for comparison, focus on the scan results Abnormal change points of medium current or voltage;
  • FIG. 3 is a curve of current changing with time obtained during the scanning process and the position of the failure point of the sample to be tested.
  • the invention can be used to locate failure points or failure units with high-resistance and low-resistance characteristics in integrated circuits, and capture the slight changes in current or voltage during laser scanning through the thermal effect principle of the interaction between laser and semiconductor materials, and determine the cause of the failure of the integrated circuit.
  • the specific failure point of the failure can capture the current change of nA level and the voltage change of ⁇ V level, and the positioning accuracy can reach 0.1 ⁇ m. It solves the problem of locating the failure point of the resistive failure of the integrated circuit, realizes a fast, accurate and reliable process of locating the failure point, and provides technical support for the research of the failure analysis of the integrated circuit.

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Abstract

Disclosed are a system and a method for integrated circuit failure positioning based on a continuous laser source, comprising: irradiating with an infrared laser a circuit sample to be detected to acquire scanning data of the circuit sample to be detected; photographing with an infrared camera the circuit sample to be detected to acquire a circuit layout diagram; and comparing the scanning data with the circuit layout diagram to obtain a failure positioning point. The present invention solves the problem of positioning the failure point of resistive failure of an integrated circuit, allowing accurate and rapid positioning of integrated circuit resistive failure and transistor gate damage. The test efficiency and positioning precision of integrated circuit failure positioning are improved, and technical support is provided for research into the analysis of integrated circuit failure.

Description

一种基于连续激光源的集成电路失效定位系统及方法Integrated circuit failure location system and method based on continuous laser source 技术领域technical field
本发明属于集成电路失效定位领域，特别是涉及一种基于连续激光源的集成电路失效定位系统及方法。The invention belongs to the field of integrated circuit failure location, in particular to an integrated circuit failure location system and method based on a continuous laser source.
背景技术Background technique
现代集成电路具有非常广泛的应用。对于集成电路而言，确保其能够长时间的稳定工作十分重要。而衡量稳定工作的标准，被称为集成电路的可靠性。可靠性的高低，大部分都取决于集成电路的制造质量。现代集成电路的制造技术中，芯片的制造需要经过一系列的工艺流程，每个流程都可能为芯片引入不同的缺陷。而缺陷的存在并不一定导致芯片直接损坏，更可能出现的是某一个或几个特定单元的失效。在芯片的晶圆测试和封装测试阶段，对失效的芯片进行故障分析，定位失效点，检测失效原因，可以对芯片生产的良率提高起到很大的帮助。Modern integrated circuits have a very wide range of applications. For integrated circuits, it is very important to ensure that they can work stably for a long time. The standard for measuring stable work is called the reliability of integrated circuits. The level of reliability depends mostly on the manufacturing quality of integrated circuits. In the manufacturing technology of modern integrated circuits, the manufacture of chips needs to go through a series of technological processes, and each process may introduce different defects to the chip. The existence of defects does not necessarily lead to direct damage to the chip, but the failure of one or several specific units is more likely. In the wafer testing and packaging testing stages of chips, performing failure analysis on failed chips, locating failure points, and detecting failure causes can greatly help improve the yield rate of chip production.
随着芯片集成度的提高、特征尺寸的减小、金属互连层厚度的增加，导致集成电路失效的失效点进行精确定位也变得越来越困难。因此，精确、高效的定位技术也是集成电路失效分析的关键所在。对于不同类型的失效，需要的定位技术并不相同。具有电阻异常特性(高阻、低阻)的失效是集成电路中常见的失效类型之一，常见的案例包括金属互连线短接、外来物引入等。另一类常见的失效类型是晶体管栅极损伤，包括裂纹、击穿等。不论是金属互连线的失效，还是晶体管的失效，由于其微小尺寸，传统的观察方法或光学显微镜定位技术 均难以实现，而利用探针进行逐点测试又效率过低，因此，针对大规模集成电路阻性失效和晶体管栅极损伤的快速精确定位技术亟待解决。With the improvement of chip integration, the reduction of feature size, and the increase of metal interconnect layer thickness, it becomes more and more difficult to accurately locate the failure point that leads to the failure of integrated circuits. Therefore, accurate and efficient positioning technology is also the key to failure analysis of integrated circuits. For different types of failures, different localization techniques are required. Failures with abnormal resistance characteristics (high resistance, low resistance) are one of the common types of failures in integrated circuits. Common cases include short-circuiting of metal interconnection lines, introduction of foreign objects, etc. Another common type of failure is transistor gate damage, including cracks, breakdown, etc. Whether it is the failure of metal interconnection lines or the failure of transistors, due to their tiny size, traditional observation methods or optical microscope positioning techniques are difficult to achieve, and point-by-point testing using probes is too inefficient. Therefore, for large-scale The rapid and precise positioning technology for resistive failure of integrated circuits and gate damage of transistors needs to be solved urgently.
