WO2023103716A1 - 一种芯片系统及通信设备 - Google Patents
一种芯片系统及通信设备 Download PDFInfo
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- WO2023103716A1 WO2023103716A1 PCT/CN2022/131597 CN2022131597W WO2023103716A1 WO 2023103716 A1 WO2023103716 A1 WO 2023103716A1 CN 2022131597 W CN2022131597 W CN 2022131597W WO 2023103716 A1 WO2023103716 A1 WO 2023103716A1
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- shielding structure
- chip
- shielding
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- circuit board
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Definitions
- the present application relates to the field of chip technology, in particular to a chip system and communication equipment.
- a conventional method to reduce the influence of electromagnetic radiation is to set up electromagnetic shielding bodies for devices that generate electromagnetic radiation or sensitive devices that are susceptible to electromagnetic radiation.
- FIG. 1 this figure is a schematic diagram of an electromagnetic shielding body of a conventional chip package.
- the illustrated chip package includes a chip 11 and a packaging substrate 14 .
- the chip 11 and the packaging substrate 14 are bonded by solder balls.
- the electromagnetic shielding body 13 is generally a technical stamping structure, covers the top side of the chip 11 , and is fixed to the upper surface of the package substrate 14 through the connection portion 15 .
- the upper surface of the chip 11 is in contact with the electromagnetic shield 13 through a thermal interface material (TIM) 12 to accelerate heat dissipation.
- TIM thermal interface material
- the packaging substrate 14 and the printed circuit board (Printed Circuit Board, PCB) 20 are connected by the solder balls 30, there is a gap between the solder balls 30, so that the solder balls 30 become a leakage source of electromagnetic radiation.
- the frequency continues to increase, the demand for reducing electromagnetic radiation leakage continues to increase, and the electromagnetic radiation leaked from the solder balls 30 may even seriously affect the performance of the chip.
- the present application provides a chip system and a communication device, which reduce the electromagnetic leakage of the first connection part, thereby improving the electromagnetic shielding capability of the chip and ensuring the performance of the chip.
- the present application provides a chip system, the chip system includes a chip package and an electromagnetic shielding body, the chip package is electrically connected to the circuit board through a first connection part, in a typical implementation, the first The connection part includes solder balls.
- the chip package includes an electrically connected packaging substrate and at least one chip, and the electromagnetic shield includes a conductive first shielding structure and a conductive second shielding structure.
- the first shielding structure is connected to the packaging substrate, and the first shielding structure includes a first cavity, and the first cavity is used for accommodating at least one chip.
- the first end of the second shielding structure is connected to the circuit board or the pad on the circuit board, and the second end of the second shielding structure is connected to the first shielding structure to form a second cavity, or the first end of the second shielding structure
- the pads on the circuit board or the circuit board are connected, the second shielding structure covers the first shielding structure to form a second cavity, and the first connection part is located in the second cavity.
- the second cavity formed surrounds the first connection part. Since the first shielding structure and the second shielding structure are both conductive, the first shielding structure and the second shielding structure The second shielding structure plays a shielding role together, which can realize the electromagnetic shielding of the first connection part, reduce the electromagnetic leakage of the first connection part, and then improve the electromagnetic shielding ability, ensure the performance of the chip, and reduce the damage of other circuit components. The influence of electromagnetic leakage.
- the first connection part includes an insulating material and a plurality of electrical connection structures, wherein the plurality of electrical connection structures are used to connect the chip package and the circuit board, and the insulating material is filled in the chip package.
- the electrical connection structure is a solder ball
- the first connecting portion includes a solder ball and an insulating material
- the solder ball is used to realize the electrical connection between the chip package and the circuit board.
- the insulating material can play a role in assisting heat dissipation; on the other hand, the insulating material filled between the chip package and the circuit board can also play a supporting role, so that the second shielding structure can be closely attached to the insulating material.
- the side wall is more stable and reliable.
- the connection area between the chip package and the circuit board is increased, and the stability of the connection between the chip package and the circuit board is improved.
- the first connection portion filled with insulating material includes two connection surfaces, one connection surface close to the circuit board is the first connection surface, and one connection surface close to the chip package is the second connection surface,
- the width of the first connection surface is greater than the width of the second connection surface. That is, the insulating material is narrow on the upper side and wider on the lower side after being filled, so as to provide support for the second shielding structure.
- the second shielding structure covers all the sidewalls of the insulating material, or partially covers the sidewalls of the insulating material.
- the insulating material When the insulating material is filled in the connection area between the chip package and the circuit board, the insulating material can be filled through the capillary principle, and the second shielding structure covers all or part of the sidewall of the insulating material, that is, the metal solder balls are surrounded inside, and then Electromagnetic shielding of metal solder balls is realized.
- the second shielding structure when the second shielding structure is in contact with the edge of the insulating material, the insulating material filled between the connection area of the chip package and the circuit board can also play a supporting role, so that the second shielding structure can be close to the side wall of the insulating material , more stable and reliable.
- the first end of the second shielding structure is connected to a pad on the circuit board, so as to improve the stability of the connection of the second shielding structure.
- the first end of the second shielding structure is connected to a pad on the circuit board, and the pad is grounded.
- the electromagnetic shielding body improves the electromagnetic shielding capability of the chip and the first connecting portion.
- the packaging substrate is located on the pad, and the first end of the second shielding structure is electrically connected to the pad.
- the chip package is electrically connected to the circuit board by using LGA packaging technology, and the ground pin of the chip package is electrically connected to the second shielding structure. Since the pad is electrically connected to the first shielding structure through the second shielding structure, when the pad is grounded, the second shielding structure and the first shielding structure are also grounded, which improves the performance of electromagnetic shielding.
- grounding pins on the circuit board are located outside the range covered by the outline of the chip package, they can also be electrically connected to the first shielding structure through the process of creep soldering, thereby avoiding grounding through wiring, which simplifies the ground line.
- the first surface of each chip in the at least one chip is connected to the first shielding structure through the first material.
- the second surface of each chip in the at least one chip is electrically connected to the first surface of the packaging substrate, and the first shielding structure is connected to the first surface of the packaging substrate through the second connection portion.
- the first material can be thermal interface material (Thermal Interface Material, TIM) material
- thermal interface material is mostly flexible material, for example can be gel, silicone grease material, fill between the first surface of the chip and the first shielding structure, a
- TIM Thermal Interface Material
- thermal interface material is mostly flexible material, for example can be gel, silicone grease material, fill between the first surface of the chip and the first shielding structure, a
- it can assist heat dissipation, so that the heat generated when the chip is working can be quickly transferred to the first shielding structure; on the other hand, it provides support for the first shielding structure and improves the stability of the first shielding structure.
- the first shielding structure is fixed to the first surface of the packaging substrate through the second connection part, and the first shielding structure is also fixed to the first surface of the chip through the first material, which improves the stability of the first shielding structure.
- the packaging substrate passes through After the first connecting portion is fixed to the circuit board, the position of the first shielding structure relative to the circuit board is also fixed.
- the second connection part is metal solder, and the first shielding structure is welded to the first surface of the packaging substrate through the second connection part. At this time, the connection between the first shielding structure and the packaging substrate is firm, and the electromagnetic The shielding body has good electromagnetic shielding performance.
