WO2023092290A1 - Read only memory circuit, read only memory, and electronic device - Google Patents
Read only memory circuit, read only memory, and electronic device Download PDFInfo
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- WO2023092290A1 WO2023092290A1 PCT/CN2021/132478 CN2021132478W WO2023092290A1 WO 2023092290 A1 WO2023092290 A1 WO 2023092290A1 CN 2021132478 W CN2021132478 W CN 2021132478W WO 2023092290 A1 WO2023092290 A1 WO 2023092290A1
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- 238000003860 storage Methods 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims description 29
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- 238000010586 diagram Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000013500 data storage Methods 0.000 description 4
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- 230000005669 field effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/08—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
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- the present application relates to the technical field of storage, in particular to a read-only storage circuit, a read-only memory and electronic equipment.
- Read-only memory is a semiconductor memory that works in a non-destructive readout mode, and can only read but not write information.
- the data stored in ROM is usually written in the chip manufacturing process. Once the information is written, it will be fixed. Even if the power is cut off, the information will not be lost, and the structure is relatively simple and easy to use. Therefore, it is often used to store various fixed programs and data. .
- the stored data of the mask type read-only memory (mask ROM) is programmed by the integrated circuit manufacturer, that is, factory programmed, and the stored data is provided by the customer to the manufacturer, and the data is converted into a custom mask layer. It ends up being stored in how certain metal wires are connected.
- FIG. 1 is a memory circuit diagram of a mask ROM (hereinafter referred to as ROM) provided in the related art
- FIG. 2 is a memory cell layout corresponding to FIG. 1 .
- ROM mask ROM
- FIG. 1 and Figure 2 in this ROM, it is necessary to insert a dummy (dummy) MOS between every two MOS (metal oxide semiconductor field effect transistor), as shown in Figure 1 in NMOS0 Inserting NMOSd between NMOS1 and NMOS1 will result in waste of memory cell area.
- two metal signal lines (bit line BL (bit line) and ground line VSS) need to be arranged above each row of MOS, which will also cause a waste of memory cell area.
- Embodiments of the present application provide a read-only memory circuit, a read-only memory, and an electronic device, which can reduce the area of a memory unit.
- An embodiment of the present application provides a read-only memory circuit, including a transistor array, a switch circuit, multiple word lines, multiple bit lines, and a ground line.
- the transistor array includes a plurality of transistors; wherein, in the transistor array: a plurality of transistors in the same row are connected in series in sequence, the gates of the plurality of transistors in the same column are connected to the same word line, and a plurality of bit lines are respectively connected to transistors in different rows One-to-one correspondence settings.
- the plurality of bit lines are connected to the ground line through the switch circuit.
- the transistor array includes: a first transistor and a second transistor located in the same column and respectively located in two adjacent rows; the plurality of bit lines include the first bit line and the second bit line; the first bit line and the first transistor are located
- the multiple transistors in the row correspond to each other, and the second bit line corresponds to the multiple transistors in the row where the second transistor is located.
- the first pole of the first transistor is connected to the first bit line
- the second pole of the first transistor is connected to the second pole of the second transistor
- the first pole of the second transistor is connected to the second bit line.
- the first pole of the first transistor is connected to the first bit line
- the second pole of the first transistor is connected to the second bit line through the second transistor.
- the first transistor and the second transistor control the connection between the second bit line and the ground line through the switch circuit, so that the high potential stored on the first bit line can be pulled down to a low potential through the second bit line, and then the second bit line can be controlled to a low potential. Reading of a "0" signal in a transistor.
- each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; connection, the bit line corresponding to the next row of transistors can be connected to the ground wire, which can be used as the ground wire of the previous row of transistors to meet the storage requirements; and only the ground wire needs to be set separately for the last row of transistors to meet its storage requirements; it is equivalent to saving About half (50%) of the ground wire is removed, so that the area of the memory cell can be further reduced, and the density of the transistor array constrained by the metal line can be increased.
- the transistor array further includes: a third transistor and a fourth transistor located in the same column and respectively located in two adjacent rows.
- the multiple bit lines include a third bit line and a fourth bit line; the third bit line corresponds to the multiple transistors in the row where the third transistor is located, and the fourth bit line corresponds to the multiple transistors in the row where the fourth transistor is located.
- the first pole of the third transistor is connected to the first pole of the fourth transistor, and the second pole of the third transistor is connected to the second pole of the fourth transistor. In this case, neither the first pole nor the second pole of the third transistor is connected to the corresponding bit line, so that when the third transistor is turned on through the word line, the stored high potential on the bit line will not changes, enabling the reading of a "1" signal.
- the multiple bit lines include a fifth bit line
- the fifth bit line corresponds to the last row of transistors in the transistor array.
- the last row of transistors includes a fifth transistor; the first pole of the fifth transistor is connected to the fifth bit line or the ground line; the second pole of the fifth transistor is connected to the fifth bit line or the ground line.
- the first pole and/or the second pole of some or all of the transistors are selectively connected to the ground to meet actual storage requirements.
- the start terminals or ends of the plurality of transistors arranged in series in each row of the transistor array are connected to corresponding bit lines.
- the connection mode of the other end (ie, drain or source) of each transistor is sequentially set.
- the transistor array includes n rows of transistors, where n is less than or equal to 32; thereby avoiding the potential impact on the subsequent bit lines due to the excessive number of bit lines located in the previous row, To ensure accurate readout of the stored data in each row of transistors.
- transistors, bit lines, ground lines, and intermediate connection lines between transistors in adjacent rows are distributed on the first metal layer; multiple bit lines and ground lines are distributed on the second metal layer; the first The metal layer is located between the plurality of transistors and the second metal layer; the bit line and the ground line extend along the row direction of the transistor array; the intermediate connection line extends along the column direction of the transistor array; The location is right.
- the position of the ground line is directly opposite to the position of the last row of transistors in the transistor array.
- the bit line corresponding to the last row of transistors is the fifth bit line; the ground line is located on a side of the fifth bit line away from the transistor array.
- the present application provides a read-only memory circuit, comprising: m rows and n columns of a plurality of transistors arranged in an array, m bit lines, n word lines and ground lines; m and n are both positive integers greater than or equal to 1 .
- Transistors in the same row are sequentially connected in series.
- the n word lines are respectively connected to the gates of the n columns of transistors in a one-to-one correspondence.
- the source of the transistor in the i-th row is connected to the i-th bit line, or connected to the source of the transistor in the same column in the i+1-th row.
- the drain of the transistor in the i-th row is connected to the i-th bit line, or connected to the drain of the transistor in the same column in the i+1-th row; 1 ⁇ i ⁇ m-1, and i is a positive integer.
- the sources of the transistors in the mth row are connected to the mth bit line or the ground line.
- the drains of the transistors in the mth row are connected to the mth bit line or the ground line.
- each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; and by setting the connection between two adjacent rows of transistors, it can
- the bit line corresponding to the next row of transistors is connected to the ground wire as the ground wire of the previous row of transistors to meet the storage requirements; and only the ground wire needs to be set separately for the last row of transistors to meet its storage requirements; it is equivalent to saving about half ( 50%) of the ground line, so that the area of the memory cell can be further reduced, and the density of the transistor array constrained by the metal line can be increased.
- the start terminals or ends of the multiple transistors arranged in series in m rows are all connected to the bit line.
- the connection mode of the other end (ie drain or source) of each transistor is sequentially set by fixing the start or end (ie source or drain) of the transistors in each row and according to the requirement of storing data.
- the storage circuit further includes a switch circuit; the m bit lines are connected to the ground line through the switch circuit; the switch circuit is configured to control the connection between each bit line and the ground line.
- the m bit lines are connected to the ground line through the switch circuit, and the on-off between each bit line and the ground line VSS is controlled by the switch circuit to meet the storage requirement.
- n is less than or equal to 32; thus, it is possible to avoid the influence on the potential of the subsequent bit lines due to the excessive number of bit lines located in the previous row, so as to ensure the storage data in each row of transistors for an accurate readout.
- sources and drains of multiple transistors, bit lines, ground lines, and intermediate connection lines between transistors in adjacent rows are distributed on the first metal layer.
- the m bit lines and ground lines are distributed on the second metal layer.
- the first metal layer is located between a plurality of transistors arranged in an array of m rows and n columns and the second metal layer.
- the bit lines and ground lines extend in the row direction.
- the intermediate connection lines extend along the column direction. The position of the i-th bit line is directly opposite to the position of the transistor in the i-th row.
- the position of the ground line is directly opposite to the position of the transistor in the mth row.
- the ground line is located on a side of the m-th bit line away from the m-1-th bit line.
- the embodiment of the present application also provides a method for reading a storage circuit as provided in any one of the aforementioned possible implementation manners, the reading method may include: precharging the 1st, 2nd, ..., x bit lines , and control the x+1, x+2,...,m bit lines to be connected to the ground line; among them, 1 ⁇ x ⁇ m, and x is a positive integer; input the start signal to the yth word line to turn on the y column transistors, and read the stored data in the transistors located in the xth row and yth column through the xth row bit line; wherein, 1 ⁇ y ⁇ n, and y is a positive integer.
- An embodiment of the present application also provides a read-only memory, including a controller and a storage circuit as provided in any one of the foregoing possible implementation manners; the controller is connected to the storage circuit.
- An embodiment of the present application further provides an electronic device, including a printed circuit board and a read-only memory provided in any of the foregoing possible implementation manners; the read-only memory is connected to the printed circuit board.
- Fig. 1 is a kind of storage circuit provided in the related art
- FIG. 2 is a schematic diagram of the layout of the storage circuit corresponding to FIG. 1;
- FIG. 3 is a storage circuit provided by an embodiment of the present application.
- FIG. 4 is a storage circuit provided by an embodiment of the present application.
- FIG. 5 is a reading method of a storage circuit provided by an embodiment of the present application.
- FIG. 6 is a schematic layout diagram of a memory circuit provided by an embodiment of the present application.
- FIG. 7 is a schematic layout diagram of a memory circuit provided by an embodiment of the present application.
- At least one (item) means one or more, and “multiple” means two or more.
- “And/or” is used to describe the association relationship of associated objects, indicating that there can be three types of relationships, for example, “A and/or B” can mean: only A exists, only B exists, and A and B exist at the same time , where A and B can be singular or plural.
- the character “/” generally indicates that the contextual objects are an “or” relationship.
- At least one of the following” or similar expressions refer to any combination of these items, including any combination of single or plural items.
- At least one item (piece) of a, b or c can mean: a, b, c, "a and b", “a and c", “b and c", or "a and b and c ", where a, b, c can be single or multiple.
- An embodiment of the present application provides an electronic device, which includes a printed circuit board (printed circuit board, PCB) and a read-only memory (ROM) connected to the printed circuit board.
- PCB printed circuit board
- ROM read-only memory
- the electronic device may be electronic products such as a mobile phone, a tablet computer, a notebook, a vehicle computer, a smart watch, and a smart bracelet.
- the above-mentioned read-only memory is provided with a controller and a read-only storage circuit (also referred to simply as a storage circuit) connected to the controller. data to be read out.
- a controller and a read-only storage circuit (also referred to simply as a storage circuit) connected to the controller. data to be read out.
- a dummy storage unit (NMOSd) needs to be set between every two adjacent storage units (NMOS0, NMOS1), and two metal signal lines need to be arranged above the storage unit (Bit line BL, ground line VSS), the storage circuit adopted in the read-only memory that the embodiment of the present application provides, saves the dummy memory cell (equivalent to saving the quantity of 1/3 transistor), and does not need to Each row of memory cells is connected to the ground line VSS (equivalent to saving about 1/2 of the ground line), so that the area of the memory cells can be reduced.
- the embodiment of the present application provides a read-only memory circuit, which includes a transistor array, and in the transistor array, a plurality of transistors arranged in an array in m rows and n columns, that is, the read-only
- the storage circuit is provided with m*n transistors (that is, storage cells) arranged in a matrix; wherein, the transistor located in the xth row and the yth column is denoted as Nx_y.
- x, y, m, and n are all positive integers greater than or equal to 1, and 1 ⁇ x ⁇ m, 1 ⁇ y ⁇ n.
- the above-mentioned transistor may be a metal oxide semiconductor field effect transistor (MOSFET), which may be referred to as a MOS transistor for short.
