WO2023093408A1 - 激光封装装置 - Google Patents

激光封装装置 Download PDF

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Publication number
WO2023093408A1
WO2023093408A1 PCT/CN2022/126905 CN2022126905W WO2023093408A1 WO 2023093408 A1 WO2023093408 A1 WO 2023093408A1 CN 2022126905 W CN2022126905 W CN 2022126905W WO 2023093408 A1 WO2023093408 A1 WO 2023093408A1
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WO
WIPO (PCT)
Prior art keywords
laser
light source
laser light
base
packaging device
Prior art date
Application number
PCT/CN2022/126905
Other languages
English (en)
French (fr)
Inventor
唐怀
郭燕玉
Original Assignee
深圳市中光工业技术研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市中光工业技术研究院 filed Critical 深圳市中光工业技术研究院
Priority to KR1020247002602A priority Critical patent/KR20240021987A/ko
Publication of WO2023093408A1 publication Critical patent/WO2023093408A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02335—Up-side up mountings, e.g. epi-side up mountings or junction up mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management

Definitions

  • the utility model relates to the technical field of laser packaging, in particular to a laser packaging device.
  • the purpose of the embodiments of the present invention is to provide a laser packaging device to solve the above problems.
  • the embodiment of the utility model achieves the above-mentioned purpose through the following technical solutions.
  • the embodiment of the utility model provides a laser packaging device, including a base, a laser light source assembly, leads and a light window
  • the base includes a light source installation part and a support part, the light source installation part and the support part are integrally arranged, and cooperate with the support part to form a storage cavity
  • the supporting part includes a top surface and a bottom surface;
  • the laser light source assembly is accommodated in the receiving cavity and arranged on the light source installation part, and the laser light source assembly is used to emit laser light;
  • the lead wire is passed through the support part, and the lead wire includes opposite first ends and second ends , the first end is set in the storage cavity for electrical connection with the laser light source assembly, the second end is set on the bottom surface;
  • the light window cover is set on the top surface to seal the storage cavity, and the laser light is emitted through the light window.
  • the support part further includes a side surface, the side surface is connected between the top surface and the bottom surface, and the side surface is flush with part of the outer surface of the light window.
  • the light source installation part includes an inner surface, the inner surface is located between the top surface and the bottom surface, the laser light source assembly is arranged on the inner surface, and the support part further includes a stepped surface, and the stepped surface is located between the top surface and the inner surface, The first end of the lead wire is disposed on the stepped surface.
  • the laser light source assembly includes a laser chip and a reflector, the laser chip is electrically connected to the first end of the lead, the laser chip includes two emission sources, each of which is used to emit laser light, and the laser light is reflected by the reflector to the light window.
  • the base has a length direction and a width direction
  • a plurality of laser light source assemblies are arranged at intervals along the length direction of the base
  • the laser chip and reflector of each laser light source assembly are arranged along the width direction of the base, along the length of the base direction, a laser chip is arranged between every two adjacent reflectors.
  • the laser chip of any laser light source assembly is staggered from the reflector of the adjacent laser light source assembly, so as to increase the distance between two adjacent laser chips in the width direction of the base.
  • the base is made of ceramic material.
  • the laser packaging device further includes a collimating lens, and the collimating lens is disposed on a side of the light window away from the base.
  • the collimator lens includes a lens body and a plurality of collimation units, the lens body is connected to the light window, the plurality of collimation units are all arranged on the lens body, and the number of laser light source assemblies is multiple, each laser The light source component corresponds to a collimation unit.
  • the laser packaging device provided by the embodiment of the utility model the laser packaging device provided by the utility model, the light source installation part and the support part are integrated, which simplifies the manufacturing process of the base.
  • the first end of the lead wire It is arranged in the receiving cavity, and the second end is arranged on the bottom surface of the supporting part, which is beneficial to reducing the size of the base and realizing the miniaturization of the laser packaging device.
  • Fig. 1 is a schematic structural diagram of a laser packaging device provided by the present invention.
  • FIG. 2 is a longitudinal sectional view of the laser packaging device shown in FIG. 1 .
  • FIG. 3 is an optical path diagram of the laser packaging device shown in FIG. 1 along the length direction of the base.
  • FIG. 4 is an optical path diagram of the laser packaging device shown in FIG. 1 along the width direction of the base.
  • FIG. 5 is an arrangement diagram of multiple laser light source components of the laser packaging device shown in FIG. 1 .
  • FIG. 6 is a top view of the arrangement of multiple laser light source components of the laser packaging device shown in FIG. 5 .
  • FIG. 7 is another arrangement diagram of multiple laser light source components of the laser packaging device shown in FIG. 1 .
  • FIG. 8 is a top view of the arrangement of multiple laser light source components of the laser packaging device shown in FIG. 7 .
  • the utility model provides a kind of laser package device 1, comprises base 10, laser light source assembly 30, lead wire 50 and light window 60, base 10 comprises light source installation part 11 and support part 13, light source installation part 11 It is integrally arranged with the support part 13, and cooperates with the support part 13 to form a storage cavity 15.
  • the support part 13 includes a top surface 132 and a bottom surface 134; the laser light source assembly 30 is contained in the storage cavity 15, and is arranged on the light source installation part 11.