- the second connection part is conductive glue, and the first shielding structure is connected to the first surface of the packaging substrate through the second connection part. This method can make the electromagnetic shielding body have good electromagnetic shielding performance.
- the second connection part is insulating melt, and the first shielding structure is connected to the first surface of the package substrate through the second connection part, which reduces the difficulty of manufacturing process and can make the connection between the first shielding structure and the package substrate firm .
- the first surface of each chip in at least one chip is connected to the first shielding structure through a first material.
- the second surface of each chip of the at least one chip is electrically connected to the first surface of the packaging substrate.
- the first shielding structure is connected to the sidewall of the packaging substrate through the second connecting portion.
- the first material can be a thermal interface material, and the first material is filled between the first surface of the chip and the first shielding structure.
- it can assist heat dissipation, so that the heat generated when the chip is in operation can be quickly conducted to the first shielding structure.
- providing support for the first shielding structure improving the stability of the connection of the first shielding structure.
- the first shielding structure is connected to the side wall of the packaging substrate, thereby surrounding the chip package, thereby improving the effect of electromagnetic shielding.
- the second connection part is metal solder, and the first shielding structure is welded to the side wall of the packaging substrate through the second connection part. At this time, the connection between the first shielding structure and the packaging substrate is firm, and the electromagnetic shielding The body has good electromagnetic shielding performance.
- the second connection part is conductive glue, and the first shielding structure is connected to the side wall of the packaging substrate through the second connection part. This method can make the electromagnetic shielding body have good electromagnetic shielding performance.
- the second connection part is insulating melt, and the first shielding structure is connected to the sidewall of the package substrate through the second connection part, which reduces the difficulty of manufacturing process and can make the connection between the first shielding structure and the package substrate firm.
- the first shielding structure is a metal structure.
- the metal structural part can be a metal structural part with a groove structure formed by stamping or casting, which is not specifically limited in the embodiment of the present application.
- the groove is used to accommodate the corresponding part of the chip package, thereby realizing the chip package. electromagnetic shielding.
- the chip package further includes a plastic encapsulant.
- Each of the at least one chip is embedded in the molding compound.
- the first shielding structure covers the outer surface of the molding compound and the sidewall of the packaging substrate.
- the plastic encapsulant can assist heat dissipation, so that the heat generated by the chip can be quickly transferred to the first shielding structure; on the other hand, it provides support for the first shielding structure and improves the stability of the connection of the first shielding structure.
- the first shielding structure covers the outer surface of the molding compound and the sidewall of the packaging substrate, and then surrounds the chip package, thereby improving the effect of electromagnetic shielding.
- the chip package further includes a molding compound, each of the at least one chip is embedded in the molding compound, and each of the at least one chip is electrically connected to the first surface of the packaging substrate.
- a shielding structure covers the outer surface of the molding compound and extends to the first surface of the packaging substrate.
- the plastic encapsulant can assist in heat dissipation, so that the heat generated by the chip can be quickly transferred to the first shielding structure; on the other hand, it provides support for the first shielding structure and improves the stability of the connection of the first shielding structure.
- the first shielding structure covers the outer surface of the molding compound and the sidewall of the packaging substrate, reducing the usage of the molding compound and reducing the material consumption of the first shielding structure.
- the first shielding structure is any one of a conductive film, a metal material, or a conductive adhesive material.
- the conductive film can be formed by spraying; when the first shielding structure is realized by a metal material, the metal material can be deposited by metal sputtering or electroplating; When the first shielding structure is realized by using a conductive adhesive material, the conductive adhesive material may be formed by coating.
- the second shielding structure is any one of a conductive film, a metal material, or a conductive adhesive material.
- the plurality of electrical connection structures included in the first connection part may be any one of metal solder balls, sintering, metal structural parts or plug terminals, and other electrical connection structures may also be used. Implementation manners, the present application will not give examples one by one here.
- the second shielding structure completely covers the first shielding structure, so as to improve electromagnetic shielding capability.
- the second shielding structure is a conductive film, it can also reduce the difficulty of forming the second shielding structure.
- the second shielding structure can be connected to the first shielding structure through an adhesive material, that is, between the second shielding structure and the first shielding structure Adhesive material is added to the contact surface to improve the stability of the connection between the two.
- the implementation manners of the second shielding structure and the first shielding structure may be the same or different, which is not specifically limited in this application.
- the conductive film can be formed by spraying;
- the metal material can be deposited by metal sputtering or electroplating;
- the conductive adhesive material may be formed by coating.
- the second shielding structure is located outside the first shielding structure, and at least a part of the second cavity is located between the packaging substrate and the circuit board.
- the second shielding structure can be connected to the outside of the first shielding structure, which is easy to process and shape.
- Layer shielding structure improves electromagnetic shielding performance.
- the second cavity is located between the packaging substrate and the circuit board, and is used for accommodating the first connection part, so as to realize electromagnetic shielding for the first connection part.
- the present application further provides a communication device, where the communication device includes the chip system provided in the above implementation manner.
- the chip package included in the communication equipment has high requirements on electromagnetic shielding, so when the chip package is mounted on the PCB, it is necessary to perform more comprehensive and complete electromagnetic shielding on the chip package.
- the electromagnetic shielding body included in the communication equipment provided by the present application can realize the electromagnetic shielding of the electrical connection structural parts in the first connection part, reduce the electromagnetic leakage of the electrical connection structural parts in the first connection part, and improve the safety of the chip package.
- the electromagnetic shielding ability ensures the performance of the chip, and can also reduce the influence of electromagnetic leakage on other circuit components, thus improving the performance of communication equipment.
- the communication device is a radio frequency transceiver.
- the radio frequency transceiver is connected to the base band processing unit (Base band Unit, BBU) of the base station through an optical fiber.
- BBU Base band Unit
- the BBU is used to process data transmitted by the radio frequency transceiver, and transmit data to be transmitted to the radio frequency transceiver.
- the technical solution of the present application improves the electromagnetic shielding ability of the chip package, and further improves the working performance of the radio frequency transceiver.
- At least one chip includes an intermediate frequency chip.
- the intermediate frequency chip is used in the intermediate frequency circuit of the radio frequency transceiver.
- Fig. 1 is the schematic diagram of traditional electromagnetic shielding body
- FIG. 2A is a schematic cross-sectional view of a chip system provided by an embodiment of the present application.
- FIG. 2B is a side view corresponding to FIG. 2A provided by the embodiment of the present application.
- FIG. 3 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- Figure 4A is an enlarged view of area A in Figure 3 provided by the embodiment of the present application.
- FIG. 4B is a top view corresponding to FIG. 3 provided by the embodiment of the present application.
- FIG. 4C is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- Fig. 5 is the waveform diagram of the simulation test that the embodiment of the present application provides
- FIG. 6 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- FIG. 7 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- FIG. 8 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- FIG. 9 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- FIG. 10 is a schematic cross-sectional view of another chip system provided by the embodiment of the present application.
- FIG. 11 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- FIG. 12 is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- Fig. 13A is the first schematic cross-sectional view corresponding to Fig. 12 provided by the embodiment of the present application;
- Fig. 13B is the second schematic cross-sectional view corresponding to Fig. 12 provided by the embodiment of the present application.
