WO2023098765A1

WO2023098765A1 - Circuit board assembly and electronic device

Info

Publication number: WO2023098765A1
Application number: PCT/CN2022/135682
Authority: WO
Inventors: 庄宝山; 熊振兴; 赵才军; 熊建波
Original assignee: 华为技术有限公司
Priority date: 2021-12-02
Filing date: 2022-11-30
Publication date: 2023-06-08
Also published as: CN216960328U

Abstract

Embodiments of the present application provide a circuit board assembly and an electronic device. In the circuit board assembly, at least one first shielding assembly is provided on the periphery of a chip assembly; each first shielding assembly comprises: a shielding frame and a shielding cover; a first circuit board is fixedly connected to the end of the shielding frame facing away from the shielding cover; at least part of the shielding cover is located between the chip assembly and a heat dissipation device, and the shielding cover is movably connected to the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame. In this way, the first shielding assembly can adapt to chip assemblies having different heights and different assembly gaps.

Description

Circuit board assembly and electronic equipment

This application claims the priority of the Chinese patent application with the application number 202123032771.3 and the application title "circuit board assembly and electronic equipment" filed with the China Patent Office on December 02, 2021, the entire contents of which are incorporated herein by reference.

technical field

With the continuous development of science and technology, the mobile Internet will provide high-definition and high-performance multimedia applications, which will lead to the rapid growth of mobile data services, and the power consumption of mobile terminal equipment will also increase significantly. challenge.

At present, the heat dissipation method adopted for the heating chip in the mobile terminal is generally to install a radiator on the side of the heating chip facing away from the circuit board, and one side of the radiator is in contact with the heating chip to achieve good heat dissipation of the heating chip. In addition, it is also necessary to suppress electromagnetic interference on the exposed chip while realizing heat dissipation. In related technologies, a shielding structure is generally provided between the circuit board and the heat sink. Specifically, one end of the shielding structure is welded on the circuit board , the other end of the shielding structure is in contact with the radiator, and the shielding structure is located on the outer periphery of the heating chip, so that a closed space is formed between the radiator, the shielding structure and the circuit board, so as to avoid signal interference caused by the outside world to the heating chip shielding effect.

However, the shielding structure in the prior art cannot adapt to chips of different heights and different assembly gaps.

Contents of the invention

Embodiments of the present application provide a circuit board assembly and electronic equipment, which can be adapted to chip assemblies of different heights and different assembly gaps.

In a first aspect, an embodiment of the present application provides a circuit board assembly, which includes: a first circuit board, a chip assembly, and at least one heat sink; one side of the chip assembly is electrically connected to the first circuit board , the other side of the chip component is in contact with the heat sink;

It also includes: at least one first shielding assembly located on the outer periphery of the chip assembly; each of the first shielding assemblies includes: a shielding frame and a shielding cover; one end of the shielding frame away from the shielding cover is connected to the first circuit The board is fixedly connected, at least part of the shielding cover is located between the chip assembly and the heat sink; and the shielding cover is movably connected to the shielding frame, so that the shielding cover can be relatively A position shift occurs in the vertical direction.

In the circuit board assembly provided by the embodiment of the present application, the circuit board assembly is provided with at least one first shielding assembly on the periphery of the chip assembly, the shielding frame of the first shielding assembly is fixedly connected to the first circuit board, and at least part of the shielding cover is located on the chip assembly. Between the component and the radiator, and the shielding cover is movably connected with the shielding frame, so that the shielding cover can move in the vertical direction relative to the shielding frame, so that the shielding cover overlaps the gap between the chip assembly and the radiator When in the assembly gap, the shielding cover can adapt to chips of different heights and move in the vertical direction relative to the shielding frame, or the shielding cover can adapt to different assembly gaps between the chip assembly and the heat sink and relative to the shielding frame. A position shift occurs in the vertical direction.

In addition, the shielding cover is overlapped in the assembly gap between the chip component and the heat sink. When the heat sink exerts pressure on the heat dissipation cover, the flexible connection between the shielding cover and the shielding frame can provide a certain buffer space for the shielding frame to avoid or The strength deformation of the first shielding component is alleviated, and the shielding frame is prevented from causing top damage to the first circuit board, thereby destroying the connection reliability between the shielding frame and the first circuit board.

In a possible implementation manner, the chip assembly includes: a chip body and a second circuit board connected to the chip body; the side of the second circuit board facing away from the chip body is connected to the first circuit board Electrically connected, the side of the chip body away from the second circuit board is in contact with the radiator. The side of the second circuit board away from the chip body is electrically connected to the first circuit board, so as to realize the electrical connection between the chip component and the second circuit board. The side of the chip body away from the second circuit board is in contact with the radiator, so that the radiator can dissipate heat from the chip component.

In a possible implementation manner, it further includes: a heat conduction element; the heat conduction element is located between the chip body and the heat sink. By arranging the heat conduction member between the chip body and the heat sink, the heat conduction performance between the chip body and the heat sink can be increased, so that the heat sink can better dissipate heat to the chip assembly.

In a possible implementation manner, the chip assembly further includes: a structural member; the structural member and the chip body are located on the same surface of the second circuit board, and the structural member is located on the chip body at least part of the shielding cover is located between the structural member and the heat sink.

The structural parts located on the periphery of the chip body can protect the chip body to a certain extent, avoiding the bad influence of the large-area exposure of the chip body on the chip body. In addition, at least part of the shielding cover is located between the structural member and the heat sink, which can also avoid direct contact between the shielding cover and the chip body, causing damage or scratches to the chip body.

