WO2023103489A1 - 一种移动终端散热装置、移动终端散热方法以及移动终端 - Google Patents

一种移动终端散热装置、移动终端散热方法以及移动终端 Download PDF

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Publication number
WO2023103489A1
WO2023103489A1 PCT/CN2022/116854 CN2022116854W WO2023103489A1 WO 2023103489 A1 WO2023103489 A1 WO 2023103489A1 CN 2022116854 W CN2022116854 W CN 2022116854W WO 2023103489 A1 WO2023103489 A1 WO 2023103489A1
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Prior art keywords
heat
mobile terminal
temperature
heat transfer
transfer medium
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PCT/CN2022/116854
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English (en)
French (fr)
Inventor
黄竹邻
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中兴通讯股份有限公司
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Publication of WO2023103489A1 publication Critical patent/WO2023103489A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present disclosure relates to mobile terminals, and in particular, to a mobile terminal heat dissipation device, a mobile terminal heat dissipation method, and a mobile terminal.
  • the present disclosure provides a heat dissipation device for a mobile terminal, which can solve the technical problem that intelligent heat dissipation cannot be performed according to actual needs.
  • the present disclosure provides a heat dissipation device for a mobile terminal, including: a first radiator, the first radiator is arranged in the heat generation area of the mobile terminal; a second radiator, the second radiator is arranged in the non- Heat generation area; heat transmission pipe, heat transmission pipe connects the first radiator and the second radiator, and is used to transfer the exchange of heat transfer medium between the first radiator and the second radiator; temperature detection device, used for temperature detection device For detecting the temperature of the mobile terminal; the heat transfer medium driving device is used to adjust the heat transfer medium between the first heat sink and the second heat sink when the temperature of the mobile terminal is detected to exceed the preset first temperature threshold exchange speed.
  • the present disclosure also provides a heat dissipation method for a mobile terminal, including: when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold, starting a heat transfer medium driving device to adjust the heat conduction between the heat generating area and the non-heat generating area The exchange speed of the medium.
  • the present disclosure further provides a mobile terminal, including: adopting the above heat dissipation method or heat dissipation device.
  • FIG. 1 is a schematic structural diagram of an embodiment of a heat dissipation device for a mobile terminal provided by the present disclosure
  • FIG. 2 is a schematic structural diagram of a heat sink located in a heat source device area of a mobile terminal heat sink provided by the present disclosure
  • FIG. 3 is a schematic flow chart of a method for dissipating heat from a mobile terminal provided by the present disclosure
  • FIG. 4 is a schematic diagram of an associated structure of a heat dissipation device for a mobile terminal provided by the present disclosure.
  • 101-mobile terminal 101-mobile terminal; 102/201/401-first radiator; 103/402-second radiator; 104/403-heat transmission pipe; 105/202-heat source device; 106/203/404-temperature detection device; 107/405—thermal conduction medium driving device; 108—middle frame of mobile terminal.
  • the cooling plate as an independent radiator has the following problems: 1. And hollowing out to accommodate the radiator will reduce the strength of the middle frame; if the strength of the middle frame is not reduced, the area of the cooling plate can only be reduced. If the cooling plate is too small, the cooling effect will be too weak. 2 Simply relying on the passive heat dissipation of the cooling plate cannot be intelligently adjusted according to actual needs, and it is difficult to achieve the ideal heat dissipation effect.
  • the present disclosure provides a heat dissipation device for a mobile terminal, a heat dissipation method for a mobile terminal, and a mobile terminal.
  • the present disclosure provides a heat dissipation device for a mobile terminal, including: a first radiator, which is arranged in a heat generating area of the mobile terminal; a second radiator, which is arranged in a non-heat generating area of the mobile terminal;
  • the transmission pipeline the heat transmission pipeline connects the first radiator and the second radiator, and is used to transfer the exchange of the heat transfer medium between the first radiator and the second radiator;
  • the temperature detection device the temperature detection device is used to detect the temperature of the mobile terminal Temperature;
  • heat transfer medium driving device the driving device is used to adjust the exchange speed of the heat transfer medium between the first radiator and the second radiator step by step when detecting that the temperature of the mobile terminal exceeds the preset first temperature threshold.
  • the mobile terminal heat dissipation device of the present disclosure combines the respective advantages of the active and passive heat dissipation schemes, increases the heat dissipation area, improves the heat dissipation effect of the mobile terminal, and further improves the user experience.
  • Fig. 1 is a schematic structural diagram of an embodiment of a mobile terminal cooling device provided by the present disclosure
  • Fig. 2 is a schematic structural diagram of a radiator located in the heat source device area of the mobile terminal cooling device provided by the present disclosure. The disclosure will be described below in conjunction with Figs. 1-2 The mobile terminal cooling device is described in detail.
  • the mobile terminal cooling device of the present disclosure may include, but not limited to: a first radiator 102 / 201 , a second radiator 103 , a heat transmission pipe 104 , a temperature detection device 106 / 203 and a heat transfer medium driving device 107 .
  • the mobile terminal 101 mentioned in this disclosure is described in detail by taking a mobile phone as an example, and the mobile terminal 101 is only explained by taking a mobile phone as an example, and is not limited to a mobile phone, such as the mobile terminal 101 It can also be a tablet.
  • the first heat sink 102/201 can be arranged in the heat generating area of the mobile phone, for example, the heat source device 105/202 that generates heat, and is used to expand the heat dissipation area of the heat generating area of the mobile phone.
  • the first heat sink 102/201 can fully cover the heat source device 105/202 of the mobile phone, and the area of the first heat sink 102/201 is larger than the area of the heat source device 105/202 .
  • the heat source device 105/202 may also include a PCB (Printed Circuit Board, printed circuit board) or other applicable heat generating devices.
  • PCB printed Circuit Board, printed circuit board
  • the second heat sink 103 can be disposed in a non-heat generating area of the mobile phone, for example, an area that does not generate heat, or an area that generates heat less than a preset value.
  • both the first heat sink 102 / 201 and the second heat sink 103 may be integrally formed with the middle frame of the mobile phone, and the specific manner of integral formation is not limited.
  • the first heat sink 102 / 201 and the second heat sink 103 may be connected through a heat transfer pipe 104 to further expand the heat dissipation area of the heat generation area.