- MOSFET metal oxide semiconductor field effect transistor
- the MOS transistor may be an NMOS transistor or a PMOS transistor, which is not limited in this application.
- the transistor used in the read-only memory circuit is an NMOS transistor as an example for illustration.
- the embodiment of the present application does not clearly distinguish the source s and drain d of the transistor, and the source s and drain d can be reversed, that is, the source s and drain d are equivalent Two poles; that is to say, among the two poles (first pole and second pole) of the transistor except the gate, one is the source s and the other is the drain d; for example, the first pole is the source s, Then the second pole is the drain d; the first pole is the drain d, and the second pole is the source s.
- the embodiment of the present application defines the source s and the drain d of each transistor according to the relative position in the transistor array, and the embodiment of the present application defines each transistor on the same side as Electrodes are defined as electrodes of the same type (ie source or drain). For example, referring to Fig. 3, it is possible to define the left electrode of each transistor as source s, and the right electrode as drain d; for another example, it is possible to define the left electrode of each transistor as drain d, then the right electrode For the source s. In the following embodiments, the left electrode of each transistor is the source s, and the right electrode is the drain d as an example for schematic illustration.
- the read-only memory circuit includes m bit lines BL, n word lines WL (word line), ground line VSS, and a switch circuit C on the basis of the aforementioned transistor array.
- the m bit lines BL can be respectively expressed as BL1, BL2, . . . , BLm; the n word lines WL can be respectively expressed as WL1, WL2, . . . , WLn.
- n transistors ie Nx_1, Nx_2, ..., Nx_n
- the drain d of the former transistor is electrically connected to the source s of the latter transistor.
- the m bit lines BL are arranged in one-to-one correspondence with the m rows of transistors.
- bit line BL1 is set corresponding to the transistors in the first row in the transistor array, so as to read the stored data in the transistors in the first row through the bit line BL1;
- bit line BL2 is set corresponding to the transistors in the second row in the transistor array, so as to pass The bit line BL2 reads the data stored in the transistors of the second row.
- the n word lines WL are arranged in one-to-one correspondence with the n columns of transistors in the transistor array, and the gates of the m transistors (ie N1_y, N2_y, ..., Nm_y) in the same column are connected to the gates of the same word
- the transistors in different columns are connected to different word lines. That is, n word lines ( WL1 , WL2 , . . . , WLn) are connected to gates of n columns of transistors in a one-to-one correspondence.
- the word line WL1 is connected to the gates of the m transistors in the first column
- the word line WL2 is connected to the gates of the m transistors in the second column, and so on.
- the m bit lines BL are connected to the ground line VSS through the switch circuit C, so as to control the connection between each bit line BL and the ground line VSS through the switch circuit C.
- the switch circuit C may include m switches (K1, K2, ..., Km), and the m bit lines BL are respectively connected to the ground line VSS through different switches, so that by controlling each switch , which can realize the on-off between each bit line BL and the ground line VSS.
- a switch is provided between each bit line BL and the ground line VSS in the switch circuit C as an example, but the present application is not limited thereto.
- a switch may be provided between the corresponding part of the bit line BL and the ground line VSS, for example, no switch may be provided between the first BL1 and the ground line VSS, only for the second A switch is provided between the bit line to the mth bit line and the ground line VSS.
- bit lines BL are connected to the ground line VSS through the switch circuit C on the basis of , in the transistors located in two adjacent rows, by connecting the transistors in the previous row to the transistors in the next row, the bit line corresponding to the transistors in the latter row can be connected to the ground wire, and can be used as the ground wire of the transistors in the previous row, To meet the storage requirements of the previous row of transistors.
- the connection between the transistors in each row, the bit line and the ground line in the read-only memory circuit of the present application will be described in detail below.
- the source s of any row (i-th row) transistor can be connected to the transistor corresponding to the row
- the bit line (BLi) can also be connected to the source s of the transistor in the same column in the next row (row i+1); wherein, 1 ⁇ i ⁇ m-1, and i is a positive integer.
- the drain d of the transistor in the i-th row can be connected to the i-th bit line BLi, or can be connected to the drain d of the transistor in the same column in the i+1-th row.
- both the source s and the drain d of the transistor Nx_y are connected to the corresponding bit line BLx.
- the source s and the drain d of the transistor Nx_y are respectively connected to the source s and the drain d of the transistor N(x+1_y) located in the next row and the same column.
- the source s of the transistor Nx_y is connected to the corresponding bit line BLx, and the drain d of the transistor Nx_y is connected to the drain d of the transistor N(x+1_y) in the next row and the same column.
- the source s of the transistor Nx_y is connected to the source s of the transistor N(x+1_y) in the next row and the same column, and the drain d of the transistor Nx_y is connected to the corresponding bit line BLx.
- connection mode of the source s and the drain d of the transistor directly determines the stored data ("0" or "1") in the transistor, so it can be stored according to the actual storage requirements. , to set the connection mode of the source s and the drain d of the transistor, so as to ensure that each transistor can satisfy the storage of "0" or "1".
- connection mode of the source s (or drain d) of the transistor can be fixed, and the drain d (or drain d) of the transistor can be set according to the storage requirement ("0" or "1") source s) connection.
- the start terminals of multiple transistors arranged in series in m rows to be connected to the bit line corresponding to the row; that is, the first column transistor (ie Nx_1)
- the source s of the row is connected to the bit line BLx corresponding to the row.
- the connection mode of the drain of the transistor in the first column is set according to the storage requirement of the transistor in the first column (ie, Nx_1), and the connection mode of the drain of the transistor in the first column (ie, Nx_1) is set.
- the connection mode of the drains of the 2 columns of transistors (ie Nx_2) is to meet the requirement of the second transistor for storing data, and so on, and the connection mode of the drains of the subsequent transistors can be designed sequentially from left to right.
- the ends of multiple transistors arranged in series in m rows to be connected to the bit line corresponding to the row; that is, the drain of the transistor in the nth column (ie, Nx_n) is connected to On the bit line BLx corresponding to the row.
- the connection mode of the source of the transistor in the nth column according to the storage requirement of the transistor in the nth column, and set the connection mode of the source of the previous transistor according to the connection mode of the drain of the transistor in the nth column , to meet the requirement of the previous transistor for storing data, and so on, the connection mode of the source of the subsequent transistor can be designed in turn from right to left.
- the data storage of the read-only memory circuit will be described in combination with the connection manner of the source and drain of the specific transistors.
- the source s of the transistor in the first column that is, Nx_1
- the bit line BLx corresponding to the row as an example.
- the switch circuit C is not shown in Fig. 4, and the connection of the switch circuit C can refer to Fig. 3.
- Transistor N1_1 (also called the first transistor) and the transistor N1_2 (also called the second transistor) located in the same column and located in two adjacent rows in FIG. 4 as an example.
- Transistor N1_1 stores "0".
- the first transistor and the second transistor do not refer to specific two transistors, and the first transistor and the second transistor may be any two transistors located in the same column and respectively located in two adjacent rows in the transistor array.
- the source of the transistor N1_1 (ie node r1c1 ) is fixedly connected to the bit line BL1 .
- the drain of transistor N1_1 (that is, node r1c2) can be connected to the drain of transistor N2_1 (that is, node r2c2), so that when transistor N1_1 and transistor N2_1 are turned on through word line WL2, node r1c2 Equipotential with the bit line BL2, through the switch circuit C to control the connection between the bit line BL2 and the ground line VSS, so that the high potential stored on the bit line BL1 can be pulled down to a low potential (for the specific control method, please refer to the relevant content below), and then can Realize the reading of "0" signal.
- transistor N1_1 ie node r1c1
- the drain of transistor N1_1 ie node r1c2
- bit line BL1 bit line BL1
- the transistor N1_2 also called the third transistor
- the transistor N2_2 also called the fourth transistor located in the same column and located in two adjacent rows respectively
- “1” is stored in the transistor N1_2 as an example.
- the third transistor and the fourth transistor do not refer to two specific transistors, and the third transistor and the fourth transistor may be any two transistors located in the same column and respectively located in two adjacent rows in the transistor array.
- the source of the transistor N1_2 (ie, the node r1c1) is fixedly connected to the node r2c2.
- the drain of transistor N1_2 (ie, node r1c3) can be connected to the drain of transistor N2_2 (ie, node r2c3), in which case neither the source nor the drain of transistor N1_2 is connected to the bit line BL1 In this way, when the transistor N1_2 and the transistor N2_2 are turned on through the word line WL2, the high potential stored on the bit line BL1 will not change, so that the reading of the "1" signal can be realized.
- the source of transistor N1_2 ie, node r1c1
- the drain of transistor N1_2 ie, node r1c3
- bit line BL1 the node r1c2
- the switch circuit C can control the connection between the bit line BL2 and the ground line VSS, so that the data stored on the bit line BL1 can be The high potential is pulled down to the low potential, and then the reading of "0" signal can be realized.
- the source of the transistor N2_3 (ie node r2c3) is fixedly connected to the bit line BL2.
- the drain of the transistor N2_3 (that is, the node r2c4) can also be connected to the bit line BL2, so that when the transistor N2_3 is turned on through the word line WL3, the bit The stored high potential on the line BL2 does not change, so that a "1" signal can be read.
- the drain of the transistor N2_3 (that is, the node r2c4) can be connected to the drain of the transistor N3_3 (that is, the node r3c4), so that the transistor N2_3 is turned on through the word line WL3
- the node r2c4 has the same potential as the bit line BL3
- the switch circuit C controls the bit line BL3 to be connected to the ground line VSS, so that the high potential stored on the bit line BL2 can be pulled down to a low potential, and then "0" can be realized signal reading.
- each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; and by arranging two adjacent rows of transistors
- the connection between the transistors in the next row can be connected to the ground wire corresponding to the bit line and used as the ground wire of the previous row of transistors to realize the storage requirement; it is equivalent to saving about half (50%) of the ground wire, which can further reduce the
- the area of the storage unit is small, and the density of the transistor array constrained by metal lines can be increased.
- the last row of transistors there is no next row of transistors, so in order to meet the storage requirements of the last row of transistors, the last row of transistors can be directly connected to the ground to meet the storage requirements.
- the source s of the transistors in the row (row m) can be connected to the The bit line (BLm; also referred to as the fifth bit line) corresponding to the transistor can also be connected to the ground line VSS.
- the drains d of the transistors in this row can be connected to the bit line (BLm) corresponding to the transistors in this row, and can also be connected to the ground line VSS.
- the reading method may include :
- Step 01. Precharge the 1st, 2nd, ..., xth bit lines (precharge), and control the x+1, x+2, ..., mth bitlines BL to communicate with the ground line VSS.
- Step 02 Input a turn-on signal to the yth word line WLy to turn on the transistor in the yth column, and read the stored data in the transistor Nx_y in the xth row and the yth column through the xth row bit line BLx.
- bit line BL1 is precharged through step 01, that is, a high-level potential is input to the bit line BL1; and other The bit lines BL2, BL3, BL4 are connected to the ground line VSS. Then, through step 02, input a turn-on signal to the word line WL1 to turn on the transistor in the first column.
- the drain of the transistor N1_1 (that is, the node r1c2) is at the same potential as the bit line BL2 (that is, grounded), thereby inputting the bit line BL1
- the high level potential of is pulled down to low potential; at this time, the stored data "0" in the transistor N1_1 is read from the bit line BL1.
- step 02 input a turn-on signal to the word line WL1 to turn on the transistor in the first column.
- the drain of the transistor N3_1 ie node r3c2
- the bit line BL4 ie, grounded
- ground line VSS is separately set for the last row of transistors in the storage circuit, when reading the stored data in the last row of transistors, only all the bit lines BL1, BL2, BL3 and BL4 can be precharged, and there is no need to connect the control bit line to the ground line VSS.
- the number of rows in the transistor array can be set to be less than or equal to 32, ie n ⁇ 32.
- n can be equal to 4, 8, 16 and so on.
- the layer-to-layer distribution of the read-only memory circuit in the read-only memory will be further described below in conjunction with the layout arrangement of the above-mentioned read-only memory circuit. It should be understood here that the layout layout of the circuit is consistent with the actual distribution of devices, signal lines, etc. in the product.
