CN218444263U - Pressure sensor sealing structure and electronic equipment - Google Patents
Pressure sensor sealing structure and electronic equipment Download PDFInfo
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- CN218444263U CN218444263U CN202221563771.8U CN202221563771U CN218444263U CN 218444263 U CN218444263 U CN 218444263U CN 202221563771 U CN202221563771 U CN 202221563771U CN 218444263 U CN218444263 U CN 218444263U
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Abstract
The utility model discloses a pressure sensor seal structure and electronic equipment. The pressure sensor seal structure includes: a substrate, a conductive member and a housing; the conductive piece is positioned on one side of the substrate and surrounds a closed area on the substrate, and the shell is fixedly connected with the conductive piece through a bonding agent; wherein the adhesive is disposed along an extension path of the conductive member and covers at least a partial region of the conductive member and a partial region of the substrate. The utility model discloses the binder is followed the extension route of electrically conductive piece is arranged and the binder covers at least partly regional and partly regional of base plate of electrically conductive piece. That is, the adhesive is simultaneously connected with the conductive piece and the substrate, and the adhesive effect of the adhesive and the substrate is better, which is beneficial to improving the connection stability of the shell and the conductive piece.
Description
Technical Field
The utility model relates to a sensor technology field especially relates to a pressure sensor seal structure and electronic equipment.
Background
Since products sensitive to stress cannot be solder-pasted to the housing, such materials and the conductive devices do not generate alloy substances, and therefore, for conductive devices with relatively smooth surfaces, the adhesion of all the adhesives to the conductive devices results in a decrease in the bonding force. The housing and the conductive member must also have partial contact due to ESD requirements.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pressure sensor seal structure and electronic equipment can effectively solve the sensitive product of stress and use the problem that the tin cream bonds the disconnect-connection that the shell leads to the shell easily.
According to the utility model discloses an aspect provides a pressure sensor seal structure, include: a substrate, a conductive member and a housing; the conductive piece is positioned on one side of the substrate and surrounds a closed area on the substrate, and the shell is fixedly connected with the conductive piece through a bonding agent; wherein the adhesive is arranged along an extension path of the conductive member and covers at least a partial region of the conductive member and a partial region of the substrate.
Further, the adhesive is located at the bottom of the side of the shell close to the closed area and the bottom of the side of the shell far from the closed area, wherein the adhesive covers a part of the area of the substrate inside the closed area and/or a part of the area of the substrate outside the closed area.
Further, a portion of the housing proximate the enclosed region is located on the substrate, and the adhesive covers a portion of the substrate within the enclosed region.
Further, the shell completely covers the conductive member, and the adhesive covers a part of the substrate inside the closed region and/or a part of the substrate outside the closed region.
Further, the base plate includes substrate layer and solder mask, the solder mask is located on the substrate layer and a part of solder mask is located within the closed area and/or a part of solder mask is located outside the closed area, wherein, the binder covers at least a part of the solder mask.
Further, the conductive piece is arranged on the substrate layer.
Further, the surface of one side, far away from the substrate, of the conductive piece is flush with the surface of one side, far away from the substrate, of the solder mask layer.
Further, the conductive member is a metal ring.
Further, the adhesive is silver adhesive or conductive epoxy adhesive.
Further, the pressure sensor seal structure further includes: the first blocking structure is arranged on the solder mask layer and is a sawtooth-shaped groove distributed in an array mode.
Further, the pressure sensor seal structure further includes: and the second blocking structure is arranged on the substrate layer or the solder mask layer and is positioned in the closed area and at a preset distance interval between the shells.
According to the utility model discloses an on the other hand provides a pressure sensor seal structure and includes: the device comprises a substrate, at least one conductive piece and a shell; the at least one conductive piece is positioned on one side of the substrate, the conductive area is arranged in the middle of the substrate, the at least one conductive piece is arranged at the edge of the conductive area, and the shell is fixedly connected with the conductive piece through an adhesive; wherein the adhesive is disposed along an edge of the conductive area and covers at least a partial area of the conductive member and a partial area of the substrate.
Further, the conductive region has at least one bending region, and the conductive member is disposed at an edge of the at least one bending region.
Further, the conductive members are grounded.
Further, the base plate includes substrate layer and solder mask, the solder mask sets up on electrically conductive region and base plate, electrically conductive piece is at least partly not covered by the solder mask.