In a possible implementation manner, the electrical connection between the second circuit board and the first circuit board is realized through at least one electrical connector; the at least one electrical connector is on the first circuit board The projection area is located within the projection area of the first shielding component on the first circuit board.

The projected area of the electrical connector on the first circuit board is located within the projected area of the first shielding component on the first circuit board, which can ensure that the first shielding component covers the electrical connector and the gap between the multiple electrical connectors to ensure The electromagnetic interference suppressed by the first shielding component on the electrical connector prevents electromagnetic interference from interfering with the electrical connection performance between the second circuit board and the first circuit board.

In a possible implementation manner, it further includes: a second shielding component; the second shielding component is located between the shielding cover and the heat sink. By arranging the second shielding component between the shielding cover and the heat sink, the shielding effect on the interference signal around the chip component can be further enhanced on the basis of the first shielding component suppressing the electromagnetic interference of the chip component.

In a possible implementation manner, the second shielding component is an elastic shielding material. By setting the second shielding component as an elastic shielding material, the second shielding component can provide a certain buffering effect on the contact between the shielding cover and the heat sink while enhancing the shielding effect on the interference signal around the chip component, so as to prevent heat dissipation. When the device applies pressure to the heat dissipation cover, the second shielding component can absorb a certain amount of pressure, so as to reduce the degree of stress on the heat dissipation cover.

In a possible implementation manner, the shielding cover includes: a first part and a second part connected to the first part; at least part of the first part is located between the chip component and the heat sink, so The second part is movably connected with the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame. At least part of the first part is located between the chip assembly and the heat sink, and the second part is movably connected with the shielding frame, so that the first part can follow the actual height of the chip assembly or the assembly gap between the chip assembly and the heat sink, thereby promoting The position of the shielding cover moves vertically relative to the shielding frame.

In a possible implementation manner, the shielding frame includes: a third part and a fourth part connected to the third part; an end of the third part away from the fourth part is connected to the first circuit The plates are fixedly connected, and the fourth portion is parallel to the first portion. By setting the fourth part parallel to the first part of the shielding cover, the contact area between the shielding cover and the shielding frame can be increased, thereby increasing the force bearing area when the two are in contact with each other, and preventing the third part of the shielding frame from deviating from the first part. When the first part of the shielding cover at one end of the circuit board contacts, the first part of the shielding cover will be damaged or even broken due to the small end area of the third part of the shielding frame.

In a possible implementation manner, the second part is movably connected to the third part, so that the shielding cover can move in a vertical direction relative to the shielding frame. The second part of the shielding cover is movably connected with the third part of the shielding frame to ensure that the shielding cover can move relative to the shielding frame.

In a possible implementation manner, the second portion is parallel to the third portion. The second part of the shielding cover is parallel to the third part of the shielding frame, and when the position of the shielding cover moves relative to the shielding frame, the relative position movement direction between the second part of the shielding cover and the third part of the shielding frame can be ensured Consistent, to avoid the movement of one of them causing interference or injury to the other.

In a possible implementation manner, one of the second part and the third part is provided with a protrusion, and one of the second part and the third part is provided with an opening ; The protrusion reciprocates in the opening along the vertical direction. The protruding part reciprocates in the opening along the vertical direction, so that the relative positional movement between the shielding cover and the shielding frame in the vertical direction can be realized.

In a possible implementation manner, the dimension of the opening in the vertical direction is greater than the dimension of the protrusion in the vertical direction. In this way, it is possible to ensure that the protruding part has a certain reciprocating movement space in the opening along the vertical direction, so as to realize the relative positional movement between the shielding cover and the shielding frame in the vertical direction.

In a possible implementation manner, the fourth part is provided with a first escape opening; the second part passes through the first escape opening, and the second part is in the extension direction of the first escape opening. Move up and down. The second part of the shielding cover passes through the first escape opening on the fourth part of the shielding frame, and the second part of the shielding cover reciprocates in the extending direction of the first avoiding opening, so that the gap between the shielding cover and the shielding frame can be realized. A relative position shift occurs in the vertical direction.

In a possible implementation manner, the dimension of the second part in the vertical direction is greater than the dimension of the fourth part in the vertical direction. In this way, it is possible to ensure that the second part of the shielding cover has a certain reciprocating movement space along the vertical direction in the extending direction of the first avoidance opening, so as to realize the relative positional movement between the shielding cover and the shielding frame in the vertical direction.

In a possible implementation manner, the shielding cover further includes: a fifth part; the fifth part is connected to an end of the second part away from the first part; the fifth part is connected to the fourth The parts are parallel, and the fifth part is used to limit the movement range of the second part when it reciprocates in the extending direction of the first avoidance opening.

In a possible implementation manner, the end of the third part close to the first circuit board is provided with a second avoidance opening; the shielding cover further includes: a sixth part; the sixth part and the first circuit board The ends of the two parts away from the first part are connected; the sixth part protrudes into the second escape opening, and the sixth part reciprocates in the second escape opening along the vertical direction. The sixth part of the shielding cover reciprocates along the vertical direction in the second avoidance opening of the third part of the shielding frame, so that the relative positional movement between the shielding cover and the shielding frame in the vertical direction can be realized.