- the source and drain of the transistor array can be set to connect with the bit line BL and the ground
- the line VSS and the intermediate connection line ML between transistors in adjacent rows are located on the first metal layer M1; the m bit lines BL and the ground line VSS are located on the second metal layer M1; the transistor array is distributed on the first metal layer M1 away from the second One side of the metal layer M1, that is, the first metal layer M1 is located between the transistor array and the second metal layer M2.
- the transistor array includes a plurality of film layer structures; for example, as shown in FIG. wait.
- the bit line BL and the ground line VSS located in the second metal layer M2 may extend along the row direction. That is, the i-th bit line is set at a position directly opposite to the i-th row of transistors.
- the ground line VSS can be set outside the last row (that is, the fourth row) of transistors, that is, the ground line VSS is set on the bit line BL4 is away from the side of the transistor array (or BL3).
- both the ground line VSS and the bit line BL4 (the last bit line) can be set at positions opposite to the transistors in the fourth row (the last row of transistors).
- the middle connection line ML located on the first metal layer M1 may extend in the opposite direction along the column.
- the middle connection line ML can be electrically connected to the bit line BL and the ground line VSS through the via hole VIA.
- the aforementioned storage circuit is an equivalent circuit diagram, and some electrical connections in the storage circuit can be designed as equivalent connections during fabrication. For example, the drains of all transistors in the fourth column in FIG.
- the middle connection line ML is directly connected to the ground line VSS, and this connection mode is equivalent to that of sequentially connecting the drains of the four transistors in the fourth column to the ground line in the storage circuit.
- one aforementioned read-only storage circuit can be set, and multiple aforementioned read-only storage circuits can also be set.
- the “opposite” involved in the above-mentioned embodiments does not refer to the absolute center-to-centre opposition.
- the ground line VSS and the bit line BL4 can be considered as the projection of the ground line VSS and bit line BL4 on the substrate, which has an overlapping area with the projection of the transistors in the fourth row; of course, in practice, it can be specified by setting The size of the overlapping area to ensure the minimum area of the memory cell.
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Abstract
The present application relates to the technical field of storage, and provides a read only memory circuit, a read only memory, and an electronic device. The read only memory circuit comprises a transistor array, a switch circuit, a plurality of word lines, a plurality of bit lines, and a ground line. In the transistor array: a plurality of transistors located in a same row are connected in series in sequence, gates of a plurality of transistors located in a same column are connected to a same word line, and the plurality of bit lines are respectively arranged in one-to-one correspondence to transistors in different rows. The plurality of bit lines are connected to the ground line by means of the switch circuit. The transistor array comprises: a first transistor and a second transistor located in the same column and respectively located in two adjacent rows. The plurality of bit lines comprise: a first bit line corresponding to the plurality of transistors in the row where the first transistor is located, and a second bit line corresponding to the plurality of transistors in the row where the second transistor is located. A first electrode of the first transistor is connected to the first bit line, a second electrode of the first transistor is connected to a second electrode of the second transistor, and a first electrode of the second transistor is connected to the second bit line.
Description
本申请涉及存储技术领域,尤其涉及一种只读存储电路、只读存储器及电子设备。The present application relates to the technical field of storage, in particular to a read-only storage circuit, a read-only memory and electronic equipment.
只读存储器(read only memory,ROM)是一种半导体存储器,以非破坏性读出方式工作,只能读出无法写入信息。ROM所存数据通常是芯片制造过程中写入的,信息一旦写入后就固定下来,即使切断电源,信息也不会丢失,并且结构较简单,使用方便,因而常用于存储各种固定程序和数据。其中,掩膜型只读存储器(mask ROM)的存储数据由集成电路制造商编程,即工艺厂编程(factory programmed),存储数据由客户提供给制造商,数据被转换为自定义掩模层,最终被存储在某些金属线的连接方式中。Read-only memory (ROM) is a semiconductor memory that works in a non-destructive readout mode, and can only read but not write information. The data stored in ROM is usually written in the chip manufacturing process. Once the information is written, it will be fixed. Even if the power is cut off, the information will not be lost, and the structure is relatively simple and easy to use. Therefore, it is often used to store various fixed programs and data. . Among them, the stored data of the mask type read-only memory (mask ROM) is programmed by the integrated circuit manufacturer, that is, factory programmed, and the stored data is provided by the customer to the manufacturer, and the data is converted into a custom mask layer. It ends up being stored in how certain metal wires are connected.
mask ROM在单个字节的存储面积上都更紧凑,并且成本低,从而比任何其他类型的半导体存储器更有优势。图1为相关技术中提供的一种mask ROM(下文可简称为ROM)的存储电路图,图2是对应图1的存储单元版图。如图1和图2所示,在该ROM中,需要每两个MOS(metal oxide semiconductor field effect transistor,金属氧化物半导体场效应晶体管)之间插入假(dummy)MOS,如图1中在NMOS0与NMOS1之间插入NMOSd,从而会造成存储单元的面积浪费。另外,在该ROM中,需要在每排MOS上方设置两根金属信号线(位线BL(bit line)和地线VSS),同样会造成存储单元的面积浪费。Mask ROMs are both more compact in terms of storage area per byte and at a lower cost than any other type of semiconductor memory. FIG. 1 is a memory circuit diagram of a mask ROM (hereinafter referred to as ROM) provided in the related art, and FIG. 2 is a memory cell layout corresponding to FIG. 1 . As shown in Figure 1 and Figure 2, in this ROM, it is necessary to insert a dummy (dummy) MOS between every two MOS (metal oxide semiconductor field effect transistor), as shown in Figure 1 in NMOS0 Inserting NMOSd between NMOS1 and NMOS1 will result in waste of memory cell area. In addition, in this ROM, two metal signal lines (bit line BL (bit line) and ground line VSS) need to be arranged above each row of MOS, which will also cause a waste of memory cell area.
发明内容Contents of the invention
本申请实施例提供一种只读存储电路、只读存储器及电子设备,能够减小存储单元的面积。Embodiments of the present application provide a read-only memory circuit, a read-only memory, and an electronic device, which can reduce the area of a memory unit.
本申请实施例提供一种只读存储电路,包括晶体管阵列、开关电路、多条字线、多条位线、地线。晶体管阵列包括多个晶体管;其中,在晶体管阵列中:位于同一行的多个晶体管依次串联,位于同一列的多个晶体管的栅极与同一字线连接,多条位线分别与不同行的晶体管一一对应设置。多条位线通过开关电路与地线连接。晶体管阵列中包括:位于同一列、且分别位于相邻两行的第一晶体管和第二晶体管;多条位线中包括第一位线和第二位线;第一位线与第一晶体管所在行的多个晶体管对应,第二位线与第二晶体管所在行的多个晶体管对应。第一晶体管的第一极与第一位线连接,第一晶体管的第二极与第二晶体管的第二极连接,第二晶体管的第一极与第二位线连接。An embodiment of the present application provides a read-only memory circuit, including a transistor array, a switch circuit, multiple word lines, multiple bit lines, and a ground line. The transistor array includes a plurality of transistors; wherein, in the transistor array: a plurality of transistors in the same row are connected in series in sequence, the gates of the plurality of transistors in the same column are connected to the same word line, and a plurality of bit lines are respectively connected to transistors in different rows One-to-one correspondence settings. The plurality of bit lines are connected to the ground line through the switch circuit. The transistor array includes: a first transistor and a second transistor located in the same column and respectively located in two adjacent rows; the plurality of bit lines include the first bit line and the second bit line; the first bit line and the first transistor are located The multiple transistors in the row correspond to each other, and the second bit line corresponds to the multiple transistors in the row where the second transistor is located. The first pole of the first transistor is connected to the first bit line, the second pole of the first transistor is connected to the second pole of the second transistor, and the first pole of the second transistor is connected to the second bit line.
在该只读存储电路中,第一晶体管的第一极与第一位线连接,第一晶体管的第二极通过第二晶体管连接到第二位线,在此情况下,在通过字线开启第一晶体管和第二晶体管,并通过开关电路控制第二位线与地线连通,从而能够通过第二位线能够将第一位线上存储的高电位下拉到低电位,进而能够实现对第一晶体管中“0”信号的读取。In this read-only memory circuit, the first pole of the first transistor is connected to the first bit line, and the second pole of the first transistor is connected to the second bit line through the second transistor. In this case, when the word line is turned on The first transistor and the second transistor control the connection between the second bit line and the ground line through the switch circuit, so that the high potential stored on the first bit line can be pulled down to a low potential through the second bit line, and then the second bit line can be controlled to a low potential. Reading of a "0" signal in a transistor.
另外,相比于相关技术中的只读存储电路需要在相邻存储单元之间设置假存储单元,并且需要在存储单元上方排布两条金属信号线(位线、地线)而言,在本申请实施例提供 的只读存储电路中,每一晶体管均作为存储单元进行数据存储,无需设置假存储单元,避免了假存储单元造成的存储面积浪费;并且通过设置相邻两行晶体管之间的连接,可以将后一行晶体管对应的位线与地线导通,作为前一行晶体管的地线,实现存储需求;而仅需要针对最后一行晶体管单独设置地线来满足其存储需求;相当于节省了约一半(50%)的地线,从而能够进一步减小存储单元的面积,并且能够提高以金属线道制约的晶体管阵列密度。In addition, compared to the read-only memory circuit in the related art, dummy memory cells need to be arranged between adjacent memory cells, and two metal signal lines (bit lines, ground lines) need to be arranged above the memory cells. In the read-only storage circuit provided by the embodiment of the present application, each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; connection, the bit line corresponding to the next row of transistors can be connected to the ground wire, which can be used as the ground wire of the previous row of transistors to meet the storage requirements; and only the ground wire needs to be set separately for the last row of transistors to meet its storage requirements; it is equivalent to saving About half (50%) of the ground wire is removed, so that the area of the memory cell can be further reduced, and the density of the transistor array constrained by the metal line can be increased.
在一些可能实现的方式中,晶体管阵列中还包括:位于同一列、且分别位于相邻两行的第三晶体管和第四晶体管。多条位线中包括第三位线和第四位线;第三位线与第三晶体管所在行的多个晶体管对应,第四位线与第四晶体管所在行的多个晶体管对应。第三晶体管的第一极与第四晶体管的第一极连接,第三晶体管的第二极与第四晶体管的第二极连接。在此情况下,第三晶体管的第一极和第二极均不与对应设置的位线连接,这样一来,在通过字线开启第三晶体管时,位线上的存储的高电位不会发生变化,从而能够实现“1”信号的读取。In some possible implementation manners, the transistor array further includes: a third transistor and a fourth transistor located in the same column and respectively located in two adjacent rows. The multiple bit lines include a third bit line and a fourth bit line; the third bit line corresponds to the multiple transistors in the row where the third transistor is located, and the fourth bit line corresponds to the multiple transistors in the row where the fourth transistor is located. The first pole of the third transistor is connected to the first pole of the fourth transistor, and the second pole of the third transistor is connected to the second pole of the fourth transistor. In this case, neither the first pole nor the second pole of the third transistor is connected to the corresponding bit line, so that when the third transistor is turned on through the word line, the stored high potential on the bit line will not changes, enabling the reading of a "1" signal.
在一些可能实现的方式中,多条位线中包括第五位线,第五位线与晶体管阵列中最后一行晶体管对应。最后一行晶体管中包括第五晶体管;第五晶体管的第一极与第五位线或地线连接;第五晶体管的第二极与第五位线或地线连接。对于晶体管阵列中最后一行晶体管而言,选择性的将部分或全部晶体管的第一极和/或第二极与地线进行连接,以满足实际的存储需求。In some possible implementation manners, the multiple bit lines include a fifth bit line, and the fifth bit line corresponds to the last row of transistors in the transistor array. The last row of transistors includes a fifth transistor; the first pole of the fifth transistor is connected to the fifth bit line or the ground line; the second pole of the fifth transistor is connected to the fifth bit line or the ground line. For the last row of transistors in the transistor array, the first pole and/or the second pole of some or all of the transistors are selectively connected to the ground to meet actual storage requirements.
在一些可能实现的方式中,晶体管阵列中每一行串联设置的多个晶体管的起始端或末端均连接到对应的位线。通过固定各行中晶体管的起始端或末端(即源极或漏极),并根据存储数据的需求,依次设置各晶体管的另一端(即漏极或源极)的连接方式。In some possible implementation manners, the start terminals or ends of the plurality of transistors arranged in series in each row of the transistor array are connected to corresponding bit lines. By fixing the start or end (ie, source or drain) of the transistors in each row, and according to the requirement of storing data, the connection mode of the other end (ie, drain or source) of each transistor is sequentially set.