发明内容Contents of the invention
为解决阻性失效和晶体管栅极损伤难以定位的问题，本发明提供了如下方案：一种基于连续激光源的集成电路失效定位系统及方法，包括：In order to solve the problems of resistive failure and transistor gate damage that are difficult to locate, the present invention provides the following solution: an integrated circuit failure location system and method based on a continuous laser source, including:
基于红外激光器照射待测电路样品，获取所述待测电路样品的扫描数据；Obtain scan data of the circuit sample to be tested by irradiating the circuit sample to be tested with an infrared laser;
基于红外相机对所述待测电路样品进行拍照，获取电路布局图；Taking pictures of the circuit sample to be tested based on an infrared camera to obtain a circuit layout diagram;
将所述扫描数据与所述电路布局图进行对照，获得失效定位点。The scanning data is compared with the circuit layout diagram to obtain failure location points.
优选地，基于红外激光器照射待测电路样品之前还包括，Preferably, before irradiating the circuit sample to be tested based on the infrared laser, it also includes,
预热所述红外激光器，将所述待测电路样品固定在可编程移动平台，对所述可编程移动平台进行供电。Preheating the infrared laser, fixing the circuit sample to be tested on a programmable mobile platform, and supplying power to the programmable mobile platform.
优选地，获取待测电路样品的扫描数据包括，Preferably, obtaining the scan data of the circuit sample to be tested includes,
通过光路调节系统，将所述红外激光器的激光聚焦在所述待测电路样品的有源区；focusing the laser light of the infrared laser on the active area of the circuit sample to be tested through an optical path adjustment system;
设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序；Setting the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform;
调节供电系统恒压供电后，对所述待测电路样品辐照激光，获得电流扫描变化数据。After adjusting the constant-voltage power supply of the power supply system, irradiate the sample of the circuit to be tested with laser light to obtain current scanning change data.
优选地，获得所述失效定位点之前，所述方法还包括，Preferably, before obtaining the failure location point, the method further includes,
基于所述电流扫描变化数据和所述电路布局图，获得电流变化量分布图；基于所述电流变化量分布图的异常变化点，获得所述失效定位点。Based on the current scanning change data and the circuit layout diagram, a current variation distribution diagram is obtained; based on an abnormal change point in the current variation distribution diagram, the failure location point is obtained.
优选地，获取待测电路样品的扫描数据包括，Preferably, obtaining the scan data of the circuit sample to be tested includes,
通过光路调节系统，将所述红外激光器的激光聚焦在所述待测电路样品的有源区；focusing the laser light of the infrared laser on the active area of the circuit sample to be tested through an optical path adjustment system;
设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序；Setting the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform;
调节供电系统恒流供电后，对所述待测电路样品辐照激光，获得电压扫描变化数据。After adjusting the constant current power supply of the power supply system, the sample of the circuit to be tested is irradiated with laser light to obtain voltage scanning change data.
优选地，获得所述失效定位点之前，所述方法还包括，Preferably, before obtaining the failure location point, the method further includes,
基于所述电压扫描变化数据和所述电路布局图，获得电压变化量分布图；基于所述电压变化量分布图的异常变化点，获得所述失效定位点。Based on the voltage scanning change data and the circuit layout diagram, a voltage variation distribution diagram is obtained; based on an abnormal change point in the voltage variation distribution diagram, the failure location point is obtained.
一种基于连续激光源的集成电路失效定位系统，包括，An integrated circuit failure localization system based on a continuous laser source, comprising,
红外激光器，用于扫描待测电路样品，获得扫描数据；An infrared laser is used to scan the circuit sample to be tested to obtain scanning data;
红外相机，用于对所述待测电路样品进行拍照，获得电路布局图；An infrared camera is used to take pictures of the circuit sample to be tested to obtain a circuit layout diagram;
供电系统，用于对所述失效定位系统进行供电；a power supply system, configured to supply power to the failure location system;
测试系统，用于监测扫描过程中待测电路样品的变化情况。The test system is used to monitor the change of the circuit sample to be tested during the scanning process.
优选地，所述失效定位系统还包括，Preferably, the failure location system further includes,
光路调节系统，用于将所述红外激光器的激光聚焦在所述待测电路样品的有源区，实现所述激光的准确入射；The optical path adjustment system is used to focus the laser light of the infrared laser on the active area of the circuit sample to be tested, so as to realize the accurate incidence of the laser light;
可编程移动平台，用于承载待测试集成电路样品，并按照预设的方式进行三轴移动；Programmable mobile platform, used to carry the integrated circuit samples to be tested, and move in three axes according to the preset method;
计算机控制系统，用于设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序，实现所述红外激光器参数的改变和所述可编程移动平台位置的移动。The computer control system is used to set the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform to realize the change of the parameters of the infrared laser and the movement of the position of the programmable mobile platform.