In a possible implementation manner, the shielding cover further includes: a seventh part; the seventh part is connected to an end of the sixth part away from the second part; The extension direction of the second part is the same. By adding a seventh part on the shielding cover, and the seventh part is connected to the end of the sixth part away from the second part, the extension direction of the seventh part is consistent with the extension direction of the second part, so that the seventh part and the first part can be connected. The six parts and the second part form an inwardly bent hook structure, which contributes to the structural stability of the sixth part of the shielding cover when it reciprocates vertically in the second avoidance opening of the third part of the shielding frame.

In a possible implementation manner, the heat sink includes: a heat sink body and a boss connected to the heat sink body; a side of the boss away from the heat sink body is in contact with the chip component.

In a second aspect, an embodiment of the present application provides an electronic device, including any one of the circuit board assemblies described above.

By arranging the above-mentioned circuit board assembly in the electronic equipment, since the circuit board assembly can be adapted to chip assemblies of different heights and different assembly gaps, the adaptability of chip assemblies of different heights and different assembly gaps to electronic equipment can be increased. . Because the reliability of the circuit board component is high, the circuit board component with high reliability can be provided in the electronic device, which will optimize the experience effect of the electronic device. At the same time, it also ensures the stability of signal transmission in the electronic equipment and ensures the normal operation of the electronic equipment.

Description of drawings

FIG. 1 is a schematic structural view of a circuit board assembly in the prior art;

2 is a schematic diagram of a circuit board assembly in the prior art in a drop scene;

FIG. 3 is a schematic diagram of a gap in the installation scene of a circuit board assembly in the prior art;

FIG. 4 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 7A is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 7B is a schematic structural diagram of the first shielding component in the circuit board component provided by an embodiment of the present application;

FIG. 8A is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 8B is a schematic structural diagram of the first shielding component in the circuit board component provided by an embodiment of the present application;

FIG. 9A is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 9B is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 10A is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 10B is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 11A is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 11B is a schematic structural diagram of a first shielding component in a circuit board component provided by an embodiment of the present application;

FIG. 12 is a schematic structural view of a chip component disposed on a first circuit board in a circuit board component provided by an embodiment of the present application;

Fig. 13 is a schematic structural diagram of the shielding frame of the first shielding assembly being arranged on the first circuit board in the circuit board assembly provided by an embodiment of the present application;

Fig. 14 is a schematic structural view of the shielding cover of the first shielding assembly provided on the shielding frame in the circuit board assembly provided by an embodiment of the present application;

Fig. 15 is a schematic structural view of the shielding cover of the second shielding assembly provided on the heat sink in the circuit board assembly provided by an embodiment of the present application;

FIG. 16 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application;

FIG. 17 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application.

Explanation of reference signs:

100-circuit board assembly; 110-the first circuit board; 120-chip assembly;

121-chip body; 122-second circuit board; 123-structural parts;

130-radiator; 131-radiator body; 132-boss;

133-radiating fins; 140-the first shielding component; 141-shielding frame;

1411-third part; 1412-fourth part; 1413-opening;

1414-the first avoidance; 1415-the second avoidance; 142-shielding cover;

1421-first part; 1422-second part; 1423-bulge;

1424-Part V; 1425-Part VI; 1426-Part VII;

150-heat conducting part; 160-electrical connector; 170-second shielding component;

200-shield structure; 300-ground.

Detailed ways

The terms used in the embodiments of the application are only used to explain the specific embodiments of the application, and are not intended to limit the application. The implementation of the embodiments of the application will be described in detail below with reference to the accompanying drawings.

The board-level application of the heat source chip on the printed circuit board (Printed Circuit Board, PCB) in the communication equipment usually includes the electromagnetic interference (Electromagnetic Interference, EMI) suppression design of the two-layer area. The connection solder joints between the chip and the circuit board are shielded.

With the improvement of transmission efficiency and capacity requirements, the layout of heat source chips on printed circuit boards in communication equipment is becoming more and more dense, and the increase in the number of chips further compresses the space between chips. Therefore, the electromagnetic interference and heat dissipation problems of chips are raised. new challenge. The current common shielding scheme is usually to use conductive materials, absorbing materials, etc. to suppress shielding, so as to achieve the shielding effect around the chip. However, the shielding material used in the conventional chip shielding scheme takes up a large space and has a strong relationship with the design constraints of the heat dissipation structure, which cannot meet the layout requirements in a high-density space, resulting in poor shielding performance and weak suppression of electromagnetic interference between chips. Therefore, in combination with chip application scenarios, the need to realize miniaturized electromagnetic shielding solutions that couple printed circuit boards and heat dissipation structures is becoming more and more urgent.

In the related art, as shown in FIGS. 1 to 3 , generally, a heat sink 130 is provided on the side of the heat-generating chip (that is, the chip component 120 ) away from the circuit board (that is, the first circuit board 110 ), and one side of the heat sink 130 is in contact with the circuit board. The chip components 120 are in contact with each other to achieve good heat dissipation of the chip component 120. In addition, a shielding structure 200 is also provided between the first circuit board 110 and the heat sink 130. Specifically, one end of the shielding structure 200 is welded on the first circuit board 110. Above, the other end of the shielding structure 200 is in contact with the heat sink 130, and the shielding structure 200 is located on the outer periphery of the chip assembly 120, so that the heat sink 130, the shielding structure 200 and the first circuit board 110 are surrounded to form a closed space, In this way, a shielding effect can be achieved to avoid signal interference caused by the outside world to the chip assembly 120 .

