WO2023109280A1 - 用于芯片封装的气动式反应液搅拌装置 - Google Patents

用于芯片封装的气动式反应液搅拌装置 Download PDF

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Publication number
WO2023109280A1
WO2023109280A1 PCT/CN2022/124668 CN2022124668W WO2023109280A1 WO 2023109280 A1 WO2023109280 A1 WO 2023109280A1 CN 2022124668 W CN2022124668 W CN 2022124668W WO 2023109280 A1 WO2023109280 A1 WO 2023109280A1
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WIPO (PCT)
Prior art keywords
cylinder
stirring device
reaction liquid
chip packaging
liquid
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PCT/CN2022/124668
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English (en)
French (fr)
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陈秀龙
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颀中科技（苏州）有限公司
合肥颀中科技股份有限公司
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Publication of WO2023109280A1 publication Critical patent/WO2023109280A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F21/00—Dissolving
    • B01F21/20—Dissolving using flow mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/40—Mixers using gas or liquid agitation, e.g. with air supply tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • the invention relates to the technical field of semiconductor production, in particular to a pneumatic reaction liquid stirring device for chip packaging.
  • reaction solutions are used in the packaging process of chips to etch and clean products, and the above reaction solutions often need to be fully stirred to maintain uniform and stable performance.
  • the pneumatic reaction liquid stirring device used for chip packaging has a simpler structure, is less affected by external environmental conditions such as vibration, high temperature, and electromagnetic, has a low failure rate, and is convenient for maintenance, which is more suitable for on-site operation needs.
  • the object of the present invention is to provide a pneumatic reaction liquid stirring device for chip packaging, which can improve the stirring effect and better keep the liquid uniform and stable.
  • the invention provides a pneumatic reaction liquid stirring device for chip packaging, which includes a cylinder body and a nozzle assembly arranged in the cylinder body, an air outlet is formed at the front end of the nozzle assembly; the front end of the cylinder body is shaped like Open and set beyond the air outlet, the cylinder body is also provided with a liquid inlet, and the liquid inlet is located behind the air outlet along the front-rear direction.
  • a supercharging portion is provided inside the cylinder, and the supercharging portion extends forward from the inner surface of the cylinder and toward the axis of the cylinder; Several through holes are opened.
  • the liquid inlets are arranged in at least two rows along the front and rear directions, and at least one row of the liquid inlets is located behind the pressurized part.
  • the cylinder includes a first cylinder and a second cylinder connected front and back; the pressurization part is arranged near the rear end of the first cylinder, and the rear The entire surface is arranged in a conical shape, and the nozzle assembly is fixed at the center of the pressurized part.
  • the taper of the rear surface of the pressurized portion is not greater than 1.
  • the nozzle assembly includes a first component fixed on the barrel, and a second component detachably mounted on the front end of the first component; A guide groove extending in a spiral shape, the air outlet is arranged at the front end of the second member.
  • the inclination angle of the guide groove relative to the axial center direction is set at 5-30 degrees.
  • the liquid inlets are arranged in two rows along the front and rear directions, any row of the liquid inlets is evenly arranged along the circumference, and one row of the liquid inlets is arranged corresponding to the diversion groove , and another row of the liquid inlets is arranged behind the diversion groove.
  • the liquid inlet is arranged along a tangential direction of the barrel, and the direction of the diversion groove along the liquid inlet deviates from the axial direction.
  • an anti-overflow cover protrudes from the outer periphery of the cylinder, and the overflow-proof cover is arranged adjacent to the rear end of the cylinder, and a number of anti-overflow holes are arranged on the overflow-proof cover, so The anti-overflow cover is set in a concave shape towards the rear.
  • the beneficial effects of the present invention adopt the pneumatic reaction liquid stirring device for chip packaging of the present invention, which introduces external compressed gas during use, and blows out the gas through the gas outlet of the nozzle assembly, and uses the gas outlet to
  • the negative pressure formed at the back attracts the liquid to flow into the cylinder from the liquid inlet, and then flows out from the front of the cylinder with the air flow, performing high-speed circulation flow, the stirring effect is better, and it is also conducive to the dissolution of the solute, which satisfies the production requirements
  • the side wall of the cylinder is provided with two sets of liquid inlets arranged front and back.
  • the setting of the two sets of liquid inlets can enhance the efficiency of liquid inlet, thereby improving the efficiency of stirring, and a booster part is set between the two groups of liquid inlets It can enhance the negative pressure adsorption effect of a group of liquid inlets where the negative pressure formed at the nozzle is relatively behind, and achieve more efficient stirring.