- Figure 14 is the first side view corresponding to Figure 12 provided by the embodiment of the present application.
- Figure 15A is the third schematic cross-sectional view corresponding to Figure 12 provided by the embodiment of the present application.
- Fig. 15B is a schematic cross-sectional view four corresponding to Fig. 12 provided by the embodiment of the present application;
- Figure 16A is the first side view corresponding to Figures 15A and 15B provided by the embodiment of the present application;
- Figure 16B is the second side view corresponding to Figures 15A and 15B provided by the embodiment of the present application.
- FIG. 17 is a schematic diagram of a radio frequency transceiver system provided by an embodiment of the present application.
- a chip package includes a chip and a packaging substrate.
- Chips include but are not limited to intermediate frequency (Intermediate Frequency, IF) chips, radio frequency (Radio Frequency, RF) chips, central processing unit (Central Processing Unit, CPU), graphics processing unit (Graphics Processing Unit, GPU), field programmable logic gate Array (Field Programmable Gate Array, FPGA) and neural network processor (Neural network Processing Unit, NPU), etc.
- solder ball connection between the chip package and the PCB as an example, continue to refer to FIG. 1, there is a gap between the solder balls 30, so that the solder balls 30 become a leakage source of electromagnetic radiation, which affects the performance of the chip 11, and will also Electromagnetic interference is caused to the radio frequency circuit contained in the electronic equipment itself, as well as the processor and memory that need to use the clock signal.
- the present application provides a chip system and a communication device.
- the chip system includes a chip package and an electromagnetic shielding body, the chip package is electrically connected to the circuit board through the first connection part, and the chip package includes a package substrate and at least one chip. An electrical connection is made between the packaging substrate and the at least one chip.
- the electromagnetic shielding body includes a conductive first shielding structure and a conductive second shielding structure.
- the first shielding structure is connected to the packaging substrate, the first cavity of the first shielding structure is used to accommodate at least one chip, the first end of the second shielding structure is connected to the circuit board or a pad on the circuit board, and the first end of the second shielding structure The two ends are connected to the first shielding structure to form the second cavity, or the first end of the second shielding structure is connected to the pad on the circuit board or connected to the circuit board, and the second shielding structure covers the first shielding structure to form the second cavity. Two cavities, the first connecting part is located in the second cavity.
- the electromagnetic shielding body provided by this application can realize electromagnetic shielding for the first connecting part, reduce the electromagnetic leakage of the first connecting part, further improve the electromagnetic shielding capability of the chip package, ensure the performance of the chip, and reduce other The effects of electromagnetic leakage on circuit components.
- Words such as “first” and “second” in the description of the present application are used for description purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
- orientation terms such as “upper” and “lower” may include, but are not limited to, definitions relative to the schematic placement orientations of components in the drawings. It should be understood that these directional terms may be relative concepts, They are used for description and clarification relative to, which may change accordingly according to changes in the orientation in which parts of the figures are placed in the figures.
- “communication” should be understood in a broad sense.
- “communication” can be fixed connection, detachable connection, or integration; Can be connected indirectly through an intermediary.
- the chip package may include one chip or multiple chips.
- the following embodiments all take the chip package including one chip as an example for illustration.
- FIG. 2A this figure is a schematic cross-sectional view of a chip system provided by an embodiment of the present application.
- the illustrated chip package includes a chip 11 and a packaging substrate 14 .
- the packaging substrate 14 may be a circuit board including multiple conductive layers, and the upper surface and the lower surface of the packaging substrate 14 are provided with exposed pad structures.
- the chip 11 is electrically connected to the package substrate 14 .
- the surface of the chip 11 includes metal bumps, and the chip 11 and the packaging substrate 14 are soldered.
- the solder can be tin-containing alloy solder, and solder paste is printed on the surface of the substrate by reflow soldering. Realize the connection between the chip and the substrate.
- the electromagnetic shielding body includes: a first shielding structure 13 and a second shielding structure 16 .
- Both the first shielding structure 13 and the second shielding structure 16 are conductive structures.
- the first shielding structure 13 is connected to the packaging substrate 14 , the first shielding structure 13 includes a first inner cavity, and the chip 11 is located in the first inner cavity of the first shielding structure 13 .
- the second shielding structure 16 is located outside the first shielding structure 13, and at least a part of the second cavity is located between the packaging substrate and the circuit board. At this time, the second shielding structure can be connected to the outside of the first shielding structure, which is easy to process and shape. Layer shielding structure improves electromagnetic shielding performance.
- the second cavity is located between the packaging substrate and the circuit board, and is used for accommodating the first connection part, so as to realize electromagnetic shielding for the first connection part.
- the chip package is electrically connected to the PCB 20 through the first connecting portion.
- the first connecting part includes a plurality of electrical connecting structural parts, and the electrical connecting structural parts may include metal solder balls, sintering, metal structural parts or plug terminals, etc., and may also be other electrical connecting structural parts, so as to realize the connection between the first connecting part and
- the electrical connection between the PCBs 20 is not specifically limited in this embodiment of the present application.
- the electrical connection structural member of the first connection part is the metal solder ball 30 as an example for illustration.
- FIG. 2B this figure is a side view corresponding to FIG. 2A provided by the embodiment of the present application.
- FIG. 2B is a schematic diagram of external observation.
- the first end of the second shielding structure 16 is connected to the circuit board 20, or connected to the pad 201 on the circuit board 20, and the second end of the second shielding structure 16
- the first shielding structure 13 is connected to form a second cavity, the second shielding structure 16 completely covers the side of the package substrate, and the first connection part is located in the second cavity formed around itself, at this time, the external observation shown in FIG. 2B
- the first connection part is completely blocked by the second shielding structure 16 .
- the electromagnetic shield formed by the first shielding structure 13 and the second shielding structure 16 covers the chip package and the first connection part, reduces the electromagnetic leakage of the first connection part, and then improves the electromagnetic shielding of the chip package The ability ensures the performance of the chip, and can also reduce the influence of electromagnetic leakage on other circuit components.
- the second shielding structure 16 partially covers the side of the package substrate, thereby saving materials.
- this figure is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- the packaging substrate 14 and the PCB 20 may be connected by a ball grid array (Ball Grid Array, BGA) package or a land grid array (Land Grid Array, LGA) package.
- BGA Ball Grid Array
- LGA Land Grid Array
- a plurality of solder balls between the package substrate 14 and the PCB 20 form an array and are distributed between the package substrate and the PCB 20 so that the PCB 20 communicates with the chip package.
- the required contacts for connecting the chip package body to the PCB 20 are located on the PCB 20 , and the underside of the package substrate covers the grid-shaped connection ends.
- the point contact technology is used to make the PCB20 communicate with the chip package, and the PCB20 provides pins, which can replace the solder balls in the BGA package.
- the multiple electrical connection structures of the first connection part in FIG. 3 are specifically a plurality of metal solder balls 30. Specific limits. It can be understood that, in some other embodiments, when the packaging method is replaced by LGA, the first connection part includes pins and contacts, which will not be repeated in this embodiment of the present application.
- the first surface of the chip 11 is fixed to the first shielding structure 13 through the first material 12 .