在一些可能实现的方式中,晶体管阵列中包括n行晶体管,其中,n小于或等于32;从而能够避免因位于前行的位线的数量过大,而造成对后行位线的电位影响,以保证对每一行晶体管中的存储数据进行准确读出。In some possible implementation manners, the transistor array includes n rows of transistors, where n is less than or equal to 32; thereby avoiding the potential impact on the subsequent bit lines due to the excessive number of bit lines located in the previous row, To ensure accurate readout of the stored data in each row of transistors.
在一些可能实现的方式中,晶体管与位线、地线、相邻行的晶体管之间的中间连接线分布于第一金属层;多条位线和地线分布于第二金属层;第一金属层位于多个晶体管与第二金属层之间;位线和地线沿晶体管阵列的行方向延伸;中间连接线沿晶体管阵列的列方向延伸;多条位线的位置分别与各行的晶体管的位置正对。In some possible implementations, transistors, bit lines, ground lines, and intermediate connection lines between transistors in adjacent rows are distributed on the first metal layer; multiple bit lines and ground lines are distributed on the second metal layer; the first The metal layer is located between the plurality of transistors and the second metal layer; the bit line and the ground line extend along the row direction of the transistor array; the intermediate connection line extends along the column direction of the transistor array; The location is right.
在一些可能实现的方式中,地线的位置与晶体管阵列中最后一行晶体管的位置正对。In some possible implementation manners, the position of the ground line is directly opposite to the position of the last row of transistors in the transistor array.
在一些可能实现的方式中,与最后一行晶体管对应的位线为第五位线;地线位于第五位线远离晶体管阵列的一侧。In some possible implementation manners, the bit line corresponding to the last row of transistors is the fifth bit line; the ground line is located on a side of the fifth bit line away from the transistor array.
本申请提供一种只读存储电路,包括:m行n列呈阵列排布的多个晶体管、m条位线、n条字线及地线;m、n均为大于或等于1的正整数。同一行的晶体管依次串联。n条字线与n列晶体管的栅极分别一一对应连接。第i行晶体管的源极,连接到第i条位线,或者连接到第i+1行中位于同列的晶体管的源极。第i行晶体管的漏极,连接到第i条位线,或者连接到第i+1行中位于同列的晶体管的漏极;1≤i≤m-1,且i为正整数。The present application provides a read-only memory circuit, comprising: m rows and n columns of a plurality of transistors arranged in an array, m bit lines, n word lines and ground lines; m and n are both positive integers greater than or equal to 1 . Transistors in the same row are sequentially connected in series. The n word lines are respectively connected to the gates of the n columns of transistors in a one-to-one correspondence. The source of the transistor in the i-th row is connected to the i-th bit line, or connected to the source of the transistor in the same column in the i+1-th row. The drain of the transistor in the i-th row is connected to the i-th bit line, or connected to the drain of the transistor in the same column in the i+1-th row; 1≤i≤m-1, and i is a positive integer.
在一些可能实现的方式中,第m行晶体管的源极,连接到第m条位线或者地线。第m行晶体管的漏极,连接到第m条位线或者地线。In some possible implementation manners, the sources of the transistors in the mth row are connected to the mth bit line or the ground line. The drains of the transistors in the mth row are connected to the mth bit line or the ground line.
相比于相关技术中的只读存储电路需要在相邻存储单元之间设置假存储单元,并且需 要在存储单元上方排布两条金属信号线(位线、地线)而言,在本申请实施例提供的存储电路中,每一晶体管均作为存储单元进行数据存储,无需设置假存储单元,避免了假存储单元造成的存储面积浪费;并且通过设置相邻两行晶体管之间的连接,可以将后一行晶体管对应的位线与地线导通,作为前一行晶体管的地线,实现存储需求;而仅需要针对最后一行晶体管单独设置地线来满足其存储需求;相当于节省了约一半(50%)的地线,从而能够进一步减小存储单元的面积,并且能够提高以金属线道制约的晶体管阵列密度。Compared with the read-only memory circuit in the related art, dummy memory cells need to be arranged between adjacent memory cells, and two metal signal lines (bit line, ground line) need to be arranged above the memory cells, in this application In the storage circuit provided by the embodiment, each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; and by setting the connection between two adjacent rows of transistors, it can The bit line corresponding to the next row of transistors is connected to the ground wire as the ground wire of the previous row of transistors to meet the storage requirements; and only the ground wire needs to be set separately for the last row of transistors to meet its storage requirements; it is equivalent to saving about half ( 50%) of the ground line, so that the area of the memory cell can be further reduced, and the density of the transistor array constrained by the metal line can be increased.
在一些可能实现的方式中,m行串联设置的多个晶体管的起始端或末端均连接到位线。在此情况下,通过固定各行中晶体管的起始端或末端(即源极或漏极),并根据存储数据的需求,依次设置各晶体管的另一端(即漏极或源极)的连接方式。In some possible implementation manners, the start terminals or ends of the multiple transistors arranged in series in m rows are all connected to the bit line. In this case, the connection mode of the other end (ie drain or source) of each transistor is sequentially set by fixing the start or end (ie source or drain) of the transistors in each row and according to the requirement of storing data.
在一些可能实现的方式中,存储电路还包括开关电路;m条位线通过开关电路与地线连接;开关电路配置为控制每一条位线与地线之间的通断。在此情况下,通过开关电路将m条位线和地线进行连接,并通过开关电路控制每一条位线与地线VSS之间的通断,以满足存储需求。In some possible implementation manners, the storage circuit further includes a switch circuit; the m bit lines are connected to the ground line through the switch circuit; the switch circuit is configured to control the connection between each bit line and the ground line. In this case, the m bit lines are connected to the ground line through the switch circuit, and the on-off between each bit line and the ground line VSS is controlled by the switch circuit to meet the storage requirement.
在一些可能实现的方式中,n小于或等于32;从而能够避免因位于前行的位线的数量过大,而造成对后行位线的电位影响,以保证对每一行晶体管中的存储数据进行准确读出。In some possible implementations, n is less than or equal to 32; thus, it is possible to avoid the influence on the potential of the subsequent bit lines due to the excessive number of bit lines located in the previous row, so as to ensure the storage data in each row of transistors for an accurate readout.
在一些可能实现的方式中,多个晶体管的源极和漏极,与位线、地线以及相邻行的晶体管之间的中间连接线分布于第一金属层。m条位线和地线分布于第二金属层。第一金属层位于m行n列呈阵列排布的多个晶体管与第二金属层之间。位线和地线沿行方向延伸。中间连接线沿列方向延伸。第i条位线的位置与第i行晶体管的位置正对。In some possible implementation manners, sources and drains of multiple transistors, bit lines, ground lines, and intermediate connection lines between transistors in adjacent rows are distributed on the first metal layer. The m bit lines and ground lines are distributed on the second metal layer. The first metal layer is located between a plurality of transistors arranged in an array of m rows and n columns and the second metal layer. The bit lines and ground lines extend in the row direction. The intermediate connection lines extend along the column direction. The position of the i-th bit line is directly opposite to the position of the transistor in the i-th row.
在一些可能实现的方式中,地线的位置与第m行晶体管的位置正对。In some possible implementation manners, the position of the ground line is directly opposite to the position of the transistor in the mth row.
在一些可能实现的方式中,地线位于第m条位线远离第m-1条位线的一侧。In some possible implementation manners, the ground line is located on a side of the m-th bit line away from the m-1-th bit line.
本申请实施例还提供一种如前述任一种可能实现的方式中提供的存储电路的读取方法,该读取方法可以包括:向第1,2,……,x条位线进行预充电,并控制第x+1,x+2,……,m条位线与地线连通;其中,1≤x≤m,且x为正整数;向第y条字线输入开启信号导通第y列晶体管,并通过第x行位线读取位于第x行第y列的晶体管中的存储数据;其中,1≤y≤n,且y为正整数。The embodiment of the present application also provides a method for reading a storage circuit as provided in any one of the aforementioned possible implementation manners, the reading method may include: precharging the 1st, 2nd, ..., x bit lines , and control the x+1, x+2,...,m bit lines to be connected to the ground line; among them, 1≤x≤m, and x is a positive integer; input the start signal to the yth word line to turn on the y column transistors, and read the stored data in the transistors located in the xth row and yth column through the xth row bit line; wherein, 1≤y≤n, and y is a positive integer.
本申请实施例还提供一种只读存储器,包括控制器以及如前述任一种可能实现的方式中提供的存储电路;控制器与存储电路连接。An embodiment of the present application also provides a read-only memory, including a controller and a storage circuit as provided in any one of the foregoing possible implementation manners; the controller is connected to the storage circuit.
本申请实施例还提供一种电子设备,包括印刷线路板以及如前述任一种可能实现的方式提供的只读存储器;只读存储器与印刷线路板连接。An embodiment of the present application further provides an electronic device, including a printed circuit board and a read-only memory provided in any of the foregoing possible implementation manners; the read-only memory is connected to the printed circuit board.
图1为相关技术中提供的一种存储电路;Fig. 1 is a kind of storage circuit provided in the related art;
图2为对应图1的存储电路的版图示意图;FIG. 2 is a schematic diagram of the layout of the storage circuit corresponding to FIG. 1;
图3为本申请实施例提供的一种存储电路;FIG. 3 is a storage circuit provided by an embodiment of the present application;
图4为本申请实施例提供的一种存储电路;FIG. 4 is a storage circuit provided by an embodiment of the present application;
图5为本申请实施例提供的一种存储电路的读取方法;FIG. 5 is a reading method of a storage circuit provided by an embodiment of the present application;
图6为本申请实施例提供的一种存储电路的版图示意图;FIG. 6 is a schematic layout diagram of a memory circuit provided by an embodiment of the present application;
图7为本申请实施例提供的一种存储电路的版图示意图。FIG. 7 is a schematic layout diagram of a memory circuit provided by an embodiment of the present application.
为使本申请的目的、技术方案和优点更加清楚,下面将结合本申请中的附图,对本申请中的技术方案进行清楚地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly described below in conjunction with the accompanying drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, and Not all examples. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
本申请的说明书实施例和权利要求书及附图中的术语“第一”、“第二”等仅用于区分描述的目的,而不能理解为指示或暗示相对重要性,也不能理解为指示或暗示顺序。“连接”、“相连”等类似的词语,用于表达不同组件之间的互通或互相作用,可以包括直接相连或通过其他组件间接相连。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元。方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。“上”、“下”、“左”、“右”等仅用于相对于附图中的部件的方位而言的,这些方向性术语是相对的概念,它们用于相对于的描述和澄清,其可以根据附图中的部件所放置的方位的变化而相应地发生变化。The terms "first" and "second" in the description, embodiments, claims and drawings of the present application are only used for the purpose of distinguishing descriptions, and cannot be interpreted as indicating or implying relative importance, nor can they be interpreted as indicating or imply order. Words such as "connected" and "connected" are used to express intercommunication or interaction between different components, which may include direct connection or indirect connection through other components. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, of a sequence of steps or elements. A method, system, product or device is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to the process, method, product or device. "Up", "Down", "Left", "Right", etc. are only used relative to the orientation of the components in the drawings. These directional terms are relative concepts, and they are used for description and clarification relative to , which may change accordingly according to changes in the orientation in which components are placed in the drawings.
应当理解,在本申请中,“至少一个(项)”是指一个或者多个,“多个”是指两个或两个以上。“和/或”,用于描述关联对象的关联关系,表示可以存在三种关系,例如,“A和/或B”可以表示:只存在A,只存在B以及同时存在A和B三种情况,其中A,B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项(个)”或其类似表达,是指这些项中的任意组合,包括单项(个)或复数项(个)的任意组合。例如,a,b或c中的至少一项(个),可以表示:a,b,c,“a和b”,“a和c”,“b和c”,或“a和b和c”,其中a,b,c可以是单个,也可以是多个。It should be understood that in this application, "at least one (item)" means one or more, and "multiple" means two or more. "And/or" is used to describe the association relationship of associated objects, indicating that there can be three types of relationships, for example, "A and/or B" can mean: only A exists, only B exists, and A and B exist at the same time , where A and B can be singular or plural. The character "/" generally indicates that the contextual objects are an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one item (piece) of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c ", where a, b, c can be single or multiple.