  • FIG. 1 is a schematic diagram of the overall structure of the pneumatic reaction liquid stirring device used for chip packaging in the present application
  • Fig. 2 is a schematic diagram of the overall structure of another angle of the pneumatic reaction liquid stirring device used for chip packaging in this application;
  • Fig. 3 is a schematic diagram of an exploded structure of the pneumatic reaction liquid stirring device used for chip packaging in Fig. 1;
  • Fig. 4 is the overall cross-sectional view of the pneumatic reaction liquid stirring device used for chip packaging in the present application
  • Fig. 5 is the structural representation of the first barrel in the pneumatic reaction liquid stirring device that the application is used for chip encapsulation
  • Fig. 6 is a cross-sectional view of the first cylinder in Fig. 5 along the direction A-A;
  • FIG. 7 is a schematic structural view of the nozzle assembly in the pneumatic reaction liquid stirring device used for chip packaging in the present application.
  • 100-pneumatic reaction liquid stirring device for chip packaging 10-cylinder; 101-first cylinder; 102-second cylinder; 11-liquid inlet; 12-pressurization part; 121-through hole; 13-constriction part; 14-overflow prevention cover; 141-overflow prevention hole; 20-nozzle assembly; 21-first component; 30-cover body; 301-locking screw; 31-intake hole; 32-exhaust hole; 40-intake pipe.
  • the reaction solution stirring device 100 for chip packaging provided by the present invention includes a cylinder 10, a nozzle assembly 20 disposed in the cylinder 10, and a nozzle assembly 20 disposed at the rear end of the cylinder 10. Cover 30.
  • the front end of the nozzle assembly 20 is provided with an air outlet 221 ; the front end of the barrel 10 is open and beyond the air outlet 221 of the nozzle assembly 20 .
  • the cylinder body 10 is formed with a gas passage through the front and back; the reaction solution stirring device 100 for chip packaging also includes a nozzle inserted into the cylinder body 10 from the back to the front and connected to the nozzle assembly 20 Intake pipe 40 (as shown in FIG. 4 ).
  • the air inlet pipe 40 is detachably installed in the gas passage of the barrel 10, and the air inlet pipe 40 can be inserted into the air passage and connected with the nozzle assembly 20 before use; in other words,
  • the main body of the pneumatic stirring device 100 does not include the air inlet pipe 40 , which is convenient for cleaning and also facilitates storage and movement of the pneumatic stirring device 100 .
  • the air intake pipe 40 can also be fixedly installed in the cylinder body 10, and the rear end of the air intake pipe 40 can be connected to an external air supply device during use. Such as the interface of the air compressor.
  • the cylinder body 10 is also provided with several liquid inlets 11 , and the liquid inlets 11 are located behind the air outlet 221 along the front-rear direction. As far as the front side of the liquid inlet 11 is concerned, the inner surface of the cylinder body 1 and the air inlet pipe are arranged in a gap to form a channel for the liquid to flow.
  • the air inlet pipe 40 is connected to external compressed air, and the corresponding air is blown out through the nozzle assembly 20, and the liquid can be sucked into the cylinder body 10 by using the negative pressure formed behind the air outlet 221, and then Along with the air flow, it flows out from the front end of the barrel 10 to realize the high-speed circulating flow of the liquid and improve the stirring effect.
  • the liquid inlets 11 are arranged in at least two rows along the front and rear directions.
  • the liquid intake of the liquid inlet 11 away from the air outlet 221 is relatively small, and the real circulation speed of the liquid has not been effectively improved.
  • the present application sets a booster portion 12 in the cylinder body 10, at least one row of the liquid inlets 11 is located behind the booster portion 12; the booster portion 12 is provided with a number of through holes 121 , the through holes 121 are preferably evenly distributed along the circumferential direction.
  • the pressurization part 12 extends forward from the inner surface of the cylinder 10 and extends toward the axis of the cylinder 10. By adjusting the cross-sectional area of the liquid channel in this area, the cross-sectional area gradually decreases to achieve the effect of supercharging and increase the pressure. Increase the liquid intake of the liquid inlet 11 on the rear side of the pressurizing part 12 .
  • the rear surface of the pressurized part 12 is generally set in a conical shape; when the taper of the rear surface of the pressurized part 12 is large, the resistance of the liquid to flow forward will be increased.
