WO2023106239A1 - Adhesive configuration, electronic equipment, and adhesion method - Google Patents

Abstract

This adhesive configuration includes multiple adhesive regions (AR) in which an adhesive agent (3) has different thicknesses depending on multiple required adhesion performances for an adhesive section.

Description

Bonded structure, electronic device and bonding method

The present invention relates to an adhesive structure, an electronic device, and an adhesive method.

Adhesives are widely used in various fields as a cheap and simple means of fixing. Various adhesive performances such as peel strength, impact strength, shear strength, and tensile strength are required for the adhesive part according to the specifications of the product. Adhesive performance can be represented by a characteristic curve with adhesive thickness as a variable. The thickness of the adhesive is set to a thickness corresponding to the intersection point of each characteristic curve in order to satisfy all required adhesive properties in a well-balanced manner.

JP 2014-178552 A

The characteristic curve has a maximum point where the adhesion performance is maximum. An intersection of a plurality of characteristic curves is calculated to balance a plurality of adhesion performances, but the intersection does not necessarily coincide with the maximum point. Therefore, it cannot be said that all adhesion performances required for the adhesion part are necessarily realized at a sufficient level.

Therefore, the present disclosure proposes a bonding structure, an electronic device, and a bonding method that achieve a high level of multiple bonding performances required for bonding portions.

According to the present disclosure, there is provided an adhesive structure having a plurality of adhesive regions with different adhesive thicknesses based on a plurality of adhesive performances required for the adhesive portion. Further, according to the present disclosure, an electronic device having the adhesive structure is provided. Further, according to the present disclosure, a bonding method is provided that includes forming a plurality of bonding regions having different adhesive thicknesses based on a plurality of bonding performances required for the bonding portion.

It is a figure which shows the conventional adhesion structure. It is a figure which shows an example of the characteristic curve which shows adhesive performance. FIG. 4 is a diagram showing a structural example for controlling the thickness of the adhesive; FIG. 4 is a diagram showing a structural example for controlling the thickness of the adhesive; FIG. 10 is a diagram showing another structural example for controlling the thickness of the adhesive; FIG. 10 is a diagram showing another structural example for controlling the thickness of the adhesive; FIG. 2 illustrates an example of an adhesive structure of the present disclosure; FIG. 2 illustrates an example of an adhesive structure of the present disclosure; FIG. 2 illustrates an example of an adhesive structure of the present disclosure; FIG. 5 is a diagram showing an example of adhesion performance when ribs are not provided; FIG. 10 is a diagram showing how the adhesive spreads on the peripheral portion of the speaker; FIG. 10 is a diagram showing another application example of the adhesive structure; FIG. 10 is a diagram showing a variation of the bonding structure; FIG. 10 is a diagram showing a variation of the bonding structure; FIG. 10 is a diagram showing a variation of the bonding structure; FIG. 10 is a diagram showing a variation of the bonding structure;

Below, embodiments of the present disclosure will be described in detail based on the drawings. In each of the following embodiments, the same parts are denoted by the same reference numerals, and overlapping descriptions are omitted.

The description will be given in the following order.
[1. Conventional adhesion structure]
[1-1. Characteristic curve showing adhesion performance]
[1-2. Structure example 1]
[1-3. Structure example 2]
[2. Adhesion structure of the present disclosure]
[2-1. Adhesive Thickness Distribution and Adhesive Performance]
[2-2. Suppression of Wetting and Spreading of Adhesive]
[2-3. Other application examples of adhesive structure]
[2-4. effect]
[3. Variation of adhesion structure]

[1. Conventional adhesion structure]
FIG. 1 is a diagram showing a conventional bonding structure CT.

The adhesive 3 is used to inexpensively and simply fix a plurality of parts EL. FIG. 1 shows an electronic device ED (for example, a mobile phone) including a speaker 2 and a housing 1 as components EL. A speaker 2 is fixed at a predetermined position on the housing 1 with an adhesive 3 .

[1-1. Characteristic curve showing adhesion performance]
FIG. 2 is a diagram showing an example of a characteristic curve showing adhesion performance PF.