优选地，所述供电系统包括直流电压源、直流电流源，所述直流电压源用于实现提供恒定电压，所述直流电流源用于实现提供恒定电流。Preferably, the power supply system includes a DC voltage source and a DC current source, the DC voltage source is used to provide a constant voltage, and the DC current source is used to provide a constant current.
优选地，所述测试系统包括电压表、电流表，所述电压表用于恒流供电下，监测扫描过程中待测电路样品的电压变化情况，获得电压扫描变化数据；所述电流表用于恒压供电下，监测扫描过程中待测电路样品的电流变化情况，获得电流扫描变化数据。Preferably, the test system includes a voltmeter and an ammeter, and the voltmeter is used to monitor the voltage change of the circuit sample to be tested during the scanning process under constant current power supply to obtain voltage scanning change data; the ammeter is used for constant voltage Under the power supply, monitor the current change of the circuit sample to be tested during the scanning process, and obtain the current scanning change data.
本发明公开了以下技术效果：The invention discloses the following technical effects:
本发明提供的一种基于连续激光源的集成电路失效定位系统及方法，可用于超大规模集成电路的阻性失效点定位，相比传统的光学显微镜、扫描电子显微镜、X射线衍射等技术，具有高精度、高效率、低成本的特点。The integrated circuit failure location system and method based on a continuous laser source provided by the present invention can be used for resistive failure point location of VLSI. Compared with traditional optical microscope, scanning electron microscope, X-ray diffraction and other technologies, it has the advantages of Features of high precision, high efficiency and low cost.
本发明采用多种测试条件，并给出的有无好品对照情况下对失效点定位的分析方法，得到的定位结果更加可靠。The present invention adopts multiple test conditions, and provides an analysis method for locating the failure point under the condition of whether there is a good product or not, and the locating result obtained is more reliable.
本发明的探测精度达到nA级和mV级，定位精度达到0.1μm，提高了集成电路失效定位的测试和定位精度。The detection accuracy of the invention reaches nA level and mV level, and the positioning accuracy reaches 0.1 μm, which improves the testing and positioning accuracy of integrated circuit failure positioning.
本发明通过将激光扫描技术与半导体材料相互作用中的热效应这一原理应用到定位技术上，实现了高定位精度、高检测效率、低成本测试的定位监测效果。解决了集成电路阻性失效的失效点定位问题，实现了集成电路阻性失效和晶体管栅极破损的快速、精确、可靠的失效点定位，为集成电路失效分析的研究提供了技术支持。The invention applies the principle of thermal effect in the interaction between the laser scanning technology and the semiconductor material to the positioning technology, and realizes the positioning monitoring effect of high positioning accuracy, high detection efficiency and low-cost testing. It solves the problem of locating the failure point of the resistive failure of the integrated circuit, realizes the fast, accurate and reliable location of the failure point of the resistive failure of the integrated circuit and the gate damage of the transistor, and provides technical support for the research of the failure analysis of the integrated circuit.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1为本发明实施例的系统结构示意图；Fig. 1 is a schematic diagram of the system structure of an embodiment of the present invention;
图2为本发明实施例的技术原理图；Fig. 2 is the technical schematic diagram of the embodiment of the present invention;
图3为本发明实施例的测试结果图。Fig. 3 is a test result diagram of the embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
一种基于连续激光源的集成电路失效定位方法,包括：An integrated circuit failure location method based on a continuous laser source, comprising:
基于1310nm连续激光器照射待测电路样品，获取待测电路样品待测电路样品的扫描数据；Based on the 1310nm continuous laser irradiating the circuit sample to be tested, the scan data of the circuit sample to be tested is obtained;
基于红外相机对待测电路样品待测电路样品进行拍照，获取电路布局图；Based on the infrared camera, take pictures of the circuit samples to be tested and obtain the circuit layout diagram;
将待测电路样品扫描数据与待测电路样品电路布局图进行对照，获得失效定位点。Compare the scan data of the circuit sample under test with the circuit layout diagram of the circuit sample under test to obtain the failure location point.
基于1310nm连续激光器照射待测电路样品之前还包括，Before irradiating the circuit sample to be tested based on the 1310nm continuous laser, it also includes,
预热待测电路样品红外激光器，将待测电路样品待测电路样品固定在可编程移动平台，对待测电路样品可编程移动平台进行供电。Preheat the infrared laser of the circuit sample to be tested, fix the circuit sample to be tested on the programmable mobile platform, and supply power to the programmable mobile platform of the circuit sample to be tested.