However, the above-mentioned shielding structure 200 achieves assembly at a certain fixed installation height, and thus cannot adapt to chip components 120 of different heights and different assembly clearances. For example, in order to further enhance the shielding effect, an elastic conductive material (that is, the second shielding component 170) is generally arranged between the radiator 130 and the shielding structure 200, but for an assembly scene where space is tight, the radiator 130 will be elastically conductive. Due to the limit compression height and compression force of the material, it cannot be in contact with the heat source surface of the chip component 120, which affects the heat dissipation effect.

Based on this, the embodiment of the present application provides a circuit board assembly. At least one first shielding assembly is arranged on the periphery of the chip assembly, the shielding frame of the first shielding assembly is fixedly connected with the first circuit board, and at least part of the shielding cover is located on the chip assembly. Between the component and the radiator, and the shielding cover is movably connected with the shielding frame, so that the shielding cover can move in the vertical direction relative to the shielding frame, so that the shielding cover overlaps the gap between the chip assembly and the radiator When in the assembly gap, the shielding cover can adapt to chips of different heights and move in the vertical direction relative to the shielding frame, or the shielding cover can adapt to different assembly gaps between the chip assembly and the heat sink and relative to the shielding frame. A position shift occurs in the vertical direction.

The specific structure of the circuit board assembly and the manufacturing method of the circuit board assembly will be described in detail below with reference to the accompanying drawings.

4 and 5, the embodiment of the present application provides a circuit board assembly 100, the circuit board assembly 100 may include: a first circuit board 110, a chip assembly 120 and at least one radiator 130, wherein the chip assembly 120 One side of the chip assembly 120 is electrically connected to the first circuit board 110 , and the other side of the chip assembly 120 is in contact with the heat sink 130 .

The circuit board assembly 100 may further include: at least one first shielding assembly 140 , specifically, the first shielding assembly 140 may be located on the periphery of the chip assembly 120 . Wherein, the material used for the first shielding component 140 may be a metal material such as a stainless steel nickel nickel base material, which is not limited in this embodiment of the present application.

Referring to FIG. 6, each first shielding assembly 140 may include: a shielding frame 141 and a shielding cover 142, wherein, one end of the shielding frame 141 away from the shielding cover 142 is fixedly connected to the first circuit board 110, and at least part of the shielding cover 142 It is located between the chip assembly 120 and the heat sink 130 . Moreover, the shielding cover 142 can be a rigid member, and the shielding cover 142 is movably connected with the shielding frame 141 , so that the shielding cover 142 can move in a vertical direction relative to the shielding frame 141 . It can be understood that the vertical direction here refers to the height direction along the chip assembly 120 .

The shielding cover 142 and the shielding frame 141 form a floating detachable overlapping structure. Exemplarily, a slidable floating structure design can be adopted between the shielding frame 141 and the shielding cover 142 in the vertical direction. In this way, the shielding cover When 142 is overlapped in the assembly gap between the chip assembly 120 and the heat sink 130, the shielding cover 142 can adapt to chips of different heights and move relative to the shielding frame 141 in the vertical direction, or the shielding cover 142 can adapt to Different assembly gaps between the chip assembly 120 and the heat sink 130 cause the position to move in the vertical direction relative to the shielding frame 141 to solve the gap tolerance between the shield cover, the chip assembly 120 and the heat sink 130 in the actual installation scene question.

It can be understood that the shielding cover 142 can be moved relative to the shielding frame 141 in the vertical direction by a predetermined distance (can be calculated according to specific scenarios), so that the first shielding component 140 can be moved without contacting the chip component 120 and the chip component 120. When the heat sink 130 interferes with each other, it can effectively absorb the space gap of a certain preset distance, thereby adapting to chips of different heights, reducing the size deviation of assembly, and making the overlapping between the shielding cover 142 and the chip component 120 more reliable , while reducing the height space requirements. For example, the shielding cover 142 can move 0.5 mm in the vertical direction relative to the shielding frame 141 , which can effectively absorb the space gap of 0.5 mm.

In addition, in the prior art, when the above-mentioned structure is dropped, vibrated or impacted, since the acceleration of the heat sink 130 is inconsistent with the acceleration of the chip assembly 120, the heat sink 130 is likely to be separated from the chip assembly 120, and under the action of gravity of the heat sink 130 , the radiator 130 will be parallel to or not parallel to the surface of the shielding structure 200, that is, the radiator 130 will be parallel to or not parallel to the ground 300 (see FIG. The structure 200 is deformed, and the connection between the shielding structure 200 and the printed circuit board (that is, the first circuit board 110 ) also has a risk of failure, which affects the connection reliability.

However, in the embodiment of the present application, the shielding cover 142 is overlapped in the assembly gap between the chip component 120 and the heat sink 130, which changes the force bearing form of the first shielding component 140, especially for the application scenario of vibration and shock, when the heat sink When 130 applies pressure to the heat dissipation cover, the movable connection between the shielding cover 142 and the shielding frame 141 can provide a certain buffer space for the shielding frame 141, eliminate or reduce the risk of pressure deformation of the first shielding assembly 140, and avoid the shielding frame 141 from The first circuit board 110 causes top damage, which causes the risk of welding cracks between the shielding frame 141 and the first circuit board 110 , and destroys the connection reliability between the shielding frame 141 and the first circuit board 110 .

It can be understood that the shielding cover 142 can move relative to the shielding frame 141 by 0.5mm in the vertical direction, which can reduce the deformation of the first shielding component 1400.25mm.