  • the pressurized part 12 The taper of the rear surface is preferably set to be not greater than 1.
  • the cylinder body 10 includes a first cylinder body 101 and a second cylinder body 102 connected front and back, and the nozzle assembly 20 is fixed in the first cylinder body 101 and adjacent to the first cylinder body 101 backend setup.
  • the first cylindrical body 101 and the second cylindrical body 102 are connected by threads, and the outer diameters of the butt joints of the two are consistent, so as to maintain the overall structural beauty.
  • the pressurization part 12 is formed in the first cylinder 101 and disposed near the rear end of the first cylinder 101 , so that the forming and setting of the pressurization part 12 is facilitated.
  • the nozzle assembly 20 is fixed at the center of the pressurized part 12, and the center of the pressurized part 12 is formed with a screw hole extending forward and backward. Screw thread, in order to realize the fixed installation of described nozzle assembly 20. It is easy to understand that the rear surface of the pressurized portion 12 is not a complete conical surface, and the specific shape of the through hole 121 can also be flexibly designed as long as it meets the liquid circulation requirement.
  • the nozzle assembly 20 includes a first component 21 fixed on the barrel 10, a second component 22 detachably mounted on the front end of the first component 21, that is, the rear end of the first component 21 It is fixed in the screw hole formed in the pressurizing part 12 .
  • a number of helically extending diversion grooves 211 are formed on the peripheral side of the first member 21 , and the diversion grooves 211 make the liquid in the barrel 10 flow forward in a helical shape, effectively improving the effect of stirring and mixing.
  • the liquid inlets 11 are arranged in two rows along the front and back directions, and any row of the liquid inlets 11 is evenly arranged along the circumferential direction;
  • the front side is disposed corresponding to the diversion groove 211
  • another row of the liquid inlets 11 is disposed behind the diversion groove 211 and the pressurizing portion 12 .
  • the first row of liquid inlets 11 is disposed on the first cylinder 101 ; the latter row of liquid inlets 11 is disposed on the second cylinder 102 .
  • the inclination angle ⁇ of the diversion groove 211 relative to the axis direction is set at 5-30 degrees to achieve a better spiral diversion effect.
  • the liquid inlet 11 is preferably arranged along the tangential direction of the cylinder body 10 , so as to prevent the turbulent flow caused by the direct impact of the liquid along the radial direction from affecting the liquid circulation.
  • the direction of the guide groove 211 along the liquid inlet 11 deviates from the axial direction, that is to say, the guide groove 211 faces the same side as the liquid inlet 11, which also better satisfies the design of the spiral flow of liquid. need.
  • the front end of the second member 22 forms the aforementioned air outlet 221 ; the second member 22 is also fixed on the front end of the first member 21 in a threaded manner.
  • the nozzle assembly 20 is assembled from a first component 21 and a second component 22 that are independent of each other, which facilitates component processing and facilitates the fixed installation of the aforementioned air intake pipe 40 .
  • the rear end of the second member 22 protrudes along the circumferential direction to form an annular fixing protrusion 222 , which is more conducive to the stable and convenient installation of the intake pipe 40 .
  • a constricted portion 13 and a spill-proof cover 14 located behind the constricted portion 13 are also formed near the rear end of the cylinder 10 .
  • the diameter of the constricted portion 13 gradually decreases from front to back, increasing the flow channel for the gas to be discharged outward.
  • the anti-spill cover 14 is arranged adjacent to the rear end of the cylinder body 10 and a number of anti-spill holes 141 are arranged on the anti-spill cover 14.
  • the anti-spill cover 14 can effectively block liquids, especially foams that are easily generated during stirring operations. liquid spilled out.
  • the anti-overflow cover 14 is set in a concave shape towards the rear, and the whole is in the shape of a "pot cover", which is beneficial to the accumulation and fall of liquid.
  • the anti-spill cover 14 is arranged as at least two front and rear at intervals; among the adjacent anti-spill covers 14, the number of anti-spill holes 141 of the anti-spill cover 14 on the front side is smaller than that on the rear side. Describe the number of spill holes 141 of the spill cover 14.
  • the anti-overflow holes 141 on the two anti-overflow covers 14 are staggered from each other.
  • the anti-spill cover 14 is formed by protruding from the outer periphery of the second cylinder 102; understandably, the anti-spill cover 14 can also be independently arranged and fixed to a predetermined position of the cylinder 10, so as to achieve similar anti-spill cover 10. overflow effect.