The adhesive part AP is required to have various adhesive performance PF according to the product specifications. The adhesion performance PF is represented by a characteristic curve with the thickness of the adhesive 3 as a variable. In the example of FIG. 2, peel strength, impact strength, shear strength, and tensile strength are shown as examples of required adhesion performance PF.

The peel strength and impact strength show similar strength changes with changes in thickness. Therefore, in FIG. 2, the peel strength and the impact strength are indicated by the same characteristic curve. Shear strength and tensile strength also show similar strength changes with changes in thickness. Therefore, in FIG. 2 the shear strength and the tensile strength are shown by the same characteristic curve. Hereinafter, the peel strength or impact strength will be referred to as first adhesive performance PF1, and the shear strength or tensile strength will be referred to as second adhesive performance PF2. The adhesion portion AP is required to have both the first adhesion performance PF1 and the second adhesion performance PF2.

A layer (adhesive layer) of the adhesive 3 having a generally constant thickness is formed on the adhesive portion AP. The characteristic curve has a maximum point at which the adhesion performance PF is maximum. The maximum point differs for each adhesion performance PF. In the example of FIG. 2, the thickness of the adhesive 3 that maximizes the first adhesive performance PF1 is 0.01 mm (10 μm), but the thickness of the adhesive 3 that maximizes the second adhesive performance PF2 is greater than 1 mm. . The thickness of the adhesive 3 is set to an intermediate thickness between the maximum points (hereinafter referred to as an intermediate thickness) in order to satisfy all the adhesive properties PF required for the adhesive portion AP in a well-balanced manner. For example, the intermediate thickness is calculated as the thickness at the intersection of a plurality of characteristic curves representing a plurality of adhesion performances PF (first adhesion performance PF1, second adhesion performance PF2). In the example of FIG. 2, the intermediate thickness is 0.1 mm (100 μm).

[1-2. Structure example 1]
3 and 4 are diagrams showing structural examples for controlling the thickness of the adhesive 3. FIG.

In the examples of FIGS. 3 and 4, a large number of columnar ribs 10 are arranged between the speaker 2 and the housing 1 . Rib 10 functions as a spacer for controlling the distance between speaker 2 and housing 1 . The adhesive 3 fills the gaps formed by the ribs 10 . The thickness of the adhesive 3 matches the height of the ribs 10 . As shown in FIG. 2, the thickness (intermediate thickness) at the intersection of a plurality of characteristic curves is 100 μm. Therefore, the height of the rib 10 is set to 100 μm.

As shown in FIG. 4, a dead space is generated around the speaker 2 due to the wetting and spreading of the adhesive 3 . The dead space increases as the thickness of the adhesive 3 (height of the rib 10) increases. It is desirable to reduce the dead space as much as possible in order to reduce the size of the electronic device ED.

[1-3. Structure example 2]
5 and 6 are diagrams showing other structural examples for controlling the thickness of the adhesive 3. FIG.

In the examples of FIGS. 5 and 6, a line-shaped counterbore 20 is formed on the attachment surface of the housing 1 . The counterbore 20 functions as a recess for filling the adhesive 3 . The speaker 2 is fixed to the housing 1 with the adhesive 3 filled in the counterbore 20 . The thickness of the adhesive 3 matches the depth of the counterbore 20 . In this configuration, the flow range of the adhesive 3 is generally restricted to the area where the counterbore 20 is formed. Therefore, the dead space due to wetting and spreading of the adhesive 3 is reduced. However, since the bonding is performed only at the position of the counterbore 20, it is difficult to secure a sufficient bonding area.

[2. Adhesion structure of the present disclosure]
[2-1. Adhesive Thickness Distribution and Adhesive Performance]
7 to 9 are diagrams showing an example of the bonding structure CT of the present disclosure.

The adhesive structure CT of the present disclosure has a thickness distribution of the adhesive 3 corresponding to the required performance at the adhesive part AP. The bonding structure CT has a plurality of bonding regions AR with different adhesive 3 thicknesses. The adhesive regions AR have different thicknesses of the adhesive 3 based on a plurality of adhesive performances PF required for the adhesive portion AP. The bonding structure CT is formed with a plurality of bonding regions AR provided with different functions depending on the thickness of the adhesive 3 . By assigning an appropriate function to each adhesion area AR, a plurality of adhesion performances PF required for the adhesion part AP are realized at a high level.