获取待测电路样品的扫描数据包括，Obtaining scan data for a circuit sample under test includes,
通过光路调节系统，将待测电路样品红外激光器的激光聚焦在待测电路样品待测电路样品的有源区；Through the optical path adjustment system, the laser of the infrared laser of the circuit sample to be tested is focused on the active area of the circuit sample to be tested;
设定待测电路样品红外激光器的扫描参数和待测电路样品可编程移动平台的扫描程序；Setting the scanning parameters of the infrared laser of the circuit sample to be tested and the scanning program of the programmable mobile platform of the circuit sample to be tested;
调节供电系统恒压供电后，对待测电路样品待测电路样品辐照激光，获得电流扫描变化数据。After adjusting the constant voltage power supply of the power supply system, the circuit sample to be tested is irradiated with laser light to obtain the current scanning change data.
获得待测电路样品失效定位点之前，待测电路样品方法还包括，Before obtaining the failure location point of the circuit sample to be tested, the method of the circuit sample to be tested also includes,
基于待测电路样品电流扫描变化数据和待测电路样品电路布局图，获得电流变化量分布图；基于待测电路样品电流变化量分布图的异常变化点，获得待测电路样品失效定位点。Based on the current scanning change data of the circuit sample to be tested and the circuit layout diagram of the circuit sample to be tested, the current variation distribution diagram is obtained; based on the abnormal change points of the current variation distribution diagram of the circuit sample to be tested, the failure location point of the circuit sample to be tested is obtained.
获取待测电路样品的扫描数据包括，Obtaining scan data for a circuit sample under test includes,
通过光路调节系统，将待测电路样品红外激光器的激光聚焦在待测电路样品待测电路样品的有源区；Through the optical path adjustment system, the laser of the infrared laser of the circuit sample to be tested is focused on the active area of the circuit sample to be tested;
设定待测电路样品1310nm连续激光器的扫描参数和待测电路样品可编程移动平台的扫描程序；Set the scanning parameters of the 1310nm continuous laser of the circuit sample to be tested and the scanning program of the programmable mobile platform of the circuit sample to be tested;
调节供电系统恒流供电后，对待测电路样品待测电路样品辐照激光，获得电压扫描变化数据。After adjusting the constant current power supply of the power supply system, the circuit sample to be tested is irradiated with laser light to obtain the voltage scanning change data.
获得待测电路样品失效定位点之前，待测电路样品方法还包括，Before obtaining the failure location point of the circuit sample to be tested, the method of the circuit sample to be tested also includes,
基于待测电路样品电压扫描变化数据和待测电路样品电路布局图，获得电压变化量分布图；基于待测电路样品电压变化量分布图的异常变化点，获得待测电路样品失效定位点。Based on the voltage scanning change data of the circuit sample to be tested and the circuit layout diagram of the circuit sample to be tested, the voltage change distribution diagram is obtained; based on the abnormal change points of the voltage variation distribution diagram of the circuit sample to be tested, the failure location point of the circuit sample to be tested is obtained.
一种基于连续激光源的集成电路失效定位系统,包括：An integrated circuit failure location system based on a continuous laser source, comprising:
1310nm连续激光器，用于扫描待测电路样品，获得扫描数据；1310nm continuous laser, used to scan the circuit sample to be tested and obtain the scanning data;
红外相机，用于对待测电路样品待测电路样品进行拍照，获得电路布局图；The infrared camera is used to take pictures of the circuit samples to be tested and obtain the circuit layout diagram;
供电系统，用于对待测电路样品失效定位系统进行供电；The power supply system is used to supply power to the failure location system of the circuit sample under test;
测试系统，用于监测扫描过程中待测电路样品的变化情况。The test system is used to monitor the change of the circuit sample to be tested during the scanning process.
待测电路样品失效定位系统还包括，The circuit sample failure location system under test also includes,
光路调节系统，用于将待测电路样品红外激光器的激光聚焦在待测电路样品待测电路样品的有源区，实现待测电路样品激光的准确入射；The optical path adjustment system is used to focus the laser light of the infrared laser of the circuit sample to be tested on the active area of the circuit sample to be tested, so as to realize the accurate incidence of the laser light of the circuit sample to be tested;
可编程移动平台，用于承载待测试集成电路样品，并按照预设的方式进行三轴移动；Programmable mobile platform, used to carry the integrated circuit samples to be tested, and move in three axes according to the preset method;
计算机控制系统，用于设定待测电路样品红外激光器的扫描参数和待测电路样品可编程移动平台的扫描程序，实现待测电路样品红外激光器参数的改变和待测电路样品可编程移动平台位置的移动。The computer control system is used to set the scanning parameters of the infrared laser of the circuit sample to be tested and the scanning program of the programmable mobile platform of the circuit sample to be tested, so as to realize the change of the infrared laser parameters of the circuit sample to be tested and the position of the programmable mobile platform of the circuit sample to be tested of the mobile.
待测电路样品供电系统包括直流电压源、直流电流源，待测电路样品直流电压源用于实现提供恒定电压，待测电路样品直流电流源用于实现提供恒定电流。The power supply system of the circuit sample to be tested includes a DC voltage source and a DC current source. The DC voltage source of the circuit sample to be tested is used to provide a constant voltage, and the DC current source of the circuit sample to be tested is used to provide a constant current.