  • An oblique guiding surface is formed on the side of the anti-spill cover 14 located on the front side away from the air outlet.
  • the anti-spill cover 14 is recessed backwards and a concave surface is formed on the side of the anti-spill cover 14 facing the air outlet, and the inclination angle of the inclined guide surface is greater than the inclination angle of the concave surface .
  • the setting of the inclined guide surface can guide the liquid passing through the anti-spill cover 14 to flow back along the inclined guide surface.
  • the purpose of setting the two-stage anti-spill cover 14 can effectively avoid the liquid passing through the anti-spill cover on the front side. It is blocked by the spill-proof cover 14 at the rear side, so as to better realize the spill-proof effect.
  • the cover 30 is provided with an air inlet 31 and a plurality of exhaust holes 32 , and the cover 30 is mounted on the rear end of the cylinder 10 through corresponding locking screws.
  • the air intake hole 31 is set at the center of the cover body 30 and is adapted to the air intake pipe 40; the exhaust hole 32 is arranged along the periphery of the air intake hole 31.
  • the The vent hole 32 can be set correspondingly to the spill-proof hole 141 on the rearmost spill-proof cover 14, and the vent hole 32 on the cover body 30 and the spill-proof hole 141 on the spill-proof cover 14 are mutually staggered,
  • the vent holes on the cover body 30 and the anti-overflow holes 141 on the anti-overflow cover 14 are staggered to effectively prevent liquid from overflowing from the device opening.
  • the cap body 30 needs to be covered at the bottle mouth of the equipment, and the reaction liquid is installed in the equipment. The mouth is clamped and positioned in the positioning groove.
  • the air inlet pipe 40 is connected to the external compressed gas, and the gas is blown out through the air outlet 221 of the nozzle assembly 20, and the gas is blown out by using the
  • the negative pressure formed behind the air outlet 221 attracts the liquid from the liquid inlet 11 to flow into the cylinder 10, and then flows out from the front of the cylinder 10 with the air flow, so as to realize high-speed circulation convection, improve the stirring effect, facilitate the dissolution of solute, and better meet the production requirements. need.