  • the heat transfer pipe 104 may also be integrated with the first radiator 102 / 201 or the second radiator 103 .
  • the heat transfer pipe 104 can also be independent from the first radiator 102 / 201 and the second radiator 103 , that is, the heat transfer pipe 104 can be added later.
  • the heat transfer pipe 104 may be made of metal, or may be made of non-metal material that can safely carry the heat transfer medium.
  • the areas of the first heat sink 102/201 and the second heat sink 103 can be set to different surface areas of the heat sinks according to actual product requirements.
  • the first radiator 102/201, the second radiator 103 and the heat transfer pipe 104 together form a circulation pipe.
  • a heat transfer medium is disposed in the heat transfer pipe 104 .
  • the heat transfer medium includes a gas-liquid mixture.
  • the heat transfer medium includes purified water or ether.
  • a temperature detection device 106/203 is also provided, and the temperature detection device 106/203 may include an NTC (Negative Temperature Coefficient Sensor) temperature sensor.
  • NTC Negative Temperature Coefficient Sensor
  • the temperature detection device 106/203 is located on the PCB for real-time monitoring of the temperature of the PCB.
  • the temperature detection device 106/203 may also intermittently detect the local temperature of the mobile terminal at preset time intervals, and the specific detection method and location are not limited.
  • the temperature of the mobile terminal when the temperature of the mobile terminal is lower than the preset first temperature threshold, relying on the temperature difference between the first heat sink 102/201 and the second heat sink 103, relying passively on the flow of the heat transfer medium Or transfer for heat dissipation.
  • the first heat sink 102/201 dissipates the heat generated by the PCB to quickly relieve the temperature concentration point, and the heat conduction in the first heat sink 102/201
  • the medium produces gas-liquid changes, and when the proportion of gas is large, it will be transported to the second radiator 103 along with the heat transmission pipe 104. Since the current temperature of the second radiator 103 is lower than the temperature of the heat transferred, it will be in the second radiator. 103 performs gas-liquid transformation to achieve further heat dissipation; then the cooled heat transfer medium flows back to the first radiator 102/201 through the return pipe of the heat transfer pipe 104 .
  • the preset first temperature threshold can be set according to the heat consumed by the actual product (the heat generated by the PCB) and the environment.
  • a heat transfer medium driving device 107 is further provided in the heat transmission pipe 104 .
  • the heat transfer medium driving device 107 includes a liquid cooled micropump (Liquid cooled micropump), which is used to start when the temperature of the mobile terminal is higher than a preset first temperature threshold to accelerate The flow velocity of the heat transfer medium (ie, actively dissipating heat).
  • a liquid cooled micropump Liquid cooled micropump
  • the heat transfer medium driving device when the temperature of the mobile phone exceeds the preset first temperature threshold, the heat transfer medium driving device is activated according to the temperature level to adjust the exchange speed of the heat transfer medium between the heat generating area and the non-heat generating area.
  • the above-mentioned activation of the heat transfer medium drive device according to the temperature level to adjust the exchange speed of the heat transfer medium between the heat generation area and the non-heat generation area can be to adjust the speed of the heat transfer medium drive device 107 step by step; it can also be based on actual conditions.
  • the temperature selects the corresponding rotation speed of the heat transfer medium driving device 107 .
  • the temperature level can be designed as one degree Celsius, or two degrees Celsius as one level, and the temperature level can also be designed and adjusted according to actual needs; each level is Corresponding to the rotation speed of the heat transfer medium driving device 107 .
  • the corresponding rotational speed of the heat transfer medium drive device 107 is adjusted step by step from the first temperature threshold.
  • the heat transfer medium driving device 107 when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the heat transfer medium driving device 107 is turned off, relying on the temperatures of the first radiator 102/201 and the second radiator 103 Poor, the heat transfer medium flows and dissipates heat by itself (that is, passive heat dissipation).
  • the preset first temperature threshold is 25 degrees Celsius.
  • the temperature difference between the first radiator 102/201 and the second radiator 103 the heat conduction medium flows by itself, that is, the current mobile phone is in a passive heat dissipation state.
  • each level when the temperature of each level (temperature level) is gradually plus two degrees Celsius, for example: the first level is 27 degrees Celsius, the second level is 29 degrees Celsius, the third level is 31 degrees Celsius, etc. .
  • each stage corresponds to a different rotational speed of the heat transfer medium driving device 107; for example: at 25.1 degrees Celsius, the liquid-cooled micropump is turned on, and the corresponding heat transfer medium driving device 107 rotates at the first stage; when When the temperature of the mobile phone reaches 27 degrees Celsius, the speed of the heat transfer medium driving device 107 corresponding to the second stage is turned on.
  • the heat transfer medium driving device 107 includes but is not limited to a liquid-cooled micropump.
  • the speed of the liquid-cooled micropump can also be set according to different heat transfer media; for example, when the heat transfer medium is pure water and the heat transfer medium is ether, the cooling effects or speeds of the two are different, and the setting The speed of the liquid-cooled micropump is different.
  • the present disclosure provides a heat dissipation method for a mobile terminal, which is applied to the above-mentioned heat dissipation device for a mobile terminal, including: when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold, starting a heat conduction medium driving device to adjust the heat generation area and the non-heat generation area The exchange rate of the heat transfer medium.
  • FIG. 3 is a schematic flowchart of a heat dissipation method for a mobile terminal provided in the present disclosure. The following will describe the heat dissipation method for a mobile terminal in the present disclosure in detail with reference to FIG. 3 .
  • step 301 the temperature detection device detects the temperature of the mobile terminal.
  • the temperature of the mobile terminal is detected by a temperature detection device.
  • the temperature detection device may include an NTC (Negative Temperature Coefficient Sensor) temperature sensor.
  • NTC Negative Temperature Coefficient Sensor
  • the local temperature of the mobile terminal can be detected by the temperature detection device to represent the current temperature of the mobile terminal; for example, the temperature of the mobile terminal can be represented by detecting the heat generation area.
  • the heat generating area includes a PCB board.
  • step 302 when it is detected that the temperature of the mobile terminal exceeds the preset first temperature threshold, the heat transfer medium driving device is activated to adjust the exchange speed of the heat transfer medium between the heat generating area and the non-heat generating area.