According to the utility model discloses an on the other hand provides an electronic equipment, include the utility model discloses any embodiment pressure sensor seal structure pressure sensor set up in on the base plate, pressure sensor's first pressure sensor chip and second pressure sensor chip including range upon range of setting.
The utility model has the advantages that, the utility model discloses the binder is followed the extension route of electrically conductive piece is arranged and the binder covers at least partly regional and partly regional of electrically conductive piece and partly region of base plate. That is, the adhesive is simultaneously connected with the conductive piece and the substrate, and the adhesive effect of the adhesive and the substrate is better, which is beneficial to improving the stability of the bonding force of the shell and the conductive piece. On the other hand, the first blocking structures are saw-toothed groove arrays distributed on the solder mask layer, so that the contact area of the solder mask layer and the adhesive is increased, the binding force of the shell and the conductive piece is further increased, the flowing area of the adhesive is limited by the second blocking structures, the contact area of the adhesive and the shell is increased, and the binding force of the shell and the conductive piece is further increased.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a top view of a pressure sensor sealing structure before an adhesive is disposed according to an embodiment of the present invention.
Fig. 2 is a top view of a pressure sensor sealing structure after the adhesive is disposed according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a pressure sensor sealing structure after an adhesive is disposed according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view of a sealing structure of a pressure sensor after a housing is installed according to an embodiment of the present invention.
Fig. 5 is a cross-sectional view of a pressure sensor sealing structure with a solder mask according to an embodiment of the present invention.
Fig. 6 is a cross-sectional view of a pressure sensor sealing structure after the housing is installed according to an embodiment of the present invention.
Fig. 7 is a top view of a pressure sensor sealing structure after an adhesive is disposed according to a second embodiment of the present invention.
Fig. 8 is a cross-sectional view of a pressure sensor sealing structure after an adhesive is disposed according to a second embodiment of the present invention.
Fig. 9 is a cross-sectional view of a pressure sensor sealing structure with a solder resist layer according to a second embodiment of the present invention.
Fig. 10 is a top view of a pressure sensor sealing structure after an adhesive is disposed according to a third embodiment of the present invention.
Fig. 11 is a cross-sectional view of a pressure sensor sealing structure after an adhesive is disposed according to a third embodiment of the present invention.
Fig. 12 is a cross-sectional view of a pressure sensor sealing structure with a solder resist layer according to a third embodiment of the present invention.
Fig. 13 is a top view of a pressure sensor sealing structure before an adhesive is arranged according to the fourth embodiment of the present invention.
Fig. 14 is a top view of a pressure sensor sealing structure before an adhesive is arranged according to a fourth embodiment of the present invention.
Fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
Referring now to fig. 1-4, fig. 1-4 are schematic structural diagrams of a pressure sensor sealing structure according to an embodiment of the present invention. The pressure sensor sealing structure includes: substrate 1, conductive member 3 and housing 6.
The conductive member 3 is located on one side of the substrate 1 and surrounds a closed region 2 on the substrate 1, and the housing 6 is fixedly connected with the conductive member 3 through an adhesive 4. The adhesive 4 is arranged along the extension path of the conductive member 3 and covers at least a partial region of the conductive member 3 and a partial region of the substrate 1.
Illustratively, a portion of the housing 6 near the closed region 2 is located on the substrate 1. The adhesive 4 covers a part of the area of the substrate 1 within the closed area 2. The adhesive 4 is located at the bottom of the case 6 on the side close to the closed region 2 and at the bottom of the case 6 on the side far from the closed region 2.
It can be seen that when the housing 6 is disposed on the conductive member 3 and the substrate 1 of the closed region 2, the adhesive 4 is located at the bottom of the housing 6 on the side close to the closed region 2 and also covers the substrate 1.
In some embodiments, as shown in fig. 5 and 6, the substrate 1 includes a substrate layer 11 and a solder resist layer 12, and the adhesive 4 is located at the bottom of the housing 6 near the side of the closed region 2 and covers the solder resist layer 12, and a portion of the housing 6 near the closed region 2 is located on the solder resist layer 12. Further, the solder resist layer 12 is also provided outside the closed region 2.
In some embodiments, the adhesive 4 covers a part of the conductive member 3, and a surface of the conductive member 3 away from the substrate is flush with a surface of the solder resist layer 12 away from the substrate.