本申请实施例提供一种电子设备,该电子设备中包括印刷线路板(printed circuit board,PCB)以及与该印刷线路板连接的只读存储器(ROM)。本申请对于该电子设备的设置形式不做限制。例如,该电子设备可以为手机、平板电脑、笔记本、车载电脑、智能手表、智能手环等电子产品。An embodiment of the present application provides an electronic device, which includes a printed circuit board (printed circuit board, PCB) and a read-only memory (ROM) connected to the printed circuit board. The present application does not limit the configuration form of the electronic device. For example, the electronic device may be electronic products such as a mobile phone, a tablet computer, a notebook, a vehicle computer, a smart watch, and a smart bracelet.
上述只读存储器中设置有控制器以及与控制器连接的只读存储电路(也可简称为存储电路),通过控制器对该只读存储电路进行控制,从而能够实现将只读存储电路中存储数据进行读出。The above-mentioned read-only memory is provided with a controller and a read-only storage circuit (also referred to simply as a storage circuit) connected to the controller. data to be read out.
相比于图1中的存储电路需要在每相邻的两个存储单元(NMOS0、NMOS1)之间设置假(dummy)存储单元(NMOSd),并且需要在存储单元上方排布两条金属信号线(位线BL、地线VSS)而言,本申请实施例提供的只读存储器中采用的存储电路,省去了假存储单元(相当于节省了1/3晶体管的数量),并且不需要针对每一行存储单元上均地线VSS(相当于节省约1/2地线),从而能够减小存储单元的面积。Compared with the storage circuit in Figure 1, a dummy storage unit (NMOSd) needs to be set between every two adjacent storage units (NMOS0, NMOS1), and two metal signal lines need to be arranged above the storage unit (Bit line BL, ground line VSS), the storage circuit adopted in the read-only memory that the embodiment of the present application provides, saves the dummy memory cell (equivalent to saving the quantity of 1/3 transistor), and does not need to Each row of memory cells is connected to the ground line VSS (equivalent to saving about 1/2 of the ground line), so that the area of the memory cells can be reduced.
以下对本申请实施例提供的只读存储电路的具体设置进行说明。The specific configuration of the read-only memory circuit provided by the embodiment of the present application will be described below.
如图3所示,本申请实施例提供一种只读存储电路,该只读存储电路中包括晶体管阵列,该晶体管阵列中m行n列呈阵列排布的多个晶体管,也即该只读存储电路中设置有m*n个成矩阵排布的晶体管(也即存储单元);其中,位于第x行第y列的晶体管表示为Nx_y。x、y、m、n均为大于或等于1的正整数,且1≤x≤m,1≤y≤n。As shown in FIG. 3 , the embodiment of the present application provides a read-only memory circuit, which includes a transistor array, and in the transistor array, a plurality of transistors arranged in an array in m rows and n columns, that is, the read-only The storage circuit is provided with m*n transistors (that is, storage cells) arranged in a matrix; wherein, the transistor located in the xth row and the yth column is denoted as Nx_y. x, y, m, and n are all positive integers greater than or equal to 1, and 1≤x≤m, 1≤y≤n.
需要说明的是,上述晶体管可以是金属氧化物半导体场效应晶体管(metal oxide semiconductor field effect transistor,MOSFET),可简称为MOS管。该MOS管可以是NMOS管,也可以是PMOS管,本申请对此不作限制。本申请实施例均是以只读存储电路采用的晶体管为NMOS管为例进行说明的。It should be noted that the above-mentioned transistor may be a metal oxide semiconductor field effect transistor (MOSFET), which may be referred to as a MOS transistor for short. The MOS transistor may be an NMOS transistor or a PMOS transistor, which is not limited in this application. In the embodiments of the present application, the transistor used in the read-only memory circuit is an NMOS transistor as an example for illustration.
应当理解的是,对于晶体管自身而言,其具有源极、漏极、栅极。参考图3中晶体管N1_1,本申请实施例并不对晶体管的源极s和漏极d进行明确的区分,源极s和漏极d可以对调,也即源极s和漏极d为等效的两个极;也就是说,晶体管除栅极以外的两个极(第一极和第二极)中,一个为源极s,另一个为漏极d;例如,第一极为源极s,则第二极为漏极d;第一极为漏极d,则第二极为源极s。It should be understood that for the transistor itself, it has a source, a drain, and a gate. Referring to transistor N1_1 in FIG. 3 , the embodiment of the present application does not clearly distinguish the source s and drain d of the transistor, and the source s and drain d can be reversed, that is, the source s and drain d are equivalent Two poles; that is to say, among the two poles (first pole and second pole) of the transistor except the gate, one is the source s and the other is the drain d; for example, the first pole is the source s, Then the second pole is the drain d; the first pole is the drain d, and the second pole is the source s.
为了对只读存储电路中各晶体管的连接关系进行清楚的描述,本申请实施例按照晶体管阵列中的相对位置来定义各晶体管的源极s和漏极d,本申请实施例将各晶体管同侧电极定义为相同类型的电极(即源极或漏极)。例如,参考图3所示,可以定义各晶体管的左侧电极为源极s,则右侧电极为漏极d;又例如,可以定义各晶体管的左侧电极为漏极d,则右侧电极为源极s。以下实施例均是各晶体管左侧电极为源极s,右侧电极为漏极d为例进行示意说明的。In order to clearly describe the connection relationship of each transistor in the read-only memory circuit, the embodiment of the present application defines the source s and the drain d of each transistor according to the relative position in the transistor array, and the embodiment of the present application defines each transistor on the same side as Electrodes are defined as electrodes of the same type (ie source or drain). For example, referring to Fig. 3, it is possible to define the left electrode of each transistor as source s, and the right electrode as drain d; for another example, it is possible to define the left electrode of each transistor as drain d, then the right electrode For the source s. In the following embodiments, the left electrode of each transistor is the source s, and the right electrode is the drain d as an example for schematic illustration.
在此基础上,如图3所示,该只读存储电路在包括前述晶体管阵列的基础上,还包括m条位线BL、n条字线WL(word line)、地线VSS以及开关电路C。m条位线BL可分别表示为BL1,BL2,……,BLm;n条字线WL可分别表示为WL1,WL2,……,WLn。On this basis, as shown in FIG. 3 , the read-only memory circuit includes m bit lines BL, n word lines WL (word line), ground line VSS, and a switch circuit C on the basis of the aforementioned transistor array. . The m bit lines BL can be respectively expressed as BL1, BL2, . . . , BLm; the n word lines WL can be respectively expressed as WL1, WL2, . . . , WLn.
如图3所示,在晶体管阵列中,位于同一行的n个晶体管(即Nx_1,Nx_2,……,Nx_n)依次串联;也即在位于同一行相邻的两个晶体管中(参考图3中N1_1,N1_2),前一个晶体管的漏极d与后一个晶体管的源极s电连接。m条位线BL与m行晶体管分别一一对应设置。如位线BL1与晶体管阵列中第1行的晶体管对应设置,以通过位线BL1读取第1行的晶体管中的存储数据;位线BL2与晶体管阵列中第2行的晶体管对应设置,以通过位线BL2读取第2行晶体管中的存储数据。As shown in Figure 3, in the transistor array, n transistors (ie Nx_1, Nx_2, ..., Nx_n) in the same row are connected in series; N1_1, N1_2), the drain d of the former transistor is electrically connected to the source s of the latter transistor. The m bit lines BL are arranged in one-to-one correspondence with the m rows of transistors. For example, the bit line BL1 is set corresponding to the transistors in the first row in the transistor array, so as to read the stored data in the transistors in the first row through the bit line BL1; the bit line BL2 is set corresponding to the transistors in the second row in the transistor array, so as to pass The bit line BL2 reads the data stored in the transistors of the second row.
需要说明的是,位于同一行的全部或部分晶体管与对应设置的位线连接,以实现对各晶体管中存储数据的读取。关于各晶体管的具体连接方式,与晶体管中实际的存储数据(“0”或“1”)相关,具体可以参考下文的相关描述。It should be noted that all or part of the transistors in the same row are connected to corresponding bit lines, so as to realize reading data stored in each transistor. Regarding the specific connection manner of each transistor, it is related to the actual stored data ("0" or "1") in the transistor, and for details, reference may be made to the relevant description below.
如图3所示,n条字线WL与晶体管阵列中的n列晶体管分别一一对应设置,并且位于同一列的m个晶体管(即N1_y,N2_y,……,Nm_y)的栅极与同一字线WL连接,不同列的晶体管连接不同的字线。也即n条字线(WL1,WL2,……,WLn)与n列晶体管的栅极分别一一对应连接。如字线WL1与第1列的m个晶体管的栅极连接,字线WL2与第2列的m个晶体管的栅极连接等。As shown in Figure 3, the n word lines WL are arranged in one-to-one correspondence with the n columns of transistors in the transistor array, and the gates of the m transistors (ie N1_y, N2_y, ..., Nm_y) in the same column are connected to the gates of the same word The transistors in different columns are connected to different word lines. That is, n word lines ( WL1 , WL2 , . . . , WLn) are connected to gates of n columns of transistors in a one-to-one correspondence. For example, the word line WL1 is connected to the gates of the m transistors in the first column, the word line WL2 is connected to the gates of the m transistors in the second column, and so on.
如图3所示,m条位线BL通过开关电路C与地线VSS连接,以通过开关电路C控制每一条位线BL与地线VSS之间的通断。示意的,如图3所示,开关电路C中可以包括m个开关(K1,K2,……,Km),m条位线BL分别通过不同的开关连接到地线VSS,从而通过控制各开关,即可实现各位线BL与地线VSS之间的通断。As shown in FIG. 3 , the m bit lines BL are connected to the ground line VSS through the switch circuit C, so as to control the connection between each bit line BL and the ground line VSS through the switch circuit C. Schematically, as shown in FIG. 3, the switch circuit C may include m switches (K1, K2, ..., Km), and the m bit lines BL are respectively connected to the ground line VSS through different switches, so that by controlling each switch , which can realize the on-off between each bit line BL and the ground line VSS.
需要说明的是,图3中仅是示意的以开关电路C中对应每一位线BL与地线VSS之间均设置有开关为例进行说明的,但本申请并不限制于此,在一些可能实现的方式中,在开关电路C中可以对应部分位线BL与地线VSS之间均设置有开关,例如,第1条BL1 与地线VSS之间可以不设置开关,仅针对第2条位线至第m条位线与地线VSS之间设置开关。It should be noted that, in FIG. 3 , it is only schematically illustrated that a switch is provided between each bit line BL and the ground line VSS in the switch circuit C as an example, but the present application is not limited thereto. In some In a possible implementation, in the switch circuit C, a switch may be provided between the corresponding part of the bit line BL and the ground line VSS, for example, no switch may be provided between the first BL1 and the ground line VSS, only for the second A switch is provided between the bit line to the mth bit line and the ground line VSS.
相比于图1中需要针对每一行晶体管单独设置地线VSS而言,本申请实施例提供的只读存储电路中,在设置m条位线BL通过开关电路C与地线VSS连接的基础上,在位于相邻两行的晶体管中,通过将前一行的晶体管与后一行的晶体管进行连接,从而能够将后一行晶体管对应的位线与地线导通,并作为前一行晶体管的地线,来满足前一行晶体管的存储需求。以下对本申请的只读存储电路中各行晶体管之间以及与位线、地线之间的连接进行具体说明。Compared with the need to separately set the ground line VSS for each row of transistors in Figure 1, in the read-only memory circuit provided by the embodiment of the present application, m bit lines BL are connected to the ground line VSS through the switch circuit C on the basis of , in the transistors located in two adjacent rows, by connecting the transistors in the previous row to the transistors in the next row, the bit line corresponding to the transistors in the latter row can be connected to the ground wire, and can be used as the ground wire of the transistors in the previous row, To meet the storage requirements of the previous row of transistors. The connection between the transistors in each row, the bit line and the ground line in the read-only memory circuit of the present application will be described in detail below.