待测电路样品测试系统包括电压表、电流表，待测电路样品电压表用于恒流供电下，监测扫描过程中待测电路样品的电压变化情况，获得电压扫描变化数据；待测电路样品电流表用于恒压供电下，监测扫描过程中待测电路样品的电流变化情况，获得电流扫描变化数据。The circuit sample testing system includes a voltmeter and an ammeter. The voltmeter of the circuit sample to be tested is used for constant current power supply to monitor the voltage change of the circuit sample to be tested during the scanning process and obtain voltage scanning change data; the ammeter of the circuit sample to be tested is used to Under the constant voltage power supply, monitor the current change of the circuit sample to be tested during the scanning process, and obtain the current scanning change data.
相比光学显微镜、扫描电子显微镜、X射线衍射、机械微探针等其他的集成电路失效定位技术，激光扫描技术能够适应高定位精度、高检测效率、低成本的测试需求。其中，将激光与半导体材料相互作用中的热效应这一原理应用到定位技术上，是一种灵敏、高效的方式。本发明提出一种利用热激光定位集成电路阻性失效和晶体管栅极损伤的失效定位技术，并开发了不同失效情况下集成电路失效点定位的更高精度的测试条件，为后续集成电路的失效分析提供了技术支持。Compared with other integrated circuit failure location technologies such as optical microscope, scanning electron microscope, X-ray diffraction, and mechanical microprobe, laser scanning technology can meet the testing requirements of high positioning accuracy, high detection efficiency, and low cost. Among them, it is a sensitive and efficient way to apply the principle of thermal effect in the interaction between laser and semiconductor materials to positioning technology. The present invention proposes a failure location technology using thermal laser to locate the resistive failure of integrated circuits and transistor gate damage, and develops higher-precision test conditions for the location of failure points of integrated circuits under different failure conditions, which provides a basis for the failure of subsequent integrated circuits. Analysis provides technical support.
如图1所示，本发明提供了一种基于近红外连续激光源的集成电路失效定位系统及方法，其中所述失效定位系统包括，As shown in Figure 1, the present invention provides an integrated circuit failure location system and method based on a near-infrared continuous laser source, wherein the failure location system includes,
1310nm连续激光器，用于产生局部温度变化的照射源，诱发集成电路局部的电阻变化并对半导体器件进行辐照和扫描；1310nm continuous laser, used to generate the irradiation source of local temperature change, induce the local resistance change of the integrated circuit and irradiate and scan the semiconductor device;
光路调节系统，用于使1310nm连续激光精确聚焦到待测样品的有源区，实现1310nm连续激光的准确入射；The optical path adjustment system is used to precisely focus the 1310nm continuous laser to the active area of the sample to be tested, and realize the accurate incidence of the 1310nm continuous laser;
红外相机，用于对集成电路的表面进行拍照并观察电路布线，穿透硅衬底对集成电路有源区进行二维成像，并与定位的失效点进行对照；The infrared camera is used to take pictures of the surface of the integrated circuit and observe the circuit wiring, penetrate the silicon substrate to perform two-dimensional imaging of the active area of the integrated circuit, and compare it with the located failure point;
可编程移动平台，用于承载待测试集成电路样品，并按照预设方式在激光扫描过程中进行沿x、y、z轴的三维移动；The programmable mobile platform is used to carry the sample of the integrated circuit to be tested, and perform three-dimensional movement along the x, y, and z axes during the laser scanning process according to the preset method;
计算机控制系统，用于实现1310nm连续激光器参数的改变和探针台位置的移动；Computer control system for changing the parameters of the 1310nm continuous laser and moving the position of the probe station;
供电系统，包括直流电压源、直流电流源，用于实现对半导体器件提供供电电压或电流；Power supply system, including DC voltage source and DC current source, used to provide power supply voltage or current to semiconductor devices;
测试系统，包括电压表、电流表等，用于实现检测半导体器件功能以及监测扫描过程中待测电路样品电流或电压的变化。The test system, including voltmeter, ammeter, etc., is used to detect the function of the semiconductor device and monitor the change of the current or voltage of the circuit sample under test during the scanning process.
进一步地，如图2所示，失效定位方法的具体步骤包括，Further, as shown in Figure 2, the specific steps of the failure location method include,
(1)打开1310nm连续激光器，预热10分钟，使激光器稳定工作；以1310nm连续连续激光作为扫描的辐照源，对待测集成电路样品进行照射，使局部的温度升高。(1) Turn on the 1310nm continuous laser and preheat it for 10 minutes to make the laser work stably; use the 1310nm continuous continuous laser as the scanning radiation source to irradiate the IC sample to be tested to increase the local temperature.