For example, the plurality of adhesion areas AR includes a first adhesion area AR1 and a second adhesion area AR2. The first adhesion area AR1 has a thickness that balances the plurality of adhesion performances PF. The second adhesive area AR2 has a thickness that maximizes a particular adhesive performance PF.

In the example of FIG. 9, the second adhesion performance PF2 (shear strength, tensile strength) is set as the specific adhesion performance PF to be maximized in the second adhesion area AR2. The second adhesion area AR2 has a thickness that maximizes the second adhesion performance PF2. In the example of FIG. 9, the thickness of the second adhesion region AR2 is set to 10 μm based on the characteristic curve of the second adhesion performance PF2.

The first adhesive area AR1 has a thickness that balances the first adhesive performance PF1 (peel strength, impact strength) and the second adhesive performance PF2 (shear strength, tensile strength). For example, the thickness of the first adhesion area AR1 is set as a thickness within the allowable thickness range including the intermediate thickness. The allowable thickness range means a thickness range in which all adhesion performance PFs other than the specific adhesion performance PF satisfy the acceptance criteria. Acceptance standards and acceptable thickness ranges are set individually based on product specifications. For example, in the example of FIG. 9, the intermediate thickness is 100 μm. The allowable thickness range is set as, for example, 80 μm or more and 120 μm or less.

In the example of FIG. 9, the thickness of the first adhesion region AR1 is set to an intermediate thickness, but the thickness of the first adhesion region AR1 is set so that one or more adhesion performances other than the specific adhesion performance are higher than the intermediate thickness. thickness. According to this configuration, the adhesion performance PF other than the specific adhesion performance PF is also enhanced. Although the specific adhesion performance PF may be low in the first adhesion region AR1, the specific adhesion performance PF is sufficiently ensured in the second adhesion region AR2. Therefore, the specific adhesion performance PF is realized at a high level for the entire adhesion portion AP.

The thickness distribution of the adhesive 3 is formed using the ribs 10 and the counterbore 20. For example, the attachment surface AS of the housing 1 is defined as a first attachment surface AS1, and the attachment surface AS of the speaker 2 is referred to as a second attachment surface AS2. The bonding structure CT has a first attachment surface AS1 and a second attachment surface AS2 facing each other with the rib 10 interposed therebetween. The adhesive 3 is arranged so as to fill the gap between the first attachment surface AS1 and the second attachment surface AS2. The first adhering surface AS1 has a counterbore 20 . The first adhesive area AR1 is formed by the adhesive 3 placed in the formation area of the counterbore 20 . The second adhesive area AR2 is formed by the adhesive 3 arranged in the area where the counterbore 20 is not formed.

For example, when viewed from the thickness direction of the adhesive 3 (the normal direction of the adherend surface AS), the area of the second adhesion region AR2 is 40% of the total area of the first adhesion region AR1 and the second adhesion region AR2. % or more and 60% or less. It is desirable that the thickness of the first adhesive region AR1 is three times or more the thickness of the second adhesive region AR2. For example, it is desirable that the thickness of the first adhesion area AR1 is 0.05 mm or more and 0.15 mm or less, and the thickness of the second adhesion area AR2 is 0.005 mm or more and 0.015 mm or less.

When the thickness of the second adhesion area AR2 is set to 10 μm based on the characteristic curve of the second adhesion performance PF2, the height of the rib 10 is set to 10 μm. If the thickness of the first adhesive region AR1 is to match the intermediate thickness, the depth of the counterbore 20 is set to 90 μm. In this configuration, the second adhesion performance PF2 of the second adhesion area AR2 is 1.34 times that of the first adhesion area AR1. In the second adhesion area AR2, the first adhesion performance PF1 is inferior to the first adhesion area AR1 (0.86 times), but since the first adhesion performance PF1 is secured in the first adhesion area AR1, it is a big problem. does not occur.