The conductive piece 3 is a metal ring, and the conductive piece 3 is used for improving the ESD protection performance of a product. The binder 4 is silver adhesive or conductive epoxy adhesive.
In some embodiments, the pressure sensor sealing structure further comprises: and the second blocking structure is arranged on the substrate layer or the solder mask layer and is positioned between the closed area and the shell at a preset interval.
In one embodiment, the adhesive 4 is disposed along the extension path of the conductive member 3 and the adhesive 4 covers at least a portion of the conductive member 3 and a portion of the substrate 1. That is, the adhesive 4 is connected to the conductive member 3 and the substrate 1 at the same time, and the adhesive effect of the adhesive 4 to the substrate 1 is better, which is beneficial to improving the stability of the bonding force between the housing 6 and the conductive member 3. On the other hand, the second barrier structure limits the flowing area of the adhesive, and increases the contact area of the adhesive and the shell, thereby further increasing the bonding force of the shell and the conductive piece.
Fig. 7-8 are schematic structural diagrams of a pressure sensor sealing structure provided by the second embodiment of the present invention. The pressure sensor sealing structure includes: substrate 1, conductive member 3 and housing 6.
The conductive parts 3 are positioned on one side of the substrate 1 and surround a closed area 2 on the substrate 1, and the shell 6 is fixedly connected with the conductive parts 3 through a bonding agent 4. The adhesive 4 is arranged along the extension path of the conductive member 3 and covers at least a partial region of the conductive member 3 and a partial region of the substrate 1.
The adhesive 4 covers a part of the area of the substrate 1 within the closed area 2. The adhesive 4 is located at the bottom of the case 6 on the side close to the closed region 2 and at the bottom of the case 6 on the side far from the closed region 2. Illustratively, a portion of the housing 6 near the closed region 2 is located on the substrate 1.
It can be seen that when the housing 6 is disposed on the conductive member 3 and the substrate 1 of the closed region 2, the adhesive 4 is located at the bottom of the housing 6 on the side close to the closed region 2 and also covers the substrate 1.
In some embodiments, as shown in fig. 9, the substrate 1 includes a substrate layer 11 and a solder mask layer 12, and in particular, refer to fig. 5 and fig. 6 in the first embodiment, in this case, the adhesive 4 is located at the bottom of the housing 6 near the side of the closed region 2 and also covers the solder mask layer 12, and a portion of the housing 6 near the closed region 2 is also located on the solder mask layer 12. Further, the solder resist layer 12 is also provided outside the closed region 2.
In some embodiments, the adhesive 4 covers the conductive member 3, and a surface of the conductive member 3 away from the substrate is flush with a surface of the solder resist layer 12 away from the substrate.
The conductive piece 3 is a metal ring, and the conductive piece 3 is used for improving the ESD protection performance of a product. The binder 4 is silver adhesive or conductive epoxy adhesive.
In some embodiments, the pressure sensor sealing structure further comprises: the first blocking structure is arranged on the solder mask layer, and the first blocking structure is distributed on the solder mask layer in a sawtooth-shaped groove array mode.
In the second embodiment, the adhesive 4 is arranged along the extension path of the conductive member 3 and the adhesive 4 covers at least a partial region of the conductive member 3 and a partial region of the substrate 1. That is, the adhesive 4 is connected to the conductive member 3 and the substrate 1 at the same time, and the adhesive effect of the adhesive 4 to the substrate 1 is better, which is beneficial to improving the stability of the bonding force between the housing 6 and the conductive member 3. On the other hand, the first blocking structure is a sawtooth-shaped groove array distributed on the solder mask layer, so that the contact area of the solder mask layer and the bonding agent is increased, and the bonding force of the shell and the conductive piece is further increased.
Fig. 10 to 11 are schematic structural diagrams of a pressure sensor sealing structure provided by the third embodiment of the present invention. The pressure sensor sealing structure includes: substrate 1, conductive member 3 and housing 6.
The conductive parts 3 are positioned on one side of the substrate 1 and surround a closed area 2 on the substrate 1, and the shell 6 is fixedly connected with the conductive parts 3 through a bonding agent 4. The adhesive 4 is arranged along the extension path of the conductive member 3 and covers at least a partial region of the conductive member 3 and a partial region of the substrate 1.