- the first material 12 is a thermal interface (Thermal Interface Material, TIM) material, and the thermal interface material is mostly a flexible material, such as a gel or a silicone grease material, which is filled in the first layer of the chip 11.
- TIM Thermal Interface Material
- the thermal interface material is mostly a flexible material, such as a gel or a silicone grease material, which is filled in the first layer of the chip 11.
- the second surface of the chip 11 is electrically connected to the first surface of the packaging substrate 14 .
- the surface of the chip 11 includes metal bumps
- the upper surface of the packaging substrate 14 includes pads
- solder paste is printed on the surface of the packaging substrate 14
- the chip 11 and the packaging substrate 14 are soldered by reflow soldering.
- an underfill material can be injected between the chip 11 and the packaging substrate 14 to improve the stability of the connection.
- the underfill material is an insulating material.
- the embodiment of the present application does not limit the specific type of the underfill material. , such as epoxy resin.
- the first shielding structure 13 is fixed to the first surface of the packaging substrate 14 through the second connecting portion 15 .
- the first shielding structure 13 is fixed to the first surface of the packaging substrate 14 through the second connection portion 15, and the first shielding structure 13 is also fixed to the first surface of the chip 11 through the first material 12, the first shielding structure 13 is improved. stability, when the packaging substrate is fixed to the circuit board 20 through the first connection portion, the position of the first shielding structure 13 relative to the circuit board is also fixed.
- the first shielding structure 13 is a metal structural part, and the metal structural part may be formed by stamping or casting, which is not specifically limited in this embodiment of the present application.
- the metal structure has a groove structure, and the groove is used to accommodate the corresponding part of the chip package, thereby realizing electromagnetic shielding of the chip package.
- the second connecting portion 15 is metal solder, and the first shielding structure 13 is welded to the first surface of the packaging substrate 14 through the second connecting portion 15. At this time, the first shielding structure 13 and the packaging substrate 14 The connection is firm, and the electromagnetic shielding body has good electromagnetic shielding performance.
- the second connection part 15 is conductive glue
- the first shielding structure 13 is fixed to the first surface of the packaging substrate 14 through the second connection part 15. This method can make the electromagnetic shielding body have good performance. electromagnetic shielding performance.
- the second connection part is insulating melt
- the first shielding structure 13 is fixed to the first surface of the packaging substrate 14 through the second connection part 15, which reduces the difficulty of manufacturing process and can Make the connection between the first shielding structure 13 and the packaging substrate firm.
- the lower surface of the packaging substrate 14 is electrically connected to the PCB 20 through metal solder balls 30 , specifically, the electrical connection between the substrate circuit 14 and the PCB can be realized through a reflow process.
- the PCB 20 includes multiple layers of circuit layers, and the PCB shown in the figure is only an illustration, and does not constitute a limitation to the technical solution of the present application.
- the pad 201 is a metal pad.
- the pad 201 is connected to the ground circuit layer of the PCB. Examples are not specifically limited.
- the first connection portion also includes an insulating material 17 .
- connection area between the chip package and the circuit board 20 is filled with the insulating material 17 , that is, the connection area between the lower surface of the package substrate 14 and the PCB 20 is filled with the insulating material 17 .
- the insulating material 17 can be an underfill material, such as epoxy resin material, etc., and the insulating material 17 can fill the gaps between the plurality of metal solder balls through the capillary principle.
- the insulating material 17 can fill the gaps between the plurality of metal solder balls as much as possible, or only fill the insulating material 17 at the edge of the connection area between the chip package and the circuit board 20 .
- the second shielding structure 16 shown in the figure covers the sidewall of the insulating material 17, the first end of the second shielding structure 16 is connected to the pad 201, and the pad 201 is grounded, thereby improving the electromagnetic shielding effect on the chip 11 and the first connecting portion. Electromagnetic shielding capability, the second end of the second shielding structure 16 is connected to the first shielding structure 13 .
- the second shielding structure 16 surrounds each metal solder ball 30 inside, thereby realizing electromagnetic shielding for the metal solder ball 30 .
- the insulating material 17 can also play a supporting role, and the second shielding structure can be closely attached to the side wall of the insulating material, which is more stable and reliable.
- the second shielding structure 16 is any one of a conductive film, a metal material or a conductive adhesive material, which is not specifically limited in this embodiment of the present application.
- the conductive film can be formed by spraying.
- the metal material can be deposited by metal sputtering or electroplating, and the metal material can be copper, silver or other metal materials, which are not specifically limited in the embodiment of the present application.
- the conductive adhesive material can be formed by coating.
- a commonly used conductive adhesive material may be a conductive adhesive material containing metallic silver, that is, conductive silver adhesive.
- FIG. 4A is an enlarged view of area A in FIG. 3 provided by the embodiment of the present application.
- the side wall formed by the insulating material 17 extends outward along the direction from top to bottom.
- the first connection portion filled with the insulating material 17 includes two connection surfaces, one connection surface close to the circuit board is the first connection surface, and the other connection surface close to the chip package is the second connection surface.
- the width of the first connection surface is greater than the width of the second connection surface. That is, the upper side of the insulating material 17 is narrow and the lower side is wider.
- the conductive film can be formed by spraying on the side walls of the insulating material 17 to ensure that the second shielding structure 16 surrounds the metal solder balls 30 inside. .
- the metal material can be deposited by metal sputtering deposition or electroplating process, and can also rely on the sidewall of insulating material 17 to ensure that the second shielding structure 16 welds each metal
- the ball 30 surrounds the inside.
- the conductive adhesive material can be formed by coating, relying on the sidewall of the insulating material 17, so as to ensure that the second shielding structure 16 surrounds each metal solder ball 30 inside .
- the sidewalls of the insulating material 17 can provide support for the second shielding structure 16 .
- the insulating material 17 can also strengthen the connection between the PCB and the package substrate.
- the insulating material 17 in the following drawings and descriptions of the present application is the filling method in FIG. 4A , which will not be repeated one by one.
- FIG. 4B is a top view corresponding to FIG. 3 provided by the embodiment of the present application.
- the top view shown in FIG. 4B is a cross-sectional view from a top view angle.
- the first shielding structure 13, the second shielding structure 16 and the PCB 20 together form a cavity, and the second shielding structure 16 completely covers the side of the package substrate 14, and makes the first connecting portion Located within the cavity formed around itself.
- the pads shown in FIG. 4B surround the chip package and are used to fully fix the first end of the second shielding structure 16, so as to improve the stability of the connection of the second shielding structure 16 and improve the electromagnetic shielding capability of the electromagnetic shielding body. .
- the pads may not surround the chip package to save material.
- the electromagnetic shield formed by the first shielding structure 13 and the second shielding structure 16 covers the chip package and the first connection part, reduces the electromagnetic leakage of the first connection part, and then improves the electromagnetic shielding of the chip package The ability ensures the performance of the chip, and can also reduce the influence of electromagnetic leakage on other circuit components.
- this figure is a schematic cross-sectional view of another electromagnetic shielding body of a chip package provided by an embodiment of the present application.
- the second shielding structure 16 of the electromagnetic shielding body is a conductive film, and the conductive film can also completely cover the second shielding structure 13.