  • a first heat sink is provided in a heat generating area (ie, a heat source device area) of the mobile terminal, and a second heat sink is provided in a non-heat generating area.
  • both the first heat sink and the second heat sink are integrally formed with the middle frame of the mobile terminal.
  • the first heat sink is connected to the second heat sink through a heat transfer pipe, and a heat transfer medium is disposed in the heat transfer pipe.
  • the heat transfer medium includes a gas-liquid mixture.
  • the heat transfer medium includes purified water or ether.
  • a heat transfer medium driving device is further provided in the heat transfer pipe, and the heat transfer medium driving device is used to drive the transmission speed of the heat transfer medium.
  • the heat transfer medium driving device includes but is not limited to a liquid cooled micropump (Liquid cooled micropump).
  • a temperature detection device is also provided, and the temperature detection device includes an NTC (Negative Temperature Coefficient Sensor) temperature sensor.
  • NTC Negative Temperature Coefficient Sensor
  • the exchange rate of the heat transfer medium is adjusted step by step according to the temperature level (ie, active heat dissipation).
  • the temperature level may be one degree Celsius, or two degrees Celsius, and the temperature level may be adjusted according to actual needs.
  • the drive device when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the drive device is turned off, and the heat transfer medium flows to dissipate heat by itself depending on the temperature difference between the first radiator and the second radiator. (ie, passive cooling).
  • the preset first temperature threshold is 25 degrees Celsius.
  • the temperature difference between the first radiator 102/201 and the second radiator 103 the heat conduction medium flows by itself, that is, the current mobile phone is in a passive heat dissipation state.
  • each level when the temperature of each level (temperature level) is gradually plus two degrees Celsius, for example: the first level is 27 degrees Celsius, the second level is 29 degrees Celsius, the third level is 31 degrees Celsius, etc. .
  • each stage corresponds to a different rotational speed of the thermally conductive medium driving device; for example: when the temperature of the mobile phone reaches At 27 degrees Celsius, turn on the speed of the heat transfer medium drive device corresponding to the second stage.
  • the heat transfer medium driving device includes, but is not limited to, a liquid-cooled micropump.
  • the speed of the liquid-cooled micropump can also be set according to different heat transfer media; for example, when the heat transfer medium is pure water and the heat transfer medium is ether, the cooling effects or speeds of the two are different, and the setting The speed of the liquid-cooled micropump is different.
  • the present disclosure also provides a heat dissipation device for a mobile terminal, including: a first heat sink disposed in a heat generating area of the mobile terminal; a second heat sink disposed in a non-heat generating area of the mobile terminal; A heat transfer pipe, the heat transfer pipe connects the first radiator and the second radiator, and is used to transfer the exchange of the heat transfer medium between the first radiator and the second radiator; the temperature detection device, the temperature detection device is used to detect the mobile terminal The temperature of the heat transfer medium driving device, the driving device is used to gradually adjust the exchange speed of the heat transfer medium between the first heat sink and the second heat sink when the temperature of the mobile terminal is detected to exceed the preset first temperature threshold.
  • the mobile terminal heat dissipation device of the present disclosure combines the respective advantages of the active and passive heat dissipation schemes, increases the heat dissipation area, improves the heat dissipation effect of the mobile terminal, and further improves the user experience.
  • FIG. 4 is a schematic diagram of an associated structure of a heat dissipation device for a mobile terminal provided in the present disclosure.
  • the associated structure of the heat dissipation device for a mobile terminal in the present disclosure will be described in detail below with reference to FIG. 4 .
  • the heat dissipation device for a mobile terminal of the present disclosure may include, but is not limited to: a first heat sink 401 , a second heat sink 402 , a heat transmission pipe 403 , a temperature detection device 404 and a heat transfer medium driving device 405 .
  • the mobile terminal mentioned in this disclosure will be described in detail by taking a mobile phone as an example.
  • the mobile terminal is only explained by taking a mobile phone as an example, and is not limited to a mobile phone.
  • a mobile terminal can also be a tablet .
  • the first heat sink 401 may be disposed in the heat generating area of the mobile phone, for example, a heat source device that generates heat source, and is used to expand the heat dissipation area of the heat generating area of the mobile phone.
  • the first heat sink 401 can completely cover the heat source device of the mobile phone.
  • the area of the first heat sink 401 is larger than the area of the heat source device.
  • the heat source device may include a PCB (Printed Circuit Board, printed circuit board) or other applicable heat generating devices.
  • PCB printed Circuit Board, printed circuit board
  • the second heat sink 402 can be arranged in a non-heat-generating area of the mobile phone, for example, an area that does not generate heat, or an area that generates heat less than a preset value, or generates less heat than a heat source generating device. area.
  • both the first heat sink 401 and the second heat sink 402 may be integrally formed with the middle frame of the mobile phone, and the specific manner of integral formation is not limited.
  • the first heat sink 401 and the second heat sink 402 may be connected through a heat transfer pipe 403 to further expand the heat dissipation area of the heat generation area.
  • the first heat sink 401 , the second heat sink 402 and the heat transfer pipe 403 form a circular heat dissipation closed-loop structure.
  • the heat transfer pipe 403 may also be integrated with the first radiator 401 or the second radiator 402 .
  • the heat transfer pipe 403 can also be independent from the first radiator 401 and the second radiator 402 , that is, the heat transfer pipe 403 can be added later.
  • the heat transfer pipe 403 may be made of metal, or may be made of non-metal material that can safely carry the heat transfer medium.
  • the areas of the first heat sink 401 and the second heat sink 402 can be set to different surface areas of the heat sinks according to actual product requirements.
  • a heat transfer medium is disposed in the heat transfer pipe 403 .
  • the heat transfer medium includes purified water or ether.
  • a temperature detection device 404 is also provided, and the temperature detection device 404 may include an NTC (Negative Temperature Coefficient Sensor) temperature sensor.
  • NTC Negative Temperature Coefficient Sensor
  • the temperature detection device 404 is located on the PCB for real-time monitoring of the temperature of the PCB. In some exemplary implementations, the temperature detection device 404 may also intermittently detect the local temperature of the mobile terminal at preset time intervals, and the specific detection method and location are not limited.