The shell 6 completely covers the conductive piece 3, and the adhesive 4 is located at the bottom of the shell 6 on the side close to the closed region 2 and at the bottom of the shell 6 on the side far from the closed region 2. The adhesive 4 now covers a part of the area of the substrate 1 within the closed area 2 and a part of the area of the substrate 1 outside the closed area 2. In some embodiments the adhesive 4 covers a portion of the area of the substrate 1 within the enclosed area 2 or a portion of the area of the substrate 1 outside the enclosed area 2.
It can be seen that when the case 6 is disposed on the conductive member 3, the adhesive 4 on both sides of the case 6 may be coated on the substrate 1.
In some embodiments, as shown in fig. 12, the substrate 1 includes a substrate layer 11 and a solder resist layer 12, and in particular, refer to fig. 5 and 6 in the first embodiment, where the adhesive 4 is located at the bottom of the housing 6 near the side of the closed region 2 and covers the solder resist layer 12. Further, the solder resist layer 12 is provided only in the closed region 2. The adhesive 4 is covered on the substrate layer 11 at the bottom of the case 6 far from the closed region 2
In some embodiments, the adhesive 4 covers the conductive member 3, and a surface of the conductive member 3 away from the substrate is flush with a surface of the solder resist layer 12 away from the substrate.
The conductive piece 3 is a metal ring, and the conductive piece 3 is used for improving the ESD protection performance of a product. The binder 4 is silver adhesive or conductive epoxy adhesive.
In the third embodiment, the adhesive 4 is disposed along the extending path of the conductive member 3 and the adhesive 4 covers at least a partial region of the conductive member 3 and a partial region of the substrate 1. That is, the adhesive 4 is connected to the conductive members 3 and the substrate 1, and the adhesive 4 adheres to the substrate 1 more effectively, which is beneficial to improving the stability of the bonding force between the housing 6 and the conductive members 3.
Fig. 13 is a schematic structural diagram of a pressure sensor sealing structure provided by the fourth embodiment of the present invention. The pressure sensor seal structure includes: a substrate 1, at least one conductive member 3 and a housing 6.
The at least one conductive member 3 is located on one side of the substrate 1, the conductive region 10 is arranged in the middle of the substrate, the at least one conductive member is arranged at the edge of the conductive region 10, and the shell is fixedly connected with the conductive member through a bonding agent. The adhesive is arranged along the edge of the conductive area 10 and covers at least a partial area of the conductive piece and a partial area of the substrate.
Compared with the first to third embodiments, the conductive member 3 is disposed in only the remaining partial region of the fourth embodiment, so as to provide an ESD protection and electrostatic protection manner for the housing 6, thereby increasing the area of the housing 6 and the substrate 1 that can be bonded by using an adhesive. Other features of the fourth embodiment can be the same as those of the first to third embodiments.
Referring to fig. 14, in some embodiments, the conductive region has at least one bending region, and the conductive member is disposed at an edge of the at least one bending region, as another implementation manner of the fourth embodiment, compared to the implementation manner in fig. 13, the conductive member is disposed at the bending region of the conductive region, and since the adhesive is disposed along the edge of the conductive region, the adhesive is also bent at the bending region of the conductive region, and compared to the non-bending region of the conductive region, the contact area of the conductive member in the bending time domain of the adhesive of the conductive member with the same area is larger, which is beneficial to improving ESD protection between the housing and the conductive member.
For example, a pressure sensor chip may be disposed in the conductive region.
Illustratively, the conductive member is grounded. For example, the conductive member is disposed on the first surface of the substrate layer and is grounded to the second surface of the substrate layer.
Illustratively, the adhesive is silver paste or conductive epoxy paste.
In some embodiments, a portion of the housing proximate the conductive region is on the substrate, and the adhesive covers a portion of the substrate within the enclosed region.
In some embodiments, the housing completely covers the conductive member, and the adhesive covers a portion of the substrate within the closed region and/or a portion of the substrate outside the conductive region.
Illustratively, the substrate includes a substrate layer and a solder resist layer, the solder resist layer is disposed on the substrate layer and a portion of the solder resist layer is located within the conductive region and/or a portion of the solder resist layer is located outside the conductive region, wherein the adhesive covers at least a portion of the solder resist layer.