The circuit board assembly 100 provided by the embodiment of the present application is coupled to the first shielding assembly 140 and the heat sink 130 at the same time, so that the heat dissipation function and the electromagnetic shielding function can be realized at the same time, wherein the suppression shielding effect of the first shielding assembly 140 can reach ≥ 5dB@20 ~30GHz. Moreover, the first shielding component 140 can be adapted to the chip component 120 with a large size (for example, 55mm-120mm), which can reduce or avoid the risk of strength deformation or failure of the large-sized first shielding component 140 .

5, the chip assembly 120 may include: a chip body 121 and a second circuit board 122, wherein the chip body 121 is connected to the second circuit board 122, and the side of the second circuit board 122 away from the chip body 121 is connected to the first circuit board 122. The board 110 is electrically connected, and the side of the chip body 121 away from the second circuit board 122 is in contact with the heat sink 130 . The side of the second circuit board 122 facing away from the chip body 121 is electrically connected to the first circuit board 110 , so as to realize the electrical connection between the chip assembly 120 and the second circuit board 122 . The side of the chip body 121 facing away from the second circuit board 122 is in contact with the heat sink 130 , so that the heat sink 130 can dissipate heat from the chip assembly 120 .

In the embodiment of the present application, the circuit board assembly 100 may further include: a heat conduction element 150 , wherein the heat conduction element 150 is located between the chip body 121 and the heat sink 130 . By disposing the heat conducting member 150 between the chip body 121 and the heat sink 130 , the heat conduction performance between the chip body 121 and the heat sink 130 can be increased, so that the heat sink 130 can better dissipate heat to the chip assembly 120 .

It can be understood that the heat conduction member 150 can be made of any material having a heat conduction function, as long as it can assist in heat transfer or heat dissipation, which is not limited in this embodiment of the present application.

In the embodiment of the present application, the chip assembly 120 may further include: a structural member 123, wherein the structural member 123 and the chip body 121 are located on the same surface of the second circuit board 122, and the structural member 123 is located on the outer periphery of the chip body 121, At least part of the shielding cover 142 is located between the structural member 123 and the heat sink 130 .

The structural member 123 located on the outer periphery of the chip body 121 can protect the chip body 121 to a certain extent, and prevent the large-area exposure of the chip body 121 from causing adverse effects on the chip body 121 . In addition, at least part of the shielding cover 142 is located between the structural member 123 and the heat sink 130 , which can also avoid the direct contact between the shielding cover 142 and the chip body 121 , causing damage or scratch to the chip body 121 .

It should be noted that, as shown in FIG. 4 , the structural member 123 is generally arranged around the outer circumference of the chip body 121 to protect the chip body 121 on the inner ring of the structural member 123 .

In the embodiment of the present application, the electrical connection between the second circuit board 122 and the first circuit board 110 can be realized through at least one electrical connector 160, and the projected area of the at least one electrical connector 160 on the first circuit board 110 can be located at The first shielding component 140 is within the projected area of the first circuit board 110 .

The projected area of the electrical connector 160 on the first circuit board 110 is located within the projected area of the first shielding component 140 on the first circuit board 110 , which can ensure that the first shielding component 140 covers the electrical connector 160 and a plurality of electrical connectors 160 The gap between them is to ensure that the first shielding component 140 suppresses the electromagnetic interference of the electrical connector 160 and avoid electromagnetic interference from interfering with the performance of the electrical connection between the second circuit board 122 and the first circuit board 110 .

Wherein, in a possible implementation manner, the electrical connector 160 may be a solder ball or solder paste, etc. Exemplarily, the connection between the second circuit board 122 and the first circuit board 110 may be based on a solder ball array package (Ball Grid Array, BGA) is electrically connected by at least one solder ball or solder paste.

In the embodiment of the present application, the circuit board assembly 100 may further include: a second shielding assembly 170 , wherein the second shielding assembly 170 may be located between the shielding cover 142 and the heat sink 130 . Specifically, the second shielding component 170 may overlap between the shielding cover 142 and the heat sink 130 . By arranging the second shielding assembly 170 between the shielding cover 142 and the radiator 130, the shielding effect on the interference signal around the chip assembly 120 can be further enhanced on the basis of the first shielding assembly 140 suppressing the electromagnetic interference of the chip assembly 120 .

In some embodiments, the second shielding component 170 may be an elastic shielding material, ie, a soft compressible shielding material. By setting the second shielding component 170 as an elastic shielding material, the second shielding component 170 can provide a certain degree of contact between the shielding cover 142 and the heat sink 130 while enhancing the shielding effect on the interference signal around the chip component 120. The cushioning function is that when the heat sink 130 exerts pressure on the heat dissipation cover, the second shielding component 170 can absorb a certain pressure, so as to reduce the stress on the heat dissipation cover.

Exemplarily, the second shielding component 170 may be other conductive materials such as conductive cloth, conductive glue, or a reed structure, which is not limited in this embodiment of the present application.

Wherein, it can be understood that the second shielding component 170 may be disposed on the shielding cover 142 , or may be disposed on the heat sink 130 . For example, the second shielding component 170 itself may have adhesive properties, and can be adhered to the shielding cover 142 or the heat sink 130 . In this way, through the assembly of the heat sink 130 , the second shielding component 170 is located in the interlayer between the shield cover 142 and the heat sink 130 , so as to suppress the electromagnetic interference of the chip component 120 and the electrical connector 160 .