  • the temperature of the mobile terminal when the temperature of the mobile terminal is lower than the preset first temperature threshold, relying on the temperature difference between the first heat sink 401 and the second heat sink 402, relying passively on the flow or transmission of the heat transfer medium To dissipate heat.
  • the first heat sink 401 dissipates the heat generated by the PCB to quickly alleviate the temperature concentration point, and the heat transfer medium in the first heat sink 401 generates gas-liquid change, when the proportion of gas is large, as the heat transfer pipe 403 is transported to the second radiator 402, since the current temperature of the second radiator 402 is lower than the temperature of the heat transferred, the gas-liquid process will be carried out in the second radiator 402 Transform to achieve the effect of further heat dissipation; then the cooled heat transfer medium flows back to the first radiator 401 through the return pipe of the heat transfer pipe 403 .
  • the preset first temperature threshold can be set according to the heat consumed by the actual product (the heat generated by the PCB) and the environment.
  • a heat transfer medium driving device 405 is also provided in the heat transfer pipe 403 .
  • the heat transfer medium driving device 405 includes a liquid cooled micropump (Liquid cooled micropump), which is used to start when the temperature of the mobile terminal is higher than a preset first temperature threshold to accelerate The flow velocity of the heat transfer medium (ie, actively dissipating heat).
  • a liquid cooled micropump Liquid cooled micropump
  • the heat transfer medium driving device when the temperature of the mobile phone exceeds the preset first temperature threshold, the heat transfer medium driving device is activated according to the temperature level to adjust the exchange speed of the heat transfer medium between the heat generating area and the non-heat generating area.
  • the above-mentioned activation of the heat transfer medium drive device according to the temperature level to adjust the exchange speed of the heat transfer medium between the heat generation area and the non-heat generation area can be to adjust the speed of the heat transfer medium drive device 405 step by step; it can also be based on actual conditions.
  • the temperature selects the corresponding rotation speed of the heat transfer medium driving device 405 .
  • the temperature level can be designed as one degree Celsius, or two degrees Celsius as one level, and the temperature level can also be designed and adjusted according to actual needs; each level is Corresponding to the rotation speed of the heat transfer medium driving device 405 .
  • the thermally conductive medium driving device 405 when it is detected that the current temperature of the mobile terminal does not exceed the preset first temperature threshold, the thermally conductive medium driving device 405 is turned off, relying on the temperature difference between the first radiator 401 and the second radiator 402, The heat transfer medium flows by itself to dissipate heat (ie, passive heat dissipation).
  • the preset first temperature threshold is 25 degrees Celsius.
  • the mobile phone is turned on and does not exceed 25 degrees Celsius, depending on the temperature difference between the first radiator 401 and the second radiator 402, heat conduction The medium flows by itself, that is, the current mobile phone is in a passive cooling state.
  • each level when the temperature of each level (temperature level) is gradually plus two degrees Celsius, for example: the first level is 27 degrees Celsius, the second level is 29 degrees Celsius, the third level is 31 degrees Celsius, etc. .
  • each stage corresponds to a different rotational speed of the heat transfer medium driving device 405; for example: at 25.1 degrees Celsius, the liquid-cooled micropump is turned on, and the corresponding heat transfer medium driving device 405 rotates at the first stage; when When the temperature of the mobile phone reaches 27 degrees Celsius, turn on the heat transfer medium driving device corresponding to the second stage at a speed of 405.
  • the heat transfer medium driving device 405 includes but is not limited to a liquid-cooled micropump.
  • the speed of the liquid-cooled micropump can also be set according to different heat transfer media; for example, when the heat transfer medium is pure water and the heat transfer medium is ether, the cooling effects or speeds of the two are different, and the setting The speed of the liquid-cooled micropump is different.
  • the heat dissipation device of the mobile terminal of the present disclosure includes a first radiator, the first radiator is arranged in the heat generating area of the mobile terminal, a second radiator is arranged in the non-heat generating area of the mobile terminal, and a heat transmission pipe , the heat transmission pipe is connected to the first radiator and the second radiator, and is used to transfer the exchange of the heat transfer medium between the first radiator and the second radiator, and the temperature detection device is used to detect the temperature of the mobile terminal,
  • the thermally conductive medium driving device is used to adjust the exchange speed of the thermally conductive medium between the first heat sink and the second heat sink when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold;
  • the special design of the middle frame of the terminal enables the combination of the passive heat sink and the active heat dissipation drive device to perform efficient and accurate control of intelligent heat dissipation according to the temperature change of the mobile terminal, and to perform passive heat dissipation and active cooling according to the temperature change of the mobile terminal At the
  • the present disclosure also provides a method for dissipating heat from a mobile terminal, including: when detecting that the temperature of the mobile terminal exceeds a preset first temperature threshold, starting the heat transfer medium driving device to adjust the exchange speed of the heat transfer medium between the heat generation area and the non-heat generation area , realizing intelligent heat dissipation regulation according to the temperature change of the mobile terminal.
  • the present disclosure also provides a mobile terminal, which may be a mobile phone, but is not limited to the mobile phone, for example, may also be a tablet and the like.
  • the mobile terminal includes the above heat dissipation method or the above heat dissipation device.