A plurality of ribs 10 arranged around the counterbore 20 precisely control the thickness of the second adhesion area AR2. Even in the conventional example of FIG. 6, a thin adhesive layer may be formed around the counterbore 20 due to the adhesive 3 leaking from the counterbore 20, but the thickness of the resulting adhesive layer is not necessarily the intended thickness. FIG. 10 is a diagram showing an example of adhesion performance PF when ribs 10 are not provided. In the example of FIG. 10, the thickness of the adhesive 3 in the peripheral portion of the counterbore 20 is smaller than the thickness (10 μm) at the maximum value of the characteristic curve of the second adhesion performance PF2. Therefore, in the peripheral portion of the counterbore 20, sufficient performance cannot be obtained in either the first adhesion performance PF1 or the second adhesion performance PF2.

[2-2. Suppression of Wetting and Spreading of Adhesive]
FIG. 11 is a diagram showing how the adhesive 3 spreads over the periphery of the speaker 2. As shown in FIG.

The second adhesion area AR2 is formed by a plurality of low (10 μm) ribs 10 arranged around the counterbore 20 . Therefore, the second adhesion area AR2 is arranged so as to surround the first adhesion area AR1. Since the adhesive area AR formed on the outer edge of the speaker 2 is the thin second adhesive area AR2, the amount of the adhesive 3 that wets and spreads around the speaker 2 is small. Therefore, the dead space DS1 caused by the wetting and spreading of the adhesive 3 is small.

FIG. 11 also shows the dead space DS2 in the conventional example of FIG. 3 as a comparative example. In the comparative example, since the height of the rib 10 is high (100 μm), the amount of the adhesive 3 that spreads around the speaker 2 is large. Therefore, the dead space DS2 caused by the wetting and spreading of the adhesive 3 is large.

In the example of FIG. 9, the number of adhesion areas AR is two, but even if the number of adhesion areas AR is three or more, the above effect can be obtained with the same configuration. That is, if the adhesive region AR having the smallest thickness among the plurality of adhesive regions AR is arranged so as to surround all the other adhesive regions AR, the adhesive 3 will wet and spread outside the adhesive portion AP. The dead space DS caused by is small.

[2-3. Other application examples of adhesive structure]
FIG. 12 is a diagram showing another application example of the bonding structure CT.

In the above-described embodiment, the adhesive structure CT of the present disclosure is applied to mobile phones. However, the application target of the adhesive structure CT is not limited to mobile phones. The method of the present disclosure can be widely applied to other electronic devices ED such as USB (Universal Serial Bus) connector UC and Audio Jack connector AJ.

For example, the USB connector UC and the Audio Jack connector AJ are themselves configured by assembling multiple parts. An adhesive 3 may be used for this assembly. USB connectors UC and Audio Jack connectors AJ are also used in mobile phones. Since a shearing force is applied to them when inserting/removing a USB cable and inserting/removing an earphone jack, increasing the shearing strength and the like by the method of the present disclosure leads to enhancing the quality reliability of those parts.

[2-4. effect]
The bonding structure CT has a plurality of bonding regions AR in which the thickness of the adhesive 3 is varied based on a plurality of bonding performances PF required for the bonding portion AP. The electronic device ED of the present disclosure has the bonding structure CT described above. The bonding method of the present disclosure includes forming a plurality of bonding regions AR having different thicknesses of the adhesive 3 based on a plurality of bonding performances PF required for the bonding portion AP.

According to this configuration, a plurality of adhesion regions AR are formed to which different functions are imparted according to the thickness of the adhesive 3. By assigning an appropriate function to each adhesion area AR, a plurality of adhesion performances PF required for the adhesion part AP are realized at a high level.

The plurality of adhesion areas AR includes a first adhesion area AR1 and a second adhesion area AR2. The first adhesion area AR1 has a thickness that balances the plurality of adhesion performances PF. The second adhesive area AR2 has a thickness that maximizes a particular adhesive performance PF.

According to this configuration, a bonding structure CT is provided that satisfies the requirements for all other bonding performance PFs in a well-balanced manner while enhancing a specific bonding performance PF.