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Abstract

用于芯片封装的气动式反应液搅拌装置(100)，包括筒体(10)、喷嘴组件(20)，喷嘴组件(20)的前端形成有出气口(221)，筒体(10)的前端呈开放设置且超出出气口(221)，筒体(10)上还开设有进液口(11)，进液口(11)沿前后方向位于出气口(221)的后方。利用出气口(221)后方形成的负压吸引液体自进液口(11)流入筒体(10)，再随气流从筒体(10)前方流出，进行高速循环流动，搅拌效果较好。

Description

用于芯片封装的气动式反应液搅拌装置 技术领域
本发明涉及半导体生产技术领域，特别涉及一种用于芯片封装的气动式反应液搅拌装置。
背景技术
在芯片的封装制程中会用到相应的反应液，以对产品进行刻蚀、清洗等，上述反应液往往需要充分搅拌以保持性能的均一稳定。相较而言，用于芯片封装的气动式反应液搅拌装置结构更为简洁，受振动、高温及电磁等外部环境条件影响较小，故障率低，检修便捷，更适于现场作业需求。
现有的用于芯片封装的气动式反应液搅拌装置大多是将进气管直接插入反应液，通过喷嘴吹出的高压气流驱使液体进行流动循环，但管路结构、喷嘴设计及紊流等因素都会影响反应液的搅拌效果。鉴于此，有必要提供一种新的用于芯片封装的气动式反应液搅拌装置。
发明内容
本发明的目的是提供一种用于芯片封装的气动式反应液搅拌装置，能够改善搅拌效果，更好地保持液体均匀稳定。
本发明提供了一种用于芯片封装的气动式反应液搅拌装置，包括筒体、设置在所述筒体内的喷嘴组件，所述喷嘴组件的前端形成有出气口；所述筒体的前端呈开放设置且超出所述出气口，所述筒体上还开设有进 液口，所述进液口沿前后方向位于所述出气口的后方。
作为本发明的进一步改进，所述筒体内设有增压部，所述增压部自所述筒体的内表面朝前并朝所述筒体的轴心延伸设置；所述增压部上开设有若干通孔。
作为本发明的进一步改进，所述进液口沿前后方向设置为至少两排，且其中至少一排所述进液口位于所述增压部的后方。
作为本发明的进一步改进，所述筒体包括前后相接的第一筒体与第二筒体；所述增压部靠近所述第一筒体的后端设置，所述增压部的后表面整体设置呈锥面状，所述喷嘴组件固定于所述增压部的中心。
作为本发明的进一步改进，所述增压部的后表面的锥度设置不大于1。
作为本发明的进一步改进，所述喷嘴组件包括固定在所述筒体上的第一构件、可拆卸安装在所述第一构件前端的第二构件；所述第一构件的周侧形成有若干呈螺旋状延伸的导流槽，所述出气口设置在所述第二构件的前端。
作为本发明的进一步改进，所述导流槽相对轴心方向的倾斜角度设置为5～30度。
作为本发明的进一步改进，所述进液口沿前后方向设置为两排，任一排所述进液口沿周向均匀排布，其中一排所述进液口对应所述导流槽设置，另一排所述进液口设置在所述导流槽的后方。
作为本发明的进一步改进，所述进液口沿所述筒体的切线方向设置，所述导流槽沿所述进液口的方向偏离轴心方向。
作为本发明的进一步改进，所述筒体的外周突伸形成有防溢盖，所述防溢盖邻近所述筒体的后端设置且所述防溢盖上布设有若干防溢孔，所述防溢盖朝后呈凹陷设置。
本发明具备的有益效果：采用本发明用于芯片封装的气动式反应液搅拌装置，其在使用过程中引入外部压缩气体，并通过所述喷嘴组件的出气口将气体吹出，利用所述出气口后方形成的负压吸引液体自进液口流入筒体，再随气流从筒体前方流出，进行高速循环流动，搅拌效果较好，也利于溶质的溶解，很好地满足生产需求；本申请在筒体的侧壁上设置有前后设置的两组进液口，两组进液口的设置能够增强进液的效率，从而提升搅拌的效率，并且在两组进液口之间设置增压部能够增强喷嘴处形成的负压多相对靠后的一组进液口的负压吸附作用，起到更高效的搅拌。
附图说明
图1是本申请用于芯片封装的气动式反应液搅拌装置的整体结构示意图；
图2是本申请用于芯片封装的气动式反应液搅拌装置另一角度的整体结构示意图；
图3是图1中用于芯片封装的气动式反应液搅拌装置的分解结构示意图；
图4是本申请用于芯片封装的气动式反应液搅拌装置的整体剖视图；
图5是本申请用于芯片封装的气动式反应液搅拌装置中第一筒体的 结构示意图；
图6是图5中第一筒体沿A-A方向的剖视图；
图7是本申请用于芯片封装的气动式反应液搅拌装置中喷嘴组件的结构示意图；。
100-用于芯片封装的气动式反应液搅拌装置；10-筒体；101-第一筒体；102-第二筒体；11-进液口；12-增压部；121-通孔；13-缩颈部；14-防溢盖；141-防溢孔；20-喷嘴组件；21-第一构件；211-导流槽；22-第二构件；221-出气口；222-固定凸起；30-盖体；301-锁紧螺钉；31-进气孔；32-排气孔；40-进气管。
具体实施方式