Abstract

本公开公开了一种移动终端散热装置，包括：第一散热器，第一散热器设置于移动终端的热量产生区域；第二散热器，第二散热器设置于移动终端的非热量产生区域；热量传输管道，热量传输管道连接第一散热器与第二散热器，用于传递第一散热器与第二散热器之间的热传导介质的交换；温度检测装置，温度检测装置用于检测移动终端的温度；热传导介质驱动装置，热传导介质驱动装置用于在检测到移动终端的温度超过预设的第一温度阈值时，调整第一散热器和第二散热器之间的热传导介质的交换速度。

Description

一种移动终端散热装置、移动终端散热方法以及移动终端
相关申请的交叉引用
本公开要求享有2021年12月07日提交的名称为“一种移动终端散热装置、移动终端散热方法以及移动终端”的中国专利申请CN202111485587.6的优先权，其全部内容通过引用并入本公开中。
技术领域
本公开涉及移动终端，尤其涉及一种移动终端散热装置、移动终端散热方法以及移动终端。
背景技术
随着电子技术的发展，移动终端的功能越来越强大，移动终端存储的信息种类和数量也越来越多。为了方便携带和使用，移动终端又需要追求轻薄化。但是由于移动终端的体积越来越小，实现的功能又越来越强大，这样就造成了移动终端功耗的增加。因此，如何解决散热问题成了业内的难题。
发明内容
为了至少解决上述技术问题，本公开提供了一种移动终端散热装置，可以解决无法根据实际需求进行智能散热的技术问题。
为达到上述目的，本公开提供一种移动终端散热装置，包括：第一散热器，第一散热器设置于移动终端的热量产生区域；第二散热器，第二散热器设置于移动终端的非热量产生区域；热量传输管道，热量传输管道连接第一散热器与第二散热器，用于传递第一散热器与第二散热器之间的热传导介质的交换；温度检测装置，温度检测装置用于检测移动终端的温度；热传导介质驱动装置，热传导介质驱动装置用于在检测到移动终端的温度超过预设的第一温度阈值时，调整第一散热器和第二散热器之间的热传导介质的交换速度。
为达到上述目的，本公开还提供一种移动终端散热方法，包括：检测到移动终端的温 度超过预设的第一温度阈值时，启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
为达到上述目的，本公开还提供一种移动终端，包括：采用上述散热方法或散热装置。
附图说明
图1是本公开提供的移动终端散热装置的一个实施例的结构示意图；
图2是本公开提供的移动终端散热装置位于热源器件区域的散热器结构示意图；
图3是本公开提供的移动终端散热方法流程示意图；
图4是本公开提供的移动终端散热装置的关联结构示意图。
附图标记说明：
101-移动终端；102/201/401-第一散热器；103/402-第二散热器；104/403-热量传输管道；105/202-热源器件；106/203/404-温度检测装置；107/405-热传导介质驱动装置；108-移动终端的中框。
具体实施方式
为使本公开的上述目的、特征和优点能够更加明显易懂，下面将结合本公开中的附图，对本公开中的技术方案进行清楚、完整地描述。需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。
随着电子技术的发展，移动终端的功能越来越强大，移动终端存储的信息种类和数量也越来越多。为了方便携带和使用，移动终端又需要追求轻薄化。但是由于移动终端的体积越来越小，实现的功能又越来越强大，这样就造成了移动终端功耗的增加。因此，如何解决散热问题成了业内的难题，虽然业内已经有了采用散热板的设计，但是散热板的性能与其面积及厚度成正相关。所以，追求散热板面积的最大化正是大家的追求目标，但是，由于移动终端越来越薄的设计，散热板作为一个独立的散热器，存在以下一些问题：①、采用中框的内嵌和挖空来容纳散热器，会降低中框的强度；而如果不降低中框的强度，就只能减小散热板的面积，如果散热板太小降温效果又太弱。②、单纯的依靠散热板的被动散热，无法根据实际需求进行智能调控，很难达到理想的散热效果。
为了至少解决上述技术问题，本公开提供了一种移动终端散热装置、移动终端散热方 法以及移动终端。下面将结合附图对本公开的技术方案进行详细说明。
本公开提供一种移动终端散热装置，包括：第一散热器，第一散热器设置于移动终端的热量产生区域；第二散热器，第二散热器设置于移动终端的非热量产生区域；热量传输管道，热量传输管道连接第一散热器与第二散热器，用于传递第一散热器与第二散热器之间的热传导介质的交换；温度检测装置，温度检测装置用于检测移动终端的温度；热传导介质驱动装置，驱动装置用于在检测到移动终端的温度超过预设的第一温度阈值时，逐级调整第一散热器和第二散热器之间的热传导介质的交换速度。
本公开的移动终端散热装置，融合了主被动散热方案的各自优势，增加了散热面积，提升了移动终端的散热效果的同时，又进一步的提高了用户的使用体验感受。
实施例一
图1是本公开提供的移动终端散热装置的一个实施例的结构示意图，图2是本公开提供的移动终端散热装置位于热源器件区域的散热器结构示意图，下面将结合图1-2，对本公开的移动终端散热装置进行详细描述。
本公开的移动终端散热装置，可以包括，但不限于：第一散热器102/201、第二散热器103、热量传输管道104、温度检测装置106/203以及热传导介质驱动装置107。
在一些示例性的实施方式中，本公开中所说的移动终端101以手机为例进行详细描述，移动终端101仅仅是以手机为例对本公开进行解释说明，并不限于手机，例如移动终端101还可以为平板。
在一些示例性的实施方式中，第一散热器102/201可以设置于手机的热量产生区域，例如，产生热源的热源器件105/202，用于给手机的热量产生区域扩大散热面积。
在一些示例性的实施方式中，第一散热器102/201可以全面覆盖在手机的热源器件105/202上，且，第一散热器102/201的面积比热源器件105/202的面积要大。
在一些示例性的实施方式中，热源器件105/202也可以包括PCB(Printed Circuit Board，印制电路板)或其他适用的热量产生器件。
在一些示例性的实施方式中，第二散热器103可以设置于手机的非热量产生区域，例 如，不产生热量的区域，或者产生热量小于预设值的区域。
在一些示例性的实施方式中，第一散热器102/201与第二散热器103可以均与手机的中框一体成型，具体一体成型的方式不限。
在一些示例性的实施方式中，第一散热器102/201与第二散热器103之间可以通过热量传输管道104相连接，进一步扩大热量产生区域的散热面积。