If the thickness at the intersection of a plurality of characteristic curves representing a plurality of adhesion performance PFs is the intermediate thickness, and the thickness range in which all adhesion performance PFs other than the specific adhesion performance PF satisfy the acceptance criteria is the allowable thickness range, the first The thickness of the adhesion area AR1 is set as a thickness within the allowable thickness range including the intermediate thickness.

According to this configuration, the requirements for all adhesion performance PFs other than the specific adhesion performance PF are met in a well-balanced manner in the first adhesion region AR1. A specific adhesion performance PF is achieved at a high level in the second adhesion area AR2. Therefore, it is possible to obtain a good bonding structure CT that fully satisfies all requirements for bonding performance PF.

The first adhesive area AR1 has a thickness that balances the first adhesive performance PF1 (peel strength or impact strength) and the second adhesive performance PF2 (shear strength or tensile strength). The second adhesion area AR2 has a thickness that maximizes the second adhesion performance PF2. The area of the second adhesion region AR2 is 40% or more and 60% or less of the total area of the first adhesion region AR1 and the second adhesion region AR2. The thickness of the first adhesion area AR1 is three times or more the thickness of the second adhesion area AR2. The thickness of the first adhesion region AR1 is 0.05 mm or more and 0.15 mm or less. The thickness of the second adhesion area AR2 is 0.005 mm or more and 0.015 mm or less.

According to this configuration, a bonding structure CT is provided that fully satisfies the requirements for the first bonding performance PF1 and the second bonding performance PF2.

The bonding structure CT has a first attachment surface AS1 and a second attachment surface AS2 facing each other with the rib 10 interposed therebetween. The adhesive 3 is arranged so as to fill the gap between the first attachment surface AS1 and the second attachment surface AS2. The first adhering surface AS1 has a counterbore 20 . The first adhesive area AR1 is formed by the adhesive 3 placed in the formation area of the counterbore 20 . The second adhesive area AR2 is formed by the adhesive 3 arranged in the area where the counterbore 20 is not formed.

According to this configuration, the first adhesion area AR1 and the second adhesion area AR2 are easily realized.

It should be noted that the effects described in this specification are only examples and are not limited, and other effects may also occur.

[3. Variation of adhesion structure]
13 to 16 are diagrams showing variations of the bonding structure CT.

The adhesion structure CT-1 in FIG. 13 is the same as that shown in FIGS. 7 to 9. In this example, a counterbore 20 is formed on the first attachment surface AS1, and a rib 10 around the counterbore 20 maintains a gap between the first attachment surface AS1 and the second attachment surface AS2. A first adhesion area AR1 is formed at a position overlapping the counterbore 20, and a second adhesion area AR2 is formed around the counterbore 20. As shown in FIG.

In the bonding structure CT-2 of FIG. 14, the rib 10 is not interposed between the first attachment surface AS1 and the second attachment surface AS2. The adhesive structure CT- 2 has a first attachment surface AS 1 and a second attachment surface AS 2 that are adhered by an adhesive 3 . The first adhering surface AS1 has a counterbore 25 . The second adhering surface AS2 has a counterbore 30 at a position not facing the counterbore 25 .

The counterbore 25 functions as a first recess for filling the adhesive 3 . The counterbore 30 functions as a second recess for filling the adhesive 3 . The first adhesive area AR1 is formed by the adhesive 3 placed in the formation area of the counterbore 25 . The second adhesive area AR2 is formed by the adhesive 3 arranged in the formation area of the counterbore 30. As shown in FIG. For example, the depth of the counterbore 25 is 100 μm and the depth of the counterbore 30 is 10 μm.

For example, the counterbore 25 is formed in a line like the counterbore 20. The counterbore 30 is formed in a ring shape at a position surrounding the counterbore 25 . As a result, the second adhesive region AR2 having a small thickness is arranged at a position surrounding the first adhesive region AR1. Therefore, the dead space DS caused by the wetting and spreading of the adhesive 3 can be reduced.

　In the bonding structure CT-3 of FIG. 15, the area of the counterbore 35 on the second attachment surface AS2 side is larger than in the example of FIG. The adhesive structure CT-3 has a first attachment surface AS1 and a second attachment surface AS2 that are bonded by an adhesive 3. As shown in FIG. The first adhering surface AS1 has a counterbore 20 . The second adhering surface AS2 has a counterbore 35 at a position partially facing the counterbore 20 .