- the second shielding structure 16 can be connected to the first shielding structure through an adhesive material (Cohensive). 13 connection, that is, adding an adhesive material on the contact surface between the second shielding structure 16 and the first shielding structure 13, so as to improve the stability of the connection between the two.
- this figure is a waveform diagram of a simulation test provided by an embodiment of the present application.
- the waveform diagrams illustrating the simulation test show the shielding effectiveness in the frequency band from 2 GHz to 10 GHz when the schemes in Fig. 3 and Fig. 1 are adopted respectively.
- Shielding effectiveness shows the degree of attenuation of electromagnetic waves by the shielding body. Since shielding can usually attenuate the intensity of electromagnetic waves to one percent to one ten thousandth of the original, it is usually expressed in decibels (dB).
- the shielding performance can be increased by about 7dB to 8dB. That is, the electromagnetic leakage of the solder balls can be reduced, thereby improving the electromagnetic shielding capability of the chip package and ensuring the performance of the chip.
- this figure is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- the first surface of the chip 11 is connected to the first shielding structure 13 through the first material 12 .
- the second surface of the chip 11 is electrically connected to the first surface of the packaging substrate 14 .
- the first shielding structure 13 is fixed to the sidewall of the packaging substrate 14 through the second connecting portion 15 .
- the first material 12 can be a thermal interface material, and the thermal interface material is filled between the first surface of the chip 11 and the first shielding structure.
- the heat is quickly conducted to the first shielding structure, on the other hand, it provides support for the first shielding structure and improves the stability of the first shielding structure.
- the first shielding structure is fixed to the side wall of the package substrate, and then surrounds the side of the chip package, thereby improving the effect of electromagnetic shielding.
- the second connecting portion 15 is metal solder, and the first shielding structure 13 is welded to the side wall of the packaging substrate 14 through the second connecting portion 15. At this time, the first shielding structure 13 and the packaging substrate 14 The connection is firm, and the electromagnetic shielding body has good electromagnetic shielding performance.
- the second connection part 15 is conductive glue
- the first shielding structure 13 is fixed to the side wall of the packaging substrate 14 through the second connection part 15. This method can make the electromagnetic shielding body have good performance. Electromagnetic shielding performance.
- the second connecting portion 15 is insulating melt, and the first shielding structure 13 is fixed to the sidewall of the package substrate 14 through the second connecting portion 15, which reduces the difficulty of manufacturing process and can Make the connection between the first shielding structure and the packaging substrate firm.
- the first end of the second shielding structure 16 is connected to the pad 201, and the grounding of the pad 201 improves the electromagnetic shielding ability of the electromagnetic shielding body to the chip and the first connection part, and the second end of the second shielding structure 16 is connected to the first shielding structure 13 .
- this figure is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- the first connecting part further includes an insulating material 17 .
- the insulating material 17 is filled between the chip package, the circuit board 20 and the plurality of metal solder balls 30 , that is, the insulating material 17 is filled in the gap between the lower surface of the package substrate 14 and the PCB 20 .
- the insulating material 17 can be an underfill material, such as epoxy resin material, etc., and the insulating material 17 can fill the gaps between the plurality of metal solder balls through the capillary principle.
- the insulating material 17 can fill the space between the chip package, the circuit board 20 and the plurality of metal solder balls as much as possible, or only fill the insulating material 17 at the edge of the connection area between the chip package and the circuit board 20 .
- the second shielding structure 16 covers the sidewall of the insulating material 17, the first end of the second shielding structure 16 is connected to the pad 201, and the pad 201 is grounded, thereby improving the electromagnetic shielding ability of the electromagnetic shielding body to the chip and the first connection part, A second end of the second shielding structure 16 is connected to the first shielding structure 13 .
- using the electromagnetic shielding body provided by this application can achieve electromagnetic shielding for the first connecting part, reduce the electromagnetic leakage of the first connecting part, further improve the electromagnetic shielding capability of the chip package, and ensure the performance of the chip , It can also reduce the influence of electromagnetic leakage on other circuit components.
- FIG. 8 this figure is a schematic cross-sectional view of another chip system provided by the embodiment of the application.
- the chip package shown in FIG. 8 also includes a molding compound 18 , and the chip 11 is embedded in the molding compound 18 .
- the chip 11 is electrically connected to the first surface of the packaging substrate 14 , and the first shielding structure covers the outer surface of the molding compound 18 and the sidewall of the packaging substrate 14 .
- the first shielding structure 13 may be a conductive film, a metal material or a conductive adhesive material.
- the conductive film may be formed by spraying.
- the metal material can be deposited by metal sputtering or electroplating, and the metal material can also be a stamped or cast metal structure.
- the conductive adhesive material may be formed by coating.
- the molding compound 18 can assist heat dissipation, so that the heat generated by the chip can be quickly transferred to the first shielding structure 13; Stability also enables the first shielding structure 13 to be formed by relying on the molding compound 18 .
- the first shielding structure 13 covers the outer surface of the molding compound 18 and the sidewall of the package substrate 14 , and further surrounds the chip package, thereby improving the effect of electromagnetic shielding.
- the second surface of the chip 11 is electrically connected to the first surface of the packaging substrate 14 .
- the surface of the chip 11 includes metal bumps
- the upper surface of the packaging substrate 14 includes pads
- solder paste is printed on the surface of the packaging substrate 14
- the chip 11 and the packaging substrate 14 are soldered by reflow soldering.
- an underfill material can be injected between the chip 11 and the packaging substrate 14 to improve the stability of the connection.
- the underfill material is an insulating material. The embodiment of the present application does not limit the specific type of the underfill material, for example, For epoxy resin.
- the lower surface of the packaging substrate 14 is electrically connected to the PCB 20 through metal solder balls 30 , specifically, the electrical connection between the substrate circuit 14 and the PCB can be realized through a reflow process.
- the pad 201 is a metal pad.
- the pad 201 is connected to the ground circuit layer of the PCB.
- the connection between the pad 201 and the ground circuit layer of the PCB can be a plated through-hole structure or slotting
- the electroplating structure is not specifically limited in this embodiment of the present application.
- the second shielding structure 16 surrounds each metal solder ball 30 inside, thereby realizing electromagnetic shielding for the metal solder ball 30 .
- the implementation manners of the second shielding structure and the first shielding structure may be the same or different, which is not specifically limited in this application.
- the conductive film can be formed by spraying; when the second shielding structure is realized by a metal material, the metal material can be deposited by metal sputtering or electroplating; When the second shielding structure is realized by using a conductive adhesive material, the conductive adhesive material may be formed by coating.
- this figure is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- the first connecting part further includes an insulating material 17 .
- the area between the package substrate of the chip package, the circuit board 20 and the plurality of metal solder balls is filled with the insulating material 17 , that is, the gap between the lower surface of the package substrate 14 and the PCB 20 is filled with the insulating material 17 .
- the insulating material 17 can use an underfill material, such as epoxy resin material, etc., and the insulating material 17 can fill the gaps between multiple metal solder balls through the capillary principle.
- the insulating material 17 can fill as much as possible the area between the packaging substrate of the chip package, the circuit board 20 and the plurality of metal solder balls, or only fill the insulating material 17 at the edge of the connection area between the chip package and the circuit board 20 .