(2)定制可编程移动平台，打开计算机上测试系统的红外相机成像界面，将预先进行背部开封装的失效芯片放在可编程移动平台中合适位置，背部朝上并固定，并连接好供电电路，等待1310nm连续激光的扫描。可编程移动平台做减震设计，以防止移动过程中的振动对待测电路样品产生干扰信号。(2) Customize the programmable mobile platform, open the infrared camera imaging interface of the test system on the computer, place the failed chip that has been pre-packaged on the back on the programmable mobile platform, fix it with the back facing up, and connect the power supply circuit , waiting for the scanning of the 1310nm continuous laser. The programmable mobile platform is designed for shock absorption to prevent the vibration during the movement from generating interference signals to the circuit samples to be tested.
(3)通过光路调节系统，将激光聚焦在待测电路样品的有源区(因本系统采用红外激光器波长为1.3μm，在硅中具有极高的透过率，因此可直接透过衬底观察到有源区)，聚焦物镜可选用10倍、50倍和100倍物镜；依照待测电路样品的尺寸，通过计算机控制系统设定好1310nm连续激光器扫描参数和可移动平台三轴的扫描程序，并将待测电路样品移动到扫描初始点。(3) Through the optical path adjustment system, the laser is focused on the active area of the circuit sample to be tested (because this system uses an infrared laser with a wavelength of 1.3 μm, which has a very high transmittance in silicon, it can directly pass through the substrate 10x, 50x and 100x objective lenses can be selected for the focusing objective lens; according to the size of the circuit sample to be tested, the scanning parameters of the 1310nm continuous laser and the three-axis scanning program of the movable platform are set through the computer control system , and move the circuit sample to be tested to the initial scanning point.
(4)通过供电系统，用导线将供电系统和测试系统的源表与待测电路样品相连接，确定接触良好，实现待测集成电路的恒压或恒流供电，供电正常后可对样品辐照激光，并开始进行扫描。(4) Through the power supply system, use wires to connect the source meter of the power supply system and the test system with the sample of the circuit to be tested, make sure that the contact is good, and realize the constant voltage or constant current power supply of the integrated circuit to be tested. After the power supply is normal, the sample can be radiated. Shine the laser and start scanning.
扫描过程为，接通电源，以待测电路样品的额定电压或额定电压的80％对样品进行供电，打开计算机的监测界面，等待监测电流/电压稳定后开始对待测电路样品进行扫描，监测样品的电流/电压变化，计算机系统可利用预设软件将电流随时间变化的曲线转化为随二维坐标变化的分布面，并在扫描结束后以颜色分布图呈现出来；The scanning process is, turn on the power supply, supply power to the sample with the rated voltage of the circuit sample to be tested or 80% of the rated voltage, open the monitoring interface of the computer, wait for the monitoring current/voltage to stabilize and start scanning the sample of the circuit to be tested, monitor the sample The computer system can use the preset software to convert the curve of current changing with time into a distribution surface changing with two-dimensional coordinates, and present it as a color distribution map after scanning;
扫描过程中，激光的辐照会导致待测电路样品电流或电压的微小变化。若采用恒压供电，则利用测试系统监测样品的电流变化；若采用恒流供电，则利用测试系统监测样品的电压变化，通过计算机控制 系统记录电流或电压数据；During the scanning process, the irradiation of the laser will cause a small change in the current or voltage of the circuit sample under test. If a constant voltage power supply is used, the test system is used to monitor the current change of the sample; if a constant current power supply is used, the test system is used to monitor the voltage change of the sample, and the current or voltage data is recorded through the computer control system;
(5)通过红外相机成像系统，对待测电路样品表面进行拍照，对样品的布局进行记录；将扫描测试的电流或电压数据与红外相机拍摄的照片进行对照，得到电流或电压微小变化量的分布图。(5) Through the infrared camera imaging system, take pictures of the surface of the circuit sample to be tested, and record the layout of the sample; compare the current or voltage data of the scanning test with the photos taken by the infrared camera, and obtain the distribution of the small changes in current or voltage picture.
(6)单次扫描完成后，计算机软件将电流分布图与红外相机拍摄的电路布局图进行重叠，确定电流变化异常位置。若要确认异常区域的电路布局，可更换50倍或100倍的物镜，对异常区域进行局部拍摄；(6) After a single scan is completed, the computer software overlaps the current distribution diagram with the circuit layout diagram captured by the infrared camera to determine the abnormal position of the current change. If you want to confirm the circuit layout of the abnormal area, you can replace the 50x or 100x objective lens and take partial pictures of the abnormal area;
单次扫描完成后，可改变扫描方式，或设定其他供电电压，或采用恒流源供电，重新进行测试，将多次测试的结果进行对照，排除掉测试过程中带来的误差。若拥有同型号同批次的未失效样品，可对其进行同样的测试，将之与失效样品的测试结果进行对照，找到异常位置；若无合适的未失效样品供对比，则重点关注扫描结果中电流或电压的异常变化点；After a single scan is completed, the scan mode can be changed, or other power supply voltages can be set, or a constant current source can be used for power supply, and the test can be performed again, and the results of multiple tests can be compared to eliminate errors caused during the test process. If you have a non-failed sample of the same model and batch, you can perform the same test on it, and compare it with the test results of the failed sample to find the abnormal position; if there is no suitable non-failed sample for comparison, focus on the scan results Abnormal change points of medium current or voltage;
(7)完成测试内容后，断电，关闭激光器，整理试验台，并处理试验数据。(7) After completing the test content, power off, turn off the laser, organize the test bench, and process the test data.