The counterbore 25 functions as a first recess for filling the adhesive 3 . The counterbore 35 functions as a second recess for filling the adhesive 3 . The first adhesive area AR1 is formed by the adhesive 3 arranged at positions where the counterbore 20 and the counterbore 35 face each other. The second adhesive area AR2 is formed by the adhesive 3 arranged at a position where the counterbore 20 and the counterbore 35 do not face each other. For example, the depth of the counterbore 20 is 90 μm and the depth of the counterbore 35 is 10 μm.

In the example of FIG. 16, the thickness of the first adhesion area AR1 is set such that one or more adhesion performances PF other than the specific adhesion performance PF are higher than the intermediate thickness. For example, in the example of FIG. 16, the second adhesion performance PF2 (shear strength, tensile strength) is the specific adhesion performance PF to be maximized in the second adhesion area AR2. The thickness of the first adhesion region AR1 is set as a thickness (for example, 3 mm) that maximizes the first adhesion performance PF1.

According to this configuration, the adhesion performance PF other than the specific adhesion performance PF is also enhanced. In particular, by setting the thickness of the first adhesion region AR1 to a thickness that maximizes the adhesion performance PF other than the specific adhesion performance PF, all adhesion performances PF are realized at a very high level.

[Appendix]
Note that the present technology can also adopt the following configuration.
(1)
An adhesive structure having a plurality of adhesive areas with different adhesive thicknesses based on a plurality of adhesive performances required for the adhesive part.
(2)
The plurality of bond regions includes a first bond region having a thickness that balances the plurality of bond performances and a second bond region having a thickness that maximizes a particular bond performance.
The adhesive structure according to (1) above.
(3)
When the thickness at the intersection of the plurality of characteristic curves representing the plurality of adhesion performances is the intermediate thickness, and the thickness range in which all adhesion performances other than the specific adhesion performance satisfy the allowable standard is the allowable thickness range, the first The thickness of the adhesive region is set as a thickness within the allowable thickness range including the intermediate thickness,
The adhesive structure according to (2) above.
(4)
The thickness of the first adhesion region is set as a thickness such that one or more adhesion performances other than the specific adhesion performance are higher than the intermediate thickness.
The adhesive structure according to (3) above.
(5)
The first adhesive region has a thickness that balances peel strength or impact strength and shear strength or tensile strength,
the second adhesive region has a thickness that maximizes shear strength or tensile strength;
The adhesive structure according to any one of (2) to (4) above.
(6)
The area of the second adhesion region is 40% or more and 60% or less of the total area of the first adhesion region and the second adhesion region.
The adhesive structure according to (5) above.
(7)
The thickness of the first adhesive region is three times or more the thickness of the second adhesive region,
The adhesive structure according to (5) or (6) above.
(8)
The thickness of the first adhesive region is 0.05 mm or more and 0.15 mm or less,
The thickness of the second adhesive region is 0.005 mm or more and 0.015 mm or less.
The adhesive structure according to (7) above.
(9)
having a first attachment surface and a second attachment surface facing each other with a spacer interposed therebetween;
The adhesive is arranged so as to fill a gap between the first attachment surface and the second attachment surface,
The first attachment surface has a recess,
The first adhesive region is formed by the adhesive disposed in the recess forming region,
The second adhesive region is formed by the adhesive disposed in the non-forming region of the recess,
The adhesive structure according to any one of (2) to (8) above.
(10)
Having a first attachment surface and a second attachment surface bonded by the adhesive,
The first attachment surface has a first recess,
The second attachment surface has a second recess at a position not facing the first recess,
The first adhesive region is formed by the adhesive disposed in the formation region of the first recess,
The second adhesive region is formed by the adhesive disposed in the formation region of the second recess,
The adhesive structure according to any one of (2) to (8) above.
(11)
Having a first attachment surface and a second attachment surface bonded by the adhesive,
The first attachment surface has a first recess,
The second attachment surface has a second recess at a position partially facing the first recess,
The first adhesive region is formed by the adhesive arranged at a position where the first concave portion and the second concave portion face each other,
The second adhesive region is formed by the adhesive arranged at a position where the first recess and the second recess do not face each other,
The adhesive structure according to any one of (2) to (8) above.
(12)
The adhesion region having the smallest thickness among the plurality of adhesion regions is arranged so as to surround all other adhesion regions.
The adhesive structure according to any one of (1) to (11) above.
(13)
An electronic device having the adhesive structure according to any one of (1) to (12) above.
(14)
A bonding method, comprising forming a plurality of bonding regions having different adhesive thicknesses based on a plurality of bonding performances required for the bonded portion.