以下将结合附图所示的实施方式对本发明进行详细描述。但该实施方式并不限制本发明，本领域的普通技术人员根据该实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
参图1至图7所示，本发明提供的用于芯片封装的反应液搅拌装置100包括筒体10、设置在所述筒体10内的喷嘴组件20及设置在所述筒体10后端的盖体30。所述喷嘴组件20的前端设有出气口221；所述筒体10的前端呈开放设置且超出所述喷嘴组件20的出气口221。
所述筒体10形成有前后贯穿的气体通道；所述用于芯片封装的反应液搅拌装置100还包括自后向前插设至所述筒体10内并与所述喷嘴组件20相连接的进气管40(如图4所示)。优选的，所述进气管40可拆卸安装至筒体10的气体通道内，所述进气管40可在使用前插装至气体通道内并与所述喷嘴组件20相连接；换而言之，所述气动搅拌装置100的主 体部分并不包括进气管40，方便清洗，也利于所述气动搅拌装置100的储放、移动。容易理解地，在本申请的其它实施方式中，所述进气管40也可以固定安装在所述筒体10内，并在使用过程中将所述进气管40的后端连接至外部供气设备如空压机的接口。所述筒体10上还开设有若干进液口11，所述进液口11沿前后方向位于所述出气口221的后方。就所述进液口11前侧来说，所述筒体1的内表面与进气管呈间隙设置，形成供液体流动的通道。
实际使用过程中，所述进气管40连通至外部压缩气体，并将相应的气体通过所述喷嘴组件20吹出，利用所述出气口221后方形成的负压可将液体吸入筒体10内部，再随气流一起自筒体10的前端流出，实现液体的高速循环流动，改善搅拌效果。为进一步提高液体循环速度与搅拌效果，所述进液口11沿前后方向设置为至少两排。但据实际验证，远离所述出气口221的进液口11的进液量较小，液体的真实循环速度并未得到有效提高。
基于此，本申请在所述筒体10内设置增压部12，至少一排所述进液口11位于所述增压部12的后方；所述增压部12上开设有若干通孔121，所述通孔121优选为沿周向均匀分布。所述增压部12自所述筒体10的内表面朝前并朝所述筒体10的轴心延伸设置，通过调整该区域的液体通道的截面积逐渐缩小，实现增压的效果，增大所述增压部12后侧的进液口11的进液量。所述增压部12的后表面整体设置呈锥面状；所述增压部12的后表面的锥度较大时，会增大液体向前流动的阻力，此处，所述增压部12的后表面的锥度优选设置不大于1。
本实施例中，所述筒体10包括前后相接的第一筒体101与第二筒体102，所述喷嘴组件20固定在所述第一筒体101内且邻近所述第一筒体101的后端设置。具体地，所述第一筒体101与第二筒体102采用螺纹连接且两者的对接处外径一致，以保持整体的结构美观。所述增压部12形成在所述第一筒体101内并靠近所述第一筒体101的后端设置，如此，便于所述增压部12的成型设置。所述喷嘴组件20固定于所述增压部12的中心，所述增压部12的中心位置形成有前后延伸的螺孔，所述喷嘴组件20同样的后端设置与前述螺孔相适配的外螺纹，以实现所述喷嘴组件20的固定安装。容易理解地，所述增压部12的后表面并非完整的圆锥面，所述通孔121的具体形状也可以灵活设计，只要满足液体流通需求即可。
所述喷嘴组件20包括固定在所述筒体10上的第一构件21、可拆卸安装在所述第一构件21前端的第二构件22，也就是说，所述第一构件21的后端固定在所述增压部12所形成的螺孔。所述第一构件21的周侧形成有若干呈螺旋状延伸的导流槽211，所述导流槽211使得筒体10内的液体呈螺旋状朝前流动，有效提高搅拌与混匀效果。在此，所述进液口11沿前后方向设置为两排，任一排所述进液口11沿周向均匀排布；其中一排所述进液口11位于所述增压部12的前侧且对应所述导流槽211设置，另一排所述进液口11设置在所述导流槽211及增压部12的后方。再具体地，前一排所述进液口11设置在所述第一筒体101上；后一排所述进液口11设置在所述第二筒体102上。
参图7所示，所述导流槽211相对轴心方向的倾斜角度α设置为5～ 30度，实现较好的螺旋导流效果。再结合图6所示，所述进液口11优选为沿所述筒体10的切线方向设置，避免液体沿径向直接冲击造成的紊流影响液体循环。显然地，所述导流槽211沿所述进液口11的方向偏离轴心方向，就是说所述导流槽211与进液口11朝向同一侧，也更好地满足液体螺旋流动的设计需求。
所述第二构件22的前端形成前述出气口221；所述第二构件22也采用螺纹连接的方式固定在所述第一构件21的前端。此处，所述喷嘴组件20设置由相互独立的第一构件21与第二构件22组装得到，便于部件加工，也方便前述进气管40的固定安装。所述第二构件22的后端沿周向突伸形成有环状的固定凸起222，更利于进气管40的稳定、便捷安装。
所述筒体10靠近后端的位置还形成有缩颈部13及位于所述缩颈部13后侧的防溢盖14。所述缩颈部13的直径自前向后逐渐减小，增大气体向外排出的流道。所述防溢盖14邻近所述筒体10的后端设置且所述防溢盖14上布设有若干防溢孔141，所述防溢盖14能够有效阻挡液体尤其是搅拌操作中易生成泡沫的液体向外溢出。