在一些示例性的实施方式中，热量传输管道104也可以与第一散热器102/201或第二散热器103一体化设计。
在一些示例性的实施方式中，热量传输管道104还可以独立于第一散热器102/201和第二散热器103，即热量传输管道104可以为后续加装。
在一些示例性的实施方式中，热量传输管道104可以为金属材质，亦可以为可以安全承载热传导介质的非金属材质制成。
在一些示例性的实施方式中，第一散热器102/201与第二散热器103的面积可以根据实际产品需求设置不同的散热器的表面积。
在一些示例性的实施方式中，第一散热器102/201、第二散热器103以及热量传输管道104共同组成一个循环管道。
在一些示例性的实施方式中，热量传输管道104中设有热传导介质。
在一些示例性的实施方式中，热传导介质包括气液混合体。
在一些示例性的实施方式中，热传导介质包括纯净水或乙醚。
在一些示例性的实施方式中，还设有温度检测装置106/203，温度检测装置106/203可以包括NTC(Negative Temperature Coefficient Sensor)温度传感器。
在一些示例性的实施方式中，温度检测装置106/203位于PCB上，用于实时监测PCB的温度。
在一些示例性的实施方式中，温度检测装置106/203也可以按照预设时间间隔进行断续检测移动终端的局部温度，具体检测方式和位置都不限定。
在一些示例性的实施方式中，在移动终端温度低于预设第一温度阈值时，依靠第一散热器102/201与第二散热器103之间的温度差，被动的依赖热传导介质的流动或传递进行散 热。
在一些示例性的实施方式中，移动终端处于工作状态时，第一散热器102/201将PCB产生的热量进行均散开，迅速的缓解温度集中点，第一散热器102/201内的热传导介质产生气液变化，气体占比较大时，随着热量传输管道104运输到第二散热器103，由于第二散热器103当前的温度低于传输过来的热量温度，所以会在第二散热器103进行气液转变，以达到进一步散热的效果；然后经过降温后的热传导介质经热量传输管道104的回流管道，回流到第一散热器102/201。
在一些示例性的实施方式中，预设第一温度阈值可以根据实际产品功耗的热量(PCB产生的热量)以及环境进行设置。
在一些示例性的实施方式中，热量传输管道104中还设有热传导介质驱动装置107。
在一些示例性的实施方式中，热传导介质驱动装置107包括液冷微泵(Liquid cooled micropump)，液冷微泵用于在移动终端的温度高于预设的第一温度阈值时启动，以加速热传导介质的流动速度(即，主动散热)。
在一些示例性的实施方式中，在手机的温度超过预设的第一温度阈值时，根据温度等级启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
在一些示例性的实施方式中，上述根据温度等级启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度，可以为逐级调整热传导介质驱动装置107转速；亦可以根据实际温度选择对应的热传导介质驱动装置107转速。
在一些示例性的实施方式中，温度等级可以设计为一个摄氏度为一个等级，还可以设置为两个摄氏度为一个等级，该温度等级还可以根据实际需要自行设计需要调整的温度等级；各个等级均对应着相应的热传导介质驱动装置107转速。
在一些示例性的实施方式中，可以设计为当检测到移动终端当前温度超过预设的第一温度阈值时，从第一温度阈值开始逐级调整对应的热传导介质驱动装置107转速。
在一些示例性的实施方式中，还可以设计为当检测到移动终端当前温度超过预设的第一温度阈值时，直接执行当前温度对应的热传导介质驱动装置107转速。
在一些示例性的实施方式中，当检测到移动终端当前温度未超过预设的第一温度阈值 时，关闭热传导介质驱动装置107，依靠第一散热器102/201与第二散热器103的温度差，热传导介质自行流动散热(即，被动散热)。
在一些示例性的实施方式中，例如，预设第一温度阈值为25摄氏度，当手机处于开机状态且不超过25摄氏度时，依靠第一散热器102/201与第二散热器103的温度差，热传导介质自行流动，即当前手机处于被动的散热状态。
在一些示例性的实施方式中，当每一级(温度等级)的温度为逐级加两摄氏度，例如：第一级为27摄氏度，第二级为29摄氏度，第三级为31摄氏度等等。
在一些示例性的实施方式中，每一级对应着不同的热传导介质驱动装置107的转速；例如：25.1摄氏度时液冷微泵开启，并处于一级的对应的热传导介质驱动装置107转速；当手机温度达到27摄氏度时，开启第二级对应的热传导介质驱动装置107转速。
在一些示例性的实施方式中，热传导介质驱动装置107包括但不限于液冷微泵。
在一些示例性的实施方式中液冷微泵的转速还可以根据不同的热传导介质进行设定；例如当热传导介质为纯净水和热传导介质为乙醚时候，二者的冷却效果或者速度不同，而设置液冷微泵的转速不同。
本公开提供一种移动终端散热方法，应用于上述移动终端散热装置，包括：检测到移动终端的温度超过预设的第一温度阈值时，启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
实施例二
图3是本公开提供的移动终端散热方法流程示意图，下面将参考图3，对本公开的移动终端散热方法进行详细描述。
在步骤301中，温度检测装置检测移动终端的温度。
在一些示例性的实施方式中，通过温度检测装置来检测移动终端的温度。
在一些示例性的实施方式中，温度检测装置可以包括NTC(Negative Temperature Coefficient Sensor)温度传感器。
在一些示例性的实施方式中，可以通过温度检测装置检测移动终端局部的温度来代表 该移动终端当前的温度；例如通过检测热量产生区域来代表移动终端的温度。
在一些示例性的实施方式中，热量产生区域包括PCB板。
在步骤302中，检测到移动终端的温度超过预设的第一温度阈值时，启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
在一些示例性的实施方式中，在移动终端的热量产生区域(即，热源器件区域)设有第一散热器，在非热量产生区域设有第二散热器。
在一些示例性的实施方式中，第一散热器与第二散热器均与移动终端的中框一体成型。
在一些示例性的实施方式中，第一散热器与第二散热器通过热量传输管道连接，热量传输管道中设有热传导介质。
在一些示例性的实施方式中，热传导介质包括气液混合体。
在一些示例性的实施方式中，热传导介质包括纯净水或乙醚。