  • the laser light source The component 30 is used to emit laser light;
  • the lead wire 50 is passed through the support part 13, the lead wire 50 includes an opposite first end 52 and a second end 54, and the first end 52 is arranged in the receiving cavity 15 for electrically connecting the laser light source assembly 30.
  • the second end 54 is disposed on the bottom surface 134 ; the light window 60 is covered on the top surface 132 to seal the receiving cavity 15 , and the laser light is emitted through the light window 60 .
  • the base 10 is approximately an open cuboid shell structure, and the base 10 has a length direction and a width direction.
  • the base 10 also has a height direction, and the length direction, the width direction and the height direction are perpendicular to each other.
  • the base 10 may also be in other shapes such as an open cylinder.
  • the base 10 can be used to install structures such as the laser light source assembly 30 and the light window 60 .
  • the base 10 is made of a ceramic material, such as alumina or aluminum nitride ceramics, and the cost of the ceramic material is low, which can reduce the cost of the laser packaging device 1 .
  • the base 10 can also be made of copper to improve the thermal conductivity of the base, such as oxygen-free copper or tungsten copper.
  • the base 10 includes a light source installation part 11 and a support part 13 , the light source installation part 11 can be used for installing the laser light source assembly 30 , and the support part 13 can be used for supporting the light window 60 .
  • the light source installation part 11 and the support part 13 are provided integrally, which can simplify the manufacturing process of the base 10, thereby simplifying the manufacturing process of the laser packaging device 1, for example, the light source installation part 11 and the support part 13 of the base 10 can be passed Made of one piece sintering process.
  • the light source installation part 11 is substantially in the shape of a rectangular plate, and the light source installation part 11 can cooperate with the support part 13 to form a receiving cavity 15 , wherein the receiving cavity 15 can be used to accommodate the laser light source assembly 30 .
  • the light source mounting part 11 includes an inner surface 112, the inner surface 112 is located between the top surface 132 and the bottom surface 134, the inner surface 112 can be used to set the laser light source assembly 30, for example, the laser light source assembly 30 can be bonded to the inner surface 112 by heat-conducting adhesive .
  • the light source installation part 11 further includes an outer surface 114 opposite to the inner surface 112 .
  • the outer surface 114 is coplanar with the bottom surface 134 of the supporting part 13 to increase the contact area between the base 10 and a supporting surface such as a desktop, so that the laser packaging device 1 can be stably placed on the supporting surface.
  • the support part 13 is substantially a rectangular frame structure, and the support part 13 is arranged around the light source installation part 11 .
  • the support part 13 also includes a side surface 136, the side surface 136 is connected between the top surface 132 and the bottom surface 134, and the side surface 136 is flush with part of the outer surface 114 of the light window 60, that is, the length of the support part 13 can be equal to the length of the light window 60,
  • the width of the support portion 13 can be equal to the width of the light window 60 , which improves the appearance consistency of the laser packaging device 1 and is also beneficial to the miniaturization of the laser packaging device 1 .
  • the length and width of the supporting part 13 are respectively the length and width of the rectangular frame, the light window 60 is roughly a rectangular plate structure, and the length and width of the light window 60 are respectively the length and width of the rectangular plate.
  • the supporting portion 13 further includes a stepped surface 138 ( FIG. 1 ), which is located between the top surface 132 and the inner surface 112 and can be used for arranging the lead wire 50 .
  • the number of the stepped surfaces 138 is two, and the two stepped surfaces 138 are flush with each other and are arranged on both sides of the laser light source.
  • the laser light source assembly 30 is accommodated in the housing cavity 15 and disposed on the light source mounting portion 11 , for example, the laser light source assembly 30 is mounted on the inner surface 112 of the light source mounting portion 11 .
  • the laser light source assembly 30 is used to emit laser light.
  • the laser light source assembly 30 includes a laser chip 32 and a reflector 34, wherein the laser chip 32 is used to emit laser light, and the laser chip 32 is electrically connected to the lead wire 50 (Fig. 2).
  • the laser chip 32 can be electrically connected to the lead wire 50, and then passed The lead wire 50 is connected to a power source so that the power source can supply power to the laser chip 32 .
  • the laser chip 32 includes two emission sources 321 , each emission source 321 is used to emit laser light, and the two emission sources 321 can increase the emission area and light intensity of the laser light.
  • the laser chip 32 may also include a single emission source 321 or more than three emission sources 321 .
  • the reflector 34 is disposed on the optical path of the laser light, and is used for reflecting the incident laser light to the light window 60 .
  • the reflector 34 includes a reflective surface 341, the reflective surface 341 is opposite to the light outlet of the laser chip 32, and the reflective surface 341 forms an angle of 45° with the inner surface 112 of the light source mounting part 11, so that the laser chip 32 emits
  • the laser light can be emitted along the top of the laser packaging device 1 after being reflected by the reflective surface 341 , so as to realize ejection of light, for example, the laser light is emitted from the top of the laser packaging device 1 along the vertical direction.
  • the emission direction of the laser light from the laser packaging device 1 can be controlled by changing the included angle between the reflective surface 341 and the inner surface 112 of the light source mounting portion 11 .