3 adhesive 10 rib (spacer)
20, 25, 30, 35 counterbore (recess)
AP Adhesion part AR Adhesion area AR1 First adhesion area AR2 Second adhesion area AS1 First attachment surface AS2 Second attachment surface CT Adhesion structure ED Electronic device PF Adhesion performance

Claims (14)

1. A bonding structure that has multiple bonding areas with different adhesive thicknesses based on multiple bonding performances required for the bonding part.
2. The plurality of bond regions includes a first bond region having a thickness that balances the plurality of bond performances and a second bond region having a thickness that maximizes a particular bond performance.
   The bonded structure according to claim 1.
3. When the thickness at the intersection of the plurality of characteristic curves representing the plurality of adhesion performances is the intermediate thickness, and the thickness range in which all adhesion performances other than the specific adhesion performance satisfy the allowable standard is the allowable thickness range, the first The thickness of the adhesive region is set as a thickness within the allowable thickness range including the intermediate thickness,
   The adhesive structure according to claim 2.
4. The thickness of the first adhesion region is set as a thickness such that one or more adhesion performances other than the specific adhesion performance are higher than the intermediate thickness.
   The bonded structure according to claim 3.
5. The first adhesive region has a thickness that balances peel strength or impact strength and shear strength or tensile strength,
   the second adhesive region has a thickness that maximizes shear strength or tensile strength;
   The adhesive structure according to claim 2.
6. The area of the second adhesion region is 40% or more and 60% or less of the total area of the first adhesion region and the second adhesion region.
   The bonded structure according to claim 5.
7. The thickness of the first adhesive region is three times or more the thickness of the second adhesive region,
   The bonded structure according to claim 5.
8. The thickness of the first adhesive region is 0.05 mm or more and 0.15 mm or less,
   The thickness of the second adhesive region is 0.005 mm or more and 0.015 mm or less.
   Bonded structure according to claim 7.
9. having a first attachment surface and a second attachment surface facing each other with a spacer interposed therebetween;
   The adhesive is arranged so as to fill a gap between the first attachment surface and the second attachment surface,
   The first attachment surface has a recess,
   The first adhesive region is formed by the adhesive disposed in the recess forming region,
   The second adhesive region is formed by the adhesive disposed in the non-forming region of the recess,
   The adhesive structure according to claim 2.
10. Having a first attachment surface and a second attachment surface bonded by the adhesive,
    The first attachment surface has a first recess,
    The second attachment surface has a second recess at a position not facing the first recess,
    The first adhesive region is formed by the adhesive disposed in the formation region of the first recess,
    The second adhesive region is formed by the adhesive disposed in the formation region of the second recess,
    The adhesive structure according to claim 2.
11. Having a first attachment surface and a second attachment surface bonded by the adhesive,
    The first attachment surface has a first recess,
    The second attachment surface has a second recess at a position partially facing the first recess,
    The first adhesive region is formed by the adhesive arranged at a position where the first concave portion and the second concave portion face each other,
    The second adhesive region is formed by the adhesive arranged at a position where the first recess and the second recess do not face each other,
    The adhesive structure according to claim 2.
12. The adhesion region having the smallest thickness among the plurality of adhesion regions is arranged so as to surround all other adhesion regions.
    The bonded structure according to claim 1.
13. An electronic device having the adhesive structure according to claim 1.
14. A bonding method comprising forming a plurality of bonding regions with different adhesive thicknesses based on a plurality of bonding performances required for the bonded portion.

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