在一些示例性的实施方式中，热量传输管道中还设有热传导介质驱动装置，该热传导介质驱动装置用于驱动热传导介质的传输速度。
在一些示例性的实施方式中，热传导介质驱动装置包括但不限于液冷微泵(Liquid cooled micropump)。
在一些示例性的实施方式中，还设有温度检测装置，温度检测装置包括NTC(Negative Temperature Coefficient Sensor)温度传感器。
在一些示例性的实施方式中，通过温度监测装置检测到移动终端当前的温度超过预设的第一温度阈值时，根据温度等级进行逐级调整热传导介质的交换速度(即，主动散热)。
在一些示例性的实施方式中，温度等级可以为一个摄氏度为一个等级，还可以设置为两个摄氏度为一个等级，该温度等级可以根据实际需要自行调整。
在一些示例性的实施方式中，当检测到移动终端当前温度未超过预设的第一温度阈值时，关闭驱动装置，依靠第一散热器与第二散热器的温度差，热传导介质自行流动散热(即，被动散热)。
在一些示例性的实施方式中，例如，预设第一温度阈值为25摄氏度，当手机处于开机状态且不超过25摄氏度时，依靠第一散热器102/201与第二散热器103的温度差，热传导 介质自行流动，即当前手机处于被动的散热状态。
在一些示例性的实施方式中，当每一级(温度等级)的温度为逐级加两摄氏度，例如：第一级为27摄氏度，第二级为29摄氏度，第三级为31摄氏度等等。
在一些示例性的实施方式中，每一级对应着不同的热传导介质驱动装置转速；例如：25.1摄氏度时液冷微泵开启，并处于一级的对应的热传导介质驱动装置转速；当手机温度达到27摄氏度时，开启第二级对应的热传导介质驱动装置转速。
在一些示例性的实施方式中，热传导介质驱动装置包括但不限于液冷微泵。
在一些示例性的实施方式中液冷微泵的转速还可以根据不同的热传导介质进行设定；例如当热传导介质为纯净水和热传导介质为乙醚时候，二者的冷却效果或者速度不同，而设置液冷微泵的转速不同。
本公开还提供一种移动终端散热装置，包括：第一散热器，第一散热器设置于移动终端的热量产生区域；第二散热器，第二散热器设置于移动终端的非热量产生区域；热量传输管道，热量传输管道连接第一散热器与第二散热器，用于传递第一散热器与第二散热器之间的热传导介质的交换；温度检测装置，温度检测装置用于检测移动终端的温度；热传导介质驱动装置，驱动装置用于在检测到移动终端的温度超过预设的第一温度阈值时，逐级调整第一散热器和第二散热器之间的热传导介质的交换速度。
本公开的移动终端散热装置，融合了主被动散热方案的各自优势，增加了散热面积，提升了移动终端的散热效果的同时，又进一步的提高了用户的使用体验感受。
实施例三
图4是本公开提供的移动终端散热装置的关联结构示意图，下面将结合图4，对本公开的移动终端散热装置的关联结构进行详细描述。
本公开的移动终端散热装置，可以包括，但不限于：第一散热器401、第二散热器402、热量传输管道403、温度检测装置404以及热传导介质驱动装置405。
在一些示例性的实施方式中，本公开所说的移动终端以手机为例进行详细描述，移动终端仅仅是以手机为例对本公开进行解释说明，并不限于手机，例如移动终端还可以为平 板。
在一些示例性的实施方式中，第一散热器401可以设置于手机的热量产生区域，例如，产生热源的热源器件，用于给手机的热量产生区域扩大散热面积。
在一些示例性的实施方式中，第一散热器401可以全面覆盖在手机的热源器件上。
在一些示例性的实施方式中，第一散热器401的面积比热源器件的面积要大。
在一些示例性的实施方式中，热源器件可以包括PCB(Printed Circuit Board，印制电路板)或其他适用的热量产生器件。
在一些示例性的实施方式中，第二散热器402可以设置于手机的非热量产生区域，例如，不产生热量的区域，或者产生热量小于预设值的区域，或者产生热量小于热源产生器件所处区域。
在一些示例性的实施方式中，第一散热器401与第二散热器402可以均与手机的中框一体成型，具体一体成型的方式不限。
在一些示例性的实施方式中，第一散热器401与第二散热器402之间可以通过热量传输管道403相连接，进一步扩大热量产生区域的散热面积。
在一些示例性的实施方式中，第一散热器401、第二散热器402以及热量传输管道403形成一个循环的散热闭环结构。
在一些示例性的实施方式中，热量传输管道403也可以与第一散热器401或第二散热器402一体化设计。
在一些示例性的实施方式中，热量传输管道403还可以独立于第一散热器401和第二散热器402，即热量传输管道403可以为后续加装。
在一些示例性的实施方式中，热量传输管道403可以为金属材质，亦可以为可以安全承载热传导介质的非金属材质制成。
在一些示例性的实施方式中，第一散热器401与第二散热器402的面积可以根据实际产品需求设置不同的散热器的表面积。
在一些示例性的实施方式中，热量传输管道403中设有热传导介质。
在一些示例性的实施方式中，热传导介质包括纯净水或乙醚。
在一些示例性的实施方式中，还设有温度检测装置404，温度检测装置404可以包括NTC(Negative Temperature Coefficient Sensor)温度传感器。
在一些示例性的实施方式中，温度检测装置404位于PCB上，用于实时监测PCB的温度。在一些示例性的实施方式中，温度检测装置404也可以按照预设时间间隔进行断续检测移动终端的局部温度，具体检测方式和位置都不限定。
在一些示例性的实施方式中，在移动终端温度低于预设第一温度阈值时，依靠第一散热器401与第二散热器402之间的温度差，被动的依赖热传导介质的流动或传递进行散热。
在一些示例性的实施方式中，移动终端处于工作状态时，第一散热器401将PCB产生的热量进行均散开，迅速的缓解温度集中点，第一散热器401内的热传导介质产生气液变化，气体占比较大时，随着热量传输管道403运输到第二散热器402，由于第二散热器402当前的温度低于传输过来的热量温度，所以会在第二散热器402进行气液转变，以达到进一步散热的效果；然后经过降温后的热传导介质经热量传输管道403的回流管道，回流到第一散热器401。
在一些示例性的实施方式中，预设第一温度阈值可以根据实际产品功耗的热量(PCB产生的热量)以及环境进行设置。
在一些示例性的实施方式中，热量传输管道403中还设有热传导介质驱动装置405。
在一些示例性的实施方式中，热传导介质驱动装置405包括液冷微泵(Liquid cooled micropump)，液冷微泵用于在移动终端的温度高于预设的第一温度阈值时启动，以加速热传导介质的流动速度(即，主动散热)。