  • the reflector 34 is a reflective prism, and the longitudinal section of the reflective prism is roughly trapezoidal, wherein the longitudinal section refers to a plane obtained by cutting the reflective prism along the length direction perpendicular to the base 10 .
  • the reflector 34 can also be in the shape of a triangular prism, or in a rectangular plate-like structure.
  • the reflector 34 can be a plane reflector.
  • the reflector 34 can also be in other shapes, with the incident laser The function of reflecting to the light window 60 is sufficient.
  • the laser light source assembly 30 further includes a heat sink 36, the heat sink 36 is arranged on the inner surface 112 of the light source installation part 11, the laser chip 32 is arranged on the side of the heat sink 36 away from the inner surface 112, and the heat sink 36 is used for Heat radiation is performed on the laser chip 32 .
  • the heat emitted by the laser chip 32 can be transferred to the base 10 through the heat sink 36 , and then exchange heat with the external environment through the base 10 to realize heat dissipation of the laser chip 32 .
  • the number of heat sinks 36 is equal to the number of laser chips 32 , that is, one laser chip 32 is disposed on the light source installation portion 11 through one corresponding heat sink 36 .
  • the number of heat sinks 36 is not equal to the number of laser chips 32, for example, multiple laser chips 32 can share one heat sink 36 for heat dissipation.
  • the number of laser light source assemblies 30 is multiple, and the multiple laser light source assemblies 30 are arranged at intervals. Multiple laser light source assemblies 30 can increase the light output intensity of the laser packaging device 1 to meet the demand for light output intensity. In this embodiment, the number of laser light source assemblies 30 is four. In other embodiments, the number of laser light source assemblies 30 may also be two, three, five or more.
  • a plurality of laser light source assemblies 30 are arranged at intervals along the length direction of the base 10 , and the laser chip 32 and reflector 34 of each laser light source assembly 30 are arranged along the width direction of the base 10 .
  • multiple laser light source assemblies 30 are arranged in a single row along the length direction of the base 10 .
  • the plurality of laser light source assemblies 30 can also be arranged in double or multiple rows, which can be set according to actual needs, which is not limited here.
  • a plurality of laser chips 32 form a row
  • a plurality of reflectors 34 form another row, that is, the rows of laser chips 32 and reflectors 34 of each laser light source assembly 30
  • the cloth direction is the same, so that the production operation of the laser light source assembly 30 is convenient and the production efficiency is high.
  • the installation of other multiple reflectors 34 or other multiple laser chips 32 can be completed by repeating the process.
  • a laser chip 32 is arranged between every two adjacent reflectors 34, that is, between every two adjacent laser chips 32 There is a reflector 34 between them, and the reflector 34 and the laser chip 32 are sequentially arranged at intervals along the length direction of the base 10 , and the arrangement directions of the laser chips 32 and the reflector 34 of two adjacent laser light source assemblies 30 are opposite.
  • the first laser light source assembly 30 is upright
  • the second laser light source assembly 30 is upside down
  • the third laser light source assembly 30 is upright, and so on.
  • the reflector 34 is positioned at the upper end of the laser chip 32 when it is placed upright, and that the reflector 34 is positioned at the lower end of the laser chip 32 when it is placed upside down, and that the direction from left to right is defined as the first A laser light source assembly 30 , a second laser light source assembly 30 , and a third laser light source assembly 30 .
  • the arrangement directions of the laser chips 32 and reflectors 34 of two adjacent laser source assemblies 30 are opposite, increasing the adjacent
  • the distance between two laser chips 32 makes the distribution of multiple laser chips 32 relatively scattered, and the heat emitted by multiple laser chips 32 is also distributed over a larger area, that is, the heat transfer channel is enlarged, thereby reducing
  • the thermal resistance of multiple laser chips 32 makes it easier for the heat emitted by the laser chips 32 to be transferred to the external environment through the base 10 , reducing the temperature of the laser chips 32 and prolonging the service life of the laser chips 32 .
  • the laser chip 32 of any laser light source assembly 30 is staggered with the reflector 34 of the adjacent laser light source assembly 30, so as to increase the distance between two adjacent laser chips 32 on the base 10.
  • the spacing in the width direction further expands the heat transfer channel, and the heat emitted by the laser chip 32 is more easily transferred to the external environment through the base 10 , reducing the temperature of the laser chip 32 and prolonging the service life of the laser chip 32 .
  • the laser chip 32 of any laser light source assembly 30 is staggered with the reflector 34 of the adjacent laser light source assembly 30, and it is necessary to ensure that the position and optical path of the laser light from the light window do not change in space.
  • the lead wire 50 is passed through the supporting part 13, for example, the lead wire 50 can be arranged inside the green body of the base 10, while the green body of the base 10 is sintered, the lead wire 50 can be fixed on the The inside of the support part 13, wherein, the green body of the base 10 refers to the structure of the base 10 before sintering.
  • the material of the lead wire 50 can be a metal with a higher melting point such as copper.
  • the lead wire 50 includes opposite first ends 52 and second ends 54.
  • the first end 52 is arranged in the receiving cavity 15 for electrical connection with the laser chip 32.
  • the first end 52 of the lead wire 50 is arranged on the stepped surface 138
  • the second end 54 is disposed on the bottom surface 134 .