参考图3所示,在第1行到第m-1行的晶体管中(与即除最后一行晶体管外),任一行(第i行)晶体管的源极s可以连接到与该行晶体管对应的位线(BLi),也可以连接到下一行(第i+1行)位于同列的晶体管的源极s;其中,1≤i≤m-1,且i为正整数。As shown in FIG. 3, among the transistors in the first row to the m-1th row (and that is, except the last row of transistors), the source s of any row (i-th row) transistor can be connected to the transistor corresponding to the row The bit line (BLi) can also be connected to the source s of the transistor in the same column in the next row (row i+1); wherein, 1≤i≤m-1, and i is a positive integer.
类似的,第i行晶体管的漏极d,可以连接到第i条位线BLi,也可以连接第i+1行中位于同列的晶体管的漏极d。Similarly, the drain d of the transistor in the i-th row can be connected to the i-th bit line BLi, or can be connected to the drain d of the transistor in the same column in the i+1-th row.
也就是说,针对晶体管阵列中的任一晶体管Nx_y而言,可能存在四种连接方式。That is to say, for any transistor Nx_y in the transistor array, there may be four connection modes.
第一种连接方式,晶体管Nx_y的源极s和漏极d均连接到与其对应设置的位线BLx。In the first connection mode, both the source s and the drain d of the transistor Nx_y are connected to the corresponding bit line BLx.
第二种连接方式,晶体管Nx_y的源极s和漏极d分别连接到位于下一行、同列的晶体管N(x+1_y)的源极s和漏极d。In the second connection mode, the source s and the drain d of the transistor Nx_y are respectively connected to the source s and the drain d of the transistor N(x+1_y) located in the next row and the same column.
第三种连接方式,晶体管Nx_y的源极s连接到与其对应设置的位线BLx,该晶体管Nx_y的漏极d连接到位于下一行、同列的晶体管N(x+1_y)的漏极d。In the third connection mode, the source s of the transistor Nx_y is connected to the corresponding bit line BLx, and the drain d of the transistor Nx_y is connected to the drain d of the transistor N(x+1_y) in the next row and the same column.
第四种连接方式,晶体管Nx_y的源极s连接到位于下一行、同列的晶体管N(x+1_y)的源极s,该晶体管Nx_y的漏极d连接到与其对应设置的位线BLx。In the fourth connection mode, the source s of the transistor Nx_y is connected to the source s of the transistor N(x+1_y) in the next row and the same column, and the drain d of the transistor Nx_y is connected to the corresponding bit line BLx.
可以理解的是,在晶体管阵列中,晶体管的源极s和漏极d的具体连接方式,直接决定了该晶体管中的存储数据(“0”或者“1”),因此可以根据实际的存储需求,来设定晶体管的源极s、漏极d的连接方式,以保证每一晶体管都能够满足“0”或者“1”的存储。It can be understood that in the transistor array, the specific connection mode of the source s and the drain d of the transistor directly determines the stored data ("0" or "1") in the transistor, so it can be stored according to the actual storage requirements. , to set the connection mode of the source s and the drain d of the transistor, so as to ensure that each transistor can satisfy the storage of "0" or "1".
示意的,在实际的电路设计时,可以固定晶体管的源极s(或漏极d)的连接方式,根据存储需求(“0”或者“1”),来设定晶体管的漏极d(或源极s)的连接方式。Schematically, in the actual circuit design, the connection mode of the source s (or drain d) of the transistor can be fixed, and the drain d (or drain d) of the transistor can be set according to the storage requirement ("0" or "1") source s) connection.
例如,在一些可能实现的方式中,如图3所示,可以设计m行串联设置的多个晶体管的起始端连接到与所在行对应的位线上;也即第1列晶体管(即Nx_1)的源极s连接到所在行对应的位线BLx上。在此情况下,根据第1列晶体管(即Nx_1)的存储需求来设置第1列晶体管的漏极的连接方式,并依据第1列晶体管(即Nx_1)的漏极的连接方式,来设置第2列晶体管(即Nx_2)的漏极的连接方式,以满足第二个晶体管对存储数据的需求,依次类推,可以从左到右依次设计后续晶体管的漏极的连接方式。For example, in some possible implementations, as shown in FIG. 3 , it is possible to design the start terminals of multiple transistors arranged in series in m rows to be connected to the bit line corresponding to the row; that is, the first column transistor (ie Nx_1) The source s of the row is connected to the bit line BLx corresponding to the row. In this case, the connection mode of the drain of the transistor in the first column is set according to the storage requirement of the transistor in the first column (ie, Nx_1), and the connection mode of the drain of the transistor in the first column (ie, Nx_1) is set. The connection mode of the drains of the 2 columns of transistors (ie Nx_2) is to meet the requirement of the second transistor for storing data, and so on, and the connection mode of the drains of the subsequent transistors can be designed sequentially from left to right.
类似的,在另一些可能实现的方式中,可以设计m行串联设置的多个晶体管的末端连接到与所在行对应的位线上;也即第n列晶体管(即Nx_n)的漏极d连接与所在行对应的位线BLx上。在此情况下,根据第n列晶体管的存储需求来设置第n列晶体管的源极的连接方式,并依据第n列晶体管的漏极的连接方式,来设置前一个晶体管的源极的连接方式,以满足前一个晶体管对存储数据的需求,依次类推,可以从右到左依次设计后续晶体管的源极的连接方式。Similarly, in some other possible implementations, it is possible to design the ends of multiple transistors arranged in series in m rows to be connected to the bit line corresponding to the row; that is, the drain of the transistor in the nth column (ie, Nx_n) is connected to On the bit line BLx corresponding to the row. In this case, set the connection mode of the source of the transistor in the nth column according to the storage requirement of the transistor in the nth column, and set the connection mode of the source of the previous transistor according to the connection mode of the drain of the transistor in the nth column , to meet the requirement of the previous transistor for storing data, and so on, the connection mode of the source of the subsequent transistor can be designed in turn from right to left.
以下参考图4中4行3列的晶体管阵列,结合具体晶体管的源极和漏极的连接方式, 对只读存储电路的数据存储进行说明。图4中是以第1列晶体管(即Nx_1)的源极s连接到所在行对应的位线BLx为例进行说明的,图4中未示出开关电路C,开关电路C的连接可参考图3。Referring to the transistor array of 4 rows and 3 columns in FIG. 4 , the data storage of the read-only memory circuit will be described in combination with the connection manner of the source and drain of the specific transistors. In Fig. 4, the source s of the transistor in the first column (that is, Nx_1) is connected to the bit line BLx corresponding to the row as an example. The switch circuit C is not shown in Fig. 4, and the connection of the switch circuit C can refer to Fig. 3.
以图4中位于同一列、且分别位于相邻两行的晶体管N1_1(也可以称为第一晶体管)和晶体管N1_2(也可以称为第二晶体管)中,晶体管N1_1中存储“0”为例。其中,第一晶体管和第二晶体管并不指具体的两个晶体管,第一晶体管和第二晶体管可能是晶体管阵列中位于同一列、且分别位于相邻两行的任意两个晶体管。Take the transistor N1_1 (also called the first transistor) and the transistor N1_2 (also called the second transistor) located in the same column and located in two adjacent rows in FIG. 4 as an example. Transistor N1_1 stores "0". . Wherein, the first transistor and the second transistor do not refer to specific two transistors, and the first transistor and the second transistor may be any two transistors located in the same column and respectively located in two adjacent rows in the transistor array.
对于晶体管N1_1而言,晶体管N1_1的源极(即节点r1c1)固定连接到位线BL1。如图4所示,可以将晶体管N1_1的漏极(即节点r1c2)连接到晶体管N2_1的漏极(即节点r2c2),这样一来,在通过字线WL2开启晶体管N1_1和晶体管N2_1时,节点r1c2与位线BL2等电位,通过开关电路C控制位线BL2与地线VSS连通,从而能够将位线BL1上存储的高电位下拉到低电位(具体控制方法可以参考下文的相关内容),进而能够实现“0”信号的读取。For the transistor N1_1 , the source of the transistor N1_1 (ie node r1c1 ) is fixedly connected to the bit line BL1 . As shown in FIG. 4, the drain of transistor N1_1 (that is, node r1c2) can be connected to the drain of transistor N2_1 (that is, node r2c2), so that when transistor N1_1 and transistor N2_1 are turned on through word line WL2, node r1c2 Equipotential with the bit line BL2, through the switch circuit C to control the connection between the bit line BL2 and the ground line VSS, so that the high potential stored on the bit line BL1 can be pulled down to a low potential (for the specific control method, please refer to the relevant content below), and then can Realize the reading of "0" signal.
当然,在晶体管N1_1的源极(即节点r1c1)固定连接到位线BL1的情况下,如果需要在晶体管N1_1中存储“1”,可以将晶体管N1_1的漏极(即节点r1c2)同样连接到位线BL1,这样一来,在通过字线WL1开启晶体管N1_1时,位线BL1上的存储的高电位不会发生变化,从而能够实现“1”信号的读取。Of course, in the case that the source of transistor N1_1 (ie node r1c1) is fixedly connected to bit line BL1, if it is necessary to store “1” in transistor N1_1, the drain of transistor N1_1 (ie node r1c2) can also be connected to bit line BL1 In this way, when the transistor N1_1 is turned on through the word line WL1, the high potential stored on the bit line BL1 will not change, so that the reading of the "1" signal can be realized.
以位于同一列、且分别位于相邻两行的晶体管N1_2(也可以称为第三晶体管)和晶体管N2_2(也可以称为第四晶体管),晶体管N1_2中存储“1”为例。其中,第三晶体管和第四晶体管并不指具体的两个晶体管,第三晶体管和第四晶体管可能是晶体管阵列中位于同一列、且分别位于相邻两行的任意两个晶体管。Taking the transistor N1_2 (also called the third transistor) and the transistor N2_2 (also called the fourth transistor) located in the same column and located in two adjacent rows respectively, “1” is stored in the transistor N1_2 as an example. Wherein, the third transistor and the fourth transistor do not refer to two specific transistors, and the third transistor and the fourth transistor may be any two transistors located in the same column and respectively located in two adjacent rows in the transistor array.
对于晶体管N1_2而言,晶体管N1_2的源极(即节点r1c1)固定连接到节点r2c2。如图4所示,可以将晶体管N1_2的漏极(即节点r1c3)连接到晶体管N2_2的漏极(即节点r2c3),在此情况下,晶体管N1_2的源极和漏极均不与位线BL1连接,这样一来,在通过字线WL2开启晶体管N1_2和晶体管N2_2时,位线BL1上的存储的高电位不会发生变化,从而能够实现“1”信号的读取。For the transistor N1_2, the source of the transistor N1_2 (ie, the node r1c1) is fixedly connected to the node r2c2. As shown in Figure 4, the drain of transistor N1_2 (ie, node r1c3) can be connected to the drain of transistor N2_2 (ie, node r2c3), in which case neither the source nor the drain of transistor N1_2 is connected to the bit line BL1 In this way, when the transistor N1_2 and the transistor N2_2 are turned on through the word line WL2, the high potential stored on the bit line BL1 will not change, so that the reading of the "1" signal can be realized.
当然,在晶体管N1_2的源极(即节点r1c1)固定连接到节点r2c2的情况下,如果需要在晶体管N1_2中存储“1”,可以将晶体管N1_2的漏极(即节点r1c3)连接到位线BL1,这样一来,在通过字线WL2开启晶体管N1_2和晶体管N2_2时,节点r1c2与位线BL2等电位,通过开关电路C可以控制位线BL2与地线VSS连通,从而能够将位线BL1上存储的高电位下拉到低电位,进而能够实现“0”信号的读取。Of course, in the case that the source of transistor N1_2 (ie, node r1c1) is fixedly connected to node r2c2, if it is necessary to store "1" in transistor N1_2, the drain of transistor N1_2 (ie, node r1c3) can be connected to bit line BL1, In this way, when the transistor N1_2 and the transistor N2_2 are turned on through the word line WL2, the node r1c2 is at the same potential as the bit line BL2, and the switch circuit C can control the connection between the bit line BL2 and the ground line VSS, so that the data stored on the bit line BL1 can be The high potential is pulled down to the low potential, and then the reading of "0" signal can be realized.
以晶体管N2_3为例,晶体管N2_3的源极(即节点r2c3)固定连接到位线BL2。Taking the transistor N2_3 as an example, the source of the transistor N2_3 (ie node r2c3) is fixedly connected to the bit line BL2.