In the embodiment of the present application, as shown in FIG. 7A and FIG. 7B, the shielding cover 142 may include: a first part 1421 and a second part 1422, wherein the first part 1421 is connected to the second part 1422, and at least part of the first part 1421 is located Between the chip assembly 120 and the heat sink 130 , moreover, the second part 1422 is movably connected with the shielding frame 141 , so that the shielding cover 142 can move relative to the shielding frame 141 in the vertical direction. In this way, the first portion 1421 can follow the actual height of the chip assembly 120 or the assembly gap between the chip assembly 120 and the heat sink 130 , so that the position of the shielding cover 142 moves vertically relative to the shielding frame 141 .

Continue referring to FIG. 7A and FIG. 7B , the shielding frame 141 may include: a third part 1411 and a fourth part 1412, wherein the third part 1411 is connected to the fourth part 1412, and the end of the third part 1411 is away from the fourth part 1412 It is fixedly connected with the first circuit board 110 , and the fourth part 1412 is parallel to the first part 1421 . By setting the fourth part 1412 parallel to the first part 1421 of the shielding cover 142, the contact area between the shielding cover 142 and the shielding frame 141 can be increased, thereby increasing the force bearing area when the two are in contact with each other, and avoiding the shielding frame 141. When the first part 1421 of the shielding cover 142 at the end of the third part 1411 away from the first circuit board 110 contacts, the first part 1421 of the shielding cover 142 will be damaged or even broken due to the small end area of the third part 1411 of the shielding frame 141 .

Wherein, in a possible implementation manner, the second part 1422 may be movably connected with the third part 1411 , so that the shielding cover 142 may move relative to the shielding frame 141 in the vertical direction. The second part 1422 of the shielding cover 142 is movably connected with the third part 1411 of the shielding frame 141, so as to ensure that the shielding cover 142 can move relative to the shielding frame 141.

In addition, in the embodiment of the present application, the second portion 1422 may be parallel to the third portion 1411 . The second part 1422 of the shielding cover 142 is parallel to the third part 1411 of the shielding frame 141, and when the position of the shielding cover 142 moves relative to the shielding frame 141, the second part 1422 of the shielding cover 142 and the third part of the shielding frame 141 can be ensured. The relative positions of the three parts 1411 move in the same direction, preventing the movement of one of them from causing interference or injury to the other.

It should be noted that, in the embodiment of the present application, the flexible connection between the shielding cover 142 and the shielding frame 141 includes the following three possible implementations:

A first possible implementation is: a protruding part 1423 is provided on one of the second part 1422 and the third part 1411, and an opening 1413 is provided on one of the second part 1422 and the third part 1411. The exit part 1423 can reciprocate within the opening 1413 along the vertical direction. The protruding part 1423 reciprocates in the opening 1413 along the vertical direction, so as to realize the relative positional movement between the shielding cover 142 and the shielding frame 141 in the vertical direction.

For example, in FIG. 7A and FIG. 7B, the second part 1422 is provided with a protrusion 1423, and the third part 1411 is provided with an opening 1413, and the protrusion 1423 can be in the opening 1413 of the third part 1411 along the vertical direction. reciprocating movement. When the protrusion 1423 moves to the top wall of the opening 1413 of the third part 1411 along the vertical direction, the structure shown in FIG. 8A and FIG. 8B is formed. When the protrusion 1423 moves to the bottom wall of the opening 1413 of the third part 1411 along the vertical direction, the structure shown in FIGS. 9A and 9B is formed.

Wherein, it can be understood that the size of the opening 1413 in the vertical direction may be larger than the size of the protrusion 1423 in the vertical direction. In this way, it can ensure that the protruding portion 1423 has a certain reciprocating movement space in the opening 1413 along the vertical direction, so as to realize relative positional movement between the shielding cover 142 and the shielding frame 141 in the vertical direction.

Exemplarily, the shape of the opening 1413 on the third part 1411 can be designed as a round hole shape as shown in FIG. 7B, the length direction of the round hole is along the vertical direction, and the protrusion 1423 is along the The length direction moves back and forth in the round waist hole to form a sliding design in which the protruding part 1423 matches the round waist hole, which can realize the effect of easy assembly and disassembly.

The second possible implementation is: as shown in Figure 10A and Figure 10B, the fourth part 1412 is provided with a first escape opening 1414, the second part 1422 passes through the first avoidance opening 1414, and the second part 1422 is in the The first escape port 1414 reciprocates in the extending direction. The second part 1422 of the shielding cover 142 passes through the first escape opening 1414 on the fourth part 1412 of the shielding frame 141, and the second part 1422 of the shielding cover 142 reciprocates in the extending direction of the first escape opening 1414, that is, The relative positional movement between the shielding cover 142 and the shielding frame 141 in the vertical direction is realized.

Wherein, in some embodiments, the dimension of the second portion 1422 in the vertical direction may be greater than the dimension of the fourth portion 1412 in the vertical direction. In this way, it can be ensured that the second part 1422 of the shielding cover 142 has a certain space for reciprocating movement along the vertical direction in the extending direction of the first avoidance opening 1414, so as to realize the space between the shielding cover 142 and the shielding frame 141 in the vertical direction. A relative positional shift occurs.