  • the lead wire 50 is drawn out from the receiving cavity 15 to the bottom surface 134 of the support part 13, so that the side surface 136 of the support part 13 can be flush with the outer surface 114 of the light window 60, so as to reduce the size of the base 10, so that the laser packaging device 1 becomes a A SMD (Surface Mounted Devices, surface mount device) product structure.
  • a SMD Surface Mounted Devices, surface mount device
  • the first end 52 is provided with a circuit layer 521 , and the circuit layer 521 can be disposed on the stepped surface 138 .
  • the second end 54 is provided with a line pad 541, and the line pad 541 can be arranged on the bottom surface 134 for the welding of the power line, and has the effect of electrically connecting with the power supply, that is, the laser chip 32 can be connected to the power supply through the line pad 541. Electrically connected, so that the power supply can supply power to the laser chip 32.
  • the number of leads 50 is two, that is, the number of circuit layers 521 and circuit pads 541 are both two, and the two circuit layers 521 are respectively arranged on the two step surfaces 138, and the two circuit layers 521 They are respectively electrically connected to the positive and negative poles of each laser chip 32; the two circuit pads 541 are respectively electrically connected to the positive and negative poles of the power supply.
  • the light window 60 is covered on the top surface 132 to seal the receiving cavity 15 and seal the laser light source assembly 30 .
  • the laser light reflected by the reflector 34 exits from the light window 60 .
  • the light window 60 is disposed on the top surface 132 of the support portion 13 to seal the cavity 15 and protect the laser light source assembly 30 in the cavity 15 without affecting the emission of the laser beam.
  • the light window 60 is substantially rectangular in order to adapt to the supporting portion 13 of the rectangular frame structure.
  • the light window 60 may also be a circular structure.
  • the material of the light window 60 may be optical glass, or other light-transmitting materials such as sapphire.
  • the light window 60 may be a fully transparent structure. In other embodiments, the light window 60 may also be a partially transparent structure, that is, the light window 60 is approximately a rectangular ring structure or a circular ring structure.
  • a transparent area is set in the area corresponding to the laser chip 32, and a non-transparent area is set in other areas, so that the light window 60 has a function similar to a diaphragm, so that the light window 60 also has the effect of shaping the light spot while emitting laser light.
  • the laser packaging device 1 may further include a collimating lens 80 , and the collimating lens 80 is disposed on a side of the light window 60 away from the base 10 .
  • the collimating lens 80 can collimate the laser light emitted by the laser light source assembly 30, thereby improving the imaging quality of the laser light.
  • the collimator lens 80 can be bonded to the light window 60, for example, it can be cured by UV (Ultraviolet Rays, ultraviolet) glue or other heat-cured glue or other glue that has good bonding performance to glass materials and less stress. Adhesive to the light window 60.
  • the collimating lens 80 includes a lens body 81 and a plurality of collimating units 83 , the lens body 81 is connected to the light window 60 , for example, the lens body 81 can be bonded to the light window 60 by UV curing glue.
  • a plurality of collimation units 83 are protruding from the lens body 81 , and the plurality of collimation units 83 can be integrated with the lens body 81 .
  • Each collimation unit 83 corresponds to one laser light source assembly 30 , so that the laser light emitted by each laser chip 32 can be collimated by the corresponding collimation unit 83 .
  • the number of collimation units 83 is equal to the number of laser light source assemblies 30 , for example, there are four collimation units 83 , and the four collimation units 83 are sequentially arranged along the length direction of the base 10 .
  • multiple collimation units 83 may also be arranged in multiple rows, so as to meet the purpose that each collimation unit 83 corresponds to one laser light source assembly 30 .
  • the laser packaging device 1 also includes a plurality of gold wires 90, each gold wire 90 is connected between the laser chip 32 and the circuit layer 521, for example, the opposite ends of each gold wire 90 are connected to the laser chip 32 and the circuit layer 521 respectively. welding.
  • each laser chip 32 is connected to two gold wires 90.
  • the number of laser chips 32 is four
  • the number of gold wires 90 is eight
  • the four gold wires 90 are connected to four laser beams respectively.
  • the other four gold wires 90 are respectively connected between the negative electrodes of the four laser chips 32 and the other circuit layer 521 .
  • the light source installation part 11 and the support part 13 are integrated, which simplifies the manufacturing process of the base 10, thereby simplifying the manufacturing process of the laser packaging device 1; in addition, the first end of the lead wire 50 52 is arranged in the receiving cavity 15, and the second end 54 is arranged on the bottom surface 134 of the support part 13, so that the side surface 136 of the support part 13 can be flush with the outer surface 114 of the light window 60, which is beneficial to reduce the size of the base 10 and realize the laser Miniaturization of the packaging device 1 .