如果需要在晶体管N2_3中存储“1”,如图4所示,可以将晶体管N2_3的漏极(即节点r2c4)同样连接到位线BL2,这样一来,在通过字线WL3开启晶体管N2_3时,位线BL2上的存储的高电位不会发生变化,从而能够实现“1”信号的读取。If it is necessary to store "1" in the transistor N2_3, as shown in FIG. 4, the drain of the transistor N2_3 (that is, the node r2c4) can also be connected to the bit line BL2, so that when the transistor N2_3 is turned on through the word line WL3, the bit The stored high potential on the line BL2 does not change, so that a "1" signal can be read.
当然,如果需要在晶体管N2_3中存储“0”,可以将晶体管N2_3的漏极(即节点r2c4)连接到晶体管N3_3的漏极(即节点r3c4),这样一来,在通过字线WL3开启晶体管N2_3和晶体管N3_3时,节点r2c4与位线BL3等电位,通过开关电路C控制位线BL3与地线VSS连通,从而能够将位线BL2上存储的高电位下拉到低电位,进而能够实现“0”信号的 读取。Of course, if it is necessary to store "0" in the transistor N2_3, the drain of the transistor N2_3 (that is, the node r2c4) can be connected to the drain of the transistor N3_3 (that is, the node r3c4), so that the transistor N2_3 is turned on through the word line WL3 When connecting with the transistor N3_3, the node r2c4 has the same potential as the bit line BL3, and the switch circuit C controls the bit line BL3 to be connected to the ground line VSS, so that the high potential stored on the bit line BL2 can be pulled down to a low potential, and then "0" can be realized signal reading.
综上所述,相比于相关技术中的只读存储电路需要在相邻存储单元之间设置假存储单元,并且需要在存储单元上方排布两条金属信号线(位线、地线)而言,本申请实施例提供的只读存储电路中,每一晶体管均作为存储单元进行数据存储,无需设置假存储单元,避免了假存储单元造成的存储面积浪费;并且通过设置相邻两行晶体管之间的连接,可以将后一行晶体管对应的位线与地线导通,作为前一行晶体管的地线,实现存储需求;相当于节省了约一半(50%)的地线,从而能够进一步减小存储单元的面积,并且能够提高以金属线道制约的晶体管阵列密度。In summary, compared with the read-only memory circuit in the related art, dummy memory cells need to be arranged between adjacent memory cells, and two metal signal lines (bit lines, ground lines) need to be arranged above the memory cells and In other words, in the read-only storage circuit provided by the embodiment of the present application, each transistor is used as a storage unit for data storage, and there is no need to set up a dummy storage unit, which avoids the waste of storage area caused by the dummy storage unit; and by arranging two adjacent rows of transistors The connection between the transistors in the next row can be connected to the ground wire corresponding to the bit line and used as the ground wire of the previous row of transistors to realize the storage requirement; it is equivalent to saving about half (50%) of the ground wire, which can further reduce the The area of the storage unit is small, and the density of the transistor array constrained by metal lines can be increased.
另外,对于最后一行晶体管而言,并不存在下一行的晶体管,因此为了满足最后一行晶体管的存储需求,可以通过设置最后一行晶体管与地线直接连接,以满足其存储需求。In addition, for the last row of transistors, there is no next row of transistors, so in order to meet the storage requirements of the last row of transistors, the last row of transistors can be directly connected to the ground to meet the storage requirements.
示意的,参考图3所示,对于最后一行(第m行)多个晶体管(也可以称为第五晶体管)而言,该行(第m行)晶体管的源极s可以连接到与该行晶体管对应的位线(BLm;也可以称为第五位线),也可以连接到地线VSS。类似的,该行(即第m行)晶体管的漏极d可以连接到与该行晶体管对应的位线(BLm),也可以连接到地线VSS。Schematically, as shown in FIG. 3 , for a plurality of transistors (also referred to as fifth transistors) in the last row (row m), the source s of the transistors in the row (row m) can be connected to the The bit line (BLm; also referred to as the fifth bit line) corresponding to the transistor can also be connected to the ground line VSS. Similarly, the drains d of the transistors in this row (that is, the mth row) can be connected to the bit line (BLm) corresponding to the transistors in this row, and can also be connected to the ground line VSS.
以下对本申请实施例提供的只读存储电路的读取方法进行示意的说明。The reading method of the read-only memory circuit provided by the embodiment of the present application is schematically described below.
参考图3所示,以对只读存储电路中第x行第y列的晶体管Nx_y(也即任意晶体管)中的存储数据进行读取为例,如图5所示,该读取方法可以包括:Referring to FIG. 3, take the example of reading the stored data in the transistor Nx_y (that is, any transistor) in row x and column y in the read-only memory circuit. As shown in FIG. 5, the reading method may include :
步骤01、向第1,2,……,x条位线进行预充电(precharge),并控制第x+1,x+2,……,m条位线BL与地线VSS连通。 Step 01. Precharge the 1st, 2nd, ..., xth bit lines (precharge), and control the x+1, x+2, ..., mth bitlines BL to communicate with the ground line VSS.
步骤02、向第y条字线WLy输入开启信号导通第y列晶体管,并通过第x行位线BLx读取位于第x行第y列晶体管Nx_y中的存储数据。Step 02: Input a turn-on signal to the yth word line WLy to turn on the transistor in the yth column, and read the stored data in the transistor Nx_y in the xth row and the yth column through the xth row bit line BLx.
示意的,以读取图4中的晶体管N1_1中的存储数据(“0”)为例,通过步骤01向位线BL1进行预充电,也即向位线BL1输入高电平电位;并将其他的位线BL2、BL3、BL4与地线VSS连通。然后通过步骤02向字线WL1输入开启信号导通第1列晶体管,在此情况下,晶体管N1_1的漏极(即节点r1c2)与位线BL2等电位(即接地),从而将位线BL1输入的高电平电位下拉至低电位;此时从位线BL1上读取到晶体管N1_1中的存储数据“0”。Schematically, taking reading the stored data (“0”) in transistor N1_1 in FIG. 4 as an example, the bit line BL1 is precharged through step 01, that is, a high-level potential is input to the bit line BL1; and other The bit lines BL2, BL3, BL4 are connected to the ground line VSS. Then, through step 02, input a turn-on signal to the word line WL1 to turn on the transistor in the first column. In this case, the drain of the transistor N1_1 (that is, the node r1c2) is at the same potential as the bit line BL2 (that is, grounded), thereby inputting the bit line BL1 The high level potential of is pulled down to low potential; at this time, the stored data "0" in the transistor N1_1 is read from the bit line BL1.
示意的,以读取图4中的晶体管N2_3中的存储数据(“1”)为例,通过步骤01向位线BL1、BL2进行预充电,也即向位线BL1、BL2输入高电平电位;并将其他的位线BL3、BL4与地线VSS连通。然后通过步骤02向字线WL3输入开启信号导通第3列晶体管,在此情况下,位线BL2上的高电位不发生变化;此时从位线BL2上读取到晶体管N2_3中的存储数据“1”。Schematically, taking reading the stored data ("1") in transistor N2_3 in FIG. ; and the other bit lines BL3, BL4 are connected to the ground line VSS. Then input the turn-on signal to the word line WL3 through step 02 to turn on the transistor in the third column. In this case, the high potential on the bit line BL2 does not change; at this time, the stored data in the transistor N2_3 is read from the bit line BL2 "1".
示意的,以读取图4中的晶体管N3_1中的存储数据(“0”)为例,通过步骤01向位线BL1、BL2、BL3进行预充电,也即向位线BL1、BL2、BL3输入高电平电位;并将其他的位线BL4与地线VSS连通。然后通过步骤02向字线WL1输入开启信号导通第1列晶体管,在此情况下,晶体管N3_1的漏极(即节点r3c2)与位线BL4等电位(即接地),从而将位线BL3输入的高电平电位下拉至低电位;此时从位线BL3上读取到晶体管N3_1中的存储数据“0”。Schematically, taking reading the stored data (“0”) in transistor N3_1 in FIG. high level potential; and connect the other bit line BL4 with the ground line VSS. Then, through step 02, input a turn-on signal to the word line WL1 to turn on the transistor in the first column. In this case, the drain of the transistor N3_1 (ie node r3c2) is at the same potential as the bit line BL4 (ie, grounded), thereby inputting the bit line BL3 The high level potential of is pulled down to low potential; at this time, the stored data "0" in the transistor N3_1 is read from the bit line BL3.
示意的,以读取图4中的晶体管N4_1中的存储数据(“0”)为例,通过步骤01向位 线BL1、BL2、BL3、BL4进行预充电,也即向位线BL1、BL2、BL3、BL4输入高电平电位。然后通过步骤02向字线WL1输入开启信号导通第1列晶体管,由于晶体管N4_1的漏极(即节点r4c2)与地线VSS连接,从而将位线BL4输入的高电平电位下拉至低电位;此时从位线BL4上读取到晶体管N4_1中的存储数据“0”。Schematically, taking reading the stored data ("0") in transistor N4_1 in FIG. BL3, BL4 input high level potential. Then input the turn-on signal to the word line WL1 through step 02 to turn on the first row of transistors, since the drain of the transistor N4_1 (namely node r4c2) is connected to the ground line VSS, the high-level potential input by the bit line BL4 is pulled down to a low potential ; At this time, the stored data "0" in the transistor N4_1 is read from the bit line BL4.
此处应当理解的是,由于存储电路中针对最后一行晶体管单独设置地线VSS,因此在对最后一行晶体管中的存储数据进行读取时,通过步骤01仅需要对所有的位线BL1、BL2、BL3、BL4进行预充电即可,不需要控制位线与地线VSS连通。It should be understood here that since the ground line VSS is separately set for the last row of transistors in the storage circuit, when reading the stored data in the last row of transistors, only all the bit lines BL1, BL2, BL3 and BL4 can be precharged, and there is no need to connect the control bit line to the ground line VSS.
需要说明的是,由于本申请实施例提供的只读存储电路中相邻行之间的晶体管之间存在电连接关系,因此在对位于某一行(第x行)晶体管进行存储数据读取时,在对第x行晶体管对应的位线BLx进行预充电的同时,需要同时向位于位线BLx之前的所有位线BL1,BL2,……,BL(x-1)均进行预充电,以降低位线BL1,BL2,……,BL(x-1)对位线BLx上的电压造成影响(如电压浮动)导致不能对存储数据的准确读取的问题。It should be noted that, since there is an electrical connection relationship between transistors in adjacent rows in the read-only memory circuit provided by the embodiment of the present application, when reading stored data from a transistor located in a certain row (row x), While precharging the bit line BLx corresponding to the transistor in row x, it is necessary to simultaneously precharge all the bit lines BL1, BL2,..., BL(x-1) located in front of the bit line BLx, so as to reduce the BL1 , BL2 , . . . , BL(x−1) affect the voltage on the bit line BLx (such as voltage fluctuation), which leads to the problem that the stored data cannot be accurately read.
另外,为了保证能够对每一行晶体管中的存储数据进行准确读出,避免因位于前行的位线的数量过大,而造成对后行位线的电位影响,在一些可能实现的方式中,可以设置晶体管阵列中的行数小于或等于32,即n≤32。示意的,n可以等于4、8、16等。In addition, in order to ensure that the stored data in each row of transistors can be accurately read out, and to avoid the potential impact on the potential of the subsequent bit lines due to the excessive number of bit lines located in the previous row, in some possible implementation methods, The number of rows in the transistor array can be set to be less than or equal to 32, ie n≤32. Schematically, n can be equal to 4, 8, 16 and so on.
以下结合上述只读存储电路的版图排布,对该只读存储电路在只读存储器中的层间分布进行进一步的说明。此处应当理解的是,电路的版图排布与产品中的器件、信号线等的实际分布是一致的。The layer-to-layer distribution of the read-only memory circuit in the read-only memory will be further described below in conjunction with the layout arrangement of the above-mentioned read-only memory circuit. It should be understood here that the layout layout of the circuit is consistent with the actual distribution of devices, signal lines, etc. in the product.