在一些示例性的实施方式中，在手机的温度超过预设的第一温度阈值时，根据温度等级启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
在一些示例性的实施方式中，上述根据温度等级启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度，可以为逐级调整热传导介质驱动装置405转速；亦可以根据实际温度选择对应的热传导介质驱动装置405转速。
在一些示例性的实施方式中，温度等级可以设计为一个摄氏度为一个等级，还可以设置为两个摄氏度为一个等级，该温度等级还可以根据实际需要自行设计需要调整的温度等 级；各个等级均对应着相应的热传导介质驱动装置405转速。
在一些示例性的实施方式中，可以设计为当检测到移动终端当前温度超过预设的第一温度阈值时，从第一温度阈值开始逐级调整对应的热传导介质驱动装置405转速。
在一些示例性的实施方式中，还可以设计为当检测到移动终端当前温度超过预设的第一温度阈值时，直接执行当前温度对应的热传导介质驱动装置405转速。
在一些示例性的实施方式中，当检测到移动终端当前温度未超过预设的第一温度阈值时，关闭热传导介质驱动装置405，依靠第一散热器401与第二散热器402的温度差，热传导介质自行流动散热(即，被动散热)。
在一些示例性的实施方式中，例如，预设第一温度阈值为25摄氏度，当手机处于开机状态且不超过25摄氏度时，依靠第一散热器401与第二散热器402的温度差，热传导介质自行流动，即当前手机处于被动的散热状态。
在一些示例性的实施方式中，当每一级(温度等级)的温度为逐级加两摄氏度，例如：第一级为27摄氏度，第二级为29摄氏度，第三级为31摄氏度等等。
在一些示例性的实施方式中，每一级对应着不同的热传导介质驱动装置405的转速；例如：25.1摄氏度时液冷微泵开启，并处于一级的对应的热传导介质驱动装置405转速；当手机温度达到27摄氏度时，开启第二级对应的热传导介质驱动装置405转速。
在一些示例性的实施方式中，热传导介质驱动装置405包括但不限于液冷微泵。
在一些示例性的实施方式中液冷微泵的转速还可以根据不同的热传导介质进行设定；例如当热传导介质为纯净水和热传导介质为乙醚时候，二者的冷却效果或者速度不同，而设置液冷微泵的转速不同。
本公开的移动终端散热装置，包括，第一散热器，第一散热器设置于移动终端的热量产生区域，第二散热器，第二散热器设置于移动终端的非热量产生区域，热量传输管道，热量传输管道连接第一散热器与第二散热器，用于传递第一散热器与第二散热器之间的热传导介质的交换，温度检测装置，温度检测装置用于检测移动终端的温度，热传导介质驱动装置，热传导介质驱动装置用于在检测到移动终端的温度超过预设的第一温度阈值时，调整第一散热器和第二散热器之间的热传导介质的交换速度；通过对移动终端中框的特别 设计，使得被动散热的散热器和主动散热的驱动装置的结合，可以根据移动终端的温度变化进行智能散热的高效准确调控，可以根据移动终端的温度变化进行被动散热和主动降温的完美结合的同时，还可以根据实际需求进行智能降温等级的调控；中框与散热器一体化设计，融合了主被动散热方案的各自优势，在保证了中框强度的前提下，又增加了散热面积，提升了移动终端的散热效果，又进一步的提高了用户的使用体验感受。
本公开还提供了一种移动终端散热方法，包括：检测到移动终端的温度超过预设的第一温度阈值时，启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度，实现了可以根据移动终端的温度变化进行智能散热的调控。
实施例四
本公开还提供一种移动终端，该移动终端可以为手机，但是并不仅限于手机，例如还可以为平板等等。
在一些示例性的实施方式中，该移动终端包括上述散热方法或者包括上述散热装置。
虽然本公开所揭露的实施方式如上，但所述的内容仅为便于理解本公开而采用的实施方式，并非用以限定本公开。任何本公开所属领域内的技术人员，在不脱离本公开所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本公开的专利保护范围，仍须以所附的权利要求书所界定的范围为准。

Claims (11)

  1. 一种移动终端散热装置，包括：
    第一散热器，所述第一散热器设置于所述移动终端的热量产生区域；
    第二散热器，所述第二散热器设置于所述移动终端的非热量产生区域；
    热量传输管道，所述热量传输管道连接所述第一散热器与所述第二散热器，用于传递所述第一散热器与所述第二散热器之间的热传导介质的交换；
    温度检测装置，所述温度检测装置用于检测所述移动终端的温度；
    热传导介质驱动装置，所述热传导介质驱动装置用于在检测到所述移动终端的温度超过预设的第一温度阈值时，调整所述第一散热器和所述第二散热器之间的热传导介质的交换速度。
  2. 如权利要求1所述的装置，其中，所述第一散热器和所述第二散热器均与所述移动终端的中框一体化设计。
  3. 如权利要求1所述的装置，其中，所述热量传输管道与所述第一散热器或所述第二散热器一体化设计。
  4. 如权利要求1所述的装置，其中，所述热传导介质驱动装置包括液冷微泵。
  5. 如权利要求1所述的装置，其中，所述热传导介质包括纯净水或乙醚。
  6. 如权利要求1所述的装置，其中，所述热量产生区域包括PCB板。
  7. 一种移动终端散热方法，应用于上述权利要求1-6任意一项所述的移动终端散热装置，所述方法包括：
    检测到所述移动终端的温度超过预设的第一温度阈值时，启动热传导介质驱动装置调整热量产生区域与非热量产生区域的热传导介质的交换速度。
  8. 如权利要求7所述的方法，其中，检测到所述移动终端的温度不超过预设的第一温度阈值时，关闭所述热传导介质驱动装置。
  9. 如权利要求7所述的方法，其中，所述调整热量产生区域与非热量产生区域的热传导介质的交换速度包括：
    在所述移动终端的温度超过预设的所述第一温度阈值时，根据所述温度等级调整所述 热量产生区域与非热量产生区域的热传导介质的交换速度。
  10. 如权利要求7所述的方法，其中，在所述移动终端的所述热量产生区域与所述非热量产生区域设有与所述移动终端的中框一体化设计的散热器。
  11. 一种移动终端，所述移动终端包括权利要求1-6任意一项所述的散热装置，或者所述移动终端采用权利要求7-10任意一项所述的散热方法。
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