  • the laser chip 32 of any laser source assembly 30 is staggered with the reflector 34 of the adjacent laser source assembly 30, which increases the distance between two adjacent laser chips 32 in the width direction of the base 10, increasing
  • the enlarged heat transfer channel makes it easier for the heat emitted by the laser chip 32 to be transferred to the external environment through the base 10 , which reduces the temperature of the laser chip 32 and prolongs the service life of the laser chip 32 .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种激光封装装置（1），包括底座（10）、激光光源组件（30）、引线（50）和光窗（60），底座（10）包括光源安装部（11）和支撑部（13），光源安装部（11）和支撑部（13）一体设置，并且与支撑部（13）配合形成收容腔（15），支撑部（13）包括顶面（132）和底面（134）；激光光源组件（30）收容于收容腔（15）内，并设置于光源安装部（11），激光光源组件（30）用于发射激光；引线（50）穿设于支撑部（13），引线（50）包括相对的第一端（52）和第二端（54），第一端（52）设置于收容腔（15）内，用于与激光光源组件（30）电连接，第二端（54）设置于底面（134）；光窗（60）盖设于顶面（132），以密封收容腔（15），激光经光窗（60）出射，光源安装部（11）和支撑部（13）一体设置，简化了底座（10）的制作工艺，另外，引线（50）的第一端（52）设置于收容腔（15）内，第二端（54）设置于支撑部（13）的底面（134），利于减小底座（10）的尺寸，实现激光封装装置（1）的小型化。

Description

激光封装装置 技术领域
本实用新型涉及激光封装技术领域，具体而言，涉及一种激光封装装置。
背景技术
随着激光器芯片封装技术的不断进步，激光器芯片在激光照明和显示领域得到了越来越广泛的应用。市面上的激光器芯片封装结构的制作工艺复杂，且通常尺寸较大，限制了激光器芯片封装技术的进一步发展。
实用新型内容
本实用新型实施例的目的在于提供一种激光封装装置，以解决上述问题。本实用新型实施例通过以下技术方案来实现上述目的。
本实用新型实施例提供一种激光封装装置，包括底座、激光光源组件、引线和光窗，底座包括光源安装部和支撑部，光源安装部和支撑部一体设置，并且与支撑部配合形成收容腔，支撑部包括顶面和底面；激光光源组件收容于收容腔内，并设置于光源安装部，激光光源组件用于发射激光；引线穿设于支撑部，引线包括相对的第一端和第二端，第一端设置于收容腔内，用于与激光光源组件电连接，第二端设置于底面；光窗盖设于顶面，以密封收容腔，激光经光窗出射。
在一种实施方式中，支撑部还包括侧面，侧面连接于顶面和底面之间，侧面与光窗的部分外表面平齐。
在一种实施方式中，光源安装部包括内表面，内表面位于顶面和底面之间， 激光光源组件设置于内表面，支撑部还包括台阶面，台阶面位于顶面和内表面之间，引线的第一端设置于台阶面。
在一种实施方式中，激光光源组件包括激光芯片和反射件，激光芯片与引线的第一端电连接，激光芯片包括两个发射源，每个发射源用于发射激光，激光经反射件反射至光窗。
在一种实施方式中，激光光源组件的数量为多个，多个激光光源组件间隔设置。
在一种实施方式中，底座具有长度方向和宽度方向，多个激光光源组件沿底座的长度方向间隔设置，每个激光光源组件的激光芯片和反射件沿底座的宽度方向设置，沿底座的长度方向，每相邻两个反射件之间设有一个激光芯片。
在一种实施方式中，沿底座的宽度方向，任一激光光源组件的激光芯片与相邻激光光源组件的反射件错开设置，以增加相邻两个激光芯片在底座的宽度方向的间距。
在一种实施方式中，底座由陶瓷材料制成。
在一种实施方式中，激光封装装置还包括准直透镜，准直透镜设置于光窗远离所述底座的一侧。
在一种实施方式中，准直透镜包括透镜本体和多个准直单元，透镜本体与光窗连接，多个准直单元均设置于透镜本体，激光光源组件的数量为多个，每个激光光源组件对应一个准直单元。
相较于现有技术，本实用新型实施例提供的激光封装装置，本实用新型提供的激光封装装置，光源安装部和支撑部一体设置，简化了底座的制作工艺，另外，引线的第一端设置于收容腔内，第二端设置于支撑部的底面，利于减小底座的尺 寸，实现激光封装装置的小型化。
本实用新型的这些方面或其他方面在以下实施例的描述中会更加简明易懂。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本实用新型提供的激光封装装置的结构示意图。
图2是图1所示的激光封装装置的纵截面图。
图3是图1所示的激光封装装置沿底座的长度方向的光路图。
图4是图1所示的激光封装装置沿底座的宽度方向的光路图。
图5是图1所示的激光封装装置的多个激光光源组件的一种排布图。