In addition, it can be understood that, as shown in FIG. 10A and FIG. 10B , the shielding cover 142 may further include: a fifth part 1424, wherein the fifth part 1424 is connected to an end of the second part 1422 away from the first part 1421, and the fifth part 1424 is parallel to the fourth part 1412 , and the fifth part 1424 is used to limit the moving range of the second part 1422 when reciprocating in the extension direction of the first avoidance port 1414 .

A third possible implementation is as follows: as shown in FIG. 11A and FIG. 11B , the end of the third part 1411 close to the first circuit board 110 is provided with a second avoidance opening 1415, and the shielding cover 142 may also include: a sixth part 1425, Wherein, the sixth part 1425 is connected with the end of the second part 1422 away from the first part 1421, and the sixth part 1425 protrudes into the second avoidance port 1415, and the sixth part 1425 is vertically inside the second avoidance port 1415 reciprocating movement. The sixth part 1425 of the shielding cover 142 reciprocates in the second avoidance opening 1415 of the third part 1411 of the shielding frame 141 along the vertical direction, so that the vertical movement between the shielding cover 142 and the shielding frame 141 can be realized. relative positional movement.

Wherein, in a possible implementation manner, the shielding cover 142 may further include: a seventh part 1426, wherein the seventh part 1426 is connected to the end of the sixth part 1425 away from the second part 1422, and the extension of the first part 1421 The direction is consistent with the extending direction of the second portion 1422 .

By adding a seventh part 1426 on the shielding cover 142, and the seventh part 1426 is connected to the end of the sixth part 1425 away from the second part 1422, the extension direction of the seventh part 1426 is consistent with the extension direction of the second part 1422, which can make The seventh part 1426, the sixth part 1425 and the second part 1422 form an inwardly bent hook structure, so that the shielding cover 142 can be closely matched with the shielding frame 141 through the surrounding hemming structure (ie, the seventh part 1426), realizing The fixed limit in the front, back, left, and right directions is helpful to the structural stability when the sixth part 1425 of the shielding cover 142 reciprocates along the vertical direction in the second avoidance opening 1415 of the third part 1411 of the shielding frame 141 . In addition, the sliding design of the inner bending hook structure can also achieve the effect of easy assembly and disassembly.

The floating structure forms between the above three shielding covers and the shielding frame 141 can realize the floating requirement along the height direction of the chip assembly 120, and realize that the shielding cover 142 can be matched and adjusted according to the actual height of the chip assembly 120, and Both can effectively meet the requirements of electromagnetic shielding and at the same time improve the structural strength. In addition, the installation of the shielding cover is simple and reliable, and it is easy to maintain.

In the actual assembly process, the chip assembly 120 can be placed at a designated position on the first circuit board 110 (see FIG. 12 ), and then the shielding frame 141 is soldered and fixed on the first circuit board 110. Specifically, The shielding frame 141 is disposed on the structural member 123 of the chip assembly 120 to ensure that the shielding frame 141 surrounds the periphery of the chip body 121 of the chip assembly 120 (see FIG. 13 ). Then, the shielding cover 142 is installed on the shielding frame 141 (see FIG. 14 ), at this time, the shielding cover 142 and the shielding frame 141 can float up and down, and the height of the shielding cover 142 can be determined according to the edge height of the actual chip assembly 120. Sure. Next, as shown in FIG. 15 , the second shielding assembly 170 is pasted on the bottom surface of the heat sink 130 (that is, the side of the heat sink 130 facing the first circuit board 110 ), and the heat sink 130 pasted with the second shielding assembly 170 is installed. on the chip assembly 120, so that the heat sink 130 is attached to the heat source surface of the chip body 121 in the chip assembly 120, and the second shielding assembly 170 can be lapped on the shielding cover 142, so that the second shielding assembly 170 can press the shielding The cover 142 is placed on the structural member 123 of the chip assembly 120, so that the first shielding assembly 140 and the second shielding assembly 170 form an electrically closed space around the chip assembly 120, that is, a circuit as shown in FIGS. 16 and 17 is formed. The board assembly 100 effectively realizes overall heat dissipation and electromagnetic interference suppression effects.

Wherein, in a possible implementation manner, the shielding frame 141 may be welded and fixed on the first circuit board 110 by using surface mount technology (Surface Mount Technology, SMT), or it may be fixed on the first circuit board 110 by screws. The shielding frame 141 is fixed by driving screws through the plate above or below the shielding frame 110 . The heat sink 130 may also be installed above the chip assembly 120 by means of screw fixing.

It should be noted that surface mount technology, also known as surface mount technology, is a method of mounting non-lead or short-lead surface mount components (chip components) on the surface or surface of a printed circuit board (PCB). On the surface of other substrates, the circuit assembly technology is soldered and assembled by methods such as reflow soldering or dip soldering.

In addition, as shown in FIG. 5 or FIG. 17, in the embodiment of the present application, the radiator 130 may include: a radiator body 131 and a boss 132, wherein the boss 132 is connected to the radiator body 131, and the boss 132 A side away from the heat sink body 131 is in contact with the chip assembly 120 .

In a possible implementation manner, the heat sink 130 may further include: heat dissipation fins 133 , and the heat dissipation fins are fixed on the side of the heat sink body 131 away from the boss 132 . The heat dissipation fins 133 can improve the heat dissipation effect of the heat sink 130 .

The embodiment of the present application also provides an electronic device, which may include any one of the above circuit board assemblies 100 .