- the second shielding structure 16 covers the sidewall of the insulating material 17, the first end of the second shielding structure 16 is connected to the pad 201, and the pad 201 is grounded to improve the electromagnetic shielding ability of the electromagnetic shielding body to the chip and the first connection part.
- the second end of the shielding structure 16 is connected to the first shielding structure 13 .
- using the electromagnetic shielding body provided by this application can achieve electromagnetic shielding for the first connecting part, reduce the electromagnetic leakage of the first connecting part, further improve the electromagnetic shielding capability of the chip package, and ensure the performance of the chip , It can also reduce the influence of electromagnetic leakage on other circuit components.
- FIG. 10 is a schematic cross-sectional view of another chip system provided by the embodiment of the present application.
- the difference between the electromagnetic shielding body shown in FIG. 10 and FIG. 8 is that the first shielding structure 13 covers the outer surface of the molding compound 18 and extends to the first surface of the packaging substrate 14 .
- the plastic encapsulant 18 can assist heat dissipation, so that the heat generated by the chip 11 can be quickly transferred to the first shielding structure 13; on the other hand, it provides support for the first shielding structure 13, improving the stability of the first shielding structure sex.
- the first shielding structure covers the outer surface of the molding compound and the sidewall of the packaging substrate. Compared with the implementation in FIG. 8 , the usage of the molding compound 18 and the material consumption of the first shielding structure 13 are reduced.
- the conductive film can be formed by spraying; when the first shielding structure 13 is realized by a metal material, the metal material can be deposited by metal sputtering or electroplating Generation; when the first shielding structure 13 is realized by using a conductive adhesive material, the conductive adhesive material may be formed by coating.
- the first end of the second shielding structure 16 is connected to the pad 201 on the PCB 20, the pad 201 is grounded to improve the electromagnetic shielding ability of the electromagnetic shielding body to the chip and the metal solder ball, and the second end of the second shielding structure 16 is connected to the first shielding structure 13 , at this moment, the second shielding structure 16 also covers the side surface of the packaging substrate 14 .
- the implementation manners of the second shielding structure 16 and the first shielding structure 13 may be the same or different, which is not specifically limited in this embodiment of the present application.
- the conductive film can be formed by spraying; when the second shielding structure 16 is realized by a metal material, the metal material can be deposited by metal sputtering or electroplating. Formation; when the second shielding structure 16 is realized by using a conductive adhesive material, the conductive adhesive material may be formed by coating.
- FIG. 11 this figure is a schematic cross-sectional view of another chip system provided by an embodiment of the present application.
- the first connection part further includes an insulating material 17 .
- the area between the packaging substrate of the chip package, the circuit board 20 and the plurality of metal solder balls 30 is filled with the insulating material 17 , that is, the gap between the lower surface of the packaging substrate 14 and the PCB 20 is filled with the insulating material 17 .
- the insulating material 17 can use an underfill material, such as epoxy resin material, etc., and the insulating material 17 can fill the gaps between multiple metal solder balls through the capillary principle.
- the insulating material 17 can fill as much as possible the area between the packaging substrate of the chip package, the circuit board 20 and the plurality of metal solder balls 30 , or only fill the insulating material 17 at the edge of the connection area between the chip package and the circuit board 20 .
- the second shielding structure 16 covers the sidewall of the insulating material 17, the first end of the second shielding structure 16 is connected to the pad 201, and the pad 201 is grounded, thereby improving the electromagnetic shielding ability of the electromagnetic shielding body to the chip and the first connection part, A second end of the second shielding structure 16 is connected to the first shielding structure 13 .
- using the electromagnetic shielding body provided by this application can achieve electromagnetic shielding for the first connecting part, reduce the electromagnetic leakage of the first connecting part, further improve the electromagnetic shielding capability of the chip package, and ensure the performance of the chip , It can also reduce the influence of electromagnetic leakage on other circuit components.
- FIG. 12 this figure is a schematic cross-sectional view of another chip system provided by the embodiment of the present application.
- Fig. 12 is a top view of the plane where the x and y axes are located.
- the chip package 10 is represented by a solid line frame, and the first shielding structure is not shown in Fig. 12 and a second shielding structure.
- the chip package 10 includes a chip and a packaging substrate, the packaging substrate is located on the pad 201 , the first end of the second shielding structure is electrically connected to the pad 201 , and the second end of the second shielding structure is electrically connected to the first shielding structure.
- the pins on the PCB 20 include first pins 202 and ground pins 203 , and the application does not specifically limit the specific distribution and quantity of the first pins 202 and ground pins 203 .
- the first pin 202 is a signal transmission pin
- the ground pin 203 is used for grounding.
- the projection of the first pin 202 on the plane where the x and y axes are located is located in the range covered by the outline of the chip package 10; the projection of the grounding pin 203 on the plane where the x and y axes are located is partially located in the area covered by the outline of the chip package 10 within the range covered by the outline of the chip package body 10 , or all located outside the range covered by the outline of the chip package body 10 , the present application will take a part within the range covered by the outline of the chip package body 10 as an example for illustration.
- the projections of the two sides of the pad 201 on the plane where the x and y axes are located are located outside the range covered by the outline of the chip package 10, and the areas extending from both sides of the pad 201, that is, the B area and the B1 area shown in the figure, are represented by
- the welding pad 201 is electrically connected to the first shielding structure through a creeping soldering process.
- the embodiment of the present application does not limit the specific area of the B1 area of the B area.
- Area C and area C1 in the figure are areas where the chip package 10 and the PCB 20 are electrically connected.
- the required contacts when the chip package 10 is connected to the PCB 20 are located on the PCB 20 , and the underside of the package substrate covers the grid-shaped connection terminals.
- the point contact technology is used to make the PCB20 communicate with the chip package, and the PCB20 provides pins, which can replace the solder balls in the BGA package.
- the region can be filled with insulating material, and the insulating material can be an underfill material, such as epoxy resin material, etc., and the insulating material can fill the gap through capillary principle.
- the insulating material can be an underfill material, such as epoxy resin material, etc., and the insulating material can fill the gap through capillary principle.
- the region may not be filled with insulating material.
- FIG. 13A this figure is the first schematic cross-sectional view corresponding to FIG. 12 provided by the embodiment of the present application.
- Figure 13A is a cross-sectional view of the plane where the x and z axes are located
- the areas extending from both sides of the pad 201 ie, the B area and the B1 area shown in the figure, are used to form the second shielding structure 16 through a creep soldering process, so that the pad 201 is electrically connected to the first shielding structure 13 .
- one end of the second shielding structure 16 is connected to the pad 201 , and the other end is connected to the first shielding structure 13 .
- the first surface of the chip 11 is fixed to the first shielding structure 13 through the first material 12 .
- the first material 12 is a TIM material
- the TIM material is mostly a flexible material, such as a gel or a silicone material, which is filled between the first surface of the chip 11 and the first shielding structure 13
- the TIM material can assist heat dissipation, so that the heat generated by the chip 11 can be quickly transferred to the first shielding structure; on the other hand, it provides support for the first shielding structure 13, thereby improving the stability of the first shielding structure 13 .
- the first shielding structure 13 is a metal structural part, and the metal structural part may be formed by stamping or casting, which is not specifically limited in this embodiment of the present application.