在本实施例中，对失效的单片机样品进行失效定位实验，图3为扫描过程得到的电流随时间变化曲线以及待测样品失效点的位置。In this embodiment, a failure location experiment is performed on a failed single-chip microcomputer sample, and FIG. 3 is a curve of current changing with time obtained during the scanning process and the position of the failure point of the sample to be tested.
本发明可用于定位集成电路中具有高阻特性和低阻特性的失效点或失效单元，通过激光与半导体材料相互作用的热效应原理，捕捉激光扫描过程中电流或电压的微小变化，确定导致集成电路失效的具体失效点，可捕捉到nA级的电流变化和μV级的电压变化，定位精 度可达到0.1μm。解决了集成电路阻性失效的失效点定位问题，实现了快速、精确、可靠的失效点定位过程，为集成电路失效分析的研究提供了技术支持。The invention can be used to locate failure points or failure units with high-resistance and low-resistance characteristics in integrated circuits, and capture the slight changes in current or voltage during laser scanning through the thermal effect principle of the interaction between laser and semiconductor materials, and determine the cause of the failure of the integrated circuit. The specific failure point of the failure can capture the current change of nA level and the voltage change of μV level, and the positioning accuracy can reach 0.1 μm. It solves the problem of locating the failure point of the resistive failure of the integrated circuit, realizes a fast, accurate and reliable process of locating the failure point, and provides technical support for the research of the failure analysis of the integrated circuit.
以上所述的实施例仅是对本发明的优选方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案做出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。The above-mentioned embodiments are only to describe the preferred mode of the present invention, and are not intended to limit the scope of the present invention. Variations and improvements should fall within the scope of protection defined by the claims of the present invention.

Claims (10)

  1. 一种基于连续激光源的集成电路失效定位方法,其特征在于，包括：An integrated circuit failure location method based on a continuous laser source, characterized in that it includes:
    基于红外激光器照射待测电路样品，获取所述待测电路样品的扫描数据；Obtain scan data of the circuit sample to be tested by irradiating the circuit sample to be tested with an infrared laser;
    基于红外相机对所述待测电路样品进行拍照，获取电路布局图；Taking pictures of the circuit sample to be tested based on an infrared camera to obtain a circuit layout diagram;
    将所述扫描数据与所述电路布局图进行对照，获得失效定位点。The scanning data is compared with the circuit layout diagram to obtain failure location points.
  2. 根据权利要求1所述的基于连续激光源的集成电路失效定位方法，其特征在于，The integrated circuit failure localization method based on the continuous laser source according to claim 1, characterized in that,
    基于红外激光器照射待测电路样品之前还包括，Before irradiating the circuit sample to be tested based on the infrared laser, it also includes,
    预热所述红外激光器，将所述待测电路样品固定在可编程移动平台，对所述可编程移动平台进行供电。Preheating the infrared laser, fixing the circuit sample to be tested on a programmable mobile platform, and supplying power to the programmable mobile platform.
  3. 根据权利要求2所述的基于连续激光源的集成电路失效定位方法，其特征在于，The integrated circuit failure location method based on continuous laser source according to claim 2, characterized in that,
    获取待测电路样品的扫描数据包括，Obtaining scan data for a circuit sample under test includes,
    通过光路调节系统，将所述红外激光器的激光聚焦在所述待测电路样品的有源区；focusing the laser light of the infrared laser on the active area of the circuit sample to be tested through an optical path adjustment system;
    设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序；Setting the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform;
    调节供电系统恒压供电后，对所述待测电路样品辐照激光，获得电流扫描变化数据。After adjusting the constant-voltage power supply of the power supply system, irradiate the sample of the circuit to be tested with laser light to obtain current scanning change data.
  4. 根据权利要求3所述的基于连续激光源的集成电路失效定位 方法，其特征在于，The integrated circuit failure localization method based on continuous laser source according to claim 3, is characterized in that,
    获得所述失效定位点之前，所述方法还包括，Before obtaining the failure location point, the method also includes,
    基于所述电流扫描变化数据和所述电路布局图，获得电流变化量分布图；基于所述电流变化量分布图的异常变化点，获得所述失效定位点。Based on the current scanning change data and the circuit layout diagram, a current variation distribution diagram is obtained; based on an abnormal change point in the current variation distribution diagram, the failure location point is obtained.