As shown in fig. 15, the present invention further provides an electronic device including the pressure sensor sealing structure of the above embodiment, wherein the functional device of the electronic device is disposed in the closed region 2. The pressure sensor is arranged on the substrate, and the pressure sensor comprises a first pressure sensor chip 31 and a second pressure sensor chip 32 which are arranged in a stacked mode.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention is to be determined by the appended claims.
Claims (16)
1. A pressure sensor seal structure, comprising: a substrate, a conductive member and a housing;
the conductive piece is positioned on one side of the substrate and surrounds a closed area on the substrate, and the shell is fixedly connected with the conductive piece through a bonding agent;
wherein the adhesive is arranged along an extension path of the conductive member and covers at least a partial region of the conductive member and a partial region of the substrate.
2. The pressure sensor sealing structure according to claim 1, wherein the adhesive is located at a bottom of the case on a side close to the closed region and at a bottom of the case on a side away from the closed region, wherein the adhesive covers a part of an area of the substrate within the closed region and/or a part of an area of the substrate outside the closed region.
3. The pressure sensor sealing structure of claim 2, wherein a portion of the housing proximate the enclosed area is located on the substrate, and the adhesive covers a portion of the substrate within the enclosed area.
4. The pressure sensor sealing structure of claim 2, wherein the housing completely covers the conductive member, and the adhesive covers a portion of the substrate inside the closed region and/or a portion of the substrate outside the closed region.
5. A pressure sensor sealing structure according to any of claims 1-4, characterized in that the substrate comprises a substrate layer and a solder resist layer, the solder resist layer being provided on the substrate layer and a part of the solder resist layer being located inside the closed area and/or a part of the solder resist layer being located outside the closed area, wherein the adhesive covers at least a part of the solder resist layer.
6. The pressure sensor seal structure of claim 5, wherein the conductive member is disposed on the first surface of the substrate layer and is grounded to the second surface of the substrate layer.
7. The pressure sensor sealing structure according to claim 6, wherein a surface of the conductive member on a side away from the substrate layer is flush with a surface of the solder resist layer on a side away from the substrate layer.
8. The pressure sensor sealing structure of claim 5, wherein the conductive member is a metal ring.
9. The pressure sensor sealing structure of claim 5, wherein the adhesive is silver paste or conductive epoxy paste.
10. The pressure sensor sealing structure of claim 5, further comprising: the first blocking structure is arranged on the solder mask layer and distributed on the solder mask layer in a sawtooth-shaped groove array mode.
11. The pressure sensor sealing structure of claim 5, further comprising: and the second blocking structure is arranged on the substrate layer or the solder mask layer and is positioned in the closed area and at a preset distance interval between the shells.
12. A pressure sensor sealing structure, comprising: the device comprises a substrate, at least one conductive piece and a shell;
the at least one conductive piece is positioned on one side of the substrate, the conductive area is arranged in the middle of the substrate, the at least one conductive piece is arranged at the edge of the conductive area, and the shell is fixedly connected with the conductive piece through an adhesive;
wherein the adhesive is disposed along an edge of the conductive area and covers at least a partial area of the conductive member and a partial area of the substrate.
13. The pressure sensor sealing structure of claim 12, wherein the conductive region has at least one bending region, and the conductive member is disposed at an edge of the at least one bending region.
14. The pressure sensor sealing structure of claim 12, wherein the conductive member is grounded.
15. The pressure sensor sealing structure of claim 12, wherein the substrate comprises a substrate layer and a solder resist layer, the solder resist layer being disposed on the conductive region and the substrate, the conductive member being at least partially uncovered by the solder resist layer.
16. An electronic device comprising the pressure sensor sealing structure according to any one of claims 1 to 15 and a pressure sensor, wherein the pressure sensor is disposed on the substrate, and the pressure sensor comprises a first pressure sensor chip and a second pressure sensor chip which are disposed in a stacked manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221563771.8U CN218444263U (en) | 2022-06-21 | 2022-06-21 | Pressure sensor sealing structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221563771.8U CN218444263U (en) | 2022-06-21 | 2022-06-21 | Pressure sensor sealing structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218444263U true CN218444263U (en) | 2023-02-03 |
Family
ID=85075565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221563771.8U Active CN218444263U (en) | 2022-06-21 | 2022-06-21 | Pressure sensor sealing structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218444263U (en) |
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2022
- 2022-06-21 CN CN202221563771.8U patent/CN218444263U/en active Active
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