图6是图5所示的激光封装装置的多个激光光源组件排布方式的俯视图。
图7是图1所示的激光封装装置的多个激光光源组件的另一种排布图。
图8是图7所示的激光封装装置的多个激光光源组件排布方式的俯视图。
具体实施方式
为了便于理解本实用新型实施例，下面将参照相关附图对本实用新型实施例进行更全面的描述。附图中给出了本实用新型的较佳实施方式。但是，本实用新型可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本实用新型的公开内容理解的更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本实用新型的技术领域的技术人员通常理解的含义相同。本文中在本实用新型实施例中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本实用新型。
请参阅图1和图2，本实用新型提供一种激光封装装置1，包括底座10、激光光源组件30、引线50和光窗60，底座10包括光源安装部11和支撑部13，光源安装部11和支撑部13一体设置，并且与支撑部13配合形成收容腔15，支撑部13包括顶面132和底面134；激光光源组件30收容于收容腔15内，并设置于光源安装部11，激光光源组件30用于发射激光；引线50穿设于支撑部13，引线50包括相对的第一端52和第二端54，第一端52设置于收容腔15内，用于与激光光源组件30电连接，第二端54设置于底面134；光窗60盖设于顶面132，以密封收容腔15，激光经光窗60出射。
在本实施例中，底座10大致为敞口的长方体形壳体结构，底座10具有长度方向和宽度方向。另外，底座10还具有高度方向，长度方向、宽度方向和高度方向两两垂直。在其他实施方式中，底座10还可以是敞口的圆柱形等其它形状。底座10可以用于安装激光光源组件30和光窗60等结构。在本实施例中，底座10由陶瓷材料制成，例如，氧化铝或氮化铝陶瓷，陶瓷材料的成本低，能够降低激光封装装置1的成本。在其他实施方式中，底座10还可以由铜材制成，以提升底座的导热性能，例如无氧铜或钨铜等。
底座10包括光源安装部11和支撑部13，光源安装部11可以用于安装激光光源组件30，支撑部13可以用于支撑光窗60。在本实施例中，光源安装部11和支撑部13一体设置，能够简化底座10的制作工艺，从而简化激光封装装置1的制作工艺，例如，底座10的光源安装部11和支撑部13可以通过一体烧结工 艺制成。
光源安装部11大致为矩形板状结构，光源安装部11可以与支撑部13配合形成收容腔15，其中，收容腔15可以用于收容激光光源组件30。
光源安装部11包括内表面112，内表面112位于顶面132和底面134之间，内表面112可以用于设置激光光源组件30，例如，激光光源组件30可以通过导热胶粘接于内表面112。光源安装部11还包括外表面114，外表面114与内表面112相背。在本实施例，外表面114与支撑部13的底面134共面，以增加底座10与桌面等支撑表面的接触面积，使得激光封装装置1能够稳定放置于支撑表面。
支撑部13大致为矩形框体结构，支撑部13围绕光源安装部11设置。支撑部13还包括侧面136，侧面136连接于顶面132和底面134之间，侧面136与光窗60的部分外表面114平齐，即，支撑部13的长度可以等于光窗60的长度，支撑部13的宽度可以等于光窗60的宽度，提升了激光封装装置1的外观一致性，也利于激光封装装置1的小型化。支撑部13的长度和宽度分别为为矩形框体的长度和宽度，光窗60大致为矩形板体结构，光窗60的长度和宽度分别为矩形板体的长度和宽度。支撑部13还包括台阶面138(图1)，台阶面138位于顶面132和内表面112之间，可以用于设置引线50。在本实施例中，台阶面138的数量为两个，两个台阶面138相互平齐，并且设置于激光光源的两侧。
请参阅图3和图4，激光光源组件30收容于收容腔15内，并设置于光源安装部11，例如，激光光源组件30安装于光源安装部11的内表面112。激光光源组件30用于发射激光。
激光光源组件30包括激光芯片32和反射件34，其中，激光芯片32用于发射激光，激光芯片32与引线50(图2)电连接，例如，激光芯片32可以与引线 50电连接，再通过引线50与电源连接，以使电源可以对激光芯片32供电。在本实施例中，激光芯片32包括两个发射源321，每个发射源321用于发射激光，两个发射源321可以增加激光的出射面积及出光强度。在其他实施方式中，激光芯片32还可以包括单个发射源321或者三个以上的发射源321。反射件34设置于激光的光路上，用于将入射的激光反射至光窗60。本实施例中，反射件34包括反射面341，反射面341与激光芯片32的出光口相对，并且反射面341与光源安装部11的内表面112成45°夹角，使得激光芯片32出射的激光经过反射面341反射后能够沿着激光封装装置1的顶部出射，实现顶出光，例如激光沿竖直方向自激光封装装置1的顶部出射。在其他实施方式中，可以通过改变反射面341与光源安装部11的内表面112之间的夹角，控制激光从激光封装装置1的出射方向。
在本实施例中，反射件34为反射棱镜，反射棱镜的纵截面大致呈梯形，其中，纵截面指的是沿垂直于底座10的长度方向对反射棱镜进行截取获得的平面。在其他实施方式中，反射件34还可以是三棱柱形，或者呈矩形板状结构，例如，反射件34可以是平面反射镜，当然，反射件34还可以是其他形状，具有将入射的激光反射至光窗60的作用即可。