如图6所示,以存储电路采用4行5列的晶体管阵列为例,在设计该只读存储电路的版图排布时,可以设置晶体管阵列的源极和漏极,与位线BL、地线VSS以及相邻行的晶体管之间的中间连接线ML位于第一金属层M1;m条位线BL和地线VSS位于第二金属层M1;晶体管阵列分布在第一金属层M1远离第二金属层M1的一侧,也可以说第一金属层M1位于晶体管阵列与第二金属层M2之间。As shown in Figure 6, taking a transistor array with 4 rows and 5 columns as an example for the storage circuit, when designing the layout layout of the read-only memory circuit, the source and drain of the transistor array can be set to connect with the bit line BL and the ground The line VSS and the intermediate connection line ML between transistors in adjacent rows are located on the first metal layer M1; the m bit lines BL and the ground line VSS are located on the second metal layer M1; the transistor array is distributed on the first metal layer M1 away from the second One side of the metal layer M1, that is, the first metal layer M1 is located between the transistor array and the second metal layer M2.
此处应当理解的是,晶体管阵列包括多个膜层结构;例如,如图6所示,可以包括有源层OD(作为晶体管的沟道层)、多晶硅层PO(作为晶体管的栅极层)等。It should be understood here that the transistor array includes a plurality of film layer structures; for example, as shown in FIG. wait.
参考图6所示,位于第二金属层M2中的位线BL和地线VSS可以沿行方向延伸,在此情况下,可以将各位线分别一一对应设置在各行晶体管正对的位置,也即将第i条位线设置在与第i行晶体管正对的位置。Referring to FIG. 6, the bit line BL and the ground line VSS located in the second metal layer M2 may extend along the row direction. That is, the i-th bit line is set at a position directly opposite to the i-th row of transistors.
对于地线VSS的设置而言,如图6所示,在一些可能实现的方式中,可以设置地线VSS位于最后一行(即第4行)晶体管的外侧,也即地线VSS设置在位线BL4远离晶体管阵列(或者说BL3)的一侧。如图7所示,在一些可能实现的方式中,可以设置地线VSS和位线BL4(最后一条位线)均设置于第4行晶体管(最后一行晶体管)正对的位置。For the setting of the ground line VSS, as shown in Figure 6, in some possible implementations, the ground line VSS can be set outside the last row (that is, the fourth row) of transistors, that is, the ground line VSS is set on the bit line BL4 is away from the side of the transistor array (or BL3). As shown in FIG. 7 , in some possible implementation manners, both the ground line VSS and the bit line BL4 (the last bit line) can be set at positions opposite to the transistors in the fourth row (the last row of transistors).
另外,参考图6或图7所示,位于第一金属层M1的中间连接线ML可以沿列反向延伸。并且中间连接线ML与位线BL、地线VSS之间可以通过过孔VIA进行电连接。需要说明的是,前述的存储电路为等效电路图,该存储电路中的部分电连接在制作时可以设计为等效连接方式即可,例如图7中第4列的所有晶体管的漏极均通过中间连接线ML直接连接到地线VSS,该连接方式与存储电路中第4列中4个晶体管的漏极依次连接到地线为等效连接方式。In addition, as shown in FIG. 6 or FIG. 7 , the middle connection line ML located on the first metal layer M1 may extend in the opposite direction along the column. In addition, the middle connection line ML can be electrically connected to the bit line BL and the ground line VSS through the via hole VIA. It should be noted that the aforementioned storage circuit is an equivalent circuit diagram, and some electrical connections in the storage circuit can be designed as equivalent connections during fabrication. For example, the drains of all transistors in the fourth column in FIG. The middle connection line ML is directly connected to the ground line VSS, and this connection mode is equivalent to that of sequentially connecting the drains of the four transistors in the fourth column to the ground line in the storage circuit.
另外,在ROM中,可以设置一个前述的只读存储电路,也可以设置多个前述的只读 存储电路,本申请对此不作限制,实际中可以根据需要进行设置。In addition, in the ROM, one aforementioned read-only storage circuit can be set, and multiple aforementioned read-only storage circuits can also be set.
需要说明的是,上述实施例中所涉及的“正对”,并不是指绝对的中心相对,以前述地线VSS和位线BL4位于第4行晶体管正对的位置为例,是指地线VSS和位线BL4可以认为是,地线VSS和位线BL4在基板上的投影,与第4行晶体管的投影具有交叠区域;当然实际中,可以在满足设计需求的情况下,通过具体设置交叠区域的大小,以保证存储单元的面积最小。It should be noted that the “opposite” involved in the above-mentioned embodiments does not refer to the absolute center-to-centre opposition. Taking the aforementioned position where the ground line VSS and the bit line BL4 are located opposite to the transistors in the fourth row as an example, it refers to the ground line VSS and bit line BL4 can be considered as the projection of the ground line VSS and bit line BL4 on the substrate, which has an overlapping area with the projection of the transistors in the fourth row; of course, in practice, it can be specified by setting The size of the overlapping area to ensure the minimum area of the memory cell.
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。The above is only a specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.
Claims (10)
- 一种只读存储电路,其特征在于,包括晶体管阵列、开关电路、多条字线、多条位线、地线;A read-only memory circuit, characterized in that it includes a transistor array, a switch circuit, a plurality of word lines, a plurality of bit lines, and a ground wire;所述晶体管阵列包括多个晶体管;其中,在所述晶体管阵列中:位于同一行的多个所述晶体管依次串联,位于同一列的多个所述晶体管的栅极与同一所述字线连接,所述多条位线分别与不同行的所述晶体管一一对应设置;The transistor array includes a plurality of transistors; wherein, in the transistor array: the plurality of transistors located in the same row are connected in series in sequence, and the gates of the plurality of transistors located in the same column are connected to the same word line, The plurality of bit lines are arranged in one-to-one correspondence with the transistors in different rows;所述多条位线通过所述开关电路与所述地线连接;The plurality of bit lines are connected to the ground line through the switch circuit;所述晶体管阵列中包括:位于同一列、且分别位于相邻两行的第一晶体管和第二晶体管;The transistor array includes: a first transistor and a second transistor located in the same column and respectively located in two adjacent rows;所述多条位线中包括第一位线和第二位线;所述第一位线与所述第一晶体管所在行的多个所述晶体管对应,所述第二位线与所述第二晶体管所在行的多个所述晶体管对应;The multiple bit lines include a first bit line and a second bit line; the first bit line corresponds to the plurality of transistors in the row where the first transistor is located, and the second bit line corresponds to the first bit line The multiple transistors in the row where the second transistor is located correspond to;所述第一晶体管的第一极与所述第一位线连接,所述第一晶体管的第二极与所述第二晶体管的第二极连接,所述第二晶体管的第一极与所述第二位线连接。The first pole of the first transistor is connected to the first bit line, the second pole of the first transistor is connected to the second pole of the second transistor, the first pole of the second transistor is connected to the The second bit line connection described above.
- 根据权利要求1所述的只读存储电路,其特征在于,The read-only memory circuit according to claim 1, wherein,所述晶体管阵列中还包括:位于同一列、且分别位于相邻两行的第三晶体管和第四晶体管;The transistor array further includes: a third transistor and a fourth transistor located in the same column and respectively located in two adjacent rows;所述多条位线中包括第三位线和第四位线;所述第三位线与所述第三晶体管所在行的多个所述晶体管对应,所述第四位线与所述第四晶体管所在行的多个所述晶体管对应;The multiple bit lines include a third bit line and a fourth bit line; the third bit line corresponds to the plurality of transistors in the row where the third transistor is located, and the fourth bit line corresponds to the first bit line The multiple transistors in the row where the four transistors are located correspond to;所述第三晶体管的第一极与所述第四晶体管的第一极连接,所述第三晶体管的第二极与所述第四晶体管的第二极连接。The first pole of the third transistor is connected to the first pole of the fourth transistor, and the second pole of the third transistor is connected to the second pole of the fourth transistor.
- 根据权利要求1或2所述的只读存储电路,其特征在于,The read-only memory circuit according to claim 1 or 2, characterized in that,所述多条位线中包括第五位线,所述第五位线与所述晶体管阵列中最后一行晶体管对应;The plurality of bit lines include a fifth bit line, and the fifth bit line corresponds to the last row of transistors in the transistor array;所述最后一行晶体管中包括第五晶体管;The last row of transistors includes a fifth transistor;所述第五晶体管的第一极与所述第五位线或所述地线连接;The first pole of the fifth transistor is connected to the fifth bit line or the ground line;所述第五晶体管的第二极与所述第五位线或所述地线连接。The second pole of the fifth transistor is connected to the fifth bit line or the ground line.
- 根据权利要求1-3任一项所述的只读存储电路,其特征在于,The read-only memory circuit according to any one of claims 1-3, characterized in that,所述晶体管阵列中每一行串联设置的多个所述晶体管的起始端或末端均连接到对应的所述位线。The start terminals or ends of the plurality of transistors arranged in series in each row of the transistor array are connected to the corresponding bit lines.
- 根据权利要求1-4任一项所述的只读存储电路,其特征在于,The read-only memory circuit according to any one of claims 1-4, characterized in that,所述晶体管阵列中包括n行所述晶体管,其中,n小于或等于32。The transistor array includes n rows of transistors, wherein n is less than or equal to 32.
- 根据权利要求1-5任一项所述的只读存储电路,其特征在于,The read-only memory circuit according to any one of claims 1-5, characterized in that,所述晶体管与所述位线、所述地线、相邻行的所述晶体管之间的中间连接线分布于第一金属层;The transistor, the bit line, the ground line, and the intermediate connection lines between the transistors in adjacent rows are distributed on the first metal layer;所述多条位线和所述地线分布于第二金属层;The plurality of bit lines and the ground line are distributed on the second metal layer;所述第一金属层位于所述多个晶体管与所述第二金属层之间;The first metal layer is located between the plurality of transistors and the second metal layer;所述位线和所述地线沿所述晶体管阵列的行方向延伸;The bit line and the ground line extend along a row direction of the transistor array;所述中间连接线沿所述晶体管阵列的列方向延伸;The intermediate connection line extends along the column direction of the transistor array;所述多条位线的位置分别与各行的所述晶体管的位置正对。The positions of the plurality of bit lines are respectively opposite to the positions of the transistors in each row.
- 根据权利要求6所述的只读存储电路,其特征在于,The read-only memory circuit according to claim 6, wherein,所述地线的位置与所述晶体管阵列中最后一行晶体管的位置正对。The position of the ground line is directly opposite to the position of the last row of transistors in the transistor array.
- 根据权利要求6所述的只读存储电路,其特征在于,The read-only memory circuit according to claim 6, wherein,所述晶体管阵列中最后一行晶体管对应的位线为第五位线;The bit line corresponding to the last row of transistors in the transistor array is the fifth bit line;所述地线位于所述第五位线远离所述晶体管阵列的一侧。The ground line is located on a side of the fifth bit line away from the transistor array.
- 一种只读存储器,其特征在于,包括控制器以及如权利要求1-8任一项所述的只读存储电路;所述控制器与所述只读存储电路连接。A read-only memory, characterized by comprising a controller and the read-only storage circuit according to any one of claims 1-8; the controller is connected to the read-only storage circuit.
- 一种电子设备,其特征在于,包括印刷线路板以及如权利要求9所述的只读存储器;所述只读存储器与所述印刷线路板连接。An electronic device, characterized by comprising a printed circuit board and a read-only memory according to claim 9; the read-only memory is connected to the printed circuit board.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1421861A (en) * | 2001-11-26 | 2003-06-04 | 萧正杰 | High-performance semiconductor memory equipment |
CN1707697A (en) * | 2004-04-26 | 2005-12-14 | 因芬尼昂技术股份公司 | Method for programming a memory arrangement and programmed memory arrangement |
JP2007095940A (en) * | 2005-09-28 | 2007-04-12 | Fujitsu Ltd | Semiconductor memory device |
CN112599167A (en) * | 2019-10-01 | 2021-04-02 | 三星电子株式会社 | Resistive memory device and method of operating resistive memory device |
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---|---|---|---|---|
CN1421861A (en) * | 2001-11-26 | 2003-06-04 | 萧正杰 | High-performance semiconductor memory equipment |
CN1707697A (en) * | 2004-04-26 | 2005-12-14 | 因芬尼昂技术股份公司 | Method for programming a memory arrangement and programmed memory arrangement |
JP2007095940A (en) * | 2005-09-28 | 2007-04-12 | Fujitsu Ltd | Semiconductor memory device |
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