所述防溢盖14朝后呈凹陷设置，整体呈“锅盖”状，利于液体聚集回落。此处，所述防溢盖14设置为前后间隔排布的至少两个；相邻所述防溢盖14中，前侧的所述防溢盖14的防溢孔141数量小于后侧的所述防溢盖14的防溢孔141数量。两个所述防溢盖14上的防溢孔141相互错开。所述防溢盖14由第二筒体102的外周突伸形成；可以理解地，所述防溢盖14也可采用独立设置并固定至所述筒体10的既定位置，能够实现类似的防溢效果即可。
相对位于前侧的防溢盖14上背离所述出气口的一侧形成有斜向导引面。所述防溢盖14朝后成凹陷设置并在所述防溢盖14上朝向所述出气口的一侧形成凹陷面，所述斜向导引面的倾斜角度大于所述凹陷面的倾斜角度。斜向导引面的设置能够导引穿过防溢盖14的液体沿着斜向导引面回流，设置两级防溢盖14的目的能够有效的避免穿设位于前侧防溢盖的液体被位于后侧的防溢盖14所阻挡，从而更好的实现防溢的效果。
所述盖体30上设有进气孔31及若干排气孔32，且所述盖体30通过相应的锁紧螺钉安装在所述筒体10的后端。所述进气孔31开设在所述盖体30的中心位置且与所述进气管40相适配；所述排气孔32沿所述进气孔的31的外周设置，可选地，所述排气孔32可与最后方的防溢盖14上的防溢孔141对应设置，所述盖体30上的排气孔32与所述防溢盖14上的防溢孔141相互错开，盖体30上的排气孔与防溢盖14上的防溢孔141相互错开能够有效的放置液体从设备口的溢出。需要说明的是，在本实施例中盖体30需要盖在设备的瓶口处，设备内装有反应液，盖体30的边缘设置有与设备的瓶口相适配的定位槽，设备的瓶口卡接定位在定位槽内。
综上所述，本发明用于芯片封装的反应液搅拌装置100使用过程中，所述进气管40与外部压缩气体相接，并通过所述喷嘴组件20的出气口221将气体吹出，利用所述出气口221后方形成的负压吸引液体自进液口11流入筒体10，再随气流从筒体10前方流出，实现高速循环对流，改善搅拌效果，利于溶质的溶解，更好地满足生产需求。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施 方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种用于芯片封装的气动式反应液搅拌装置，其特征在于：包括筒体、设置在所述筒体内的喷嘴组件，所述喷嘴组件的前端形成有出气口；所述筒体的前端呈开放设置且超出所述出气口，所述筒体上还开设有进液口，所述进液口沿前后方向位于所述出气口的后方；所述筒体内设有增压部，所述增压部自所述筒体的内表面朝前并朝所述筒体的轴心延伸设置；所述增压部上开设有若干通孔。
  2. 根据权利要求1所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述进液口沿前后方向设置为至少两排，且其中至少一排所述进液口位于所述增压部的后方。
  3. 根据权利要求1所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述筒体包括前后相接的第一筒体与第二筒体；所述增压部靠近所述第一筒体的后端设置，所述增压部的后表面整体设置呈锥面状，所述喷嘴组件固定于所述增压部的中心。
  4. 根据权利要求3所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述增压部的后表面的锥度设置不大于1。
  5. 根据权利要求1所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述喷嘴组件包括固定在所述筒体上的第一构件、可拆卸安装在所述第一构件前端的第二构件；所述第一构件的周侧形成有若干呈螺旋状延伸的导流槽，所述出气口设置在所述第二构件的前端。
  6. 根据权利要求5所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述导流槽相对轴心方向的倾斜角度设置为5～30度。
  7. 根据权利要求5所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述进液口沿前后方向设置为两排，任一排所述进液口沿周向均匀排布，其中一排所述进液口对应所述导流槽设置，另一排所述进液口设置在所述导流槽的后方。
  8. 根据权利要求5-7任一项所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述进液口沿所述筒体的切线方向设置，所述导流槽沿所述进液口的方向偏离轴心方向。
  9. 根据权利要求1所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述筒体的外周突伸形成有防溢盖，所述防溢盖邻近所述筒体的后端设置且所述防溢盖上布设有若干防溢孔，所述防溢盖朝后呈凹陷设置。
  10. 根据权利要求9所述的用于芯片封装的气动式反应液搅拌装置，其特征在于：所述防溢盖设置为前后间隔排布的至少两个；相邻所述防溢盖中，前侧的所述防溢盖的防溢孔数量小于后侧的所述防溢盖的防溢孔数量。
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