本实施例中，激光光源组件30还包括热沉36，热沉36设置于光源安装部11的内表面112，激光芯片32设置于热沉36远离内表面112的一侧，热沉36用于对激光芯片32进行散热。例如，激光芯片32散发的热量可以通过热沉36传递至底座10，再通过底座10与外界环境进行热交换，实现激光芯片32的散热。在本实施例中，热沉36的数量与激光芯片32的数量相等，即，一个激光芯片32通过对应的一个热沉36设置于光源安装部11。在其他实施方式中，热沉36的数 量与激光芯片32的数量不相等，例如，多个激光芯片32可以共用一个热沉36进行散热。
在本实施例中，激光光源组件30的数量为多个，多个激光光源组件30间隔设置。多个激光光源组件30可以增加激光封装装置1的出光强度，以满足对出光强度的需求。在本实施例中，激光光源组件30的数量为四个。在其他实施方式中，激光光源组件30的数量还可以是两个、三个、五个或者更多个。
请参阅图5和图6，多个激光光源组件30沿底座10的长度方向间隔设置，每个激光光源组件30的激光芯片32和反射件34沿底座10的宽度方向设置。在本实施例中，多个激光光源组件30沿底座10的长度方向呈单排设置。在其他实施方式中，多个激光光源组件30还可以呈双排或者多排设置，具体可以根据实际需求设定，此处不进行限定。
在本实施例中，沿底座10的长度方向，多个激光芯片32形成一排，多个反射件34形成另一排，即，每个激光光源组件30的激光芯片32和反射件34的排布方向相同，使得激光光源组件30的生产操作方便，生产效率高。例如，通过某工序完成任一反射件34或者激光芯片32的安装后，再通过重复工序即可完成其他多个反射件34或者其他多个激光芯片32的安装。
请参阅图7和图8，在一种实施方式中，沿底座10的长度方向，每相邻两个反射件34之间设有一个激光芯片32，即，每相邻两个激光芯片32之间设有一个反射件34，反射件34和激光芯片32沿底座10的长度方向依次间隔设置，相邻两个激光光源组件30的激光芯片32和反射件34的排布方向相反。例如，第一个激光光源组件30为正放，第二个激光光源组件30为倒放，第三个激光光源组件30为正放，以此类推。以图8所示的视角为例，定义正放为反射件34位于激 光芯片32的上端，则倒放为反射件34位于激光芯片32的下端，定义从左至右的方向依次为第一个激光光源组件30、第二个激光光源组件30、第三个激光光源组件30。
与每个激光光源组件30的激光芯片32和反射件34的排布方向相同相比，相邻两个激光光源组件30的激光芯片32和反射件34的排布方向相反，增大了相邻两个激光芯片32之间的间距，使得多个激光芯片32的分布较为分散，多个激光芯片32散发的热量也就分布于更大的面积，即，扩大了热传递通道，从而减小了多个激光芯片32的热阻，激光芯片32散发的热量更容易通过底座10传递到外界环境，降低激光芯片32的温度，延长激光芯片32的使用寿命。
在本实施例中，沿底座10的宽度方向，任一激光光源组件30的激光芯片32与相邻激光光源组件30的反射件34错开设置，以增加相邻两个激光芯片32在底座10的宽度方向的间距，进一步扩大了热传递通道，激光芯片32散发的热量更容易通过底座10传递到外界环境，降低激光芯片32的温度，延长激光芯片32的使用寿命。需要说明的是，任一激光光源组件30的激光芯片32与相邻激光光源组件30的反射件34错开设置，需要在空间上保证激光自光窗的出光位置及出光光路不发生改变。
请参阅图2和图3，引线50穿设于支撑部13，例如，引线50可以设置于底座10的胚体内部，在对底座10的胚体进行烧结的同时，可以将引线50固设于支撑部13的内部，其中，底座10的胚体指的是底座10在烧结前的结构。引线50的材质可以是铜等熔点较高的金属。
引线50包括相对的第一端52和第二端54，第一端52设置于收容腔15内，用于与激光芯片32电连接，例如，引线50的第一端52设置于台阶面138，第二 端54设置于底面134。引线50自收容腔15内引出至支撑部13的底面134，使得支撑部13的侧面136可以与光窗60的外表面114平齐，以减小底座10的尺寸，使得激光封装装置1成为一种SMD(Surface Mounted Devices，表面贴装器件)产品结构。
第一端52设有线路层521，线路层521可以设置于台阶面138。第二端54设有线路焊盘541，线路焊盘541可以设置于底面134，用于电源线的焊接，具有与电源进行电连接的作用，即，激光芯片32可以通过线路焊盘541与电源电连接，使得电源可以对激光芯片32供电。
在本实施例中，引线50的数量为两条，即，线路层521和线路焊盘541的数量均为两个，两个线路层521分别设置于两个台阶面138，两个线路层521分别与每个激光芯片32的正负极电连接；两个线路焊盘541分别与电源的正负极电连接。
光窗60盖设于顶面132，以密封收容腔15，并将激光光源组件30密封。经由反射件34反射的激光从光窗60出射。
光窗60设置于支撑部13的顶面132，以密封收容腔15，从而在不影响激光光束出射的情况下保护收容腔15内的激光光源组件30。本实施例中，光窗60大致为矩形结构，以与矩形框体结构的支撑部13适应。在其他实施方式中，当支撑部13为圆柱形时，光窗60也可以是圆形结构。光窗60的材料可以是光学玻璃，也可以是蓝宝石等其他透光材料。光窗60可以为全透明结构。在其它实施方式中，光窗60也可以为部分透明结构，即，光窗60大致为矩形环状结构或者圆环状结构。例如，与激光芯片32对应的区域设置透明区，其它区域设置非透明区，使得光窗60具有类似光阑的作用，从而光窗60在出射激光的同时，还 具有对光斑整形的作用。