- the metal structure has a groove structure, and the groove is used to accommodate the corresponding part of the chip package, thereby realizing electromagnetic shielding of the chip package.
- the pad 201 Since the pad 201 is electrically connected to the first shielding structure 13 through the second shielding structure 16, when the pad 201 is grounded, the second shielding structure 16 and the first shielding structure 13 are also grounded, which improves the performance of electromagnetic shielding.
- ground pins 203 on the PCB 20 are partly located outside the range covered by the outline of the chip package 10, they can also be electrically connected to the first shielding structure 13 through a process of creep soldering, thereby avoiding the need for wiring on the PCB 20. ground, simplifying the ground wiring.
- FIG. 13B is the second schematic cross-sectional view corresponding to FIG. 12 provided by the embodiment of the present application.
- 13B is a cross-sectional view of the plane where the x and z axes lie.
- the chip package also includes a plastic encapsulant 18 , and the chip 11 is embedded in the plastic encapsulant 18 .
- the first shielding structure 13 may be a conductive film, a metal material or a conductive adhesive material.
- the conductive film may be formed by spraying.
- the metal material can be deposited by metal sputtering or electroplating, and the metal material can also be a stamped or cast metal structure.
- the conductive adhesive material may be formed by coating.
- the molding compound 18 can assist heat dissipation, so that the heat generated by the chip can be quickly transferred to the first shielding structure 13; Stability also enables the first shielding structure 13 to be formed by relying on the molding compound 18 .
- the first shielding structure 13 covers the outer surface of the molding compound 18 and the sidewall of the package substrate 14 , and further surrounds the chip package, thereby improving the effect of electromagnetic shielding.
- FIG. 14 this figure is the first side view corresponding to FIG. 12 provided by the embodiment of the present application.
- Fig. 14 is a side view of the plane where the y and z axes are located.
- the second shielding structure 16 is formed by using the process of creep welding, so that the pad 201 is electrically connected to the first shielding structure 13, and the second shielding structure 16 only Part of the second shielding structure 16 is covered to save material.
- the part of the ground pin 203 extending to the outside of the chip package body 10 can also form the second shielding structure 16 through a creep soldering process to realize the electrical connection with the first shielding structure 13, thereby avoiding the grounding of the PCB 20 through wiring, simplifying ground line.
- the ground pin 203 , the bonding pad 201 , the first shielding structure 13 and the second shielding structure 16 surround the first pin 202 , which also improves the electromagnetic shielding performance of the chip system.
- FIG. 15A this figure is the third schematic cross-sectional view corresponding to FIG. 12 provided by the embodiment of the present application.
- FIG. 15A is a cross-sectional view of the plane where the x and z axes are located.
- the difference between the chip system shown in FIG. 15A and FIG. 13A is that the second shielding structure 16 of the chip system shown in 15A is a conductive film, and the conductive film covers the outside of the second shielding structure 13. .
- FIG. 15B is a schematic cross-sectional view corresponding to FIG. 12 provided in the embodiment of the present application.
- FIG. 15B is a cross-sectional view of the plane where the x and z axes lie.
- the difference between the chip system shown in FIG. 15B and FIG. 15A is that the chip package also includes a plastic encapsulant 18 in which the chip 11 is embedded.
- the first shielding structure 13 may be a conductive film, a metal material or a conductive adhesive material.
- the conductive film may be formed by spraying.
- the metal material can be deposited by metal sputtering or electroplating, and the metal material can also be a stamped or cast metal structure.
- the conductive adhesive material may be formed by coating.
- the molding compound 18 can assist heat dissipation, so that the heat generated by the chip can be quickly transferred to the first shielding structure 13; Stability also enables the first shielding structure 13 to be formed by relying on the molding compound 18 .
- the first shielding structure 13 covers the outer surface of the molding compound 18 and the sidewall of the package substrate 14 , and further surrounds the chip package, thereby improving the effect of electromagnetic shielding.
- FIG. 16A this figure is the first side view corresponding to FIGS. 15A and 15B provided by the embodiment of the present application.
- Fig. 16A is a side view of the plane where the y and z axes are located, and the second shielding structure includes two parts at this time.
- the first part of the second shielding structure is a conductive film, which covers the outside of the second shielding structure 13 , and the conductive film is fixed by the areas extending from both sides of the pad 201 .
- the ground pin 203 extends to the part outside the range of the chip package body 10, and the second part of the second shielding structure 16 is formed by a creep welding process, so as to realize the electrical connection with the first shielding structure 13, thereby avoiding grounding on the PCB 20 through wiring. , simplifying the ground wiring.
- the ground pin 203 , the bonding pad 201 , the first shielding structure 13 and the second shielding structure 16 surround the first pin 202 , which improves the electromagnetic shielding performance of the chip system.
- FIG. 16B this figure is the second side view corresponding to FIGS. 15A and 15B provided by the embodiment of the present application.
- FIG. 16B is a side view of the plane where the y and z axes are located.
- the second shielding structure 16 is a conductive film
- the ground pin 203 extends to the part outside the range of the chip package 10. and the parts extending out of the chip package 10 on both sides of the pad 201 are used for electrical connection with the conductive film.
- the conductive film can completely cover the first shielding structure 13 or completely cover the sidewall of the first shielding structure 13 .
- the pad 201 , the first shielding structure 13 and the second shielding structure 16 surround the first pin 202 , which improves the electromagnetic shielding performance of the chip system.
- the first pin 202 and the ground pin 203 are located on the upper and lower sides of the chip package 10 in the chip system as an example. As the number of ground pins 203 changes, their layout positions can be adjusted accordingly, and can be arranged on only one side, or on three sides, or on four sides, which will not be repeated here.
- an embodiment of the present application further provides a communication device using the system-on-a-chip, which will be described in detail below.
- the communication device includes a PCB, and chip packages corresponding to intermediate frequency (Intermediate Frequency, IF) chips and radio frequency (Radio Frequency, RF) chips on the PCB may use the chip system provided in the above embodiments.
- IF Intermediate Frequency
- RF Radio Frequency
- this figure is a schematic diagram of a radio frequency transceiver system provided by an embodiment of the present application.
- the radio frequency transceiver 01 applied to the wireless communication system supports multiple-input multiple-output (Multiple-Input Multiple-Output, MIMO) function, and can transmit signals to different user equipments (User Equipment, UE) simultaneously by using multiple transmitting antennas, And use multiple receiving antennas to simultaneously receive signals sent by multiple UE02s.
- MIMO Multiple-Input Multiple-Output
- the radio frequency transceiver system provided in the embodiment of the present application includes: a radio frequency transceiver 01 and a baseband processing unit (Base band Unit, BBU) 03.
- BBU Base band Unit
- a radio frequency transceiver system generally includes multiple radio frequency transceivers 01 and multiple BBUs 03 .
- One BBU03 supports simultaneous access to multiple radio frequency transceivers 01, and this embodiment of the present application does not limit the specific number of radio frequency transceivers 01 that one BBU03 simultaneously accesses.
- the number of radio frequency transceivers 01 connected to each BBU 03 may be the same or different, which is not specifically limited in this embodiment of the present application.
- the RF transceiver 01 is connected to the BBU03 through an optical fiber.