By arranging the above-mentioned circuit board assembly 100 in electronic equipment, because the circuit board assembly 100 can be adapted to chip assemblies 120 of different heights and different assembly clearances, it is possible to increase the impact of chip assemblies 120 of different heights and different assembly clearances on electronic equipment. degree of fitness. Because the reliability of the circuit board assembly 100 is high, the circuit board assembly 100 with high reliability can be provided in the electronic device, which will optimize the experience effect of the electronic device. At the same time, it also ensures the stability of signal transmission in the electronic equipment and ensures the normal operation of the electronic equipment.

It should be noted that the electronic devices provided in the embodiments of the present application may include, but are not limited to, mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC for short), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDA for short), wearable devices, virtual reality devices and other mobile or fixed terminals with the circuit board assembly 100 .

In the description of the embodiments of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific situations.

The devices or components referred to in the embodiments of the present application must have specific orientations, be constructed and operated in specific orientations, and therefore should not be construed as limiting the embodiments of the present application. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise specifically specified.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects, while It is not necessarily used to describe a particular order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein, for example, can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "may include" and "have" and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a series of steps or units need not be limited to the expressly listed Instead, other steps or elements not explicitly listed or inherent to the process, method, product or apparatus may be included.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, but not to limit them. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or modify some or all of the technical features. equivalent replacement. These modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

A circuit board assembly, characterized in that it at least includes:

a first circuit board, a chip assembly, and at least one heat sink;

One side of the chip component is electrically connected to the first circuit board, and the other side of the chip component is in contact with the heat sink;

It also includes: at least one first shielding component located on the periphery of the chip component; each of the first shielding components includes: a shielding frame and a shielding cover;

An end of the shielding frame away from the shielding cover is fixedly connected to the first circuit board, at least part of the shielding cover is located between the chip assembly and the heat sink;

And the shielding cover is movably connected with the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame.
The circuit board assembly according to claim 1, wherein the chip assembly comprises: a chip body and a second circuit board connected to the chip body;

A side of the second circuit board away from the chip body is electrically connected to the first circuit board, and a side of the chip body away from the second circuit board is in contact with the radiator.
The circuit board assembly according to claim 2, further comprising: a heat conduction element; the heat conduction element is located between the chip body and the heat sink.
The circuit board assembly according to claim 2, wherein the chip assembly further comprises: a structural member; the structural member and the chip body are located on the same surface of the second circuit board, and the structure The components are located on the periphery of the chip body;

At least part of the shielding cover is located between the structural member and the heat sink.
The circuit board assembly according to claim 2, wherein the electrical connection between the second circuit board and the first circuit board is realized through at least one electrical connector;

A projection area of the at least one electrical connector on the first circuit board is located within a projection area of the first shielding component on the first circuit board.
The circuit board assembly according to claim 1, further comprising: at least one second shielding component; the second shielding component is located between the shielding cover and the heat sink.
The circuit board assembly according to claim 6, wherein the second shielding component is an elastic shielding material.
The circuit board assembly according to any one of claims 1-7, wherein the shielding cover comprises: a first part and a second part connected to the first part;

At least part of the first part is located between the chip assembly and the heat sink, and the second part is movably connected to the shielding frame so that the shielding cover can be vertically positioned relative to the shielding frame position shift occurred.
The circuit board assembly according to claim 8, wherein the shielding frame comprises: a third part and a fourth part connected to the third part;

An end of the third part away from the fourth part is fixedly connected to the first circuit board, and the fourth part is parallel to the first part.
The circuit board assembly according to claim 9, wherein the second part is movably connected to the third part, so that the shielding cover can move in a vertical direction relative to the shielding frame .
The circuit board assembly of claim 10, wherein the second portion is parallel to the third portion.
The circuit board assembly according to claim 10 or 11, wherein a protrusion is provided on one of the second part and the third part, and the second part and the third part one of which is provided with an opening;

The protrusion reciprocates within the opening along a vertical direction.
The circuit board assembly according to claim 12, wherein the dimension of the opening in the vertical direction is larger than the dimension of the protrusion in the vertical direction.
The circuit board assembly according to claim 10 or 11, wherein a first avoidance opening is opened on the fourth part;

The second part passes through the first escape opening, and the second part reciprocates in the extending direction of the first escape opening.
The circuit board assembly according to claim 14, wherein the dimension of the second portion in the vertical direction is larger than the dimension of the fourth portion in the vertical direction.
The circuit board assembly according to claim 14, wherein the shielding cover further comprises: a fifth part;

The fifth part is connected to an end of the second part away from the first part;

The fifth part is parallel to the fourth part, and the fifth part is used to limit the moving range of the second part when reciprocating in the extending direction of the first avoidance opening.
The circuit board assembly according to claim 10 or 11, wherein a second avoidance opening is provided at an end of the third part close to the first circuit board;

The shielding cover further includes: a sixth part; the sixth part is connected to an end of the second part away from the first part;

The sixth part protrudes into the second avoidance opening, and the sixth part reciprocates in the second escape opening along the vertical direction.
The circuit board assembly according to claim 17, wherein the shielding cover further comprises: a seventh part; the seventh part is connected to an end of the sixth part away from the second part;

The extending direction of the seventh portion is consistent with the extending direction of the second portion.
The circuit board assembly according to claim 1, wherein the heat sink comprises: a heat sink body and a boss connected to the heat sink body;

A side of the boss away from the radiator body is in contact with the chip component.
An electronic device, characterized by comprising the circuit board assembly according to any one of claims 1-19.