请继参阅图2和图3，激光封装装置1还可以包括准直透镜80，准直透镜80设置于光窗60远离底座10的一侧。准直透镜80可以对激光光源组件30发射的激光进行准直，从而提高激光的成像质量。准直透镜80可以粘结于光窗60，例如，可以通过UV(Ultraviolet Rays，紫外线)固化胶或者是其它对玻璃类材料具有良好粘接性能、且应力较小的热固化胶或者其他黏胶粘接于光窗60。
准直透镜80包括透镜本体81和多个准直单元83，透镜本体81与光窗60连接，例如，透镜本体81可以通过UV固化胶与光窗60粘接。多个准直单元83均凸设于透镜本体81，多个准直单元83可以与透镜本体81一体设置。每个准直单元83对应一个激光光源组件30，使得每个激光芯片32发出的激光都可以被对应的准直单元83准直。在本实施例中，准直单元83的数量与激光光源组件30的数量相等，例如，准直单元83为四个，四个准直单元83沿底座10的长度方向依次设置。当激光光源组件30为多排时，多个准直单元83也可以呈多排设置，满足每个准直单元83对应一个激光光源组件30的目的即可。
激光封装装置1还包括多根金线90，每根金线90均连接于激光芯片32和线路层521之间，例如，每根金线90的相对两端分别与激光芯片32和线路层521焊接。在本实施例，每个激光芯片32与两根金线90连接，当激光芯片32的数量为四个时，金线90的数量为八根，其中四根金线90分别连接于四个激光芯片32的正极和其中一个线路层521之间，另外四根金线90分别连接于四个激光芯片32的负极和另一个线路层521之间。
综上，本实用新型提供的激光封装装置1，光源安装部11和支撑部13一体设置，简化了底座10的制作工艺，从而简化激光封装装置1的制作工艺；另外， 引线50的第一端52设置于收容腔15内，第二端54设置于支撑部13的底面134，使得支撑部13的侧面136可以与光窗60的外表面114平齐，利于减小底座10的尺寸，实现激光封装装置1的小型化。沿底座10的宽度方向，任一激光光源组件30的激光芯片32与相邻激光光源组件30的反射件34错开设置，增加了相邻两个激光芯片32在底座10的宽度方向的间距，增大了热传递通道，激光芯片32散发的热量更容易通过底座10传递到外界环境，降低了激光芯片32的温度，延长了激光芯片32的使用寿命。
以上所述实施例仅表达了本实用新型的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本实用新型专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干变形和改进，这些都属于本实用新型的保护范围。因此，本实用新型专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种激光封装装置，其特征在于，包括：
    底座，所述底座包括光源安装部和支撑部，所述光源安装部和所述支撑部一体设置，并且与所述支撑部配合形成收容腔，所述支撑部包括顶面和底面；
    激光光源组件，所述激光光源组件收容于所述收容腔内，并设置于所述光源安装部，所述激光光源组件用于发射激光；
    引线，所述引线穿设于所述支撑部，所述引线包括相对的第一端和第二端，所述第一端设置于所述收容腔内，用于与所述激光光源组件电连接，所述第二端设置于所述底面；以及
    光窗，所述光窗盖设于所述顶面，以密封所述收容腔，所述激光经所述光窗出射。
  2. 根据权利要求1所述的激光封装装置，其特征在于，所述支撑部还包括侧面，所述侧面连接于所述顶面和所述底面之间，所述侧面与所述光窗的部分外表面平齐。
  3. 根据权利要求1所述的激光封装装置，其特征在于，所述光源安装部包括内表面，所述内表面位于所述顶面和所述底面之间，所述激光光源组件设置于所述内表面，所述支撑部还包括台阶面，所述台阶面位于所述顶面和所述内表面之间，所述引线的第一端设置于所述台阶面。
  4. 根据权利要求1所述的激光封装装置，其特征在于，所述激光光源组件包括激光芯片和反射件，所述激光芯片与所述引线的第一端电连接，所述激光芯片包 括两个发射源，每个所述发射源用于发射所述激光，所述激光经所述反射件反射至所述光窗。
  5. 根据权利要求4所述的激光封装装置，其特征在于，所述激光光源组件的数量为多个，多个所述激光光源组件间隔设置。
  6. 根据权利要求5所述的激光封装装置，其特征在于，所述底座具有长度方向和宽度方向，多个所述激光光源组件沿所述底座的长度方向间隔设置，每个所述激光光源组件的所述激光芯片和所述反射件沿所述底座的宽度方向设置，沿所述底座的长度方向，每相邻两个所述反射件之间设有一个所述激光芯片。
  7. 根据权利要求6所述的激光封装装置，其特征在于，沿所述底座的宽度方向，任一所述激光光源组件的所述激光芯片与相邻所述激光光源组件的所述反射件错开设置，以增加相邻两个所述激光芯片在所述底座的宽度方向的间距。
  8. 根据权利要求1所述的激光封装装置，其特征在于，所述底座由陶瓷材料制成。
  9. 根据权利要求1-8任一项所述的激光封装装置，其特征在于，所述激光封装装置还包括准直透镜，所述准直透镜设置于所述光窗远离所述底座的一侧。
  10. 根据权利要求9所述的激光封装装置，其特征在于，所述准直透镜包括透镜本体和多个准直单元，所述透镜本体与所述光窗连接，多个所述准直单元均设置于所述透镜本体，所述激光光源组件的数量为多个，每个所述激光光源组件 对应一个所述准直单元。
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