- the RF transceiver 01 obtains the optical signal sent by the BBU through an optical fiber, converts the optical signal into a high-speed electrical signal through an optical module, and passes through the internal baseband circuit, intermediate frequency circuit and After processing by the radio frequency power amplifier circuit, it transmits to multiple user equipments through multiple transmitting antennas; on the other hand, the radio frequency transceiver 01 can receive radio frequency signals sent by multiple user equipments through multiple receiving antennas, and transmit the signals through the internal radio frequency
- the power amplification circuit, intermediate frequency circuit and baseband circuit are processed and converted into high-speed electrical signals, and then the high-speed electrical signals are converted into optical signals through optical modules and then transmitted to BBU03 through optical fibers.
- the intermediate frequency chip of the intermediate frequency circuit can apply the chip system provided by the embodiment of the present application, that is, the above electromagnetic shielding body is used to arrange the chip package of the intermediate frequency chip on the PCB where the intermediate frequency circuit is located.
- the chip system included in the communication device provided by the embodiment of the present application can realize electromagnetic shielding for the first connecting part, reduce the electromagnetic leakage of the first connecting part, improve the electromagnetic shielding capability of the chip package, and ensure It not only improves the performance of the chip, but also reduces the influence of electromagnetic leakage on other circuit components, thus improving the performance of communication equipment.
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Abstract
Description
频率 | 图1方案的屏蔽效能 | 图3方案屏蔽效能 |
2GHz | 53.07dB | 60.83dB |
4GHz | 52.96dB | 60.79dB |
6GHz | 52.93dB | 60.75dB |
8GHz | 52.43dB | 60.06dB |
10GHz | 51.62dB | 59.02dB |
Claims (22)
- 一种芯片系统,其特征在于,所述芯片系统包括芯片封装体和电磁屏蔽体,所述芯片封装体通过第一连接部与电路板电连接,所述芯片封装体包括封装基板和至少一个芯片,所述封装基板和所述至少一个芯片电连接,所述电磁屏蔽体包括:第一屏蔽结构和第二屏蔽结构,所述第一屏蔽结构与第二屏蔽结构均导电;所述第一屏蔽结构与所述封装基板连接;所述第一屏蔽结构包括第一腔体,所述第一腔体用于容纳所述至少一个芯片;所述第二屏蔽结构的第一端连接所述电路板上的焊盘或连接所述电路板,所述第二屏蔽结构的第二端连接所述第一屏蔽结构以形成第二腔体;或者,所述第二屏蔽结构的第一端连接所述电路板上的焊盘或连接所述电路板,所述第二屏蔽结构覆盖所述第一屏蔽结构以形成第二腔体;所述第一连接部位于所述第二腔体内。
- 根据权利要求1所述的芯片系统,其特征在于,所述第一连接部包括绝缘材料以及多个电连接结构件;所述多个电连接结构件,用于连接所述芯片封装体以及所述电路板;所述绝缘材料填充于所述封装基板、所述电路板以及所述多个电连接结构件之间的区域。
- 根据权利要求2所述的芯片系统,其特征在于,所述第一连接部包括两个连接面,靠近所述电路板的一个连接面为第一连接面,靠近所述芯片封装体的另一连接面为第二连接面,所述第一连接面的宽度大于所述第二连接面的宽度。
- 根据权利要求2或3所述的芯片系统,其特征在于,所述第二屏蔽结构覆盖全部所述绝缘材料的侧壁,或覆盖部分所述绝缘材料的侧壁。
- 根据权利要求1至4中任一项所述的芯片系统,其特征在于,所述焊盘接地。
- 根据权利要求5所述的芯片系统,其特征在于,所述封装基板位于所述焊盘上,所述第二屏蔽结构的第一端与所述焊盘电连接。
- 根据权利要求6所述的芯片系统,其特征在于,所述芯片封装体采用栅格阵列LGA封装技术和所述电路板电连接,所述芯片封装体的接地引脚与所述第二屏蔽结构电连接。
- 根据权利要求1-7中任一项所述的芯片系统,其特征在于,所述至少一个芯片中的每个芯片的第一表面,通过第一材料与所述第一屏蔽结构连接;所述至少一个芯片中的每个芯片的第二表面,与所述封装基板的第一表面电连接;所述第一屏蔽结构通过第二连接部与所述封装基板的第一表面连接。
- 根据权利要求8所述的芯片系统,其特征在于,所述第二连接部为金属焊料;或,所述第二连接部为导电胶;或,所述第二连接部为绝缘熔胶。
- 根据权利要求1-7中任一项所述的芯片系统,其特征在于,所述至少一个芯片中的每个芯片的第一表面,通过第一材料与所述第一屏蔽结构连接;所述至少一个芯片中的每个芯片的第二表面,与所述封装基板的第一表面电连接;所述第一屏蔽结构通过第二连接部与所述封装基板的侧壁连接。
- 根据权利要求9所述的芯片系统,其特征在于,所述第二连接部为金属焊料;或,所述第二连接部为导电胶;或,所述第二连接部为绝缘熔胶。
- 根据权利要求1-11中任一项所述的芯片系统,其特征在于,所述第一屏蔽结构为金属结构件。
- 根据权利要求1-7中任一项所述的芯片系统,其特征在于,所述芯片封装体还包括塑封料;所述至少一个芯片中的每个芯片埋设于所述塑封料中;所述第一屏蔽结构覆盖所述塑封料的外表面以及所述封装基板的侧壁。
- 根据权利要求1-7中任一项所述的芯片系统,其特征在于,所述芯片封装体还包括塑封料;所述至少一个芯片埋设于所述塑封料中;所述至少一个芯片中的每个芯片与所述封装基板的第一表面电连接;所述第一屏蔽结构覆盖所述塑封料的外表面,并延伸至所述封装基板的第一表面。
- 根据权利要求13或14所述的芯片系统,其特征在于,所述第一屏蔽结构为以下中的任意一种:导电薄膜、金属材料或导电胶材料。
- 根据权利要求1至15中任一项所述的芯片系统,其特征在于,所述第二屏蔽结构为以下中的任意一种:导电薄膜、金属材料或导电胶材料。
- 根据权利要求2所述的芯片系统,其特征在于,所述多个电连接结构件为以下中的任意一种:金属焊球、烧结、金属结构件或插接端子。
- 根据权利要求1至17中任一项所述的芯片系统,其特征在于,所述第二屏蔽结构完全包覆所述第一屏蔽结构,且所述第二屏蔽结构与所述第一屏蔽结构的接触面有粘接材料。
- 根据权利要求1至18中任一项所述的芯片系统,其特征在于,所述第二屏蔽结构位于所述第一屏蔽结构的外侧,所述第二腔体的至少一部分位于所述封装基板与所述电路板之间。
- 一种通信设备,其特征在于,所述通信设备包括权利要求1至19中任一项所述的芯片系统。
- 根据权利要求20所述的通信设备,其特征在于,所述通信设备为射频收发信机;所述射频收发信机用于通过光纤与基站的基带处理单元BBU连接。
- 根据权利要求20或21所述的通信设备,其特征在于,所述至少一个芯片包括中频IF芯片。
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JP2018093015A (ja) * | 2016-12-01 | 2018-06-14 | 太陽誘電株式会社 | 無線モジュール及び無線モジュールの製造方法 |
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