  5. 根据权利要求2所述的基于连续激光源的集成电路失效定位方法，其特征在于，The integrated circuit failure location method based on continuous laser source according to claim 2, characterized in that,
    获取待测电路样品的扫描数据包括，Obtaining scan data for a circuit sample under test includes,
    通过光路调节系统，将所述红外激光器的激光聚焦在所述待测电路样品的有源区；focusing the laser light of the infrared laser on the active area of the circuit sample to be tested through an optical path adjustment system;
    设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序；Setting the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform;
    调节供电系统恒流供电后，对所述待测电路样品辐照激光，获得电压扫描变化数据。After adjusting the constant current power supply of the power supply system, the sample of the circuit to be tested is irradiated with laser light to obtain voltage scanning change data.
  6. 根据权利要求5所述的基于连续激光源的集成电路失效定位方法，其特征在于，The integrated circuit failure location method based on continuous laser source according to claim 5, characterized in that,
    获得所述失效定位点之前，所述方法还包括，Before obtaining the failure location point, the method also includes,
    基于所述电压扫描变化数据和所述电路布局图，获得电压变化量分布图；基于所述电压变化量分布图的异常变化点，获得所述失效定位点。Based on the voltage scanning change data and the circuit layout diagram, a voltage variation distribution diagram is obtained; based on an abnormal change point in the voltage variation distribution diagram, the failure location point is obtained.
  7. 一种基于连续激光源的集成电路失效定位系统，其特征在于， 包括，An integrated circuit failure location system based on a continuous laser source, characterized in that it includes,
    红外激光器，用于扫描待测电路样品，获得扫描数据；An infrared laser is used to scan the circuit sample to be tested to obtain scanning data;
    红外相机，用于对所述待测电路样品进行拍照，获得电路布局图；An infrared camera is used to take pictures of the circuit sample to be tested to obtain a circuit layout diagram;
    供电系统，用于对所述失效定位系统进行供电；a power supply system, configured to supply power to the failure location system;
    测试系统，用于监测扫描过程中待测电路样品的变化情况。The test system is used to monitor the change of the circuit sample to be tested during the scanning process.
  8. 根据权利要求7所述的基于连续激光源的集成电路失效定位系统，其特征在于，包括，The integrated circuit failure location system based on a continuous laser source according to claim 7, characterized in that it comprises:
    所述失效定位系统还包括，The failure location system also includes,
    光路调节系统，用于将所述红外激光器的激光聚焦在所述待测电路样品的有源区，实现所述激光的准确入射；The optical path adjustment system is used to focus the laser light of the infrared laser on the active area of the circuit sample to be tested, so as to realize the accurate incidence of the laser light;
    可编程移动平台，用于承载待测试集成电路样品，并按照预设的方式进行三轴移动；Programmable mobile platform, used to carry the integrated circuit samples to be tested, and move in three axes according to the preset method;
    计算机控制系统，用于设定所述红外激光器的扫描参数和所述可编程移动平台的扫描程序，实现所述红外激光器参数的改变和所述可编程移动平台位置的移动。The computer control system is used to set the scanning parameters of the infrared laser and the scanning program of the programmable mobile platform to realize the change of the parameters of the infrared laser and the movement of the position of the programmable mobile platform.
  9. 根据权利要求7所述的基于连续激光源的集成电路失效定位系统，其特征在于，包括，The integrated circuit failure location system based on a continuous laser source according to claim 7, characterized in that it comprises:
    所述供电系统包括直流电压源、直流电流源，所述直流电压源用于实现提供恒定电压，所述直流电流源用于实现提供恒定电流。The power supply system includes a DC voltage source and a DC current source, the DC voltage source is used to provide a constant voltage, and the DC current source is used to provide a constant current.
  10. 根据权利要求7所述的基于连续激光源的集成电路失效定位系统，其特征在于，包括，The integrated circuit failure location system based on a continuous laser source according to claim 7, characterized in that it comprises:
    所述测试系统包括电压表、电流表，所述电压表用于恒流供电下，监测扫描过程中待测电路样品的电压变化情况，获得电压扫描变化数据；所述电流表用于恒压供电下，监测扫描过程中待测电路样品的电流变化情况，获得电流扫描变化数据。The test system includes a voltmeter and an ammeter, and the voltmeter is used to monitor the voltage change of the circuit sample to be tested during the scanning process under a constant current power supply to obtain voltage scanning change data; the ammeter is used under a constant voltage power supply, Monitor the current change of the circuit sample to be tested during the scanning process, and obtain the current scanning change data.
PCT/CN2022/140337 2021-12-22 2022-12-20 System and method for integrated circuit failure positioning based on continuous laser source WO2023116688A1 (en)

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